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MiniBlade™ SPECIFICATION - SFF-SIG

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1. REF 24 96 983 15 200 5984 BE TOL NON ACCUM TOL NON ACCUM SBBS 20 01 DV A LTC 13 N O1 2 00 079 REF TYP 15 200 5984 22 40 882 REF NOT SYMMETRIC ABOUT a 425 167 0 552 022 MiniBlade Right Angle Connector Drawings Dimensions in mm in MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 15 8S DH 20 GEO 31 17 1 227 LTC 17 02 LTC 17 01 15 200 5984 TOL NON ACCUM 18 13 714 REF 27 4411 080 REF T 2 16 085 il AD 0 38 015 29 00 1 142 31 0 1 22 27 11 1 067 5 00 197 4 61 182 MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 16 SECTION F F Recommended PCB and Stencil Layouts Dimensions in mm in All dimensions are symmetric about the centerline La die BSR E 1 i 15 20 598 REF CONNECTOR ema guziei PTH 5 00 197 E DUODDOODOO a eres 0 80 031 0 51 o20 440 173 2 80 110 40 882 NOT SYMMETRICAL ABOUT 31 00 1 220 36 25 1 427 REF PCB layout for vertical MiniBlade socket MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 17 32 79 1 291 enn ai fp 7 UI l mu 1 esnez m 1 Stencil layout for vertical MiniBlade socket ege EE von adia m 5 00 197 WY h EEE beak E SEE 1 95 077 4 60 181 S Z RR K KK n WN VY bo PCB layout for right angle MiniBlade s
2. If an SBC vendor s board does not or cannot support one or more of the interfaces it should be clearly marked in the data sheet and technical manuals Power The MiniBlade specification provides for power to be supplied on designated pins Ground return is supplied through individual pins in each bank populated The power available to a MiniBlade module is shown below although the processor board chosen may also limit the total power available to modules somewhat less than the MiniBlade specification Power requirements in excess of the SBC s available power specification or greater than those listed below for the system level definition must be supplied by a secondary connector on the MiniBlade module itself In any case it is up to the system integrator to ensure that the power the processor supplies to the MiniBlade connector s the number of modules and total power consumption for all modules are reconciled and conform to the system available resources The following tables describe the typical power a host systems should make available for each MiniBlade module in the system MiniBlade modules that require power in excess of these ratings should document such requirements in the module s datasheet or user manual MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 12 4 1 MiniBlade System Power Specifications MiniBlade module Host supplied BG Interface EO GOO Voltage tolerance
3. Solid state storage USB 2 0 200mA 5V 1096 Solid state storage SATA 400mA 5V 1096 Solid state storage SD 120mA 3 3V 10 Solid state storage MMC 120mA 3 3V 1096 Solid state storage PCle 500mA 3 3V 10 Solid state storage SPI 120mA 3 3V 1096 Solid state storage USB 3 0 At the time of publication this interface has not been built and tested Please contact SFF SIG for status of verification Connector Ratings 85 C 3 3V 3A continuous 3VSB 3A continuous 5V 3A continuous MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 13 Appendix A MiniBlade Connector Physical Specifications Samtec Part Number SBS 120 01 S DV A ML Materials Housing Contact RoHS Compliant Contact Finish Socket Interface Underplate Electrical Performance Contact Current Capacity Solderability Lead Free Solderable Processing Temperature SMT Lead Coplanarity Spec LCP Liquid Crystal Polymer Thermoplastic UL 94 VO BeCu Yes Spec 30 micro inches Gold On Contact Area 50 micro inches Minimum of Nickel Spec 3 1 A 30 C Temp Rise Spec Yes 260 C Produces No Blistering Distortion or Discoloration 20 seconds 3x 230 C for 60 seconds 0 004 0 1mm max MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 14 MiniBlade Vertical Connector Drawings Dimensions in mm in 18 125 7136 REF anman di EIE 9 50 3740 1 85 073 REF TEN
4. SDIO DO 20 MMC SDIO D3 or SPI GEA 27 BLADE PRSNT 30 MMC SDIO CMD or SPI DI 32 MMC_SDIO_CLK or SPI_SCLK Note Host platforms must connect 3 3V and 5V signals in all cases Host platforms that do not supply 3 3VSB must connect 3 3VSB to 3 3V in all cases This specification does not allow for exceptions Copyright 2009 SFF SIG 24 Interfacing to Secure Digital SD Protocol Secure Digital protocol has two modes of operation four bit high speed and one bit Further documentation and specifications for the SD interface can be found at http www sdcard org 4 bit High Speed SD Pin Signal 1 3VSB 2 15 21 33 40 GND 7 13 3 3V 10 PERST or SDIO_WP 14 MMC_SDIO_DO or SPI DO 16 MMC_SDIO_D1 or SPI IRQ 18 MMC SDIO D2 20 MMC SDIO D3 or SPI GEA 27 BLADE PRSNT 30 MMC SDIO CMD or SPI DI 32 MMC SDIO CLK or SPI SCLK MiniBlade Specification Revision 1 00 1 bit SD Pin Signal 1 3VSB 2 15 21 33 40 GND 7 13 3 3V 10 PERST or SDIO WP 14 MMC SDIO DO or SPI DO 27 BLADE PRSNT 30 MMC SDIO CMD or SPI DI 32 MMC SDIO CLK or SPI SCLK Note Host platforms must connect 3 3V and 5V signals in all cases Host platforms that do not supply 3 3VSB must connect 3 3VSB to 3 3V in all cases This specification does not allow for exceptions Copyright 2009 SFF SIG 25 Interfacing to Serial Peripheral Interface SPI Protoc
5. Specifications Appendix A MiniBlade Connector Physical Specifications MiniBlade Vertical Connector Drawings MiniBlade Right Angle Connector Drawings Recommended PCB and Stencil Layouts Appendix B MiniBlade Connector Pin Assignments MiniBlade Module Recommended Pin Lengths Interfacing to USB Protocol Interfacing to SATA Protocol Interfacing to MultiMedia Card MMC Protocol Interfacing to Secure Digital SD Protocol Interfacing to Serial Peripheral Interface SPI Protocol Interfacing to PCle Protocol Table of Figures Figure 1 MiniBlade Module amp MiniBlade Socket right angle Figure 2 MiniBlade Module MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG oo ol oo 11 11 12 13 14 14 15 15 17 20 20 21 22 23 24 25 26 27 1 0 1 1 Introduction The MiniBlade system consists of a MiniBlade module and its host socket The MiniBlade module is a postage stamp sized rugged 40 pin card edge solid state storage solution intended for embedded system environments It is complimented by a robust latching 40 pin socket available in both vertical and right angle configurations Together the MiniBlade module and MiniBlade socket are known as the MiniBlade storage solution or just MiniBlade technology This MiniBlade specification contains information physical and electrical on the MiniBlade module the storage device and the latching MiniBlade socket This specification affords a design engineer s
6. up and down with the system 5V and one that remains powered unless the supply is unplugged from the AC source 5VSB standby in order for the system to be capable of waking up from network traffic keyboard etc A PCI Express link is built around dedicated unidirectional couples of serial 1 bit point to point connections known as lanes PCI Express lanes are full duplex links meaning that data can be transferred in both directions simultaneously Tx transmit and Rx receive lines are separate Lane counts are written with an x prefix with x1 designating a single lane and x4 for a four lane interface A x1 pronounced by one lane is very space efficient compared to the parallel PCI bus that it replaces with 2 5 times the bandwidth using only five signals A connection between any two PCI Express devices is known as a link and is built up from a collection of one or more lanes All devices must minimally support single lane x1 link A memory card form factor that uses SDIO signals Abbreviation for PCI Express It is a high speed computer expansion bus designed to replace the general purpose PCI expansion bus It is software compatible with PCI in order to be transparent to system software It is structured around point to point full duplex serial links called lanes In PCI Express version 1 1 currently the most common version each lane operates at a data rate of 250 MB s in each direction MiniB
7. BLADE MiniBlade SPECIFICATION Revision 1 00 March 6 2009 IMPORTANT INFORMATION AND DISCLAIMERS The Small Form Factor Special Interest Group Inc SFF SIG does not make any warranties with regard to the MiniBlade specification Specification and in particular neither warrants nor represents that this specification nor any products made in conformance with it will work in the intended manner Nor does the SFF SIG assume responsibility for any errors that the Specification may contain or have any liabilities or obligations for damages including but not limited to special incidental indirect punitive or consequential damages whether arising from or in connection with the use of this specification in any way No representation or warranties are made that any product based in whole or part on this Specification will be free from defects or safe for use for its intended purposes Any person making using or selling such product does so at his or her own risk THE USER OF THIS SPECIFICATION HEREBY EXPRESSLY ACKNOWLEDGES THAT THE SPECIFICATION IS PROVIDED AS IS AND THAT THE SFF SIG MAKES NO REPRESENTATIONS EXTENDS ANY WARRANTIES OF ANY KIND EITHER EXPRESS OR IMPLIED ORAL OR WRITTEN INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE OR WARRANTY OR REPRESENTATION THAT THE SPECIFICATION OR ANY PRODUCT OR TECHNOLOGY UTILIZING THE SPECIFICATION OR ANY SUBSET OF THE SPECIFICATION WILL BE
8. FREE FROM ANY CLAIMS OF INFRINGEMENT OF ANY INTELLECTUAL PROPERTY INCLUDING PATENTS COPYRIGHT AND TRADE SECRETS NOR DOES THE SFF SIG ASSUME ANY RESPONSIBILITIES WHATSOEVER WITH RESPECT TO THE SPECIFICATION OR SUCH PRODUCTS THE SFF SIG DISCLAIMS ALL LIABILITY INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS RELATING TO USE OF INFORMATION IN THIS SPECIFICATION NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED HEREIN Designers must not rely upon the absence or characteristics of any features marked reserved The SFF SIG reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them Please send comments via electronic mail to info sff sig org Copyright 2008 2009 Small Form Factor Special Interest Group Inc All product names and trademarks registered trademarks or service marks are property of their respective owners MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG Revision History Draft Issue Comments Revision Date 1 00 3 06 09 Initial Release MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG Table of Contents 1 0 Introduction 1 1 General Description 1 2 Audience 1 3 Related Documents and Organizations 2 0 Acronyms and Terms 3 0 Connector 3 1 Connector and Placement 4 0 Power 4 1 MiniBlade System Power
9. TA been built and tested Please contact SFF SIG for status of verification 7 3 3V All ground and power pins implemented on MiniBlade 8 5V All ground and power pins implemented on modules must be on long gold fingers as defined in the table MiniBlade modules must be on long gold fingers as below defined in the table below 9 USB3RX At the time of publication this interface has not 10 PERST or SDIO WP Reserved for future use as been built and tested Please contact SFF SIG for status of a general purpose interrupt verification 11 USB3RX At the time of publication this interface has not 12 BLADE_REQ General purpose interrupt request been built and tested Please contact SFF SIG for status of signal from the MiniBlade module to the host verification SBC chipset 13 3 3V All ground and power pins implemented on MiniBlade 14 MMC SDIO DO or SPI DO The SPI pin out is an modules must be on long gold fingers as defined in the table alternate to SD MMC and is overlaid in the pin out below Refer to the table below 15 GND All ground and power pins implemented on MiniBlade 16 MMC SDIO DI or SPI IRQ The SPI pin out is modules must be on long gold fingers as defined in the table an alternate to SD MMC and is overlaid in the pin below out Refer to the table below 17 USB 18 MMC_SDIO_D2 19 USB 20 MMC SDIO D3 or SPI CS The SPI pin out is an alternate to SD MMC and is overlaid in the pin out Refer to the table below 21 GND A
10. gold plated card edge signals An inner layer ground plane must extend to the end of the module underneath the gold fingers MiniBlade Module Recommended Pin Lengths MiniBlade Specification Revision 1 00 Signal Type Pin Length Power and ground 2 6 mm BLADE_PRSNT 1 6mm All other signals 2 1 mm Copyright 2009 SFF SIG 21 Interfacing to USB Protocol The USB standard defines three modes of operation Detailed descriptions and technical documentation for the USB 1 1 2 0 and 3 0 specifications can be found at http www usb org MiniBlade Module pin outs vary by operating mode USB 1 1 2 0 USB 3 0 Pin Signal Pin Signal 8 34 5V 3 USB3TX 2 15 21 33 40 GND 5 USB3TX 17 USB 8 34 5V 19 USB 9 USB3RX 27 BLADE_PRSNT 11 USB3RX 2 15 21 33 40 GND 17 USB 19 USB 27 BLADE_PRSNT Note At the time of publication USB 3 0 designs have not been built and tested Please contact SFF SIG for status of verification Host platforms must connect 3 3V and 5V signals in all cases Host platforms that do not supply 3 3VSB must connect 3 3VSB to 3 3V in all cases This specification does not allow for exceptions MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 22 Interfacing to SATA Protocol SATA has three modes of operation SATA 1 5 Gb s SATA 3 Gb s and SATA 6 Gb s All three modes support the same pin out configuration a
11. h require high reliability high performance and long product life cycles The MiniBlade socket has latching tabs on both sides which provide a secure fit when the MiniBlade module is properly inserted These latches snap into the pockets on the MiniBlade module shell The MiniBlade socket is a high speed socket able to handle all protocols called out in this specification MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG MiniBlade technology supports the PCle SATA SDIO MMC and USB interfaces that were originally developed for desktop and mobile environments while leveraging them for use in embedded medical instrumentation communications and industrial applications A single MiniBlade socket may support more than one protocol simultaneously While initial MiniBlade modules may support only mass storage it is the intention of this specification to lay the groundwork for MiniBlade modules that address other I O capabilities such as wired or wireless networking and GPS Likely Uses e Flash disk drive on single board computers e Operating system boot device e Wireless transceivers Likely Applications e Industrial control systems Wireless data loggers Process monitoring probes Wearable computers Automotive Medical Military This iteration of MiniBlade technology specifically supports the following I O connectivity One x1 PCle channel One USB 2 0 channel One SATA 3 0Gbps channel One 8 bit MMC or One 4 bit SDIO c
12. hannel Optional SPI is overlaid on this channel A given MiniBlade module may use one or more of the above interfaces In the event that a host platform does not include all of the interfaces simultaneously included interfaces must be clearly declared on all product documentation MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 1 2 Audience This document is written for design engineers that understand the basics of PC style peripherals and chipsets It specifies the electrical and mechanical parameters of the MiniBlade socket and MiniBlade modules in order to ensure multiple sourcing Since MiniBlade supports high speed serial bus signals care must be exercised with respect to best layout practice for high speed signals Please reference industry standard organizations and special interest groups websites listed below for their design and layout recommendations 1 3 Related Documents and Organizations The MiniBlade specification makes reference to and is based on the current version of the following specifications and datasheets MiniBlade Socket Samtec SiliconBlade Socket datasheet Samtec Inc 520 Park East Boulevard New Albany IN 47151 1147 USA Phone 1 812 944 6733 Fax 1 812 948 5047 http www samtec com MiniBlade Module SiliconSystems SiliconDrive Blade Solid State Drives datasheet SiliconSystems Inc 26840 Aliso Viejo Parkway Aliso Viejo CA 92656 USA Phone 1 949 900 9400 Fa
13. lade supports two single lanes and one quad lane of data between the baseboard and expansion card Lane counts are written with an x prefix with x1 designating a single lane and x4 for a four lane interface A x1 pronounced by one lane is very space efficient compared to the parallel PCI bus that it replaces with 2 5 times the bandwidth using only five signals Four lanes of 250 MB s in a x4 link gives a maximum transfer rate of 1 GB s 250 MB s x4 in each direction for PCle 1 1 MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 10 SBC Abbreviation for Single Board Computer SBS Samtec Inc SiliconBlade socket 2X20 positions card edge connector with latches SDIO Secure Digital JO Secure Digital SD is a flash non volatile memory card format developed by Matsushita SanDisk and Toshiba for use in portable devices such as digital cameras handheld computers PDAs mobile phones GPS receivers and video game consoles Although SD cards are typically for consumer applications the interface signals and software are useful for embedded applications when placed on a suitably rugged connector SMBus System Management Bus A simple two wire bus derived from PC and used in the x86 architecture for communication with low bandwidth devices such as memory sticks clock generators and temperature sensors USB Universal Serial Bus It is a serial bus designed to allow peripherals to be c
14. ll ground and power pins implemented on MiniBlade 22 MMC_SDIO_D4 modules must be on long gold fingers as defined in the table below 23 A PETpO 24 MMC SDIO D5 MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 20 Pin Notes Pin Notes 25 A PETnO 26 MMC SDIO D6 27 BLADE_PRSNT Always grounded by the MiniBlade 28 MMC_SDIO_D7 module This signal must be on module short pins for PnP plug and play hot swap module applications 29 A PERpO 30 MMC SDIO CMD or SPI DI The SPI pin out is an alternate to SD MMC and is overlaid in the pin out Refer to the table below 31 A PERn0O 32 MMC SDIO CLK or SPI SCLK The SPI pin out is an alternate to SD MMC and is overlaid in the pin out Refer to the table below 33 GND All ground and power pins implemented on MiniBlade 34 5V All ground and power pins implemented on modules must be on long gold fingers as defined in the table MiniBlade modules must be on long gold fingers as below defined in the table below 35 A_CLKp 36 SATB 37 A_CLKn 38 SATB 39 PCle PRSNT Grounded by the MiniBlade module only if 40 GND All ground and power pins implemented on PCle is used to save power and reduce EMI from A_CLK toggling This signal must be on short pins for PnP plug and play hot swap module applications MiniBlade modules must be on long gold fingers as defined in the table below Note Signals are implemented as
15. nd require a 5V supply voltage Further documentation and specifications for SATA can be found at http www serialata org Pin Signal 2 15 21 33 40 GND 4 SATA 6 SATA 8 34 5V 27 BLADE_PRSNT 36 SATB 38 SATB Note Host platforms must connect 3 3V and 5V signals in all cases Host platforms that do not supply 3 3VSB must connect 3 3VSB to 3 3V in all cases This specification does not allow for exceptions MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 23 Interfacing to MuitiMedia Card MMC Protocol MultiMedia Card protocol has two modes of operation eight bit high speed and four bit Further documentation and specifications for the MMC interface can be found at http www mmca org or http www jedec org 8 bit High Speed MMC Pin Signal 1 3VSB 2 15 21 33 40 GND 7 13 3 3V PERST or SDIO_WP MMC_SDIO_DO or BEL DO MMC_SDIO_D1 or SPI IRQ MMC SDIO D2 20 MMC SDIO DO or GEL CS 22 MMC SDIO D4 24 MMC SDIO D5 26 MMC SDIO DO 27 BLADE PRSNT 28 MMC SDIO D7 30 MMC SDIO CMD or SPI DI 32 MMC SDIO CLK or SPI SCLK MiniBlade Specification Revision 1 00 4 bit MMC Pin Signal 1 3VSB 2 15 21 33 40 GND 7 13 3 3V 10 PERST or SDIO_WP 14 MMC SDIO DO or SPI DO 16 MMC SDIO DI or SPI IRQ 18 MMC
16. ocket MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 32 79 1 291 5 00 197 dl erie UOUUUU0U000000000000 IUNE EK LI Lr n DE E E ea 24 80 976 e E KO Ez pa a a l F N l CONNECTOR OUTLINE i i H 2 46 097 LE 29 03 1 143 Stencil layout for right angle MiniBlade socket MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 19 Appendix B MiniBlade Connector Pin Assignments Pin Notes Pin Notes 1 3VSB Optional Connecting the always on standby voltage 2 GND All ground and power pins implemented on 3VSB to the target electronics allows the module to remain MiniBlade modules must be on long gold fingers as powered during low power ACPI suspend standby sleep defined in the table below states for those SBCs that support ACPI The module would then be capable of waking up resuming the system Support for optional features must be declared in data sheets and manuals of host boards and MiniBlade modules If not used 3VSB must be tied to 3V on the host system The 3VSB and 3 3V pins must NOT be connected together on a MiniBlade module Doing so would short circuit the power supply on an ACPI enabled SBC 3 USB3TX At the time of publication this interface has not 4 SATA been built and tested Please contact SFF SIG for status of verification 5 USB3TX At the time of publication this interface has not 6 SA
17. ol Serial Peripheral Interface protocol is a pseudo standard synchronous serial data link There is no international governing body for the SPI protocol Pin Signal 1 3VSB 2 15 21 33 40 GND 7 13 3 3V 14 MMC_SDIO_DO or SPI DO 16 MMC_SDIO_D1 or SPI IRQ 20 MMC SDIO D3 or SPI CS 27 BLADE PRSNT 30 MMC SDIO CMD or SPI DI 32 MMC SDIO CLK or SPI SCLK Note Host platforms must connect 3 3V and 5V signals in all cases Host platforms that do not supply 3 3VSB must connect 3 3VSB to 3 3V in all cases This specification does not allow for exceptions MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG Interfacing to PCle Protocol PCle requires a 3 3V supply voltage The following describes the signals used and the connections needed to support PCle Further documentation and specifications for PCle can be found at http www pcisig com Pin Signal 1 3VSB 2 15 21 33 40 GND 7 13 3 3V 8 34 5V 10 PERST or SDIO_WP 23 A PETpO 25 A PETnO 27 BLADE PRSNT 29 A PERpO 31 A PERnO 35 A CLKp 37 A CLKn 39 PCle PRSNT Note Host platforms must connect 3 3V and 5V signals in all cases Host platforms that do not supply 3 3VSB must connect 3 3VSB to 3 3V in all cases This specification does not allow for exceptions MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG
18. onnected using a single standardized interface which replaces certain legacy varieties of serial and parallel ports 3 0 Connector 3 1 Connector and Placement MiniBlade uses a 40 pin card edge connector Both vertical and right angle low profile sockets are part of the standard The assignments for the connector pins are shown in Appendix B MiniBlade can support Generation 1 PCI Express data rates of 2 5Gb s Actual test results to demonstrate that it will support data rates of 5Gb s which is required for PCI Express Generation 2 are not available at the time this specification version was created In addition the USB 2 0 data rate of 480Mbps is supported The Samtec SBS 120 01 S DV A ML socket with a 0 8 mm 0 031 inch pin pitch is the vertical connector designed specifically for MiniBlade The right angle connector part number is SBS 120 01 S DH WT ML Gold plated pins are mounted in a double row configuration A total of 40 pins 2X20 are available in the MiniBlade socket The connector is rugged enough to support many industrial environments For more information about these connectors contact Samtec as listed in section 1 3 above MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 11 4 0 Specifications drawings and suggested PCB land patterns for the socket and the mating gold plated PCB traces card edge fingers are in Appendix A Certain chipsets do not support all the interfaces defined on a MiniBlade socket
19. ufficient pertinent information to implement the MiniBlade module storage solution into an embedded system design Figure 1 MiniBlade Module 8 MiniBlade Socket right angle General Description MiniBlade technology is intended to meet the storage requirements of high reliability high performance and multi year life cycle embedded applications These systems may be deployed in environments that must endure high vibration temperature extremes G forces and other difficult environments The criteria for developing MiniBlade module technology are small size mechanically rugged support an array of common protocols and achieve initial storage capacity of 8GB As the storage technology matures MiniBlade module MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG capacity could become larger The array of protocol support may also be expanded The MiniBlade module is encapsulated in a rugged plastic frame This frame has chamfered corners that act as a polarization feature to ensure proper insertion into the MiniBlade socket There is a pocket in either side of the frame to accommodate the latches from the MiniBlade socket to ensure a firm insertion 26 8mm gt 24 25mm d vo amr eki 8 5mm 40 2 Figure 2 MiniBlade Module The 40 pin MiniBlade socket is available in a vertical or right angle configuration Like the MiniBlade module the MiniBlade socket is designed to endure environments whic
20. x 1 949 900 9500 Email info siliconsystems com http www siliconsystems com MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG Interfaces SD Card Association 2400 Camino Ramon Suite 375 San Ramon CA 94583 USA Telephone 1 925 275 6615 Fax 1 925 886 4870 E mail office sdcard org http www sdcard org SATA IO Administration 3855 SW 153rd Drive Beaverton Oregon 97006 USA Tel 1 503 619 0572 Fax 1 503 644 6708 E mail admin sata io org http www sata io org PCI Express Specification PCI SIG 3855 SW 153rd Drive Beaverton OR 97006 USA Phone 1 503 619 0569 Fax 1 503 644 6708 http www pcisig com USB USB Implementers Forum Inc 3855 SW 153ra Drive Beaverton OR 97006 http Awww usb org MMC JEDEC 3103 North 10 Street Suite 240 South Arlington VA 22201 2107 Phone 1 703 907 7540 Fax 1 703 907 7583 http www jedec org SPI The SPI bus is a de facto standard rather than one agreed by any international committee The reason for this is its essential simplicity A good reference is http www freescale com files microcontrollers doc ref_manual S12SPIV3 pdf MiniBlade Specification Revision 1 00 Copyright 2009 SFF SIG 2 0 Acronyms and Terms AT X style Lane Link MMC PCle Refers to the power supply configuration that allows the computer to be turned off via software ATX power supplies have two separate five volt signals one that powers

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