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1. New Creates a new film Delete Deletes the currently selected film from the database A film cannot be deleted if itis used in ANY process To delete a film you must first delete the film from each process where it is used Copy Creates a duplicate of the currently selected film The function of each Edit Films tab and its associated controls are identical to those detailed in the Edit Processes section Please consult Section 3 4 1 for that information 3 21 Chapter 3 SQS 242 Software 3 4 3 Edit Materials The Edit Material dialog box provides the functions needed to build a materials database In addition to the functions listed below the main screen SoftKeys provide capabilities to add edit delete materials Note See the Appendix for a list of standard Material Density and Z Factor ef Material wl Rename New Delete Material Density Z Factor gm cc Rename Edits the name of the selected material New Creates a new material Delete Deletes the currently selected material from the database A material cannot be deleted if it is used in ANY process To delete a material you must first delete each film where it is used Material Selects a material to edit Density Sets the density for this material Material density has a significant impact on deposition calculations Z Factor Sets the Z factor a measure of a material s effect on quartz crystal frequency change Z factor has no effect on measurement
2. Conditioning 2 Quick Start Select the Condition tab and the Silver Sample layer Set each parameter to the values shown below Layer RateRamps Deposit Condition Source Sensor Errors Layer N ps Hep 2 E Pre Condition Rampl Pwr 25 00 Ramp Time Sec Soak1 Time Sec Ramp 2 Pwr 7 55 00 Auto Ramp2 Time Ser Soak2 Time Sec Post Condition Feed Power 25 Ramp Time Ramp Time Save Edits Start Process Click Close Form or press the first SoftKey to save this two layer codeposition process Answer Yes if it displays the Do you want to change message box to make this the current process Press the START SIMULATE SoftKey to start the first layer preconditioning phases Note that two outputs are displayed for this codeposition layer Preconditioning of the two materials is entirely independent If the preconditioning of one layer takes longer than the other the start times are adjusted so that the end times coincide When preconditioning ends codeposition of the two materials begins 2 15 Chapter 2 Quick Start Your response should be similar to the graph shown below your vertical scale may be slightly different The slight ringing on the waveforms indicates some further tuning may be desired However this is an example of a reasonably well tuned loop ERA At 400k thickness the Silver Sample deposition rate ramps d
3. Physscal helen fice Control Hamme Sensore Dis Output Rate TEE pee fal feme al EF 7 m a m nag None Sensor A rione rione a Name A meaningful name assigned to each sensor For clear display keep the name to less than 8 characters Physical Sensor Up to six SQM 242 cards physical sensors 1 to 24 may be installed in a computer However the SQS 242 software can display a maximum of 8 sensors simultaneously Use this dropdown to assign a physical sensor to a display sensor Dual Indicates that a pair of sensors is set up as primary secondary duals When a primary sensor fails the SQS 242 switches to the secondary sensor Monitor Output Select the output that each sensor is positioned to measure The rate and thickness displayed by the sensor will be calculated based on the material assigned to the selected output Control Checkboxes Click Rate to assign the sensor to the PID rate control loop for the assigned output during deposition Click Thk to use the sensor for Thickness endpoint detection Typically you will check both boxes so that the sensor controls to rate setpoint and detects the thickness endpoint If multiple sensors are assigned to control the same output the sensor readings are averaged when calculating rate and thickness Uncheck both boxes to have a sensor monitor an output without controlling deposition rate or stopping when final thickness is reached 3 25 Chapter
4. Query Command Format lt command gt lt param1 gt lt paramn gt lt Chksum gt lt CR gt Example Software Version Query QU 11 44 lt CR gt where Message start character Separator Query Utility command Separator Parameter 11 SID242 Software Version Separator Checksum see section that follows on checksums Carriage Return ASCII 13 Example Response to Software Version Query QU lt ACQ gt 2 1 6 lt CR gt Response to Software Version query where QU lt ACQ gt 2 1 6 0C CR Query Acknowledged ASCII 06 Message Software Version Separator Checksum actual checksum varies with different versions Carriage Return ASCII 13 6 3 Chapter 6 Computer Interface Update Command Format lt command gt lt param1 paramn data Chksum CR Example Set Process Update UP 11 MyProcess 44 lt CR gt where UP Update Process command Separator 01 Parameter 01 Set Process Separator MyProcess Data S Separator Checksum CR Carriage Return ASCII 13 Example Response Set Process Update Succeeded UP lt ACQ gt lt CR gt Example Response Set Process Update Failed UP lt NAK gt lt ERR gt lt CR gt Where 01 Illegal Command 02 Illegal Parameter 03 Illegal Format 04 Checksum Error 05 Request Denied 06 Unknown Error 6 4 Chapter 6 Computer Interface Checksum Calculation The sample code below calculates t
5. The SID 242 uses an inexpensive PLC to provide digital VO capabilities The I O tab assigns deposition events i e open shutter start deposit final thickness etc to the physical relays and inputs on the PLC Note Omron CPM series PLCs number relays from 10 00 to 10 07 then 11 00 to 11 07 These correspond to Relays 1 to 16 on the I O tab Similarly inputs 0 00 to 0 11 on the Omron PLC correspond to inputs 1 to 12 on this screen ER Goes tem Setup Faneme new Dee Ge Gass Sensor Analog Indears VO Cards Comm Relay Events Input Events Proteas Fa nig Sien Process T fw Relm 1 C Beleeg fw Input C input C Paley 2 Aeley 10 Input 2 input C Pale 3 Paley 17 Input 3 t Input 8 Paley 4 C Raley 12 i Input 4 dnputiD f Ralay 5 Fale 13 f Inputs C Mput 11 t Relay E Aeley 14 f Input 6 input 12 e Dale 7 t EE ET Falay E Raley 16 Par Address Test Comm p li Sei eer cewa SEDOE 2 2 CPMI 2 Relay Events The relay events dropdown box lists the deposition events that can cause a relay output to be activated To assign a deposition event to a relay click the Relay then select the desired event from the dropdown box As you click each Relayst the dropdown will change to show its currently assigned event A description of each relay output event follows Source Shutter 1 to 6 These relays control the Shutter that covers your deposition source At the beginning
6. tab This tab establishes the gain P Deposition Term time constant Term and dead time D Term for your process Set these values to 55 7 and 0 respectively Lever BamFarnps Depos Condition Source Sensor Errore Loop Shutter Delay Dote Sampling P Tarm Enabled IS Continous IT Accu ACCUNICy 10 00 em recy efec MEI 0 d Sr S Sec C Time Dazed D Tarm Watt Hold Semple Hold ac mar ac Be sure Shutter Delay Enabled is not selected Select Continuous for Rate Sampling Chapter 2 Edit Pre Post Conditioning Edit Source Sensor Quick Start Before deposition begins the source material is often brought to a ready state by slowly raising the evaporation source power Select the Condition tab and set each parameter to the values shown below Layer RateRamps Deposit Condition Source Sensar Errors Pre Condition Poet Condition Rampi Fer Fe Pear Feed Powar Idle Powar m Ki Ki Auto Se Rampl Time Ramps Tiria Ramp Time Fiera Time 5 00 ET 0 00 0 00 Sec Sec Sec Sec Saski Time Soak Time Feed Time Sec Sec Sec Select the Source Sensor tab Select the proper material for this film Gold Set the maximum power and slew rate that should be used for the selected material Sensor Tooling adjusts for differences in the substrate deposition and that measured by each sensor Select 100 for now Layer BeieFiemps Deposi Condition Source Sensor Enos Source
7. thickness to 1kA This can be useful for low rate applications but annoying for moderate rates The SQM 242 card resolution for PID control is unchanged 3 38 Chapter 3 3 6 Software Specifications Display Rate Hamps ee Sensors DU EES Layer Parameters SetPoiNE EE ee ee ee ee ee ee ee ee al UR Te Time e LEE Thickness Endbomt ee ee see ees ee ee ee ee ee ee ee EE naaa aaa Source Indexers ccooccccccccccnncccnoncconacinonacinonacinnnas Layer ndexvers ese ee ee e Rate Ramp Bn EE Rate Ramp TITIO aue n or ao bo EE ee New Rate sesse eike ee se ee neta ee Ge se rra Film Parameters Ramp Time EE RA EG tue cee Soak Power 1 OE OE OE ME D Wu Soak MIME 1 2 EER EE Ee et EM Shutter Delay Time EEN Shutter Delay Era ior hrs Lain mU SQS 242 Software Rate Deviation Power Rate Dev Thick Power 12 characters Unlimited Unlimited Unlimited Unlimited 1 to 8 4 Dual 1to6 Any defined 1to6 Sensor s Timed Power Analog Input 0 00 to 999 99 A sec 0 00 to 100 0096 Power 0 00 to10 00 VDC 0 0 to 999 9 kA 0 to 30000 sec 0 0 to 999 9 kA Auto Manual 6 Index 1 16 3 Index 1 16 0 0 to 999 9 kA 0 to 1000 sec 0 00 to 999 99 A sec 12 characters 0 to 30000 sec 0 0 to 100 0 O to 30000 sec 0 to 200 sec 0 0 to 30 0 96 1 to 9999 0 to 999 9 sec 0 to 99 9 sec Ignore Stop Hold 3 39 Chapter 3 SQS 242 Software Gontrol EMOS t e tte od aba ta p d abl dus 0 to 30
8. Creates a new process Since every process must have at least one film the first film of the currently selected process is used Delete Deletes the selected process from the database There is no undelete Copy Creates a duplicate of the currently selected process N Process Edit Sample Save Rename Delete Copy Layer Out Film SetPt Thickness Time Gold Sample 10 Cut Layer Silver Sample 15 a Gold Sample E Copy Layer Paste Layer Paste CoDep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold Sample Output 1 Sensor s SetPt Final Thick Time EndPt Thk EndPt System Setup 10 00 0 500 ma 0 00 E 000 Default Afs KA Auto Start indexers C Continuous Source Substrate Userl User2 CT EGIT None None None None Index Index Index Index z Layers List To select a process layer click on it in the Layers list Chapter 3 SQS 242 Software Cut Copy Paste the selected layer as described below Cut Layer Removes the selected layer from the process and places the layer on the clipboard Copy Layer Places the layer selected in the Layers list box on the clipboard without removing it from the process Paste Layer Inserts the clipboard layer above the currently selected layer in the Layers list box Existing layers are shifted down Paste CoDep Pastes the clipboard layer as a CoDeposition layer at the currentl
9. Liep Silver Sample 15 Gold Sample Pre Condition Post Condition Ramp Pwr Ramp2 Pwr Feed Power Idle Power SE Auto Rampl Time Ramp2 Time Ramp Time Ramp Time Sec Sec Sec Sec Soak1 Time Soak2 Time Feed Time Sec Sec Sec Ramp 1 Ramp power sets the power level that is desired at the end of the ramp phase in of full scale Ramp time sets the time to ramp with a linear rate from the initial power to the Ramp power Soak time sets the time the output remains at the ramp power level Ramp 2 Ramp 2 functions are the same as Ramp 1 Typically Ramp 2 power is set near the power level required to match the desired initial deposition rate Selecting the Ramp2 Power Auto checkbox stores the power over the last few seconds of the deposit phase for this film That value is used as the Ramp2 power for the next run of the selected film Feed The feed phase begins immediately after deposition is complete It holds output power at the level and time required to wire feed new material Idle The Idle phase follows the Feed phase 3 15 Chapter 3 SQS 242 Software Source Sensor Tab The Source Sensor tab controls the physical setup of the deposition system ZW process Fat y x Sample Seve D Rename ed Delete Cop Lear Cut Film Salt Thicknass Time Gold Sample 10 Cut 1 2 Bike Sempe 15 0 5 n outse ba 2 1 Gold Sample 10 1 5 Layer ReieFiames Deposit Condition Souc
10. and frequency readings Unlike the main screen s Film Readings this display is the raw data coming from each sensor In addition the output i e PID control loop that each sensor is assigned to is displayed Sensor assignments are established on the Sensor tab of System dialog box A P in the Control column indicates the sensor is the primary sensor of a dual sensor pair S indicates a secondary sensor An R in the Control column indicates that the sensor is being used only for rate control A T indicates the sensor is used only for Final Thickness endpoint detection An M indicates the sensor is being used to monitor but not control the output These options are selected on the Sensor tab of System dialog box Note The Sensor Readings dialog box can be sized to also show SAM 242 card analog input readings and digital VO information The digital VO information is useful for troubleshooting VO problems during setup Rate Graph Fixes the main graph to deposition rate Deposition rate is useful during the shutter delay rate ramp and deposition phases During other phases the power output graph is usually more useful Deviation Graph Fixes the main graph to display percent deviation from the rate setpoint Rate deviation is useful for fine tuning the PID control loop Power Graph Fixes the main graph to output power Output power is directly adjusted during the PreConditioning feed and hold phases Output power is also useful
11. used TouchPad On the SID 242 a TouchPad is located below the setting knob The TouchPad serves the same function as a normal mouse Use the TouchPad or mouse to access the menus and for functions not available from the six function keys 3 4 Chapter 3 SQS 242 Software 3 3 File Menu Note The current process must be stopped for the File menu to be available 3 3 1 File Process Used to select a process from a list of all processes in the current database If the process selected is different than the current process you are prompted to confirm the change 3 3 2 File Open and Save Database Open Database Selects a process database to be used for deposition Remember a single process database may contain an unlimited number of processes films and materials Open Database File File name SID142 mdb Files of type Database files mdb Cancel LZ Note A read only demo database VER DEMO MDB is included with each release To use this database use Windows Explorer to make a copy then right click the new file and uncheck the read only property Save Database As Saves the current process database to disk under a different name This is useful for saving the process database to floppy disk for backup or for making trial changes without affecting your working database Process databases are saved in Microsoft Access format Once again a pop up keyboard may appear If you want to browse ju
12. 1 12 Indexer Done 0 Not Done Bit 1 is Layer Indexer 2 Bit 2 is Layer Indexer 3 5 5 Chapter 5 Digital VO 5 6 Chapter 6 Computer Interface 6 0 Introduction The computer interface capabilities of the SQS 242 program allow operation from an external computer via Ethernet or RS 232 serial communications and a simple ASCII command set Programs running on the same computer can also control the SQS 242 program using ActiveX and the same ASCII command set Parameters may be read Query commands while the process is running but can only be changed Update commands while the process is stopped Changes to the structure of a process e g add or delete layers are not allowed from the computer interface 6 1 Serial Interface Connect a serial cable from the SID 242 serial port to a computer serial port The cable required is a DB9 female to female with pins 2 and 3 crossed commonly referred to as a null modem cable In the SQS 242 program select the Edit System menu then the Comm tab Set the Comm Port to match the serial port the cable is connected to on the SID 242 Set the baud rate to match the baud rate of the host computer that will be connected to the SID 242 Communications format is No Parity 8 bits 1 stop bit 6 2 Ethernet Interface Connect a cable from the Ethernet card to your Ethernet network In the SQS 242 program select the Edit System menu then the Comm tab Set the Ethernet Port to 1001 and the Etherne
13. SOM242 Mode 0 1 03 SQM242 Period 04 SQM242 Filter 06 Front Panel Enabled 0 1 07 Application Visible 0 1 08 Full Scale Output Index 1 to 6 14 Application On Top 0 1 Query Measurement QM lt param1 gt in Output n Power n 1 to 6 2n Output n Rate 3n Output n Thickness An Output n Deviation 5n Sensor n Rate n 1 to 8 6n Sensor n Thickness 7n Sensor n Freguency 8n Sensor n Life 9n Analog Input n Voltage Query Register QR lt param1 gt 0 Layer Phase Register 1 Sensor Output Register 2 Analog Output Register 20 Source Index Register 21 Source Index Done Register 22 Relay Register 24 Input Register 25 Layer Index Register 26 Layer Index Done Register 6 10 Chapter 6 Computer Interface 6 11 A Material Parameters Appendix Material Density ZFactor Material Density ZFactor Aluminum 2 73 1 08 Magnesium Fluoride 3 1 Aluminum Oxide 3 97 1 Manganese 7 2 0 377 Antimony 6 62 0 768 Manganese Sulfide 3 99 0 94 Arsenic 5 73 0 966 Mercury 13 46 0 74 Barium 3 5 2 1 Molybdenum 10 2 0 257 Beryllium 1 85 0 543 Neodymium Fluoride 6 506 1 Bismuth 9 8 0 79 Neodymium Oxide 7 24 1 Bismuth Oxide 8 9 1 Nickel 8 91 0 331 Boron 2 54 0 389 Niobium 8 57 0 493 Cadmium 8 64 0 682 Niobium Oxide 4 47 1 Cadmium Selenium 5 81 1 Palladium 12 0 357 Cadmium Sulfide 4
14. The PID and Shutter Delay controls operate the same as a Sensor input Rate sampling is not possible for analog inputs Condition Tab Conditioning is identical to that of a Sensor input with one significant exception Source Sensor Tab Only Max Power and Slew Rate are functional Errors Only Control Error applies The Analog Input s measured value converted to the defined units and deviation from setpoint are shown below the graph The analog input values are NOT shown on the normal Rate graph the values could lead to poor rate resolution on the graph Instead the analog input voltages are shown on the View Analog graph Volts are displayed on this graph rather than the scaled units again to maintain adequate graph resolution 3 20 Chapter 3 SQS 242 Software 3 4 2 Edit Films The Edit Films dialog box allows you to rename delete and copy films The functions in the tabbed control are identical to those for this film on the Edit Processes dialog Note Edits to a Film will affect all processes and layers that use that film GE El Gold Sample se ce Deposit Condition Source Sensor Errors Loop Shuar Daley Raie Sampling P Term I Enabled i Continonus Accuracy Term Accuracy de Based sed Ser 56 C Time Based D Term TimeChut Sample Hold Bec Sec Sec Sec Film A dropdown box that selects the film parameters displayed in the edit film dialog box Rename Edits the name of the selected film
15. bieserimi M Power Slow Date Se Se Sensor Tooling 2 Senacor T Barnanr Z Eananr3 Seraor4 100 oo Sensor amp Sensor Sensor Sensor bl Chapter 2 Quick Start Edit Select the Errors tab to control the actions taken when a Errors sensor or deposition control error occurs You can elect to ignore errors unlikely stop deposition for this layer or continue deposition at a fixed power level Select Stop Layer for this example Until a process is well established it is best to enable only the Crystal Fail error checking Uncheck the remaining error conditions Leyes FisteRiamps Deposi Condition Source Sensor Errors Dn Error ignore amp Stop Lever Timed Power Control Ergo Create Fail Crsente Ouality Crystal Sail Enabled Enabled Enabled Enabled Counts n Single Hz Tra et Counts Total Hz Save Edits Select the Close Form SoftKey to save this one layer process If you are prompted Do you want to change answer Yes to make this the current process Your new single layer process is now the active process in the main window Notice the process layer and time information above the graph Chapter 2 Quick Start 2 5 Single Layer Process Simulation If you have followed this chapter you are ready to simulate a deposition process First take a look at the information provided on the main screen Process Layer Phase Film s Name Number Name Elapsed Time Elapsed Time Time Ela
16. computer then select the Utility tab Set the Comm Port and Baud Rate for the host computer or select Ethernet and set the Ethernet Port typically 1001 Setup for Active X Control Load the Comm program on the same computer that is running the SQS 242 program Start the Comm program then select Active X on the Utility tab Start the SQS 242 program but minimize it or bring the Comm program to the foreground Communicating with the SQS 242 Program In the Comm program Utility tab click the Version button under the SID 242 Controller heading Click Send to send the query to the computer running the SQS 242 program The response from the SQS 242 program should show in the Comm program Response window A typical response is QU ACK 3 0 2 32 which indicates software version 3 02 The next section describes the Query Update and Response strings in detail The transmissions to and from the Comm program will also show in the SQS 242 Edit System Comm Receive Data and Transmit Data windows 6 2 Chapter 6 6 5 Protocol Computer Interface SQS 242 commands fall into two categories Query commands request data from the SQS 242 program Update commands update a setting or instruct the program to take an action The SQS 242 responds to both Query and Update commands with a response that indicates the results of the command request The SQS 242 program never initiates communications It only responds to commands from the host
17. during the deposition phases to detect error conditions which cause oscillations Be sure the Full Scale voltage is set properly in the SQM 242 Setup menu Sensors Graph Normally the graph displays output or film based information The Sensors Graph selection displays the rate readings from each individual sensor 3 37 Chapter 3 SQS 242 Software assigned to a system setup It is a graphical display of the Rate column of the Sensor Readings screen Analog Graph If an SAM 242 analog input card is installed this graph shows the voltage readings from each analog input assigned to a system setup Automatic Changes the main graph to display the most pertinent information for each deposition phase During preconditioning output power is displayed During shutter delay rate ramps and deposition the main graph displays deposition rate During feed and hold phases the graph reverts to output power Note The appearance of each of the graphs has been pre set for best viewing on the Color LCD display of Sigma s SID 142 rack mount computer To alter the appearance of a graph right click anywhere on the graph Use the Graph Property Page dialog box to alter the graph to your preferences To permanently save the changes click the Control tab the General tab then the Save button Save the graph setup to the appropriate OC2 file for the graph you are modifying High Resolution When this option is checked rate is displayed to 01 A s and
18. on which this software is supplied will be free from defects for a period of 90 days from the date of shipment Sigma Instruments does not warrant that 1 the software and any updates will be free from defects 2 the software will satisfy all of your requirements 3 the use of the software will be uninterrupted or error free Limitation of Warranty Defects from or repairs necessitated by misuse or alteration of the product or any cause other than defective materials or workmanship are not covered by this warranty NO OTHER WARRANTIES ARE EXPRESSED OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE UNDER NO CIRCUMSTANCES SHALL SIGMA INSTRUMENTS BE LIABLE FOR CONSEQUENTIAL OR OTHER DAMAGES RESULTING FROM A BREACH OF THIS LIMITED WARRANTY OR OTHERWISE Return Policy The purchaser may return this product in new condition within 30 days after shipment for any reason In case of return purchaser is liable and responsible for all freight charges in both directions Sigma Instruments 120 Commerce Drive Unit 1 Fort Collins CO 80524 USA 970 416 9660 970 416 9330 fax Software License Agreement Sigma Instruments grants to you the Licensee a non exclusive license to use this software on any computer as long as only one copy is used at a time Sigma Instruments retains ownership of the software Licensee may transfer the software to another party so long as the pa
19. parameters TECHSs can also select and run processes because those functions are assigned to a lower level access However TECHs can also edit process parameters Only Supervisors can change System Setup or Security assignments Kl Security Users Ancess File Menu E dit bierni Process uses BI Process TECH esd TECH j Film TECH d Datal ag TECH J Material TECH Print TECH gd System supv J Exit lECH Security SUP Main Form Settings TECH 3 36 Chapter 3 SQS 242 Software 3 5 View Menu The View menu controls the appearance of the main display Film Settings Displays hides a ribbon of commonly accessed process settings along the right of the screen Additional process parameters are available in the Edit menu When displayed the settings ribbon allows the user to easily modify process settings during deposition without leaving the main screen Changes are made to the current process and the process database immediately In CoDeposition first click on the desired film to display its parameters Film Readings Displays hides film deposition readings along the bottom of the screen Readouts of Film Rate Deviation Thickness and Power are displayed simultaneously for each of the active outputs The rate deviation and thickness readings displayed represent an average of the quartz sensors assigned to each film Sensor Readings Displays hides a pop up window of sensor rate thickness remaining life
20. send the source supply to max power Therefore it is unlikely you will ever want to disable this error Crystal Quality Each time the rate deviation for this film exceeds the 96 value a counter is incremented Each time the rate deviation is within the value the counter is decremented to zero minimum If the counter exceeds the Counts value during the entire layer deposition an error occurs 3 18 Chapter 3 SQS 242 Software Crystal Stability When material is being deposited a crystal s frequency normally drops At the end of crystal life sensor frequency may briefly mode hop to higher frequencies Single Hz is the largest single positive frequency shift allowed Total Hz is the sum of positive shifts allowed during a film s deposition On Error When an error condition occurs three actions are possible Ignore the error and let the PID loop attempt to maintain rate control Stop the layer and allow the user to fix or manually control deposition The last choice Timed Power uses the last good Rate Power settings to estimate rate and thickness In Timed Power the output is set to the power level that last yielded a rate reading within the Control Error 96 deviation setting 1096 deviation if Control Error is disabled The program then calculates the estimated thickness based on that rate and the deposition elapsed time When the calculated thickness reaches thickness setpoint deposition stops 3 19 Chapter 3 SQS 242 So
21. start the program There is no work around Press OK to show the unlock screen Unlock codes are in the SQS 242 CDROM sleeve If a valid User ID and Unlock Code are entered the program will start normally Otherwise after three tries the program will start in unregistered mode Please ender the unlock infonmetion Hame Comprar Harms Lir ock Code _ ou Note If you enter a name of DEMO and Unlock Code of 5A8CAC8E5586268 the software will be placed in Demo mode All features of the software are permanently available except that readings from the SQM 242 card are only simulated The Demo mode can be disabled later by entering a valid User ID and Unlock Code 3 2 Chapter 3 SQS 242 Software 3 2 Operation The SID 242 displays a progress bar during startup then a User Login screen Note The SQS 242 software ships with one pre assigned user The user name is Super with no Password Do not confuse this with the registration Name and Unlock Code discussed in the previous section User Name Super D Password Cancel User Login Select a User Name from the drop down box type in the Password then click OK to start the program If your software is configured for keyboardless operation an on screen keyboard will appear as shown below You can use your normal keyboard or mouse TouchPad to type the password then click Enter See System Setup SQM 242 Setup later in this chapter to enable or disable the
22. vacuum chamber feedthrough to the desired SQM 242 Card Input s Refer to Chapter 4 for detailed instructions on system hookup to the SQM 242 card s Connect the dual phone plug from the SQM 242 output jack to your evaporation supply control input Refer to Chapter 4 for detailed instructions on wiring the SQM 242 output phone plug Digital VO is not required for initial operation of the SID 242 Perform initial setup and checkout of the SID 242 before connecting your digital I O Refer to Chapter 5 for detailed information on wiring the SID 242 for digital VO A keyboard is supplied for initial user setup of Windows Attach the keyboard to the keyboard input jack on the rear of the SID 242 2 1 Chapter 2 2 2 Front Panel Quick Start KeyLock Power Reset SoftKeys TouchPad Control Knob Floppy Disk Keyboard not shown Front Panel Controls Insert key and turn clockwise to enable the power red and reset gray buttons Turn key counterclockwise to disable the power and reset buttons Provide basic instrument operations within the SQS 242 deposition program The SoftKeys are functional only in programs written specifically for the SRC computer Provides mouse functions in all Windows programs including the SQS 242 software Move your index finger along the TouchPad surface to move the cursor Press the left or right buttons below the TouchPad surface to click Used to adjust values within th
23. was ramped up to 15 A s and held until the desired final thickness of 1 000 kA was achieved At this point this single layer process is finished E E Deposition Phase with one Rate Ramp You should adjust the PID parameters on the setting ribbon then Start Stop the process several times to become familiar with their effect on control loop response Note In Simulate Mode a deposition rate is not measured until the output power exceeds 50 Quick Start Chapter 2 2 6 SoftKey Functions As you have seen the SoftKey functions remain constant during deposition Spend a few minutes to become familiar with each of these SoftKey functions START PROCESS ABORT PROCESS START LAYER STOP LAYER NEXT LAYER AUTO gt MAN MAN gt AUTO ZERO NEXT FILM NEXT SETTING Starts the first layer of a process when START is pushed If AUTO gt MAN is shown on the third SoftKey AUTO mode the process starts PreConditioning If MAN gt AUTO is shown on the third SoftKey MANUAL mode the process immediately starts in the Deposition phase Aborts the process The process can only restart at the first layer Starts a stopped layer or a layer that has been designated Manual Start in the process database Starts the layer based on the state of the AUTO gt MAN SoftKey as described above Stops the current layer Also changes the function of the first SoftKey to NEXT LAYER Abandons the current layer and moves t
24. 0 Feed Ramp Time aan eege 0 to 30000 sec Feed POWER eee ar ER DE RR ri tact DEEG eed EE RE 0 0 to 100 0 Feed Time Ice 0 to 30000 sec Idle Ramp Time sets REN 0 to 30000 sec Idle POWER IR GR UR KE DE Kk CR BR Ge ee EMERGERE 0 0 to 100 0 96 Tooling Sensor 1 to EE 10 0 to 999 0 Max POWER EE EE EE ee ei 0 0 to 100 0 Slew Palette tomate boa eb ED ER ED Ee Ee ed 0 0 to 100 0 sec Source Index Pocket ee 0 to 15 Material Parameters Nada c ETT 12 characters DENS ES EE MU EE 0 40 to 99 99 gm cm EE e pune robs quc qu RCRUM 0 100 to 9 900 Digital Inputs available only with PLC option Start Process EE eM NS SIOD PIOCOSS cuiu c RE LO EE ERG EG Ee AE Ge Ee Start O eene ee ie ee SES Stop Layer Start Next Faerie dd aida VAMOS AE D TTE Force Final Thickness ccccccccccccccccccccccceecececeeeeeeeeeeeeees Substrate Index Complete ooocccnnnncccocccnncccccnonananccncnnncncnnnnns Source Index Complete een Relay Outputs available only with PLC option Source SUE issie ita trot dad ei d ri ue ag dax a ax qox qud qax Ee 1to6 Sensor SDBTIBE nina M M M ME MM iiu 1108 PAINS EY STAM Fa MET RE poi Ee EE All Crystal Good RR Prada dota SM Process Running Sissies is RE ttt b b o aen PROCESS SIDDDOO EE EE RA Ee ntl Process ACI EE DEERE DEERE ER Bee ER ER DEEG ERR De Ee Ge DE Deposit Phase si la ebd quida dep acto ipee Pre Gond PANAS NANO EEed de Pase ina Matital Mode nca Dreier Dor IEEE ME ratt Max POWOL
25. 242 Software Continuous Check this box to have the graph continuously display data for each phase of the deposition cycle Uncheck this box to clear the graph at the end of the preconditioning deposition and post conditioning phases Graph X Axis Sets the width of the X axis during deposition normally 100 seconds Whatever width is selected the graph automatically scrolls the X axis as required Due to screen resolution setting a width of more than 10 minutes 600 seconds may cause some data points to not be plotted Graph Y Axis Sets the Y axis Rate graph maximum value during deposition Setting the value to O causes the Y axis to automatically scale to the highest rate displayed 3 33 Chapter 3 SQS 242 Software Comm Tab The SQS 242 software can be controlled by another computer through an RS 232 or Ethernet connection See Chapter 6 for a complete discussion ER Syahem Setup E x Charrier Rename Haw Delete Copy Chripauts Sensor Analog indexers vol Cards Comm AS 232 Ethernet Local Pon Ramota Par Port GITE a e F Hama Hame Baud Raie Fer 3500 Address Pda EN bantar Reca Data Tranarnil Deis RS 232 Port Selects the comm port used for serial communications with another computer The Comm Port dropdown box lists available ports Baud Rate Sets the baud rate used for serial communications Ethernet Ports Local Port sets the TCP IP port used by the SQS 242 softw
26. 3 SQS 242 Software Analog Tab ER Goes tem Setup i x Chamier D Rename Heu Delete Cog Outputs Sensors Analog Indexers VO Cards Comm Name Gem Daat Uritz 2 a2 oo rats analog 100 0 00 ET 4 anaoga 1 00 ooo rens Diregi OC oli bo eur res uging wiolbs x Gain Ciffsst Writs The SAM 242 analog input card measures DC voltages in the 10 volt range These voltages may represent temperature flow or any other process variable The analog tab allows you to modify the display to show values in the desired units using a linear y mx b transformation For example assume you have a temperature transmitter that sends OV at 0 C and 1V at 100 C To display temperature in F set the Gain to 180 Offset to 32 and Units to DegF The SQM 242 will display setpoints and measurements associated with the analog input in degrees F To leave the analog input display in Volts set Gain 1 and Offset 0 Name A meaningful name assigned to each analog input For clear display keep the name to less than 8 characters Gain The gain term for transforming voltage to measured units This is the m term in y 2 mx b Offset The offset term for transforming voltage to measured units This is the b term in y mx b Units The units that you wish to display for the analog input 3 26 Chapter 3 SQS 242 Software Indexers Tab E yabem Setup Defauli r Rename Mew Deep Copy Duiput
27. 83 1 02 Platinum 21 4 0 245 Cadmium Teluridium 5 85 0 98 Potassium Chloride 1 98 2 05 Calcium 1 55 2 62 Rhenium 21 04 0 15 Calcium Fluoride 3 18 0 775 Rhodium 12 41 0 21 Carbon Diamond 3 52 0 22 Samarium 7 54 0 89 Carbon Graphite 2 25 3 26 Scandium 3 0 91 Cerium Fluoride 6 16 1 Selenium 4 82 0 864 Cerium Oxide 7 13 1 Silicon 2 32 0 712 Chromium 7 2 0 305 Silicon Dioxide 2 2 1 07 Chromium Oxide 5 21 1 Silicon Oxide 2 13 0 87 Cobalt 8 71 0 343 Silver 10 5 0 529 Copper 8 93 0 437 Silver Bromide 6 47 1 18 Copper Sulfide 4 6 0 82 Silver Chloride 5 56 1 32 Copper Sulfide B 5 8 0 67 Sodium 0 97 4 8 Copper Sulfide A 5 6 0 69 Sodium Chloride 2 17 1 57 Dysprosium 8 54 0 6 Sulfur 2 07 2 29 Erbium 9 05 0 74 Tantalum 16 6 0 262 Gadolinium 7 89 0 67 Tantalum Oxide 8 2 0 3 Gallium 5 93 0 593 Tellurium 6 25 0 9 Gallium Arsenide 5 31 1 59 Terbium 8 27 0 66 Germanium 5 35 0 516 Thallium 11 85 1 55 Gold 19 3 381 Thorium Fluoride 6 32 1 Hafnium 13 1 0 36 Tin 7 3 0 724 Hafnium Oxide 9 63 1 Titanium 4 5 0 628 Holnium 8 8 0 58 Titanium Oxide 4 9 1 Indium 7 3 0 841 Titanium Oxide IV 4 26 0 4 Indium Intimnide 5 76 0 769 Tungsten 19 3 0 163 Indium Oxide 7 18 1 Tungsten Carbide 15 6 0 151 Iridium 22 4 0 129 Uranium 18 7 0 238 Iron 7 86 0 349 Vanadium 5 96 0 53 Lanthanum 6 17 0 92 Ytterbium 6 98 1 13 Lanthanum Fluoride 5 94 1 Yttrium 4 34 0 835 Lanthanum Oxide 6 51 1 Yttrium Oxide 5 01 1 Lead 11 3 1 13 Zinc 7 04 0 514 Lead Sulfide 7 5 0 566 Zinc Oxide 5 61 0 556 Lithi
28. Aas he ee se os oo etes oe Ee ed Thickness Setpoint un Time Setpoint EE et elle d E Substrate Index Select ee 0 to 15 Source Index Pocket Select ANEN 0 to 15 3 40 Chapter 3 SQS 242 Software Security User Natie aras AE N eae fX rto EEN Ge o pete va ee 16 characters PasSWOd teni Hi eL E e iii 8 characters ACTOS invitum EEN 3 levels Computer Interface WD uci OE RON ER RENDERE EE ER EE ETE RS 232 Ethernet ActiveX 3 41 Chapter 3 SQS 242 Software 3 42 Chapter 4 SQM 242 Card 4 0 Introduction This section is an overview of installation and operation of SQM 242 card More detailed and current information is available in the SQM 242 User s Guide The SQM 242 is a deposition controller on a PC card Each SQM 242 card has four 1 10MHz quartz sensor inputs and two 0 10V control outputs Up to six cards can be installed in a computer The diagram below shows a typical single sensor deposition system The SQM 242 receives sensor inputs via a BNC cable from each sensor oscillator It supplies a control voltage to the evaporation power supply this connection is not shown in this diagram The SQM 242 s internal circuitry measures the sensor inputs calculates the measured deposition rate against the desired rate and updates the output voltage based on its PID control loop calculations The evaporation supply adjusts power to the evaporation source based on the control voltage input Visual Basic and LabView demonstration pro
29. Frag r Axes Height Front Panel 5000000 ee EE ee Mode In Normal mode the SQS 242 gets readings from the SQM 242 card s In Simulate mode the SQS 242 generates simulated readings even if a card is not installed This is useful for testing new processes and learning the software The firmware revisions of the installed SQM 242 cards are listed below the mode buttons A value of 0 indicates the card is not installed Analog Rev refers to the revision of an SAM 242 card if installed DLL Return is the status of the SQM 242 card s Windows drivers DLL return values of 9XX indicate a card installation error see the SQM 242 Card Manual for card installation instructions Front Panel Enabled When used with the SRC series computer enables disables the SQS 242 software to read the SoftKeys and setting knob Period Sets the measurement period between 2 seconds 5 readings per second and 2 seconds A longer period gives higher reading accuracy especially at low rates Max Init Min Frequency The frequency values for the quartz crystal sensors used as inputs to the SQM 242 Typical values are Max 6 1 Init 6 0 Min 5 0 Sensor readings outside the min max values cause a Sensor Fail error Filter Sets the number of readings used in the reading filter A low setting gives rapid response to process changes high settings give smoother graphs Last Output Limits the maximum number of outputs shown on the main screen 3 32 Chapter 3 SQS
30. Measure up to eight quartz crystal sensors simultaneously Control up to six deposition source supplies simultaneously CoDeposition Provide PreConditioning multiple rate ramps and feed idle phases Graph deposition rate rate deviation or power output Store process film and material parameters in Microsoft Access database Provide flexible and reliable digital VO using an inexpensive PLC A typical deposition cycle for a thin film is shown below The cycle can be broken into three distinct phases pre conditioning ramp soak deposition and post conditioning feed idle Fate Y Rate 1 i b _ Rate 3 Power Rarp Soak Ramp Soak Shutter Deposit Feed idle I l Z A Delay During pre conditioning power is applied to prepare the source material for deposition The first ramp soak preconditioning phase is used to bring the material to a uniform molten state The second ramp soak phase is typically set to a power that is near the desired deposition rate When pre conditioning ends PID rate control of deposition begins Initially the substrate material may remain shuttered until the desired deposition rate is achieved shutter delay Once the control loop achieves the desired rate the shutter opens and deposition begins Multiple deposition rates rate ramps can be programmed When the desired thickness is reached the evaporation source is set to feed or idle power At this point the process may be complete or deposition of another
31. Min Max Frequency parameters are accurate for your system All Tooling parameters are best set to 10096 for now A Period of 25 seconds is also a good starting point Simulate should be OFF Create a One Layer Test Process Create a new process that has a single film as its only layer and select it as the current process Set the film s Initial Rate to your desired rate and Final Thickness to a large value say 10X your desired Final Thickness Select the proper Sensor s Output and Material Set Max Power to 10096 and Slew rate to 10096 Disable all errors except Crystal Fail Set On Error to Stop Layer Test the Setup Press Auto Manual to start the layer in Manual mode Slowly turn the control knob to a power of 10 and verify that your power supply output is about 10 of full scale Continue to turn the control knob until a Rate A s above 0 is shown Again verify that the power supply output agrees with the SID 242 Power reading If the readings don t agree check your wiring and process setup In particular verify that the System Outputs Full Scale voltage agrees with your power supply input specifications Determine Open Loop Gain Slowly adjust the control knob until the Rate A s reading approximately matches your Initial Rate setting Record the Power reading as PW Ror power 9 desired rate Slowly lower the power until the Rate A s reading is just at or near zero Record the zero rate Power reading as PWRor Determ
32. PLC should flash several times a second when the Address and Comm Port are set properly The Test section of the I O tab provides a means of testing your PLC communications and digital VO wiring To set a relay on the PLC go to the Digital VO tab and find which VO event is assigned to that relay On the PLC tab select the same event in the test dropdown then click Set The assigned Relays should close Click Clear to open the relay The Indexers tab of the Edit System dialog box allows you to move a source or substrate indexer Select the index i e pocket to activate then click the appropriate move button 9 3 Chapter 5 Digital VO 5 3 PLC Programming The PLC runs a small ladder logic program that communicates with the SQS 242 software This program transfers external relay and input states from the PLC connecting block to internal PLC registers The SQS 242 software reads writes to those registers The preset functions of the SQS 242 software will be adequate for most applications If you need to perform additional logic functions they can be programmed using Omron s CX Programmer software Contact Sigma Instruments for more information on programming your PLC The functions of the internal PLC registers used by the standard SQS 242 program are shown below PLC Register SQS 242 Function 200 Layer Phase Register Bits 0 9 are BCD layer number running Bits 10 15 are BCD Phase as shown below O0 A Application Startup 09 S
33. Power Relay Closes when any control voltage output is at the programmed maximum power level Thickness Setpoint Relay This relay will become active when the Thickness Setpoint is reached This is a programmable process parameter Time Setpoint Relay This relay will become active when the Time Setpoint has been reached This is measured from the beginning of the deposit phase and is a programmable parameter Test The Test section provides a simple means of testing I O wiring To close a relay select the desired relay button then click Set Click Clear to open the relay contacts Input Events The input events dropdown box lists the deposition events that can be caused by an external digital input To assign a deposition event to an input click the Input then select the desired event from the dropdown box As you click each Input the dropdown will change to show its currently assigned event A brief description of each input event follows Start Process Input Triggering this input is the same as pushing the Start Process button Abort Process Input Triggering this input will abort the process Start Layer Input Triggering this input will start or restart the current layer Stop Layer Input Triggering this input will stop the current layer Start Next Layer Input Triggering this input will skip the current layer and start the next layer Zero Thickness Input This will zero the thickness It is identical to pressing th
34. SID 242 Thin Film Deposition Controller SQS 242 Deposition Control Software SQM 242 Deposition Control Card Version 3 25 User s Guide Copyright Sigma Instruments Inc 1998 2005 H Sigma instruments Safety Information Read this manual before installing operating or servicing equipment Do not install substitute parts or perform any unauthorized modification of the product Return the product to Sigma Instruments for service and repair to ensure that safety features are maintained Safety Symbols WARNING Calls attention to a procedure practice or condition that could possibly cause bodily injury or death CAUTION Calls attention to a procedure practice or condition that could possibly cause damage to equipment or permanent loss of data Ki Refer to all manual Warning or Caution information before using this product L to avoid personal injury or equipment damage N Hazardous voltages may be present Earth ground symbol Chassis ground symbol beu Equipotential ground symbol Warranty Information Hardware Warranty This Sigma Instruments product is warranted against defects in material and workmanship for a period of 2 years from the date of shipment when used in accordance with the instructions in this manual During the warranty period Sigma will at its option either repair or replace products that prove to be defective Software Warranty Sigma Instruments warrants that the media
35. Set Tooling as described in the Edit Process section of Chapter 3 Incorrect Tooling values will cause consistently low or high rate thickness values for a material Verify that the Material Density and Z Factor values match those in the Materials Parameters Appendix If the material is not listed check a materials handbook Density has a significant effect on rate thickness calculations Z Factor corrects for stresses as a crystal is coated If readings are initially accurate but deteriorate as crystal life drops below 60 70 you need to adjust the Z Factor or replace crystals more frequently The relationship between Z Factor and Acoustic Impedance is discussed in the Materials Appendix 4 4 3 Poor Rate Stability First be sure that a stable rate can be achieved in Manual mode as explained in Section 4 4 1 Once a stable rate is achieved in Manual mode follow the Loop Tuning procedures of Section 4 5 Chapter 4 SQM 242 Card 4 5 Chapter 5 Digital VO 5 0 Introduction Digital VO for the SQS 242 software is handled by an inexpensive Omron CPM2 series PLC Itis not necessary however to use external I O with the SQS 242 software There are several benefits to using an inexpensive external PLC for I O First noisy high voltage wiring can be placed near the control sources rather than routed into the controller s equipment rack Only a single serial cable runs from the PLC to the controller The PLC also provides electrical iso
36. ames comma delimited list Source Shutter Status n 1 to 6 D Open 1 Close Sensor Shutter Status n 1 to 8 All Crystal Good Status Crystal n Good n 1 to 8 All Crystal Fail Sensor to Output Map n 1 to 8 D Open 1 Close O False 1 True O False 1 True O False 1 True Dann 6 6 Chapter 6 Computer Interface Update Process UP lt param1 gt lt data gt where lt param1 gt is 01 Set Process Example Update UP 01 MyProc Select MyProc Example Response UP 06 Start Process Stop Process Start Layer Stop Layer Start Next Layer Auto Mode all films in layer Manual Mode all films in layer Zero Thickness all films in layer Set Run Set Active Layer Output n 1 to 6 Power Manual Mode Only Map Sensor n to Output 6 7 Chapter 6 Query Update Layer Computer Interface QL lt param1 gt lt layer gt lt output gt UL lt param1 gt lt layer gt lt output gt Note A layer value of zero sets returns data on the current layer where lt param1 gt is 01 Film Name Example UL 01 1MyFilm New Film set Layer 1 MyFilm to NewFilm Setpoint Start Thickness Time SP Thickness SP Start Mode Substrate Index obsolete Layers in Process query Start Prompt Phase of the requested output query Ramp n Start Thickness n 1 to 9 Ramp n Ramp Time n 1 to 9 Ramp n New Rate n 1 to 9 Layer Indexer 1 Index Layer Indexer 2 Index Layer Indexer 3 Index So
37. are for Ethernet communications 1001 is a typical value 1 for no Ethernet When communications is established Remote Port displays the TCP IP port of the remote computer communicating with the SQS 242 software Ethernet Name Displays the name of the local and remote computers as set in their Windows My Computer dialog box Ethernet IP Address Displays the IP address xxx xxx xxx xxx of the local and remote computers Receive Data Displays the Query and Update requests received from the Comm and Ethernet port See Appendix B for a description of the serial communications protocol Transmit Data Displays the response to Query and Update requests received from the Comm and Ethernet port Note The Comm tab does not monitor communications with the PLC 3 34 Chapter 3 SQS 242 Software 3 4 5 Edit Security The Security menu assigns Users their Password and their Access Level It also provides a flexible way to assign program functions to different Access Levels Note The Security dialog box is available only to users with Supervisor Access Users Tab Users Fees User ST Ancnss Supervisor Password User Dropdown box used to select an existing user to edit their Access or Password It is not possible to edit or add a user name in the User dropdown Use the New SoftKey to create a new User Use the Delete SoftKey to delete the selected user Access Assigns a program access level to the select
38. as the input the setpoint is Rate in A s This sets the initial Rate setpoint for the selected layer Rate is controlled by the PID parameters for the film assigned to the layer If no rate ramps are defined for the layer this is the rate setpoint for the entire layer 3 10 Chapter 3 SQS 242 Software If the Input selected is Timed Power the setpoint is shown as Power This sets a fixed 96 output Power during deposition In Timed Power the Time Endpoint establishes the length of time for the deposition cycle The layer will end when either the time endpoint is reached or when the Final Thickness is reached whichever occurs first If one of the SAM 242 analog inputs are selected the setpoint is in volts or the analog input s corresponding user defined units The layer will end when either Time Endpoint or Final Thickness is reached whichever occurs first See the Analog Inputs section later in this chapter for a discussion of programming for analog inputs Final Thickness Sets the endpoint thickness for the layer When final thickness is reached deposition is stopped for that layer and the feed hold phase is entered Time EndPoint Sets an arbitrary time after deposition begins when the time setpoint relay is activated During Power and Analog Input deposition it also sets the length of the deposition cycle Thickness EndPoint Sets an arbitrary thickness that activates the thickness limit relay Auto Manual Continuous Sta
39. ayed on the screen For now use the Default system setup Manual Start causes this layer to wait for user input before beginning An optional user prompt is possible We won t use any indexers for this example so select None A thin film deposition process consists of one or more layers of material evaporated onto a substrate The diagram below illustrates a complete deposition cycle for a single layer Refer to this diagram as we set the remaining parameters Rang Dik Ramp Ena Ter Capra H Feed 1 a Er Chapter 2 Quick Start Edit It may be desirable to vary the deposition rate during a layer Rate Ramps For example to deposit slowly at first then more quickly once the initial material is deposited Click the Rate Ramps tab then click Insert Ramp Adjust the Start Thickness to 0 400 kA Ramp Time to 5 seconds and New Rate to 15 A s Lever RaleRampr Deposi Candition Source Sensar Erors Ramp StetThick Damp mp Hora Stet Thickness Insan amp Dolata Ramp Ramp Time so Move Up Sec Mew Hate Mave Dinan 15 000 Als Note Settings on the Layer and Rate Ramp tabs must be set for each layer in a process Settings on the remaining four tabs Deposit Condition Source Sensor and Errors correspond to the Film that was selected on the Layers tab This allows a Film s settings to be used in a number of layers without the need to individually adjust each layer Edit Select the Deposit
40. database If the setup is used in a process an error message is displayed Copy Creates a duplicate of the currently selected system setup 3 23 Chapter 3 SQS 242 Software Outputs Tab ER Goes tem Setup i x Chamier D Rename Hew Delete Cog Duipuis Sensors Analog indexers Vol Cards Comm Name W FRO Color aa bh s nm Test Output UN Ful Scale tot co o amp owes fa look Name Assigns a name to each displayed output For clear display keep the name to less than 8 characters Physical Output Up to six SQM 242 cards physical outputs 1 to 12 and a single SAM 242 card physical outputs 13 and 14 may be installed in a computer However the SQS 242 software can display and control a maximum of 6 outputs simultaneously Use this dropdown to assign a physical output to a display output FS Out The input voltage required by the deposition source power supply to produce 100 output power Positive or negative full scale values are possible Color Selects the color used to graph and display output data Test Output Useful for testing output wiring and Full Scale voltage settings Select an output then click Full Scale to set the SQM 242 card output to its Full Scale voltage Click Zero to return the selected output to O volts 3 24 Chapter 3 SQS 242 Software Sensors Tab Deteut Rename Hew Delete i Copy Chripuis Sence Anaiog Incixars yo Card Comm
41. e End Deposit Phase records process data rate thickness time etc at the end of each layers deposit phase Similarly End Each Phase logs data at the end of each phase conditioning depositing etc I O Events logs data each time an external digital input or output changes Timed logging records data at the selected time intervals throughout the process 3 6 Chapter 3 SQS 242 Software Click the Sensors box to include individual sensor data in addition to the normal film based data Click Analog Inputs to also log that data Finally click Readings to log every reading from the SQM 242 card s The file will be saved in the application directory with a name in yymmad log format That is readings logged on January 15 2004 will be saved as 040115 log Note This file can grow quite large and cause Windows to slow significantly Typically the Timed option is a better choice unless you must record every reading When Readings is selected a reminder screen appears each time the SQS 242 program is started Format There are two formats for writing data If Spreadsheet is selected each entry is a comma delimited line of data If Text is selected the data is formatted for easy reading The first few lines of the LOG file is a heading that illustrates the file format and content Note If you wish to use a different delimiter than a comma change the SQS242 INI file so that under the DataLog section the L
42. e Sensors Anatoa Indexars ro Cora Comm Source Indewers Layer Indeaars Completa Timenut Complete Tirnecut Signal Ger Signed Ger 1 30 Substrate ke 30 z o J Luar IT 3n 1 10 Liser D EU 4 L 30 Test indexer Index y 1 m a Source z G E 10 Mee Source Indexers A unique source indexer pocket rotator is available for each output used The source indexer moves at the beginning of each layer Layer Indexers Three layer indexers are also available Layer indexers also move at the beginning of each layer Layer indexer values are useful for control of substrate indexers or other external process equipment Note The Layer Indexer names the range of values and the first entry can be customized by editing entries in the SQS242 INI file Complete Signal Check this box if your indexer sends a signal indicating that the move is complete Timeout If Complete Signal is checked the process will halt if a move complete signal is not received within this timeout period If Complete Signal is not checked the process waits for this fixed time period before starting a layer Move Useful for testing indexer functions manually Select an indexer then an index pocket Click Move to move to the selected index Layer indexers are typically named Substrate User 1 and User 2 Layer indexer names can be edited in the SQS242 INI file 3 27 Chapter 3 SQS 242 Software VO Tab
43. e in CoDep Film the Films dropdown and Output 2 in the Output dropdown The layers list will update to show the new Silver Sample film assigned to Layer 3 Add a Select Layer 3 in the layers list then click Cut Layer Now CoDep Layer select Layer 1 Click Paste CoDep The Silver Sample film will be added below Gold Sample as a codeposition layer Your setup should match the picture below Process Edit Sample Save Rename Delete Copy Layer Out Film SetPt Thickness Time Gold Sample Cut Layer 1 2 Silver Sample 10 1 0 2 1 Gold Sample 10 1 0 C opy Layer Paste Layer Paste CoDep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold Sample Output 1 Sensor s SetPt Final Thick TimeEndFt Thk EndPt System Setup 10 00 1 000 Ren BEET o oool Detsut Ais kA Auto Start Indexers Continuous Source Substrate Userl User2 fe senem None None None None Index Index Index Index iz We now have two layers in our process Layer 1 has Gold being deposited from source Output 1 and Silver is being codeposited on Output 2 Layer 2 is Gold alone 2 13 Chapter 2 Quick Start Hint It s easiest to copy a layer then paste several temporary layers of that type as additional layers Next assign the films and outputs that you want to each of these additional layers Now use Cut Layer on the temporary layers and Paste CoDep to a
44. e SQS 242 software Pushing the control knob stores the current setting and moves to the next setting Functional only in programs written specifically for the SRC computer 1 44 MB floppy disk for upgrades backup and data storage transfer Required for Windows data entry and useful during initial SID 242 setup The F1 through F6 keys on the keyboard provide the same functions as the six SoftKeys on the front panel 2 2 Chapter 2 Quick Start 2 3 Program Startup This section will start the SID 242 and run the SQS 242 deposition control program Power On the Computer Start the Program User Login Screen Process Database Main Display Simulate Mode Insert the and turn clockwise to enable the power and reset buttons Push the power button to start the computer The SID 242 will boot Windows from the internal disk and start the SQS 242 deposition program If the SQS 242 program does not start automatically use the TouchPad to double click the desktop icon Note If you are prompted to register the software just click Cancel for now The SID 242 ships with one pre assigned user The user name is Super with no Password The SID 242 displays a progress bar during program startup then a User Login screen Select a User Name from the drop down box enter the Password then click OK See Chapter 3 for more information on users passwords access levels and registration The SID 242 normally starts with t
45. e Seneor Erara Source Misha real Max Poner Slow Asia Ki En Sensor Tanling 5 Sercor 1 Sensor d Sensor 3 Sensor 4 100 00 Sensor 5 Sensor Sensor Sensor Material Selects the physical deposition material for the film selected on the Layers tab Selecting a material sets the Density and Z Factor as defined in the Edit Materials dialog box Max Power The maximum output power allowed for the selected output The full scale output voltage is a function of the deposition power supply input specifications and is set in the Edit System menu Outputs tab Max Power controls the maximum of the full scale power that can be used by this film in all phases PreConditioning Deposition and Feed ldle Slew Rate The maximum power change allowed on an output per second If rate ramps or PID power requirements exceed this value an error will occur 3 16 Chapter 3 SQS 242 Software Sensor Tooling Adjusts for sensor measured deposition rates that differ from the substrate deposition rate A higher tooling value yields higher rates For example if the sensor sees only 50 of the substrate rate set the value to 200 Setting Tooling to 096 causes a sensor to be ignored for this film N P4 Substrate e e A A Substrate N wills Wha sn Tooling vel Under 100 The System Setup selection on the Layer tab establishes
46. e Zero button Force Final Thickness Input Triggering this input has the same effect as reaching Final Thickness setpoint Comm Port Selects the serial port used to communicate with the PLC The Comm Port dropdown lists available ports However some ports may be used by other devices modem mouse etc Select Disabled to prevent I O from using the PLC 3 30 Chapter 3 SQS 242 Software The communications paramaters baud parity bits stop are shown below the Comm Port dropdown The baud rate can be changed in the SQS242 INI file Address Several PLCs can be controlled from a single computer Comm Port by connecting their expansion ports The slave address of each such PLC is usually set by a rotary or dip switch and must be unique Single PLC systems usually use Address 0 Consult your PLC User Manual If the PLC is found at the selected Comm Port and Address the COMM LED on the PLC will flash continuously The PLC model is displayed below the address 3 31 Chapter 3 SQS 242 Software Cards Tab 5 system sem E Ontnur Agnemo Hew Delete Copy Outputs Sensars Anelog Indeseess HO Card Comm Cards Display m Eimulala gu Fiber Last Ouigut i li 25 PRES E ow m Ced 1 Pier 201 Poos Diego e Mee Freq Ced E Rene D Ord Gard 3 Pear 0 00 6 100000 Graph ard d Pear 0 00 Hz Contnunus Card 5 Pier 0 00 mp Freq Ages ph Gard 6 Aow 0000 nnn 600000 MET Anelog Aes 2 01 Hr DLL Aster 000 Min
47. e next four parameters control setup of the 4 indexer values where Name is the Indexer label on the Process form Start is the first index number typically 0 or 1 End is the last index number typically 15 or 16 First is the text displayed for the Start index number Sourcelndex Name Start End First Layerlndex1 Name Start End First Layerlndex2 Name Start End First Layerlndex3 Name Start End First
48. ed user Generally speaking Supervisor SUPV provides access to all program functions Technicians TECH have access to a subset of functions While User level access USER has access to only those functions needed to run deposition processes See the Access Tab section to assign SUPV TECH and USER program capabilities Password Each user will typically have his her own password When a password is entered a second box will appear for password confirmation If the Password box is left blank no Password is needed for that user to login Note User names and passwords are limited to A Z 0 9 _ and space Passwords are a maximum of 8 characters 3 35 Chapter 3 SQS 242 Software Access Tab The Access tab allows Supervisors to assign which program functions are available to each of the three Access Levels When a program function is assigned to a particular access level it is automatically available to higher access levels In the example below every user has access to the File Process menu and the File Exit menu Only Supervisors have access to the Edit System and Edit Security menus The remaining menus are assigned TECH access They will be available to TECH and SUPV users but not to USER access users The settings along the right side of the Main Form can be viewed by any user but values can only be edited by TECH or higher access Those who login with USER access can select and run processes but they cannot edit process
49. equipment configurations The Index names the range of values 0 to 15 or 1 to 16 and the first entry can be customized by editing entries in the SQS242 INI file Chapter 3 SQS 242 Software Rate Ramps Tab Rate ramps cause changes to the deposition rate over time under PID control Each rate ramp has a starting thickness an elapsed time to ramp to the new rate and a new rate setpoint Each process layer can have an unlimited number of rate ramps ZA process Fat E x Sample eaa T Rename hoe Dele Cop Lear Cut Film Saft Thicknass Time 1 D Siker Sample 15 n5 i Gold Sample 10 5 Layer FinteFiemos Depasit Condition Saurce Sansor Errors Remp ExSerlTheck RampTime MHNawPledo Start Thickness ihsan Ramp 05d KA Delete Ramp Fearn Time 30 00 Hera Up Sec New Rate Move Down 1 50 Aja Insert Ramp Inserts a new rate ramp for the selected layer at the selected position in the rate ramps list Existing rate ramps are shifted down Delete Ramp Deletes the selected rate ramp Move Up Shifts the selected rate ramp up one position Move Down Shifts the selected rate ramp down one position Start Thickness The thickness that triggers a timed ramp to a new rate Start thickness should be greater for each subsequent ramp and less than the final layer thickness otherwise the rate ramp is ignored Ramp Time The time in seconds to ramp to the new rate If the rate ramp is too
50. fast a PID control error may be generated New Rate The new deposition rate setpoint for the selected layer 3 12 Chapter 3 SQS 242 Software Deposition Tab The deposition tab contains parameters that directly affect the deposition phase of the process cycle Sampie Seva Figname jew Deleie Copy Leer Out Film Satt Thickness Time 1 2 SiverSample 15 0 5 7 a re 1 Gold Sample 15 TE D Capy Layer Poste Leer Pasta CoDiep Layer Bsieamps Deposit Condition Sourca Sansor Errars Loop Shutter Delay Rate Sampling FTam 9 s Enabled Continous ITem ATTAC r Sed 10 00 Sac Se Tine Based DO Term ent Hold Sample Hold ug 60 00 ETE Sec Sec Sec SEL Sec P Term Sets the gain of the control loop High gains yield more responsive but potentially unstable loops Try a value of 25 then gradually increase decrease the value to respond to step changes in rate setpoint Term The integral term controls the time constant of the loop response A small term say 1 to 3 seconds will smooth the response of most loops D Term The differential term causes the loop to respond quickly to changes Use 0 or a very small value 1 x Term to avoid oscillations See the Appendix B for loop tuning tips Shutter Delay It is often desirable to assure stable process control before the substrate shutter opens Enabling shutter delay requires that the system reach the programmed shutter delay Accurac
51. film layer may begin Up to six separate films can be codeposited within a single layer There is no practical limit to the total number of processes layers or materials that can be stored in the process database 3 1 Chapter 3 SQS 242 Software 3 1 Installation and Registration The SQM 242 card can be installed before or after the SQS 242 software Consult the separate SQM 242 card User s Guide for installation information Note CD ROM installation on the SID 242 rack mount computer can be accomplished with an external USB CDROM or by copying the CD ROM Disk folder to 3 v2 diskettes It is also possible to use the SID 242 Ethernet connection to install the software over a network To install the program insert the disk or CD ROM Click Start then Run then type d Setup where d is the drive you are using Click OK to begin installation and follow the on screen prompts When installation is complete you may be prompted to restart the computer To start the SQS 242 program click Start Programs Sigma Instruments then SQS 242 Until the software is registered this Registration nag screen will appear i This software is nolregsterad end wil expire in 30 runs SR Riegistretion inlprmatinn is op the COACH slesws Frese DEF in REGIS TER or CANCEL to SEIF registraban ECC ER Cancel Note You may select Cancel for a maximum of 30 unregistered runs After 30 runs you must contact Sigma Instruments to
52. ftware Analog Inputs Normally the SQS 242 software uses SQM 242 card quartz sensor inputs to measure or control rate and thickness The SAM 242 Analog Input Card extends this capability to allow measurement and control on DC voltage based process variables such as temperature transmitters pressure flow controllers Analog input based control is treated for the most part identically to quartz sensor based control Considerations for using an analog input are discussed below Layers Tab In the Inputs dropdown select one of the Analog inputs In the Outputs dropdown select the output that is to be controlled Enter the desired setpoint Normally this setpoint is in Volts but can be converted to other units e g degrees or PSI in the Edit System Analog screen Use Time Endpoint to stop the analog layer after a set time Otherwise a Sensor input programmed as a Codep layer can control the layer endpoint Final Thickness and Thickness Endpoint settings have no effect for an analog input If Continuous Start is selected the analog input controls to its programmed Layer Setpoint through all of the Ramp Soak Feed phases This allows temperature or pressure control for example to be maintained through all phases of the layer If Stop Layer is selected control is still maintained at setpoint Pressing Abort Process will set the output to zero Rate Ramps Tab Setpoint ramps can also be programmed for an analog signal Deposition Tab
53. g a valid reading Process Stopped and Running Relays These relays indicate the overall status of the process The Process Running relay closes as soon as Start Process is selected by front panel or digital input and opens when Abort Process is selected Even if a layer is stopped within a process the Process Running relay remains closed until the last film of a process has finished The Process Stopped relay contacts behave in the inverse manner Layer Stopped and Running Relays The Layer Running relay closes as soon as Start Layer is selected by front panel or digital input and opens when Stop Process is selected The Layer Stopped relay contacts behave in the inverse manner Deposit Phase Relay This relay indicates that you are in the deposit phase of a film It is like having the two Source Shutter Relays connected in parallel If you have shutter delay enabled this relay will wait until the end of the shutter delay before going active Pre Cond Phase Relay This relay closes for the preconditioning phases Ramp1 Soak1 Ramp2 Soak2 of a film Soak Hold Phase Relay This relay closes for the Soak and Hold phases after deposition Process Active Relay This relay action is similar to the Process Running relay except it will open if the process is temporarily halted for any reason e g a Manual Start layer Manual Mode Relay Closes when the program is placed in Manual mode 3 29 Chapter 3 SQS 242 Software Max
54. grams allow easy setup and operation A Windows DLL also provides user written programs access to SQM 242 setup and readings Y pee EE Computer II pl E d if Ground In Vac Cables c d Cable Evaporation Power Supply System Gnd Chapter 4 SQM 242 Card 4 1 Installation Consult the SQM 242 Card User s Guide for driver installation and card jumper instructions 4 2 Sensor Connections Once the SQM 242 is installed in the PC connect the cable from the sensor oscillator to the BNC jack on the SQM 242 card Refer to the drawing in Section 4 0 Avoid running the sensor wires near high voltage or noisy lines _ Control Outputs Sensor 1 Sensor 2 Sensor 3 Sensor 4 4 3 Power Supply Connection The connection to your evaporation power supply is done through a 1 4 Stereo Phone Jack on the SQM 242 card There are 2 control voltages on this connector as shown in the figure below The ground is common to both channels Power supply input connectors vary Consult your power supply manual Ground Sleeve Chan 1 Ring Chan 2 Tip o 4 2 Chapter 4 SQM 242 Card 4 4 Troubleshooting Defective crystals or improper software setup causes most SQM 242 problems Follow the procedures below to identify and correct common problems 4 4 1 No Readings or Erratic Read
55. h 3 10 Rate le 3 12 Beers esos sais hr M 3 13 o E 3 15 Ma 3 16 O 3 18 Analog pS e dc 3 20 AMS A A 3 21 3 4 3 Materials ccccccccccccccecceecceccecceeeceeceeceecuecaeeceeceeaeecuecaecceecsecaeeceecseeaeeatesaes 3 22 Chapter 3 SQS 242 Software continued SE DEE UNSUNG EE DO ED es DE EISEN Analog RE REENEN ee eene eene a er E EE E parT Card and Display Setup iss ee ee RR ee ee ee ee Comm eo m EHNEN 3 5 View ER bod eebe 9 5 OPOCIICANONS ss ER EE EE rp EE EE pius Chapter 4 SOM 242 PC Card AO leg eelere WEE EE a AMS AAO KEEN 4 2 Sensor Connections ee ee ee Ee ee Ee nennen nena KENNEN ee ee ee ee ee 4 3 Power Supply GonfnecllOn iio ce eo eee 4 4 TroubleShooting PRETI Chapter 5 Digital VO BOC ige ode ee OR EE 5 T REG Installation ss iet GE ee ee tet rete tette den Ee EE se pie PLC Sellip and Test ashen RS eoi GE OE le EE EIERE Chapter 6 Computer Interface G02 ntroducltloltasesias EE o trie ate EcL avra EFC GEEN De de 6 Serial Interface eer ere ee 6 2 Ethernet Interface ooi ee ed es ie ed eta rim a t 6 3 ActiveX COM Intertace AANEREN 6 4 9509 242 Comm dee TT EE o REENEN 6 6 Command Gummam eene Appendix A Material Parameters B Loop Tuning Chapter 1 Introduction 1 0 Introduction This manual covers both the hardware and software associated with the SID 242 Thin Film Deposition Controller The SID 242 consists of four main elements integrated into a complete depos
56. he FCS checksum of a string of characters In the code Message is a string that has been stripped of terminator and checksum characters before being passed to this routine XOR ASCII codes For i 1 To Len Message FCS Asc Mid Message i 1 Xor FCS Next i Convert FCS to two character hex string If Len Hex FCS 1 Then CalcChkSum 0 amp Hex FCS Else CalcChkSum Hex FCS Note While checksums may be useful for RS 232 communications they are not needed for Ethernet or ActiveX If you don t want to use a checksum replace the checksum in each command with 00 two ASCII zero Hex 30 characters The program response will contain two checksum characters which you can just ignore Chapter 6 Computer Interface 6 6 Command Summary Note Update commands except UPO2 UP10 are only valid in Stop Mode Query Process QP lt param1 gt where lt param1 gt is Process Name Example Query QP 01 Example Response QP 06 MyProc Process is MyProc Process Time mm ss Active Layer Layer Time mm ss Phase where phase numbers returned are O0 Application Startup 09 ShutterDelay Phase 01 Program Initializing 10 Deposit Phase 02 Not Used 11 Layer Stopped 03 Not Used 12 Layer Starting 04 Process Stopped 13 Not Used 05 Ramp1 Phase 14 Feed Ramp Phase 06 Soak1 Phase 15 Feed Hold Phase 07 Ramp2 Phase 16 Idle Ramp Phase 08 Soak2 Phase 17 Idle Phase Phase Time mm ss Run All Process N
57. he last active process displayed If that process is not found a Database Open dialog is displayed Use the TouchPad to select the SQS242 database As you operate the SID 242 the six SoftKey labels along the left of the screen will change to display appropriate functions Along the top of the display is a menu of less commonly used functions This menu is available only when the SID 242 is stopped i e not running a deposition process Simulate mode allows you to familiarize yourself with SID 242 operation and test process recipes Simulate Mode will be used for the remainder of this chapter If the first SoftKey is labeled START SIMULATE then the Simulate mode is active Otherwise click the Edit menu selection along the top of the display then click System On the Card tab click the Simulate button Select the Close SoftKey to activate Simulate mode 2 3 Chapter 2 Quick Start 2 4 Single Layer Process Setup We will build a simple single layer process as an introduction Create a New Process Click the Edit menu selection along the top of the display then click Process The Process Edit dialog will display the setup data for the active process To create a new process click the New button at the top of the Process Edit dialog box ZW Process Edit Sampie Dau Rename Mew Delete Copy Lexar Curt Firn Beta Thickness Tia 1 E Biber Sample 15 1 5 Layer BateRamps Deposi
58. hutterDelay Phase 01 Program Initializing 10 Deposit Phase 02 Not Used 11 Layer Stopped 03 Not Used 12 Layer Starting 04 Process Stopped 13 Not Used 05 Rampi Phase 14 Feed Ramp Phase 06 Soaki Phase 15 Feed Hold Phase 07 Ramp2 Phase 16 Idle Ramp Phase 08 Soak2 Phase 17 Idle Phase 18 Continuous Phase 201 Sensors Outputs 1 4 Register updated each layer Bits 0 7 are sensors used 1 used O unused Bits 12 15 are outputs used 12 is Out1 13 is Out2 etc 202 Analog Outputs 5 6 Register updated each layer Bits 0 3 are analog inputs used 1 used O unused Bits 4 5 outputs used 4 is Out5 5 is Out6 Bits 8 11 are BCD of Output source index Bits 12 15 are BCD of Output 6 source index 220 Source Index Register updated each layer Bits 0 3 are BCD of Output 1 source index Bits 4 7 are BCD of Output 2 source index Bits 8 11 are BCD of Output 3 source index Bits 12 15 are BCD of Output 4 source index 5 4 221 222 224 225 226 Chapter 5 Digital VO Source Indexer Done Flag Bit 0 is Source Indexer 1 12 Indexer Done 0 Not Done Bit 1 is Source Indexer 2 Bit 2 is Source Indexer 3 Bit 3 is Source Indexer 4 Bit 4 is Source Indexer 5 Bit 6 is Source Indexer 6 Relays 1 16 Bit 0 is Relay 1 etc Inputs 1 12 Bit 0 is Input 1 etc Layer Index Register Bits 0 3 are BCD of Layer Indexer 1 Bits 4 7 are BCD of Layer Indexer 2 Bits 8 15 are BCD of Layer Indexer 3 Layer Indexer Done Flag Bit O is Layer Indexer
59. ine Open Loop Response Time Calculate 1 3 of your desired rate RATE 5 and 2 3 of the desired rate DATE for this layer Slowly increase the power until Rate A s matches RATE Get ready to record the loop s response to an input change Quickly adjust Power to PWRpr Measure the time for the Rate A s reading to reach RATE You may want to do this several times to get an average response time reading Displaying the Rate graph will also help Twice the measured time is the step response time TIMEsr TIMEsn is typically 7 to 1 5 seconds for E Beam evaporation 5 to 20 seconds for thermal evaporation Press Abort Process then Manual Auto to return to Auto mode Follow these steps to set the loop PID parameters Set PID Values In the Edit Process Deposition tab set P225 l TIMEsr D 0 Assure that all Conditioning values are set to zero Save the values and close the Edit Process dialog Press Start Process and observe the Power graph The power should rise from 0 and stabilize near PWRpn with little ringing or overshoot If there is more than about 10 overshoot lower the P Term If the time to reach DW Do is very slow Appendix increase the P Term A lower Term will increase response time a higher value will eliminate ringing and setpoint deviations lt is unlikely you will need any D Term Continue to Start the process and adjust PID until steady state response is smooth and the step response is reasonably controlled You do
60. ing is illustrated above Notice that some relays i e 02 03 and 04 05 06 07 share a common terminal Note The internal 24VDC 3A supply of the Omron PLC is NOT adequate to serve as the supply shown in the diagram above 5 2 Chapter 5 Digital VO Indexer I O Indexers from different manufacturers use a variety pocket decoding schemes The PLC monitor program adapts information from the SQS 242 program to a specific indexer The two most common indexer decoding schemes are illustrated below Binary Pocket Select Each pocket requires a dedicated relay That is 8 pockets require 8 relays The CPM2A Basic PLC monitor program assigns relays 11 00 to 11 03 to operate a 4 pocket indexer of this type Binary Coded Pocket Select Pockets are selected by a value that is the binary representation of the pocket That way fewer relays are required For example 16 pockets can be selected with only four relays The CPM2A BCD monitor program assigns relays 11 00 to 11 03 to this function Please contact Sigma Instruments for information on your indexer Other Digital I O Depending on the PLC model used additional relay and input pins are available for other functions i e source indexer operation Please contact Sigma Instruments 5 2 PLC Setup and Test In the SQS 242 software select Edit System then the I O tab Set the Address to match the PLC Address usually 0 Set the Comm Port to the serial port you are using The COMM LED on the
61. ings from Sensors Disconnect the deposition source supply This eliminates the possibility that a noisy source or poor loop tuning are causing an unstable PID loop Verify that the sensors oscillator and cabling are connected as shown in Section 4 0 Replace the quartz crystal Crystals sometimes fail unexpectedly or exhibit erratic frequency shifts before total failure Depending on the material crystals may fail well before the typical 5MHz value If you find that crystals consistently fail early you may want to set Min Frequency see below to a value higher then 5 MHz In the SQS 242 software Edit System menu assure that Simulate Mode is OFF and Frequency Min Max are set properly for your crystals typically Min 5 0 MHz Max 6 0 MHz Some manufacturer s crystals exceed 6MHz when new Setting Frequency Max to 6 1 Hz will correct that problem with no effect on measurement accuracy Assure that the proper sensors are enabled and assigned to the desired output Close the Edit System menu and select View Sensors to show sensor frequency and Life While not depositing observe the Life display for each active sensor The value should be stable between 20 and 100 If the Life reading is zero or unstable Recheck the wiring from the sensor to the SQM 242 and verify that the system is properly grounded Also check that the crystal is seated properly in the sensor head Move the sensor to another SQM 242 input If both SQM 242 i
62. ition control system SRC Series Rack mount Computer SQM 242 PC Card s SQS 242 Windows CoDeposition Software PLC for Digital VO option While the focus of this manual is on the SID 242 Controller package it also covers each of these components separately If you have purchased only the SQS 242 Software and or the SQM 242 Card we suggest that you also review Chapters 1 and 2 of this manual for important information 1 1 SRC Series Computer Sigma s SRC Series computers are Celeron or better class computers running the Microsoft Windows operating system SRC computers use standard off the shelf components and Sigma s custom rack mount chassis to provide a compact flexible yet low cost instrument Included in the 5 25 high rack mount chassis are an LCD Display a TouchPad pointing device a setting Knob and six SoftKeys A standard keyboard is provided an optional rack mount keyboard is also available 1 1 Chapter 1 Introduction 1 2 SQM 242 Deposition Control Card Sigma s SQM 242 is a PCI expansion card for use in computers running the Microsoft Windows operating system Each card measures up to four quartz sensors via BNC inputs and supplies the control signal for two evaporation sources via a Va stereo phone plug Up to six SQM 242 cards can be installed in a computer A single SAM 242 piggyback card with four analog inputs and two control outputs can also be installed Consult the se
63. lation for the process controller And finally the PLC s ladder logic programming provides fail safe process protection and allows VO to be easily tailored to each end user s installation 5 1 PLC Installation CAUTION The Omron PLC uses a special RS 232 cable as shown below Do not use a standard serial cable Damage to the SID 242 or the PLC could result SID 142 Serial Port PLC Port o s ss o s os e 5 fm o Cn H Bis WCS o 1 ES ae TR Lb es 9 so Mount the PLC controller near the devices it is controlling and sensing Connect the PLC to a properly grounded power source See the PLC User Manual on the SQS 242 CD ROM for detailed PLC mounting and connection information Connect the serial cable supplied from the PLC serial port to your computer serial port 5 1 Chapter 5 Digital VO Input Wiring The 0 0 to 0 11 inputs on Omron PLCs correspond to Inputs 1 to 12 in the SQS 242 software Omron PLC input wiring is shown below Input TE devices Output Wiring The PLC output relays are mapped to output events using the SOS 242 software s Edit System dialog VO Events tab Note Helays 1 to 8 in the SQS 242 software correspond to relays 10 00 to 10 07 on the PLC Relays 9 to 12 correspond to Omron relays 11 00 to 11 03 fa o9 o 9 ory oo Te cow cow cow os Cow oe cow oi os AD WARS 250 VAL DO WAL LUG 2AVOG 24 vDC Omron PLC output wir
64. n t need to totally eliminate ringing during the step if the steady state response is smooth Preconditioning will minimize step changes Set Preconditioning The power level you recorded as PWRon is the power where deposition just begins That s a good value for Ramp 1 power DW Po or slightly less is a good value for Ramp 2 Power This will eliminate a large step change when entering the deposition phase Once PID terms are established for a material they will typically be similar for other materials Only the P Term and preconditioning power levels may need adjustment Appendix C INI File Parameters Parameters that control operation of the SQS 242 program are stored in the SQS242 INI file Most of these are easily altered within the program and updated automatically However a few of the parameters cannot be changed within the program Use a text editor to alter the parameters listed below Note Always make a backup of the INI file before editing MDISize Left Top Width Height Screen size and location in pixels Debug True or False Show SQM 242 card error messages Show True or False True loops continuously through a process KillErrLog True or False True clears error log each time application NumberFormat 0 or 1 0 uses Windows setting for number format 1 uses the U S format i e 1 000 00 BackColor Color Default is BLACK ForeColor Color Default is LIGHTGRAY HighLightColor Color Default is WHITE Th
65. net A single serial communications cable runs to the SID 242 computer The PLC provides electrical isolation fail safe operation and extensive I O processing capabilities through its ladder logic programming See Chapter 5 for more information on digital VO capabilities 1 3 Chapter 1 Introduction Chapter 2 Quick Start 2 0 Introduction This section covers the minimum system connections and initial setup required to run the SID 242 Deposition Controller Consult later chapters of this manual for more detailed setup and operational instructions 2 1 Installation WARNING Care should be exercised to route SID 242 cables as far as practical from other cables that carry high voltages or generate noise This includes other line voltage cables wires to heaters that are SCR controlled and cables to source power supplies that may conduct high transient currents during arc down conditions Rack Installation Power Connection Sensor Input Connections Source Output Connections Digital VO Connections Keyboard Connection The SID 242 occupies a 5 25 high 4U rack space Install the unit in a 19 rack with the supplied hardware WARNING Verify that the 120 240 Voltage Selector Switch next to the power switch matches your mains supply voltage WARNING Verify that the power cable provided is connected to a properly grounded mains receptacle Connect the BNC cables and oscillators from your
66. nputs show zero or unstable readings the problem is almost certainly a wiring or sensor problem If the 96 Life is less than 50 Replace the crystal and assure that 96 Life is near 100 very stable If 96 Life is not near 10096 check the Frequency Min Max limits If the problem is not corrected Referring to Section 4 0 disconnect the 6 M F BNC cable from the feedthrough A test crystal and BNC barrel adapter is supplied with each Sigma oscillator Attach the test crystal to the 6 BNC cable as shown below 4 3 Chapter 4 SQM 242 Card The Sensor Readings display should show 5 5 MHz very stable If not contact Sigma Instruments technical support When a stable frequency reading is achieved with the test oscillator reconnect the sensor and verify a stable reading When stable sensor readings are achieved without deposition reconnect the source supply Start the deposition process in Manual mode with 0 output The Life readings should remain stable Slowly raise the 96 Output until a rate reading is displayed in Sensor Readings As material is deposited on the crystal the 96 Life reading should remain stable or drop slowly and consistently If not check your source supply for erratic output Also assure that the sensor is not too close to the source particularly in sputtering 4 4 2 Incorrect Rate or Thickness Measurement First complete the procedures in Section 4 4 1 to assure reliable sensor operation
67. o the next layer in the process If it is the last layer of a process the same as pushing ABORT PROCESS When AUTO MAN is pushed the source output is set to manual control You may adjust the output using the settings ribbon Because the PID loop is not running you can manually set the output power to different levels and observe the associated deposition rate Returns the output to PID loop control If the process is running ABORT PROCESS and STOP LAYER shown on the first two SoftKeys deposition continues If the process is stopped sets the output to zero and awaits a start command Resets the thickness reading to zero Sequences the setting ribbon through each Film in a codeposition layer When the settings ribbon is shown sequences the setting knob action through each of the displayed parameters 2 12 Chapter 2 Quick Start 2 7 Multi Layer CoDeposition Process Our final example builds on the previous sections If you have modified the setup of your process return to Section 2 4 and adjust the process to those values When your single layer process matches Section 2 4 complete these steps Duplicate a Open the Edit Process dialog Click on Layer 1 click the Layer Layer tab then click Copy Layer Now click Paste Layer A duplicate Gold Sample film will be added as Layer 2 Click Paste Layer again to add a third Gold Sample layer Select a Select Layer 3 in the layers list Now select Silver Sampl
68. of the deposit phase the relay will close its contacts When the deposit phase finishes the shutter relay contacts open Sensor Relays 1 to 8 These relays control sensor shutters Their function depends on whether you have single or dual sensors If Dual Sensor is not selected i e a single sensor the relay contacts close when Shutter Delay phase is entered on a layer with the sensor enabled As an example 3 28 Chapter 3 SQS 242 Software let s say you have sensors 1 and 3 enabled for Film 1 and sensors 2 and 4 enabled for Film 2 When you start Film 1 Shutter Delay phase the contacts for Sensor Relays 1 and 3 will close When you start Film 2 these contacts open and the contacts for Sensor Relays 2 and 4 will close when Shutter Delay is entered If the software is configured for dual sensors the relay operation is considerably different Dual sensors use pairs of sensors i e Sensor 1 and 2 or Sensor 3 and 4 With Sensors 1 or 3 selected the associated relay contacts are open If a Crystal Fail is detected the relay contacts for the failed sensor will close to select the second sensor in the Dual Sensor assembly for the duration of the film Xtal All Good and Xtal All Fail Relays These two relays provide an indication of the general health of your sensors If the Xtal All Good Relay is closed then all enabled sensors are returning a valid reading If the Xtal All Fail Relay is closed none of the enabled sensors are returnin
69. ogDelimit entry shows the character you wish to use To use a TAB character type the word Tab 3 3 4 File Print Print Process Prints the parameters for the current process to the system printer Select Print to File in the Printer Setup Menu to print the data to a file Print Setup Selects and modifies the current system printer 3 3 5 File User Login Displays the User Login screen so that a different user may log in The existing user is logged off automatically The user Access Level changes immediately to that of the new user See the Edit Security section for more information on Users Passwords and Access levels 3 3 6 File Exit Exits the SQS 242 deposition control program and saves the current data 3 7 Chapter 3 SQS 242 Software 3 4 Edit Menu 3 4 1 Edit Process A process is a sequence of thin film layers Multiple films deposited in the same layer are known as CoDeposition The Edit Process dialog provides the functions needed to develop a thin film deposition process from the database of existing films and materials Controls along the top of the Process Edit dialog box apply to the entire process Process A dropdown box that selects the process to be edited Defaults to the current process Below the process dropdown a listing of each layer assigned to the Process CoDeposition layers are listed with the same layer number but a different output Rename Edits the name of the selected process New
70. on screen keyboard Enter Password An Access Level is associated with each User Name The Access Level controls which software functions are available to each user For example only users with an Access Level of Supervisor can add new users See the Security section of this chapter for information on setting up users 3 3 Chapter 3 SQS 242 Software The remainder of this chapter covers the purpose and operation of each software function arranged by menu selections For a more operational approach consult the previous Quick Start chapter Menus The menus along the top of the main screen provide access to functions for building deposition processes configuring the hardware for your vacuum system and data display SoftKeys The six switches to the left of the display are used for the normal operation of the instrument and to navigate the setup programs see below for the individual switch functions Normally you press the button that is adjacent to the labels on the SID 242 screen but you can also use the mouse Just move the cursor over the key label on screen and single click the mouse You can also use the keyboard F1 to F6 function keys to simulate the front panel function switches The SoftKeys change during operation to address different user input requirements Setting Knob The knob to the right of the display is used by the SID 242 to set numeric data The keyboard keys or the on screen up down arrows can also be
71. own from 15A s to 0 Similarly at 400 kA thickness the Gold Sample film ramps to a higher deposition rate of 15A s Because the initial rate for Gold was set lower than the initial rate for Silver Gold reached its 400 kA thickness rate ramp trigger later in the deposition cycle Try a P Term in the 25 30 range less gain for both Gold and Silver to decrease the loop susceptibility to noise Increasing the Term a little say toward 1 0 will lessen overshoot during rate changes The D term can be thought of as a dead band term Most systems require little or no D term 2 8 Conclusion Once again spend some time with this process to become familiar with its setup and the effect of changes on deposition performance Because we selected Simulate Mode at the beginning of this Quick Start session the SQM 242 card is faking an actual process You can use the Simulate feature at any time to become familiar with SID 242 operation and the effect of various settings on process performance It is also a very useful feature for pre testing your process setups Return to the Edit menu then select System and set the Mode to Normal to begin running your process with the SID 242 controller 2 16 Chapter 2 Quick Start 2 17 Chapter 3 SQS 242 Software 3 0 Introduction The SQS 242 Deposition Control Software works with Sigma Instrument s SQM 242 Card to provide a powerful PC based Thin Film Deposition Controller that can
72. parate SQM 242 card User s Guide for detailed information on installing SQM 242 and SAM 242 cards 1 3 SQS 242 CoDeposition Control Software Included with the SID 242 is Sigma s SQS 242 software a Windows based program that provides all of the functions required for an eight sensor six output CoDeposition controller It is optimized for use with the Setting Knob and six SoftKeys of our SID 242 controller However it will run on any Win98 or later system with our SQM 242 and SAM 242 cards installed 1 2 Chapter 1 Introduction The six SoftKeys provide easy access to the common operating functions A single tabbed dialog box provides all of the settings required for a thin film process Material parameters sensor source setup pre post conditioning and error conditions are all visible on a single screen Process settings numeric data and graphical displays are displayed during all phases of deposition The SQS 242 software stores process parameters in a Microsoft Access compatible database This provides virtually unlimited access to desktop tools for building and analyzing thin film processes The SQS 242 software can be controlled from another computer using the RS 232 or Ethernet command protocol 1 4 Digital VO Digital VO for the SID 242 is provided through an inexpensive external programmable logic controller PLC This allows the PLC and the associated I O wiring to be placed in a convenient location in a wiring cabi
73. psed Remain Run Number N Percent Complete i i i i i A i l Operating SoftKeys Film Measurements Film Settings Setup Click the View menu and assure that these options are Displays selected Film Settings Film Readings and Automatic Note that the settings ribbon along the right side of the screen displays the pre conditioning parameters you entered in the previous section Start Verify that the top SoftKey label displays START SIMULATE Process If START PROCESS is displayed follow the instructions at the end of Section 2 3 to enable simulate mode Press the START SIMULATE SoftKey to start the process 2 9 Chapter 2 Quick Start The process will start with preconditioning i e Ramp1 Soak1 Ramp2 Soak2 as shown below Once preconditioning is complete the process will enter the Deposit phase You may want to select ABORT SIMULATE then START SIMULATE several times to familiarize yourself with the on screen displays during preconditioning You may also want to use the settings ribbon to adjust parameters while the process is running Preconditioning Phases Because we selected Automatic in the View menu the graph displays Output Power during preconditioning then switches to Rate during the deposition phase 2 10 Chapter 2 Quick Start As shown below the initial deposition rate was 10 A s until a thickness of 400 kA Then the deposition rate
74. rors Film Output Input Gold Sample Output 1 Sensor s SetPt Final Thick Time EndPt Thk EndPt System Setup 10 00 0 500 n 0 00 E 000 Default Als kA Auto Start Indexers Continuous Source Substrate Userl User2 KS Rene None None None None Index Index Index Index Film DropDown Box Assigns a film to the selected layer A film is basically a Material plus the other settings shown on the Deposit Condition Source Sensor and Error tabs Output DropDown Box Selects the output that is used for deposition of the selected layers film A particular film often uses the same output i e a thermal boat or EBeam pocket Note Due to the way outputs are stored in the process database the physical output number not its name is listed in the layers listing Outputs 1 and 2 refer to the first SQM 242 card outputs Outputs 3 and 4 refer to the second SQM 242 card outputs if installed Outputs 13 and 14 are the SAM 242 card outputs if installed Input DropDown Box Selects the input used to measure and control deposition of the selected layer The combination of an output and its input defines the deposition control loop for the selected layer The Input selection can significantly alter operation of the deposition phase as described in the following discussion on the SetPt parameter SetPt The function of the setpoint parameter depends on the Input dropdown If Sensor s are used
75. rt Auto Start begins the next layer automatically upon completion of the previous layer Continuous ignores Conditioning phases and controls continuously at rate setpoint see Analog Inputs If Manual Start is selected the previous layer ends at its idle power and waits for the user to push the Start Layer switch An optional User prompt can be entered for Manual Start layers This feature can be disabled by editing ShowPrompts in the SQS242 INI file Note The following parameters are common to all of the films in a layer In the previous screen shot for this section both layer 1 1 and 1 2 would share common values for the following parameters Layer 2 1 could have different values System Setup System setup assigns outputs to their controlling sensors called sensor mapping It also determines which physical sensor and output connections are displayed on the main screen See Edit System for detailed System Setup information Source Index Assigns each film to a specific source indexer pocket one of 16 values Each of the six possible outputs is associated with a unique source indexer These values are sent to the digital VO PLC at the beginning of each layer Substrate Index If using a substrate indexer assigns the substrate to one of 16 possible values These values are set at the beginning of each layer User1 User2 Index These additional values are output to the PLC for use as needed Common applications are to select external
76. rty agrees to accept the terms of this agreement Licensee may terminate this license by destroying all copies of the software Table of Contents Chapter 1 Introduction 1 0 SID 242 dee c HOT cordero du cA det Ed M d cM uu Md NE M LM 1 1 1 1 SRC Series Computer etra ha osi nies eir e bibi tio bis 1 1 1 2 SQM 242 Deposition Control Card EES t EE Ge E He ER RES 1 2 1 8 SQS 242 CoDeposition Control Software ee ee 1 2 A48 EDITO ERO o tuom RS rco tate osa toe oo tun opto pid optat oce 1 3 Chapter 2 Quick Start A dee iod hs oed ocn as ie ncn go ene ua ee EE Rt 2 1 za Italo cop co pro uod uet ove mo 2 1 EN EES IE EE OE OE RE AR OE Lette att 2 2 A le En EE 2 3 2 4 Single Layer Process Setup ee 2 5 2 5 Single Layer Process Simulation EE 2 9 2 6 SoftKey Functions SE e Ace il ls LA LM ue ede te 2 12 2 7 Multi Layer CoDeposition Process see ee ee ee ee ee ee 2 13 20 Seile ei codi iii 2 16 Chapter 3 SOS 242 Software A A eE AEE EDAEN E EDENDE Re r a e eai 3 1 3 1 Installation and Registration ee 3 2 SE le E KERE EE M DALAI M LULA LA ME 3 3 2 9 Mle MERE dois RE EES M autas auta ee ee ee ics iced 3 5 KE IN te 3 5 3 3 2 Open Save Database iese RA RR ee nennen nnne 3 5 2313 9 Data LOGOING LE ENE RE EE ER hs ee EE 3 6 E des EE 3 7 1555 WISE Ee ee OE OE EO EE RE ELE EL ON 3 7 A 3 7 3 4 Edit MGA mec n 3 8 9 4 1 BIOGOSSOS ois dete E eae ee ee 3 8 DAV CIS As ERE Um re hE m De sh
77. s when using a new crystal If the Z Factor for your material is not known using crystals with gt 80 life will eliminate the effect of the Z Factor term 3 22 Chapter 3 SQS 242 Software 3 4 4 Edit System The System Setup dialog box configures the SQS 242 software to the physical setup of your deposition system Several settings that control the overall operation of the program are also accessed in System Setup The combination of sensor input and control output assignments known as a System Setup are stored in the SQS 242 database Most systems will have a single setup that applies to all processes However complex systems may use several different system setups within a single process Note Settings on the Outputs Sensors Analog and Cards tabs are unique for each System Setup Settings on the Indexers VO and Comm tabs apply to all System Setups Output colors are also common to all setups Zu e yrs bem Stu Chamiver zl gna w Det Cripuis Sensors Analog indexers Cards Comm Name W FRO Color Tow N d m Tesi Duiput res B sum Controls along the top of the System Setup dialog box apply to the selected system setup System Setup A dropdown box that selects the setup to be edited Defaults to the current setup Rename Edits the name of the selected setup New Creates a new system setup based on the existing default setup Delete Deletes the currently selected setup from the
78. ssign the film to the desired codeposition layers Remember that each film in a codeposited layer must be assigned to a different source output Review this example until you are comfortable with these concepts Edit Layer 1 Click Silver Sample in the list of layers Set Initial Rate to 15 Rate amp Thickness Ais Final Thickness to 1 500 kA Click the Rate Ramps tab and adjust Start Thickness to 0 400 k Ramp Time to 15 seconds and New Rate to 0 A s Edit Layer 2 Click the Layer Tab then click Layer 2 Gold Sample Set Final Rate amp Thickness Thickness to 5000 kA Set Layers to At the end of deposition you may choose to have the next Auto Start layer wait for a Start Layer command or to start automatically Select each Layer in the layers list then click Auto to set that layer to start automatically N Process Edit Sample Save Rename Delete Copy 7 Layer Out Film SetPt Thickness Time Cut Layer Copy Layer Paste Layer Paste CoDep Layer RateRamps Deposit Condition Source Sensor Errors Film Output Input Gold Sample Output 1 Sensor s SetPt Final Thick TimeEndPt Thk EndPt System Setup 10 00 0 500 BS RE 0 000 Defaut Als kA Auto Start Indexers Continuous Source Substrate Userl User2 fs Bim None None None None Index Index Index Index Ef Verify that your process matches the one shown above 2 14 Chapter Edit Silver
79. st select Cancel from the pop up keyboard 3 5 Chapter 3 SQS 242 Software 3 3 3 File Data Logging Logs data from a deposition process to a disk LOG file There are four options for file naming and logging Log File Select None to disable data logging If Overwrite is selected the last run of the process is saved as FileName LOG where FileName is the name shown in the FileName text box Subsequent runs overwrite the log file If Append is selected each run is appended to FileName LOG If Run is selected each run of the process is saved as a separate file under the format FileName Runz LOG Changing Run on this screen will also change the Run displayed at the top of the main program screen Data Logging Log File Events to Log Mans End Deposit Phese C Dverwnlg End Each Phase i Append 10 Events C Fund i Tmed as Sac Filename Sensors FemleSaa Analog inputs Select Wine Readings iyymmddlag Format Sh Owen ox Cancel DE SE Normally the log file is saved to the folder where the program is installed If desired you can click Select and navigate to a different folder Log files can be viewed in Notepad by clicking the View button Note To avoid delays in data acquisition DO NOT log data to a floppy disk file Instead save to the hard disk and transfer the files to a floppy disk later Events to Log A number of events can trigger a data entry in the log fil
80. t Condition Source Sensor Errors Film Output Input Gold Sample Output 1 Sensors Final Thick TimaEndFi Thk End Systam Setup Eet BR mc C Amo Start indexers Continuous Source Subsinete Leper Limerd E Menua rione rione Hore Hore mem Pramp Joere iritis lrei Index Type a new process name using your keyboard or the touchpad and on screen keyboard Click Enter to save the new process name 2 4 Chapter 2 Quick Start Edit Layer Parameters Click the Layer tab to display the layer parameters Layer RateRamps Deposit Condition Source Sensor Errors Film Cup Input EX Gold Sample Output l Sensors EE Thick End EndPt Eie C Auto Start Bead Continuous Source Substrate Useri Usg iE Meno Hone Hone Hone E doe SE Uses Prompl Index Index Index A Film is basically a material plus the settings that will control its deposition Select Gold Sample in the Film dropdown box We will be simulating a quartz sensor input that is controlling the deposition rate of Output 1 Select Output 1 in the Output dropdown and Sensor s in the Input dropdown Click the SetPt setting and then use the Control Knob or your keyboard to adjust the rate setpoint to 10 A s Adjust the Final Thickness to 1 000 kA Time and Thickness Endpoints won t be used for this example System Setup determines the physical inputs and outputs that are used and displ
81. t name to the Network name or IP Address of the computer you wish to communicate with Enter a 1 for the Ethernet Port to disable the Ethernet functions 6 3 ActiveX COM Interface Any program that supports Microsoft s COM Active X interface i e LabView Wonderware etc can communicate with the SQS 242 program A small ActiveX interface program SQS242X EXE provides receive data and transmit data entry points to the global cComm242 class Contact Sigma Instruments for examples in other languages and detailed technical information The SQS242 Comm demo program discussed in the next section provides a Visual Basic example of using another program to control the SQS 242 program 6 1 Chapter 6 Computer Interface 6 4 SQS 242 Comm Program SQS 242 Comm found on the SQS 242 CDROM is a simple Windows program to demonstrate SQS 242 communications concepts With SQS 242 Comm you can easily send commands to and read the responses returned by the SQS 242 program SQS 242 Comm is written in Visual Basic and the source code is included as an example of programming concepts for computer interfacing Setup for RS 232 or Ethernet In the SQS 242 program select Edit System and set the RS 232 or Ethernet settings as detailed in the previous sections Load the Comm program on a computer the host and connect an Ethernet or RS 232 cable between the host and the computer running the SQS 242 program Start the Comm program on the host
82. um 0 53 5 9 Zinc Selenide 5 26 0 722 Lithium Fluoride 2 64 0 774 Zinc Sulfide 4 09 0 775 Magnesium 1 74 1 61 Zirconium Oxide 5 6 1 001 Appendix The equation governing all quartz crystal thin film monitors and controllers is Pa Fe F q ND Ti 0 T T D m C Z tan where the constant terms for the quartz crystal are H AT crystal constant N q 1 668 wi m Density of Quartz Dau 2 648 7 cm For example a material and sensor frequency change of Density of material D n 2 70097 cm Z Factor of material Z 1 00 Starting Frequency F q 6000000 Hz Ending Frequency F c 5999995 Hz Yields a Thickness in Angstroms of Tem 2 272 Z Factor is used to match the acoustic impedance of the deposited material Zm to that of the base quartz material Zg 8 83 of the sensor crystal Z Factor Zq Zm For example the acoustic impedance of gold is Z 23 18 so Gold Z Factor 8 83 23 18 381 Finally Z Factor can be calculated using the Shear Modulus of quartz Ug and the deposited material Um Z Da Ug Dm Un where U 32GPa Appendix B Loop Tuning This section will help you adjust your control loop PID parameters to achieve a stable deposition process Keep in mind that there is no best way to determine PID parameters and no one set of settings that are best Setup System Parameters Be sure that the output Full Scale voltage and crystal
83. urce Indexer Index Input Type Sensors 0 TimedPower 1 System Configuration Source Indexer Done Layer Indexer 1 Done Layer Indexer 2 Done Layer Indexer 3 Done A s V or 9o Power kA mm ss kA 0 1 0 to 15 250 characters or less kA mm ss A s 0 to 15 0 to 15 0 to 15 0 to 15 Analog1 4 2 5 0 1 0 1 0 1 0 1 6 8 Chapter 6 Computer Interface Query Update Film QF lt param1 gt lt layer gt lt output gt UF lt param1 gt lt layer gt lt output gt lt value gt Note lt layer gt 0 is active layer where lt param1 gt is P Term Term D Term Shutter Delay Status 0 1 Shutter Timeout Shutter Accuracy Control Error Status 0 1 2 Control Error Accuracy Rate Sampling Status 0 1 2 Sample Accuracy Sample Time Sample Hold Ramp 1 Power Ramp 1 Time Soak 1 Time Ramp 2 Power Ramp 2 Time Soak 2 Time Feed Power Feed Ramp Time Feed Time Idle Power Idle Ramp Time Output 1 6 Source Index obsolete Max Power Slew Rate Material Tooling n n 1 to 8 AutoSoak2 0 1 6 9 Chapter Query Utility 01 6 Computer Interface QU lt param1 gt SQM242 DLL Version 02 SQM242 Mode 0 1 03 SQM242 Period 04 SQM242 Filter 05 SQM242 Number of Cards Installed 06 Front Panel Enabled 0 1 07 Application Visible 0 1 11 SID242 Software Version 12 SID242 Operating System 13 SID 242 Computer Name Update Utility QU lt param1 gt lt Index gt 02
84. which sensor s are visible Only those sensors mapped to the layer s output are visible 3 17 Chapter 3 SQS 242 Software Errors Tab Several source or sensor error conditions are possible during deposition This tab establishes the program s response to errors Note It is best to leave all error settings except Crystal Fail disabled until you are confident of the stability and repeatability of your process ZW process Fat E D Sample Seve D Rename Diaw Delete Copy Lear Cut Film Salt Thickness Time Cut Lena 1 2 BilverSample 15 n5 n sales del 1 Gold Sample 1 1 5 Copy Layer Layar EntoFiamps Dapasa Condition Saurce Sensor Errors Om Error Ignore Spp Lever C Timed Power Control Error Crretal Fail Crystal Gunliby Crystal Stabilihy Enabled Ennblad Enabled Enabled Ki Counts Singha Hz 5 00 000 00 mec Counts Total Hr Control Error If the control loop cannot maintain the desired deposition rate due to loss of source material excessively high rate ramps or equipment malfunction a control error occurs Control error is the accuracy that must be exceeded for the specified time in seconds to trigger a control error Use shutter delay accuracy to assure adequate process control before entering the deposition phase Crystal Fail Establishes the number of bad readings i e 0 Hz from a sensor that generates a Crystal Fail condition If a crystal fails the PID loop will
85. y and maintain that accuracy before deposition begins If the accuracy is not reached within Wait seconds the process halts If accuracy is achieved and maintained for Hold seconds then the substrate shutter opens and deposition begins The Thickness reading is zeroed at the end of the shutter delay period 3 13 Chapter 3 SQS 242 Software Rate Sampling Rate sampling can extend the life of crystals With rate sampling the deposition rate is sampled for a period of time then the sensor shutter is closed Power is then held at the same level as the final power setting during the sample period Continuous selects no sampling the sensor shutter remains open during deposition Accuracy Based sampling opens the shutter until the desired accuracy is reached leaves the shutter open for Sample time then closes the shutter and holds power constant for Hold time Time Based sampling opens the shutter for a fixed period of time then closes it for a fixed time 3 14 Chapter 3 SQS 242 Software Condition Tab Before deposition begins it is often necessary to PreCondition the source material This places the system at the proper power level to achieve rapid PID control when deposition begins eh Process Edit Sample Save Rename Delete Copy Layer Out Film SetPt Gold Sample 10 Thickness Time Cut Layer Copy Layer Paste Layer Paste CoDep Layer RateRamps Deposit Condition Source Sensor Errors Lay de ps
86. y selected layer number Attempting to paste a layer that uses an output already assigned to the selected layer generates an error message Hint To add layers to a process it is easiest to select an existing layer in the layers list then click Copy Click Paste repeatedly to insert several temporary layers Next assign the proper film and layers parameters to each of these temporary layers To change one of the temporary layers to a CoDep layer highlight the temporary layer and click Cut Layer Next click the layer desired for CoDep and click Paste CoDep to assign the selected layer The Multi Layer CoDeposition Process section of Chapter 2 illustrates this concept Controls in the tabbed control apply to the layer selected above in the Layers list The Layer and Rate Ramp tabs assign layer specific parameters to the selected layer Note that captions on the Layer tab may change depending on the input and output selections The remaining tabs provide access to the film assigned to the selected layer Note Edits to the Deposition Condition Source Sensor and Error tabs will affect all processes and layers that use the selected film 3 9 Chapter 3 SQS 242 Software Layer Tab lt Process Edit Sample Save Rename Delete Copy T Layer Out Film SetPt Thickness Time Gold Sample Cut Layer Silver Sample E Copy Layer Paste Layer Paste CoDep Layer RateRamps Deposit Condition Source Sensor Er

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