MultiConnect mDot Developer Guide - Multi
Contents
1. weeds 18 Serial Pinout 0 18 WOR Gh 0 M 18 Hates LOT 18 18 Chapter 20 ans 20 P lse Electronics ntn dee re RANA 20 Anternna SpecifiCatlOns s ret er vex erbe Fa ku 20 Integration 20 FCC amp 1C Information to CONSUMERS 20 FOC Grant NOUS nr 20 HOSE EAD ER EEUU 21 Chapter 5 gt 22 Handling Pr cautions rues 22 Radio Frequency RF 5 22 22 MultiConnect mDot MTDOT Developer Guide 3 CONTENTS S curit relative aux appareils radiofr quence 22 Interference with Pacemakers and Other Medical Devices iii 23 Potential interference 23 Pr cautions for pacemaker W ar rs 23 fe t2. BA X us o y o CR _ b b b bp b gt bp waa b b b b s b b b b b as wena p b b b b b bp b b p Jo JoJo J X X BU f CIC IT 5 2006 RER RAP EIR IR BOR p pq x 8 je b 3 8 x 9 o 0 059 Jo e 59 9 e 5 1 p je 5 je k ___ D 9 2 o 9 p mDot MTDOT Developer Guide CHAPTER 8 LABELS Chapter 8 Labels Approvals and Certification In most cases when integrated and used with an antenna system that was part of the MultiTech modem certification additional approvals or certifications are not required for the device you develop as long as the following are met PTCRB Requirements The antenna system cannot be altered Model Identification The MultiTech model identification allows the carrier to verify the modem as one of its approved models This information is located on the label below the bar code Example Labels Note Actual labels vary depending on the regulatory approval markings and content This device complies with part 15 of the FCC Rules Operation is subject to the following two co
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4. NMS z 19045H 8 wus 033 INNIS 031 XL q38W ANUS SWL 153 033W ANUS DDA Guay p sn s 6 30u 664 uam 111685010 AM aseda MultiConnect mDot MTDOT Developer Guide 44 CHAPTER 12 DEVELOPER BOARD SCHEMATICS 03083536 5 gt 5 31545 LUN 1020 5 31545 1N3SNOD NILUUM 0310916250 350804 035n008d34 38 LON 503155 3 Q3NWO SI 0 134235 1 n 1 Auvi3hidOud SIN3S34d34 ONMYHO SIHL 32uON DIN FIX TL zi DINIX 8 z 5 M 5 5 H 5 5 y 8888888514 5 lt 5 5 5 4 ot DW DIL zi PIX D sen EIU ELA ven 45 MultiConnect mDot MTDOT Developer Guide CHAPTER 13 DESIGN CONSIDERATIONS Chapter 13 Design Considerations Noise Suppression Design Adhere to engineering noise suppression practices when designing
5. gS 014 aum o D m m o pos J Link Header 07 mE NC o D4 o 5 VREF 9 LED Indicators DO mDot Arduino Shield Headers Board Components Description RS232 DB 9 Serial Connector mbed USB Connector Serial Disconnect Header J Link Header Reset Button Arduino Shield Connector Arduino Shield Connector MultiConnect mDot MTDOT Developer Guide 35 CHAPTER 10 BOARD COMPONENTS Label Description Arduino Shield Connector LED Indicators Label LE Location Do um DredyaesfomtemDotemwetos 36 mDot MTDOT Developer Guide CHAPTER 11 DEVELOPER BOARD INSTALLATION Chapter 11 Developer Board Installation Installing an mDot on the Developer Board To install an mDot on the Developer Board 1 Align the mDot with the developer board as shown 2 Gently press the mDot into the connectors MultiConnect mDot MTDOT Developer Guide 37 CHAPTER 11 DEVELOPER BOARD INSTALLATION Arduino Shield mDot Arduino Pins Signals module pin micro pin Arduino Shield 3 3V nReset from pushbutton 5 9V input from J3 ADO DIOO 20 PB1 AD1 DIO1 19 PBO Associate AD5 DIO5 15 PC1 no connect no connect no connect Installing an Arduino Shield with an mDot Signals module pin micro pin PWMO RSSI I2CSCL 6 PWM1 12CSDA 7 PC9 3 3V Ground AD2 DIO2 SCK 18 PAS DO8 MISO 4 6 AD4 DIO4 MOSI
6. HEIGHT TOP 062 1 57 0075 ADO DIOO PB1 PCB THICKNESS Dout PA2 2 AD1 DIO1 PBO Din 3 AD2 DIO3 SCLK 5 D08 MISO 4 AD3 DIO3 SNSS nReset 5 PWMO RSSI CSCL 2 nDTRISIeepROID AT 6 i 5 Ground 10 ADGIDIOG RTS Associate AD5 DIO5 1 Nene ca T 10 nCTSIDIO REF 326 8 28 ADAIDIO4IMOSI PAT 2 556555555 866 22 2 079 2 ans MTDOT 868 X1 UFL MTDOT 915 X1 UFL DIMENSIONS IN In mm MultiConnect mDot MTDOT Developer Guide 11 CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTS MTDOT xxx M1 UFL 201 5 11 101 2 55 060 1 52 2 040 1 02 090 2 29 3 446 11 33 157 3 99 0787 2 PICK AND PLACE ORIGIN 958 24 32 118 3 28 998 25 35 059 1 50 28 278 7 06 463 11 76 503 12 76 RECOMENDED SOLDERING FOOTPRINT 1 470 37 34 1 460 37 08 116 2 95 1 380 35 05 1 371 34 82 1 250 31 75 1 239 31 47 740 18 80 0787 2 TYP 446 11 34 _ amp 363 9 2 7 8 D o an VDD 3 3V TO 5 input 1 1 20 ADO DIOO PB1 e 9 N 8 Dout PA2 2 BE 19 ADI DIO1 PBO um 3 BE 18 AD2 DIO3 SCLK DO8 MISO 4 DE 17 AD3 DIO3 SNSS qe
7. 9 12 nCTSIDIOY PAD MAX COMP Ground 10 11 AD4 DIO4 MOSI HEIGHT TOP 588555885 0 5 EEDEN TT ES 173 4 39 062 1 57 5 8 geese REF PCB THICKNESS 65558 5 a DOT 868 M1 ME Bre i DIMENSIONS In mm MultiConnect mDot MTDOT Developer Guide 13 CHAPTER 3 SPECIFICATIONS Chapter 3 Specifications 14 MTDOT Specifications Description ompatibility LoRaWAN 1 0 specifications mens SSCS orage Temperature 40 485 2096 9096 RH non condensing Operating Voltage Input Power MultiConnect mDot MTDOT Developer Guide CHAPTER 3 SPECIFICATIONS Category Description Transmission Max Transmitter 15 dBm 14 dBm Power Output TPO Maximum Receive 130 dBm 137 dBm Sensitivity Link Budget 154 dB Point to Multipoint 147 dB 145 dB Point to Multipoint 147 dB Point to Point to Point Point Max Effective 36 dBm 10 dBm Isotropic Radiated Power EiRP IEC 60950 1 2nd ED AM1 AM2 Weight is for the MTDOT xxx X1P SMA which is the heaviest model Greater link budget is possible with higher gain antenna 3Point to Multipoint using MultiTech Gateway with MT LORA accessory card Power Draw Note B Power measured with the mDot installed on the MTUDK2 developer board MTUDK2 supplied 3 3 VDC to the mDot B Power measured with mDot spreading factor SF set to 9 MultiConnect mDot MTDOT Developer Guide 15 CHAPTER 3 SPECIFIC
8. DO8MISO 4 nReset 5 PWMO RSSI CSCL PA8 6 PWM1 12CSDA 9 7 Reserved 8 nDTR SleepRQ D18 11 9 Ground 10 16 AD6 DIO6 RTS PA1 15 Associate AD5 DIO5 PC1 14 No connect 11 AD4 DIO4 MOSI 3 3V Output 4 Ground 25 Debug RX PA10 Debug TX PAS MTDOT 868 X1 SMA MTDOT 915 X1 SMA 10 1 766 44 85 1 470 37 34 1 239 31 47 740 18 80 502 12 75 g 2101 j 6 312 7 93 249 6 32 116 2 95 N N 1 510 38 35 1 194 30 34 363 9 23 407 10 35 010 0 25 0 ow wow NND Sy 111 2 82 8 5 8 MAX COMP HEIGHT 062 1 57 5 185 4 70 PCB THICKNESS 511 12 98 REF 326 8 281 rs 866 22 079 2 DIMENSIONS IN In mm MultiConnect mDot MTDOT Developer Guide CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTS MTDOT xxx X1 UFL 116 2 95 N N 0787 2 TYP 1 460 37 08 ale 1 380 35 05 TIT 1 155 29 34 1 371 34 82 4 194 30 34 1 250 31 75 1 239 31 47 020 0 51 740 18 80 SQUARE 363 9 23 407 10 35 010 0 25 olo o o 9o o VDD 3 3V TO 5V input 1 wu N C T FES WB 2 eee 111 2 82 Su 8 Tow 586 2599 88 5
9. AAMI standard This standard allows manufacturers to ensure that cardiac pacemakers and defibrillators are safe from cellular device EMI The FDA continues to monitor cellular devices for interactions with other medical devices If harmful interference occurs the FDA will assess the interference and work to resolve the problem Precautions for pacemaker wearers If EMI occurs it could affect a pacemaker in one of three ways Stop the pacemaker from delivering the stimulating pulses that regulate the heart s rhythm Cause the pacemaker to deliver the pulses irregularly Cause the pacemaker to ignore the heart s own rhythm and deliver pulses at a fixed rate Based on current research cellular devices do not pose a significant health problem for most pacemaker wearers However people with pacemakers may want to take simple precautions to be sure that their device doesn t cause a problem Keep the device on the opposite the side of the body from the pacemaker to add extra distance between the pacemaker and the device Avoid placing a turned on device next to the pacemaker for example don t carry the device in a shirt or jacket pocket directly over the pacemaker Device Maintenance When maintaining your device Do not attempt to disassemble the device There no user serviceable parts inside Do not expose your device to any extreme environment where the temperature or humidity is high Do not exp
10. ER PR 32 Developer 05 aS ud ag 32 Chapter 10 Board 60 33 Developer 33 Developer Board Connectors sae TB 35 Board COMPONENES RE Ne ku ERRORS 35 mnm 36 Chapter 11 Developer Board Installation annue e 37 Installing an mDot on the Developer Board 37 Pes 38 mDot Arduino 38 Installing Arduino Shield with an MDOt iii 38 RSMA to Cables 39 4 MultiConnect mDot MTDOT Developer Guide CONTENTS Connecting an Antenna through the Developer Board 39 Chapter 12 Developer Board 5 40 Block Diap ra tea danse 40 41 Chapter 13 Design 605100 30 46 Noise Suppression 46 Board Layout Guideline 46 User Accessible Areas iie 46 Electromagnetic Interference 3 esten sides 47 El
11. For other warranty options visit www multitech com es go World Headquarters Multi Tech Systems Inc 2205 Woodale Drive Mounds View MN 55112 Phone 800 328 9717 or 763 785 3500 Fax 763 785 9874 2 MultiConnect mDot MTDOT Developer Guide CONTENTS Contents Chapter 1 Product Overview 4 5 6 r M PEE 6 Documentation M 6 Related 6130 6 6 mbed Documentation 6 Programming the MDot Microcontroller sise 6 METAL RP E L 7 IMD Ot 1 7 e 7 Product ODUONS nit e 8 Chapter 2 Mechanical Drawings with 5 1 7 9 Pleni es OE oM 9 MT DOT XXX X1 SMA wes dees 10 1 1 11 1 5 12 MIT DOT RG ne 13 Chapter 3 0 14 MIT DOT Sp cifications nn dunes aes 14 15 Character EET ETE TED OLD LTD 16 Pin Information RE 16 mbot PINOUT D sigh
12. Multi Tech Systems Inc products relative to the EIP standards set by China s Ministry of Information Industry MIl Hazardous Toxic Substance Elements Name of the Component Lead Mercury Cadmium Hexavalent Polybromi Polybrominat Hg Chromium nated ed Diphenyl CR6 Biphenyl Ether PBDE PBB Printed Circuit Boards Resistors Capacitors Ferrite Beads Relays Opticals ICs Diodes Transistors gt lt Oscillators and Crystals Regulator Voltage Sensor Transformer Speaker Connectors LEDs Screws Nuts and other Hardware AC DC Power Supplies Software Documentation CDs Booklets and Paperwork Chassis X Represents that the concentration of such hazardous toxic substance in all the units of homogeneous material of such component is higher than the SJ Txxx 2006 Requirements for Concentration Limits O Represents that no such substances are used or that the concentration is within the aforementioned limits MultiConnect mDot MTDOT Developer Guide 29 CHAPTER 7 ENVIRONMENTAL NOTICES 30 Information on HS TS Substances According to Chinese Standards in Chinese ACHR HP Jo RATER P M E TAA ih EIP PRA RICE UFR SSM INE CE 39 90 RoHS Multi Tech Systems Inc hr A TS RA HS wet Be ACE 8 AEA DAE PK PB 2 Hg CD CR6 239 EET
13. Note The MTUDK2 ST Cell Developer Kit is also compatible with mDot devices Developer information in this section applies to either of these developer board models when used with mDots The MTUDK2 ST Cell model includes additional components which are used to develop with other devices Features USB and serial interfaces USB port for mbed development environment RS 232 DB 9 connector for serial interface Arduino shield socket Developer Kit Contents Your Developer Kit MTUDK2 ST MDOT includes the following Developer Board 1 MTUDK 2 0 mDot Developer Board Cables 1 Micro USB Cable 1 RSMA U FL Antenna Cables attached to developer board Antennas 1 868 945 MHz Antenna Customer Notices Quick Start Additional One promotional screwdriver 32 MultiConnect mDot MTDOT Developer Guide CHAPTER 10 BOARD COMPONENTS Chapter 10 Board Components Developer Board MultiConnect mDot MTDOT Developer Guide 33 CHAPTER 10 BOARD COMPONENTS 34 MultiConnect mDot MTDOT Developer Guide CHAPTER 10 BOARD COMPONENTS Developer Board Connectors JP95 Serial RS 232 DB 9 Enable LED Indicators STAT COM 0 5 EE UU 8 re z 8 BB Lis esl el 4 5 mbed usBe Connector 8B 5 88 8 Disconnect 5 Header 9 5 3 3 500 3 1
14. Set Addressing Commands Description Attention Personal Area Network ID High setting of 64 bit Address Low setting of 64 bit Address High setting of 64 bit Destination Address Low setting of 64 bit Destination Address MultiConnect mDot MTDOT Developer Guide 51 CHAPTER 14 AT COMMANDS Description ATJN Join Notification ATAR Aggregate Routing Notification Security Commands Command Description ATEE Encryption Enable ATEO Encryption Options ATNK Network Encryption Key 52 mDot MTDOT Developer Guide CHAPTER 14 AT COMMANDS Command Description ATKY Link Key RF Interfacing Commands Command Description Serial Interfacing Commands Command Description mDot MTDOT Developer Guide 53 INDEX Index A 20 cree 39 Arduino Shield 38 commands 49 XBee Zigbee 51 B block diagrammes 40 board components 35 build OPTIONS 8 Cables ms 39 Chinese hazardous substances Chinese version 30 English version 29 GECCH sos 24 Industry Canada 25 6 CONMECLOMS 35 D 46 dc c
15. a printed circuit board PCB Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment Any OEM board design must consider both on board and off board generated noise that can affect digital signal processing Both on board and off board generated noise that is coupled on board can affect interface signal levels and quality Noise in frequency ranges that affect modem performance is of particular concern On board generated electromagnetic interference EMI noise that can be radiated or conducted off board is equally important This type of noise can affect the operation of surrounding equipment Most local government agencies have certification requirements that must be met for use in specific environments Proper PC board layout component placement signal routing trace thickness and geometry and so on component selection composition value and tolerance interface connections and shielding are required for the board design to achieve desired modem performance and to attain EMI certification Other aspects of proper noise suppression engineering practices are beyond the scope of this guide Consult noise suppression techniques described in technical publications and journals electronics and electrical engineering text books and component supplier application notes PC Board Layout Guideline In a 4 layer design provide adequate ground plane covering the entire board In 4 layer desi
16. articles In light of the definition in 7 1 b which requires registration of an article only if it contains a regulated substance that is intended to be released under normal or reasonably foreseeable conditions of use Our analysis is that Multi Tech Systems Inc products constitute nonregisterable articles for their intended and anticipated use Substances of Very High Concern SVHC Per the candidate list of Substances of Very High Concern SVHC published October 28 2008 we have reviewed these substances and certify the Multi Tech Systems Inc products are compliant per the EU REACH requirements of less than 0 1 w w for each substance If new SVHC candidates are published by the European Chemicals Agency and relevant substances have been confirmed that exceeds greater than 0 1 w w Multi Tech Systems Inc will provide updated compliance status Multi Tech Systems Inc also declares it has been duly diligent in ensuring that the products supplied are compliant through a formalized process which includes collection and validation of materials declarations and selective materials analysis where appropriate This data is controlled as part of a formal quality system and will be made available upon request MultiConnect mDot MTDOT Developer Guide 27 CHAPTER 7 ENVIRONMENTAL NOTICES Restriction of the Use of Hazardous Substances RoHS aleju 2011 65 EU COMPLIANT Multi Tech Systems Inc Certificat
17. dans les d p ts de carburant dans les usines de produits chimiques ou dans les zones o des dynamitages sont en cours Suivez les restrictions relatives chaque type d environnement o vous utiliserez l appareil Ne placez pas l antenne en ext rieur teignez votre appareil sans fil dans les avions L utilisation d appareils lectroniques portables en avion est ill gale elle peut fortement perturber le fonctionnement de l appareil et d sactiver le r seau cellulaire S il ne respecte pas cette consigne le responsable peut voir son acc s aux services cellulaires suspendu ou interdit peut tre poursuivi en justice ou les deux teignez votre appareil sans fil proximit des pompes essence ou de diesel avant de remplir le r servoir de votre v hicule de carburant MultiConnect mDot MTDOT Developer Guide CHAPTER 5 SAFETY INFORMATION teignez votre appareil sans fil dans les h pitaux ou dans toutes les zones des appareils m dicaux sont susceptibles d tre utilis s Interference with Pacemakers and Other Medical Devices Potential interference Radiofrequency energy RF from cellular devices can interact with some electronic devices This is electromagnetic interference EMI The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices This test method is part of the Association for the Advancement of Medical Instrumentation
18. designer manufacturer and reseller has the sole responsibility of ensuring that any end user product into which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers MultiTech has no responsibility whatsoever for the integration configuration testing validation verification installation upgrade support or maintenance of such end user product or for any liabilities damages costs or expenses associated therewith except to the extent agreed upon in a signed written document To the extent MultiTech provides any comments or suggested changes related to the application of its products such comments or suggested changes is performed only as a courtesy and without any representation or warranty whatsoever Contacting MultiTech Knowledge Base The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products Visit http www multitech com kb go Support Portal To create an account and submit a support case directly to our technical support team visit https support multitech com Support Business Hours M F 8am to 5pm CT Country By Email By Phone Europe Middle East Africa support multitech co uk 44 118 959 7774 U S Canada all others support multitech com 800 972 2439 or 763 717 5863 Warranty To read the warranty statement for your product visit www multitech com warranty go
19. exigences du Reglement Canadien sur le mat riel brouilleur This device complies with Industry Canada RSS Appliance radio exempt from licensing The operation is permitted for the following two conditions 1 the device may not cause harmful interference and 2 the user of the device must accept any interference suffered even if the interference is likely to jeopardize the operation Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement MultiConnect mDot MTDOT Developer Guide 25 CHAPTER 7 ENVIRONMENTAL NOTICES Chapter 7 Environmental Notices 26 Waste Electrical and Electronic Equipment Statement Note This statement may be used in documentation for your final product applications WEEE Directive The WEEE Directive places an obligation on EU based manufacturers distributors retailers and importers to take back electronics products at the end of their useful life A sister directive ROHS Restriction of Hazardous Substances complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase The WEEE Directive covers all MultiTech
20. for use and should not be used or sold or re sold for use in connection with applications requiring fail safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death significant property damage or serious physical or environmental damage Examples of such use include life support machines or other life preserving medical devices or systems air traffic control or aircraft navigation or communications systems control equipment for nuclear facilities or missile nuclear biological or chemical weapons or other military applications Restricted Applications Use of the products in such Restricted Applications is at the user s sole risk and liability MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED TIMELY SECURE OR ERROR FREE NOR DOES MULTI TECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR COMMUNICATIONS NETWORK MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES DAMAGES OBLIGATIONS PENALTIES DEFICIENCIES LIABILITIES COSTS OR EXPENSES INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR COMMUNICATIONS NETWORK USING THE PRODUCTS The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech products as used in the final application The
21. guidelines are offered specifically to help minimize EMI generation Some of these guidelines are the same as or similar to the general guidelines To minimize the contribution of device based design to EMI you must understand the major sources of EMI and how to reduce them to acceptable levels B Keep traces carrying high frequency signals as short as possible Provide a good ground plane or grid In some cases multilayer board be required with full layers for ground and power distribution B Decouple power from ground with decoupling capacitors as close to the device s power pins as possible Eliminate ground loops which are unexpected current return paths to the power source and ground B Decouple the telephone line cables at the telephone line jacks Typically use a combination of series inductors common mode chokes and shunt capacitors Methods to decouple telephone lines are similar to decoupling power lines however telephone line decoupling may be more difficult and deserves additional attention A commonly used design aid is to place footprints for these components and populate as necessary during performance EMI testing and certification B Decouple the power cord at the power cord interface with decoupling capacitors Methods to decouple power lines are similar to decoupling telephone lines B Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits B Locate cables and c
22. products imported into the EU as of August 13 2005 EU based manufacturers distributors retailers and importers are obliged to finance the costs of recovery from municipal collection points reuse and recycling of specified percentages per the WEEE requirements Instructions for Disposal of WEEE by Users in the European Union The symbol shown below is on the product or on its packaging which indicates that this product must not be disposed of with other waste Instead it is the user s responsibility to dispose of their waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in manner that protects human health and the environment For more information about where you can drop off your waste equipment for recycling please contact your local city office your household waste disposal service or where you purchased the product July 2005 MultiConnect mDot MTDOT Developer Guide CHAPTER 7 ENVIRONMENTAL NOTICES REACH Statement Registration of Substances After careful review of the legislation and specifically the definition of an article as defined in EC Regulation 1907 2006 Title 1 Chapter 1 Article 7 1 a b it is our current view Multi Tech Systems Inc products would be considered as
23. radio frequency 22 18 related 6 28 RSMA to U FL cable 39 MultiConnect mDot MTDOT Developer Guide INDEX 5 safety RFiint rference teutates 22 safety standards chr 46 41 SMA to haste a 39 5063 14 22 s curit interf rences RF 22 U 39 USB design consideration esee 48 user responsibility 23 55
24. restrict the use of cellular devices Respect restrictions on the use of radio equipment in fuel depots chemical plants or where blasting operations are in process Follow restrictions for any environment where you operate the device Do not place the antenna outdoors Switch OFF your wireless device when in an aircraft Using portable electronic devices in an aircraft may endanger aircraft operation disrupt the cellular network and is illegal Failing to observe this restriction may lead to suspension or denial of cellular services to the offender legal action or both Switch OFF your wireless device when around gasoline or diesel fuel pumps and before filling your vehicle with fuel Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use S curit relative aux appareils a radiofr quence RF A cause du risque d interf rences de radiofr quence RF il est important de respecter toutes les r glementations sp ciales relatives aux quipements radio Suivez les conseils de s curit ci dessous Utiliser l appareil proximit d autres quipements lectroniques peut causer des interf rences si les quipements ne sont pas bien prot g s Respectez tous les panneaux d avertissement et les recommandations du fabricant Certains secteurs industriels et certaines entreprises limitent l utilisation des appareils cellulaires Respectez ces restrictions relatives aux quipements radio
25. 11 7 AD3 DIO3 SNSS 17 4 no connect no connect nDTR SleepRQ DI8 9 PA11 nRTS AD6 D106 16 1 no connect no connect nCTS DIO7 12 PAO ON nSleep 13 PC13 Dout 2 PA2 Din 3 PA3 Note When using an Arduino Shield with an mDot install the mDot on the developer board before installing the Arduino shield To use an Arduino Shield with an mDot 1 Disable the developer card s serial port by removing jumper from JP95 Jumper pins 1 2 Disable 05 on USB high Jumper pins 2 3 US always disabled Default jumper position is on pins 1 2 2 Align the Arduino Shield on the developer board as shown 38 MultiConnect mDot MTDOT Developer Guide CHAPTER 11 DEVELOPER BOARD INSTALLATION RSMA to U FL Cables The developer kit includes one 4 5 RSMA to U FL cables which is preinstalled on the developer board Connecting an Antenna through the Developer Board Connectors Depending on the mDot model either connect the antenna directly to the mDot or through the RSMA to U FL antenna cable on the developer board To connect an antenna to the device through the developer board 1 Finger tighten the antenna to the SMA connector 2 Attach the U FL connector from the cable connector on the device MultiConnect mDot MTDOT Developer Guide 39 CHAPTER 12 DEVELOPER BOARD SCHEMATICS ICS Chapter 12 Developer Board Schemat Block Diagram 310H ONLLNNOW 3010H VNN3INY S310H ONL
26. 5 1020 5 31545 JO NILUYM LNOHLIM 39 SIHL ONI 5 5 AG A13AI 012X3 SI ANY 30 134235 ONY 51 353 434 NOILONN3 134505 0120S 125 514 AGUS 5 050 218 ISOW 11Q NOD oF OLW 22 pesn jou gsn 158 ovr 17 194205 OLW 5 43 MultiConnect mDot MTDOT Developer Guide CHAPTER 12 DEVELOPER BOARD SCHEMATICS Q3Au3538 SLHOM TIV DM 5931545 531545 JO 1N3SNOD ML Vo suueys S 350804 0320008438 39 LON ONIMVEO SIHL NI 531545 SI ONY JO 134235 99 n ONY 1VI1N30I4NOO 4 5193534438 ONIMVUQ 9 350 4 5 1013 5 gt ywost andano H35010953N4 D 82 SNRIS dH AM 192 40 850 Le 918 0 aa
27. ATIONS Transmit power measured with mDot transmitting to a MultiConnect Conduit with MTAC LORA accessory card installed Distance separating the Conduit from the mDot was 18 inches Voltage Packet Average Current Average Current Total Inrush Charge Total Inrush Size Amps at Low Amps at Default Measured in Charge Duration Transmit Power Transmit Power Millicoulombs mC during Powerup Setting TXP 2 Setting TXP 11 5 DC Characteristics Description Max Min CCS Standard operating voltage Operating current mA 5V 5 135 00 3 3V Pin Information Using the mbed platform with the Cortex M4 processor expands your pin functionality options Refer to the document mDot Pin Function Mapping which is available at www multitech net developer multiconnect mdot and https developer mbed org platforms MTS mdot f411 for details Base Description Number Where applicabl 3 3 to 5 V input D08 MISO nReset PWMO RSSI CSC 16 MultiConnect mDot MTDOT Developer Guide CHAPTER 3 SPECIFICATIONS Base Description Number Where applicabl e 7 PWM1 12CSDA 1 Reserved PA11 nDTR SleepRQ D 18 10 Ground _ 15 1 Associate AD5 D 105 m m a _ m su m o _ x mewo m _ m _ MultiConnect mDot MTDOT Developer Guide 17 CHAPTER 3 SPECIFICATIONS 18 m
28. Dot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations All pins that go to connectors are direct connect Reset is the only pin with pull up O is 5V tolerant mDots allow you to program pins depending on your application B Serial Available out of the box See Serial Pinout Notes for details Xbee Comforms to the Xbee pinout Designed with the mbed STM32F411 RET 64 pin processor this option provides the most flexibility For more information about processor capabilities see the STM32F411 RET datasheet Note To program the mDot you need an mDot model with programming header Serial Pinout Notes Out of the box these pins are available for serial applications Refer to the mechanical drawing for your model for pin locations B 2 Dout TX 3 Din RX 9 12 CTS 13 On Sleep 16 RTS LoRa Data Rates Theoretical maximum speeds for LoRa mode with ACKs off are Using spreading factor 7 at 125kHz5 the data rate is 5470 bps 5 47 kbps Using spreading factor 7 at SOOkHz the data rate is 21900 bps 21 9 kbps Range Variables effecting the mDot range include TX power antenna gain RX sensitivity fade margin earth s curvature Use the following formula to calculate the maximum range TxPower Antenna gain total RX Sensitivity Fade Margin 36 56 _ 10610 10 20 iiS The following table provides example settings and the theore
29. LNNOW 3010H VNN3INY 310H ONLLNNOW 43010H VNN31INY S310H O1W 2WS SNOLLD3NNOD 38034 34025 3uv 9zf scr 15 4223 3 413 45 13 31 58 MultiConnect mDot MTDOT Developer Guide 40 CHAPTER 12 DEVELOPER BOARD SCHEMATICS 5 Schemat 531545 30 AN3SNOD ea a en ne 6 A SI ONY 30 134235 ONY 136084 S1N3538434 2 puwou ALEE anon pmen 45 04 58 SuOLSIS3H 1 09 0 3n04 54 NOLINS 13534 QNO OND QNO ant aszoseenn puou 5 05 anon ASE 530151539 AS 304 Wed 09069541 94 54 2 45 indu A6 3 5 41 MultiConnect mDot MTDOT Developer Guide CHAPTER 12 DEVELOPER BOARD SCHEMATICS z 1 uonisod 43dunf sn aiqesiq z suid u6iu ASN sn ajqesiq z 1 sud 564 22A Der YA
30. MULTITECH MultiConnect mDot MTDOT Developer Guide www multitech com MULTICONNECT MDOT DEVELOPER GUIDE MultiConnect mDot Developer Guide Models MTDOT 915 xxx MTDOT 868 xxx includes also the MTUDK2 ST MDOT Developer Kit Part Number S000612 Version 1 2 Copyright This publication may not be reproduced in whole or in part without the specific and express prior written permission signed by an executive officer of Multi Tech Systems Inc All rights reserved Copyright 2015 by Multi Tech Systems Inc Multi Tech Systems Inc makes no representations or warranties whether express implied or by estoppels with respect to the content information material and recommendations herein and specifically disclaims any implied warranties of merchantability fitness for any particular purpose and non infringement Multi Tech Systems Inc reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi Tech Systems Inc to notify any person or organization of such revisions or changes Trademarks and Registered Trademarks MultiTech and the MultiTech logo and MultiConnect are registered trademarks and mDot and Conduit are a trademark of Multi Tech Systems Inc All other products and technologies are the trademarks or registered trademarks of their respective holders Legal Notices The MultiTech products are not designed manufactured or intended
31. OUTS Chapter 2 Mechanical Drawings with Pinouts MTDOT xxx XP1 SMA 1 470 37 34 0787 2 1 460 37 08 1 380 35 05 1 155 29 34 1 250 31 75 1 194 30 34 1 239 31 47 020 0 51 740 18 80 SQUARE 407 10 35 117 2 98 070 1 78 010 0 25 S 0231058 o 0 o o gt Qo 0 5888 5 2 8 3 5 2 111 2 82 5 5 599 MAX COMP 5 HEIGHT TOP 062 1 57 0075 VDD 3 3V TO 5V input 1 PCB THICKNESS Dout PA2 2 Din 3 008 150 4 nReset 5 PWMO RSSI CSCL 6 20 AD0 DIO0 PB1 19 AD1 DI01 PB0 18 AD2 DIO3 SCLK PAS 17 AD3 DIO3 SNSS PA4 16 AD6 DIO6 RTS PA1 15 Associate ADS DIO5 PC1 PWM1 12CSDA 7 14 No connect 511 12 98 Reserved 8 13 ON Sleep PC13 nDTR SleepRQ D18 PATI 9 19 nCTSIDIO PAG REF 326 8 28 Ground 10 11 AD4 DIO4 MOSI 650 16 50 169 4 30 866 22 079 2 33520922 787 20 577088 MTDOT 868 X1P SMA MTDOT 915 X1P SMA DIMENSIONS IN In mm MultiConnect mDot MTDOT Developer Guide 9 CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTS MTDOT xxx X1 SMA 0787 2 TYP 1 155 29 Ll 020 0 51 SQUARE o 0 20 ADO DIOO PB1 19 AD1 DIO1 PBO 23 Ground 21 Ground VDD 3 3V 5V input 1 Dout PA2 2 Din PA3 3
32. Testing MultiTech strives to follow these recommendations Input protection circuitry is incorporated in MultiTech devices to minimize the effect of static buildup Take precautions to avoid exposure to electrostatic discharge during handling MTDOT Developer Guide 47 CHAPTER 13 DESIGN CONSIDERATIONS 48 MultiTech uses and recommends that others use anti static boxes that create a faraday cage packaging designed to exclude electromagnetic fields MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers USB Design MultiTech recommends that you review Intel s High Speed USB Platform Design Guidelines for information about USB signal routing impedance and layer stacking Also Shield USB cables with twisted pairs especially those containing D D m Use single 5V power supply for USB devices See Power Draw for current ampere requirements Route D D together in parallel with the trace spacing needed to achieve 90 ohms differential impedance for the USB pair and to maintain a 20 mil space from the USB pair and all other signals f power is provided externally use a common ground between the carrier board and the device MultiConnect mDot MTDOT Developer Guide CHAPTER 14 AT COMMANDS Chapter 14 AT Commands MultiTech AT Command Set General Commands Command Description Details AT Attention Atte
33. ca Europe and worldwide mDot simplifies local connectivity for Internet of Things loT applications mDot features an integrated Cortex processor and mbed compatible software library for developers to control monitor and bring edge intelligence to their Internet of Things loT applications Documentation Overview This manual is one part of mDot documentation Refer to the Related Documentation and mbed sections for additional information needed to program your mDot and integrate your application with the MultiConnect Conduit gateway This document includes the following sections mDot device information Mechanical drawings specifications safety and regulatory information and other device specific content Chapters 1 8 Universal Developer Kit information Using the MTUDK ST MDOT Developer Kit including design considerations schematics and installation and operation information Chapters 9 13 commands Includes both MultiTech and Xbee Zigbee AT Command sets Chapters 14 15 This manual is available at www multitech com support Related Documentation Use cases application notes LoRa information and documentation for related products such as the MultiConnect Conduit MTCDT gateway and the LoRa accessory card MTAC LORA are available on the MultiTech developer site This site information on using the Conduit with mDots Go to www multitech net mbed Documentation ARM mbed i
34. d test cases https developer mbed org platforms MTS mDot F411 EUI and Networking All mDots have factory programmed Extended Unique Identifier EUI This is marked as Node on the mDot label To connect an mDot to a network you will need to program it with the network ID for the network you are connecting to as well as the network key and application key For information on setting up mDots as part of a LoRa network go to www multitech net MultiConnect mDot MTDOT Developer Guide 7 CHAPTER 1 PRODUCT OVERVIEW Product Build Options Product Description Quanity to Order North America MTDOT 915 X1 SMA MTDOT 915 X1P SMA MTDOT 915 X1 UFL MTDOT 915 M1 UFL MTDOT 915 M1 TRC 915 MHz XBee LoRa SMA 915 MHz XBee LoRa SMA with Programming Header 1 50 1 915 MHz LoRa U FL 915 MHz SMT LoRa U FL 915 MHz SMT LoRa RF Pad 1 or 50 1 or 100 1 or 100 MTDOT 868 X1 SMA MDOT 868 X1P SMA MTDOT 868 X1 UFL MTDOT 868 M1 UFL MTDOT 868 M1 TRC 868 MHz XBee LoRa SMA 868 MHz XBee LoRa SMA with Programming Header 1 50 1 868 MHz LoRa U FL 868 MHz SMT LoRa U FL 868 MHz SMT LoRa RF Pad 1 or 50 1 or 100 1 or 100 Developer Kits MTUDK2 ST MDOT mDot Developer Kit Note The complete product code may end in Rx For example MTDOT 915 M1 X1 Rx where is revision and x is the revision number 8 MultiConnect mDot MTDOT Developer Guide CHAPTER 2 MECHANICAL DRAWINGS WITH PIN
35. e of Compliance 2011 65 EU Multi Tech Systems Inc confirms that its embedded products comply with the chemical concentration limitations set forth in the directive 2011 65 EU of the European Parliament Restriction of the use of certain Hazardous Substances in electrical and electronic equipment RoHS These MultiTech products do not contain the following banned chemicals Lead Pb gt 1000 PPM Mercury Hg gt 1000 PPM Hexavalent Chromium Cr 6 gt 1000 PPM Cadmium Cd gt 100 PPM Polybrominated Biphenyl gt 1000 PPM Polybrominated Diphenyl Ether PBDE gt 1000 PPM Environmental considerations Moisture Sensitivity Level MSL 21 Maximum Soldering temperature 2606 in SMT reflow oven usage in some components is exempted by the following RoHS annex therefore higher lead concentration would be found in some modules gt 1000 PPM Resistors containing lead in a glass or ceramic matrix compound 28 MultiConnect mDot MTDOT Developer Guide CHAPTER 7 ENVIRONMENTAL NOTICES Information on HS TS Substances According to Chinese Standards In accordance with China s Administrative Measures on the Control of Pollution Caused by Electronic Information Products EIP 39 also known as China RoHS the following information is provided regarding the names and concentration levels of Toxic Substances TS or Hazardous Substances HS which may be contained in
36. e us 23 USEF serene EEUU 23 Chapter 6 Regulatory Information sense pov ko taba ooa hav FERE es buy FERE aepo na 24 EMC Safety and R amp TTE Directive Compliance 24 47 CFR Part 15 Regulation Class B 24 FCC Interference Notice 24 0 24 Industry Canada Class 25 Chapter 7 Environmental 26 Waste Electrical and Electronic Equipment Statement 26 WEEE ae 26 Instructions for Disposal of WEEE by Users in the European Union 26 Mace 27 Registration OF Substances et 27 Substances of Very High Concern SVHC c cccccssscsesesssccececssececcecsseseseseseseeesesesecesesessecsceessecscsasseseesesaaeesesssaaeees 27 Restriction of the Use of Hazardous Substances RoHS 28 Information HS TS Substances According to Chinese Standards sse 29 Information on HS TS Substances According to Chinese Standards in Chinese 30 Chapter 8 Labels pee 31 Approvals and Certification maitre t nantes 31 Example 31 Chapter 9 Developer Kit 1 32 Developer Board 32 FO ACU
37. ectrostatic Discharge 60 47 USB DESIGN 48 Chapter 14 Command 49 MultiTech Command Set 49 General Cominands 49 Network Addressing 49 Radio Config Urat ON shed M 50 50 Serial Gata miode options 3 51 M lti tech 51 Standard XBee Zigbee AT Command Set 51 Addressing 51 Networking Commands 52 Sec rity Comimands nm nn O tte E 52 RF INtertacing 53 Serial Interfacing COMMANAS 53 54 mDot MTDOT Developer Guide 5 CHAPTER 1 PRODUCT OVERVIEW Chapter 1 Product Overview Overview The MultiConnect mDot is a secure programmable long range RF module that provides data connectivity to sensors industrial equipment and remote appliances By using the Semtech LoRa Long Range Spread Spectrum technology bi directional data communication can be maintained over 10 miles 16 km deep into buildings and within noisy environments using the unlicensed ISM bands in North Ameri
38. etwork Join Status 0 Not joined 1 Joined does this perform link check or just display last known state Network Link Check Perform network link check OK or ERROR Link Check Count Set number of packets between each link check if ACK s are disabled AES Encryption Enable disable AES encryption 0 off 1 on Signal Strength Displays signal strength of last received packet Signal To Noise Ratio Display signal to noise ratio received packets last minimum maximum average Data Pending Indicator of data in queue on server Send Ping Sends ping displays RSSI and SNR from gateway on pong Radio Configuration gt gt gt gt gt gt 5 gt 2 2 2 olo 0 Description Details Set the Tx spread factor for all channels 7 10 Set the Tx power for all channels Set Tx frequency TBD one channel or a list of channels map frequencies to channel numbers 0 902 7 1 902 9 etc Set Tx signal inverted default off AT RXDR Set the Rx spread factor for all channels 7 10 T RXF Set the Rx frequency for RECV RECVC Set the Rx timeout after a send in ms default 3000 Set the Rx output type O hexadecimal 1 binary Set Rx signal inverted default on Configure Forward Error Correction 1 to 4 Set CRC check on off Enable disable CRC checking of received packets 0 off 1 on Adaptive Data Rate Enable disable Adaptive Data Rate 0 off 1 on gt gt gt gt g
39. gns power and ground are typically on the inner layers Ensure that all power and ground traces are 0 05 inches wide The recommended hole size for the device pins is 0 036 in 0 003 in in diameter Use spacers to hold the device vertically in place during the wave solder process All creepages and clearances for the device meet requirements of safety standards listed in the technical specifications The requirements are based on a working voltage of 125V or 250V When implementing the recommended DAA circuit interface a third party design strictly follow all creepage and clearance requirements to meet safety standards The third party safety design must be evaluated by the appropriate national agency according to the required specification User Accessible Areas Based on where the third party design is marketed sold or used it may be necessary to provide an insulating cover over all TNV exposed areas Consult with the recognized safety agency to determine the requirements Note Even if the recommended design considerations are followed there are no guarantees that a particular system complies with all the necessary regulatory requirements Make sure a qualified and recognized agency evaluates specific designs DAA stands for Data Access Arrangement DAA is the device s telephone line interface 46 MultiConnect mDot MTDOT Developer Guide CHAPTER 13 DESIGN CONSIDERATIONS Electromagnetic Interference The following
40. gurations constituting a device for portable use lt 20 cm from human body require separate FCC IC approval Host Labeling The following statements are required to be on the host label This device contains FCC ID Add the FCC ID of the specific device This device contains equipment certified under IC ID Add the IC ID of the specific device For additional labeling requirements see the product s Labeling Requirements For the FCC and IC IDs see specific certificate information in the Regulatory Statement chapter mDot MTDOT Developer Guide 21 CHAPTER 5 SAFETY INFORMATION Chapter 5 Safety Information 22 Handling Precautions To avoid damage due to the accumulation of static charge use proper precautions when handling any cellular device Although input protection circuitry has been incorporated into the devices to minimize the effect of static build up use proper precautions to avoid exposure to electronic discharge during handling and mounting the device Radio Frequency RF Safety Due to the possibility of radio frequency RF interference it is important that you follow any special regulations regarding the use of radio equipment Follow the safety advice given below Operating your device close to other electronic equipment may cause interference if the equipment is inadequately protected Observe any warning signs and manufacturers recommendations Different industries and businesses
41. haracteristics 00 16 device maintenance dites 23 6 E electromagnetic interference 47 electrostatic discharge 47 EME P 46 47 ESD Oa ae oe IAE TE 47 P 7 Brant NOLES 20 FCC Notice 54 1855 EE 24 ground plane ERIS 46 H handling precautions due to 47 hazardous substances 28 host labeling 20 7 31 Industry Canada 25 inistall MDOt 37 interf rence des radiofr quences 22 K 447498 Section 8 sers 20 L labeling 20 ai 31 630 36 LoRa 18 M 23 6 mechanical 910111213 6 6 6 MultiConnect ss 6 N 7 MultiConnect mDot MTDOT Developer Guide 46 PACKING nn 32 PC board layout 46 piri informiatiOon 16 PINOUT notes 18 15 R
42. mplies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation FCC Notice The MTDOT x family of products are open development based products that contain a sub ghz radio technology MultiTech has certified for compliance with US and Foreign compliance bodies including FCC R amp TTE and others e g FCC 15 247 2015 amp IC RSS 210 2010 MultiConnect mDot MTDOT Developer Guide CHAPTER 6 REGULATORY INFORMATION MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified To ensure this level of compliance the software code is provided in binary form only Users are prohibited from making any changes that affect the operation of the radio performance Accessing or controlling the radio through any means other than the provided binary software will require the user to obtain their own intentional radiator license from the certification body governing their locality as all precertification provided with mDot will have been made invalid Industry Canada Class B Notice This Class B digital apparatus meets all requirements of the Canadian Interference Causing Equipment Regulations Cet appareil num rique de la classe B respecte toutes les
43. nReset 5 HX 16 ADS DIOG RTS lt PWMO RSSI CSCL 6 15 Associate AD5 DIO5 PC1 PWM1 12CSDA PC9 7 DE 14 No connect Pa 5 6 2 Ground 10 DE 11 lear Roue RASRERES lace 9509545 173 4 39 062 1 57 0075 5 REF PCB THICKNESS D MTDOT 868 M1 UFL MTDOT 915 M1 UFL DIMENSIONS IN In mm 12 MultiConnect mDot MTDOT Developer Guide CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTS MTDOT xxx M1 TRC 201 5 11 101 2 55 060 1 52 2 040 1 02 090 2 29 3 446 11 33 157 3 99 0787 2 TYP PICK AND PLACE ORIGIN 958 24 32 118 3 28 998 25 35 059 1 50 28 278 7 06 463 11 76 503 12 76 RECOMENDED SOLDERING FOOTPRINT 1 470 37 34 1 460 37 08 1 250 31 75 1 239 31 47 740 18 80 446 11 34 363 9 23 010 0 25 5 N 22 RF 21 Ground o0 sven VDD 3 3V TO 5V input 1 20 ADO DIOO PB1 222 Aaa Dout PA2 2 19 ADV DIO1 PBO T XO EE ae Din PA3 3 18 AD2IDIO3ISCLK PAS D08 MISO 4 17 AD3 DIO3 SNSS 4 22 nReset 5 16 AD6 DIOG RTS PWMO RSSIICSCL 6 15 Associate ADS DIO5 2 PCS 7 14 connect 111 2 82 eservel 13 ON Sleep 13 nDTR SleepRID18 PA11
44. nd 7 1 3 FCC Grant Notes The OEM should follow all the grant notes listed below Otherwise further testing and device approvals may be necessary MultiConnect mDot MTDOT Developer Guide CHAPTER 4 ANTENNAS FCC Definitions Portable 2 1093 A portable device is defined as a transmitting device designed to be used so that the radiating structure s of the device is are within 20 centimeters of the body of the user Mobile 2 1091 A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter s radiating structure s and the body of the user or nearby persons Actual content pending Grant This device is a mobile device with respect to RF exposure compliance The antenna s used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operate in conjunction with any other antenna or transmitter except in accordance with FCC multi transmitter product guidelines Installers and end users must be provided with specific information required to satisfy RF exposure compliance for installations and final host devices See note under Grant Limitations Compliance of this device in all final host configurations is the responsibility of the Grantee Note Host design confi
45. nditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation The label shown is not than actual size 1 MultiTech Model Identification 2 MultiTech Ordering Part Number 3 Device Node Number Example North America Package Label 94557141LF 1 gt MODEL MTDOT 915 1 MultiConnect mDot 2 ORDER P N MTDOT 9 5 X1 SMA 1 i 4 dc North America Device Label 1 9 Ress MULTITECH FOC ID AUTS2UISA SKU 94557141LF 3 MultiConnect mDot MTDOT Developer Guide Example EMEA Package Label 94557131LF 1 gt MODEL MTOOT 868 1 5 1 2 gt ORDER P N 868 1 1 MultiConnect mDot VA tage ren tre vagari M i EMEA Device Label SKU 94557131LF Serial zoxo0or d 2080827 31 CHAPTER 9 DEVELOPER KIT OVERVIEW Chapter 9 Developer Kit Overview Developer Board Overview The MTUDK2 ST MDOT Developer Kit supports development with mDot devices Use the developer board to streamline your development efforts and evaluate your products and applications Easily plug in your communications device and use the developer kit for testing programming and evaluation
46. ntion returns OK AT Request 14 Shows model version info Reset CPU Reset the CPU AT ATl ATZ ATEO 1 ATEO disable ATE1 enable ATVO 1 ATVO disable ATV1 enable Reset current configuration to factory defaults Save configuration to flash memory Displays current settings and status 0 AT command mode 1 Serial data mode Network Addressing Commands Set frequency band 868 or 915 Set the frequency sub band for US 915 0 1 8 Enable disable public network mode 0 off 1 on Device EUI unique set at factory 8 bytes Network address devAddr in LoraMac 4 bytes Command Description Details K Network Session Key Network session encryption key 16 bytes K Data Session Key Data session encryption key App session keyin LoraMac 16 bytes A A AT DI AT NA AT NS AT DS A K A Network ID Configured Network EUI Name App EUI in LoraMac AT NI 0 hex AT NI 1 network_name Net ID crc64 network_name 8 bytes AT JOIN Join Network Join network acquire network address and session keys A JM Network Join Mode 0 Manual configuration 1 OTA Network Join 2 Auto OTA Network Join on start up default 1 MultiConnect mDot MTDOT Developer Guide 49 Network Key Configured network key passphrase App Key in LoraMac AT NK 0 hex AT NK 1 passphrase Net key cmac passphrase 16 bytes T F T D T N T N T D T N T N T N CHAPTER 14 AT COMMANDS Description Details N
47. on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity 47 CFR Part 15 Regulation Class B Devices This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference ina residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help Warning Changes modifications to this unit not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment FCC Interference Notice Per FCC 15 19 a 3 and a 4 This device co
48. onnectors to avoid coupling from high frequency circuits Lay out the highest frequency signal traces next to the ground grid If using a multilayer board design make no cuts the ground or power planes and be sure the ground plane covers all traces Minimize the number of through hole connections on traces carrying high frequency signals Avoid right angle turns on high frequency traces Forty five degree corners are good however radius turns are better On 2 layer boards with no ground grid provide a shadow ground trace on the opposite side of the board to traces carrying high frequency signals This will be effective as a high frequency ground return if it is three times the width of the signal traces Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point Electrostatic Discharge Control Handle all electronic devices with precautions to avoid damage due to the static charge accumulation See the ANSI ESD Association Standard ANSI ESD S20 20 1999 a document for the Development of an Electrostatic Discharge Control for Protection of Electrical and Electronic Parts Assemblies and Equipment This document covers ESD Control Program Administrative Requirements ESD Training ESD Control Program Plan Technical Requirements grounding bonding systems personnel grooming protected areas packaging marking equipment and handling and Sensitivity
49. ose the device to water rain or spilled beverages It is not waterproof Do not place the device alongside computer discs credit or travel cards or other magnetic media The information contained on discs or cards may be affected by the device Using accessories such as antennas that MultiTech has not authorized or that are not compliant with MultiTech s accessory specifications may invalidate the warranty If the device is not working properly contact MultiTech Technical Support User Responsibility Respect all local regulations for operating your wireless device Use the security features to block unauthorized use and theft MultiConnect mDot MTDOT Developer Guide 23 CHAPTER 6 REGULATORY INFORMATION Chapter 6 Regulatory Information 24 EMC Safety and R amp TTE Directive Compliance The CE mark is affixed to this product to confirm compliance with the following European Community Directives Council Directive 2004 108 EC of 15 December 2004 on the approximation of the laws of Member States relating to electromagnetic compatibility and Council Directive 2006 95 EC of 12 December 2006 on the harmonization of the laws of Member States relating to electrical equipment designed for use within certain voltage limits and Council Directive 2011 65 EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment and Council Directive 1999 5 EC of 9 March 1999
50. s a free open source platform and operating system for embedded devices using the ARM Coretx M microcontrollers The mbed website provides free software libraries hardware designs and online tools for rapid prototyping of products The platform includes a standards based C C SDK a microcontroller HDK and supported development boards an online compiler and online developer collaboration tools Note To use the mDot mbed code you need LoRaWAN 1 0 gateway such as MultTech s MultiConnect Conduit MTCDT with an MTAC LORA accessory card installed Programming the mDot Microcontroller With the mDot and the MTUDK2 ST xx developer board use the ARM mbed ecosystem to program the microcontroller Compile in the cloud or locally copy the resulting binary file to the mbed USB drive and reset the mDot 6 MultiConnect mDot MTDOT Developer Guide CHAPTER 1 PRODUCT OVERVIEW Note To program the mDot you need an mDot model with programming header On the mDot mbed page MultiTech supplies source code for non RF portions of the mDot and MTAC LORA cards To comply with FCC and ETSI certification some portions of the software will be available only as binary libraries mBed Links Explore mbed http developer mbed org explore Getting Started with mbed http developer mbed org getting started mbed Handbook http developer mbed org handbook Homepage mDot Platform The mDot mbed page includes the mDot library an
51. t gt gt gt gt gt gt D Ra 4 4 4315515 5 351313 SE ol gt lt lt lt 2 I 2 Send Receive Description Details Require Send ACK Enable to require send acknowledgement 0 off N number of retries until ACK recevied Sends supplied packet data one time and return response 50 MultiConnect mDot MTDOT Developer Guide CHAPTER 14 AT COMMANDS Command Description Details AT SENDB Send Binary Sends supplied binary hex packet data one time and return response AT SENDH Send Once High BW Sends supplied packet data one time and return response using High Bandwidth channel max 240 bytes AT SENDI Send Interval Sends supplied packet data on interval escape sequence AT RECV Receive Once Receive and display one packet optional timeout argument N milliseconds AT RECVC Continously receive and display packets escape sequence Serial data mode options Command Description Details AT SD Enter serial data mode Reads serial data and sends Lora packets escape sequence AT SDWI Serial wake interval Serial data wakeup interval to generate wake signal milliseconds AT SDTO Serial receive timeout Read serial data until timeout milliseconds AT SDWD Serial Wake Delay Time to wait for data after wakeup signal milliseconds MultiTech Debug Description Details Standard XBee Zigbee AT Command
52. tical maximum range based on these settings Example 18dB Transmit Power for Units Example 14dB Transmit Power for 915 MHz Models 868MHz Models MultiConnect mDot MTDOT Developer Guide CHAPTER 3 SPECIFICATIONS Example 18dB Transmit Power for Units Example 14dB Transmit Power for 915 MHz Models 868MHz Models EE m B m B Raw o 9 _ Distance ju o S8 _ MultiConnect mDot MTDOT Developer Guide 19 CHAPTER 4 ANTENNAS Chapter 4 Antennas 20 Antenna System The LoRa antenna performance depends on the implementation and antenna design The integration of the antenna system into the product is a critical part of the design process therefore it is essential to consider it early so the performance is not compromised If changes are made to the device s certified antenna system then recertification will be required Pulse Electronics Antenna Manufacturer Pulse Electronics Description 868 915 MHz RP SMA Antenna 8 Model Number W1063 MultiTech Part Number 45009830L MultiTech ordering information Ordering Part Number Quantity Antenna Specifications Category Description Frequency Range 868 928 MHz OEM Integration FCC amp IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations 47 C F R 15 19 a 3 15 21 15 105 and RSS Gen Issue 3 Dec 2010 7 1 2 a
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