COLOR MONITOR SERVICE MANUAL
Contents
1. 1 NO POWER NO POWER POWER INDICATOR OFF NO CHECK ADAPTER AND TEST WITH ANOTHER ONE U503 PIN 5 NO CHECK U503 AND OLTAGE 5V 2 AROUND CIRCUIT IS U501 T PIN3 3 3V CHECK U501 VOLTAGE pes 15 U502 PIN2 1 8V CHECK U502 VOLTAGE 3 CHECK NO 1 U101 PIN 127 PULSE CHECK X TAL pe CHECK U101 AND U102 Waveforms 1 9101 127 Tek MUTE 25 0GS s 975 Acas E ne 14 2 Low signal lU amplitude i j 46 015 7 2607 s Dec 2004 BE 1 00 11 51 39 14 2 NO RASTER OSD IS NOT DISPLAYED INVERTER NO RASTER OSD IS NOT DISPLAYED 4403 PIN1 PIN2 12V J403 PIN7 3 3V YES J403 PIN6 AND PULSE YES CHECK PULSE AS CONTACTING SCOP PROBE TO CAUTION LABEL CONTACT PROBE TO CAUTION LABEL AN YOU SEE PULS AT YOUR SCOPE REPLACE CCFL LAMP IN THE LCD MODULE NO NO CHECK 12V LINE AND FIND OUT A OPEN POINT AS OPENING EACH POWER LINE NO CHECK MICOM INV ON OFF PORT NO CHECK SCALER DIM ADJ PORT REPLACE INVERTER gt AND RECHECK 15 3 NO RASTER OSD IS DISPLAYED MSTAR NO RASTER OSD IS NOT DISPLAYED U101 PIN 71 87 NO gt CHECK 0501 3 3V2. 716 1H XE TO CONTROL KEY mxi mxit 9415 1 2 Au D ScLB 122 D SDAB R417 100 LED_AMBER 5427 200 __ __ 2 KEYi 4 5 DOET DOCSVD 2 24 3 DC DC BLOCK Svst 1501 12VS KIA78D33F oa MLB 201209 0120p N2 m 3V PL 2 509 10518 ZZ 10042 zo iur 1 1000pF 16 L503 MLB 201209 0120P N2 a 3 3VD 510 C515 c519 ZZ 1000 iur 1000pF tev 0502 LD1117518TR 1 1502 MLB 201209 0120P N2 em 1 8VD 4 541 C516 C520 2 1000 iur 1000pF tev 45 2 5 1501 15uH ST gt SVS MP1583DNZZ 21 0 tur ep m C513 C508 0 O1uF 0 1uF C522 4 1000 16V C523 1000 16V 6524 1000 16V H A503 47K 0501 MBRS190T 6525 py 1000 16V gt este Lo 90 O4UF 100pF C501 0 tuF Br py 10042 7 H 15 READY a502 6503 py 100uF 9505 206 7 15 C504 py 10042 7 157 7 AGSOTKAOO 1A ASSOTKAO01A P3 AGSOTKAOO 1A 25 Jun 2006 P NO 3828950041 Printed in Korea
3. PIN127 128 NO 1 CHECK C110 C109 SOLDERING CONDITION OSCILLATE AS 14 31MHZ U101 PIN32 IS 48KHz H SYNC PIN33 IS 60Hz V SYNC NO 2 CHECK X101 3 TROUBLE IN U101 CHECK CONNECTION LINE IS PULSE APPEARED AT SIGNAL PINS AT MODE 123 TROUBLE IN CABLE OR LCD MODULE Waveforms FROM D SUB TO U101 1 U101 127 128 BIBITR 25 0G5 5 975 Acas 5 00 5 5 ET 2 U101 32 H SYNC 144 Acqs p A 3 30 1 56 C3 Freq 14 28775 Low signal amplitude 40 075 Chi 7 2 90V s Dec 2004 11 51 39 viv ICh oom 10 005 CHIS 2 44V 18 Aug 2004 09 00 51 2 U101 33 V SYNC _ 3 60 234 Rz histogram 910 05 Cht 7 1407 18 Aug 2004 09 02 50 16 4 TROUBLE IN DPM TROUBLE IN DPM NO CHECK PC gt PC IS NOT GOING INTO DPM OFF MODE CHECK R458 R459 CHECK U101 PIN 32 33 SYNC PULSE NO gt CHECK H V SYNC LINE TROUBLE IN U101 Waveforms SE 5 00 5 5 144 Er 1 SE 5 004575 3 Acas 4 ES histogram A Fe pow ERBEN T 2007 Mops Chi 244V 18 Aug 2004 oon Litas eT 15V 18 Aug 20
4. Left 70 min 80 Typ Right 70 min 80 Typ Top 60 min 75 Typ Bottom 70 min 85 Typ 2 2 Luminance 200 min 250 Typ 6500K 150 min 200 Typ 9300K 2 3 Contrast Ratio 450 min 700 1600 DCR SIGNAL Refer to the Timing Chart 3 1 Sync Signal Separate Sync Digital SOG Composite sync 3 2 Video Input Signal 1 Type G Analog 2 Voltage Level 0 0 71 a Color 0 0 0 Vp p b Color 7 0 0 467 Vp p c Color 15 0 0 714Vp p 3 Input Impedance 750 3 3 Operating Frequency Horizontal Analog 30 83kHz Horizontal Digital 30 71kHz Vertical 56 75Hz 5 2 Power Consumption MODE H V SYNC VIDEO POWER CONSUMPTION LED COLOR POWER ON NORMAL ON ON less than 39 W BLUE STAND BY OFF ON OFF less than 1 W AMBER SUSPEND ON OFF OFF less than 1 W AMBER DPMS OFF OFF OFF OFF less than 1 W AMBER POWER S W OFF less than 1W OFF 6 ENVIRONMENT 6 1 Operating Temperature 10 C 35 C 50 F 95 F Ambient 1026 8096 Non condensing 50 000 HRS with 9096 Confidence 50 000 Hours Min 6 2 Relative Humidity 6 3 MTBF Lamp Life 7 DIMENSIONS with TILT SWIVEL Width 411 3 mm 16 19 Depth 345 mm 13 58 Height 59 mm 2 32 8 WEIGHT with TILT SWIVEL Net Weight Gross Weight 5 4 kg 11 91 Ibs 7 45 kg 16 43 lbs PRECAUTION WARNING FOR TH
5. Turn off the power switch at the front side of the display 2 Wait for about 5 seconds and press MENU POWER switch with 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a Auto Color W B balance and Automatically sets the gain and offset value b NVRAM INIT EEPROM initialize 24C08 CLEAR To initialize using time d AGING Select Aging mode on off e R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually 9 R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B Gain value manually Analog Only i MODULE To select applied module 900008 1 6 eje o Video Signal 0 SKK 6 Generator 1 ee PARALLEL PORT 1900 00 0000009901 59 0 01000000 0 8l0 OFF ON 5 E E L 8 lt Power inlet required m 2 amp 4 ON 4 7 _ Power Select Switch 995 4 W 110V 220V TEM 74506 Power LED OFF be 74 806 ST Switch V Sync On Off Switch Switch must be ON Figure 1 Cable Connection 13 TROUBLESHOOTING GUIDE
6. sinks are correctly installed Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last b 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly Use only a grounded tip solderin
7. used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body Bend into a U shape the end of each of three leads remaining on the circuit board Bend into a U shape the replacement transistor leads Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection 2 3 4 Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads Remove the heat sink mounting screw if so equipped Carefully remove the transistor from the heat sink o
8. 04 09 00 51 5 17 WIRING DIAGRAM 30P 6631900080A 7P 6631T12006F 6P 6631T12006L EXPLODED VIEW SCHEMATIC DIAGRAM 1 SCALER 2 a LED BLUE 2 LED AMEER 2 5 ES REED 2 Hg lt OKEYO Loeb 0 o4uFTO Our ga 10uF 16V prO 2 He ls 1 2 C w Tw ao R116 C114 ala cle 5544 2 A 28 aloe E 5 3m ep up d al st lt g 1
9. 34 200 1152 900 V Lines 65 96 937 900 2 4 31 12 H Pixels 108 0 63 981 1688 1280 48 112 248 1280 x 1024 V Lines 60 02 1066 1024 1 3 38 13 H Pixels 135 0 79 976 1688 1280 16 144 248 1280 x 1024 V Lines 75 035 1066 1024 1 3 38 DISASSEMBLY 1 2 0 Disassembly Hinge Cover Remove the screws 3 4 Pull out the cable 5 6 1 Pull the front cover upward 1 Disassemble Control PCB 2 Then let the all latches are separated 2 Putthe front face down 7 Disassemble back cover BLOCK DIAGRAM Jeydepy q DdGO INOODIW SCINL ONIHOLIMS LAdNI Y31V9S SGAT 9QV l HM9SONnS L NEE AS jenueJeyig 8167141 22887 Bay Ag L Bay AS usej OldScIN DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is from 25MHz to 135 2 This part consists of the Scaler ADC and TMDS receiver The Scaler gets the video signal converted analog to digital interpolates input to 1280 X 1024 resolution signal and outputs 8 bit R G B
10. 919 qs s 8 8 8 5 5 5 5 5 5 5 5 5 9 5 5 5 2 z oo gt 6 6 GG G Z 2 2 2 S 6 S 2 2 Gla S G G S S K388Eg929552229292825883 GND 1 5455 zz ASSS 9 BYPASS _ 14 GND 12 in nd GPIO_P15 LVBOM en is 3 GPIO_P16 LVBOP s ali can DDCD_SDA LVB1M den 3 tur DDCD SCL LVB1P 2 osas gt 1 4 2 EVEEM 2 x u AVDD 33 1 LVB2P 2 te RXeP VBCKM mer 2 CLKOUTM 2 LVBCKP B 2 fa Rxe GND_2 0101 LVB3M Y 5 RX1P LVB3P PXA AXIN LVBAM Y3P B H TSUMOSSWHU LF ER RXOP GND 14 RXON VDDP 2 Ro GND 3 LVAOM 5 P m Ba Dine m Rxc YIMA i AVDD 33 3 LVA1P ipod iar AVDD 18 LVA2M u103 Ew BINOM 2 P 100 0107 0 0470 2 8104 56 C104 0 04747 BINOP LVACKM nu nus Nees od CLKOUTM A 4 7K 100 C198 0 GINOM LVACKP eh asi 2 _ 10 0 0474F GINOP LVA3M Ana 2 Fe ja 10000 SOGINO LVA3P vara tel po aiio vss 4 R103 100 O47uF RINOM LVA4M 1 SDATAI ans A104 56 C104 0 047UF R
11. E SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are important for safety These parts are marked on the schematic diagram and the feplaceneni parts list It is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or electric shock as this will result in damage to the screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel CAUTION Please use only a plastic screwdriver to protect yo
12. INOP 2 GND 4 VDDC 3 A REFM GPIO PO4 c108 Ead REFP GND_10 u T HSYNCO VODP_6 VSYNCO NC 13 er ie DICA SDA RS232 TX GND 9 a awe x isi DPCA SCL RS232_RX GND 8 pem SEN GPID P22 PWM1 NC 12 NT MODE VDDP 5 2 _ VODP_4 soo 4 9 s E dp ex A126 ae 501 9193 n127 8 o 1u asm 222222822 8 2 2 2 2 5 5 0212 9 NM ooa 2 2 Ws gt gt gt 1 2 8 d 8 3 S x a 5 44 0 E hi 888 i Im a 23 2 POWER amp WAFER 2 aos ES 12vs p 2 5 0 hd koso L basos Loos Lose our Tiooopr we ES D SOAA D SCLA J403 zac m cues MMEDSO1LTAG c SS ua lt p RAOG READY 8407 iK TO INVERTER lt 01 00 lt OEEPROM 4 2 lt SINVON osecala 2 4 2 i C410 0 O1uF 0420 0 107
13. Website http biz L Gservice com G E mail http www L GEservice com techsup html COLOR MONITOR CHASSIS NO LM62A MODEL FLATRONL1970HR L1970HR BFR A RQP Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL I CONTENTS SPECIFICATIONS 2 SERVICE OSD 2 teo eet 13 PRECAUTIONS essen einig 3 TROUBLESHOOTING GUIDE 14 TIMING CHART 7 WIRING DIAGRAM 2 2222 18 DISASSEMBLY 8 BLOCK p EAPCODED VIEW ii DISCRIPTION OF BLOCK DIAGRAM 10 REPLACEMENT PARTS LIST 21 ADJUSTMENT emet buie i 12 SCHEMATIC 23 SPECIFICATIONS 1 LCD CHARACTERISTICS 4 Max Resolution Type TFT Color LCD Module D sub Analog 1280 x 1024 75Hz Active Display Area 19inch Digital 1280 x 1024 60Hz Pixel Pitch 0 294 H x 0 294 V Color Depth 16 2M colors 5 POWER SUPPLY Size 396 0 H x 324 0 V x 17 5 D 5 1 Power AC 100 240V 50 60Hz 0 6A LVDS Hard coating 3H Anti Glare Normally White Transmissive mode 4 CCFL Electrical Interface Surface Treatment Operating Mode Backlight Unit N OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio 2 10
14. ectrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage Do not spray chemicals on or near this receiver or any of its assemblies Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 9096 9996 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required Do not defeat any plug socket voltage interlocks with which receivers covered by this service manual might be equipped Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat
15. f the circuit board Insert new transistor in the circuit board Solder each transistor lead and clip off excess lead Replace heat sink 2 3 4 5 6 Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body Bend the two remaining leads perpendicular y to the circuit board Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board Securely crimp each connection and solder it Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder 2 3 Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake Securely crimp the leads of replacement component around notch at stake top Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures 2 3 Circuit Board Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper
16. g iron to solder or unsolder ES devices Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40
17. lse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized and also the over power protection is also monitor by this part Photo Coupler isolation This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage Signal collection This part function is to collect the any change from the DC output and feed back to the primary through photo transistor 11 ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP Port Setup Windows 98 gt Don t need setup Windows 2000 XP gt Need to Port Setup This program is available to LCD Monitor only WinEDID 1 Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button C Click Write button c Remove all default number d Add 300 3FF 300 e Click Start button f Click Exit button 12 SERVICE OSD 1
18. omponent on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges TIMING CHART VIDEO A ey Din ap qae SYNC Ly om Dot Total Video Sync Front Blanking IV Polarity Clock Frequency Peod Tima A D Resolution 1 H Pixels 25 175 31 469 800 640 16 96 48 640 x 350 V Lines 70 09 449 350 37 2 60 2 H Pixels 28 321 31 468 900 720 18 108 54 720 X 400 V Lines 70 08 449 400 12 2 35 3 H Pixels 25 175 31 469 800 640 16 96 48 640 x 480 V Lines 59 94 525 480 10 2 33 4 H Pixels 31 5 37 5 840 640 16 64 120 640 x 480 V Lines 75 500 480 1 3 16 5 H Pixels 40 0 37 879 1056 800 40 128 88 800 x 600 V Lines 60 317 628 600 1 4 23 6 H Pixels 49 5 46 875 1056 800 16 80 160 800 x 600 V Lines 75 0 625 600 1 3 21 7 H Pixels 57 283 49 725 1152 832 32 64 224 832 624 V Lines 74 55 667 624 1 3 39 8 H Pixels 65 0 48 363 1344 1024 24 136 160 1024 x 768 V Lines 60 0 806 768 3 6 29 9 H Pixels 78 75 60 123 1312 1024 16 96 176 1024 x 768 V Lines 75 029 800 768 1 3 28 10 H Pixels 100 0 68 681 1456 1152 32 128 144 1152 870 V Lines 75 062 915 870 3 3 39 11 H Pixels 92 978 61 805 1504 1152 18 1
19. parts lead Keep the soldering iron tip clean and well tinned Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F Heat the component lead until the solder melts Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F First hold the soldering iron tip and solder the strand against the component lead until the solder melts b Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be
20. pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest c
21. signal to transmitter 2 Power Part This part consists of the 3 3V regulator to convert power which is provided 12V 5V in Power board and Micom 5V is provided for LCD panel Also 5V is converted 3 3V by regulator and 3 3V is converted 1 8V by regulator Converted power is provided for IC in the main board 3 MICOM Part This part consists of EEPROM IC which stores control data and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in EEPROM 10 LIPS Board Block Diagram 50 60Hz INPUT RECTIFIER SWITCHING 100kHz OUTPUT RECTIFIER COMPONENTS AND FILTER TRANSFORMER AND FILTER LINE 100 240V PWM PHOTO SIGNAL CONTROL Saupe COLLENT CIRCUIT ISOLATION ION PRIMARY SECONDARY INVERTER CIRCUIT High Voltage Operation description LIPS EMI components This part contains of EMI components to comply with global marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor and of course the primary protection fuse Input rectifier and filter This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer Output rectifier and filter This part function is to make a pu
22. urself from shock hazard during service operation WARNING BE CAREFUL ELECTRIC SHOCK If you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE CONDUIT etc To Instrument s exposed METALLIC PARTS 2221 1 5 Kohm 10W SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly Disconnecting or reconnecting any receiver electrical plug or other electrical connection Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of el
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