EGWafer User`s Manual - us
Contents
1. 97 4 7 21 SETUP lt gt LOG lt gt Select Setup File Ioj 18 x Quasi37 MDS Setup Files Setup 1 Select Create New Create Copy Add Setup to List Remove Setup From List Delete Setup Change Password Configuration JosT 2002 Slider Level Setup Name D Program FilessIntegral Solutions Int Quasi 37 1 mds Category Quasi9 MDS Setup Files gt Setup 1 Figure 3 2 Quasi97 Setup Selection Dialog User should then select one of the available test scripts or create his or her own After selecting test setup file user can start testing dies on the prober Page 11 EGWafer User s Manual Integral Solutions Int l March 30 2010 3 3 Testing Wafers in Engineering Mode Quasi97 has two modes operator and engineer In engineer mode user can change the test parameters test sequence and all other options Engineer can also run a few parts from the wafer to verify test parameters Operator mode allows user to start running production test or abort it change the log file and select which devices to test from the wafer map To switch between engineering and operator mode user can go to File Operator Log In and in the prompted dialog box type in the password If the password matches with whatever is in tools options then software will go to engineering mode all other passwords will force operator mode The password can be different for each test script and ther2. Mal Align Start Meu Lot Set Die Wafer f Alternatively user can click Handler gt Load Profile and Align in the EGWafer menu Once the wafer is loaded and aligned Quasi97 can start probing dies If the wafer was already loaded on the chuck prior to starting the software then Load Profile and align is not necessary user can go straight to probing sliders If user prefers to load Page 12 EGWafer User s Manual Integral Solutions Int l March 30 2010 profile and align wafer using the prober interface then after alignment user should click EGWafer gt Hander gt Check New Wafer Center Single Slider Mode The simplest mode of operation that does not require setting up the wafer in EGWafer application is the single slider mode This mode can be enabled in EGWafer software e EG Wafer Prober m Wafer Setup Tester Handler Total Selected Move To Die Black 5 _ How E EE CN Use Map for ae Single Slider Mode Test Single Block Broken Bar Figure 3 3 EGWafer Single Slider Mode Here user can move manually to any XY position on the wafer then click START button 1n Quasi97 and run any test Note that Quasi97 does not turn off bias automatically here and user should click STOP button in Quasi97 prior to moving to a different site on the wafer
3. 36 7 1 EMITTED WARRANT tate tastier ae Gade woes Rr cc Od LANE PEE Md Ted oo 36 T2 S hes MS 36 7 3 IPIE 36 7 4 cate ey ed 36 7 5 PENTRE OBIO ATIONS 36 Page 2 EGWafer User s Manual Integral Solutions Int l March 30 2010 1 Introduction This document describes the set up and operation of ISI Wafer Level Analyzer WLA based on Electroglass Horizon 4080 Water Prober In this implementation Quasi97 is the master software controlling the overall test sequence and EGWafer module is the driver that relays commands to the prober telling it when and where to move This manual does not touch the actual tests run on the wafer but focuses on the wafer and die setup and part selection for the test The WLA has two major components the tester rack and the wafer prober The tester rack contains a computer and some test equipment Test equipment can vary depending on the application however in all implementations it will include at least quasi static tester QST 2002E and QPS 1050 power supply Test equipment will be controlled from Quasi97 software Any additional test modules that are installed in the rack are controlled through their respective tests that will
4. GetUserFromRealSTR function should return usrRow and usrCol which are passed by reference EGwafer will call this function and supply Row Col and the name of the block EGWafer name created using block prefixes For example if user row and column start from 1 instead of O then this function could do the following usrRow usrCol Col 1 GetUsrBlockFromReal function should return the name of the block as user wants to see it EGWafer will pass the name of the block created using prefixes then user can parse out that name to figure out which exact block that is and create a different one As an example the user can rearrange row and column number of the block GetHeadSNStr function should return the actual head label that the user wants to use for the die under test EGwafer will supply row number column number and the name of the block egwafer name created using block prefixes User can then create a custom name and return it this will appear on virtually every plot and in the result info For example GetHeadSNStr GetUsrBlockFromReal block amp x amp CStr row 1 amp y amp CStr col 1 Page 27 EGWafer User s Manual Integral Solutions Int l March 30 2010 5 Alignment Procedures 5 1 Changing Probe Card There are several ways to update the probe card position manual and manual cam With manual way user needs to load the wafer and move the reference die under the probes then move on Z
5. User can move the chuck using the joystick on the prober The joystick has 3 modes of operation jog index and scan In addition to this the joystick has a turbo button Pressing that button in conjunction with moving the joystick runs the selected same mode faster To switch between the modes twist the joystick around its vertical axis clockwise or counterclockwise the mode will be displayed in the top right corner of the prober s display The jog mode moves in smallest increments the index mode moves one die size at a time as defined in the Prober s setup the scan mode moves using fixed velocity and stops when the Joystick 1s returned to center position Page 13 EGWafer User s Manual Integral Solutions Int l March 30 2010 Row Column Mode Once the wafer is defined in EGWafer software user can move between sites using Block Row and Column addressing In this mode when user clicks start EGWafer enables as many heads in Quasi97 software as there are columns in the selected row Then user can iterate through the devices by changing the head in the lower right corner of Quasi97 screen water Setup Tester Handler Total Selected Move To Die EX CIEN mn Zoe ee Test Single Block E Figure 3 4 Block Row Column Die Selection The block can be selected from the combo box The row and column can be selected by typing in the row and column numbers and clicking GO button or by us
6. EGWafer User s Manual VAN Integral Solutions Intl Version 2 0 0 March 30 2010 Copyright 2010 Integral Solutions Int l All rights reserved Integral Solutions Int l 3000 Olcott St Santa Clara CA 95054 Phone 408 653 0300 Web http www us isi com Fax 408 653 0309 E mail 1s1 us isi com While every effort has been made to verify the accuracy of the information contained in this publication this publication may contain technical and or typographical errors Please contact Integral Solutions Int to report any errors in this publication EGWafer User s Manual Integral Solutions Int l March 30 2010 Contents 1 INTRODUCTION eec T INR MEI 3 1 1 IREBA TED DOCUMENTATION es A UP DE 4 2 INSTALLATION 5 2 4 5 2D APRI ere ree 5 23 eU 7 3 TESTER BASICS 1 E E EEE E E EE E Poe de e 10 3 1 STARTING PR OBER lah sees 10 3 2 SPAR TING PES TER fi Ote at Ubi 11 3 3 TESTING WAFERS IN ENGINEERING ccceces
7. c d e a b c d a b c d e a b c d Integral Solutions Int l March 30 2010 Turn on the rack Turn on the computer and pull out the monitor tray Ensure the compressed air is ON Raise the test head and remove the protective cover if present on the probe card Keep the test head raised until ready to test Turn on the prober in the back and then in front The prober will turn on the air to the chuck stage and start MS DOS and then pause waiting for user response DO NOT RESPOND UNTIL THE PAD IS REMOVED FROM UNDERNEATH THE FORCER Take the forcer prying tool and insert on the right side of the forcer into specially designated holes Push on the tool to lift one side of the forcer Slide the pad out from underneath the forcer Gently lower the forcer onto the plenum by releasing the prying tool Click any key on the prober s keyboard to let the machine continue startup Once the EGCommander 15 loaded and prompts for it harbor the forcer After the EGCommander software completely go to Commands System Calibration click Walk button Follow prober s prompts to complete system calibration Connect Universal interface through ribbon and two SMB cables to the rack Connect Magnet to the tester rack Connect the microscope camera to the rack Connect front end board power to the rack The rest of the connection will be specific to the application but all the cab
8. Will try to connect to EG prober using the new specified GPIB address Will display the video application s main menu This can be used to mirror the acquired image If enabled will track the current wafer ID block type block row and column and automatically change the log file if those change This option can be used to trim the log file size If the probes are installed on the right side of the magnet then this options should be enabled Such as in the case of FMRA tester Page 26 EGWafer User s Manual Integral Solutions Int l March 30 2010 45 Wafer SN Module The module allows modification of the block and row col numbering scheme such that it matches user s documents The module is written in Visual Basic 6 and is an ActiveX dll with one public interface class The class should have 4 public properties to work with EGWafer Public Sub GetRealFromUserSTR usrRow usrCol col block Public Sub GetUserFromRealSTR usrRow usrCol row col block Public Function GetUsrBlockFromReal block As String Public Function GetHeadSNStr row col block As String GetRealFromUserSTR function should return row and col which are passed by reference EGwafer will call this function and supply usrRow usrCol and the name of the block EGWafer name created using block prefixes For example if user row and column start from 1 instead of then this function could do the following Row usrRow 1 Col usrCol 1
9. motion tool Prete D set Probe card 2 H Mawai Test Start Mss comer Pon Forceer motion tool utilities Buxrcr UM ue Est Start usc Setup Sts flan Align Start Meu Lot Sten Beference Dic Reset Wafer nterunalz fet ET few Lot BA set Wafer mterualt Exin Bea Ima pum emen 9 E on e NEN a T Quick rogload wafer Un 1 inerti 1 ime Ihiinad FTPU A PCard Update Ble Sie X rrofile Wafer Camera Text Y Find Target inmediate operation Diameter Text Probes die x f 1 158 Umm Maler aucrage thickness JE inat i Thickness dewiation 2 017 wafer radius iz ZET amp Direct iin Set Probes to Pada Clean Probes 0 227 mn Is Hofer canter effect to ist Aef Die System Calibration Ramal ly Load Change probe card liy Unlaad Set Probe card 2 WnhlankzBlank Forcer famil motion tool Text Start usse Utilities Burrer UM Stu flan Align Start Mew Lot E Weferenr nic Wat Wafer Interealz f 3 E p H J m Cni nt kin Mide Ak j E E 4 59 Af 4 E Y w x ul w 3 Chick Set t Tip Center Signal Host
10. Uncrate the tester rack a b c d a b e Prepare the prober c d e f e Prepare the rack a b c Remove the front panel off the prober crate Remove the 4 screws on the right side panel holding the monitor rack Remove the rest of the panels from the prober crate Move the prober off the pallet Remove the bubble wrap of the prober s monitor Remove the front panel off the prober crate Unscrew the ramps from the front panel and put them on the pallet Wheel the rack off the pallet Remove shrink wrap from the test equipment Connect the wafer prober to power outlet Connect wafer prober to compressed air and vacuum supplies Remove the tape holding the top access panel and manual tray Remove the tape holding cassette loader cover Remove the bubble wrap from inside the wafer prober wafer handler fork and the chuck Remove the left top panel from the prober and cut the tie wraps holding the chuck but do not remove the pad from underneath the chuck until the prober is on Remove the shrink wrap from the test equipment Plug in the tester rack to power outlet Connect the GPIB cable from the tester rack to IEEE port on the wafer prober NOT the TESTER port Page 5 EGWafer User s Manual e Remove the pad from underneath the chuck e Calibrate the wafer prober e Connect the rack to the test head e Power ON the rest of the equipment on the test rack d b
11. first step for the user 15 to identify the repeating patterns on the wafer The wafer will be separated into grids of X columns and Y rows and each Each die in the grid can be represent another grid on its own Once that is determined user can load the wafer and easly set up the block structure by moving the wafer to various blocks 1 Create a new wafer setup file mdb file 2 Set Wafer Size 3 Load a wafer using the prober then profile and align it 4 Click Handler gt Check new wafer center 5 In Describe Wafer menu click Set Ref Die Offs This will save the distance of the reference die with respect to the wafer center If you change the reference die though the prober you will need to update this 6 Click add under wafer blocks 7 Give the block unique name and unique prefix 8 Set number of columns rows 9 Set the column pitch and row pitch in um The default coordinate system is such that positive direction on X Columns is moving to the right of the wafer Positive direction on Y rows 15 moving towards the bottom of the wafer So if user coordinates are different set the corresponding pitch to negative number 10 Move the wafer such that one of these blocks is under the probe card use microscope camera feed The best thing to do is to move to a corner of the wafer where the position 1s clearly identifiable 1 1 Set Ref Col Die and Ref Row Die this 1s the XY address of the block in the grid 12 Click Calculat
12. if any from the maker thereof of such non Manufacturer made products or components This warranty also does not apply to Products upon which repairs have been effected or attempted by persons other than pursuant to written authorization by Manufacturer 7 3 Exclusive Obligation THIS WARRANTY IS EXCLUSIVE The sole and exclusive obligation of Manufacturer shall be to repair or replace the defective Products in the manner and for the period provided above Manufacturer shall not have any other obligation with respect to the Products or any part thereof whether based on contract tort strict liability or otherwise Under no circumstances whether based on this Limited Warranty or otherwise shall Manufacturer be liable for incidental special or consequential damages 7 4 Other Statements Manufacturer s employees or representatives ORAL OR OTHER WRITTEN STATEMENTS DO NOT CONSTITUTE WARRANTIES shall not be relied upon by Buyer and are not a part of the contract for sale or this limited warranty 7 5 Entire Obligation This Limited Warranty states the entire obligation of Manufacturer with respect to the Products If any part of this Limited Warranty is determined to be void or illegal the remainder shall remain in full force and effect Page 36
13. of the block 15 S 0 5 D 1 1 which is S for the parent block and D for the child block That name would indicate block is located on row O and column 5 within the block structure 5 and on row 1 and column 1 within substructure D TBD Number of blocks dies on X axis in the selected grid Number of blocks dies on Y axis in the selected grid Page 22 EGWafer User s Manual Column Pitch Row Pitch Ref Col Die Ref Row Die Ref Col Pos Ref Row Pos Calculate Ref X and Y Pos Build Wafer Map Floppy Disk Integral Solutions Int l March 30 2010 The distance in um from die 0 0 to die 0 1 The distance in um from die 0 0 to die 1 0 The Die number 1 to Columns which will be used to calculate the X offset of the selected grid from the center of the wafer or from the location of the parent block if parent block exists The Die number 1 to Rows which will be used to calculate the Y offset of the selected grid from the center of the wafer or from the location of the parent block if parent block exists Offset from the center of the wafer in um of the Ref Col Die Offset from the center of the wafer in um of the Ref Row Die Move the wafer such that the reference die of the selected structure is under the probes and click this button to find set Ref Col Pos and Ref Row Pos Use this button to build wafer map only then map becomes useful Also if you change the number of rows or columns in any
14. to until the probes touch the pads and set Z work Manual way is best used if the probe card position was set by manual camera procedure and now needs to be slightly realigned If manual cam procedure never ran it could be a chore to find put the probes on the right die With manual cam mode user needs to define pads on the wafer first then unload the wafer and then run probe card alignment using up facing DPS camera on the prober Manual Probe Card Alignment procedure 1 Load the wafer on the chuck profile and align it 2 Go to EGCommander Commands Set Probes to Pads Quick Commands an set Probes to Pads 3 Select Manual 4 Move the wafer on XY such that the probes land on the right set of pads on the reference die Use the joystick on the prober to do this 5 Then use Z jog up down buttons to move the chuck up to contact Monitor the progress on the microscope camera tester PC Once the probes start scrubbing stop and click Z Work on the wafer prober 6 Click F10 to close the menu and remember XY position of the chuck 7 In EGWafer software click Handler Check new wafer center position Manual Cam Probe Card Alignment procedure 1 Load your target wafer profile and align it 2 In EGCommander go to Product Cntrl Map Pads 3 Delete whatever preexisting pads were there 4 Click Train to train new pads 5 Move the chuck such that the crosshair on the screen is over the first pad Once the crosshai
15. 002 To quad pole magnet 2 pin Female connector for Transverse coils To QPS Splitter Output BNC X field output control To QPS Splitter Output DB9 X QPS communication Page 7 EGWafer User s Manual Integral Solutions Int l March 30 2010 QMS 1050B AC Power To 115 outlet 9 pin round To quad pole magnet 2 pin Male connector for Longitudinal coils BNC To QPS Splitter Output BNC Y field output control DB9 To QPS Splitter Output DB9 Y QPS communication QPS Splitter om USB To computer digital IO DC Power Inlet No Connect Input BNC To QST 2002 Field 1 output Input DB9 To QST 2002 DB9 Output BNC X To QPS 1050 BNC Output DB9 X To QPS 1050 DB9 Output BNC Y To QMS 1050B BNC Output DB9 Y To QMS 1050B DB9 Output BNC Z No Connect Output DB9 Z No Connect Quad pole Magnet 2 pin Female To QPS 1050 9 pin round connector 2 pin Male To QMS 1050B 9 pin round connector 2xBar Gen3 Interface Board Universal Interface 60pin ribbon To QST 2002E 2x SMB To QST 2002E RD OUT and WD IN connection Page 8 EGWafer User s Manual 2x SMB 50 ribbon 40pin ribbon 2x Black SMB ribbon probe card cable Integral Solutions Int l March 30 2010 From universal board to 2xBar G3 board From universal board to 2xBar G3 board 2xBar Gen3 Intermediate board assy 2xBar Gen3 Intermediate Board Assy To the left side of the probe card on the test head Page 9 EGWafer User s Manual
16. Integral Solutions Int l March 30 2010 3 Tester Basics 3 1 Starting Prober The prober should have compressed air and vacuum sources on prior to turning on To turn on the prober click the ON button in the bottom right corner of the prober The MS DOS on the prober will start and prompt operator to click a key to continue loading EGCommander software click spacebar Then the prober will ask Start handler initialization the operator can click F10 on the prober keyboard or select OK on the touchscreen Next the prober will blank the forcer and ask operator to harbor the forcer This is homing sequence where operator should open the front left panel and move the forcer to the front left corner of the plenum At that point operator should close the front left access panel and then click OK and the forcer will energize Then the front panel should be closed and operator should click Verify and the prober will verify that home position is correct by moving the chuck s feducial point under the bridge camera Once the initialization sequence is complete the prober will show Command menu which operator can use to load wafer profile align or to change probe card Before loading the wafer the operator should ensure that correct product file with wafer parameters is open Product file can be selected from Product Select Quick Commands Page 10 EGWafer User s Manual Integral Solutions Int l Ma
17. Oj O O L L O EN gm LI L1 LII LJ DI EI EJ Column Select Row Select nigigigigiWIgigiBiBIia Select All in Block Clear All in Block Reset Wafer Map Apply Map To All Blocks Copy Map Paste Map Figure 3 5 Wafer Die Map There are several options available for the operator e Test Single Block e Test Wafer e Test Cassette These options are located in EGWafer s main menu In case of single block the test will stop after all selected rows and columns on the current block are tested With test wafer option the test will stop after all the blocks are tested on the wafer iol xj Wafer Setup Tester Handler Total Selected Move To Die Black skotna m 2 How E ur gt Col E aoe Use Map for Stepping Single Slider Mode Test Single Black Broken Bar Mode a Test Single Block Test wafer Test Cassete Figure 3 6 Operator Test Mode Lastly with Test Cassette option upon completing testing the wafer the EGWafer software will attempt to load the next wafer from the cassette Once loaded onto the prober the cassette has to be mapped through the EGCommander software Prober s command menu Go Page 15 EGWafer User s Manual Integral Solutions Int l March 30 2010 to Prober gt Cassete Map to do this After the mapping operator can go to View e
18. be added to Quasi97 setup files via ActiveX interface see Add Ins9 Selected Modules in QST 2002 User s manual Further the test rack 1s connected through an array of cables to the front end board s installed on the prober s test head Those in turn are connected to the probe card which makes contact with dies on the wafer The test head can also contain the magnet and the microscope The microscope would have a camera feed going back to the PC inside the tester rack this can be used during testing to monitor where the probes land The second component of the WLA 15 wafer prober The prober is responsible for handling wafers to and from the cassettes or the manual tray loading the wafer onto the chuck measuring the height of the wafer and doing the XY and Theta alignment The prober keeps track of probe card Z and XY coordinates of the reference die on the wafer Prober will also control the wafer temperature if hot chuck option is installed In this implementation the wafer prober is not responsible for stepping to different dies on the wafer running tests scripts or grading The function of stepping to different devices on the wafer lies with EGWafer application that is running on the PC in the tester rack and communicating with the prober via GPIB interface The EGWater application can tell the prober to load the wafer unload it where the prober will do all of the work However once the wafer is on the chuck profiled and aligned t
19. block or number of block structures the wafer map needs to be rebuild Save wafer setup Page 23 EGWafer User s Manual Integral Solutions Int l March 30 2010 4 3 Wafer Die Selection Wafer The wafer map menu should be used to enable disable dies and change their test outcomes On the left side of the menu user can control which blocks to display whether to display die enable or test outcome on the wafer map and helpful commands such as copy and paste On the bottom right the wafer diagram shows the approximate location of the block on the water On the right side of the menu the map 1s displayed ini xi DieSkip 1 TestQutcome 0 WHERE DieCol 4 OR DieCol 5 AMD DieRow 2 SND DieRow8 Die Map for Go Parent Go Child Show D untested Calumn Select Row Select Select Allin Block Clear All in Black Reset Water DN 39 32 Apply To All Blocks Copy Map Paste Map r 4 k Figure 4 5 Wafer Map Menu Block Selection Block Type Tree On the left top there is a tree with all block types defined for this wafer User can hide some of the blocks in the Block combo box but unchecking one or a few of these At least one block type should be enabled in this tree Block combo box This selects what block is shown on the right side of the menu Go Parent Goes to the parent of the block shown on the right Once the parent is displayed the row and colum
20. ceccececccceccecececsceccsceccscuccececescecscscescscesescesescesescs 12 3 4 TESTING WAFERS IN OPERATOR MODE cccsccsceccsceccececcsceccscscscscascscesesceccscecescssescssescscasescesescesecs 15 4 EGWAFER APPLICA LION Cos deoa qoe esee Uc Cos 17 4 1 Yd WEAN Dee or CU DE E UE 18 4 2 WOATEROSETUB A ED MI nS m ORE OT kx NT CE 21 4 3 WAFER DIE SELECTION CW APER i doctr retro Ih EI EX YR sean ERIS voee ta Veo canoes 24 4 4 FESTER OP TON ire tr M EM RM MU e Main ec 26 4 5 WAFERS N BIB 2T 5 ALIGNMENT aea A A eosque EE 28 5 1 CHANGING Oe 28 5 2 CREATING WAFER SETUP ON THE PROBER 32 5 3 CREATING WAFER SETUP IN EGW AFER 33 6 APPENDIX E A A N E E 35 1 BG PROBER GS 35 7 Ree rn
21. d a wafer and try probing Adjust the Z overdrive from EGCommander Prober Tool Points Probe Card Page 31 EGWafer User s Manual Integral Solutions Int l March 30 2010 5 2 Creating Wafer Setup on the Prober Each wafer design requires product file on the prober The prober stores information such as wafer diameter alignment patterns pad shape size and location die pitch and others The following procedure describes the step needed to do this All of the following steps need to be done in the EGCommander software using the Probers input interface 1 2 3 4 5 6 n 8 9 10 11 12 Go to product click Select then type in a new file name and click Save as This will create a new product file In Product Control map change the wafer diameter and the die size In case of really small die sizes it may make more sense to set the die size equivalent to a group or a block of dies Then in EGWafer define finer structure Change the wafer loading angle For this check how the probes are set up on the probe card Load the water Profile the wafer Click Find Target Follow the prompts of the prober to select unique target on the screen If this is not working you may have to go to product 2options and change the Alignment WSSC settings to match your wafer If successful the prober should be able to align the wafer Set the reference die when prompted Since EGWafer software does not us
22. dit cassette and enter the wafer IDs for all the wafers that the system detected During production test in the test cassette option after a single wafer 1s tested an unloaded back to the cassette the wafer map 15 reset ie for all dies that are enabled in the wafer map the test outcome will be changed to untested Note that for any for any option in the operator mode the Single Slider Mode and Broken Bar Mode should be disabled Page 16 EGWafer User s Manual Integral Solutions Int l March 30 2010 4 EGWafer Application The EGWafer module is a standalone application that can be used to tell the Electroglass prober where to move on the wafer probe and unprobe It can also do other miscellaneous operations like loading and aligning the wafer Quasi97 uses EGWafer module as a driver Through ActiveX interface Quasi97 calls functions within EGWafer prober telling it when the test is started completed and when to move to a different die EGWafter on the other hand tells Quasi97 how many devices to and uses the information passed back from Quasi97 to update test outcomes of dies on the map After every slider selection EGWafer module changes the PartID and Head label and Part Reference fields in Quasi97 So each test result logged by Quasi97 can include the PartID wafer serial number the Head Label die name on the wafer per user defined naming convention and Part Reference indicating offset of the part probe from the cen
23. e Ref X and Y Pos 13 If the block is another grid then click Add Child and define the child block Page 33 EGWafer User s Manual Integral Solutions Int l March 30 2010 14 For setting the Ref X and Y Pos of the child block you must stay within the same parent die 15 Continue to set all blocks on the wafer 16 Once finished click Build Water Map 17 Then click the floppy disk button to save the setup 18 Go to Wafer Setup Map and deselect all dies that do not exist on the wafer the wafer is usually round and the grid structure is square so most often you will have to disable some dies 19 Save Wafer setup file Page 34 EGWafer User s Manual Integral Solutions Int l March 30 2010 6 Appendix 6 1 EG Prober GPIB Settings In case the prober settings are lost user can the core GPIB options to necessary for EGWafer application The menus may look different than on the screenshot depending on the version of EGCommander software but enabled options should be present there Figure 6 2 EG Prober GPIB Settings Page 35 EGWafer User s Manual Integral Solutions Int l March 30 2010 7 Limitted Warranty Integral Solutions Int l a California Corporation having its principal place of business at 3000 Olcott St Santa Clara CA 95054 Manufacturer warrants its Quasi Static Tester model QST 2002 products the Products as follows 7 1 Limited Warranty Manufacturer warrants that the Product
24. e is an option to prompt operator login after opening the setup file refer to QST 2002 Users manual for more information User can load the wafer from manual tray or from the cassette then profile and align the wafer using the prober s menus To do this select the command using the touchscreen and click execute A Quick Commands Quick Commands Load wafer On ine Df E 1 ine M d r gt Quick wafer Onl 1 ne rur 4 FCard Uplate P 3 Unions ualer FTO 4 PCard Update E Profile Wafer Text Bie Size X nm i Camera Text Find Target Immediate operation m T imm ind Target Immediate c ud fata fign Test Probes Wafer Diameter fato Align Text Jab o 1 Clean Probes Flat Birect ion Set Probes to Pad ER To es s B ce Mp Caton Sigel E la Set Set Prahe Tip und dimi CE i come fac rr Signa x Aug mmm jue mae euro to Die System Calibration 1k Bot Limit i us m 11 Laad Change probe card Ehe Sterne Buts iy Unna Set Probe card Z Bst Linit Wenn iy Change probe card Umblank Hlank Forcer
25. e reference die numbers it is not important which one would be reference However if you want the Prober s wafer diagram to show which die you are on you may need to adjust the reference die numbering under product Cntrl Map Skip pad detection click escape The pad detection can be done separately as part of the probe card alignment procedure Go to product Select and click Save In the EGWafer software click Handler Check new wafer center position Page 32 EGWafer User s Manual Integral Solutions Int l March 30 2010 5 3 Creating Wafer Setup in EGWafer EGWater is responsible for XY stepping once the wafer is loaded on the chuck Through this software user can select which dies to test so 1 needs to be aware of the die pattern on the wafer Almost all of the steps in this procedure will be done in EGWafer Wafer Setup Describe Wafer Common Settings Wafer Size nn oo Production Orde Rowoto perator Description Binch wafer Mas rj WaferSN App mywafersn clswatersnfinch Remove Set Ref Die Offs o LM Blocks PN Shot Parent Comment Enumerator Prefix 5 Color Columns fi 1 Rows fi 1 Column Pitch 1 6500 Row Pitch 16500 Ref ColDie 5 Ref Col Pos 81043 Ref Row Pos 1 922 Remove Add Add Child Calculate Ref and Y Pos Build Wafer Map Figure 5 1 Creating Wafer Setup EGWafer The
26. e this project modify it and compile Then it can be used in this setting to better orient the wafer map To enable the sample wafer SN app type it waferSN clsWaferSN here This will inquire from the prober the location of the reference die and the location of the center of the wafer and will calculate the offset of the reference die to the center Reference block XY position 15 more stable than wafer center position Any time the wafer is loaded XY position of the reference block will be read from the wafer and used in conjunction with ref die offs to calculate the actual motor position to go to any dies on the wafer col or Col Row this defines whether the rows are incremented first then columns or columns first then rows The wafer map is stored in the mds file under map This selection can help user select different wafer maps on the wafer quickly This defines the hierarchy of blocks on the wafer Note that after adding a new block it is a good idea to give it a meaningful name Block name has to be unique for the wafer and can not be numeric The order the blocks appear here will also have an effect of the order they are tested in production test The name of the block for the easier reference Shows the name of the parent block of the selected item on the block tree User field can be any user comment This is important setting as it will be used to build the name of the block For example the name
27. e user gets to define a single row of dies to be tested With this option the user can select the starting XY position the last XY position and the number of dies Then by selecting different heads in Quasi97 user will be able to go to any one of the dies in the defined row Keeps the EGWafer main menu on top of other menus Page 19 EGWafer User s Manual EGWafer Menues Total Selected Wafer Setup 2 Describe Wafer Wafer Setup 2 Wafer Setup Wafer Setup 2 Wafer Map Tester Options Tester Probe Card Alignment Tester 2 Diagnostics Handler gt Load Profile and Align Handler gt Load Next Wafer Handler gt Unload Handler Check new wafer center Integral Solutions Int l March 30 2010 Calculates how many dies are selected on the wafer map dies that are ON and marked as UNTESTED Displays that information in the status bar of EGWafer main menu Menu to define block structures on the wafer Displays the list of the blocks and their coordinates with respect to the wafer center in a table This can be used for diagnostics none of the changes made in that menu will stay The actual map of the wafer where user can enable disable dies and change die test outcome Tester options are saved in the EGSetup ini file and can be modified through this menu These are general options GPIB address of the prober the name of the video applicat the default wafer setup selection log file options etc This m
28. elected block to 0 Untested Clear All in Block Wij change test outcome for all sliders in the selected block to 2 Tested Passed Grade 1 Reset Wafer Map Resets the test outcomes of all dies that are ON to untested ON XX Shows how many dies in the current block are turned ON and how TestOutcomes YY many have the same test outcome as selected in the Show menu Apply Map To All wil propagate die ON Off selection to all blocks of the same type Blocks In case show option is set to or higher then will propagate die test outcome selection to all blocks of the same type Copy Map Will remember the block for which you made the selection it does not put anything in the clipboard Paste Map Will look up the remembered block and apply the same die ON Off selection to the current selected one If Show option is set to 0 or higher then will copy test outcomes instead SQL Selection This option allows to update the database directly for the currently selected block In some cases this will be faster than selecting dies by clicking them on the map For example the SOL line DieSkip 1 TestOutcome 0 WHERE DieCol 4 OR DieCol 5 AND DieRow gt 2 AND DieRow lt 8 Equates to UPDATE WaferMap SET DieSkip 1 TestOutcome 0 WHERE DieCol 4 OR DieCol 5 AND DieRow gt 2 AND DieRow lt 8 and Block BB User can use standard SQL logic expressions and setting both DieSkip and TestOutcome 15 not necessary These can be set ind
29. enu can be used to change the probe card alignment such as after changing chuck temperature Prober Diagnostics menu This can be used to check probe communication or send some commands to the prober through GPIB interface This command will try to load the wafer from the cassette if the wafer is not already loaded on the chuck Then it will try to profile the wafer on the chuck if the wafer is not already profiled Then it will align the wafer on the chuck if the wafer was not aligned already Lastly EGwafer will read of feducial point XY position of the reference block from the prober If wafer 1s loaded on the chuck then this command will unload the wafer first to the original location in the wafer cassette or manual tray then will load the next wafer from the cassette profile and align it Unloads the wafer from the chuck to its original slot in the cassette or to the manual tray if it was loaded from there The function will read feducial point XY position of the reference block from the prober This may be necessary if operator went through EGCommander to load profile and align the wafer Page 20 EGWafer User s Manual Integral Solutions Int l March 30 2010 4 2 Wafer Setup Water setup is stored in Microsoft access database format in the file with the extension mdb From the main menu user can create a new wafer setup save the current setup under different name or open an existing setup The wafer setup s
30. ependently Page 25 EGWafer User s Manual Integral Solutions Int l March 30 2010 4 4 Tester Options This menu should be used to set global options for all wafer setups w Tester Options GPIB Address 2 Conner Wideo Driver atraxB Driver Show Control Default Wafer Setup File Default ater Map File C Program Files Integral Solutions Int EG Ww afe PreProbe Auto Lag File Change Usel st Offset E very wafer Every Block Type Y Offset 0 Every Block E delay m5 100 Every Row C Every Column Iv Figure 4 6 Tester Options Menu GPIB Address The GPIB address of the prober This must match with whatever is selected on the prober Video Driver The name of the video application that will capture the video feed from the microscope located above the probe card Default is vdmatrox8 driver Default Waf The name of wafer setup file that was last opened When Setup File restarting the software this wafer setup file will be opened automatically Default Wafer Map NOT USED PreProbe If enabled before going to a die this option will force prober to XOffset move to the die X position Xoffset die Yposition Y Offset then YOffset probe and wait for the specified delay This can be used to remove Delay mS the initial charge on the devices if the backplane of the wafer is not grounded Connect Show Control Windows Auto Log File Change Options Use 1
31. he EGWafer application takes over and commands the prober XY positions to move for testing The Wafer Prober and EGWater are the primary topics of this manual Page 3 EGWafer User s Manual Integral Solutions Int l March 30 2010 1 1 Related Documentation Quas d 7 Software Contains detailed description of all menus in Quasi97 software User s Manual along with procedures on how to set up test parameters log data and run the QST in production and engineering modes OST External Modules Description of additional tests provided with the QST and Quasi97 User s Manual software STT MRAM Tests Test algorithms and menus if using the wafer prober for STT Users Manual MRAM memory testing RIA 2006 Users Test algorithms and menus if using ISI inductance measurement Manual equipment FMRA Users Manual Test Algorithms and menus if using ISI FMRA option and high frequency probes Page 4 EGWafer User s Manual 2 Installation 2 1 Requirements Vacuum Source 22inchH 115 tester rack 100 220 VAC prober Water Prober 46 x40 x61 Tester Rack 24 x32 x45 Integral Solutions Int l March 30 2010 Compressed Air supply at least S0psi 3CFM Keyboard tray when opened adds 15 to the depth o Door when opened on the rack adds 21 to the depth 2 2 Arrival Checklist The WLA arrives in two crates one for the prober and one for test equipment rack e Uncrate the prober a b c d e e
32. icking to Quasi97 System System Device Setup 4 By clicking to Quasi97 Peripherals gt EG Wafer The main menu allows basic navigation on the wafer probe unprobe actions as well as gives access to wafer setup wafer map prober diagnostics and others EG Wafer Prober B x Wafer Setup Tester Handler Total Selected Move To Die Block SHOT 1 x MAP mls Fou I _ ait Use Map for E Single Slider Mode Test Single Black M Braken Bakod U Figure 4 3 EGWafer Main Menu Block The list of enabled blocks that are available from the wafer map Only the blocks that do not have any child structures will appear in this list and only the blocks that are enabled on the wafer map The name of the block by default is composed of parent block prefix and X and Y position within the parent grid However by using custom Wafer SN Module user can modify the default block names and the user defined names will appear in this list making selection easier Row Row indicates the Y position of the die within the selected block By default the row number is based and positive row indicates the row closer to the operator However by changing the block row pitch to negative value this will reverse Also by using custom Wafer SN Module through API calls user can supply their row and column numbering Col Column indicates the X position of the die within the selected block By default the column numbe
33. ing the arrow key buttons User can confirm the current location on the wafer by clicking the Video button and looking at the probes through the built in microscope In engineering mode user can select any head and run a single test on it Or if desired user can select Production Test and run it on all the columns in the selected block and row This mode can be useful to check test scripts on several dies before running on the whole wafer or to check repeatability of the results Page 14 EGWafer User s Manual Integral Solutions Int l March 30 2010 3 4 Testing Wafers in Operator Mode In operator mode user can select the dies to test through EGWafer gt Map and then click Quasi97 gt START to commence testing The dies that are turned ON and marked as untested in the EGWafer map will be probed and tested After testing each die it will be marked in the map according to its grade Because of the test outcome 15 recorded after every slider if the test is aborted user can continue from where it left off without doing any changes to the map w Wafer Slider Map Inl x Shot SQL Select DieSkip 1 TestOutcome 0 WHERE DieCol 4 OR DieCol 5 AND DieRow 2 AND DieRow lt 8 Die Map for ED TI ee LI LJ O oO oO L
34. les on the test head should be connected to the test rack Power on QST 2002E QPS 1050 QMS 1050 FMRA RIA and any other test equipment located on the rack Run Quasi97 and open the last setup file on the tester Ensure that no error messages appear during hardware detection If error messages are present check all cable connection or follow troubleshooting guide to fix the problem Lower the test head and realign the probe card using manual camera probe card alignment procedure on the prober Page 6 EGWafer User s Manual Integral Solutions Int l March 30 2010 e Try a sample wafer a Load a wafer profile and align it using probers menu b In EGWafer software enable Single Slider Mode move to one of the devices and run tests on it c Check basic functionality of the tester magnetic field bias pulsing high frequency channel etc 2 3 Connections The following connections are typical for the WLA However your configuration may have additional test modules or not have some QST 2002 USB 14 pin round BNC Field 1 DB9 SMB SMB QPS 1050 3pin AC Power 14 pin round 9 pin round BNC DB9 To computer digital IO To QPS 1050 DC power for QST 2002 To QPS Splitter Input BNC field output control To QPS Splitter Input DB9 QPS communication To RD OUT on universal interface board To WD IN on universal interface board To 115VAC outlet To QST 2002 DC power for QST 2
35. n X and ref row position Y The water map on the right side shows the approximate position of the block on the wafer based on these numbers When defining the new wafer user should click Set Ref Die Offs which will calculate the distance from the reference X and Y block on the wafer to the center of the wafer Rather than using the center of the wafer which tends to move around on the prober after redefining wafer position the prober s reference block XY position is used as a starting point All positions used and reported in the EGWafer software are still center of the wafer based Page 21 EGWafer User s Manual Wafer Size Operator Description Wafer SN App Set Ref Die Offs Production Order Map Add Remove Map Wafer Block Add Remove Add Child Block Definition Block Name Parent Comment Enumerator Prefix Color Columns Rows Integral Solutions Int l March 30 2010 The size of the wafer in mm Used only to scale the block position and size on the wafer diagram Not used on the prober or to calculate any die position The comment for the operator if the file name is not easily recognizable This is user field and is not used by EGWafer software The name of the ActiveX application and class that will convert the block names from EGWafer number scheme to user numbering scheme When EGWeafer is installed it copies WaferSN visual basic project on the target hard drive User can renam
36. n of the current block is selected Go Child Looks up the child block of the one selected in the map on the right Block Enable The enable checkbox shows whether the block is enabled in general Block will be disabled if any one of its parents is disabled Page 24 EGWafer User s Manual Integral Solutions Int l March 30 2010 Die Selection Show Each die has an enable disable flag and test outcome number This Enabled combo box controls what to show on the map The enable disable flag is permanent selection will stay when resetting the map The Faile test outcome is volatile selection which is valid for the currently 2 Passed Grade I wafer but may be reset for the next To change die enable simply click on the checkbox for that die To change test outcome select the corresponding cell in the wafer map and change the test outcome number to new one Column Select If this option is on then after changing the die enable disable or its test outcome all the dies in the column will be updated to have the same value for die enable or test outcome if show option is set to 0 or higher Row Select If this option is on then after changing the die enable disable or its test outcome all the dies in the row will be updated to have the same value for die enable or test outcome if show option is set to 0 or higher Select All In Block wij change test outcome for all sliders in the s
37. ound Note that this command is optional when moving between dies the prober will recognize when its probing If probing the prober will move down to clear the probes first then will move to the target wafer location and move back up to probe Shows the map of the currently selected block In the map menu user can go to parent block or any other block on the wafer and change which dies are ON and the test outcomes Move to different row in the selected block Move to different column in the selected block If enabled then when using UP DOWN and Left Right arrows the prober will skip the sliders that are turned Off in the map Note that the prober can appear to be stuck in one location if none of the rows in the selected column are enabled or columns in the selected row Options for the operator mode in Quasi97 Tell the software whether to run only the selected block the full wafer or all the wafers in the cassettes Note that with any one of these options selected the software will only test dies that are marked enabled and untested If enabled in engineering mode EGWafer application will set the number of heads in Quasi97 to 1 When user would press START or STOP in Quasi97 the software simply will go to probe and unprobe without moving the wafer on XY plane This mode is can be used to manually move the wafer using the joystick on the prober and test that single site Normally not used Similar to single slider mode but th
38. r is 0 based and positive column indicates the position further to the right of the operator However by changing the block col pitch to negative value this will reverse Also by using custom Wafer SN Module through API calls user can supply their row and column numbering GO Just selecting Block Row and Col from the textboxes will not force the prober to move to that location Use the button to actually move to the site selected in Block Row and Col textboxes Page 18 EGWafer User s Manual Video REF 0 0 Zup Zdn Map UP Down Arrows Left Right arrows Use Map for Stepping Test Single Block Test Wafer Test Cassette Single Slider Mode Broken Bar Mode Pushpin Integral Solutions Int l March 30 2010 Button to turn on the video feed from the microscope located directly above the probes Note that the LED intensity is controlled manually from the LED power supply on top of the tester rack This button moves the wafer such that the reference die is under the probes The location of reference die vs the probes is set in the EG Prober and is completely independent of wafer setup in EGWafer software Moves the wafer such that the first die 1n the selected block 1s under the probes row 0 amp column 0 Probe command Move to Z probe position 4 Z overdrive as defined in the prober Unprobe command Moves some distance below the probes such that it is safe to move ar
39. r is aligned click Turbo button on the joystick The EGCommander should say Pad 1 set 6 Continue setting other pads Page 28 EGWafer User s Manual Integral Solutions Int l March 30 2010 7 Once done click F10 to stop 8 Confirm pad selection and size using the prompts from EGCommander 9 Once the pad alignment is done save the product file 10 Unload the wafer 11 Go to EGCommander Commands gt Set Probe Center position 12 Select PTCent option 13 Look on the microscope camera and move the chuck such that the probe card 1s over a flat region of the chuck not the vacuum hole or vacuum ring 14 Click SET XY This is where the next step will find the probe card Z 15 Go to EGCommander Commands Set Probes to Pads 16 Select manual cam Page 29 EGWafer User s Manual Integral Solutions Int l March 30 2010 18 In the next dialog box where the pads are shown click Camera button 19 Move the chuck until you see the tip of the probes on the screen Align the probe tip of the selected pad to the crosshair C Agr SEE 21 Now click Close or F10 to finish Finding other pads is not recommended as it can mistakenly lead the prober to believe that the probe card is at an angle and the prober would try to compensate by rotating the chuck Page 30 EGWafer User s Manual Integral Solutions Int l March 30 2010 22 The probe card alignment is done Loa
40. rch 30 2010 3 2 Starting Tester Each module on the test equipment rack has its own power switch The order in which components are turned ON is not important However it is important to start the Quasi97 software only after all of the required test equipment was turned on and the wafer prober initialized Integral Solutions Int l Quasi 9 Board Mot Detected P Synthesizer Board Mat Detected Filter Mat Detected Filter Not Detected 32 Bit Universal Interface Board Mat Detected F DUT Board Not Detected Version 4 7 21 Fzt Option Not Detected Board Mat Detected Main Board Not Detected E ight 1997 2010 Mother Board Not Detected Warning This computer program is protected by copyright law and international treaties Unauthorized reproduction ar distribution of this program or portion af it result in severe civil and criminal penalties and will be procecuted to the maximum extent possible under lawr eee Figure 3 1 Starting Quasi97 Quasi97 software will detect the installed options and read off the calibration factors from EEPROMs in the QST 2002E Then Quasi97 will start EGWafer driver and prompt for test script selection If EGWafer application does not start then operator needs to select EG Wafer on the Setup Selection dialog When EGWafer starts it will show violet disk icon in the system tray which can be used to invoke its operator menu
41. s sold hereunder will be free from defects in material and workmanship for a period of six 6 months from the date of purchase If the Products do not conform to this Limited Warranty during the warranty period as herein above specified Buyer shall notify Manufacturer in writing of the claimed defects and demonstrate to Manufacturer satisfaction that said defects are covered by this Limited Warranty If the defects are properly reported to Manufacturer within the warranty period and the defects are of such type and nature as to be covered by this warranty Manufacturer shall at its own expense furnish replacement Products or at Manufacturer s option replacement parts for the defective Products Shipping and installation of the replacement Products or replacement parts shall be at Buyer s expense 7 2 Other Limits THE FOREGOING IS IN LIEU OF ALL OTHER WARRANTIES EXPRESS OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Manufacturer does not warrant against damages or defects arising out of improper or abnormal use of handling of the Products against defects or damages arising from improper installation where installation is by persons other than Manufacturer against defects in products or components not manufactured by Manufacturer or against damages resulting from such non Manufacturer made products or components Manufacturer passes on to Buyer the warranty it received
42. ter of the wafer in um Static Tests 1 Hd vets Test Time Date Time__Pat ID __ SpeelDLoUD Fst Code PHa O 10 004 Static Tests T 3 15 2010 125106 nU Figure 4 1 EGWafer Fields in Info When EG Wafer configuration is selected in Quasi97 the module adds a Slider Info test to the Static Tests collection which can supply more information about the die under test Static Tests 1 Hd Grade Cycles Test Time Date Time Part ID 1 1 398 3 15 201 12 48 54 Cycles i Averages 10 Pre Conditioning Write Frequency 25 Small Drive Voice Coil Test Slider Info Insert Item Identification Tests RDX RDY Tests VCC Tests It Point to Point Tests Point to Ground Tests O Remove Item Voice Coil Tests L Results Data Parameters Grades User Row iia X Pos 33957 0 ETT afer Y Po 84422 0 84422 1 TU Tenn Figure 4 2 EGWafer s Slider Info Test Page 17 EGWafer User s Manual Integral Solutions Int l March 30 2010 4 1 Main Menu The EGWafer s main menu will appear first if EGWafer is started on its own If EGWater is started from Quasi97 then its main menu 15 accessible by all of these means 1 By clicking the purple 1 4 disk icon in the system tray 2 By clicking to Quasi97 File Device Setup 3 By cl
43. tores the meta information about the wafer all the structure definition and the actual wafer maps The first menu user should access to define the wafer 15 Describe Wafer In this menu user can set the wafer size the production test order and the information about wafer blocks Common Settings Wafer Size 200 Production Order Operator Description inch wafer 1 gl Water SM App mswafersn clewafersntinch Add Map Remove Set Ref Die Offs Water Blacks Block Mame Shot Shot Parent Comment Enumerator Prefix 5 Color lo Select Columns 1 1 Column Pitch 6500 Row Fitch 6500 Ref Col Die 10 Ref Row Die P Ref Cal Pos 8 043 Hef Haw Pas 1 922 Remove Add Add Child Calculate Ref Pos Build Water Figure 4 4 Describe Wafer In EGWafer software all die stepping 15 build on the blocks The block a 2 dimensional array of dies in which dies are spaced using a single row and column pitch Each block can have child blocks or another grid of dies with fixed row and column spacing Only the blocks that have no child blocks as defined in this menu will be used for testing User can have more than one block structure at any level of the hierarchy and blocks with 1 row and 1 column are allowed by the software Each block structure can be anchored to a location on the wafer by specifying the reference Col die row die ref col positio
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