Home

NLX Motherboard Specification

1. 345 44 REF BOARD LENGTH wi 13 6001 MOTHERBOARD PRIMARY SIDE TOP VIEW WITH CHASSIS KEEPOUTS TO RISER r PRIMARY SURFACE Figure 9 Chassis Keepout Areas and Motherboard EMI Clip Location Areas Page 26 NLX Motherboard Specification Release 1 8 3 2 1 EMI Grounding Using Motherboard Rails To allow for grounding of the motherboard to the chassis through the rails a required ground path has been specified The four hatched areas shown in Figure 10 are dimensioned from the motherboard mounting holes as defined by board size Rails with ground clips attached will contact the motherboard grounding pads extend through the mounting rails and rest on the pads shown in Figures 10 and 11 This will increase the grounding options provided on an NLX board to improve EMI characteristics if required The cross sectional view in Figure 11 shows the standard rail clip design with the 0 313 inches required pad height to ensure contact with the rail mounted EMI clips If a chassis design is such that the board height is greater than 0 313 inches then an emboss or additional detail should be provided to ensure ground contact with a standard rail clip design 228 60 Mai MUM X IMU BOARD fu IDTH 4X 5 08 200 CARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION THESE AREAS MUST PROVIDE A GROUND PATH TO CHASSIS FOR EMI CLIP CONTACT THROUGH THE RAILS Figure 10 Ground Pad Detail on Chassis for EMI Clips on Rails Secondary sid
2. FAN TACH1 MSC 1 NA B152 IRSL1 MISC VO NA Ge FAN TACH2 MISC I M B153 IRSL2 MISC I O A154 FAN TACH3 MSC 1 NA B154 IRTX MISC VO NA Ge FAN CTL MISC I MA B155 IRRX MISC I O A156 5VDC PWR NA NA B156 FP_SLEEP MISC MB Ge USB1 3_N MISC O Note1 B157 FP_RST MISC A158 USB1 3 P MISC O Note 1 I 8158 GND PWR NA NA FEE se l RIS B159 PWRLED MISC O RIS A160 USB2 4 N MISC O Note 1 I B160 PWOK PWR l NA A161 USB2 4 P MISC VO Note 1 B161 SOFT _ON OFF PWR MB A162 USB2 4 OCH MSC II RIS I B162 PS _ON PWR O NA Kc GND PWR TNA NA B163 LAN_WAKE MISC MB A164 VBAT Msc To RIS I B164 LAN ACTVY LEDH MISC O NA Ge TAMP D I MISC II MB PE tee fe A166 MSG WAIT LED MSC O AIS I B166 RESERVED RES NA NA Se NA NA B167 TPA 1394 I O NA Note 2 A168 TPB 1394 VO NA Note2 B168 TPA 1394 I O NA Note 2 Ge 5VSB PWR II TNA 8169 TPB 1394 I O NA Note 2 A170 3 3VSENSE PWR Io NA B170 5V PWR NA NA I O column definitions relative to motherboard O Output from motherboard to riser Input from riser to motherboard Termination column definitions MB Termination pullup pulldown debounce is on motherboard RIS Termination pullup pulldown is on riser card NA Not on motherboard or riser Note 1 USB termination for EMI belongs on the riser close to the USG connector Pulldown and series
3. corrected two recommended voltage tolerances Current industry standard power supplies support 10 tolerance on negative rails and 5 on the 3 3V rail Motherboards and option cards do not require tighter tolerance This correction was made in the NLX Power Supply Recommendations and is being made here to match that change e Figure 32 was Fig B 2 and Figure 33 was Fig B 3 the measurement from the key on the NLX riser connector to pin on the connector was corrected to be 75 50 2 972 not 77 44 3 049 e Table 17 was Table B 1 Pin X5 corrected the description of FP SPKR EN Front Panel Speaker Enable this signal is pulled low through a pulldown on the motherboard not pulled high Pin Y5 corrected the description of FP_MIC_EN Front Panel Microphone Enable this signal is high when the microphone is plugged in and low when it is not Pin Y13 corrected the MODEM_SPKR signal to input to the motherboard not output Pins X9 X10 X11 formerly reserved now carry AC 97 input signals to the motherboard Pin Y8 previously supported an AC 97 device its name has been modified from AC SD IN to AC SD INO to indicate that it now carries input signal 0 of 4 Page 5 NLX Motherboard Specification Release 1 8 Page 6 NLX Motherboard Specification Release 1 8 Contents 1 ENEE Lu e EN 11 LI Technology uenee S ie r cagbechschbgsceseapacasiiabasceeyaghaadeabbasedenapasasiiagsatady 11 12 O
4. versions 1 not numbered 11 4 9 2 3 1 12 4 10 3 4 1 13 4 11 4 4 2 14 A 1 5 4 3 15 A 2 6 4 4 16 A 3 7 4 5 17 B 1 8 4 6 18 new 9 4 7 19 new 10 4 8 Page 84
5. NEX Riser EXample 2 aa atra ed the Ae 72 Chassis to Rail Mounting Method Example 73 EM hp Example Siiner Ov aati ie dive 74 EMI Clip Footprint Example ccccccccccceeeeeceeeeeceeeeeeeaeeeeeeeseeeeeceaeeesaaeeneaeeseaeeesaeeeeeeseeeesaes 74 Back Panel I O Shield Example ssesseseeeeeeresresrssrrsstissrisstintttnttnnstnnntnnntnnntnnnenn nenn nennnnt 75 Figure 37 Page 9 NLX Motherboard Specification Release 1 8 Tables Table 1 Definition of Terms Used in the Mechanical Draorams 16 Table 2 Mounting Hole Placement 17 T ble 3 Audio Signals Total Of ees e EEN Zeen 47 Table PCI Signals Total of 69 summit deen AATAS E aan bedrive kaka 47 Table 5 Power Pins Signals Total Of 68 47 Table 6 ISA Signals Total Of Op 47 Table 7 IDE Signals Total Of 30 x 2 0 47 Table 8 Floppy Signals Total Of 19 48 Table 9 Miscellaneous and Front Panel Signals Total Of 20 48 Table 10 PCI Segment Riser Interconnect Pinout ccccccessecceceseceeeseeeeeeesseeeeeeseneeeessseeaeessseeaeess 49 Table 11 ISA Segment Riser Interconnect Pinout cceccccccseceeeeseeeeeseeeeeeeseneeeesseeeeeesseeeaeesseeeaees 51 Table 12 IDE Floppy and Front Panel Section Riser Interconnect Pinot 53 Table 13 IDE Floppy and Front Panel Signal Descriptions cceccceesecceeeseeceeeseeeeeeeseeeaeeesseeaees 55 Table 14 Recommended IDSEL Assignments seesseesseesseeeseeenetenetttttnttn tten tstnntnnrnsstnssrnn
6. NLX Riser Card Considerations Moved Riser Mechanical Support and Connector and Card Edge Alignment paragraphs from section 2 1 1 to section 3 3 3 Paragraph added on Alignment of the 340 pin Connector and the Supplemental Connector Section 3 3 4 added Reserved Space for Workstation Server Performance Connector Definition Section 3 7 AGP Support Changed NLX compliant chassis should contain a rubber bumper to NLX chassis should enable a rubber bumper Section 3 9 2 Added the following text This chassis surface must be flat over the maximum top flange dimension outside of this dimension the chassis designer is free to implement any guide or alignment features desired To standardize a shield design the dimensions flagged with an asterisk must be used Also required is the minimum motherboard location dimension of 7 62mm 300 inches A standard shield must fit between the back of the chassis and the board mounted connectors at the MINIMUM MOTHERBOARD LOCATION This will limit the standard shield flange length to a maximum of 5 84mm 230 inches plus tolerance Any deviation from the above mentioned dimensions may require the use of a chassis specific shield Section A 5 Motherboard Rails Mounting the Motherboard to Chassis changes to paragraphs two and three were made to clarify the spec Figure 3 7 1 added Ground Pad Detail on Chassis for EMI Clips on Rails Figure 3 7 2 added
7. RMS X4 LINE_OUT_LT AUDIO O Analog line out left Analog 1V RMS x5 FP_SPKREN AUDIO I This signal indicates if headphones have been plugged into the TTL front panel LINE_OUT jack The signal is connected to one of the wipers on the audio jack and is HIGH when the headphones are plugged into the front audio jack and LOW when they are not The signal is pulled LOW through a pulldown on the motherboard typically 100K X6 VOL DN AUDIO I Connects to Volume Down switch on front panel appropriate TTL pullup resistor on motherboard The motherboard provides debounce protection and a pullup resistor vz GND PWR NA Ground NA X8 SMI SYS System Management Interrupt that is an input to the open motherboard drain ag AC_SD_IN1 AC 97 Serial time division multiplexed AC 97 input stream to the TTL motherboard from the codec on the riser output from codec X10 AC_SD_IN2 AC 97 I Serial time division multiplexed AC 97 input stream to the TTL motherboard from the codec on the riser output from codec X11 AG SD IN3 AC 97 Serial time division multiplexed AC 97 input stream to the TTL motherboard from the codec on the riser output from codec X12 AGND PWR NA Low pass filtered ground for audio circuitry on the riser NA az MODEM_MIC AUDIO O Preamplified microphone mono output signal from motherboard Analog to telephony device 1V RMS l gt I O column relative to motherboard O output from motherb
8. Rail Section View of Ground Pad Figure 3 9 NLX Card Edge Detail Primary Top Side changed board width tolerance to 0 007 0 005 Dimensioned cutout in front of 340 pin connector Included 2 00mm reference dimension from gold finger centerline to notch edge Figure 3 10 1 added Reserved Space for Workstation Server Performance Connector Page 78 NLX Motherboard Specification Release 1 8 e Figure 3 12 AGP Connector Pin I Location added AGP connector location detail e Figure 3 13 NLX Motherboard Primary Side Height Restrictions changed keepout dimension from 4 700 inches to 4 750 inches Changed second keepout dimension from 7 8 inches to 7 46 inches Other figure changes are consistent with general figure changes noted above e Figure 3 15 Chassis Back Panel I O Shield Opening View changed to be viewed from outside the system e Figure 3 16 Side View of Double High I O Shield Opening Dimensions Added shield clearance detail added 1 690 inches dimension for double high opening added 0 300 inch dimension for motherboard to chassis gap e Figure 3 17 added Side View of Single High I O Shield Opening Dimensions e Figure 3 18 added Side View of Double Stack I O Shield Placement e Figure A 2 Rail Motherboard View adjusted to account for EMI clip in rail design e Figure A 3 Rail Side View adjusted to account for EMI clip in rail design Taper added to the tip of the rail to ease insertion into guides during asse
9. TRIS A10 PCICLK2 Pcl O MB EG 3 3VD0C PWR NA NA A11 3 3VDC PWR NA NA B11 PCICLK3 PCI 10 MB EE PCI Io MB an GND PWR NA IMA A13 GNTO PCI 0 RIS B13 GNT3 PCI 0 RIS A14 PCICLK4 PCI TO MB ban 3 3VDC PWR INA INA A15 GND PWR NA NA B15 GNT2 PCI lo RIS Ei GNT1 PCI epee AD 31 PCI O RIS A17 3 3VDC PWR NA NA B17 REQO PCI 1 RIS A18 REQ2H PCI RIS B18 GND PWR NA IMA A19 REQ3 PCI RIS I B19 AD 29 PCI vo RIS A20 AD 30 PCI VO RIS B20 AD 28 PCI VO RIS A21 GND PWR NA NA B21 AD 26 PCI O RIS A22 AD 25 PCI O RIS B22 3 3VDC PWR NA INA A23 REQI PCI RIS I B23 AD 24 PCI vo RIS A24 AD 27 PCI 1 0 RIS arse PCI vo RIS A25 3 3VDC PWR NA NA B25 AD 22 PCI O RIS A26 AD 23 PCI VO RIS B26 GND PWR NA INA A27 AD 20 PCI O RIS B27 AD 21 PCI O RIS A28 AD 18 PCI O RIS B28 AD 19 PCI VO RIS A29 GND PWR NA NA B29 AD 16 PCI O RIS A30 AD 17 PCI 1 0 RIS B30 3 3VDC PWR NA INA A31 IRDY PCI 10O RIS I B31 C BE 2 PCI O RIS A32 DEVSELH PCI 1 O RIS EISEN PCI 10 TRIS A33 3 3VDC PWR NA NA B33 TRDY PCI uo RIS A34 STOP PCI O RIS B34 GND PWR NA INA O column definitions relative to motherboard O Output from motherboard to riser KS I Input from riser to motherboard Termination column definitions MB Termination pullup pulldown debounce is
10. a motherboard which is considered a processor board may now be self certified or approved as a component to be used in systems assembled by integrators which requires no further testing by meeting the following EMC specification with the chassis cover off CFR 47 Part 15 Subpart B Class B 3dB 5 4 NLX Thermal Recommendations It is the responsibility of the system designer to provide a sufficient heat sink airflow combination to cool the motherboard and processor Please refer to manufacturer s component cooling specifications to determine system requirements Subject to change Page 61 NLX Motherboard Specification Release 1 8 6 Recommendations 6 1 Recommended IDSEL Assignments for PCI Slots and Onboard Devices A board manufacturer can put a number of board devices on a motherboard To avoid a conflict the manufacturer must know which ID selects can be used for PCI slots Figure 26 shows the PCI slot numbers and Table 14 lists the recommended ID select assignments PCISLOTS SLOT 1 ISA SLOTS Figure 26 Recommended IDSEL Assignments PCI Slot Numbers Table 14 Recommended IDSEL Assignments Device number AD line Function 20 AD31 Slot 1 19 AD30 May not be used 18 AD29 Slot 2 17 AD28 May not be used 16 AD27 Slot 3 15 AD26 Free 14 AD25 Slot 4 13 AD24 Free 12 AD23 Slot 5 or PCI PCI bridge for larger riser cards 11 6 AD22 17 Free 5 AD16 Reserved for AGP on board 4 1 AD15 12 Reserved fo
11. be taken to ensure that placement of tall components does not block airflow past the processor heat sink The middle of the mid left side of the motherboard accepts a component height of up to 1 75 inches supporting placement of tall components such as DIMM SIMMs This area of the board is not intended to support tall processor modules and heat sinks The back of the mid left side of the motherboard accepts double height stacked I O connectors of up to 1 400 inches The keepout zone is 1 430 inches which leaves 030 inches clearance for the connectors Page 36 NLX Motherboard Specification Release 1 8 3 8 3 Component Height Motherboard Primary Side Right Side Mid to Back The right side mid to back section of the motherboard has a 0 70 inch height restriction which allows the use of half length add in cards in all of the NLX expansion slots 3 8 4 Component Height Motherboard Primary Side Right Side Mid to Front Chassis system designers should assume that a height keep out restriction of 2 800 inches exists in the right side mid to front section of the motherboard zone C Motherboard designers should assume that a height keep in restriction of 700 inches exists for components placed in this area This restriction includes processors and associated retention mechanisms It is not an absolute restriction although encroachment into this area by either motherboard components or chassis system features would restrict the bottom two
12. design their own cabling for the front panel Page 70 NLX Motherboard Specification Release 1 8 NLX connector NLX riser TOP View looking down on BEG chassis oppy connectors standard right angle header Front panel I O header front panel I O cable motherboard Front panel I O connectors FAN on off switch O power LED HD LED standard right angle header Keel IDE reset Ca i PC speaker IR VIEW W O Front panel I O MOTHERBOARD header L USB EMI shield Figure 31 Front Panel Support Example Page 71 NLX Motherboard Specification Release 1 8 7 2 Riser Card Examples Figures 32 and 33 show riser card examples Actual NLX riser cards can extend longer in these cases the component feature restriction areas extend with the riser along its length to the ends See the notes for these figures on the next page res 15 50 2 972 Figure 32 NLX Riser Example 1 62 87 2 475 36 37 MYTEN ss INN a WLLL EE EE d pe MAXIMUM oe PIN TO P IN KEY TO KEY 15 50 2 972 Figure 33 NLX Riser Example 2 Page 72 NLX Motherboard Specification Release 1 8 Notes to Figures 32 and 33 Component heights are restricted to the following to ensure that riser card components do not interfere with motherboard components
13. expansion slots to half length add in cards Page 37 NLX Motherboard Specification Release 1 8 Sa gt we RD ef ES Gm DP Om f 36 32 1430 i 65 41 2 575 Nuas 11 750 191 77 17 78 Opes 0 700 7112 K 2 800 o a AKA A D N G ann SUPPORT lt ONL LENGTH 9 BOARD PRIMARY ee dg SIDE A ZONE C 1 gt O A HOLE SET A SHOWN m 114 30 FOR REFERENCE ONLY 4 500 Figure 18 NLX Motherboard Primary Side Height Restrictions for a Design That Supports AGP Add in Cards Page 38 NLX Motherboard Specification Release 1 8 23 19 120 65 913 4 750 JA I IT 36 32 114301 65 4 2 575 44 45 1750 T 1 8 191 77 1 18 7 550 0 700 7112 2 800 S p E N PRIMARY A 9 A oe 25 40 m 114 30 1 000 4 500 m 189 48 7 460 m XIMUM WIDTH Figure 19 Does Not Support AGP Add in Cards Page 39 NLX Motherboard Primary Side Height Restrictions for a Design That NLX Motherboard Specification Release 1 8 3 8 5 Motherboard Secondary Side Figure 20 shows the maximum component height specification on the motherboard secondary side Restricted zones D are highlighted crosshatched Overall the motherboard has a secondary side height restriction of 0 150 inches except in the restricted areas D where the secondary side compon
14. on motherboard RIS Termination pullup pulldown is on riser card NA Not on motherboard or riser Continued Page 49 NLX Motherboard Specification Release 1 8 Table 10 continued PCI Segment Riser Interconnect Pinout Pin Signal Name Type I O Termination Pin Signal Name Type I O Termination A35 PERR PC O RIS B35 SDONE PC uo IRIS A36 SERR PCI 10 RIS B36 LOCK PCI uo RIS A37 GND PWR NA NA B37 SBO PCI O RIS A38 C BE 1 PCi 11 0 RIS I B38 3 3VDC PWR NA NA A39 AD 13 PCI vo RIS E AD 15 Pcl O RIS A40 AD 10 PCI vo RIS B40 PAR PCi vo RIS A41 GND PWR NA NA E AD 14 Pcl O RIS A42 C BE 0 H PCi O RIS B42 GND PWR NA NA A43 AD 00 Pcl O RIS B43 AD 11 PCI VO RIS A44 AD 06 PCI vo RIS B44 AD 12 PCI 1O RIS A45 3 3VD0C PWR NA NA B45 AD 09 PCI I O RIS A46 AD 05 PCI O RIS B46 3 3VDC PWR NA NA A47 AD 01 PCI 10 RIS B47 AD 08 PCI TO RIS A48 AD 03 PCI 1 0 RIS I B48 AD 07 PCI O RIS A49 GND PWR NA MA B49 AD 04 PCI uo RIS A50 AD 02 PCI O RIS B50 GND PWR NA NA A51 5VDC PWR NA MA B51 PCI_PM PCI O MB I O column definitions relative to motherboard O Output from motherboard to riser Input from riser to motherboard Termination column definitions MB T
15. physical size and thermal characteristics Today s low profile form factors are not well suited for the physical size and thermal characteristics of the next generation of microprocessors New processors will dissipate more heat and will use more physical space in the system These new processors combined with new high powered graphics solutions such as the Accelerated Graphics Port AGP and DIMM technology can cause designs like LPX to have limitations such as restricted use of these technologies Dual processor technology will also increase the thermal and mechanical needs of today s designs Multimedia drives new form factor requirements Video playback enhanced graphics and extended audio connectivity are becoming the standard hardware building blocks to support multimedia To achieve cost savings the features are being integrated onto the motherboard To achieve this integration most multimedia features must have connectors on the motherboard However with today s form factors it is a challenge to bring more I O connectivity out of the chassis Some designers bring audio and video I O out of the chassis with small passive daughter cards or cables connecting motherboard components to connectors mounted on spare expansion slots on the chassis While this reduces cost compared to a full add in card solution it is still substantially more costly than placing I O connectors on the motherboard The NLX form factor addresses this need by pr
16. termination is on the motherboard Note 2 Four pins are assigned as differential pairs to implement 1394 1995 IEEE standard Page 54 NLX Motherboard Specification 4 1 2 Miscellaneous and Front Panel Signals Table 13 IDE Floppy and Front Panel Signal Descriptions Release 1 8 Signal Pin I O Description Signal Type Reserved RESERVED A116 NA These pins should not be used for any purpose They are NA A140 NA reserved to allow compatibility with future implementations of NA A167 NA the interface compatibility problems can result if these signals NA are misused B166 NA NA Infra Red IRSLO B151 O These signals control and configure an infrared transceiver 5V TTL IRSL1 B152 o module 5V TTL IRSL2 B153 O 5V TTL IRTX B154 O Infrared serial output data 5V TTL IRRX B155 l Infrared serial input data 5V TTL LEDs PWRLED B159 O Control signal for system power LED A low level will signal 5V TTL the system is in a power on state a high level will signal a power managed state A current limiting series resistor typ Value 330 ohm is located on the riser MSG_WAIT_LED A166 O Control signal for telephony device to indicate a message is 5V TTL waiting A low level will turn the LED on and a high level will turn the LED off A current limiting series resistor typ Value 330 ohm is located on the riser LAN_ACTVY_LED B164 O Control signal for a LAN Activity LED A low level will turn the 5V TTL LED on and a high level wi
17. that either do or do not accept AGP add in cards Provided two separate figures instead of just one do or do not accept AGP cards Section 3 8 4 clarified the text that describes the optional keepout zone C Section 3 9 1 added text to clarify the allowable area for motherboard connectors to protrude from the I O aperture Figure 21 was Fig 3 17 corrected the corners for the I O aperture and clarified the allowable I O connector area Continued Page 3 NLX Motherboard Specification Release 1 8 Revision History Current continued e Section 3 9 2 added text to clarify the intent of the contact surface for the I O aperture location of the end surface flange in the I O aperture Modified the explanation of the flat surface on the flange to match Figures 21 and 22 e Figure 22 callouts was Fig 3 18 clarified the wording about the flanges on the I O aperture to help ensure that a standard NLX I O shield can be used with the specified flanges Changed callout maximum top flange to maximum top flange gap changed callout minimum lower flange to minimum lower flange gap e Table 5 was Table 4 3 deleted the two pins used for IEEE 1394 power and added the 3 3Vaux 3 3VSB signal Changed total signals to 68 e Table 9 was Table 4 7 changed the number of reserved pins to four Changed total signals to 30 e Table 12 was Table 4 10 Pin A135 was redefined to carry 3 3V Standby 3 3 Vaux on the
18. 020 210 MAXIMUM LENGTH BEYOND MOTHERBOARD SINGLE STACK 1 0 DETAIL Figure 23 Side View of Single High I O Shield Opening Dimensions 35 56 REF 1 400 MAX IMUM DOUBLE HEIGHT CONNECTOR MOTHERBOARD 1 Z Z 1 0 51 CONN FACE TO EDGE OF MOTHERBOARD 6 86 020 ae he a MAXIMUM LENGTH BEYOND MOTHERBOARD DOUBLE STACK 1 0 DETAIL Figure 24 Side View of Double Stack I O Shield Opening Dimensions Page 44 NLX Motherboard Specification Release 1 8 3 9 3 I O Shield EMI Containment Contacts The specific EMI containment implementation is left to the vendor The perimeter of the I O shield should provide EMI containment by contacting the chassis An NLX chassis will provide a flat surface that contacts the I O shield A flat electrically conductive clean surface must be provided for all six sides of the chassis I O opening to be compliant with the NLX specification These surfaces are Top of the stacked area Top of the single height area Bottom contact area of the I O shield Left end of the contact area of the I O shield Back inside of the chassis at the double stack end of the I O shield Side between the stacked and single height connector area The method of contact between the I O shield and the chassis is not specified Spacing between the EMI contacts varies with the frequencies present inside the chassis An EMI shield example is illustrated in Section 7 6 Note that this is only an examp
19. 030 1 52 0 060 a 0 y 66 68 2 625 2X 8 90 2X 3 05 0 350 0 120 t 203 20 zs 8 000 Ted B B 86 36 db 3 400 R 76 0 030 R2 79 WI 25 0 110 120001 4 mo y 14 10 FT 0 555 22 35 0 880 Figure 28 Rail Side View Page 66 NLX Motherboard Specification Release 1 8 woe MOTHERBOARD 0 313 CENTER LINE RAIL amp MOUNTING HOLE r 3 90 CLEARANCE 0 140 SECTION B B END VIEW OF MOTHERBOARD amp RAIL MOTHERBOARD EDGE 228 60 9 000 MOTHERBOARD EDGE 203 2018 000 30 48 Srl 1 200 RAIL MOTHERBOARD MOUNTING HOLE RAIL VIEW FROM BOTTOM OF MOTHERBOARD Figure 29 Rail Section View Page 67 NLX Motherboard Specification Release 1 8 8 4 3311 1 050 14 25 6 99 5611 12175 5 79 37 06 1228 1 459 6 99 1215 28 72 1 1311 3 029 104 09 4 098 SECTION B B Figure 30 Latch View Page 68 NLX Motherboard Specification Release 1 8 6 6 NLX Motherboard Insertion and Extraction The NLX motherboard is installed by sliding it into the riser already mounted to the chassis The back of the motherboard is supported by the back panel I O shield The two rails guide the motherboard to the riser connector It is recommended that NLX chassis designers include a visual alignment marking such as an arrow or stamped line on the base of the chassis such that i
20. 2 is now AGND X13 was AP_CS is now MODEM_MIC Y6 was VOL UP is now VOL_UP Y12 AC BIT CLK signal type changed from Output to input Y13 was AP_REQ is now MODEM SPKR Revision 1 0a to 1 1 Figure 3 7 Updated riser primary surface dimension to include metric equivalent and put brackets around the 260 dimension Figure 3 8 Changed the length dimension of the first segment of the 340 pin card edge from 77mm to 77 5mm Two associated dimensions changed also 45 19mm was changed to 44 68mm and 7 09mm was changed to 6 58mm Labeled the number of gold fingers on each section of the card edge connector for the 340 pin connector Corrected a visual inaccuracy on the last segment of the pins shown on the 340 pin card edge gold finger closer to the front of the board These pins appeared longer than the other segments no dimensions were affected Included Primary in the figure name Figure 3 9 Changed dimension on the narrow end of the gold finger paddle from 6mm from 41mm This change should enable more easily manufactured pcb boards Removed unnecessary 11 68mm dimension in the upper right of the figure Removed unnecessary character that existed after the word side in lower figure Removed Bottom Side from the figure name Figure 3 10 Changed the 146 35mm dimension to 146 29mm Corrected a visual inaccuracy on the last segment of the pins shown on the 340 pin card edge gold finger closer
21. 2 inchestoa 9 800 4 400 minimum board length of 3575 7 800 10 0 inches 3 575 4 400 Page 17 NLX Motherboard Specification Release 1 8 3 1 4 NLX Board Complete Keepout Specification e Primary side Required four keepout areas these are 0 390 inches in diameter and centered around the four mounting holes plated and grounded Mounting Hole Required keepout area A e Secondary side Required six keepout zones these are 0 400 inches square centered around the four mounting holes plated required keepout zone A and the two additional keepout areas required keepout zone B for rail bumpers No traces through holes devices or SMT devices are allowed within keepout zone A No through holes devices or SMT devices are allowed within required keepout zone B The NLX specification encourages motherboard manufacturers not to use through hole and secondary side SMT devices along the suggested keepout zones B see Figures 3 to 8 for notes on zones If these zones are kept free the user has the option of sliding the motherboard in directly and mounting it to the chassis without rails For this situation board traces are allowed along the recommended keepout zones but system assemblers are required to ensure that the motherboard traces are not damaged during the motherboard slide in out process gt Note See section 3 8 5 for additional secondary side component height constraints Page 18 NLX Motherboard
22. 3 7 4 Motherboard EMI Clip Exvample 74 7 5 Reference Clip Contact Impecdance nennen nen nnnn 75 7 6 Back Panel I O Shield Exvample 75 7 7 NLX Riser with Supplemental Connector Example ssssssssesssessiessresissrsrississrrnsnnnrnnsrnn nes 75 8 Revision History E ennnen 78 Page 8 NLX Motherboard Specification Release 1 8 Figures Figure 1 NLX Board and Riser Example ceesre ein Ea E EE EEEREN AEE 13 Figure 2 NLX System Layout Exvample 14 Figure 3 NLX Motherboard Dimensions 10 0 Inches Primary Gide 19 Figure 4 NLX Motherboard Dimensions 10 0 Inches Secondary Side asrasrrrnvervrrrvvrrvrrnnvernrevnnenn 20 Figure 5 NLX Motherboard Dimensions 11 2 Inches Primary Gide 21 Figure 6 NLX Motherboard Dimensions 11 2 Inches Secondary Side rnrrranrrnnnrrrnnrnnnnnvnnnnnnrrrrennr 22 Figure 7 NLX Motherboard Dimensions 13 6 Inches Primary Gide 23 Figure 8 NLX Motherboard Dimensions 13 6 Inches Secondary Side manrrrarvrnrnrrvnnrrnnnnrnnnnvnrrrreenr 24 Figure 9 Chassis Keepout Areas and Motherboard EMI Clip Location Areas 26 Figure 10 Ground Pad Detail on Chassis for EMI Clips on Rails secondary side shown 27 Figure 11 Rail Section View of Ground Pad 28 Figure 12 NLX Card Edge Detail Primary Top Side 29 Figure 13 NLX Card Edge Deia 30 Figure 14 NLX Card Edge Board View 31 Figure 15 Maximum Recommended Connector Tilts for Riser Board Card Edge Connectors 32 Figure 16 R
23. 4 1995 pin assignments depend on your specific implementation Refer to the EEE Standard for a High Performance Serial Bus 1394 1995 for more information The pullup and pulldown networks required for each differential pair must be placed close to the pins in the PHY This also applies for repeater PHYs Page 57 Continued NLX Motherboard Specification Release 1 8 Table 13 continued IDE Floppy and Front Panel Signal Descriptions Signal Pin I O Description Signal Type Serial bus SDA A150 I O Serial data signal Open Drain SCL A151 O Serial clock signal Open Drain Note The NLX specification reserves EEPROM binary device address 1010111 for future riser configuration initiatives On Off Control PS ONS B162 O This signal controls the on off state of the power supply A low level CMOS open will turn on the power supply and a high level will turn off the power drain supply The power supply provides a pullup to 5VSB SOFT_ON OFF B161 System power on off request signal In an off state a low level Open Drain pulse of at least 16ms indicates a switch on request In an on Motherboard state a low level pulse of at least 16ms indicates a switch off Specifi request The motherboard provides debounce protection and a pecile pullup resistor IEEE 1394t See Figure 25 for further reference TPA B168 I O IEEE 1394 1995 port This signal pair comprises the differential Per IEEE data signal for a 1394 por
24. 7 IDEB_DASP IDE l RIS A138 DRV2 FLOPPY GND NA B138 GND PWR NA NA I O column definitions relative to motherboard O Output from motherboard to riser Input from riser to motherboard Termination column definitions MB Termination pullup pulldown debounce is on motherboard RIS Termination pullup pulldown is on riser card NA Not on motherboard or riser Pin A135 is rated at 2A Continued Page 53 NLX Motherboard Specification Release 1 8 Table 12 continued IDE Floppy and Front Panel Section Riser Interconnect Pinout Pin Signal Name Type I O Termination Pin Signal Name Type I O Termination A139 5VDC PWR NA NA B139 DRATEO FLOPPY O NA A140 RESERVED RES NA NA B140 FDS1 FLOPPY O NA A141 DENSEL FLOPPY O NA B141 FDSO FLOPPY O NA A142 FDMEO FLOPPY O TNA B142 DIR FLOPPY o NA Ee INDX FLOPPY I RIS B143 MSEN1 FLOPPY A144 FDME1 FLOPPY O NA 8144 GND PWR NA NA ES GND PWR TNA NA B145 WRDATA FLOPPY A146 WE FLOPPY Io NA I B146 TRKO FLOPPY RIS Go STEP FLOPPY O NA B147 MSENO FLOPPY A148 WP FLOPPY RIS I B148 RDDATA FLOPPY RIS ae HDSEL FLOPPY O NA B149 DSKCHG FLOPPY A150 SDA MISC O MB I 8150 GND PWR NA NA Ge SCL MISC O MB B151 IRSLO MISC I O A152
25. 8 0 inches x 10 0 inches minimum and any size in between To simplify the design of both motherboards and chassis the specification details three sets of mounting holes which are located to allow motherboard size optimization Any given motherboard needs to have only one set of four mounting holes whereas the chassis is required to support all three sets The chassis designer must determine how the motherboard is mounted to the chassis with the specified set of mounting holes The exact method of how the chassis uses these holes to mount the motherboard is left to the system designer The chassis designer must adhere to all requirements and keepout area details of this specification for the chassis to be NLX compliant The motherboard can be mounted with any set of the mounting holes provided but must support the four holes in the defined set The chassis needs to support only one set of four holes at a time Three sets of holes are defined to support the most common motherboard sizes as listed in Table 2 with hole sets and locations Table 2 Mounting Hole Placement Hole set and board length Position of hole along Position of hole along length dimension inches width dimension inches Hole set A 13 400 7 800 13 6 inch board length 13 400 4 400 7 175 7 800 7 175 4 400 Hole set B 11 000 7 800 Less than 13 6 inchestoa 11 000 4 400 minimum board length of 4 775 7 800 11 2 inches 4 775 4 400 Hole set C 9 800 7 800 Less than 11
26. B B91 DACKO ISA O MB A92 MEMR ISA vO MB B92 DACK5 ISA O MB A93 MEMW ISA VO MB B93 SD 8 ISA VO MB A94 SD 9 ISA O MB B94 DACK6 ISA O MB A95 DRQ5 ISA l MB B95 SD 10 ISA vO MB A96 DRQ6 ISA l MB B96 5VDC PWR NA NA A97 5VDC PWR NA NA B97 SD 11 ISA vO MB A98 SD 12 ISA IO MB B98 DRQ7 ISA l MB A99 DACK7 ISA O MB B99 SD 13 ISA vO MB A100 SD 14 ISA VO MB B100 SD 15 ISA I O MB A101 MASTER ISA l MB B101 GND PWR NA NA I O column definitions relative to motherboard O Output from motherboard to riser Input from riser to motherboard Termination column definitions MB Termination pullup pulldown debounce is on motherboard RIS Termination pullup pulldown is on riser card NA Not on motherboard or riser Page 52 NLX Motherboard Specification Release 1 8 Table 12 IDE Floppy and Front Panel Section Riser Interconnect Pinout Pin Signal Name Type UO Termination Pin Signal Name Type UO Termination A102 IDEA DD8 IDE I O MB B102 GND PWR NA NA A103 IDEA_RESET IDE O MB B103 IDEA DD7 IDE I O MB A104 IDEA_DD9 IDE I O MB B104 IDEA DD6 IDE I O MB A105 5VDC PWR NA NA B105 IDEA DD5 IDE UO MB A106 IDEA_DD4 IDE I O MB B106 IDEA DD11 IDE I O MB A107 IDEA DD10 IDE I O MB B107 IDEA DD12 IDE I O MB A108 IDEA DD3 IDE I O MB B108 GND PWR NA NA A109 IDEA
27. C Figure 21 Chassis Back Panel I O Shield Opening Page 41 NLX Motherboard Specification Release 1 8 3 9 2 Back Panel I O Shield Side View The NLX I O shield side view is illustrated in Figures 22 through 24 The I O shield is surrounded by a flange used to provide EMI containment EMI containment is discussed in more detail in the next section The top of the I O shield mates with a flat surface provided by the chassis back panel opening The bottom of the I O shield mates with the base of the chassis A flat surface on the chassis is required for all surfaces of the I O shield This chassis surface must be flat over the maximum top flange dimension outside of this dimension the chassis designer is free to implement any guide or alignment features desired The surface of the chassis flange at the top of the I O opening must be flat from the inside surface of the chassis to the beginning of the minimum top flange gap area Ifitis desired to implement a guide or alignment feature for the I O shield in this top flange the chassis designer should ensure that any such feature does not interfere with the I O shield where it meets the flange The I O shield will generally require a flat surface on the flange extending to the outer edge of the motherboard The areas used for end contact of the I O shield are specified by surface size only and the specific location of these contact surfaces is left to the designer A good design will keep thi
28. C_SD_OUT AC 97 O Serial time division multiplexed AC 97 output from the TTL motherboard to the codec on the riser input to the codec Y11 AC_SYNC AC 97 O 48KHz fixed rate sample sync signal from the motherboard to TTL the codec on the riser Y12 AC_BIT_CLK AC 97 l 12 288 MHz serial data clock TTL Y13 MODEM SPKR AUDIO I Analog mono input signal to motherboard from telephony Analog device 1V RMS UO column relative to motherboard O output from motherboard to riser I input from riser to motherboard Page 77 NLX Motherboard Specification Release 1 8 8 Revision History Previous Revision 1 1 to 1 2 Edits and clarifications Most of the figures have been edited to make the specification easier to understand and to assure consistency between figures Examples of the changes include consistent usage of decimal places on dimensions and notation for english metric and the hatching used to identify gold fingers Any structural changes are called out specifically in the notes Removed revision history going from revision 0 9 to 1 0 Sections I and 2 Removed references to the basic riser Section 3 1 4 NLX Board Complete Keepout Specification Changed chassis manufacturers to system assemblers Section 3 2 1 added EMI Grounding Using Motherboard Rails Section 3 3 NLX Card Edge Connectors changes include Added front to back in fourth paragraph Section 3 3 3 added
29. DD13 IDE I O MB B109 IDEA DD14 IDE I O MB I A110 IDEA DD1 IDE I O MB B110 IDEA DD2 IDE I O MB A111 GND PWR NA NA B111 IDEA DDO IDE I O MB A112 IDEA _DIOW IDE O MB Bii2 IDEA DD15 IDE UO MB A113 IDEA DMARQ IDE MB B113 IDEA _DIOR IDE O MB A114 IDEA_IORDY IDE MB B114 IDEA_CSEL IDE O MB A115 IDEA_DMACK IDE O MB B115 IDEA_INTRQ IDE MB A116 RESERVED RES NA NA B116 5VDC PWR NA NA A117 IDEA_DA2 IDE O MB B117 IDEA_DA1 IDE O MB A118 IDEA CS0f IDE O MB B118 IDEA DAO IDE O MB A119 5VDC PWR NA NA B119 IDEA_CS1 IDE O MB A120 IDEA_DASP IDE RIS Bi20 IDEB DD8 IDE I O MB A121 IDEB_RESET IDE O MB B121 IDEB_DD7 IDE I O MB A122 IDEB_DD9 IDE I O MB B122 GND PWR NA NA A123 IDEB DD6 IDE I O MB Bi23 IDEB DD10 IDE I O MB A124 IDEB DD5 IDE UO MB B124 5VDC PWR NA NA A125 IDEB DD11 IDE UO MB Bi25 IDEB DD4 IDE I O MB A126 IDEB DD12 IDE UO MB Bi26 IDEB DD3 IDE I O MB A127 GND PWR NA NA B127 IDEB DD13 IDE UO MB A128 IDEB_DD2 IDE I O MB Bi28 IDEB DD14 IDE I O MB A129 IDEB DD15 IDE UO MB B129 IDEB Di IDE I O MB I A130 IDEB_DIOW IDE UO MB Bi30 IDEB DDO IDE UO MB A131 IDEB DMARQ IDE MB B131 IDEB_DIOR IDE O MB A132 IDEB_IORDY IDE l MB B132 IDEB_CSEL IDE O MB A133 GND PWR NA NA B133 IDEB_INTRQ IDE l MB A134 IDEB_DMACK IDE O MB B134 IDEB_DA1 IDE O MB A135 3 3Vaux PWR O NA B135 IDEB_DA2 IDE O MB A136 IDEB DAO IDE O MB B136 IDEB_CS1 IDE O MB A137 IDEB CS0H IDE O MB B13
30. FP_SLEEP from active low to active high e Section 4 1 FAN_CTL signal type changed from output instead of an input Also the description was changed FROM This signal sets the fans to maximum speed when the voltage potential on this pin is near ground 0 volts whereby this pin sinks a total maximum of ampere This signal sets the fans to minimum speed off when this signal floats whereby this pin sinks no current Fan speeds in between can be achieved by setting the voltage potential of this pin between 0 and 12 volts say 6 volts or limiting the current sink of this pin TO This signal sets the fans to maximum speed when the voltage potential on this pin is 10 5 volts or greater This signal sets the fans to minimum speed off when this signal is 1 volt or less Fan speeds in between can be achieved by setting the voltage potential of this pin between I and 10 5 volts The maximum current supplied by this pin is S0mA and is not meant to drive fans directly Internal power supply fan driving circuitry has been allotted 20mA of the available 50mA from this signal Remaining 30mA may be used for circuitry on riser or motherboard to drive other fans in the system e Section 4 1 Changed PCI PM signal to PCI PM Also the pull up resistor was defined as on the riser e Section A 6 Added NLX Motherboard Insertion and Extraction statement It is recommended that NLX chassis designers include a visual alignment marking such as an arr
31. ICATION OR ANY SUBSET OF THE SPECIFICATION WILL BE FREE FROM ANY CLAIMS OF INFRINGEMENT OF ANY INTELLECTUAL PROPERTY INCLUDING PATENTS COPYRIGHT AND TRADE SECRETS NOR DOES INTEL OR ANY CONTRIBUTOR ASSUME ANY OTHER RESPONSIBILITIES WHATSOEVER WITH RESPECT TO THE SPECIFICATION OR SUCH PRODUCTS 4 A COPYRIGHT LICENSE IS HEREBY GRANTED TO REPRODUCE THIS SPECIFICATION FOR ANY PURPOSE PROVIDED THIS IMPORTANT INFORMATION AND DISCLAIMERS SECTION PARAGRAPHS 1 4 IS PROVIDED IN WHOLE NO OTHER LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY OTHER INTELLECTUAL PROPERTY RIGHTS IS GRANTED HEREIN Copyright 1997 1999 Intel Corporation All rights reserved Version 1 8 April 1999 f Third party brands and names are the property of their respective owners Page 2 NLX Motherboard Specification Release 1 8 Revision History Current Revision 1 2 to 1 8 for previous revision history see Section 8 in this specification General Preliminary Version 1 61 had a limited external distribution Preliminary Version 1 7 had internal distribution only These versions addressed a proposed form factor addition that was subsequently dropped We have incremented to Version 1 8 for this public release of the specification because of the number of electrical changes that have incremented since Version 1 2 see the details below We made various editorial changes for clarity and consistency Title page substituted a detailed example d
32. NLX Motherboard Specification Release 1 8 AN NLX Motherboard Specification Release 1 8 IMPORTANT INFORMATION AND DISCLAIMERS 1 INTEL CORPORATION AND ANY CONTRIBUTOR MAKES NO WARRANTIES WITH REGARD TO THIS NLX SPECIFICATION SPECIFICATION AND IN PARTICULAR DOES NOT WARRANT OR REPRESENT THAT THIS SPECIFICATION OR ANY PRODUCTS MADE IN CONFORMANCE WITH IT WILL WORK IN THE INTENDED MANNER NOR DOES INTEL OR ANY CONTRIBUTOR ASSUME RESPONSIBILITY FOR ANY ERRORS THAT THE SPECIFICATION MAY CONTAIN OR HAVE ANY LIABILITIES OR OBLIGATIONS FOR DAMAGES INCLUDING BUT NOT LIMITED TO SPECIAL INCIDENTAL INDIRECT PUNITIVE OR CONSEQUENTIAL DAMAGES WHETHER ARISING FROM OR IN CONNECTION WITH THE USE OF THIS SPECIFICATION IN ANY WAY 2 NOREPRESENTATIONS OR WARRANTIES ARE MADE THAT ANY PRODUCT BASED IN WHOLE OR IN PART ON THE ABOVE SPECIFICATION WILL BE FREE FROM DEFECTS OR SAFE FOR USE FOR ITS INTENDED PURPOSE ANY PERSON MAKING USING OR SELLING SUCH PRODUCT DOES SO AT HIS OR HER OWN RISK 3 THE USER OF THIS SPECIFICATION HEREBY EXPRESSLY ACKNOWLEDGES THAT THE SPECIFICATION IS PROVIDED AS IS AND THAT INTEL CORPORATION AND ANY CONTRIBUTOR MAKES NO REPRESENTATIONS EXTENDS NO WARRANTIES OF ANY KIND EITHER EXPRESS OR IMPLIED ORAL OR WRITTEN INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR WARRANTY OR REPRESENTATION THAT THE SPECIFICATION OR ANY PRODUCT OR TECHNOLOGY UTILIZING THE SPECIF
33. NLX riser to comply with PCI 2 2 PM 1 1 previously this pin was reserved Added footnote to table Pins A157 A158 A160 and A161 a footnote was added to clarify the location of USB pulldown and series termination Pins A168 B167 B168 and B169 were redefined to implement 1394 1995 TEEE standards in NLX The four pins previously reserved are now assigned for the differential pairs Pins A167 and B166 were changed to Reserved there is no longer a need to carry isolated 1394 power on these two pins e Table 13 was Table 4 11 Corrected the description of Serial bus signals SDA and SCL to be Open Drain not TTL The change allows compatibility with SM bus implementations Corrected the description of Serial bus signal SCL to show the correct reserved EEPROM address as 1010111 Removed pins A168 B167 B168 and B169 from the section listing Reserved pins and added them to the section listing IEEE 1394 signals Removed pin A135 from the section listing Reserved pins and added it to the section listing Power Removed pins A167 and B166 from the section listing IEEE 1394 pins and added them to the section listing Reserved pins Added a footnote about speed requirements and a pointer to the IEEE standard e Added Figure 25 to support Table 13 information about IEEE 1394 signals Page 4 NLX Motherboard Specification Release 1 8 Revision History Current continued e Table 16 was Table A 3
34. PENING TOP FLANGE STANDARD SHIELD SECTION A A Figure 37 Back Panel I O Shield Example 7 7 NLX Riser with Supplemental Connector Example An optional supplemental connector is defined for designers who would like to eliminate all possible cables from the motherboard or who simply need to use some of the less common signals from the motherboard This supplemental connector is positioned rearward of the NLX riser connector along the goldfinger edge where the notch at the back of the motherboard occurs Refer to Figure 12 NLX Card Edge Detail Primary Top Side for the supplemental connector detail The optional supplemental connector is a 2x13 pin 0 1 inches pitch card edge connector AMP 145274 1 or equivalent The signals are defined in Table 17 The X side is the bottom secondary side of the motherboard and the Y side is the top primary side of the motherboard Pin I is toward the back of the motherboard back panel I O connectors Page 75 NLX Motherboard Specification Release 1 8 Table 17 Signals NLX Riser with Supplemental Connector Pin Signal Name Type UO Description Signal Type x1 CD_IN_LT AUDIO CDROM line in left Analog X2 AGND PWR NA Low pass filtered ground for audio circuitry on the riser NA aa MIC_IN AUDIO I Pre amplified microphone input Pre amp circuitry to reside on Analog riser or in microphone 1V
35. SA VO MB I 870 SA 11 ISA VO MB A71 SYSCLK ISA O MB B71 SA 10 ISA O MB A72 SA 9 ISA O MB I B72 IRQ7 ISA i MB A73 5VDC PWR NA INA B73 IRQ6 ISA 1 TMB A74 IRQ5 ISA I MB I B74 sais ISA O MB A75 SA 7 ISA O MB B75 SA 6 ISA I O MB A76 IRQ3 ISA i MB B76 DACK2 ISA 10 MB A77 IRQ4 ISA I MB B77 SA 4 ISA VO MB A78 SA 5 ISA O MB B78 GND PWR NA NA A79 TC ISA O MB B79 SA 3 ISA VO MB A80 BALE isa 10 MB B80 SA 2 ISA O MB A81 GND PWR NA NA B81 SAN ISA O MB A82 OSC isa 10 MB 882 SA 0 ISA O MB A83 OCS16 ISA I MB B83 SBHE ISA O MB A84 MEMCS16f ISA I MB B84 LA 23 ISA O MB A85 IRQ11 ISA I MB B85 LA 22 ISA O MB A86 IRQ10 Isa i MB B86 LA 21 ISA O MB A87 IRQ15 ISA 1 TMB B87 LA 20 ISA I O MB I O column definitions relative to motherboard O Output from motherboard to riser SE I Input from riser to motherboard Termination column definitions MB Termination pullup pulldown debounce is on motherboard RIS Termination pullup pulldown is on riser card NA Not on motherboard or riser Continued Page 51 NLX Motherboard Specification Release 1 8 Table 11 continued ISA Segment Riser Interconnect Pinout Pin Signal Name Termination Signal Name Termination A88 LA 19 er KG ara fk S A90 IRQ14 LA 17 VO MB A91 DRQO ISA l M
36. See i PS 2 Form Factor Mother board a ae Power Supply slides out of chassis improving access and reducing service time Cables Processor connect LT riser card to ke peripherals Improved processor access cooling and d clearance Fan 5 25 drive bay 3 5 drive bay Figure 2 NLX System Layout Example Summary of features shown in Figure 2 e Use of double high connectors across half the back I O area and single high across the whole 9 inch maximum board width e Power supply harness that connects directly to the NLX riser not to NLX boards e Floppy and IDE based peripheral signal cables that attach to the riser card e Drive bays that can all fit to one side of the riser in a convenient 17 5 inch wide low profile system form factor e Processor located toward the front of the system close to the fan for optimum cooling e Dockable motherboard that slides into the system and docks with the riser card Page 14 NLX Motherboard Specification Release 1 8 2 1 1 NLX Riser Card Riser design NLX has extended the traditional basic riser card functionality to define an extended pinout for the riser card connection The NLX pinout defines pins for the PCI bus ISA bus power IDE floppy serial bus and other I O signals which allows the following Most cables that would normally attach to the motherboard can now be attached to the riser enabling high motherboard serviceability The system designer c
37. Specification Release 1 8 254 00 10 000 248 92 9 8001 5 08 REF 158 12 REF 90 81 200 6 225 3 575 we X 3 96 AX el G 156 OUNTING HOLES REQUIRED KEEPOUT AREA A NTIN 30 48 REF 1 200 REF 86 36 3 400 ARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION Figure 3 NLX Motherboard Dimensions 10 0 Inches Primary Side Page 19 NLX Motherboard Specification Release 1 8 5 08 TYP 200 10 10 16 A 1400 8 WE 08 TYP 200 228 60 BOARD WIDTH CARD EDGE GOLD F L 8 DAA NGERS SHOWN FOR ORIENTATION REQUIRED KEEPOUT ZONE SECONDARY SIDE 2X 2 29 0901 2X REQUIRED KEEPOUT ZONE B 254 00 10 000 Figure 4 NLX Motherboard Dimensions 10 0 Inches Secondary Side Page 20 NLX Motherboard Specification Release 1 8 Lk 284 48 11 2001 19 4g 11 000 5 08 REF ke 158 12 REF s __ _ 121 29 200 6 225 4 775 AX 9 91 AX 3 56 E390 156 REQUIRED KEEPOUT AREA A MOUNTING HOLES 30 48 REF 1 200 ee Ee i 228 60 86 36 REF 9 000 3 400 MAX I MUM BOARD WIDTH ape SP Se 203 20 ME 198 12 INT MU Rete BOARD WIDTH 111 76 PRIMARY SIDE 4 400 J ARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION Figure 5 NLX Motherboard Dimensions 11 2 Inches Primary Side Page 21 NLX Motherboard Specifi
38. able 8 Floppy Signals Total of 19 Number of Signals LOGIC CONTROL 19 Table 9 Miscellaneous and Front Panel Signals Total of 30 Requirements Signal Group Reserved Infra Red Power LED Front Panel Sleep Modem Wake Up LAN Wake Up LAN Activity Front Panel Reset USB Fan Control Tamper Detection VBAT Message Waiting Serial bus Number of Signals 4 5 1 1 1 1 1 1 6 4 1 1 1 2 Any required components such as pullup resistors must be placed on the riser unless otherwise stated in the miscellaneous and front panel signal descriptions Section 4 1 2 Page 48 NLX Motherboard Specification 4 1 1 1 Riser Interconnect Pinout Table 10 PCI Segment Riser Interconnect Pinout Release 1 8 Pin Signal Name Type I O Termination Pin Signal Name Type UO Termination At 12V PWR NA NA Bi PCSPKR_RT AUDIO O NA A2 REQ4 PC I RIS E RS PWR NA NA A3 12V PWR NA NA B3 PCSPKR_LFT AUDIO O NA A4 GNT4 PCI Io RIS E 412V PWR NA MA Ap 3 3VDC PWR NA NA 85 PCICLKO PCI 10 MB A6 PCIINT3 PCI li RIS B6 GND PWR NA INA Ai 3 3VDC PWR NA NA I 87 PCICLK1 PCI 10 MB A8 PCIINTO PCI RIS e Jace MISC VO MB A9 PCIINT1 PCI i Ris B9 PCIINT2 po i
39. ail locations on the motherboard e Figures 28 and 29 show rail design side and section views respectively e Figure 30 shows the latch view Figure 27 shows the rail features for attaching the rail to the motherboard and to the chassis The rail flange geometry and position relative to the motherboard mounting holes are fully specified and fixed This lets chassis manufacturers design chassis mounting schemes that will accept the rails on any given NLX board A 0 140 inch clearance is defined between the top of the rail and the bottom of the motherboard for the length of the rails except in the mounting hole locations where the screw boss and support tabs exist Page 64 NLX Motherboard Specification Release 1 8 LEVER LATCH SHOWN AS REFERENCE LEVER S MOUNTED TO THE CHASSIS AND WORKS WITH THE RAIL FOR BOARD INSERTION EXTRACTION SEE DETAIL LEVER LOCATION RAIL TO ACCEPT 6 THREAD FOR MOUNTING TO BOARD 4X BOARD PRIMARY SIDE SHOWN FOR ORIENTATION ii TO RISER PRIMARY SURFACE ARD EDGE GOLD FINGERS 30 23 1 190 Figure 27 Rail Motherboard View Page 65 NLX Motherboard Specification 7 95 0 313 wi 3 56 0 140 CLEARANCE TO MOTHERBOARD 1 15 0 305 IF USED WITH 200 008 GROUNDING CLIP Release 1 8 16 51 0 650 8 89 0 350 3 81 ble 2X 45 X 0 76 0 150
40. an optionally place devices and connectors on the riser improving options for product differentiation for the PC OEM 2 2 Benefits for OEMs The NLX design provides improved design flexibility for product features total lower cost of ownership improved manufacturability and quality Features and Benefits PC system manufacturers can increase their manufacturing and inventory flexibility by stocking fewer motherboards and using several different riser cards each with active features such as audio or I O logic i e 1394 on the riser card instead of the motherboard NLX boards can be used in a minitower chassis by vertically orienting the motherboard Using a single motherboard design for both the low profile and minitower offerings provides inventory management benefits to many PC manufacturers The NLX form factor with its riser card configuration is a versatile design because it can be used in a wide range of system configurations including low profile desktop modular minitower and servers The specification is written such that the same form factor and chassis can be used for single and dual processor systems Page 15 NLX Motherboard Specification Release 1 8 3 NLX Mechanical Specifications The following sections describe the mechanical dimensions of the NLX form factor motherboard including physical size mounting hole placement back panel I O shield opening card edge connector placement and component height co
41. cation Release 1 8 REQUIRED KEEPOUT ZONE A MINIMUM BOARD WIDTH 2 500 2X 2 29 090 2X REQUIRED KEEPOUT ZONE p CARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION 284 48 11 200 Figure 6 NLX Motherboard Dimensions 11 2 Inches Secondary Side Page 22 NLX Motherboard Specification Release 1 8 he 345 44 el 13 600 340 36 13 400 5 08 REF 158 12 REF 182 25 eh 2001 6 225 7 175 EIER dette REQUIRED KEEPOUT AREA A MOUNTING HOLES rs 228 60 9 0001 MAX I MUM BO RD WIDTH 203 20 8 000 dt BOARD WIDTH PRIMARY SIDE 111 76 4 4001 ARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION Figure 7 NLX Motherboard Dimensions 13 6 Inches Primary Side Page 23 NLX Motherboard Specification 228 60 91000 AX IMU BOARD WIDTH SECONDARY SIDE ARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION Figure 8 NLX Motherboard Dimensions 13 6 Inches Secondary Side AX REQUIRED KEEPOUT ZONE ug Release 1 8 te 10 16 4001 08 TYP 2001 m 10 16 400 63 50 2 500 as 2X 2 29 090 2 REQUIRED KEEPOUT ZONE B Page 24 NLX Motherboard Specification Release 1 8 3 2 Motherboard EMI Clip Locations with Chassis Keepouts The specification defines EMI clip location areas and chassis keepout areas for motherboard designs that require multipoint grounding
42. ck for both the connector and the card edge is 5 38mm 211 inches If the motherboard is off center from the connector by more than 2 69mm 106 inches a mechanical interference will occur Page 28 NLX Motherboard Specification Release 1 8 e 181 000 25 0 201 00810 Y z0 7 126 010 pg mr TE 079 Se m 6 58 REF FINGER 0 201 007910 Y 10 2259 TO EDGE SEE DETAIL CARD EDGE SEE DETAIL OPTIONAL CONNECTOR 11 68 REF 460 PRE PIN BI E 1 mmm Aia AT SPACES 4 SPACES 73 SPACES 47 00 47 00 H 13 00 SCALE 1 000 1 8501 1 850 2 874 52 00 ch 2 047 a 8X CHAMFER 45 X 0 761 030 E5770 17 RAW BOARD L AE 007 EN 062 90 r 118 1 4 6501 last nl ET IT DEEN 1 340 010 D 2 00 REF PIN YI SE 0791 FINGER TO EDGE 114 REF SECTION A A zil 1045 SCALE 4 000 6 60 MIN 2601 A WII 10 38 REF ai ka REF 1 4081 sep 1 40 0 12 E045 Lode I 055 005 1 200 0 251 0101IOY 2M 12 SPACES Figure 12 NLX Card Edge Detail Primary Top Side Notes 1 Dimensioned with GDT Geometric Dimensions and Tolerances per ANSI Y14 5M a fF wo Dh See Fi
43. commended between the riser connector and the first I O connector Ideally this termination should be located as close to the riser connector as possible Motherboard and riser vendors are encouraged to perform their own independent simulations that will help guide the choice and layout of components Also great care should be used in routing the PCI bus and clocks on the riser to ensure that trace length and signal skew are minimized 6 4 Ultra DMA 33 It is recommended that NLX systems accommodating Ultra DMA 33 devices limit the IDE cable length to 12 inches for these devices 6 5 Motherboard Rails Mounting the Motherboard to Chassis The NLX motherboard rail system enables the mechanical support required for new processors and the slide in installation and removal of the motherboard To ensure that any rail mounted NLX motherboard can be inserted into any chassis design for NLX the motherboard rail fully specified herein is recommended Because each vendor is free to determine where in the assembly process the rails are installed the rails are part of the chassis kit The rail design shown here is for plastic rails that contain a ridge bumper that contacts the motherboard but is not attached to it The ridge bumper prevents the plastic rails from striking components during shipping Metal rails being stiffer do not and must not have this ridge bumper because it would damage secondary side motherboard traces e Figure 27 shows r
44. ded Voltage Tolerances for Motherboard at Riser Connection Voltage Tolerance 5 VDC 5 5 VDC 10 12 VDC 5 12 VDC 10 3 3 VDC 5 5VSB 5 3 3Vaux 4 Page 69 NLX Motherboard Specification Release 1 8 7 Example Designs 7 1 Front Panel Support Example Figure 31 shows an example of front panel I O cabled from the riser card to the front panel The connectors switches and indicators have been divided into two groups standard I O and high signal quality I O The first group includes the standard signals such as the power switch power indicator and fan and disk activity indicators This group could use the standard header used on most motherboards today Placement of these switches and indicators would be vendor specific and the same molded switch and indicator holders from previous chassis designs may be used The second I O group could include USB or other I O that may not be used on all systems A PCB containing these I O connectors and appropriate associated circuitry would be mounted to the front panel and cabled through a shielded cable back to the connector on the riser Advantages of the design shown in Figure 31 e The same front panel header is used on many other motherboard designs e All the drive cables are on the riser allowing for easier removal of the motherboard e Allows designs to have USB going out the front panel e Allows flexible options for front panel design e Designers can
45. dictated by the processor and core logic placement requirements Processor The exact location of the processor is not specified Ideally the processor should be located to the left of the I O cards and toward the front of the motherboard The exact location will be dictated by the core logic placement requirements For the system to support full length add in cards the maximum component height should be 700 inches in this area Refer to Figures 18 and 19 and Section 3 8 to determine proper placement based on motherboard height restrictions 3 7 AGP Support The Accelerated Graphics Port AGP is a high performance component level interconnect targeted at 3D graphical display applications the interconnect is based on a set of performance enhancements to the Peripheral Component Interconnect PCI Detailed information regarding the AGP specification can be found on the World Wide Web site at www agpforum org Supporting video down takes no special effort to comply with the NLX specification To support an AGP expansion slot the connector location and chassis opening must be specified for compatibility between the motherboards and chassis An NLX notched AGP card with a reduced total height from top surface of motherboard to top edge of card has been defined in the AGP specification This smaller AGP card is defined to fit in a low profile chassis Some AGP cards may require special cooling requirements It is recommended that the c
46. e shown Page 27 NLX Motherboard Specification Release 1 8 MOTHERBOARD A MOUNTING HOLE CHASSIS GROUNDING CLIP KEEPOUT GROUND I NG ZONE Figure 11 Rail Section View of Ground Pad 3 3 NLX Card Edge Connectors The primary NLX card edge connector on the motherboard consists of a 340 2x170 position gold finger contact 1 00mm pitch The first gold finger center location begins 2 787 inches from the back of the motherboard and is detailed in Figures 12 13 and 14 The mating connector for this card edge connector is Molex 71796 0003 AMP 145275 1 or equivalent An optional supplemental connector is also defined If the motherboard designer is not implementing the supplemental connector then this area must be notched to a depth of 0 460 inches The NLX riser card must not contain components that interfere with the motherboard or components on the motherboard For details on the supplemental connector signals refer to Section 7 7 NLX Riser with Supplemental Connector Example The seating depth of an NLX motherboard into the NLX card edge connector is defined to be the distance from the riser board primary surface to the edge of the NLX motherboard when fully inserted into the connector This distance is 260 inches The gold finger connector must have a minimum contact backout wipe within the connector for the upper and lower contacts of 0 99mm 039 inches The total available mechanical lead in front to ba
47. ent height is limited to 0 120 inches see Section 6 5 motherboard rails for more details The restricted zones D allow sufficient board to chassis clearances to allow for chassis features such as rail guides to be built directly into the chassis See Sections 6 and 7 for more information To assure compliance with UL Enclosure requirements it is highly recommended that the motherboard manufacturer not place secondary side components active or passive within the restricted D zones shown in Figure 20 For each motherboard dimension and hence each set of motherboard mounting holes the motherboard designer MUST also adhere to the secondary keepout zones as detailed in Section 3 1 4 NLX Board Complete Keepout Specification SEE TEXT AREA D 2 BV seen iena A 10 500 ARD EDGE GOLD FINGERS 3 3001 DDD 169 55 6 675 DD ia Li Figure 20 NLX Motherboard Secondary Side Component Height Restrictions Page 40 SHOWN FOR ORIENTATION NLX Motherboard Specification Release 1 8 3 9 Back Panel I O Shield The NLX chassis must use the specified I O shield opening to ensure that any NLX board will fit into any NLX chassis The I O shield opening is fully defined so the designer can define an I O shield to fit into the standard NLX shield opening The shield location relative to the motherboard is fully defined to ensure compatibility between board and chassis It is the r
48. ermination pullup pulldown debounce is on motherboard RIS Termination pullup pulldown is on riser card NA Not on motherboard or riser Page 50 NLX Motherboard Specification Table 11 ISA Segment Riser Interconnect Pinout Release 1 8 Pin Signal Name Type I O Termination Pin Signal Name Type I O Termination A52 RSTDRV ISA O MB B52 5VDC PWR NA NA A53 IOCHK ISA II MB B53 IRQ9 ISA O MB A54 Spiel ISA O MB B54 DRQ2 ISA I MB A55 SD 7 ISA O MB B55 SD 3 ISA O MB A56 SD 4 ISA VO MB B56 owS aa i MB A57 5VDC PWR NA NA B57 SDM ISA O MB A58 SD 2 ISA vO MB B58 AEN isa O IM A59 SD 5 ISA VO MB B59 IOCHRDY ISA I MB A60 SD 0 ISA I O MB B60 SA 18 ISA O MB A61 SMEMW ISA O MB B61 SMEMR ISA O MB A62 SA 19 ISA VO MB I Be2 SA 16 ISA VO MB A63 IOW ISA VO MB B63 IOR ISA O MB A64 SA 17 ISA VO MB 864 DRQ3 ISA i MB A65 GND PWR NA NA B65 SA 15 ISA VO MB A66 DACK 3 Isa 10 MB B66 GND PWR NA NA A67 SA 14 ISA I O MB B67 SA 13 ISA O MB A68 DACK1 ISA 10 MB I Bes 5VDC PWR NA NA A69 DRQ1 ISA II MB B69 REFRESH ISA O MB A70 SA 12 I
49. escccceeeecceeeeeseceeeeeseaeeesneeaeeeeneeceeesneeseeseeeaeenenees 59 CH Board Shock shire sell ei eld i eh Rt techn Heed een de 59 5 13 Board Vibration NEEN ENEE ENER feire ci bedeheabdetsdidadenetee den ets 59 B SAU aent kuene Pula 60 5 3 Regulatory Compliance raannnnnnnvnnnnrnnnnrnnnnnvnnnnvvnnnrrnnnnnnnannnnnenrennnrnrennnnnnnnennrrresnnrnssnnnenenneesnn 60 5 3 1 NLX CE Mark CGompltance nnt 60 5 4 NLX Thermal Recommendations A 61 6 RECOMMOENCALONS wiviciiicccisicincnincudacucacatnevanaudecudaccdiencedudacudacwaeceduactaardacddecudeadineuana 62 6 1 Recommended IDSEL Assignments for PCI Slots and Onboard Devices ssnsssn1esee1a 62 6 2 Recommended INTA INTD Interconnect at PCI Glots 63 6 3 PCI Implementation Iesues eae eeeaaeeeeeeeseaeeesaaeseseaeseeeeeseaeeesaaeeeeaeesneeeee 64 GE NN lee RI mads 64 6 5 Motherboard Rails Mounting the Motherboard to Chasse 64 6 6 NLX Motherboard Insertion and Extraction rarnvonnnannvrnnnnnnvrnnnennvrnnnnnnrrnnnennrrnnnernrrnnsensrrnneenn 69 6 7 DC Voltage at the Motberboard nnn nnnn 69 7 Example Designs sisisssisisssanssniscnsderisansserssansensseriearieansdenccnsnertecnieerieenieeiccieaneds 70 Al Front Ranelzupport Eelere nine 70 7 2 Ris r Gard Ex mpl ansetter iere eg dE dagedusdcceusscadasushuaccesiecbaatidvadsdenseesdesshsaloreia dad 72 7 3 Chassis to Rail Assembly Example ssesseeeesresrssiresirssirssrissiisstisstinstinttnnttnnstnnstnnnenn nenn nnt 7
50. eserved Space for Workstation Server Performance Connechor 33 Figure 17 AGP Connector Pin 1 Lo ation siet egnar alt eanan asiria aaga raa aa eai aray 35 Figure 18 Figure 19 Figure 20 Figure 21 Figure 22 Figure 23 Figure 24 Figure 25 Figure 26 Figure 27 Figure 28 Figure 29 Figure 30 Figure 31 Figure 32 Figure 33 Figure 34 Figure 35 Figure 36 NLX Motherboard Primary Side Height Restrictions for a Design That Supports AGP Add in Cards AE 38 NLX Motherboard Primary Side Height Restrictions for a Design That Does Not Support AGP Add in Cards 39 NLX Motherboard Secondary Side Component Height Restrictions esseesesseesseeseeeeeee 40 Chassis Back Panel I O Shield Opening sssssseessesenesinesrnssrrssrrssirssrnssrrssrnssrnnsrnnsrnnsrnnsnnnne 41 Side View of Back Panel Double High I O Shield Opening Dimenslons 43 Side View of Single High I O Shield Opening Dimensions srrranvrnnonvnnnrrnnnnrnnnnrnnnnnnnrnnnnrnnr 44 Side View of Double Stack I O Shield Opening Dimensions uanvrnenrnnnnrrrnnrnnnnnvnnnnvnrrnrennnnr 44 Riser Differential er EI usns E a EREE T EA RR EA 58 Recommended IDSEL Assignments PCI Slot Number 62 Rail Motherboard View 65 e WEIT 66 e WE eer RE 67 atch View sia Alhandra te ae een E ee en 68 Front Panel Support Example ccccccccccseceeeeceeeeeceeeeeeaeeseeeeecaeeesaaeseeaeeseaeeesaeesaeeneneeeenees 71 Na Riser Example tcc ele eld ele le all a al eed 72
51. esponsibility of the system or board designer to provide mechanical support for the motherboard with the I O shield 3 9 1 Back Panel I O Shield Opening Dimensions The I O shield opening is defined in Figure 21 The specification does not define the location of individual I O connectors However it does limit the allowable area for motherboard connectors to protrude from the aperture This area is defined in order to provide sufficient clearance between the connectors and the chassis opening for the I O shield structure to make proper contact However this specification does limit placement of the I O connector to this extent The motherboard supplier must ensure that there is sufficient clearance between the I O connector the connector housing and the chassis to allow sufficient material in the I O shield to make proper contact THIS AREA TO BE FREE OF FLANGES OR OTHER CHASSIS OBSTRUCTIONS TO ALLOW CLEARANCE FOR MOTHERBOARD AND SHIELD TO SLIDE 6 60 be 260 e 228 60 9 000 ha 19 38 109 22 REF 4 700 4 3001 RI 27 4 45 et la 4 45 MER 050 Pn 175 RADIUS MINIMUM 4 45 De d OG 175 RADII vei y be SE SE APERTURE na U 6901 145 0 CONNECTOR AREA el Beery REF DOUBLE 175 Gro 0 STACK AREA y 22 E BASEBOARD END CONTACT AREA tt MINIMUM LU REF TNGLE 1 0 REQUIRED FOR 1 0 CHASSIS OPENING REAR VIEW SHIELD CONTA
52. gure 14 for pin location details connector keys are the same size Page 29 Optional connector detail was changed to 260 Minimum from 300 Sect A A 045 Dimension was changed to REF The secondary key slot size was changed to 2 06 from 1 88 to prevent any insertion problems if the NLX Motherboard Specification Release 1 8 cl k 080 05 OF 7 043 002 0 201 00810 Ix 709 10 051 00210 PAD TO PAD N 1 00 j 0 20 REF 03937 008 9 14 MIN Ve 360 j 02361 pe ae jn 0 20 008 7 1 14 REF STT ordet fag E 045 1 88 0 05 I bei 3 50 11381 MIN ant 074 002 SW 0 41 0 05 DETAIL CARD EDGE B SIDE 0 016 0 002 BOARD PRIMARY SIDE 0 201 008 10 X 209 SCALE 4 000 0 94 k be 0 051 002 10O PAD TO PAD 0 33 037 013 A 2 50 H 2 50 He 098 098 r 27 0 12 k 0504 005 L l 0 25 SEE DETAIL FINGER 0 13 HD DETAIL CARD EDGE FINGER SIDE BOARD SECONDARY SIDE SCALE 4 000 UL DETAIL FINGER SCALE 20 000 Figure 13 NLX Card Edge Detail Notes 1 Dimensioned with GDT Geometric Dimensions and Tolerances per ANSI Y14 5M 2 See Figure 14 for pin location details 3 Added detail view Finger with configu
53. hassis designer refer to the AGP specification for more details and design implications Page 34 NLX Motherboard Specification Note Release 1 8 An NLX motherboard solution with an AGP connector must be a 9 00 inch wide board to fit into an NLX compliant chassis Motherboards without an AGP connector can vary in width from 8 00 inches to 9 00 inches Figure 17 shows the required position of the AGP connector on the NLX motherboard 105 03 4 135 TO CONNECTOR KEY la 213 33 8 399 0 NECTOR SLOT 203 20 8 000 MOTHERBOARD CO CARD EDGE GOLD FINGERS FOR ORIENTATION 254 00 10 000 OTHERBOARD 284 48 11 200 MOTHERBOARD MOTHE 345 HET 1 44 600 RBOARD Figure 17 AGP Connector Pin 1 Location Note The AGP connector can be placed only on 9 inch wide motherboards Page 35 NLX Motherboard Specification Release 1 8 3 8 Motherboard Component Height Constraints Primary and Secondary Sides Three figures show maximum height restrictions the terms left and right in the text below refer to the orientation of the board in the following figures e Figure 18 motherboard primary side design that supports AGP add in card e Figure 19 motherboard primary side design that does not support AGP add in card e F
54. igure 20 motherboard secondary side The chassis designer should dimension the chassis with sufficient margin to accommodate dynamic excursions vibration movements of taller components 3 8 1 Component Height Motherboard Primary Side Far Left The far left side of the motherboard accepts a maximum component height of up to 600 inches 15 24 mm in the area where an NLX AGP notched card would be present if an AGP connector is provided on a 9 000 inch wide motherboard To support AGP the NLX motherboard designer should not place any component taller than 600 inches 15 24 mm in that area The NLX chassis designer should refer to the AGP specification to determine how to support an AGP add in card Figure 18 shows the height restrictions for boards that support AGP cards For boards that do not support an NLX AGP notched card or are less than 9 000 inches wide the maximum component height in this area is 2 800 inches 71 12 mm and 1 750 inches 44 45 mm Figure 19 shows the height restrictions for boards that do not support AGP cards For detailed information about the Accelerated Graphics Port AGP specification and compliance see the World Wide Web site at www agpforum org 3 8 2 Component Height Motherboard Primary Side Mid Left The front of the mid left side of the motherboard accepts a component height of up to 2 80 inches supporting placement of tall components such as processor modules and heat sinks Care must
55. in Area A 0 200 inches maximum in Area B 0 600 inches maximum Refer to Sections 3 3 and 3 8 and Figures 12 and 13 for details about component height restrictions in Areas A and B 7 3 Chassis to Rail Assembly Example Figure 34 shows an example chassis base with built in rail guides Rails are shown in the locations that would be used for the 13 6 inch motherboard Figure 34 Chassis to Rail Mounting Method Example Page 73 NLX Motherboard Specification Release 1 8 7 4 Motherboard EMI Clip Example The EMI clip protrudes through the secondary side of the motherboard and provides an electrical ground contact between the motherboard and chassis The EMI clip can be either soldered or press fit to the motherboard Figure 35 shows examples of EMI clips and Figure 36 shows an example of an EMI clip footprint for the motherboard attachment The EMI clip is provided by the motherboard vendor Figure 35 EMI Clip Examples KEEP OUT FOR EMI GROUND CLIPS BOTH SIDES Figure 36 EMI Clip Footprint Example Page 74 NLX Motherboard Specification Release 1 8 7 5 Reference Clip Contact Impedance The reference EMI Clip contact impedance is defined to be the Class R Bond per MIL B 5087B which is 2 5 milliohms 7 6 Back Panel I O Shield Example Figure 37 shows an example back panel I O shield The motherboard vendor must ensure availability of the I O shield CHASSIS 1 0 O
56. inated as NC now terminated as RIS A161 was terminated as NC now terminated as RIS A162 was USB2 4_OC is now USB2 4_OC also was terminated as NC is now terminated as RIS Page 79 NLX Motherboard Specification Release 1 8 A165 was TAMP DET is now TAMP DETt A166 was RESERVED is now MSG WAIT LED and terminated at the riser B159 was terminated as NA is now terminated as RIS B160 PWRGOOD signal name changed to PWOK This makes the signal consistent with the NLX power supply recommendations B164 was ACTIVITY LED is now LAN ACTVY LEID also was terminated as NA is now terminated as RIS B161 was SOFT_ON OFF is now SOFT_ON OFF also was terminated as NA is now terminated as MB B163 was terminated as NA is now terminated as MB B165 was terminated as NA is now terminated as MB e Table 4 11 IDE Floppy and Front Panel Signal Descriptions USB descriptions For pins A159 and A162 changed pullups from motherboard to riser Bl and B3 SCSPKR_RT and SCSPKR_LFT added in the description a note that reads Note When mono audio is used PCSPKR_LFT will function as the mono signal B51 changed signal type from PCI TTL to Open Drain B156 FP_SLEEP added to the description to read The motherboard provides debounce and pulldown resistor B157 FP_RST Signal Type should be open drain B159 PWRLED Definition modified to A low level will signal the system i
57. iser and likewise all riser functions are not necessarily supported on the motherboard An example of this is the NLX riser supporting two USB ports whereas the motherboard may not support these ports across the NLX riser Requirements e PCI ISA Power two IDE channels one floppy serial bus and miscellaneous front panel signals e Riser to supply up to 100 W of SVDC power e Riser to supply up to 60 W of 3 3VDC power I 1 d 3 d i Additional motherboard power requirements are supported with additional power connectors on the motherboard Page 46 NLX Motherboard Specification Release 1 8 Table 3 Audio Signals Total of 2 Signal Group PC Speaker Number of Signals 2 Table 4 PCI Signals Total of 69 Signal Group PCIINTO 3 PCICLK REQ GNT0 4 AD 0 31 CBE 3 0 PCI MISC Number of Signals 4 5 10 32 4 14 Table 5 Power Pins Signals Total of 68 Signal Group 5VDC 3 3VDC SENSE3 3 5V 12V 12V Ground Power Supply On Off Soft On Off Powergood 5VSB 3 3Vaux Number of Signals 13 13 1 1 1 3 31 oe Table 6 ISA Signals Total of 88 Signal Group IRQ DMA ISA MISG SD 0 15 SA 0 19 LA 17 23 Number of Signals 26 19 16 20 7 Table 7 IDE Signals Total of 30 x 2 60 Signal Group ADDR DATA CONTROL Number of Signals 19 11 Page 47 NLX Motherboard Specification Signal Group Release 1 8 T
58. le The EMI shield design is left entirely up to the motherboard designer or system designer Page 45 NLX Motherboard Specification Release 1 8 4 Riser Card Pinouts and Edge Connector Specifications 4 1 The NLX riser card has the IDE floppy and front panel connectors on the riser card removing most cables from the motherboard The NLX riser card can support up to five PCI clocks and five PCI REQ GNT pairs The number of ISA slots supported is not specified it is determined by the system designer NLX Card Edge Connector The NLX motherboard connects to the riser with a 340 pin 2x170 pin Imm pitch card edge connector The pinouts for the riser interconnect are listed in the tables in Section 4 1 1 The A side is the bottom secondary side of the motherboard and the B side is the top primary side of the motherboard Pin I is toward the back of the motherboard back panel I O connectors See Figures 8 and 13 for connector placement relative to the motherboard 4 1 1 NLX Card Edge Connector Pin Definitions The tables in this section associate the NLX specification pin names with their functions and proper location on the card edge connector The tables also describe front panel and miscellaneous signals gt Note Support for all of the signals defined in the NLX riser definition is determined by each particular motherboard implementation All motherboard functions are not necessarily supported by the r
59. ll turn the LED off A current limiting series resistor typ value 330 ohm is located on the riser Front Panel Sleep FP_SLEEP This signal is driven from a front panel button to request a system level sleep mode This signal is active high The motherboard provides debounce and pulldown resistor Front Panel Reset FP_RST This signal is driven from a front panel button to request a system level reset This signal is low level active The motherboard provides debounce and pullup resistor Modem Wake Up INN SV TTL Open drain MDM_WAKE B165 l A high to low transition of this signal will request a system 5V TTL wake up Note that activity may be initiated by a pulse train signal LAN Wake Up LAN_WAKE B163 This signal when pulsed high for at least 50ms will requesta 5V TTL system wake up When power is applied to the system this signal must remain low I O Column Definitions Relative to Motherboard O Output from motherboard to riser I Input from riser to motherboard Continued Page 55 NLX Motherboard Specification Release 1 8 Table 13 continued IDE Floppy and Front Panel Signal Descriptions Signal Pin I O Description Signal Type USB USB1 3_N A157 I O Universal Serial Bus Port This signal pair comprises the differential data per USB spec USB1 3 P A158 VO signal for a USB port Refer to USB specification for more information USB2 4_N A160 I O Univer
60. mbly e Figure A 4 Rail Section View adjusted to account for EMI clip in rail design Taper added to the tip of the rail to ease insertion into guides during assembly e Figure A 5 Latch View This is an example design We will be providing a second example in our design guide to enable the latch to automatically engage the rail head as the board is inserted See the NLX web site for details e Figure B 5 EMI Clip Examples added two more examples of EMI clips e Figure B7 Back Panel I O Shield Example added to figure a cross section of the shield mounted in the chassis e Table 3 1 Clarified descriptions on hole sets B and C e Tables 4 5 4 6 and 4 7 Changed floppy and IDE reserved signals to general reserved pins and adjusted tables accordingly e Table 4 8 PCI Segment Riser Interconnect pinout B8 SER_IRQ was termination on the riser is now terminated on the motherboard B51 PCI_PM signal was terminated on the riser is now terminated on the motherboard e Table 4 10 IDE Floppy and Front Panel Section Riser Interconnect Pinout A140 was FLPY_RSVD is now RESERVED A116 was IDEA RESRV is now RESERVED A135 was IDEB RESRV is now RESERVED A138 DRV2 signal was terminated as GND is now shown as NA A150 was terminated as NA is now terminated as MB A151 was terminated as NA is now terminated as MB also I O was changed to O A159 was USB1 3_OC is now USB1 3 OCH A160 was term
61. mm 039 inches e Section 3 3 Added the following statement The total available mechanical lead in for both the connector and the card edge is 5 38mm 21 linches If the motherboard is off center from the connector by more than 2 69mm 106 a mechanical interference will occur e Section 3 3 Added 340 pin connector part number AMP 145275 1 e Section 3 7 Removed the statement Appendix B 8 AGP Add in Card Chassis Support Example defines an example of the chassis implications of the AGP slot on the motherboard and the size and location of an opening in the back of the NLX chassis e Section 4 1 Changed MDM_WAKE to MDM_WAKE e Section 4 1 Changed TAMP DET to TAMP_DET This eliminates a constant drain on VBAT Also changed the description wording FROM This signal is low when the switch is open and is high when the switch is closed This signal is pulled high to VBAT on the motherboard via a I Kohm resistor and is CHANGED TO This signal is low when the chassis lid is open indicating an intrusion The signal should be open when the chassis lid is closed indicating normal operation Debounce and associated circuitry uses battery voltage and is located on the motherboard Also TAMP_DET signal type was changed from TTL VBAT to Open drain VBAT e Section 4 1 Added location of signal termination for all 340 card edge connections in Tables 4 8 4 9 4 10 e Section 4 1 Changed FP_SLEEP to
62. n about the Accelerated Graphics Port AGP specification see the World Wide Web site at http www agpforum org Page 12 NLX Motherboard Specification Release 1 8 2 NLX Form Factor Overview Figure shows an example of an NLX board and riser e The add in card riser is located at the left edge of the motherboard as viewed from the back Tall components such as the processor and memory are typically located on the opposite side from the I O slots This allows full length add in cards in many system configurations e The back I O connectors are stacked single and double high to support more connectors E y Yi Figure 1 NLX Board and Riser Example 8 25 x 10 inch board as example Page 13 NLX Motherboard Specification Release 1 8 2 1 NLX System Configuration Example Figure 2 shows an NLX motherboard in a system layout that highlights NLX form factor features for a low profile design Note that this specification offers many possible system configurations Double height I O Single height I O connectors connectors Power supply fan Support for multiple TI d board sizes provides j Back Panel Connectors product line Power connector differentiation 1 Full length gt Lat I O slots gt NS
63. nents and connectors This area reserved for future performance signal and connector definition Figure 16 Reserved Space for Workstation Server Performance Connector Page 33 NLX Motherboard Specification Release 1 8 3 4 3 5 3 6 PCI and ISA Card Support Support for full length PCI and full length ISA cards is dependent on each vendor s chassis implementation including their placement of the peripheral bays and power supply The NLX specification allows for support of full length PCI and full length ISA cards The NLX specification supports standard XT card height 4 20 inches Taller AT cards may be supported in the NLX chassis that has expansion slots above the 2 8 inch keepout area Memory Sockets The exact location of the memory sockets SIMM DIMM or other type of connector is not specified Ideally the sockets should be located to the left of the I O cards to eliminate component height restrictions This location should also simplify memory upgrades through better user accessibility The exact locations will be
64. nstraints Table I defines the terms used in the mechanical diagrams in this document 3 1 NLX Motherboard Dimensions 3 1 1 Definition of Terms Used in Mechanical Diagrams Table 1 Definition of Terms Used in the Mechanical Diagrams Term phrase Tolerances Motherboard thickness Keepout areas for EMI clips required Keepout areas for mounting holes required Keepout zones recommended Definition All dimensions are mm inches unless otherwise specified tolerances are Sheet metal chassis 0 010 inches board mounting hole to edge 0 010 inches board hole to hole 0 005 inches board hole size 0 003 inches 0 001 inches plastic 0 005 inches A nominal motherboard thickness of 0 062 inches is used throughout the specification to calculate dimensions Any deviation from this nominal value will affect most of the dimensions and must be considered The EMI clip location area is reserved for EMI clips The chassis must provide keepout areas in the EMI clip location areas to provide an electrical contact to the chassis The EMI clips protrude from the secondary side of the motherboard in these areas Required Primary side areas of the motherboard with no traces and components to assure the motherboard can accommodate the attachment of rail support Required Secondary side zones of the motherboard with no protruding pins from primary side components and no secondary side SMT components to assu
65. oard to riser I input from riser to motherboard i Continued Page 76 NLX Motherboard Specification Release 1 8 Table 17 continued Signals NLX Riser with Supplemental Connector Pin Signal Name Type UO Description Signal Type Y1 CD IN RT AUDIO I CDROM line in right Analog Y2 CD_IN_GND PWR l Isolated CDROM Ground NA Y3 AVCC PWR O Clean power from the motherboard to audio circuitry on the NLX 5 9V DC riser could be an isolated power source 1 5 Ampere max limitation because of the connector gold finger limitation Y4 LINE_OUT_RT AUDIO O Analog line out right Analog 1V RMS Y5 FP MIC EN AUDIO I This signal indicates if a microphone has been plugged into the TTL front panel MIC IN jack The signal is connected to a wiper on the MIC IN jack and is HIGH when the microphone is plugged in and LOW when it is not The signal is pulled LOW through a pulldown resistor on the motherboard Typically 100K Y6 VOL UPH AUDIO I Connects to Volume Up switch on front panel appropriate TTL pullup resistor on motherboard The motherboard provides debounce protection and a pull up resistor Y7 AC_RST AC 97 O AC 97 master H W reset TTL Y8 AC_SD_INO AC 97 1 Serial time division multiplexed AC 97 input stream to the TTL motherboard from the codec on the riser output from the codec Y9 GROUND PWR NA Digital main motherboard ground plane NA Y10 A
66. oviding more connector space at the back of the chassis and by allowing connectors to be placed out the front of the chassis through the use of the riser The NLX design also provides other Page 11 NLX Motherboard Specification Release 1 8 features such as less cable clutter and fewer connections thus reducing cost and improving the quality of the system The introduction of new technologies processor memory and graphics requires a new motherboard form factor to take full advantage of these powerful new components NLX supports these technologies with its form factor design 1 2 Other Technical Documents For information about the following areas see the series of NLX design guidelines and suggestions that can be downloaded from the NLX public Web site at http www teleport com nlx e NLX Board Gauge User Manual e NLX Chassis Design Suggestions e NLX Electrical Design Suggestions V1 21 e NLX EMC Design Suggestions e NLX Generic Riser Card Design Overview updated e NLX Ground Clip Design Suggestions e NLX I O Shield Design Suggestions updated e NLX Power Supply Recommendations V1 1 e NLX Rail Design Suggestions e NLX Thermal Design Suggestions e NLX Chassis Gauge User Manual For information about signal requirements for a high speed serial bus see the IEEE Standard for a High Performance Serial Bus 1394 1995 refer to the IEEE World Wide Web site at http standards ieee org For detailed informatio
67. ow or stamped line on the base of the chassis such that it will align with the Page 82 NLX Motherboard Specification Release 1 8 connector key datum on the motherboard in its proper insertion location Refer to the NLX Card Edge Board view Figure 3 10 Motherboard designers may want to put a mark next to the connector key datum on the motherboard to facilitate the users alignment during insertion This will help the installer guide the rails into the chassis mounts Revision 1 0 to 1 0a e Section 3 3 Replaced Figure 3 10 with clarified drawing of NLX connector e Section B 2 Figures B 2 and B 3 adjusted shaded areas of keepout zones to match outline of riser card Renamed keepout zones on recommended riser layout Relaxed recommended keepout restrictions Also reworded the keepout area explanations Revision 1 8 Figure and Table Number Updates Table 18 Figure Number Updates Now in In earlier Now in In earlier Version 1 8 versions Version 1 8 versions 1 2 1 20 3 16 2 2 2 21 3 17 3 3 2 22 3 18 4 3 3 23 3 19 5 3 4 24 3 20 6 3 5 25 new 7 3 6 26 A 1 8 3 7 27 A 2 9 3 8 28 A 3 10 3 7 1 29 A 4 11 3 7 2 30 A 5 12 3 9 31 B 1 13 3 10 32 B 2 14 3 11 33 B 3 15 new 34 B 4 16 3 12 1 35 B 5 17 3 13 36 B 6 18 3 14 37 B 7 19 3 15 Page 83 NLX Motherboard Specification Release 1 8 Table 19 Table Number Updates Now in In earlier Now in In earlier Version 1 8 versions Version 1 8
68. r on board devices 0 AD11 Reserved for on board devices e g motherboard chipset White 12 point font is recommended to clearly identify each PCI slot number on the riser card Smaller white 8 point font is recommended to identify other connectors on the riser e g label all of the power connector pins like 12V 12V 5V 5V 5VSB GND etc Page 62 NLX Motherboard Specification Release 1 8 6 2 Recommended INTA INTD Interconnect at PCI Slots BIOS uses a table to implement Plug and Play assignment of interrupts When the BIOS as well as OS assigns an interrupt to an add in card the BIOS must know exactly which INT pin is connected to the corresponding slot Table 15 Recommended PCI Interrupt Routing Slot Connection number INT line to riser pin 1 INTA PCIINTO 1 INTB PCIINT1 1 INTC PCIINT2 1 INTD PCIINT3H 2 INTA PCIINT1 2 INTB PCIINT2 2 INTC PCIINT3H 2 INTD PCIINTO 3 INTA PCIINT2 3 INTB PCIINT3H 3 INTC PCIINTO 3 INTD PCIINT1 4 INTA PCIINT3H 4 INTB PCIINTO 4 INTC PCIINT1 4 INTD PCIINT2 5 INTA PCIINTO 5 INTB PCIINT1 5 INTC PCIINT2 5 INTD PCIINT3 Page 63 NLX Motherboard Specification Release 1 8 6 3 PCI Implementation Issues Because the high speed PCI bus exists on both the motherboard and riser great care should be taken to ensure the integrity of the signals Current simulations show that to ensure signal integrity a 33 ohm series termination resistor is re
69. ration to eliminate swipe while cutting chamfer 4 Added key slot tolerance under Z Page 30 NLX Motherboard Specification Release 1 8 1 0 AREA SHOWN FOR ORIENTATION BOARD PRIMARY SIDE TT 10 79 REF 2 1811 AB Y lu 146 29 REF PIN BI 5 759 PIN AI 70 PIN Al BOARD SOLDER SIDE SCALE 2 000 Figure 14 NLX Card Edge Board View Notes 1 Picture update shows chamfer 2 Pin number and location reference details are included 3 3 1 I O Signals Routed to the NLX Riser Card To reduce the number of cables to the motherboard NLX defines a comprehensive set of pins on the riser for I O signals Section 7 shows an example method to implement front panel features 3 3 2 Disk I O to the NLX Riser Card The IDE and floppy disk drive connectors are supported on the NLX riser card The IDE interface has two distinct sets of data address and control lines for the primary and secondary IDE connectors This interface supports all IDE modes Page 31 NLX Motherboard Specification Release 1 8 3 3 3 NLX Riser Card Design Considerations Riser Mechanical Support Validation testing has shown that the riser card must have adequate support directly behind the card edge connector to eliminate any torque of the riser card during motherboard insertion extraction Connector and Card Edge Alignment The system designer should ensure that there exists enough clearance in the system rails so the mothe
70. rawing Incorporated all approved published Engineering Change Requests ECRs to date Listed figures in the Contents Updated all figure numbers to be consecutive throughout the document and omitted the section numbers from the figure numbers For the equivalent old new numbers see Table 18 in Section 8 Listed tables in the Contents Updated all table numbers to be consecutive throughout the document and omitted the section numbers from the table numbers For the equivalent old new numbers see Table 19 in Section 8 Renamed Appendix A to be Section 6 and Appendix B to be Section 7 to enable use of automatic paragraph numbering Section 2 Figure 1 was Fig 2 1 repeated the example drawing from the title page Figure 5 was Fig 3 4 corrected mounting hole size to 0 156 inches from 0 140 inches Figure 8 was Fig 3 7 the correct measurement from zone A to zone B 2 5 63 5mm is from the bottom of zone B not from the top of zone B Inserted Figures 12 13 and 14 in place of Figures 3 9 3 10 and 3 11 see the notes below each figure Section 3 3 3 added text and Figure 15 was Fig 3 11 1 in ECR P16 to specify the recommended connector tilts for the axes of the NLX riser board card edge connector Section 3 6 clarified the text that describes the optional keepout zone C Section 3 8 1 clarified the text that describes the maximum component height at the far left primary side of the motherboard distinguishing between boards
71. rboard can align properly with the connector If the guide holds the rail too tightly the motherboard card edge may not easily guide into the riser card connector Alignment of the 340 pin Connector and the Supplemental Connector Riser card designers should consider the tilt and alignment of the two independent connectors that mate with the motherboard If these connectors tilt excessively and in opposite directions the resulting interference could cause board insertion difficulties gt Note The maximum allowed connector tilt is 0 010 inches from the plane of the riser card for both the short and long axes see Figure 15 Excessive tilts could cause board insertion difficulties and damages Figure 15 shows tilts on both short and long axes Figure 15 Maximum Recommended Connector Tilts for Riser Board Card Edge Connectors 010 2X13 pin connector and 340 pin connector Page 32 NLX Motherboard Specification Release 1 8 3 3 4 Reserved Space for Workstation Server Performance Connector Definition Standard NLX boards must have a reserved space at the front of the motherboard in line with and in front of the 340 pin connector This space is shown in Figure 16 A future revision to the NLX specification will define a set of pins and a connector for use in this space by workstations and servers Standard boards should not enter this space for ANY function and designers should keep this area free of board fiberglass compo
72. rd nom 3V 3 3Vaux A135 O Provides 3 3V Standby power on the NLX riser 3 3V TTL I O Column Definitions Relative to Motherboard O Output from motherboard to riser Input from riser to motherboard EI O D o w Rei Q m Z z a gd 9 z a b gt D zm 5 ao Gel gt A E K Es m Zz op iD EF E gt Oo o fo o o wo st fo e Ro lt lt lt lt lt lt lt lt LI LI L I 062 in Ed o st be Re 8 8 amp 8 HFS g Sg e Seng 7 yr e m m m m m m m m 1 4 i r UI 3 D 4 lt Se D a D UI lt x H D D el gt gt Q Z Ee 2 5 Sei e Zz x 3 Figure 25 Riser Differential Pair Pins Page 58 NLX Motherboard Specification Release 1 8 5 NLX Motherboard Environmental Safety Regulatory and Thermal Considerations The NLX environmental considerations are specific to the motherboard These considerations are not intended to be used at the system level 5 1 Environmental The following guidelines are suggested to ensure a high level of board chassis synergy They serve as a template of typical thermal dynamic and emissions targets that may be used in board and or chassis development to create a system environment conducive to optimal motherboard or system performance reliability and service life Close attention to motherboard chassis interdependencies leads to a s
73. re that the motherboard can slide into the chassis and be mounted without rails Recommended 3 1 2 NLX Board Size The NLX specification supports motherboards with overall dimensions of 9 0 inches x 13 6 inches maximum to 8 0 inches x 10 0 inches minimum An NLX compatible chassis must be able to accommodate motherboards with these two extreme dimensions and all sizes in between The specification defines the maximum motherboard width as 9 0 inches so an NLX chassis must be designed to accept boards up to 9 0 inches wide The minimum motherboard width is 8 0 inches an NLX chassis can support board widths down to 8 0 inches because of the way the NLX mounting holes are placed The specification defines motherboard lengths from 10 0 inches to 13 6 inches To accommodate these board sizes Page 16 NLX Motherboard Specification Release 1 8 the chassis must allow for a maximum length board of 13 6 inches and must include all three sets of mounting holes Motherboard dimensions with keepout areas are illustrated in Figures 3 to 8 The figures show the primary and secondary sizes of 8 0 inch 9 0 inch board widths in lengths of 10 0 inches 11 2 inches and 13 6 inches Section 3 3 NLX Card Edge Connector describes the location of the card edge gold fingers 3 1 3 Mounting Hole Placement As detailed in the section above the NLX specification supports motherboards with overall dimensions of 9 0 inches x13 6 inches maximum to
74. s area at a maximum and centered in the opening to the extent possible To standardize a shield design the dimensions flagged with an asterisk must be used Also required is the minimum motherboard location dimension of 7 62mm 300 inches A standard shield must fit between the back of the chassis and the board mounted connectors at the MINIMUM MOTHERBOARD LOCATION This will limit the standard SHIELD FLANGE LENGTH to a maximum of 5 84mm 230 inches plus tolerance Any deviation from the above mentioned dimensions may require the use of a chassis specific shield Page 42 NLX Motherboard Specification Release 1 8 CHASSIS REAR WALL 7 62 MINIMUM MOTHERBOARD LOCATION 300 1 27 MAXIMUM TOP FLANGE GAP END CONTACT AREA 8 36 050 329 MINIMUM REQUIRED SURFACE SEE DETAIL SHIELD CLEARANCE GN MOTHERBOARD 42 93 49 91 1 690 I ae AA p DOUBLE STACK VU ort l END CONTACT AREA 10 46 BIN e SE GEN INIMUM REQUIRED SURFACE Sail AT e 0 97 REF LOWER FLANGE GAP 038 BASED ON RECOMMENDED RAIL DESIGN STANDARD NLX SHIELD PROVIDE CLEARANCE IN THIS AREA FOR SHIELD SLIDE THROUGH 5 84 230 SHIELD FLANGE LENGTH DETAIL SHIELD CLEARANCE Figure 22 Side View of Back Panel Double High I O Shield Opening Dimensions Page 43 NLX Motherboard Specification Release 1 8 16 51 REF SINGLE HEIGHT CONNECTOR m MOTHERBOARD Ba CONN FACE TO EDGE OF MOTHERBOARD 5 86
75. s in a poweron state a high level will signal a power managed state B160 PWRGOOD signal name changed to PWOK This makes the signal consistent with the NLX power supply recommendations B165 was MDM WAKE is now MDM_WAKE A116 A135 were IDE reserve pins now general RESERVED pins A140 were Floppy reserve pins now general RESERVED pin A151 changed I O to O Description added to reserve EEPROM binary device address 1010000 for future riser configuration initiatives A165 TAMP_DET Signal type change was open drain VBAT is now open drain A166 MSG_WAIT_LED signal added Description enhance to include Control signal for telephony device to indicate a message is waiting A low level will turn the LED on and a high level will trun the LED Off A current limiting series resistor typ value 330 ohm is located on the riser A166 taken off the reserved list e Table B 1 Supplemental connector signals changed I O APIC signals removed Telephony Audio added Signal Definitions for AC 97 added Y3 description suggested 2 0amp max now suggests 1 5amps X6 was VOL_DN is now VOL_DN X7 was IRQ0 is now GROUND and description changed to ground Page 80 NLX Motherboard Specification Release 1 8 X8 was IRQI is now SMI with open drain signal type X9 was IRQ8 is now RESERVED X10 was AP ACK1 is now RESERVED X11 was GROUND is now RESERVED X12 was AP_ACK
76. s sisina iina ear ee eet eet dagen dere 34 3 5 Meter eege Eege ee A take a Ee 34 3 06 Processor Aune 34 3 27 E Supportive avtales en an 34 3 8 Motherboard Component Height Constraints Primary and Secondary Sides 001001aae 36 3 8 1 Component Height Motherboard Primary Side Far Let 36 3 8 2 Component Height Motherboard Primary Side Mid Let 36 3 8 3 Component Height Motherboard Primary Side Right Side Mid to Back 37 3 8 4 Component Height Motherboard Primary Side Right Side Mid to Front 37 3 8 5 Motherboard Secondary Side A 40 3 9 E Panel e RUE DEE 41 3 9 1 Back Panel I O Shield Opening Dimensions ssssssesseessesssessiesrsrsresnstnrstnnsnssrnsens 41 3 9 2 Back Panel I O Shield Side View 42 3 9 3 I O Shield EMI Containment Contacts tees eeeeeeseeeeeseaeeesaeeneneeees 45 Riser Card Pinouts and Edge Connector Specifications nnnnvrnnnnnnnnnnnnnnnnn 46 4 1 NLX Card Edge Connector sensira ei ia aii iia ieia ieaie iian 46 4 1 1 NLX Card Edge Connector Pin Detinitions 46 4 1 2 Miscellaneous and Front Panel Gionals nnr tennnernnernnssnneennens 55 Page 7 NLX Motherboard Specification Release 1 8 5 NLX Motherboard Environmental Safety Regulatory and Thermal Considerations oegzeeugeueeugeeregee eeeEuEeeEkEENESESESEEEEEKEVEKENeegeEENEEEAgeg 59 Bel Environm Srntallesss asset sa tiebe eege tosh tite ee sac phaa nscaha vcdiond geet de 59 5 1 1 Temperature Requirement eecccccc
77. s to maximum speed when the voltage potential on this pin is 10 5 volts or greater This signal sets the fans to minimum speed off when this signal is 1volt or less Fan speeds in between can be achieved by setting the voltage potential of this pin between 1 and 10 5 volts The maximum current supplied by this pin is 50mA and is not meant to drive fans directly Internal power supply fan driving circuitry has been allotted 20mA of the available 50mA from this signal Remaining 30mA may be used for circuitry on riser or motherboard to drive other fans in the system A 10K minimum pull up resistor to 12 Volts should be supplied on the riser card of the NLX system for FAN_CTL This will ensure that as a default the fan control will be set to full speed Tamper Detection TAMP_DET A165 This signal indicates the state of an intrusion sensing device switch or Open drain equivalent This signal is low when the chassis lid is open indicating an intrusion The signal should be open when the chassis lid is closed indicating normal operation Debounce and associated circuitry is located on the motherboard I O Column Definitions Relative to Motherboard O Output from motherboard to riser Input from riser to motherboard Continued Page 56 I O Column Definitions Relative to Motherboard O Output from motherboard to riser Input from riser to motherboard Speed requirements capabilities for the 139
78. sal Serial Bus Port This signal pair comprises the differential data per USB spec USB2 4 P A161 VO signal for a USB port Refer to USB specification for more information USB1 3_OC A159 This signal is used to monitor the status of the USB power supply lines 5V TTL USB2 4 OCH A162 I This signal is low when an overcurrent condition exists on the USB T power supply line and is high during normal operation The riser contains the pull up resistors PC Speaker Note When mono audio is used PCSPKR_LFT will function as the mono signal PCSPKR RT Bi O This signal pair provides the capability to drive a connector on the riser application PCSPKR LFT B3 o to which a speaker can be attached Both speaker signals are DC driven dependent on the motherboard and can each drive 8 ohm speakers to ground Fan Control FAN_TACH1 A152 Signal from a fan tachometer to allow monitoring of fan speed 0 12V max FAN _TACH2 A153 The motherboard must condition these signals to meet the input open drain FAN TACH3 A154 requirements of the monitoring device and the type of fan used FAN_CTL A155 o This signal is used to control fan RPM rate 0 12V max The exact speed of the fans controlled by this signal will depend on the implementation Because of this the system designer should ensure that all of the system acoustics and cooling requirements are met when this signal is set for maximum fan speeds This signal sets the fan
79. snnnsrnnnns 62 Table 15 Recommended PCI Interrupt Rougmg 63 Table 16 Recommended Voltage Tolerances for Motherboard at Riser Connection 69 Table 17 Signals NLX Riser with Supplemental Connechor 76 Table 18 Figure Number Uodates AAA 83 Table 19 Table Number Updates AAA 84 Page 10 NLX Motherboard Specification Release 1 8 1 Executive Summary 1 1 NLX is a new low profile motherboard form factor designed to improve upon today s low profile form factors and to adapt to new market trends and PC technologies NLX does the following e Supports current and future processor technologies e Supports new Accelerated Graphics Port AGP high performance graphics solutions e Supports tall memory modules and DIMM technology e Provides more flexibility for system level design and integration for example the new design flexibility allows system designers to implement a motherboard that can be installed quickly in most cases without using screws thus lowering the PC s total cost of ownership Several major PC vendors world wide worked jointly to define the NLX form factor and to incorporate flexibility to accommodate the best designs for current and future PCs NLX is a public specification intended for widespread use in many types of systems The specification and other information on NLX are available through the public Web site http www teleport com nIx or http www teleport com ffsupprt Technology Influences New
80. solutions A flat electrically conductive clean surface must be provided in these keepout areas The optional clips provide a ground contact between the motherboard and chassis replacing the electrical functionality of screws used in previous chassis designs Figure 9 shows chassis keepout areas and motherboard EMI clip location areas for all three motherboard lengths The EMI clips protrude through the secondary side of the motherboard in the clip location areas Figure 9 shows the areas of a motherboard where a board designer can place EMI clips to make electrical contact to the chassis The chassis manufacturer must design the chassis with the required keepout areas to allow a motherboard with EMI clips to slide into the chassis without interference The primary surface of the riser card is defined as the side that the 340 pin connector is mounted on Page 25 NLX Motherboard Specification p KEEPOUTS TO EXTEND TO THE OPEN EDGE OF THE CHASSIS i 3 PLACES 11850 PE je 3X 17 78 19 05 700 1750 KAN NN NNN NN mmm lt lt 1 Release 1 8 EMI CLIP LOCATION AREAS TO BE KEPT CLEAR IN CHASSIS FOR EMI GROUND PROTRUD ING FRO OF THE MOTHERBOARD CLIPS M THE SECONDARY SIDE 3X 25 40 1 000 6 60 REF 260 CARD EDGE GOLD FINGERS SHOWN FOR ORIENTATION 254 00 REF BOARD LENGTH wt 10 0001 284 48 REF BOARD LENGTH wt 11 200
81. t Refer to the 1394 1995 standards for standard TPA B167 vO more information These pins are defined with respect to a 1394 1394 1995 PHY located on the motherboard Risers implementing 1394 should have this taken into consideration in their design TPB A168 I O IEEE 1394 1995 port This signal pair comprises the differential Per IEEE data signal for a 1394 port Refer to the 1394 1995 standards for standard TPB B169 1O more information These pins are defined with respect to a 1394 1394 1995 PHY located on the motherboard Risers implementing 1394 should have this taken into consideration in their design PCI Power Management PCI_PM B51 I O This signal is used to change the power management state of PCI Open Drain devices Refer to the PCI Power Management specification for more information NLX Motherboard Specification Release 1 8 Table 13 continued IDE Floppy and Front Panel Signal Descriptions Signal Pin I O Description Signal Type Serial IRQ SER IRQ B8 I O This signal is used to implement a serial IRQ scheme to allow PCI TTL the reporting of ISA style interrupts over a single signal Power PWOK B160 I This signal from the power supply is used to reset system logic 5V TTL and indicate proper operation of the power supply During normal operation this signal is high it is low during a fault condition or during power off VBAT A164 O Provides battery voltage to riser battery is on the motherboa
82. t will align with the connector key datum on the motherboard in its proper insertion location Refer to the NLX Card Edge Board View Figure 14 Motherboard designers may want to put a mark next to the connector key datum on the motherboard to make it easier for the installer to align the motherboard while inserting it This will help the installer guide the rails into the chassis mounts The rail system and a single lever latch work together to insert and remove the motherboard from the riser connector The lever latch must be installed on the middle rail to provide sufficient leverage and to not interfere with the required chassis keepout areas for EMI clips See Figure 34 for an example 6 7 DC Voltage at the Motherboard To assure proper motherboard operation the NLX motherboard designer must know the voltage tolerances that will be supplied by the NLX riser to the motherboard Table 16 lists the NLX specification recommendations for voltage requirements for the motherboard at the riser connection to ensure interoperability between NLX compliant motherboards and risers NLX recommends the power supply connector be placed on the secondary side of the riser card but the exact location of the connector is not specified Refer to the NLX Power Supply Recommendations a separate document for details about potential NLX compatible power supplies including connector form factors and pinouts power requirements etc Table 16 Recommen
83. the two general requirements for reducing EMI in a system Containment of EMI usually centers around the chassis design seams and apertures Suppression of noise generation centers around ground system design The NLX Motherboard Specification is written to allow ground system design as either single point grounding or multipoint grounding e The single point grounding scheme may be possible using a slide in I O shield at the back of the chassis e The multipoint grounding scheme may be possible using a slide in I O shield and EMI clips attached to the motherboard This scheme connects the motherboard s ground structure to the chassis at strategically located points Page 60 NLX Motherboard Specification Release 1 8 5 3 1 1 Emissions It is the responsibility of the system designer and or board designer to provide the following emission requirements for their product CFR 47 Part 15 Subpart B Class B CISPR 22 EN 55022 Class B 5 3 1 2 Immunity It is the responsibility of the system designer and or board designer to provide the following immunity requirements for their product EN 50082 1 1992 Generic Immunity Requirement IEC 801 2 1984 ESD IEC 801 3 1984 Radiated Electric Field IEC 801 4 1988 EFT 5 3 1 3 Self Certified Emissions Compliance It is the responsibility of the system designer and or board designer to provide the Self Certified Emissions Compliance for their product Because of change in FCC Rules
84. ther Technical Doc mentS ennaa aa a aaa a A hehe AAE a ae Eaa ENAS 12 NLX Form Factor OvervieW asnsssssnunnnnnennnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn nnmnnn 13 2 1 NLX System Configuration Example rannrnnnnrnnnnvrnnnnrnnnnnvnnnrrnnnnrnnnnnrnnnnnnnerrennrrrennnrnnsnnnnrnnnen 14 2L NEX Riser Cardigan aud a a a a a a leet thet 15 2 2 Benefits fo GIE Meet thie Adie ee Adie aie Ath Aa Ata 15 NLX Mechanical SpecificatiOns rrrrnnnnnnnnnvvvnnnnnnnnnnnnnnnnnvnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn 16 3 1 NLX Motherboard Dimensions AA 16 3 1 1 Definition of Terms Used in Mechanical Diagrams urrnnronnnnnvnnnnnnnrnnnnnnrnvnrnnrnnnrnnnnn 16 3 1 2 gt NEX Ee Ee RTE 16 3 1 3 Mounting Hole Placement 17 3 1 4 NLX Board Complete Keepout Specification ssesseessesseesseeeesseeenrsrnrsrnssrnssrnsens 18 3 2 Motherboard EMI Clip Locations with Chassis Keepouts mmmrmarsvrrnvrrrrrvrrvrrvnnnrnnrnnenennennn 25 3 2 1 EMI Grounding Using Motherboard Rails ccccececeeeeeeeeeeeeeeneeeeeeeeseaeeesaeeeeneeees 27 3 3 NLX Card Edge Connectors nesr netresrnstnsrsstnsstenstenstenstenstnnstnnsnnnttnnntnnntnneennnnt 28 3 3 1 I O Signals Routed to the NLX Riser Card 31 3 3 2 Disk I O to the NLX Riser Card 31 3 3 3 NLX Riser Card Design Considerations rrrarnvrnnnnvnnonrvnnnrrvnnnrnnnnnvnrnrrernnrnrnnnnnnennn 32 3 3 4 Reserved Space for Workstation Server Performance Connector Definition 33 3 4 PCl and ISA Card Support
85. to the front of the board These pins appeared longer than the other segments no dimensions were affected Changed pin label from 1B to B1 Changed 70 8 dimension to 70 79 Figure B 6 Removed the dimensions from the EMI clip detail drawing Figures B 8 and B 9 Removed AGP card mechanical drawings The AGP specification team will be modifying the AGP NLX bracket that is used for the AGP card The modified design will enable a more user friendly installation The mechanical design will be available on a separate document on the NLX spec site and on the AGP spec site on the World Wide Web Table 4 10 pin B161 changed from SOFT_ON OFF to SOFT_ON OFF Section 2 1 1 Added the following statement Connector and Card Edge Alignment The System designer should ensure that there exists enough clearance in the system rails so the motherboard can align properly with the connector Too much tilt or lack of alignment will prevent board insertion and seating Section 3 3 Added the following statement The seating depth of a NLX motherboard into the NLX card edge connector is defined to be the distance from the riser board Page 81 NLX Motherboard Specification Release 1 8 primary surface to the edge of the NLX motherboard when fully inserted into the connector This distance is 260 Also the minimum contact backout wipe within the connector for the upper and lower contacts on the gold finger pads shown in Figure 3 9 is 0 99
86. uccessful system solution 5 1 1 Temperature Requirements Storage temperature 40 C to 70 C Operational temperature 10 C to 45 C 5 1 2 Board Shock Unpacked 40 G trapezoidal waveform Velocity change of 170 inches second Packaged Half sine 2 millisecond 5 1 3 Board Vibration Unpacked 5 Hz to 500 Hz 3 1 gRMS random Packed 10 Hz to 500 Hz 1 0 gRMS random Page 59 NLX Motherboard Specification Release 1 8 5 2 Safety It is the responsibility of the system designer and or board designer to provide the following safety requirements for their product UL 1950 CSA 950 95 3RD EDITION 28 JULY 1995 The Standard for Safety of Information Technology Equipment including Electrical Business Equipment USA and Canada CSA C22 2 NO 950 93 2ND EDITION The Standard for Safety of Information Technology Equipment including Electrical Business Equipment Canada EN 60 950 2ND EDITION 1992 WITH AMENDMENTS 1 AND 2 The Standard for Safety of Information Technology Equipment including Electrical Business Equipment European Union IEC 950 2ND EDITION 1991 WITH AMENDMENTS 1 2 AND 3 The Standard for Safety of Information Technology Equipment including Electrical Business Equipment International EMKO TSE 74 SEC 207 94 Summary of Nordic deviations to EN 60 950 Norway Sweden Denmark and Finland 5 3 Regulatory Compliance 5 3 1 NLX CE Mark Compliance Containment and suppression of EMI noise are

NLX Motherboard Specification

Contents

Download Pdf Manuals

Related Search

Related Contents