MG815+ Module Hardware Design User Manual
Contents
1. 18 LM UNA 18 4 22 Kesa uyu u 18 43 Serial 19 44 SIM UIM Card Interface encor roter 3 20 45 Audio Interface Saa eee EYE PR EHESE EON EVEN ENE SR EEEE R VENE VENERE 21 4 6 Sei 22 Mechanical iiie RU RUE i a annie 24 24 2 2 Module Assembly intuy 24 9 3 Main board PCB layouts seeds nn uuu tete EO UR EU Fr REX 25 54 Esdr 26 6 Peripherals ERR 27 FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU ZTEDH MG815 Module Hardware Design User Manual Table of figures 2 1 MG815F PRINCIPLE a e aaa asa as 12 2 2 I ener petere three orbes eia rr E Ee PEERS YER ben EPOR I ERE E PERRA 12 RE 3I PIN2. 6 Peripherals components Introduces the peripherals components Update History V1 5 July 12 2007 This is the sixth time to release the new version The update contents include Add this manual is also applicable for ME3006 1 1 Technical Specification modification in ME3000 s frequency and GSM s Maximum current 3 1 Modification in RI s description 4 3 Modification in serial port V1 4 June 25 2007 This is the fifth time to release the new version The update contents include 1 1 4 Modifications in Technical parameters 1 2 Modifications in Relevant Documents 4 2 Power and Reset Add ON OFF timing TEA MG815 Module Hardware Design User Manual 5 1 Change the modules weight a more accurate value V1 3 31 2007 This is the fourth time to release the new version The update contents include 4 2 Modifications in Section Power and Reset 4 4 Change user ID card interface to SIM UIM card interface 4 5 Audio Interface Deleted x05 x06 x07 in the picture and just kept receiver handset and line out Change CDMA and GSM audio interface design 4 6 Change RF interface as antenna interface 5 1 Appearance Add ME3000 s appearance 5 3 Change PCB Layout 6 Change Key components as peripherals V1 2 April 24 2007 This is the third time to release the version The update contents include 6 4 Audio Interface Add Auto power on off audio interface design V1 1 CApril 13 2007 The update
3. MG815 Module Hardware Design User Manual 1 General Description This manual is applicable for ME3000 ME3006 MG8 15 MG615 MG415 MG416 modules Except for antenna design the hardware mechanical design is completely compatible with the applications of CDMA 800M Sec800MHz 450M and GSM GPRS above modules have voice SMS and data service function which could be used for data transmission wireless POS security lottery intelligent metering wireless fax small exchangers tobacco network campus network wireless AD wireless media medical surveillance relay station surveillance railway terminal intelligent home appliances vehicle mounted surveillance etc Taking MG815 and ME3000 module as examples this manual describes the module s logic structure hardware interface and main functions and provides reference design for the hardware and mechanics 1 1 Technical Specification 1 1 1 Module Specification Please refer to table 1 1 for the specifications of 5 types of modules ME3000 ME3006 MG815 MG615 MG415 and MG416 Table 1 1 module specification Module Models Frequency MHz ME3000 GSM GPRS Dual Band EGSM 900 DCS 1800 ME3006 GSM GPRS Quad Band GSM 850 EGSM 900 DCS 1800 PCS 1900 Remarks The modules are compatible on hardware and mechanical design except for frequency Below is just an example for MG815 ME3000 modules 1 1 2 Main Functions and Features Please refer to Table 1 2 for the Main F
4. C 5 me deti m n u eden 14 RE 4 1 POWER AND RESET CIRCUIT DESIGN REFERENCE 18 aun PAG e Joa ce 19 REA 3 UART SIGNAL DIAGRAM ERE Ee ERN ERE PER E PEN Guau Eee EY sene FE EE 20 RE 4 4 SIM UIM CARD INTERFACE DESIGN REFERENCE enne nene en een nene 21 RE 4 5 AUDIO INTERFACE CIRCUIT DESIGN REFERENCE 2 2 4 21 RE 4 6 ANTENNA INTERFACE uu nn m 23 RE 4 7 IRF CABLE INTERFACE au tie ee CHEER REPE a akaun re Eee eR 23 RE 5 1 MODULE APPEARANCE 815 24 4 2 20 40000000000000000000000000 0008 0 00 00 24 RE 5 2 MODULE APPEARANCE ME3 000 0000 eescessseceeececssecesececseccesneecsaccesneecsacceeneecsaeceneecsseceeneecsaeeeeneessaeenenees 24 5 3 MODULE ASSEMBLY BOTTOM VIEW csccccssssesscssssessesessesecssssesecsescesecsssaesecassseaecsesaesecassaeaeessseeaseaees 24 RE 5 4 MAIN BOARD PCB LAYOUT TOP VIEW ccccssssessessssesscsssesecsessesecsessesecaescesecaessesescesseaecaesseaecaesaeaecaesaeaseaees 25 RE SSS FIXING METHOD vs 26 ZTEDH MG815 Module Ha
5. D TxD TxD RxD Rice RTS en CTS DCD DCD DTR DTR VON The corresponding PINS of UART 2 are for both UART and USB GSM modules support UADT notes not include RTS2 and CTS2 but not USB while CDMA modules support USB and UART both Please refer to table 4 3 for details Table 4 3 USB and UART 2 Pin SN and Name USE DATARXDZ RXbi USE DAT 3 4 4 SIM UIM Card Interface 20 ZTEDH MG815 Module Hardware Design User Manual Modules support 3V SIM UIM card SIM UIM terminal includes 4 pins V_CARD is used to supply SIM UIM card It s strongly recommended to add ESD to protect SIM UIM card in hostile environments D2 in the following layout is for ESD Figure 4 4 SIM UIM card interface design reference S O Car LN TERE ALE x23 CARD_DATA NOTE A 10k resistor is required for CARD DATA to be draw up to V CARD pin because there are different SIM UIM cards with quite different output currents SIM UIM card PCB circuit should be laid closely around the module as possible as you can to avoid the interference of reading writing from other sources 4 5 Audio Interface The module provides audio input and output through MIC 2P There are 2 speaker interfaces 2 microphone interfaces and 1 line output Only one pair I O works at the same time Figure 4 5 audio interface circuit design reference AUDIO INTERFACE SIP 1 Microphone The system connector provi
6. ZTEDH MG815 Module Hardware Design User Manual MG815 Module Hardware Design User Manual Version V1 5 ZTE Corporation This manual is also applicable for ME3000 ME3006 MG615 MG415 MG416 modules ZTEDH MG815 Module Hardware Design User Manual Copyright Statement Copyright 9 2007 by ZTE Corporation All rights reserved No part of this publication may be excerpted reproduced translated or utilized in any form or by any means electronic or mechanical including photocopying and microfilm without the prior written permission of ZTE Corporation ZTEDH is the registered trademark of ZTE Corporation All other trademarks appeared in this manual are owned by the relevant companies ZTE Corporation reserves the right to make modifications on print errors or update specifications in this manual without prior notice ZTE Corporation keeps the right to make the final explanation to this manual ZTEDH MG815 Module Hardware Design User Manual With strong technical force ZTE Corporation can provide CDMA GPRS module customers with the following all around technical support 1 Provide complete technical documentation 2 Provide the development board used for R amp D test production after sales etc 3 Provide evaluations and technical diagnosis for principle diagram PCB test scenarios 4 Provide test environment ZTE Corporation provides customers with onsite supports and also you could get supports through telepho
7. andset mr MIC 2N MIC 2 Cathode MIC 2 for earphone 3 5 2P O 2 Receiver2Anode LM DE draw up internal low level Earphone button test valid draw down internal EAR DET Earphone inserting test level valid sso ot cia UE MS NE _ xp mesedm initialized 14 ZTEDH MG815 Module Hardware Design User Manual CDMA producing a periodic signal 100ms low 5 9s high when received a ring indicating signal then back to high level when the ring indicating signal is terminated GSM low level during the ring indicating signal then back to high level when the ring indicating signal is terminated EN DSR lO Module is low level valid DAT Data cable UIM interface V_CARD 3V power output Po _ O USB_ OE TXD2 USB DATA port20r 3 RXD2 USB M USB VMO interface 5 7 USB_SUS mE LED 30 SIG LED USB GSM module TE supports UART but not USB CDMA Transceiver module supports both UART and USB but Transceiver same to software should be Transceiver port 1 different interface ER Pin 5 and pin 7 are Transceiver available at low level S d stat ithi indicating Draw down internal LED dicat Comes will be turned on at high level with external driver Draw down internal LED will be turned on at high level with external driver Turn on LED off Searching for net
8. ch Communication Baseband 5 T 31 S lt c C Interface 40 pins connector SIM UART POWER AUDIO ZTEDH MG815 Module Hardware Design User Manual 3 PIN definitions The main connector of MG815 or ME3000 is 40 PIN connector and 10 PIN connector The distance between two PINS is 1 27mm Refer to the figure below Figure 3 1 PIN x21 USB_OE TXD2 1 J 2 2 CORD RST USB DATA RXDZ 3 3 alLa CARD DATA SND 1 USB_UMO RTS2 5 5 _6 CARD_CLK 2 USH WERE 62 7 e 8 VU_CARD GND 3 hae 9 18 RESE GND A Xn 11 11 12 Lie 15 5 LB 13 13 14114 7RTS 5 RI 15 15 16 165 DTR 7 k am Ki 18 18 DCD 8 JU 19 lis 29 9 U_MAIN di 21 22 22 U MAIN 10 GND 23 123 24 24 GND 25 25 26 25 SN ZO Y 10S1 UB 024 AUXOP 27 27 28 28 SMS_CED AUXON 25 log 32 SIG LED N 31 1 32 SPK IN MODULE 33 33 34 ELI SPK IDP EAR_AN_DE 32 35 EAR_DE MIC IN 37137 38 MIC 2 INTERFACE E 39 39 4 40 SQPOF Z 40 S1 VB 0 Refer to table 3 1 3 2 below for PIN definitions Table 3 1 PIN definitions of 40 PIN connector Eum sss MIC 1 Anode MIC 1 Cathode MIC 1 is the default SPK IP S Receiver 1 Anode configuration for audio I O SPK IN Receiver 1 Cathode when power on generally 2P mm MIC2Ande 2 Anode MIC 1 is used for h
9. ches 52dB The level of 2P PIN is about 1 8V The receiver s design is just the same as the handset s GSM GPRS module audio interface is designed as below Design of audio interface on the receiver Select the microphone with the sensitivity lower than 51 5dB since the output impedance for SPK 1 is 32 ohm and the max gain in MIC 1 reaches 51 5dB The level of MIC 1P PIN is about 2 5 V Note if other kind of audio input method is adopted the input signal should be within 0 5V If the signal voltage is lower than 0 5V then the pre amplifier should be added If the signal voltage is higher than 0 5V then network attenuation should be added Design of audio interface on the earphone Select the microphone with the sensitivity lower than 51 5dB since the output impedance for SPK 2 is 32 ohm and the max gain in MIC 2 reaches 51 5dB The level of MIC 2P PIN is about 2 5V The receiver s design is just the same as the handset s 4 6 Antenna Interface The module provides two types of RF connector Extended jointing connector RF testing socket PCB jointing connector is used to connect module with antenna by 50 ohm RF shielding cable to cut down the cost But it s not a complete way to shield EMI and RF signal quality may be trivially affected So if you decide to use this method intense radiation must keep far away from PCB jointing connector At the same time 22 ZTEDH MG815 Module Hardware Design User Man
10. contents include 5 PIN definitions Change fig5 1 PIN Diagram 6 Hardware Interface and Reference Design Change R12 impedance in Fig6 1 as 1K 6 4 Audio Interface Add the design of audio interface Add section 6 6 Module Layout V1 0 Feb 09 2007 This is the first to formally release the document ZTEDH MG815 Module Hardware Design User Manual Table of Contents 1 General Description niece noH ee n ee ORI E RE EE per a eee icis 8 IL Technical Specification oce er ua ua E EEUU GRE 8 1 1 1 Module e e e RO EM eR a RID PNIS 8 1 1 2 Main Functions and Eeatures ll i eene neret eterne tenens etes enne etes enne 8 1 1 3 Intetfa6es aeter tre tei etr PD ED FD ROT E 9 1 1 4 Technical parameters oy ac eed tete e beth ede tede apo vrbis eet 9 1 2 Relevant Dosu umanma uuu uu m 10 1 3 Abbreviations uuu aa E M 10 2 Bref Introduction to MG815 AE ETS 12 2 1 Brief Introductton tO MGS SE sirepna ettet ee ee ee ete et e en cR 12 2 2 Brief Introduction to 12 3 PIN definitions re Ee qA i e 14 Hardware Interfaces and Design
11. d Design Reference 4 1 Summary This section describes the function interfaces and usage of MG815 modules in details and provides the designing sample Power and Reset Interface Serial Port SIM UIM Card Interface Audio Interface Antenna Interface Remarks In the system the module layout should be far away from high speed circuit switch power power transformer large power inductor or single chip microcomputer s clock circuit 4 2 Power and Reset Figure 4 1 power and reset circuit design reference POWER INTERFACE gt pve vD IN SND 4 13 ir TAT s s SNE R11 MAIN R42 ZRESCT mo ON OFF ON OFF Cane VTi d ge CLL RESET Bie IK L GND Power design The module is powered by V MAIN and the voltage feature is below Table 4 1 Voltage features Ma D1 is a LDO with low valid control making V MAIN supplies power to module through adjusting R31and R41 at 3 9V Modules have very high requirements on power and ground processing signals must be filtered Power ripple needs to be controlled under 50Mv Do not supply power to any other part of system otherwise RF performance will be compromised Finally select the power cables with at least 40mil traces during the layout and keep the integrality of ground line 18 ZTEDH MG815 Module Hardware Design User Manual Power ON The module will be tur
12. des two microphone interfaces 1 2 which are both differential interface They could be also used as single ended input for example earphone It s recommended to use 21 ZTEDH MG815 Module Hardware Design User Manual differential mode to reduce the noises These two input are coupled in AC domain and added a 1 8V offset voltage inside and they should directly connect with the receiver Speaker The system connector provides two speakers 1 amp SPK_2 The former is differential interface and the latter is single ended interface usually used for earphone They both have 32 ohm impedance Line output The MIC_2P connector provides a differential line output via AUXOP and AOXON The impedance is 8 ohm CDMA module audio interface is designed as below Design of audio interface on the handset Select the microphone with the sensitivity lower than 52dB since the output power for SPK_1 is 35mW and the max gain in MIC_1 reaches 52dB The level of MIC_1P PIN is about 1 8V Note if other kind of audio input method is adopted the input signal should be within 2V If the signal voltage is lower than 2V then the pre amplifier should be added If the signal voltage is higher than 2V then network attenuation should be added Design of audio interface on the receiver Select the microphone with the sensitivity lower than 52dB since the output power for SPK 2 is 8 8mW and the max gain in MIC 2 rea
13. is saved safely please don t cut off the power when the module is on It s strongly recommended to add battery or soft switch like the power key on the mobile phone 4 3 Serial Port The module provides an integrated full duplex UART interface and an accessorial full duplex UART interface 19 ZTEDH MG815 Module Hardware Design User Manual whose maximal data rate is 115200bps External interface is 2 9VCMOS level signal their logic functions conform to RS 232 interface standard the definition of RI in CDMA and GSM are different refer to Table 3 1 These two UART could be used as serial port data interfaces usually UART1 is used for AT commands data transmission and updating software of module UART2 is used to provide test and debug channel Note users need to extend UARTI to update software if they d like to connect module to DTE in the design phase The module s output IO level is 2 9VTTL it needs to transfer the level when connect with standard 3 3V or 5V logic circuit such as MCU or RS232 drive chip MAX3238 etc Figure 4 3 shows the serial port level transfer circuit The converted signal should connect with MCU or RS232 drive chip directly Common low power switch triode should be applied as the crystal triode shown in Figure 4 3 Note when the RxD signal is at high level the module will not be in dormant state Figure 4 3 UART Signal Diagram 100 DSR DSR MG815 RS232 MCU DSR DSR Rx
14. ne website instant communication E mail etc The module website module ztemt com cn provides the relevant industry information and module technical documentation The authorized module customers could download the latest technical documentation for our website If you have more requirements you could send an E mail to module zte com cn You can also call us at 0755 86360280 for more supports ZTEDH MG815 Module Hardware Design User Manual Preface Summary This manual is applicable for ME3000 ME3006 MG815 MG615 MG415 MG416 modules This manual takes MG815 and ME3000 as examples to instruct the users how to design the hardware and how to quickly and conveniently design different kinds of wireless terminals based on the modules Target Readers System designing engineers Mechanical engineers Hardware engineers Software engineers Testengineers Brief Introduction Chapter Contents 1 General Description Introduces technical specs of the modules and relevant documents and abbreviations 2 Product Introduction to Introduces the principle charts and relevant standards of both MG815 and MG815 ME3000 modules 3 PIN Definitions Introduces the name and function of PIN 4 Hardware Interfaces and Introduces the hardware interface designing of the modules design reference 5 Mechanical Introduces the module s appearance assembly line main board PCB layout and fixing
15. ned off after power on normally To turn on the module firstly put RESET at high level and then provide a 1500 2000mS low level pulse to ON OFF PIN Reset needs to connect an open collector or open drain gate Power OFF To turn off the module firstly provide a 1500 2000mS low level pulse to ON OFF PIN after 5s or 6s and put RESET at low level Reset You could turn off the module firstly and then turn it on to reset the module ON OFF timing figure is as follows Figure 4 2 ON OFF timing off state on timing on state off timing off state PWRE 8 tti t t f t t ta Table 4 2 ON OFF timing features ta tb te ta te 20mS 10mS 28 28 65 e MSM There is voltage output pin with current adjuster which be used to supply external power to the board The voltage of this pin and the voltage of baseband processor memory come from the same voltage adjuster The voltage output is available only when the module is on The normal output voltage is 2 85 and the user should absorb the current from this pin as little as possible less than 10mA Generally it is recommended to use this pin to match the level When the module is off the output voltage for this pin remains unchanged but the impedance is rather high Therefore it s not recommended to use this pin for other purposes e Other Advice In order to make sure the data
16. nel 160 210 260 DCS1800 Tx 1710 1785MHz Rx 1805 1880MHz 450MHz C Et Tx 450 460 MHz Rx 460 470 MHz Preferred channel 47 97 147 PCS1900 Tx 1850 1910MHz Rx 1930 1990MHz ZTEDH MG815 Module Hardware Design User Manual 12 Relevant Documents ZTE Dragon tooth wireless module series product catalog Command Manual for ZTE Corporation s MG815 Modules Command Manual for ZTE Corporation s ME3000 Modules ZTE MG815 Module Development Board User Guide FAQ for ZTE Corporation s CDMA Modules FAQ for ZTE Corporation s GSM GPRS Modules Test References of ZTE Corporation s CDMA Wireless Modules 1 3 Abbreviations 10 TEA MG815 Module Hardware Design User Manual Liquid Crystal Display MCU MMI Printed Circuit Board Personal Communication System 11 TEA MG815 Module Hardware Design User Manual 2 Brief Introduction to MG815 2 1 Brief Introduction to MG815 Please refer to Figure 2 1 for the principle of MG815 Figure 2 1 MG815 principle Antenna GND 4 connector 10 pins connector Communication Baseband u a u e 3 5 215 lt G O Interface 40 pins connector SIM UART POWER AUDIO 2 2 Brief Introduction to ME3000 Please refer to Figure 2 2 for the principle of ME3000 Figure 2 2 ME3000 principle 12 TEA MG815 Module Hardware Design User Manual Antenna GND 4 connector 10 pins connector PA and Swit
17. on degree among ports must more than 30dB when multi ports antenna is used For example between two different polarized ports on dual polarized antenna two different frequency ports on dual frequency antenna or among four ports on dual polarized dual frequency antenna isolation degree should be more than 30dB 23 ZTEDH MG815 Module Hardware Design User Manual 5 Mechanical 5 1 Appearance Figure 5 1 module appearance of MG815 Dimensions 44 0 mm length x 28 0mm width x 7 6mm height Weight 8 5g Figure 5 2 module appearance of ME3000 Dimensions 44 0 mm length x 28 0mm width x 7 6mm height Weight 3g 5 2 Module Assembly Line Figure 5 3 Module assembly line bottom view 24 ZTEDH MG815 Module Hardware Design User Manual amp 2 8 b ETELE 5 3 Main board PCB layout Figure 5 4 main board PCB layout top view 25 ZTEDH MG815 Module Hardware Design User Manual Sa cay yap aaa as es aa a alg a ma ped 63 0 60 I 4 104 127 11 80 role Cy Cy Cy a eS Y i C 2 rt 10 l 1 I 0 44 al I i I i I I I I i I i I i I l I I i I I I i I I i I 1 I l 39 05 i I I i i I 1 I 1 I I I m 0 76 I I 1 27 1 ett 27 17 1 I 39 I o 1 TEC 140 5 4 Fixing Method The fixing metal sheet is made of stainles
18. rdware Design User Manual TABLE 1 1 MODULE SPECIFICATION eet 8 TABLE 1 2 MAIN FUNCTIONS AND FEATURES sscccesccessceceseessneecsecesseecsuceesneeceaceesncecsaceseneeceaeeeeneecsaceseneeceaeeeeneeceeeseneee 8 TABLE 1 3 INTERFACES OF THE MODULES ccescccessceesceceseeeesceceseeeeseecssceeeneecaeeeeaceceeeeesaeceaeeeeaeeceeeseneeceeeeeaeeseeeeseneeens 9 TABLE 1 4 TECHNICAL PARAMETERS reperire rhone Freier eene Ar o re AE EAE SA eue voee HEEL ub Re reas PESE SEE CERE u EEG 9 TABLE 3 1 PIN DEFINITIONS OF 40 PIN 2 2 2 0 0 00000001010000000 000000000000 14 TABLE 3 2 PIN DEFINITIONS OF 10 PIN CONNECTOR ceeeeeeeeeeenne enne nne en nennen en nnst tene 17 TABLE 4 1 VOLTAGE FEATURES escccesscesscecesceeeseecesceesscecsaceesneecsaceesacecsaceesneecsaeessneecsaeeseaeecsaeeecaeecaeeeeaeecaeeeeaeecnaeeeaees 18 FABLE 422 ON OFE TIMING FEATURES u usuta boe nre rem Ere 19 TABLE 4 3 USB AND UART 2 PIN SN AND 4022 2 0 0 20 TABLE 6 1 PERIPHERALS 8 2 142 01 n tetti tene nene tren nennen 27 ZTEDH
19. s steel and there are two fixing methods jointing or inserting bolt Refer to Fig 5 5 for product specification Figure 5 5 fixing method 26 TEA MG815 Module Hardware Design User Manual 30 M WW e E sto MM 6 Peripherals components Table 6 1 Peripherals components MICREL www micrel com D2 SEMTECH www semtech com ON www onsemi com D3 PERICOM www pericom com IDT www idt com AMPHENOL www amphenol com 27
20. ual you must ensure that core line of RF shielding cable has been jointed to PCB jointing connector and the shielding metal wire netting on the RF cable has been jointed to GND of module According to the figure below the grounding part must be jointed firmly otherwise the core cable may be ruptured caused by shielding cable shaking Figure 4 6 Antenna Interface Antenna test socket is used for calibration and testing It connects module with antenna conveniently by appropriative 50 ohm socket to SMA connecting cable The touch impedance of this socket is so tiny and shielding characteristics are excellent The impedance of antenna test socket is 50 ohm its type is MM9329 2700B please refer to socket manual provided by supplier to choose relative plugs This is the antenna cable interface Figure 4 7 RF cable interface Proper measures should be taken to reduce the access loss of effective bands and good shielding should be established between external antenna and RF connector Besides external RF cables should be kept far away from all interference sources such as high speed digital signal or switch power supply According to mobile station standard stationary wave ratio of antenna should be between1 1 to 1 5 and input impedance is 50 ohm Different environments may have different requirements on the antenna s gain Generally the larger gain in the band and smaller outside the band the better performance the antenna has Isolati
21. unctions and Features Table 1 2 Main functions and features Description CDMA GSM EVRC and 13kQCELP High quality voice Support TEXT Support TEXT and PDU Y Support internal TCP IP stack Y Support virtual keep on line VKL CDMA maximum up down link data rate 153 6kbps GSM maximum up link data rate 42 8kbps maximum down link data rate 85 6kbps ZTEDH MG815 Module Hardware Design User Manual 1 1 3 Interfaces Please refer to Table 1 3 for the Interfaces Table 1 3 Interfaces of the modules UART interface Download software to update Data communication Maximum data rate 230 4kbps through the port 1 1 4 Technical parameters Please refer to Table 1 4 for the Technical parameters Table 1 4 Technical parameters Item Description CDMA GSM Working temperature 30 C 75 C 20 C 80 C Input voltage 3 3V 4 25V Maximum current 560mA 104 dBm 1800mA 102 dBm Idle current 5mA 75 dBm 10 75 dBm Call current 230mA 75 dBm 150mA 75 dBm sensitivity 104 dBm 102dBm Tx power 23dBm 30dBm Class III GSM850 EGSM900 Class4 2W GSM1800 PCS1900 Class1 1W Frequency range 800MHz Tx 824 849 MHz Rx 869 894 MHz GSM850 Tx 824 849 MHz Rx 869 894MHz Sec800MHz Tx 806 821 MHz Rx 851 DL866 MHz EGSM900 Tx 880 915 MHz Rx 925 960MHz 450MHz Et Tx 450 460 MHz Rx 460 470 MHz Preferred chan
22. work LED flashes and it lasts for about 50ms when it is on Signal indicator and the time is flexible when 15 ZTEDH MG815 Module Hardware Design User Manual power reserved it is off Idle LED blinks per 100ms Traffic call data LED blinks per 500ms Draw up internal Low level 26 I switch control valid For details please refer to section 4 2 Power and Reset Low level valid Need to connect an open 10 RESET I Reset signal collector or an open drain switch For details please refer to section 4 2 Power and Reset Power input Power I input Power input m jop E a fow omm MG815 module has voltage output pin with current limited adjuster It can be used to supply external circuit on main board the voltage of this pin baseband processor and storage come from the same power 25 V_MSM Digital power voltage adjuster voltage Output output is 2 85V when power on Users should distribute current as little as possible from this pin less than 10 Generally we suggest this pin is used to pull up chips pin only when it needs level match Used for module inside need to be suspended 16 ZTEDH MG815 Module Hardware Design User Manual Table 3 2 PIN definitions of 10 PIN connector Used for module inside need to be suspended 17 ZTEDH MG815 Module Hardware Design User Manual 4 Hardware Interfaces an
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