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tft_lcd_l500b2015-05-09 02:232.1 MB - Wiki Karat

1. R92 1 2K 5V5 5VS R46 m C96 i 22pF Lu our 2 C23 1 5 92 7542 N 22pF U18 RESET Y2 ALJER VP 8 Sen PO uL 00 2 Fsg ons E 5 35 504 ES SE 20 4 54 505 x2 0 5 33 506 82 507 RESET e 9 nr 453BSYNC 1 p2 0 Z SUSPEND 224 22 2olNTO p2 2 23 HSYNC JolNTI p23 24 qos tjm HET 521 SCHIER 5010 71 10 1 P1 0 27 28 R3 R4 2 Jon SS 4 7K 4 7K 5 e B 2013 WR UP P14 PSEN 028 SDN 7 P1 5 ALE P Hi gt 4 SCL 8 E 159 10 5VS LED_ON OFF 8051 WATCHDOG WR RD R18 5VS 4 7K 4 gt POWER ON OFF Q9 R902 R903 R904 4 7K 4 7K 4 7K KTC3875 JI 515 e Se 1 Si S1 DOWN 5 t 2 je 4 E 2 UP 2 GRN 51 52 21515 1 SW SW 53 1 R10 R9 6 PS o 1K 1K 3 S4 RIGHT 8 ie 5 ON OFF 56 a OSD KEY D R400 B _ LED SUSPEND i 53 19
2. RALO 7 0 7 BALO 7 ea eae lt lt lt lt lt lt laxe ea Jet Let fee E r Or 22 ien ggg 2999955 4958 mue ACA lt lt lt lt lt lt lt lt lt lt lt lt lt lt 0 Oooooo0o0c0 0 mmm 00 5010 71 HL RBI 22 500 220 89 501 221 50 582 502 222 155 582 87 505 223 605 RB5 BE 504 224 201 nne 85 505 225 524 685 RI 506 226 55 507 227 657 Z 4 7 228 CB A15 CS HS wei 232 685 78 233 WR 88281 Ta 77 ALE 250 ALE E L 75 RESETE 235 256 GE 2 R2 74 DCLKA 252 E 78 gt 253 Incr g HA 885 70 T PDAOI pas 59 PDAO2 7 5pA2 BBG 98 BEAD 516 PDAOS 6 er 887 C3 _ 10pf PDAQ4 9 22pf 22pf 05 4 Jonas Lusync o 22 3 DA Ps LVSYNC EN celles PDAO7 als 25 LDTG DA7 LDTG gt PDAOB 18 94 PDAO9 WS S95 16 H TOUT osont HAt DAN PDATS E BESED P PDATA 12 251 CLAMP DA14 CLAMP gt PDAIS Jeans
3. K K K K K K 37 LOC PART CODE HRFT750JCA PART NAME R CHIP PART DESC 1 10 75 OHM J 2012 HRFT750JCA R CHIP 1 10 75 OHM J 2012 LOC PART CODE ELECTRIC AL PARTS LI PART NAME DIODE SCHOTTKY PART DESC SK14 HRFT750JCA R CHIP 1 10 75 OHM J 2012 DIODE SCHOTTKY SK14 HRFT102JCA R CHIP 1 10 1K OHM J 2012 HLC220M00E L CHIP COIL 22UH M BA220 HRFT302JCA R CHIP 1 10 3K OHM J 2012 HLC220M00E L CHIP COIL 22UH M BA220 COIL CHIP BEAD HB 4H3216 300JT TFDS6930A FET CHIP FDS6930A HFFH4M121E COIL CHIP BEAD HB 4M3216 121JT TFDS6930A FET CHIP FDS6930A HFFH4M121E COIL CHIP BEAD HB 4M3216 121JT 1K1A78L05F IC REGULATOR CHIP 78 121 COIL CHIP BEAD HB 4M3216 121JT TNDS9435A FET CHIP K N DS9435A HFFH4H300E COIL CHIP BEAD HB 4H3216 300JT T2N3904SRT TR CHIP 3904S RTK COIL CHIP BEAD HB 4H3216 300JT 1K1A78L05F IC REGULATOR CHIP KIA78LOSF RTF COIL CHIP BEAD HB 4H3216 300JT HRFT104JCA R CHIP 1 10 100K OHM J 2012 COIL CHIP BEAD HB 4H3216 300JT HRFT220JCA R CHIP 1 10 22 OHM J 2012 HFFH4M121E COIL C
4. Check output voltage of adapter NO Trouble in adapter Im 15 the 5VS line normal NO Trouble in SQ8 and its ambient circuit Is the pulse of pin9 ofthe IC1 Trouble in IC2 or its ambient circuit NO s Trouble in Q7 or its ambient circuit 16 TROUBLESHOOTING HINTS 3 No raster No raster Trouble in the Q10 or 25V y 88281 If its trouble Check the output ofthe 010 or pin of CN1 in the MX88282 change the main B D CN1 1 pin 12V check Check the DC AC output NO Check the 12V ofthe main power NO Trouble in DC AC inverter YES Replace LCD panel D TROUBLESHOOTING HINTS 4 One color is missing Im Is OSD color Check the output signal ofthe MX88281 and 74act573 NO Check video signal cable or video card normal Is input signal normal Are the R B digital 8 bit output ofthe U17 TDA8752 Trouble in the soldering NO Replace the main B D TROUBLESHOOTING HINTS 5 Pre check Check output voltage 5V 3 3V 12V Check on off Check reset signal 9 pin of micom and its ambient circuit NO Signal of micom pe Check output of Q9 NO Trouble in the Q9 and its ambient circuit YES Trouble each trouble item Trouble in the 501 TROUBLESHOOTING HINTS 6 Abnormal vide
5. 27 SCHEMATIC DIAGRAM POWER DC DC HEADER 3 POWER ON OFF 508 bi D 2 o a 3 e 2 SR4 78105 sci H 502 100k 620 od Sept eke 22 F 35V 22UF 35 T eps gi 78 1 k CS3 FB3 zt SRS 2 553 3 E TONS 1 3 S us 3 10K e 514936DY 6 15 6 SE L28 2 o Foy x e 101 85 END PGND L 565 deg 0 02 DL5 104 EV SYNC 5 I Heisei Zeen VE 14 SHON LX5 red Tov 220ur 10v 220UF 10K e AX7B6 SRI SES SR16 SR14 100K 10 100K m 7 8 SC6 507 568 103 103 105 SR10 P 502 e e S14936DY R 4 7K 2506 tes SRB 110 61 5 CY epee iW 0 02 BEAD H I j tsc wf Tt AT 507 10V 220UF 2200 3 o 2139045 815 Lg 100K BEAD L 5018 _ 22UF 35V
6. ig 27 VCCAG C105 C104 F AG D I 3549 AGNDR 1nF O tuF DG 29 AGNDB VCCAB P 3 VREF C85 luF C86 oa DoD EXT CBS C2 0 01uF C1 C100 AINC CC 0 022uF EC CBB AINC 0 022uF EC C101 AINC am UU ZU UU UO 0 022uF EC gt 1 2 02 CA gt gt 00 01 DGND I He YNC CKREF WOFF AGND 97 COAST VCCA P VDDD IC 3W VCCD vCCO P VCCOR vCCOG VCCOB Ua DITH CZ oB7 PCSEL 7 C97 9 uE C94 0 01uF 15 C95 17 Q 0luF C4B 0 0tuF 23 C47 25 0 C46 16 R Check Point ec 47 G Check Point B Check Point 80 81 835 84 TDA8752 95 m 59 gd C112 C25 C1231 C38 C107 O tuF Our i in O 47uF Tou Fa e e l 1 t PDALOO 231 RW2 1W 33 o RIS 1 2W 100 em l
7. 4 TT2 BIN 4x14 MFZN ST FRO ST REAR 22 9972923500 FRICTION PAD 1 PC ABS GY 275A 21 7063421011 SCREW MACHINE M S BIN 4 12 MFZN SW STAND 20 8972214300 COVER MOUNT 1 5 275 94 19 7173401411 SCREW TAPTITE 2 TT2 BIN 4x14 MFZN CO MOUNT HINGE 18 9973922500 HINGE ASS Y 1 SUS 1 57 17 9975111400 DECO PANEL 1 GY 275A 94 HB 16 7173401411 SCREW TAPTITE 4 112 BIN 4x14 MFZN FRONT REAR 15 9872116400 COVER REAR 1 FR ABS 27 14 SUB PCB 1 13 INBERTER PCB 1 12 7178301011 SCREW TAPTITE 2 TT2 WAS 3x10 MFZN INBERTER PCB REAR 11 7173401411 SCREW TAPTITE 1 772 BIN 4x14 MFZN 10 MAIN PCB 1 9 7178301011 SCREW TAPTITE 4 TI2 WAS 3x10 MFZN PGB REAR 8 7178301011 SCREW TAPTITE 4 2 WAS 3x10 MFZN REAR LCD 7 LCD PANEL 1 6 7178501011 SCREW TAPTITE 4 TT2 WAS 3x10 MFZN 5 CONTROL PCB 1 4 9974822500 BUTTON POWER 1 HB ABS 275 94 3 9977918300 LENS LED 1 ACRYL 2 9974822500 BUTTON POWER 1 HB ABS GY 275A 94 HB 1 9972019800 COVER FRONT 1 FR ABS 275 NO PART CODE PART NAME DESCRIPTION REMARK INFORMATION OF PARTDESCRIPIION Important Safety Notice Components identified with the International Symbol have special characteristics important for safety When replacing any components use only manufacturers specified parts
8. Amt ir 7 0 47uF e s Ek ag y 4 eite senec A Ae Con Sagas he 4 115 gt ADCVDAI BEAD 116 ADCPLA1 Y BEAD gt 21633 1OuF AGND EXPLODED VIEW amp MECHANICAL PARTS LIST 21 9972923200 STAND REAR HB ABS CY 275A 94 HB 1 34 9977245700 SHIELD CONNECTOR 1 0 8T REAR REAR 33 7178301011 SCREW TAPTITE 2 TI2 WAS 3x10 MFZN SUB PCB REAR 32 7063401211 SCREW MACHINE 4 M S BIN 4 12 MFZN SW HINGE ST FRONT 31 9975424800 LABEL RATING 1 PE 30 7173401411 SCREW 4 TT2 BIN 4x14 MFZN ST TOP ST BOTTOM 29 9972712800 FOOT 6 RUBBER 28 9972923400 STAND BOTTOM 1 5 275 84 27 9973724700 SUPPORTER STAND 1 EGI 3 07 26 7173401411 SCREW 4 TT2 BIN 4x14 MFZN ST TOP FRIC PAD 25 9972923300 STAND 1 5 275 94 24 9972923100 STAND FRONT 1 6 275 84 23 7173401411 SCREW
9. CARBON FILM 1 6 4 7K OHM J 85801052GY RE COPPER 1 0 52 TIN COAT HRFT472JCA CHIP 1 10 4 7K OHM J 2012 85801052GY RE COPPER 1 0 52 TIN COAT HRFT102JCA R CHIP 1 10 1K OHM J 2012 85801052GY RE COPPER 1 0 52 TIN COAT HRFT101JCA CHIP 1 10 100 OHM J 2012 85801052GY RE COPPER 1 0 52 TIN COAT HRFT104JCA R CHIP 1 10 100K OHM J 2012 85801052GY RE COPPER 1 0 52 TIN COAT HRFT474JCA CHIP 1 10 470K OHM J 2012 85801052GY WIRE COPPER 1 0 52 TIN COAT HRFT103JCA R CHIP 1 10 10K OHM J 2012 9979100010 JACK DC POWER JACK 6 5PIE 14 5 9 RD 2Z101J R CARBON FILM 1 2 100 OHM J HFFTB2601B COIL CHIP BEAD 3216117260 HRFT105JCA RCHIP 110 1 J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT105JCA 1 10 1M OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT472JCA R CHIP 1 10 4 7K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT472JCA R CHIP 1 10 4 7K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT220JCA R CHIP 1 10 22 OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT472JCA R CHIP 1 10 4 7K OHM J 2012 HFFTB2601B CHIP BEAD TB3216112260 HRFT472JCA R CHIP 1 10 4 7K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT473JCA R CHIP 110 47K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT472JCA R CHIP 1 10 4 7K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFTO00JCA R CHIP 1 10 0 OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT220JCA R CHIP 1 10 22 OHM J 2012 HFFTB
10. Abbreviation of Description RESISTOR Description Allowance Example Fig amp Index Part No Description Resistors R18 HRFT472JCA Chip 1 10W 472J CAPACITOR Description Allowance 0 25pF 0 5 1 5 10 100 0 80 Example Fig amp Index Part No Description Capacitors HRFT104ZCA Chip CERA 50V Y5V 0 1HF Z 2012 C044 ELECTRIC AL PARTS LIST The components identified by mark have special characteristics important for safety and X ray These should be replaced only with the types specified in the parts list PART CODE PART NAME PART DESC PART CODE PART NAME PART DESC 9979720013 ADAPTER POWER ISA50 1 HCFK103ZCA CHIP CERA 50V Y5V 0 01 Z 2012 W3414M731 POWER KKP 419C KKS 15A 1 8M BK HCFK103ZCA CHIP CERA 50V 5 0 01MF 2 2012 1047 CHIP CERA 50V 5 0 1MF Z 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 HCFK104ZCA C CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK103ZCA C CHIP CERA 50V 5 0 01MF Z 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1037 C CHIP CERA 50V 5 0 01MF Z 2012 HCFK223ZCA CHIP CERA 50V Y5V 0 022MF 7 2012 1037 CHIP CERA 50V 5 0 01MF Z 2012 2237 CHIP CERA 50V Y5V 0 022 7 2012 1047 CHIP CERA 50V 0
11. 1047 CHIP CERA 50V Y5V 0 1MF 22012 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 1047 CHIP CERA 50V 5 0 1MF 2 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 35 ELECTRIC AL PARTS LOC PART CODE PART NAME PART DESC LOC PART CODE PART NAME PART DESC HCFK474ZCA CHIP CERA Y5V 50V 0 47MF Z 2012 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCQK220JCA CHIP CERA 50V CH 22PF J 2012 1057 C CHIP CERA 16V Y5V 1MF Z 3216 HCQK470JCA CHIP CERA 50V CH 47PF J 2012 HCQK121JCA CHIP CERA 50V CH 120PF J 2012 HCQK470JCA CHIP CERA 50V CH 47PF J 2012 HCQK121JCA CHIP CERA 50V CH 120PF J 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTAF109MB C CHIP TANTAL 16V 1MF M 3216 HCQK150JCA C CHIP CERA 50V CH 15PF J 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF
12. 2 3 4 5 6 7 8 CAUTION USIMENTAND REPAIR The white balance adjustment has been done by a color analyzer in factroy The adjustment proce dure described in the service manual is made by a visual check Allow 20 minutes warm up time for the display before checking or adjusting only electrical specifica tion or function Reform the leadwire after any repair work OPERATION amp ADJ USIMENT Control Panel BRIGHTNESS MENU CONTRAST Move cursor to the right window on the OSD window Increase the value of any selected function 9 Move cursor to the left window on the OSD window Decrease the value of any selected function Launch OSD On Screen Display MENU window Increase the value of V center Move cursor to the low window on the OSD window Decrease the value of V center e Move cursor to the high window on the OSD window 10 OPERATION amp ADJ USTMENT Key Process LANG UAGE ENGLISH 04 50 DEUTSCH ESPA OL GO FRANCAIS ITALIANO EN 50 8 9300 6550 RED CONTROL EXIT FIT SCREEN When you choose the icon on the OSD window you can exit the OSD screen Hot Key HOT KEY BRIGTHNESS CONTRAST OPERATION amp ADJ USTMENT Adjustment procedure Is the mode 1024x768 Adjust the FIT SCREEN Is the H Size proper Adjust the CLOCK control Per
13. 9 TL c35 C22 C122 eee e e 71 O 1uF O tuF E Le 3 3V 3 3V Y Y YN gt BEAD C121 C142 C143 ats L 0 1uF T 10uF 10uF o 9 oa oN IS SEE Ez DE GOOD 65555565 0 91 C4 c5 C16 218 gt Ten Q tuF l 40uF 1 FMDO MMMM gt gt gt gt gt gt gt 217 515 02 2 214 MD5 4 FMAA e e 215 5 05 F 21214 C7 C12 7 211 DOE 0 ZT Cer 210 F e e 209 FMD6 208 M09 RAS F RAS 206 M010 RAS CAS e e e FMD11 CAS WEE 209 WE C9 204 MD12 MN O 1uF D luF m FMD14 MX88281 FMCLK Seis FMD15 FMCKE e e 77 rupi PART B FUSE cso 76 7 51 gis E mu LU un 21 DE 7 DOMS e e FMD23 pree Z EMD24 AVCC1 56 1925 AVCC2 g4 MD26 E FMD27 65 GND 028 62 E GND FMD29 161 GND FMD30 c19 60 MD31 GND C15 GND T tour O luF 22 FMD32 FMD33 56 GND e e 55 034 GND FMD35 54 GND BaF MD36 END FMD37 52 GND FMD38 151 GND FMD39 D 50 GND i6 M40 GND FMD41 45 GND FMD42 44 GND FMD43 45 GND FMD44 12 GND FMD45 MIL GND ig M046 END FMD47 e END sheet 2 3 MD 00 47 5 gt lt MX8B281 B 4 318MHz R17 1M 14
14. 50V Y5V 0 1MF Z 2012 DRLS4148 DIODE CHIP RLS4148 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 DRLS4148 DIODE CHIP RLS4148 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 DRLZ5R6B B DIODE ZENER CHIP RLZTE 11 5 6 5 5 S S S S S S S S S S S S ELECTRICAL PARTS LIST LOC PART CODE PART NAME PART DESC LOC PART CODE PART NAME PART DESC 9979200209 D SUB 15P ANGLE 15P DDC BLUE W IN SCREW TKTC3875SY CHIP KTC3875SY RTK 5PFIBH471M FILTER LC CFI 06 B 1H 471M TKTC3875SY TR CHIP KTC3875SY RTK 1DWM300 MICOM 78 58 24 1K1A7805P1 REGULATOR KIA7805API 9979300500 SOCKET IC WSDIF 40T TKTC3875SY TR CHIP KTC3875SY RTK 174HCT4538 74HCT4538D TKTC3875SY TR CHIP KTC3875SY RTK DBA11501 LCD INVERTER 1501 1KA7542 VOTAGE DETECTOR KA7542 85801052GY RE COPPER 1 0 52 TIN COAT DKDS226RTK DIODE CHIP KDS226 RTK 85801052GY RE COPPER 1 0 52 TIN COAT TKTC3875SY TR CHIP KTC3875SY RTK 85801052GY RE COPPER 1 0 52 TIN COAT RD AZ472J CARBON FILM 1 6 4 7K OHM J 85801052GY RE COPPER 1 0 52 TIN COAT RD AZ472J CARBON FILM 1 6 4 7K OHM J 85801052GY RE COPPER 1 0 52 TIN COAT RD AZ472J
15. RESETO 0234 PDA16 27 25 DA16 BLGT ON1 6S8 PIX PDAT 26 125 BDATB 25 000 BLET ON2 545 gt PDAT9 5 Beet 23 PDA20 SA7 PMSO 225 PDAS Sp 21 6 51 21 5 PDA22 SA5 RDCON 65 0 231 DA23 20 EE vec 256 R6 T SAD GPIDO 559 O P ADCCLKI SM CPIO1 538 39 LADCCLK2 SA2 GPIO2 259 Pur I SA3 GPIO3 570 249 HSYNC 1 SAA GPIO4 R20 VSYNC 1 E 133 STANDBY 242 4 7K SCLK pS 132 ne 245 050 5 134 0SD CS e m ELONI OSD R 155 E Q10 050 6 116 55825 R23 DSD B 14050 8 OSD BLNK 158 BLANK 4 7K KTC3875 ef DIE E Orne 07 0 mm m m HSYNC 8827 m CH Guananoaannna agnoaananad 985 145 55 1939449 8825 25 SCHEMATIC DIAGRAM TOP CIRCUIT m gt 55 vee BEAD
16. overheating the circuit board printed foil 9 SERVICING PRECAUTIONS E FIGURE1 USE SOLDERING IRON TO PRY LEADS IC Removal Replacement Some utilized chassis circuit boards have slotted oblong holes through which the IC leads are inserted and then bent flat against the circuit foil When holes are slotted the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 on the page under the title of general soldering guidelines Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the solder ing iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with desolder ing braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the area Small Signal Discrete Transistor Removal Replacement Remove the defective transistor by clipping its leads as close as possible to the component body Bend the end of each of three leads remaining on the circuit board into U shape Bend the repl
17. 047 C CHIP CERA 50V 5 0 1MF 2 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 HCQK102JCA C CHIP CERA 50V CH 1000PF J 2012 HCQK220JCA CHIP CERA 50V CH 22PF J 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 HCTAF109MB CHIP TANTAL 16V 1MF M 3216 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 HCTEF101MC CHIP TANTAL 16V 100MF M 7343 TS HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTEF101MC CHIP TANTAL 16V 100MF M 7343 TS HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 HCTAF109MB CHIP TANTAL 16V 1MF M 3216 HCTEF101MC CHIP TANTAL 16V 100MF M 7343 TS 1047 CHIP CERA 50V 5 0 1MF Z 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 HCTEJ220MC CHIP TANTAL 35V 22MF M 7343 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V 0 1MF 2 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 1547 C CHIP CERA 50V 0 15MF Z 2012 HCFK474ZCA CHIP CERA Y5V 50V 0 47MF Z 2012 1047 C CHIP CERA 50V Y5V 0 1MF 2 2012
18. 1MF 2 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK104ZCA C CHIP CERA 50V Y5V 0 1MF Z 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCQK220JCA CHIP CERA 50V CH 22PF J 2012 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK103ZCA CHIP CERA 50V 5 0 01MF 2 2012 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK103ZCA CHIP CERA 50V 5 0 01MF 2 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCQK220JCA CHIP CERA 50V CH 22PF J 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK103ZCA CHIP CERA 50V 0 01MF Z 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 2237 C CHIP CERA 50V Y5V 0 022 7 2012 1047 C CHIP CERA 50V Y5V 0 1MF 2 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK223ZCA CHIP CERA 50V 5 0 022MF 7 2012 1047 CHIP CERA 50V 5 0 1MF 2 2012 2237 CHIP CERA 50V Y5V 0 022MF 2 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 2237 CHIP CERA 50V YSV 0 022 7 2012 1
19. 2601B COIL CHIP BEAD TB3216112260 HRFT220JCA R CHIP 1 10 22 OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT102JCA 1 10 1K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT472JCA R CHIP 110 4 7K OHM J 2012 HFFTB2601B COIL CHIP BEAD TB3216112260 HRFT472JCA R CHIP 110 4 7K OHM J 2012 DLM151X2C2 LCD LM151X2 C2TH HRFT362JCA R CHIP 1 10 3 6K OHM J 2012 DSD50GYW LED SD50GYW GREEN AMBER HRFT362JCA R CHIP 1 10 3 6K OHM J 2012 9979220080 CONN WAFER DBBV 41PJ 1 0SM HRFT472JCA CHIP 1 10 4 7K OHM J 2012 9970741001 CONN AS 9 415 2 1571 32 220 HRFT220JCA R CHIP 110 22 J 2012 TKTC3875SY TR CHIP KTC3875SY RTK HRFT513JCA 1 1051K OHM J 2012 DKDS226RTK DIODE CH DS226 RTK HRFT512JCA RCH 1 10 5 1K OHM J 2012 DKDS226RTK DIODE CH DS226 RTK HRFT512JCA RCH 1 10 5 1K OHM J 2012 DKDS226RTK DIODE CH DS226 RTK HRFT103JCA RCH 1 10 10K OHM J 2012 DKDS226RTK DIODE CH HRFT472JCA 1 10 4 7K OHM J 2012 DKDS226RTK DIODE CH HRFT101UCA RCH 1 10 100 OHM J 2012 DKDS226RTK DIODE CH HRFT472JCA 1 10 4 7K OHM J 2012 Wi W W W Wi Wi W W W W G 02 2 G G G G G G G
20. 28 MEMORY SCHEMATIC DIAGRAM 91 MALO 91 0 91 0 91 91 A 1 2 AT 3 4 2 5 6 2 AR BFAD MD 00 47 MDE00 471 0 00 471 7 B 3 3V 4 1 2 MAL as 72 3 4 MAS A6 5 amp 7 7 MAT Us U4 US 1 38 1 38 1 38 1 2 MAB vec 7 ec vec 7 Ncc vere 4 AR BEAD 13 13 15 Me FMCKE 5 6 28 56 Ap Dog 28 EC po LZ D16 25 Wee po L2 D32 FMCLK 7 MCLKB 12 NDA Spa 053 MABO 211 4 52 5 DOZA MABO 211 5 s e 018 MABO 211 ap 5 D34 2214 2516 DOS MABI 22 E 019 MABI 22 2516 055 MABZ 2314 54 004 MABZ 2514 020 MAB2 23 5 8 036 067 MABS 24 ps 9 605 _ 24 4 ps 9 D21 MABS 24 5 05 9 D37 22pF 27 4 05 MAB4 27 4 be Lt 022 MAB4 27 7 pe L1 D38 MABE 28142 09 12 507 MABE 2846 DS 12 023 5 28 05 12 059 MABE 29 42 MABE 29172 MABE 29 2 3 3V 7 30 JAS 39 008 MAB7 50145 39 024 MAB7 50149 pg 39 040 gt MABB 31 40 509 MABE 25140 025 MAB
21. 35 CABLE SIGNAL AS 15P 15P DDC 1 5M GY275A HCQK220JCA CHIP CERA 50V CH 22PF J 2012 9979220020 CONN WAFER AW250 05 ANGLE HCQK220JCA CHIP CERA 50V CH 22PF J 2012 9970750034 CONN AS 250 5264 5 1007 24 110 HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 9979220024 CONN WAFER 250 09 ANGLE 1047 CHIP CERA 50V Y5V 0 1MF 2 2012 9970790107 CONN AS H250 9 2 1007 24 270 HCQK470JCA C CHIP CERA 50V CH 47PF J 2012 9979220018 CONN WAFER 250 03 ANGLE HCQK330JCA C CHIP CERA 50V CH 33PF J 2012 9970730071 CONN AS H250 3 2 1354 28 250 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS 9979220021 CONN WAFER AAW250 06 ANGLE HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS 9970760042 CONN AS H250 6 2 2464 24 120 HCTEF101MC C CHIP TANTAL 16V 100MF M 7343 TS 9979220022 CONN WAFER AW250 07 ANGLE 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 9970760043 CONN AS 250 1354 28 14 100 HCFK104ZCA C CHIP CERA 50V Y5V 0 1MF Z 2012 9979220022 CONN WAFER AW250 07 ANGLE HCQK220JCA CHIP CERA 50V CH 22PF J 2012 9979220021 CONN WAFER AW250 06 ANGLE HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS 9979220018 CONN WAFER AW250 03 ANGLE 1047 CHIP CERA 50V 5 0 1MF 2 2012 9979220024 CONN WAFER 250 09 ANGLE 1047 CHIP CERA 50V 0 1MF 2 2012 DRLS4148 DIODE CHIP RLS4148 HCTAF109MB C CHIP TANTAL 16V 1MF M 3216 DRLS4148 DIODE CHIP RLS4148 1047 CHIP CERA
22. 35V 22MF M 7343 1TC74ACT57 TC74ACT573FT EL HCTEJ220MC C CHI 35V 22MF 7343 1AT24C21 IC EEPROM 24 21 HCTBF100MB C CHI 16V 10MF M 3528 TS 1ZRC250N80 IC ZRC250N802 1057 C CHIP CERA 16V 1MF 7 3216 1 4165102 IC SDRAM KM416S1020CT G8 HCTBF479MB C CHIP TANTAL 16V 4 7MF M 3528 1 4165102 IC SDRAM KM416S1020CT G8 HCFK104ZCA C CHIP CERA 50V 5 0 1MF 2 2012 1 4165102 IC SDRAM KM416S1020CT G8 HCFK104ZCA CHIP CERA 50V 5 0 1MF 2 2012 1 24 1610 IC AT24C16 10PC HCFK103ZCA C CHIP CERA 50V 5 0 01MF Z 2012 1DWOSD05 IC OSD DWOSD05 HCFK103ZCA C CHIP CERA 50V 5 0 01MF Z 2012 TNDS9958 FET CHIP NDS9958 1057 C CHIP CERA 16V IMF 7 3216 1TC74ACT57 IC TC74ACT573FT EL DKDS181RTK DIODE CHIP KDS181 RTK 5XJ14R318F CRYSTAL QUARTZ 49 5 14 31818MHZ 50PPM 5XJ11R059E CRYSTAL 49 5 11 0592MHZ 30PPM
23. 9 L C148 22pF 22pF ed 26 SCHEMATIC DIAGRAM LA vec e e r 1 1 d PEAD C75 C68 C70 C71 C72 C69 3 3V 014 10uF T gt 0 1uF ong T gt tur T 100uF A 1 20 U7 oc Ga 5 90 n gt gt 15 E OSD R LS d Kg 204044 ELSE ep 8 06 0699 10 10 07 474 H2 e gt OSD_BLNK GND G SDA Zens i lt 74 573 1 5 elec 8 C13 C151 T ee EE EM 0 10 4TPF E 5VS DWEOSD50 4 Q R14 10 Sv coc 5 Ge e UM A u10 7
24. B Zi 40 041 9 32 43 2122 D10 MABS 32 48 m 42 026 MABS 52 49 56 22 042 20 o pit 43 DTI 201 nn 23 D27 20 043 18 48 012 19 n big 5 D28 19 pip 48 044 RB 15126 D13 nig 46 29 Dis 46 025 14 48 D14 14 48 030 14 48 046 36 02 0 014 015 36 DQMO 014 49 031 36 DQMO 014 49 047 47K QM1 D15 DQM1 015 DQM1 D15 ORA GND o RAS GND o 4 CND lotas GND 60 As GND olo m JA GND 640 GND 628 Ic we CND 025 ow GND 626 ME ZE AR BEAD END OO 34 POLK CND Em 37 GND 55 DAMAO 1 2 DQMO CKE CKE CKE RAS 3 4 0 1 SDRAMX16M SDRAMX16M CAS 5 6 CASB 2m je WE 7 8 WEBF 4 A e DQM2 Je DQM3 DQMA3 3 4 DQM3 4 5 DQMO DQMA2 5 6 DQM2 4 5 DAMI LAN e RASBH WEB RP5 4 i WEB R5 4 MCLKB DQMA 4 CLKE 22 3 3V L C49 c50 C51 C52 C53 C54 0 tuF Q tuF O 1uF D TuF 0 1uF 0 1uF e e 1 C55 C56 H c41 C57 C58 C59 C60 TS tour 0 luF Q luF TS D luF SE 0 1uF 0 luF e d c C61 62 C63 C64 C65 C66 0 tuF Q tuF e 29 SCHEMATIC DIAGRAM MICOM
25. HIP BEAD HB 4M3216 121JT HRFT104JCA R CHIP 1 10 100K OHM J 2012 HFFH4M121E COIL CHIP BEAD HB 4M3216 121JT HRFT104JCA R CHIP 1 10 100K OHM J 2012 HFFH4M121E COIL CHIP BEAD HB 4M3216 121JT HRFT113JCA R CHIP 1 0 11K OHM J 2012 5012330 R FILM 1W 33 OHM J TAPPING HRFT103JCA R CHIP 1 10 10K OHM J 2012 5950101701 SW TACT KPT 1115VM 1C 1 HRFT103JCA R CHIP 1 10 10K OHM J 2012 5550101701 SW TACT KPT 1115VM 1C 1 HRFT104JCA R CHIP 1 10 100K OHM J 2012 5950101701 SW TACT KPT 1115VM 1C 1 HRM1407JPD R CHIP METAL PLATE 1W 0 04 OHM J 8340 5550101701 SW TACT KPT 1115VM 1C 1 HRM1207JPD R CHIP METAL PLATE 1W 0 02 OHM J 8340 5550101701 SW TACT KPT 1115VM 1C 1 1SB3052P IC B3052P SSOP 28 5550101701 SW TACT KPT 1115VM 1C 1 1M62393P M62393P HCTEJ220MC C CHI 35V 22MF M 7343 1TDA8752AH TDA8752AH 8 HCTED221MC C CHI 10V 220MF 7343 1TC74ACT14 IC TC74ACT14FN HCTED221MC C CHI 10V 220MF 7343 1 88281 IC LCD CONTROLLER MX88281FC HCTED221MC C CHI 10V 220MF 7343 1TC74ACT57 TC74ACT573FT EL HCTED221MC C CHI 10V 220MF M 7343 1TC74ACT57 TC74ACTS73FT EL HCTEJ220MC C CHI
26. M 3528 TS HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V 5 0 1MF 2 2012 HCFK104ZCA C CHIP CERA 50V YSV 0 1MF Z 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK474ZCA CHIP CERA Y5V 50V 0 47MF Z 2012 1047 C CHIP CERA 50V Y5V 0 1MF 2 2012 HCFK474ZCA CHIP CERA Y5V 50V 0 47MF Z 2012 1047 CHIP CERA 50V 5 0 1MF 2 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 C CHIP CERA 50V Y5V 0 1MF 2 2012 HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB CHIP TANTAL 16V 10MF M 3528 TS HCTBF100MB C CHIP TANTAL 16V 10MF M 3528 TS 1047 CHIP CERA 50V 0 1MF Z 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 CHIP CERA 50V 5 0 1MF 2 2012 HCQK100JCA CHIP CERA 50V CH 10PF 22012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 CHIP CERA 50V 0 1MF 2 2012 HCFK104ZCA CHIP CERA 50V YSV 0 1MF Z 2012 1047 C CHIP CERA 50V Y5V 0 1MF Z 2012 HCQK102JCA CHIP CERA 50V CH 1000PF J 2012 1047 C CHIP CERA 50V 5 0 1MF 2 2012 HCFK104ZCA CHIP CERA 50V Y5V 0 1MF Z 2012 1047 CHIP CERA 50V Y5V 0 1MF Z 2012 99708000
27. Service LCD MONITOR Model L500B P d d D 7 T 7 WT 1 1 DAEWOO ELECTRONICS OVERSEAS SERVICE lt TABLEOFCONTENTS SAFETY PRECAUTIONS I U U ii inn 2 GENERAL SAFETY INFORMATION ie 3 SERVIC ING PREC AUTIONS l U U U U nnn nn 4 GENERAL INFORMATION eine 8 PIN CONNECTOR qu 9 OPERATION amp ADJ USIMENT I U U U U U uuu QQ uu 10 ALIGNMENT PROC EDURE I U nnn i na 14 TROUBLE SHOOTING HINTS 15 BLOC K DIAGRAM TR 22 PCB LAYOUT pum 23 SC HEMATIC DIAG RAM U U nn ri nn 25 EXPLO DED VIEW amp AL PARTS LIST e eene nnne u u 33 INFORMATION OF PART DESCRIPTION U U nnn nnn nnn 34 ELECTRIC AL PARTS LIST L 35 SAFETY PRECAUTIONS CAUTION No modifications of any circuit should be attempted Service work should only be performed after you are thoroughly familiar with all of the following safety check and servicing guidelines Fire amp Shock Hazard In servicing pay attention to original lead dress especially in the high voltage circuit if a short circuit is found replace all parts which have been overheated as a result of the short circuit All the protective devices must be reinstalled per original design Soldering must be inspected for possible cold solder points frayed leads damaged insulation
28. acement transistor leads into a 4 shape Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the with long nose pliers to insoure metal to metal contact then solder each connection gt SERVICING PRECAUIIONS Power IC Transistor or Devices Removal Replacement Heat and remove all solders from the device leads Remove the heatsink mounting screw if applicable Carefully remove the device from the circuit board Insert new device in circuit board Solder each device lead and clip off excess lead Replace heatsink oocRON Diode Removal Replacement Remove defective diode by clipping its leads as close as possible to diode body Bend the two remaining leads perpendicularly to the circuit board Observing diode polarity wrap each lead out of the new diode around the corresponding lead on the circuit board Securely crimp each connection and solder it Inspect the solder joints of the two original leads on the circuit board copper side If they are not shiny reheat them and apply additional solder if necessary A TECHNICAL INFORMATION Electrical Pixel pitch 0 3mm X 0 3mm Horizontal frequency 30KHz to 62KHz Automatically Vertical frequency 50Hz to 85Hz Automatically Operating temperature 10 40 50 104 F Operating humidity 8 80 Mechanical Cabinet Molded Plastic Cabinet with
29. attachable tilt amp swivel base Dimension set with packing 502 H X 502 W X 242 D mm Weight net 4 5 Kg Power Switch Controls OSD control GENERALINFORMATION This TFT LCD monitor automatically scans all horizontal frequencies from 30KHz to 62KHz and all verti cal frequencies from 50Hz to 85Hz This TFT LCD monitor supports IBM PC PC XT PC AT personal System 2 PS 2 Apple Macintosh and compatible users crisp text and vivid color graphics display when using the following graphics adapters VGA Super VGA VESA and XGA and Apple Macintosh Video Card And so this TFT LCD monitor has a maximum horizontal resolution of 1024 dots and a maximum vertical resolution of 768 lines for superior clarity of display By accepting analog signal inputs which level is zero to 0 7 Volts This TFT LCD monitor can display and 262 144 colors depending on the graphics adapter and software being used available used to 8 bit panel is 16 7M colors Abbreviations Adjustment Automatic Frequency Control Horizontal Synchronization Oscillator Power Supply Unit Printed Circuit Board Wiring Assembly Red Green Blue Vertical Synchronization PIN CONNECTOR Pin Signal Red Green Blue GND GND GND Red GND Green GND Blue 5Vdc Arrangement of 15 pin D sub connector GND H Sync GND V Sync Bi directional Data SDA Horizontal Sync Vertical Sync VCLK Data clock SCL 1
30. ce of component damage caused by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed for potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate enough electrical charges to damage ES devices 5 Do not use freon propelled chemicals These can generate enough electrical charges to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be s
31. ee C74 ue L 20 ap AR BEAD O 1uF 01117 2 Go Ze 19 1 2 8 VCC TEST 4 018116 5 qi 18 3 4 C32 c31 5DA A2 5 01115 4 02 02 17 5 6 47PF 47PF 4 SCL 1 1 RR U18114 5 63 0316 7 8 gt 5 DA 04 4 lois 24016 Ut 05 05 e B 15 EHS Ae LR tu 1007 47 1 SC e GND G RP 2 AR BEAD 1 2 a Z4ACT573 1 3 4 E C13Q 5 5 1 8 3 3V lt DCL 2 un 000 HSYNC VSYNC DCND L 20 RPIS AR BEAD 7 8 e e Uuog FB 1 2 2210 DGND TO 011107 Jo o HS 5 4 le 2 e 019106 oU 5 5 15 R3 U14105 5 103 036 7 8 13 5 H 014104 6 15 17 18 0 04 04 DEM DGND U18103 7105 05114 19 56 or 20 01 102 B pe 13 2 22 06 62 DGND 5 012101 Iio 472 25 G3 64 24 10 25 26 CND D 57 05 28 SIDEN DGND 74ACT573 1 29 BD B 30 L 6153 zz 82 5583 36 57 5 DG RP9 _ AR BEAD 22 0 3V 20 1 2 4T 3 3V 3 3V 53V d 3 4 3 3V LE ENNE U12 A LNN LG41PIN Kc Gen 20 RPB AR BEAD 4 01100 2 pi ao 19 1 2 11499 ZE Gy ES 3 4 C28 c1 1198 4 02 02 4 5 5 W s Our U1 97 5 53 16 7 8 Q3 01795 54 oa 15 e 2105 0515 15 U1 93 uL de 9 DS 2 12 12V dL 10 11 BEAD e GND G 74 575 1 R51 7 8 853 51 0132 5 4K 1 kp UB de gt lASI9958DY R52 1 Q3 R55 24 KTC3875 BLON 10K KTC3875
32. ei EE KTC3875 KTC3875 d SW N 1 0 R401 LED ON OFF 3 6K c _ x 95255 56 Ss o c N LED DK 1 4 RGB SYNC SCHEMATIC DIAGRAM 5 5 5VS SyS 5VS E t M 915 TE R41 R40 116 DA rhe RU vcc test 07 T 5 SDA 2 5 FERENT i 2 SCL e o3 GD A die T 4 SCL 24C21 BE DIODE ME e CN4 x AGND HEADER 6 alle ag L A 22 2 ga 525 ET ri u Pa i SCL 424 8 j MSYNC Q17 zi DIO HSYNC RB21 CRBOI DIODE E EE SEXDEROE 75 75 75 EE 4 R35 E 5VS 13 22 u A ees A R34 e 02 111 22 012
33. form the AUTO POSITION Adjust the CLOCK FINE until the screen 1s cleared No noise displayed on Ee End the screen yet OPERATION amp ADJ USTMENT OSD Functions ICON CONTROL FUNCTIONS LANGUAGE Select language for OSD 5 languages EA CLOCK Adjust the width horizontal size of the screen image Sharpen the focus by aligning the illuminated pixels and adjust until the 9 CLOCK FINE screen image looks focused crisp and sharp Adjusting the CLOCK FINE after the CLOCK adjustment will produce a clear screen B COLOR TEMP Choose different preset color temperatures or set your own customized color parameters amp RED CONTROL Adjust the red color GREEN CONTROL Adjust the green color amp BLUE CONTROL Adjust the blue color H CENTER amp Adjust the position of the display horizontally left or right and vertically V CENTER up or down Make characters of displayed text easier to read only for resolutions E Ve lower than 1024x768 SMART do et 2 SCALING Adjust the display image quality if the screen proceed to scaling up AUTO 3 TRACKING Adjust the horizontal amp vertical picture image quality and size OSD 1 TIME OUT Adjust the display OSD Menu STATUS Display horizontal amp vertical frequency and polarity RECALL Reset the screen to the Factory Preset Display Settings Eh AUTO Choose automatically the proper horizontal po
34. i 19 BEAD i 5 N4148 L12 BAZ CYY YN e 2 5 C125 C126 Us C145 C146 129 H 5 O 1uF TS tour L T 10uF 7 5 12 BEAD Sen GND Y6 74 14 e U15 RESETA lest 2 aog ES SCL 250 gt 8 S SDA SDA AD7 Fee JP15 gt VSYNCB 8 HAE 1 SC 5 VREFUZ 4 BLON C150 C139 VREFL A05 5 BLCNYRL u 20 15 DGND 197250 gt L o5 25 14 SC2 A03 HEADER 5 e o cND 13 aoi H2 H 76 O luF T 23uF 38V M62393 e 55 T 575 D SUBI RED iG R12 BL 100K GREEN 2 o 12 SDA R13 C90 T la gt HSYNC 470 019 T 10uF BLUE E 102 VSYNC 1 Jm HE CN4 2 9 2 15 5 5 SCL 2412 211 7717 0 gt i 41100 27275 O 1uFH ps MER 1 2CD u Dessen WATCHDOG 5 2A 12 D SUBI DI C127 B 5 s 1 VSYNCB RESET 710 zo 10 453BVSYNC 2 1 4148 1UF 16V ais 74HCT453B 31 SCHEMATIC DIAGRAM TDA8752A ADCVDAI LM385 2 5 ens 10uF C273 1000 o 32 40 59 AGND RIN CIN BIN AGND SCL SDA HSYNC 8828 CLAMP VSYNCB
35. o Abnormal video NO Is LCLK output the L1 waveform normal Is the OSD normal NO Check the output of MX88281 Check the control and Check connection data signal of SDRAM of 41 pin cable 20 TROUBLESHOOTING HINTS 7 No video NO YES YES OUT1 41 pin cable connection check Trouble connection Trouble connection U8 2 pin output 12V check YES Is OSD No raster normal vs Are the contrast controls maximum rs Are the video signal and output signal of the TDA8752 ves Are the output ignal of the MX882817 Change the contrast control value to maximum NO Change the main B D Trouble in the TDA8752 Change the main B D Trouble in the TDA8752 vs Check the LCD panel or 41 pin cable 21 BLOCK DIAGRAM lt 29 onuoo jjo uo Ag et 29 19319AU0O Oq Od ZH CO OV AED 1014009 JJo UO 89H 8 oui 2 SSOIPPW aaa Red KEN ees 05515 2 Ionuoo ECH 0950 Se el por oseud 3oo O ooutjsiso1 29 juo xm IT8c88XIN 39 ou amp s AH GE sseqppy 29 1SJJO OT U X INV3IGS X LOOCOTS9I PNA CSL8VGL pusis HOLOHNNOO NIdSI Od WOH 22 SCHEMATIC DIAGRAM MAIN88281A
36. r information is to be found Symbols as marked on equipment Protective GROUND terminal High Voltage Warning And Critical Component Warning Label Following warning label is on the backlight outside WARNING This product includes critical mechanical and electrical parts For continued safety replace critical components indicated in the service manual only with exact replacement parts given in the parts list Refer to service manual for measurement procedures and proper service adjustments SERVICING PRECAUIIONS CAUTION Before servicing instruments covered by this service manual its supplements and addendum read and follow the SAFETY PRECAUTIONS of this manual NOTE If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 1 of this manual always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other instrument assembly b Disconnecting or reconnecting any electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the instrument CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in a explosion hazard 2 Do not any spra
37. sition and vertical position POSITION amp size of the screen image ALIGNMENT PROC EDURE Standard Check point Power source 100 240Vac 50 60Hz Aging Take at least 20 minutes warm up time Signal Video input Analog 0 7Vpp 75Q terminal positive polarity Synchronizing acceptable negative or positive at TTL level Resolution Horizontal 1024 max Vertical 768 max Frequency Horizontal 30KHz 62KHz Vertical 50Hz 85Hz available only non interlace mode Adjustment OQ A Smart scaling set to 50 Contrast set to 100 Brightness set to 50 Switching to factory alignment mode Press power key with down menu key Y at the power off status Video level adjustment Receive stair pattern of 16 step doesnt care any mode Readjust coarse R G B in TDA8752 menu before saturation point Set up the tracking See the users manual at page 8 th Switching to users mode If turn off and turn on then switched to user mode All of adjusted data stores by fade out of OSD TROUBLE SHOOTING HINTS 1 Abnormal mode detect Abnormal mode detect Im Check input H Sync of TDA8752 Im Check waveforms of 84 pin of TDA8752 correct NO Trouble video input circuit NO Trouble in the TDA8752 Trouble in the MX88281 TROUBLESHOOTING HINTS 2 Trouble in Power on Trouble in power on Power LED ON Refer to No video or raster
38. solder splashes or sharp solder points Be certain to remove all foreign materials Implosion Protection TFT LCD in this monitor employs integral implosion protection system but care should be taken to avoid damage and scratching during installation Use only same type replacement TFT panel IMPORTANT SAFETY NOTICE There are special components used in analog TFT LCD color display which are important for safety These parts are shaded on the schematic diagram and on the replacement parts list It is essential that these critical parts should be replaced with manufacturers specified parts to prevent X radiation shock fire or other hazards Do not modify the original design without getting a written permission from DAEWOO ELECTRONICS CO or this will void the original parts and labor warranty GENERAL SAFETY INFORMATION Terms in the manual CAUTION Statements identify conditions or practices that could result in damage to the equipment or other property WARNING Statements identify conditions or practices that could result in personal injury or loss of life Terms as marked on equipment CAUTION Statements indicate a personal injury hazard not immediately accessible as one reads the marking or a hazard to properly including the equipment itself WARNING Statements indicate a personal injury hazard immediately accessible as one reads the marking Symbols in the manual This symbol indicates where applicable cautionary or othe
39. ure that no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmful motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate enough static electricity to damage an ES devices General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron with appropriate tip size and shape that will maintain tip temperature within a 550 F 660 F 288 316 range 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead Keep the soldering iron tip clean 4 Throughly clean the surface to be soldered Use a small wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following soldering technique a Allow the soldering iron tip to reach normal temperature 550 F to 660 or 288 C to 316 C b Hold the soldering iron tip and solder strand against the component lead until the solder melts quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush CAUTION Work quickly to avoid
40. y chemicals on or near this instrument or any or its assemblies 3 Unless specified otherwise in this service manual clean electrical contacts by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable nonabrasive applicator 1096 by volume Aceton and 90 by volume isopropyl alchohol 9096 9996 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts is not required 4 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 5 Always connect the test instrument ground lead to the appropriate instrument chassis ground before connecting the test instrument positive lead Always remove the test instrument ground lead last 6 Use only the test fixtures specified in this service manual with this instrument CAUTION Do not connect the test fixture ground strap to any heatsink in this instrument SERVICING PRECAUIIONS Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices The examples of typical ES devices are integrated circuits some field effect transistors and semiconductor components The following techniques should be used to help reduce the inciden

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