BGA Rework Station TOUCHBGA GM390
Contents
1. do not use flammable spray liquid gas 5 Don t try to redo the rework station or will cause fire or electric shock 6 There are high voltage parts in electric box don t take part or remove without permission 7 If there is metallic object or liquid fall into rework station shut off the power immediately unplug power line and completely remove the object and dirt after the station get cooling If having residue will emit odor after rework 8 When rework station abnormal heating up or smoke shut off the power immediately notify the technician repair partly shut off power when move electric box or machine hold the plug when unplug the wire otherwise will cause poor contact cannot work 9 Shut off the power when stop use 10 Rework station do not press or run over line or communication cable of other equipments power otherwise may cause equipment malfunction or cause fire or electric shock 11 Before operating the rework station must read this introduction manual carefully touchbga com 3 BGA Rework Station Main Specification gt o wt U d en ieee e pr touchbga com Station description 1 Up Down Front Back For adjusting up and down Adjustment Handle front and back the top heater 2 LED Light For lighting AM 3 Removable hot air Can be changed in case of chip nozzle size 4 Cooling Fan For cooling after heating set by touch screen 5 Temp PCB sensor For checking the real Plug in the soc2. of surface of Tim Sweat and soldering pad 8 Welding Put PCB on the position support of rework station select the appropriate hot air reflow nozzle set proper welding temperature curve start heating inching switch run touchbga com soldering procedure stop running front BGA cooling fan start cool BGA improve hot air point make hot air nozzle above on surface of BGA 8 10mm and keep cooling 30 40 seconds or after the start switch light power off move hot air head and then take awav the PCB board from bottom heating area position stably a Missing Solder because of manually counterpoint will make deviation between chips and solder pad Tension of tin sweat surface will make a process of correct the place between BGA chips and pad automatically Because of uneven heating leading the chip fall unevenly if stopping reflowing now the chip will not fall normally resulting in non co planarity phenomenon and then cause missing solder and cold solder so need extend the time of temperature of third and forth section THERMATICS our enhance the pre heating temperature at bottom melt tin sweat and fall evenly b Short Circuit The tin sweat is liquid when get melting point the extension and Support function of tin sweat support will be damaged when suffer over time over heat temperature or over press and then lead short circuit because of chip fall on the PCB pad completely while reflowing Hence we need decrease temperature and time o
3. 5MM up to the upper surface of BGA and keep cool for 30 to 40 seconds or remove the main heater after turning off the start switch lights then remove the PCB board from the rack pan 5 Before BGA installation you must check whether the PCB board by chip and BGA solder ball pad is good BGA chip must be carried out by visual inspection after soldering If something is unusual one should stop the installation of BGA and test the temperature one cannot weld it before it is adjusted properly otherwise it may damage the BGA or the PCB board 6 The surface of the machine should be cleaned regularly in particular keep the clean of Infrared heating board to prevent dirt accumulating in the top which will affect the normal heat radiation resulting in poor welding quality and shortening the life of infrared heater If the heating unit is burned due to this reason the Company will not be responsible for free replacement touchbga com Concluding Remarks In production areas of electronic products especiallv computer and communications electronics products the component is developing to the miniaturization multi function green orientation various packaging technologies continue to emerge BGA CSP is the mainstream of packaging technology nowadays To meet the rapidly growing demand of circuit assembly of BGA devices manufacturers need to choose safer more convenient and more efficient assembly and rework equipment technology Enclo
4. 99 9 999 9 999 9 999 9 999 9 PERN ABAD DWELL sen 99 0 E 9 9 99 9 9 9 Modifv and save temperature curve often used Set the heating temperature constant temperature time heating speed required bv production craft this product can store the temperature curve up to 50 groups Save various production craft specifications in svstem call it directiv when meet different production craft Means the Formula stored in svstem because the heating temperature is different while different products using We could save different specification in different formula When change the product do not modifv the specification much just click call the corresponding formula Click the Enter kev numerical value at the pop up touchbga com LEE E Hr Enter the modified data press Finished setting Temperature specification of Three THERMATICS click then all specification set just now have stored under the name serial number of present formula Also can get the asked temperature curve directly through The formula noted 0 49 enter corresponding serial NO Click the running temperature curve of heating Or save the modified temperature specification in present interface through 4 Click touchbga com Heating finished Svstem will run cooling and vacuum as Counting bv second or manuallv control cooling and vacuum state bv after went into manual whether heating or not vacuum
5. cuum suction pen remove BGA 3 Clean the welding Cleaning of PCB and BGA welding pad one is use the suction tin line tow to same level another is use soldering iron drag smooth directly It is best remove soldering tin in a short time after remove BGA while BGA not cooling totally less damage of temperature difference to welding pad Use soldering flux in the process of removing solder can improve the solder activity conducive to the removal of solder Especially pay attention to do not damage the welding pad of PCB for ensuring reliability of BGA welding try to use some strong volatile solvent washer industrial alcohol during clean the remain solder paste on solder pad 4 BGA REBALLING Evenly coated solder paste on BGA pad with a brush select the corresponding REBALLING steel mesh use REBALLING STATION plant BGA tin sweat on corresponding BGA pad 5 BGA Tin Sweat Welding Heating the bottom of Tin sweat station and rework station heating zone solder the tin sweat on BGA pad 6 Spread soldering flux Spread a layer of solder flux on PCB pad with a brush too much will cause soldering together on the other hand too less will cause missing soldering thus for clean the dirt on BGA tin sweat enhance soldering effect solder paste must be spread appropriately 7 Mount Mount BGA on PCB when counterpoint by hand use silk screen print frame line helps counterpoint confirming whether mount BGA in counterpoint by hand touch feeling
6. ecifications but this specification will not be saved in inner of procedure only be used in the heating curve after start at this specification To save please read formula setting content return to curve interface mm the whole machine get into start heating the running heating curve is specification as above described specification meantime clean out last curve show on screen Under normal operation when top target temperature and heating speed is zero the whole process finished machine stop work hear Roar sound if have set cooling and vacuum state in cooling vacuum interface the output of cooling and vacuum will run GA running the whole machine will ue current state is the Click go into temperature holding state the three group of heating temperature output will When running this button will shine notify that the whole machine remain at present temperature running in constant temperature till to re a mm return to normal heating state Click popup function select interface touchbga com The default pass word is 8888 after enter the code and enter into PID specification setting touchbga com TOP malo om mom COLD a SRR All specifications have been set before leave factory no need change 3 Click ee will appear follow image SLOPE 1 SLOPE 2 SLOPE 3 SLOPE 4 SLOPE 5 SLOPE 6 mp 999 9 999 9 999 9 999 9 999 9 DWELL HEATING E BOTTOM rmp 999 9 9
7. f the third and forth heating section or decrease the preheating temperature at bottom Note Will appear small quantity ozone when reword station using in order to ensure a comfortable healthy and safe operating environment please keep good air circulation touchbga com 5 BGA Rework Station Touch Screen Operation Operation Introduction A Open the control power supply rework station is powered You will see like the below interface 300 0 TARGET 225 0 TOP TEMP 150 0 888 8 BOTTOM 0 0 00 00 00 00 00 01 00 02 00 03 00 04 00 05 Feature And then will appear top target temperature top actual temperate bottom actual temperature actual thermostatic temperature of the third THERMATIC preheating temperature at bottom outer actual temperature from up to down at the right side of the touch screen TANN OPTY Tel TEKMI ELE S MA L KATKERA MAL Curves on image are Tope target temperature blue top target actual temperature red bottom actual temperature green infrared actual temperature purple out tested actual temperature touchbga com Click enter into each asked specification of running after start heating These specifications are the target temperature holding temperature time heating up speed Second is the unit of heating up speed three THERMATIC of Top infrared can set 6 section heating up 6section temperature holding curve model at this interface also can modify the sp
8. ket temperature of the PCB temperature test wire Touch Screen For operating the machine Look the follow user manual 1st Top HR Heater For heating chip Set by touch O O 10 2nd Bottom HR Heater For heating PCB Set by touch TTT Les 11 3rd Bottom IR Heater For heating PCB Set bv touch em Main parameters Total Power 5450W Top heater LOOOW HR 450W IR 300W CHX Bottom heater 2nd heater 1000W 3rd Infrared Radiation heater 2700W Power supply AC 220V 230V 50 60HZ Dimensions 520x500x560mm Temperature Control High precision K type thermocouple 7 Knob Screw for PCB For locking the platform handle Positioning V shaped slot PCB positioning PCB size Max PCB size 375 335mm Min PCB size 40 40mm Size of bottom heating area 355 240mm O don A Ww BR WN FP 10 Electrical material Highly sensitive temperature control Touch screen PLC 11 Machine weight 28kg touchbga com Description 1 This product adopt 4 3 HD touch screen Human Machine Interaction HMI PLC Control real time display five temperature curve temperature precision be controlled in degree 2 6 section temperature controls can further refine the temperature of each solder segment to better ensure the welding effect 3 Can save 0 49 group of temperature curve setting analyze the curve and change the setting on touch screen anytime 4 There are 3 heating zones to heating separately can control multi group multi secti
9. on temperature in the 3 heating zones at same time ensure achieve the best welding effect in different heating zones Heating temperature time slope cooling vacuum all can be set on HMI 5 Select high precision K Type thermocouple closed loop control detect temperature precisely through the external temperature testing interface 6 Have alarm function after finish unsolder have over temperature protection circuit around the whole machine stop heating and alarm when abnormal over temperature 7 Use High Cross flow Fan cool PCB board promptly in case the deformation of PCB board ensure the welding effect 7 Use V Shape groove address the PCB Flexible removable have the function of protect PCB 8 For large thermal capacity PCB and other high temperature requirements both lead free BGA CSP and column BGA can deal with easily 9 Hot air nozzles can 360 degree rotation easy to replace With a variety size of hot air nozzle special requirements can be customized touchbga com BGA Rework Station Operation Steps 1 Pre heating Pre heat PCB and BGA before rework in case of bursting while rework temperature of constant temperature oven is generally set at 80 C 100 C time often are 12 24hours 2 Disassembly Put PCB on the position support of rework station select the appropriate hot air reflow nozzle set proper welding temperature curve pull the start switch when procedure run over move the hot air manually use va
10. onstant Temperature Time CC eege touchbga com 33733 BGA Solder Temperature Setting Preheating Temperature Heating up lA Et Temperature section Molding section SE SEH drop section section p Top Heating E Constant Temperature Time Heating Constant Temperature 30 30 35 40 Time Constant Temperature Slope 2 2 192 1 21 Above is reference for lead BGA temperature Curve touchbga com Lead free temperature curve solder 47 47 BGA Solder temperatures setting Preheating ae lee Heating solder Solder Temperature section A N ten section 1 section 2 drop section a Temperature Time Constant Temperature 30 30 35 55 25 Time Infrared Time Constant Temperature Preheating Temperature Heating up Solder Solder Temperature section Holding section SECUQIU Sector _ section Ear Ad a EM Top Heating Heating Temperature 30 Time Es ee pe be PO Heating Temperature 30 30 35 45 25 Time Constant Temperature Time soe ee touchbga com 33733 BGA Solder Temperature Setting Temperatur oe Solder Solder Temperature Preheating section e holding q SCH drop EDM sion EU Top Heating Heating Constant Temperature 30 30 35 40 20 Time Bottom Heating 165 teo 20 20 ats Constant Temperature 30 30 35 40 20 Time Constant Temperature 30 30 35 40 20 Time 2 2 223 2 Above is reference for lead free BGA temperature Curve If you want
11. se Packing List pe Touch BGA Rework Station GM390 screen CT mee Wee Loes C sf 4 thermometricwie La EEGENEN e mae In remm ie 8 mmm e o sumer O nm sponsers e
12. suction alwavs worked click cooling manual button only stop heating then output heating start output stop for having enough time take awav the suction pen suggest that when remove chip set the cooling to zero This machine can real time monitor the rotating speed of cooling fan of up down hot air also can set the min rotating speed Fan stop work or rotating speed less than set data during heating and up down hot air data high than 300 degree svstem will stop heating immediatelv alarm at same time whole machine turn to cooling state will show where is the trouble on main interface can help worker find the trouble in a short time Caution While alarm due to trouble all functional button will be locked It cannot work still after deal with the trouble power off Temperature specification often used as following Lead solder temperature curve touchbga com 47747 BGA Solder temperatures setting Preheating est rengt Heating up Solder Solder Temperature section oer eg section section 1 jsection2 drop section Top Heating Heating Constant Temperature Time Es el as Heating Constant Temperature 30 30 39 Time Constant Temperature 41941 BGA Solder Temperature Setting Preheating he Heating up Solder paced Temperature section a section section 1 2 drop section Constant Temperature 30 30 35 40 Time Bottom Heating mm oas f ew o Constant Temperature 30 30 35 40 Time Infrared Time C
13. to dismantle BGA it is enough to set the value of temperature drop section as 0 touchbga com 6 BGA Rework Station Handling Precautions 1 Open repair station power switch first check whether there is cold wind blowing in the upper hot lips and lower hot lips If no wind blowing out don t use the start switch otherwise it will burn the up and bottom main heater the bottom of the all infrared heating area is controlled with the switch Vou can choose the bottom of the infrared heating area according to the size of PCB board 2 Rework different BGA it needs to set different temperature curve the maximum temperature of each segment setting cannot exceed 300 C When rework with lead free one can set according to welding temperature curve reference of BGA solder beads 3 When dismantle BGA first transfer cooling fan and vacuum gear to the automatic gear when the temperature curve operation is end the buzzer alarms automatically at this time quickly suck away BGA from the PCB board with vacuum suction pen and then remove PCB board holder from the location grid 4 While soldering the BGA first transfer cooling fan is to the manual gear turn off the vacuum When the temperature curve operation is end buzzer alarms automatically the cooling fan starts to cool the heating area BGA and the down heating zone Hot air chills cold wind at the same time Then upgrade the main heater at the top so that the bottom of hot air nozzle is 3
14. touchbga com BGA Rework Station TOUCHBGA GM390 User Manual 1 BGA Rework Station Setting Up 2 BGA Rework Station Safetv Precautions 3 BGA Rework Station Main Specification 4 BGA Rework Station Operation Steps 5 BGA Rework Station Touch Screen Operation 6 BGA Rework Station Handling Precautions Enclose Packing List touchbga com 1 BGA Rework Station Setting Up a Installation Location In order to ensure the service life of rework station the installation must meet the following conditions Away from flammable explosive materials Don t spilled by water and other liquid Well ventilated and Dry Place Stable Smooth less vibrate place Little dusty place Don t put anything on control box Away from the place affected by the direct flow of air condition heater and fan SE e E EAL get E S For upper part easv move and turn Make more than 30cm match at the back of rework station b Power supplv requirements Use small fluctuant voltage power supply Voltage 220V 10 Frequency 50Hz 3 2 BGA Rework Station Safety Precautions 1 Don t blow the rework station directly when it work or will lead the negative differential of the surface of the heating plate burned the parts 2 After starting up high temperature heat area cannot contact anything directly or may cause fire or explosion PCB board should be put on the PCB board support 3 Don t shake rework station move lightly 4 After starting up
Download Pdf Manuals
Related Search