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MK71050-03 Evaluation Kit Hardware Manual
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2. dispose them properly with a industry waste company e Prohibition Regarding Intellectual Property LAPIS Semiconductor prohibits the purchaser of the Products to exercise or use the intellectual property rights industrial property rights or any other rights that either belong to or are controlled by LAPIS Semiconductor other than the right to use sell or dispose of the Products PEXK 71050 03 USB EK HardManual 01 11 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual e The other precautions 1 Please use the Products in accordance with any applicable environmental laws and regulations such as the RoHS Directive For more details including RoHS compatibility please contact a ROHM sales office LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non compliance with any applicable laws or regulations 2 When providing our Products and technologies contained in the Specification to other countries you must abide by the procedures and provisions stipulated in all applicable export laws and regulations including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act Copyright 2015 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd 2 4 8 Shinyokohama Kouhoku ku Yokohama 222 8575 Japan http www lapis semi com en PEXK 71050 03 USB EK HardManual 01 111 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware
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4. outdoors where the Products are exposed to direct sunlight or in dusty places c Use in places where the Products are exposed to sea winds or corrosive gases including CL HBS NH SO and NO d Use in places where the rPoducts are exposed to static electricity or electromagnetic waves e Use in environment subject to strong vibration and impact f Use in proximity to heat producing components plastic cords or other flammable items g Use involving sealing or coating the Products with resin or other coating materials h Use of the Products in places subject to dew condensation 5 The Products might receive the radio wave interference from electronic devices such as Wireless LAN devices Bluetooth devices digital cordless telephone microwave oven and so on that radiate electromagnetic wave 6 The Products are not radiation resistant 7 Verification and confirmation of performance characteristics of Products after on board mounting is advised 8 Confirm that operation temperature is within the specified range described in the Specification PEXK 71050 03 USB EK HardManual 01 1 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual 9 Although LAPIS Semiconductor is continuously working to improve product reliability and quality semiconductors can break down and malfunction due to various factors Therefore 1f product malfunctions may result in serious damage including that to human life sufficient fail
5. safe measures must be taken including the following a Installation of protection circuits or other protective devices to improve system safety b Installation of redundant circuits in the case of single circuit failure 10 Failure induced under deviant condition from what defined in the Specification can not be guaranteed 11 This product is a specification to radiate the radio wave It is necessary to acquire the attestation of decided Radio Law of each region used to use the equipment that radiates the radio wave Please inquire about the attestation of Radio Law that this product acquires 12 When product safety related problems arises please immediately inform to LAPIS Semiconductor and consider technical counter measure ePrecautions for Reference Circuits 1 If change is made to the constant of an external circuit allow a sufficient margin due to variations of the characteristics of the Products and external components including transient characteristics as well as static characteristics 2 The reference circuit examples their constants and other types of information contained herein are applicable only when the Products are used in accordance with standard methods Therefore if mass production is intended sufficient consideration to external conditions must be made e Precaution for Electrostatic This product is Electrostatic sensitive product which may be damaged due to Electrostatic discharge Please take proper ca
6. Manual Preface This document outlines the hardware of MK71050 03 evaluation k1t MK71050 03USB EK which enables 2 4 GHz band radio communication conforming to Bluetooth LE on Windows PC via USB The following related documents are available for reference MK71050 03 Data Sheet ML7105 Data Sheet ML7105 User s Manual Bluetooth Application Controller Interface BACI Command Manual BLE Evaluation Kit AT Command VSSPP2 Edition Reference Manual BLE TOOL User s Manual BLE Evaluation Kit Setting Utility VSSPP2 AT Command Edition Operation Manual Bluetooth is a registered trademark of Bluetooth SIG Inc eAll other company and product names are the trademarks or registered trademarks of the respective companies PEXK 71050 03 USB EK HardManual 01 IV LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual Table of Contents Era tt ts A SS erry meron oa IV Elo Ore OMNE a N E E N E dade bla a cide A danse dutt dane lad cee E N V Ta MKL1050 039USB EK OVCRVIOW enee telen N a a a eege 1 A ee EE 2 25k System ee Te EE 2 2 2 Contiguration of MK71050 03 U5SB DONO EE 3 Si BE ar e is 4 31 Geen ere O UE EE 4 A A A eee ee nee 5 Al MKF 1050 03 Evaluation dee TEE 5 A2 USB CONVE AI Cl na EA A a ae ata ed eed Agee tae hd Sade vain Eloi T REVISO lee EE 8 PEXK 71050 03 USB EK HardManual 01 v LAPIS Semiconductor Co Ltd MK71050 03USB EK Hardware Manual 1 MK71050 03USB EK Overview 1 MK71050 03USB EK O
7. ROHM GROUP FEXK71050 03 USB EK HardManual 01 LAPIS SEMICONDUCTOR MK71050 03 Evaluation Kit MK71050 03USB EK Hardware Manual Initial Release Official June 11 2015 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual Precautions for the Specification 1 Contents of the Specification are the information at the time of their issuance The information contained herein is subject to change without notice 2 LAPIS Semiconductor has used reasonable care in preparing the information included in the Specification but LAPIS Semiconductor does not warrant that such information is error free LAPIS Semiconductor assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein 3 The technical information specified herein is intended only to show the typical functions of the Products and examples of application circuits for the Products No license expressly or implied 1s granted hereby under any intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this document therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute concerning such rights owned by third parties arising out of the use of such technical information 4 The Specification contains information related to the LAPIS Semiconductor s copyright and technical know how Any use of
8. h BtoB connector plug by Molex USB conversion board 6 0 5 mm pitch BtoB connector receptacle by Molex 7 Reset switch 8 USB UART USB serial conversion IC by FTDI 9 PCB pattern for USB connector A PEXK 71050 03 USB EK HardManual 01 3 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual 3 User Interface 3 User Interface 3 1 Connection of uEASE uEASE is an incircuit emulator ICE module for the U8 microcontroller ML610Q482 implemented on the MK71050 03 evaluation module Connect the MK71050 03 evaluation module with uEASE as shown in the following figure Because the pin pitch of the uEASE connector is different from that of the uEASE cable the uEASE pitch conversion board is necessary Position of pin 1 ki Connector direction mark q Position of pin 1 Figure 3 1 Connection of MK71050 03 Evaluation Module and uEASE The uEASE module enables the following functions O Writing an application code to the flash memory included in ML610Q482 O On chip debug function reset step run break point etc A sample application for VSP software is written at shipment For details of the debug function see the manuals ofuEASE PEXK71050 03 USB EK HardManual 01 4 LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual 4 Circuit Diagram 4 Circuit Diagram 4 1 MK71050 03 Evaluation Module See the next page FEXK 71050 03 USB EK HardManual 01 Lem 3 E 2o
9. it Setting Utility VSSPP2 AT Command Edition Operation Manual Central Peripheral USB Dongle la mx71050 USB 3 Terminal Wireless Conversion j Software Module Board BLE TOOL Bluetooth Low Energy Slave Figure 2 1 Example 1 of System Configuration with MK71050 03USB EK Central USB Dongle eines seen Terminal SO o USB MK71050 Conversion Wireless Board Module P eeeeeeeeeesgeeeeeeeeee e eeeeeeeeeeeeeeee ee ee Bluetooth Low Energy Master Peripheral USB Dongle Mx71050 USB Terminal Wireless Conversion Module Board Software Bluetooth Low Energy Slave oe Figure 2 2 Example 2 of System Configuration with MK71050 03USB EK Note The configuration example 2 requires two kits of MK71050 03USB EK PEXK 71050 03 USB EK HardManual 01 Z LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual 2 Configuration 2 2 Configuration of MK71050 03 USB Dongle Figure 2 2 shows the appearance of MK71050 03 USB dongle and Table 2 1 shows its configuration Bottom 1 2 ssa 5 i a OTT Figure 2 2 Appearance of MK71050 03 USB Dongle Table 2 1 Configuration of MK71050 03 USB Dongle No Description MK71050 03 evaluation module 1 U1 Bluetooth LE radio communication module 2 B3U 3000P M MK71050 03 reset switch 3 U8 microcontroller 4 Connector port for uEASE pitch conversion board 5 0 5 mm pitc
10. them other than pertaining to the usage of appropriate products is not permitted Further the Specification in part or in whole may not be reprinted or reproduced and disclosed to third parties without prior consent of LAPIS Semiconductor Precautions for the Products ePrecautions for Safety 1 The Products are designed and produced for application in ordinary electronic equipment AV equipment OA equipment telecommunication equipment home appliances amusement equipment etc 2 For use of our Products in applications requiring a high degree of reliability as exemplified below please contact and consult with a LAPIS Semiconductor representative transportation equipment i e cars ships trains primary communication equipment traffic lights fire crime prevention safety equipment medical systems servers solar cells and power transmission systems 3 Do not use our Products in applications requiring extremely high reliability such as aerospace equipment nuclear power control systems and submarine repeaters 4 The Products are designed for use in a standard environment and not in any special environments Application of the Products in a special environment can deteriorate product performance Accordingly verification and confirmation of product performance prior to use is recommended if used under the following conditions a Use in various types of liquid including water oils chemicals and organic solvents b Use
11. ution during manufacturing and storing so that voltage exceeding Product maximum rating won t be applied to the Products Please take special care under dry condition Grounding of human body equipment solder iron isolation from charged objects setting of Ionizer friction prevention and temperature humidity control etc e Precautions for Storage Transportation 1 Product performance and connector mating may deteriorate if the Products are stored in the following places a Where the Products are exposed to sea winds or corrosive gases including Cl H S NH3 SO and NO b Where the temperature or humidity exceeds those recommended by LAPIS Semiconductor Temperature 5 C to 40 C Humidity 40 to 60 c Storage in direct sunshine or condensation d Storage in high Electrostatic 2 Even under LAPIS Semiconductor recommended storage condition connector mating mountability and heat resistance of products over 1 year old may be degraded 3 Store transport cartons in the correct direction which is indicated on a carton as a symbol otherwise bent leads may occur due to excessive stress applied when dropping of a carton e Precaution for Product Label QR code printed on LAPIS Semiconductor product label is only for internal use and please do not use at customer site It might contain internal products information that is inconsistent with product information e Precaution for Disposition When disposing Products please
12. verview When you recetve MK71050 03USB EK make sure that all of the following components are included in the kit Should there be any missing or broken part contact our sales representative Contents Quantity MK71050 03 USB dongle 4 MK71050 03 evaluation module USB conversion board UEASE pitch conversion board MK71050 03USB EK configuration MK71050 03 USB dongle ROHM GROUP E SEMICONDUCTOR e OTTO gek HUTT fer me Po y MK71050 03 evaluation module gt es USB conversion board A 1 Been UEASE pitch conversion board Figure 1 1 MK71050 03USB EK PEXK 71050 03 USB EK HardManual 01 l LAPIS Semiconductor Co Utd MK71050 03USB EK Hardware Manual 2 Configuration 2 Configuration 2 1 System Configuration MK71050 03 USB dongle can operate as Central Master or Peripheral Salve for the Bluetooth LE connection With the LAPIS VSSPP software it supports the following functions in addition to a simple communication between PCs OMaster slave switching OUp to five pairings OCommunication with smartphones with Android 4 3 or later OConnection to iPhone beacon application with Beacon operation The online shopping only new GUI PC can easily change various parameters of BLE VSSPP Vender Specific Serial Port Profile See the following related manuals for details E BLE Evaluation Kit AT Command VSSPP2 Edition Reference Manual BLE TOOL User s Manual BLE Evaluation K
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