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MEMSPro tutorial

1. length gt E T inner gap L outer gap 7 width Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 609 Ground Plate S_ GDPLATE_1 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Cell groundplate Macro MEMSLIB DLL Description Generates a ground plate on the Poly0 layer Parameter List The following table provides the ground plate parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Ground plate width width 300 um plate_width Ground plate length length 600 um plate_length S Edit Symbol Name S_GDPLATE_1 S Edit Test Schematic N A Contents Index MEMSLib Reference Resonator Elements Ground Plate Rectangular Plane Parameters S_GDPLATE_1 Layout Parameter Entry Dialog Box width lt length Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 611 Bonding Pad S_PAD_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Cell bpad Macro MEMSLIB DLL Description Generates a bonding pad Parameter List The following table provides the bonding pad parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Pad width width 100 um pad_width Pad length length 100 um pad_length S
2. Figure 90 Customizing the AC analysis Next we need to select the parameters of interest in our model Left click into the work area to invoke the T Spice Command Tool dialog again MEMS Pro User Guide Contents Index 443 Optimization Tutorial Setting up the Optimization i In the left tree double click Settings and then Parameters Add the springlength parameter statement Set Parameter name to springlength and Parameter value to 100e 6 Figure 91 Click Add Click Insert Command T Spice Command Tool nalysis urent source Bus definition lobal nodes 1008 6 imulation options E Optimization Add Delete ea springlength 100e 6 Figure 91 Customizing the setting parameters Now we define the quantities that will be measured during the simulation MEMS Pro User Guide Contents Index 444 Optimization Tutorial Setting up the Optimization Left click into the work area to invoke the T Spice Command Tool dialog again In the left tree double click Output and then Measure Set Analysis type to AC and Measurement type to Find when Enter res_freq into the Measurement result name field Under Find click the x value radio button Under When click the Signal radio button and enter vp rtm Set equals value to 90 From the drop down menu next to on select crossing For number select 7 Figure 92 Click Insert Command T Spice Command Tool C small signal model DC result
3. Figure 13 Chart Options dialog The chart title can also be customized if you wish MEMS Pro User Guide Contents Index 52 5i In the General tab of the Chart Options dialog set the Chart title to Lateral Comb drive Resonator and click OK Lateral Comb Drive Resonator Displacement rtm um ts 104004 138004 1654004 2 0E 004 2 54004 3254004 40E 004 5 0E4004 6354004 79EH004 104005 Frequency Hz Figure 14 Customizing the amplitude wave form You may want to measure specific values on the chart Cursors are vertical lines horizontal lines or points that can be used to identify locations on the trace for measuring The vertical and horizontal line cursors extend to the full height or length of the chart As the line cursors are moved around the chart their Contents Index coordinates appear at the margins of the chart window We demonstrate the use of Vertical Bar cursors below Select Chart gt Cursors gt Vertical Bars Two vertical cursors should appear on the chart They can be dragged with the left mouse button Their X axis locations x1 and x2 and the difference in X axis locations dx are displayed on the top left corner of the chart window The Y axis location of the moving or last moved cursor is displayed under the trace name on the right side of the chart Position the left bar so that it lines up with the tip of the trace peak Select View gt Mouse Zoom Click
4. Contents Index Library Palette MEMSCAP BEI Active Elements Passive Elements Test Elements Resonator Elements kan w H HH al Linear Comb Drive Motor ALAA a 88 3 a I 1 n alrgaj r airgap 47 Hide Details lt lt f rywiath sywidth Figure 126 Enlarged Library Palette dialog box The Show Details button has changed to the Hide Details button By selecting this button you revert the Library Palette dialog box to its initial size and the Show Details button appears again Contents Index MEMSLib Reference Accessing the MEMS Library Palette Editing the Generated Layout Parameters To edit a generated layout select it and choose Tools gt Edit Component in the MEMS Pro Palette The device parameters dialog box Figure 127 appears with the parameters values filled in Change these values and click OK The layout is automatically updated Array of Guckel Rings Parameters S_GURINGS_1 Figure 127 Parameters dialog box for the array of Guckel rings MEMS Pro User Guide Contents Index 530 MEMSLib Reference Accessing the MEMS Library Palette MEMSLib L Edit Library Page Library L Edit File MEMSLIB TDB Cell Library Macro MEMSLIB DLL Library Palette MEMSCAP E Library Palette MEMSCAP m H e A alaa AEE Figure 128 Various available library elements MEMS Pro User Guide Contents Index 531 Active Elements Linear Electrostatic Comb D
5. MEMS Pro User Guide Contents Index Click the Run Simulation button located in the Simulation toolbar to run Click Start Simulation in the Run Simulation dialog The AC analysis that you 43 The Simulation Output window will appear displaying simulation statistics and progress information as well as any warning or error messages During the AC analysis simulation results are recorded Once the simulation is complete you may examine the analysis results using the S Edit Probe tool Contents Index Probing a Waveform Note The waveform probe is used to browse through an S Edit design and probe nodes to examine circuit simulation results for the specified node When a node is probed S Edit invokes W Edit which automatically displays the waveform corresponding to the simulation results for that node W Edit can also be launched from T Spice by selecting Window gt Show Waveform Viewer or by clicking the W Edit button from the T Spice toolbar In this tutorial we will invoke W Edit from S Edit using the probing feature For more information on waveform probing see Waveform Probing on page 243 of the S Edit User Guide and Reference Click somewhere in the S Edit schematic window that contains the resonator schematic to re activate S Edit Click the Probe tool l located on the Schematic toolbar The cursor now has the shape of the Probe tool Left click with the Probe tool on the rtm node During waveform probing
6. Electrical ground m Plane of symetry xz Computed capacitance Bias voltage Figure 71 Electrostatically actuated micro mirror description Contents Index Reduced Order Modeling ROM Tutorial Model Generation First provide a finite element model of your structure In this example run a macro You can use other tools the GUI for example to do this MV Copy the following files to your working directory gen_esman macro esman mdl esman elec esman str They are all located under the same tutorial directory Vv In the ANSYS Input window execute the macro that generates the model of the electrostatically actuated micro mirror and related Physics Files USE gen_esman macro ANSYS Input Figure 72 ANSYS Input window The ANSYS Graphics EPLOT window shows the 3D view of the model and its meshing Figure 71 MEMS Pro User Guide Contents Index 410 Reduced Order Modeling ROM Tutorial Performing Reduction You now have to define a single degree of freedom to which the model will be reduced In this example you are interested in the model behavior at a particular node that has a number attributed to the N_ MASTER variable see the model description macro It is the node located at the end of the top face in the symmetry plane In this example you chose to use the vertical displacement as master degree of freedom Mw Set the degree of freedom to Master Dof by entering the following command i
7. Generating Concentric Circles 168 NSO AGO EE cus tees oon tet E ied emanate ttettete 168 DSS CIN TIN say eee goal sa e as permet ees a natal aE 168 Accessing the Macro c2s ccestbes sects hue ctacetaraisaivsoereneiiestends 169 Parameters xis ste sae Ma acta ca Sos coca bee cas te hs cae ee alles ee coe eas 169 Input Pile Format c2f22 c ues ea iittatini etaseat want 169 VLAN amanan aa hinaan at hues a ona 170 Example er a Ae EE E TE 170 Parameters oneni eaii i a RA R E 171 SD Modeler i 172 Introduction 1010eeeennn 173 MCNC MUMPSs Thermal Actuator 0 eee 173 Contents Index Help MCNC MUMPs Rotary Motor 0 0 ceeeeeeeeeeeeeeeeeeeeeeeeeees 175 Analog Devices iMEMS ADXL Accelerometer 177 Bulk Micromachined Diaphragm cee 180 Accessing 3D Models 000 0000 182 JB s ole fol alr 2 01 apeereetemerty kenna an e ENa 182 3D Modeler Output stccdsnaueneciiudssaaciunen 182 Accessing the 3D Tools sis ccseitec neltseiaronaumin nantes 184 Defining Colors for 3D Models 186 Viewing 3D Models from Layout 188 3D Model View User Interface 190 Application Elements lt psas cedcrreciss ede eerlteleers eee eees 190 Title Bare atin eee teeta cera E e Eocene eee oe carer ate 191 Menu ES A 5 ERE BN iN ca O 192 File Meni iia ach Rech a et Roce Rot te ae ho kt 192 View ICING oa tics siiatatinres a ER R 195 Contents In
8. View anyway Regenerate or Cancel Regenerate Cancel Figure 104 3D Model Out Of Date dialog Select View to display the existing outdated 3D model Select Regenerate to replace the existing 3D model Select Cancel to quit the operation Checking if a Process Definition is used A 3D model cannot be generated without a process definition Click OK to return to the layout view and add a process definition by accessing the Edit Process Definition dialog Contents Index Note Checking for Process with Derived Layers If the process file refers to a derived layer a note reminds you to use the L Edit command Generate Layers before continuing Click Yes to proceed with the generation of the 3D model Click No to abort the operation For more information on generating layers and derived layers see Introduction to Generated Layers on page 1 403 of the L Edit User Guide Checking for the Existence of all Required Layers All layers specified in the process definition file must be present in the layer setup If any of the layers referred to in the process definition does not exist in the layer setup a warning is issued specifying the missing layers Click OK to return to the layout view Once in layout view the missing layers can be added Checking for Wires or Self Intersecting Polygons Wires and self intersecting polygons are not currently supported by the 3D Modeler If these objects exist in the layout a wa
9. 3D Modeler Bulk Micromachined Diaphragm Shown below is a diaphragm suspended by four beams over a pit created by a backside etch of a wafer Such devices may be designed to sense pressure by placing piezoresistors at the center of the diaphragm edges Edit diaphram bulk 30 Model Cross Sertion He Wow Saup windon aalala dee Se pels Ale e ee ale jeejee a mle ee ea MEE ajja a el Al d e a alale z ml lolslalel slale a ol lelel lalol IF Wanhram bulk ab Modell F diaphram buik 30 Seles Boon Layer sate W 86 000 H 525 000 A O44800 00 Figure 72 Various views of the bulk micromachined diagram Contents Index In Figure 4 four views of the diaphragm are displayed clockwise from the upper left a layout view a top view with cross section line a cross section view and a rotated view of the 3D model from beneath The tdb file containing the example of the bulk micromachined diagram is lt install directory gt Examples 3DModel bulk bulk tdb Contents Index Accessing 3D Models 3D Model Input 3D models of MEMS devices can be created viewed and manipulated within L Edit Both L Edit mask layout and a process definition are required to accomplish this task Process definitions summarize the geometric effect of the fabrication steps used to construct a device These definition
10. ProcessInfo Name S Version S Unit unit Contents Index Example ProcessInfo Name MUMPS Version 1 0beta Unit microns Description The ProcessInfo command identifies the emulated fabrication process by Name Version and Unit It must be the first block of your process definition file Parameters for Processinfo are described below Parameter Description Name Any valid process name enclosed in quotation marks is an acceptable entry for Name Version Any valid version number enclosed in quotation marks is an acceptable entry for Version Unit Any of the following length units may be entered for Unit microns millimeters centimeters mils inches lambda other Do not enclose the entry in quotation marks Contents Index Wafer The syntax for the Wafer command is presented below followed by an example containing valid entries for its parameters Syntax Wafer WaferID S MaskName layer Thickness P Target layer Label sS Comment S Example Wafer MaskName substrate Thickness 5 WaferID wl1 Target substrate Label Wafer Comment Wafer Contents Index Description A Process Step can be applied only once a wafer has been identified The Wafer command establishes a wafer and assigns it a name Multiple wafers are not supported in MEMS Pro Version 3 If multiple Wafer steps exist only the first Wafer command will be used A warning will be i
11. Verification nnn 457 Introduction nnn 458 Adding Connection Ports 0 0 0 0 459 Extracting Layout sss 463 Extracting Schematic for LVS 468 Comparing Nethists 0 0 0 00000000000000 0 ccoccecccccccccccsccescecseee 471 Comma nd Tool 11000 474 Introduction nnn 475 Usage S Editarea leet EEEE E 475 Schematic Mode onooesneeesessresieeseen 475 Symbol Mode 8 sissies ccasicacacdosistacacdsiunacnssgtatgedetunesest teauutden 476 Contents Index Help Property Creation sss is tases decane oh Rea tees habeas 476 Accessing the Command Tool 477 Schematic Tools Toolbar sssssssssssssessssessseesssessressrrsssresse 477 Mod le Men venison aaa 478 Command Tool Dialog 2 101191101101101101101001100 479 Schematic Object Creation 0 000000000000000000000000 482 Template MOA Ears 20 8 so castaalisite de Nh ca saestad al coe Satta 482 Symbol Me o oo oecccscecesssssssssssssssssssssssssesesesssnsenenes 483 Schematic Object in Symbol Mode ee eee 483 Create Property Dialog 33 ca cssinsasieseeunsnwenanmoen 484 Block Place and Route Tutorial 46 Initializing the Design 0 0 488 Contents Index Help Routing the Design 00 00 0000 499 Extending the MEMS Library 50 Introduction nnn 507 Schematic Symbols o 0 cccccccecscecscscsccssssceeseeseeee 508 SPICE Models 2000 cccccccccccccccssssssssssssssneneeeeeeeees 511 Application Example 0 cccccccs
12. es a a am i Figure 30 Generate 3D Model Cross Section dialog m Click OK A new L Edit window will appear with a cross section view The 3D Model View window will snap to the top view and a line representing the cross section cut plane will be displayed on top of the model The cross section plane is always normal to the surface of the wafer m Select Window gt Tile so that you can view all the open windows at once MEMS Pro User Guide Contents Index 83 MEMS Pro Tutorial 1g a 3D Model Mw Manipulate the cross section plane line to the desired location by using the left mouse button to move the end points of the line The cross section window will be updated with each manipulation of the line Ele Cel Setun Iods Window Hap ASUS PRA can alAle he alae ieramen ko GOa tN Pa Soos ale tas lees wa ate op os toon ee oe ee Some m am Som maoa e Figure 31 Tiling the windows displaying the various cross section steps M To exit the cross section mode select a different mode by clicking a toolbar button or by selecting the menu item corresponding to the next desired function MEMS Pro User Guide Contents Index 84 Note For more information on cross sections see Viewing a Cross section on page 141 Contents Index Drawing Tools In this section of the tutorial we will explore the drawing tools available with ME
13. status bar 173 thermal actuator 134 title bar 152 toolbar 169 user interface 151 viewing 3D models 149 Contents Index 3D Modeler 7 3D To Layout Add Volumes 310 Create Volumes 305 Delete Volumes 309 Export CIF File 319 Import MEMS 302 345 Save MEMS 317 3D To Layout menu 298 3D Tools Delete 3D Model 178 Edit Process Definition 185 663 3D Tools menu Delete 3D Model 119 Edit Process Definition 116 Export 3D Model 120 View 3D Model 118 3D Tools menu 116 145 A Accelerometer 138 Contents Index Add Volumes 310 Adding volumes 310 356 Alignment macro 577 All angle wire 88 Analog Devices MCNC iMEMS 607 Analysis running 391 viewing the results 392 AMF file format 144 ANSYS accessing the R O M menu 218 adding an element type 383 ANSYS Neutral Format anf 144 connection product for SAT 144 182 378 379 importing 3D models 380 linear structural analysis 391 links to 8 meshing a model 388 running an analysis 391 setting boundary conditions 384 setting material properties 382 viewing a 3D model 380 Contents Index viewing the results 392 ANSYS to layout editing a 3D model 353 limitations 339 ANSYS to Layout dialog box 323 ANSYS toolbar LAYOUT 320 Approximation 420 Area perimeter dielectric isolation test structure 538 Array Euler colums 548 Guckel ring 554 B Beam doubly supported Euler column 545 linear folded 532 Bidirectiona
14. 0 000 000000000 0 00 0000000000000 129 Creating Splines o oo cccccccccccscssssssssssssseeeeeeee 132 Creating Splines from Angled Wires 0 eee 132 Interpolation e325 2 ecpzstslas es las Cee eit wen caida ssaeaea aoniu 134 I DVORINIQUION 62s tect n n Re alee 137 Re creating Angled Wires a ic ashininvyinausianuiauaain 139 Creating Splines from Polygons ccceeeeeeseeeeeeeeteeees 141 Editing Splines oc cccecesssssssssssssssssssssssee 146 MEMS Pro Utilities 000 147 Introduction seen 148 Running Macros in L Edit 149 Contents Index Help Loading the Macros enididenciininaemninnstves 149 Generating Polar Arrays 2 000000 cesses 150 Description eoni en aE A eed ascii EN 150 Accessing the Function ssssessseesssessiessrisssrersseesseessressresse 150 Parameters uena a R E NA 152 Generating Holes in a Plate 154 Viewing Vertex Coordinates and Angles 157 Viewing Vertex Coodimates 0 eeecceeseesseseseeteceeteeeeeenees 157 Viewing Vertex Angles intact cncauataherceiopannroest 159 Viewing Vertex Information ssssssssisssiissseersseesssessiessres 161 Clearing Vertex Information 0 0 0 0 cccceeeeeeeeeeeeeeteteeees 163 Approximating All angle Objects 164 Des nption ee i ee eai RE O E 164 Accessing the Macro cate harks ae Ae atau cs 164 PALAMELCES jcsscusesesstunvavesiisopendvasavesvutesacksnateianernvevssdasdgesdeaiasasees 167 Contents Index Help
15. Condensation Current LS Figure 47 Condensation Current LS dialog box The algorithm applies the currently defined load case The above dialog box asks you to enter the output file name For example call it MyExample Be careful to enclose the output file name in single quotes Click OK to run the algorithm During the execution of the algorithm the ANSYS Process status progress bar indicates to you which action the software is performing Moreover information is printed in the ANSYS Output window informing you about the currently performed task and its results KKEKKKKKKKKKKKKKKKKKKKKKKKKKK KKK KKK KKK KKK KKK KKK KKK KKKK Guyan Irons condensation KEKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKKK KKK KKK KKKKKK Ansys substructure file MyExamplel sub Contents Index Run substructuring with current load step Waiting for ANSYS solution Done Number of selected DOF 1 Number of load steps 1 KKEKKKKKKKKKKK KKK KKK KK KKK KKK KKKKKKKKKKKKKKKKKK Reduced model successfully generated KKK KEKE KKK KKK KKK K KK KKK KK KKK KKK After the execution results files are created in your working directory They contain the behavioral model reduced equation written in the selected format In this case the output file is MyExample1 sp Another file called MyExamplel sub has been created It is the ANSYS substructure file Condensation Reduction with Multiple DOFs amp Load Cases The second example use
16. Copy and paste the ground symbol five times Move two ground symbols to a place on the schematic near each voltage source Now wire the negative lower terminal of each of the three voltage sources to a ground symbol Contents Index Mw Of the remaining three ground symbols one should be connected to the fix_m pin of the top spring and the other two should be connected to the fix_m pins of the two comb drives Compare your wiring to the completed schematic presented in Figure 1 Pins fix_e fixed electrical and fix_m fixed mechanical of the bottom fspring should be the only pins left unconnected at this point Connect them to the fix_e and fix_m pins respectively of the top fspring Mw Compare your design to the finished design presented in Figure 1 to make sure the resonator has been wired correctly Editing Object Properties Now you will edit the properties of one of the voltage sources in the schematic to set up the design for simulation 5 Select the voltage source next to the left comb by right clicking it Invoke the Edit Instance of Module Source_v_ac dialog by selecting Edit gt Edit Object Contents Index MEMS Pro Tutorial Creating a Schematic Edit Instance of Module Source_v_ac Peet Oooo a 4 vit pos neg lt l a 4 Figure 5 Edit Instance of Module Source_v_ac dialog Enter 1 for mag 0 for phase and 0 for Vdc in the corresponding edit fields Click OK Give the vol
17. Index MEMSLib Reference Passive Elements Linear Folded Beam Suspension Elements Linear Folded Beam Suspension w Ground Plane Parameters S_LFBS_1 _ Layout Parameter Entry Dialog Box wsyoke ee HH s lbeam lsyoke Layout Parameter Illustration Layout Palette Button MEMS Pro User Guide Contents Index 574 Dual Archimedean Spiral Spring Elements S_SPIRAL_1 S_SPIRAL_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates dual archimedean spiral springs on the first or second structural layer A possible application of the spiral spring is in a torsional suspension system Actuators or other mechanical elements can be connected to the rotor supports at the ends of the spiral spring The length parameter of the spiral beam corresponds to the length of the central axis of the beam The element parameters can be selected to obtain the electrical connect layer on the dielectric properties of the isolation layer Parameter List The following table provides the dual archimedean spiral spring parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Radius of support shaft rshaft 10 um support_shaft_radius Contents Index Description Layout Default Schematic parameter Parameter Value name Name Starting radius of spiral beam rinner 15 um spiral_initial_radiu
18. LayerName Poly1 Thickness 2 Scf c WaferID wl Target Polyl Label Deposit Poly1l Poly1 Comment Deposit fl EtchType SURFAC Face TOP askName Polyl1 EtchMask OUTSID Depth 4 5 Angle 90 Undercut 0 EtchRemoves Poly1 Fl Contents Index WaferID w1 Label Etch Polyl Comment Etch Polyl Deposit Deposit Type CONFORMAL Face TOP LayerName 0x2 Thickness 75 Sch 5 WaferID wl Target 0x2 Label Deposit Ox2 Comment Deposit Ox2 Etch EtchType SURFACE Face TOP askName Polyl Poly2 Via EtchMask INSIDE Depth 1 5 Angle 87 Undercut 0 EtchRemoves 0x2 EtchRemoves ox1 WaferID w1 Label Etch Polyl Poly2 Via Comment Etch Polyl Poly2 Via Contents Index Fl tch EtchType SURFACE Face TOP askName Anchor2 EtchMask INSIDE Depth 5 25 Angle 87 Undercut 0 EtchRemoves 0x2 EtchRemoves ox1 WaferID wl Label Etch Anchor2 Comment Etch Anchor2 Deposit Fl tch DepositType CONFORMAL Face TOP LayerName Poly2 Thickness 1 5 Scf c WaferID w1 Target Poly2 Label Deposit Poly2 Comment Deposit Poly2 EtchType SURFACI Face TOP askName Poly2 fl Contents Index EtchMask
19. Simulation from a netlist 40 using T Spice 40 Contents Index Simulation 33 SNOWFALL deposit 197 630 Spice models 475 Splines approximation 420 creation 125 415 drawing 95 edition 127 429 interpolation 417 understanding 410 Splines menu 125 Create 125 Edit 127 Spring dual archimedean spiral 535 folded 564 Spring 377 SURFACE etch type 202 T Technology Contents Index Analog Devices MCNC iMEMS 607 MCNC MUMPs 604 MOSIS CMU 609 MOSIS NIST 610 Sandia ITT 608 Technology file 328 Technology setup 602 Test structure area perimeter dielectric isolation 538 crossover 1 541 crossover 2 543 Guckel ring 551 Thermal actuator 134 Tool Flow 3 Tools menu Clearing Vertex Information 130 Viewing Vertex Angles 129 Viewing Vertex Coordinates 128 Viewing Vertex Information 129 Tools menu 128 Torus drawing 88 T Spice Contents Index launching 39 simulation 40 user interface 40 T Spice Pro 4 U Unidirectional rotary comb drive type 1 502 type 2 505 UPI 6 Utilities 570 Vv Vertex clearing information 130 viewing angles 129 viewing coordinates 128 viewing information 129 View 3D Model 118 Contents Index Viewing a 3D model in ANSYS 380 a 3D model 72 81 118 149 a cross section 175 analysis results 392 properties 69 vertex angles 129 vertex coordinates 128 vertex information 129 waveform 45 Viewing Vertex Angles 129 Viewin
20. Switch to Schematic mode to complete the schematic for your symbol Contents Index SPICE Models Note We frequently refer to T Spice concepts operations and commands all of which are more fully described in the T Spice User Guide and Reference SPICE can of course be used to simulate electrical circuits SPICE can also be used to simulate multiple domain systems if the non electrical system can be characterized by differential equations This section offers instructions for creating a behavioral model under a multiple domain system Find the appropriate mapping between SPICE s electrical variables and the variables in the other domain For example to model behavior in the mechanical domain force can be mapped to current and position to voltage Find the differential equation that best describes the element Create a subcircuit model that captures the differential equation The subcircuit may contain external functional models and or a network of electrical primitive components Test your model Verify that you have captured the behavior as you intended Contents Index Application Example A simple one dimensional linear spring may be modeled by a network of electrical primitives VM Map force to current and position to voltage The mechanical equation F k x can be mapped to the electrical equation I k V where the spring constant k is a function of the geometry of the spring Electrically the element is
21. W Edit is launched graphically displaying the results of the T Spice simulation Contents Index The W Edit window should display a chart containing the magnitude and phase of the displacement of node rtm for the performed AC analysis Contents Index Viewing a Waveform The W Edit application window can contain many child windows each containing one or more charts MV Maximize the window containing your results by clicking the DJ button on the upper right corner of the window Chart Setups W Edit allows the expansion of charts with more than one trace into separate charts each containing a single trace Collapsing the chart causes W Edit to show all the visible traces in one chart MV Select Chart gt Expand Chart There should now be two charts Figure 11 one with amplitude information for node rtm vm rtm and one showing the phase angle vp rtm plotted versus frequency Contents Index Mw Now you should be able to view a peak in amplitude at around 13 kHz Resonator mrt vm rtrn uv erere aren reve erey reve even rere ere rere ere 0E 004 1364004 1 664004 2 04004 2564004 3264004 4 0 004 5 0E 004 6 364004 7 9E 004 1 064005 Frequency Hz Resonator wp rtm deg 0E 004 1 364004 1 664004 2 04004 2 5E 004 3 2E 004 4 0 004 5 0E 004 6 3E 004 7 9E 004 1 06 005 Frequency Hz Figure 11 Charts representing the amplitude and the phase angle Trace Mani
22. a tool tip will appear displaying the layer name PolyO will also appear in the list box at the top of the Layers Palette Contents Index mi Click once to set the upper left corner hold the key down and drag to the opposite corner and release Figure 23 Attaching the first bonding pad Copy the bonding pad and place it to the left of the left comb drive Flip the bonding pad by selecting Draw gt Flip gt Horizontal Connect the bonding pad to the comb drive by drawing a box on PolyO overlapping the comb drive and the bonding pad in a similar fashion as above Make a third copy of the bonding pad and place it to the bottom left side of the ground plate Contents Index MEMS Pro Tutorial Generating a Layout M Connect the ground plate to the bonding pad by drawing a box on Poly0 overlapping the bonding pad and the ground plate in a similar fashion as above VM Change the name of the cell you have been working on from Cello Select Cell gt Rename Enter MyResonaior as the cell name M Save the file by choosing File gt Save Enter myreson tdb as the file name and click OK Figure 24 Final view of the lateral resonator MEMS Pro User Guide Contents Index 69 If you are interested in performing layout netlist extraction and layout vs schematic comparison refer to Chapter 11 Verification and use the myreson tdb file Viewing Properties Note Properties can be attached to any L Edit object including boxes
23. gt SAT and browse for the spring sat file You may also export your model from MEMS Pro in ANF format as described in Exporting the 3D Model on page 259 Contents Index ANSYS to Layout Generator Introduction 279 3 D to Layout Tools 281 The Layout Generator Program 299 Definition of a Technology File 303 Limitations 315 Tutorial 316 Layout view of the mirror 333 Contents Index Introduction The ANSYS 3D Model to Layout Generator allows you to project an ANSYS database into a CIF file that can be read by almost all Electronic Design Automation tools LEdit heat thermal_act tdb File Edt View Draw Cell Setup Tools Window Help la x PROGR Al tN pew OAS Al y u Bl Figure 1 Horizontal heat actuator 3D and 2D views A palette of utilities often used to create 3D structures has been added to the MEMSCAP palette in the 3D to Layout menu The utilities help you create keypoints lines arcs areas and volumes by using the same method as the Contents Index standard ANS YS commands But these utilities are necessary to the generation of a layout from a 3D model Indeed they associate to the created volumes a component name relating those volumes to the material it represents i e to the layer These component names are necessary to the 3D to Layout translator Options for editing volumes by moving them subtracting or adding them have also been added to th
24. polygons wires circles ports rulers instances cells and files Properties can contain supplementary but necessary information about an object such as what color it will appear when modeled or what its constituent material is MEMS Pro library components have a properties category called Extract Properties This category provides a link between a design layout and its netlist description Extract Properties are accessed via the Cell Info dialog box or the Edit Instance dialog box For more information on properties and extraction see Properties on page 1 66 and Extracting Layout on page 3 48 of the L Edit User Guide Properties were applied to each part of the resonator as it was constructed You will look at those properties now Select the instance of the Plate and choose Edit gt Edit Object Contents Index Click the Properties button This instance should have no properties attached to it If the instance does not have Extract Properties L EdivExtract pursues the hierarchy and looks for extract properties on the parent cell Select Cell from the Parent list box and click the View Parent button to view the properties for the Plate cell To view the extract properties click the sign next to the EXTRACT folder Three properties should be displayed under the EXTRACT folder Figure 25 Property EXTRACT SPICE OUTPUT Type Sting 9 Cancel Value _ S instance PL_Left _mi Sub properties Add Pr
25. 07 5 5223359e 10 6 8235294e 15 9 6 6666667e 07 4 8555243e 10 6 467956le 15 10 0000000e 06 4 3132108e 10 6 1539385e 15 Contents Index Once the numerical values of reduced forces and capacitance if requested have been approximated by an analytical expression an accuracy estimation of the fitting process is performed on each fitted value This evaluation consists in the comparison at each fitting point of the numerical value with the analytical expression A summary of the greatest absolute difference is also printed and compared with the absolute mean value of the numerical values in order to obtain a relative data 1 2 5765530e 09 2 5766599e 09 1 0695196e 13 2 1 8065974e 09 1 8064695e 09 1 2799081le 13 3 1 3646935e 09 1 3647061e 09 1 2506981e 14 4 1 0811644e 09 1 0811986e 09 3 4230521e 14 5 8 8548790e 10 8 8549709e 10 91 9176866 15 6 7 44327995967107 743269896 10 9 6567069e 15 7 6 3585629e 10 6 3584617e 10 1 0119246e 14 8 5 5223359e 10 5 5223378610 18783152616 9 4 8555243e 10 4 8555978e 10 7 3576808e 15 10 4 3132108e 10 4 3131849e 10 2 5912165e 15 Contents Index Il Mean absolute value 1 0562739e 09 Maximum absolute difference 1 2799081e 13 0 0121 3 Capa 1 1 accuracy estimation Point Reference Approximation Difference F 1 2358000e 14 1 2356427e 14 1 5729220e 18 2 1 0862294e 14 1 0865342e 14 3 0473488e 18 3 9 7759145e 15 9 7753145e 15 5 9910553e 19 4 8 9370341e 15
26. 8 9355797e 15 1 4543140e 18 5 8 2623515e 15 8 2619657e 15 3 8578644e 19 6 7 7036706e 15 7 7043433e 15 6 7263844e 19 7 7 2307667e 15 7 2315074e 15 7 4077217e 19 8 6 8235294e 15 6 8234690e 15 6 0393615e 20 9 6 4679561e 15 6 4672164e 15 7 3966534e 19 10 6 1539385e 15 6 1542450e 15 3 0649302e 19 Mean aboslute value 8 4575456e 15 Maximum absolute difference 3 0473488e 18 0 0360 kkkkkkxkxkxkxkxkxkxk xkxkxk xkxkxk xkxkxkxkxkxkxkxkxkxkxkxkxkxkkxkxkkxkxkkkxkkkxkkxkxkkkxkkkxkkkxkkx k Reduced model successfully generated kkxkxkxkxkxkxkxkxkkkkxkxkxkxkkkkkxkxkxkxkxkxkkkkkkkxkxkxkxkxkkkkkkkkxkxk xkxkxkkkkkkkkxxkxx k After execution results files are created in your working directory They contain the behavioral model written in the selected format In this case the output file is MyExample sp Contents Index Simulating a reduced model using the SPICE simulator Once you have created your SPICE model you can simulate it using T Spice Launch S Edit by selecting Programs gt Tanner MEMS Pro gt S Edit Click File gt Open and browse for the MicroMirror sdb file The schematic view of the micro mirror appears in the S Edit window Figure 77 Contents Index Reduced Order Modeling ROM Tutorial MEE jul output1 alalolo MER output1 dt os outputl d2t Gua iin e NUM Figure 77 Shematic view of the micro mirror m Click Module gt Open MEMS Pr
27. Contents Index The spring see Figure 105 whose layout is shown below was designed to be fabricated with the MCNC MUMPS technology It is on the second polysilicon layer Poly1 suspended over the ground plane It is anchored to the ground plane formed on the first polysilicon layer Poly0 at the small area on the lower center of the spring There are three dimples at the top of the spring M E E analysis __spring tdb Poly0 ground plate Poly1 spring Figure 105 Viewing the spring Viewing the 3D Model The spring tdb file already contains a 3D model built from the layout and MUMPS manufacturing process You can find out more about how models are constructed in the main tutorial section entitled Viewing a 3D Model on page 71 Contents Index Vv In the MEMS Pro Palette choose 3D Tools gt View 3D Model to view the model F analysis reson 3D Model Figure 106 Viewing the 3D model of the spring Exporting the 3D Model Two file formats used in MEMS Pro to describe 3D models are ANF ANSYS Neutral Format and SAT Save As Text MEMS Pro can write SAT files directly under all operating systems Under Windows 95 you must export your 3D model in ANF format to use with ANSYS MEMS Pro uses the ANSYS connection module called The ANSYS EMS Pro User Guide Contents Index 259 Connection Product for SAT to write the ANF file that describes your model You must have this connection module installed i
28. D To Layout x Figure 4 3 D to Layout menu This menu see Figure 4 helps you work with the 3D model before its translation to layout MEMS Pro User Guide Contents Index 284 ANSYS to Layout Generator 3 D to Layout Tools Import Mems wy You can import a 3D model by clicking Import MEMS Figure 5 3 D To Layout Ea Import MEMS Ea Figure 5 Reading the 3D Solid model MEMS Pro User Guide Contents Index 285 ANSYS to Layout Generator 3 D to Layout Tools You can choose to read an input file inp a log file log or an ANSYS database file db These commands are also available through the Read Input From for ASCII files or Resume From for a database buttons in the ANSYS File menu Any of these choices brings up the same following dialog box Figure 6 Import Your INP File Figure 6 Reading a MEMS file in ANSYS Select the file you want to import MEMS Pro User Guide Contents Index 286 ANSYS to Layout Generator 3 D to Layout Tools Creation of Volumes You can create keypoints lines arcs and areas using the 3 D to Layout palette These commands are exactly the same as ANS YS commands but with some extra book keeping related to the materials used yw By clicking the Create Volumes button you can create blocks cylinders prisms and volumes by areas Figure 7 3 D To Layout x Create Yolumes x MEMS Pro User Guide Contents Index 287 ANSYS to Layout Generator 3
29. D to Layout Tools Figure 7 Create Volumes button Once the volume is created a new dialog box see Figure 8 prompts you to select a component name for the volume This component name is related to the name of the mask layer on which the 2D projection of the volume will reside after translation Defines the Component of your Yolume Figure 8 Attaching a component name to the created volume MEMS Pro User Guide Contents Index 288 Warning Warning If a volume has no component name it cannot appear in the CIF file created by the ANSYS to Layout translator If a volume has more than one component name the program generates an error message If all the previously created volumes have valid component names the Volume Number field is automatically filled with the next available number If your solid model contains volumes that are not attached to component names the dialog box loads the smallest number of volumes If you do not change the volume number this volume is associated to the selected component name The volume you first intended to create will not be attached to a component You must fill the dialog box with the correct volume number A scrolling list appears containing component names defined for the technology Enter the component name in the appropriate field Click OK to record the component name When entering a component name you must enclose the name in single quotes Contents Inde
30. Edit Symbol Name S_PAD_2 S Edit Test Schematic N A Contents Index MEMSLib Reference Resonator Elements Bonding Pad Bonding Parameters S_PAD_2 Layout Parameter Entry Dialog Box width lt length gt Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 613 16 Technology Setup Introduction MCNC MUMPs Analog Devices MCNC iMEMS Sandia ITT MOSIS CMU MOSIS NIST Contents Index 615 616 619 620 621 622 Introduction For your convenience we have included technology setup information for several processes MCNC MUMPS Sandia ITT ADI MCNC iMEMS MOSIS CMU and MOSIS NIST SCNAMEMS The process setup information includes design rules layer definitions extraction rules process definitions model parameter values and macros Contents Index MCNC MUMPs Note See http mems mcnc org mumps html for the most up to date information The Multi User MEMS Processes MUMPs is a program designed to provide low cost access to MEMS technology Hundreds of users from the domestic industry government and academic communities have used MUMPSs to access MEMS And beginning with MUMPs run 26 access was made available worldwide to the international MEMS community MUMPs provides low risk opportunities for small business and industry to access the prototype to commercialization pathway Past participants have created a wid
31. F2F3 Arrow Keys J gt When certain keys are to be pressed simultaneously their abbreviations are adjoined by a plus sign For example Ctrl R means that the Ctrl and R keys are pressed at the same time When certain keys are to be pressed in sequence their abbreviations are separated by a space For example Alt E R means that the Alt and E keys are pressed at the same time and then released immediately after which the R key is pressed Abbreviations for alternative key presses are separated by a slash For example Shift T J means that the Shift key can be pressed together with either the up T arrow key or the down J arrow key Contents Index MEMS Pro Tutorial Introduction Creating a Schematic Exporting a Netlist Simulating from a Netlist Probing a Waveform Viewing a Waveform Generating a Layout Viewing a 3D Model Drawing Tools Contents Index Introduction In the MEMS Pro tutorial you will follow the complete design of a MEMS resonator The ANSYS Tutorial on page 176 the ROM Tutorial on page 370 the ANSYS to layout Tutorial on page 316 the Block Place and Route Tutorial on page 486 and the Optimization Tutorial on page 435 are targeted to special features of MEMS Pro The advanced portion of this tutorial includes a demonstration of layout extraction and netlist comparison using L Edit Extract and LVS Those chapters assume that the user is completely fam
32. Index The following figure gives an explanation of the model Load sa In pins Ax Ay Az Ux 1 Retained DOF Uy 1 In Out pins Uz 1 Figure 57 Model explanation Load cases pins are input pins You get as many input pins as the number of Load Steps you defined in this case 3 for 3 possible different directions for the acceleration You get as many output pins as the number of Master DOFs you defined in this case 3 for 3 possible different directions of movement for the specified node 1 There is no correlation between the number of output pins and the number of input pins Contents Index Simulating a reduced model using the SPICE simulator Once you have created your SPICE model you can simulate it using T Spice Launch S Edit by selecting Programs gt Tanner MEMS Pro gt S Edit Click File gt Open and browse for the accel3 sdb file The schematic view of the accelerotor appears in the S Edit window Figure 58 Contents Index Reduced Order Modeling ROM Tutorial Foe options abstol 1e 10 options reltol 0 0001 options numt 1000 options chargetol 5e 3 Bae nene on ee Go _ clamped the input ports represent load cases on each direction The hidirectional ports stand for the various chosen Master DORs Voltage output quantity stands for displacement in the chosen direction Geo Je ee
33. Library Palette Library Palette The Library Palette contains a variety of components that can be assembled to create a full MEMS device It allows the instantiation of active passive and test elements but also resonator elements 5i Access the Library Palette see Figure 41 by selecting Library gt Library Palette in the MEMS Pro Toolbar Contents Index MEMS Pro Toolbar Library Menu Library Palette MEMSCAP T i eH A A 2 A ae e ae 2 Es Figure 41 Library Palette Note For more information on discovering and using the Library Palette refer to Chapter 15 MEMSLib Reference MEMS Pro User Guide Contents Index 104 Edit Component You have now the possibility to modify the components that you have previously created using the Library Palette To edit components perform the following steps 5i Select the component you want to edit In this example consider a harmonic side drive refer to Figure 42 Contents Index MEMS Pro Toolbar Library Menu Figure 42 Default harmonic side drive vi Select Library gt Edit Component A dialog box displaying the parameters of the selected component appears Figure 43 MEMS Pro User Guide Contents Index 106 MEMS Pro Toolbar Library Menu Harmonic Side Drive Parameters S_RHARSDM_1 Figure 43 Parameters dialog box of the harmonic side drive i Modify the parameters values and click OK MEMS Pro User Guide Contents Index 107 MEMS Pro
34. List The following table provides the array of Euler column parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Minimum residual strain eOmin 0 0005 um __ residual_strain_minimum Maximum residual strain eOmax 0 0025 um __ residual_strain_maximum Contents Index Description Layout Parameter Name Default Value Schematic parameter name Residual strain by step deleO 0 00025 um residual_strain_step Width of doubly supported bwidth 20 um beams_width beam Size of anchor supports asize 30 um anchor_size Thickness of beam structural heigth 2 um beam_thickness layer S Edit Symbol Name N A Contents Index MEMSLib Reference Test Elements Array of Euler Column Elements Array of Euler Column Parameters S_EUBEAMS_1 Layout Parameter Entry Dialog Box bwidth w calculated from parameters calculated from parameters Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 592 The array of Euler columns depend on the following equation where L is the length and h is the height of the beam the minimum of width and height parameters specified The anchored ends of the beam are considered ideal clamped ends and the elasticity of the supports is not modeled The beam parameters are chosen to set the critical buckling strain of the beam and hence the residual
35. Palette The Library Palette dialog box should appear Figure 124 Library Palette MEMSCAP Figure 124 Library Palette MEMS Pro User Guide Contents Index 526 MEMSLib Reference Accessing the MEMS Library Palette The Library Palette is a dialog box Each tab corresponds to a set of MEMS elements Categories include active passive and test elements and resonators The layout generator for a particular element is executed by clicking the palette button corresponding to the desired element in the library palette A parameters dialog box appears in which you can modify the parameters of the element For instance if you want to create a Harmonic Side Drive Motor click the corresponding button and the following dialog box appears Harmonic Side Drive Parameters S_HSDM_1 Figure 125 Harmonic Side Drive Parameters dialog box MEMS Pro User Guide Contents Index 527 Once the parameters have been set click OK to create the device layout in a new cell and instantiate it in the current cell Show Details Button The Library Palette dialog box contains a new button the Show Details button This button allows you to enlarge the Library Palette dialog box and displays the layout illustration for the selected element If for instance you wish to view the layout illustration of the Harmonic Side Drive Motor an active element click the Show Details button and the Library Palette will be expanded Figure 126
36. Parameter Entry Dialog Box wsyoke ERA Le emisep pi Hip Rak Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 568 Linear Crab Leg Suspension Elements Type 2 S_LCLSB_1 S _LCLSB_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a linear crab leg suspension on the first or second structural layer The local origin of the element is at the center of the shuttle mass Actuators can be connected to the yokes on the shuttle mass Unlike Icls this element is anchored at 4 points Parameter List The following table provides the linear crab leg suspension parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Length of beam1 Ibeam 1 30 um beam1_length Width of beam1 wbeam1 20 um beam1_width Length of beam2 Ibeam2 75 um beam2_length Contents Index Description Layout Default Schematic parameter Parameter Value name Name Width of beam2 wbeam2 8 um beam2_width Seperation between type 1 beam sep 70 um beams_separation beams Width of shuttle swidth 30 um shuttle_width Length of shuttle slength 100 um shuttle_length Width of anchor support wanchor 25 um anchor_width Width of shuttle yoke wsyoke 12 um shuttle_yoke_width Length of shuttle yoke Isyoke 98 um shuttle_yoke_length S Edit Symbol Name S_LCLSB_1_M_X S_LCLS
37. S Edit yw Launch S Edit by double clicking the S Edit icon RS in the installation directory The S Edit user interface consists of five areas The title bar at the very top of the application window contains the file name module name page name and mode The menu bar at the top contains commands The palette bar on the left contains tool icons The status bar at the bottom contains runtime information The display area in the center contains the schematic a The standard commands toolbar below the menu bar contains often used commands Contents Index Designs are contained in files each of which consists of one or more modules Modules are viewed in either of two modes Symbol Mode a graphical representation of the module showing the module s connections Schematic Mode shows the composition and connectivity of the module The schematic may contain one or more pages which consist largely of two component types Primitives geometrical objects wires ports annotation objects and labels all created with the S Edit drawing tools Instances copies of other modules dynamically linked to their originals Instances are displayed in a design using the module s symbol page Note For more information on instancing modules see Working with Modules on page 97 of the S Edit User Guide and Reference Opening the File As part of this section of the tutorial you will place the co
38. S25 2 2f Sle Sl els ele elo le heat heat th E le F heat heat 30 Model 1 jai AE BEES MJE Oe vt E JE E fi D i j Selostione Box on Layer Poly1 Po 2 Via W 80 000 H 20 000 A 1000 00 aeee Figure 69 Various views of the thermal actuator In Figure 1 four views of the thermal actuator are displayed clockwise from the upper left a layout view a top view of the 3D model with a cross section line a view of the cross section and a rotated view of the 3D model Contents Index The tdb file containing the example of this thermal actuator is lt install directory gt Examples 3DModel mumps heat heat tdb MCNC MUMPs Rotary Motor The device modeled below is a rotary side drive motor designed for the MCNC MUMPs 3 layer polysilicon surface micromachining process The motor has twelve stators and eight rotors Tangential electrostatic forces tending to align the rotor poles with the excited stator poles cause the hub to rotate Contents Index 3D Modeler Introduction Figure 70 Various views of the rotary motor In Figure 2 four views of the rotary side drive motor are displayed clockwise from the upper left a layout view a top view of the 3D model with a cross section line a view of the cross section and a rotated close up view of the 3D model MEMS Pro User Guide Contents Index 176 The tdb
39. Scf Thickness m a S A Parameters for CONFORMAL deposits are described below Parameter Description WaferlD This optional parameter identifies the Wafer that will receive the deposit Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferID where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Contents Index Parameter Description DepositType Face LayerName Thickness Type of deposit Parameter options are CONFORMAL SNOWFALL and FILL The value is set to CONFORMAL for a conformal deposit Side of the Wafer that will receive the deposit Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Name of the layer to be deposited Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for LayerName LayerName and Target are typically set to the same value You may enter any positive value for the vertical dimension of the CONFORMAL deposit This thickness is deposited on the sides s specified by the Face parameter Contents Index Parameter Description Scf Target Label The Sef Sidewall coverage factor parameter is the height of the material deposited on vertical sidewalls divided by the Thickness of the material depos
40. Toolbar Library Menu The component has been edited Figure 44 Figure 44 Edited harmonic side drive MEMS Pro User Guide Contents Index 108 3D Tools Menu The 3D Tools menu gathers all the options related to the 3D model generation and viewing You can perform the following operations Edit a process definition View a 3D model Delete a 3D model Export a 3D model Editing a Process Definition wy To edit a process definition select 3D Tools gt Edit Process Definition The Process Definition dialog box appears allowing you to browse for the desired process definition file pdt and to edit the various steps of the 3D generation see Figure 45 Contents Index MEMS Pro Toolbar 3D Tools Menu Process Definition borrinenae SU TGGe Fortis step ommen Figure 45 Process Definition dialog box MEMS Pro User Guide Contents Index 110 Note For more information on editing process definitions refer to Editing the Process Definition in Chapter 17 Process Definition Viewing a 3D Model Note To view the 3D model of a layout a process definition has to be previously determined refer to Editing a Process Definition in the present document for more information To view the 3D model of a layout the layout has to be displayed in the L Edit main window Then select 3D Tools gt View 3D Model in the MEMS Pro Toolbar A progress bar called Generating 3D Model appears ind
41. Use Cell gt New to create a cell for use during initialization Enter top level in the New cell name field Create New Cell top level Tanner Research Pasadena CA Figure 115 Create New Cell dialog i Click OK to close the Create New Cell dialog The cell top level should now be the active cell i Use Tools gt BPR gt Initialization to open the BPR Initialization dialog MEMS Pro User Guide Contents Index 495 Block Place and Route Tutorial Initializing the Design In the BPR Initialization dialog you will enter a netlist assign the default signal type specify a top level I O cell set a routing pitch and pick a routing guide layer BPR Initialization of cell top level Figure 116 BPR Initialization dialog a In the Netlist file group browse to the lt install directory gt Examples Bpr subdirectory and select the memsdemo tpr netlist Confirm that the BPR Initialization of cell top level fields appear as shown above Select Signal as the Default Signal Type Select Connectivity from the layers in the Routing guide layer pull down list Enter a routing pitch of 7 Click Initialize MEMS Pro User Guide Contents Index 496 Block Place and Route Tutorial Initializing the Design yw Maximize the active window and press the Home key to center the image The initialized design should look like the following Figure 117 La
42. accessed from the Module menu The Text Size is set to the Default Port Text Size and the Show Format is set to None The Value of this property is defined by your entry into the T Spice Command Tool dialog Any existing entry in the Value field will be overwritten by the formulated command string Contents Index If the SPICE OUTPUT property already exists an error message will be displayed and the operation will be terminated Create Property Dialog Tool Tip In the symbol view mode of S Edit you may also access the Command Tool while creating a new property To create a new property the Properties tool must be activated by clicking the Properties button on the Schematic Tools toolbar Once the button is clicked it remains depressed until another tool is activated by clicking any of the other buttons on the same toolbar When the Properties tool is active the mouse cursor becomes a cross hair Clicking somewhere in the work space will invoke the Create Property dialog Name SPICE OUTPUT Cancel Command Tool gt Format Text Size B Separator character E Co mman d Tool Value Type integer x Show Name and Value 7 Figure 110 Create Property dialog Contents Index Pressing the Command Tool button in the Create Property dialog will invoke the T Spice Command Tool dialog As described in Command Tool Dialog on page 479 a SPICE command string will be formulated from your entries to the dialog
43. and UNIX MEMS Pro users who wish to use ANSYS have the option of exporting their files in either ANF or SAT format If you choose to export to ANF format MEMS Pro will invoke The ANSYS Connection Product for SAT as you export the file If you choose to export your model from MEMS Pro in SAT format ANSYS will invoke The ANSYS Connection Product for SAT as it reads the SAT file In either case you must have The ANSYS Connection Product for SAT installed in your ANSYS directory Contents Index Accessing the 3D Tools 3D model tools may be accessed from the L Edit layout menu The Edit Process Definition View 3D Model Delete 3D Model and Export 3D Model options may be accessed through the 3D Tools button of the MEMS Pro Toolbar S Pro MEMSCAP Library EEOAE EasyMEMS Splines Tools Help Edit Process Definition View 3D Model Delete 3D Model Export 3D Model Figure 73 Accessing the 3D Tools option The View 3D Model Delete 3D Model and Export 3D Model options may also be accessed from the Design Navigator s context sensitive menu which is Contents Index 3D Modeler Accessing 3D Models reached by a right click while in the Design Navigator window The Design Navigator can be reached from the L Edit View submenu Tee dees 3D tools Figure 74 Accessing the 3D Tools options using the context sensitive menu All commands available from the context sensitive menu operate on the selected cell Since the proce
44. and Z scales and the X Y and Z axes drawn 120 degrees apart For more information on viewing the 3D models see 3D Model View User Interface on page 190 Contents Index 3D Model View User Interface Application Elements The graphical user interface for the 3D Model View has six important screen components the Title Bar the Menu Bar the 3D Model Tool Bar the Palette the Status Bar and the Work Windows Title Bar vi Is Dlslalel ele Sie ala Aloe fortes A Ela Sage as ale aaa sazsr 124465 PR Sf EIN ffrotne eI EEEE Menu Bar a a eee Work Pa ee SIRI E kor 13D Model resona ork h a Windows o ol 3D Model m Tool Bar a M M D gt Palette H v AAE a rity Status Bar 534 Mode Drawing Figure 77 Graphical User Interface for the 3D Model View Contents Index Note Title Bar The L Edit Locator and Mouse Button Bar are inactive while in a 3D Model View While in 3D Model View mode the left center and right mouse buttons offer shortcuts to three view commands Ctrl Left activates the Orbit View a Ctrl Center activates the Pan View Ctrl Right activates the Drag Zoom View For two button mice the Pan View may be accessed by clicking the Ctrl Alt Left combination See View Menu on page 195 for more information When a 3D Model View is active the L Edit applicati
45. box and it will be inserted into the Value field replacing the previous content Clicking OK will create a property placed at the cursor location Contents Index 13 Block Place and Route Tutorial Initializing the Design 488 Routing the Design 499 This tutorial demonstrates some key steps in the Block Place and Route BPR design flow for use with MEMS BPR assists in the design of systems by providing an automated means of placing and routing the blocks that compose them Blocks may contain the layout of MEMS sensors amplifiers demodulators oscillators A D converters and so forth BPR enables you to focus on the design issues of individual blocks and when those designs are functional helps you gather the pieces and connect them Contents Index in the configuration you desire Some features of BPR including timing analysis signal integrity analysis and layout verification will help you optimize your entire design to an overall system performance goal The BPR process consists of four stages design preparation initialization placement and routing Optional steps include timing analysis signal integrity analysis and layout verification Placing and Routing Block Designs on page 2 144 of the L Edit User Guide gives a detailed description of the BPR design process and terminology including a tutorial based on a CMOS adder circuit that demonstrates BPR initialization routing moving vias and routing wires the
46. compressive strain that it would detect If the thickness of the structural layer used is larger than the width of the beam lateral buckling will occur Guckel Ring Test Structure Elements S_GURING_1 S_ GURING_2 Description S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Generates a single Guckel ring test structure on the first or second structural layer These ring structures can be used to estimate the residual strain in a film with tensile residual strain An array of rings with different radii are used to estimate the critical radius at which buckling occurs in the cross beam of the test structure and hence infer the tensile residual stress present in the structural film The ring parameters are chosen to set the critical buckling strain of the cross beam and hence the Contents Index residual tensile strain that it would detect If the thickness of the structural layer used is larger than the width of the cross beam lateral buckling will occur i e buckling in the plane of the wafer Otherwise buckling will occur out of the plane of the wafer Parameter List The following table provides the Guckel ring test structure parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Mean radius of ring radius 200 um ring_mean_radius Width of ring bring 20 um ring width Width of cross beam bbeam 10 um cross_beam_width Size of anch
47. definition Once created the 3D model is displayed in an L Edit window Additional views of the model in separate windows may also be created These views can then be rotated translated and scaled The 3D Modeler may be used to catch errors in the layout and fabrication process before submitting a design to a foundry It is an essential tool for generating input files for 3D device analysis 3D models created in the MEMS Pro 3D Modeler may be exported for direct use with third party finite element and boundary element analysis tools including those available from ANS YS CFDRC Coyote Systems and Hewlett Packard Four examples of 3D models of MEMS devices a thermal actuator a rotary motor an accelerometer and a diaphragm are presented on the following pages MCNC MUMPs Thermal Actuator The model below is of a thermal actuator designed for the MCNC MUMPs 3 layer polysilicon surface micromachining process The thin arm has greater resistance than the thick arm Therefore when a voltage is applied to the contact pads the thin arm heats more rapidly and to a higher temperature than the thick Contents Index arm The larger thermal expansion of the thin arm causes the tip of the actuator to deflect upward L Edit heat heat 3D Model A file View Seup Window saja nae ae pe eel feet es eee Foe es I se BS eet et fe fret se ae 3585176023 a OT SS Pea ee 0s le ee el ee ne Eps ee a l
48. existing all angle objects with the approximated objects The third option is enabled only for DRC and Extract it deletes approximated objects when the action is complete Contents Index Generating Concentric Circles Location The ccircle dll library is located under the following directory lt install directory gt memslibs ccircle dll Description ccircle dll generates concentric circles on the current layer in L Edit Dimensions and the fill type of the circles must be submitted in an ASCII file Contents Index Accessing the Macro To access this macro select Tools gt Concentric Circles Concentric Circle Generator Ea M Concentric circle generator input file Browse Cancel Help Input File Format Figure 68 Concentric Circle Generator dialog Parameters Parameters Default Value Description Input File Input file name Input File Format Ccircle inp is a sample input file Contents Index Syntax group lt groupname gt CCIRCS lt circlename gt lt radius gt lt filltype gt endg lt groupname gt Comment lines begin with the character Example group AGroup CCIRCS circ 10000 1 circ2 20000 0 circ3 35000 1 endg AGroup Contents Index Parameters Parameters Default Value Description groupname Any sequence of characters is allowed for the groupname except and white space radius The radius of circle in Internal Units T
49. file containing the rotary side drive motor example is lt install directory gt Examples 3DModel mumps RotMotor motor tdb Analog Devices iMEMS ADXL Accelerometer Shown below is an accelerometer designed using Analog Devices iMEMS process The iMEMS process is a surface micromachining process that enables the fabrication of a polysilicon MEMS device and BiCMOS interface circuitry on a single chip The accelerometer is a center plate that is suspended between a pair of springs Comb fingers attached to the two sides of the plate create a differential capacitor with the set of fixed outer fingers The interface circuitry not shown creates a feedback control system that applies sufficient electrostatic force to balance the effects of acceleration The feedback is used to measure the acceleration Contents Index 3D Modeler Introduction Figure 71 Various views of the ADXL accelerometer In Figure 3 six views of the accelerometer are displayed clockwise from the upper left a layout view of the entire sensor a layout view of a set of comb MEMS Pro User Guide Contents Index 178 fingers two views of the 3D model of the comb fingers a 3D model of one of the springs and a layout view of a spring The tdb file containing the example of this accelerometer is lt install directory gt Examples 3DModel adimems adimems tdb Contents Index
50. file is a text file that describes in sequence the geometric effect of the fabrication steps used to build a device Process definitions are parameterized in geometric terms that is in terms such as etch depths and etch angles not in processing terms such as time of immersion or ambient temperature Process information can be entered into a process definition file and imported into L Edit or manually entered using the MEMS Pro Edit Process Definition dialog From the Edit Process Definition dialog the information can be stored in a process definition file and or stored as part of the layout in the Tanner Database tdb file Many designs use standard foundry processes for which process definition files have already been written MEMS Pro includes complete process definition files in design kits for major MEMS foundries including MCNC MUMPS Sandia M3S ADI MEMS and MOSIS NIST Details about design kits can be found in chapter Technology Setup on page 343 Contents Index Process definitions sequentially list process commands and their parameters All process parameters must appear between curly braces The style for each entry appears in the sample code below Command Parameter setting Parameter setting Parameter text Parameter real number Parameter setting Parameter text Label label text Comment comment text Although the parameters order may vary the parameters list must be complete An ac
51. force_polynome2 1 216000e 20 param force_polynome3 3 139320e 24 param force_polynome4 2 171035e 29 param m11 5 468008e 13 param dll 0 000000e 00 param k11 4 947165e 01 RK11 output_fl 0 1 k11 C_output_fl1 N11 N12 1 E_output_fl1 N11 0 output_f101 V_output_fl N12 0 0 Vdamp_output_fl output_fl N13 0 FD11 N13 0 V_output_fl ndari Hvel_output_fl output_fl_dt 0 V_output_fl 1 L_output_fl1 output_fl_d2t 01 Fvel_output_fl 0 output_fl_d2t V_output_fl1 1 GM11 output_fl 0 output_fl_d2t 0 ml11 Contents Index Goutput_fl 0 output_fl VALUE v input1 v inputl 1 538212e 10 3 855341e 15 v output_f1 1 216000e 20 v output_fl v output_f1 3 139320e 24 v output_fl1 v output_fl v output_fl1 2 171035e 29 v output_f1 v output_fl1 v output_fl1 v output_f1 Eoutputl outputl 0 VALUE 1 0 5 647164e 14 4 949925e4 19 v output_fl1 1 915843e 24 v output_fl v output_f1 2 133310e 29 v output_f1 v output_fl v output_f1 2 785264e 34 v output_f1 v output_fl v output_fl1 v output_f1 Contents Index ROM Tutorial This tutorial aims at briefly explaining how to use the R O M Reduced Order Modeling tool Finite element models may involve a large number of degrees of freedom so that full simulation especially in case of transient analyses can be prohibitively expensive The aim of the R O M tool is to make mod
52. how to contact technical support can be found by selecting About L Edit Figure 87 Options of the Help menu MEMS Pro User Guide Contents Index 208 3D Model Tool Bar Sees The 3D Model Toolbar buttons represent the most commonly used viewing commands See View Menu on page 195 Viewing a Cross section on page 215 and Linking to ANSYS on page 223 for specific descriptions of each command listed below S S DDDSe FRSH 2 aH PHP S OH Figure 88 3D Model View Toolbar MEMS Pro Palette gt 3D Tools gt View 3D Model View gt Orbit View gt Rotate gt X axis View gt Rotate gt Y axis Contents al 3D Model Cross section View View gt Preset Views gt Isometric View gt Preset Views gt Top p View gt Preset Views gt Front Index D View gt Rotate gt Z axis View gt Preset Views gt Right A View gt Pan p View gt Preset Views gt Bottom 2 View gt Zoom gt Drag View gt Preset Views gt Back iA View gt Zoom gt Box View gt Preset Views gt Left View gt Spin dy Invokes ANSYS The bottom icon on the right is not a 3D Model View command It is a hot link to ANSYS a program that performs finite element and boundary element analyses See the ANSYS Tutorial on page 176 for more information on ANSYS Note that in L Edit layout mode the 3D Model View and ANSYS buttons are both active while in 3D Model View mode only the ANSYS button Palette The 3D Model View
53. if the layer does not appear in the layout Enter the END string to indicate the end of the line Contents Index Limitations Negative Mask Without Hole For the time being if a negative mask contains no holes the resulting layout is not correct Substrate A substrate must appear in the 3D solid model of your active session Splines If the 3D is defined with splines instead of lines the layout generator considers splines as straight lines Boolean Operations on Layers The tool does not handle boolean operations on layers Contents Index Tutorial This tutorial illustrates how to use the ANSYS 3D Model to Layout Generator tools For this tutorial you will start from an existing model stored in an APDL file import it in to ANSYS modify it by adding volumes and deleting others then generate the corresponding CIF file The model you want to import is a micro mirror designed with the Surfmic technology Meshing and analyzing of the model is out of the scope of this tutorial Import Mems Mw Launch ANSYS 5 7 and select your working directory Note You can save all the necessary files under the same working directory But this is not mandatory Contents Index ANSYS to Layout Generator Tutorial Mv In the ANSYS Main menu click MEMSCAP Tools see Figure 14 ANSYS Main Menu EA Figure 14 ANSYS Main menu The MEMSCAP Tools menu appears z Figure 15 MEMSCAP Tools MEM
54. in the MEMS Pro Palette For detailed instructions see Editing the Process Definition on page 149 Contents Index Process Definition Example MUMPs The following process definition file describes the MCNC MUMPs 3 polysilicon layer process The form of a particular 3D model created using this process definition depends on its specific mask layouts ProcessInfo Name MUMPS Version 1 0beta Unit microns Wafer MaskName substrate Thickness 5 WaferID wl1 Target substrate Label Wafer Comment Wafer Deposit Deposit Type CONFORMAL Face TOP LayerName nitride Thickness 6 Scf c WaferID wl Target nitride Contents Index Label Deposit Nitride Comment Deposit Nitride Deposit Deposit Type CONFORMAL Face TOP LayerName Poly0 Thickness 5 Scf c WaferID wl Target Poly0 Label Deposit Poly0 Comment Deposit Poly0 Deposit Deposit Type CONFORMAL Face TOP LayerName o0x1 Thickness 2 Scf 15 WaferID wl Target 0xl Label Deposit Ox1 Comment Deposit Ox1 Etch EtchType SURFACI Face TOP askName Dimple Fl Contents Index EtchMask INSIDE Depth 75 Angle 87 Undercut 0 EtchRemoves ox1 WaferID wl Label Etch Dimple Comment Etch Dimple Deposit Etch Deposit Type CONFORMAL Face TOP
55. is emulated to produce a 3D model Intermediate models can be displayed by checking the Display 3D model for this step box When the 3D Modeler begins a checked step a new window will open to display the model as it exists at the conclusion of that step A separate window titled cellname 3D Model Step filename will open for each step marked by Display 3D model for this step Move Step To the right of the Process Steps list are two arrows These arrows allow you to move a selected highlighted Process Step up Ei or down 4 within the Process Steps list Contents Index Add Step The Add Step button will insert a step below the currently selected step and label it New Step The default step type is Deposit Once the new step has been added you can redefine the Command in the editing area to the right of the Process Steps list Commands available in MEMS Pro Version 3 include Deposit Etch Wafer and MechanicalPolish Delete Step You may delete steps from the process definition by selecting the step and clicking the Delete Step button Editing Individual Process Steps All Process Steps have three parameters in common the WaferID Label and Comment WaferlD This parameter identifies the wafer you will be working on MEMS Pro Version 3 supports just one Wafer so this value is set to a default value of W1 and cannot be edited Future versions of the software will support multiple wafers and user assigned names Content
56. key features also available in MEMS Pro encompass a 3D solid model generator using mask layout and process information a 3D solid model viewer with cross section capability a process description editor true curved drawing tools and automation of time consuming tasks using the MEMS Pro Easy MEMS features Embedded features within ANSYS 5 6 allow automatic mask layout generation from an ANSYS 3D Model and process description 3D to Layout as well as automatic MEMS behavioral Model generation in hardware description languages Reduced Order Modeling Total Solution S Edit schematics are easily transferred to EDIF SPICE and VHDL industry formats L Edit layout exports to standard formats accepted by mask makers and foundries including GDS II CIF and DXF through an optional converter 3D Contents Index models also can be generated from layout and process definition and viewed in the L Edit environment These 3D models may also be exported in SAT format and directly used with third party tools such as AutoCAD ANSYS Ansoft HFSS Maxwell 3D ABAQUS and MSC NASTRAN and those from CFDRC and Coyote Systems Now Version 3 00 offers the possibility to generate CIF format layouts from 3D models The Reduced Order Modeling feature generates MEMS behavioral models in SPICE and HDL A for fast and accurate system level simulations Contents Index Tool Flow Each stage of the MEMS design process is addressed by a different component of the
57. lee Pegi 220 slog re es wd Extract 8 03 s LEIN YALIS hipittoriafvesont tb J NODE NAME arises 1 RIGHT 85 889 30 ail ft 1 8 il 3 BOTTOM 155 98 267 4 Tor ts7 395 365 a Springlnc1 BOTTOM m 5_e BOTTOM e fspring L 0 0002 W 2E 061G 1E 05 06 16 05 AE AUG L AE 05 GAP 3E D06 NG 20 OL 1 5E 08 Springlnct 5_m TOP_m 6 TOPe fspring L 0 0002 W 2E 06 1G 1E 06 06 16 05 PE Contents Index Figure 102 Viewing the extracted file Vv Select File gt Exit to exit L Edit Contents Index Extracting Schematic for LVS To export a schematic netlist for use in LVS the schematic must contain only the device components and be free of all stimuli and simulation commands You will now re open the tutorial file Open S Edit Select File gt Open to open the reson sdb file Contents Index Mw Select Module gt Open to open the SchemLVS module fiom tke I tom Gee yl itn E r O l Figure 103 Schematic view of the resonator vi Select File gt Export to invoke the Export Netlist dialog Contents Index Verification E Extracting Schematic for LVS In the Export Netlist dialog choose Pin number order for the Netlist Port Order and uncheck the Enable waveform probing checkbox Click OK Export Netl
58. list and selecting Transient The command options dialog will replace the category list on the right side of the dialog In the example the transient analysis command options have been filled in p Modes DC operating point Standard from DC op point ay transfer sweep Powerup simulation ramp DC sources to final values ourier A TE Noise Preview mode view input signals Transient E F Transfer function Manimum time step Sn Parametric sweep Simulation length 500r sec E Current source 4 Files Output start time 0 sec E Initialization p Methods E Output Standard BDF Waveform relaxation E Settings Table Voltage source E Optimization p Sweep Sweep Not used Insert Command Cancel Figure 109 Customizing the transient analysis Contents Index Once the command parameters are set clicking the Insert Command button will create a grammatically correct SPICE command string and a schematic object is created that contains the SPICE command string Contents Index Schematic Object Creation As described in Command Tool Dialog on page 479 a SPICE command string will be formulated from your entries to the T Spice Command Tool dialog box In the Schematic mode an instance of a template module described in Template Module on page 482 will be created and placed at the cursor location if the Command Tool was accessed from the Schematic Toolbar or at the origin of the schemat
59. most up to date information MEMS stands for Integrated Micro machined mechanical Systems This process supports BiCMOS with MEMS surface micromachining with polysilicon as the structural layer Please refer to the website for more details Contents Index Sandia ITT Note See http www mdl sandia gov micromachine integrated html for the most up to date information EXPLANATIONS TO BE ADDED Contents Index MOSIS CMU Note See http Awww ece cmu edu mems cmos mems html for the most up to date information EXPLANATIONS TO BE ADDED Contents Index MOSIS NIST Note See http www mosis org New Technical Designsupport nist mems 1 html for the most up to date information This process enables the fabrication of MEMS structures using standard CMOS technology and a maskless post processing step Please refer to the website for more details Contents Index 17 Process Definition Introduction Process Steps ProcesslInfo Wafer Deposit Etch MechanicalPolish ImplantDiffuse Grow Process Definition Example MUMPs Contents Index 624 628 628 630 634 647 659 664 669 676 Introduction The 3D Modeler ascertains the three dimensional 3D characteristics of the designed device from fabrication process definition information in combination with L Edit mask layout The process information is contained in a process definition pdt file The process definition
60. pa in the installation directory A default file named Layout should be visible in the work area The L Edit user interface is similar in appearance to the S Edit user interface In addition to the menu palette and status bars there is a shortcut bar that contains buttons for the most commonly used menu commands As in S Edit L Edit files are assembled hierarchically from discrete usually functionally distinct units called cells which can be edited and instantiated The current file and cell are named at the top of the application window Contents Index Opening the File Select File gt Open to open the reson tdb file The Resonator cell should appear as the active cell Use this view of the Resonator cell of the reson tdb file as a reference while you work through this section Make the Layout file active by selecting the window containing Cell0 of Layout from the list of windows under the Window menu Creating Components The mask layout for MEMS components can be created using the Library Palette accessed via the Library option of the MEMS Pro Toolbar The MEMS Library Palette contains active elements passive elements test elements and resonator elements The resonator element collection contains all the parts you will need to create a resonator All of these parts can be created manually using the drawing primitives available in MEMS Pro but that task would be tedious and time consuming The MEMS Library Pal
61. ports P_GND P_MTL P_GND looks like a long rectangle 2 units thick stretching across the left side of the pad P_MTL looks like a long rectangle stretching across the right side of the pad Begin by connecting he PL_Left and PL_Right ports of PlateInst to the C_Free ports of CombLeft and CombRight Choose the Box tool m and select the Poly1 layer from the Layer Palette by clicking it Poly1 should be the first item in the fourth row from the top of the Layer Palette As you cover Poly1 the tool tip will read the layer name Poly1 will also appear in the list box at the top of the Layer Palette Draw a box covering the PL_Right port of Platelnst and the C_Free port of CombRight Click once to set the lower left corner hold the key down and drag to the opposite corner and release Draw a box covering the PL_Left port of Platelnst and the C_Free port of CombLett Contents Index We will now connect the PL_Top and PL_Bottom ports of Platelnst to the FS_Free ports of SpringTop and SpringBottom Connect the top folded spring to the plate by drawing a box on Poly1 covering the FS_Free port of SpringTop and the PL_Top port of PlateInst Connect the bottom folded spring to the plate by drawing a box on Poly covering the FS_Free port of SpringBottom and the PL_Bottom port of Plateinst Finally we will connect the FS_Free ports of SpringTop and SpringBottom to the GP_GND port of GroundPlatelnst Connect the ports of the two fold
62. rotary comb drive parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Inner radius of rotor ring rringi 38 um rotor_inner_radius Outer radius of rotor ring rringo 44 um rotor_outer_radius Inner radius of stator comb rsi 50 um stator_inner_radius Outer radius of stator comb rso 150 um stator_outer_radius Width of comb fingers fwidth 3 um finger_width Airgap between adjacent airgap 3 um finger_gap comb fingers Rotor spoke width rspokew 12 um rotor_spoke_width Stator spoke width sspokew 14 um stator_spoke_width Gap between stator spokes at sspokeg 5 um stator_spoke_gap radius Stator overlap as a fraction of rsovlp 0 3 finger_overlap length Contents Index S Edit Symbol Name S_RCDM_1_M_PHI_S and S_RCDM_1_M_PHI B for poly layer S_RCDM_2_M_PHI S and S_RCDM_2_M_PHI_B for poly2 layer Contents Index Rotary Comb Drive Elements Rotary Comb Drive Parameters S_RCDM_1 Inner radius of rotor ring rotor_inner_radius um ringi fe Outer radius of rotor ring rotor_outer_radius um ringo jo Cancel Inner radius of stator comb stator_inner_radius um rsi fo Outer radius of stator comb stator_outer_radius um rs fis Width of comb fingers finger_width um a Ajitgap between adj comb fingers finger_gap um Bt Rotor spoke width rator_spoke_width um tspokew 2s Stator spoke width stator_spoke_width um ss
63. simultaneously as you drag the mouse and can be accessed through a Ctrl Left click keyboard mouse combination Contents Index Rotate Rotate refers to a motion about a single axis As shown below you may choose to rotate the view about the X axis Y axis or Z axis In the diagram below the X axis is selected Once Rotate is selected the left mouse button must be clicked and the mouse must be moved to activate the command Note that since the point of view not the model is shifted moving the mouse to the left will appear to rotate the model to the right Preset Views gt Spin Orbit Toolbars Status Bars Figure 81 Selecting the X axis as rotation axis Contents Index Pan Pan translates your view of the object while maintaining its orientation and magnification If you move the mouse to the left the window will follow and your view will move to the left If you move the mouse to the top of the screen your view will follow to the top of the screen Pan can be accessed through a Ctrl Center click keyboard mouse combination For two button mice the combination Ctrl Alt Left click will access Pan Zoom As shown below the Zoom command varies the magnification of the 3D model Contents Index 3D Modeler Zoom Zoom gt In Zoom gt Out Zoom gt Fit Window MEMS Pro User Guide 3D Model View User Interface Figure 82 Selecting the zoom in command Magnification is increased by a factor of
64. single command A typical Grow step might be localized oxidation of silicon LOCOS The Depth Thickness and Undercut parameters model the geometric effects of the Grow step The effect of this step with Depth d Thickness t and Undercut u is shown in the following diagram Contents Index silicon u Contents Index Parameters for Grow are described below Parameters Description WaferlD Face MaskName Thickness This optional parameter identifies the Wafer to be grown Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferlID where valid entries will be text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Side of the Wafer to be grown Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Name of the inclusive mask layer The areas drawn on this layer will be affected by Grow Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for MaskName Any positive decimal number may be entered for the vertical height of the growth Contents Index Parameters Description Depth Undercut Target Source Maximum intrusion of the source material into the target as a percentage of the total Thickness Depth 50 implies that growth embeds its
65. spline from an angled wire perform the following operations Choose the Selection icon of the Drawing toolbar of MEMS Pro Select the angled wire often referred to as the reference wire Figure 53 by clicking on it Contents Index Splines Creating Splines L Edit Cell0 Layoutt Te Figure 53 Selecting the reference wire j Choose Splines gt Create in the MEMS Pro Palette MEMS Pro User Guide Contents Index 133 Splines Creating Splines The Create Spline dialog box appears Figure 54 Create Spline Figure 54 Create Spline dialog box Interpolation A shape factor between 1 O applied to the second vertex of the selected reference wire Figure 53 will cause the shape to behave like an interpolation spline i Select the second vertex on the left side of the Create Spline dialog box MEMS Pro User Guide Contents Index 134 Select the Interpolate radio button in the Control Point Shape Factor box Choose whether you want to replace the original object with the new one or not Click OK The interpolated spline appears in the L Edit window Figure 55 It goes through all the control points even the second one Contents Index Splines Creating Splines L Edit Cell0 Layout1 BoE M 181 x All Levels Spline Create Figure 55 Interpolation spline MEMS Pro User Guide Contents Index 136 NH A A A Appr
66. stator rso 200 um stator_pole_outer_radius electrode Angular width of rotor pole phirp 18 degrees rotor_pole_angular_width Angular gap between phirg 27 degrees rotor_poles_angular_gap adjacent rotor teeth Angular widh of stator pole phisp 18 degrees _ stator_pole_angular_width Angular gap between phisg 12 degrees stator_poles_angular_gap adjacent stator poles Angular offset of rotor roffset 0 degrees rotor_stator_angular_offset S Edit Symbol Name Contents Index S_RSDM_1_M_PHI for poly layer S_RSDM_2_M_PHI for poly2 layer MEMSLib Reference Active Elements Rotary Side Drive Elements Rotary Side Drive Parameters S_RSDM_1 Layout Parameter Entry Dialog Box 2s Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 556 Harmonic Side Drive Elements S_ HSDM_1 S HSDM_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a harmonic side drive on the first or second structural layer A central bearing bearing1 bearing2 has to be added to complete the harmonic or wobble motor The rotary side drive designed on the first structural layer S_HSDM_1 has a corresponding symbol S_HSDM_1_M_PHI The rotary side drive designed on the second structural layer S_HSDM_2 has a corresponding schematic S_HSDM_2_M_PHI Parameter List The following table provides the harmonic side drive parameters their values and descrip
67. that includes search and replace of strings and regular expressions incremental find and the Command tool for SPICE syntax assistance There are four areas on the T Spice user interface The menu bar at the top contains menu commands The toolbar beneath the menu bar contains tool icons The status bar at the bottom contains runtime information The work area in the center contains input file and runtime information windows Contents Index MEMS Pro Tutorial Simulating from a Netlist The T Spice window Figure 10 allows to view a SPICE file in which the exported resonator components their simulation parameters and connectivity are displayed T Spice Resonator sp File Edit View Simulation Table Options Window Help Mm Ei ojsjajele al gt e Bj e gt al Hi Resonator sp SPICE netlist written by S Edit Win32 6 00 Beta 6 Written on Feb 19 1999 at 15 04 26 Waveform probing commands probe options probefilename Resonator dat probesdbfile reson sdb probetopmodule Resonator Main circuit Resonator include process sp ac dec 500 10k 100k Xcomb_1 rtcbias Gnd rte rtm 0 comb Xcomb_2 ine Gnd lte ltm O comb Xfspring_1 gpbias Gnd tope topm fspring Xfspring_2 gpbias Gnd bote botm fspring Xplate4_i bote botm lte itm rte rtm tope topm O plated v1 ine Gnd 0 0 ac 1 0 0 0 Figure 10 T Spice window the simulation set up from S Edit will now be performed
68. the S Edit icon Xl Contents Index To open the tutorial select File gt Open and choose the file called lt install directory gt Examples optimize resonator reson sdb The schematic appears in the S Edit window Figure 88 S Edit reson sdb OptExample1_Start Schematic Page BEE Eie Edt View Modde Page Setup Hep su sele 2 4e aa A alela alela Ble Caa Al agal E Optimization Example 1 Finding the optim value ot spring length to achieve resonance at ili See the Optimization Chapter of the MMS Pro Wamal for more details p Simlation Commands Il lelle lslolo L A3 simulation comands using the Comand Tool d Click the T Spice toolbar button to invoke T Spice A SPICE netList uill be generated and the T Spice application will appear with the netlist opened 3 In the T Spice wind click the Simulate toolbar button P The simulation aill zun and the parameters uill be swept to discover the best value to achieve the desired resonare frequency 2 eS Lalo oo 19 ole et 1 feiic 4 Ure the Probe tool to view the simulated wavetom at the rtm node The At analysis curves should shoo esonance at hte A Tie comand tool can be used to aid in the placement of the simletion comands It it particularly vreful for ertering optimization commends via a wizerd MOVEEDIT MOVEEDIT DESELECT Selecti
69. the inside of the rotor on structural layer1 is the second bearing surface The clearance between the two bearing surfaces is determined by the thickness of the second sacrificial layer used in the surface micromachining fabrication process The radius of the shaft is set by the inner radius of the journal rotor and the second sacrificial layer thickness used in the process Contents Index Parameter List The following table provides the journal bearing parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Radius of cap of central shaft rcap 8 5 um cap_radius Inner radius of journal rotor rinner 4 5 um rotor_inner_radius Outer radius of journal rotor router 15 um rotor_outer_radius S Edit Symbol Name S_JBEARG_1 S Edit Test Schematic N A Contents Index MEMSLib Reference Passive Elements Journal Bearing Elements 1 Journal Bearing Parameters S_JBEARG_1 Layout Parameter Entry Dialog Box EPE eer Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 562 Journal Bearing Elements 2 S_ JBEARG_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a journal bearing intended to connect with a rotary element on the second structural layer The outside of the shaft on structural layer2 is one bearing surface while the inside of the rotor o
70. used to create and arrange multiple windows These commands are Cascade Tile Arrange Icons Split Horizontal and Split Vertical Figure 86 Options of the Windows menu Cascade Arranges windows in an overlapping fashion starting from the top left corner of the work area so that the title bars are visible The active window remains active in front Tile Resizes all the open windows so that they do not overlap Windows will appear in a row and column matrix MEMS Pro User Guide Contents Index 206 Arrange Icons Split Horizontal Split Vertical Currently open files Help Menu Arranges any minimized window icons presenting rows starting at the bottom left of the work area Splits the active window horizontally and copies the 3D model view onto both panels The 3D model or cross section views may be independently manipulated Splits the current window vertically and copies the 3D model view onto both panels The 3D model view or cross section views may be manipulated independently The last items on the Windows menu vary Names of all the currently opened windows appear below the Split Vertical choice Online versions of the standard L Edit manuals as well as the MEMS Pro User Manual can be directly accessed from the Help menu Information about the installation of L Edit on your machine including installed modules version Contents Index 3D Modeler 3D Model View User Interface number memory allocation and
71. 0 um elec_layer_line_width connect layer Contents Index Description Layout Parameter Default Value Schematic parameter name Name Wire width of first structural plwidth 12 um first_struct_layer_line_width layer Wire width of second p2width 12 um second_struct_layer_line_wid structural layer th S Edit Symbol Name N A Contents Index Crossover Test Structure Element Type 1 Multi layer Cross Over Parameters S_COTEST_1 Wire width of elect connect layer elect_layer_line_width um pOwiath oOo Wire width of first structural layer frst_ayer_line_width um p1 width heo ooo Cancel Wire width of second structural layer second_layer_line_width um p2 i Name of cell feen oo Layout Parameter Entry Dialog Box Layout Palette Button Layout Parameter Illustration Contents Index Crossover Test Structure Element Type 2 S_COTEST_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a crossover test structure that can be used to test electrical interconnection using bridges on structural layer2 to cross over lines on the first electrical interconnect layer The wires are anchored to the substrate except at the bridges Parameter List The following table provides the crossover test structure type 2 parameters their values and descriptions Description Layout Default Schematic parameter name Parameter Valu
72. 00e 06 Reference bias voltage 1 0000000e 00 Minimum DOF value gt Performing set of coupled analyses number 1 10 gt Performing set of coupled analyses number 2 10 gt Performing set of coupled analyses number 3 10 gt Performing set of coupled analyses number 4 10 Contents Index At the end of the coupled effect evaluations a summary of analysis points is Performing Performing Performing Performing Performing Performing set set set set set set of of of of of of coupled coupled coupled coupled coupled coupled printed If the capacitance relationship is requested the mutual capacitance value between first and second conductors Capa 1 2 is printed in the result table or the capacitance between the conductor and the ground Capa 1 1 if a single conductor is modeled analyses analyses analyses analyses analyses analyses number number number number number number 5 10 6 10 7 10 8 10 9 10 10 10 W O oO 2 0000000e 06 6666667e 06 3333333e 06 0000000e 06 6666667e 07 33333338207 4 2351647e 22 3 3333333e 07 6666667e 07 0000000e 06 5765530e 09 8065974e 09 3646935e 09 0811644e 09 8548790e 10 4327955e 10 3585629e 10 2922335 96 10 8555243e 10 3132108e 10 2358000e 14 0862294e 14 7759145e 15 9370341e 15 2623515e 15 7036706e 15 2307667e 15 8235294e 15 4679561e 15 1539385e 15 Contents Index Once the numeri
73. 01 derivative 3 73793 Optimization initialization resid 0 278656 grad 3 73793 Marquardt 0 001 Optimization parameters springlength 0 00011275 derivative 0 640763 Contents Index Optimization iteration 1 resid 0 067675 grad 0 640763 Marquardt 0 0005 Optimization parameters springlength 0 00011725 Optimization iteration 2 Marquardt 0 00025 Optimization parameters springlength 0 0001175 Optimization iteration 3 Marquardt 0 000125 Optimization iteration 4 Marquardt 0 0005 Optimization iteration 5 Marquardt 0 002 Optimization iteration 6 Marquardt 0 008 Optimization iteration 7 Marquardt 0 032 Optimization iteration 8 Marquardt 0 128 Contents derivative 0 0522022 resid 0 00669069 grad 0 0522022 derivative 0 00137331 resid 0 00221041 grad 0 00137331 resid 0 resid 0 resid 0 resid 0 resid 0 Index 00221041 00221041 00221041 00221041 00221041 grad 0 grad 0 grad 0 grad 0 grad 0 00137331 00137331 00137331 00137331 00137331 Optimization iteration 9 resid 0 00221041 grad 0 00137331 Marquardt 0 512 Optimization iteration 10 Marquardt 2 048 Optimization parameters springlength 0 00011775 Optimization iteration 11 Marquardt 1 024 Optimization iteration 12 Marquardt 4 096 Optimization parameters springlength 0 00011775 Optimization iteration 13 Marquardt 2 048 Optimized parameter val
74. 12 0 6428 shift I I The next output indicates the sweeping parameters for coupled effects evaluation A status is printed after each set of analyses Number of analyses 10 Degree of fitting 4 Minimum DOF value 2 0000000e 06 Maximum DOF value 1 0000000e 06 Reference bias voltage 1 0000000e 00 Contents Index gt Performing set of coupled analyses number 1 10 gt Performing set of coupled analyses number 2 10 gt Performing set of coupled analyses number 3 10 gt Performing set of coupled analyses number 4 10 gt Performing set of coupled analyses number 5 10 gt Performing set of coupled analyses number 6 10 gt Performing set of coupled analyses number 7 10 gt Performing set of coupled analyses number 8 10 gt Performing set of coupled analyses number 9 10 gt Performing set of coupled analyses number 10 10 At the end of the coupled effect evaluations a summary of analysis points is printed As a single conductor is modeled there is only one capacitance value between this conductor and ground Point Master DOF Reduced FMAG Capa 1 1 1 2 0000000e 06 2 5765530e 09 1 2358000e 14 2 1 6666667e 06 1 8065974e 09 1 0862294e 14 3 1 3333333e 06 1 3646935e 09 9 7759145e 15 4 1 0000000e 06 1 0811644e 09 8 9370341le 15 5 6 6666667e 07 8 8548790e 10 8 2623515e 15 6 3 3333333e 07 7 4327955e 10 7 7036706e 15 a 4 2351647e 22 6 3585629e 10 7 2307667e 15 8 3 3333333e
75. 7 ANSYS to Layout Generator 278 Contents Index Help Introduction onic ccccccccccccsssccsssecsssecsssecessecsseesessecssecee 279 3 D to Layout Tools esses 281 OV CEY LOW ae leanituau atone wes sees amas 281 Imp rt Mems a iotgses cane cttlctan tase iea stare seiadee ciation ER 285 Creation of Volumes 2 51 3 lt cct73 Sera esleconsrumeaimnceieen aes 287 Deletion of Volumes csrscssscnepunesenininniiiiei 291 Addition of Volumes sssssssseesseessssessiessresssrerssesssessressresses 292 Component Names s 2c22 2 tact eee neath 292 Saving MEMS 24 uot ea cle oto 295 Oa ist EE EEE E E 296 Exporting a CIF File sts cscs Ri Seca Serer eelae ames oe 297 The LAYOUT Menu Item 00 eccccseeseseseseeeeseseneeeeees 298 The Layout Generator Program 299 Definition of a Technology File 303 Limitations gees eiiacas ss agesaten ees 315 Contents Index Help Negative Mask Without Hole 0 0 ccceeeceeeeeseeeeeeeeees 315 SUDSU AUC 7 ccuiretmec ura earthen cites anemia 315 SS PMS anien certian Cotes tec E eee 315 Boolean Operations on Layers cccccessseceseeeeteteeeeeeeees 315 Tutorial tainicn rc tenic dani AN 316 Inport Mems 355 4 tee amin atadsianei ea meetin 316 3D Modification Saurna nuan a asides 323 The Layout Generator Program 0 cceceeceeeeeteeeeeeeeees 326 Reduced Order Modeling 334 User Mantal eserde aE 335 UOC COM sicsiericumotmie ien e aa aa ii
76. AN RED RED BLUE BLUE GREE LAYOUT LAYOUT LAYOUT LAYOUT LAYOUT LAYOUT LAYOUT Index poly anchor dimple metal contact holpoly holmetal 2 3 4 5 6 7 Some requirements Place SU before the substrate NEG before the negative mask or OXIDE and before particular layers There should be a space or a tabulation before the other layers Name of the component in ANSYS should not be longer than 8 characters Except for the substrate that has no CIF code the name of the CIF code should not be longer than 3 characters For the negative mask indicate the CIF code of its hole For special layers indicate the CIF code of the layer they belong to In this example for the ANCHOR layer you have to indicate the CIF code of POLY 1 For the substrate enter either a space or a tabulation The COLOR string Contents Index 8 The ANSYS color code except for hole layers and substrate is the following MRED Magenta Red CBLU Cyan Blue YGRE Yellow Green DGRA Dark Gray MAGE Magenta CYAN Cyan YELL Yellow LGRA Light Gray BMAG Blue Magenta GCYA Green Cyan ORAN Orange WHIT White Contents Index 9 10 11 BLUE Blue GREE Green RED Red BLAC Black The LAYOUT string If the layer does not appear in the layout enter either a space or a tabulation Indicate the name of the layer in the layout except
77. B_2_ M_X Contents Index MEMSLib Reference Passive Elements Linear Crab Leg Suspension Elements Type 2 Linear Crab Leg Suspension Parameters S_LCLSB_1 Layout Parameter Entry Dialog Box wanchor Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 571 Linear Folded Beam Suspension Elements S_LFBS_1 S_LFBS_ 2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a linear folded beam suspension on the first or second structural layer Actuators or other mechanical elements can be connected to the yokes at the ends of the shuttle mass Parameter List The following table provides the linear folded beam suspension parameters their values and descritpions Description Layout Default Schematic parameter Parameter Value name Name Length of beam Ibeam 150 um flexure_length Width of beam wbeam 4 um flexure_width Seperation between beams beamsep 50 um beams_separation Width of connecting bar wbar 12 um truss_width Width of shuttle swidth 30 um shuttle_width Contents Index Description Layout Default Schematic parameter Parameter Value name Name Width of anchor support wanchor 25 um anchor_width Width of shuttle yoke wsyoke 12 um shuttle_yoke_width Length of shuttle yoke Isyoke 98 um shuttle_yoke_length S Edit Symbol Name S_LFBS_1_M_X S_LFBS_2_M_X Contents
78. CIF layer is made from projections of connected volumes of several components The relation between the name of the component in ANSYS and the name of the layer in the resulting layout for a specific example technology is shown in the following table For the technologies some layers representing holes HOLPOLY and HOLMETAL for example in the surfmic technology are defined Those layers are not used in the 3D models They are in the components list but you must not associate them with volumes Contents Index The surface micromachining process COMPONENT LAYER NAME NAME SUBSTRAT POLY poly ANCHOR anchor DIMPLE dimple METAL metal CONTACT contact HOLPOLY holpoly HOLMETAL holmetal Contents Index Saving Mems If you made some modifications to the 3D Solid Model you can save them as a database see Figure 9 with the Save MEMS option It is exactly the same as the Save as option in ANSYS VM Select MEMSCAP Tools gt 3 D To Layout gt Save MEMS in the ANSYS Main Menu The Save Database of your MEMS dialog box appears Figure 9 Contents Index ANSYS to Layout Generator 3 D to Layout Tools Save Database of your Mems Figure 9 Save Database of your MEMS In the Directories list choose the directory and in the File Name field enter the name of the database db then click OK Unit Before converting a database into a CIF file define the mep_unit varia
79. Command Tool Module Menu In the Schematic mode of S Edit the Command Tool may also be activated by selecting Module gt Command Tool Figure 107 Selecting the Command Tool Option of the Module Menu Selecting Module gt Command Tool will invoke the T Spice Command Tool dialog MEMS Pro User Guide Contents Index 478 Command Tool Command Tool Dialog Command Tool Dialog The graphical interface for the Command Tool is the T Spice Command Tool dialog Figure 108 T Spice Command Tool E Voltage source E Optimization Figure 108 T Spice Command Tool dialog The left side of the dialog displays a hierarchical list of command categories Double clicking on a category or clicking the plus or minus sign next to the category name expands or collapses the list of specific commands The right side of the dialog displays the list of commands corresponding to the selected MEMS Pro User Guide Contents Index 479 category When a specific command is highlighted on the left side or a command is selected from the command list on the right hand side the right side of the dialog contains a field for each of the variables required by the command The T Spice command is generated from your dialog entry for the command variables The following example is a T Spice Command Tool dialog for a transient analysis Figure 109 This is done by clicking the plus sign in front of the Analysis category to expand the command
80. Create Spline Figure 57 Angled wire MEMS Pro User Guide Contents Index 140 Warning The resultant curved wire is realized with a polygon since L Edit does not implement a spline primitive This has the downside of forcing you to start over if you click OK and then change your mind Creating Splines from Polygons A more impressive possibility is that splines can be generated from polygons To view the advantages of this feature perform the following steps VM Create a five vertex polygon Figure 58 Contents Index Splines Creating Splines L Edit Cell0 Layout1 Boe M lalxl Figure 58 Polygon MEMS Pro User Guide Contents Index 142 Splines Creating Splines Select the polygon Select Splines gt Create in the MEMS Pro Toolbar The Create Spline dialog box appears Mw Modify the shape factors of all the vertices so that the curve approximates each vertex Figure 59 Create Spline 26 000 Figure 59 Modifying the vertex shape factors i Click OK MEMS Pro User Guide Contents Index 143 Splines Creating Splines The created rounded shape of the polygon appears Figure 60 L Edit Cell0 Layout1 I 5 1G all Levels 2 000 Va Figure 60 Rounded shape of the polygon MEMS Pro User Guide Contents Index 144 You can choose to either interpolate or approximate the vertices of the polygon In the case of
81. For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 186 Contents Index 3D Modeler Editing the Process Definition Etch Etch is used to sculpt the terrain of the Wafer If the process Command is set to Etch new parameters will appear on the right side of the Process Steps list The specific parameters required to define this step depend on the selected combination of EtchType and EtchMask Emoe Unde Grid Layer Drag Box Layer Eee Figure 103 Process Definition dialog box MEMS Pro User Guide Contents Index 241 Possible EtchTypes are SURFACE BULK and SACRIFICIAL Possible EtchMasks are INSIDE and OUTSIDE SURFACE etches remove material that has been deposited during previous steps BULK etches remove parts of the Wafer A SACRIFICIAL etch completely removes all bodies on the EtchRemoves layers It does not require masking and therefore there is no setting for EtchMask or MaskName for a SACRIFICIAL etch The orientation of the Wafer must be taken into account when setting these parameters Orientation Considerations The Face to be etched may be the top face TOP the bottom face BOT or both faces simultaneously TOPBOT If you are designing masks for processing on both faces of the wafer you must be careful of the orientation of the masks As Alan Nutt of Kodak Research Laboratories points out to ensure correct alignment as drawn in layout of the masks
82. INOW Figure 58 Shematic view of the accelerometer Click Module gt Open The Open Module window appears MEMS Pro User Guide Contents Index 393 Reduced Order Modeling ROM Tutorial Open Module 3by3 Figure 59 Open Module window Choose Accelerometer_3by3 as the Module to Open and click OK The module appears in the S Edit window MEMS Pro User Guide Contents Index 394 Reduced Order Modeling Ir Ol Ie co a Ke MASAN fran AZ clamped i clamped The input ports represent load cases on each direction The bidirectional ports stand for the various chosen Master DOFS Voltage output quantity stands for displacement in the chosen direction ROM Tutorial Figure 60 Schematic view of the Accelerometer_3by3 module M Click View gt Schematic Mode Click the T Spice Command Tool Figure 61 MEMS Pro User Guide Contents Index 395 S Figure 61 T Spice Command Tool The T Spice Command Tool window appears Left click anywhere in the blank design sheet Select Files gt Include Files and click Browse in the right part of the window The T Spice Command Tool window appears Contents Index Reduced Order Modeling T Spice Command Tool Current source Files Library file Table file Delete library file Initialization Output Settings Table Voltage source oy Optimizati
83. Left click the newly drawn dimple box to select it Move the dimple into place with a center click Alt Left click for two button mice and hold drag and release at the desired location The dimple should be Contents Index MEMS Pro Tutorial Drawing Tools placed to the right side of the rotor so that it is approximately 90 from the next nearest dimple Figure 37 new dimple Figure 37 Creating a dimple This concludes the basic tutorial of MEMS Pro MEMS Pro User Guide Contents Index 96 MEMS Pro Toolbar Introduction Library Menu 3D Tools Menu Easy MEMS Menu Splines Tools Help Contents Index 98 103 109 114 118 121 124 Introduction The new MEMS Pro Toolbar see Figure 38 offers the opportunity to access relevant MEMS specific features These features are either former options that were previously accessible from the Tools menu of the L Edit menu bar Library Palette 3D Tools menu and Polar Array option or new created features Plate Release option Splines menu and Tools menu that facilitate the designer s tasks The MEMS Pro Toolbar can be launched automatically at the opening of the L Edit session Its purpose is to better expose all the MEMS Pro features to the user MEMS Pro MEMSCAP Library 3D Tools Easy MEMS Splines Tools Help Figure 38 MEMS Pro Toolbar If the MEMS Pro Toolbar is not automatically loaded perform the following operations Conten
84. MEMS Pro tool suite T Spice Mixed MEMS IC MEMS Modeler Simulator Reduced Order Modeling Powered by ANSYS Multiphysics S Edit Schematic Editor Library Manager FEA Model ANSYS Other FEA 3D Multiphysics Tools SAT 3D Model Generator UPI L Edit Found and hints Viewer User Full Custom Description 4 Programmable Layout Editor 3D to Interface Layout CIF GDSII Foundry Services Contents Index Schematic Capture S Edit S Edit is a fully hierarchical schematic capture program for MEMS and IC applications The program also serves as a schematic entry front end to the T Spice simulator L Edit SPR automatic standard cell placement and router and layout vs schematic LVS netlist comparison programs S Edit and its associated libraries are technology independent that is the design may be built and tested before choosing a specific manufacturing technology and vendor User defined global symbols convey connection among nodes without wiring S Edit also supports global node naming so that a single symbol can represent several distinct nodes in the design Using S Edit MEMS schematics can be designed to include signals in multiple energy domains For example the MEMS Library includes a set of examples of electro mechanical schematic symbols and models Simulator T Spice Pro The T Spice simulator provides full chip analysis of analog mixed analog digita
85. MS Pro MEMS Pro supports objects such as all angle wires and polygons arcs tori circles splines and curved polygons We will use some of these to draw a rotary side drive motor A special tutorial to use splines is given in Chapter 4 Splines Tutorial Breakpoint If you are starting the tutorial here double click the L Edit icon Ten object types are supported Box Polygon Wire Circle Arc Torus Splines Contents Index Port Ruler Instance Note For more information on drawing objects see Drawing and Editing Objects on page 1 240 of the L Edit User Guide MV From L Edit open the motor tdb file complete motor E EE example Area to be completed In the visible cell Demo there are complete left and incomplete right layouts of a rotary side drive electrostatic motor This part of the tutorial will guide you in finishing the incomplete design Contents Index Drawing a Wire On the incomplete motor design a pad is not attached to a stator on the poly layer A wire must be drawn to connect this pad to its stator The anchor point is the first vertex of a wire Wires can have several vertices 5 Select View gt Zoom gt Mouse so that the pad and torus are visible as in Figure 32 Left click at one box corner hold the button down as you drag to the opposite box corner and release Figure 32 Wiring the pad to the stator Contents Index Select All A
86. OUTSIDE Depth 6 75 Angle 90 Undercut 0 EtchRemoves Poly2 WaferID w1 Label Etch Poly2 Comment Etch Poly2 Deposit DepositType Face TOP LayerName Thickness WaferID wl Label Sp Comment t tch EtchType SU Face TOP askName EtchMask OU Depth 52 Angle 90 Undercut EtchRemoves WaferID wl Con SNOWFALL Metal 52 m Target Metal utter Metal Sputter Metal RFACE Metal TSIDE 0 Metal m tents Index Fl tch Label Metal Liftoff Comment Metal Liftoff Et chType SACRIFICIAL Face TOP EtchRemoves ox1 EtchRemoves 0x2 WaferID wl1 Label Sacrificial Etch Comment Sacrificial Etch Contents Index INDEX Numerics 3D model deletion 119 178 edition 353 export 120 180 378 generation 77 importing to ANSYS 380 meshing in ANSYS 388 view 72 81 118 149 viewing in ANSYS 380 3D Model View toolbar 169 3D Modeler accelerometer 138 cross section 175 defining colors for models 147 Contents Index deleting a model 178 diaphragm 141 error checking 212 exporting 3D models 180 input formats 143 menu bar File menu 153 Help menu 167 Setup menu 165 Tools menu 164 View menu 156 Window menu 166 menu bar 153 multiple views 79 output formats 143 palette 170 rotary motor 136
87. Pro Version 3 supports just one Wafer the WaferlD is assigned automatically and is read only The default value of w1 will override any entry made for WaferID where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Type of etch Parameter options are SURFACE BULK and SACRIFICIAL The value is set to SACRIFICIAL for a sacrificial etch Side of the Wafer to be etched Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Name of layer to be removed by this etch Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for EtchRemoves There may be multiple entries of this parameter Contents Index Parameter Description Label Comment During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Comment may be any text enclosed in quotation marks Contents Index MechanicalPolish The syntax for the MechanicalPolish command is given below followed by an example containing valid entries for its parameters Syntax MechanicalPolish WaferID S Face face Depth P Thickness P Label S Comment S Example MechanicalPolish WaferID wl1 Face TOP Depth 23 0 Label Mechanical Polish Comment Mechanical Polish Contents Index Descr
88. S Pro User Guide Contents Index 317 ANSYS to Layout Generator Tutorial Mw Then click 3 D To Layout Figure 15 The Prompt dialog box appears Figure 16 E Figure 16 Prompt dialog m Enter the technology file name Surfmic Remember that single quotes are necessary and that the name must not be longer than 8 characters i Click OK The 3 D To Layout menu appears Figure 17 MEMS Pro User Guide Contents Index 318 ANSYS to Layout Generator Tutorial 3 D To Layout Ea Figure 17 3 D To Layout menu j Click Import MEMS to import a 3D model The Import Mems menu appears Figure 18 MEMS Pro User Guide Contents Index 319 ANSYS to Layout Generator Tutorial Import MEMS Ed Figure 18 Import MEMS menu yw Click Inp File and the following dialog box opens Figure 19 Import Your INP File Figure 19 Import Your INP File dialog box MEMS Pro User Guide Contents Index 320 Select the mirror inp file under the appropriate directory Click OK ANSYS warnings appear Click OK to close the warning messages The 3D model mirror appears in ANSYS Graphics Figure 20 Contents Index ANSYS Graphics YPLOT type 1 mat 1 re VOLUMES TYPE NUM Figure 20 ANSYS Graphics window Contents Index 3D Modifications You will now delete parts of the mirror These parts are blocks of the levers VM Click Delete Volumes gt Volume amp Below in the 3 D To Layout me
89. T_P12 VIA1 VIA2 VIA3 OXIDE2 OXIDE3 OXIDE4 OXIDES PASSIV LOCOS PWELL ACTIVE N NPLUS PPLUS ACTIVE P MEI ME2 ME3 CNT VII VI2 VI3 OX2 OX3 Ox4 OX5 PAS LOC PWE NPN NPP PPN PPP HM1 HM2 HM3 PO2 MEI ME2 ME3 CNT Vil VI2 VI3 PAS LOC PWE NPN NPP PPN PPP COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR COLOR Contents BLUE CBLU BMAG MAGE BLUE CBLU BMAG YELL ORAN GREE YELL YGRE WHIT LFRA DGRA DGRA MRED MRED LAYOUT LAYOU LAYOU LAYOU T T T LAYOUT LAYOU T LAYOUT LAYOU LAYOU LAYOU LAYOU T T LAYOUT LAYOU Index metall metal2 metal3 cont_plp2 vial via2 via3 passiv pwell nplus nplus pplus pplus SU HOLE_P1 HOLE_P2 HOLE M1 HOLE_M2 HOLE_M3 HP1 HP2 HM1 HM2 HM3 POL PO2 MEI ME2 ME3 LAYOUT LAYOUT LAYOUT LAYOUT LAYOUT holepoly1 holepoly2 holemetal1 holemetal2 holemetal3 The following is a technology file of the Surfmic process for ANSYS SUBSTRAT POLY ANCHOR DIMPLE METAL CONTACT HOLPOLY HOLMETAL ge O z ls HPO POL MET HME MET POL MET COLOR COLOR COLOR COLOR COLOR COLOR Contents CY
90. Table Of Contents Table Of Contents 20 i Introduction enean MEMS Pro System 20cecescssssssssssssssssssnsnsen Total Solution 45 ees ieiuna in a AR R Tool FOY aoe a AA Schematic Capture S Edit pce yess a so tanatt basi es etenteactas Contents Index Simulator T Spice Pro sedi tincnndenenionentieiss 6 Layout Editor L Edit csc ter ccs as ccna scaettetenateceeaatuarern teat eee 7 User programmable Interface 0 0 0 eeeceeeeeeeteeeeeeeeeeteteees 8 Layout vs Schematic LVS o ecceccceseeseseseseeeeeseeeeeeeeeeesees 9 SID Modelek roetine aoe Lota tact ens cath ata n 9 MEMS Block Place and Route 0 0 0 ccceeeeseteteeeeseeeeees 9 MEMS Library MEMSSLib eeceeecctesesesceeseseseesesesenes 10 Foundry SUpport orines n a e 10 Embedded features in ANSYS ccccccccccceseeseeeeeeeeetenees 10 Reduced Order Modeling Macro Model Generation 10 Automatic mask layout generation 3D to Layout 11 What s New in Version 3 0 0000000000000000000000000nn 12 Documentation Conventions 13 Contents Index Help MEMS Pro Tutorial 16 Introduction is 55 cs8s50 nate berarastat aketies 17 The Design Example x cadec cceeniacstagterciassteraiieneduesaoeai ences 18 Creating a Schematic 0 0 0 0 19 Launching S Edif ites usesscussat gisahid tsa tascien Gannett 19 Opening the File sunieiaps ees Rear ete rene etter na enn tees rere 20 Creating a New Module lt c05 25 5 c 0nacuauch wana lace 22 Instanti
91. Toolbar menu The ANSYS to Layout dialog box opens Figure 25 The first field refers to the name of the CIF file without extension the second one to the name of the cell containing the layout and the last field to the technology file name MEMS Pro User Guide Contents Index 327 ANSYS to Layout Generator Tutorial Figure 25 ANSYS to Layout dialog box Attribute a name to the CIF file mirror enter the name of the cell and the name of the technology file Surfmic Click OK The mirror cif file has been created in your working directory You can now access this file in MEMS Pro Launch L Edit MEMS Pro User Guide Contents Index 328 Select File gt New to create a new file The New File dialog box appears Figure 26 File type CE Copy TDB setup from file fcempty gt Browse Layout Figure 26 New File dialog box Choose Layout as File Type and lt empty gt in the Copy TDB setup from file Click OK Select File gt Replace Setup The Replace Setup Information dialog box appears Figure 27 Contents Index ANSYS to Layout Generator Tutorial Replace Setup Information tw a a 9 2 Figure 27 Replace Setup Information dialog box Browse for the ledit tdb file that is located in the installation directory Click OK Select File gt Import Mask Data MEMS Pro User Guide Contents Index 330 ANSYS to Layout Generator Tutorial The Import Mask Data
92. _PHI_S and S_RCOMBUA_2_M_PHI B for poly2 layer Contents Index MEMSLib Reference Active Elements Unidirectional Rotary Comb Drive Elements Type2 Unidirectional Rotary Comb Parameters S_RCOMBUA_1 Unidirectional Rotary Comb Drive Layout Parameter Entry Dialog Box Motor Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 545 Bidirectional Rotary Comb Drive Elements S_RCOMBD_1 S RCOMBD_ 2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a bidirectional rotary comb drive on the first or second structural layer The bidirectional rotary comb drive designed on the first structural layer S_RCOMBD_1 has a corresponding symbol S_RCOMBD_1_M_PHI_S and a corresponding behavioral model S_RCOMBD_1_M_PHI_B The bidirectional rotary comb drive designed on the second structural layer S_RCOMBD_2 has a corresponding schematic S_RCOMBD_2_M_PHI_S anda corresponding behavioral model S_RCOMBD_2_M_PHI_B Parameter List Contents Index The following table provides the bidirectional rotary comb drive parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Active angular comb length aclength 120 degrees active_comb_length Inner radius of rotor rri 50 um rotor_inner_radius Inner radius of stator comb rsi 60 um stator_inner_radius Outer radi
93. a CIF file a 3D model must be represented in the active session of ANSYS In the layout CIF file the program creates all the layers of the 3D solid model defined in the previously specified technology file If you do not want to load all the layers refer to Definition of a Technology File If you click LAYOUT in the ANSYS Toolbar or Export CIF File in the 3D to Layout palette the ANSYS to Layout dialog box Figure 12 prompts you to enter the appropriate information Contents Index ANSYS to Layout Generator The Layout Generator Program Figure 12 ANSYS to Layout dialog box m In the CIF File Name field enter the name of the CIF output file without its extension m In the Cell Name field enter the name of the layout cell that will contain the layout m In the Technology File Name field enter the name of the technology file MEMS Pro User Guide Contents Index 300 Note Note The technology file name should not be longer than 8 characters and should match the one you used when you started the session All the entries must be between single quotes These single quotes are already loaded in the dialog box The CIF name and the cell name cannot contain more than 8 characters If you enter a name including more than 8 characters ANSYS only takes into account the first 8 characters If the name contains a dot the Layout Generator only takes into account the characters placed before the dot For example
94. a resistor whose resistance is a function of the spring geometry 5i Mapped to the electrical domain k becomes 1 R I represents force F and V represents position x Therefore the subcircuit model is subckt LinearSpring nle n2e nlm n2m k 1 Re 1k Rmech nim n2m 1 k Relect nle n2e Re ends To use this model in a SPICE file reference it by Xspring nle n2e nim n2m LinearSpring k 5 Re 2k The external model feature can model behavior that cannot be described in terms of electrical primitives for instance the behavior of a controlled source that depends on arbitrary functions of state variables Contents Index Note The External Model feature is fully described in the chapter entitled User Defined External Model on page 634 of the T Spice User Guide and Reference Contents Index Layout Generators Note We frequently refer to L Edit concepts operations and commands all of which are more fully described in the L Edit User Guide For more detailed information on writing UPI code see Programming the User Interface on page 4 10 of the L Edit User Guide To learn how to create a new layout generator follow the instructions in the L Edit UPI On Line Tutorial Here we describe an existing layout generator Sample Layout Generator The following code generates a rectangular plate drawn on the Poly layer from values supplied by the user The plate is parameterized by its length and width The macro i
95. agnification NoMag if LCell_Find File_Now plate name LLayer_Find File_Now LCursor_GetPosition Contents Index LDialog_AlertBox Cell with that name exists EXITING return 0 Cell_Now LCell_New File Now plate name draw the plate LBox_New Cell_Now Layer_Polyl 0 O plate length plate width instance plate cell into current cell NoMag num LLen 1 NoMag denom NoMag num Plate_Xform LTransform_Set Point_Cursor x Point_Cursor y LNormalOrientation NoMag Plate_Inst LInstance_New Cell_Original Cell_Now Plate_Xform LPoint_Set 1 1 LPoint_Set 0 0 Linstance_SetName Cell_Original Plate_Inst plate instname LCell_MakeVisible Cell_Original return 1 Contents Index 15 MEMSLib Reference Introduction Using the MEMS Library Active Elements Passive Elements Test Elements Resonator Elements Contents Index 519 524 532 560 578 601 Introduction MEMSLib provides a library of components from which full MEMS devices can be built The library provides schematic symbols export to SPICE capability SPICE models and parameterized layout generators The layout generation part of this library is largely based on creating a graphical user interface to the Consolidated Micromechanical Elements Library CaMEL developed at MCNC The layouts for the library elements are automatically generated based on som
96. al tdb Design Navigator s Ali tutorial design navigator design navigator Figure 113 Tutorial design navigator and mems design navigator MEMS Pro User Guide Contents Index 492 Block Place and Route Tutorial Initializing the Design Mi From the mems tdb file s Design Navigator select the Capacitor and drag and drop it into the tutorial tdb file s Design Navigator a k Poy Top down all cells Capacitor Cell Comb Comb2 5 CombDrive o N_100_2 F Top down all cells N_400_2 N500_2 Capacitor P1002 Comb P_800_2 Comb2 pad CombDrive Plate E main resistor N_100_2 E resonator N_400_2 Spring N_500_2 Via P_100_2 P_800_2 pad Plate resistor amp resonator Spring Via Figure 114 Copying cells from a database to another Mv Likewise drag and drop the cells N_100_2 N_400_2 N_500_2 P_100_ 2 P_800_2 pad resistor resonator and Via into tutorial tdb MEMS Pro User Guide Contents Index 493 Warning Note Do not copy the main cell Since the Spring is referenced by the resonator it is automatically copied The cells you copied include a capacitor three NMOS transistors two PMOS transistors a pad a resistor a resonator and a via Use Ctrl S to save your tutorial tdb file Close both Design Navigator windows by clicking the X button on the upper right corner of the windows Contents Index Block Place and Route Tutorial Initializing the Design yw
97. ally and is read only The default value of w1 will override any entry made for WaferID where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Contents Index Parameter Description DepositType Face LayerName Target Thickness Label Type of deposit Parameter options are CONFORMAL SNOWFALL and FILL The value is set to SNOWFALL for a snowfall deposit Side of the Wafer to receive the deposit Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Name of the layer to be deposited Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for LayerName LayerName is often set to the same value as Target Target specifies the 3D model rendering characteristics of the deposited layer You may enter any valid L Edit layer name as text enclosed in quotation marks for Target Target is often set to the same value as Layername For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 114 Any positive decimal number may be entered for the vertical dimension of the SNOWFALL deposit This thickness is deposited on the side s specified by the Face parameter During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation ma
98. an interpolation the curved resulting shape goes through all the vertices of the polygons In the case of an approximation the curved resulting shape does not go through any vertex of the original polygon Contents Index Editing Splines Note A spline editor has been added to MEMS Pro to help in fluidics device layout To edit a spline perform the following operations Select the spline you want to modify Choose Splines gt Edit in the MEMS Pro Palette The Create Spline dialog box Figure 52 appears Follow the same method as the one used to create splines It is the same dialog as the one used for the creation of splines Using the dialog box radio buttons and or slide bar you can change the behavior of the existing spline to come back to the original shape an angled wire or to apply the opposite shape factor Contents Index MEMS Pro Utilities Introduction Running Macros in L Edit Generating Polar Arrays Generating Holes in a Plate Viewing Vertex Coordinates and Angles Approximating All angle Objects Generating Concentric Circles Contents Index 148 149 150 154 157 164 168 Introduction The MEMS Library contains a host of macros that facilitate the MEMS layout design process In this chapter we describe where these macros are located and how to use them Contents Index Running Macros in L Edit The macros described in this chapter should have been loaded automaticall
99. and drag a box around the tip of the peak in vm rtm Make sure your drag box is within the chart window W Edit will change the magnification of the chart so that the area outlined by the box fills an entire window The smaller the box is drawn the closer W Edit will zoom into the chart Continue magnifying your view until you have a clear view of the peak If you have zoomed in too closely you can retreat Be sure that your mouse is in the window you want to adjust then select View gt Zoom Out Position the left cursor so that it lines up with the tip of the trace peak Contents Index The frequency value is shown as x1 and should be about 13 kHz The displacement value can be found under the trace name vm rtm and should be about 5 1 um x1 x2 and a ae y value of the Lateral Comb Drive Resonator curve at the Xx Taon Ri ga value of the sd moving or last moved cursor F Cursors i q m 4 H EU l Frequency Ez Figure 15 Using the Vertical Bars cursor Contents Index Generating a Layout 4 You may now exit S Edit T Spice and W Edit if you like using File gt Exit Now you will learn how to create from MEMS layout components the plate comb drives and springs used in the resonator Tutorial Breakpoint You will now generate the layout of a resonator using the MEMS Layout Palette Launching L Edit 5 Launch L Edit by double clicking the L Edit icon
100. ap gap 3 um gap Finger overlap overlap 15 um overlap Number of gaps ng 20 number_of_gaps Contents Index S Edit Symbol Name S_LCOMB_3_M_X Contents Index MEMSLib Reference Comb Drive comb Resonator Elements Linear Comb Parameters S_LCOMB_3 Layout Parameter Entry Dialog Box Layout Palette Button MEMS Pro User Guide Contents width length overlap gap 4 Ky ng number of ga a Layout Parameter Illustration Index 606 Folded Spring S_LFBS_3 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Cell fspring Macro MEMSLIB DLL Description Generates a folded spring on the Poly layer Parameter List The following table provides the folded springs parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Beam width width 2 um flexure_width Beam length length 200 um flexure_length Outer gap inner gap 10 um flexure_outer_gap Inner gap outer gap 10 um flexure_inner_gap S Edit Symbol Name S_LFBS_3_M_X Contents Index MEMSLib Reference Resonator Elements MEMS Pro User Guide Contents Index 608 MEMSLib Reference Resonator Elements Folded Spring Linear Folded Parameters S_LFBS_ 3 Layout Parameter Entry Dialog Box
101. appears asking you whether you want to overwrite the existing file S Edit A N Output file exists on disk Overwrite E Figure 65 S Edit warning message Click Yes The netlist generated by S Edit shows up in the T Spice window Figure 66 Contents Index Reduced Order Modeling ROM Tutorial SPICE netlist written by S Edit Win32 6 01 Written on Jul 12 2001 at 15 31 24 Waveform probing commands probe options probefilename D public gaelle Documentation MemsPro reference files ROM ACCELERATOR accel3 dat probesdbfile D public gaelle Documentation MemsPro reference_files ROM ACCELERATOR accel3 sdb probetopmodule Transient_Accel 3by3 SUBCKT Accelerometer_3by3 Input1 Input2 Input3 Output1 Output2 Outputs include D public gaelle Documentation MemsPro reference_files ROM ACCELERATOR example3 sp ENDS Main circuit Transient_Accel_3by3 XAccelerometer_3by3_1 Gnd Gnd Excitation Ux N2 Uz Accelerometer_3by3 vl Excitation Gnd pwl 0 O 0 1m O 1 1m 100 3 4m 100 3 41m 0 7 0m 0 options abstol 1e 10 Options numnt 1000 Options chargetol 5e 3 tran op 0 1m 7 0m start 0 05m method bdf Options reltol 0 0001 End of main circuit Transient_Accel_3by3 Figure 66 Viewing the generated netlist in T Spice Mw Launch the simulation by clicking the Run Simulation button The Run Smulation dialog box appears MEMS Pro User Guide Contents Index 402 Reduced Order Mo
102. ar on page 213 MEMS Pro User Guide Contents Index 203 Tools Menu The Edit Process Definition Regenerate 3D Model Delete 3D Model and Export 3D Model commands can all be accessed from the 3D Tools button of the MEMS Pro Palette Edit Process Definition Regenerate 3D Model Delete 3D Model Export 3D Model Figure 85 Options of the 3D Tools menu Edit Process You may import and edit process definitions through this Definition command This menu command performs the same action as Tools gt 3D Tools gt Edit Process Definition described in Editing the Process Definition on page 225 Regenerate3D This menu command overwrites the current 3D model witha Model newly generated one It performs the same action as Tools gt 3D Tools gt View 3D Model described in Viewing 3D Models from Layout on page 188 assuming that the model is not up to date and you chose to regenerate it Contents Index Delete 3D This command deletes the currently viewed 3D model and Model removes all of its open views Export 3D This menu command allows you to export files in SAT or Model ANF format It performs the same action as Tools gt 3D Tools gt Export 3D Model described in Exporting 3D Models on page 220 Setup Menu The Setup Application dialog can be reached through the Setup menu item on the 3D Model View menu bar Contents Index 3D Modeler 3D Model View User Interface Window Menu The Window menu contains commands that are
103. arget Target is often set to the same value as LayerName For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 114 The vertical dimension of the FILL deposit as measured from the highest point on the Wafer up for the TOP face or from the lowest point of the Wafer down for the BOT face See the figure on page 377 Thickness may be any positive decimal number The material is deposited on the side s specified by the Face parameter During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Comment may be any text enclosed in quotation marks Contents Index Etch The syntax for the Etch command is presented below followed by an example containing valid entries for its parameters Syntax Etch WaferID S EtchType etype Face face askName layer EtchMask emask Depth P Angle A Undercut R EtchRemoves layer EtchRemoves layer Label S Comment S Example Etch EtchType SURFACI Face TOP E Contents Index askName Anchorl EtchMask INSIDE Depth 2 5 Angle 87 Undercut 0 EtchRemoves ox1 WaferID wl1 Label Etch Anchorl Comment Etch Anchorl Description There are three types of etches SURFACE BULK and SACRIFICIAL SURFACE etches remove material that has been deposited during previous s
104. arks Future versions of the software will support multiple wafers and user assigned names Type of etch Parameter options are SURFACE BULK and SACRIFICIAL The value is set to BULK for a bulk etch Side of the Wafer to be etched Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Any valid L Edit layer name enclosed in quotation marks is an acceptable input for MaskName The geometry on this mask defines the area to be etched or excluded from etching Vertical dimension of the etch Any positive decimal number may be entered for Depth Etch Angle is given in decimal degrees between 45 and 90 Contents Index Parameter Description Undercut The distance the etching material will extend over the mask edge Undercut may be any positive decimal number Undercut 0 is a sharply defined cut aligned to the mask edge Label During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Comment Comment may be any text enclosed in quotation marks Note that Angle and Undercut are supported for Bulk etches in MEMS Pro Version 3 Contents Index EtchType SACRIFICIAL Parameters for a SACRIFICIAL etch are illustrated below Parameter Description WaferlID EtchType Face EtchRemoves This optional parameter identifies the Wafer to be etched Since MEMS
105. ating Components 2 eee eee teteeeeeeteseseeeeteteeeeeeees 23 Instantiating a Plate iso Shoes ast eun Sort ral toneaseananen Seabamene 23 Instantiating Comb drives sssini 24 Instantiating Folded Springs w cccccccccscscecscssecscsssssseseeeee 25 Witnes Objects ocsiren ienien Te ture uerenean Cane e 26 Zooming THE View chested ie aS cies taka ais Ry eaeca he Gea iaks al 26 Instantiating Voltage Sources oo eeeeeecseeseeteteseeeeeeteteteeees 29 Contents Index Help Placing Global Nodes cauhianstnraitienindrerteminnanianen 29 Editing Object Properties eras csesccsssasecsahtensnanteresiten 32 sabe Ltn Nodes ornin a a E ERR 34 Adding Simulation Commands 0 cccceeseseeeeeeeetetees 35 Exporting a Netlist 00cesssssssssssssssneen 40 Putonal Break pom 1c00 ce uecnusener es eau delen wane 40 Simulating from a Netlist 2 000 000 0000 42 Simulating with T Spice cccceeeceeeeeeeseeeseeeeeeteteteeeneeees 42 Probing a Waveform iss 45 Viewing a Waveform ese 47 Chart Setups ina n a ia 47 Trace Want SULA Tae i us ti Sate ae 48 Generating a Layout 10100 56 Tutorial Break pomlesccei idee Scie h tae duets eridlstectns 56 Lanche LEdifyscsna nnen ena tres T erhe 56 Contents Index Help Op nins the Pile cits tonenling teen Peeve a ant 57 Creating Components ase csrscsccatsccrteatncseuletonstnan ten eemiaek 57 Using the MEMS Library Palette ccccccccceeteteteceee 58 Generating the Plate o on 59 Generating the Comb drives vecce
106. ayers in the design The geometry on this mask defines the area to be etched or excluded from etching Contents Index Depth Depth of material to be etched Only the layers that are specified in the EtchRemoves parameter will be removed For example if the Depth is greater than the Thickness of the layer etched the layer underneath will not be affected Any positive value can be entered for Depth Angle The Angle parameter is not supported in MEMS Pro Version 3 and therefore it may not be edited Its value is assumed to be 90 0 for this release Etch Angle is the angle of the sidewalls achieved by the etch Undercut The Undercut parameter is not supported in MEMS Pro Version 3 for SURFACE etches and therefore may not be edited Its value is assumed to be 0 for this release For EtchMask INSIDE Undercut is the distance the etch front will extend over the drawn mask edge For EtchMask OUTSIDE Undercut is the distance the etch front will intrude beneath the drawn mask edge Undercut 0 is a sharply defined cut aligned to the mask edge for both Contents Index cases EtchMask Parameter options are INSIDE or OUTSIDE This parameter sets the mask orientation that is whether the material to be removed is INSIDE or OUTSIDE of the drawn layout EtchRemoves Parameter options include the list of layers in the design these appear in a scrolling checklist Click on the name s of the layer s in the EtchRemoves list to mark them
107. bar buttons become enabled Manipulating the 3D Model View To manipulate the 3D model view use either the 3D Model View toolbar or the menu options under the View menu SP PCHSVHBSe P4SF 2 OF PH PS OD Figure 28 3D Model View Toolbar The Orbit View allows you to rotate the model in order to view it from any angle Contents Index Select View gt Orbit or click the Orbit toolbar button Click and drag over the 3D model window to orbit the model The 3D model view may be translated by panning the view Select View gt Pan or click the Pan a toolbar button Click and drag over the 3D model window to pan You may examine the details of the model by zooming in to the area of interest Select View gt Zoom gt Box or click the Window Zoom toolbar button Click and drag the pointer to the opposite corner of the zoom box and release the mouse button You may also use the Ctrl key and the three mouse buttons to Orbit Pan and Zoom Ctrl Left click and drag over the 3D model window to Orbit Ctrl Right click and drag over the 3D model window to Zoom in and out Ctrl Center click and drag over the 3D model to Pan the view Contents Index Note For more information on changing your point of view of the solid model see Accessing 3D Models on page 110 of the MEMS Pro User Guide Multiple Views Multiple views of the generated 3D model may be viewed simultaneously Click somewhere in the title bar of t
108. ble If the 3D model loaded in the ANSYS session comes from the 3D Modeler the unit is the micron MEMS Pro User Guide Contents Index 296 ANSYS to Layout Generator 3 D to Layout Tools Mi Enter mcp_unit 1 0e 6 in the ANSYS Input window Figure 10 ANSYS Input Figure 10 ANSYS Input window Exporting a CIF File The Export CIF file option allows you to transfer a 3D solid model into a CIF file It creates a CIF file that any EDA tool can read The 3D solid model must be loaded in the ANSYS active session as a database db as an input file inp or as a log file log You can also create your volumes in the ANSYS graphics window To access this functionality click the LAYOUT button in the ANSYS toolbar refer to Section The LAYOUT Menu Item MEMS Pro User Guide Contents Index 297 ANSYS to Layout Generator 3 D to Layout Tools For more details on this function refer to Section The Layout Generator Program The LAYOUT Menu Item In the ANSYS Toolbar you can export a CIF file by clicking the LAYOUT button see Figure 11 If the LAYOUT button does not appear in the ANSYS toolbar you can recover it by clicking 3 D to Layout in the ANSYS Main Menu or by clicking Clear amp Start New in the File menu of the ANSYS Utility Menu and choose the Read file option Figure 11 LAYOUT button in the ANSYS Toolbar MEMS Pro User Guide Contents Index 298 The Layout Generator Program Before exporting
109. cal connect width 50 um anchor_width wire Serpentine height heigth 940 um serpentine_height Serpentine wavelength length 60 um serpentine_half_wavelength Number of wavelengths nw 10 um number_of_wavelengths S Edit Symbol Name N A Contents Index Area Perimeter Dielectric Isolation Test Structure Element Area Perimeter Parameters S_APTEST_1 Width of electrical connect wire anchor_width um width Serpentine height serpentine_height um height Serpentine half wave length serpentine_half_wavelength um length 60 Number of wavelengths number_of_wavelenaths um nw 10 Name of cell aptest Layout Parameter entry dialog length height width saa 2 nw length width Layout Palette Button Layout Parameter Illustration Contents Index Crossover Test Structure Element Type 1 S_COTEST_1 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a crossover test structure that can be used to test electrical interconnection using bridges on structural layers and 2 to cross over lines on the first electrical interconnect layer The wires are anchored to the substrate except at the bridges Parameter List The following table provides the crossover test structure type 1 parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Wire width of electrical pOwidth 1
110. cal values of reduced forces and capacitance if requested have been approximated by an analytical expression an accuracy estimation of the fitting process is performed on each fitted value This evaluation consists in comparing at each fitting point the numerical value with the analytical expression A summary of the greatest absolute difference is also printed and compared with the absolute mean value of the numerical values in order to obtain a relative data Generated files In both cases when running the algorithm ANSYS solvers are called and as a consequence files are created in your current working directory During this step the ANSYS jobname remains unchanged While result files are created scratch cmatrix out and jobname s_db files are generated Result files associated to the reduced model are created in your current working directory by adding the appropriate suffix to the output file radical prefix you entered The following table provides the meaning of the different suffixes Suffix Description sub ANSYS substructure file Contents Index chdla Reduced model described in HDLA _capa hdla Capacitance relationship described in HDLA Sp Reduced model described in SPICE _capa sp Capacitance relationship described in SPICE Behavioral model Description of the sp files When the SPICE output option is active two sp files can be generated T
111. cccecscesesscssesesstsestseseseeees 60 Editing an Already Generated Component 61 Attaching Components sa ceinicne einen ean ani 63 Generating the Folded Springs cccccccccccsccsvscssecssessseseees 65 Generating the Ground Plate ccecececececccecseseeeseseeeeeeeeees 66 Generating the Bonding Pads wo cececccccecscscscsceveveseseseseseees 67 Viewing Properties 2624 2yachs ae dcua eo iearouel icon bat eesehdeopeenees 70 Viewing a 3D Model cesses 73 Tutorial Break poi 2Avei Ca evs e Gis eit lett ieee 73 Launching L Edit and Opening a File 00 ee 73 PROCESS ST MAILE ensesine an i 74 Contents Index Help Importing the Process Definition ccccccccccccceecrceees 74 DUDE Vie We Sich soe ates nea tecsttet cen aed eerste ayn a tea manent dees ston 78 Generating the 3D Model viccececececesecscscssssssesesssssssesesssesees 78 Manipulating the 3D Model View o cccccccccccccsssssessssesseeees 78 Multiple Views ci stu cssd ecco heche aks cds creek tase ovaetleatettes 80 Viewing the 3D Model uicicuwscnuscn dna nasuaasee 82 DID Cross section nipis n binaan a yim 82 Drawing Tools ccecssssssssssssssssssssssssssssssssssssen 86 Tutorial Breakpoint s 0 354 00s askin choad 86 Drawing a WITE ermanno niee nE AST O SNEEN 88 Drawing a TOUS cn monnn anen aa i 89 Drawing a Curved Polygon ecceceececeeseeeeeeeeseeeeteeeteeeeees 91 TAWA ea ONS i as ain a tad at ae ee eae 95 Drawing a BO riase ith eh el al Ges 95 Conten
112. click Back to make changes If the commands are correct click Insert Command T Spice Command Tool nalysis Current source MEMS Pro User Guide Contents Index 451 Figure 98 Finalizing the optimization customization Contents Index Running the Optimization 5 Clicking the T Spice icon H located in the toolbar will launch T Spice with the exported netlist open MV Run the optimization by selecting Simulation gt Run Simulation Contents Index Examining the Output OPTIMAL VALUES The optimization engine output file contains the results of each simulation iteration The value of each optimization parameter submitted for a given run appears followed by the gradient of the objective function at that parameter value In the example we had just one parameter springlength The next line contains the residual or the difference between the output measure and your goal The Levenberg Marquardt algorithm is used for the optimization the Marquardt value is an artifact of that algorithm Once the optimization engine produces a result that falls within the tolerance you have set it desists The final parameter estimate optimized parameter values springlength 1 1775e 004 and the goal measure Measurement result summary OPTIMIZE opt1 res_freq 3 9922e 004 are written to the output file The output file for the optimization set up in our first example appears below Optimization parameters springlength 0 00
113. closed in quotation marks for Target Target and Maskname may be set to the same layer For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 114 Contents Index Parameter Description Label During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Comment Comment may be any text enclosed in quotation marks Contents Index Deposit The syntax for the Deposit command is presented below followed by an example containing valid entries for its parameters Syntax Deposit WaferID S DepositType dtype Face face LayerName layer Thickness P Scf scf Target layer Label S Comment S Example Deposit Deposit Type CONFORMAL Face TOP LayerName Poly0 Thickness 5 Scf c Contents Index WaferID wl1 Target Poly0 Label Deposit Poly0 Comment Deposit Poly0 Description Deposit types include CONFORMAL SNOWFALL and FILL CONFORMAL deposit adds a layer that follows the contour of the processed wafer SNOWFALL covers only those surfaces that are not shadowed by other surfaces on the wafer FILL is a maskless Process Step that makes the surface of the wafer plane Each DepositType has unique parameter requirements Contents Index DepositType CONFORMAL A CONFORMAL deposit is illustrated below Thickness l
114. color scale on the contour plot Contents Index ANSYS Tutorial Displaying the Results Choose Def shape only for Items to be plotted Contour Nodal Solution Data DOF solution Stress Strain total En Strain creep Strain other Figure 114 Contour Nodal Solution Data dialog Click OK Choose Front from the Pan Zoom Rotate menu to view your results Note that the deflection is not to scale From the ANSYS Utility menu choose PlotCirls gt Style gt Displacement Scaling In the Displacement Display Scaling dialog select 1 0 true scale as the DMULT Displacement scale factor MEMS Pro User Guide Contents Index 274 Click OK Now the deflection is displayed to scale as in Figure 115 Figure 115 Deflection results Contents Index Computing the Spring Constant On the right side of the display window notice that the maximum deflection is 3 9 microns Thus the spring constant for this device is approximately 2 microNewtons 3 9 microns 0 5 Newtons meter By varying the applied load it can be verified that the relationship between the load and the maximum deflection is linear Contents Index Entering Models under Windows NT On Windows NT and UNIX systems the SAT file may be read directly into ANSYS without the need to export it in ANF format However to use this capability you must have The ANSYS Connection product for SAT module installed VM In the ANSYS utility menu choose File gt Import
115. cotidiete neers 616 Device XANES dapat hos tava ees catM uscdge te lla be coe N o 618 Analog Devices MCNC iMEMS 619 Sandia FET es os scence re N 620 MOSISCM U viccterc ecccanancetccctsvesta muna 621 MOSIS NIST oie eeessssssssssssssneeseesssee 622 Contents Index Help Process Definition ccc 623 Jntroduction ccc cccccccccsssssssssssssseeeeeeeseeeeeneeeen 624 Process Steps on ccscsssssssssssssssssssssssssssssssssssssssssssssssssssssssssst 628 PROCES SUMO cansi coal E nice need aliens ccna es asta ee antes 628 ELAN paaa Dee ies nto cath g Death ashes tases he 628 Ex mpl sa cartose ti hot leat stn Ba cect hia ls ore eO toes Sook ate tant 2 629 Description dei ha lath res ia Nate EE e Bad Our at 629 Wafer ae eee ae 630 SUID casei a e a iterations teh N estes 630 Example i pes erates a e neat Teh aia 630 Descriptor ee Meh Os a E E tad 631 DEPOSTE e AE EN O A RAE SIR OEA 634 DV ALAN ae Roa hes ciara Ola cet Riba tea A hie Te 634 Example nauman nn T ede let geen a 634 Contents Index Help Description Akere ts gents ellen ach Soe heen dda EEEN 635 DepositType CONFORMAL uviceccccccccscscsctstetetetetees 636 TUICINCSS NOS CS csecces tical taunt a occas n an 639 DepositType SNOWFALL uu ceccccscsssessseceseseseeetseeeeneees 642 DepositType ET Los cscaits a ie och aie conte cea us Suelo te ee 644 Ete hiregana tanh eect atte tales eerste ag 647 SYNIAN cask ass aca leh oi aa hne aan at hse aan ances 647 Example eee ee Ae Re R
116. ct the three degrees of freedom using a single command MEMS Pro User Guide Contents Index 385 ALL means that you now consider all the degrees of freedom associated to the N_MASTER node A symbol is displayed on each selected degree of freedom Click MEMSCAP Tools gt R O M Tools The R O M Tools window appears and gives access to all the condensation algorithms implemented in the MEMSCAP Tools R 0 M Tools Ea Figure 53 R O M Tools menu Before performing the reduction you must select the format s in which the reduced models will be generated Contents Index Reduced Order Modeling ROM Tutorial mi Click Output options Output options Figure 54 Output options dialog box The Output options dialog box allows you to select HDLA SPICE or both languages for the results file In this example the SPICE language is chosen m Click SPICE Now you may run the condensation The condensation part of the R O M tool gives access to the Guyan Irons reduction algorithm m As you are working with three load cases click Condensation gt From LS files in the R O M Tools menu MEMS Pro User Guide Contents Index 387 Reduced Order Modeling ROM Tutorial R 0 M Tools xX Figure 55 Selecting the Condensation from LS files option The Condensation From LS files dialog box appears From LS files Figure 56 Condensation From LS files dialog box MEMS Pro User Guide Contents Index 388 y
117. ction 70 simulating from 40 Nodes labeling 32 O Object properties edition 30 Optimization examining the output 467 running 466 setting up 453 Contents Index Optimization 450 Optimizing a design 450 P Pad bonding 568 multilayer 557 Plate generation 58 ground 566 instantiation 21 Plate Release 121 Plate 559 Polar Array 123 Polygon drawing curved 90 Ports about 66 Process edition 663 Contents Index Process definition edition 116 185 import 73 186 process steps 616 Process definition 611 Process step parameter Deposit 194 622 Etch 201 635 Grow 657 ImplantDiffuse 652 MechanicalPolish 209 647 ProcessInfo 616 Wafer 191 618 Process steps edition of parameters 190 edition 186 188 Properties view 69 Property creation 407 Contents Index R R O M menu 3D To Layout menu 298 R O M menu 218 Reduced Order Modeling Voir ROM Reduction algorithm 235 281 Results viewing in ANSYS 392 ROM condensation algorithm 222 reduction algorithm 235 ROM 216 Rotary comb drive 511 Rotary motor 136 Rotary side drive 514 Routing a design 443 Contents Index S SACRIFICIAL etch type 202 208 SAT file format 144 Save MEMS 317 Saving MEMS 317 Schematic creation 17 extraction 102 Schematic symbol creation 472 Schematic tools Command tool 400 S Edit 4 Show Details button 492 Side drive harmonic 517 linear 499 rotary 514
118. ctly to ANF format from MEMS Pro Under Windows NT and UNIX MEMS Pro users also have the option of writing to SAT format Both MEMS Pro and ANSYS use an ANSYS module called The ANSYS Connection Product for SAT to convert SAT files to ANF format You must have this connection module in your ANSYS directory both to export ANF files from MEMS Pro and to read SAT files into ANSYS Contents Index 3D Modeler Linking to ANSYS Linking to ANSYS Once you have successfully exported your model for use by ANSYS see Exporting 3D Models on page 220 you are ready to invoke the program The direct link to the ANSYS program can be accessed by clicking the ANSYS button from the 3D Model Toolbar If the 3D Modeler cannot find the ANSYS executable the following dialog will appear Locate Program Cees a e Figure 97 Locate Program dialog Once you have located your ANSYS installation by browsing or typing the path to it click OK L Edit will make a record of this location in the Windows MEMS Pro User Guide Contents Index 223 registry You will not see this query again unless you move the ANSYS executable Contents Index Editing the Process Definition Process definitions may be imported exported and edited from the Process Definition dialog This dialog can be accessed from the MEMS Pro Toolbar selecting 3D Tools gt Edit Process Definition Note that if the design file does not contain a process definition the dialog w
119. d reduced mass m by the following expression _ 1 jk allen 5 Computing the eigen frequency of the complete model by running a modal analysis and considering the reduced stiffness the previous equation allows you to define a corrected reduced mass to obtain a reduced model that has an eigen frequency that matches exactly the eigen frequency of interest of the full model Electrostatic loads Contents Index The idea of this approach is to generate a numerical approximation of the external force term In order to obtain an expression of the last term of equation 4 representing the force versus displacement dependency a numerical fitting is performed The procedure consists in generating a set of deformed configurations of the complete model For each of them the electrostatic loads acting on the structure are computed and condensed in accordance with the structural reduction algorithm In order to obtain an analytical expression of the previous result a polynomial fitting is performed Capacitance evaluation The previous reduction method allows you to compute the structural system behavior taking into account the electrostatic coupling Nevertheless the output value of interest may be an electrical result depending on the structural configuration To match this requirement the generation of a capacitance expression in terms of the selected degree of freedom was added to the structural reduction procedure This gen
120. deling ROM Tutorial Run Simulation x 2 System Transient_Accel_3by3 sp Bertsch Share T eufT euf MEMSM Figure 67 Run Simulation dialog box Check the Do not show box and click the Start Simulation button Click Yes when asked if you want to overwrite the existing file A Simulation Output window opens presenting the results of the simulation M Click the Probe button Be Figure 68 Probe button MEMS Pro User Guide Contents Index 403 Probe the Az node by clicking on it A W Edit window opens It contains the chart representing the result of the simulation performed on the Az node Figure 69 This chart shows the excitation results Contents Index CARAS Ty Waveform Viewer public gaelle D ocumentation MemsPro reference_files ROMSACCELERAT OR accel3 dat _ Oo x E Eile Edit View Chart Window Help CSBHS BB SB GQ oR Hauer oe ean amp v oD 2 o gt For Help press F1 Figure 69 Viewing the results of the excitation simulation Contents Index Access back the S Edit window and probe for the Uz node A new chart appears in the W Edit window To view only the results of the last simulation click Chart gt Traces and unselect the excitation chart in the right part of the Traces dialog box Then select Chart gt Expand Chart to obtain an expanded view of the chart Figure 70 Contents Index ELERATOR accel3 dat IES A 3 v op E 3 i For Help p
121. described in the section on Thickness and Scf on page 368 Entries for Sef can be a decimal number between 0 and 1 or the letter c An Scf of c is equivalent to an Scf of 1 0 which is a Contents Index completely conformal deposit that is a deposit with uniform thickness along the wafer contour Target Parameter choices include the list of layers in the design file Target specifies the 3D model rendering characteristics of the deposited layer Target and LayerName are typically set to the same value For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 186 DepositType SNOWFALL SNOWFALL deposits no material on vertical and shadowed surfaces as shown below Horizontal surfaces have the deepest coverage Inclined surfaces have an intermediate amount of material deposited upon them Contents Index flat surface inclined surface Possible parameters for SNOWFALL deposits are Face LayerName Thickness and Target Face Parameter options include TOP BOT for bottom and TOPBOT for both top and bottom Face identifies the side s of the wafer to receive the deposit LayerName Parameter choices include the list of layers for the design LayerName identifies the layer to be deposited it is often set to the same value as Target Thickness Any positive decimal number may be entered for the vertical dimension of the SNOWFALL deposit This thickness is deposited on the side s
122. designed for processing on the bottom of the wafer with the masks designed for processing on the top of the wafer the former must be flipped horizontally i e left right reversed You may be required to perform the reversal yourself or have the mask maker perform it Please consult your mask maker for further information Contents Index Another consideration for SURFACE etch is whether the mask setting is inclusive or exclusive EtchMask may be set to either INSIDE inclusive or OUTSIDE exclusive For EtchMask INSIDE areas beneath the mask layer geometry are removed generally used for insulator masks For EtchMask OUTSIDE areas beneath the mask layer geometry are protected generally used for conductor masks Below identical masks with different EtchMask settings illustrate this effect a EtchMask OUTSIDE SURFACE BULK and SACRIFICIAL etches are described below Contents Index EtchType SURFACE The SURFACE etch removes layers specified in the EtchRemoves parameter Parameters for SURFACE etches include EtchType Face MaskName Depth Angle Undercut EtchMask and EtchRemoves In the diagram below the parameter EtchMask is set to OUTSIDE Drawn Mask Drawn Mask Angle Undercut r Depth Face Parameter options include TOP BOT for bottom and TOPBOT for both top and bottom Face identifies the side s of the wafer to be etched MaskName Parameter options include the list of l
123. dex Help Tools VACHE nare tela oben sonore Mh as ns Sa hd hem aniae oh 204 Setup Mennene E canta tates cent donate 205 Window WINS witha cis ncacenclos tarmrln eoaaniete tiga aneuenagrs 206 Help NICH oi co seers i EnaA a tanta sessilis ts tare 207 3D Model Tool Bat giz sete atia acs tint ee teal 209 Palette cs uicens facets eset tthe el nein 210 Status Bares niu on a peel ees at a 213 Viewing a Cross section 011191191111010111101n 215 Deleting 3D Models 000 000 0000 218 Exporting 3D Models 00 0 0 220 Linking to ANSYS oo ccccecesscsssssssesnennnntnnennsen 223 Editing the Process Definition 225 Importing the Process Definition 00 0 0 eeeeeeeeeeeteeeee 226 PROCESS Identification Sica sciieisschaser ets gn csemetunnetanase 228 Editing the Process Steps Lists auesiscisicunciiuaoiy 228 Contents Index Help Display 3D model fOr this step cccccccccccccsccccsesssssesesesees 229 MoveStep eisene wstans coe ean es eeu a 229 PROSE GID casts re cof hats att A AE ENER lates sha aca 230 Delete Stepi nipan aan nan ee eek 230 Editing Individual Process Steps ceeeceeseeseseeeeeeees 230 Wafer ennan a es tg NE aces be cee ed oe ec Nass 231 Deposits ira mucee aa ii E Le le 234 DepositType CONFORMAL uu icecccccccccscecsstetetetetees 235 DepositType SNOWFALL wuu ceccccccssssseeseseseseeseseseeneees 237 DepositType FIL runean get esau Ra 239 Eteh ee ataa tinct E o see enone E R 241 O
124. dialog box appears Figure 28 Import Mask Data l x ba g on Layout empty Layout1 Figure 28 Import Mask Data dialog box m Indicate the appropriate file type CIF in the Import file type field and browse for the mirror cif file you have previously generated in ANSYS m Click Import MEMS Pro User Guide Contents Index 331 The Layout of the mirror appears in the L Edit window Contents Index ANSYS to Layout Generator Tutorial Figure 29 Layout view of the mirror MEMS Pro User Guide Contents Index 333 MEMScAP 9 Reduced Order Modeling MEMS Pro User Gui de User Manual 335 ROM Tutorial 370 Contents Index User Manual Introduction The ROM Reduced Order Modeling tool is a MEMScAP customized ANS YS feature It allows you to automatically generate behavioral models describing 3D structures reduced to a few master degrees of freedom The resulting models describe the behavior of the considered degrees of freedom e g displacement of nodes according to variations of the applied loads e g accelerations voltages The behavioral models are written in SPICE and or HDL A languages Additional formats will be implemented in further releases Finite element models may involve a large number of degrees of freedom so that full simulation especially in the case of transient analyses can be prohibitively expensive As a consequence designers really have to simplify m
125. displayed Contents Index Clearing Vertex Information Once you have viewed the vertex information of a selected element you can remove them from the design by selecting Tools gt Clear Vertex Information Contents Index Help The Help menu gives access to the MEMS Pro User Guide and to various information concerning MEMS Pro MEMS Pro User Guide To access the MEMS Pro User Guide select Help gt MEMS Pro User Guide About MEMS Pro To access information on MEMS Pro and its current version select Help gt About MEMS Pro The About MEMS Pro dialog box appears Figure 51 Contents Index MEMS Pro Toolbar Help About MEMS Pro MEMSCAP S 0 Figure 51 About MEMS Pro dialog box MEMS Pro User Guide Contents Index 125 Splines Introduction Create Spline Dialog Box Creating Splines Editing Splines Contents Index 127 129 132 146 lt Introduction A spline generator refer to the paper on Software Fragments section on X Splines web page link http www gk dtu dk home jab software html has been added to MEMS Pro to aid in fluidics device layout This is an adaptation based on the lack of a spline primitive in MEMS L Edit Please read the web site to understand how the generator has been implemented The beauty of the X spline is that the user will have an intuitive way of dialing in spline behavior at each control point and it can be shown to go smoothly between the extreme of an
126. e Name Wire width of first structural pl width 10 um first_struct_layer_line_width layer Wire width of second p2width 12 um second_struct_layer_line_width structural layer Contents Index S Edit Symbol Name N A Contents Index MEMSLib Reference Test Elements Crossover Test Structure Element Type 2 Crossover Parameters S_COTEST_2 Layout Parameter Entry Dialog Box p2width ll plwidth Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 586 Euler Column Doubly Supported Beam Elements S_EUBEAM_1 S EUBEAM_2 Description Parameter List S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Generates a doubly supported beam test structure on the first or second structural layer This element can be used to estimate the residual strain in a film with a compressive residual strain Generally an array of beams with varying lengths is used to determine the critical buckling length for the residual strain in the structural layer of interest Hence the name Euler columns for these test structures The beam parameters are chosen to set the critical buckling strain of the beam and hence the residual compressive strain that it would detect If the thickness of the structural layer used is larger than the width of the beam lateral buckling will occur i e buckling in the plane of the wafer Otherwise buckling will occur out of the plane of th
127. e user input parameters using the MEMS parameterized layout generator macro The layout generators assume a two layer surface micromachined process with two structural layers two sacrificial layers and two electrical connect layers The default technology setting is for MUMPS Macro usage information can be found in MEMSLib Layout Macros on page 257 Schematic designs are created using MEMSLib by instantiating the MEMSLib symbol modules Simulations results can be viewed directly from the schematic they model using the waveform probing feature Further instruction on usage of the library elements appear in Using the MEMS Library on page 524 of this chapter This library reference provides descriptions file locations and parameter lists including default parameter values for each library element The corresponding layout palette button the L Edit UPI parameter input dialog box and illustrated geometry for each element are also shown The layout library example cell for each element was generated using default parameter values Contents Index Element Description Library Accessing the MEMS Library Palette on page 526 Active Elements S_LCOMB Linear Electrostatic Comb Drive Elements S_LCOMB_1 S_LCOMB_2 on page 532 S_LSDM Linear Side Drive Elements S_LSDM_1 S_LSDM_2 on page 535 S_RCOMBU Unidirectional Rotary Comb Drive Elements Type 1 S_RCOMBU_1I S_RCOMBU_2 on page 538 4 S_RCOMBUA Unidirectional Rotary Comb Drive Ele
128. e 335 ROM MU enrian aisre 337 Contents Index Help Condensation Algorithm 2 0 0 cececeeeceeeeeeeeeeseeeeeeteteeees 340 F ndame ntalS cesses cr cicachas tetera ieee sta s ue terrains ntact le 340 Running the Condensation c cccccccccceseeseteseseteesteeseeees 341 Reduction of Electrostatically Coupled Structural Systems 348 Fundamentals sees cecal ae cas oe cath Nea eete Mars tol ahh Oe ccm ads 349 Running the Reduction Algorithm ccccccccccccccccscsseeeees 353 ROM Tutorial ooo ccccecessssssssssnsnnnnttntnnnsnsnne 370 Condensation Reduction with Single DOF amp Load Cases 370 Model Generation sadist edi oi eae eee 372 Performing Reduction sesser 374 Condensation Reduction with Multiple DOFs amp Load Cases 380 Model Generation ssa feos pss ai alt leks fo aaa 382 Performing Reduction a ue chee uiiaae Raa kee cheers 385 Simulating a reduced model using the SPICE simulator 392 Contents Index Help Reduction of Electrostatically Coupled Structural Systems 408 Model Generation seca siessies cts Seseccentdegeeaued un utrnet as 410 Performing Reduction osese 411 Simulating a reduced model using the SPICE simulator 422 Optimization Tutorial ww 436 ntroduction cece ccccccccccccsssessssssssssseseeesseeeeeneeee 437 Setting up the Optimization 439 Running the Optimization 453 Examining the Output 20 19110110110100110100110110100 454 Contents Index Help
129. e E ITE 647 De seripton Re ee ne Oe A aCe ee ee eee 648 Orientation Considerations o ceeccccsceceesiiere te teteteteees 649 Eich Tyne SURFACE eeccasiunscbossntiossaicistes enh Myastesaghasaeet 651 EtehType BUTS kirar Oe oi hte I lt od 654 EtchType SACRIFICIAL 6 ccsc c c s0sccccsesscsscsssesceveessectes 657 MechanicalPolish ici huecck te chek hie clit acer h esse 659 VEIN merae T R atten iat satunces a aut Ad 659 Contents Index Help Desctipti On accep sce cies onn tae Sed eaten cant eae are seat eet ae 660 ImplantDiff se tipena a 664 SYNTAX wc scacte te ceanlyr a A A E RE 664 Example amp cbse shed ctae tardies insana N ann 664 Description nee es gene eer oe Erte Ree eae Oa eae Rear rae 665 Orientation Considerations u 666 GLOW 25 cae EERE TEET E T E 669 RNY Le 8 eaa a a a REN Nee 669 TERI DUC en N N R AES 669 Description shea ca osth Taher Stercc tin i e aches casas shat biautea Sas 670 Editing the Process Definition 675 Process Definition Example MUMPs 676 Contents Index Help Introduction MEMS Pro System Tool Flow What s New in Version 3 0 Documentation Conventions Contents Index MEMS Pro System The interdisciplinary nature of Micro Electro Mechanical Systems MEMS and the expertise required to develop the technology is a significant bottleneck in the timely design of new products incorporating MEMS technology This issue calls for a new generati
130. e These features are quite useful for the creation and edition of splines refer to Chapter 4 Splines Viewing Vertex Coodinates To view the vertex coordinates of a flat object box polygon wire perform the following operations Select the object for which you want to view the vertex coordinates Select Tools gt View Vertex Coordinates in the MEMS Pro Palette Contents Index MEMS Pro Utilities Viewing Vertex Coordinates and Angles The number and coordinates in locator units of each vertex are displayed on the layout as port text on the ruler layer at the corresponding vertices The size of the port text is the default port text size of the Ruler layer The text is displayed according to the following format vertex number X_coordinate Y_coordinate Figure 63 Viewing vertex coordinates MEMS Pro User Guide Contents Index 158 This information remains visible until the Clear Vertex Information option is issued Viewing Vertex Angles To view the vertex angles of a flat object box polygon wire perform the following operations Select the object for which you want to view the vertex angles Select Tools gt View Vertex Angles in the MEMS Pro Toolbar The number and angle in degrees of each vertex are displayed on the layout as port text on the Ruler layer at the corresponding vertices The size of the port text is the default port text size of the Ruler layer The text is displayed accordi
131. e palette These modifications maintain the component name Contents Index 3 D to Layout Tools Overview The 3 D to Layout menu gathers frequently used commands defined in several locations in ANSYS with functions developed by MEMSCAP for the ANSYS to Layout translator Mw You can access the 3 D to Layout menu through the ANSYS Main Menu by selecting MEMSCAP Tools gt 3 D to Layout Figure 2 Contents Index ANSYS to Layout Generator 3 D to Layout Tools ANSYS Main Menu a Figure 2 Accessing the MEMSCAP Tools menu The Prompt dialog box appears Figure 3 MEMS Pro User Guide Contents Index 282 ANSYS to Layout Generator 3 D to Layout Tools Figure 3 Setting up the technology file name m Enter the technology file name and press OK or Return This file defines the component names for the materials of the 3D model and links them to mask layer names in the corresponding CIF file See Component Names for more details Warning The name of the technology file must be enclosed in single quotes Note ANSYS restricts variable name lengths to 8 characters If you enter a component name of more than 8 characters ANSYS only takes into account the first 8 characters For example if you enter Bulketch1 ANSYS reads Bulketch MEMS Pro User Guide Contents Index 283 ANSYS to Layout Generator 3 D to Layout Tools Once the techno name is entered the 3 D To Layout menu appears 3
132. e range of devices using MUMPs including accelerometers micro optical components actuators motors and many others MUMPS is a three layer polysilicon surface micro machining process designed to be as general as possible to provide maximum user flexibility Polysilicon is used as the structural material deposited oxide PSG as the sacrificial material and silicon nitride for electrical isolation from the substrate The process is derived from work performed by the Berkeley Sensors and Actuators Center at the University of California Berkeley Contents Index The process is different from most customized surface micromachining processes in that it is designed to be as general as possible and to be capable of supporting many designs on a single silicon wafer Since the process was not optimized with the purpose of fabricating any one specific device the thicknesses of the structural and sacrificial layers were chosen to suit most users and the layout design rules were chosen conservatively to guarantee the highest possible yield Process Cross Section Nitride Poly iIstOxide Poly1 2nd Oxide Poly2 Metal Figure 129 Cross Section of the MUMPs process Contents Index Technology Setup MCNC MUMPs Device Examples Rotary Side drive Motor Rotary Comb drive Linear Comb drive Resonator Bolt 29K Btn Des MEMS Pro User Guide Contents Index 618 Analog Devices MCNC iMEMS Note See http imems menc org for the
133. e three previous methods Introducing loads Regarding the theoretical basis of the algorithm multiple load cases can be independently taken into account during the condensation process Any given load case obtained by linear combination of the initial load cases can then be introduced in the reduced equations by combination of the reduced load arrays Selecting master degrees of freedom You have to define one or more degrees of freedom to which the model will be reduced In practice these degrees of freedom are often those you want to concentrate on Nevertheless running the condensation algorithm introduces an approximation to the model behavior that is related to the choice of the master Contents Index degrees of freedom You have to make sure that the selected master degrees of freedom are representative of the structural behavior of interest You can select the degrees of freedom called master degrees of freedom in ANSYS using the ANSYS M command that can also be accessed through the GUI refer to the ANSYS documentation for more information Performing reduction To easily manage the load cases two buttons are available in the R O M Tools menu under the Condensation option Current LS and From LS file The Current LS option allows you to perform a condensation reduction with only one Contents Index Reduced Order Modeling User Manual load case and one degree of freedom The From LS file allows you to perform a conde
134. e wafer Contents Index The following table provides the Euler column parameters their values and descriptions Description Layout Parameter Default Value Schematic parameter name Name Length of doubly supported blength 200 um beam_length beam Width of doubly supported bwidth 20 um beam_width beam Size of anchor supports asize 30 um anchor_size S Edit Symbol Name N A Contents Index MEMSLib Reference Test Elements Euler Column Doubly Supported Beam Elements Euler Column Parameters S_EUBEAM_1 Layout Parameter Entry Dialog Box Layout Palette Button MEMS Pro User Guide bwidth asize a OS blength Layout Parameter Illustration Contents Index 589 Array of Euler Column Elements S_ EUBEAMS_1 S EUBEAMS 2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a set of doubly supported beam test structures on the first or second structural layer This element can be used to estimate the residual strain in a film with a compressive residual strain The element uses the residual strain range and step size specified to determine the beam lengths of the array of doubly supported beams The lengths are chosen such that the critical strain that the beams can support before buckling corresponds to the desired value of residual strain to be detected Euler buckling criterion for the compressive strain in the film is used Parameter
135. ed springs to the ground plate by drawing a box on the Polyd layer covering the GP_GND port of GroundPlatelnst This box should cover all of GroundPlatel nst Now all the connections will be properly recognized by L EdivExtract Contents Index Extracting Layout Note Layout extraction produces a SPICE netlist consisting of device and connectivity information used for comparing layout vs schematic LVS or SPICE simulations Design rule checking DRC ensures that a layout conforms to fabrication process requirements but it does not verify that the layout actually implements what was intended nor does it assist in determining whether the system will perform to your specifications Extracting MEMS designs involves the use of the MEMS Pro feature called subcircuit extract Subcircuit extract involves the extraction of subcircuit cells as black boxes with connection ports and cell properties For more information see Subcircuit Recognition on page 3 73 and Extracting Layout on page 3 48 of the L Edit User Guide Select Tools gt Extract to invoke the Extract tabbed dialog box An extract definition file must be loaded to provide technology information about your design It contains a list of the connections and devices to be extracted Contents Index Verification Extracting Layout m Click the Browse button and use the windows browser to select mumps ext from the tutorial directory and enter Layout spc as the output
136. ed without the prior written consent of MCNC Title to copyright to this software and to any associated documentation shall at all times remain with MCNC and Licensee agrees to preserve the same Licensee agrees not to make any copies in whole or part except for the Licensee s internal noncommercial use Licensee also agrees to place this copyright notice on any such copies MCNC makes no representation or warranties express or implied By way of example but not limitation MCNC makes no representation or warranties of merchantability or fitness for any particular purpose or that the use of the licensed software components or documentation will not infringe any patents copyrights trademarks or other rights MCNC shall not be held liable for any liability nor for any direct indirect or consequential damages with respect to any claim by Licensee or any third party on account of or arising from this Agreement or use of this software PostScript is a registered trademark of Adobe Systems Inc GDSII is a trademark of Calma Valid Cadence SUN and SunOS are trademarks of Sun Microsystems Inc UNIX is a trademark of AT amp T Bell Laboratories Contents Index Using the MEMS Library New users of the MEMS Library should first run through the MEMS Pro Tutorial on page 14 Listed below are high level descriptions of the steps a user should take to use the MEMS Library to create a MEMS design 5 Create an S Edit schematic design using s
137. educed In practice it is often the degree of freedom you want to concentrate on Nevertheless running the condensation algorithm introduces an approximation of the model behavior that is related to the choice of the master degrees of freedom You have to make sure that the selected master degrees of freedom are representative of the structural behavior of interest You can select the master degree of freedom using the ANSYS M command that can also be accessed through the GUI refer to the ANSYS documentation for more information Contents Index Reduced Order Modeling User Manual 3 Performing reduction M To start the reduction algorithm click the Single DOF button of the Electrostatic option R 0 M Tools Ea Figure 37 R O M Tools menu The following dialog box Figure 38 opens asking you to define data as well as algorithm control parameters For some parameters default values are suggested but you must check their compatibility with your own configuration MEMS Pro User Guide Contents Index 356 Reduced Order Modeling User Manual Note Character strings must be in single quotes and must not be longer than 8 characters Electrostatic structure reduction to single DOF t conductor p eee poem as a pec a VV pewne a eere _ P a P eet Figure 38 Electrostatic structure reduction to single DOF dialog box MEMS Pro User Guide Contents Index 357 The output
138. efer to Showing and Hiding Layers on page 1 221 of the L Edit User Guide For more information on setting up colors refer to Color Parameters on page 1 103 of the L Edit User Guide Status Bar The Status Bar located at the bottom of the L Edit window displays context sensitive information on items in the interface The status bar contains two panes The right pane usually displays the L Edit mode for layout views The left pane displays the status of the 3D Model View as indicated in the following table Action Description The pointer is in the 3D Model The name of the identified layer If a layer is generated View palette this will be the Boolean formula for that layer A menu item is highlighted A list of the menu s commands Contents Index Action Description The pointer is in the tool bar The function of the identified tool All other times Ready The status bar may be displayed or not To Show or Hide a status bar select View gt Status Bars m Status Bars M Status Bar M Mouse Button Bar M Locator Bar Figure 91 Status Bars dialog The checked status bars will appear as part of the viewer interface Uncheck the bars you do not wish to see They will immediately disappear Click Close to exit the dialog Contents Index Viewing a Cross section From an active 3D Model View window clicking the al toolbar button snaps the 3D model to the top view and invokes cross section viewing bringing
139. efinition In addition to layout or mask data the 3D Modeler needs the fabrication process description to generate 3D models This information may already be saved with the layout if not it must be imported into the design file Contents Index Note The following setup procedure loads the process information into the design file Once imported the process definition information is saved with the design file it need not be re imported when the file is re opened Choose 3D Tools gt Edit Process Definition in the MEMS Pro Palette In the Process Definition dialog click the Import button In the Open dialog box select mumps_i pdt and click the Open button For more information on process definitions see Process Definition on page 352 of the MEMS Pro User Guide Contents Index MEMS Pro Tutorial Viewing a 3D Model Information describing the MCNC MUMPs process is imported into the dialog box This information in conjunction with the open layout is used to build a 3D model Deposit Ox1 Etch Dimple Etch Anchort Deposit Poly Etch Poly1 Etch Hole1 Sacrificial Etch Figure 27 Process Definition dialog box The top of the dialog box contains identifying information for the process definition The left side of the dialog contains a list of the process steps Beneath MEMS Pro User Guide Contents Index 76 Note it and to its side are the controls for adding deleting moving enabling and di
140. egree of freedom by giving its Minimal and Maximal fitting values The number of configurations used for the sweeping range must also be specified Number of fitting points The Degree of fitting must always be smaller than the Number of fitting points The Reference bias voltage is a control parameter that theoretically has no effect on the results but has been introduced to deal with possible numerical troubles This value is used as the bias voltage applied to the excitation component to perform the coupled system analysis The Maximum number of eigen modes is an advanced parameter related to the reduced model frequency response tuning process The theoretical presentation of the Guyan condensation algorithm explained that this method introduces an approximation on the mass matrix that leads to an overestimated approximation of the eigen frequencies To overcome this behavior a modal analysis of the structural system has been performed and a corrected reduced mass value has been computed to match a given eigen frequency As an upper limit of the eigen frequencies is of interest initial reduced eigen frequency the modal analysis is performed by imposing a maximum number of Contents Index modes to compute the default is 10 as well as the upper limit of the frequencies This works correctly in the average case but the procedure could nevertheless fail in some particular cases Regarding the procedure it is obvious that the
141. el simplifications or limit the available results in order to obtain accurate but fast solution during simulations The following parts indicate how to perform a reduction with two different examples condensation of an accelerometer model and reduction of an electrostatic structural coupled system Condensation Reduction with Single DOF amp Load Cases Before using the R O M tool you first have to provide a finite element model in ANSYS For the following examples use an inertial accelerometer model that consists of a structural mass supported by four thin beams clamped at their extremities as shown in Figure 39 Contents Index AVANSYS Graphics EPLOT 1 ELEMENTS U Figure 39 ANSYS Graphics window Contents Index Reduced Order Modeling ROM Tutorial The first example is the most simple A single load case is taken into account and the accelerometer model is condensed in terms of a single degree of freedom Model Generation First provide a finite element model of your structure In that example all the information is gathered in two macros you only have to execute them This can be done using multiple tools All the information concerning the model geometry mesh and boundary conditions is gathered in the file called accelman mdl located under the tutorial directory Copy accelman mdl to your working directory In the ANSYS Input window enter the following command see ANSYS documentation for furth
142. elf or alternatively expands within the Target to half of the total Thickness Depth must be a positive decimal number between 0 and 100 The distance the growth will extrude outward from the mask edge Undercut 0 is aligned to the mask edge Any positive decimal number may be entered for Undercut The Target is the material that is reduced or consumed by the chemical process that produces the Source Any valid L Edit layer name may be entered as text enclosed in quotation marks to identify the Target There may be multiple entries for Target Layer name of the material constructed on the Target It is the primary reference for 3D rendering information for the Grow step For example silicon dioxide is the Source for thermal oxide growth on exposed silicon Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for Source For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 114 Contents Index Parameters Description Label Comment During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Comment may be any text enclosed in quotation marks Contents Index Editing the Process Definition You may graphically edit the process definition To do this access the Process Definition dialog by selecting 3D Tools gt Edit Process Definition
143. ents Index Note For more information on performing the condensation reduction with multiple DOFs refer to Condensation Reduction with Multiple DOFs amp Load Cases in this chapter Generated files In both cases when running the algorithm the ANSYS solver is called and as a consequence classical ANSYS results and temporary files are created in your current working directory During this process the ANSYS jobname remains unchanged A temporary file named scratch is also generated Result files associated with the reduced model are created in your current working directory by adding the appropriate suffix to the output file prefix you previously entered The following table provides the meaning of the different suffixes Suffix Description sub ANSYS substructure file chdla Reduced model described in HDLA Sp Reduced model described in SPICE Contents Index Description of the sp models This type of optionally generated file contains a set of lumped basic circuit elements resistors capacitors inductors controlled voltage and current sources Depending on the number of load cases and degrees of freedom you entered the number of nodes in the generated equivalent circuit can be high Nevertheless the number of nodes for simulation external connecting nodes remains low These external connected nodes can be classified in three categories 1 The input nodes there are as many inpu
144. ents Index This editing possibility is quite useful Indeed if you instantiate a component and then decide that it should be larger or longer you can just modify one of its parameters and the newly edited component is automatically instantiated Attaching Components Drag the comb drive to the right side of the plate so that the two objects slightly overlap Recall that an object can be dragged to new locations by selecting it with a click and then holding down the center mouse button while moving it to the desired location on the page For two button mice left click on the object while holding down the Alt key to accomplish the move Zoom in with the plus key Use the arrow keys to pan the view to where the comb drive overlaps the plate Contents Index i Re align the comb drive so that it looks like the figure below Figure 20 Aligning the comb drive to the plate Copy the comb drive by clicking it and choosing Edit gt Copy then Edit gt Paste The new comb drive will appear in the center of the page on top of your existing drawing Move it to the side of the other layout objects Flip the second comb drive by selecting Draw gt Flip gt Horizontal Change the name of this copied instance by selecting Edit gt Edit Object and entering CombLeft in the Instance Name field Attach the second comb drive to the left side of the plate Figure 21 Contents Index Figure 21 Viewing the uncomplete design Genera
145. er name Residual strain step size deleO 0 00025 residual_strain_step Width of ring bring 20 um ring width Width of cross beam bbeam 10 um cross_beam_width Size of anchor supports asize 40 um anchor_size Thickness of structural layer heigth 2 um ring_thickness Poisson s ratio for structural nu 0 23 poissons_ratio film S Edit Symbol Name N A Contents Index MEMSLib Reference Test Elements Array of Guckel Ring Elements Array of Guckel Rings Parameters S_GURINGS_1 Layout Parameter Entry Dialog Box Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 598 Multilayer Pad Element S_PAD_1 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a pad for wafer probe or wire bond purposes It has a stack of layers electrically connecting the first electrical connect layer first structural layer first structural layer second structural layer and the second and final electrical layer Parameter List The following table provides the multilayer pad parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Pad width padw 100 um pad_width S Edit Symbol Name N A Contents Index Multilayer Pad Element Multi Layer Parameters S_PAD_1 Pad width pad_width um padw 100 Name of cell pad Layout Parameter Entr
146. er Guide Contents Index 448 Optimization Tutorial Setting up the Optimization Note that this target value will overwrite the one set earlier during the measurement setup Click Continue to go to the next dialog Set parameter limits Set the Parameter name to springlength Minimum value to 10e 6 Maximum value to 200e 6 Delta Optional to 0 25e 6 and Guess value Optional to 100e 6 Figure 96 Click Add to add the values to the List of parameters T Spice Command Tool nalysis Current source 200e 6 100 6 Bete Ge springlenath minval 10e 6 200e 6 delta 0 25e 6 Pes MEMS Pro User Guide Contents Index 449 Optimization Tutorial Setting up the Optimization Figure 96 Customizing the parameters limits Click Continue to go to the next dialog Set optimization algorithm In the Name field type optmod For all other values accept the defaults Figure 97 When you are finished the T Spice Command tool dialog will look like the following T Spice Command Tool nalysis Current source Levenberg Marquardt Level 1 M MEMS Pro User Guide Contents Index 450 Optimization Tutorial Setting up the Optimization Figure 97 Customizing the optimization algorithm Click Continue to go to the next dialog Insert command The optimization commands you have created are displayed in the dialog Review your entries make sure they are correct If you need to change a line
147. er Guide and Reference This section offers step by step instructions for creating the schematic symbol that you will use to reference the MEMS element you will design To understand how you will produce the symbol let s look at a symbol from our existing library Double click the S Edit icon de to launch S Edit Select File gt Open Open the reson sdb file in the tutorial directory Figure 123 Select Module gt Open Select module Plate4 Contents Index Extending the MEMS Library Schematic Symbols Symbol model plated w 0 0002 ae Properties elele lelo L 0 0002 om m top_m t left_e S right_e bottom e top_e model L L W W Ports o D E a A id f a Walle Figure 123 Symbolic view of the resonator Plate4 is composed of three parts the symbol representing the element its properties and ports The SPICE OUTPUT property shown across the bottom of the S Edit window is essential for exporting to a SPICE netlist MEMS Pro User Guide Contents Index 509 g N A A A Perform the following steps to create a new symbol Select Module gt New In the Module Name field enter the name of your new symbol Ensure that the current view is in symbol mode by selecting View gt Symbol Mode Draw your symbol with the Annotation tools Place input and output ports on your symbols with the Port tool Add properties to your symbol with the Properties tool
148. er details USE accelman md1 Figure 40 ANSYS Input Figure 40 ANSYS Input window MEMS Pro User Guide Contents Index 372 Reduced Order Modeling ROM Tutorial The accelerometer appears in the ANSYS Graphics EPLOT window Figure 39 It is a 3D meshed view of the accelerometer The load case is an acceleration applied to the vertical axis of the model The conditions corresponding to the chosen load case are contained in the file called accelman load1 located in the tutorial directory Copy the following macro accelman load1 to your working directory Click the ANSYS Input window and execute the macro using the ANSYS USE command USE accelman loadl AVANSYS Input Figure 41 ANSYS Input window The applied acceleration is shown by an arrow on the triad Figure 42 It allows you to verify the applied boundary conditions MEMS Pro User Guide Contents Index 373 Figure 42 Arrow in the Z direction Performing Reduction You now have to define one or more degrees of freedom to which the model will be reduced In this example you are interested in the model behavior at a particular node that has a number given to the N_ MASTER variable see the model description macro accelman mdl In fact it is the center node of the accelerometer top face We will use only one degree of freedom the vertical displacement Define this degree of freedom as a master degree of freedom by entering the fo
149. eration is based on the same fitting procedure as the loads Contents Index Running the Reduction Algorithm Defining a model Before using the MEMScAP R O M tools you have to load a finite element model of your structure in ANSYS and provide all the data related to both electrical and structural behaviors of your system That means at least nodes requested parameters if any and physical properties as well as boundary conditions To provide a complete finite element model in ANSYS generate a common geometrical model and separately describe the two independent physical environments electrical and structural using PHYSICS files refer to the ANSYS User Manual and documentation for further details The generation of the requested files and data can be performed using multiple methods executing a macro introducing commands in the ANSYS Input window using the GUI or combining those three methods In the case of electrostatically coupled systems the principle of solution is to iteratively solve the electrical or structural equation updating each equation using the results of the previous one That means updating the geometry before solving the electrical equation and introducing electrostatic loads in the structural equation Contents Index In practice structural components are separated by gaps most often filled with air that is a material that does not contribute to the structural stiffness calculation So it is not mandato
150. erence Usage in S Edit Schematic Mode In Schematic mode the Command Tool is used to add SPICE commands which can be passed via netlist export to the T Spice simulator This simplifies the task of entering complex simulation commands such as those for parameter sweeps and optimization It also allows the user to maintain within the schematic database symbols schematics and simulation parameters Contents Index Symbol Mode In Symbol mode the Command Tool can be used to associate a SPICE command with a symbol This capability is of use to library designers who might want to associate an often used SPICE command with a symbol Property Creation The Command Tool can be used to set the value of an arbitrary property for use in a schematic symbol With this use the name of property is not limited to SPICE OUTPUT Contents Index Accessing the Command Tool Schematic Tools Toolbar In the Schematic mode of S Edit the Command Tool is activated by clicking the Command Tool button on the Schematic Tools toolbar Once the button is clicked it remains depressed until another tool is activated by clicking any of the other buttons on the same toolbar Ik mal cacai ee S Command Tool When the Command tool is active the mouse cursor becomes a cross hair as it is dragged over the work space A left click on the work space will invoke the T Spice Command Tool dialog Contents Index Command Tool Accessing the
151. es are especially useful for power ground anchor clock reset and other system wide nodes that require routing throughout the hierarchy of the design Contents Index Note For more information on global nodes see Global Nodes on page 191 of the S Edit User Guide and Reference To create a global node you must place a global symbol on the design with the Global Symbol tool Global symbols are special instances that function as wireless connectors When you attach a node to a global symbol you connect that node to all other nodes on every page and module in the design file that are attached to the same global symbol Such nodes then become global nodes You will add six global ground symbols to the schematic Three of them will be connected to the negative terminals of the voltage sources to set electrical grounds The other three will be connected to the fixed mechanical terminals to signify mechanical anchors To place a ground symbol onto the design click the Global Symbol tool on the left side of the schematic window 4s Contents Index Left click on the schematic page The Instance Module browse box will appear with a list of the available global nodes and the ground Gnd symbol will be preselected p Files l x myreson Cancel r Select Module To Instance Et Figure 4 Instance Module browse box Click OK The ground symbol will be placed where you left clicked in the previous step
152. es in the oxide mapped to the layer with CIF code COF The ANSYS component is Yellow in ANSYS This negative mask has no mask name in the layout NEG OXI1 AAA COF COLOR YELL END Special Layers Anchors dimples contact and via layers components are commonly declared as special layers in the technology file They are part of other structural layers such as Poly or Metal but at different heights In the technology file enter the character at the beginning of the lines describing these layers N diffusion P diffusion These are normal layers except for those defined by combination of layers example for act area crossing poly to perform transistor Contents Index The following is a technology file of the front side bulk etching process for ANSYS SU SUBSTRAT COLOR CYAN END ANCHOR BAN BPO COLOR RED LAYOUT anchor END POLY1 BPO BHO COLOR RED LAYOUT polyl END METALI BME BHM COLOR BLUE LAYOUT metall END CONTACT BCO BME COLOR GREE LAYOUT contact END NEG PASS BPA BPA COLOR YGRE LAYOUT pass END HOLPOLY BHO BPO LAYOUT holpoly1 END HOLMETAL BHM BME LAYOUT _ holmetall END NEG LOCOS BLO BAN COLOR WHIT END NEG OXIDE BOX BCO COLOR DGRA END Hereafter is a technology file of the backetch process SU SUBSTRAT COLOR CYAN END POLY1 POI HP1 COLOR RED LAYOUT poly1l END POLY2 PO2 HP2 COLOR MAGE LAYOUT poly2 END Contents Index NEG NEG NEG NEG NEG NEG METALI METAL2 METAL3 CON
153. esonator Schematic Pagel a2 aleja alela gt Eea E etelt lelo Ereet A NI NI Figure 1 Schematic view of the complete resonator Creating a New Module To initiate your new resonator design you must first create a new module MEMS Pro User Guide Contents Index 22 Select Module gt New to create a module In the Module Name edit field enter MyResonator and click OK Now would be a good time to save a copy of the file Select File gt Save As to invoke the Save As dialog Select the tutorial directory enter myreson sdb as the filename and click the Save button You can compare your work to the reference design at any time by using the Module gt Open command and choosing Resonator as the module to open Use Module gt Open again to return to your design this time selecting MyResonator as the module to be opened Instantiating Components Instantiating a Plate Select Module gt Instance to invoke the Instance Module dialog Select plate4 as the Module to Instance and click OK Plate4 a four sided plate with eight points of connection pins will appear at the center of the schematic page Contents Index Note Home the view by selecting View gt Home or by pressing the Home key The view of the plate will be resized so that the plate fills the con
154. est point of the Wafer for the TOP face or from the lowest point of the Wafer for the BOT face Depth may be any positive decimal number Vertical measure of the material that remains after the polish It is measured from the lowest point of the Wafer for the TOP face and from the highest point of the Wafer for the BOT face Any positive decimal number may be entered for Thickness During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Contents Index Parameter Description Comment Comment may be any text enclosed in quotation marks Contents Index ImplantDiffuse ImplantDiffuse is not supported in MEMS Pro Version 3 The syntax for the ImplantDiffuse command is given below followed by an example containing valid entries for its parameters Syntax ImplantDiffuse WaferID S Face face MaskName layer Depth P Angle A Undercut P Target layer Source layer Label S Comment S Example ImplantDiffuse WaferID wl1 Face TOP Contents Index MaskName NOxide 1 Depth 4 Angle 90 Undercut 0 Target Polyl Source NOxide Label ImplantDiffuse Comment Nwell Source for Implant Description This step models the implantation and diffusion of impurities into a material The result of this step is similar to the EtchType SURFACE EtchMask INSIDE step except that the
155. etched part is replaced not removed The Depth Undercut and Angle parameters model the geometric effects of the ImplantDiffuse step The Depth parameter represents the vertical junction depth The Undercut and Angle parameters model the lateral diffusion effect The Undercut sets the extent to which the impurities spread over the edge of the mask Notice that the actual mask used during fabrication is the boolean negative of the drawn mask shown in the diagram The Angle parameter models the curved profile of the diffusion region as a straight line Contents Index Orientation Considerations The Face to be etched may be the top face TOP the bottom face BOT or both faces simultaneously TOPBOT If you are designing masks for processing on both faces of the wafer you must be careful of the orientation of the masks As Alan Nutt of Kodak Research Laboratories points out to ensure correct alignment as drawn in layout of the masks designed for processing on the bottom of the wafer with the masks designed for processing on the top of the wafer the former must be flipped horizontally i e left right reversed You may be required to perform the reversal yourself or have the mask maker perform it Please consult your mask maker for further information Some parameters for ImplantDiffuse are illustrated below mask Undercut A Angle ImplantDiffuse Region Contents Index Parameters for ImplantDiffuse are described bel
156. ette should have been loaded as part of your installation setup Check that the MEMS Pro Toolbar has automatically appeared in the L Edit window Contents Index If the MEMS Pro Toolbar is not automatically loaded you will need to load it manually Refer to the introduction of Chapter 3 MEMS Pro Toolbar Using the MEMS Library Palette Select Library gt Library Palette in the MEMS Pro Toolbar to invoke the Library Palette dialog box The MEMS Library Palette dialog box contains four tabs Active Elements Passive Elements Test Elements and Resonator Elements You will use the Resonator Elements in this tutorial Contents Index MEMS Pro Tutorial Generating a Layout mi Select the Resonator Elements tab to make the resonator components available Library Palette MEMSCAP Baa i Figure 16 MEMS Layout Palette Generating the Plate K Click the Plate B button to invoke the plate generation macro A dialog box will appear requesting the parameters of the plate MEMS Pro User Guide Contents Index 59 MEMS Pro Tutorial Generating a Layout yw Enter 100 as the Width and click OK accepting the default values for the other parameters Rectangular Parameters S_PLATE_1 Figure 17 Plate Parameters dialog L Edit UPI now creates a plate matching the input parameters To see the entire plate home the view by selecting View gt Home or by pressing the Home key The plate shown in the active windo
157. fering EtchMask settings illustrate this effect Contents Index EtchMask INSIDE i drawn mask EtchMask OUTSIDE a drawn mask SURFACE BULK and SACRIFICIAL etches are described below Contents Index EtchType SURFACE The outcome of a SURFACE etch depends on EtchMask Angle Undercut and Depth In the diagram below the EtchMask parameter is set to OUTSIDE Drawn Mask Drawn Mask Angle Undercut gt Depth Parameters for a SURFACE etch are described below Parameter Description WaferlD This optional parameter identifies the Wafer to be etched Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferID where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Contents Index Parameter Description EtchType Face MaskName EtchMask Depth Type of etch Parameter options are SURFACE BULK and SACRIFICIAL The value is set to SURFACE for a surface etch Side of the Wafer to be etched Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Any valid L Edit layer name enclosed in quotation marks is an acceptable input for MaskName The geometry on this mask defines the area to be etched or excluded from etching Parameter op
158. file radical is a prefix used to create result files see generated files ANSYS Physics files are defined by a title a file radical prefix and a file extension In accordance with your own model generation procedure you have to define these three character strings for both the structural and electrical environments The reduction algorithm generates a scalar equation governing the transient response of the system in terms of the master degree of freedom If required a capacitance versus master degree of freedom relationship can also be generated The capacitance values you extract are the lumped capacitances that are presented as matrix results The size of the matrix depends on the number of conductors and the ground definition The generated capacitance relationship is time independent Transient capacitance values can be obtained by solving the reduced coupled structural equation and applying the capacitance relationship to the resulting master degrees of freedom values To activate or disable this relationship generation check the Compute capacitance box From the electrical point of view the system can be divided into conductors that electrostatically interact To allow the algorithm to access them a component of nodes must be associated to each conductor The name of the component is the Contents Index Conductors component name defined in the dialog box followed by the Number of conductors Component names must not be lo
159. g Vertex Coordinates 128 Viewing Vertex Information 129 Voltage sources instantiation 27 Volumes addition 310 356 creation 305 353 deletion 309 360 Contents Index W Wafer 191 618 Waveform probing 43 viewing 45 Wire drawing 87 Wire tool 24 Contents Index
160. g a wire For more information on making connections see Nodes on page 184 Pins on page 180 and Wires on page 175 of the S Edit User Guide and Reference Move the cursor down and end the wire placement by right clicking at the pin called free_m on the bottom fspring This pin is shown as an open circle on the top left of the bottom fspring instance Repeat this process to wire the plate with the other components see Figure 3 Contents Index Mw Home the view by pressing the Home key Figure 3 Schematic view of the wired elements Next you will add stimuli and commands to set up this schematic for simulation Contents Index Instantiating Voltage Sources Instantiate the Source_v_ac module Place it to the left of the left comb Instantiate the Source_v_dce module Place it to the right of the right comb Copy the instance of Source_v_de and place it to the right of the top fspring NH A A A A ABA Wire the positive terminals of the voltage sources to the fix_e pins of the right comb left comb and top fspring The positive terminals are on the top of the voltage source in this example 5 Compare your design to the finished design in Figure 1 to make sure you have placed the voltage sources correctly Placing Global Nodes Global nodes simplify the drawing and maintenance of schematics They allow nodes throughout a design to be connected to each other without the need to draw or delete wires Global nod
161. gorithm and the summary of the data you entered in the previous dialog box KKKKKKKKKKKK KK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKKKKKKKKKKKKK Electrostatic reduction single degree of freedom KKKKKKKKKKKK KK KKK KKK KKK KKK KKK KKK KKK KKK KKKKKKKKKKKKKKKKK Structure PHYSICS File structu phy Title u Electrostatic PHYSICS File electric phy Title Conductors name cond Number of conductors 2 Ground key 0 Capacitance matrix dimension 1 Excitation component cond2 Contents Index The next display is related to the structural condensation algorithm The name of the ANSYS substructure file is printed as well as the reduced values of mass damping and stiffness Ansys substructure file tmp sub Waiting for ANSYS solution Done Structural reduced parameters Stiffness k Mass m Damping c 1 1646848e 00 4 9866184e 12 0 0000000e 00 Then comes the modal analysis and the frequency response tuning procedure Structural eigen frequencies computed with the complete model are printed followed by a comparison between the estimated eigen frequencies and mass values The comparison of the values gives an indication on the representation of the mode by the selected master degree of freedom Contents Index Tuning transient response Expected eigen frequency 7 6670774e 04 Approximated eigen frequency 7 6916812e 04 0 3209 shift Reduced mass 4 9866184e 12 Corrected mass 5 0186740e
162. he damping parameter we want to sweep Now you will study the influence of damping on the chosen device You will perform a step excitation and look at the response of the device with various damping parameters You will sweep the damping parameter between typical values for MEMS le 7 to le 3 N s m Select Module gt Open Contents Index Reduced Order Modeling ROM Tutorial yw Choose SWEEP_Damping in the Open Module dialog box The appropriate module appears in the S Edit window S Edit MicroMirror sdb SWEEP_Damping Schematic PageO tims metini ERIE tint ie paian ping 1 Ye Excitation py sce Displacement Velocity Acceleration Figure 81 Viewing the SWEEP_Damping module MEMS Pro User Guide Contents Index 428 Reduced Order Modeling ROM Tutorial Mi Select Setup gt Probing The Waveform Probing Setup dialog box appears Waveform Probing Setup Bertsch Share T eufT euf MEMS Modeler ror Mi Mi E E M M al B al Figure 82 Waveform Probing Setup dialog box Click the Browse button and browse for the MicroMirror dat file located in the tutorial directory MEMS Pro User Guide Contents Index 429 Click Open and then click OK Click the T Spice button An S Edit warning appears asking you whether you want to overwrite the existing file or not S Edit iN Output file exists on disk Overwrite CE Figure 83 S Edit warn
163. he first sp file is created by default The file name prefix is the name you entered or the ANSYS jobname if no file radical prefix is specified It contains a circuit of lumped elementary elements used to model the Master Degree Of Freedom as a function of the applied voltage The connection to a global circuit of this model has to be performed through three nodes input output and 0 The signal connected to the input node must be the applied voltage The voltage at the ouput node models the master degree of freedom behavior The 0 node must be connected to the voltage reference in the circuit The second sp file is generated only if the capacitance output option is toggled to Yes The file name prefix consists of two parts separated by an underscore The first part is identical to the previous file prefix and the Contents Index second part is the capa string The connection to an external global circuit is similar to the MDOF behavior connection There is only one difference instead of having only one output node in the MDOF model case output1 you can have up to NM output nodes in the capacitance model outputl outputNM NM being the number of mutual capacitance interaction coefficients In this release NM 1 The following provides an example of a capacitance output Spice equivalent netlist generated by Memscap MEMS Modeler param force_polynomeO 1 538212e 10 param force_polynomel 3 855341le 15 param
164. he layout window to make it active In the MEMS Pro Palette select 3D Tools gt View 3D Model twice to create two more views of the 3D model Contents Index MEMS Pro Tutorial Viewing a 3D Model mi Select Window gt Tile to tile the windows All open windows will be resized so that they fit without overlapping Figure 29 Each 3D model view may be manipulated independently ioi x EET Figure 29 Tiling the windows displaying the 3D generation steps MEMS Pro User Guide Contents Index 81 lt Viewing the 3D Model Once generated 3D models do not need to be regenerated to be viewed again In addition 3D models are saved with the design information into the Tanner Database tdb file Keep the layout window with the original design open and active close all 3D model windows by clicking the X button in the upper right corner of each window Select 3D Tools gt View 3D Model in the MEMS Pro Palette and the 3D model will reopen without generating 3D Cross section Cross sections may be taken from the 3D model using the Cross section tool Click somewhere in the title bar of the layout window to make it active Select 3D Tools gt View 3D Model in the MEMS Pro Palette to create another view of the 3D model Click the Cross section tool a The Generate 3D Model Cross Section dialog will appear Figure 30 Contents Index MEMS Pro Tutorial Viewing a 3D Model Generate 3D Model Cross Section x
165. he object Pass List but you may choose alternate colors from the Color sample bar You can select colors for each layer in your 3D model Solid colors are available in MEMS Pro Version 3 Stipple patterns are not Contents Index Viewing 3D Models from Layout Model viewing is launched by selecting 3D Tools gt View 3D Model in the MEMS Pro Toolbar If the model is up to date you may immediately view it If the model is new or needs to be updated the model is generated when the View 3D Model command is selected You will be warned if the model is out of date For more information on warnings and error messages see 3D Modeler Error Checks on page 252 During model generation a progress bar will display the Label and Process Step number associated to each command as it is processed by the 3D Modeler For more information on Labels and Process Step numbers see Editing the Process Definition on page 225 Generating 3D Model Press Esc to abort Processing Etch Poly Step 9 of 10 Estimated time left 0 seconds Figure 76 Generating 3D Model progress bar An estimate of the time remaining to complete each step is reported below the progress bar To abort 3D model generation press the Esc key Contents Index Note The model is displayed in an L Edit 3D Model View window with the E icon in the left corner followed by Cellname 3D Model Filename The initial view of the 3D model will be Isometric that is with equal X Y
166. he optimization goal or goals and your choice among the analysis and the optimization algorithms we provide Further you decide which measurements will be used to determine if the optimization has been successful Once you have successfully run an optimization the optimized parameter values can be used in subsequent analyses of the same model This allows for incremental optimization some parameters can be optimized while others are held fixed later other parameters can be optimized based on the results of the earlier optimization If multiple analyses are requested DC analyses will be performed first then AC analyses and then transient analyses Multiple analyses of the same type are performed in the order they appear in the input file The optimization process is most easily explained by walking through some examples Our first example is a simple optimization with just one parameter measure analysis and goal Contents Index Note For more information on optimizing your design see Optimization on page 130 of the T Spice Pro User Guide Contents Index Setting up the Optimization If you recall the MEMS Pro Tutorial on page 14 we explored the construction and behavior of a resonator Here we explore that model further The MEMS Pro optimizer will help you find the value of the springlength parameter that will most closely achieve the optimization goal a resonant frequency of 40 kHz MV Launch S Edit by double clicking
167. he radii of circles found in a group block must be of increasing size See the example above filltype The value of the first circle s fill type indicates whether the circle is to be filled or left blank If fill type of the first circle is the value 1 then the circle is filled That is the space between the center and the circumference of the circle will be assigned a layer outside the circle s circumference the region will be left blank Circles of greater radius will be drawn as defined in the following geometry definition statements The fill types of these circles will be ignored alternating between filling and not filling the areas between the subsequent circles in the group If the first circle has a fill type of value zero 0 then the area between the center and the circumference of the circle will be left blank The area between subsequent circles will be alternately filled and left blank Contents Index 3D Modeler Introduction Accessing 3D Models Defining Colors for 3D Models Viewing 3D Models from Layout 3D Model View User Interface Viewing a Cross section Deleting 3D Models Exporting 3D Models Linking to ANSYS Editing the Process Definition 3D Modeler Error Checks Contents Index 173 182 186 188 190 215 218 220 223 225 252 Introduction The 3D Modeler emulates the geometric effects of the fabrication process on a wafer from its mask layout and process
168. hen the mesh is completed the elements are displayed This display can be manipulated by the Pan Zoom Rotate menu in the same way as that of the 3D model Figure 113 Meshed view of the spring Contents Index Running the Analysis Now that you have set material properties applied boundary conditions and meshed the model you are ready to perform a linear structural analysis Vv In the ANSYS Main menu choose Solution gt Solve Current LS VM Take a moment to review the information in the STAT Command window Close this window by clicking the Close icon in the upper right corner 5i In the Solve Current Load Step dialog click OK Depending on CPU speed and memory allocation the analysis may take several minutes VM When the analysis is finished an Information dialog will appear stating Solution is done Click Close Contents Index Displaying the Results The results of the analysis are not immediately displayed You must identify the results you want to display and specify how you want them to be displayed In the ANSYS Main menu choose General Postproc gt Read Results First Set In the ANSYS Main menu choose General Postproc gt Plot Results gt Contour Plot Nodal Solution 4 In the Contour Nodal Solution Data dialog verify that DOF solution is selected in the left box and Translation UX in the right box for Item to be contoured ANSYS will use the relative displacement in the X direction for the
169. herefore has no setting for EtchMask or MaskName SACRIFICIAL etch parameters are Face and EtchRemoves Face EtchRemoves Parameter options include TOP BOT for bottom and TOPBOT for both top and bottom Face identifies the side s of the wafer to be etched Parameter options include the list of layers in the design these appear in a scrolling checklist Click the name s of the layer s in the EtchRemoves list to mark them with an X Marked layers will be removed during this Etch step Contents Index MechanicalPolish MechanicalPolish truncates the specified Depth off the top or bottom of the entire wafer regardless of material type The effects of MechanicalPolish can be specified by either a Depth or a Thickness but not both When a Depth is specified that Depth is truncated off the face of the wafer When a Thickness is specified that Thickness remains after polishing The drawing below gives the profile of a wafer before and after MechanicalPolish The depth d has been sliced off the top of the wafer BEFORE Depth d AFTER Contents Index In the drawing below the MechanicalPolish command has sliced material from the bottom of the Wafer and left Thickness t BEFORE AFTER Face Parameter options include TOP and BOT for bottom Face identifies the side of the wafer to be etched Note that only one side of the wafer may be mechanically polished at a time TOPBOT is not an available opt
170. his condensation method usually known as the static or Guyan method consists in selecting a reduced set of degrees of freedom that are assumed to be representative of the complete model behavior selected degrees of freedom and in eliminating the remaining degrees of freedom condensed degrees of freedom from the initial set of equations This condensation algorithm introduces the approximation that consists in assuming that the set of condensed degrees of freedom are related to the selected ones by the means of the static behavior equation In practice the reduced model can only be connected to the external world using the set of selected degrees of freedom In the same way explicit forces can be applied to them eventually combined with a linear combination of equivalent loads computed in accordance with the condensation algorithm This reduction method leads to an overestimation of the system eigen frequencies Contents Index Running the Condensation Defining a model Before using the MEMScAP R O M tools you have to load the finite element model of a structure in ANSYS That means at least nodes cells possibly generated upon geometrical entities requested parameters if any and physical properties as well as boundary conditions that are not included in the load case s There exist multiple methods to load a finite element model executing a macro introducing commands in the ANSYS Input window using the GUI or combining th
171. ial Creating a Schematic m Click the work area to open the T Spice Command Tool dialog Click the next to the Files entry of the tree located on the left side of the dialog Click Include file under Files Set Include file to process sp and click the Insert Command button You can type the filename in or you can find it with the Browse button Spice Command Tool Table file Delete library file nitialization E Voltage source E Optimization Figure 9 Selecting the technology process file MEMS Pro User Guide Contents Index 39 Exporting a Netlist An S Edit schematic can be exported to a SPICE netlist by performing one of the following operations Using the Export Netlist dialog box accessed via File gt Export Clicking the T Spice button on the Standard Commands toolbar The netlist can be used to test the performance characteristics of the system using T Spice or other SPICE programs The next few instructions ask you to invoke T Spice from S Edit to export a netlist and to run a simulation When you invoke T Spice a new active application window will appear The current S Edit window will become inactive but do not close it You will be returning to S Edit to analyze your simulation results Tutorial Breakpoint You will now use T Spice to simulate a circuit If you are starting the tutorial here double click the S Edit icon and select File gt Open to open the reson sdb file in the tutorial d
172. ic declaration If these layers contain holes you must define a hole layer associated to this positive layer in the technology file This layer should also have a layer name in the layout setup There is a specific declaration for this hole layer The character should be located at the beginning of the line describing this layer The following example shows you how the couple positive layer hole layer is declared Contents Index The structural layer with ANSYS component name POLY 1 and CIF code CPS is RED in ANSYS and its layout layer name is POL1 Holes in this layer are mapped in a layout layer named HOLE which CIF code is CHO Holes do not appear in the 3D view POLY1 CPS CHO COLOR RED LAYOUT POL1 END HOLE1 WP CHO CPS LAYOUT HOLE1 END If a mask is not in the layout and if it has no holes you must not write it in the technology file Considering a layer whose holes are not defined If the program detects a hole the layer name that is considered is the name of the layer containing the hole Negative Mask This is a mask whose holes correspond to a layer in the layout Holes in this type of layer can be mapped to layers such as ANCHOR VIA Example holes in an OXIDE layer can appear as CONTACT in the layout Place NEG to declare the negative mask before the ANSYS component name Contents Index The following example represents an oxide component called OXI1 in ANSYS with a CIF code AAA and hol
173. ic window if the Command Tool was accessed from the Module menu The command you specified using the T Spice Command Tool dialog will be inserted as the Value of the SPICE OUTPUT property of the new instance Template Module The template module is provided as a part of the schematic library and is named TSPICE COMMAND If this module does not exist within the current design space a browse dialog will prompt you to enter the name of the module to use as the template If the chosen template module does not contain a SPICE OUTPUT property one will be created and placed at the origin of the symbol page with the Value set to Contents Index Symbol Mode The method of access and the result of the Command Tool is similar for both Schematic and Symbol modes The exception is that in the Schematic mode an instance is created as the schematic object and in the Symbol mode a property is created instead The Command Tool is activated by clicking the Command Tool button on the Schematic Tools toolbar as before The Command Tool may also be accessed by selecting Module gt Command Tool Schematic Object in Symbol Mode As described in Command Tool Dialog on page 479 a SPICE command string will be formulated from your entries to the dialog box and a property named SPICE OUTPUT of type Text will be created and placed at the cursor location if the Command Tool was accessed from the Schematic Toolbar or at the origin if the Command Tool was
174. icating which step is currently performed At the end of the 3D generation the 3D model appears in a new window For more information on viewing a 3D model refer to Viewing 3D Models from Layout of Chapter 6 3D Modeler Contents Index MEMS Pro Toolbar 3D Tools Menu Deleting a 3D Model To delete a 3D model select 3D Tools gt Delete 3D Model in the MEMS Pro Toolbar The Delete 3D Models dialog box appears Figure 46 You can choose to delete one cell one file or all open files Delete 3D Models 9 si s Figure 46 Delete 3D Models dialog box Note For more information on deleting 3D models refer to Deleting 3D Models of Chapter 6 3D Modeler MEMS Pro User Guide Contents Index 112 MEMS Pro Toolbar 3D Tools Menu Exporting a 3D Model To export a 3D model select 3D Tools gt Export 3D Model in the MEMS Pro Toolbar The Export 3D Model dialog appears Figure 47 You can export your 3D model into a sat or a anf file Export 3D Model ACIS text format SAT a Figure 47 Export 3D Model dialog Note For more information on exporting 3D models refer to Exporting 3D Models of Chapter 6 3D Modeler MEMS Pro User Guide Contents Index 113 Easy MEMS Menu The Easy MEMS menu offers two useful features that allow you to perform the following operations Creating holes in a plate Customizing the duplication of elements Creating holes in a plate To create hole
175. if the cell name is demo 1 the resulting cell name is demo The CIF file is created under the working directory you defined after launching ANSYS To import the CIF file in MEMS Pro use the Import Mask Data options of the File menu in L Edit Select File gt Import Mask Data The Import Mask Data dialog box appears Figure 13 Contents Index ANSYS to Layout Generator The Layout Generator Program Import Mask Data Ea e me fLeyoutt empty Layout1 Figure 13 Import Mask Data dialog box m You have the possibility to import a CIF or GDSII file Make sure you chose CIF By cliking Import you open the layout view of the 3D model MEMS Pro User Guide Contents Index 302 Definition of a Technology File This section provides information on how to create and use a technology file First of all a technology file is used to attribute a CIF code to a volume which has a component name in ANSYS A technology file is also used to detect negative masks and substrate to get the layer name for the layout back and to define a component color in ANSYS To create a technology file you need to know the layer name in the layout and if these layers are a negative mask or not Then you have to define a component name a CIF code and a color for each layer Some layers do not appear in the layout but are important in the 3D Model in ANSYS like OXIDE To create a technology file first steps are Def
176. ifies the mesh element shape It must be declared for the finite element before boundary conditions are set M In the ANSYS Main menu choose Preprocessor gt Element Type gt Add Edit Delete MV In the Element Types dialog click Add MV In the Library of Element Types dialog choose Structural Solid in the left box zi In the right box scroll to the Tet 10node 92 entry Select Tet 10node 92 Click OK Library of Element Types Tet_16node lTet 1 node 92 Figure 108 Library of Element Types dialog M Click Close in the Element Types dialog Contents Index Setting Boundary Conditions You will anchor the spring to the surface it shares with the layer below it this is surface number 59 in the 3D model and apply a small leftward pointing force to the two keypoints numbers 41 and 42 on the upper right corner of the model This will cause the spring to bend slightly to the left First anchor the spring VM Picking the correct area will be easier if only the edges of the 3D model are displayed Choose Plot gt Lines from the ANSYS Utility menu and then PlotCtris gt Pan Zoom Rotate Zoom in on the area near the anchor using either one of the zooming tools in the Pan Zoom Rotate menu It will be helpful in picking the correct area to rotate the 3D model so that the viewing angle is not directly from above VM In the ANSYS Main menu choose Preprocessor gt Loads gt Loads Apply gt Structural Displacement g
177. iliar with the material covered in this general tutorial In this tutorial you will create a schematic design analyze system behavior and generate device layout with the MEMS Pro tools S Edit T Spice W Edit and L Edit You will draw mask layout manually and automatically and generate and view 3D models and cross sections in L Edit All files mentioned in this chapter are located in the tutorial subdirectory of the main MEMS Pro installation directory We recommend that you follow the tutorial from the beginning however you may enter and exit the tutorial at several points during the design Tutorial breakpoints occur at Simulating from a Netlist on page 42 Generating a Layout on page 56 Viewing a 3D Model on page 73 and at Drawing Tools on page 86 Contents Index The Design Example The design example appearing throughout the MEMS Pro User Guide is an electrostatic lateral comb drive resonator A resonator is a MEMS transducer that can be used as a sensor by exploiting the high sensitivity of its resonant frequency to various physical parameters The resonator was chosen for your review because it is an easily understood coupled electro mechanical system The resonator will be designed using the MEMSLib library components including comb drives a plate and folded springs Contents Index Creating a Schematic In this section you will learn how to navigate and manipulate designs using the S Edit schematic editor Launching
178. ility to view the coordinates angles and information related to a vertex For more information on how to use these features related to vertices refer to Viewing Vertex Coordinates and Angles in Chapter 5 MEMS Pro Utilities Viewing Vertex Coordinates The View Vertex Coordinates feature of MEMS Pro V3 0 allows you to view the coordinates of selected elements To view the coordinates of a particular element perform the following steps Select the desired element Choose Tools gt View Vertex Coordinates in the MEMS Pro Toolbar The vertex number and coordinates of the selected element are displayed in the layout window Contents Index Viewing Vertex Angles The View Vertex Angles feature allows you to view the angle values of selected elements To view the angle values of a particular element perform the following operations M Select the desired element Choose Tools gt View Vertex Coordinates in the MEMS Pro Toolbar The vertex number and the angle values of the selected element are displayed in the layout window Viewing Vertex Information The View Vertex Information feature allows you to view the coordinates the angle values and the number of the vertices of a selected element VM To access that feature select the element for which you want to view the information Mw Select Tools gt View Vertex Information in the MEMS Pro Toolbar The information concerning the vertices of the selected element are
179. ill appear empty as shown below Te Erebie Fal i E aE g Add Step DEBE BIE Comment Sx woot eso OE cen Figure 98 Process Definition dialog To construct a 3D model process definition information must either already be present in the design entered manually through the Process Definition dialog or imported from a process definition pdt file Contents Index Importing the Process Definition The process definition may be imported by clicking Import in the Process Definition dialog An Open dialog will appear as shown below Fim ol epee Princes Diran Fey f pet Cancel BEN Figure 99 Open dialog After locating and selecting the process definition file click the Open button to populate the Process Steps list in the Process Definition dialog Click OK again to import the process information into the 3D Modeler When the file is saved the process definition will be attached to the tdb file The next time the layout is opened the process information will be available to construct a 3D model it will not have to be re entered Contents Index 3D Modeler Editing the Process Definition The Process Definition dialog may be used to Add Steps Delete Steps and to edit the parameters of an existing Process Step A MUMPs process definition has been imported into the dialog below The commands correspond to the example used in the chapter on Process Definition o
180. information on using the Polar Array function refer to Generating Polar Arrays in Chapter 5 MEMS Pro Utilities MEMS Pro User Guide Contents Index 117 Splines The Splines feature is a new feature of MEMS Pro Version 3 0 It consists of the possibility of creating and editing splines Note For more information on the creation and edition of splines refer to Chapter 4 Splines Creating Splines To create splines perform the following operations Mw Select the reference wire or the object for which you would like to create spline edge VM Select Splines gt Create in the MEMS Pro Toolbar The Create Splines dialog box appears Figure 50 You have the possibility to extrapolate or approximate the reference object Contents Index MEMS Pro Toolbar Splines Create Spline Figure 50 Create Spline dialog box MEMS Pro User Guide Contents Index 119 Editing Splines To edit a spline perform the following steps 5i Select the spline you want to edit MV Select Splines gt Edit in the MEMS Pro Toolbar The same Create Spline dialog box see Figure 50 in which you can modify the operation of creating a spline appears Note This option also allows you to undo the spline creation that is to re create the original reference wire Contents Index Tools Note The Tools menu gives you access to options related to the vertex coordinates angles and information You now have the possib
181. ing Click Yes The netlist generated by S Edit opens in the T Spice window Contents Index Reduced Order Modeling ROM Tutorial SPICE netlist written by S Edit Win32 6 01 Written on Jul 12 2001 at 17 29 03 Waveform probing commands probe options probefilename D public gaelle Documentation MemsPro reference_files ROM MicroMirror MicroMirror dat probesdbfile D public gaelle Documentation MemsPro reference_files ROM MicroMirror MicroMirror sdb probetopmodule SWUEEP_Damping SUBCKT Micro_Mirror_w_Damping O inputi output1 outputil_d2t outputi_dt dii damping ENDS Main circuit SWEEP_Damping XMicro_Mirror_w_Damping_1 Gnd Excitation Displacement Acceleration Velocity Micro_Mirror_w_Damping vi Excitation Gnd pwl O0 O 0 1m O 1 1m 5 4 2m 5 options chargetol 5Se 3 options numnd 500 options numnt 1000 tran op O 1m 4 2m start 0 05m method bdf sweep dec param damping 1le 7 1e 3 1 param damping 1e 7 End of main circuit SWEEP_Damping Figure 84 Viewing the generated netlist m Launch the simulation by clicking the Run Simulation button The Run Simulation dialog box opens MEMS Pro User Guide Contents Index 431 Reduced Order Modeling ROM Tutorial Run Simulation Figure 85 Run Simulation dialog Check the Do not Show box and click the Start Simulation button Click Yes when asked if you want to overwrite the existing file Access back the S Edit wind
182. ing operations Select the object for which you want to clear the vertex information Select Tools gt Clear Vertex Information on the MEMS Pro Palette A dialog box prompting you to confirm the removal of the vertex information of the selected object appears Confirm your intention of removing the vertex information of the selected object by clicking OK The vertex information of the selected object disappears ertexInfo x N Do you only want to clear markers for the selected object 4 No Cancel Figure 66 Vertexinfo Confirmation dialog Note If you click No the vertex information of all the objects is cleared Contents Index Approximating All angle Objects Description Approx dll generates 90 and 45 approximated polygons for all angle objects within a cell The macro operates on the entire hierarchy of the design The user may choose to perform approximation approximation and cross section view approximation and design rule check or approximation and extract Accessing the Macro To access this macro select any of the following commands Tools gt MEMS Approx Tools gt MEMS CSV Tools gt MEMS DRC or Tools gt MEMS Extract Parameter Default Value Description MEMS Approx Available approximation types are Manhattanize and Bostonize Manhattanize generates 90 polygon approximations Bostonize generates 90 and 45 polygon approximations MEMS CSV Generates a cross section view af
183. ining the layer name in the layout Determining if the mask is negative or not Choosing a CIF code for this particular mask Contents Index The general syntax of a line in a technology file is the following Type Name CIF code CIF hole code COLOR Color Code LAYOUT Layout layer END The possibilities are the following Type SU for substrate NEG for a negative mask for a special layer A blank space or a tabulation should be used if it is a structural layer associated to a positive mask Name Name of the component in ANSYS max 8 characters CIF code A 3 letter abbreviation for the CIF file Contents Index CIF hole code CIF code for the layer s holes COLOR Keyword string for Color declaration in ANSYS component rendering Color Code Color code for the layer For holes use a blank space LAYOUT Keyword for a Layout Layer Specifies if the layer in 3D should be associated to a mask layer a Layout layer The name of the layer in the layout END End of the line Contents Index Substrate Within ANSYS an ANSYS component called SUBSTRAT should exist It helps you detect what is not covered by the negative mask In the technology file place the SU string at the beginning of the line describing this layer we recommend you to start each technology file by this layer SU SUBSTRAT COLOR CYAN END Positive Mask Normal positive layers do not have specif
184. interpolated curve to an approximated curve passing through the angled curve the original wire Understanding Splines A spline is defined by a set of vertices and shape factors To each vertex is assigned a shape factor The shape factors lie in the 1 1 interval If the shape factor lies between 1 O where 0 does not belong to the set the curve is interpolated in a geometrically continuous way If the shape factor is 0 the vertices of the curve become angles This shape factor allows one to recreate angled segments from curved elements If the shape factor lies between 0 1 where 0 does not belong to the set the created curve approximates the vertex Contents Index The Splines option allows you to perform one of the following operations Creating a spline Editing a spline Contents Index Splines Create Spline Dialog Box Create Spline Dialog Box The only dialog box used to create and edit splines is the Create Spline dialog box Figure 52 You access it by selecting either Splines gt Create or Splines gt Edit in the MEMS Pro Toolbar Create Spline 69 000 0 000 Figure 52 Create Spline dialog box MEMS Pro User Guide Contents Index 129 Note Parameter Interpolate On the left side of the dialog box the coordinates in locator units and the shape factor are displayed for each vertex also called a control point of the reference wire The vertices are d
185. ion for this step Depth Depth may be any positive decimal number It is the vertical measure of the material removed measured from the highest point of the Wafer for the TOP side or from the lowest point of the Wafer for the BOT side Contents Index Thickness Thickness may be any positive decimal number It is the vertical measure of the material that remains after the polish It is measured from the lowest point of the Wafer for the TOP side and from the highest point of the Wafer for the BOT side Contents Index 3D Modeler Error Checks The 3D Modeler performs several checks before presenting or generating the 3D model for view These checks are the following Is the 3D model out of date Does the process definition exist Are there derived layers in the process definition Do all the required mask layers exist Are there any visible wires or self intersecting ambiguous polygons in the mask layout These checks are described on the following pages Contents Index Checking if the 3D Model is Out of Date An existing 3D model is made obsolete if the process definition or layout used to generate it has been altered If a 3D model is out of date a warning dialog will appear that states the situation 3D Model Out Of Date and what changes have occurred since the model was last generated 3D Model Out Of Date Eg 3 D Model for this cell is out of date Changes to gt have been made since solid model was generated
186. ions This kind of equations can only be solved using an iterative process Once the electric potential field equation is solved the electric field can be deduced from the scalar potential and on the external areas of conductors the expression of electrostatic pressure can be evaluated Structural equivalent forces are then computed by integration of the electrostatic pressure according to the structural degrees of freedom Structural behavior Considering a structure that globally interacts electrostatically with its environment the output of interest is a single degree of freedom From the structural point of view the model behavior can be reduced to the following single scalar equation MXR CXR kxXp f xp V 4 Contents Index The mass m the damping coefficient c and the stiffness k are computed by the application of the Guyan reduction algorithm described in the previous section This reduced model corresponds to a mass connected to a spring damper The displacement dependent electrostatic interaction is included into the term of external force in which V represents the bias voltage applied between the structure and the environment Tuning eigen frequency As the Guyan reduction algorithm leads to an overestimated approximation of the system eigen frequency the reduced system parameters must be adjusted In the case of single degree of freedom systems the eigen frequency is given in terms of the stiffness k an
187. iption MechanicalPolish truncates the specified Depth off the top or bottom of the entire wafer regardless of material type The effects of MechanicalPolish can be specified by either a Depth or a Thickness but not both When a Depth is specified that Depth is truncated off the face of the wafer When a Thickness is specified that Thickness remains after polishing The drawing below gives the profile of a wafer before and after MechanicalPolish The depth d has been sliced off the top of the wafer BEFORE Depth d AFTER Contents Index In the drawing below the MechanicalPolish command has sliced material from the bottom of the Wafer and left Thickness t BEFORE AFTER Contents Index Parameters for MechanicalPolish are described below Parameter Description WaferlID Face Depth Thickness Label This optional parameter identifies the Wafer to be polished Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferlD where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Side of the Wafer to be polished Parameter options are TOP or BOT Only one face may be polished at a time in Version 3 Do not enclose in quotation marks Vertical measure of the material removed measured from the high
188. irectory Contents Index Note Note that we have provided a working module of the resonator for you to use through the rest of the tutorial if the resonator you created is incomplete or if you are entering the tutorial at this step Our module is called Resonator Follow the next two steps to access Resonator If you want to use the resonator you have created move ahead to the third step Launch T Spice Use the Module gt Open command Select the module Resonator click OK Click the page containing Resonator to ensure that it is active Launch T Spice Click the T Spice button located in the Standard Commands toolbar T Spice will launch with the exported netlist open If you chose your resonator module the exported netlist file name will be MyResonator sp If you chose our resonator module the exported netlist file name will be Resonator sp in the tutorial directory This name will appear in the title bar of the input file window of T Spice You should leave S Edit open For more information on exporting schematics see Exporting a Netlist on page 228 of the S Edit User Guide and Reference Contents Index Simulating from a Netlist Using T Spice and W Edit SPICE netlists can be simulated and the simulation results can be displayed graphically In this example the coupled electro mechanical behavior of the resonator is simulated using SPICE Simulating with T Spice T Spice contains a full featured editor
189. is second instance of fspring by selecting Edit gt Flip gt Vertical Contents Index Wiring Objects Note Wires are drawn using the Wire tool E First time users of S Edit may confuse the Wire tool with the Line tool Lines are used to graphically represent components they are non electrical objects used to annotate your schematic Wires are electrical and are used to connect objects For more information on wiring your schematic see Wires on page 175 of the S Edit User Guide and Reference Zooming the View Sensitive operations such as wiring nodes require a closer view for accuracy Select View gt Zoom gt Mouse Drag a box around the plate with the left mouse button Allow enough room to see the areas between the comb drives and the folded springs If you find you have zoomed in too much or too little use the plus and minus keys to Zoom in and out The arrow keys can be used to pan the view Contents Index Note Note For more information on zooming see Panning and Zooming on page 134 of the S Edit User Guide and Reference You will now create connections between the plate and other schematic components with wires Select the Wire tool from the schematic toolbar Initiate the wire placement by left clicking on plate4 at the bottom_m pin The pin is shown as an open circle on the bottom left of the plate4 instance Vertices can be placed on wires by clicking the left mouse button while placin
190. isplayed in a specific order depending on their numbers You can view the numbers of the vertices by choosing Tools gt View Vertex Coordinates in the MEMS Pro Toolbar For more informations on this viewing feature refer to Viewing Vertex Coordinates and Angles in Chapter 5 MEMS Pro Utilities On the right side the behavior of the curve at each control point can be manipulated either using the slide bar or the radio buttons Whether using the slide bar or the rado buttons one can change the behavior at a control point to be an approximate angled or interpolated spline The parameters of the Create Spline dialog box are described in the following table Default Value Description 1 00 Allows interpolation of a reference segment the value ranges from 1 to 0 Angle 0 00 Allows creation of angles on a curved object the only available value is 0 Contents Index Parameter Default Value Description Approximate 1 00 Allows approximation of the angle of a reference segment the value ranges from 0 to 1 Note You also have the possibility to decide whether you want to overlay the original object with the spline or replace the original object by the spline using the Overlay original object and Replace original object radio buttons of the Spline Curve area The shape factor values range from 1 1 Contents Index Creating Splines Creating Splines from Angled Wires To create a
191. ist x Beers te ema ae y 9 a Se SchemL S dat Figure 104 Export Netlist dialog Clicking OK will save the setup information run the extraction and create an output netlist file that is preloaded with the module name In this case the file name will be SchemLVS sp This is a text file in SPICE format that contains device descriptions their connectivity and geometrical parameter information The netlist file can be used to perform layout versus schematic verification LVS Select File gt Exit to exit S Edit MEMS Pro User Guide Contents Index 470 Verification Comparing Netlists Comparing Netlists An important step in the MEMS design process involves comparing the layout and the schematic to ensure that they describe the same system This is layout versus schematic comparison performed by comparing two netlists one derived from the layout and one from the schematic Double click the LVS icon wa to launch LVS Select File gt Open to open the reson vdb file in the tutorial directory The file contains predefined parameters to compare the SPICE files you created Freson vdb MEMS Pro User Guide Contents Index 471 Verification Comparing Netlists Figure 105 Viewing the preset parameters of the reson vdb file m Click the Run button P located on the toolbar to launch the comparison The verification window will appear displaying the results Verificatio
192. ited on horizontal surfaces of a CONFORMAL deposit Material coverage t on intermediate slopes depends on the angle of the wall according to the relationship described in the section on Thickness and Scf on page 639 Entries for Scf can be a decimal number between 0 and 1 or the letter c and whether numeral or character must be enclosed in quotation marks An Sef of is equivalent to an Sef of 1 0 which is a completely conformal deposit that is a deposit with uniform thickness along the wafer contour The Scf parameter is not supported in MEMS Pro Version 3 and therefore not required The value of this parameter is assumed to be 1 0 or c for this release This parameter specifies the 3D model rendering characteristics of the deposited layer You may enter any valid L Edit layer name as text enclosed in quotation marks for Target Target and LayerName are typically set to the same value For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 114 During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Contents Index Parameter Description Comment Comment may be any text enclosed in quotation marks Thickness and Scf The relationship between Thickness and Scf Sidewall coverage factor can be clarified using some diagrams Assume that the profile below has been crea
193. itle Conductors name cond Number of conductors 2 Ground key 0 Capacitance matrix dimension 1 Excitation component cond2 The next display is related to the structural condensation algorithm The name of the ANSYS substructure file is printed as well as the reduced values of mass damping and stiffness Run structural substructuring Contents Index ANSYS substructure file tmp sub Waiting for ANSYS solution Done Structural reduced parameters Stiffness k 1 1646848e 00 Mass m 4 9866184e 12 Damping c 0 0000000e 00 Then comes the modal analysis and the frequency response tuning procedure Structural eigen frequencies computed on the complete model appear followed by a comparison between the estimated eigen frequencies and mass values The comparison of the values gives an indication on the representation of the mode by the selected master degree of freedom Waiting for ANSYS solution Done Contents Index 1 7 6670774e 04 Tuning transient response 6670774e 04 6916812e 04 0 3209 shift 9866184e 12 0186740e 12 0 6428 shift Expected eigen frequency a e NN Approximated eigen frequency Reduced mass S Corrected mass The next output indicates the sweeping parameters for coupled effects evaluation During these analyses a status is printed after each set of analyses Number of analyses 10 Degree of fitting 4 2 0000000e 06 Maximum DOF value 1 00000
194. ius point inner radius point center Figure 33 Creating a torus MEMS Pro User Guide Contents Index 90 Drawing a Curved Polygon To create a curved polygon a straight edged polygon must be drawn first The straight edges can then be converted to curved edges by selecting a given edge with a Ctrl Right click and then dragging out the desired curve with the center mouse button You will used a curved polygon to draw a stator like the one you drew with the torus tool 5i Select the Window Zoom tool to arrange the view in such a way that the left most stator is visible Figure 34 MV Select the All Angle Polygon tool is from the Drawing toolbar Contents Index MEMS Pro Tutorial Drawing Tools M Left click the first numbered vertex to begin drawing the polygon Left click the second and the third vertices then complete the polygon by right clicking the fourth numbered vertex Figure 34 X4 p N Figure 34 Creating the all angle polygon VM Select the rightmost edge with a Ctrl Right click Once selected the edge will be highlighted MEMS Pro User Guide Contents Index 92 MEMS Pro Tutorial Drawing Tools Vv Press the Ctrl key hold and drag the center mouse button Alt Left hold for two button mice to the left to convert the straight edge into a curved edge as shown below Release the mouse button to complete this action X4 ee Figure 35 Curving the rightmost edge of the polygon Mw Simi
195. ize your view with features such as panning zooming cross section modeling and other viewing controls 3D solid model geometry can be exported in a SAT format MEMS Block Place and Route The block place and route feature will save you time and prevent wiring mistakes Routing may be done automatically or manually The MEMS block place and route enables you to connect component level blocks of MEMS and IC Contents Index devices Efficiency enhancing features include hierarchical block placement block level floor planning an EDIF netlist reader and on line signal integrity analysis MEMS Library MEMSLib MEMSLib provides MEMS designers with schematics simulation models and parameterized layout generators for a set of MEMS components MEMSLib includes several types of suspension elements electro mechanical transducers and test structures for extracting material properties Various example elements can be assembled to produce a single MEMS device Foundry Support We ve included examples of process setup information for design rules layer definitions extraction rules process definitions model parameter values and macros from the most popular foundries Processes examples include MCNC MUMPs Sandia M3M ADI MEMS and MOSIS NIST Embedded features in ANSYS Reduced Order Modeling Macro Model Generation Powered by ANSYS Multiphysics MEMS Modeler offers automatic generation of behavioral models for fast and accura
196. l and MEMS designs using an extremely fast simulation engine that has been proven in designs of over 300 000 devices For large circuits the T Spice simulator can be ten times faster than typical SPICE simulators MEMS macromodels can be implemented in 3 different ways in T Spice In the simplest form MEMS devices may be modeled using equivalent circuits of standard SPICE components Another method is to create table models from experimental data or finite element or boundary element analysis of the MEMS Contents Index devices A third method is to use the external functional model interface This last method allows quick and easy prototyping of custom MEMS macromodels using a C code interface The program includes standard SPICE models BSIM3 models and the advanced Maher Mead charge controlled MOSFET model that is ideally suited to sub micron design The W Edit graphical waveform viewer embedded within T Spice displays analysis results and automatically updates its display each time T Spice simulates a circuit Powerful optimization algorithms automatically determine device or process parameters that will optimize the performance of your design Defining parameters to be varied setting up optimization criteria and choosing optimization algorithms is a cinch using the new Optimization Wizard The Wizard prompts you for the optimization criteria the program will need Monte Carlo analysis generates random variations in paramete
197. l rotary comb drive 508 Block place and route Voir BPR Bonding Pad Contents Index generation 63 Bonding pad 568 Boundary conditions setting in ANSYS 384 Box drawing 94 BPR initialization 432 routing a design 443 BPR 7 430 BULK etch type 202 206 C Checking errors in 3D model 212 CIF file export 319 Circle drawing 94 Clearing Vertex Information 130 Comb drive Contents Index bidirectional rotary 508 generation 59 instantiation 22 linear electrostatic 496 rotary 511 unidirectional rotary 1 502 unidirectional rotary 2 505 Comb drive 561 Command tool accessing 400 resulting schematic object 405 Command Tool dialog 402 Command tool 398 Components definition 310 Condensation algorithm 222 CONFORMAL deposit 195 624 Connecting global nodes 27 Crab leg linear 1 526 linear 2 529 Create Property dialog box 407 Contents Index Create Spline dialog box 412 Create Volumes 305 Creating a hole 121 a module 20 a new property 407 a schematic symbol 472 a schematic 17 splines 125 415 volumes 305 353 Crossover test structure type 1 541 type 2 543 Cross section view 175 Cross section 81 D Defining components 310 Delete 3D Model 119 Contents Index Delete Volumes 309 Deleting a 3D model 119 178 volumes 309 360 Deposit type CONFORMAL 195 624 FILL 199 632 SNOWFALL 197 630 Deposit 194 622 Design optimizati
198. l with shaded surfaces from the ANSYS Utility menu choose PlotCtrls gt Reset Plot Ctrls then choose Plot gt Volumes again In the ANSYS Utility menu choose PlotCtrls gt Pan Zoom Rotate In the Pan Zoom Rotate menu check the box labeled Dynamic Mode The left mouse button now controls panning and the right mouse button controls rotation Contents Index Figure 107 3D model of the spring displayed in ANSYS Contents Index Setting Material Properties Our example assumes that the spring mechanism is made of polysilicon that has a Young s modulus of 150 GigaPascals and a Poisson s ratio of 0 2 The 3D model however is defined in microns and not meters Instead of converting the 3D model to meters we will perform all the calculations in this tutorial in a system of units consisting of microns kilograms and seconds In these units the Young s modulus has the value of 1 5 x 10 the Poisson s ratio is dimensionless so it is unchanged You will now enter these material properties for polysilicon into your model M In the ANSYS Main menu choose Preprocessor gt Material Props gt Constant Isotropic 5i In the Isotropic Material Properties dialog verify that the material number is set to 1 and click OK zi In the Isotropic Material Properties dialog enter 1 5e5 for Young s modulus EX and 0 2 for Poisson s ratio NUXY 5i Click OK Contents Index Adding an Element Type The element type spec
199. larly select the left edge with a Ctrl Right click Once selected the edge will be highlighted MEMS Pro User Guide Contents Index 93 MEMS Pro Tutorial Drawing Tools Vv Press the Ctrl key hold and drag the center mouse button Alt Left hold for two button mice to the left to convert the straight edge into a curved edge Release the mouse button to complete this action Figure 36 lt p y Figure 36 Curving the leftmost edge of the polygon Note For more information on drawing and editing curves see Curves on page 1 254 of the L Edit User Guide MEMS Pro User Guide Contents Index 94 Drawing a Circle MV Select the Circle tool o and select the polyd layer VM Place a circle at the center of the incomplete design so that it matches the completed design Left click to anchor the center of the circle drag the mouse to set the radius of the circle and release Drawing a Box Close inspection of the rotor reveals there are three dimples positioned at 90 intervals near the center of the rotor A fourth dimple must be placed on the dimple layer to complete the pattern Mw Choose the Box tool m and select the dimple layer The box may be constructed anywhere on the layer We will move it to the proper location after it is complete Mi Left click to anchor the first corner of the box drag away from the anchor point to determine the opposite corner of the box three grid units away and release
200. le objects that are not touching can also be drawn on the MaskName layer to define the Wafer extent If there are objects drawn on other layers whose boundaries extend beyond the drawn Wafer extent those objects will be truncated as the 3D model is built If no closed curve is drawn on the MaskName layer its extent will be set to 110 of the minimum bounding box of the layout on all other masks Thickness Any positive value is acceptable for the vertical height of the Wafer Target Target choices include the list of layers in the design file This parameter specifies the 3D model rendering characteristics of the Wafer Target and MaskName are typically set to the same layer For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 186 Contents Index 3D Modeler Editing the Process Definition Deposit If the process Command is set to Deposit a new set of parameters will appear to the right of the Process Steps list These parameters are DepositType Face LayerName Thickness Scf and Target Process Definition Deposit Poly0 elie foowrorva H Etch Hole0 CONFORMAL Deposit 0x1 Etch Dimple Etch Anchorl Deposit Poly1 Etch Polyt Etch Holet Sacrificial Etch Figure 102 Characteristics of the Deposit Nitride step MEMS Pro User Guide Contents Index 234 The three possible values of DepositType are CONFORMAL SNOWFALL and FILL CONFORMAL deposit adds a la
201. llowing command in the ANSYS Input window Contents Index Reduced Order Modeling ROM Tutorial M N_MASTER UZ AAANSYS Input Figure 43 ANSYS Input window A symbol appears on the selected node to indicate the selected degree of freedom j Select MEMSCAP tools gt R O M Tools Figure 44 in the ANSYS Main menu MEMS Pro User Guide Contents Index 375 Reduced Order Modeling ROM Tutorial ANSYS Main Menu Eg Figure 44 R O M Tools menu MEMS Pro User Guide Contents Index 376 Reduced Order Modeling ROM Tutorial The R O M Tools window appears and gives access to all the condensation algorithms implemented in the MEMSCAP R O M tool R 0 M Tools x Figure 45 R O M Tools menu Before performing the reduction you must select the format s for which the reduced models will be generated MEMS Pro User Guide Contents Index 377 mi Click Output options Output options Figure 46 Output options dialog box The Output options dialog box allows you to save your model in SPICE HDLA or both languages As an example the SPICE language is chosen Click SPICE Now you may run the condensation The condensation part of the R O M tool gives access to the Guyan Irons reduction algorithm In the R O M Tools menu click Condensation gt Current LS to work on the current load case The Condensation Current LS window appears Figure 47 Contents Index Warning yw
202. ly completed the BPR tutorial L Edit main _ mems_placed tdb fe Figure 122 Layout view of the routed design MEMS Pro User Guide Contents Index 504 You may continue experimenting with BPR by removing the routed connections of the design Tools gt BPR gt Unroute All moving the blocks around and then routing again Contents Index MEMScAP 14 Extending the MEMS Library Introduction 507 Schematic Symbols 508 SPICE Models 511 Layout Generators 514 MEMS Pro User Guide Contents Index Introduction The MEMS library MEMSLib contains a variety of elements also called primitives that can be combined to create MEMS devices These building blocks are listed in the chapter MEMSLib Reference on page 280 of the MEMS Pro User Guide MEMSLib is continually updated to make available the widest possible selection of parts for generating MEMS devices However the possibilities of MEMS design are too broad for MEMSLib to completely represent all components of all possible devices Our priority is to construct those components most often required for MEMS design A powerful feature of MEMS Pro is that our design library can be easily extended We outline the process for adding new elements to the MEMS library in this chapter Contents Index Schematic Symbols Note We frequently refer to S Edit concepts operations and commands all of which are more fully described in the S Edit Us
203. mand to another only the viewing angle changes not the magnification Contents Index 3D Modeler 3D Model View User Interface Preset Views gt As shown below seven common viewing angles are Isometric available with the Preset View menu item As you move Top Front from one command to another only the viewing angle Right Bottom changes not the magnification Back Left Figure 80 Options of the Preset Views menu The Isometric view has equal X Y and Z scales and has the X Y and Z axes drawn 120 degrees apart MEMS Pro User Guide Contents Index 196 For the View tools the center of the 3D model is the origin of the X Y and Z axes the Top view is from above the object parallel to the X Y plane The Front view is from the positive X direction looking back at the object and parallel to the Y Z plane The Right view is from the positive Y direction looking back at the object parallel to the X Z plane Likewise the Left view is from the negative Y direction the Bottom view is from the negative Z direction and the Back view is from the negative X direction Spin This selection will cause the 3D model to rotate around the Z axis for one complete revolution Note that if your 3D object is symmetrical about the Z axis it will appear to revolve twice Orbit Orbit gives you an arbitrary view of the 3D model This command causes the model to rotate around its center thus accomplishing angular motion along all three axes
204. maximum number of eigen modes to compute must be greater or equal to the structural eigen mode of interest related to the master degree of freedom A second case of failure is a system in which the frequency gap between the mode of interest and the following one is less than the error on the eigen frequency induced by the condensation algorithm In this case you must indicate the number of the mode to be considered in the tuning process Nevertheless in such a case the reduced structural model will probably be unable to accurately represent the transient response of the real system Once you have completed the previous dialog box click OK to run the algorithm or select Cancel to close the dialog box Algorithm output When the reduction algorithm is running information is printed in the ANSYS Output window The display is related to the algorithm status as well as results and accuracy estimation Hereafter is an example of display during the execution of the algorithm Contents Index The first information displayed is the title of the algorithm and a summary of the data you entered in the previous dialog box KKKKKKKKKKKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKKKKKKKKKKKK KKK Electrostatic reduction single degree of freedom KKKKKKKKKK KKK KKK KK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKK KKKKKKKKKK KKK Structure PHYSICS File structu phy Title u Electrostatic PHYSICS File electric phy T
205. ments Type 2 S_RCOMBUA_1 S_RCOMBUA_2 on b page 542 S_RCOMBD Bidirectional Rotary Comb Drive Elements S_RCOMBD_1 S_RCOMBD_2 on page 546 S_RCDM Rotary Comb Drive Elements S_RCDM_1 S_RCDM_2 on page 550 S_RSDM Rotary Side Drive Elements S_RSDM_1 S_RSDM_2 on page 554 S_HSDM Harmonic Side Drive Elements S_HSDM_1 S_HSDM_2 on page 557 Passive Elements S_JBEARG_1 Journal Bearing Elements S_JBEARG_1 on page 560 S_JBEARG_2 Journal Bearing Elements 2 S_JBEARG_2 on page 563 Contents Index Element Description S_LCLS S_LCLSB S_LFBS S_SPIRAL Test Elements S_APTEST S_COTEST_1 S_COTEST_2 S_EUBEAM S_EUBEAMS S_GRING S_GRINGS S_PAD Linear Crab Leg Suspension Elements Type 1 S_LCLS_1 S_LCLS_2 on page 566 Linear Crab Leg Suspension Elements Type 2 S_LCLSB_1 S_LCLSB_2 on page 569 Linear Folded Beam Suspension Elements S_LFBS_1 S_LFBS_2 on page 572 Dual Archimedean Spiral Spring Elements S_SPIRAL_1 S_SPIRAL 2 on page 575 Area Perimeter Dielectric Isolation Test Structure Element S_APTEST_1 on page 578 Crossover Test Structure Element Type 1 S_COTEST_1 on page 581 Crossover Test Structure Element Type 2 S_COTEST_2 on page 584 Euler Column Doubly Supported Beam Elements S_EUBEAM_1 S EUBEAM_ 2 on page 587 Array of Euler Column Elements S_EUBEAMS_1 S_EUBEAMS_2 on page 590 Guckel Ring Test Structure Elements S_GURING_1 S_GURING_2 on page 593 Array of Guckel Ri
206. mponents of an electrostatic lateral comb drive resonator connect those components and run an AC analysis on your design Contents Index Note The schematic symbols for these components have two pins for each connecting side one carrying the electrical signal denoted with the subscript _e and the other carrying the mechanical signal denoted with the subscript _m These symbols are assembled to form the resonator design and a frequency sweep AC analysis of the system is performed to discover the resonant frequency and the magnitude of displacement The electro mechanical behavior of the components are modeled by expressing the mechanical behavior in terms of electrical analogs These models can then be used to solve for the electrical and mechanical behavior of the system as well as the coupling between the two energy domains The completed design is provided for your reference in the reson sdb file in the tutorial directory Select File gt Open to open this file The current visible file module page and mode are named at the top of the title bar The schematic view of the resonator appears in Figure 1 For more information see Working with Files on page 92 Working with Modules on page 97 Working with Schematic Pages on page 116 Levels of Design on page 31 and Viewing Modes on page 33 of the S Edit User Guide and Reference Contents Index MEMS Pro Tutorial Creating a Schematic gt S Edit reson sdb R
207. n 7 automorphed element class es 14 perfectly matched node class es ett POST ITERATION MATCHING eeesreesonencncnenin Doing detailed trial matching Matched Elements XPlatelnst_plate4 and plate4_1_plate4 see nacsicensessensentnacsicetoesseteseetene FINAL RESULT ssessssssseseneeeeeeeenenene Circuits are equal Figure 106 Verification window The netlist generated from the schematic and the netlist generated from the layout are identical e Select File gt Exit to exit LVS MEMS Pro User Guide Contents Index 472 Note For more information on netlist comparison see Netlist Comparison on page 3 139 and Resolving Discrepancies on page 3 157 of the L Edit User Guide Contents Index 12 Command Tool Introduction Accessing the Command Tool Command Tool Dialog Contents Index 475 477 479 Introduction The Command Tool provides a graphical interface for entering device and model statements simulation stimuli commands and options in SPICE syntax The Command Tool is accessible from both T Spice and S Edit In S Edit the Command Tool forms the grammatically correct SPICE commands for use in Schematic mode Symbol mode or in output property strings In T Spice the Command Tool can also be used to insert grammatically correct SPICE commands into your netlist For more information on accessing the Command Tool in T Spice see Simulation Commands on page 168 of the T Spice User Guide and Ref
208. n the ANSYS Input window Figure 73 M N_MASTER UZ I ALANSYS Input Figure 73 ANSYS Input window Mw Click MEMSCAP Tools gt R O M Tools MEMS Pro User Guide Contents Index 411 The R O M Tools menu appears Figure 74 R 0 M Tools Ea Figure 74 R O M Tools menu It gives access to all the condensation algorithms implemented in the MEMSCAP tool Before performing the reduction you must select the format s in which the reduced models will be generated Click Output options The Output options Figure 75 dialog box appears It allows you to save your result file in HDLA SPICE or both languages Contents Index Reduced Order Modeling ROM Tutorial Output options Figure 75 Output options dialog box In this example the SPICE language is chosen Click SPICE Now you may start the reduction algorithm Click the Single DOF button under the electrostatic title MEMS Pro User Guide Contents Index 413 Reduced Order Modeling ROM Tutorial Electrostatic structure reduction to single DOF as ae jaeren paea aes jersei C Iv songs i pema S a a a m Figure 76 Data dialog box MEMS Pro User Guide Contents Index 414 The above dialog box opens prompting you to define data and algorithm control parameters For some parameters default values are suggested but you must check their compatibility with your own configuration First indicate the radical p
209. n marks is an acceptable entry for EtchRemoves There may be multiple entries of this parameter During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Contents Index Parameter Description Comment Comment may be any text enclosed in quotation marks EtchType BULK The BULK etch sketched below is of KOH or EDP on a silicon wafer of 100 crystal orientation The pit is bound by the 111 plane which is attacked at a much slower rate than all other crystallographic planes The outline of the box is the minimum bounding box of the mask pattern This etch assumes EtchMask INSIDE The etch is viewed from above the TOP face A cross section corresponding to the dashed line appears below cross section line EN cross section p Parameters for the BULK etch are described below Contents Index Recall that the BULK etch is designed to remove the Wafer material only There is no need to identify the Wafer with the EtchRemoves parameter Parameter Description WaferID EtchType Face MaskName Depth Angle This optional parameter identifies the Wafer to be etched Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferID where valid entries are any text enclosed in quotation m
210. n page 352 Figure 100 Process Definition dialog box MEMS Pro User Guide Contents Index 227 Process identification information appears at the top of the dialog A Process Step may be edited in the body of the dialog A Comment for each Process Step may be entered at the base of the dialog Process Identification At the top of the process definition dialog you may enter identifying information Name The name of the process definition Version The version string of the process definition Units Browse options for units are microns millimeters centimeters mils inches lambda and other Editing the Process Steps List The process definition editor has several useful features Steps may be added removed rearranged or disabled that is commented out 3D models of intermediate processing steps can be displayed at points set in the Process Steps list Each Process Step is identified by an order number and by a label Below the Process Steps list are two check boxes Enable and Display 3D model for this Contents Index step These check boxes select options to be applied to the selected Process Step Enable Process Steps are enabled by default If you would like to see the 3D model that is created by omitting a given step highlight the step and uncheck the Enable box The disabled step will appear gray in the Process Steps list Display 3D model for this step By default the entire fabrication process
211. n structural layer is the second bearing surface The clearance between the two bearing surfaces is determined by the thickness of the second sacrificial layer The radius of the shaft is set by the inner radius of the journal rotor and the second sacrificial layer thickness used in the process The rotor has an outer ring on structural layer2 that is mechanically connected to the rotary part of the bearing on structural layer Parameter List The following table provides the journal bearing 2 parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Radius of cap of central shaft rcap 8 5 um cap_rafius Inner radius of journal rotor rinner 4 5 um rotor_inner_radius Contents Index Description Layout Default Parameter Value Name Schematic parameter name Outer radius of journal rotor router 15 um rotor_outer_radius S Edit Symbol Name S_JBEARG_2 S Edit Test Schematic N A Contents Index Journal Bearing Elements 2 Journal Bearing Parameters S_JBEARG_2 Radius of cap of central shaft cap_radius um reap 2 5 Inner radius of journal rotor rotor_inner_radius um rinner 45 Cancel Outer radius of journal rotor rotor_outer_radius um router fi 5 Name of cell Layout Parameter Entry Dialog Box Layout Palette Button gt SMS a AS SOE gt gt ie te oes Layout Parameter Illust
212. n your ANSYS directory to accomplish this task Under Windows NT and UNIX MEMS Pro users who wish to use ANSYS can export their files in either ANF or SAT format If you choose to export to ANF format MEMS Pro will invoke The ANSYS Connection Product for SAT as you export the file If you choose to export your model from MEMS Pro in SAT format ANSYS will invoke The ANSYS Connection Product for SAT as it reads the SAT file In either case you must have The ANSYS Connection Product for SAT installed in your ANSYS directory In this tutorial you will export the 3D model as an ANF file for analysis in ANSYS Choose Tools gt Export 3D Model Set the file type to ANF and the file name to spring anf and click Export Refer to lt jinstall directory gt ToAnsys ansys wri for details on connecting MEMS Pro output to ANSYS input Contents Index Reading the 3D Model in ANSYS Launch ANSYS by clicking the ANSYS button ay on the 3D Model View toolbar The location of ANSYS depends on your individual system you may have to browse your file system to find the ANSYS executable The default location is c ansys55 bin Intel ansysir exe MV In the ANSYS Utility menu choose File gt Read Input from and browse for the spring anf file Viewing the 3D Model in ANSYS Once the 3D model has been read it may be viewed in several ways Vv In the ANSYS Utility menu choose Plot gt Volumes to show the edges of the 3D model To view the mode
213. name Output Subeirewit Er b Bin sizes Locator Writs Figure 100 Selecting the extract definition file MEMS Pro User Guide Contents Index 464 Verification Extracting Layout M Click the Subcircuit tab Figure 101 Subcircuit tab of the Extract dialog box i Check the Recognize Subcircuit Instances checkbox Select SubCktID as the Subcircuit Recognition Layer uncheck the Flag Improper Overlaps checkbox MEMS Pro User Guide Contents Index 465 Click the Run button to begin the layout extraction Note that clicking OK will save the setup information but will not run the extraction After clicking Run a netlist file called Layout spe will be created This is a text file in SPICE format containing the devices extracted their connectivity and device geometrical parameter information The netlist file can be used to run T Spice simulations or to perform layout versus schematic verification LVS When the L Edit Warning dialog appears click the Ignore All button Open the Layout spc file selecting File gt Open In the Open dialog box change the File Type to Spice Files sp spc select Layout spe from the file list and click OK A text window is brought up in L Edit containing the file Examine the extracted file by using the scroll bar on the text window Teste He SsonAl ce hee oe slFe lfa na sos 0 ito 2 I cearr e ee ann Fee aA E ja ae
214. nd Tool dialog The T Spice Command Tool dialog lists command categories on the left By default the Analysis category is selected and the right side of the dialog contains buttons listing the commands within that category This command list may also be viewed by clicking the sign next to each category For example clicking the sign next to Analysis category will expand this category and show the same list of commands as those on the buttons When a command is selected the right side of the dialog changes to contain the parameters for the selected command Contents Index Add an AC analysis command by clicking the AC button on the right side of the T Spice Command Tool dialog The directory tree on the left side of the T Spice Command Tool dialog will open up to list the commands available under Analysis The right side of the T Spice Command Tool dialog will contain parameters specific to the AC Analysis command Contents Index MEMS Pro Tutorial Creating a Schematic mi Select decade as the Frequency sampling type set Frequencies per decade to 500 Frequency range From to 10k and Frequency range To to 100k Click Insert Command T Spice Command Tool E Optimization Figure 8 Customizing the AC analysis Once the AC analysis is set up we need to bring fabrication process information into the netlist The steps below guide you through this task MEMS Pro User Guide Contents Index 38 MEMS Pro Tutor
215. nd its mesh The conditions corresponding to the chosen load cases are contained in the macro called accelman load3 located under the tutorial directory It generates three LS files in the working directory Copy accelman load3 under your working directory Click on the ANSYS Input window and execute the macro ANSYS Input Figure 51 ANSYS Input window The macro generates three load cases and for each of them loads the configuration to a file After execution the last load case remains defined in ANSYS In this case an acceleration in the Z direction is symbolized by an arrow on the triad MEMS Pro User Guide Contents Index 384 Reduced Order Modeling ROM Tutorial Performing Reduction You now have to define one or more degrees of freedom to which the model will be reduced In this example you are interested in the model behavior at a particular node that has a number attributed to the N_ MASTER variable see the model description macro accelman mdl In fact it is the center node of the accelerometer top face Choose three degrees of freedom which are the displacements along the three axes Mi Define these degrees of freedom as master degrees of freedom by entering the following command in the ANSYS Input window M N_MASTER ALL ANSYS Input Figure 52 ANSYS Input window As the degrees of freedom associated with the nodes are the displacements in the three directions of the space you can sele
216. nd select Edit gt Edit Object From the Edit Node Label dialog box click one of the eight radio buttons representing the location of the label origin Contents Index Mv Edit the node label orientations to look somewhat like the layout in Figure 6 right m sighs Oo Figure 6 rtm and rte nodes VM You may rename the rest of the nodes in your diagram to match the names we have given ours in the Resonator module in reson sdb if you wish This is an optional step S Edit will automatically assign names to unlabeled nodes Adding Simulation Commands The Command tool provides an easy convenient means of entering device and model statements stimuli simulation commands and simulation options within the S Edit environment We will use the Command tool to add two SPICE commands One instructs the simulator to run an AC simulation The other instructs the simulator to include a file in the simulation netlist that contains fabrication process parameters for the resonator components Contents Index wy Select the Command tool from the schematic toolbar Click the work area to invoke the T Spice Command Tool dialog Figure 7 T Spice Command Tool x c Analysis Current source Files E Initialization E Output E Settings Table E Voltage source E Optimization Analysis Transient DC operating point Transfer function DC transfer sweep Parametic sweep Fouter Figure 7 T Spice Comma
217. ndow as shown below L Edit main ee et E Figure 118 Layout view of the mems_placed tdb file MEMS Pro User Guide Contents Index 500 Block Place and Route Tutorial Routing the Design yw Use Tools gt BPR gt Setup to confirm that the General tab fields are set as below Route selection type should be set to Net and the boxes should be checked Figure 119 General tab of the BPR Setup dialog MEMS Pro User Guide Contents Index 501 Block Place and Route Tutorial Routing the Design i Select the Autorouter tab to confirm that fields in that tab of BPR Setup are set as shown below BPR Setup Keep Out SubCktID Figure 120 Autorouter tab of the BPR Setup dialog MEMS Pro User Guide Contents Index 502 Block Place and Route Tutorial Routing the Design Click OK to close the BPR Setup dialog Use Tools gt BPR gt Route All to automatically route all nets in the design The following BPR Automatic Routing Report appears when the router has completed its attempt Note that 11 nets were completely routed no nets were partially routed or not routed at all BPR Automatic Routing Report Figure 121 BPR Automatic Routing Report dialog Click OK to close the routing report MEMS Pro User Guide Contents Index 503 Block Place and Route Tutorial Routing the Design The routed design should look like the figure below You have successful
218. ner_radius Outer radius of stator comb Tso 150 um stator_outer_radius Rotor spoke width rspokew 12 um rotor_spoke_width Stator spoke width sspokew 15 um stator_spoke_width Width of comb fingers fwidth 5 um finger_width Air gap between adjacent airgap 5 um finger_gap comb fingers Angular finger overlap trsovlp 30 degrees finger_overlap Direction of comb 1 DIR Contents Index S Edit Symbol Name S_RCOMBU_1_M_PHI_S and S_RCOMBU_1_M_PHI B for poly layer S RCOMBU_2_M_PHI_S and S RCOMBU_2_M_PHI B for poly2 layer Contents Index MEMSLib Reference Active Elements Unidirectional Rotary Comb Drive Elements Type1 Unidirectional Rotary Comb Parameters S_RCOMBU_1 Layout Parameter Entry Dialog Box Layout Palette Button MEMS Pro User Guide Unidirectional Rotary Comb Drive Motor sspokew Ai Layout Parameter Illustration Index 541 Unidirectional Rotary Comb Drive Elements Type 2 S_ RCOMBUA_1 S RCOMBUA_2 Description S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Generates a unidirectional rotary comb drive on the first or second structural layer This element is similar to rcombu The difference is in the design of the spoke The center of the circular fingers is at X center Y center and the rotor spoke is aligned with the X axis The unidirectional rotary comb drive of type 2 designed on the first structural layer S_RCOMBUA_1 has a corre
219. netlist navigator and assisted manual routing In this tutorial you will be placing and routing the blocks that compose a Q controlled resonator system This system consists of a MEMS linear resonator and interface circuitry that includes several transistors a resistor and a capacitor Two example files are located at lt install directory gt Examples Bpr The first file mems tbd is a source for setup information as you create your own tutorial file The second file mems_placed tbd is used to demonstrate automatic routing Contents Index Initializing the Design During BPR initialization L Edit reads a netlist places the cells in the design in a special top level BPR cell and displays their connectivity as routing guides You must first specify the netlist that L Edit will read for connectivity information All the cells appearing within the netlist must be present in your design file In this part of the tutorial you will Use the design navigator to copy cells into a design Enter initialization values Seta top level BPR cell 5 Launch L Edit L Edit opens with Cell0 of a new empty file called Layout1 You will add cell information to Layout as part of the initialization process Contents Index Block Place and Route Tutorial Initializing the Design Mi Select File gt Replace Setup Replace Setup Information x MEMSPro v2 0 Examples BPR mems tdb ETA Figure 111 Replace Setup I
220. nformation dialog All the boxes to import values from your design should be checked these describe the palette application design and layer setup information that will be incorporated into the Layout file MEMS Pro User Guide Contents Index 489 Browse to lt install directory gt Examples Bpr and select the file mems tdb Click OK to close the Replace Setup Information dialog The setup information has been transferred to your file Use File gt Save to save your file in the lt install directory gt Examples Bpr subdirectory as tutorial tdb swen Sr Sl lle mems_placed tdb File name tutorial tdb 7 Save as type Tanner Database Files tdb x Cancel Figure 112 Saving the setup information In order to initialize a design for BPR all the cells referenced in the netlist must exist in the active layout file You will copy the cells that you will need for Contents Index initialization into the tutorial tdb file using L Edit s Design Navigator The Design Navigator lists all the cells included within a single design and allows you to browse among them Use View gt Design Navigator to open the Design Navigator for tutorial tdb Contents Index Block Place and Route Tutorial Initializing the Design yw Use File gt Open to open the mems tdb file in the lt install directory gt Examples Bpr subdirectory The Design Navigator for mems tdb should appear 77 L Edit tutorial tdb tutori
221. ng Elements S_GURINGS_1 on page 596 Multilayer Pad Element S_PAD_1 on page 599 Resonator Elements S_PLATE_1 S_LCOMB_ 1 Plate S_PLATE_1 on page 601 Comb Drive S_LCOMB_3 on page 604 Contents Index Element Description S_LFBS_3 Folded Spring S_LFBS_3 on page 607 S_GDPLATE_1 Ground Plate S_GDPLATE_1 on page 610 S_PAD_2 Bonding Pad S_PAD_2 on page 612 Acknowledgment The layout generation portion of the MEMSLib library is based on the Consolidated Micromechanical Element Library CaMEL developed at MCNC and funded by the Defence Advanced Projects Agency contract DABT 63 93 C 0051 The CaMEL software and associated manual CaMEL User s Guide by Ramaswamy Mahadevan amp Allen Cowen are Copyright 1994 1997 by MCNC The CaMEL software and portions of the CaMEL manual are reproduced here and distributed with permission from MCNC Please read the attached CaMEL license and copyright For more information on MCNC or CaMEL please refer to the following URLs http www mcnc org http mems mcnc org http mems mcnc org camel html Contents Index Copyright 1994 1996 by MCNC All rights reserved By using the software you the Licensee indicate that you have read understood and will comply with the terms listed below Permission to use copy and modify for internal noncommercial purposes is hereby granted Any distribution of this program or any part thereof is strictly prohibit
222. ng to the following format vertex_number vertex_angle Contents Index MEMS Pro Utilities Viewing Vertex Coordinates and Angles 62 5924 degrees 46 0809 degrees Figure 64 Viewing vertex angles These information remain visible until the Clear Vertex Information option is issued MEMS Pro User Guide Contents Index 160 Viewing Vertex Information To view the vertex information number coordinates and angle of a flat object box polygon wire perform the following operations Select the object for which you want to view the vertices angles Select Tools gt View Vertex Information in the MEMS Pro Palette The number coordinates in locator units and angle in degrees of each vertex are displayed on the layout as port text on the Ruler layer at the corresponding vertices The size of the port text is the default port text size of the Ruler layer The text is displayed according to the following format vertex_number X_coordinate Y_coordinate vertex_angle Contents Index MEMS Pro Utilities Viewing Vertex Coordinates and Angles L Edit Layout 21 20 62 5924 degrees 3 29 4 46 0809 degrees Figure 65 Viewing vertex information These information remain visible until the Clear Vertex Information option is issued MEMS Pro User Guide Contents Index 162 Clearing Vertex Information To remove the vertex information from the layout view of an object perform the follow
223. nger than 8 characters You must specify the Number of conductors It is restricted to 2 In an electrical system a ground bias voltage reference must be defined It may be associated with a modeled conductor or may be assumed to be at infinity In the first case the ground is assumed to be the last defined conductor greatest conductor number Choose Last conductor or At infinity in the Ground Key field to specify the appropriate configuration To perform the reduction of the coupled system the algorithm needs to apply electrical excitation to the system and evaluate the resulting electrostatic forces This excitation is applied using the component of nodes specified in the dialog box as the Excitation component name This component may be a conductor component It has been explained in the theoretical presentation of the algorithm that force and capacitance relationships are numerically computed point by point An analytical expression is then extracted from these numerical values according to a mean square fitting method This analytical expression is a polynomial in terms of the reduced degree of freedom or its inverse with a maximum degree Degree of fitting you can define in the dialog box Contents Index Note The principle of the coupled system reduction algorithm is to analyze its electrical behavior in a set of structural configurations that covers the range of use You must define this interval in terms of the master d
224. ngle Wire by clicking the button in the Drawing toolbar Choose the poly layer from the Layer Palette The mask layers are displayed in the Layer Palette as an arrangement of square icons that represent the available layers The icons are differentiated by color and pattern As you move the cursor over an icon the name of the layer beneath the cursor appears in the Status bar A layer is selected by clicking the corresponding icon Mw Click the stator opposite the pad to start drawing a wire Successive clicks will produce intermediate points of connection Right click the pad to end the wire It is important that the wire touch the poly layer of the torus and the pad or these elements will not be connected When the drawing operation is completed that new object remains selected You will now change the width of the wire Mw Select Edit gt Edit Object Change the Wire Width to 15 locator units and click OK Drawing a Torus When drawing a torus the first click of the left mouse button sets the center The second click determines the inner radius of the torus The third click decides the outer radius and the sweep angle Contents Index MEMS Pro Tutorial Drawing Tools Select the Torus tool N from the Drawing toolbar Left click the center of the incomplete motor to begin drawing the torus Left click at the inner radius point then complete the torus by right clicking at the outer radius point Figure 33 outer rad
225. nsation reduction with multiple degrees of freedom and load cases R 0 M Tools Ea Figure 34 R O M Tools menu MEMS Pro User Guide Contents Index 343 Reduced Order Modeling User Manual Current LS m If you click Current LS the algorithm applies the currently defined load case if any In this case a dialog box opens and prompts you to enter the output file name Condensation Current LS EE Figure 35 Condensation Current LS dialog box Click OK to run the algorithm or select Cancel to close the dialog box E Note For more information on performing the condensation reduction with one single DOF refer to Condensation Reduction with Single DOF amp Load Cases in this chapter MEMS Pro User Guide Contents Index 344 yw From LS files If you click From LS files the algorithm applies multiple load cases These load cases have to be previously defined in LS files refer to the ANSYS documentation for further information The name of these files must be the current ANSYS jobname and the extension must contain the s letter followed by the LS file number In this case a dialog box opens prompting you to enter the output file name and a selection of LS files to process This is done by defining the arguments of a loop Condensation From LS files Figure 36 Condensation From LS files dialog box Click OK to run the algorithm or select Cancel to close the dialog box Cont
226. nu The Delete Volume amp Below dialog box appears Figure 21 Contents Index S to Layout Generator Tutorial Delete Volume amp Below a ies Figure 21 Delete Volumes amp Below dialog box Pro User Guide Contents Index 324 Click the Pick radio button The cursor has changed to an upward arrow Select the volumes you want to delete two blocks for each lever of the hinges by clicking on them The color of the selected part changes Then click OK The model appears in the ANSYS Graphics window Figure 22 Figure 22 Mirror with and without levers Contents Index ANSYS to Layout Generator Tutorial The hinges of the mirror now have smaller levers Save the new mems file as a database db using the Save MEMS menu item see Figure 9 and then click OK The Layout Generator Program Before exporting a CIF file define the mcp_unit variable in order to indicate the unit of the 3D Model i As the unit of the 3D model imported from MEMSCAP 3D Modeler is the micron enter mcp_unit 1e 6 in the ANSYS Input window see Figure 23 ANSYS Input Figure 23 ANSYS Input window MEMS Pro User Guide Contents Index 326 ANSYS to Layout Generator Tutorial In the layout CIF file the program creates all the layers defined in the corresponding technology file Mv Click LAYOUT in the ANSYS Toolbar Figure 24 or Export CIF Files in the 3 D To Layout menu Figure 24 ANSYS
227. o User Guide Contents Index 423 Reduced Order Modeling The Open Module window appears Open Module Figure 78 Open Module window Choose MicroMirror and click OK e Click View gt Schematic Mode Click the T Spice Command Tool MEMS Pro User Guide Contents Index ROM Tutorial 424 Figure 79 T Spice Command Tool M Click somewhere in the blank window The T Spice Command Tool window appears Contents Index Reduced Order Modeling ROM Tutorial T Spice Command Tool Insere sora Figure 80 T Spice Command Tool window Left click anywhere in the blank design sheet Select Files gt Include file and click Browse in the right part of the window Choose the previously created SPICE model MyExample sp and click Open MEMS Pro User Guide Contents Index 426 If you did not follow the first part of the tutorial generation of the spice model use our SPICE model named example sp located in the tutorial directory Click Insert Command A T Spice command line that loads the generated model is then instantiated within the schematic view of the module Click View gt Symbol Mode You can check that the pin names match the names described in the model description of the previous part In this case the ground pin name is 0 We created the symbol view of the device It can be re used as such since the generated model uses a fixed template We added some commands to declare d11 as t
228. odels or limit the available results in order to obtain accurate but fast solutions The solution is to create reduced order models from finite element models in a form that captures the essential physical behavior of a component and that is directly compatible with a system level description HDLA is a trademark of Mentor Graphics Corporation Contents Index You can describe the dynamic behavior of a finite element model assumed to be linear using the following matricial equation M ix Clix K xt tft 1 The variables contained in the x arrays are called degrees of freedom They entirely describe the state of the system The number of DOFs can be very high 104 to 10 The K M and C matrices are respectively called the stiffness mass and damping matrices and characterize the elastic behavior of the system its inertia and damping effects The f array contains the equivalent forces related to structural variables One reduced order modeling approach called reduction or condensation consists in describing the behavior of the model by the following reduced set of equations M xp Clir K xp 7 2 Contents Index R O M Menu When running the MEMScAP customized ANSYS software the following windows appear They are the typical ANSYS windows You can find help or information on them in the ANSYS help or in the ANSYS User Manual In the MEMScAP customized release of ANSYS the ANSYS Main menu ha
229. oly1 layer S_LSDM_2_M_X for poly2 layer Contents Index MEMSLib Reference Linear Side Drive Elements Active Elements Linear Side Drive Parameters S_LSDM_1 Layout Parameter Entry Dialog Box Layout Palette Button MEMS Pro User Guide Contents swidth Sp jonoon rheight rwidth Layout Parameter Illustration Index 537 Unidirectional Rotary Comb Drive Elements Type 1 S_ RCOMBU_1 S RCOMBU_2 Description S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Generates a unidirectional rotary comb drive on the first or second structural layer The unidirectional rotary comb drive of type 1 designed on the first structural layer S_RCOMBU_1 has a corresponding symbol S_RCOMBU_1_M_PHI_S and a corresponding behavioral model S_RCOMBU_1_M_PHI_B The unidirectional rotary comb drive of type designed on the second structural layer S_RCOMBU_2 has a corresponding schematic S_RCOMBU_2_M_PHI_S anda corresponding behavioral model S_RCOMBU_2_M_PHI_B Contents Index Parameter List The following table provides the unidirectional rotary comb drive type 1 parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Active angular comb length aclength 60 degrees active_angular_length Inner radius of rotor rri 50 um rotor_inner_radius Inner radius of stator comb rsi 60 um stator_in
230. on Figure 62 T Spice Command Tool window ROM Tutorial m Choose the previously created spice model MyExample3 sp and click Open If you did not follow the first part of the tutorial generation of the SPICE model use our spice model named example3 sp located in the tutorial directory MEMS Pro User Guide 397 Reduced Order Modeling ROM Tutorial M Click Insert Command A T Spice command line that loads the generated model is then instantiated within the schematic view of the module E E 3 Dl aloo a vlel sine lude D public gaelie Document ation MemsPro reference_files ROM ACCELERATOR example3 sp Figure 63 Viewing the command line MEMS Pro User Guide Contents Index 398 Click View gt Symbol Mode You can check that pin names match the names described in the model description Click Module gt Open and set accel3 as Files and Transient_Accel_3by3 as Module to Open Click OK The new module opens in the S Edit window Select Setup gt Probing The Waveform Probing Setup dialog box appears Contents Index Reduced Order Modeling ROM Tutorial Waveform Probing Setup x Ch M Ere M a M E E Figure 64 Waveform Probing Setup dialog box Click the Browse button and browse for the accel3 dat file yw Click Open and then click OK m Click the T Spice button MEMS Pro User Guide Contents Index 400 An S Edit warning message
231. on 450 Diaphragm 141 Drawing a box 94 a circle 94 a curved polygon 90 a spline 95 a torus 88 a wire 87 Drawing 85 Dual archimedean spiral spring 535 Contents Index E Easy MEMS menu Plate Release 121 Polar Array 123 Easy MEMS menu 121 Edit component 112 Edit Process Definition 116 663 Editing a 3D model 353 a process definition 116 185 a process 663 a spline 127 generated layout parameters 494 object properties 30 process steps parameters 190 process steps 186 188 splines 429 Element type addition in ANSYS 383 Etch type BULK 202 206 SACRIFICIAL 202 208 Contents Index SURFACE 202 SURFACE SURFACE etch type 203 Etch 201 635 Euler column array 548 Euler Column 545 Export 3D Model 120 Export CIF File 319 Exporting a 3D model 120 180 378 a CIF file 319 a netlist 38 Extracting a netlist 70 F FILL deposit 199 632 Folded spring generation 61 instantiation 23 Folded spring 564 Contents Index Foundry Support 8 G Generated layout parameters edition 494 Generating a 3D model 77 a comb drive 59 a ground plate 62 a plate 58 bonding pads 63 folded springs 61 Global nodes connection 27 Ground plate generation 62 Ground plate 566 Grow 657 Guckel ring array 554 Guckel ring test structure 551 Contents Index H Harmonic side drive 517 Help menu 131 Holes creation 121 I ImplantDiffuse 652 Import MEMS 302 345 Imp
232. on Box W 112 H 12 O NN Figure 88 Viewing the resonator in S Edit Now we need to associate process and material properties to the model Contents Index Optimization Tutorial Setting up the Optimization M Select the Command Tool button to enter the Command tool mode or left click on the work area to invoke the T Spice Command Tool dialog Figure 89 T Spice Command Tool nalysis Current source Library file Table file Delete library file nitialization Figure 89 T Spice Command Tool dialog In the left hand tree double click Files and then Include file Type process sp in the Include file field Click Insert Command MEMS Pro User Guide Contents Index 441 The optimization engine needs to know what analysis we will use to determine whether we have reached our optimization goal Click somewhere in the work area to invoke the T Spice Command Tool dialog again In the left hand tree double click Analysis and then AC Choose decade for Frequency sampling type set Frequencies per decade to 500 Frequency range From to 10k and Frequency Range To to 100k Figure 90 Click Insert Command Contents Index Optimization Tutorial Setting up the Optimization T Spice Command Tool Analysis DC operating point DC transfer sweep Fourier Noise Transient Transfer function Current source Files Initialization Output Settings Table Voltage source Optimization
233. on Layout Palette Buttons MEMS Pro User Guide Contents Index 534 Linear Side Drive Elements S_LSDM_1 S_LSDM_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a linear side drive on the first or second structural layer Parameter List The following table provides the linear side drive parameters their values and descriptions The linear side drive designed on the first structural layer S_LSDM_1 has a corresponding schematic named S_LSDM_1_M_PHI The linear side drive designed on the second structural layer S_LSDM_2 has a corresponding schematic named S_LSDM_2_M_PHI Description Layout Default Schematic parameter Parameter Value name Name Active length of motor mlength 120 um motor_active_length Stator electrode width swidth 12 um stator_pole_width Contents Index Description Layout Default Schematic parameter Parameter Value name Name Stator electrode pitch spitch 20 um stator_pole_pitch Stator electrode length slength 40 um stator_pole_length Rotor tooth width rwidth 12 um rotor_pole_width Rotor tooth pitch rpitch 30 um rotor_pole_pitch Rotor tooth height rheight 20 um rotor_pole_height Rotor yoke width yokewidth 20 um Air gap between stator and airgap 2 um rotor_stator_gap rotor Rotor offset with respect to roffset 0 um stator Number of gaps 3 number_of_gaps S Edit Symbol Name S_LSDM_1_M_X for p
234. on of design tools that combines aspects of EDA and mechanical thermal fluidic optical magnetic CAD MEMSCAP approach to solving this design bottleneck is based on the following principles and features Supporting multiple flows for the component engineer multi physics circuit designer and for the system engineer Allowing data exchange between the different description levels the structural level FEM BEM the system behavioral level SPICE HDL A VHDL AMS Verilog AMS and the physical level mask layout Targeting key features for MEMS specific design MEMS Pro in combination with ANSYS Multiphysics or other 3D analysis programs enables system designers MEMS circuit designers IC designers process engineers MEMS specialists and packaging engineers to share critical design and process information in the most relevant language for each contributor Contents Index The MEMS Pro package includes a schematic entry tool an analog and mixed analog digital circuit level behavioral simulator a statistical analyzer an optimizer a waveform viewer a full custom mask level layout editing tool an automatic layout generator an automatic standard cell placement and routing tool a design rule checking feature an automatic netlist extraction tool from layout or schematic a comparison tool between netlists extracted from layout and schematics Layout Versus Schematic and libraries of MEMS examples MEMS specific
235. on title bar indicates the current cell name active window type in square brackets and the file name Cellname 3D Model Filename Further the application window can be reduced to an icon zoomed resized moved or closed from this title bar Contents Index Menu Bar The Menu Bar refers to six 3D Model View menus The menus can be opened to show available commands by clicking the menu bar or by pressing the keyboard shortcuts indicated below File Alt F View Alt V Tools Alt T Setup Alt S Window Alt W Help Alt H File Menu Commands for creating opening saving and printing files Commands for expanding contracting and shifting the view Commands for viewing deleting and exporting 3D models and editing process definitions Commands for customizing interface elements and program functions Commands for manipulating windows Commands for invoking Tanner EDA help documentation The File menu contains commands for opening saving and printing files Contents Index 3D Modeler 3D Model View User Interface Figure 78 File menu options New Invokes a dialog to create a new text or layout file Open Opens an existing Tanner Database tdb file text files or a solid model in SAT format If a 3D model has been saved to this TDB file the model can be brought up in a window with the View 3D Model command MEMS Pro User Guide Contents Index 193 If you wish to open a SAT file select File gt O
236. operty Delete Property Delete Value Figure 25 Properties dialog box Contents Index Try selecting different properties to view their types and values on the right side of the display Click the L property The value that you entered to represent the plate length is shown as the Value on the right side of the dialog To return to the layout perform the following operations Click Cancel to exit this Properties dialog box Click Cancel to exit the main Properties dialog box Click Cancel to exit the Edit Object s dialog box Contents Index Viewing a 3D Model The 3D Model Viewer automatically generates a 3D model from a layout and a process definition Tutorial Breakpoint You will now create and view a solid model If you are beginning the tutorial now follow the next section on Launching L Edit and Opening a File to open the design file you have been provided with If you are continuing from the previous section you may use your own design and skip to Process Definition on page 74 Launching L Edit and Opening a File Launch L Edit by double clicking the L Edit icon is in the installation directory A default file named Layout should be visible in the work area 5 Close the Layout file by selecting File gt Close Contents Index m Using the File gt Open command open the reson tdb file Figure 26 Ek Figure 26 Layout view of the resonator Process Definition Importing the Process D
237. or supports asize 30 um anchor_size S Edit Symbol Name N A Contents Index MEMSLib Reference Test Elements Guckel Ring Test Structure Elements Guckel Ring Parameters S_GURING_1 Layout Parameter Entry Dialog Box D Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 595 Array of Guckel Ring Elements S_GURINGS_1 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates an array of Guckel ring test structures on the first or second structural layer These ring structures can be used to estimate the residual strain in a film with tensile residual strain The ring parameters are calculated for the critical strain values desired using a mechanical model of the test structure If the thickness of the structural layer used is larger than the width of the cross beam lateral buckling will occur i e buckling in the plane of the wafer Otherwise buckling will occur out of the plane of the wafer Parameter List The following table provides the array of Guckel ring parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Minimum residual strain eOmin 0 0005 residual_strain_minimum Maximum residual strain eOmax 0 0025 residual_strain_maximum Contents Index Description Layout Parameter Name Default Value Schematic paramet
238. orting a 3D model in ANSYS 380 MEMS 302 345 process definition 186 Instantiating a plate 21 comb drives 22 components 21 folded springs 23 voltage sources 27 Interpolation 417 Contents Index J Journal bearing type 1 520 type 2 523 L Layout extraction 97 LAYOUT button 320 Layout Versus Schematic Voir LVS L Edit 5 L Edit UPI 55 Library menu Edit component 112 library palette 110 Library menu 110 Library palette editing parameters 494 Library palette 110 Contents Index Library 8 Linear crab leg type 1 526 type 2 529 Linear Electrostatic comb drive 496 Linear folded beam 532 Linear side drive 499 LVS extracting schematic 102 launching 105 LVS 6 105 M Macros alignment functions 577 all angle objects approximation 594 concentric circles generation 598 logo generator 574 plate release 584 polar array 580 viewing vertex coordinates and angles 587 Contents Index Material properties setting in ANSYS 382 MCNC MUMPs cross section 605 MCNC MUMPs 604 MechanicalPolish 209 647 MEMS import 302 345 MEMS Layout Palette using 57 MEMS layout palette 56 Active Elements tab 55 Passive Elements tab 55 Resonator Elements tab 55 Test Elements tab 55 MEMS Library 8 MEMS Pro tool flow 3 Meshing 3D model in ANSYS 388 Module creation 20 MOSIS CMU 609 Contents Index MOSIS NIST 610 Multilayer pad 557 N Netlist comparison 105 export 38 extra
239. ow Parameter Description WaferlD Face MaskName Depth Angle This optional parameter identifies the Wafer to be implanted diffused Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferlID where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Side of the Wafer to be implanted diffused Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Name of the inclusive mask layer The areas drawn on this layer will be affected by ImplantDiffuse Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for MaskName Vertical measure of the extent of ImplantDiffuse Any positive decimal number is an acceptable entry for Depth Angle in decimal degrees Any decimal number between 45 and 90 is an acceptable entry for Angle Contents Index Parameter Description Undercut Target Source Label Comment The distance the implanted diffused material will extend outward from the mask edge Undercut 0 is a sharply defined cut aligned to the mask edge Undercut may be any positive decimal number The name of the layer that will receive the implanted diffused material Any valid L Edit layer name enclosed in quotation marks may be ente
240. ow and probe for the node called displacement The chart corresponding to the displacement results appears in the W Edit window MEMS Pro User Guide Contents Index 432 Edit View Chart Window Help OSBES BO Sele RoR E Hn gt e MicroMirror 5 a v Ei gt For Help press F1 Figure 86 Viewing the 5 displacement values Mi In the W Edit window select Chart gt Traces Contents Index VM Keep only the first and last traces corresponding to the extreme values for the damping coefficient by unchecking the other boxes mi Click OK LZ W Edit Waveform Viewer D public gaelle D ocumentation MemsPro reference_files ROM MicroMirror MicroMirror dat 23 Ele Edt View Chart Window Help DSBas e aR b Rea 6 MicroMirror For Help press F1 Contents Index Figure 87 Viewing the extreme values for the displacement Vv You can now close S Edit Contents Index 10 Optimization Tutorial Introduction Setting up the Optimization Running the Optimization Examining the Output Contents Index 437 439 454 Introduction Optimization is a critical tool for the MEMS engineer The MEMS Pro optimization engine lets you tune the parameters of your system to achieve its best possible performance Optimization is achieved by running iterative simulations over a constrained set of selected parameters In order to specify an optimization you must supply a list of parameters t
241. oximation A shape factor between 0 1 applied to the second vertex results in an approximation spline The created curve approximates the second vertex of the reference wire Select the second vertex on the left side of the Create Spline dialog box Select the Approximate radio button in the Control Point Shape Factor box Choose whether you want to replace the original object with the new one or not Click OK The approximated spline appears in the L Edit window Figure 56 It does not go through the second vertex Contents Index Splines Creating Splines L Edit Cell0 Layout1 N osushk nes unal Oe few a IPON eo Hoana HL SE FETS Al rc ol 2 99 969 5 0 Create Spline Figure 56 Creating an approximated spline MEMS Pro User Guide Contents Index 138 Re creating Angled Wires NH A A A A shape factor of 0 applied to the second vertex of a spline may be used to create or re create an angled vertex Thus you can re create the reference wire from the approximated or interpolated curve Perform the following operations Select the spline Choose Splines gt Create in the MEMS Pro Toolbar Select the Angle radio button of the Control Point Shape Factor box Click OK The angled wire is created or re created from the spline Figure 57 Contents Index Splines Creating Splines L Edit Cell0 _ Layout1 BEES M 181 x z Al Levels B
242. palette is similar in look and function to the L Edit layer palette except that individual choices are displayed as cubes not squares The 3D Model View palette displays the colors of the 3D bodies these settings are Contents Index related to the mask layer of the same name The palette contains only the 3D bodies present in the active 3D model Figure 89 3D Model View Palette Hiding layers is particularly useful for obtaining a view of the interior of a 3D model Layers may be hidden or shown using the 3D Model View palette To toggle between hide and show center click on the desired layer for two button mice Alt Left click Contents Index 3D Modeler 3D Model View User Interface Hide or Show layers is also available from a context sensitive menu Right click on the icon corresponding to the layer you want to hide or show gll Figure 90 Context sensitive menu If the body is currently hidden as in the diagram above the icon corresponding to that layer will appear with hash marks The context sensitive menu will offer the option to Show that layer followed by Show All and Hide All layers MEMS Pro User Guide Contents Index 212 If the body is currently displayed the icon will appear as solid color and the context sensitive menu will display the option to hide the layer followed by Show All and Hide All layers This control is similar to the hide show feature of L Edit For more information on this feature r
243. pen and choose 3D Model Files sat in the Files of type field Recall that the view of a SAT file can be manipulated by the 3D Modeler but the model itself cannot be edited Close If the 3D Model View contains an internally generated 3D model then Close will close all the windows for the model and leave the tdb file from which it was generated open If a model from an external sat file is under examination Close will simply close that file and close the window Print Print These commands allow you to print and preview the Preview Print contents of the 3D Model View window and to change Setup printer and print settings Recently The most recently opened files are listed here If any sat Opened Files files have been accessed they will appear on the list as well as the Tanner EDA database and text files Exit Exit will prompt to save changes and then quit L Edit Contents Index View Menu The View menu contains seven Preset Views and five interactive viewing options namely Spin Orbit Rotate Pan and Zoom There are also options for determining the look and content of the Toolbars and Status Bars Preset Views gt Spin Orbit Rotate Pan Zoom Toolbars Preset Views gt Isometric Top Front Right Bottom Back Left Status Bars Figure 79 View menu options As shown below seven common viewing angles are available with the Preset View menu item As you move from one com
244. plex parameterized cell generation for example comb drives rotary motors gears etc as well as simple but often used geometry for example bonding pads can be implemented with a single key stroke L Edit UPI includes a C language interpreter for reading macro code eliminating the need for a system compiler The program reads dll files produced by the user or from MEMSCAP or Tanner libraries or libraries supplied by third party vendors The UPI provides user access to L Edit s Design Rule Checker and netlist extraction modules and may be used to integrate L Edit with other third party applications Contents Index Layout vs Schematic LVS 3D Modeler LVS compares the SPICE netlist generated from S Edit or another schematic editor with the netlist generated from layout by L EditvExtract LVS is a check to ensure that both netlists represent the same multiphysics circuit Should any inconsistencies be found between the two lists LVS can be used to identify and resolve the ambiguity Accurate three dimensional 3D visualization of your design in progress is crucial to successful fabrication You can create 3D models of your MEMS device layout geometry directly in L Edit using one of the many foundry fabrication process descriptions we support or by specifying your own custom process The 3D Solid Modeler permits views of surface and bulk micromaching steps including deposit etch and mechanical polishing You can easily custom
245. pokew fe Gap between stator spokes at radius stator_spoke_gap um sspokeg fb Finger overlap as a fraction of length finger_overlap trsovip fps Name of cell feom o Layout Parameter Entry Dialog Box Layout Palette Button Layout Parameter Illustration Contents Index Rotary Side Drive Elements S_ RSDM_1 S RSDM_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a rotary side drive on the first or second structural layer If the offset is set to zero the first rotor tooth will be aligned with the first stator electrodes The rotary side drive designed on the first structural layer S_RSDM_1 has a corresponding symbol S_RSDM_1_M_PHDI The rotary side drive designed on the second structural layer S_RSDM_2 has a corresponding schematic S_RSDM_2_M_PHI Parameter List The following table provides the rotary side drive parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Inner radius of rotor ring rring 50 um rotor_ring_inner_radius Inner radius of rotor tooth rri 60 um rotor_pole_inner_radius Contents Index Description Layout Parameter Name Default Value Schematic parameter name Outer radius of rotor tooth rro 150 um rotor_pole_outer_radius Inner radius of stator rsi 155 um stator_pole_inner_radius electrode Outer radius of
246. pulation At times you may find it necessary to hide traces in order to simplify a waveform window Contents Index NH A A A A Select both charts by choosing Edit gt Select All Choose Chart gt Collapse Charts With the now single chart selected choose Chart gt Traces In the Traces dialog select vp rtm Click the box beneath the Show label to unselect vp rtm The checkmark will disappear Contents Index MEMS Pro Tutorial Viewing a Waveform The trace information will still be available but the trace will not appear the next time you view the chart idb lt comb_1 Xderiv_fix Eampir idb lt comb_1 Xderiv_fix E ampe idb lt comb_1 Xderiv_free E amy Figure 12 Traces dialog Click Apply and then OK to return to the chart MEMS Pro User Guide Contents Index 50 Notice that the displayed unit for vm rtm is Volts The mechanical behavior of this system is modeled with electrical analogs of mechanical components the mechanical displacement maps to voltage Therefore vm rtm represents the displacement at the rtm node Let s change the label on the dependent variable axis from Volts to Displacement The new Y axis units will be meters Contents Index MEMS Pro Tutorial Viewing a Waveform mi Select the top chart Choose Chart gt Options to invoke the Chart Options dialog Click the Axes tab Enter Displacement rtm in the Y axis Label field and m as the Y axis Units Chart Options
247. r values by drawing them probabilistically from a defined distribution This type of statistical analysis may be used to discover what effects process variation will have on system performance Layout Editor L Edit L Edit is an interactive graphical layout editor for MEMS and IC design This full custom editor is fast easy to use and fully hierarchical Primitives include boxes polygons circles lines wires labels arcs splines and tori Drawing Contents Index modes include 90 45 and all angle layout Shortcuts are also available for quickly laying out circles tori pie slices splines and curved polygons with true curved edges Designs created in L Edit are foundry ready The new MEMS Pro Toolbar in Version 3 00 gives access to MEMS specific design features They gather the creation of splines the display of vertex information and the use of Easy MEMS features like the polar array feature and the plate release feature It also includes access to the process definition graphical interface 3D modeler and viewer MEMS specific DRC and MEMSLib the MEMS library User programmable Interface L Edit UPI is a powerful tool for automating customizing and extending L Edit s command and function set The heart of L Edit UPI is the macro interface Macros are user programmed routines written in the C language that describe automated actions or sets of actions Macros can be recognized by their dll file extension Com
248. ration Contents Index Linear Crab Leg Suspension Elements Type 1 S_LCLS 1 S LCLS 2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a linear crab leg suspension on the first or second structural layer The local origin of the element is at the center of the shuttle mass Actuators can be connected to the yokes on the shuttle mass Parameter List The following table provides linear crab leg suspension parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Length of beam1 Ibeam 1 30 um beam1_length Width of beam1 wbeam1 20 um beam 1_width Length of beam2 Ibeam2 75 um beam2_length Width of beam2 wbeam2 8 um beam2_width Contents Index Description Layout Parameter Name Default Value Schematic parameter name Seperation between type 1 beam sep 70 um beams_separation beams Width of shuttle swidth 30 um shuttle_width Length of shuttle slength 100 um shuttle_lendth Width of anchor support wanchor 25 um anchor_width Width of shuttle yoke wsyoke 12 um shuttle_yoke_width Length of shuttle yoke Isyoke 98 um shuttle_yoke_length S Edit Symbol Name S_LCLS_1_M_X S_LCLS_2_M_X Contents Index MEMSLib Reference Passive Elements Linear Crab Leg Suspension Elements Type 1 Linear Crab Leg Suspension Parameters S_LCLS_1 Layout
249. ray This number does not include the original Center of array X 0 Y 0 Center of the polar array in locator units You may enter the X and Y values in the edit fields or click the Pick button to select the center by clicking in the layout window Picking a center displays a center mark in the layout Total Angle 360 Total angle according to which the polar array will be performed You may choose between specifying the Total Angle or the Gap Angle Gap Angle 180 Angle separating the various occurences of the device to copy You may choose between specifying the Total Angle or the Gap Angle Contents Index Parameter Default Value Description Pick Angle Clicking the Pick Angle button allows you to select the angle by selecting two points in the layout window The angle is calculated between the 2 points and the center point Picking an angle displays the center and angle text marks with a pie wedge sweeping out the angle Contents Index Generating Holes in a Plate Note The Plate Release feature is a new MEMS Pro feature To ensure the complete release of wide plates holes must be cut out of the plate to allow the etching of the sacrificial oxide layer placed underneath the plate Placing these holes can be a very time consuming task that adds no significant value to the design however it is a necessary step to ensure manufacturability The Plate Release utility dramatically shorten
250. red for Target There may be multiple entries of this parameter Layer name of the material that is being introduced into the Target 3D rendering information for the ImplantDiffuse step is derived from this layer Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for Source For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 114 During 3D model generation this string describing the ongoing step will be displayed in the progress dialog The Label may be any text enclosed in quotation marks Comment may be any text enclosed in quotation marks Note that only Target is affected by ImplantDiffuse If the targeted Depth is greater than the Target s Thickness the layer beneath is not affected Contents Index Grow Grow is not supported in MEMS Pro Version 3 The syntax for the Grow command is presented below followed by an example containing valid entries for its parameters Syntax Grow WaferID S Face face MaskName layer Thickness P Depth percent Undercut P Target layer Source layer Label S Comment S Example Grow WaferID wl1 Face TOP Contents Index MaskName Grow Thickness 7 0 Depth 40 Undercut 5 Target Silicon 1 Source Silicon Dioxide Label Grow Comment Grow uw Description Grow consolidates the processes of nitride deposition nitride etch oxide growth and nitride removal into a
251. refix of the file name used to generate the results In this example the name is MyExample Under structure PHYSICS and electrostatic PHYSICS accept the default parameters These definitions must be in accordance with your generated files see gen_esman macro Then define the Electrical parameters In this example the relationship between the capacitance and the selected degree of freedom is modeled by selecting Yes in the appropriate field In this model conductors are associated to components of nodes respectively called cond1 and cond2 Then the conductor name is cond and the number of conductors is 2 The cond2 conductor is assumed to represent the electrical ground The first conductor cond1 is used to apply electrical excitation You now have to define the algorithm parameters In this example to generate the reduced model assume that the master degree of freedom varies between 2 microns and micron These values are the minimal and maximal fitting values Contents Index In this range take 10 points and the resulting polynomial is of the 4th order The last two boxes keep their default values in this example They are advanced parameters During the execution of the reduction algorithm information is printed in the ANSYS Output window The display is related to the algorithm status results and accuracy estimation The first information displayed is the title of the al
252. ress F1 Figure 70 Viewing the results of the Uz simulation Contents Index Reduction of Electrostatically Coupled Structural Systems The electrostatic part of the R O M tool gives access to an algorithm for the reduction of electrostatically coupled structural system In this algorithm the system can only be reduced in terms of a single structural degree of freedom Before using the R O M tool you first have to load in ANSYS a finite element model and provide all the data related to both electrical and structural behavior of your system The method used to provide a complete finite element model is the generation of a common geometrical model and the separate description of an electrical and structural environment using Physics Files In this example use the model of an electrostatically actuated micro mirror It consists of a plate connected at one end to a square beam that behaves as a torsional spring The lower side of the plate is separated from the electrical ground by an air gap The electrostatic interaction between the structure and the ground is assumed to be restrained to the space located under the plate and boundary effects are neglected As the model is symmetric only one part of the structure is modeled and appropriate boundary conditions applied to the symmetry plane Contents Index EPLOT type 3 mat 3 real 1 csys 0 ELEMENTS JUN 27 2001 09 56 MAT NUM 09 09 56 Top plate Torsianal beam Plate
253. rientation Considerations sssi 242 EtchType SURFACE ssoonsnsssesssessossnsososossesessesesses 244 Eteh Type BULK mernerranara a a ra 246 Contents Index Help EtchType SACRIFICIAL wu ccccsscccsssescsseesssseretesssee 248 Wlechamicall POUSE sini sync e ccestateie Uieteesterseutsuercentcancuttys 249 3D Modeler Error Checks 252 Checking if the 3D Model is Out of Date 0 0 0 0 253 Checking if a Process Definition is used 20 253 Checking for Process with Derived Layers 254 Checking for the Existence of all Required Layers 254 Checking for Wires or Self Intersecting Polygons 254 ANSYS Tutorial oes 256 Introduction 2 cccecedadiedenicrnctanasastgekheeiuts 257 Launching L Edit eee anne ene nee eens nee nee et ee 257 Op ning the File ninisi 257 Contents Index Help Viewing the 3D Model ic psiinctnciindecinnianctien 258 Exporting the 3D Model i ce siese s sccceasestacesstetenatsiacanteriantetans 259 Reading the 3D Model in ANSYS 261 Viewing the 3D Model in ANSYS ote 261 Setting Material Properties 20 00 cceeseeeeeseeteteteteteeeeteees 263 Adding an Element Type cascicisscinanjusanchannses 264 Setting Boundary Conditions 265 Meshing the Model 0s 269 Running the Analysis 2 0 0 0 272 Displaying the Results oe 273 Computing the Spring Constant 276 Entering Models under Windows NT 27
254. rive Elements S_LCOMB_1 S LCOMB 2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a linear comb drive on the first poly1 or second poly2 structural layer The linear electrostatic comb drive that is designed on the first structural layer S_LCOMB_1 has a corresponding schematic named S_LCOMB_1_M_X The linear electrostatic comb drive designed on the second structural layer S_LCOMB_2 has a corresponding schematic named S_LCOMB_2_M_X Parameter List Contents Index The following table provides the electrostatic comb drive parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Active rotor comb width arwidth 98 um Rotor yoke width rywidth 12 um Stator yoke width sywidth 14 um Length of comb fingers flength 60 um finger_length Width of comb fingers fwidth 4 um finger_width Air gap between fingers airgap 3 um finger_gap Stator rotor finger overlap rsoverlap 30 um finger_overlap Direction of comb 1 DIR S Edit Symbol Name S_LCOMB_1_M_X for poly1 layer S LCOMB_2_M_X for poly2 layer Contents Index MEMSLib Reference Active Elements Linear Electrostatic Comb Drive Elements Linear Comb Parameters S_LCOMB_1 Layout Parameter Entry Dialog Box t sywidth flength rsoverlap 1 fwidth p airgap rywiain a aed arwidth Layout Parameter Illustrati
255. rks Contents Index Parameter Description Comment Comment may be any text enclosed in quotation marks DepositType FILL As illustrated below the Thickness of FILL is set from the highest point on the model at that step for the TOP Face Thickness Contents Index Parameters for FILL deposits are described below Parameter Description WaferlD DepositType Face LayerName Identifies the Wafer to be filled Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatically and is read only The default value of w1 will override any entry made for WaferlID where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Type of deposit Parameter options are CONFORMAL SNOWFALL and FILL The value is set to FILL for a fill deposit Side of the Wafer to be filled Parameter options are TOP BOT and TOPBOT for both top and bottom Do not enclose in quotation marks Name of the layer to be deposited Any valid L Edit layer name enclosed in quotation marks is an acceptable entry for LayerName Layername is often set to the same value as Target Contents Index Parameter Description Target Thickness Label Comment This parameter specifies the 3D model rendering characteristics of the filled layer You may enter any valid L Edit layer name as text enclosed in quotation marks for T
256. rning is issued that the objects will be ignored The warning will list the cells that contain the unsupported objects Click OK to ignore the unsupported objects and proceed with model generation Contents Index Note For more information see Polygons and Wires on page 1 248 of the L Edit User Guide Contents Index ANSYS Tutorial u Introduction Reading the 3D Model in ANSYS Setting Boundary Conditions Meshing the Model Running the Analysis Displaying the Results Computing the Spring Constant Entering Models under Windows NT Contents Index 257 261 265 269 272 273 276 277 Introduction Files created by the 3D Modeler can be read into the ANSYS program Once the 3D model is entered it can be analyzed using any ANSYS finite element module In this tutorial you will perform a simple structural analysis of the spring mechanism on a lateral comb resonator You will apply a small force on one end of the device model ANSYS will compute the resulting deflection You will then calculate the spring constant using Hooke s law Launching L Edit 5i Launch L Edit by double clicking the L Edit icon BA located in the installation directory A default file named Layout should be visible in the work area K Close the Layout file by selecting File gt Close Opening the File MV Use File gt Open to open the file named spring tdb in the lt install directory gt tutorial ansys directory
257. rostatically coupled structural systems In this algorithm the system can only be reduced in terms of a single structural degree of freedom Contents Index The reduced model consists of a scalar equation describing the transient behavior of the system possibly combined with a relationship giving capacitance values in terms of the selected degree of freedom Fundamentals In the case of an electrostatic structural coupled system assumed to be linear and modeled by a finite element model the equation governing its behavior can be written as follow ee ae a You can split the array of degrees of freedom into the x and V arrays which respectively describe the structural displacements rotations and electrical potential state of the system The K M and C structural matrices are respectively called the stiffness mass and damping matrices and characterize the elastic behavior of the system its inertia and its damping effects The f array contains the equivalent forces related to the structural variables The electrical equation is time independent and expresses the irrotationality of Contents Index the electric field combined with Maxwell s divergence equation The q array introduces a possible free charge loading of the structure These two sets of equations are said to be weakly coupled That means off diagonal terms of the matrices are null and coupling between the two physics arises from the load express
258. ry to take into account gap elements when solving the structural equation if it is possible to extrapolate displacement fields into the gaps in order to update the mesh of these zones Such features are available in ANSYS but are not managed by the reduction algorithm As a consequence to use the reduction tool you must model gaps as structural components possibly associated with negligible structural material properties The structural fields are thus solved in the entire space And the mesh update in gap zones occurs naturally with a greater efficiency than the one obtained using ANSYS mesh management features In the case of an electrical model featuring an open infinite boundary it is convenient to model the far field behavior using a Trefftz domain refer to the ANSYS documentation for more information When using such a feature you have to carefully generate the model and PHYSICS files Indeed in the structural environment the superelement associated with the Trefftz domain must be canceled element type set to 0 and the associated constraint equations deleted as well as infinite flags that become meaningless Furthermore as the Trefftz domain includes a substructure that has a file name that is based on the current ANSYS jobname it is strictly forbidden to use this jobname as an output file name Contents Index Selecting Master Degrees of freedom You have to define a single degree of freedom to which the model will be r
259. s Final radius of spiral beam router 65 um spiral_final_radius Length of each spiral beam length 300 um spiral_length Width of the spiral beam width 2 um spiral_width Outer radius of rotor support rrotor 80 um rotor_outer_radius S Edit Symbol Name S_SPIRAL_1_M_PHI S_SPIRAL_2_ M_PHI Contents Index MEMSLib Reference Passive Elements Dual Archimedean Spiral Spring Elements Spiral Parameters S_SPIRAL_1 Layout Parameter Entry Dialog Box rrotor Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 577 Test Elements Area Perimeter Dielectric Isolation Test Structure Element S_APTEST_1 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates an area perimeter test structure that can be used to test the dielectric properties of the isolation layer between the first electrical connect layer and the substrate It can also be used to measure the resistance of the first electrical contact layer Probe pads are included in the structure to allow electrical probing for measurements An electrical connection to the conductive substrate is required for dielectric measurements Parameter List Contents Index The following table provides the area perimeter dielectric isolation test structure parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Width of electri
260. s Power tansient results Noise results al nomee E Figure 92 Customizing the quantities to measure MEMS Pro User Guide Contents Index 445 Optimization Tutorial Setting up the Optimization Now that we have set up the model we are ready to set up the optimization m Left click into the work area to invoke the T Spice Command Tool dialog yw In the left hand tree double click Optimization Figure 93 T Spice Command Tool nalysis Current source Figure 93 Customizing the optimization MEMS Pro User Guide Contents Index 446 Optimization Tutorial Setting up the Optimization yw Click Wizard in the left tree or the Wizard button on the right to bring up the Optimization setup dialog m Enter opt1 in the Optimization name field and type or select First AC Analysis as the Analysis name Figure 94 T Spice Command Tool Heommana Figure 94 Customizing the optimization setup MEMS Pro User Guide Contents Index 447 Optimization Tutorial Setting up the Optimization Click Continue to access the next dialog Set optimization goals Set Measurement to res_freq and Target value to 40e3 Click Add to add these values to the List of optimization goals Figure 95 When you finish the T Spice Command tool dialog will look like the following T Spice Command Tool nalysis Current source Figure 95 Customizing the optimization goals MEMS Pro Us
261. s S_RSDM_1 S_RSDM_2 554 Rotary Side Drive Elements 0 cccceeeeeeteeeeeteeeeeeeeees 556 Harmonic Side Drive Elements S_HSDM_1 S_HSDM_2 557 Harmonic Side Drive Element 0 0cccccceeeeeeeeeeeeees 559 Passive Elements 0 cceccecsssssssssssssssssssnsssesssen 560 Journal Bearing Elements 1 S_JBEARG_1 0000 560 Journal Bearing Elements 1 0 0 0 cccecessseessssseseseeseeeseseseess 562 Contents Index Help Journal Bearing Elements 2 S_JBEARG_2 0000 563 Journal Bearing Elements 2 00 0 0 ccsceesessssesseseseeeseneesseees 565 Linear Crab Leg Suspension Elements Type 1 S_LCLS_1 S_LCLS_2 566 Linear Crab Leg Suspension Elements Type 1 568 Linear Crab Leg Suspension Elements Type 2 S_LCLSB_1 S_LCLSB_2 569 Linear Crab Leg Suspension Elements Type 2 571 Linear Folded Beam Suspension Elements S_LFBS_1 S_LFBS_2 572 Linear Folded Beam Suspension Elements 574 Dual Archimedean Spiral Spring Elements S_SPIRAL_1 S_SPIRAL_2 575 Dual Archimedean Spiral Spring Elements 577 Test Elements 1210011010010orisisreoisesrorsereeseeen 578 Contents Index Help Area Perimeter Dielectric Isolation Test Structure Element S_APTEST_1 578 Area Perimeter Dielectric Isolation Test Structure Element 580 Crossover Test Structure Element Type 1 S_COTEST_1 581 Crossover Test Structure Element Type 1 0 583 Crossover Te
262. s been updated to give access to MEMScAP additional features via the MEMSCAP ANSYS Main Menu E Tools button Figure 30 ANSYS Main menu Contents Index Reduced Order Modeling User Manual M To access the MEMSCAP Tools menu click the MEMSCAP Tools option of the ANSYS Main menu A new window containing the MEMSCAP Tools menu opens Figure 31 MEMSCAP Tools menu m Click R O M Tools to access the Reduced Order Modeling main menu R 0 M Tools EJ MEMS Pro User Guide Contents Index 338 Reduced Order Modeling User Manual Figure 32 R O M Tools menu This menu gives you access to the reduction algorithms available in the MEMSCAP tool Algorithms that are greyed in the above window are not available at this time The first button Output options gives you access to a dialog box Figure 33 allowing you to select the format s under which the reduced models will be generated Output options Figure 33 Output options dialog box At this time two formats are available HDLA and SPICE The options can be independently checked or unchecked MEMS Pro User Guide Contents Index 339 Condensation Algorithm The Condensation part of the R O M Tools menu gives access to a classical reduction algorithm It can deal with a single field as well as strongly coupled equations For example structural linear systems can be reduced according to this condensation algorithm Fundamentals The principle of t
263. s Index Wafer Label This string appears in the progress dialog while the step is interpreted during 3D model generation Short descriptive terms are best for labels Comment A note describing each Process Step or Command in more detail may be entered here The first Process Step is automatically selected in the Process Steps list that appears on the left side of the Process Definition dialog when the process definition file is opened It is usually the Wafer step Wafer is selected in the Process Steps list on the left side of the Process Definition dialog below Wafer also appears in the Command browse box on the right side of the dialog The WaferID appears below it Since MEMS Pro Version 3 only supports one Wafer the WaferID is assigned automatically It appears in gray and cannot be edited Contents Index 3D Modeler Editing the Process Definition Process Definition x Etch Hole0 Deposit 0x1 Etch Dimple Etch Anchorl Deposit Poly1 Etch Poly1 Etch Hole1 Sacrificial Etch Figure 101 Characteristics of the Wafer step MEMS Pro User Guide Contents Index 232 Other parameters for the Wafer command are MaskName Thickness and Target MaskName MaskName choices include the list of layers in the design file The geometry drawn on this layer defines the extent of the wafer The boundary of the mask is usually defined by a box but any drawing object may be used including circles and curved polygons Multip
264. s are parameterized in geometric terms such as etch depths and etch angles and not in processing terms such as time of immersion or ambient temperature The 3D Modeler can view models stored in SAT sat format but it cannot edit them Process definitions can be read from a text pdt file or they can be entered manually through the Edit Process Definition dialog For more information about defining processes see Process Definition on page 352 3D Modeler Output The 3D model may be stored with mask layout in an L Edit tdb file The 3D model may also be exported as a SAT sat or ANF anf file Contents Index The sat file format is commonly used to exchange data between 3D model visualization and analysis tools SAT is a standard industry format and is accepted by many tools including AutoCAD ANSYS Ansoft HFSS Maxwell 3D ABAQUS and MSC NASTRAN and those from CFDRC and Coyote Systems The anf file format is the ANSYS Neutral Format ANF files can be directly imported into ANSYS The details of converting SAT files to the ANF file format depend on your operating system Under Windows 95 MEMS Pro users must export their solid models in ANF format if they wish to use ANSYS MEMS Pro uses the ANSYS connection module called The ANSYS Connection Product for SAT to write the ANF file that describes your model You must have this connection module installed in your ANSYS directory to accomplish this task Under Windows NT
265. s bound to the F1 hot key This source code can also be found in lt install directory gt Examples lupi plate c include lt stdlib h gt include lt string h gt include ldata h include lupi_usr h struct Plate_Struct Contents Index char name 20 char instname 20 int width int length int Get_Parameters_Plate struct Plate_Struct Structure int Create_Plate struct Plate_Struct plate void Generate_Plate void int UPI_Entry_Point void LMacro_BindToHotKey KEY_F1 Generate PLATE Generate_Plate return 1 void Generate_Plate void struct Plate_Struct Plate if Get_Parameters_Plate amp Plate return if Create_Plate Plate return return int Get_Parameters_ Plate struct Plate Struct Structure Contents Index LDialogItem Dialog_Items 3 name name width 200 35 length 100 if LDialog_MultiLineInputBox Plate Parameters Dialog_Items 3 return 0 strcpy Structure gt name Dialog_Items 0 value Structure gt width atoi Dialog_Items 1 value Structure gt length atoi Dialog_Items 2 value return 1 int Create_Plate struct Plate_Struct plate LCell Cell_Original LCell_GetVisible LFile File _Now LCell_ GetFil Cell_Original LLayer lLayer_Polyl MP oaey bm gy LPoint Point_Cursor LCell Cell_Now LTransform Plate_Xform LiInstance Plate_Inst LM
266. s in a plate perform the following operations 5 On your layout select the plate in which you want to create holes VM Choose Easy MEMS gt Plate Release in the MEMS Pro Toolbar The Plate Release dialog appears Figure 48 You can define the width length and spacing of the holes that will be created You can also determine whether you want to create dimples or not And you can define not only the width and length of the dimples but also the ratio of dimples per hole Contents Index MEMS Pro Toolbar Easy MEMS Menu Plate Release MEMSCAP Alte LerGtT iios ITBIETGT eoe eZ Ges be Ss Gies Biola aver Figure 48 Plate Release dialog MEMS Pro User Guide Contents Index 115 Note For more information on creating holes in a plate refer to Generating Holes in a Plate in Chapter 5 MEMS Pro Utilities Copying objects The Polar Array feature allows you to copy objects around a reference point and to keep a regular angle between each object 5i To use the Polar Array feature select the element you want to duplicate and choose Easy MEMS gt Polar Array in the MEMS Pro Toolbar The Polar Array dialog box appears Figure 49 This feature depends on three parameters The number of copies you want to create The angle for the copies The center of the array Contents Index MEMS Pro Toolbar Easy MEMS Menu Polar Array MEMSCAP Figure 49 Polar Array dialog Note For more
267. s the process of adding these holes to plates by automatically generating them according to your options settings You can use this tool to add dimples as well To use the Plate Release function select one shape either on the poly or on the poly2 layer You have to select either a poly or a poly2 layer If no shape is selected an error message appears Then select Easy MEMS gt Plate Release in the MEMS Pro Palette The Plate Release dialog box appears Contents Index MEMS Pro Utilities Generating Holes in a Plate Plate Release MEMSCAP Aleti enat pales Binoan P plete GIES fe sales DIT BIE Aver Figure 62 Plate Release dialog box MEMS Pro User Guide Contents Index 155 The following table explains the parameters used in the Plate Release dialog box and their explanation Parameter Default Value Description Width 5 Width of the created holes Length 5 Length of the created holes Spacing 20 Space between the created holes Extract Holes Extract the holes from the shape Create Dimples The Create Dimples checkbox allows you to create dimples in addition to the holes Contents Index Viewing Vertex Coordinates and Angles Four new MEMS Pro features allow you to view the coordinates and angles of the vertices of selected objects View Vertex Coordinates View Vertex Angles View Vertex Information Clear Vertex Information Not
268. s the same model the accelerometer It is more complex than the first example The aim is to apply three load cases to the model and select multiple degrees of freedom The loads are accelerations along the three axes X Y and Z You will model the displacement of one node located in the middle of the proof mass in the X Y and Z directions resulting from an acceleration in an unknown direction Contents Index ANSYS Graphics EPLOT ANSYS Graphics PLNS Figure 48 Model description Contents Index Reduced Order Modeling ROM Tutorial Model Generation First provide a finite element model of your structure In that example all the information is gathered in two macros you only have to execute them This can be done using multiple tools All the information concerning the model geometry mesh and boundary conditions is in the file called accelman mdl located under the tutorial directory Copy accelman mdl under your working directory Click the ANSYS Input window and enter the following command see ANSYS documentation for further details USE accelman mdl ANSYS Input i Figure 49 ANSYS Input window MEMS Pro User Guide Contents Index 382 The following window appears A ANSYS Graphics EPLOT 1 ELEMENTS U Figure 50 ANSYS Graphics EPLOT window Contents Index Reduced Order Modeling ROM Tutorial The ANSYS Graphics EPLOT window shows the 3D view of the accelerometer a
269. sed specifically for interconnection For more information on connecting ports see Drawing Objects on page 1 246 and Subcircuit Recongnition on page 3 73 of the L Edit User Guide Ports allow L Edit s Extract command to recognize connectivity at a block or circuit level The cells that were generated automatically for this design the plate comb drive folded spring ground plate and bonding pad already have properly drawn ports in place You can examine the port connections in the example Resonator by choosing Edit gt Find to find objects of type port Contents Index The location of ports in each of the layout cells is described and illustrated in Figure 99 The plate has 4 ports PL_Left PL_Right PL_Top PL_Bottom They look like long rectangles 2 units thick stretching across the length of each of the four sides of the plate PL_Top PL_Lett Figure 99 Ports of the plate element The comb drive has 2 ports C_Free C_Fixed They look like long rectangles 2 units thick stretching across the left and right sides of the element Contents Index The folded spring has 2 ports FS_Free FS_Fixed FS_Free looks like a rectangle stretching across the bottom of the element FS_Fixed looks like a rectangle attached to the right side of the element overlapping the anchor point The ground plate has 1 port GP_GND It looks like a rectangle overlapping the entire ground plate The bonding pad has 2
270. specified by the Face parameter Contents Index Target Target choices include the list of layers in the design file Target specifies the 3D model rendering characteristics of the deposited layer It is typically set to the same value as LayerName For more information on 3D model rendering characteristics see Defining Colors for 3D Models on page 186 DepositType FILL As illustrated below the Thickness of FILL is set from the highest point of the model at that step for the TOP Face Thickness Contents Index Possible parameters for FILL deposits are Face LayerName Thickness and Target Face Parameter options include TOP BOT for bottom and TOPBOT for both top and bottom Face identifies the side s of the wafer to be filled LayerName Parameter choices include the list of layers for the design LayerName identifies the layer to be deposited it is often set to the same value as Target Thickness The vertical dimension of the FILL deposit as measured from the highest point on the Wafer up for the TOP face or from the lowest point of the Wafer down for the BOT face See the figure on page 377 Thickness may be any positive decimal number The material is deposited on the side s specified by the Face parameter Target Parameter choices include the list of layers in the design file Target specifies the 3D model rendering characteristics of the filled layer It is typically set to the same value as LayerName
271. splaying 3D models for intermediate steps The right side of the dialog contains the parameters of the selected step in the process steps list For more information on editing process definitions see Editing the Process Definition on page 149 and Process Steps on page 357 of the MEMS Pro User Guide Mumps_i pdt is an abridged version of the MUMPS process definition It includes the steps up to the patterning of the second polysilicon layer A simplified process is used for the tutorial in the interest of saving computation time You do not lose any important information because the linear resonator structure is defined by the process steps up to the patterning of the second polysilicon layer Note though that the bonding pads are composed of the stacking of the first polysilicon layer third polysilicon layer and the metal layer so the 3D representation of the bonding pads will be incomplete To attach the MUMPs process information to the design database click OK to close the Process Definition dialog Contents Index 3D Model View Generating the 3D Model 4 Click somewhere in the title bar of the resonator layout window to make it active M Choose 3D Tools gt View 3D Model in the MEMS Pro Palette The 3D model generation will begin and a progress dialog will appear In a few minutes the 3D model will appear in a new active L Edit window When a 3D Model View window is active the menu bar changes and the 3D Model View tool
272. sponding symbol S_RCOMBUA_1_M_PHI_S and a corresponding behavioral model S_RCOMBUA_1_M_PHI_B The unidirectional rotary comb drive of type 2 designed on the second structural layer S_RCOMBUA_2 has a corresponding schematic S_RCOMBUA_2_M_PHI_S anda corresponding behavioral model S_RCOMBUA_2_M_PHI_B Contents Index Parameter List The following table provides the unidirectional rotary side drive type 2 parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name X location of center of comb xcenter 0 center_x_location fingers Y location of center of comb ycenter 0 center_y_location fingers Active angular comb length aclength 60 degrees active_angular_length Inner radius of rotor rri 50 um rotor_inner_radius Inner radius of stator comb rsi 60 um stator_inner_radius Outer radius of stator comb Tso 150 um stator_outer_radius Rotor spoke width rspokew 12 um rotor_spoke_width Stator spoke width sspokew 15 um stator_spoke_width Width of comb fingers fwidth 5 um finger_width Contents Index Description Layout Default Schematic parameter Parameter Value name Name Air gap between adjacent airgap 5 um finger_gap comb fingers Angular finger overlap trsfovlp 30 degrees finger_overlap Direction of comb drive 1 DIR S Edit Symbol Name S_RCOMBUA_1_M_PHI_S and S RCOMBUA_1_M_PHI_B for poly layer S RCOMBUA_2_M
273. ss definition is a file wide property it is not possible to access the Edit Process Definition dialog from this menu MEMS Pro User Guide Contents Index 185 Defining Colors for 3D Models The setups for the standard fabrication processes have preset colors for the solid bodies that result from fabrication process steps these colors are related to the mask layout color for the 3D models It is not necessary to specially assign colors for the 3D models but if you wish to define colors you may do so The color corresponding to each of the layer materials is determined by parameters set in L Edit Setup Layers dialog The layout window must be active for you to access the color setup If the layout is active the standard L Edit layout menu bar will appear at the top of the window If this is not the case move the cursor to a layout window and left click to activate it Contents Index From the L Edit layout menu Setup gt Layers will invoke the Setup Layers dialog box Click the Rendering tab Select 3D Model in the Pass List to show the current color settings for models generated from the selected layer T ind Cover Aria a ro ie i Pe Caste bam Ta M SEF mines ins we a fa E Ba Ja Hej ej Figure 75 Setup Layers dialog By default the Use Custom Color check box is unchecked To customize the 3D model colors check Use Custom Color The interface highlights the color of the first pass on t
274. ssssssscesesssessesssssesnsesenessseess 512 Layout Generators occ 514 Sample Layout Generator a ccsincsaunsnnaucusuniaians 514 MEMSLib Reference 518 Contents Index Help Introduction ooo cece ccccccccccecccssssecssssesssssesssseecsssecesssesssssees 519 Acknowledgment tse or aie ses cacuesteseins nona e 522 Using the MEMS Library 0 524 Accessing the MEMS Library Palette 526 Show Details Button ccccsesessecssssescssesescssstessecsecseserses 528 Editing the Generated Layout Parameters 0 04 530 Active Elements oo cecccccccccceeesssssssssesnessnssssseeeenee 532 Linear Electrostatic Comb Drive Elements S_LCOMB_ 1 S_LCOMB 2 532 Linear Electrostatic Comb Drive Elements 2 0 0 0 534 Linear Side Drive Elements S_LSDM_1 S_LSDM_2 535 Linear Side Drive Elements 0 cece ceeceeecessescseseseneees 537 Unidirectional Rotary Comb Drive Elements Type 1 S_RCOMBU_1 S_RCOMBU_2 538 Unidirectional Rotary Comb Drive Elements Typel 541 Contents Index Help Unidirectional Rotary Comb Drive Elements Type 2 S_RCOMBUA_1 S _RCOMBUA_2 542 Unidirectional Rotary Comb Drive Elements Type2 545 Bidirectional Rotary Comb Drive Elements S_RCOMBD_1 S_RCOMBD_2 546 Bidirectional Rotary Comb Drive Elements 549 Rotary Comb Drive Elements S_RCDM_1 S_RCDM_2 550 Rotary Comb Drive Element 000 0 eeeeseseeeeeeeeeeeeees 553 Rotary Side Drive Element
275. ssued as the extraneous Wafer commands are encountered by the 3D Modeler Parameters for the Wafer command are described below Parameter Description WaferlD This optional parameter identifies the new Wafer Since MEMS Pro Version 3 supports just one Wafer the WaferlD is assigned automatically and is read only The default value of w1 will override any entry made for WaferlD where valid entries are text enclosed in quotation marks Future versions of the software will support multiple wafers and user assigned names Contents Index Parameter Description MaskName Thickness Target The geometry drawn on the MaskName layer defines the extent of the wafer The boundary of the mask is usually defined by a box but any drawing object may be used including circles and curved polygons Multiple objects that are not touching can also be drawn on the MaskName layer to define the Wafer extent Objects that extend past the drawn wafer extent will be truncated If no closed curve is drawn on the MaskName layer its extent will be set to 110 of the minimum bounding box of the layout on all other masks Any valid L Edit layer name enclosed in quotation marks is an acceptable input for MaskName Vertical dimension of the Wafer Any positive decimal number is an acceptable input for Thickness This parameter specifies the 3D model rendering characteristics of the Wafer You may enter any valid L Edit layer name as text en
276. st Structure Element Type 2 S_COTEST_2 584 Crossover Test Structure Element Type 2 0 0 0 0 586 Euler Column Doubly Supported Beam Elements S_EUBEAM_1 S_EUBEAM_2 587 Euler Column Doubly Supported Beam Elements 589 Array of Euler Column Elements S_EUBEAMS_1 S_EUBEAMS_2 590 Array of Euler Column Elements 0 0 00 ceeeeeseeeeeeeeees 592 Guckel Ring Test Structure Elements S_GURING_1 S_GURING_2 593 Contents Index Help Guckel Ring Test Structure Elements 0 0 0 0 595 Array of Guckel Ring Elements S_GURINGS_1 596 Array of Guckel Ring Element 0 0 0 0 cceeceeeeeeereeeeeees 598 Multilayer Pad Element S_PAD_1 uu 599 Multilayer Pad Blement jc nc52canmdinklaraiee 600 Resonator Elements 0 0000 0000 0 ccccccccceeeeeeeee 601 Plate SPEA TE Ng cies ics tices wel eit nea elena tar 601 ed Fee en Ens ee een ae cee 603 Comb Drive S_LCOMB 3 neseser 604 Comb Drive comb 0 ccecceceecceeeeeescsssesscsssscsssesseeeseenes 606 Folded Spring S LMP BS 3 hci Sevecsitenae mocuengant 607 Folded Spin Siino ole es oles Aina ad ad 609 Ground Plate S_GDPLATE_ 1 eeeeeeee 610 Gr ound Plate ipa ei ee hae Roce Roe ate E ck teil 611 Bonding Pad S_PAD_2 esos heunectcoemrsiituaetaeieieunees 612 Contents Index Help Bondins Pad surmise Se ice Nh eel odes 8d ates Soa ig 613 Technology Setup 0 614 Introduction oii cececccccccscsssseseeeessessssssssssseeeeeseseee 615 IVE IN MUMPS reau
277. t On Areas The Apply U ROT on Areas picking menu will appear VM Now hold the left mouse button down and drag the pointer around the display Notice that different areas are highlighted while the pointer is over them Drag the pointer over the anchor area until it is highlighted as in Figure 109 Releasing the mouse button will pick this area which should be number 59 If you Contents Index accidentally select another area you can click Reset in the Apply U ROT on Areas picking menu to unselect it Once the correct area and only this area is selected click OK in the Apply U ROT on Areas picking menu Figure 109 Selecting a particular area of the 3D model Contents Index In the Apply U ROT on Areas dialog verify that DOFs to be constrained is All DOF and Apply as is Constant value Type 0 0 for Displacement value Click OK Next locate the keypoints where the testing force will be applied Click Fit in the Pan Zoom Rotate menu Now zoom in on the opposite end of the model near the dimples In the ANSYS Main menu choose Preprocessor gt Loads gt Loads Apply gt Structural Force Moment gt On KeyPoints The Apply F M on KPs picking menu will appear Contents Index 5 Using the same technique as above select the two keypoints on the upper right end of the spring These should be numbers 4 7 and 42 Refer to Figure 110 to check if you have selected the appropriate keypoints Figure 110 Selecting t
278. t nodes called inputl input2 as load cases For SPICE simulations the inputs used during ANSYS simulation must be applied to these entries as voltage excitation 2 The output nodes there are as many output nodes in an sp files as degrees of freedom e g with 3 degrees of freedom you have 3 nodes called outputl output2 and ouput3 During system simulation the voltage signals on these outputs are very close to the behavior of the corresponding degrees of freedom calculated by the FEM simulator 3 The 0 node this node must be connected to the voltage reference when the circuit model is instantiated in a larger SPICE circuit The following is an example of a generated one input one load case one output one degree of freedom sp circuit T Spice equivalent netlist generated by Memscap Model Builder Contents Index param m11 1 151887e 06 param dll 1 151887e 03 param k11 4 116023e 01 param 111 1 150145e 06 GM11 outputl 0 outputl_d2t 0 ml11 GL11 0 outputl 0 inputi 111 RK11 outputl 0 1 k11 C_output1 N11 N12 1 E_output1 N11 0 outputl 01 V_outputl1 N12 0 0 Vdamp_outputl outputl N13 0 FD11 N13 0 V_outputl ar Hvel_outputl outputl_dt 0 V_outputl1 1 L_outputl outputl_d2t 01 Fvel_outputl 0 outputl_d2t V_outputl 1 Reduction of Electrostatically Coupled Structural Systems The Electrostatic part of the R O M Tools menu gives you access to an algorithm for the reduction of elect
279. tage source for the right comb drive a DC value of 0 volts Do this by choosing Edit gt Edit Object with this source selected Enter 0 in the V field Similarly give the voltage source for the folded springs a DC value of 50 Volts MEMS Pro User Guide Contents Index 33 Labeling Nodes In S Edit connectivity is defined in terms of nodes A node is a point on the schematic to which one or more pins or wires are connected Nodes are defined by their name and the scope of a node is normally the collection of schematic pages in a module That is if a node name appears twice within a single module both names refer to the same point of connection If the same node name appears within two different modules the nodes refer to completely different points of connection S Edit automatically assigns names to each node but you may also manually name nodes User assigned node labels are helpful for annotating S Edit schematics and producing more readable netlists z Select the Node Label tool aN from the schematic toolbar M Label the two wires connecting plate4 to the right comb rtm and rte To label a node click it and enter the new node name in the Place Node Label dialog box The rtm node label should be placed on the wire between right_m and free_m pins and the rte node label should be placed on the wire between right_e and free_e pins M To change the orientation of the node label click the Selection button click the node label a
280. te system level simulation It captures the Contents Index essential behavior for mechanical devices and coupled electrostatics mechanics MEMS components Transient simulations what if analysis and very accurate system simulation are then easily and quickly performed Automatic mask layout generation 3D to Layout FEM to layout automatically generates mask layout in CIF format from FEM models developed from a target process definition Contents Index What s New in Version 3 0 MEMS Pro has been enhanced to simplify design flow and boost your productivity We have incorporated technology that will let you optimize your designs before you submit them to the foundry and thereby shorten your design cycle For more information about The new MEMS specific Graphical User Interface refer to MEMS Pro Toolbar on page 97 Easy MEMS including the plate release feature the polar array feature and the vertex information viewer refer to MEMS Pro Utilities on page 147 Automatic spline generator refer to Splines on page 126 3D to Layout generator refer to ANSYS to Layout Generator on page 278 Reduced Order Modeling refer to Reduced Order Modeling on page 334 Contents Index Documentation Conventions This section contains information about the typographical and stylistic conventions employed by this user guide In line references to menu and simulation commands device statements special characters and examples of
281. ted by previous steps in the fabrication process Contents Index Setting DepositType CONFORMAL Scf 1 0 c and Thickness t for example MUMPS deposition of Poly7 the profile becomes the following Material has been evenly deposited across the entire surface of the wafer Contents Index If however Scf is set to a value between 0 and 1 the coverage will depend on the existing geometry as the following diagram illuminates Thickness A Scf Thicknes ra 9 N lt j The thickness t on sidewalls at intermediate angles depends on the angle of inclination O of the sidewall and CONFORMAL parameters Scf and Thickness according to the following expression t Thickness ces 6 Scf sin 0 When the angle O is 90 the expression for t reduces to Scf Thickness as it must by the definition of Scf Setting Scf to 0 5 deposits half as much material on the sides of a 90 wall as on the top Contents Index DepositType SNOWFALL SNOWFALL deposits no material on vertical and shadowed surfaces as shown below Horizontal surfaces have the deepest coverage Inclined surfaces have an intermediate amount of material deposited upon them flat surface inclined surface Parameters for SNOWFALL deposits are described below Parameter Description WaferlID This optional parameter identifies the Wafer that will receive the deposit Since MEMS Pro Version 3 supports just one Wafer the WaferID is assigned automatic
282. tents of the window Instantiating Comb drives Instantiate the comb module as you instantiated the plate The newly instantiated comb will appear on top of plate4 in the middle of the schematic window You will have to move it to a new location using the S Edit click and drag feature Objects in S Edit can be moved by selecting with the left or right mouse button and dragging with the center mouse button For two button mice press the Alt key and left click to drag objects Place the comb drive to the right side of the previously instantiated plate Place a second comb drive into the design by copying the instance With the first comb instance selected select Edit gt Copy then Edit gt Paste Select the left comb and then flip it by choosing Edit gt Flip gt Horizontal Contents Index yw Move the comb drives so that their connection pins represented by circles line up with the pins on the plate4 instance Figure 2 see Pins on page 180 of the S Edit User Guide and Reference Pr Bpa tpa en L o o m GE TE HO Heft right m O GHE keem h f GER p e HO Hefte right e GHE ke se f a o o m E kia bottoms botton SS Figure 2 Aligning the comb drives to the plate Instantiating Folded Springs Instantiate the fspring module and place it above the plate Create a copy of the folded spring and place it below the plate Flip th
283. teps BULK etches remove parts of the Wafer SACRIFICIAL etches completely remove all bodies on the EtchRemoves layers This etch does not require masking and therefore has no setting for the EtchMask or MaskName parameter The orientation of the Wafer must be taken into account when setting these parameters Contents Index Orientation Considerations The Face to be etched may be the top face TOP the bottom face BOT or both faces simultaneously TOPBOT If you are designing masks for processing on both faces of the wafer you must be careful of the orientation of the masks As Alan Nutt of Kodak Research Laboratories points out to ensure correct alignment as drawn in layout of the masks designed for processing on the bottom of the wafer with the masks designed for processing on the top of the wafer the former must be flipped horizontally i e left right reversed You may be required to perform the reversal yourself or have the mask maker perform it Please consult your mask maker for further information Another consideration for SURFACE etch is whether the mask setting is inclusive or exclusive EtchMask may be set to either INSIDE inclusive or OUTSIDE exclusive For EtchMask INSIDE areas beneath the mask layer geometry are removed generally used for insulator masks For EtchMask OUTSIDE areas beneath the mask layer geometry are protected generally used for conductor masks Below identical masks with dif
284. ter a Bostonize approximation Contents Index Parameter MEMS DRC Default Value Description Initiates a design rule check after a Bostonize approximation MEMS Extract Extracts the layout after a Bostonize approximation Contents Index MEMS Pro Utilities Approximating All angle Objects These commands must already be loaded as described previously Once any of them are invoked the All Angle Approximation dialog will appear EV Angle Approximation FIRE AGpIGHiniauah GEDTeti alter ACUGT Figure 67 All Angle Approximation dialog MEMS Pro User Guide Contents Index 166 Parameters Parameters Approximation Type Default Value Description Choose between Manhattanize 90 only and Bostonize 90 and 45 This parameter only applies to the MEMS Approx action Approximation Grid Grid for approximation in number of internal units The default grid is 100 since most technology files use 1000 internal units per locator unit Choosing 1 10 of the technology unit for this setting is sufficient for most layouts Finer grid selections will adversely affect execution time Overlay There are three overlay options Overlay Approximation Geometry Replace Approximated Geometry or Delete Approximation Geometry after Action The first option overlays the approximated objects on top of the existing all angle objects The second option replaces the
285. the volumes and all the areas lines and keypoints created with the volumes click Volumes amp Below i Then select the volumes you want to delete by using the Pick radio button Warning If you delete all the volumes attached to the same component this component is also deleted and no longer appears in the component list Contents Index Addition of Volumes yw To add volumes click Add Volumes in the 3 D to Layout palette After the addition of volumes a dialog box appears indicating that ANSYS will add the areas of the new volumes This is specific to MEMSCAP s implementation You can also subtract or move volumes by using the Subtract Volumes and Move Volumes options of the 3 D To Layout menu These boolean operations delete the component of the added or subtracted volumes After the addition or the subtraction the dialog box see Figure 8 appears in order to define a component name for the new volume If you move a volume with non circular arcs and circular arcs ANSYS loses the information about the arcs For instance if you create a sphere and move it all the arcs of the sphere become straight lines Component Names When you click Define Component the dialog box Figure 8 appears to allow you to define the component name of the smallest volume which is not attached to a component Contents Index Each component in ANSYS corresponds to the name of the layer in the resulting CIF file Geometry on each
286. ting the Folded Springs Create a folded spring by clicking the Folded Spring a button from the Library Palette Change the Name of Instance to SpringTop and click OK Contents Index Position it above the center of the plate so that it overlaps see Figure 22 FS Fixe Figure 22 Positioning the folded spring Copy and paste SpringTop Then select Edit gt Flip gt Vertical Position the new folded spring below the plate Change the name of this copied instance by selecting Edit gt Edit Object and entering SpringBottom in the Instance Name field Generating the Ground Plate Create a ground plate by clicking the Ground Plate button from the Library Palette Leave all the parameters at their default values and click OK Contents Index Home the view then move the ground plate so that it covers all the moving parts of the resonator refer to Figure 24 Generating the Bonding Pads Create a bonding pad by clicking the Bonding Pad E button Leave all parameters for the bonding pad at their default values Click OK Position the bonding pad slightly to the right of the right comb drive Figure 23 Now you must connect the bonding pad to the comb drive by drawing a box on Poly0 overlapping the two components Choose the Box tool o by clicking it and select the Poly0 layer from the Layers Palette by clicking on the first item in the first row of the Layers Palette As your mouse is moved over the Poly0 button
287. tions Description Layout Default Schematic parameter Parameter Value name Name Inner rotor radius rri 5 um rotor_inner_radius Outer rotor radius Tro 60 um rotor_outer_radius Contents Index Description Layout Default Schematic parameter Parameter Value name Name Rotor ring width rwidth 10 um rotor_ring_ width Stator inner radius rsi 65 um stator_inner_radius Stator outer radius rso 125 um stator_outer_radius Stator pole angle phisp 18 degrees stator_pole_angle Angular gap between poles phisg 12 degrees _ stator_poles_angular_gap S Edit Symbol Name S_HSDM_1_M_PHI for poly1 layer S HSDM_2_M_PHI for poly2 layer Contents Index MEMSLib Reference Harmonic Side Drive Elements Active Elements Harmonic Side Drive Parameters S_HSDM_1 Layout Parameter Entry Dialog Box Layout Palette Button MEMS Pro User Guide Si gsh e twidih Layout Parameter Illustration Index 559 Passive Elements Journal Bearing Elements 1 S_JBEARG_1 Description S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Generates a journal bearing intended to connect with a rotary element on the first structural layer The shaft is anchored to the substrate and the retaining cap on top of the shaft central to the bearing is formed on the second structural layer The outside of the shaft on structural layer2 is one bearing surface while
288. tions are INSIDE or OUTSIDE This parameter sets the mask orientation that is whether the material to be removed is INSIDE or OUTSIDE of the drawn layout Do not enclose in quotation marks Vertical dimension of the etch Only the layers specified in the EtchRemoves parameter will be affected by the etch If the Depth is greater than the Thickness of the etched layer the layer beneath will not be removed Depth may be any positive decimal number Contents Index Parameter Description Angle Undercut EtchRemoves Label The etch Angle is determined in decimal degrees between 45 and 90 Angle is not supported for SURFACE etch under MEMS Pro Version 3 and therefore not required In the current version of the program the 3D Modeler assumes that the etch Angle is 90 for SURFACE etches For EtchMask INSIDE Undercut is the distance the etch front will extend over the drawn mask edge For EtchMask OUTSIDE Undercut is the distance the etch front will intrude under the drawn mask edge Undercut 0 is a sharply defined cut aligned to the mask edge for both cases Undercut may be any positive decimal number Undercut is not supported under MEMS Pro Version 3 and therefore not required In the current version of the program the 3D Modeler assumes that there will be no Undercut i e Undercut 0 for SURFACE etches Name of the layer that will be removed by this etch step Any valid L Edit layer name enclosed in quotatio
289. ts Index Select Tools gt Macro to invoke the Macro dialog Click the Add button to bring up the Open dialog Select MEMSPhysical dll in the memslibs directory The MEMS Pro Toolbar appears Click the Close button to exit the Macro dialog Then select Setup gt Application The Setup Application dialog box appears Contents Index MEMS Pro Toolbar Introduction Setup Application Figure 39 Setup Application dialog box MEMS Pro User Guide Contents Index 100 MEMS Pro Toolbar Introduction i Browse to the ledit ini file located under Program Files Memscap MEMS Pro v3 00 and click OK Mu Click Tools gt Macro The Macro dialog box appears o 5 alette MEMS Pro Library Library Palette MEMS Pro Library Edit Component MEMS Pro Easy MEMS Polar Array MEMS Pro Easy MEMS Plate Release MEMS Pro Splines Create MEMS Pro Splines Edit MEMS Pro Tools Yiew Vertex Coordinates MEMS Pro Tools View Vertex Angles MEMS Pro Tools View Vertex Information MEMS Pro Tools Clear Vertex Information MEMS Pro Tools Fracture Figure 40 Macro dialog box MEMS Pro User Guide Contents Index 101 Select the MEMSPhysical dll in the bottom area and click the Load at startup check box Click Close Your MEMS Pro Toolbar will now appear automatically Contents Index Library Menu The Library menu offers two possibilities Accessing the Library Palette Editing components created using the
290. ts Index Help MEMS Pro Toolbar 97 Introduction 5 55 00 nace oeranastat anes 98 Library Menu ou cccccssssssssssssssssssssssssssset 103 Library SP ANS OC ya simaurra ce eed alan canes asta rant aes 103 PqieC OMponent ccde nce eh iret a aa neueand 105 3D Tools Menu oie cccccsssccccceesssssssseesnnntnsnsnssnees 109 Editing a Process Definition ccececeeeeteeseeeeteeeeeeeeeees 109 Viewing a 3D Model 22 cccheronersuicte aaa 111 Deleting a 3D Model sifc52n deen tesonvstun anne 112 Exporting a 3D Model hse oe eactetevenccietiaat mocienoiey 113 Easy MEMS Menu 114 Creating holes in a plate cneweei entities od 114 Copying ODJCCUS tte Aurel a pes EE E Rue es 116 SMES aces ee A a 118 Contents Index Help Creatine Spline Sosaia a en tes E cas 118 Edifins Spines yinneanoniieen a a ret 120 Tooli peera an eel iadnecnnee 121 Viewing Vertex Coordinates 20 0 cccecececceeeeseeseseeseeeeeeeeees 121 Viewing Vertex Angles 2228 4 sn ese ea miceaelarauiee 122 Viewing Vertex Information 0 cccececeeeseeseeeeteeeeeeeeees 122 Clearing Vertex Information 0 0 0 0 cccceeeeeeeeeeeeeeeteeees 123 cl eerie ee eres a eo 124 MEMS Pro User Guide 3 22 enccdeuiciiiewnstius 124 About MEMS Pro s cac pie onumrabuneam ii oi 124 Splines 1111111111111 126 Introduction a ii ictshiisiceslsisantacsdsiarinadiincanslonals 127 Contents Index Help Understanding Splines 2x 2 cccceiacivg nia enias 127 Create Spline Dialog Box
291. tual process definition file appears in its entirety at the end of this chapter in the section entitled Process Definition Example MUMPs on page 676 As you read the process command descriptions that appear later in the chapter you will note that parameters require specific inputs such as text numbers or switches Parameter types and the values that may be entered for them are listed in the table below In general character strings for example S and layer must be enclosed in quotation marks Parameter types are case sensitive The 3D Modeler will not recognize top as TOP In general numbers for example J and P do not require quotation marks Switches for example TOP BOT and microns do not require quotation marks and they must be entered exactly as they are given in the reference table The numeric parameters of type J P and R Contents Index are in the units specified in the ProcessInfo step Do not enter the unit when setting these parameters values For details on specifying units see ProcessInfo on page 628 Permissible Values for Process Parameter Types Type Permissible Value s A Angle in degrees Any value between 0 and 90 I An integer A whole number between 2147483648 and 2147483648 P A positive real number Any positive decimal number R A real number Any decimal number S A string Text that must be enclosed in quotation marks percent A decimal number between 0 and 100 layer Any valid L Edit la
292. two Magnification is decreased by a factor of two Magnifies the 3D model to fit the window Contents Index 200 Zoom gt Box Zoom gt Drag Toolbars Left click once to set one corner of the box left click again to select the opposite corner of the box The area bounded by the box will fill the entire 3D Model View window Once you are in drag mode you can smoothly zoom towards and away from the model by holding down the left mouse button and dragging the mouse forwards and backwards Zooming towards the model increases the magnification zooming away decreases the magnification As shown below the 3D Model View toolbar may be shown or hidden This same dialog box may be reached with L Edit View gt Tools gt Toolbars command Any of the toolbars shown below may be hidden by unchecking the box next to its name Click Close to exit the dialog Contents Index 3D Modeler 3D Model View User Interface ESTE ia cal z z z ia ia Figure 83 Toolbars dialog Status Bars As shown below you may show or hide the Status Bar while viewing 3D models Note that the Mouse Button Bar and Locator Bar are not active while in 3D Model View You may remove a bar by unchecking the box to its left Click Close to exit the Status Bars dialog MEMS Pro User Guide Contents Index 202 3D Modeler 3D Model View User Interface Status Bars Figure 84 Status Bars dialog For more information on the Status Bar see Status B
293. ues resid 0 00221041 grad 0 00137331 derivative 0 00389856 resid 0 00195898 grad 0 00389856 resid 0 00195898 grad 0 00389856 derivative 0 00389856 resid 0 00195898 grad 0 00389856 springlength 1 1775e 004 Measurement result summary OPTIMIZE opt1 res_freq 3 9922e 004 Contents Index 11 Verification Introduction Adding Connection Ports Extracting Layout Extracting Schematic for LVS Comparing Netlists Contents Index 458 459 463 471 Introduction This chapter explains how to verify a mixed technology layout by showing the processes of layout extraction and layout vs schematic comparison This chapter contains a tutorial on these important design steps The tutorial is a continuation of the main MEMS Pro tutorial from Chapter 2 MEMS Pro Tutorial Contents Index Adding Connection Ports Note We will begin the tutorial with the design you completed in Chapter 2 MEMS Pro Tutorial Please open it in L Edit Launch L Edit by double clicking the L Edit icon and select File gt Open to load the design file we have provided you reson tdb As long as geometrical objects on the same layers touch or overlap they will be fabricated as connected however for SPICE netlist extraction to work correctly the connection must be explicitly stated These connections are called ports and they define connectivity for a cell Ports are objects drawn with the Port tool on a layer u
294. up the following dialog safe ya 406 Horizontal eae xj ya 0 Vertical Z Sealing Factor n Figure 92 Generate 3D Model Cross Section dialog All cross sections are performed perpendicularly to the surface of the wafer The cross section line is the intersection of the cross section plane and the X Y plane of the 3D model The endpoints of the cross section line are the X Y pairs in the parameter list below X1 Y1 X2 Y2 Coordinates of the cross section line Z Scaling Factor The ratio of the height Z to the horizontal or vertical baseline Not available in Version 3 Contents Index The orientation of the cross section line along the width or length of the substrate may be set with the Horizontal or Vertical buttons Choosing the Horizontal button will set Y2 to the same value as Y1 Choosing the Vertical button will set X2 to the same value as X1 The cross section line will appear in the 3D model window the cross section view itself will appear in a new window fe Samana e Seber Be oneal We 150000 HTN ONO Asz2en000 Baie Benny Figure 93 Performing the cross section of a torsional mirror Contents Index In Figure 24 the various steps of the cross section of a torsional mirror are displayed clockwise from the upper left the 3D model the top view with the cross section line and the cross section view Note that the windo
295. us of stator comb rso 150 um stator_outer_radius Rotor spoke width rspokew 12 um rotor_spoke_width Stator spoke width sspokew 15 um stator_spoke_width Width of comb fingers fwidth 5 um finger_width Airgap between adjacent airgap 5 um finger_gap comb fingers Angular finger overlap afovlp 30 degrees finger_overlap Direction of combdrive 1 DIR S Edit Symbol Name S_RCOMBD_1_M_PHI_S and S_RCOMBD_1_M_PHLI B for poly1 Contents Index layers S_RCOMBD_2_M_PHI_S andS_RCOMBD_2_M_PHI B for poly2 layers Contents Index MEMSLib Reference Active Elements Bidirectional Rotary Comb Drive Elements Bidirectional Rotary Comb Parameters S_RCOMBD_1 Layout Parameter Entry Dialog Box Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 549 Rotary Comb Drive Elements S_RCDM_1 S RCDM_2 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a rotary comb drive on the first or second structural layer The rotary comb drive designed on the first structural layer S_RCDM_1 has a corresponding symbol S_RCDM_1_M_PHI_S and a corresponding behavioral model S_RCDM_1_M_PHI_B The rotary comb drive designed on the second structural layer S_RCDM_2 has a corresponding schematic S_RCDM_2_M_PHI_S anda corresponding behavioral model S_RCDM_2_M_PHI_B Parameter List Contents Index The following table provides the
296. user input and program output are represented by a bold font For example print tran v out Elements in hierarchical menu paths are separated by a gt sign For example File gt Open means the Open command in the File menu Tabs in dialog boxes are set off from the command name or dialog box title by a dash For example Setup gt Layers General and Setup Layers General both refer to the General tab of the Setup Layers dialog Freestanding quotations of input examples file listings and output messages are represented by a constant width font for example ac DEC 5 1MEG 100MEG Variables for which context specific substitutions should be made are represented by bold italics for example myfile tdb Contents Index Sequential steps in a tutorial are set off with a check box dingbat WZ in the margin References to keyboard mouse button combinations are given in boldface with the first letter capitalized for example Alt Left The terms left click right click and center click all assume default mappings for mouse buttons Text omitted for clarity or brevity is indicated by an ellipsis Special keys are represented by abbreviations as follows Key Abbreviation Shift Shift Enter Enter Control Ctrl Alternate Alt Backspace Back Delete Del Escape Esc Insert Ins Tab Tab Contents Index Key Abbreviation Home Home End End Page Up PgUp Page Down PgDn Function Keys F1
297. w Warning Set the output file radical prefix to gt MyExample3 Do not forget to enclose the output file radical prefix in single quotes Set the Ending LS file number to 3 The algorithm applies three load cases These load cases have been previously defined in LS files The name of these files are the current ANSYS jobname followed by the number of the LS file The created LS files are called lt working_directory_name gt s01 lt working_directory_name gt s02 and lt working_directory_name gt s03 Click OK to run the algorithm During the execution information is printed in the ANSYS Output window informing you about the currently performed tasks and their results KKKKKKKKK KK KKK KK KKK KKK KKK KKK KKK KKK KK KK KKKKKKKKKKKKK Guyan Irons condensation KKKKKKKKKKKK KKK KKK KKK KKK KKK KKK KKK KKK KKKKKKKKKKKKKKK Ansys substructure file MyExample3 sub Run Substructuring with LS files Contents Index LS files FROM ds TO INC 1 Waiting for ANSYS solution Done Number of selected DOF Number of load steps oil w w KKKKKKKKKKK KKK KKK KKKKKKKKKKKKKKKKKKKKKKK KKK KK KKK KKK Reduced model successfully generated KKK KKK KKK KKK KKK KKK KKK KKK KKKKKKK KK KKK KKK KKK KKK KKK KKK After execution result files are created in your working directory They contain the behavioral model reduced equation written in the selected format In this case the output file is MyExample3 sp Contents
298. w is an instance Platelnst of a newly created cell named Plate Each cell name must be unique in a file Therefore you should set the Name of Plate Cell to something other than Plate when running the macro again in the same file Generating the Comb drives M Click the comb drive button to create a lateral comb drive MEMS Pro User Guide Contents Index 60 MEMS Pro Tutorial Generating a Layout Change the Name of Instance to CombRight and click OK Once a comb drive appears on the screen zoom out by pressing the minus key several times or by selecting View gt Zoom Out Editing an Already Generated Component You will now learn to edit a component once you have created it The component you will edit is the comb drive you have just instantiated Select the comb drive Select Library gt Edit Component The Linear Comb Parameters dialog box appears Linear Comb Parameters S_LCOMB_1 Figure 18 Linear Comb Parameters dialog box MEMS Pro User Guide Contents Index 61 M Set the Number of gaps to 21 and click OK The modified comb drive appears in the L Edit window L Edit Cell0 Layout1 A Eie Edt View Dew Cel Setup Toole Window Hep Tiai ROEG AES peu zl o aN Ae 5 ep mia MENE Fe VERSO Library 3D Tools EasyMEMS Splines Tools Help Oog m O Ao IC jE ai md a PL_Bottom c_free Figure 19 Viewing the modified comb drive Cont
299. with an X Marked layers will be removed during this Etch step EtchType BULK The BULK etch sketched below is of KOH or EDP on a silicon wafer of 100 crystal orientation The pit is bound by the 111 plane which is attacked at a much slower rate than all other crystallographic planes The outline of the box is the minimum bounding box of the mask pattern This etch assumes EtchMask INSIDE The etch is viewed from above the TOP face A cross section corresponding to the dashed line appears below Contents Index cross section line EN cross section gt BULK etch parameters include EtchType Face MaskName Depth Angle and Undercut Face Parameter options include TOP BOT for bottom and TOPBOT for both top and bottom Face identifies the side s of the wafer to be etched Depth Vertical dimension of the etch Any positive decimal number may be entered for Depth Only the layers identified by the EtchRemoves parameter will be attacked Contents Index Angle Undercut Etch Angle is the angle of the sidewalls achieved by the etch and is given as a decimal value between 45 0 and 90 0 Undercut may be any positive decimal number It is the distance the etch front will extend over the mask edge Undercut 0 is a sharply defined cut aligned to the mask edge EtchType SACRIFICIAL A SACRIFICIAL etch completely removes all bodies on the EtchRemoves layers This etch does not require masking and t
300. wo keypoints on the spring VM Making sure that only these two keypoints are selected click OK in the Apply F M on KPs picking menu Contents Index ANSYS Tutorial Meshing the Model yw In the Apply F M on KPs dialog make sure FX is shown for the Direction of force mom and Apply as is set to Constant value For Force moment value enter 1 0 i e the force on each node is pointing in the negative X direction and has a magnitude of one microNewton remember our units are microns kilograms seconds Thus the total leftward pointing force on the spring is two microNewtons Figure 111 Apply F M on KPs dialog i Click OK Meshing the Model You are now ready to mesh the model MEMS Pro User Guide Contents Index 269 ANSYS Tutorial Meshing the Model mi In the ANSYS Main menu choose Preprocessor gt MeshTool In the MeshTool dialog check the SmartSize box Position the slider so that smartsizing is set to 8 Verify that Volumes is selected for Mesh that Shape is set to Tet and that Mesher is set to Free M Click Mesh Mesh f Clear Figure 112 Mesh Tool dialog MEMS Pro User Guide Contents Index 270 The Mesh Volumes picking menu will appear Specify the volume for meshing by its number rather than selecting it with the mouse Select the spring by typing 4 in the ANSYS Input window then press Return Click OK in the Mesh Volumes picking menu The mesher will take a short time to mesh the spring W
301. ws are tiled The cross section line may be graphically modified by dragging its ends As the cross section line is moved the cross section view will automatically be updated Simultaneous views of different cross sections are not possible since each time the cross section line is moved the cross section is redrawn in the 3D cross section window The title of the 3D cross section view reads i CellName 3D Model Cross Section Filename Multiple cross section views of a single 3D model view cannot be made Contents Index Deleting 3D Models To delete a 3D model select 3D Tools gt Delete 3D Model in the MEMS Pro Toolbar The following dialog will appear m Delete from F 7 This cell i This file ancel C All open files WARNING This operation cannot be undone Figure 94 Delete 3D Models dialog Select This cell to remove the 3D model in the active cell Select This file to remove all 3D models in the active file Select All open files to remove all 3D models in all open files The Delete 3D Models dialog can also be accessed from the context sensitive menu of the Design Navigator From an active layout window select View gt Design Navigator To activate the context sensitive menu right click on a cell Select the Delete 3D Model command to invoke the dialog above Contents Index Warnin This operation cannot be undone p Contents Index Exporting 3D Models 3D models may be e
302. x Warning Warning Note In the layout you cannot select hole layers because they correspond to nothing in ANSYS For example you cannot choose HOLMETAL or HOLPOLY1 The volume is the same color as the component name You can choose another volume number if this one has no component If you make a mistake forget the single quotes for instance or if you want to attach a volume to a component without creating a volume you can click Define Component in the 3 D to Layout palette and the same dialog box appears Figure 8 Once a component name is attached to a volume you can modify it by deleting the component name associated with the selected volume and redefining it using the Define Component command in the 3 D to Layout palette If you remove a component name this component is deleted in every volume containing this name ANSYS restricts variable name lengths to 8 characters If you enter a component name including more than 8 characters ANSYS only takes into account the first 8 characters For example if you enter CONTACT_POLY ANSYS creates a Contents Index volume which component name is CONTACT_ Since this name does not exist in the component list and the volume will not appear in the layout Deletion of Volumes This is a standard ANSYS command 5i To delete volumes click Delete Volumes in the 3 D to Layout palette Two options are available Volumes Only and Volumes amp Below To delete
303. xported to SAT or ANF formats The Export 3D Model option may be reached from L Edit through the 3D Tools menu of the MEMS Pro Toolbar Once accessed the Export 3D Model dialog will request the destination and format of your output file Export 3D Model x Eile name fexpor sat Browse File type facis text format SAT 7 Emo cence Figure 95 Export 3D Model dialog Click the Export button to export a file with the name and type you selected Export 3D Model can also be accessed through the context sensitive menu within the Design Navigator The Design Navigator can be accessed from L Edit Contents Index 3D Modeler Exporting 3D Models through the View menu Right click on the cell of interest to access the Export 3D Model command iQ acc el bd Chest A rrighi Top dosm sil mel Figure 96 Accessing the Export 3D Model option via the context sensitive menu For more information refer to Design Navigator on page 1 353 of the L Edit User Guide MEMS Pro User Guide Contents Index 221 If you plan to view the model in another graphics program then exporting the file in SAT format a general interchange format for solid models is sufficient If you plan to use ANSYS to analyze your model the decision to export in SAT or ANF format will depend on your preferences and on your operating system ANSYS is able to import ANF files under any operating system and it is always possible to write dire
304. y Dialog Box aN ee PIIIIIIILELA Layout Palette Button Layout Parameter Illustration Contents Index Resonator Elements Plate S_PLATE_1 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Macro MEMSLIB DLL Description Generates a plate on the Poly layer Parameter List The following table provides the plate parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Plate width width 200 um plate_width Plate length length 200 um plate_length S Edit Symbol Name S_PLATE_1_M_X Contents Index MEMSLib Reference Resonator Elements MEMS Pro User Guide Contents Index 602 MEMSLib Reference Resonator Elements Plate Rectangular Parameters S_PLATE_1 Layout Parameter Entry Dialog Box width lt length gt Layout Palette Button Layout Parameter Illustration MEMS Pro User Guide Contents Index 603 Comb Drive S_LCOMB_ 3 S Edit File MEMSLIB SDB L Edit File MEMSLIB TDB Cell comb Macro MEMSLIB DLL Description Generates a comb drive on the Poly layer Parameter List The following table provides the comb drive parameters their values and descriptions Description Layout Default Schematic parameter Parameter Value name Name Finger width width 4 um width Finger length length 40 um length Finger g
305. y at start up and bound to the Tools gt menu in the MEMS Pro Toolbar You may confirm whether the macros have been loaded by starting L Edit selecting the Tools gt menu and looking for them Loading the Macros If the macros have not been loaded automatically you may load them manually using the procedure below Start L Edit Select Tools gt Macro in the main L Edit menu bar to access the Macro dialog Click Add and load the macro file lt install directory gt memslibs MEMSPhysical dll M To run a macro either select the macro from the Macros list and click Run Alternatively you may access the macro from the Tools menu Contents Index Generating Polar Arrays Description The Polar Array function allows you to generate multiple instances of a selected cell and to place them in an arc The Polar Array function depends on three parameters The center of the polar array The number of desired copies The total angle for the copies Accessing the Function M To access this function select Easy MEMS gt Polar Array in the MEMS Pro Palette Contents Index MEMS Pro Utilities Generating Polar Arrays The Polar Array dialog box opens Polar Array MEMSCAP Figure 61 Polar Array dialog MEMS Pro User Guide Contents Index 151 Parameters The following table provides a description of the Polar Array dialog box options Parameter Default Value Description Copies 1 Number of copies in the polar ar
306. yer name Text enclosed in quotation marks unit Any of the following units of length microns millimeters centimeters mils inches lambda other face Any of the following three options TOP BOT TOPBOT Do not enclose in quotation marks dtype Any of the following three options CONFORMAL SNOWFALL FILL Do not enclose in quotation marks Contents Index Type Permissible Value s scf The scf type characterizes the Scf parameter It accepts any decimal fraction a real number from 0 0 to 1 0 enclosed in quotation marks The character value c enclosed in quotation marks is also an acceptable input for scf type etype Any of the following three options SURFACE BULK SACRIFICIAL Do not enclose in quotation marks emask Any of the following two options INSIDE OUTSIDE Do not enclose in quotation marks In the following pages the parameters for each step and the options available for the designer are described in details Contents Index Process Steps Process definitions are concatenated from strings of Process Steps These steps or commands appear in the file in the same order as they occur in the actual fabrication processing Below the syntax of each Process Step is described followed by a description of the step its uses and its parameters Processlinfo The syntax for the Processinfo step is presented below followed by an example containing valid entries for its parameters Syntax
307. yer that follows the contour of the processed wafer SNOWFALL covers only those surfaces that are not shadowed by other surfaces on the wafer FILL is a maskless Process Step that makes the surface of the wafer a plane Each DepositType has unique parameter requirements DepositType CONFORMAL A CONFORMAL deposit is illustrated below Thickness l Scf Thickness E AA Contents Index Parameters for CONFORMAL deposits are Face LayerName Thickness Scf and Target Face Parameter options include TOP BOT for bottom and TOPBOT for both top and bottom Face identifies the side s of the wafer to receive the deposit LayerName Parameter choices include the list of layers for the design LayerName identifies the layer to be deposited it is typically set to the same value as Target Thickness Any positive number can be entered for the vertical dimension of the CONFORMAL deposit This thickness is deposited on the side s specified by the Face parameter Sef The Scf parameter is not supported in MEMS Pro Version 3 and therefore it may not be edited Its value is assumed to be 1 0 or c for this release The Sef Sidewall coverage factor is the height of the material deposited on vertical sidewalls divided by the Thickness of the material deposited on horizontal surfaces of a CONFORMAL deposit The material coverage t on walls at intermediate angles depends on the angle of inclination of the sidewall according to the relationship
308. ymbols from the MEMS symbol library 5 Customize the properties of the symbols to meet the design requirements 5 Add stimulus and simulation conditions to the schematic 5 Import the process parameters for MUMPS by adding a include process sp statement to the schematic Examining the test schematics in the memslib sdb file may help illustrate the setting up of simulations using S Edit 5i Export to SPICE netlist and run a T Spice simulation m If the simulation results do not match the design requirements iterate the process of modifying symbol properties and running simulations until the two match Generate layout using the MEMS Layout Palette Verify design Contents Index Note The simulation model for each library element is documented in the schematic view of the symbol The documentation of these models should be examined before use in order to fully understand the behavior of the element and to check for usage information Note that some schematic elements such as the side drive motor must be built from composable elements To simulate these elements you may have to specify some external parameters Review the release notes and the MEMS Application Notes for more information on the library elements and their use Contents Index MEMSLib Reference Accessing the MEMS Library Palette Accessing the MEMS Library Palette To access the MEMS Library Palette select Tools gt Library Palette in MEMS Pro
309. yout view of the initialized design Mv Save and close the tutorial tdb file MEMS Pro User Guide Contents Index 497 You ve successfully initialized your BPR cell BPR has placed the blocks listed in the netlist file The connectivity is displayed as a network of routing guides for pin to pin connections and will update interactively as you move the blocks Contents Index Routing the Design After initialization you can manually or automatically move and connect the blocks in your design to the positions you desire In this tutorial we demonstrate automatic routing of a placed file mems_placed tdb The autorouter can route all the nets in a design or a restricted set of selected nets Assisted manual routing tools are useful for hand routing nets when you need more control over their exact placement for example when you want to reduce parasitic capacitances and resistances around a MEMS sensor and its interface circuitry In this portion of the tutorial you will Define routing layers and via cells set wire widths select keep out and subcircuit recognition layers set the routing pitch and define any excluded signals Use the automatic router to route an entire design Contents Index Block Place and Route Tutorial Routing the Design yw Use File gt Open to open the mems_placed tdb file in the lt install directory gt Examples Bpr subdirectory Maximize the window and press the Home key so the design fills the wi

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