Quintel Mask Aligner
Contents
1. 5 5 EXPOSE Exposes the wafer to UV light when activated 5 6 Focus UP DOWN button Changes the microscope level in order to focus on the sample 5 7 Red Indicating Pointer Attached to the front of the wafer chuck assembly indicates the theta position chuck rotation Starting it centered gives you maximum theta adjustment 5 8 SEPARATION PRESSURE Used to establish the separation distance for alignment Preset by staff 5 9 CHAMBER VACUUM Used in setting up the machine for vacuum printing Preset by staff 5 10 ILLUMINATION Top and bottom light sources for alignment Select the appropriate knob position for the top and IR light source There are also four knobs that control illumination levels for the microscope and IR source They all should be in off position when the machine is not in use 6 0 Safety 6 1 Ultra Violet Light The Quintel uses broadband ultraviolet light UV to expose photoresist Direct exposure to UV light can damage the cornea of the eyes and also cause sunburn In normal use the Quintel does not represent a hazard however if the lamp cover is removed or if an exposure is made using the shutter override switch UV injury could result 6 2 High Voltage Mercury arc lamps require high voltage to start and operate at potentially lethal dc voltage DO NOT TAMPER WITH THE ARC LAMP SYSTEM OR ARC LAMP SUPPLY If the lamp is off do not turn it on Report as equipment problem on the WAND using FAULTS 7 0 St2. MA Study Guide Be sure to know 12 3 1 12 3 2 12 3 3 12 3 4 12 3 5 12 3 6 12 3 7 12 3 8 12 3 9 12 3 10 12 3 11 12 3 12 12 3 13 12 3 14 12 3 15 12 3 16 12 3 17 12 3 18 What to do with a malfunctioning lamp Possible ultraviolet hazards with quintel Scan vs align stage Loading a mask Getting alignment marks into the field of view How NOT to strip threads on rails Rotating the mask After aligning wafer flat to the flat finder What the white plastic flap is for SEP button When alignment is complete Setting exposure timer how to set longer times Removing the mask Shutting down the machine The 5 steps to doing backside IR alignment If the airflow whistles Typical intensity of UV lamp measuring it Calculating exposure time
3. besides the process mode selected 9 5 3 Press Enter to return to the main menu Set the Operation Mode On the UniOp PLC 9 6 1 Select 3 from the main menu for Op Modes 9 6 1 1 Enter 1 for Exp Pressure 9 6 1 1 1 Use in pressure contact mode for highest resolution 9 6 1 2 Enter 2 for Contact Expose Pressure 9 6 1 2 1 Normal contact exposure mode 9 6 1 3 Enter 3 for IR View 9 6 1 3 1 Activates IR viewing illumination 9 6 1 3 2 Activates controls to move remove IR illumination system after a wafer is loaded unloaded 9 6 2 Press Enter to return to the main menu 9 7 Loading the Mask quintel Chapter 4 16 9 7 1 Remove the dummy mask and place your mask on the mask vacuum chuck with the emulsion or chrome side facing down The mask should rest against the banking pins in the rear left corner Center the mask and mask plate over the opening and press MASK VACUUM to fix assembly to the mask vacuum chuck When the light is on vacuum is present to hold the mask 9 8 Rotational Alignment of the Mask to the Microscope 9 9 9 8 1 9 8 2 9 8 3 Select MIC on the illumination selection switch if not using the IR feature Turn up the light intensity for the L amp R microscope illuminators Turn on the ULT9 RAK monitor and MV 200 box Adjust the focus on both objectives simultaneously with the black toggle switch on the front left control panel of the tool scan using the left hand disc to locate the alignment marks You
4. desire pressure setting 12 1 1 1 Load a mask as usual 12 1 1 2 Load your wafer or a dummy wafer 12 1 1 3 Press Contact button 12 1 1 4 Press Separation button 12 1 1 5 Test the operation in contact and separation mode a couple of times to make sure it operates correctly with the right pressure 12 1 1 6 Remove wafer and mask when finish and put dummy mask back on 12 1 2 If the mask is pushed off the mask plane because of high pressure Do the following 12 1 2 1_ Press the Clear button to unload the wafer 12 1 2 2 Pull the stage out and push it back in 12 1 2 3 Press Mask Vac button to release the mask vacuum quintel 12 1 3 Chapter 4 16 12 1 2 4 Center the mask back on the mask plane and press Mask Vac button to activate the vacuum on the mask 12 1 2 5 Adjust Substrate Chuck Force Control knob until 15 PSI or desire pressure 12 1 2 6 Press Load to load the wafer 12 1 2 7 Press Contact button 12 1 2 8 Press Separation button 12 1 2 9 Test the operation in contact and separation mode a couple of times to make sure it operates correctly with the right pressure 12 1 2 10 Remove wafer and mask when finish and put dummy mask back on 12 1 2 11 If the operation is not working right with the new pressure setting repeat step 12 1 2 1 to 12 1 2 9 If the focus for alignment is blurry because of low pressure Do the following 12 1 3 1 Press the Clear
5. system errors I cannot see this taking less than 60 minutes as subtleties of the MA process are sure to come up for discussion Equipment time and dummy wafer should be recharged to new user s account Step 12 2 3 should be done at least twice with two different current users Upon successful completion of Step 12 2 4 new users should take the MA Users Test Tests are administered by Microlab office staff and are graded by Microlab staff Kim Chan Estimate 2 5 days for grading The idea of the test is to simply make sure all new users understand the material Satisfactory completion of this test will enable the user to meet with a Superuser for qualification quintel 12 3 12 2 6 12 2 7 Chapter 4 16 Superusers will first ask who trained you of the new user Training implies adequately following Steps 12 2 1 12 2 4 above The users identified as being the ones who did the training will be responsible for the information conveyed by the new user during the qualification It is suggested that the test be reviewed with another user while at the Quintel aligner tool before taking the final oral qualification with the superuser Description of Alignment Target Placement An optional standard spacing for the alignment marks is 76 2 mm or 3 inches apart on a 4 substrate along the X axis and center on the substrate along the Y axis Use 51 15 mm or 2 25 inches spacing if backside alignment is needed Quintel Q4000
6. will want to start with the microscope on the lowest magnification setting align 1 to the marks under the zoom labels on the objectives One alignment mark should be visible on each half of the split field image To get both into the field of view you may need to adjust the spacing between the split field objectives and or the rotation of the mask 9 8 1 1 Using IR feature for backside alignment 9 8 1 1 1 Select IR OPTL ILLUM on the illumination selection switch Turn up the IR illuminators This will allow you to see the mask and the backside of the wafer when loaded You can also select BOTH on the illumination selection switch but the microscope illuminators cannot be too bright otherwise it will wash out the IR image and you will not be able to see it Also the microscope objectives must be over the IR illuminators in order to see both the backside and mask features In other words you cannot illuminate one place and look for the image elsewhere Use the large knobs at the left hand side and right hand side of the microscope to adjust the spacing between the split field objectives making sure they are unlocked before adjusting Four small knobs on the microscope bracket are for tightening the X and Y microscope movement Make sure these 4 small knobs are loose before making the adjustment because otherwise you will strip the threads on the rails which is a very expensive damage Looking from side at the top of the mask with your naked e
7. Marvell Nanofabrication Laboratory University of California Berkeley Berkeley Microfabrication Laboratory ae Lab Manual HE Marvell NanoLab Member login Lab Manual Contents MercuryWeb Berkeley Microlab 1 0 2 0 3 0 4 0 5 0 Chapter 4 16 Quintel Mask Aligner quintel 382 Title Quintel Q4000 Mask Aligner Purpose The Quintel Q4000 MA Mask Aligner is a top and bottom side contact lithography printer with the video view split field microscope used for fine line lithography down to 1 micron or better It is capable of processing both 4 and 6 inch substrates using 7 photomasks The quintel was recently modified to accept 6 wafers while retaining the ability for 4 wafers and smaller substrates This modification duplicates many of the contact and proximity photolithography capabilities of the ksaligner allowing NanoLab member access to two contact printers and provides a backup when one aligner is down for maintenance or repairs Modifications included a new 6 chuck and a new mask plate while keeping the 4 chuck The new mask plate requires a 7 mask which matches the ksaligners mask requirements The quintel retains its IR light source and cameras for through wafer backside alignment for 6 wafers The previously used mask clamp has been obviated by this modification and is no longer available or needed After reading this manual the user should be able to describe a typical MA quintel process for both top a
8. System Shutdown 9 13 1 Illumination selection switch should be off 9 13 1 1 All four light control knobs fully counterclockwise 9 13 1 2 IR View should be off on the Op Modes 9 13 2 Wafer chuck down 9 13 3 Ensure the substrate chuck is pushed entirely in 9 13 4 Mask Vacuum on 9 13 5 Power off on Ultrak monitor and MV 200 quintel 9 14 9 13 6 Chapter 4 16 Do not turn off main POWER HEAD LOCK or UniOp Measure Lamp Intensity 9 14 1 9 14 2 9 14 3 9 14 4 9 14 5 9 14 6 9 14 7 9 14 8 9 14 9 The exposure power is approximately 8 3 to 15 0 14 2 mW cm for I line Obtain Karl Suss UV Intensity Meter Model 1000 from the drawer next to the Karl Suss Aligner Select 4 from the main menu for Controls Mode on the OniOp PLC Enter 3 for Expose Test on the menu The optical head will rise Connect the I line probe to the UV intensity meter Turn on the power on the intensity meter Put the I line probe in its holder and place it on the center of the dummy mask from the side of the tool Enter 2 for Manual Shutter on the menu You can read the intensity on the meter Press 2 to turn off Manual Shutter Take I line probe off the aligner Disconnect the probe on the intensity meter Turn off the power on the intensity meter Place everything back in order and store it back in the drawer by the Karl Suss Aligner 9 14 10 Press 3 to lower optical head 9 14 11 Press Enter to return to the main menu 10 0
9. Troubleshooting Guidelines 10 1 10 2 10 3 During SEP and press CONT modes the flow of gas out of the chamber can make a hissing noise If this happens you may wish to press the CLEAR button unload the wafer pull the wafer chuck out and wipe the seal around the edge of the chuck with a clean wipe No light during exposure If this happens check the power on lamp power supply 10 3 1 10 3 2 10 3 3 10 3 4 10 3 5 Wafer chuck gets stuck on mask Load wafer chuck up without wafer will make vacuum hold on to mask If this happens do the following under Main Menu to release the vacuum Press 4 Controls Press Right Arrow button Press 2 Chuck Vac Off Press Clear button Press ENTER button on UniOp to return to Main Menu quintel Chapter 4 16 11 0 Figures amp Schematics Substrate Chuck Force Controller 12 0 Appendices 12 1 Substrate Separation Adjustment The normal separation setting between the mask and the substrate is 15 PSI When pressure is too high the substrate chuck will push the mask too hard and the mask vacuum can not hold the mask in position When the pressure is too low the gap between substrate chuck and the mask will be too big and the focus will be too blurry for alignment If this happens please do the following 12 1 1 Adjust Substrate Chuck Force Control knob until 15 PSI or desire pressure Note Always start at a lower pressure to avoid hysteresis and then adjust to the
10. and the wafer used for highest resolution possible A 0 30 vacuum gauge indicator is located on the left hand side of the tool Exposing Small Dice The 4 vacuum chuck is designed for 100 mm 4 wafers If you use odd sized substrate there are several methods for adapting the 100 mm wafer chuck You can cut a 100 mm diameter piece of Mylar film and make a cutout for your sample You can mount your sample to a wafer with wax or mount your sample to wafer dicing tape Whatever method the goal is to obtain good chuck vacuum Planarization may be adversely affected by having a sample off center It may be necessary to place another sample opposite it for balance Equipment Operation 9 1 9 2 9 3 9 4 9 5 9 6 Enable the quintel on the wand All selection controls should be unlit except the POWER and HEAD LOCK Check if the lamp is on by the seeing if there are power and voltage readings on the lamp power supply Set the Exposure Time On the UniOp Programmable Logic Controller PLC 9 4 1 Select 1 from the main menu for Exp Time 9 4 2 Press Insert and the cursor will blink 9 4 3 Enter the desired time up to 999 seconds Contact the Process Engineering Manager if you need a longer exposure 9 4 4 Press Enter to return to the main menu Set the Exposure Mode On the UniOp Programmable Logic Controller 9 5 1 Select 2 from the main menu for Pr Modes 9 5 2 Enter to select desired mode an asterisk will appear
11. atistical Process Data 8 0 N A Available Processes Process Notes 8 1 8 2 The correct default idle state of the Q 4000 should be as follows 8 1 1 System power ON and HEAD LOCK ON if not notify staff 8 1 2 2105C2 Illumination Controller Power ON Meter Select at V mode Meter Select Power mode Ch A and Cl 8 1 3 Monitor is OFF 8 1 4 MV 200 power box is OFF H V split knob marker set at center H V switch set at V All A amp B cross hair switches set at OFF 8 1 5 The 7 inch dummy mask is loaded without mask vacuum and the 7 inch MA lithography chuck is in place in the down position No wafer is on the chuck 8 1 6 Microscope Magnification range is 10X to 70X 8 1 7 Normally the vacuum on the wafer chuck switches on automatically when the wafer chuck assembly is in Otherwise it switches off when it is out 8 1 8 Maximum substrate thickness for standard operation is 5 08 mm or 2 inch 8 1 9 Separation Gap Preset by staff Recommend 30 um or 0016 with 2X objective power Maximum gap can be 100 um or 004 Recommend 20 um or 0008 with 5X objective power Maximum gap can be 50 um or 002 Basic Exposure Programs quintel 9 0 8 3 Chapter 4 16 8 2 1 CONTACT CALIB Used to select proximity printing mode Contact staff to set it up 8 2 2 PRESSURE CONTACT Selects pressure contact mode the normal operation mode 8 2 3 VACUUM CONTACT Mode that applies vacuum between the mask
12. button to unload the wafer 12 1 3 2 Pull the stage out and push it back in 12 1 3 3 Adjust Substrate Chuck Force Control knob until 15 PSI or desire pressure 12 1 3 4 Press Load to load the wafer 12 1 3 5 Press Contact button 12 1 3 6 Press Separation button 12 1 3 7 Test the operation in contact and separation mode a couple of times to make sure it operates correctly with the right pressure 12 1 3 8 Remove wafer and mask when finish and put dummy mask back on 12 1 3 9 If the operation is not working right with the new pressure setting repeat step 12 1 3 1 to 12 1 3 7 12 2 Qualification Procedures 12 2 1 12 2 2 12 2 3 12 2 4 12 2 5 After studying the Q4000 User Manual potential new users should arrange ahead of time to have an existing user review the MA operation Casual questioning e g Hey can you review this with me for a moment is not to be considered an official review period The first question that should be asked is whether Section 4 16 Quintel Mask Aligner on the web and the equipment header file has been thoroughly reviewed If not the current user should insist that it be reviewed before the meeting The meeting between the current and new user should be scheduled for enough time to explain equipment operation Loading and unloading the mask and substrate top side alignment using the top microscope back side alignment using IR the exposure process and a review of
13. light up from the wafer chuck through the wafer Features on the backside of the wafer cast shadows up to the focal plane located at mask level To generate an IR image these light pipes must be positioned below the split field microscope objectives If the pipes are grossly out of alignment no image will be seen If the pipes are slightly out of alignment shadows will be cast up at angles thereby affecting alignment Adjust each pipe grossly so that it illuminates respective to the target Perform a fine pipe alignment by watching the motion of backside features as you adjust the pipes It is usually possible to determine when the pipe is directly below the target by watching the rate at which the shadow moves as you move the pipe The motion of the backside image should be at a minimum when the pipe is directly below its target Follow the same procedure as Steps 9 6 to 9 9 Expose the Wafer Press EXPOSE button The Expose position provides a reflector to direct the UV light down to expose the wafer 9 11 1 After exposure the chuck lowers automatically Pull the wafer chuck assembly out all the way towards you Remove the wafer with tweezers and then push the wafer chuck assembly back in Removing the Mask 9 12 1 To remove the mask press the MASK VACUUM button light will go off to release the mask from the mask vacuum chuck You can now lift the mask out Place the mask right side up on top of the left cover on the Quintel aligner
14. nd backside alignment explain the theory of operation and state all hazards associated with the system After successfully completing the qualification procedures for this tool see Appendix 12 2 the user should be able to perform a full photolithography process for both TSA and BSA using this system Only trained and approved qualified Users may use this tool Scope The mask aligner consists of several coordinated inter related systems including 3 1 Substrate loading holding and unloading system 3 2 The mask supporting system 3 3 The substrate mask scan align lock system 3 4 The viewing system microscope and illuminators 3 5 The exposing system 3 6 Use 7 inch masks Applicable Documents Revision History Quintel Q4000 Operating Manual Manufacturer hardcopy is located in the Microlab office Definitions amp Process Terminology All the front panel controls are push on push off buttons with indicator lamps The buttons are illuminated green when an option is active 5 1 MASK VACUUM Turns vacuum on off to affix mask to mask chuck 5 2 LOAD CLEAR Raises the wafer chuck 5 3 CLEAR Lowers the wafer chuck quintel Chapter 4 16 5 4 SEP CONTACT When a wafer is loaded the chuck will planarize with the mask and then lower out of contact for alignment Contact is selected to put the wafer back into contact with the mask after alignment and before exposing Lights illuminate to indicate which mode is active
15. r 9 9 4 Align your wafer using split field as mask alignments on the mask should be visible after the Step 9 9 1 procedure There are two degrees of motion reduction available or the align stage It either operates at a 3 1 ratio coarse align mode or at a 150 1 ratio fine align mode Use the right hand joystick on the align stage to search for the alignment marks on the wafer to match the alignment marks on the mask Press the COARSE button on the left front panel and the right hand side joystick simultaneously to make coarse alignment Next use the theta micrometer on the left side of the stage to rotate the alignment marks on wafer to match the mask alignment marks Press the button on the scan align stage joystick on the left front side to move the alignment marks into the viewing position under both objectives The scan align mode moves the stage and the mask together 9 9 5 When alignment is complete pressing the CONTACT button will bring the wafer into contact with the mask Confirm the alignment is correct If an adjustment is necessary press the SEPARATE button and realign Procedure for Backside Alignment Alignment marks must be within the IR viewing windows on the wafer chuck The position of the light pipes may be changed by adjusting the thumbscrews on the light pipe insertion assembly The default objective separation of 51 15 mm 2 25 is set for current 4 wafer chuck The infrared light pipes work by projecting infrared
16. ye can be helpful for finding the right spacing The green light of the microscope illuminator can be seen on the mask indicating where the objectives are aimed Mask Rotation 9 8 3 1 Press the MASK VACUUM switch to turn off the vacuum releasing the mask The MASK VACUUM switch will be unlit 9 8 3 2 Press the MASK VACUUM switch again to fix the assembly to the mask vacuum chuck Loading and Aligning the Wafer 9 9 1 9 9 2 Slide the wafer chuck assembly towards you until it stops With tweezers center your wafer on the chuck Align flat against the white plastic flat finder Note that with the modification the white plastic flat finder will only reach a 7 wafer For a 4 wafer align the wafer flat with the flat line scribed on the 4 chuck Push the wafer chuck assembly 1 or 2 inches and listen to the click which is the chuck vacuum turning on Return the plastic flat finder to its original position push the assembly fully back under the mask until it hits its stop Press the LOAD switch and the wafer will be raised under the mask and held in place The wafer will contact the mask to planarize the wafer to the mask a then the SEPARATE button should light indicating that there is a separation between the wafer and the mask The instrument goes into separation mode automatically quintel 9 10 9 11 9 12 9 13 Chapter 4 16 9 9 3 Confirm you are in the SEPARATION mode and proceed to align your substrate or wafe
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