Transcend 128MB DDR266 Unbuffer Non-ECC Memory
Contents
1. DQ DM and DQS inputs changing twice per clock cycle 50 of IDD4W 620 mA input data changing at every burst Auto refresh current tRC tRFC min IDD5 660 mA Self refresh current CKE lt 0 2V IDD6 12 mA Operating current Four bank operation Four bank interleaving with BL 4 IDD7 1200 mA Refer to the following page for detailed test condition Note Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading capacitor Transcend Information Inc 6 TS16MLD64V6G 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx16 CL2 5 AC OPERATING CONDITIONS Parameter Symbol Min Max Unit Note Input High Logic 1 Voltage DQ DQS and DM signals VIH AC VREF 0 31 V 3 Input Low Logic 0 Voltage DQ DQS and DM signals VIL AC VREF 0 31 V 3 Input Differential Voltage CK and CK inputs VID AC 0 7 VDDQ 0 6 V 1 Input Crossing Point Voltage CK and CK inputs VIX AC 0 5 VDDQ 0 2 0 5 VDDQ 0 2 V 2 Note 1 VID is the magnitude of the difference between the input level on CK and the input on CK 2 The value of VIX is expected to equal 0 5 V DDQ of the transmitting device and must track variations in the DC level of the same 3 These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation The AC and DC input specifications are relat2. i js Cd cS E E Go joo CI E food jn Tal Ca ja om mi j w jams Gd mn io E ox Cal mem a i j co c 3 mm Co 5 A j s j E je a mam 4 Co T jm zam m mi E a all B aer a T jem am jaan a co m jen a Tami mi jam jmn q C D ren _ i eens i tt n I 4 i H G F tH E PCB 09 1850 Transcend Information Inc 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx16 CL2 5 TS16MLD64V6G Dimensions Pin Identification Side Millimeters Inches Symbol Function 133 35 0 20 5 250 0 008 AO A12 BAO BA1 Address input z eae DQ0 DQ63 Data Input Output C 6 35 0 250 pe ae DQS0 DQS7 Data strobe input output E 30 48 0 20 1 200 0 008 SR ee pH F 19 80 0 780 KUSOK G 4 00 0 157 CKEO Clock Enable Input H 12 00 0 472 CSO Chip Select Input 1 27 0 10 0 050 0 004 RAS Row Address Strobe Refer Placement ICAS Column Address Strobe IWE Write Enable DMO DM7 Data in Mask VDD 2 5 Voltage power supply VDDQ 2 5 Voltage Power Supply for DQS VREF Power Supply for Reference VDDSPD 2 5 Voltage Serial EEPROM Power Supply SA0 SA2 Address in EEPROM SCL Serial PD Clock SDA Serial PD Add Data input output VSS Ground NC No Connection Transcend Information
3. 9 mA VOUT VTT 0 45V Output High Current Half strength driver IOL 9 mA VOUT VTT 0 45V Note 1 Includes 25mV margin for DC offset on VREF and a combined total of 50mV margin for all AC noise and DC offset on VREF bandwidth limited to 20MHz The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise coupled TO VREF both of which may result in VREF noise VREF should be de coupled with an inductance of lt 3nH 2 VTT is not applied directly to the device VTT is a system supply for signal termination resistors is expected to be set equal to VREF and must track variations in the DC level of VREF 3 VID is the magnitude of the difference between the input level on CK and the input level on CK 4 These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ 5 The value of Vix is expected to equal 0 5 VDDQ of the transmitting device and must track variations in the dc level of the same Transcend Information Inc 5 184PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 DC CHARACTERISTICS Recommended operating condition unless otherwise noted VDD 2 7V TA 10 C Parameter Symbol Max Unit Note Operating current One bank Active Precharge tRC tRCmin tCK tCK min DQ
4. Ao As A11 A12 Note Extended Register Mode Register Set X L L L L OP CODE 1 2 Register Mode Register Set X L L L L OP CODE 1 2 Auto Retesh r L L L H x Refresh Self bi m gt Refresh i Exit L H H X X X X 3 Bank Active amp Row Addr H X L L H H V Row Address Auto Precharge Disable L Col 4 Read amp 2 H x L H L H V Address Column Address Auto Precharge Enable H Ao As i Auto Precharge Disable L Col Write amp 9 H x L H L L v Address Column Address Auto Precharge Enable H Ao As 4 6 Burst Stop H x L H H L x 7 Bank Selection V L Precharge All Banks H x L L H L X H X 5 Entry H E MRE R AeA Active Power Down L V V V X Exit L H X X X X H X X X Entry H L Precharge Power L h h H x Down Mode Exit H X X X L H L V V V DM H X X H X X X No Operation Command H x x L H H H 9 Note 1 OP Code Operand Code AO A12 amp BAO BA1 Program keys EMRS MRS OFORI EMRS MRS can be issued only at all banks precharge state A new command can be issued 2 clock cycles after EMRS or MRS Auto refresh functions are same as the CBR refresh of DRAM The automatically precharge without row precharge command is meant by Auto Auto self refresh can be issued only at all banks precharge state BAO BA1 Bank select addresses If both BAO and BA1 are Low at read write row active and precharge bank A is selected If both BAO is High and BA1 is Low at read write row active and precharge bank B is selected If both BAO is Low and BA1
5. DM and DQS inputs changing twice per clock cycle IDDO aap mA Address and control inputs changing once per clock cycle Operating current One bank Active Read Precharge Burst 2 IDD1 460 mA tRC tRC min CL 2 5 tCK tCK min VIN VREF fro DQ DQS and DM Percharge power down standby current All banks idle power down mode CKE lt VIL max tCK tCK min IDD2P 12 mA VIN VREF for DQ DQS and DM Precharge Floating standby current CS gt VIH min All banks idle CKE gt VIH min tCK 133Mhz for DDR266 Address and other control inputs changing once per clock cycle VIN VREF for DQ DQS and DM IDD2F 80 mA Active power down standby current one bank active power down mode CKE lt VIL max tCK tCK min IDD3P 120 mA VIN VREF for DQ DQS and DM Active standby current CS gt VIH min CKE gt VIH min one bank active active precharge tRC tRASmax tCK tCK min DQ DQS and DM inputs changing twice per clock cycle address and other control IDD3N 180 mA inputs changing once per clock cycle Operating current burst read Burst length 2 reads continuous burst One bank active address and control inputs changing once per clock cycle CL 2 5 at IDD4R 680 mA tCK tCK min 50 of data changing at every burst lout 0 mA Operating current burst write Burst length 2 writes continuous burst One bank active address and control inputs changing once per clock cycle CL 2 5 at tCK tCK min
6. Inc 184PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 Pinouts Pin Pin Pin Pin Pin Pin Pin No Name No Name No Name No Name 01 VREF 47 DQS8 93 VSS 139 VSS 02 DQO 48 AO 94 DQ4 140 DM8 03 VSS 49 CB2 95 DQ5 141 A10 04 DQ1 50 VSS 96 VDDQ 142 CB6 05 DQSO 51 CB3 97 DMO 143 VDDQ 06 DQ2 52 BA1 98 DQ6 144 CB7 07 VDD 53 DQ32 99 DQ7 145 VSS 08 DQ3 54 VDDQ 100 VSS 146 DQ36 09 NC 55 DQ33 101 NC 147 DQ37 10 NC 56 DQS4 102 NC 148 VDD 11 VSS 57 DQ34 103 NC 149 DM4 12 DQ8 58 VSS 104 VDDQ 150 DQ38 13 DQ9 59 BAO 105 DQ12 151 DQ39 14 DQS1 60 DQ35 106 DQ13 152 VSS 15 VDDQ 61 DQ40 107 DM1 153 DQ44 16 CK1 62 VDDQ 108 VDD 154 RAS 17 CK1 63 IWE 109 DQ14 155 DQ45 18 VSS 64 DQ41 110 DQ15 156 VDDQ 19 DQ10 65 ICAS 111 CKE1 157 CS0 20 DQ11 66 VSS 112 VDDQ 158 CS1 21 CKEO 67 DQS5 113 NC 159 DM5 22 VDDQ 68 DQ42 114 DQ20 160 VSS 23 DQ16 69 DQ43 115 A12 161 DQ46 24 DQ17 70 VDD 116 VSS 162 DQ47 25 DQS2 71 NC 117 DQ21 163 NC 26 VSS 72 DQ48 118 A11 164 VDDQ 27 A9 73 DQ49 119 DM2 165 DQ52 28 DQ18 74 VSS 120 VDD 166 DQ53 29 A7 75 ICK2 121 DQ22 167 NC 30 VDDQ 76 CK2 122 A8 168 VDD 31 DQ19 77 VDDQ 123 DQ23 169 DM6 32 A5 78 DQS6 124 VSS 170 DQ54 33 DQ24 79 DQ50 125 A6 171 DQ55 34 VSS 80 DQ51 126 DQ28 172 VDDQ 35 DQ25 81 VSS 127 DQ29 173 NC 36 DQS3 82 NC 128 VDDQ 174 DQ60 37 A4 83 DQ56 129 DM3 175 DQ61 38 VDD 84 DQ57 130 A3 176 VSS 39 DQ26 85 VDD 131 DQ30 177 DM7 40 DQ27 86 DQS7 132 VS
7. refresh to non Read command tXSNR 75 ns 5 Exit self refresh to read command tXSRD 200 Cycle Refresh interval time tREF 7 8 us 1 Clock half period tHP TCLmin or ns tCHmin Data hold skew factor tQHS 0 75 ns DQS write postamble time tWPST 0 4 0 6 TCK 3 Note 1 Maximum burst refresh of 8 2 The specific requirement is that DQS be valid High or Low on or before this CK edge The case shown DQS going from High_Z to logic Low applies when no writes were previously in progress on the bus If a previous write was in progress DQS could be High at this time depending on tDQSS 3 The Maximum limit for this parameter is not a device limit The device will operate with a great value for this parameter but system performance bus turnaround will degrade accordingly 4 For registered DIMMs tCL and tCH are gt 45 of the period including both the half period jitter tJIT HP of the PLL and the half period jitter due to crosstalk tUIT crosstalk on the DIMM 5 A write command can be applied with tRCD satisfied after this command Transcend Information Inc 9 184PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 SIMPLIFIED TRUTH TABLE V Valid X Don t Care H Logic High L Logic Low COMMAND CKEn 1 CKEn CS RAS CAS IWE BAo 1 A1o AP
8. 84PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 72 Manufacturing Location T 54 54 53 31 36 4D 4C 73 90 Manufacturers Part Number TS16MLD64V6G 44 36 34 56 36 47 20 20 20 20 20 20 91 92 Revision Code 0 93 94 Manufacturing Date By Manufacturer Variable 95 98 _ Assembly Serial Number By Manufacturer Variable 99 127 Manufacturer Specific Data 128 255 Unused Storage Locations Undefined 0 Transcend Information Inc 12
9. D 20 ns Row active to Row active delay tRP 20 ns Row active to Row active delay tRRD 15 ns Write recovery time tWR 15 tCK Last data in to Read command tCDLR 1 tCK Col Address to Col Address delay tCCD 1 tCK Clock cycle time tCK 7 5 12 ns 4 Clock high level width tCH 0 45 0 55 tCK Clock low level width tCL 0 45 0 55 tCK DQS out access time from CK CK tDQSCK 0 75 0 75 ns Output data access time from CK CK tAC 0 75 0 75 ns Data strobe edge to output data edge tDQSQ 0 5 ns 4 Read Preamble tRPRE 0 9 1 1 tCK Read Postamble tRPST 0 4 0 6 tCK CK to valid DQS in tDQSS 0 75 1 25 tCK DQS in setup time tWPRES 0 ns 2 DQS in hold time tWPREH 0 25 tCK DQS falling edge to CK rising setup time tDSS 0 2 tCK DQS falling edge from CK rising hold time tDSH 0 2 tCK DQS in high level width tDQSH 0 35 tCK DQS in low level width tDQSL 0 35 tCK DQS in cycle time tDSC 0 9 1 1 tCK Address and Control input setup time tIS 0 9 ns Address and Control input hold time tlH 0 9 ns Data out high impedance time from CK CK tHZ 0 75 0 75 ns Data out low impedance time from CK CK tLZ 0 75 0 75 ns Mode register set cycle time tMRD 15 ns Transcend Information Inc 8 184PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 DQ amp DM setup time to DQS tDS 0 5 ns DQ amp DM hold time to DQS tDH 0 5 ns DQ amp DM input pulse width tDIPW 1 75 ns Power down exit time tPDEX 7 5 ns Exit self
10. S 178 DQ62 41 A2 87 DQ58 133 DQ31 179 DQ63 42 VSS 88 DQ59 134 CB4 180 VDDQ 43 A1 89 VSS 135 CB5 181 SAO 44 CBO 90 NC 136 VDDQ 182 SA1 45 CB1 91 SDA 137 CKO 183 SA2 46 VDD 92 SCL 138 CKO 184 VDDSPD Please refer Block Diagram Transcend Information Inc 3 TS16MLD64V6G 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx16 CL2 5 Block Diagram A0 A12 A0 A12 BA0 BA1 BAO PAT DQ0 DQ63 DQ0 DQ15 IRAS ICAS WE 0 KEO CKO CKO DQ32 DQ47 IRAS ICAS ME ICS CKE CK1 CK1 BS DM4 DM5 DQS4 DQS5 A0 A12 BA0 BA1 DQ16 DQ31 RAS ICAS IWE ICS CKE CK CK 16Mx16 DDR SDRAM DM2 DM3 DQS2 DQS3 A0 A12 BA0 BA1 DQ48 DQ63 RAS CAS 16Mx16 DDR 16Mx16 DDR SDRAM SDRAM EEPRO M SCL SCL SDA SDA AO A1 A2 EAO EA1 EA2 This technical information is based on industry standard data and tests believed to be reliable However Transcend makes no warranties either expressed or implied as to its accuracy and assume no liability in connection with the use of this product Transcend reserves the right to make changes in specifications at any time without prior notice Transcend Information Inc 184PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit Voltage on any pin relative to Vss VIN VOUT 0 5 3 6 V Voltage on VDD supply to Vss VDD VDDQ 1 0 3 6 V Storage tempera
11. TS16MLD64V6G 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx16 CL2 5 Description The TS16MLD64V6G is a 16M x 64bits Double Data Rate SDRAM high density for DDR266 The TS16MLD64V6G consists of 4pcs CMOS 16Mx16 bits Double Data Rate SDRAM in 66 pin TSOP II 400mil packages and a 2048 bits serial EEPROM on a 200 pin printed circuit board The TS16MLD64V6G is a Dual In Line Memory Module and is intended for mounting into 184 pin edge connector sockets Synchronous design allows precise cycle control with the use of system clock Data I O transactions are possible on both edges of DQS Range of operation frequencies programmable latencies allow the same device to be useful for a variety of high bandwidth high performance memory system applications Features e Power supply VDD 2 5V 0 2V VDDQ 2 5V 0 2V e Max clock Freq 133MHZ e Double data rate architecture two data transfers per clock cycle e Differential clock inputs CK and CK e DLL aligns DQ and DQS transition with CK transition e Auto and Self Refresh 7 8us refresh interval e Data I O transactions on both edge of data strobe e Edge aligned data output center aligned data input e Serial Presence Detect SPD with serial EEPROM e SSTL 2 compatible inputs and outputs e MRS cycle with address key programs CAS Latency Access from column address 2 5 Burst Length 2 4 8 Data Sequence Sequential amp Interleave Placement Ol co
12. embly 0 00 8 VDDQ and Interface Standard of this Assembly SSTL 2 04 9 DDR SDRAM Cycle Time at CAS Latency 2 5 7 5ns 75 10 DDR SDRAM Access Time from Clock at CL 2 5 0 75ns 75 11 DIMM configuration type non parity Parity ECC NON ECC 00 12 Refresh Rate Type 7 8us Self Refresh 82 13 Primary DDR SDRAM Width X16 10 14 Error Checking DDR SDRAM Width z 00 15 Min Clock Delay for Back to tCCD 1CLK 01 Back Random Column Address 16 Burst Lengths Supported 2 4 8 OE 17 of banks on each DDR SDRAM device 4 bank 04 18 CAS Latency supported 2 2 5 oC 19 CS Latency 0 CLK 01 20 WE Latency 1 CLK 02 21 DDR SDRAM Module Attributes Deere 20 Clock Input 22 DDR SDRAM Device Attributes General Hoey volage 00 tolerance 23 DDR SDRAM Cycle Time CL 2 0 10ns AO 24 DDR SDRAM Access from Clock CL 2 0 0 75ns 75 25 DDR SDRAM Cycle Time CL 1 5 00 26 DDR SDRAM Access from Clock CL 1 5 00 27 Minimum Row Precharge Time tRP 20ns 50 28 Minimum Row Active to Row Activate delay tRRD 15ns 3C 29 Minimum RAS to CAS Delay tRCD 20ns 50 30 Minimum active to Precharge time tRAS 45ns 2D 31 Module ROW density 128MB 20 32 Command Address Input Setup Time 0 9ns 90 33 Command Address Input Hold Time 0 9ns 90 34 Data Signal Input Setup Time 0 5ns 50 35 Data Signal Input Hold Time 0 5ns 50 36 61 Superset Information 00 62 SPD Data Revision Code 00 63 Checksum for Bytes 0 62 A6 64 71 Manufacturers JEDEC ID Transcend TF 4F Transcend Information Inc 11 1
13. is High at read write row active and precharge bank C is selected If both BAO and BA1 are High at read write row active and precharge bank D is selected If A10 AP is High at row precharge BAO and BA are ignored and all banks are selected During burst write with auto precharge new read write command cannot be issued Another bank read write command can be issued after the end of burst New row active of the associated bank can be issued at tRP after the end of burst Burst stop command is valid at every burst length DM sampled at the rising and falling edges of the DQS and Data in is masked at the both edges Write DM latency is 0 This combination is not defined for any function which means No Operation NOP in DDR SDRAM Transcend Information Inc 10 TS16MLD64V6G Serial Presence Detect Specification 184PIN DDR266 Unbuffered DIMM 128MB With 16Mx16 CL2 5 Serial Presence Detect Byte No Function Described Standard Specification Vendor Part 0 of Bytes Written into Serial Memory 128bytes 80 1 Total of Bytes of S P D Memory 256bytes 08 2 Fundamental Memory Type DDR SDRAM 07 3 of Row Addresses on this Assembly 13 oD 4 of Column Addresses on this Assembly 9 09 5 of Module Rows on this Assembly 1bank 01 6 Data Width of this Assembly 64bits 40 7 Data Width of this Ass
14. ive to a VREF envelope that has been bandwidth limited 2OMHz AC OPERATING TEST CONDITIONS VDD 2 5 VDDQ 2 5 TA 0 to 70 C Parameter Value Unit Note Input reference voltage for Clock 0 5 VDDQ V Input signal maximum peak swing 1 5 V Input Levels VIH VIL VREF 0 31 VREF 0 31 V Input timing measurement reference level VREF V Output timing measurement reference level Vtt V Output load condition See Load Circuit VIT 0 5 VDDQ moi lt Output OF room h VREF se 0 5 VDDQ Cioap 30pF 7 17 Output Load circuit Input Output CAPACITANCE Von 2 5V Voda 2 5V TA 25 C f 1MHz Symbol Min Unit Input capacitance AO A12 BAO BA1 RAS CAS WE CIN1 29 34 pF Input capacitance CKEO CIN2 29 34 pF Input capacitance CSO CIN3 26 30 pF Input capacitance CKO CK1 CIN4 30 32 pF Input capacitance DMO DM7 CIN5 8 9 pF Data and DQS input output capacitance DQ0 DQ63 COUT1 8 9 pF Transcend Information Inc 184PIN DDR266 Unbuffered DIMM TS1 6M LD64V6G 128MB With 16Mx16 CL2 5 AC Timing Parameters amp Specifications These AC characteristics were tested on the Component Parameter Symbol Min Max Unit Note Row cycle time tRC 65 ns Refresh row cycle time tRFC 75 ns Row active time tRAS 45 120K ns RAS to CAS delay tRC
15. ture TSTG 55 150 C Power dissipation PD 6 W Short circuit current los 50 mA Mean time between failure MTBF 50 year Temperature Humidity Burning THB 85 C 85 Static Stress C Temperature Cycling Test TC 0 C 125 C Cycling C Note Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded Functional operation should be restricted to recommended operating condition Exposure to higher than recommended voltage for extended periods of time could affect device reliability DC OPERATING CONDITIONS Recommended operating conditions Voltage referenced to Vss 0V TA 0 to 70 C Parameter Symbol Min Max Unit Note Supply voltage VDD 2 3 2 7 V I O Supply voltage VDDQ 2 3 2 7 V I O Reference voltage VREF _ VoDQ 2 50mV VDDQ 2 50mV V 1 I O Termination voltage VTT VREF 0 04 VREF 0 04 V 2 Input logic high voltage VIH DC VREF 0 15 VDDQ 0 3 V 4 Input logic low voltage VIL DC 0 3 VREF 0 15 V 4 Input Voltage Level CK and CK inputs VIN DC 0 3 VDDQ 0 3 V Input Differential Voltage CK and CK inputs VID DC 0 3 VDDQ 0 6 V 3 Input crossing point voltage CK and CK inputs VIX DC 1 15 1 35 V 5 Input leakage current lI 2 2 uA Output leakage current OZ 5 5 uA Output High Current Normal strength driver IOH 16 8 mA VOUT VTT 0 84V Output Low Current Normal strength driver IOL 16 8 mA VOUT VTT 0 84V Output High Current Half strength driver IOH
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