Enermax ELC-LT240-HP
Contents
1. 609 ENERMAX POWER INNOVATION DESIGN LIQTECH 240 IN ONE LIQUID COOLER ELC LT240 ENERMAX POWER INNOVATION DESIGN Index Limited Warranty Specification Part list Intel Installation AMD Installation 16 ENERMAX POWER INNOVATION DESIGN Limited Warranty Please read this limited warranty carefully Warranty is subject to void under following criteria 1 The serial number label or warranty seal is defaced modified or removed 2 Taking apart of the product and or modification of any component or cable without ENERMAX s written authorization 3 Ignoring connector s faulty insertion prevention design by attaching a connector to a device under incorrect orientation 4 Damage caused by natural phenomena or uncontrollable forces such as lightning flooding fire earthquake or misuse abuse negligence accident wear and tear mishandling misapplication This ENERMAX Technology Corporation product is warranted to be free from defects in material and workmanship for a period of two 2 years from the date of purchase ENERMAX Technology Corporation agrees to repair or replace the product at its own option and at no charge if during the warranty period it is returned to nearest ENERMAX Technology Corpora tion subsidiary agent with all shipping charges prepaid and if inspection reveals that the product is defective Please present the proof of purchase for requesting RMA C2. sesuai di back plate untuk socket CPU anda Moxany cta nonoxwre kBanparnyto Npoknagky Ha LeHTparbHoe orBepcrue kpen xHo D aCTHHbl YeTAHOBMTE BUHTBI AVIA KPEN KHO MNacTUHbI B COOTBETCTBYIOLUME OTBEPCTUA ANA Bawero npoueccopa a i LIQTECH 240 Install the AMD back plate on to the back of motherboard fix the back plate with the stand off Befestigen Sie die AMD Backplate auf der Mainboard R ckseite Schrauben Sie die Backplate mit den zugeh rigen Abstandshaltern fest 3 8 Installez la plaque arri re AMD sous la carte m re l aide des vis du support Installare la piastra posteriore AMD nella parte posteriore della scheda madre fissare la piastra posteriore con il montante Instalar la placa posterior AMD en la parte posterior de la placa madre fijar la placa posterior con el tornillo de pilar Umie ptyte mocujaca pod p yt g wn i wkr za pomoc nakr tek mocuj cych AMO MUERES ENTERA TRAMDSR MARIE SIXE T ERED AMDA YI TL REZA RORI MEL SAY CHELT FEL AMD 4 ID Pasang back plate AMD pada bagian belakang motherboard kencangkan back plate dengan stand off YcTaHoBuTe kpen xHylo nnactuHy AMD Ha MaTepuHckol nate 3aTeM 3akpenure Kpen xHyto niiacrHy c NOMOLUbIO BAHTOB 22 ENERMAX POWER INNOVATION DESIGN Ap
3. U und drehen Sie die Federschrauben fest bis alle vier Seiten fixiert sind Placez la pompe sur le CPU et serrez les vis ressort jusqu ce que les quatre coins soient bien fix s Posizionare la pompa sulla CPU e fissare le viti fino a che tutti e quattro gli angoli siano fissati Coloque la bomba en la CPU y apriete los tornillos hasta que las cuatro esquinas est n fijadas Umie pompe na procesorze i przykre wszystkie cztery srubki spr yste 7k FRAO CPU_E sh SH BE Dj 98 RE AR A W7KIR BF CPU LIEB 1A 2 AY 58683092 24 p E SRA ERLIAARRYS 7 CPUO ELCISIREUC FEU S cru HE ul DA ID Tempatkan pompa pada CPU dan kencangkan keempat sekrup sampai keempat sudut aman YcrauoBure Hacoc Ha npoueccope n 3aTAHUTE Bce 4 ra kn 13 LIQGTECH Intel Connect the pump power connector to the motherboard SchlieBen Sie den Stromstecker der Pumpe am Mainboard an Branchez le connecteur d alimentation de la pompe a la carte m re Collegare il connettore di alimentazione della pompa alla scheda madre Conecte el cable de la bomba a la placa madre Podtacz wtyczke do zasilania pompy do plyty gtownej HEKRERKER TAREAS EAA E DT fe E KA IDIRIA FAK ELCH CFL Inl Hubungkan konektor daya pompa ke motherboard Tloxanylcra nogKnioynTe paz
4. are secured Platzieren Sie die Pumpe auf der CPU und drehen Sie die Federschrauben fest bis alle vier Seiten fixiert sind Placez la pompe sur le CPU et serrez les vis a ressort jusqu a ce que les quatre coins soient bien fix s Posizionare la pompa sulla CPU e fissare le viti fino a che tutti e quattro gli angoli siano fissati Coloque la bomba en la CPU y apriete los tornillos hasta que las cuatro esquinas est n fijadas Umie pompe na procesorze i przykre wszystkie cztery srubki spr yste iG 7k FRB S CPU E 3E SHE P038 IRA TEKRBCT CPU LIA id RS BEER 2 1 E BARD EBALTKARY Z CPUO E LCIBSREUC RF Us CPUO zzz MIA LAS ID Tempatkan pompa pada CPU dan kencangkan keempat sekrup sampai keempat sudut aman YcrauoBure Hacoc Ha npoueccope n 3aTAHUTE Bce 4 ra kn 25 LIQTECH 240 Connect the pump power connector to the motherboard SchlieBen Sie den Stromstecker der Pumpe am Mainboard an Branchez le connecteur d alimentation de la pompe a la carte m re Collegare il connettore di alimentazione della pompa alla scheda madre Conecte el cable de la bomba a la placa madre Podtacz wtyczke do zasilania pompy do plyty gtownej HIEKRERKER Sk RBS zEUURIS Diete IRL TDIRIB AR YAR FLCCC FEU ID Hubungkan konektor daya pompa ke motherboard Noxany
5. be Length Weight w o fan Bracket Compatibility Dimension Bearing MTBF Speed Rated Voltage El Rated Current Air Flow Static Pressure Noise Level Connector Copper Ceramic Bearing 50 000 hrs 2500 rpm 12V 0 3A 273 x 120x27 mm Aluminium Polyamide PA rubber 310 mm 1095 g Intel LGA 775 1150 1155 1156 1366 2011 AMD AM2 AM2 AM3 AM3 FM1 FM2 FM2 120 x 120 x 25 mm Twister Bearing 160 000 hrs 600 1300 2000 2500 rpm 12V 0 13A 0 27A 0 45A 28 6 60 3 88 9 111 0 CFM 48 5 102 4 150 9 188 7 m3 h 0 8 1 7 4 7 7 4 mm H20 15 21 5 27 30 dBA 4 pin PWM ENERMAX POWER INNOVATION DESIGN Part list Cooler x 1 Back Plate x 1 By Square Spacer x 1 Stand off x 4 Fan Screw x 8 Case Screw x 8 Spring Screw x 4 Wl intel Clip x 2 AMD Clip x 2 Intel LGA 2011 Position Screw x 4 Screw x 4 Insulating sheet x 4 Thermal Grease x 1 DI PWM Y cablex 1 e LIQTECH 240 Intel Installation ENERMAX POWER INNOVATION DESIGN Intel Silent mode 600 1300 rpm Performance mode 600 2000 rpm OverClock mode 600 2500 rpm Choose your desired max fan speed by adjusting the speed control at the fan hub Wahlen Sie die gew nschte Maximaldrehzahl des L fters ber den kleinen Regler an der L fternabe D terminez la vitesse de rotation maximale du ventilateur en r glant le dispositif central Selezionare la velocit massima della ventola attraverso il
6. bem NUTAHUA Hacoca K MaTepuHckol nare si ENERMAX POWER INNOVATION DESIGN Intel Connect the fan connector to the motherboard SchlieBen Sie den 4 Pin PWM Stecker des L fters am Mainboard an fax Branchez le connecteur du ventilateur la carte m re Collegare il connettore della ventol Conecte el conector del ventilador Podtacz wtyczke 4 pin PWM wenty rana ERRE a alla scheda madre a la placa madre latora do ptyty gtownej GUS BRS LADA DP YARIS ELI RBZ Xr HEGEL T REL yy ID Hubungkan konektor kipas ke motherboard Noxany cta nonkniouure pazbem BEHTUNATOPa K MarepuHcko Nate 15 LIQTECH 240 AMD Installation 16 ENERMAX POWER INNOVATION DESIGN Silent mode 600 1300 rpm Performance mode 600 2000 rpm OverClock mode 600 2500 rpm Choose your desired max fan speed by adjusting the speed control at the fan hub Wahlen Sie die gew nschte Maximaldrehzahl des L fters ber den kleinen Regler an der L fternabe D terminez la vitesse de rotation maximale du ventilateur en r glant le dispositif central bg Selezionare la velocit massima della ventola attraverso il regolatore di velocit nella parte posteriore della ventola Seleccione la velocidad m xima del ventilador a trav s del control de velocidad en la parte trasera del ventilador Pym We
7. cta noniurouure pazbem NUTAHMA Hacoca K MaTepuHckoli nnare 2262 AX POWER INNOVATION DESIGN Connect the fan connector to the motherboard Schlie en Sie den 4 Pin PWM Stecker des L fters am Mainboard an fax Branchez le connecteur du ventilateur la carte m re Collegare il connettore della ventola alla scheda madre Conecte el conector del ventilador a la placa madre Podtacz wtyczk 4 pin PWM wentylatora do ptyty g wnej ERRATE iS 585 EREIN e DLE RE DPV ARIZ EE FELTRE m Hubungkan konektor kipas ke motherboard Noxany cta noaknrouure pa3eeM BEHTUNATOPa K MaTepuHckol nnate 27 609 ENERMAX POWER INNOVATION DESIGN LIQTECH 240 AII IN ONE LIQUID c U COOLER 2013 Enermax Technology Corporation All rights reserved Technical changes printing errors and mistakes excepted
8. dtug wymaga systemu wybierz maksymaln pr dko wentylatora za pomoc ma ego prze cznika z ty u wentylatora REIER DISS ERE WMA EE SR REP LIZA PWMA BRAK gt sl REES TP 50D CIBSEETUCU S AC Y FO BEA AO Tc GA BIRLT RE H SSS m Pilih kecepatan kipas yg anda inginkan dengan menyesuaikan kontrol kecepatan pada fan hub Bbi6epuTe ckopocrb BpaujeHua BEHTUNATOPa MaNeHbKMM nepekxntoyatenem Ha o6patHo cropoHe BeHTUNATOPA 17 LIQTECH 240 Attach the fan and the radiator to the chassis Schrauben Sie den L fter und den Radiator am Geh use fest lw Fixez le ventilateur et le radiateur sur le chassis Fissare la ventola e il radiatore al case Fijar el ventilador y el radiador a la caja Zamontuj wentylator i radiator na obudowie komputerowej Be BUS BE AR ABP EUR RARA ZTVEZUI A cHiIBUCZ ARCBURVUCF amp EU YSIS PC ID Pasang kipas dan radiator ke casing 3akpenure BEHTUNATOP n pagnaTtop Ha Kopnyce 18 60 ENERMAX POWER INNOVATION DESIGN Remove the preinstalled Intel clip and install the AMD clip to the pump Entfernen Sie die vorinstallierten Halterungen f r Intel Plattformen und montieren Sie die AMD Halterungen an der Pumpe Enlevez les clips Intel pr install s et fixez les clips AMD la pompe Rimuovere il clip Intel preinstallat
9. e hole on the back plate for your CPU socket Drehen Sie die Montageschrauben in die zu Ihrem Sockel passende Bohrung in der Backplate Ins rez la vis de fixation a l emplacement pr vu sur la plaque arri re de votre CPU Inserire le viti di montaggio nel foro appropriato nella piastra posteriore per il socket della vostra CPU Inserte los tornillos de montaje en el agujero correspondiente en la placa trasera del socket de la CPU W zaleznosci od platformy procesora wkre ruby dystansowe w odpowiednie otwory na ptycie mocujacej Backplate TR Sec Re I XE RRR A S E IS A IR FL TR ZR SECPUST BAD gt Rtg TE YL A cPUY TY iO fel v7 ZbL FESBA TE dB CEE S cru Y SO ALS 184 TEN ID Posisikan sekrup pada lubang yang sesuai di back plate untuk socket CPU anda YcTaHOBMTe BUHTbI ANA KPEnN KHO NNACTNHbI B COOTBETCTBYIOLUME OTBEPCTUA ANA Bawero npoueccopa LIQTECH 240 LGA775 Intel Notice For LGA775 please place the square spacer on the central hole of the back plate Bitte beachten Sie F r LGA775 Plattformen muss ein zusatzlicher Unterlegrahmen ber die Backplate Offnung gelegt werden Remarque pour LGA775 veuillez placer l entretoise carr sur le trou central situ sur la plaque arri re Attenzione per LGA775 sistemare il distanziatore sul foro centrale della piastra posteriore Ate
10. ert the position screw into the appropriate hole on the back plate for your CPU socket Legen Sie den Unterlegrahmen ber die Backplate Offnung Drehen Sie die Montageschrauben in die zu Ihrem Sockel passende Bohrung in der Backplate Veuillez placer l entretoise carr sur le trou central situ sur la plaque arri re Ins rez la vis de fixation l emplacement pr vu sur la plaque arri re de votre CPU Sistemare il distanziatore sul foro centrale della piastra posteriore Inserire le viti di montaggio nel foro appropriato nella piastra posteriore per il socket della vostra CPU Coloque el espaciador en el agujero central de la placa posterior Inserte los tornillos de montaje en el agujero correspondiente en la placa trasera del socket de la CPU Umies podktadke nad otw r w plycie mocujacej Backplate W zaleznosci od platformy procesora wkr ruby dystansowe w odpowiednie otwory na p ycie mocujacej Backplate DI 75277688 HEURE EH ARI MARAE CPUT ERE XE TAS ARS FUSE BIERRE PIAR MHRABCPUSH ERA EEE SAFLE PAN 4 EINY IT b FOripIcBURI CF Us CPUV TY Mio ta vv 7 Z b bo SERE EL Ew d CU ID Tempatkan spacer persegi pada tengah lubang di back plate Posisikan sekrup pada lubang yang
11. erteilen Sie gleichm ig eine d nne Schicht W rmeleitpaste auf der CPU Oberflache Appliquez une couche uniforme de p te thermique sur la surface du CPU Applicare in modo uniforme la pasta termica sulla superficie della CPU Aplicar de forma uniforme la pasta t rmica en la superficie de la CPU Nat z r wnomiernie cienk warstw pasty termoprzewodzacej na metalow ostone na procesorze HEALEY 5 RS ARCU S TT BHECPUE REUS SIRIA IAA Y VIVIVRECPUDRAITII ACE 54 538 FE CPU BHO BH In Oleskan secara merata thermal pasta ke permukaan CPU HaHecure Tepmonacty paBHomepHo Ha noBepxHocrb npoueccopa LIQTECH 240 Intel Remove the protect film from the cold plate Entfernen Sie die Schutzfolie von der K hlplatte der Pumpe Retirez le film protecteur de la plaque froide Rimuovere la pellicola di protezione dalla piastra di raffreddamento Quite la pel cula de protecci n del bloque de refrigeraci n Zdj folie ochronn z bloku wodnego HRD 2k 72 ARRERA EROS KRIAR T A IVEFL hORBI 1 IVLEALT REL BES ID Lepaskan pita pelindung dari plat pendingin Moxanyiicra ynanure 3aL4MTHYIO KpbILKY c OXAK AALE NNACTHHbI 12 ENERMAX POWER INNOVATION DESIGN Intel Place the pump on the CPU and tighten the spring screws until all four corners are secured Platzieren Sie die Pumpe auf der CP
12. harges for removing or installing the product are excluded under the terms of this warranty agreement This warranty shall not apply to any product which has been subject to connection to a faulty power source alteration negligence or accident or to any product which has been installed other than in accordance with these instructions In no event shall ENERMAX Technology Corporation or its subsidiaries or agents be liable for damages for a breach of warranty in an amount exceeding the purchase price of this product If you are uncertain whether or not your ENERMAX liquid cooler is defective please contact your dealer reseller for support Web Site http www enermax com E mail enermax enermax com tw ENERMAX Technology Corporation 15F 2 No 888 Jing Guo Road Taoyuan City 330 Taiwan R O C Tel 886 3 316 1675 Fax 886 3 346 6640 2013 ENERMAX Technology Corporation All rights reserved Specifications are subject to change without prior notice Actual product and accessories may differ from illustrations Omissions and printing errors excepted Content of delivery might differ in different countries or areas Some trademarks may be claimed as the property of others Reproduction in any manner without the written permission of ENERMAX is strictly forbidden is Specification LIQTECH 240 Cold Plate Material Bearing MTBF Pump Motor Speed Rated Voltage Rated Current Dimension Radiator Material Material Tu
13. kr za pomoc nakr tek mocuj cych intel BRL EEE FARE intel AL ER ELE RS SLRE T SE MC TT Intel V7 7 LL FA FAR FORINTREL BRAY CIBIREU C FEN Intel 8 DIGHE Dot y ID Pasang back plate intel pada bagian belakang motherboard kencangkan back plate dengan stand off YcTaHoBuTe kpen xHyto nnactuHy Intel Ha MatepuHckol nnare 3arem 3aKpenuTe Kpen xHyto M acTuHy C NOMOLLbIO BHHTOB LIQTECH 240 Intel LGA2011 Tighten the Intel LGA 2011 screw to the motherboard Schrauben Sie die Backplate mit den passenden LGA2011 Abstandshaltern am Mainboard fest Serrez la vis du support Intel LGA2011 a la carte m re Fissare i montanti per Intel LGA 2011 alla scheda madre Fije los tornillos de pilar para Intel LGA 2011 a la placa madre Przykre plyte mocujaca za pomoca przeznaczonych do platformy LGA2011 nakretek dystansowych 3E LGA201152 KEER ERE T8LGA201138 E EEE SR BB IE SERE E Intel LGA 20110354 20118 JB Ze BRI UJ Vv 7 TL MAZA FICBIREUC FEU Intel LGA 2011 DS Kencangkan Intel LGA 2011 sekrup ke motherboard 3arauure raviku Intel LGA 2011 Ha MarepuHckol nare 10 ENERMAX POWER INNOVATION DESIGN Intel Apply the thermal grease evenly on the CPU surface V
14. nci n para LGA775 coloque el espaciador en el agujero central de la placa posterior Uwaga Platformy LGA775 wymagaja dodatkowg podktadke Umies podktadke nad otw r w plycie mocujacej Backplate B 24LGA77 50M SETA TE SR FUIS AR RIM HE MURSEEFBRUCPUZILGA775SE gt MBA BAB TARA 33 LGA77500388 VUfB AA 9 11977 L ORIENT REL El LGA775 Y Setol Inl Perhatian untuk LGA 775 tempatkan spacer persegi pada tengah lubang di back plate FU BHumaHue Ecnu y Bac npoueccop Intel LGA775 noxanylcra nonoxwre kBanparHyto npok laAKy Ha ueHrpa ibHoe orBepcrue Kpen xKHOM NNACTNHbI ENERMAX POWER INNOVATION DESIGN x LGA775 1150 1155 1156 1366 LL LA HA HA Intel Install the Intel back plate on to the back of motherboard fix the back plate with the stand off J Befestigen Sie die Intel Backplate auf der Mainboard R ckseite Schrauben Sie die Backplate mit den zugeh rigen Abstandshaltern fest Installez la plaque arri re Intel sous la carte m re l aide des vis du support bg Installare la piastra posteriore Intel nella parte posteriore della scheda madre fissare la piastra posteriore con il montante 33 Instalar la placa posterior Intel en la parte posterior de la placa madre fijar la placa posterior con el tornillo de pilar Umie ptyte mocujaca pod p yt gt wna i w
15. o e installare il clip AMD alla pompa Quitar el clip Intel preinstalado e instalar el clip AMD a la bomba bal Ei kd m BEEEB EH Zdja przeznaczone do procesor w Intel wsporniki mocujace i zamontuj wsporniki mocujace do procesor w AMD BRR Intel RAR E AMD Sc RISI TE ER BUR Intel 3I RA S2 AMD ART RI JU ABI STUCUTE7 87 SEAL AMD 2745 RU T CIEE amp a amp lintel SES 400 S Lepaskan clip intel yang sudah terpasang pada pompa dan gunakan clip amd pada pompa Pi E El Pei indi Pd Pa E iem Yaanute npeaycrauoBnenHoe Kpennenne Intel n ycraHoBute AMD Kpennenne K Hacocy 19 LIQTECH 240 Stick the insulating sheet on the appropriate position Legen Sie die Entkopplungsplatten an die vorgesehenen Stellen auf der Backplate Collez la feuille d isolation sur la position appropri e Attaccare il foglio isolante nella posizione appropriata Pegue la hoja aislante en la posici n adecuada Umie podktadki do ttumienia drga na odpowiednich miejscach plyty mocujacej Backplate PRAMAS RAS FAM A TAE AIRY PES ICAU TIT TRE ID Tempelkan lembar insulting pada posisi yang sesuai Hakneiite u30n8UMOHHYIO npOK IaAKy Ha COOTBETCTBYIOLUYIO NOZUUMIO 20 ENERMAX POWER INNOVATION DESIGN Aligning Place the square spacer on the central hole of the back plate Ins
16. ply the thermal grease evenly on the CPU surface Verteilen Sie gleichm ig eine d nne Schicht W rmeleitpaste auf der CPU Oberflache Appliquez une couche uniforme de p te thermique sur la surface du CPU Applicare in modo uniforme la pasta termica sulla superficie della CPU Aplicar de forma uniforme la pasta t rmica en la superficie de la CPU Nat z rownomiernie cienka warstwe pasty termoprzewodzacej na metalowa ostone na procesorze HHA EDU HE ERIS CPU CUBE a 3 x V 20 AX CPUOXIBICISS ICT 4 238 ROC FEN CPU HAO BH H ID Oleskan secara merata thermal pasta ke permukaan CPU HaHecute Tepmonacty paBHoMepHo Ha noBepxHocrb npoueccopa 23 LIQTE CH 240 AMD Remove the protect film from the cold plate Entfernen Sie die Schutzfolie von der K hlplatte der Pumpe Retirez le film protecteur de la plaque froide Rimuovere la pellicola di protezione dalla piastra di raffreddamento Quite la pel cula de protecci n del bloque de refrigeraci n Zdj folie ochronn z bloku wodnego BUTS 7k 74 ER URSEERA S ERREI KRIET A IVEFL bh ORB 1 IVLENRLT REL MI ID Lepaskan pita pelindung dari plat pendingin NMoxany cta ynanure 3aL4MTHYIO 10 0 OxNaXgaowWel NnactuHbi 24 ENERMAX POWER INNOVATION DESIGN Place the pump on the CPU and tighten the spring screws until all four corners
17. regolatore di velocit nella parte posteriore della ventola Seleccione la velocidad m xima del ventilador a trav s del control de velocidad en la parte trasera del ventilador Wedtug wymagan systemu wybierz maksymalna predkos wentylatora za pomoca matego przetacznika z tytu wentylatora CEEI EMP WM ARE SE E HERE PWMABIBET AE UE 7277 RED E IFC BEH CE Tc Ilis BIRLT FEW H ID Pilih kecepatan kipas yg anda inginkan dengan menyesuaikan kontrol kecepatan pada fan hub Bbi6Gepure ckopocrb Bpauieuua BEHTUNATOPa ManeHbKkum nepekntovatenem Ha o6parHo CTOpoHe BEHTUNATOPA LIQTECH 240 Attach the fan and the radiator to the chassis Schrauben Sie den L fter und den Radiator am Geh use fest Fixez le ventilateur et le radiateur sur le chassis Fissare la ventola e il radiatore al case Fijar el ventilador y el radiador a la caja Zamontuj wentylator i radiator na obudowie komputerowej SCR SUB AA HE 16 xU EUR RCA HE 22 REL E IPIFII I II RELTA TFE PC DI Pasang kipas dan radiator ke casing 3akpenure BEHTUNATOP M pagnaTtop Ha kopnyce Intel 60 ENERMAX POWER INNOVATION DESIGN Step LGA775 1150 1155 1156 1366 OL L6A1366 PY Ne Intel LGA1150 1155 1156 Aligning Insert the position screw into the appropriat
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