Hardware User Manual
Contents
1. as ri PN pn Ed a Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstra e 3 19 A 1140 Vienna AUSTRIA EUROPE office bluetechnix at http www bluetechnix com Document No 100 1207 3 1 0 Date 2011 10 17 CM BF533_HUM_V3 0 docx Table of Contents Blackfin Core Modules EE sr rro neanannannn DORE RARA aa naaa 5 Blackfin Development Boards ssssssssssssssssssssssssssssnssssssssssssssssscsssssssssscssssnsssscsssesssssseesssssssnsseesssssssusseessessssnsesssssestsnsesessssssnsesesesssesnees 7 N ee ao EE pe n RR AR Ree e AE OR EIN 8 1 1 OS EE N RE EE EE EE 8 1 2 ys EE OR OR 9 1 32 Applications EE EH EE EE O 9 2 Gener l Description P 10 2 1 Functional DESCIIP TOM 10 2 2 e E 10 2 3 MEN A AA 2 3 1 Core Module Memory 2 3 2 Externally Addressable Memory on connector etes eeent tenerent tenant tois corre AR scis 11 A N 12 3 1 Electrical Sel Tel edel csscssssscssssscsssssccsssscssssccsssscesssscessseessnsecessecssuscessuscessueesssuscessscessuscessusecesssccsssscecsseccnseecnscecsnsseests 12 3 1 1 Operating Conditions Rm 12 3 1 2 MaximuM ee ee Re EE OE OE RENS QESEU ER EINE RENE EUR RINT RH has 12 3 1 3 SPEC 13 A Connector Bed ede OR EE 14 4 1 Connector 14 4 2 CONE daa 15 5 Application Information ccsssscssssscss2. CM BF533 C C I Q25 S32 F2 Product Family CM Core Module SBC Single Board Computer CPU Type Equals the name of CPU Connection Type A BGA B Border pad C Connector S Special Operating Temperature Range A Automotive C Commercial Industry Crystal Frequency Notation OXX MHz 8 1 Predefined mounting options for CM BF533 Article Number Name 100 1207 3 CM BF533 C C Q25S32F2 CM BF533 100 1206 3 CM BF533 C 1 025532F2 CM BF533 I Table 8 1 Ordering information CM BF533 Former name Special Custom Core Modules or specials uC uclinux Extra controllers mounted E Ethernet U USB Flash MB F NOR Flash MB N NAND Flash MB RAM S SDRAM MB Temperature Range Commercial Industrial NOTE you are interested in custom Core Modules Custom Core Modules are available on request Please contact Bluetechnix office bluetechnix com if CM BF533_HUM_V3 0 docx 22 9 Dependability 9 1 MTBF Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results because MTBF numbers just represent a statistical approximation of how long a set of devices should last before failure Nevertheless we can calculate an MTBF of the Core Module using the bill of material We take all the components into account The PCB and solder connections are excluded from this estimation For test conditions we assume a
3. The Tiny Core Module TCM BF518 is powered by Analog Devices single core ADSP BF518 processor up to 400MHz 32MB SDRAM up to 8MB flash The 2x60 pin expansion connectors are backwards compatible with other Core Modules ACM BF525C C C Q25S64F4N1024 The Core Module ACM BF525C is optimized for audio applications and performance It is based on the high performance ADSPBF525Cfrom Analog Devices It addresses 64MByte SDRAM via its 16bit wide SDRAM bus has an onboard NOR flash of 4MByte and a NAND flash with 1024MByte CM BF527 C C Q50S32F8 CM BF527 The Core Module CM BF527 is powered by Analog Devices single core ADSP BF527 processor key features are USB OTG 2 0 and Ethernet The 2x60 pin expansion connectors are backwards compatible with other Core Modules CM BF533 C C Q25S32F2 CM BF533 The Core Module CM BF533 is powered by Analog Devices single core ADSP BF533 processor up to 600MHz 32MB SDRAM 2MB flash 2x60 pin expansion connectors at a size of 36 5x31 5mm TCM BF537 C 1 Q25S32F8 TCM BF537 The Tiny Core Module TCM BF537 is powered by Analog Devices single core ADSP BF537 processor up to 500MHz 32MB SDRAM 8MB flash a size of 28x28mm 2x60 pin expansion connectors Ball Grid Array or Border Pads for reflow soldering industrial temperature range 40 C to 85 C CM BF537 C C Q25S32F4 CM BF537E The Core Module CM BF537 is powered by Analog Devices single core ADSP BF537 processor up to 600MHz 32MB SDRAM 4
4. 10k pull up JTAG 33 TDO O JTAG 34 Disconnected 35 Disconnected 36 BMODE1 100k pull down Boot mode 37 MISO VO SPI 38 TX O UART 39 PFO nSPISS VO 40 PF2 SPISEL2 VO 41 PPI CLK VO PPI Clock CM BF533 HUM V3 0 docx Signal Type Function 42 TMR2 PPI1Sy2 VO PPI Sync 43 PF4 SPISELA PPI1D15 VO aa PF6 SPISEL6 PPI1D13 VO 45 PF8 PPI1D11 1 0 PPI Data 46 PF10 PPI1D9 VO 10k pull up PPI Data 47 PF12 PPI1D7 VO PPI Data 48 PF14 PPI1D5 1 0 PPI Data 49 PPI1D3 VO PPI Data 50 PPI1D1 VO PPI Data 51 GND PWR 52 GND PWR 53 DT1SEC O SPORT1 54 TFS1 1 0 SPORTI 55 DRISEC SPORT 56 RFS1 VO SPORTI 57 DTOSEC O SPORTO 58 TFSO 1 0 SPORTO 59 DROSEC SPORTO 60 RFSO VO SPORTO Table 4 1 Connector description X1 4 2 Connector X2 Pin No Signal 10 Type Function 61 Al O Address Bus 62 A3 O Address Bus 63 A5 O Address Bus 64 A7 O Address Bus 65 A9 O Address Bus 66 A11 O Address Bus 67 A13 O Address Bus 68 A15 O Address Bus 69 A17 O Address Bus 70 A19 O Address Bus 71 ABE1 SDQM1 O Byte Enable 72 N C 73 F_A21 O Address Bus 74 F_A23 O Address Bus 75 N C O 76 ADRY 10k pull up Hardware Ready Control 77 nBG O Bus Request active low 78 CLK Out O Clock Output 79 GND PWR 80 nAMS3 O Bank Select CM BF533_HUM_V3 0 docx 15 Function 81 nAWE O Write Enable active low 82 NMI 10k pull down Non Maskable Interrupt 83 DO VO Data Bus 84 D2 VO Data Bus 85 D4 VO Data Bus 86 D6 VO Data
5. Controllers e Optional o Special and or o Former name That expands of course the name but allows the customer to get the most important Core Module specific information at the first sight Have a look at the example below to get an idea of the new Core Module names Example CM BF537 C C Q25S32F4 CM BF537E CM BF537 C C 025 32 Product Family CM Core Module SBC Single Board Computer CPU Type Equals the name of CPU Connection Type A BGA B Border pad C Connector S Special Operating Temperature Range A Automotive 40 to 125 C Commercial 0 to 70 Industry 40 to 85 Crystal Frequency Notation QXX MHz CM BF537E Former name Special Custom Core Modules or specials uC uclinux Extra controllers mounted E Ethernet U USB Flash MB F NOR Flash MB N NAND Flash MB RAM S SDRAM MB CM BF533 HUM V3 0 docx Blackfin Development Boards ADEV BF52xC Feature rich low cost embedded audio development platform which supports Audio Core Modules ACM The form factor of the ADEV BF52xC allows easy integration of the board into OEM products Dedicated interfaces such as USB2 0 Line In Out headphone out and an onboard silicon microphone turn the ADEV BF52xC into a full featured development platform for most embedded audio applications in commercial areas DEV BF5xxDA Lite Get ready to program and debug Bluetechnix Core Modules with this t
6. General support for products can be found at Bluetechnix support site https support bluetechnix at wiki 7 2 Board Support Packages Board support packages and software downloads are for registered customers only https support bluetechnix at software 7 3 Blackfin Software Support 7 3 1 BLACKSheep OS BLACKSheep OS stands for a powerfully and multithreaded real time operating system RTOS originally designed for digital signal processing application development on Analog Devices Blackfin embedded processors This high performance OS is based on the reliable and stable real time VDK kernel from Analog Devices that comes with VDSP IDE Of course BLACKSheep OS is fully supported by all Bluetechnix Core Modules and development hardware 7 3 2 LabVIEW You can get LabVIEW embedded support for Bluetechnix Core Modules by Schmid Engineering AG http www schmid engineering ch 733 uClinux You can get uClinux support boot loader and uClinux for Bluetechnix Core Modules at http blackfin uClinux org 7 4 Blackfin Design Services Based on more than seven years of experience with Blackfin Bluetechnix offers development assistance as well as custom design services and software development 7 4 1 Upcoming Products and Software Releases Keep up to date with all product changes releases and software updates of Bluetechnix at http www bluetechnix com CM BF533 HUM V3 0 docx 21 8 Ordering Information
7. Processor eCM Enhanced Core Module EBI External Bus Interface ESD Electrostatic Discharge GPIO General Purpose Input Output I Input PC Inter Integrated Circuit VO Input Output ISM Image Sensor Module LDO Low Drop Out regulator MTBF Mean Time Between Failure NC Not Connected NFC NAND Flash Controller O Output os Operating System PPI Parallel Peripheral Interface PWR Power RTOS Real Time Operating System SADA Stand Alone Debug Agent SD Secure Digital SoC System on Chip SPI Serial Peripheral Interface SPM Speech Processing Module SPORT Serial Port TFT Thin Film Transistor TISM Tiny Image Sensor Module TSC Touch Screen Controller UART Universal Asynchronous Receiver Transmitter USB Universal Serial Bus USBOTG USB On The Go ZIF Zero Insertion Force Table 12 1 List of abbreviations CM BF533 HUM V3 0 docx 26 A List of Figures and Tables Figures Figure 1 1 Main Components of the CM BF533 MOUIE ssssscssssccsssscessssecssseccssssessuscessusccssseccssseessuecesssscesssecssuscessusecessscessssecctsecsssseest Figure 2 1 Detailed block diagram ss Figure 5 1 Schematic of reset circuit on the Core Module Figure 6 1 Top view of the module eek eek RR AR AR AR ee m Figure 6 2 Mechanical outline and Bottom Connectors Top View eee Gee GAAR ORR GAAR ORR ea Geek OAR eek 19 Figure 6 3 Side View with connectors mounted ssscscssssc
8. 0 seconds 260 XC Pame Relative ambient humidity 90 Table 3 2 Absolute maximum ratings D Commercial grade 2 Industrial grade CM BF533 HUM V3 0 docx 12 3 1 3 ESD Sensitivity ESD electrostatic discharge sensitive device Charged devices and circuit boards can discharge without detection Although this product features patented or proprietary protection circuitry damage may occur on devices subjected to high energy ESD Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality CM BF533_HUM_V3 0 docx 4 Connector Description 4 1 Connector X1 1 RSCLKO VO SPORTO 2 DROPRI SPORTO 3 TSCLKO VO SPORTO 4 DTOPRI O SPORTO 5 RSCLK1 VO SPORT1 6 DR1PRI SPORT1 7 TSCLK1 VO SPORT1 8 DT1PRI O SPORT1 9 Vin 3V3 PWR 10 Vin 3V3 PWR 11 PPI1DO VO PPI Data 12 PPI1D2 VO PPI Data 13 PF15 PPI1D4 VO PPI Data 14 PF13 PPI1D6 VO PPI Data 15 PF11 PPI1D8 VO 10k pull up PPI Data 16 PF9 PPI1D10 1 0 PPI Data 17 PF7 SPISEL7 PPI1D12 VO PPI Data 18 PF5 SPISEL5 PPIID14 VO PPI Data 19 PF3 SPISEL3 PPI1Sy3 VO 10k pull up PPI Sync 20 TMR1 PPI1_Sy1 VO PPI Sync 21 TMRO VO Timer 22 PF1 SPISEL1 TMRCLK VO Timer clock 23 RX 100k pull up UART 24 MOSI VO SPI 25 SCK SPI 26 BMODEO 100k pull down Boot mode 27 GND PWR 28 TCK 10k pull up JTAG 29 TDI 10k pull up JTAG 30 nTRST 4k7 pull down JTAG active low 31 nEMU O JTAG active low 32 TMS
9. 1 Document Revision History 12 list of Ned el RE 26 A ListofFigures and RE Lo ER A 27 CM BF533 HUM V3 0 docx Bluetechnix Mechatronische Systeme GmbH 2011 All Rights Reserved The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics Terms of delivery and rights of technical change reserved We hereby disclaim any warranties including but not limited to warranties of non infringement regarding circuits descriptions and charts stated herein Bluetechnix makes and you receive no warranties or conditions express implied statutory or in any communication with you Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a particular purpose Bluetechnix takes no liability for any damages and errors causing of the usage of this board The user of this board is responsible by himself for the functionality of his application He is allowed to use the board only if he has the qualification More information is found in the General Terms and Conditions AGB Information For further information on technology delivery terms and conditions and prices please contact Bluetechnix http www bluetechnix com Warning Due to technical requirements components may contain dangerous substances CM BF533_HUM_V3 0 docx 4 Blackfin Core Modules TCM BF518 C C Q25S32F2 TCM BF518
10. Bus 87 D8 VO Data Bus 88 D10 VO Data Bus 89 D12 VO Data Bus 90 D14 VO Data Bus 91 D15 VO Data Bus 92 D13 VO Data Bus 93 D11 VO Data Bus 94 D9 VO Data Bus 95 D7 VO Data Bus 96 D5 VO Data Bus 97 D3 VO Data Bus 98 D1 VO Data Bus 99 nReset see chapter Figure 5 1 Reset 100 nAOE O Output Enable active low 101 nARE O Read Enable active low 102 nAMS2 O Bank Select active low 103 VDD RTC PWR RTC Supply 104 nBGH O Bus Grant Hang active 105 nBR 10k pull up E REESE active low 106 nWP Write Protect active low 107 F_A24 O Address Bus 108 F_A22 O Address Bus 109 N C 110 N C 111 ABEO SDOMO O Byte Enable 112 A18 O Address Bus 113 A16 O Address Bus 114 A14 O Address Bus 115 A12 O Address Bus 116 A10 O Address Bus 117 A8 O Address Bus 118 A6 O Address Bus 119 A4 O Address Bus 120 A2 O Address Bus Table 4 2 Connector description X2 CM BF533_HUM_V3 0 docx 16 5 Application Information 5 1 Resetcircuit The reset of the flash and the processor are connected to a power monitoring IC The output can be used as power on reset for external devices see Figure 5 1 RESET Figure 5 1 Schematic of reset circuit on the Core Module 5 2 Application Example Schematics Have a look at our EVAL BF5xx schematics which can be found at www bluetechnix com goto eval bf5xx to get application examples CM BF533_HUM_V3 0 docx 17 6 Mechanical Outline All dimensions are given in
11. MB flash integrated TP10 100 Ethernet physical transceiver 2x60 pin expansion connectors at a size of 36 5x31 5mm CM BF537 C C Q30S32F4 U CM BF537U The Core Module CM BF537 is powered by Analog Devices single core ADSP BF537 processor up to 600MHz 32MB SDRAM 4MB flash integrated USB 2 0 Device 2x60 pin expansion connectors at a size of 36 5x31 5mm CM BF548 C C Q25S64F8 CM BF548 The Core Module CM BF548 is characterized by its numerous peripheral interfaces its performance in combination with its high speed memory interface DDR Key features are 533MHz 64MB DDR SD RAM 266MHz and 8MB flash CM BF561 C C Q25S64F8 CM BF561 The Core Module CM BF561 is powered by Analog Devices dual core ADSP BF561 processor up to 2x 600MHz 64MB SDRAM 8MB flash 2x60 pin expansion connectors at a size of 36 5x31 5mm eCM BF561 C C Q25S128F32 eCM BF561 The Core Module CM BF561 is powered by Analog Devices dual core ADSP BF561 processor up to 2x 600MHz 128MB SDRAM 8MB flash 2x100 pin expansion connectors and a size of 44x33mm CM BF533_HUM_V3 0 docx 5 Core Module naming information The idea is to put more Core Module specific technical information into the product name New Core Module names will have following technical information covered in their names e Product Family e CPU Type e Connection Type e Operating Temperature Range e Crystal Frequency MHz e RAM MB e Flash MB e External
12. ash using asynchronous chip select lines or as SPI flash Low Voltage Reset Circuit o Resets module if power supply goes below 2 93 V for at least 140 ms e Dynamic Core Voltage Control o Core voltage adjustable by setting software registers on the Blackfin Processor o Core voltage range 0 8 1 32V CM BF533 HUM V3 0 docx 8 Expansion Connector A o Data Bus o Address Bus o Control Signals o Power Supply Expansion Connector B o SPORT 0 and SPORT 1 JTAG UART SPI PPI Parallel Port Interface GPIO s 8 0 0 O 1 2 Key Features ADSP BF533 DSP 32 MByte SD RAM up to 133Mhz MByte Flash Industrial or commercial Core Module 40 to 85 C or 0 to 70 C 1 3 Applications Multimedia Home Audio Video Embedded Modems Instrumentation Imaging Industrial Control Voice Communication CM BF533_HUM_V3 0 docx 2 General Description 2 1 Functional Description 3V3 Power Reset A amp D Bus Boot Mode JTAG Power Supply 16 Bit Data Bus Y o i a Dynamic m Core Voltage 2 Control js 32 MByte 2 MByte 3 600 MHz SDRam Flash Low Voltage c gt ES Reset E Clock 20 Bit Address Bus Clock out PPI SPORT 0 SPORT 1 UART SPI GPIO Figure 2 1 Detailed block diagram Figure 2 1 shows a detailed block diagram of the CM BF533 modul
13. csssssssssccssecessseccsneccssneecssuecessuecsesecessuscessuecsssseccesscessuseesssscessuceessusccstsceessseeessecs 19 Figure 6 4 Recommended footprint for the Core Module top View cocino 20 Tables le Neo ee E eR 10 Table 2 2 Memory map we Table 2 3 External addressable memory 11 Table 3 1 Electrical characteristics cinc 12 Table 3 2 Absolute maximum AAA O e PE E E desk steeds oceertatSbestt 12 Table 4 1 Connector description X1 Tabl amp 4 2 C nnector deseription m 16 Table 6 1 Core Module connector types ten setti is 20 Table 6 2 Core Module connector types w 20 Table 8 1 Ordering information sesinin 2522 Table 10 1 Overview CM BF533 C C Q25S32F4 product changes 24 Table 10 2 Overview CM BF533 C I Q25S32F4 product changes sees seek ee Gee ea ea Geek GR ea ea GAAR Geek RR AAS 24 Table 10 3 Overview product ANOMALICS cssssccssssecssssccssseccsssecssssecssneecssueccssuecessueessuccessuecesssscsssssessuscessusecesusecsssscesssseessasecsnsscesnsceensseestes 24 Table 11 1 Revision history uses sesse sesse ee Table 12 1 List of abbreviations CM BF533 HUM V3 0 docx 27
14. e AMS Line Start Address End Address Max Size nAMS2 0x20200000 Ox202FFFFF 1MB nAMS3 0x20300000 Ox203FFFFF 1MB Table 2 3 External addressable memory CM BF533 HUM V3 0 docx 11 3 Specifications 3 1 Electrical Specifications 3 1 1 Operating Conditions Symbol Parameter Min Typical Max Unit Vin Input supply voltage 3 0 3 3 3 6 V lava 3 3V current 250 mA Vou High level output voltage 2 4 V Vo Low level output voltage 0 4 V lin IO input current 10 HA loz Three state leakage current 10 HA fcc Core clock frequency 100 600 MHz feck Core clock frequency 100 500 MHz Table 3 1 Electrical characteristics D Average load 25 C ambient temperature Commercial grade Industrial grade 3 1 2 Maximum Ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device These are stress ratings only Operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied Exposure to absolute maximum rating conditions for extended periods may affect device reliability Symbol Parameter Min Max Unit Vio Input or output voltage 0 5 3 6 V Vin Input supply voltage 3 0 5 5 V lon loL Current per pin 0 10 mA Tame Ambient temperature 0 70 C Tams Ambient temperature 40 85 E Tsro Storage temperature 55 150 C Ts o Solder temperature for 1
15. e Beside the SDRAM control pins the CM BF533 has all other pins of the Blackfin processor at its two main 60 pin connectors Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the clock frequency dynamically in accordance to the required processing power A low voltage reset circuit guarantees a power on reset and resets the system when the input voltage drops below 2 93V 2 2 BootMode Default Boot Mode 00 BMODEO and BMODE 1 have internal pull down resistor Connect BMODEO to Vcc and leave BMODE1 pin open for Boot Mode 01 equals to 8 or 16 bit PROM FLASH boot mode this is the default boot mode of the BLACKSheep software BMODE1 0 Description 00 Execute from 16 bit external memory bypass boot ROM 01 Boot from 8 bit or 16 bit FLASH 10 Boot from serial master connected to SPI 11 Boot from serial slave EEPROM flash 8 16 or 24 bit address range Table 2 1 Bootmode CM BF533 HUM V3 0 docx 10 2 3 Memory Map 2 3 Core Module Memory Memory Type Start Address End Address Size Comment FLASH 0x20000000 Ox201FFFFF 2MB PC28F320J3D SDRAM 0x00000000 OxO1FFFFFF 32MB 16Bit Bus Micron MT48LC16M16A2BG 7 Table 2 2 Memory map Please be aware that you have to unlock the flash before starting an erase process 2 3 2 Externally Addressable Memory on connector The Blackfins External Bus Interface EBI allows connecting devices via an asynchronous memory interfac
16. iny development platform including an USB Based Debug Agent The DEV BF5xxDA Lite is a low cost starter development system including a VDSP Evaluation Software License DEV BF548 Lite Low cost development board with a socket for Bluetechnix CM BF548 Core Module Additional interfaces are available e g an SD Card USB and Ethernet DEV BF548DA Lite Get ready to program and debug Bluetechnix CM BF548 Core Module with this tiny development platform including an USB Based Debug Agent The DEV BF548DA Lite is a low cost starter development system including a VDSP Evaluation Software License eDEV BF5xx Feature rich low cost rapid development platform which provides all interfaces on dedicated connectors and has all Core Module pins routed to solder pads which easily can be accessed by the developers The eDEV BF5xx supports the latest debugging interface from Analog Devices ADI SADA Analog Devices Stand Alone Debug Agent EVAL BF5xx Tiny low cost embedded platform which supports Bluetechnix powerful Blackfin based Core Modules The form factor 75x75mm of the EVAL BF5xx allows easy integration of the board into OEM products Dedicated interfaces such as USB2 0 SD card slot CAN interface connectors and of course Ethernet turn the EVAL BF5xx into a full featured evaluation platform for most embedded applications Extender boards Extender boards EXT BF5xx are expanding the development and evaluation boards by seve
17. millimeters 6 1 Top View 31 00 Ed re 36 maa Figure 6 1 Top view of the module CM BF533 HUM V3 0 docx 18 6 2 Bottom View a NM SX im E NU ion E sa IX CH BL233 3 0 2 00 7 50 mo2 xinr5e suld uuu w 31 00 im L 2 00 29 10 36 00 Figure 6 2 Mechanical outline and Bottom Connectors Top View 6 3 Side View The module is shipped with two 60pin connectors The total minimum mounting height including receptacle at the motherboard is 6 1 mm l 36 0 Figure 6 3 Side View with connectors mounted 6 4 Footprint The footprint for Altium Designer is available on request The used connectors can be found in Table 6 1 For detailed dimensions of the connectors please see the datasheet from the manufacturer s homepage CM BF533 HUM V3 0 docx 19 e e oo o a 9 e ON oO lt e N o oo e N o N N S 2 00 dl 0 60 0 35 9 30 36 00 Figure 6 4 Recommended footprint for the Core Module top view 6 5 Connectors The connectors on the CM BF533 are of the following type Connector Manufacturer Manufacturer Part No X1 X2 Hirose FX8 60P SV Table 6 1 Core Module connector types For the baseboard the following connectors have to be used Connector Manufacturer Manufacturer Part No X1 X2 Hirose FX8 60S SV Table 6 2 Core Module connector types CM BF533_HUM_V3 0 docx 20 7 Support 7 1 General Support
18. n ambient temperature of 30 C of all Core Module components except the Blackfin processor 80 C and the memories 70 C We use the MTBF Calculator from ALD http www aldservice com and use the reliability prediction MIL 217F2 Part Stress standard Please get in touch with Bluetechnix office bluetechnix com if you are interested in the MTBF result CM BF533 HUM V3 0 docx 23 10 Product History 10 1 Version Information 10 1 1 CM BF533 C C Q255S32F4 CM BF533 Version Component Type 3 0 2 Processor ADSP BF533SKBCZ600 Rev 0 6 RAM MT48LC16M16A2BG 75IT 32MB Flash PC28F320J3D75 4MB Table 10 1 Overview CM BF533 C C Q25S32F4 product changes 10 1 2 CM BF533 C 1 025532F4 CM BF533 I Version Component Type 3 0 1 Processor ADSP BF533SBBCZ500 Rev 0 6 RAM MT48LC16M16A2BG 75IT 32MB Flash PC28F320J3D75 4MB Table 10 2 Overview CM BF533 C I Q25S32F4 product changes 10 2 Anomalies Version Date Description V3 0 2011 10 14 No anomalies reported yet Table 10 3 Overview product anomalies CM BF533_HUM_V3 0 docx 24 11 Document Revision History Version Date Document Revision 1 2011 10 14 First release V1 0 of the Document Table 11 1 Revision history CM BF533_HUM_V3 0 docx 25 12 List of Abbreviations Abbreviation Description ADI Analog Devices Inc Al Analog Input AMS Asynchronous Memory Select AO Analog Output CM Core Module DC Direct Current DSP Digital Signal
19. ral interfaces and functionalities Targeted application areas are audio video processing security and surveillance Ethernet access positioning automation and control experimental development and measuring Note Bluetechnix is offering tailored board developments as well CM BF533_HUM_V3 0 docx 7 1 Introduction The CM BF533 is optimized for performance and costs The Core Module integrates processor RAM flash and power supply at a size of 31 5x36 5mm It is based on the high performance ADSP BF533 from Analog Devices The Core Module is available for commercial and industrial temperature range It addresses 32MByte SDRAM via its 16bit wide SDRAM bus and has an on board NOR flash of 2MByte 1 1 Overview The Core Module CM BF533 consists of the following components 60 Pin Expansion Connector B Dynamic Core Voltage Control es 32 MByte 2 MByte 600 MHz sDRam Hee Low Voltage Reset 60 Pin Expansion Connector A Figure 1 1 Main Components of the CM BF533 module e Analog Devices Blackfin Processor BF533 o ADSP BF533SKBCZ600 0 70 C Commercial grade o ADSP BF533SBBCZ500 40 85 C Industrial grade e 32MBSDRAM o SDRAM clock up to 133 MHz o MT48LC16M16A2BG 7 16Mx16 at 3 3 V e 2MB of Byte Addressable Flash o PC28F320J3D 2Mx16 at 3 3 V 2MByte addressable only o Additionally flash memory can be connected through the expansion board as parallel fl
20. sssccsssecsssssessssscssssecsssscesscsesssecssscesssseccsnscessueeessnccsssseessasecssuseecsaseccsuceecsscecssseesnatecsnsceesnsees 17 5 1 AAA E E E S 5 2 Application Example Schematics Mechanical O tlirie RE EE ers 18 6 1 Top AE EE EE EE EE EE EE EE 18 6 2 Head EE OE EE EO EE TERRA 19 63 SIDE VEW EE EE Ge EN Ge GE Ee ee ie 19 6 4 20101101A ER TD M 19 danser fee 20 Support 7 1 7 2 7 3 7 3 1 7 3 2 Elda 21 CM BF533 HUM V3 0 docx 7 3 3 UIS as 21 7 4 Blackfin Design Services sssssssssssssssssessssssssssssessssssssssssssssssssnssssesssssssssessssssnsssssessssssssscsesssssnsessesssesnuesescsssssnsusceesessnsessees 21 7 4 1 Upcoming Products and Software Releases ssssscssssssssssccsssssesseccsseesssssecsssecsssseessasecsssceessseessaeessasecssaceeeesses 21 8 Ordering iek ii Lo OR M 22 8 1 Predefined mounting options for CM BF533 sssssscssssscssssscsssecsssseccsssecssseecsssecsssseecsssecssssecssseecsateessueeessceessaceeeseeess 22 9 Dependability EEEMMEMMEM 23 Gl NBE EE EE EE EO E ER 23 10 Product History einer its 24 10 1 Version nene ER 24 10 1 1 CM BF533 C C Q25S32FA CM BF533 esee nnne ttt nenes 24 10 1 2 CM BF533 C 1 Q25S32F4 CM BF533 I eones 24 102 ANOMaAlE S ERR 1
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