Heidelberg microPG
Contents
1. Figure 21 Positioning with automatic alignment of origin position a one alignment mark b two alignment marks e Manual Alignment This option allows to shift the design position with respect to the plate center see Figure 20 Positioning repeatability is unchanged e Auto Alignment lf a substrate already contains one or two alignment structures that were e g exposed in a previous run the design can be positioned with high accuracy with respect to these structures In the case of two marks even a rotational error of the plate position can be compensated see Figure 21 For more details on what conditions a structure has to fulfill to be usable as alignment structure how an automatic alignment sequence works and what has to be defined to use it please refer to the corresponding section further down Details on how exposures with alignment are done are given in the following sections Exposure Powe2. HEIDELBERG INSTRUMENTS wuPG 101 User Manual System Description The uPG 101 lithography system consists of two units firstly the lithography unit with the optics the stage the write head and the electronics and secondly the supply unit which contains the power supply as well as the compressed air conditioning It is controlled via a standard PC that is part of the system package LITHOGRAPHY UNIT Kf f 3 Figure 2 Lithography System Front Side 1 Cover lid with interlock circuit 2 System base 3 Stage 4 Vacuum field adjustment screws 5 Vacuum switch 6 Writehead 7 Vacuum and compressed air supply lines 8 Optics cover 9 Ventilation slits HEIDELBERG INSTRUMENTS uPG 101 User Manual Figure 3 Lithography System Back Side System power connector Service key switch safety interlock lamp Stage vacuum connector 6mm inner hose diameter Compressed air connector autofocus 4mm inner hose diameter Compressed air connector stage air bearings 8mm inner hose diameter Firewire connector Network connector for LAN HEIDELBERG INSTRUMENTS wuPG 101 User Manual SUPPLY UNIT Figure 4 Supply Unit Main power connector with voltage switch and fuse Main power switch Power connector to lithography system Compressed air inlet Particle filter and manometer for compressed air main line Compressed air circuit for autofocus Manometer and connector for autofocus compressed air line Con
3. e Writehead Control Writehead gt Up Down allows to manually move the write head up into the rectracted position or to focus down onto the substrate CAUTION Never focus close to or on the edge of a substrate Wrong use of the Writehead gt Down function can cause severe damage to the equipment ADVANCED CAMERA WINDOW FUNCTIONS e Focus De focus Function corresponding to Writehead gt Up Down e Camera stop Camera live Freezes the current camera image or unfreezes it if it is freezed 32 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Maintenance and Troubleshooting This section contains advice on some possible problems that might be encountered during operation of the PG 101 If you encounter a problem that can not be solved in this way please contact your Heidelberg Instruments service office see section Contact in the preface EXPOSURE RESULT PROBLEMS Problem Exposure does not start Possible causes air pressure low lid not closed properly software hangup Remedies check air pressure see system installation instructions on required values check on interlock lamp before starting a new exposure reboot system Problem Exposure was interrupted stage motors are disabled Possible causes air pressure low lid was opened motor capability to maintain stage speed against vibration shock was exceeded Remedies check air pressure see system installation instructions on required
4. 4 HEIDELBERG INSTRUMENTS uPG 101 User Manual Alignment Pins Vacuum Setting plate wafer Figure 16 Alignment pins placement 19 4 Make sure the resist coated side of the substrate is HEIDELBERG INSTRUMENTS wuPG 101 User Manual turned up and position it against the alignment pins lf the substrate bears alignment marks that should be used for exposure note that the coordinate system of the stage is oriented such that the x axis corresponds to a backward forward movement while the y axis corresponds to a left right movement when standing in front of the machine see Figure 17 lf a vacuum region bigger than 2 is required activate the required vacuum region extensions using the vacuum field adjustment screws 4 see Figure 17 Stage coordinate Figure 18 and the right part of Figure 16 on the system previous page Switch on the vacuum with the vacuum turn knob 5 Check whether the plate is really held tight by trying to move it slightly sideways If plate is not held switch off the vacuum and clean plate backside and chuck before trying again H problems persist use a different subtrate selected deselected If the substrate is thinner than or of equal thickness S D as the alignment pins remove the alignment pins _ l Close the cover lid and make sure the interlock Figure 18 Vacuum region selection lamp is off loading side CAUTION If the alignment pins are left on the stage during
5. p L Figure 8 Compressed air stage system supply unit front left to lithography unit back right 11 HEIDELBERG INSTRUMENTS uPG 101 User Manual 8 Connect the supply unit to the facility supplies using the supplied standard cable for the power and the 5 m braided hose for the compressed air GR e 40V 120V ON OFF i POWER ON Figure 10 Main power line connection supply unit back Figure 9 compressed air inlet supply unit front 9 Hook up the facility vacuum to the lithography unit back side using the 5 m long 6 mm inner diameter hose J 5 Figure 11 Vacuum connection lithography unit back 12 HEIDELBERG INSTRUMENTS wuPG 101 User Manual 10 Establish communication line connections firewire network between the lithography unit back side and the Control PC The network connection must be established directly using the crossover cable supplied with the system Firewire ie Cl o Figure 12 Communication line connectors lithography unit back 11 At the supply unit front side pull up the regulator knob of the inlet compressed air pressure left manometer to release it adjust it to 5 5 bar and push down the knob again to secure it S P i 2 i Ka Gg e 4 w M a J Ta ra S W St H inlet pressure autofocus 5 5 bar pressure D di N A Ki dr E e kal H e KS EN Ge Figure 13 Pressure manometers at supply unit front
6. HEIDELBERG INSTRUMENTS User Manual uHPG 1071 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Table of Contents PREFACE eras a ccc avec ctisesu cee wean once seat as eeccitsen de oe eens cece eayesude see actuary secdecken saci eunscvessstcesmdanadedeeescnens 3 Conventions used WEE 3 S lety INTOM AOD EEN 3 Related DocumentatiON sssrinin ninen nieni Enare E NARAR RARE SE naia EE 3 COA ege 4 CHOOSING AND PREPARING THE SYSTEM SITE cccccssseeeeeeeeeeeeeeesssneeeeeeeeeeeesneeeeees 5 SYSTEM DESCRIPTION BE 7 LMAOOFADAY al Lu 7 SUDON Re 9 UNPACKING AND INSTALLATION Sege EEN 10 System Installation Instruction ceecccccccseeeeeeeeeeeeeeeeeeeaeeeeeeeeeeeeseeeeeseeeeeeeeesaeeeeeeeesseeeeeeeesas 10 SYSTEM STARTUP AND SHUTDOWN ccccccccccssssseeeeeeeeeeeeessseeeeeeeseeoeasneseeeeeeeeoennneeeeees 14 EE 14 SNOWN NEE 14 DESIGN DATA ME 15 General design TUE 15 DXF specific d sign rUleS i iiissssrriirssiicsiniiiiasisrennn oi iianenskani ninina iad un kand E KERATON eask TENERA Rini EERE 15 SIS lee Leier 16 CIF SPECS Ce ele Re E 16 EXPOSURE eae cece eerste cece EE E E E E E 17 BEE 17 EE E DO E eoe 17 A EEGEN er ee eee ee ne Rna RENAE 17 Be le Load EE 18 EO SN EE 20 D Unloading and Processing c ccccsssccccseeeeeceeeeceeeeeeseeeeeesaeeesseeeeesaeeeesegeeesseeeesseseessneeneas 22 Manual Alignment Option 23 Automatic Alignment ODOM E 25 ADVANCED FEATURE E 29 SU SENES esnemesi iinne p
7. The design will be transferred to the lithography unit and converted into the machine data format some design parameters are listed and a preview appears in the preview window Clicking on the preview window will open the design in the standard viewing application set in the operating system Here the viewer tools can be used to Figure 14 e g Zoom into the design wizard Design window Note No changes to the design itself can be affected here Click on Next to continue B SUBSTRATE LOADING 1 Make sure the cover lid 1 is closed interlock Ga Teos Enea nose geng 7 lamp 12 off Click on the button Load Substrate The stage will move to the loading Load Substrate position at the front of the machine and the oe Loading Status window will open on the User Manual Alignment PC C Auto Alignment 2 Wait until all movement has finished Open the Stan Afen cover lid On the chuck mount the alignment pins in the appropriate positions for the plate size to be exposed see eft part of Figure 16 on next page 3 Switch off all light except safe light Take a Rea substrate out of its storage container Check Figure 15 Options window substrate quality Wizard e Never use out of date substrates e Do not use substrates with scratches on top or bottom visible contaminations in the resist or non uniform resist distribution in the area to be exposed no plate 2 3
8. e normal standard speed normal exposure dose e twice 2 speed double exposure dose e quadruple 1 4 speed quadruple exposure dose EXPOSURE OPTION FIXED AUTOFOCUS Use this option carefully Wrong usage may result in severe damage to the equipment The uPG uses a so called air gauge autofocus system to keep the substrate surface in the focus of the write lens This system uses compressed air that is blown onto the substrate around the write lens to measure the distance between lens and substrate by measuring the pressure buildup within the write head The signal is then used to keep this distance constant by regulating the z position of the lens with a piezo If the writehead is focused onto the substrate the gap between writehead and substrate is approximately 100 um The air gauge autofocus system is able to compensate surface fluctuations of 35 um to keep this distance stable and to ensure stable focus conditions Additionally the depth of focus of the write lens is approximately 10um which also enlarges tolerance of substrate level fluctuations The autofocus is a slow closed loop regulation which is responsible to readjust S Hee E small thickness fluctuations of large area substrates during exposure procedure As SES these changes actually occur very slowly the Z xg system has problems when passing 10 of 16 mW substrate edges When moving back to Expose Offset substrate level the autofoc
9. CAUTION Never touch the regulator for the AF pressure If the setting was changed a system service is necessary for readjustment of the autofocus system Note The manometer can be secured by pushing the turning knob down To release it pull the knob up HEIDELBERG INSTRUMENTS wuPG 101 User Manual System Startup and Shutdown STARTUP 1 Atthe System Supply Unit switch on the uUPG 101 with the On Off switch 19 The switch should light up 2 Make sure that air pressure for the stage is applied gt 5 0 bar and the lid is closed The Safety Interlock lamp 12 should be off 3 Power up the Control PC according to the manufacturers instructions 4 Wait for at least 20 minutes for the system to warm up and stabilise before doing an exposure SHUTDOWN 1 Close the Exposure Control Wizard Exit 2 Switch off the uPG system using the On Off switch on the supply unit 19 3 Power down the control PC according to the manufacturer s instructions HEIDELBERG INSTRUMENTS wuPG 101 User Manual Design Data The uPG 101 can expose designs created in one of the following formats o DXF Standard AutoCAD format o BMP Standard MS Windows Bitmap format This is the only format useable for grayscale exposures 3D resist structuring o CIF Caltech Intermediate Form easy to use language for direct definition of structures in a text file However to get the correct results certain rules have to be followed when creating the
10. an alignment mark image has to be Figure 28 Automatic Alignment created This can be done using the pPG101 Setup Camera system f Stage Control Click on Create Mark to open the Camera window Use the cross of buttons three on each side around 0 0 in the Stage Control frame to move the desired part of the substrate into the image field of the camera Stage movement happens stepwise and the button sizes denote the size of the step small buttons 100um medium buttons 400um large buttons 900um When moving the stage keep in mind that the x axis buttons move the stage from back to front while the y axis runs parallel to the loading edge right to left In the camera image on the other hand the x axis is horizontal and Figure 29 Stage the y axis vertical Control buttons Move To s Y 26 HEIDELBERG INSTRUMENTS wuPG 101 User Manual 5 Once the alignment mark is in view use the button Begtstrston Tass sequence of the Registration Tools frame to teach it to the et system First click on Make The camera window freezes and a green rectangle appears Move this rectangle roughly lean over the structure by left mouse click on the center and D drag and drop After the first drag and drop the green box becomes gray and a small cross appears in the center Click anywhere on the box and fine position the cross within the structure by drag and drop The position of this small cross defines the later alignment positi
11. expose series Era of the stage using alignment pins if necessary The size of the test sample should be at least 1x1 inch After the substrate is loaded the stage moves back to the center position and the exposure begins The standard uPG performance test pattern is exposed in a column of as many fields as were defined during setup Each of these fields is exposed with a different energy the highest one being at the top the lowest at the bottom Once the series has been finished unload the test sample and examine the exposures to determine the best energy The PG performance pattern resolution pattern circles 9um block grid E 10m Siemens stars ari SOOM Spiti OWI Sun PLL wu ef Wi WEE pattern 30 HEIDELBERG INSTRUMENTS wuPG 101 User Manual ENERGY MODES For some applications the energy of the installed laser might not be sufficient or the energy should be deposited in a more Swine smooth way e g to improve edge quality For these cases twice there is the possibility of reducing the speed at which the Se system exposes In this way the same area is exposed over a longer time allowing to deposit more energy or to deposit the same amount of energy more slowly In the menu Energy Mode choose the mode that should be used Each higher mode reduces exposure speed by half Once a mode is selected it stays active until another mode is chosen or the wizard is restarted esign
12. that marks the position where the design origin should be exposed For correct representation the size of the plate has to be given before the design shift can be entered The steps listed here should be executed after step C 1 of the standard exposure instruction 1 In the Check Options window if Manual Alignment was selected for Placement an additional setting selection for the substrate size will appear Enter the size of the substrate either in inch or centimeter check the according checkbox Note Only square substrate sizes may be entered Once all options are set click on Next to continue The following window is exclusive for the setup of exposures with manual alignment It is used to define the position of the design center relative to the plate center in the exposure By default the design origin is placed on the center of the plate If a different positioning is required the design can be shifted by adding or substracting an offset in x and y respectively In the Manual Alignment window a graphic representation shows the current position and size of the design green on the plate white as well as the maximum write area slash dottet square and the stage area grey The Orientation in this representation is like within the machine meaning that the y axis runs from right to left while the x axis runs from front to back bottom to top With the Zoom In button the representation zooms in to the mask area Cl
13. the additional steps necessary for preparing an exposure before proceeding 21 HEIDELBERG INSTRUMENTS wuPG 101 User Manual 3 After all parameters and options have been set Fam click on Next to proceed to the Expose Design __ window Here all options and parameters are displayed for crosscheck In addition options for the exposure itself can be chosen upg_acc cif rgy 10 of 16 m Expose Offset Centered Auto Unload after Exposure Once the exposure has finished the system automatically moves into the position for unloading Ze Expose with fixed Autofocus The air gauge autofocus system used to keep the distance between substrate and write lens constant only works reliably while the nozzle through which the air flows is completely above the substrate When writing is done very close to the substrate edges the method deteriorates and ultimately fails If exposures have to be done very close to substrate edges e g because the substrate is very small it is an option to expose with fixed autofocus The write lens then does not try to follow the substrate surface but stays fixed after the initial focussing See also the Chapter on Advanced Features ion IT Auto Unload after Exposure _ Expose with fixed Autofocus Preparing data please wait Figure 22 Expose window Wizard Click on Expose to start the exposure During an exposure the exposure status is s
14. an exposure of a thin substrate the system can take serious damage Click OK in the Loading Status window The stage will move to the center position and the write head will move down until the focal point is on the substrate top Click on Next C EXPOSING 1 In the next window options and parameters have to be set that depend on the substrate type that is used and on how the design should be positioned on this substrate Alignment By default No Alignment selected the Origin of the design which according to the design rules should coincide with the design center will be exposed in the plate center The accuracy of positioning is in this method given by the repeatability of loading against the alignment pins Other methods can be used to shift the design position on the plate and to increase the positioning accuracy These methods are called Alignment Methods The two available methods are Figure 19 Standard design positioning 20 HEIDELBERG INSTRUMENTS wuPG 101 User Manual
15. ane dae yet iina reaa inana Eesi Paaa is aeea i aaea daea Pir Uai 29 ENVOY ele 31 Exposure Option Fixed Autofocus ccccccseseseeeeeeceeeeeeeeeeeeeseeeeseeeeeeeeesseaeeeeessaeeeessaeeeeess 31 System Conirol FUNCHONS E 32 Advanced Camera Window Funchons 32 MAINTENANCE AND TROUBLESHOOTING ccccccccssseeseseeeeeeeeeeeesseeeeeeeeeeneeenseeeeeeeeeoneeenss 33 Exposure result problemS nannnneneannnnnnnnnennsrrnrreosrnrnrnsrnnrrensnnrnresnnrnrennanrrensrnrnnenennrrennennnee 33 Exposure Wizard error messages 34 PUSO a E E 34 EE EU EE 35 Doc No DWL HI 021 Revision 2 April 2008 Copyright 2008 by Heidelberg Instruments HEIDELBERG INSTRUMENTS wuPG 101 User Manual Preface CONVENTIONS USED Throughout this manual there are safety warnings To classify the degree of danger in each of these situations the following notation is used CAUTION Advises that you risk damaging your equipment if you do not heed instructions WARNING Advises that you risk danger to personal health if you do not follow instructions carefully SAFETY INFORMATION The uPG 101 is a class 1 laser product Opening of the optics cover turns it into a class 3B laser product WARNING The optics cover should only be opened by Heidelberg Instruments service engineers or trained personnel Unauthorized opening of the optics cover leads to immediate loss of warranty The uPG 101 is fused for 10A Electrical voltages of up to 230VAC an
16. camera Stage movement happens stepwise and the button sizes denote the size of the step effected by them small buttons 100um medium buttons 400um large buttons 900um When moving the stage keep in mind that the x axis oe buttons move the stage from back to front while the y axis runs parallel to the loading edge right to left In the camera Figure 25 image on the other hand the x axis is horizontal and the y axis Control buttons vertical To return to the plate center click on 0 0 Once the plate is in the correct position click into the image to activate the image field position detection A cross hair will appear Now click on the position in the image where the origin should be set e g on the structure center The cross hair will jump there and the position coordinates of this point will be displayed in the Exposure Offset text boxes of the Camera Window Push the Move To button to move the selected point to the center of the image field If the position is correct click Accept to return to the Manual Alignment window The selected coordinates are automatically transferred to the Expose Offset frame of this window Stage Control Stage Figure 26 Camera window Manual alignment 24 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Find Plate Center If the design should be exposed at the center of a structureless plate but with a higher precision than the mechanical alignment pins allow this method can be us
17. d 120V DC are present within the system when it is connected and turned on WARNING Removing any cover of the uPG 101 apart from those explicitly stated in this manual can make lethal voltages accessible Only Heidelberg Instruments service engineers or trained personnel should perform any tasks that include the removal of such a cover while the system is energized RELATED DOCUMENTATION Heidelberg Instruments offers further Manuals related to the machine and its operation lf you did not get one of these or need an update please contact Heidelberg Instruments Mikrotechnik Germany e Preinstallation Guide system requirements sizes and weights of components etc HEIDELBERG INSTRUMENTS pPG 101 User Manual CONTACT Should you need assistance please call Heidelberg Instruments during normal business hours CET Phone 49 6221 3430 0 Fax 49 6221 3430 30 or contact your local service office China Heidelberg Instruments China Rm 2320 21 Block A Qun Xing Plaza HuaQiang Rd North Fu Tian District 518028 Shenzhen Phone 86 755 8301599 1 2 Fax 86 755 25589180 Taiwan Heidelberg Instruments Taiwan 5F No 174 Chung Yang Road Hsinchu City Taiwan Phone 886 3531 1 304 284 Fax 886 35311 243 Korea Heidelberg Instruments Korea 718 Expo Officetel 381 Mannyeon dong Seo gu Deajeon 302 834 Korea Phone 82 42 482 1668 Fax 82 42 482 1669 Japan Heidelberg Instruments Japan Germany Center
18. delberg Instruments for details In addition to the electrical service the system needs compressed air and vacuum for its operation Power Compressed Air Vacuum The uPG can be operated with either 230V 50Hz or 110V 60Hz switchable at the supply unit The average power consumption during operation is 120 W Peak currents are 2 A 230V or 5 5A 110V The system is equipped with either a european type 230V plug or a US american type 110V plug The pressure of the compressed air has to be within 6 10 bar with a flow capacity of 5 standard liter per minute during regular operation incidentally up to 25 SL min One standard liter is one liter at 20 C and 1 bar pressure The vacuum is used to fix a substrate on the plate The pump has to be able to produce a pressure difference of 0 5 bar ata flow of 5 SL min HEIDELBERG INSTRUMENTS wuPG 101 User Manual 700 mm 630 mm Figure 1 Top view scetch of the uPG 101 To ensure a stable positioning and operation of the system the substructure on which the system will be placed should fulfill certain requirements Surface Size Weigth Capacity Stiffness Vibration Damping Placement The surface on which the system is placed should be at least as big as the system see Figure 1 The weight of the system is 120 kg The underconstruction has to be able to support this weigth without significant bending of the surface See Figure 1 for the positions of the suppo
19. design GENERAL DESIGN RULES Keep in mind that defined areas will be exposed Do not use special characters Spaces punctuation marks umlauts in the design name The design coordinate origin must be the center of the design If possible create the whole design in only one layer If several layers are used they will be merged using an OR function All polylines must be closed Keep in mind that interiors of polyline structures will be filled out completely covering any structures within Do not cross polylines or create doubled vertices vertices with no distance between them This will create data errors Do not use single lines without width Limits o maximum design size 100mm x 100mm o 1 000 000 vertices polygon o maximum definition or reference depth 16 o maximum number of definitions or references 100 000 DXF SPECIFIC DESIGN RULES Use a 100 AutoCAD compatible editor The design has to be created in metrical units As far as possible only use the structure types polyline circle and text Only one text font is provided This will replace any other font used in the design creation The only supported text attributes are rotated mirrored and scaled Try to use as few layers as possible All layers will be merged via an OR operation Do not use special characters in the layer names Polylines with width must not change their width tapered lines When inserting blocks the same scaling has to be us
20. ection 5 Exact coordinates have to be known for a point of the structure that can be clearly marked with a crosshair e g center of a cross with narrow lines corner of an L shape or square Different structures may be used for the two sites The automatic alignment sequence that can be executed before exposure consists of the following steps 1 Movement to the coordinates given for the first alignment site 2 Search for a predefined structure image alignment mark template within the camera field 3 Adjustment of the uPG coordinate origin so that the coordinates given for the site match the detected structure position Optional 4 Movement to the coordinates of the second alignment site 5 Search for the second predefined structure image alignment mark template within the camera field 6 Adjustment of the uPG coordinate system rotation so that the coordinates given for the second site match the detected structure position 20 Before an automatic alignment sequence can be run the position coordinates and an alignment mark template for each site that should be used have to be either defined or selected from a list Each position template pair forms an alignment site All sites together form an alignment data set The instructions given here set in after step C 1 of the HEIDELBERG INSTRUMENTS uPG 101 User Manual Exit Tools Energy Mode Writehead example al r Position No 1 a 25000 um 25000 um s
21. ed When it is started the positions of all four edges are detected using the distance values measured by the autofocus system From these the position of the exact center of the plate is calculated and the coordinates are displayed in the Expose Offset frame Here an additional offset can be added by modifying the numbers before continuing After the origin shift is defined click on Next and proceed with the exposure as usual step C 3 AUTOMATIC ALIGNMENT OPTION The uPG 101 offers the option of using an automatic alignment sequence for detection of one or two preexposed alignment structures on the plate and arranging the design position and in the case of two structures the rotation accordingly During the automatic alignment sequence detection of the alignment structure s is done via comparison of the contents of the camera image field with a predefined sample image of the structure alignment mark template For this image detection to work properly the stucture used as alignment mark has to fulfill certain properties 1 The structure should be simple recommended cross L shape or square 2 The structure size has to be at least 20um 3 No similar structures may be within the image field 100x100um even if the structure itself is not at the center but close to the border of the camera image 4 If two structures are used they should be as far apart from each other as possible to increase accuracy of the angular error det
22. ed Autofocus Preparing data please wait reason it is possible to uncheck the option Use Figure 32 Expose window Alignment Procedure to run the exposure without Auto Alignment previous automatic alignment 28 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Advanced Features At the top bar of the Exposure Wizard there are menues containing options and procedures for advanced handling of the uPG system This chapter explains functions and usage of these features In addition a deeper explanation of some advanced options encountered during the exposure process is given ENERGY SERIES For optimal exposure results the correct energy for a substrate has to be determined To avoid having to do many single exposures with manually changed energies the Expose Energy Series procedure was introduced Necessary exposure energies depend on type and thickness of the photosensitive coating reflectivity of the substrate and the developing process All these parameters have to be predetermined according to the intended application For more information on choice of substrate types and processing please refer to the corresponding publications on photolithography The energy series function is located in the Tools menu Tools Exit Tools Energy Mode Writehead gt Expose Energy Series Upon selection a window opens Expose Energy Series x e Reset Stage where the series can be configured The first step is to s
23. ed for x and y External blocks are not supported HEIDELBERG INSTRUMENTS wuPG 101 User Manual BMP SPECIFIC DESIGN RULES e Maximum image file size is 4 GB e For grayscale exposures use 8 bit format The 256 gray values will be interpolated down to 100 gray values e Create the design in a 90 counter clockwise rotated version as the design will be rotated 90 clockwise during data processing CIF SPECIFIC DESIGN RULES e Use only one layer If several layers exist in a design file only the layer with the most references will be written e Maximum definition or reference depth is 50 e The subroutine with the highest number definition will be taken as main routine HEIDELBERG INSTRUMENTS wuPG 101 User Manual Exposures GENERAL ADVICE e Take care to protect the substrates from light even safe light as far as possible and humidity at all times until developing is finished e Always wear lint free gloves e g Latex when handling the substrates e Recommended materials O O plates wafers resist developer Stripper flushing cleaning chromium covered soda lime glass plates with anti reflection coating application specific for recommendations contact the Heidelberg Instruments Customer Application Center thin film Shipley AZ15 or S18 series thick film Shipley AZ45 or AZ92 series refer to manufacturers documentation for selection of type and coating recommendations e g spin
24. elect the main laser power settings Depending on the laser type installed a POLO one ec ene EO certain laser power range can be used The laser en o power selected here correspond to the maximum EE power used in the series Enter a number and click OK to proceed At the next step you can choose whether to ne expose a wide range energy series or a small one Please choose type of series Back Coarse 10 100 stepping 10 The coarse series exposes 10 fields from 10 Deg until 100 pixel strength with steps of 10 It is stepping 1 starting al 50 OK recommended to execute a coarse series first At the fine series a starting point has to be defined 1 91 With increments of 1 10 exposures will cover a smaller but fin er area of exposure energy It is recommended to use this option if a coarse series was executed before and approximated energy was determined Select the required type of series and click OK to proceed 29 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Now the chosen energy series parameters are jm mumm displayed again for confirmation and the exposure SIMS CUI SEIS SS hel EE laser power procedure can be started with Execute Expose 10 fields stepping from 10 to 100 pixel pulse with 10 increments First you will be asked to load stage with a test sample on which the energy series should be sq EATER ea ents exposed Load a test sample in the center position test sample and
25. for Industry amp Trade 1 18 2 Hakusan Midori ku Yokohama 226 0006 Phone 81 45 938 5250 Fax 81 45 938 5251 USA Heidelberg Instruments Inc USA 2807 Oregon Court Unit E2 Torrance CA 90503 Phone 1 310 212 5071 Fax 1 310 212 5254 You can also reach Heidelberg Instruments via e mail himt himt de or visit our site on the Internet htto www himt de HEIDELBERG INSTRUMENTS wuPG 101 User Manual Choosing and Preparing the System Site The uPG 101 is an easy to use lithographic system developed for desktop setup To reach the specified exposure results the room in which the system is placed should fulfill certain conditions Temperature and Humidity The room temperature should be within 18 25 C Lighting Particles and stable within 1 C during the time of an exposure The heat load of the system to the room air is below 500 W The humidity in the room should be set to 50 10 and has to be below the condensation limit at any time Depending on the substrates used either yellow safe light photoresists or red safe light ohotoemulsion should be used The system cover does not protect the substrate from stray light exposure by outside light sources Depending on the desired quality and resolution of the products a certain cleanness of the air is required Recommended is a clean room class of at least 1000 i e less than 1000 particles of 0 5 micron size per cubic meter Please contact Hei
26. heck with a spirit level if it is leveled If adjustment is necessary remove the front cover of the system base by opening the screws with a 2 5 allen key With a 19 wrench release the countering bolt of the system foot that has to be adjusted Using a 5 wrench adjust then the height of the foot according to the spirit level Replace the front cover 5 Set up the Control PC within 3 m of the lithography unit Please refer to the PC manufacturers manual for details on the setup 6 Position the supply unit within 1 5m of the lithography unit Make sure it is set to the correct voltage rotary knob below the power plug on the back side of the power supply 7 Install the connections between the lithography unit and the Supply unit using the 1 5m power cable and the two 1 5m hoses see following pictures Figure 5 Voltage Selector HEIDELBERG INSTRUMENTS wuPG 101 User Manual Note All hose connectors allow fast and simple connecting Just push the hose into the connector To remove a hose push back the blue ring to release it and at the same time pull out the hose a System power connection Figure 6 System power connection from supply unit left to lithography system right b Compressed air for autofocus system 4 mm inner diameter hose O WW Figure 7 Compressed air autofocus supply unit front left to lithography unit back right c Compressed air for stage air bearings 8mm inner diameter hose i
27. hown online in the window Make sure that during the complete exposure time the cover lid stays closed and no white light is switched on In addition to get best results avoid vibrations caused by people passing by or heavy loads being moved on the floor close to the system To interrupt an exposure click on the red BREAK label in the Expose Design window After exposure is finished the write lens is retracted to the upper position and the stage moves automatically to the unloading position D UNLOADING AND PROCESSING 1 Wait until all movement has stopped Open the lid switch off the vacuum with the vacuum turn knob 5 and carefully lift the substrate off the chuck 2 Develop etch and strip the substrate according to the directions of the resist manufacturer and the manufacturers of the chemicals used e Never use out of date chemicals e If a dilution is used as developer always shake well before use so the heavier parts are well distributed 22 HEIDELBERG INSTRUMENTS wuPG 101 User Manual MANUAL ALIGNMENT OPTION In an exposure with manual alignment the position of the design on the substrate can be shifted with respect to the plate center This option can e g be used if the design Origin was not placed in the design center The Exposure Wizard offers the possibility of either directly entering offset values by which the design should be shifted or manually identifying the position of an existing structure on the substrate
28. ick Zoom Out to return to the view of the full stage There are two ways now of adjusting the design position on the mask Shift by values If the offset should be entered manually tyoe the required distances in um into the respective fields of the Exposure Offset frame Click on Offset to view the result in the graphic representation Exit Tools Energy Mode Writehead C No Alignment Manual Alignment Auto Alignment i Expose Options a ie mw 8 10 inverted r Substrat Size Figure 23 Manual Alignment option in Check Options window uPG101 Exposure Wizard Exit Tools Energy Mode Writehead lt Back Next gt Preparing data please wait Figure 24 Manual Alignment window Wizard 23 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Shift to structure Instead of a manual entry of the offset values they can also be determined by selecting the exact point where the design origin should be exposed on the plate in the camera image This is of use e g if there is a preexposed structure on the plate relative to which the design should be positioned To move the stage to the point of interest and mark the structure position the Camera Window has to be used which is opened by clicking on the button Camera In the Stage Control frame of the Camera window use the cross of buttons three on each side around 0 0 to move the desired position on the substrate into the image field of the
29. ll alignment sites are defined click on Save and enter a name under which the alignment data set should be saved The Setup Automatic Alignment window returns now to its original state of displaying the currently selected alignment data set The template image loaded for structure detection on site 1 is displayed in the image frame and the position of this structure is shown above it Clicking on the arrow buttons switches between the defined alignment sites 2 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Click on Next to continue In the Expose window use the additional function for automatic alignment testing to verify the functioning of the sequence with the defined data set before Starting the exposure Clicking on Test Alignment runs only the automatic alignment procedure If any mark is not found at the desired coordinates the alignment switches to manual and the camera window opens Using the Stage Control buttons move manually towards the alignment site then click Retry Alignment to continue Once the alignment procedure runs successfully the exposure can be run with automatic alignment lf there are problems with the procedure or the automatic sequence should not be used for any other uPG101 Exposure Wizard Exit Tools Energy Mode Writehead upg_acc cif 7 10 of 16 mW MV Use Alignment Procedure example Test Alignment O Expose ption IT Auto Unload after Exposure IT Expose with fix
30. nector for stage air bearings compressed air line Ventilator Ventilation slits HEIDELBERG INSTRUMENTS wuPG 101 User Manual Unpacking and Installation The uPG 101 comes in one wooden crate Please open the container only in an indoor location and with utmost care During unpacking please check the contents 1 Lithography unit 1 Supply unit 1 European or optionally US type main power cable 2 m 1 System power connection cable 25 Pins 1 5 m 1 3 4 inner diameter braided hose 5 m 1 compressed air connection adapter 1 8mm outer 6 mm inner diameter hose 5 m 16mm outer 4 mm inner diameter hose 1 5 m 1 4mm outer 3 mm inner diameter hose 1 5 m 1 Firewire cable Am 1 Network cable crossover 5 m 4 grip hole covers 6 Alignment pins 2 sets 1 Windows XP PC with accessoires keyboard mouse PC manuals software 1 Monitor SYSTEM INSTALLATION INSTRUCTION 1 Carefully lift the lithography unit out of the crate using the four grip holes on the sides of the system base CAUTION Weight of main system is 120 kg We recommend that the unit ist lifted by four people using the four gripholes To make uncrating easier the sides of the wooden box can be dismanteled 2 Place the lithography unit on the underconstruction Make sure the system is stable in its position and can not be moved accidentally 3 Close the grip holes in the system base side with the covers 4 Check if the system stands firmly on all four feet C
31. ning speed pre bake and post bake parameters etc TMAH series metal ion free or 351B commercial stripper or concentrated NaOH solution after exposure of the remaining resist with an UV lamp all flushing during processing should be done with DI water after the processing chrome plates can be cleaned using DI water and a mild detergent STEPS OF AN EXPOSURE For easy use the uPG 101 provides an Exposure Wizard that guides the operator through most steps of an exposure A DESIGN PREPARATION 1 Prepare the design in dxf bmp or cif format Please make sure the design complies with all design rules given above 2 3 If the design is not accessible via network from the control PC copy it to the PC manually e g using a floppy or CD Start the PG 101 Exposure Wizard using the link icon on the desktop S The startup screen will open showing the progress of the connect and initialization sequence This takes approximately two minutes Once the startup sequence is finished click on Next HEIDELBERG INSTRUMENTS wuPG 101 User Manual 4 In the following window click on Load Design Fatze Exit Tools Energy Mode Writehead Navigate to the directory on the PC or the network that contains the design file select it and click OK A dialog window requests the size that was defined for one drawing unit during design creation Only integer values may be entered for dxf and bmp designs Enter the number and click OK
32. on Therefore it is important that it is well positioned on that point within the structure of which the coordinates are known e g the center Figure 31 Examples for alignment of the alignment mark definition box to a structure left good alignment right bad alignment Figure 30 Registration Tools frame lf the structure is bigger than the rectangle the size of the definition box can be adjusted by click and drag on the lines Note Do not reduce the size below the original one Once you are satisfied with size and location of the box click on Learn The selected image part will appear as a small picture in the Registration Tools viewer Test the image by clicking Search If the image is found within the camera field a red box appears around the detected position To finish the alignment mark creation click on Save Name the mark and Close the camera window 6 In the alignment data setup window click on Add Mark Choose the alignment mark image that should be used as template Click OK and enter in the following two dialog boxes first the x and then the y postion of this mark with respect to the plate center in um Now the template image of the mark is shown together with the coordinates entered in the lower part of the Alignment Setup window 7 To define a second site repeat this procedure from step 3 on Once the second site is defined the arrows serve to toggle between the viewing of the two sites 8 Once a
33. r There are two parameters that influence the amount of energy that is deposited on the resist surface On the one hand the output power of the laser in mW Milliwatt can be regulated left value on the other hand the power can be reduced further in finer steps by setting the pixel pulse duration in percent right value In general it is recommendable to avoid very low laser output power as the relative noise increases towards low output power levels The output power needed for a certain exposure depends on the type and thickness of the photoresist used For a resist with spectral sensitivity of 70mJ cm a laser output power of 8 mW in conjunction with a 50 pixel pulse length is needed to expose the resist To find the right energy for a certain type of substrates several exposures have to be done at different energy levels until the energy is found that gives the best result in structure size and quality Note f good edge quality of the exposed structures is important it is recommendable to decrease the design structure sizes by 1 2 um and increase the laser power until the exposed structure sizes reach the required size Inverted Per default the structures that were defined in the design are exposed on the substrate If the checkbox option Inverted is selected all areas with no structure defined are exposed instead If an option other than No Alignment was chosen in the Placement frame refer to the correlated section below for
34. rting feet of the system The uPG 101 uses a fast scanning stage system to move the substrate during an exposure To ensure a stable performance of this system the underconsiruction has to be able to resist lateral forces of up to 20N at a frequency ranging from 0 5 Hz to 5 Hz without starting to swing or rock significantly also when loaded with a weight of 100 kg The Heidelberg Instruments system is equipped with rubber feet for coarse vibration damping However for optimum results it is recommendable to use an underconstruction with additional damping e g a damped table for microscopes However the above mentioned stiffness requirements have to be taken into account in the layout of any damping system The system should be placed as close as possible to the outlets for power compressed air and vacuum Cables and hoses for connection of the supply unit to the facility outlets are provided with 2 m length The connections between the supply unit and the system have a length of 1 5 m Measured from the surface of the underconstruction a free height of at least 700 mm is needed for the complete system At the back of the system at least 100 mm should be kept free for the cables and hoses connecting to the supply unit CAUTION The ventilation slits on the top and at both sides of both the lithography system and the supply unit have to be kept free minimum distance to walls 200 mm CAUTION Do not place heavy items on top of the machine
35. t back 34 HEIDELBERG INSTRUMENTS wuPG 101 User Manual MAINTENANCE Cleaning The system covers and internal surfaces should be cleaned occasionally to avoid transfer of particles onto the substrate e Use clean lint free cloth e Incase of stronger contamination wet the cloth slightly with a mild soap sud The base on which the stage air bearings are travelling is automatically cleaned from any dust particles due to the air pressure of the bearings If the air bearing base was accidentally contaminated with oil or fat e g due to touching with bare hands it has to be cleaned to prevent damage to the air bearings due to stuck particles e Use clean lint free cloth and isopropanol Data Backup To make sure that the system can be rebuilt as fast as possible in a fairly recent state the data should be saved occasionally to a backup data carrier e g CD floppy other PC on the network e From the installation directory of the system software copy the directory designs to your backup device The backuped data can easily be restored again to a new or repaired system e Install system software see Chapter Unpacking and Installation Section Software Installation e Copy the complete directory designs from your backup device to the directory where the system software was installed Overwrite any existing data 35
36. tandard exposure sequence i ii 1 After choosing Auto Alignment in the Check Options window and having set all other parameters click on Next to proceed to the Setup Automatic Alignment window lt Back Next gt Exit Preparing data please wait The new window serves for the viewing of the Figure 27 Automatic alignment data set that will be used in the predefined gnment Data Set Setup automatic alignment sequence before the exposure is started At startup no data set is selected A previously defined data set can be loaded using the Load button When the data is loaded the template image and the i connected position of the first site defined within this set are displayed in the Positions frame If a second New Alignment Procedure site was defined for this set clicking on the arrows 4 Add Mark Create Mark toggles between the position template pairs To Save Cancel continue after alignment data set loading click Next Pasion J and proceed with step 9 EE Ba lf no data set exists yet for the current substrate a J new set can be defined Click New to create the first alignment site for a new alignment data set The window contents change offering now the necessary functions for alignment site definition Preparing data please wait lf a template image of the alignment mark to be used for a site already exists proceed with step 6 Otherwise
37. us is not able to EE readjust stable focus conditions immediately and focus quality near substrate edges could be limited In addition the measurement completely fails whenever the nozzle opening that is surrounding the lens is not Expose Option completely located above the substrate Bee a T Auto Unload after Exposure To improve exposure quality for exposures that have to be done close to substrate edges e g because the substrate ist very Preparing data please wait HEIDELBERG INSTRUMENTS wuPG 101 User Manual small it is possible to fix the autofocus system during exposure procedure This means that normal focussing is done on the center of the substrate but after that the lens position is fixed In this state the structure quality concerning focus is limited by the focal depth of the write lens For small substrats with surface variations lt 10um quality should be fair If larger substrates should be exposed in this way make sure the surface flatness is better than 40um Otherwise the write head might crash on the substrate which might cause severe damage to the equipment SYSTEM CONTROL FUNCTIONS Further elements of the main menu allow to directly address certain system components e g to change the system state after an error has occurred These include e Stage Reset Tools gt Reset Stage allows to reinitialize the stage if for any reason the motors were disabled or the coordinate system is mixed up
38. values check on interlock lamp before starting a new exposure reset stage menu Tools gt Reset Stage Problem Plate is blank Possible causes structures too small energy too low developer too old wrong type wrong mixture laser off or damaged Remedies check design against design rules and lens resolution try higher energies use fresh developer 33 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Problem Plate is completely exposed Possible causes Stray light old materials Remedies check for possible stray light sources and eliminate them use fresh batch of plates Problem some structures are missing Possible causes structures do not comply with design rules or are too small chrome etch old air bubbles in structures during etching Remedies check design against design rules and lens resolution use fresh chrome etch avoid drying of the substrate between developing and etching or water the plate thoroughly before etching EXPOSURE WIZARD ERROR MESSAGES All errors messages of the exposure wizard include tips on how to find and solve the possible cause of the problem If these don t help shut down the system restart it and try again If the problem persists please contact your service office see above for contact addresses and phone numbers FUSES Types and locations of fuses used in the PG 101 Below main power line 10A fast Figure 33 10A fast fuse at Supply Uni
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