Datasheet ISP13030-ANT
Contents
1. 30 C 60 RH during 48 hours before assembly on the PCB Soldering information Recommendation for RoHS reflow process is according to Jedec J STD 020 and 033 standard profiles or re SR R Max Ramp Up Rate 3 C s Li Max Ramp Down Rate 6 C s Temperature gt ____ Time 25 C to Peak Time lt gt Preheat Soak 260 C Temperature Min T smin 150 C 0 5 C Temperature Max T smax 200 C Classification Temperature T 260 C Time ts from Tsmin tO Tsmax 60 120 sec Time t maintained above Ich C 30 sec Ramp up rate T to T Ramp down rate T to T 6 C sec max Peak package body temperature T Liquidous temperature T1 217 C Time tL maintained above T 60 150 sec NEE ele Pearelainpenattr EE HS December 19 2014 Page 13 15 Document Ref isp_ble_DS130301ANT_R2 docx S Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ag K s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party E without written permission Specification subject to change without notice Distributed by ees T E XIM www texim europe com EUROPE Insight SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT 6 Quality amp User information Certifications FCC Identifier 2AAQS ISP130301 Certificate N 142180643 AA 00 CE C2. BP 309 06906 Sophia Antipolis Cedex France www insightsip com e A dette The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Fee without written permission Specification subject to change without notice LEAF Distributed by oe Aha _Www texim europe com TEXIM Insight SP AN T BLE MODULE It s all in the package ISP 1 30301 A NT 3 Product Development Tools Interface ISP130301 ANT integrates a full microprocessor interface with up to 32 General Purpose I O pins GPIO and several functions 2 x SPI 2 x 12C UART 8 x ADC SWDIO interface Development Tools and Software The following development tools and software are recommended for using and testing 1SP130301 ANT module d Nordic Semiconductor nRFgo Studio downloadable from www nordicsemi com Nordic Semiconductor Master Control Panel downloadable from www nordicsemi com Keil MDK ARM Lite downloadable from https www keil com demo eval arm htm Segger J Link Lite downloadable from http www segger com jlink software html S100 series BLE nRF51 SoftDevice S210 ANT nRF51 SoftDevice and S310 ANT BLE nRF51 SoftDevice fully qualified Bluetooth low energy stacks for nRF51422 integrated in ISP130301 ANT module All SoftDevices object code no source can be downloaded from www nordicsemi com d nRF51 Software Development Kit SDK nRF51 SDK can be downloaded f
3. be disclosed to any third party without written permission Specification subject to change without notice Distributed by Ce w Uh Wwww texim europe com TEXIM Insight SP ANT BLE MODULE It s all in the package IsSsP 1 30301 ANT 2 RF Performances RF Specifications according to standards Parameter VELT Condition Channels Output Power 20 to 4 dB 0 to 39 Better than Channels RF Frequency tolerance Hz 0 to 39 B Rx sensitivity BLE mode 93 Level for BER lt 0 1 Rx sensitivity ANT mode pm ideal Tx Open field 1m height dBm dBm Level for BER lt 0 1 Max range gt 200 m Antenna Gain Rx sensitivity 51 4 Typical Antenna Return Loss Module mounted on a USB dongle ground plane 0 a 6 co O 12 2 0 2 1 2 2 23 2 4 2 5 2 6 Zt 2 8 2 9 3 0 freq GHz ele le December 19 2014 Page 6 15 Document Ref isp_ble_DS130301ANT_R2 docx Te Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com oe E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Fee aye without written permission Specification subject to change without notice ons Distributed by Ce T EX lM www texim europe com EUROPE Insight SIP ANT BLE MODULE It s all in the package ISP 1 30301 A NT Radiation Pattern in 3
4. planes Module mounted on a USB dongle ground plane gain dBi 2 45GHz gain dBi 2 45GHz Ground Plane Effect Simulation gt DLE USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane size 18 x 30 mm size 40 x 100 mm size 40 x 100 mm ele Els Document Ref isp_ble_DS130301ANT_R2 docx 2 December 19 2014 Page 7 15 ke Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Ze Kou without written permission Specification subject to change without notice at k ra al The information contained in this document is the property of Insight SiP and should not be disclosed to any third party EE Distributed by oe Aha _Www texim europe com TEXIM Insight SiP ANT BLE MODULE It s all in the package ISP 1 30301 A NT Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane size 40 x 100 mm size 40 x 100 mm Cell phone config 1 with side ground plane Return loss dB Cell phone config 1 ground plane Cell phone config 2 with side ground plane Cell phone config 3 with side ground plane USB dongle ground plane freq GHz lg lef December 19 2014 Page 8 15 Document Ref isp_ble_DS130301ANT_R2 docx T Insight SiP Green Side 400 avenue Roumanille
5. 9 2014 Page 12 15 Document Ref isp_ble_DS130301ANT_R2 docx Tier Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com e dette The information contained in this document is the property of Insight SiP and should not be disclosed to any third party De without written permission Specification subject to change without notice m k Za Distributed by Ce T EX IM www texim europe com EUROPE Insight A SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT 5 Storage amp Soldering information Moisture Sensitivity All plastic packages absorb moisture During typical solder reflow operations when SMDs are mounted onto a PCB the entire PCB and device population are exposed to a rapid change in ambient temperature Any absorbed moisture is quickly turned into superheated steam This sudden change in vapor pressure can cause the package to swell If the pressure exerted exceeds the flexural strength of the plastic mold compound then it is possible to crack the package Even if the package does not crack interfacial delamination can occur Since the device package is sensitive to moisture absorption it is recommended to bake the product before assembly The baking process for dry packing is 24 hours at 125 C ISP130301 has been tested MSL 5 according to standards After baking modules can be exposed to ambient room conditions approximately
6. Digital I O General purpose I O pin Analog input ADC input 3 AREFO Analog input ADC Reference voltage GND_EP Exposed metal pad Should be connected to ground plane on application PCB ISP130301 ANT pad placement and pin assignment for the LGA QFN package TOP VIEW December 19 2014 Page 4 15 Document Ref isp ble DS130301ANT_ R2 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Distributed by ex IM www texim europe com EUROPE Insight SiP ANT BLE MODULE It s all in the package ISP 1 30301 ANT Electrical Schematic Electrical schematic showing ISP130301 module connections antenna Ant OUT MOD OUT ANT a R S L3 AVDD c8 D Ko its 7 G9 C Ao Mi et kk K lt ER Ld A N N sf ei To IL e E SEEEEER ARAA 333333 s ajae tiha EES EE S y GLa amp 2 2 2 B S Sl 2 2 218 A z a gs s S 2 2 2 2 z 2343 33 3 a 83 8 55 5 lelelelelelelelelelel u Bai g gt oO QO e S pi 8 T i o t 8 5 Oo lt f O December 19 2014 Page 5 15 The information contained in this document is the property of Insight SiP and should not
7. Insight SiP It s all in the package ANT BLE MODULE ISP130301 ANT ISP130301 ANT Dual ANT BLE Module with Integrated Antenna Key Features A ANT ANT protocols d Single Mode BLE v4 1 Proprietary 2 4 GHz protocols d Based on Nordic Semiconductor nRF51 family 2 4GHz low energy RF Transceiver 32bit ARM Cortex MO CPU with 256kB Flash d Analog and Digital peripherals 4 Ultra Low Power Consumption Single 2 1 to 3 6 V supply d Very small size 8 0 x 11 0 x 1 2 mm d Temperature 25 to 75 C d Fully integrated RF matching and Antenna Integrated 16 MHz and 32 768 kHz Clocks Certifications Complies with FCC CE IC and TELEC A Bluetooth SIG certified d RoHS compliant Storage DCDC EE H Inductor amp ER Converter 46kB ADC ADC X 8 Caps RAM Debug SPI x2 SWD Interface GPIO GPIO UART I2C x2 UART 16MHz Xtal amp Caps Cortex RF Antenna E matching ISP130301 ANT nNRES1XXX Applications Space constrained ANT BLE Devices d Sport and fitness sensors Health care sensors d Out of Range OOR sensors d Personal User Interface Devices PUID d Remote controls General Description This module is based on nRF51422 Nordic Semiconductor 2 4GHz wireless System on Chip SoC integrating a 2 4 GHz transceiver a 32 bit ARM Cortex MO CPU a flash memory and analog and digital peripherals It can support ANT ANT Bluetooth Low Energy and 2 4GHz pro
8. dicates that it contains our module The label should use wording such as Contains IC 11306A ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below IC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le present appareil est conforme aux CNR d industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible den compromettre le fonctionnement Of ee L Gr D December 19 2014 Page 14 15 Document Ref isp_ble_DS130301ANT_R2 docx lt at Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com a i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party K without written permission Specification subject to change without no
9. ht SiP and should not be disclosed to any third party K without written permission Specification subject to change without notice Distributed by Ce T E LhM EUROPE www texim europe com Insight SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT Contents 1 eer le EE Page 1 2 2 RFP PO OMIM ANG geg Page 1 6 el geet eieiei gl Lee sirip enr p E E Page 1 9 4 Mechanical Outlines ccccccceeccceeeesseeeeeeeceeeeaeeeseeeeseeeeeeeseueeseeeseueeseeeseeesseeeseeteueesseetaneess Page 1 10 5 Storage amp Soldering Information nnennnannnnsennnsnnensnteerntrrrnrrnrnrrrrrrrnrrtrerrrenrnrrsrrrrrrrrrreen ne Page 1 13 6 Quality amp User lntormaton Page 1 14 1 Electrical Specifications Electrical Performance The specifications of the module follow those of the nRF51822 The following high level parameters are given for the module The operating temperature range Is 25 to 75 C with the following performances Parameter VEUT Supply voltage Supply Voltage Current consumption Static levels Peak current receiver active supply at 2 1V a Peak current transmitter active 4 dBm Output Power Peak current transmitter active 0 dBm Output Power Current drain connection less state Current drain between connection events SS Pin Assignment The module uses an LGA format with a double row of pads on a 0 65 mm pitch The pad layout follows the QFN Jedec standard for 2
10. nnected to the internal antenna It should be connected to Pin 24 OUT_MOD for normal operation During certification the pin may be connected to an RF connector for antenna measurement VCC_nRF 33 SWDIO Digital I O System reset active low Also HW debug and flash nRESET programming I O PO_16 Digital I O General purpose I O pin DO 15 Digital I O General purpose I O pin PO 14 Digital I O General purpose I O pin PO 12 Digital I O General purpose I O pin PO 10 Digital I O General purpose I O pin PO 11 Digital I O General purpose I O pin PO_05 AIN6 Digital I O General purpose UO pin Analog input ADC input 6 m Ce December 19 2014 Page 3 15 Document Ref isp_ble_DS130301ANT_R2 docx ZE Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com en The information contained in this document is the property of Insight SiP and should not be disclosed to any third party bk feel without written permission Specification subject to change without notice or Distributed by Ce T EX lM www texim europe com EUROPE Insight SP ANT BLE MODULE It s all in the package ISP 41 30301 ANT Pin Name Pin function Description 41 PO_06 AIN7 Digital I O General purpose I O pin Maree Analog input ADC input 7 Analog input ADC Reference voltage Analog input ADC input 4 Analog input ADC input 5 Analog input ADC input 2 PO 31
11. ny application which requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party s life body or property including and not limited to i aircraft equipment ii aerospace equipment ili undersea equipment iv power plant control equipment v medical equipment vi transportation equipment vil traffic signal equipment vill disaster prevention crime prevention equipment The only warranty that Insight SiP provides regarding the products is its conformance to specifications provided in datasheets Insight SiP hereby disclaims all other warranties regarding the products express or implied including without limitation any warranty of fitness for a particular purpose that they are defect free or against infringement of intellectual property rights Insight SiP customers agree to indemnify and defend Insight SiP against all claims damages costs and expenses that may be incurred including without any limitation attorney fees and costs due to the use of products m Ce December 19 2014 Page 15 15 Document Ref isp_ble_DS130301ANT_R2 docx ZE Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com a i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ES without written permission Specifica
12. omplies with 1999 5 EC EN300328 V1 8 1 Statement N 142140199 AA 00 IC Certification N 11306A ISP130301 Telefication N 142170180 AA 00 TELEC certification N 001 A03467 Bluetooth SIG certified N D024444 RoHS compliant USA User information This intends to inform how to specify the FCC ID of our module ISP130301 on the product Based on the Public Notice from FCC the host device should have a label which indicates that it contains our module The label should use wording such as Contains FCC ID 2AAQS ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below FCC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation Caution Any Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment CANADA User information This intends to inform how to specify the IC ID of our module ISP130301 on the product According to Canadian standards RSS 210 and RSS Gen the host device should have a label which in
13. prietary ultra low power wireless protocols Fully qualified BLE stacks for nRF51422 are implemented in the S100 series of SoftDevices which can be freely downloaded nRF51 platform also provides extensive software support for ANT applications with S210 SoftDevices and dual ANT BLE stack S310 SoftDevices ISP130301 ANT can then be used for ANT applications as well as Master and Slave modes for BLE or proprietary protocols on request The module is designed for ultra low power applications such as sports and wellness sensors Advanced power management enables battery lifetimes up to several years on a coin cell battery Even though its very small size 8 x 11 x 1 2 mm the module integrates the wireless SoC load and decoupling capacitors 16 MHz and 32 kHz crystals DC DC converter RF matching circuit and antenna The module forms a standalone ANT ANT BLE_ node for which only the addition of a suitable DC power source and appropriate sensor is necessary for sensor applications As the module has several end applications the antenna was designed to be compatible with several ground plane sizes such as USB dongle or cell phone elei gtchs December 19 2014 Page 1 15 Document Ref isp_ble_DS130301ANT_R2 docx Tier Qn Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Sa de The information contained in this document is the property of Insig
14. rom www nordicsemi com It contains example of source codes applications C language Precompiled HEX files Source code Keil ARM project files IAR project files GCC project files elei gtchs December 19 2014 Page 9 15 Document Ref isp_ble_DS130301ANT_R2 docx Tier Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com is The information contained in this document is the property of Insight SiP and should not be disclosed to any third party nA without written permission Specification subject to change without notice a Distributed by Ce T E UM www texim europe com EUROPE Insight A ANT BLE MODULE insight sip ISP130301 ANT 4 Mechanical Outlines Mechanical Dimensions Dimensional drawing for 8 x 11 x 1 2 mm 57 Pad LGA Package PAN 1 INDICATOR lt CO3mmn Ba December 19 2014 Page 10 15 Document Ref isp_ble_DS130301ANT_R2 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Fe without written permission Specification subject to change without notice Insight SiP ANT BLE MODULE It s all in the package ISP 1 30301 ANT SMT Assembly Guidelines Recommended PCB Land Pat
15. row LGA parts Pads 1 thru 56 are signal pins 0 4 x 0 4 mm Pad 57 is an exposed metal pad that is connected to ground The NC pads are 0 8 x 0 8 or 0 4 x 0 4 mm and are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability drop test EE iS Gs ore December 19 2014 Page 2 15 Document Ref isp_ble_DS130301ANT_R2 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Distributed by ee T i XIM www texim europe com EUROPE Insight SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT Pin Name Pin function Description 6 JNC LNotGonmected 1 Isolated pad on application PCB for mechanical stability 8 NC LNotGonmected 1 Isolated pad on application PCB for mechanical stability 9 P017 Domain General purpose I O pin S y O 24 OUT_MOD Module UC This pin is the RF I O pin of the BLE module It should be connected to Pin 26 OUT_ANT for normal operation During certification the pin may be connected via to an RF connector for module measurement using a Bluetooth test setup VDD_PA PA supply PA supply indicates Transmit mode Active High 26 OUT_ANT Antenna LUC This pin is co
16. tern and Solder Mask layout wi B H mmm e e gn e e a 7 Re S E E gt V e e i o D one e E ki E U t i p p ee ee ee es es ee X WM a A ZZ ps WW d KI x WW i H T A December 19 2014 ele Els Page 11 15 Document Ref isp_ble_DS130301ANT_R2 docx V s ob Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Ss ICH Lt JEE The information contained in this document is the property of Insight SiP and should not be disclosed to any third party RES a without written permission Specification subject to change without notice Distributed by ee EAA Www texim europe com TEK Insight SP ANT BLE MODULE It s all in the package ISP 1 30301 A NT Antenna Keep Out Zone Recommended metal keep out areas for optimal antenna performance no metal no traces and no components on any layer except mechanical LGA pads 18 0 mm min Metal exclusion zone to edge of board no metal on any layer except mechanical LGA pads board uu GZl6 S TOP VIEW Package marking ISP130301 Product number ANT CL Hardware version Two digit year number Two digit week number Insight SiP Model ISP130301C YYWW ANT R 001 A03467 5 mm max for i IC 11306A ISP130301 FCC ID 2AAQS ISP130301 laser marking KE IC C 0560 Oe December 1
17. tice ol oar Distributed by Ce T E UM www texim europe com EUROPE Insight SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT Discontinuity Normally a product will continue to be manufactured as long as all of the following are true The manufacturing method is still available There are no replacement products There is demand for it in the market In case of obsolescence Insight SiP will follow Jedec Standard JSD 48 A Product Discontinuation Notice PDN will be sent to all distributors and made available on our website After this the procedure goes as follows Last Order Date will be 6 months after the PDN was published Last Shipment Date will be 6 months after Last Order Date i e 12 months after PDN Disclaimer Insight SiP s products are designed and manufactured for general consumer applications so testing and use of the product shall be conducted at customer s own risk and responsibility Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment Please also pay attention i to apply soldering method that don t deteriorate reliability ii to minimize any mechanical vibration shock exposure to any static electricity lil not to overstress the product during and after the soldering process The products are not designed for use in a
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