Service Guide Specification
Contents
1. Add 300 3FF 300 3FF EE THO VE e Click Start button f Click Exit button 12 SERVICE OSD 1 Turn off the power switch at the front side of the display 2 Wait for about 5 seconds and press MENU POWER switch with 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a Auto Color W B balance and Automatically sets the gain and offset value b NVRAM INIT EEPROM initialize 24C08 CLEAR ETI To initialize using time d AGING Select Aging mode on off e R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually g R G B Offset Allows you to set the R G B Offset value manually Analog h R G B Gain Allows you to set the R G B Gain value manually Analog Only i MODULE To select applied module A N IBM Compatible PG Video Signal Generator PARALLEL PORT OFF 5V o Power inlet required Control Power Select Switch 110V 220V V Sync On Off Switch Switch must be ON Figure 1 Cable Connection 13 TROUBLESHOOTING GUIDE 1 POWER POWER INDICATOR OFF CHECK POWER BOARD 1 lt CHECK J705 VOLTAGE AND FIND OUT2. Chi X60V BE 200v soos Chi Z 2 00 1 5K 17 SUR USYNC1 HSYNC1 ADO MUTE DIMADI LAMPADI MODON ALE WDZ LED GR LED AM RDN D SCLA D SDAA KE YO KEY1 aD ADE ADI SUR SCLK SDATA 33 4 C15 4 C13 45 C4 C13 45 4 3 c1 lt 1 4 C4 1 1 4 1 4 4 4 1 1 1 35 4 94 4 C4 3 POWER L17505 L1950S POWER UBD3 4 LH1117 OUT e IN OUT S 9 1 80 1 A E 3 3uD i C832 7 100U 16U RADIAL 105DEREE 21 4 SUR 4 12US RPT P e e 5U 12U MoD 4 Q803 yak We C821 7 77 01U 1990 1650 C e C amp RADIAL UP 7 Q LOSDEREE R826 R807 R8O9 390 390 390 390 b L 7 E e 3 8 3UD 3 3vA i 2 MODON 81 7 C819 ab u 2 EY A 9 d G RADIAL N U802 PA UJ 1 J707 5 6 U801 1 U803 3 FDC6326L Tek 5 00MS s 355 Acqs Es E 2 009 50 045 Ch2 7 3 92V 21 Jul 2004 14 27 07 25 4 CONNECTOR amp JACKS ZUR Te lt 35 1 J707 5 6 U801 1 U803 3 Tek 5 00MS s 355 Acqs amp MI 5 3 A 62yus 147 C2 RMS BE 2 009 M50 0ps Ch2 7 3 92V 21 Jul 2004 14 27 07 Tek 25 0MS s 132 Acqs D oes Inverter Off Micom Port check J705 Inverter output
3. Ch2 2 00V M 10 0us Ch2 7 160mV 21 Jul 2004 1 00 v 15 22 22 4 4707 42 Tek 25 0MS s 73 Acqs I E Inverter On Micom Port check J705 Inverter output Ch2 Mid ons Ch2 Z i60mV 21 Jul 2004 1 00 v 15 23 00 8 L1750S L1950S CONNECTOR amp JACKS 4 SUR 23 7703 DSUB15P a RED 1 1 BLU DDCSU lt 2 ST DET R717 20701 A R716 4 7K 5 68 4 7K 7705 CONDLIP 8 OMM V 5 130 V 12V 12V GND GND SU 5V GND NC INU DIM LAMA 4 1205 3 SUR 2133 1 2 15K INVON 2 DIMADI 1 25 J727 CONDSP RADIAL TEMP 105 D c2 eBERBRRBREBE ERE ERE rl chy 1 1 2 4 LED AM 2 7 SUR 2 35 DF14A_20P_125H 1704 C716 R726 R727 L K10K C72 568P KDS184 READY 1 68P 1728 5 OMM U T gt CONDSP R 1205 3 SCLK 2 SDATA 2 cDOFMUTE 2 CON3 P J706 d J702 SE CONDEP E Su i D R782 1 2 2 3 1 2 3 pus uet mpo 3 o 1 8 z L4 ju jJ AB s h gy E _ 4 4 x Sa 5 amp 9 LED GR lt lt c729 C711 2 21U T Q1UT js g dsos SUR p snea 1 HSYNCi 1 USYNC1 1 p sca 1 SV 12V MOD Y3P A Y3M A CLKOUTP A CLKOUTM A Y2P A Y2M A YIP A YIM A Y P A YaM A Y3P B Y3M B CLKOUTP B CLKOUTM B
4. Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F Heat the component lead until the solder melts Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F First hold the soldering iron tip and solder the strand against the component lead until the solder melts b Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and ther bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When workina with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 above Removal 1 Desolder and siraighten each IC lead in one operation by
5. C2 RMS i i 5 130 V rana eh ana d i ani Heron Ba E 109mv i i C3 RMS Micom Port check Micom Port check AUN J705 Inverter output 9705 Inverter output 2 00 V M50 04s Ch2 7 3 92V 21Jul2004 cn2 Mi 0gs Ch2 7 160mV 21 Jul 2004 Ch2 2 00v Mi10 0us Ch2 7 160mV 21 jul 2004 14 27 07 TENDA 15 22 22 1 00 15 23 00 15 3 NO RASTER OSD IS NOT DISPLAYED gmZAN3SL NO RASTER OSD IS NOT DISPLAYED NO CHECK U803 U801 U201 POWER PINS 3 3V U201 PIN88 OSCILLATE AS 12MHZ NO 1 CHECK PIN88 SOLDERINGCONDITION 2 CHECK X501 2 TROUBLE IN U201 RA 5 5 CHECK CONNECTION PIN44 IS 60Hz V SYNC IS PULSE APPEARED LINE FROM U201 TO U501 U501 PIN8 CHECK 5VR LINE 5V TROUBLE iN CABLE OR ECD MODULE Waveforms 2 U201 88 6 U501 44 Tek 4 00GS s 1434 Acqs _ Be a a an ig amp Tek Run 5 00MS s Sample GRE Tek 25 0kS s C2 Freq 64 1075kHz M2 00ms 7 1 72V 21 Jul 2004 16 12 12 1 00V Wi ogs Ch2 Z 1 72V 21 Jul 2004 1 00V M 62 5ns Ch2 J 1 527 21 Jul 2004 14 57 40 16 31 06 2 00 V 16 4 NO RASTER OSD IS DISPLAYED gmZANSSL NO RASTER OSD IS DISPLAYED U201 POWER PIN99 1 8V PIN33 3 3V NO V CHECK 1803 U801 NO CHECK PC 2 CHEC
6. Y2P B Y2M B Y P B YIM B YOP B YOM B SV 12V MOD Y M A YIM A Y1P Y2M A Y2P A CLKOUTM A CLKOUTP A DDCSU 2 3 D SCLA 1 3 D SDAA 1 2 2 2 2 2 33 1 12 1 C1 1 1 1 1 1 c1 1 1 1 1 1 1 1 1 1 1 3 1 1 1 1 1 1 1 13 4 13 26 Dec 2004 P NO 3828TSL096P Printed in Korea SS lt gt
7. Nh 05017 OIZZTSZ594A L1750SN ZAN3SL MICOM ASSY L1750S OCK103CK51A 0 01UF 1608 50V 10 R TP B Y T 111502 01502408608 M24C08WMNET P LF SGS THOMSO OCK103CK51A 0 01UF 1608 50V 10 R TP B Y II U801 OIPMGKEO11A KIA78D33F R TP 3 3V OCK103CK51A 0 01UF 1608 50V 10 R TP B Y x Usos OIPMGSGO19A LD1117S18TR LF STM SOT223 R OCK103CK51A 0 010 1608 50V 10 R TP Q502 OIKE704200H KIA7042AP TO 92 TP 4 2 VOLT OCK103CK51A 0 010 1608 50V 10 R TP L OCK103CK51A 0 01UF 1608 50V 10 R TP B Y TRANSISTOR OCK103CK51A 0 01UF 1608 50V 10 R TP B Y OCK103CK51A 0 01UF 1608 50V 10 R TP BiY OTR390409AE FAIRCHILD KST3904 LGEMTF 0CE106CK610 10UF SHL SD 50V 20 BULK EL OTR390409AE FAIRCHILD KST3904 LGEMTF TP 0CCO30CKO1A 1608 50V 0 25 PF R TP NP OTR390409AE FAIRCHILD KST3904 LGEMTF 0CC180CK41A 18PF 1608 50V 554 R TP NPO OTR390609FA KST3906 MTF TP SAMSUNG SOT OCK103CK51A 0 01UF 1608 50V 19 OTR390609FA KST3906 MTF TP SAMSUNG SOT OCK105CD56A 1UF 1608 10 10 X7R 0TR127309AA KTA1273 Y KTA966A TP KEC TO L1750S OCK103CK51A 0 01UF 1608 50V 10 R TP OTR390409AE FAIRCHILD KST3904 LGEMTF TP L1750S OCK103CK51A QOO lF 1806 50V 10 R TP OTFVI80023A VISHAY SI3865DV R TP TSOP 6 L1950S 0CC101CK41A AGAPE 1608 50V 5 R TP NPO 0CC101CKA1A 4 00PF 1608 50V 5 R TP NPO 0CC680C 41 A G8PF 1608 50V 5 R TP NPO 0CC680CK41A 68PF 1
8. 0 0 467 Vp p c Color 15 0 0 714 Vp p 3 Input Impedance 75Q 3 3 Operating Frequency Horizontal 30 83kHz Vertical 56 75Hz 4 Max Resolution Analog 1280 x 1024 75Hz 5 POWER SUPPLY 5 1 Power AC 100 240V 50 60Hz 1 0A 5 2 Power Consumotion H V SYNC VIDEO POWER CONSUMPTION LED COLOR less than 43 W L1750S GREEN less than 45 W L1950S than 45 W L1950S less than 1 W AMBER ON OFF lessthan 1W AMBER OFFIOFF OFF lessthan 1W AMBER POWER ON NORMAL ON ON ISTE Pass than 45 W L1950S SUSPEND DPMS OFr 6 ENVIRONMENT 5 1 Operating Temperature 100595 50 F 95 F Ambient 1096 8096 Non condensing 6 2 Relative Humidity 6 3 MTBF 50 000 HRS wiht 90 Confidence level Lamp Life 50 000 Hours min 7 DIMENSIONS with TILT SWIVEL L1750S Width 368 mm 14 49 Depth 230 5 mm 9 07 Height 389 2 mm 15 32 L1950S Width 413 mm 16 26 Depth 230 5 mm 9 073 Height 421 4 mm 16 59 8 WEIGHT with TILT SWIVEL L1750S Net Weight 4 9 kg 10 80 Ibs Gross Weight 6 5 kg 14 33 Ibs L1950S Net Weight 5 7 kg 12 57 lbs Gross Weight 7 9 kg 17 42 lbs PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are important for safety These parts are marked Non the schematic diagram and the replacement parts list lt is essential that these critical part
9. ASSEMBLY FRAME MAIN L1950 LPL E03 TN AUO EN04 V2 A C SKD PWB PCB SEMB POWER M CHASSIS 1720 DOCKING 2PIN 450V POWER TOTAL LIEN CHANG PB FREE L1750S PWB PCB ASSEMBLY POWER M CHASSIS 19INCH TN 1720 DOCKING 2PIN 450V POWER TOTAL LIEN CHANG PB FREE ANALOG L19505 MAIN TOTAL ASSEMBLY L1750SN LPL ZANSSL BRAND CL 66 3313TL7087E MAIN TOTAL ASSEMBLY L1750SN LPL ZAN3SL MX C SKD BRAND CL 82 LF 3313TL9078A MAIN TOTAL ASSEMBLY L1950SN LPL ZAN3SL BRAND CL 66 3313TL9073E MAIN TOTAL ASSEMBLY L1950SN LPL ZAN3SL MX C SKD BRAND CL 82 LF 4951TK3 S202A METAL ASSEMBLY REAR SHIELD LX50 KUMI 4951TKS203B METAL ASSEMBLY REAR SHIELD LX50 KUMI A C SKD 100 3550 TKK7404 COVER L1750 BACK DOOR BRAND RT pesi TE 110 6871T9T798A PWB PCB ASSEMBLY SUB L1750 CONTROL TOTAL BRAND KEY 6871T9T798C 6871TST911A 6871TST911C PWB PCB ASSEMBLY SUB L1750 CONTROL TOTAL BRAND MX C SKD LF PWB PCB ASSEMBLY SUB L1950 CONTROL TOTAL BRAND KEY PWB PCB ASSEMBLY SUB L1950 CONTROL TOTAL BRAND MX C SKD LF 20 REPLACEMENT PARTS LIST CAUTION BEFORE REPLACING ANY OF THESE COMPONENTS READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL NOTE S SAFETY Mark A AL ALTERNATIVE PARTS DATE 2004 12 17 LOC NO PART NO DESCRIPTION SPECIFICATION DATE 2004 12 17 LOC NO PART NO DESCRIPTION SPECIFICATION MAIN BOARD 91 C832 OCE107EF628 100UF KMG
10. CPIO7 B4 amp 2 Ans 43 HDATA2 AD2 6521608856 2 2 2 Ant 1 44 HDATAL ADL CDTOOZBS 257 E 25 ADB A 45 HDATAZZADZ VBUFS_RPLL L 8 1 2 2 RDN D 37 RDN UCO LU Fr TIA 1 2 2 WDZ 156 WRN Tek 4 00GS s 1434 2 ALE 35 _IHCLK7ALE E EL c 23 MEM REG e 1 34 MEM_REG ES EA STI TM2e Z 6 ee NNNNMN 1 511 V R211 200000 222220 120 TY YY YY gt 01010101010 C2 Freq 11 91363MH2 istogram 8 BE 1 009 W62 5ns Ch2 7 1 52V 21 12004 14 57 40 xc 2 MICOM L1750S L1950S MICOM SUR 3s 45 SUR 33 4 N DIP TYPE 77777 C584 X OUT Aa Z 100 160 0501 SERA SUR MTV312PLCC Q522 KIA7 42DIP a 1 pa2 USYNC 2 DAL HSYNC i 2 22 DA3 UDD3 DA4 NC 1 DAS RST Das 8 UDD HBLANK Pb_3 VBLANK Yoo DAY HCLAMP lt os 4 SDATA a9 ISDA DAL2 4 SCLK re 14 ISCL 1 MEM REG FEZ is P4_2 ANI HE Ba 1 a 4 ST DET lle m 515 PI_2_INTO 1 LT 20 APf 2 1 AD3 E d A 154 1 3 Ct ADA 77 D1_4 3 42 SUR YY 3 43 SUR _ 77 ZI _ X OUT puse w 7 LA M ESTEE X IN C1 u 24LCOSGB Usa2 443 44 Tek Run 100kS s SE i I resolution H Sync Check i i 45 Imv c2 Freq 60 0237 Hz Unstable histogram V Sync Check l
11. NO DESCRIPTION SPECIFICATION 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP 0RJ3301D677 3 3K OHM 1 10 W 5 1608 R TP X501 6212AA2004A HC 49U TXC 12 2MHZ 30 PP 0RJ3301D677 3 3K OHM 1 10 W 5 1608 R TP AN 0RJ1000D677 100 OHM 1 10 W 5 1608 R TP CONTROL BOARD CDN 0RJ1000D677 100 OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP C1 OCK104CK56A 0 1UF 1698 50V 19 R TP X7R ORJ4701D677 4 7K OHM 1 10 W 5 1608 R TP C2 OCK104CK56A 0 107 1508 50V 40 X7R 0RJ4700D677 470 OHM 1 10 W 5 1608 R TP LEDI ODLLTO208AA LITEONiTST C155KGJSKT 0RJ4700D677 470 OHM 1 10 W 5 1608 R TP R1 0RJA701D677 4 7 lt OHM 1 10 W 5 1608 R TP 0RJ0332D677 33 OHM 1 10 W 5 1608 R2 0RJA701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0332D677 33 OHM 1 10 W 5 1608 R3 0RJ2001D677 2KOMM 1 10 W 5 1608 R TP 0RJ1000D677 100 OHM 1 10 W 596 1608 R TP R4 0RJ2001D677 2K OHM 1 10 W 5 1608 0RJ1000D677 100 OHM 1 10 W 596 1608 R TP R5 ORJ4701D677 47K OHM 1 10 W 5 1608 R TP 0RJ1501D677 1 5K OHM 1 10 W 5 1608 R TP L1750S Sw
12. for transfer the input AC voliage to a DC voltage through a bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to maxe a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize and also the over power proiscilon is also monitor by this part 5 Photo Coupier isolation This part functicri is to reed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage 6 Signal collection This part function is to collect the any change from the dc output and feed back to the primary through photo transistor sepu ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP Wi Port Setup Windows 98 gt Don t need setup Windows 2000 XP gt Need to Port Setup This program is available to LCD Monitor only 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe REMOVE _ HHETTIGVE c Remove all default number d Add 300 3FF UserPort Tomas Franzon 2000 20 01 51 00
13. gently prying up on the lead with the soldering iron tip as the solder melts Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the componant Bend into a U shape the end each of three leads remaining on the circuit board Bend into a U shape the replacement transistor leads Connect the replacement transistor leads to the corresponding leads exiendiria from the circuit board and crimp the U with long nose pliers to insure metal to metal contact trien solder each connection 2 Power Output Transister Device Removal Keplacement 1 Heat and emove an solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped Carefuily remove the transistor from the heat sink of the circuit board Insert new transistor in the circuit board Solder each transistor lead and clip off excess lead Replace heat sink CO Removal Replacement Remove defec
14. lt lt Dot Clock MHz Horizontal Frequency kHz Vertical Frequency Hz Horizontal etc us Verticai etc ms gt gt Duration Back Porch 86 48 640x350 60 70Hz 720x400 70Hz 640x480 60Hz 640x480 75Hz 800x600 60Hz 800x600 75Hz 832x624 75Hz 1024x768 60Hz 1024x768 75Hz 1152x900 75Hz 1152x900 65Hz 1280x1024 60Hz 1280x1024 75Hz 1 3 5 7 DISASSEMBLY 1 Pull the front cover upward 2 Then let the all latches are separated 3 Put the front face down 9p TTL wat ttti 11 un tot are 9 4 SIA 97 6777 t Remove the 6 screws from each up of metal frame Remove Al tape from control pcb fix Disassemble back cover 6 8 Remove the 4 screws from each side of metal frame BLOCK DIAGRAM 19 119148 JOLOAU JOMOd oO eee eee weIs S gt AI 43 V 12 O41u02 Ady OL n lt JONIWISUEAL ans q SUONI g 9 4 bojeuy 1SENYZUWD DESCRIPTION BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel cl
15. 5 T Y3M A 4 CLKP LU E R2 L T CLKOUTP A 4 CLKN LU_E RS CLKOUTM A 45 USS RPLL CH2P_LU_E RA 25 cas o g 85 AVSS_RPLL CH2EN_LV_EYRS 10 YPM A 4 A CHIP_LUV_E 7RS 11 YiP a 45 N CHIN_LU_E R7 12 YIM A 45 xX CH P LU E GU i3 Y2P a 45 IL 87_ XTAL CH N_LU_E G1 u m 45 x IN LT TCLK LZ il CHSP_LV_O G2 17 T Y3P B 4 Z A N 5 lz CH3N_LV_O G3 18 Y3M B 4 DI CLKP LU O G4 s a CLKOUTP B 43 4 RED 2 2 2 ZA RED CLKN_LV_ 0765 CLKOUTM B 4 2_N D REDZ CH2P_LV_0 766 21 Y2P B 4 lt 4 gt GRN 2 AD 77 GHILEIN CH2N_LUV_O GT 22 Y2M B 4 2 0 0 PA BREEN CHIP_LUV_0 7BQ 23 Y P B 4 UE ET L2 mu J BLUE CHIN_LU_O BI 24 ae cas L2 4 BLE CHZP LU O B2 zs ar CHYN_LV_O BS YOM B 4 2 4 R213 1 2g 3 ss HSYNC SU D E214 1 MV 2 p ss USYNC PPWR 30 2 i 73 SOG_MGSS PBIAS 2 M 91 N C 43 N C 1 2 ZAN3 RESET sa RESETN N C 45 GPIO1D IRQN CPIODU PLAMO 53 0 52024 1 2 x I 2 4 GPIOIZPWMI gt SERN 214 D SCLA RIPA i 2g ste DDC_SCL Bu P DR 1 2 p ss DDC_SDA GPIO2 DHS 54 1 2 D SDAA e AUD ON GPIO4 DEN 1 2 x MUTE 2 en 3 38 GPI013 AD7 GPIOZEZDCLK 257 2 ADE a 39 GPIO12 ADE 2 ens 40 GPIO11 ADS 2 anu 41 HFS ADA GPIO6 B7 _ 2 a 42 HDATA3 AD3
16. 608 50V 5 R TP NPO ORJ1000D677 100 OHM 1 10 W 5 1608 R TP 0CK105CD56A LIF 3608 10V 10 R TP X7R ORJ1000D677 100 OHM 1 10 W 5 1608 R TP 0CiX1032K51A 010 1608 50V 10 RITP B Y 0RJ1000D677 100 OHM 1 10 W 5 1608 R TP OCK104CK56A 0 1UF 1608 50V 10 R TP X7R 0RJ1200D677 120 OHM 1 10 W 5 1608 R TP OCK104CKS6A 0 1UF 1608 50V 10 R TP X7R 0RJ1200D677 120 OHM 1 10 W 5 1608 R TP OCK104CK56A 0 1UF 1608 50V 10 R TP X7R 0RJ1200D677 120 OHM 1 10 W 5 1608 R TP OCK103CK51A 0 01UF 1608 50V 10 R TP B Y 0RJ1000D677 100 OHM 1 10 W 5 1608 R TP OCK104CK56A 0 1UF 1608 50V 10 R TP X7R L1750S 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP OCK103CK51A 0 01UF 1608 50V 10 R TP B Y 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP OCE107EF610 100UF KMG RD 16V 20 FL BULK 0RJ0000D677 O0 OHM 1 10 W 5 1608 R TP OCE107EF628 100UF KMG RD 16V 20 FM2 5 T C SKD 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP OCK103CK51A 0 01UF 1608 50V 10 R TP B Y 0RJ1004D677 1000000 OHM 1 10 W 5 1608 R OCK103CK51A 0 01UF 1608 50V 10 R TP B Y 0RJ4701D677 4 7K OHM 1 10 W 5 1608 OCE107EF610 100UF KMG RD 16V 20 FL BULK 0RJ4701D677 4 7K OHM 1 10 W 5 1608 OCE107EF628 100UF KMG RD 16V 20 FM2 5 T C SKD 0RJ4701D677 4 7K OHM 1 10 W 5 1608 OCE107EF610 100UF KMG RD 16V 20 FL BULK C SKD 0RJ4701D677 4 7K OHM 1 10 W 5 1608 DATE 2004 12 17 DATE 2004 12 17 LOC NO PART NO DESCRIPTION SPECIFICATION LOC NO PART
17. A SHORT PIN5 PING 5V POINT AS OPENING EACH POWER LINE YES CHECK U801 PIN 1 amp U803 NL El PIN 3 VOLTAGE CHECK 0801 5V Y YES Q803 PIN 3 3 3V amp CHECK 5VR LINE 803 PIN 4 1 8V OPEN CHECK NO PROBLEM CHECK KEY CONTROL CONNECTOR ROUTINE IS U201 PIN88 VOLTAGE REPEATED AS PULSE NO CHECK IIC LINE CONNECTION 1501 41502 CHECK U201 VCC XTAL RESET Waveforms 1 J705 5 6 U801 1 U803 3 2 U201 88 TOP SUAE T LET Tek SH 4 00GS s 1434 Acqs UR E 1476 C2RMS 5 130 V ni C2 Freq 11 91363MHz i I Unstable Bia TN NE histogram 2 00V M50 0us Ch2 7 3 92V 21 12004 14 27 07 1 00V M625ns Ch27 1 52V 21 ul2004 14 57 40 14 2 NO RASTER OSD IS NOT DISPLAYED LIPS NO RASTER OSD IS NOT DISPLAYED J705 PIN5 PIN 6 5V NO CHECK LIPS J705 PIN9 N CHECK MICOM INV 2 5V2 gt ON OFF PORT 1501 PINO E 1 CONFIRM BRIGHTNESS NSS V OSD CONTRL STATE 2 CHECK MICOM DIM ADJ PORT U501 PIN41 J705 PIN10 5V CONTACT PROBE TO CAUTION LABEL REPLACE CFL LAMP IN THE LCD MODULE Waveforms B 1 J705 5 6 U801 1 U803 3 13 9705 49 Tek 5 00MS s 355 Acqs Tek 25 0MS s 132 Acqs Tek 25 0MS s 73 Acqs p TT la zus ipa Inverter gt Inverter On
18. I D 15 250NITS SXGA LVDS or 6304FLP110A LCD LIQUID CRYSTAL DISPLAY LM170E01 A5N5 LG PHILPS TFT COLOR LPL N 290NITS SXGA LVDS or 6304FLP160A LED LIQUID CRYSTAL DISPLAY LM170E01 ASKS LG PHILPS TFT COLOR NEG D IC 250NITS SXGA LVDS 6304FLP142A LCD LIQUID CRYSTAL DISPLAY LM190E03 B4K1 LG PHILPS TFT COLOR 20T TN 250NITS SXGA LVDS or 6304FLP184A LCD LIQUID CRYSTAL DISPLAY LM190E03 B4N2 LG PHILPS TFT COLOR B4K1 LPL NJ 20T TN 250NITS SXGA LVDS 3809TKL101E BACK COVER ASSEMBLY 19505 L101 BRAND PC ABS 9930 BK US VER 080 3809TKL101F 3043TKK227A 3043TKK227C 3043TKK227B 3043TKK227D 3043TKK228A 3043TKK228B 4951TKS199A 4951TKS199B 4951TKS200A 4951 TKS200C 6871TPT282C 030 3809TKL100E BACK COVER ASSEMBLY L1750S L100 PC ABS 9930 BK JS VEH 3809TKL100G BACK COVER ASSEMBLY 175051 100 PC ABS 99 SOBE ANALOG US VER E C SKD 6871TPT282Q 3313TL7087A BACK COVER ASSEMBLY L1950S L101 BRAND 5 9930 BK US VER E C SKD TILT SWIVEL ASSEMBLY L1750S TILT ST AND BODY TILT SWIVEL ASSEMBLY L1750S TILT STAND BODY A C SKD TILT SWIVEL ASSEMBLY L1950S AILT STAND BODY TILT SWIVEL ASSEMBLY 119505 Tl 1 STAND BODY B C SKD TILT SWIVEL ASSEMBLY L1750 ba LT STAND BASE TILT SWIVEL ASSEMBLY 50S TILT STAND BASE A CISKD METAL ASSEMBLY FRAME MAIN 1 1750 LPL AS KUMI METAL ASSEMBLY FRAME MAIN L1750 A C SKD METAL ASSEMBLY F FRAME MAIN 1 1950 LPL E03 TN AUO EN04 V2 KUMI METAL
19. K SIGNAL CABLE amp D SUB CONNECTOR LINE CHECK R G B INPUT U201 PIN 70 74 77 gt CHECK H SYNC INPUT U201 PIN 95 NO CHECK H SYNC LINE D SUB U501 U201 PIN95 CHECK V SYNC INPUT U201 PIN 96 MONS CHECKV SYNGLINE D SUB gt U501 gt U201 PIN96 TROUSLE IN gt N LCD MODULE d WIRING DIAGRAM Connector Ass y P N 6631T11012W or 6631T11020W Ln E w D N gt V E 3 Wy wa v m m Connector Ass y P N Connector Ass y P N 6631 d 6631T11017X L1750S or 6631T20034 6631T11017Y L1950S 18 EXPLODED VIEW 19 VIEW LIST RUNS Feto TO 010 3091TKL143N CABINET ASSEMBLY L1750S BRAND L122 SILVER PC ABS 89483 TCO03 US VER 3091TKL143R CABINET ASSEMBLY L1750S BRAND L122 SILVER PC ABS TCO03 12MS FLATRON N C SKD CABINET ASSEMBLY L1950S BRAND L123 SILVER PC ABS 89483 TCO03 CABINET ASSEMBLY L1950S BRAND L123 SILVER PC ABS 12MS TCO03 US N C SKD LCD LIQUID CRYSTAL DISPLAY LM170E01 A5N5 LG PHILPS TFT COLOR PART NUMBER CHANGE FOR COST COMPENSATION 3091TKL144N 3091TKL144Q 6304FLP110B or 6304FLP086A LCD LIQUID CRYSTAL DISPLAY LM170E01 A5K6 LG PHILPS TFT COLOR LVDS SXGA OKI GATE D IC or 6304FLP194A LCD LIQUID CRYSTAL DISPLAY LM170E01 ASK2 LG PHILPS TFT COLOR T
20. RD 16V 2096 FM2 5 T C833 OCK105CD56A 1UF 1608 10 1052 R TP X7R L1950S OCK103CK51A 0 01UF 1608 50V 10 R TP B Y C834 OCC102CK41A 1000PF 608 50V 5 R TP NPO L1950S OCK103CK51A 0 01UF 1608 50V 10 R TP B Y Ver OCK103CK51A 0 01UF 1608 50V 10 R TP B Y DIODEs CSS OCK103CK51A 0 01UF 1608 50V 10 R TP B Y OCK103CK51A 0 01UF 1608 50V 10 R TP B Y D701 0DS226009AA KDS226 TP KEC SOT 23 80V 30 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y D702 ODS228009AA KDS226 gt TP SOT 23 80V 30 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y D706 0DS226009AA KDS226 KEC SOT 23 80V 30 OCK103CK51A 0 01UF 1608 50V 10 B Y 20701 ODZKEOUI38A KDZ5 6V USC 0 2W 5 OCK103CK51A 0 01UF 1608 50V 10 R TP ZD702 45 KDZ5 6V KEC R TP USC 0 2W 5 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y ZD705 ODZKE00138A KDZ5 6V KEC USC 0 2W 5 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y ZD704 ODZKEOO0138 KDZ5 6V KEC R TP USC 0 2W 5 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y ZD705 ODZKE00138A KDZ5 6V KEC R TP USC 0 2W 5 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y 70711 oDZKEO0138A KDZ5 6V R TP USC 0 2W 5 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y PX 2 OCK103CK51A 0 01UF 1608 50V 10 R TP B Y OCK103CK51A 0 01UF 1608 50V 10 R TP B Y OCK103CK51A 0 01UF 1608 50V 10 R TP B Y U201 OIPRPGNO16B GMZANSSL BD LF GENESIS 128P OCK103CK51A 0 01UF 1608 50V 10 R TP B Y
21. Service Guide Specification oo ooo _ 1 Model Description MODEL L17505 SNN un L1950S SNN CO 3828TSL096P SUFFIX 2 Printing Specification 1 Trim Size Format 215mm x 280 mm 2 Printing Colors Cover LG COLORS Inside Black 3 Stock Paper Cover Snow White 150 g Inside Snow White 100 g 4 Printing Method 5 Bindery Saddle stitch 6 Language English 7 Number of pages 28 Including blank 3 Special Instructions 1 Origin Notification LGEDI Printed in Indonesia Printed in U K LGESP Printed in Brazil LGEMX Printed in Mexico LGENT Printed in Chin LGEIL Printed in India 4 Changes S a VIDI A m No MM DD YY SIGNATURE CHANGE NO CHANGE CONTENTS P NO 3828TSL096P Pagination sheet Total pages 28pages Front cover English English English English English Inside U blank English English English English English Rear cover i Inside 22 24 25 26 Website http biz LGservice com G E mail http www LGEservice com techsup html COLOR MONITOR CHASSIS NO CL 82 MODEL FLATRONL1750S FLATRONL1950S CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL apply the Genesis ZAN3SL Chip CONTENTS SPEGIFIGATIOIS sasso etur osea dE saneta cO adus 2 juni EO C D 13
22. W 5 1608 R TP L1750S ORJQ900D677 390 OHM 1 10 W 5 1608 R TP L1750S ORJ39000677 390 OHM 1 10 W 5 1608 R TP L1750S 0RJ3900D677 390 OHM 1 10 W 5 1608 R TP L1750S 0RJ3900D677 390 OHM 1 10 W 5 1608 R TP L1750S 0RJ2202D677 22K OHM 1 10 W 5 1608 R TP L1950S 0RJ5600D677 560 OHM 1 10 W 5 1608 R TP L1950S 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 0RJ0472D677 47 OHM 1 10 W 5 1608 R TP 22 _ SCHEMATIC DIAGRAM 1 SCALER tt 1 L1750S L1950S ZAN3SL 3 1 3 i ipe 22 A 22 C223 C224 C225 C210 nam 00 00 00000000 T 0 2120 T u T 2 2 uT Z iu Inn SE 9 ess gegen Ps 3VA e 58 AVDD_ADC_33 gt gt gt gt 2 gt gt gt gt gt L U 33 1 3 BVA 3 7 3 amp 79 AVDD_ADC_33_ rrr 81818 8188 c217 C218 Ayca a 6220 capv 0368 UDD_OUT_LU_33 6 en 2 21UT 0 01 8 001 B 21T d O1U 1 ev 84 VDD_RPLL_18 UDD_OUT_LU_ 33 28 f AAA S a P see UDD_ADC_I8 AUSS_LU 3 GND_ADC USS_OUT_LU Lais A 35 3 BVA aW USS OUT LU 27 co u 213 C214 C215 C216 amp 72 AGND_ADC 2 21u 2 10 amp 75 AGND_ADC CH3P_LV_E R 5 r Y3P A A gt a 5 AGND_ADC CHSN_LU_E RI
23. aged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copoer pattern Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder trie connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges TIMING CHART
24. i 66007810024 SKQGACE010 J ALPS NON 12V 50 0RJ4702D677 47000 OHM 1 10 W 5 1608 R T L1950S SW2 6800TR1002A SKQGACEO10 J ALPS NON 12V 50 0RJA701D677 4 7K OHM 1 10 W 5 1608 R TP SW3 6600TR1002A SKQGACEO10 J ALPS NON 12V 50 0RJ1002D677 10K OHM 1 10 W 5 1608 R TP SWA 6600TRi002A SKQGACEO10 J ALPS NON 12V 50 0RJ0752D677 75 OHM 1 10 W 5 1608 SW5 6800TR1602A SKQGACEO10 J ALPS NON 12V 50 0RJ0752D677 75 OHM 1 10 W 5 1608 2 00256000908 BZT52C5V6S F LF DIODES R T 0RJ0752D677 750HM1 10W5 1608 ZD2 0DZ560009GB BZT52C5V6S F LF DIODES R T 0RJ4700D677 470 OHM 1 10 W 5 1608 R TP 0RJ1001D677 1K OHM 1 10 W 5926 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP 0RJ4700D677 470 OHM 1 10 W 5 1608 R TP 0RJ1000D677 100 OHM 1 10 W 5 1608 R TP 0RJ0682D677 68 OHM 1 10 W 5 1608 R TF 0RJ0682D677 68 OHM 1 10 W 5 1608 RATP 0RJ1002D677 10K OHM 1 10 WE 1598 RTP 0RJ1002D677 10K OHM 1 10 W 5 1608 R 1P 0RJ0000D677 0 OHM 1 10 W 596 1605 R TP 0RJ4701D677 4 7K OHM 1 10 W 596 1608 R TP 0RJ4701D677 4 7K OHM 1 10 W 5 1608 R TP 0RJ0000D677 0 OHM 1 10 W 5 1608 R TP 0RJ0682D677 68 OHM 1 0 W 5 1602 A TP 0RJ0682D677 68 OHM 1 10 5 1608 R TP 0RJ2001D677 2K OHM 1 06 V 5 1608 R TP 0RJ2001D677 2K OHM 1 10 W 5 1608 R TP 0RJ0471D677 4 7 OHM 1 10 W 5 1608 R TP 0RJ0000D677 0 OHM 1 10 W 596 1608 021110020677 10K OHM 1 10
25. n TROUBLESHOOTING GUIDE 14 b BLOCK DIAGRAM SL 9 EXPLODED VIEW edt 19 DESCRIPTION OF BLOCK 10 REPLACEMENT PARTS LIST co E 21 ADJUSTMENT uia y vidus 12 SCHEMATIC DIAGRAM 23 SPECIFICATIONS 1 LCD CHARACTERISTICS Type TFT Color LCD Module Active Display Area 17 inch diagonal L1750S 19 inch diagonal L1950S Pixel Pitch 0 264 H x 0 264 V L1750S 0 294 H x 0 294 V L1950S Size 358 5 W x 296 5 H x 17 0 D L1750S 404 2 W x 330 H x 22 0 D L1950S Color Depth 16 2M colors Electrical Interface LVDS Surface Treatment Operating Mode Backlight Unit Hard coating 3H Anti Glare Normally White Transmissive mode 4 CCFL Cold Cathode Fluorescent Lamp 2 OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio gt 10 L1750S Left 60 min 70 Typ Right 460 min 70 Typ Top 45 min 60 Typ Bottom 50 min 60 Typ L1950S Left 70 min 80 Typ Right 70 min 80 Typ Top 75 min 85 Typ Bottom 75 min 85 Typ 2 2 Luminance 185 min 250 Typ 2 3 Contrast Ratio 300 min 450 Typ L1759S 300 min 500 Typ L1950S 3 SIGNAL Refer to the Timing Chart 3 1 Sync Signal e Type Separate Sync SOG Sync On Green 3 2 Video Input Signal 1 Type B Analog 2 Voltage Leve 0 0 71 V a Color 0 0 gt 0 Vp p b Color 7
26. ock is from 25MHz to 135MHz This part consists of the Scaler ADC LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1280 X 1024 resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V regulator and one 1 8V regulator to convert power which is provided 12V 5V in Power board 5V is provided for LCD panel and Micom Also 5V is converted 3 3V by regulator and 3 3V is converted 1 8V by regulator Converted power is provided for IC in the main board 3 MICOM Part This part consists of EEPROM IC which stores control data Reset IC and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in EEPROM 10 LIPS Board Block Diagram aw 12V 50 60Hz EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER gt COMPONENTS AND FILTER TRANSFER AND FILTER LINE GND 100 240V SIGNAL PWM CONTROL PHOTO COUPLER COLLECT CIRCUIT ISOLATION PRIMARY SECONDARY 12V E INVERTER CIRCUIT High Voltage output TRI Operation description LIPS 1 EMI components This part contains of EMI components to comply with aiebal marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor o course the primary protection fuse 2 Input rectifier and filter This part function is
27. on propelled chemicals These can generate electrical charges sufficient to damage ES devices Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device Ju General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F Use an appropriate gauge of RMA resin core solder composed o 60 parts tin 40 parts lead Keep the soldering iron tip clean and well tinned Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners
28. ped with a suitable high voltage probe Do not test high voltage by drawing an arc Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid persona contact with high voltage Do not spray chemicals on or near this receiver or any of its assemblies Unless specified otherwise in this service manual clean electrical contacts only by applying ihe following mixture to the contacts with pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Ac tone ana 90 by volume isopropyl alcohol 9096 999 strengt CAUTION This is a tiammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required Do not defeat any niug socket B voltage interlocks with which receivers covered by this service manual might be equipped Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last b 9 Use with this
29. rcuit about 650Vrms Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit To Instrument s exposed METALLIC PARTS AC Volt meter E l NL lt te Good Earth Ground such as WATER PIPE CONDUIT etc 1 5 Kohm 10W SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 o this publication NOTE If unforeseen circumstances create conllict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly Disconnecting or reconnecting any receiver electrical plug or other electrical connection Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equip
30. receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components tne following techniques should be used to help reduce the incidence of component damage caused by siatic py static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to appiying power to the unit under test After remeving an electrical assembly equipped with ES devices place the assembly on a conductive suriace suchas aluminum foil to prevent electrostatic charge buildup or exposure of the assembly Use only a grounded tip soldering iron to solder or unsolder ES devices Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices Do not use fre
31. s should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or electric shock as this will result in damage to the screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature end in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty please wipe it off with a softmaterial Cieaning with a dirty or rough cloth may damage the pari CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation A WARNING BE CAREFUL ELECTRIC SHOCK If you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter ci
32. tive diode by clipping its leads as close as possible to diode body Bend the two remaining leads perpendicular y to the circuit board Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board Securely crimp each connection and solder it Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder D 2 3 Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake Securely crimp the leads of replacement component around notch at stake top Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures 2 3 Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the dam
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