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Intel® E7501 Scalable Performance Board Development Kit

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1. 8 ser arar sree am CET N 1 PB_AD lt 17 gt 11 5 3 JDI Qi 1 5 CS Do 4 e 1 EB x25 JSK 1K 1 NC 5 7 E S Xn UCC3 82544 30 5 A AD lt 63 gt lt 7 ACLS P54H2 1 PB CBE7 N 82544 RD lt 62 gt 2 1
2. DDRA_D amp E3 AM4 HQ_R lt 53 gt AE23 DDRA_WE_N_R fe 145 DD DQ62 ALS 19 NIBBLE SRE22 DDRA_CAS_N_R DD DO61 PRE11 DQ_A lt 61 gt DATA GROUP PSAN24 DDRA_RAS_N_R 15 iens ions DD a e68 lt 12 131 DDRA_MAL2_R ems ions DD 00516 AH9 DQS_A lt 16 gt MA_A lt 11 gt D
3. A 2642 2 63 u mX 0 4 JIS DX re To z PAAD lt 63 gt PAPCIXCAP P22 2 2 4 PAAD lt 62 gt 020 Po4r2 2 PAAD lt 515 RB22_P54H2_2_P_ RCK54_N abes CED 885 2 PAAD lt 68 gt PRREQ54 MY22 P64H2_2_PA_REQG4_N 5 PARD lt 59 gt PA_133EN XE23 Pbe4H2 2 P8 133E 643 CH z PAAD lt 58 gt amp 2 d PAAD lt S7 gt lt 5 gt 2 6412 2 OU TY LXSHDR PAAD lt 55 gt lt 4 gt 23 2 2 Lis a PARD l
4. UCC3 UCC3 T A CU 2 1 PA_AD lt 63 DY aaar sane op gt u NSO ino 014 05 i P64H2A eg 021 PRRD lt 53 gt P22 PE4H2_1_PA_PCIXCAP 7 e AD20 PAAD lt 62 gt 020 2 1 ee AC20 PAAD lt 61 gt PRRCK54 gt 2 1 _PALACKE4 ess ses 8026 5 PREQ54 rFSY22 1 64 7 720 PAQD lt 39 PR_133EN E23_P64H2_1_PR_133E z 1X HHR PAAD lt 58 gt IPS 9 paap sov 5 gt E22 1 OUTS 2 lt 1 R799 PAAD lt SS gt pe PAGNT lt 4 gt E23 P64H2_ 1 PA_GNT4_ 3 wy np gy 9
5. 1778 79028 LVSCDAP 15 017 SCDAR lt 15 gt 15 gt 016 LUSCDAM1S LUSCDRP1 4 B16 5CDAP 14 gt SCDRNM lt 14 gt C16 LUSCDAM14 1778 LUSCDAP 13 015 SCDOP 13 13 gt C15 LYSCDAM13 ei QIC 79028 LUSCDOP12 ALS SCDAP lt 12 gt SCDAM lt 12 gt BIS arco eee gt LUSCDRP1 1 524 SCHRP lt 11 gt SCDAM lt 11 gt LUSCDAMIL DM LUSCDGP10 23 SCDAP lt 18 SCDAM lt 18 F24 LUSCDRMIO sri LUSCDBP15 2 SCDBP 15 SCDBM 15 LVSCDBMI5 LUSCDAPS 25 SCDAP lt 9 gt Feo LYUSCDAMS agence LUSCDBP 14 4 SCDBP 14 SCDBM lt 14 gt 4 LUSCDBM14 pee bei LUSCDAPB E23 SCDAP lt 8 gt SCDAaM 8 E24 YSCDAMS go d MS LUSCDBP1 3 1 SCDBP 13 SCDBM 13 LUSCDBMIS3 eren 7
6. VCES 2 0 2_1 PB RD 63 OV ET sre sr Vis o X A pom 0 4 PBAD lt 63 gt 9 Po4H2 1 PB PCIXCOP TN T PBAD lt 62 gt ACS 64 2 1 PB sons PBACKB4x m PBAD lt 60 gt 4 mS PBAD 59 PB 133EN p PBGNTx lt 5 gt 564 P54H2_1_PB_GNT5_ E 1 R828 2 PBAD lt 565 PBGNT 4 gt HS 64 1 ey 2 Oo K 5 T 1 PB 2 18 c BAB lt 55 PBG 3 S 1 X 15 603 CH oF PBAD lt S4 gt PBGNTx lt 2 gt PS Ql Y Ya EE ENN D32 2 3 PBRD lt 51 gt PBRE 5 G3 Po4H2 1 PB HEQS p 21048 22
7. D DDRA CB1 D DDRA_DQS8 D 006517 D DDRA_DQ33 0039 DDRA_DQ44 DDRA_DG44_R DDRA_DQ35 0040 0040 RA_DQ63 DDRA_DQE3_R RA_DQS8 558 b HA 0657 0059 559 DDRA_DQS6 0056 0 060516 DURH_UGS15_R DDRA_DQ62 DURH_UGO2_R DURH_UGS7_R 00515 00515 DDRA_DQS6 0056 0054 0654 0655 555 5 5 DURH_UGS1 DURH_UGS1_R DURH_UG61 0061 0048 DDRA_DG48_R RA_DQS2 DDRA_DQS2_R 0049 49 0053 53 0045 0941 41 RA_DQS14 514 RA_DQSS DDRA_DQSS_R DDRA_DG4e2_R DDRA_DG46_R DDRA_DQ47_R DDRA_DG43_R i DDRA_DGS4_R 2 4
8. A XEON 6804 T CPUL_BCLK1 WS ADS CPUI BCLKO Y4 Ji BCLK FSB HD 63 0 enini 1X2HDR ET F 3 A lt 35 3 gt N OO 1 BOOT_SELECT 63 DX 63 lt 35 gt SEREF 52 YOA nues E CPU_BPMS_N SI pue ge IS 61 vien 212 FSB_DEFER_N e gt ACS wae AEB BPM4 5 Cie ES Reet 59 Du 2 N 219 BR x 58 7 Seve 1008 5 AB pr 3012 CPUO BREQU N EL P D ES 2 Dx lt 56 gt Ax lt 28 gt _BREQO_N 2 BROX 2 CPU_BPM2_N gt 100a 7 Dx 55 14 Y di 54 AA NM exce PLES RS CPUL_COMP 1 Const FB pre SDS 23 CPU1 COMPO Mii om Dx lt S2 gt AKL 24 F Sc aB 2 gt BE lt C 2 GTLREF 4
9. gt 2 CU Jess 2 7264H28 d D lt 63 gt 9 2 Deane 2 PC e eB D 51 PBaCK54 593 PO4HP 2 PB RCK64 N sss soso sos oss oe oe D lt 60 gt PBREQS4 AD2 P64He_e_PB_REQ64_N Se PBAD lt 59 gt PB_133E P64H2_2_PB_133EN D 58 0457 lt 5 782 P64H2_2_PB_GNT5_N dise 4 gt KHS P64H2_2_PB_GNT4_N D lt 55 gt 35 P54H2_2_PB_GNT3_N 1127933 1 Siae gt 04545 PBGNT lt 2 gt HI P54H2_2_PB_GNT2_N ab MP Oe EE 2 D lt S3 gt lt 1 J5 P54H2_2_PB_GNT1_N iis E HDR HDR 04525 lt 0 gt J2 P54H2_2_PB_GNT_N m N RS D lt 51 gt DBREQx 5 GS P64H2_2_PB_REGS_N m Y E D lt 50 gt PBREQx lt 4 gt PSH4 P54H2_2_PB_REQ4_N sc D lt 49 gt PBREQ lt 3 gt H2 2 2 D lt 48 gt PBREQx lt 2 gt PKJE P64H2 2 PB REQ2 N D lt 47 gt PBREQx lt 1 gt 523 P54H2_2_PB_REG1_N D lt
10. RP24 0036 1 DDRA_DQ36_R 0032 00377 3 DDRA_DG37_R DDRA_DQ33 4 o DDRA_DG 33_R 12 0634 RP25 DDRA_CB2 DDRA_CB2_R DDRA_CB6 DDRO CBO R DDRA_CB3 o DDRA_CB3_R DDRA_CBY gt DDRA_CB7_R 0634 HP26 0024 0024 0028 P 0029 o 0025 RA_DQS3 DDRA_DQS3_R RA_DQS12 DURH_DGS12_R RA_DQ30 5 DDRA_DG30_R RA_DQ26 gt DDRA_DGQ26_R S 0634 DDRA_DQ17 DDRA DQ17 R DURH_UQ21_R DDRA_DQS2 DDRA_DQS2_R DDRA_D S11 DURH_UQS11_R DDRA_DQ18 DDRA_DQ1B8_R DDRA_DQe2 b DDRA_DQ23 DDRA_DQ23_R DDRA_DQ1S DDRA_DQ1I9S_R 01 0018 0911 DURH_UQ11_R DDRA_DQ20_R 0016 0516 RA_DQB_R 0512 0812 DOGS 9 H 06051 0851 0513 29510
11. UCC3 Iber CE EN d wp 4 S vers QA QA QA QA A u u 01 mS De mS 145 ev Fe vv vv Se TCH3_RD lt 31 gt TCHR 9 Saale OS PS D lt 31 gt 3923 TCH3_R2PN_ T iets El RD lt 3 gt CPUSLPx W21 TCH3_CPUSLP_ 5 TCH3 TENNE Q32 AD lt 28 gt 2 IGNNE ICH3 TTE Qu lt 2 gt INT Tk euo OMNEM 5 MBTSSO4DURL AD lt 26 gt m INTR 3 RI 180425 721 ICHG LINTI NMI 2 55 cPU FERR_N KIN ee AD lt 24 gt 5 7723 5 A 23 gt E STPCLKx 5023 ICH3 STPCLK 1 RIZO 2 2 1 E AD lt 22 gt RCI 5022 e IC 1 4 AD lt 21 gt H 1 e G AD lt 20 gt CPUPWRGD 3 CPUP P2 lap i19 DPSLPx JHB22 CPU_STPCLK_N FAT ues 1 BU G4 AD lt 18 gt eb A _ AD lt 17 gt lt 165 lt AD lt 15 gt L 411 9 1 S aD lt 14 gt Q T lt 1 gt 19 A R358 C 33 AD lt 13 gt 9 825 4 JAD lt 12 gt 8 19 14 4 lt 11 gt 2 O lt 7 gt L4 aD 10 4 6 R20 E G2 ap o n 5 R22 S e e e L2 a8
12. 2 ud 1 m gt e m E a n n 2 226 9 4 al al P s Y n Y C Y P E E eg Cg ig c HHUU pr 4082 2 Q IHO HHUU 1282 CNS HHUU 2245 CNS HHUU 6280 ELT TAT 6 ON INS 8590 2r 8 SOd 4 CNS a rao HHUU per P HO NS e GHO JHU 10285 NS GO HHUU 9249 CNS 287 HHUU 82 NOD QJ zZ 215501 2125903 QNO gt gt gt H vou HU 4 CNS LS HS HAS SH gt 90 QI3H31SIO3H CNS 04 Fo X lt o cou HHUU 1 2290 03H31819388 NON EDU HH 8 lt 6 gt 90 CNS 6 j INS e you HHUU p6 v 00 NO a a 550 agut S O0 CNS GOU HHUU 1 9290 CNS Li Li H LOU HHUU 66 1 2290 CNS 6590 275 lt 6 gt lt 504 j CNS HHUU 4 CNS HHUU 1 lt 6 gt o0d CNS UIOU HHUU er lt t gt od ANG OKES ON OU HNUU IT OH ANG XES gt DN HHUU I lt Soa j N 1
13. cc Al CX DATA GROUP 3 NON OO OT E i v AIO fU CJUO X Ul rO TL TO 0 eM DATA GROUP 2 v Ge TO CO 1 uS UPS FES PRPS UD W UT O1 N DDD DD DD DID DIDI DI DIDI DIDI DID DID DIDI DI DIDI DIDI DIDI DID DID DD 01 70 D UJ UJ UJ w ner DATA GROUP 1
14. a 18 CIS zou BLU lt 192 a gt s gesor lt 182 lt 182 T 0 14 o Dm 3 0 14 stor 6 Dt Grou 18 ID aa Ecou 0 14 gt eon T peor lt 162 w lt 162 1D seou usau 0 14 scour dst gt Bice id gt gesor lt _192 ID eoram 95 w lt 182 peor E lt 182 as E 0 14 eet 7 OU id gt ror E lt 192 yao m lt 182 SEE E GES ggat ig gt ECO T secor 5 14 lt an secou gaat id vwrou usau 18 gt OU det 3 lt 182 gt son lt 182 lt 19 gt lt 182 C182 seou usau 6 aet lt
15. EnzT EnzT yaT vast EST ugg vast EST Eugg vast 2 pyst vaT vyst 2021 vast 9021 vyst vast ZT EST 21 291 vast 7021 EST gg ZT 291 LT 291 vast 2 vast 7021 9021 291 1 uae vast 1 281 21 291 vast 291 291 5021 291 SnzT 291 sast 5021 szT 291 5021 5021 ge SnzT 3997 ge szT 5021 5021 5021 SnzT 9091 5021 9997 snzT sogg 5021 9021
16. 48 17 Front Panel Connector J43 49 18 DDR SDRAM 9 2 50 19 a 51 20 SMBUS0VSBY5 8 eerte 52 21 SMBUS1 NCGS JPS9 52 22 SMBUS 2 VCO3S JP4O 53 23 SMBUS 3 aaa 53 LE 53 25 USB Connector ue a ea ea 54 26 PS 2 Style Mouse and Keyboard Pinout 54 27 NGA Port Signals ae ae 54 28 Parallel Port Connector 55 29 Serial Port Connector 56 30 Gigabit Ethernet RJ 45 Connector 56 31 P64H2 Set p OPtlOns os aa 61 32 Board Specific Fatal Error 5 63 33 Channel Jumper Settings J1 69 34 Channel B Jumper Settings J2 70 35 BllofiMateralSiiaa 0 71 6 Inte E7501 Scalable Performance Board Development Kit User s Manual intel Revision History Contents Date Revision Description February 2003 001 Initial release of this document Inte E7501 Scalable Performance Board Development Kit User s Manual 7 Contents This page intentionally left blank Inte E7501 Scalable Performance
17. CENE A J18 XEON_6 4 e e WS sx AD19 FSB 5 N TU al z Y7 lt 0 ADSTB1x F14 1 gt 5675 s yasa sa u SIP SB_ADSTB lt 1 2 gt _N FSB BeRI D23 dM s 2 4 CPU_BPM5_N FSB_HD lt 53 gt N 118 Tree C25 O rere dis ep es ES BP Ads FSB 8 35 3 N AES CPU BP N 53 Dx lt 63 gt 5 gt 8 35 CPU1 401 1808 3 1166 aps DRKEWO_ BRix u 52 Bele Dx lt eay A ww BT gt e CPUO BREGO N So _ 2_ CT lt lt ERE 58 ACSA exco PLAS 32 2 R34 CPU _COMP1 E16 FS CPU_BPML_N Se gt lt Dx 59 Ax lt 31 gt lt 7 31 e 558 25 5 CPUS ADLS 1 7 BT gt e sm 58 BET pacon exco FG CPU ae Dx lt 5 gt 5 29 aL 1 3 CL pier iene 55 4 E DIN CPUB GTL VREFI GTLREF lt 3 gt sse CPU _BSEL 1 S4 RATIO n Jac T GTLREF 2 CE cd 92925 25 ED e CPU _GTL_UREF 2 e 23 gsELue C
18. lt 1 260 UHUU lt ee gt 0d AND TID UHUU amp e od ANd THO lt 259 peod cc 29 4 2380 gada ce Se o lt gt gzoq gada 9e o lt gt 98 UHUU Qr lt 4 2200 Ed ON ESOU gata oc lt E gt SOT jJ lt gt gatu gei 22 ToU UHUU 227 lt 62 gt 90 cou geod lt ve gt od lt 1 6260 pou 1550 gadu 1 lt 1 gt SOH 26 zeod lt CE gt OH lt gt EEUU lt 66 gt 90 228 gada 26 rE o 826 GEOU gada go lt SE gt od lt gt gatt lt 7 gt Ssod_ jJ SgEOU UHUU Spi 96 0 lt TT gt ZEOU UHUU 1426200 ZT ON lt 8 gt 0U ETY ON UHUU lt 656 gt 90 KTS a EISOU lt gt 590 UHUU lt Tr gt od go er o amp r o 6291 gaua 24 S SOd jJ 6201 BAUU lt gt OQ 6201 UHUU lt S7 gt od 6201 UHUU 9 260 ODDA lt 27 gt 00 6201 a gadu lt
19. EE 48 4 3 4 Floppy Drive 48 4 3 5 2 EE 49 4 3 6 Front Panel 49 487 Ree aee 50 4 3 8 50 44 lt DDR SDRAM Slots rtt ete 50 4 5 JUImperss RECOGE ORE RAE ERR DUREE IRAE DURO ECCE teenies 51 451 SMBUS Headers nete en 52 446 BUMOMS A MELIA LM ELTE i 53 47 Peripheral 5 et nette p o ree Pre ete ia trav eda 53 4 7 1 Dual Stacked USB Connector 54 47 2 PS 2 Style Mouse and Keyboard Connectors 54 4 7 3 eed ee ea 54 474 Paralel RO preter ir eee bete 55 4 725 OP OS SR 56 4 7 6 Gigabit Ethernet RJ 45 56 5 BIOS OVerNVIeW REE dst 57 5 1 Power On and 57 STIL uei ALAA EE 57 5 1 2 BIOS Setup Configuration 58 5 13 Help on Options inerte t tn ret e 58 Su MM EIS EE 58 5 15 Advanced Setup cirea boe edt egi iate reas 59 5 31 67 Boot Setup 60 5 CHp et Setup
20. DDRB_D amp E3 AB26 53 WE 032 DDRB WE N_R 5 Bans ans DDRB_DQ62 RC27 lt 10 CAS_Bx DDRB COS N R up 507 2205 sas 2425 DDRB DQG1 1 lt 61 gt DATA GROUP RRS_B MY32 DDRB RAS N R aspe DURB_UQG AL32 lt 12 C32 DDRB_MAL2_R suat dane sans x 55 DQS_B lt 16 gt MA_B lt 11 gt S um tr DOS lt 7 gt MO B 10 _ 659 AR25 8459 x 5 MA B lt 9 gt E29 DDRB_MAG_R DDRB_DGS8 AB2S lt 5 LOW NIBBLE m MR_B lt B gt DDRB_MAB_R sci 2205 san cans DDHRB DQor AG23 DQ_B lt S7 gt DATA GROUP MA_B lt 7 gt DURB_UQS6 8138 B 56 2 MA_B lt 6 gt F31 DDRB_MAG_R DDRB_DQ55 RH33 DQ B 555 MO B 5 029 _ DDRB_MAS_R DDRB_DQS4 Aged pa B SRB Ma B 4 F32 DDRB_MA4_R po DURB_UQS3 AR26 8453 DATA GROUP MA_B lt 3 gt 630 a _ 5 AC28 DQ B 52 B 2 36 DDRB_MA2_R DDRB_DQS15 005 lt 15 gt lt 1 gt DDRB_MAL_R DURB_UQS6 AE28 DQS_B lt 6 gt MA_B lt gt 26 DDRB_MAB_R DDRB_DQ51 RH31 DQ_B lt 51 gt DDRB_DQ5 AH322 LOW NIBBLE 0049 HB 7 B 49 DATA GROUP DDRB_DOQ48 ves DQ_B lt AB
21. INR e I2C CPU BUS3 PS_PWRGD 7 RASERR_N 1 SS_N DAT DAT DAT N N HOT TOCC_N N AJ 7 AJ 6 17B4 1994 aece lang Bca 52B5 7107 3cs 40C7 n 583 SC3 782 1206 7101 1063 1063 684 lt 2294 2304 718 AN_TACH lt 7 0 lt TNI CORP 5088 C ORG TION ANDLER B CHAND Rs 85226 NUMB 3 72 SPARE FAN HEA P 4LUC14 3g UCC3 USBY R 082 j c GND YEC3 YSBY2 182 5 14 GNU UCC USBYS5 0 de UCC 14 GNU UCC USBYS MT 2 3 4 5 6 7 8 9 lt lt lt 0000000 LO ONOI oN nn Ro oN nn oN nn MTG_SPOK MTG_SPOK KG MTG_SPOK KG NC NC i lt lt lt lt MD NOU BWIN OO NIU BWIN OO N11 SPOK KG MTG_SPOK KG NC 1 INTEL CORPORATION NUMBER PAG
22. Quantity Reference Description Description Manufacturer Manufacturer P N TDKCORPORATION C1608C0G1H150J 1 C618 CAPN_603 15PF 1 C1244 1245 C1246 C1247 C1248 C1249 C1250 C1251 C1252 C1253 C0603C180K5GAC n C1254 C1255 C1256 01257 1258 603 180 REME 9045 C1259 C1260 TDKCORPORATION C1608X7R1H222K 1 C512 603 2200 E C534 C535 C536 C537 C538 C539 16 C540 C541 C1261 01262 C1262 CAPN 603 220PF 06035C221KAT4A 1264 1265 1266 1267 1268 2 C1270 C1271 CAPN 603 22PF NM 7 06035A220JAT4A 0 C599 C600 603 22 4 1509 1510 1511 1512 603 3300PF Bie POM 2 C645 C1563 603 330PF CORP 06085C331KAT4A C628 C629 C1240 C1241 C1448 MURATA ELEC GRM39C0G471J05 8 1451 1452 1453 CAPN_603 470PF NORTH AMERICA 0AJ C69 C70 C71 C76 C77 C622 C623 14 624 644 1561 1593 1594 CAPN 603 47PF 06035A470KAT4A C1595 C1596 3 1532 1533 1534 CAPN 603 56PF 2 06035A560JAT4 TDKCORPORATION C2012X7R1H103K 4 C909 C910 C911 C912 805 01UF MENOR AS 4 C1043 C1044 1055 C1056 805 01UF 08055C103KAT4A 454 1129 1130 1131 1132 TDKCORPORATION C2012X7R1H104K C1133 CAP 805 1UF OFAMERICA TOO9N 451 452 453 713 714 715 C716 C717 C718 C719 C720 C721 C722 C723 C724 C725 C726 C727 C905 C906 C907 C908 C913 C914 C915 C916 C1041 C1042 C1053 57 1054 1081 1085 1086 1089
23. Pin Signal Pin Signal 13 Ground 14 Drive Select A 15 Ground 16 Reserved 17 Ground 18 DIR 19 Ground 20 STEP 21 Ground 22 Write Data 23 Ground 24 Write Gate 25 Ground 26 Track 00 27 Ground 28 Write Protect 29 Ground 30 Read Data 31 Ground 32 Side 1 Selec 33 Ground 34 Diskette Changez 4 3 5 ITP32B Connector See Section 3 3 7 and ITP documentation for information on the In Target Probe ITP 4 3 6 Front Panel Connector The development kit is not shipped with a chassis so the front panel connector is unused by default However if you wish to place your evaluation board in a chassis refer to the following table for the pinout of the front panel connector Table 17 Front Panel Connector J43 Pin Signal Pin Signal 1 Reserved 16 Power button 2 Ground 17 Reserved 3 Chassis Intruder 18 Ground 4 Hard drive activity LED 19 Fan Tachometer 0 5 3 3V 20 Fan Tachometer 4 6 Reserved 21 Fan Tachometer 1 7 Reserved 22 Fan Tachometer 5 8 Power LED 23 Fan Tachometer 2 9 Reserved 24 Fan Tachometer 6 10 Ground 25 Fan Tachometer 3 11 Reserved 26 Fan Tachometer 7 12 Reserved 27 Reserved 13 Reserved 28 Ground 14 Reset button 29 bus 0 clock 15 5V standby voltage 30 bus 0 data Inte E7501 Scalable Performance Board Development Kit User s Manual 49 Hardware Reference ntel 4 3 7 Fan Connectors There ar
24. INTEL CORPORATION NUMBER PAG 5 88 M CHANDLER B 56 Rs OM OM n 2222 2222 5 5 X N ANON LD UU 8 25222227 gt 2 gt N N lt RDATA_N WDATA_N ATE O_N RK WRIPR IDSE SK D STE ORO TION SIN Y OSINY LOOO IN CORI N TY YY Y YY A A A A A A A A AA me DTR1 N OM TXD1 COM X z5 a Z 2 8 Oi ra S Ns mm XN KBDATA 5 CON x SI 5s KEYB com toll is Loln is 022202 2222 2222 lt lt lt lt lt lt gt UID NE amp DUSE wl TN gt lt BDATA N NOTE ROUTE AS DIFFERENTIAL PAIR INTEL CORPORATION NUMBER PAG 5888 CHANDLER 58 CHAND 85226
25. 21280 H CHO 2280 H EHO 46580 ELT ZOT 6 ON INS a HSGOU 2r 8 SOd jJ NS pao UHUU 280 SHO 185280 SHO UHUU cere 9245 H LHO 22 42 a 27550 gadt 1 lt 2T gt SOH vou gaua lt gt oqd H gaua rod cou gaua e od 1615 NON GND cou gaad SEO USOU gaua 4 CNS H you gaad v OU sou gaad ce lt S gt ON CNS 9501 gaad ae lt 9 gt 90 AOU eaat 66 lt 2 200 76 6 SO J CNS HOU lt 8 gt 00 gaad lt 6200 grou gada er 2 OKES 2 ON OH gadu IT Od ANG OKES 5 ON SOU osuu I lt 1 gt 500 CN3 L3 322 ON gatt CI gt OH OK 13S 3542 ON gada lt 61 gt 90 4285 20 lt gt 295 gata OTT lt 51 gt 90 lt 2 gt 95 ISOU saud QI lt 25 505 esd grou cz lt 91 gt 90 105 26 ZITOU lt 21 gt 90 2 ge lt 81 gt 90 CdS 221 gau er od T3325 Ge lt 2 gt 2690 Q3 2 GSU pT XOc 9d
26. vare vave vare vazz vare rozz vare vazz vave v ve vazz v ve v zz 1218 use vave v ve v zz vare v ve v zz varz use pave v ve va Suse pave vave vyse 2212 adve suse Save Suse sazz vyse Save S gg 2212 save suse Save Save Sngg Suse suse suse Save pose Save sag votz Gave Save sazz Save SIZE suse pose Save sazz E212 Save S gg Save adve adve adve adve suze adve sazz adve suze sos adve suze adve ose adve suze 902z
27. vdve E 5 I IG coquat E So eem gt 98 22 or goo esaa E a lt OU TT ED eee once pozz vace vave ma a 4 75 T USCOU HEU ED erez cave sae E 98duy on gt ZOU HU gt sex ies gt pozz vace vave oae 4 or gt coo 2 SEOUL roma STOUT qau LED ee ece core esse et AAAS ssor gt E eene cave sse D Sade A eC IH Sermo E SCOUTS LED ee erez core JO H ETOU HEU at wave eose vade T om gt i NH UTGDU uuu X O Tt sace save mse 4 Q gt E LD at reez wave cn x U a N Y IG 2 CD e N A CIS goo esaa E g gou qau C ED 5 2 sace save sa s an 5 Bou L eeens T TID 9 CID giri Se DOC cave eave ose 2 eomm TS LD eee wave eose c
28. aD lt 51 gt CBE gt EE DOD54 1 05 SERRK P542 BSERR Z AD lt 52 gt gt PAOC2U 1 NI EE cs MSA ee BERR EE LL AD lt 59 gt 9 CBEK 3 gt PALS 2 1 FE Sk j 1 R668 2 155550 e CBEx lt 2 gt P64H2_1_PB_CBE2_N x EE SK ZN COMP _WIZN_COMP 57 lt 15 PSRFL12 P64H2 1 PB CBE1 N ZB COMP LEER COUR 1 AD lt 55 gt CBE gt APIS P54H2_1_PB_CBE _N 67 Bese AD lt 55 5 F ADDB lt 17 gt TBI ODE 21 C AD lt 54 gt par P64H2_1_PB_PAR 058 FL ADD lt 16 gt RO 3 53 PRR54 2019 P654H2_1_PB_PRR54 4 FL ADD lt 15 gt C AD lt 52 gt 2 FRRME PACS 4 2 gs s F24 F ADD T AD lt 5 gt H TRDY ADS P64H2_1_PB_TRDY_N ado BT se 49 gt PB STOP sre s FL_ADD lt 11 gt RP277 AD lt 48 gt 8 IDSEL VACS IDSE s B AD lt 47 gt DEFUSEL P64H2_1_PB_DEUSEI AD lt 46 gt UIO 2 PAF24 CDI erore 54 RDD lt B gt 3 6 AD lt 45 gt UIO 1 RF3 25 FL ADD lt 7 gt O 5 4 e J23_IFL_RDD lt B gt 58 25 5 J H SM
29. s041 9891 ge 9281 ge 9281 9021 9997 9021 9997 gugg 9997 2021 9891 9222 2021 9891 ge 9591 2041 9997 ngT 2021 9281 Q PI coon c e N oa NX TL 105 SX OSX FS gj EI EI e e VOX 12 x LO x 0 x Sn Yo egg EI o n gt UNUU lt NI veer zage vost voe NOO UHO I lt gt do INO
30. 1 PBAD lt 27 gt PBC BE lt gt 5 PB4H2_1_PB_CBE _ arises PBAD lt 25 gt 2 PBAD lt 25 gt x PBPCLKI 98 P64H2_1_PB_PCLKI p 588023 PBPCLKO lt 6 gt KE 1 PB PCLK5 1 2 PBAD lt 22 gt PBPCLKO lt 5 gt K4 33 5 I PBAD lt 21 gt PBPCLKO 4 gt Ka 623 17164 PLACE SERIES RESISTORS WITHIN 1 INCH OF 64H2 PBAD lt 20 PBPCLKO lt 3 gt PBAD lt 19 gt PBPCLKO lt 2 gt LY PBAD lt 185 PBPCLKO lt 15 L5 54H2_1_PB_PCLK1_R i 1947 2 P54H2_1_PB_PCLK1 PBAD lt 17 gt PBPCLKO lt gt L 1 OBAD 155 i 29982 P64H2 1 PCLKO CoD PBAD lt 15 gt PBPCIRSTx 592 4H _1_ PB_ RS _N OU TY sm ssas 33 PBAD lt 14 gt PBAD lt 13 gt PBIRQ lt 15 gt P654H _1_PB_TRGQ15 PBAD lt 12 gt PBIRQ lt 14 gt LE 1 14 sins PBAD lt 11 gt S lt 13 Dl 1 13 18 PBIRQ 12 P64H _1_PB_1TRQ1 9 AAS PBRD lt gt PBIRQ lt 11 gt Bl P64He2_ 1 1 DE 8 To PBAD lt 8 gt PBIRQ 10 E 2 1 15010 dida 7 OCA PBAD lt 7 gt an PBIRQ 9 2 1 S AB4 PBRD lt B5 gt PBIRQ 8 De P64He 1 PB IRQS en 5 Y4__ PBAD lt 5 gt PBIRQ lt 7 gt C2 2 1 543 Dips 4 4 PBAD lt 4 gt PBIRQ lt 6 gt B2 Po4H2 1 PB IRQO 3 PBAD lt 3
31. HHUU 5282 HHUU 19280 NO 285 HHUU prr 2282 CNS REEE 21594 HHUU 2 oSv 3 You HSUU CNS ASN ASN 360 gt 90 Q3H31SIO3H CNS X lt o Fo X lt o cou HHUU o gt 09 1S15 NON ONS EDU 8 lt gt 90 SOU HU 0 500 4 e you r6 lt gt NO GOUT HHUU 9290 CNS n 990 HHUU 96 1 lt 9260 H LOU HHUU 66 lt 2 gt 0d 6500 HHUU 76 lt 6 500 4 NO HHUU 1 lt B gt OH 4 CNS pou HHUU 1 lt 6260 UIOU HHUU ANG CKES ON OU HHUU ANG OKES HHUU ri I2SOd 4 lt N 1 gt ON HHUU OK L 3S 382 ON lt EIOU HHUU oor lt ET gt 00 HHUU lt 2 lt gt 86 HHUU orr ST Od lt 91 500 ee 125 2100 HHUU re 1 lt 21 gt 90 HIOU HHUU lt 81 gt 0 dS 22n H lt 61 gt oa DIO e mm nn ecou HHUU 2 gt 504 4 Geo HHUU rii lt c gt odq DNA EX 5 5 HHUU 1 lt 12 gt 90 a GOON
32. UHUU go HON dM USUU UHUU lt Et gt 00 5558 278 1 lt S gt seq j QOOQ prod lt gt O ODON Grou UHUU GT 5 200 grou 9 200 ODN H LVOU UHUU 1 2 290 FISOU lt r T gt sod4 S22n grou 8P O ODN UHUU lt 6r gt 00 ODON H USOu EJ 425200 ODN Tsou og IS O ODON 8 lt 9 gt 50 j 9200 lt UHUU lt ES gt oa ODN groo UHUU 5200 ODON 155200 SISOU UHUU 1 lt StT gt soad4 UNUU eq 95 gt 0 DDN 2500 lt 2S gt 00 On 8500 UHUU 78 1 lt 8S gt 00 On 6500 88 lt 6S gt 00 On 2504 SO j DDN H USOu 9 On 419200 On 1 lt 29 gt 90 N rue E mae sayas SISOU UHUU ZIT 9T S0d4 NNOO TR al REV 18 NUMBER PAGE DOCUMENT Bl ER 85226 N CHAN ER INTEL CORPORATION 2000
33. 22 A23 gt 21 ACS lt 21 Y C22 HI XTAL1 2 AE AD DBS YS 021 O XTAL2 C4 XTRL2 19 AF 19 gt x ale REF 18 OD AD lt 18 gt K1 5 8 1 R658 2 17 175 5 7 K2 SDP6 5 DI_ Sodan 16 AF 8 AD lt 16 gt KS I DIMDI1_ CH 15 RC12 aH lt 15 gt u SLPS 14 i4 18 14 CO 1_PB_RST_N eae SDP2 DI 2 EIMDI2 13 AFIS Aid 71 SDPI DI_2 2 2 12 RC13 4412 HDR G2 SDPO DI 3 _EIMDI3_ UCC3 11 8013 AD lt 11 gt 9 NI 82544EI_TEST 813 TEST DI 3 FAIS 18 RF 14 NI 5 gt LES E RE14 Pio 1579 L3 GMII TESTI TCK R937 8 BC14 lt y TS m Le TDI 04 2 1 T 8015 RD lt gt C um ES 02 1K 5 ACIS ap gs QS 5_ Li TMS Ul ITAG_TMS 559 5 16 5 TRST QH 2 1 ALIS AD lt 4 gt 16 RC15 ap a3 2 OF 4 2 AF 17 Abe 2s Q 2 2 4 94 AD lt gt d Es 2 1 1 OF 4 1 INTEL CORPORATION DOCUMENT NUMBER PAGE REV 5888 WN CHANDLER BLUD CHANDLER A 85226 COPS NI 0 26 26 00000900 00 00000000 00 D
34. RESERVED 4 2 RS 2 P 54H _ _PB_ S 3807 0 1 DD DD DD DD G D lt 3507 3707 3807 3907 400 4287 SON YDD AC v Ov UJ gi 3992 3907 40n2 21 4 2 DD DD DD x Db CC DD 39n2 3907 4165 2187 41C4 7070 39A2 241C1 417 4165 aC 4 D JOG oo 37 7 71A SERVED RESE Dx D ESERVED LA OJ 5 37C7 39C7 71A LO 8 F gt A e Zx A A C UI Z 72060002021 A FN U EAA AE A AE 020727 0 AJ me PEZ BT S 0 0101 1010 NZ P S SoS S X Oo VA 0 Ul A JLOLOU v m 2 PB 53 0 3107 3563 3862 2 2282 2287 4167 2161 AICA _2_ _ 6 64H2 2 PB AD lt 63 gt 3107 35A3 3BR2
35. Tea E NOD Ci Cg HHUU 0 82 NO Ho IHO HHUU 1289 INS CHO HHUU HO NS HO EHS HHUU Ic 5280 ELT TAT INS BSOU HHUU 1 lt e gt sod J NO poo HHUU INS GES HHUU 5280 NS HHUU eri 19280 INS LHO HHUU 12280 NS b gt LISGOU HHUU 1 lt 21 gt 590 INO m MSY mir vou HSUU 4 CNS cae E aS lt 250 Q3H31SIO3H CNS 04 Fo Yo cou HHUU 95 1 lt 2 gt 90 3H31SIOJ3N NON ONS ESU HHUU 8 lt 5 gt 09 INS i i HUU 1 lt gt sod H CNS a a pou HHUU pe vP OUd 4 INS Q 0 Sou HHUU s 1 lt 5 gt 90 INS 9590 HHUU 96 lt 9260 INS LOU HHUU 66 lt 4 260 INS 6500 76 lt 6 gt 6504 4 INS BOU HHUU CI 1 lt B gt OH 4 INS HHUU lt 6260 CNS HHUU lt t gt od OK2S ON Ou asua ANG OkKES HHUU ri I2SOd 4 N 1 gt ON HHUU lt 2 EIOU HHUU 1200 2255 OBS HHUU lt 29 1255 eat UG HHUU lt S1 gt C 2 gt 06 eat 295 IU DIGOUu gaud 1 lt 21 gt 590 Leu ESM groa l
36. lt te gt od lt gt 2 FH FON asad CTSOU lt 21 gt 690 lt S ZE SEW axdu UD CEOU HHUU lt 9 gt SUN HU edt icd 2 EEOU 200 H LUN varr sure save HHUU 26 6200 SEW asad Ward tose ates Seon g3 SE od Je asad tee ote E PSOU r SOd 4 lt T gt Y HU AE ocou 1 lt GE gt OH lt TT gt att SH wav boat sar LEOU HSUU ppp lt 2 gt o00 CZT ON STITH HEOU HHUU QST lt BE gt 00 CETWOON Reg 3 H8HUU lt 6 200 KTS EST 8 EGO HW Le 5 amp EL SOd 255 HU m bd grou HHUU 1 lt gt OH 2 Suo 3 SEO HH ue HHUU It OU E XSUY ul asas asss sare crou HHUU 200 N JM 0 svez sare Erou lt gt 0 COOn 08 GSGOU HHUU 798 1 lt S gt soq j 0221 c HHUU 1 gt OH OOOn Grou HHUU 200 0221 os Grou HSUU 200 0221 Zro lt 27 gt o0d 0221 SE HHUU 1 lt 1 gt 690 6500 H grou HHUU 22 lt B gt OH OO
37. 3SB2 3BC3 39C3 4188 5000 RODS OD 010 100 JD OG YDD O DD PB_ACK64 non CET O C0 AI OU YDVAGAD JDDG NI NI NJ 07 N MWIN NI NIN DD pos SLO cC 66M Ade US Det cg F Oy ZO N SES EE S RAEL Ga a ME 2 228389 RE men 33 INTEL CORPORATION NUMBER 5000 W CHANDLER B CHAND 35226 SOINU DD 010 100 AY gt P64H2_2_PB_CBE7_N K BT gt AH2 2 PB CBESN KEY CONT ESERUED GND P64H2_2_PB_CBES_N D lt 7 BE x 6 lt 5 BE gt k lt 4 UCC3 D ARG 4 63 gt D lt 62 gt 1 TRST VAL PCI_SLOTS_TRST_N lt T o t gt PET SLOTS_f K PR 2 4 UCC 5 SLOT 2D TMS 1 AAA B A a4 SLOT 2D TDI 2 53 AS VEE AR6 2 IRG12 lt A TROLA SINT Dx e S PRSNT 1 RESERVED C PRSTN2x 00002 D G D lt 58 D 56 UCC 0 52 D 58 D lt 4 D 4 2 v xv D CJ v VDD
38. WF INTEL CORPORATION NUMBER PAG 5888 CHANDLER 44 CHANDLER 85226 oNN 55 6 4 7 3 1 1 1 1 1 PDDREQ 2 PDIOW N 2 PDIOR_N 12 PIORDY e PDDaCK_N TRQ14 31 PDR1 PDAG PDCS1_N RCT_N SY NY SY NY Y Y Y Y Y Y Y Y Y KA A A A A A A A rr Y Y Yr y gt gt 2 INTEL CORPORATION NUMBER PAG 5000 N CHANDLER 45 CHAND 85226 U45 TORS D lt 52 gt GND lt 0451 GND lt D lt S gt 41 2 D lt 4 GND lt 1 1 gt D lt 46 GND lt D lt 4 D lt 99 gt D lt 46 D lt 98 gt D lt 45 0497 D lt 4 D lt 96 gt D lt 4 D lt 95 gt D lt 4 D lt 94 gt D lt 4 BLSA D lt Af D lt 92 gt D lt 39 gt 0491 D lt 38 gt D lt 94 gt D lt 89 gt D lt 36 gt D lt 88 gt D lt 35 gt D lt B7 gt D lt 34 gt D lt 86 gt D lt 33 gt D lt 85 gt D lt 32 gt D lt 84 gt 0431 D lt 83 gt D lt D lt 82 gt D lt 29 gt 0481 D lt 28 gt D lt 84 gt D lt 27 gt 079 Deo 078 16 2655 D lt 77 gt D lt 24 gt D lt 76 0475 D lt 22 gt D lt 74 gt lt D lt 20 gt D lt 0419 0471 D lt D lt 78
39. 0014 0515 DORA DIRA DDRR_DG5 DDRR_DQ5_R RP34 DDRR_DQ2 _DDRR_DQ2_R m 7 DIRA a DAS 5_DDRG DG3 R Ves 063A 1705 1805 1905 2295 1705 1805 1905 2295 1705 1805 1905 2295 1705 1805 1905 2295 1702 1802 1902 2895 1703 1802 1903 1702 1802 1902 2895 1703 1803 1903 1704 1804 1904 1705 1804 1905 1705 1804 1905 1704 1804 1904 1704 1804 1905 1705 1805 1905 1705 1804 1905 1704 1804 1904 1704 1804 1904 2 C 1704 1804 1904 1704 1804 1904 1704 1804 1904 1704 1804 1904 1704 1804 1904 1704 1804 1904 1704 1804 1904 1703 1803 1903 2 Ci 1703 1803 1903 2 Ci 1704 1804 1904 1704 1804 1904 1703 1803 1903 1704 1803 1904 1703 1803 1903 2203 1703 1803 1904 2a3 1704 1803 1904 2203 1704 1804 1904 1704 1803 1904 2 Ci 1704 1804 1904 2 Ci 1703 1803 1903 2562 1703 1803 1903 220
40. 2 R CHANNEL Suri BoyT rd BoyT Boyt BoyT BoyT a21 Boyt Boyt e21 e21 eart B21 BoyT ByT Suri art art
41. 2 2 22 2 220 0 0 02 02 02 2 2 22200 0 0 09 02 CO C2 CO CO CO CO CO 0 0 02 CO CO CO CO CO CO CO CO 0 C9 02 CO 020222 0 909 0909 09 9 C9 2 CO CO C9 9 09 0909 02 02 CO CO CO CO CO CO CO C CO CO CO CO CO NAINA NINIS lt lt NVENMWAUIOING 2 POWER AND DECQOUMHI INTE CORPORATION JOCUMENT NUMB 5000 CHAND 522222 E 2000 2222 2222 alee a ado e MIN ORAT ION 37DE 37DE 3703 27C4 27C4 2702 3783 COR N 5 5906 5907 2706 37082 37C7 FP LOL OAR otn cof LOL E 2222 gk lt lt lt E 5 lt lt lt 5 Pere lt lt lt 5 lt lt lt ce lt lt lt 16 EEE lt lt lt lt lt lt lt lt lt 55 lt 2 5555 9 lt lt lt lt lt lt lt lt 5 5 ANON ANON ANON ANON ANON _ _ IOD IO Hos ciis a SS Sy Show lt lt o T lt lt lt lt Pa E a of lt lt ANMN 2 2607 35A 1010 Lon
42. APICCLK 96 4H2_1_APICD 4 APICD1 64 2 1 64 PITCH UTU C T0 C0 UIO1AJ0000 CU101424 P54H2_1_TEST_N HPB SORR HPB SOR HPB_SOLR PB_SO PB_SOD PB_SOC HPR_SLOT2 gt GL OT 2 gt HPR_SLOT 1 I SLOT 1 SL OTt S 21 PB_SIL P64H2_1_HPA_SID c HPB_ SID 321 SIC Sg Z 0B gt OT PLUG DISA ADDRESS LIB IN lt CORPORATION JOCUMENT NUMBER AG 5000 N CHANDLER B 28 CHAND 85226 2 Z U 2 1010 gt gt gt 9 202 2 2 2 22 0 0 0 9 CO CO CO CO CO CO CO 2 2 9 9 C9 C2 09090909 02 9 2 22222 09 0909 09 02 CO CO CO CO C2 9 09 09 09 9 C9 2 222 020 0 09 lt lt lt CO CO CO CO CO CO CO CO CO CO CO CO CO CO CO C2 P64H2 UCC lt 24 gt UCC3 4 lC C t UCC lt 22 gt CC 4 UCC3 lt 4 UCC 20 LAC C S lt AS CC 1 gt LC C a 2t UCC3 lt 4 UCC3 lt 4 UCC3 lt 4 UCC3 lt A
43. 7501 NOPO AES 005 1 I 3157 L E20 ITQ_ lt 11 gt 7500 NOPOP DD AGEL lt 10 LOW NIBBLE STUFF FOR E7580 E7501 49 9 OHM DD 059 24 9 GROUP 2 1 R118 2 LL DA LE LIN AL2S DD DOG AL 25 neg HIGH NIBBLE DDRUREF 2 1 R202 2 EMPTY 2 2 2 DD DOS 28 a 5 DATA GROUP 1 D 402 C1143 C1144 C1145 DD 004 AN29 A lt 4 gt DURUREF_ 3 21 503 CH 1UF 1UF DD 0659 05 9 w DDRUREF lt 2 gt STUFF FOR E7501 i 25 DOS 9 _A lt 1 gt ame 1 1 1 DG DDRUREF DIRA DOS RE21 LOW NIBBLE DD 051 441 GROUP 1 DD AF 22 6G 0 DD CB RG15 lt 7S VCC3 DD AMIS HIGH NIBBLE RESERVED 029 MCH_RSuD_g1 1 948 2 DD CBS AGI Q 5 CHECK BITS 1K 12 DD RE17 0 lt 4 gt RESERUEDA 221567 702 lt DD DOS 1 16 DQS_A lt T7 gt 4 7K 5 TI6 RESERVED ap ds ee DDRA_CB3 AKIS _ DDRR_CB2 ALI6 LOW NIBBLE DDRA CB1 AH16 CB_A lt 1 gt CHECK BITS EMPTY DDRO 16 _ STUFF FOR E7580 3 OF INTEL CORPORATION DOCUMENT NUMBER PAGE REV HEU 0 5 IC 5888 CHA
44. D lt 24 gt E D lt 23 gt PBPCLKO 6 PB4H2_2_PB_PCLK5 1 WITHIN 1 CH OF Pe4H D lt 22 gt PBPCLKO lt 5 gt K4 0421 PBPCLKO lt 4 gt 1 RIOD 2 D 20 PBPCLKO 3 gt P64H2_2_PB_PCLK3_R P64 D lt 19 gt PBPCL KO lt 2 gt L PB54H2_2_PB_PCLK2_R 33 2 2 PB_PCLKS DU T e D lt 18 gt 1 L5 P54H2_2_PB_PCLK1_R 1 D lt 17 gt PBPCLKO lt gt L4 P64H2_2_PB_PCLK _R p64 25 Pu u 2 GUD D lt 15 gt PBPCIRST gt P64H2_2_PB_RST_N 145 2 1 1002 2 P64H2 2 PB 0 135 PBTRQ lt 15 gt PB4H2 2 PB TRG15 33 gt DU gt D lt 12 gt PBIRQ lt 14 gt LE P64H2_2_PB_IRQI4 1 R1903 gt 0411 PBIRQ lt 13 gt Dl P64H2_2_PB_IRQL3 52 P64 T D lt 10 gt PBIRQ lt 12 gt P54H2_2_PB_IRQ12 33 OUT D lt Q gt PBIRQ lt 11 gt P54H2_2_PB_TRQ11 D lt 8 gt PBIRO 10 P54H2_2_PB_TRQ1 se adhe D lt 7 gt 9 gt P64H2 2 PB IRGS aeons D lt 6 gt PBTRQ lt gt D2 P54H2_2_PB_ TRGB lt 5 lt 7 gt C2 P54H2_2_PB_TRQ Mn D 4 PBIRQ lt 6 gt B2 P54H2_2_PB_ TRG E D lt 3 gt PBTRQ lt 5 gt 82 P54H2_2_PB_TRQ5 NN D 2 lt 4 P54H2_2_PB_ TRG4 Dc1 PBIRQ lt 3 gt P54H2_2_PB_TRQ3 Sasha D lt gt PBTRQ lt 2 gt D3 P54H2_2_PB_TRQ2 PBTRQ lt 1 gt
45. N cloud HHUU 2 LISIA DNI Qi Ex lt gt 8265 OBS cH IU plod lt gt lt gt 96 TU GIOU HHUU ett lt St gt od 2 gt 95 ET ces IU UISOU HHUU 1 lt 01 gt 590 6 grou HHUU 91200 2 IOS ID ESN LIOU HHUU pe lt 4 200 CONO dM grou H8HUU lt 8t gt od oon 5IOU HHUU lt 61 gt 00 H8UU ADL rer eese voe csou e sod j 2380 2 OU HHUU pir lt 02 gt 90 97 7 211 lt TZ gt 00 GOON HHUU Ter ec o u Ecou cer lt 62 gt 90 ANG 1512 CUm ITGOU 1 lt 11 gt 590 Q2 g ecou HHUU lt 72 gt 04 E OUND 99008 GcOU ggat EE 200 lt gt uba 6S 3H 084 HU yar ve quet ser HH lt 92 gt 90 lt Toba 4 Tee HU Pakt ave yess aes 2290 HHUU Ot lt 42200 ZoD INT E 6550 HHUU og 1 lt E gt SOH j 826 8p FH ggu war abet tees athe HCOU HBHUU Get lt Sc gt od lt TH Er TSW asad ecou HHUU 2 1 5 204 J HSUU gt geou lt 06 gt 90 EUW agut IEOU
46. E7501 Scalable Performance Board Development Kit User s Manual i ntel Getting Started 8 Install MCH heatsink You must install the included heatsink on the 066 using the Z shaped metal bracket If there is a cover on the thermal interface material on the bottom of the MCH remove it Place the heatsink squarely on top of the MCH Place the center of the bracket across the center of the MCH lining up the bracket hooks with the arch shaped retention hooks on the evaluation board Attach the bracket hooks to the board hooks to secure the heatsink See Figure 5 for a picture of the installed MCH heatsink Figure 5 Installed MCH Heatsink 9 Install memory Your kit includes two 256 Mbyte DIMMs For dual channel configuration you must install these in memory slots J5 and J9 the two slots furthest from the MCH To install ensure the tabs on the slot are open or rotated outward from the slot Line up the DIMM above the slot the DIMM is keyed so that it only fits in the slot in one orientation Firmly but carefully insert the DIMM into the slot until the tabs close Repeat for the other DIMM and slot For a single channel support you must populate channel A 10 Install storage devices There is one IDE connector on the evaluation board which supports two IDE devices a master and a slave The kit includes one IDE hard drive preloaded with a dual boot QNX RTP and Wind River VxWorks For a correct
47. SLOT_1A_TDI B4 UGE 4707 4105 400 Po4H2 1 IRkRQO 6 e P64He_1_PA_IRQ2 P64 P64 PAE TRON PAS TROIS 34C6 2694 H2_1 2694 CO AJ O YI UT S DODD DDODD DOWUDZWOWAZAZAWVUU 26C4 _ N 10 1 TRDY_N JE Jays lt lt wor e OU U 2601 2604 SOO NUT SO u SLOG AO UT ZW c 38C7 26C4 37c y 8 U 26C4 U3OOtC 3406 2601 0 0 lt QOD NY TO FN J ZEZ 5 3 E A 3 Pus t LO Le Ades due 1 PCI BUS A DSEL ADIL EQ GNIT 0 RQ lt W 3 ALS da Et ASONI WIMA INTEI CORPORATION JOCUMENT NUMBER 5000 CHANDLER B 36 CHAND 35226 4707 4105 4205 SEOTS TEKS emm UCC 2_1_PB_IRQ4 5 2 1 PB IRQS P64 P64 PB_IRQS UT T 274 2794 a AN EN 2 ASONI ari S
48. 22 Inte E7501 Scalable Performance Board De velopment Kit User s Manual n Getting Started Table 3 Jumper Settings Sheet 2 of 2 J27 Write Protect Short 1 2 JP24 JP25 JP26 JP27 PCI X Slot 1 Bus A Mode All open JP28 JP29 JP30 PCI X Slot 2 Bus B Mode All open JP31 JP32 JP35 SCSI PCI PCI X Mode All open JP33 JP34 PCI X Slots A D Mode Both open J36 Test Header Open JP38 SMBUS 0 VSBY5 Open JP39 SMBUS 1 VCC3 Open JP40 SMBUS 2 VCC3 Open JP41 SMBUS 3 VCC3 Open z OO 471 BMC Connector Short 5 6 7 8 9 10 17 18 19 20 29 30 5 Verify installed hardware Make sure the following hardware is populated on your evaluation board Two Intel Xeon processors or Low Voltage Intel Xeon Processor in sockets J17 and J18 BIOS FWH in socket U69 Battery in battery holder BH1 Note The above hardware should have been correctly installed at the factory If they are not installed correctly DO NOT power on the board Correctly re install the components before proceeding If you suspect that any of the kit components has been damaged contact your Intel field sales representative or local distributor for assistance 6 Install board on stand A board component stand is provided in your kit Refer to Figures 1 and 2 for placement of components on the assembled stand Note If you choose not to use the stand you must use processor retention mechanisms with Tuflok f
49. sast vast vost GE J Hp wen AIT MILL ILL sast vost G20 Usa Sel ep H TON BaUU eoe sve CL OH BgJHU 22 lt gt 90 lt gt CU Badd POET 9002 8661 DU Is ECC lt 56290 a C gs sast ser EET 1 lt 16 gt 90 Le FON UHUU vacr csoe svor soer oo er Sod Se H GON UHUU L zoez svor soer ngr ecoa lt gt OH 96 gga NEL IL IL LS s ts 938 Sers SUA BS MILL 4 5 ee svert Mo peo UNIT 28 SE gt OT 826 t sast s991 EO OAT ge lt SE gt dd Jz H UHUU 2202 svor soer pm aust GO OG lt posod LL gt a EO lt 9 gt 00 4 29 arre LIUM Ue side bas S EEE LT CLE O IN OTU T foe x oxda BST lt 200 2 scoa yada TST lt 66 gt 90 KTS past 52 Und m gt _EISOH_ oadd lt gt 500 AST N 852 a Hoa 9291 lt ar gt od 1 CEO NEL LL Ld gt cast s
50. tel Ee Od ANG THD SOU lt N 5 UHUU i vCOU UNQU EE 2 gt 0 242 Seow UHUU EE 52200 lt O gt GE q Ee 492200 q E zeo gre lt 22 gt 00 EOS ON H ESOU amp sod j lt gt gyud Lese Sei 82 gt 0 Dg TON UHIU E gaut 227 lt 62 gt 00 ou H CUN gyud de E Qe OQ EON gyud Teed UHUU lt TE gt 00 lt t gt U FON UHIU E minem CISOU el2SodJ H GON gyud ceou BUC 928 H Sow UHIU m obe H EEOU 56200 lt 229 H LUN UHIU Lei Je FE OU lt B gt BON gyud m UHUU 1 lt SE gt a lt 6 gt BON UHIU m 2222 FSOU j Qro UH 9594 L imm H SEOU Spi 1 lt 96 gt 90 TOU UH USUU 3 ZEOU UHUU JET lt 2 gt 00 ZT ON UN sa geod 86200 CET 6 6200 KIS EGO UBHUU 3 EISOU 1 2600 5 J CGO ml 3 ta 585 9544 Trou UHUU gydd
51. be 9 82 INO To 0 LHO UHUU 12280 TSOU grt lt 4 2500 CNS wou BaHH 2 lt TOU SSUU 1 1290 IGIOJH cou yada Q3H31SIO3H NON ONS 9599 8 j H FOU MUU pe 201 Ge lt 5 gt 90 QN QN QN 9599 1 9290 i Due 24 ZOU 9599 66 lt 2 gt 04 MSY MSX x BSOU 75 amp Sod 4 NS CASE AS HOU 8 OUu INO Ho 0 9599 1 lt 6 gt 00 grou 2 NH GS 2 ON Trou 1 11290 ANG KES DN Tsou lt I gt j lt N 1 gt ON clou lt e ol Ok 1 3S ON gaud 51200 56 IOU 200 1268 orr lt St gt od Eus UISOU QI lt at gt soads esu 9I O IOS EEE I ZIOU 02 1200 CONG dM H HIOU UHUU 81200 4457 2958 OU 5290 TINS FAUT esou lt j 2335 pit Oc OU UHUU IT 1 lt 12 gt 00 8220 UHUU 1 lt 22 gt 90 ANG TO
52. 38C7 Jans 3889 3887 2182 2051 1101 Gis NN YT NR A SS Ima v py S O 2D UXB CONNECOTR yeh ee PE HSE ADLY lS ALIOS 2 INTEL CORPORATION NUMBER PAG 5 88 CHANDLER B 41 CHAND 85226
53. 59 LURSTA URSTBP 25 AN 99 LURSTB B LUMSGAP 26 EN LUMSGAR UMSGBP 26 LUMSGB LUSELAP 27 LUSELA LUSELBP 27 a 61 LUSELB 28 62 LUCDAM LUCDBP 28 V 62 LUCDBM sati saco LUREQAP 29 v 53 LURE YREQBP 29 LUREGB E LUTOAM LUIOBP T 54 LUIOBM LUSCDAPB 31 5441765 LUSCDAMS LUSCDBP8 Bil APA 65 LUSCDB B LUSCDAPS 32 66 LUSCDBPS gardes 66 LUSCDB esc 6998 33 67 LUSCDAMI 33 a HAN 67 LUSCDB LUSCDAP 1 1 34 68 LUSCDAMII LUSCDBP 11 34 68 LUSCDB MENS p d cd E s NC 69 69 ISUB INTEL CORPORATION DOCUMENT NUMBER PAGE 5000 N CHANDLER BLUD CHANDLER A 85226 lt P IMI ID DOMINE ON CAANNE LIN ms esa QAP SCDAPSB De USC USC YA UBS 53B 63 5 6786 63C5 6786 638 63C5 67B6 isu mim 63C5 6786 MR SCDAP VSCDaP9 UCDAP UMSGAP 6385 6786 63C5 6786 63C5 6786 63C5 6786 12020202020 40 40 J 1202020202020 J ZJ 12020202040 20 40 J lt sap 63C5 6786 O NI ema m cx UI
54. DX 36 Ax lt 8 gt m 0 CPUV 35 de pee 35 gt exco PSALO 7 Ss a ner 2 R25 1 CPU _TESTHI6 AES restre oss 7 Dx 34 lt C18 6 OM gt ty 1 51 CPUD TESTHIS ADS TESTHIS UID 4 B3 4 ETN sear n 33 2816 Dx lt 33 gt exc PSB18 5 4 51 2 R49 CPUB_TESTHI4 AAT TESTHIA VID lt 3 gt C3 3 32 5 PS OO 4 e 2 I 51 CPU _TESTH13 Y6 UID D3 2 PUO UID 4 gt 3i PY exc3 54 2 CPUD TESTHI2 WS TESTHI2 VIDE 1 gt 1 2 FSB N AA ES 2 RS I tester vine 24 28 QEZE C QDS FSB API N Ma IEE LE AE esra D lt 28 gt AP lk lt 4C6 1186 27 22 lt lt na gt Ben vcesense B27 UCC SENSE Qe o 26 AREA Dx lt 26 gt DBIxc3 S CED 0 25 2 0 25 gt DBTx lt 2 gt 2 s PES Aes 5 026 CPUD 055 SENSE 24 BIB 1f FSB DBI 3 0 Oe iN BE TUER EE AES Dx lt 23 gt DBI lt gt 2 c Om 4203 1083 ICH3_A2BM_N Dx lt 22 gt 3 AEAT CPU_FERR_N DUTY Bs AREA Dx 21 DPx 3 r FSB_RSP_N E FERR PBE 7 BUTS cT Dx lt 2g gt DPx 2 2 7 gt 5815 CPU_F ORCEPR_N 19 Doe 19 gt DPx lt 1 gt 9 1 e Bi S 18 Dx lt 18 gt
55. gt NN USS 164_DPAK 2 IN OUT SCS FST sane sso O 64C5 SENSE DJ GND TAB e 5 I C INTEL CORPORATION NUMBER PRG 5808 W CHANDLER B 66 CHANDLER 85226 s T j So E UCC UCC A CR46 2 CRA 2 MBRD320 RT3 2 1 RT4 LUTRMPWR_A 1 3 LYTRMPWR_B GUT DS ssaz s s 2 A OUT 27 CUD DPAK FUSE DPRK FUSE G DIO DIO C 4 1 AXL SC S FO pM LUSCDRP12 1 35 LVSCDAML2 LUSCDBPI2 1 lt l 35 LUSCDB deest 6 LUSCDRP13 2 35 LUSCDOMIS3 LUSCDBP13 2 vA 36 LUSCDB E cos LUSCDOPIA 3 gt 37 LUSCDAMIA LUSCHBP1 4 3 37 LUSCDB an cos LUSCDAPIS v 38 LUSCDOMIS LUSCDBPIS 4 VA M
56. vyse 9 gg adve sazz 9972 adve suze adve 9972 vyse vyse 902z adve sazz 9972 adve suze adve adve 9972 vuse Lape 2212 Lave Sngg Lave Love Lave 2 gg vyse Lape gg Love Love Lave 2 zz 23 U Bl ER 85226 N
57. S218 l AE22 _FSB_HIT_N v CC3 E e es s x ms LTN gt 1CH3 CPUSLPN n CDI pom mam A Dx lt 16 gt REQx 4 Y 4 1102 0 y AR23 FSB HITM N 15 ARIS uus P 3 CBI o CPUD 7 CBI m ss 14 ABIOW FSB_HREQ lt 4 gt _N 4 02 irae EZ 4 AESS Dx lt 13 gt REQX lt 1 gt 1 0 ass CPU_STPCLK_N DAA P _ 9 sm Dx lt 12 gt REox lt gt 7 Im m u Lockx VAL FSB_HLOCK_N 1103 05 20 2 e TRD ESB HTRDT N ELS Oe RAS I ITP TRST N ESA B SB_BERR_RN 505 1186 N u 8 Dx lt B gt RESERUED lt gt Y 25 CPU_PROC_HOT_N ITA 7 AB25 24 RESERuEp lt e gt DZS rece ana recs TN gt TTE E 24 Tck AR24 gt lt ne RESERUED lt 5 gt _HE15 CPU 9_SKTOCC_N 7an 159 RESERUED lt 4 515 s INY ITP_TDI_P C24 TDI euL 3 88254 erene lA 26 ITP_TDo_Pg E25 i ee 2 Y 4 Dx 2 22 816 7 E ice 1 ven DOS Y27 CPUO THRM 2 Y26 lt CPUUCC D eru LS CPUg_ ccR Je 2 5 T BEU 4 UH C667 AB4 THERMDC Y28 CRU
58. gt PAIRQ lt 9 gt BS 2 PAAD lt 6 gt PAIRQ lt 8 gt A5 P64H2_2_PA_IRQS Ls PAAD lt S gt PATRQ lt 7 gt P64H2_2_PA_IRQT 7 PAAD lt 4 gt PTRQ lt 5 gt 2 mm PAAD lt 3 gt PAIRQ lt 5 gt DS P64H2_2_PA_IRQS sss PRRD 2 gt PRTRQ lt 4 gt P64H2_2_PA_TRO4 PAAD lt 1 gt PAIRQ lt 3 gt 2 sed PAAD lt gt PAIRQ lt 2 gt 2 Lus PaIRO 1 Dv 2 PTRQ lt gt 2 PAPLOCKx NR23_P54H2_2_PR_PLOCK_N POR 1 5 JP3 JP32 JP27 PROTOCOL MAX FREQ 828 EE qe 5 5 e JU PER JUMPER JUMPER 13382 9 JUMPER JUMPER JUMPER 5 JUMPER JUMPER PIN 1 2 PSI X DES e e SRI FE CONTROLLER e INTEL CORPORATION DOCUMENT NUMBER PAGE REV 5888 CHANDLER BLVD CHANDLER A 85226 P64He_2_PB_AD lt 63 28 JP JQ S UT O1 JN LO
59. 6 lt 43 gt C1667 DD 0042 RN12 DQ_R lt 42 gt CN NIBBLE CS_AK lt 7 gt 2 C DD 2041 AH13 DQ_A lt 41 gt GROUP 6 CS_Ax lt 6 gt PKALS R524 DD 4 RE14 lt E CS_Rk lt 5 gt MAKT DDRO CSS N R OU TY ins BAS S DDR_DQ 9 AGI4 DA lt 395 CS lt 4 PSRNB_ DDRA_CS4_N_R iris Ep 0057 0038 DA A 389 NIGH NIBBLE CS_Ax lt 3 gt AHB DDRR_CS3_N R 1666 DD 053 ANIS DQ_A lt 37 gt DATA GROUP 5 9 CS_R lt 2 gt DDRA_CS2_N_R Asia chat 2 2521 DD DQ36 lt 36 gt CS_ lt 1 gt DDRR_LCS1_N_R pou M 5 13K DD 00513 713 DQS_ lt 13 gt CS_Ax lt gt PSAELS DDRR_CS _N_R Take ites BASE cs 5 1 49 9 DD 0054 8313 nQS_ lt 4 gt VIT DDR DDRR_DG35 AFIS 100 lt 35 gt 1 R841 2 2841 B e EAS DD 8715 DG 34 gt LOW NIBBLE E 500 47 OHM A DD 33 AMIS IDQ_ lt 33 gt GROUP 5 7501 49 9 OHM oR RE lt 31 gt 5 6 98 RN21 NIBBLE C1 _ DDRR_RCU_EN_ 1 RISI 2 1 NOPOP 0 e DD 0029 84721 lt 29 DATA GROUP 4 04 PS 00 0028 20 6 28 lt DD 00512 AK20 0105 2 lt 12 gt R161 00 0053 RE18 DOGS a RCUENOUT 2 DDRAa RCU EN OUT E7TS501 2NOPOP
60. 9021 9581 9021 9021 9021 sogg s041 9891 9891 9041 9891 9021 9891 9222 9041 9891 sogg 9041 sogg 9041 9891 9891 s041 9897 sogg 9891 ge 9021 9591 ge 9281 avez 9041 9291 9021 3997 206 9021 9997 206 2021 9891 9222 2021 BST ge LOET 2021 9281 avez 206 2021 9997 LOET 2021 9281 3E 9289 a UHUU ep 1742 CHO UHUU 2280 INO tonc e EHO lt E 507 EAT CAT aNs N eu N lt 8 gt 500 j O2 y H pet 2 SY UHUU EET
61. UCC3 lt 48 gt AH UCC lt 21 gt UCC3 lt 46 gt UCCK 20 gt UCC3 lt 45 gt UCC lt 19 gt UCC3 lt 44 gt UCC3 42 UCC3 lt 41 gt UCC3 lt 40 gt lC Sk el UCC3 38 MC iso EC E 255 UCC3 lt 34 gt UCC3 lt 32 gt UCC3 lt 30 gt B E A UCC3 lt 28 gt 22 EC CY UCC lt 1 gt CC don UCC3 lt 25 gt UCC3 lt 24 gt MC UCC3 lt 22 gt lE 21 gt UCC3 lt 20 gt MO UCC3 UCC3 UCC3 UCC3 CC UCC3 MO UCC3 lt 1 UCC3 lt 9 gt UCC3 lt 8 gt UCC3 lt 7 gt UCC3 6 EC UCC3 lt 4 gt VOCUS GS gt UCC3 lt 2 gt UCC3 lt 1 gt 40 00 A ETE 2 CQ 222 2200 0 0 02 2 2 CO CO CO CO CO 2 2 0222 2 20 0 0 02 9 C2 2 222200 0 0 02 02 02222200 0 09 09 0 02 2 2 CO CO C2 9 lt lt lt lt lt CO CO CO CO CO CO CO CO CO CO CO CO CO CO C2 CO VV YY AAA QO P LO LO NE O2 QU 3 OLOLOLOLOLOLO LO LO Vv CICICICICICICIC
62. lolo Mons 1010 Ex Tocco x Roo 2222 595250 4 2222 4 2222 lt lt lt lt lt lt lt lt lt 85555 lt lt lt lt lt lt lt lt lt lt lt lt lt s UMN ANMN ANMN UMN UIN ANMN ANMN ANMN QI cotton cot OM ODN 2 eee or 32002 R 5 gt gt gt 42202028 5 55 ES lt C GOD SS AM 2 UD 2 ER CORPORAT 5008 N AN 5 C Occ ANS NE SNS 5 OBS 25555 54220 60 AN m amp Y 0 00 0 00 01 1010 es 2 05 5 52554 5 55522 852224 2222 5252256 ue e og E amp ROCCO ROCCO ANS P64H2_2_PR_RCK54_N 2_2_PR_REQ3 P64H2_2_PA_REQ eO P LO LO LOL Qi 01 100 OT QI gt 1 e EE a oo G SS x xc MRR ee meee EOC HNMR ANMN ANMN HNMR ANMN ANMN ANMN HNMR z P64H2_2_PA_IRDY_N P64H2_2_PA_STOP_N PCI_SLOTS_TRST_N 2 2 PCI SLOTS H 3703 3803 3953 4107 4704 SLOT_1Q_TMS
63. roaz 8291 YH OST UM 220 Ort gg aast 9991 lt 25 gt 00 avaz saat 9291 Go 28 88 09 220 auae 9981 XH ESOC uuaa 88 lt 65 260 QO auae 2061 9591 lt 22590 KOK 22 XH OIC UOMO ELT 25 6 Qt 22 a ECC 521 CTA 85 c9od 84T 220 2 eT 13900 qian ar oar nnn nnn gg 2161 8291 SISOQ 221 lt 91 gt 550 dena T V 203 FBINNOO el gt EA peur v A E Le ul gt 23BB 2288 1988 1BBB 50C7 0 east sezr LA gt 290 gnzT 6 2021 vast Suae 2021 gnzT 9091 edet edet EnzT 2082 2902 edet edet EzT 1091 EzT PaT Eugg ugg PBT PBT EnzT 1291 gos edet EnzT 1291 ugg PBT ugg
64. 2 0 O D D 9 5000 25000 50000 50000 D J D D D 9 YG YG YG YG 00000000000000000000000000000000000000000000000000000000000000000000000000 4S 00000 IS UT BA UIUIUIUIUIUIUIUIUIUIUIUIUIUIUIUIUIUIUIUIUITUIUIUIUIUIUIUIUIUIUIUTUIUIUIUIUIU1U1 INTEL CORPORATION NUMBER PAG 5 88 CHANDLER B 25 CHAND Rs 85226 DDRA_DG27_R 0031 09031 RA_CB4 DDRA_CB4_R QOD RA_CBS DDRA_CBS_R
65. 69 CX u INTEL CORPORATION NUMBER PAG 5 88 CHANDLER B 68 Rs MNO TON XS 63B1 OU 63C1 OU 63C1 67c2 63C1 cc 6381 5782 7 xs 63ci 63ci 6782 57 6381 6782 eca 57 E 2 6381 5782 63C1 63ci 6782 250455 7 6381 6782 7 2 gt 6381 6782 6381 5782 57 NS i M 6381 67B2 6381 67c2 6381 6782 7 2 RS 2 63ci 6782 67c2 ACCS 1202020202020 40 UJ 2202020202040 40 J 6381 67B2 7 O NL ID NM GSC CN 0 INTEL CORPORATION NUMBER PAG 5 88 CHANDLER B 69 CHAND Rs 85226 WIN JM BU INTEL CORPORATION NUMBER PAG 5888 CHANDLER 70 CHANDLER 85226 JP38 1X3HDR e 1 2 SMBUS_ _USBYS_ YY USBYS 0 683 e 3 A C166 1 UE USBYS 0 623 A e e 1 2 e QJ UF QN Ya Y I u APRON 1020 Sg 051 5 0 SU SU Y Goin 0125 2 _ 1 YRC YR x
66. 7B_F RAMEN 10 1 7B_TRDY_N cj lt 4 01 c 4gc3 41B8 U C3 4188 SOO NUT SO GS CD AO UT ZW 37C7 C3 4188 gt 363 4ec3 gt 3653 4 D D is R R TK SY D B A D s D D OO QOD AJOUT S OU S S A 2 443 CK64 ED EE iiu 31C4 3504 4 3 4103 3504 4 3 4103 ES IU 2B Aaa 2 PC T3 RQOQ lt gt lt 3803 3962 ee CONN SUB INTEL CORPORATION RAG GND 5888 W CHANDLER B 39 CHAND 85226 E E J DD DDUDD DD DDUDD OC CO AJOUT S OU 3982 38c7 3867 41C1 2167 41R5 20 7 TORIS SLOT 2C EMS SLOT_2C_TDI P64He_2_PB_IRQB P64He_2_PB_IRQ1 G YEE P64 He_2_PB_ IRQS R I Deore 3703 3 D3 4107 4704 LJ 5 3184 35ca 3184 P64He_2_PB_IRQI11 ODD 1D E 3982 3662 21 4 41C1 ala 010 100 DD 10 1 4188 3582 2 38c3 as 3582 3BC3 39C3 4188 7
67. The Intel Xeon processor and Low Voltage Intel Xeon processor are based on the Intel NetBurst microarchitecture which includes the following advanced features Inte E7501 Scalable Performance Board Development Kit User s Manual 31 Theory of Operation ntel Hyper Pipelined Technology Branch prediction recovery pipeline is implemented in 20 stages whereas the previous architecture was 10 stages This enables an increase in performance frequency and scalability 400 533 MHz System Bus The highest performance Intel system bus yet allows for 3 2 4 3 Gbytes of data transfer per second over a 100 133 MHz core system bus clock that is quad pumped and buffered to achieve a sustained rate of 400 533 MT s Execution Trace Cache The L1 execution trace cache stores up to 12 000 in order decoded micro operations Because the decoder has been removed from the main execution loop instructions that are branched around are not stored resulting in maximum utilization of this cache Rapid Execution Engine Two arithmetic logic units ALUs are clocked at twice the core frequency allowing for basic integer operations such as Add Subtract Logical AND and Logical OR to be executed in one half of a clock cycle Advanced Transfer Cache The L2 ATC is 256 Kbytes in size and delivers a much higher throughput channel between the L2 cache and processor core Advanced Dynamic Execution The out of order execution unit is very
68. The evaluation board has a 40 pin connector for one of the IDE controllers present in the ICH3 S The connector will support up to one master and one slave IDE device RS 232 Serial Port The evaluation board provides one built in serial port IEEE 1284 Parallel Port One 25 pin DSUB IEEE 1284 Standard EPP ECP parallel port is provided on the evaluation board USB Ports The evaluation board has two USB connectors VGA Port The VGA port is a 15 pin DSUB female connector for output to a monitor Keyboard Mouse Ports There is one stacked PS 2 connector for a keyboard and mouse The top connector is for the keyboard and the bottom connector is for the mouse Expansion Slots and I O Connectors The evaluation board has the following expansion slots and I O Connectors One 64 bit 133 MHz PCI X slot One 64 bit 100 MHz PCI X slot Four 64 bit 66 MHz PCI X slots one contains a 2 0 extension which is connected directly to the MCH via HI 2 0 One 32 bit 33 MHz PCI slot Inte E7501 Scalable Performance Board De velopment Kit User s Manual In 3 3 5 1 3 3 5 2 3 3 5 3 3 3 6 3 3 7 3 3 8 3 3 8 1 Theory of Operation PCI X Slots There are six PCI X slots available on the evaluation board one 133 MHz one 100 MHz and four 66 MHz HI 2 0 Extension One of the 66 MHz PCI X connectors contains a HI 2 0 extension which is connected directly to the MCH via HI 2 0 If you purchased a P64H
69. UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC UCC lt 151 gt lt 150 gt 4159 158 156 4155 154 152 4151 158 149 148 147 4146 145 144 143 142 4141 140 lt 139 gt lt 138 gt lt 13 gt i 1 lt 1 lt i CHAOS co coc GS GENS C CAS ES SE SENOS EME SES 18 XEON_604 lt lt lt lt lt lt UCCUIDLBZUT OPTIMIZED COMPAT CPUO gt 1 2 DINAG 0 Ul 7295 583 563 763 1566 PAR DRO HERMRI M INTEL CORPORATION 5008 N CI x AND ER AN 85226 NUMB 3 INTEL CORPORATION NUMBER PAG 5000 CHANDLER B CHANDLER 85226 160 150 160 16 v EP Ag 3 5 3 5 3 ONDUIO NO AN ONDUIO NO ANI N PROCESSOR
70. dba ind CH3_PCIRST_N 3 PCIRST x GPTO3 PTRQF BS ICH3 PIRQF CLOSE pM CH3_PLOCK_N 1 gt PLOCK C5 ICH3_PIRQG_GP104 ESE lt SERR J GPTO5 PTRQH 85 1TCH3_PTRGH_GPTO5 DS 189 10 1 R 7 CH3_PME eu EM LPC SMI C4 GPIOD REQO s lt wo eis SIO PME 1 L SHCLK D18 es CH3_GNTR_ B6 GPIO16 GNTAx EE DIN 08 e GPIOL17 GNTBX GNTSx EE DOUT EE_CS E9 CH3 REG4 E4 REQ lt 4 gt 2022 ei CH3 REQ3 RAP REQ K lt 3 gt H CH3 REQ2 4 lt 2 gt LRN_CLK 9 F4 REQ lt 1 gt 1 AN_RXD lt 2 gt 89 CH3 REQO 03 gt Q AN_RXD lt 1 gt 88 Z q LAN_RXD lt gt cj GNT 4 LAN RSTSYNC 07 05 lt 3 gt QN TXD 2 818 9 G TK lt 2 gt _ 1 1 lt 1 gt LRN_TXD lt gt 9 ICH3_GNT _N A4 G 0 u it 1 OF 4 4 5 3852 5 5 ae PCIRST_2_N TY densi ss vote vecs 9 x PCISST2 S N sr ira ias nest T 68 2 168 10 ICH3_PCIRST_N UCG 1 4 ses aono arer ass aan TN CC 1 4 UCC UCC3 UCC UCC3 INTEL CORPORATION DOCUMENT NUMBER PAGE R
71. f 2 1 e 1 6 ucc 3 4 2 9 SMBUS 2 CC 8 e 510 GND 4 e Q VEE 2Y lt i gt UCC 1 UCC US USBYS_ A e ICH3_SMBDATA 3 27 2C_BUS A ICH3 SMBCLK d 1Y 3 1 C1553 e 1Y lt 2 gt 15 5 ECH3_SMBUS_SEL1 9 g lt 1 gt 14 ICH3_SMBUS_SEL 10 lt gt Y O 12 2C BUS2 Qu e 9 S E 5 SU SU GN 8 X lt v lt TE 1X3HDR gt Sey e e 1 id e 214 SMBUS 2 UCC3 95 as O BYS_ v 13 A Qu T C1664 e e QJ OSS 05 9 IN SU SU X lt 1X3HDR 1 25 SMBUS 3 UCC3 e gt USBYS 0 U113 A T 74ACTO4 C1665 2C BUSS CLK CE rm ma isnt ana sata vana 1UF SYS_SLP_S5_N 2C_BUS3_DA 1784 Lona Send 23A4 Sana TEAS lt 2C_BUS1_CLK S 9 CJ D INTE CORPORATION DOCUMENT NUMBER PAG 5000 CHANDLER UD TL CHANDLER A 852206 s j j 2304 2294 38C7 37C7 SD3 71A I2C BUS 3 6 P64H2 2 ROSERR N U113 4ACTQ4 JOINIUIO io Noa CONNECTOR IDAT ION 7 Z Do
72. gt LC C 3 doo CC gt YOCS lt 23 gt UCC3 lt 22 gt CC 1 UCC3 lt 20 gt UC S TS VECS TES UCECI VECIS UCC3 VECS CC 276 6622 MC VECS gt MCI CCS T UCC3 lt 6 gt gt 4 gt YOCS lt MCC CC3 1 gt 500000000 300000000 D D D Zi apa apu uv wv 22252 20 20 D ees D G T0 UANO NAINA y D OOD OOD D 2 D amp UIO1A1 000 G9 PO C0 U101 A100 D D D J HW D OOD OOD D J 700 500 lt lt lt D J D QJ 09 C9 WW NO b D J UJUUUUUDUUUUDUUDOUUUUUUDGUU UUUUUUUUuUUuUUuUUUuUuJuuuuuuUuuuuu uuuUuuuuutu dG OO 70200006 DESAY NONO N NC NS OG UE JE EET EE JE CD SG EE WC OR JEJE EE C s Q Oln INTEL CORPORATION NUMBER PAG 5000 N CHANDLER 60
73. pi 22840 A UNO T 5 2 149 594 51242 INS por 4 O H zgo UHUd 2 a shee BTU E S E ELT TAT 6 ON ENS 2 2 all 1282 east 2081 OSO BS Lv lt B gt Sod 4 OND p rd lt paren euer ane POO PET p HO INO EOIN a Q UME GET lid WZ 2302 east vost J ogo waaa T 9582 aNs N 20486 ST 4 4 9 8 ik u 285 Usdd 4280 son MU ua lt e aa Gri lt 2 gt 500 IND Do gt y caet S UO SGL i a o M x m Y m east edet rust TOO uuaa T gt 04 133331 OND rs S S east eaat von HEB OHIO eO 1S15 NON ONS caet EnBT vest H EDU URB 8 260 OND m uada x osod uuaa gQ sod 4 OND ose ener 1281 H pod v6 rou CNS m gos eqet eget M GO UNI G o OND e east EnBT rust Ud 96 lt 260 OND zuez east EBT uat MH LOO UOI 66 lt 2 O0 OND east ener rust 3 ESD UHHH 26 lt 6 gt S500 J INO x Y x caet eget vast H ADT UNIT 8750 OND QN QN 5 eva edet 891 UH ET lt 6 gt 0d NO 0 0 m 0 58 bast H aiod Usdd AND OK2S ON A A m um Pede dogr eder T TOH US Ge rr od ANG KES O
74. 1807 5 es VID_UCC lt 2 gt N C lt 1 gt GND lt 195 gt GND lt 24 gt 215 4 a 2 CPU_SMBUS_WP GND lt 194 gt GND lt 23 gt Mons 945582 28 N NUTUS UCC 184 FREES urp_ucc lt i gt NZC lt gt E LM GND lt 1 2 gt 2 5 1X2HDR MP 3 Tae BUS2 CI K TER fo UCC 102 e NZC S Se A 1 PT UCC 181 it 2 OO 1 Rees UCC lt 1 gt ps CNE UCC 88 D ES N C lt 2 gt pea UCC 98 UCCVIDLB UTT N C lt 1 gt UCC 97 UCC 98 E Ns UCC 95 OPTIMIZED COMPATX UCC 94 UCC 93 UCC 92 UCC 91 WUN GND lt 96 gt GND lt 95 gt GND lt 94 gt GND lt 93 gt GND lt 92 gt GND lt 91 gt GND lt gt CC lt gt GND lt 89 gt UCC lt 89 gt GND lt 88 gt UCC lt 88 gt UCC lt 7 gt GND 87 UCC 87 UCC lt gt GND lt 86 gt 72 NUS X UCC 88 UCC lt 5 gt A28 GND lt 85 gt GND lt 4 gt t PA 27 2 UCC lt 85 gt UCC 4 gt GND lt 84 gt GND lt gt e A2 UCC lt 84 gt UCC lt gt GND lt 83 gt GND lt 2 gt 3 z fd UCC 83 UCC lt 2 gt GND
75. E7501 Chipset ki 33 3 9 9 Boot ROM u uuu La xu uiu 35 3 3 4 System 35 3 3 5 Expansion Slots and 36 3 3 6 Post Code Debugger 37 3 9 7 InsTarget Probe LT Pus itane tener 37 3 3 8 Clock Generation ce ea 37 3 3 9 Power Supply Requirements 38 3 4 Battery Requirements scans aaa 38 4 Hardware Refe rence iie needed A 39 4 1 Chipset Components 40 4 2 Expansion Slots and Sockets sarisini iiaa eiia 40 421 32 Bit PCI Slot 41 4 2 2 64 bit PCI X 41 4 2 3 Interface 2 0 Extension 43 4 2 4 Processor Sockets cad espe iei 44 4 2 5 Firmware Hub FWH BIOS 44 42 6 Battery lt 44 4 3 On Board Connectors itp 44 431 WTX ee Sa va sd a 45 432 SCS 5 LLL EORR nad ESER 47 Inte E7501 Scalable Performance Board Development Kit User s Manual 3 Contents ntel 4 33 1
76. For example a CPU Frequency Multiplier value of 20 on a board that is populated with 400 MHz FSB processors will result in an effective processor operating frequency of 2 0 GHz It should be noted that not all multipliers are allowable While the setup option may allow a value to be entered it is not guaranteed that the entered multiplier will actually result in the intended processor frequency The effective frequency of the processor depends on the supported frequency range of the processor If a value entered in this option is not explicitly supported by the processor the system should exhibit the following behavior Ifthe multiplier would target a processor frequency of below 1 2 GHz the system will strap to 800 MHz Ifthe multiplier would target a processor frequency between 1 2 GHz and the lowest supported processor frequency the system will strap to the lowest supported processor frequency Ifthe multiplier would target a processor frequency above the highest supported processor frequency the system will strap to the highest supported processor frequency Hyper Threading A setup option is available to turn Hyper Threading on and off as well If you are running on an operating system that takes advantage of hyper threading technology you will want to have this option enabled The setting of this option will affect how many processors are reported on the BIOS splash screen as well as to the operating system Inte E
77. RA RA QOD NOU T KA DDODD 0 sgcs 7B_F RAMEN 10 1 34C2 AB TRDY DUD lt lt woo c SOO A OYUT SO u CS CD AO UT 20 lt 38C7 36C7 38C7 U GIC RS CSI OL 3492 2702 GC NOU Js CJ LOZ 5 G m 143 E A S OU 3CK O64 gt 59 OU U 596 MP SLO S4H2 1 DSEL 2018 E abonar Glue chee INTEL CORPORATION NUMBER PAG 5808 CHANDLER 37 CHAND 85226 E DDUDD DD DD DDUDD QOD AJOUT S RSUD CO RSUD TRS 20 Deore 3703 3803 4203 4107 4704 SLOT_2A_TDI UCC P54H2_2_PB_TRQG e 2 P64H2_2_PB_TRQ2 P64H2_2_PB_TRG1 P54H2_2_PB_TRQ3 LJ ck 5 3184 35ca 3184 ODD D 3992 3862 21 4 aici ala 40C3 41CE
78. gi v O AAA MUA OC HHHHHHHHH Cel CEOS H PSTRB_C lt gt C23 VXB PSTRB lt 0 gt 823 UXB PSTRB_C lt 1 gt 018 UXB TRB PSTRB Cx 1 7 UXB IRCOMP_B HIRCOMP C Cag COMP _ ISWNG_B HISWNG_C YSWING TUREF_B TUREF IUREF HTSMNG HIRCOMP STRB Dx 1 STRB CLKES STRB C RSTINX STRB HH E PR SWNG_A UR UREF 11 RCOMP UT 5 116 SH CH3_PSTRBS D13 N PSTRB_Ax 212 11 18 i Q 10 3 jit 8 J1 lt gt a5 4 3 gt N CT I D 20 aca ER HHHHHHHHHH T INTEL CORPORATION NUMBER SOO0 CHANDLER 12 CHAND 85226
79. 0059513 P G 1704 1804 1804 2266 1706 1805 1905 1703 1802 1903 2286 1703 1802 1903 22c3 1702 1802 1902 1702 1802 1902 1702 1802 1903 1703 1803 1903 1705 1805 1905 1706 1805 1906 2267 1705 1805 1905 2897 1705 1805 1905 1707 1807 1907 2 RB 1706 1806 1906 2 RB 1706 1806 1907 2 RB 1706 1806 1906 2 RB 1706 1806 1906 1707 1807 1907 1707 1806 1907 1706 1806 1906 1706 1806 1906 22C5 1706 1806 1906 2265 1706 1806 1906 2265 1706 1806 1906 2865 1706 1806 1906 2265 1707 1806 1907 2865 1706 1806 1906 2865 1707 1806 1907 2865 1706 1806 1906 2065 1706 1806 1906 2 5 1706 1806 1906 2865 1706 1806 1906 22C5 1706 1805 1906 2206 1705 1805 1905 2865 1706 1806 1906 2895 1705 1805 1906 20 5 1705 1805 1905 1706 1805 1906 2064 1706 1806 1906 2294 1705 1805 1905 1705 1805 1905 1705 1805 1905 1705 1805 1905 1705 1805 1905 13Ba 1 1 1308 1308 1308 1308 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1388 1308 1308 1388 1388 1308 1308 1308 1308 1388 1308 1388 1388
80. 1 gt 590 6201 grou lt B gt OH 6201 lt 67 gt 00 0201 baud lt a S gt od 6201 ISOU UHUU lt 18260 6201 gsou gaua 9 SOd j 6201 gatu 0201 EGOU UHUU lt ES gt od 6201 lt 7S gt od 6201 GGOU UHUU lt 55 gt 90 0221 a SISOU gatu 151 500 220 cg lt 965 gt 90 220 ZGOU lt 26 gt 201 HGOU gada 78 9860 lt 6S gt o0d 220 2500 gada og lt 2 gt SOCG 4 220 gogoa gatt 9264 220 IGOH_BJHU lt 19260 220 zgod lt 49 gt 90 Don 2 UHUU amp 1 lt S gt o0d UI a SISOU gadu 227 lt St gt sod 3380 T 203 e aul om gt H A a 4 bit L x gt gg 1788 sopa LN J vaer vaer POET ALT bBT POET Gugg BT bBT POET v8g21 bBT POET gugg SALT bBT POET gugg SALT bBT POET Egg SALT bBT POET Egg SALT SYET POET Ogg SALT SUBST POET Eugg SALT POET LUAZ SALT SYET POET Egg SALT SbBT v ET SALT POET 2202 SALT SbBT POET Ogg SALT POET SALT SbBT v2ET eos POET Gogg SALT SbBT POET SALT SUBST POET GOgg SALT SbBT
81. 299 gt D lt 298 gt 297 D lt 296 02295 02294 DASS D lt 292 gt D lt 291 gt D 290 D 289 D 288 D 287 D 286 D lt 285 gt lt 2684 lt 2683 262 D lt 281 gt D 280 D lt 279 gt D lt 278 gt LI Dy 76 gt D lt 275 gt D lt 274 gt Deer o gt D lt 272 gt D lt 271 gt 50000000 50000000 DD DD D D D 50000000 50000000 D D D OOOOOOOG OOOOOOOG OOOOOOOO0 OOOOOOOO0 D J D D 9 D D J D J D J D D OG OG OG OG D D D D D D J D D J D D D 0 O 0 D D D OD OOG 0200 D J D 9 D D INR TOC S O S 0 D D D 9 D NN OD OD OD D D OOG OOG OOG OOG D 50000 50000 50000 30000 D D J D D D D 3 D 9 D D OG OG OG OG D J D OD OD OG OG D D
82. 992 993 994 995 996 997 998 999 1000 1001 1002 1003 1004 1005 1006 C1007 C1008 C1009 C1010 C1011 1012 1013 1014 1015 1016 1017 1018 1019 1020 Ref Des Cont 74 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 5 of 17 Bill of Materials Quantity Reference Description Description Manufacturer Manufacturer P N 402 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 1032 1033 1034 1035 1036 1037 1038 1039 1040 1143 1144 1145 1146 1147 C1148 C1149 C1150 C1152 C1153 1154 1156 1157 1158 1159 1160 1161 1162 1163 1164 1165 1166 1167 1168 1169 1170 1171 1172 1173 1174 1175 1176 1177 1178 1179 1180 1181 1182 1183 1184 1185 1186 1187 1188 1189 C1190 C1191 C1192 C1193 Ref Des Cont 402 C1194 C1195 C1196 C1197 C1198 1199 1200 1201 1202 1203 1204 1205 1206 1207 1208 1209 1210 1211 1212 1213 1214 1215 1216 1217 1218 C1219 C1220 C1221 C1222 C1223 C1224 C1225 C1226 C1227 C1228 C1319 C1320 C1323 C1324 C1341 1378 1380 1381 1382 1383 1384 1385 1386 1387 1388 1389 1501 1503 1504 1507 1508 1513 1514 1515 1516 1517 1518 1519 1520 1521
83. AD lt 43 gt REQ64x 9719 1 PB 4 1 6 AD lt 425 ACIB 64 2 _ C1928 ae FL_RDD lt 4 gt ADC ALS Oris e FL_ADD lt 3 gt gt 25 7 AD lt 40 gt GNT 4 P64H2_1_PB_GNT _N E 2 cpu E e e AD lt 39 gt LOCK P54H2_1_PB_PLOCK_N 42 AD lt 385 22 7A4 3492 37C3 55 AD lt 37 gt CLK P64H2_ 1 PB PCLKO LJ 1 1 AD lt 35 gt amp GEN ELB P64H2 1 PB MEGEN uc AD 355 RSTx KYL IM Ex AD lt 34 gt lt 1 2 i 2 Las NPO NPO 33 gt B21 SYS_PAROK_ 21 1209 DATA lt T gt AD lt 32 gt FIRST TUR EM PME CPF E IB FL_DATA lt 6 gt gt ud AD lt 31 gt APM_WAKEUP 25 589 a DATA lt 5 gt e AD lt AUX Y4 AUX_PWR sepes TRSA C1 AD lt 29 gt 91 1 UCCa 25 J EL DATA lt 3 gt AD lt 28 gt PLMIR_STRTE DATAK 2 gt INK UP yP3_LINK_UP_N ICUD e l F DA lt 1 RX_ACTIVITY OE RE4 AD lt 26 gt NT P54H2_1_PB_IRQg 2 1 lt gt DX ACTIVITY GCI N Ty se 25 AD lt 25 gt E lt y R939 LTNK1 223 CUD _ mam j SE 57 1 K A14 OX LINK1 x P lt R2 LINKIOO N OUT 23 605 235 S 17164 603 2 1 ec J LINKI N Hy
84. CC 4 305 Uoc MC 5 gt CC gt MC LCG S lt UCGS lt LUC C Sk ES UCC3 lt 27 gt ce 26 gt CC 25 gt CC gt MC gt Pu pit CC oig VECS LS VECS CC MC CCC MCC VECS o gt UCC3 lt 7 gt MC OY x UCCS lt 25 34 00 1 4 0 2 2 22 2 2 20 0 0 09 02 CO 22 22 2 09 0 0909 C9 CO C2 CO CO 22 02 09 09 09 9 CO CO CO CO CO CO CO C2 0 02 CO COCO CO C2 0 2 00 0909 09 9 2 CO CO CO CO C9 0 0 09 09 9 CO CO CO CO CO CO CO C CO CO CO CO CO CICICICICICICIC NAINA lt lt NVEMWAUIOING POWER ANI DECOUPLING 2 INTEI CORPORATION JOCUMENT NUMBER AG 5000 N CHANDLER B 29 CHAND 35226
85. CHAND 5 85226 AN_AGND ED eem CAD NOTE CREA A FLOOD 1 AN AROUND RJ45 CONNECTOR AN_AGND IN AN EEPROM MAGNETICS AND CONNECTOR INTEL CORPORATION NUMBER 5000 W CHANDLER CHANDLER 85226 3592 H2 2 Pa IRQO H2 2 586 wa 5 5 2 2 El 5 1 3 4T 64H2 2 s COT E Ud C 2 Pn SEG N REGEA 9 2 GN IN HANDBOOK FOR ION REGARDING DE 1 675 2 Po4H2 2 Pa aD oa3 0 3586 3508 3508 POI PO POL POS 7 CXXX 586 2 2 2 RSUDA TESTA RSUDS RSUDT RSUDO RSUDS 25003 94 2 TEST10 T JD OD NUMBER Other names and brands may be claimed as the property of others ae 62 CHAND 35226
86. GND lt 148 gt GND lt 67 gt 7 F30 UCC lt 148 gt 5 FS GND lt 147 GND lt 66 gt 1 11 7295 7191 1 CC lt 14 gt GND lt 146 gt GND lt 65 gt UCC lt 146 GND 145 GND lt 64 gt 9 lt 145 GND lt 144 gt UCC lt 144 gt GND 143 UCC 143 UCC lt 142 gt 5 GND lt 141 gt LG 4141 V 5 GND 140 604 UCC 140 5 GND lt 139 gt UCC lt 139 gt GND lt 138 gt Y7 CC lt 138 Ul 5 SS ao o UCC 181 GND 187 GND 137 YS 136 137 UCC lt 188 GND lt 186 GND 136 YR UCC lt 136 gt 55 Sas o eo UCC 179 GND 185 131 GND lt 135 gt me UCC 135 5 o UCC lt 1785 GND lt 184 GND lt gt G 5 M a UCC lt 134 gt 5 UCC 1 gt GND lt 183 0 GND lt 133 gt 52 S L OJ 8 UCC lt 133 gt 52 9 lt 1765 GND lt 182 GND lt 132 gt S HE UCC lt 1325 5 C UCC 1755 GND lt 181 gt 715 GND 131 Y UCC lt 131 gt 5 UCC 174 gt GND lt 180 171 GND lt gt 1 4 MUS D UCC 130 Vi UCC 1735 GND lt 1795 4 GND lt 129 129 UCC 172 GND 178 C SMB P GND lt 128 e 9 n ID CPUL_SMB_PRT CC lt 128 4 UCC 171 GND lt 177 GND 127 CC lt 12 gt 5 CC lt 17 gt GND lt 176 gt W26 GND
87. Inte E7501 Scalable Performance Board Development Kit User s Manual 21 Getting Started Intel Table 2 Additional Hardware Sheet 2 of 2 An Intel 82544 Gigabit Ethernet Controller is included in the development kit Cat5 cable with an RJ 45 connector is required to connect this Ethernet adapter to your Network Adapter network You may use a different network card other than the controller included on the board however you are responsible for installing the correct drivers for any additional network cards The evaluation board supports PCI PCI X cards P64H2 Riser You may have purchased a P64H2 Riser Card with your development kit It is Card recommended that you install this card after you have initially booted and configured your system Refer to Chapter 5 for detailed installation instructions Other Devices and Adapters The evaluation board behaves much like a standard workstation or server motherboard Many PC compatible peripherals be attached and configured to work with the evaluation board For example you may want to install a sound card or additional network adapters You are responsible for procuring and installing any drivers required for additional devices 2 6 Setting up the Evaluation Board Once you have gathered the hardware described in the last section follow the steps below to set up your development kit This manual assumes you are familiar with basic concepts involved
88. Love Lave 20 Love 9972 Love 2 Ez cove gt gt n n DE D e e u u u A d Y N w N 0 A KC oi UHO HHUU rr 9289 TES HHUU cz 1249 CHO HHUU 2242 HHUU TS 45280 ELT ZOT TAT 6 ON INS esou HHUU 2 8 S0d NO H PUO HHUU pet
89. NOD NOY VDD DD 39C3 41C 1G 1 D a C3 4188 2 B_TRDY_N 4gc3 4188 OO NOY 00 C3 4188 BS 37C7 C3 4188 S 37C7 700 lt gt 3983 4 t 0 0 4 DU NIS Giz 05 OG 002 lls WN lt ODD O OAD DD REQ64_N F085 54H2_2_PB_RCK54 CBI gt 00041010 5DUTOOO0 DDC 1019 0110 1901101 N MWIN NI NIN DD la x O PA 2 L el Y UE 32 KO DT an RE BU RSI a eem Y 9316 INTEL CORPORATION NUMBER 5000 W CHANDLER B CHAND 85226 SOINU DD NOD NOY VDD 4105 4206 RELA SLOTS peeve sss seo 972 2 S pas p 2 2 PB IRO4 e A 2_2_PB_IRQ6 P64H2_2_PB_IRQS P64H2_2_PB_IRQ 3184 OU T LJ 5 3184 35ca 3184 FN a 2 QOD AN IDODD4 A2 3902 3563 3107 38C3 41C 21 4 41C1 2187 4165 40A CO NO GT DDODD 38C3 40C3 1
90. PAAD lt 32 gt PAC BE lt 5 gt 21 P64H2_1_PA_CB PAAD 31 gt PAC BEx lt 4 8821 1 8 PAAD lt 30 gt PRC BE lt 3 gt E22 Pe4H2 1 PR CB Ke4 PAADK 29 gt 2 NLS _ P64H2_1_P_CB Kee PAADK lt 28 gt PAC BEx lt 1 gt 3124 1 CB PARD lt 27 gt x PAC BEx lt gt pxahe4 64 2 1 PAAD lt 25 gt 18 PAAD lt 25 PRPCLKT 917 1 p 57 PAAR 93 PRPCLKO lt 5 gt 3 P54H2_1_Pa_PCLK6 8586 2 PAAD lt 22 gt PAPCLKO lt 5 gt 22 33 23 PAAD lt 21 gt PAPCLKO lt 4 20 21 PAAD lt 2 gt PAPCLKO lt 3 gt 19 PLACE SERIES RESISTORS WITHIN 1 INCH OF P64H2 28 PAAD lt 19 gt PAPCLKO lt 2 gt 2 2 PAAD lt 18 gt PAPCLKO lt 1 gt 3 22_ PAAD lt 17 gt PAPCLKO lt gt J21 P64H2 1 PA PCLK R 1 5956 2 1 KO DT 21 PARAD lt 16 gt 33 ze PAAD lt 15 gt PAPCIRST E24 PS4r2 1 Pe RST N LETS PAAD lt 14 gt Bly PAAD lt 13 gt PRTRQ lt 15 gt 2 xm asta PAAD lt 12 gt PRTRQ lt 14 gt 1 23 PD lt 11 gt PRTRQ lt 135 LES P64H2 1 FOR ATION ONLY 22 PAAD lt 1 gt 2 PAIRQ lt 12 gt ES PB54H2 1 IFQ12 Aui PAAD lt 9 gt PATRQ lt 11 gt EZ 5 E 1 ans 8 4 4He_1_ 7 24 an B5 1 4 gt JP26 JP24 e JP25 MAX FREQ 6 U24 PRD lt 5 gt PATRQ
91. U K 44 0 1793 421333 Germany 44 0 1793 421777 France 81 0 120 47 88 32 Japan fax only Inte E7501 Scalable Performance Board De velopment Kit User s Manual n About This Manual 1 5 Related Documents Table 1 Related Documents Document Title 5 Low Voltage Intel Xeon Processor Datasheet 273766 Low Voltage Inte Xeon Processor for Embedded Applications Thermal Design Guide 273764 Intel Xeon Processor with 512 L2 Cache at 1 80 GHz to 2 8 GHz Datasheet 298642 Intel Processor Specification Update 249678 Intel Processor with 512 KB L2 Cache System Compatibility Guidelines 298645 Voltage Regulator Module VRM 9 0 DC DC Converter Design Guidelines 249205 Voltage Regulator Module VRM 9 1 DC DC Converter Design Guidelines 298646 Dual Intel Xeon Processor Voltage Regulator Down VRD Design Guidelines 298644 ITP700 Debug Port Design Guide 249679 Intel Xeon Processor Thermal Design Guidelines 298348 Intel Xeon Processor and Intel E7500 E7501 Chipset Compatibile Platform Design Guide 251929 Intel E7500 Chipset Design Guide Intel E7500 Chipset Memory Controller Hub Thermal and Mechanical Design Guidelines Intel E7501 Chipset Datasheet Intel E7501 Chipset Memory Controller Hub 251927 Intel 82870P2 PCI PCI X 64 bit Hub 2 P64H2 Datasheet 290732 Inte 82801CA
92. a Dx lt 40 gt 49 Dk lt AB PAL3 48 x DK lt 47 gt RB 47 Dx lt 45 gt PARTY 45 Dx lt 45 gt N7 45 Dx lt 44 gt PSP 44 n 43 gt 43 Dx lt 42 gt PSPS 42 A Dx lt 41 gt KJS 41 gt Dx lt 40 gt PNE 42 5 Dx 39 Dx lt 38 gt 38 x Dx 37 71 A Dx 36 63 36 m D lt 35 gt K3 35 Dx lt 34 gt 562 34 n Dx lt 33 gt HS 33 I D lt 32 gt 32 x lt 31 XM c Dx lt 30 gt PEL m D lt 29 gt 29 Dx lt 28 gt E2 28 n Dx lt 27 gt 27 I Dx lt 26 gt PES 26 X HDx 25 25 gt Dx 24 8 24 Dk lt 23 gt E4 23 I Dx lt 22 gt KES 22 x Dx 21 506 21 Dx 20 66 28 Dx lt 10 gt KEE 19 5 Dx lt 18 gt 18 DK lt 17 gt 17 I Dx lt 16 gt KE 16 x Dx lt 15 gt 577 15 Dx lt 14 gt IS 14 D lt 13 gt RCE 13 Dx lt 12 gt H 12 n DK lt 11 gt 07 11 I Dx lt 10 gt PSC 10 5 Dx 9 PICA gt Dx lt 8 gt AB 8 lt 7 p3C8 T Dx 6 5 Dx lt 5 gt 583 5 Dx 4 2 Dx lt 3 gt BS 3 E Dx 2 404 2 DK lt 1 gt P489 1 Dx lt O gt BS 2 Em d 2 INTEL CORPORATION OOOOOOOO0 QAKRAKRAKRAAAA OC PO QJ OC 2
93. ie te Pie Pate lei epo 60 531 9 EXITS p ierat DE EA SS E O e 61 5 2 Updatingrthe BIOS saa E ea tia tias 62 5 9 Troubleshooting SEE A bati tes SRE 62 531 Error Messages nus cce eee e ec a eee 62 5312 COMES uuu SS Eu uay 62 5 3 37 Fatal Error CONES tere erae ne 62 6 P64H2 Riser Card annon Iram ed o eto 64 6 1 DERIT 64 62 Hardware Installationen ertet re eet ete Re ne Rite er er erede 66 6 3 Hardware 69 6 3 1 J mper Settings cep nter 69 6 3 2 Hot Plug and Bootable 70 4 Inte E7501 Scalable Performance Board Development Kit User s Manual ntel Figures 1 Assembled Board Component Stand Front 24 2 Assembled Board Component Stand 24 3 Mounting Hardware Installation 25 4 Processor Assembly 26 5 Installed Heatsink 27 6 Block Diagram EE 30 7 Board Layout Blagram ete tede 39 8 Peripheral Connectors u L U E Hed ERE 53 9 P64H2 Riser Card Block Diagram 64 10 P64H2 Riser Card 65 11 Inserting
94. lt 29 DATA GROUP 4 RCUENOUT RE DDRB_RCU_EN_OUT 1 NOPO Qu DDRB_DQ28 32 DQ_B lt 28 gt DDRB_DRCOMP e DOSE Llc DQS_B lt 12 gt DDRCUOH A32 DDRCUOH B e DQS_B lt 3 gt 00 8 T32 DO 3 QA 0058 0026 R26 DQ_B lt 2B LOW NIBBLE pas 1 DQ_B lt 25 gt GROUP 4 __ C4 923 DDRCVOL_B Sa 77 80 ni gi DQ_B lt 24 gt US NIS DDRB_DQ23 U31 lt 23 gt 603 EMPTY 5 2 p DDRB DG22 soc MTCN CKE_B M32 1 1948 ppRB_ckEg ar PM amp DDRB DSA 532 SOUP 32 a d 5 1 lt lt gt lI DDRB_DQS1 1 DQS 115 RESERVEDS VTT DDR TT DDRB_DQS2 933 1005 lt 25 R215 DDRB_DQ19 126 DG lt 195 7500 NOPOP DDRB_DQ18 B 18 oN NIBBLE 7501 24 9 ST La DQ B lt 17 gt DATA GROUP CMDCLK_B3 22 A C784 DQ1 DQ_B lt 15 gt CMDCLK_B3 2 DDRB_DQ15 P28 a CMDCLK_B2 Je6DDRB CMDCLK2 S 1 NOPOD DDRB_DQ14 P26 0 8414 106 2 CMDCLK B2x as lt n DDRB DQ13 L31 DQ_B lt 13 gt GROUP 2 CMDCLK_B1 FL28DDRB CMDCLKI eO R3125 DDRB DQ12 131 lt 12 gt 54 CMDCLK_Bix pP M2Z8DDRB CMDCLKI N 24
95. 0 0 0 e q i LJ U KA 2 wok EN 4 L 0 zm FSS CS QD 1 QJ CAD NOTE AIL CARS SHOUL D HAVE DIRECT CONNECT 2 5U PLANE 2 VIAS INTEL CO 2000 ORATION DOCUM UJ 2 J c DOCUMENT NUMBER PAGE REV 17 gt m O 2 O Zn NOD z gt Go
96. 01UF 10 50V 603 E A V X CERAMICS CORP 06035C103KAT4A 34 C631 C638 C889 C1269 C1276 C1277 C1278 C1291 C1293 C1294 C1295 C1296 C1297 C1298 C1299 C1300 C1304 C1305 C1306 C1307 C1308 C1309 C1310 C1311 C1312 1613 1614 1615 1616 1617 1618 1623 1624 1625 CAPN_603 01UF A V X CERAMICS CORP 06035C103MAT4A 66 777 779 780 781 782 783 1313 1314 1315 1316 1317 1318 1321 1322 1325 1326 1327 1328 1329 1330 1331 1332 1333 1334 1335 1336 1337 1338 1342 1343 1344 1345 1346 1347 1348 1349 1350 1351 1352 1353 1354 1355 1356 1357 1358 1359 1360 1361 1362 1363 1364 1365 1366 1367 1368 1369 1370 1371 1374 1375 1376 1379 1598 1599 1670 1671 CAPN_603 01UF A V X CERAMICS CORP 06035C103JAT4A Inte E7501 Scalable Performance Board Development Kit User s Manual 73 of Materials Table 35 Bill of Materials Sheet 4 of 17 Intel Quantity Reference Description Description Manufacturer Manufacturer P N 3 617 1372 1373 CAPN_603 047UF AVXCERAMICS CORP 0603YC473JAT4A 41 785 786 787 788 789 790 791 792 793 794 795 796 797 798 799 800 801 802 C803 C804 C805 C806 C807 C808 C809 C810 C811 C812 C813 C814 C815 C816 C817 C818 C819 C820 C821 C822
97. 056 057 058 0 IC DS FET N TO 8 SHO OB VISHAY SUP70N03 09BP MURATA ELEC 2 FB4 FB5 FERRITE_SM 651080 003 LE BLM21P300SPT1 FER BEAD 0805 600 0 7 FB6 FB7 FB8 FB9 FB10 FB30 FBS1 OHM 20 A MURATA BLM31A700S MURATA ELEC 5 FB13 FB14 FB15 FB16 FB18 BD SM 651080 002 MORATA ELEC a BLM31P500SPT1 MURATA ELEC 6 FB1 FB2 FB3 FB27 FB28 FB29 BD SM 693286 00 BLM11P600SPT1 DIODES INC 1 Q55 FET SOT23 201924 001 LITEON POWER BS870 SEMI FAIRCHILD 1 Q54 FET_SOT23 665805 001 SEMICONDUCTOR BSS138 CORP 2 RT3 RT4 POLYSWITCH SMT 2 600A Raychem SMD260 2 1 U69 ee INTELCORP N82802AC8SB48 60752325 SSOP 621111 TEXAS U61 103 A INSTRUMENT GD7S2320BR XFMR LAN 1000 BASE 9 U65 TSMT24 Pins SINGLE PULSE 5007 IC LIN SOIC HIP6301 CON HIP6301CB 1 U55 INTERSIL 4 U48 U49 U50 U51 CNT INTERSIL H1P6601BECB ASSY IC CHIPSETS FW N 1 U45 4 INTEL FW82801CA QC43 78 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 9 of 17 Bill of Materials Quantity Reference Description Description Manufacturer Manufacturer P N 1 U60 22227400540 ICS932S203AF INDUCTOR_SM 201005 MURATA ELEC 2 L20 L21 us _ LQG21NR10K10T2 INDUCTOR SM 721891 MURATA ELEC 6 121314151619 AMERICA LQG21N4R7K10T2 CHOKE COI
98. 18 6321 PAMA 26000 ucc 20 ICH3_URMPWRGD 1 21 21 1 PHASE GOTE BOOT GATE GND Z NES INTEL CORPORATION NUMBER 5 88 M CHANDLER B 53 CHAND Rs 85226 CAD NOTE ROUTE CLOSE CK4 8B lt 1 ITP_BCLK1 ITP_BCLK Lace e e e SE 2 iei CAD NOTE 1 1 1 1 pas TRACE ENGHTS MUST C88 18 CB57 C869 5 207 1UF 1UF 1UF 15 001 107 1 12 gt 155 1695 50 526 x7 XIR 5239 5239 503 060 E TN ICS93252038 1 2 LACE ENGHTS CAD NOTE TRACE LENGHTS MUST BE gt 3 ROUTED LENGTH MATCHED JL_BCLK1 56MHZ 56MHZ 56MHZ 56MHZ 3 pu OUT2 3U55_ 4 CPUC BCLKO OUT1 3U55_3 OUT 73U66_2 N 3U66_5 BY_PGOOD 25 CK498_UTT_PMRGD_N 2t le gt R532 lt CH 503 PWRGD OU sane sac CAD NOTE 33 TRACE LENGHTS MUST B cn X OU LENGTH e CPUO BCLK 1 4 d CE lt CPUB_BCLK 48MHZ USB ARS CH3_CLK48 4406 48MHZ MCH_CLK66 UCH_CLIOK SINE E 1 p EN C _2ICH3_CLK66 CLK sane 17B4 1994 2484 71A1 7 1784 1994 7181 72AE 2 INTEL CORPORATION NUMBER PAG 5
99. 192 Deom lt 182 gt c 0 14 gt Trou 18 scu E 5500 gaat 14 y agor lt 182 Derom seror lt 182 gt grou lt 182 gt lt 18 y zron lt 18 CD lt 18 CDon qat cad H ESOT lt 18 gt C m usuu 18 82 POU y oroo lt 18 gt qsqa Jeda H ESOT usuu lt 18 gt 25 s usuu lt 192 GED C Tsou lt 192 SOU Heit a ocon lt 192 gece a 187 E gt rora masa usuu lt 18 sor Heit gece USOT usuu lt 18 182 y usuu lt 18 gt escu uauu g zgo aoar lt 18 Deso pad usuu lt 18 EIOU Heit gecon lt 18 gt sor dst y Bose H ESOT usuu lt 18 gt gou a lt 18 5 na g zoor lt 18 E 187 y
100. 2 0931 r6 EGOU HHUU 55200 O20n GE root HHUU 200 DIN GGOU HHUU TIT SS 0d OOOn STsou HHUU 1 lt St gt soad 555 9500 HAUT OSO 4 598 2500 HHUU 025200 55 HHUU 78 lt 85 gt 00 55 gr 5GOU HHUU 6290 221 2500 lt 4 gt 5 4 SON 09 0d ON 8e 99 HHUU 929 55 CODU HHUU BIT 29200 22n J 1 9 gt 04 ur uum LT SIGOU HHUU 227 1 lt 91 gt 590 T 003 VS INNOO D Gr Ai ec 98110 UREF DDR DIMM REV 24 NUMBER PAGE DOCUMENT 85226 LER N CHAN ER INTEL CORPORAT 2000 MW CHAN T nae east ORAT TON ana 1484 CORI N
101. 2975992 suce FEOU HSUU 2786 FE OU BON HU nn sue GEOU g3 SE od lt 5 gt 72 FH Le ren svee PSOU lt gt SOH lt BR Le soez dEOU Spi lt 9E gt OH 4 lt TT gt UL Le ren svez LEOU HHUU lt 28 gt 04 ZT H frot tose svee svee H HEOU HHUU lt 8E gt 00 ON 5EOU HHUU lt 6E gt C KTS 555 HHUU G EISOU HHUU lt 1 50 GO HHUU umi HHUU lt gt OH GES HHHUU e 1282 svee trou HSUU SGoe vg gaqt ue soez H erot HHUU 89 lt tr gt 0 HN JM HHUU rr suse svee HHUU lt Et gt 00 5337 ga GSOU 298 lt G gt SOH O20n 27 proa EST lt gt OH Ooon rg Grou HHUU lt Sr gt od 0931 96 Grou HHUU 9200 2 HHUU 1 lt 2 gt 90 0221 SE 1590 HHUU FI SOQ DON TBE grou 1 lt B gt OH OOOn H HHUU 0921 HHUU lt S gt og 0931 96 1500 HHUU lt 15 gt 04 0221 24 9590 8 9 SO0d j Ooon HHUU S81 lt
102. 2X17HDR5 TH 732440 WIESON 1 J34 2120 888 001 FOXCONN 1 J16 2X20HDR20 TH 201418 ELECTRONICS HL09207 D2 040 INC TYCO 1 J50 a 2 201082 ELECTRONICS 650090 6 CORPORATION 1 J36 2X5HDR_TH 102283 005 TYCO 146443 5 TYCO 2 J37 J38 7SCSIRA_TH 717126 ELECTRONICS 787190 7 CORPORATION IC VLSI VIDEO M69000 BG ASILIANT U54 256 TECHNOLOGIES M69000 FAIRCHILD 1 0113 74ACT04_SOIC 100604 SEMICONDUCTOR 74ACTO4SCX 183 VCC VSA CORP 74AHC74 SOIC 100713 TEXAS 0126 184 VCC VSA INSTRUMENT SNIAAHCTABDR 74CBT3306 SSOP 4 U121 U122 U123 U124 SN74CBTD3306 IC LOGDIG 1 U58 COMP SOP SN74HC682D SN74HC682DWR WIMAGNITU gt 74HCT125 SOIC 100624 PHILIPS U68 181 VCC VA COMPONENTS TAHCTTASDET Inte E7501 Scalable Performance Board Development Kit User s Manual 71 of Materials Table 35 Bill of Materials Sheet 2 of 17 Intel Quantity Reference Description Description Manufacturer Manufacturer P N IC LOG MULTIPLEX SOT 7 1 U125 pid D PHILLIPS 74HCT4052D IC LOG 1 U57 GATES SOIC 74LVCOOA N PHILLIPS 74LVCOOAD T AND 74LVCOBAD SOIC PHILIPS 100608 361 COMPONENTS OU 74LVC14 SOIC 676292 PHILIPS 1 U72 RES 74LVC14AD T IC ASIC CORDOVA A0 416 IC VLSSCSLAIC7902 BG em 456 AT93C46A_66_SOIC 1 U101 ATMEL AT93C46
103. 4 u 65580 1582 rO WI m 4n Q HE E Sb ANT ANT T YI e u n m TE mama al al B989 2580 lass 1 n zaze eave NE 2785 2 alla S T 0 aose eave zoez gt eave gave z ez suse EEz eave gos eaez gave eaez suse eaez eave euse gave EEE euse eaez gave EDEE gave EEE suse gave gave EEE euse gave EEE gave EEE eaez gave gave eaez vare eaez vare EDEE vaez vare vaez vare vaez vare voez vave vare vaez v ve v ve Suse vare EE v ve 112 vare vaez v ve vose vare vaez
104. 46 gt PBREQK lt A gt PSK N D lt 45 gt D lt 44 gt PBPRR54 ACL P54H2_2_PB_PRR54 qaspa l D lt 43 gt PBPAR ABY P54H2_2_PB_PRR D lt 42 gt PBSTOP AAS P64He_e_PB_STOP_N 38C7 39C7 40C7 4185 0441 PBPERR PAY P54H2_2_PB_PERR_N Ea O ES D lt 40 gt PBSERR Xk ORA Pb4H2 2 PB SERR N aec 39C3 4ec 4188 D 39 PBIRDY ARS P64He_e_PB_IRDY_N aec 39C3 40C3 4188 D lt 38 gt PBTRDYx P64He_e_PB_TRDY_N aec 39C7 40C7 4185 ON Q LY D lt 37 gt PBF RAME gt ABS P64H2_2_PB_FRAME_N shee doc yates 04365 PBDEUSELx ACB P64H2_2_PB_DEUSEL_N cope EH 72355 9 JP33 PROTOCOL MAX FREQ D lt 34 gt 7 gt Aca P64H2_2_PB_CBE7_N O NO lt 33 gt PBC BEx lt 6 gt 4882 P54H2_2_PB_CBE5_N A OE JUMPER JUMPER PCI X D lt 32 gt 5 Y2 P64He_e_PB_CBES_N 39A7 4101 E D 31 4 7352 P54H2_2_PB_CBE4_N sept PA PCI 66MHZ D 30 PBC BEx lt PSBD1 1 4 2_2_ _ _ 0 1 JUMPER JUMPER D lt 29 gt 2 ADS P54H2_2_PB_CBE2_N D lt 28 gt 1 2_PB_CBE1_N JUMPER Jumper Shine D lt 27 gt 995 PB4H2_2_PB_CBE _N MERE o lt 25 gt 0405 PBPCLKI 08 2_2_ _
105. 4788 4287 3DY ver 7 4708 4287 H3_DEUSEL_N 4784 4287 C HH3_PLOCIK BID KEN aD Ol J 4287 4782 4887 gt CCXXUXC A a 4257 7 4784 4287 a JANN B54 BSS B56 BST I ADA 1 555 SU 9 53 3 TT aue armo 9 CSI jJ 5 B61 CAPS NEAR CONNECTOR ji cta 862 9 7 2 INTEL CORPORATION NUMBER PAG 5808 CHANDLER B 47 CHAND 85226 UGR_HSYNC NI BARA 50 O U ZB 48 5 4884 UGA_YSYNC 4 5 4864 0 AX D VUGA_RED OU Dy sees on CRS ARA G T0 UTO1A1 C0 V V V V V V V V V 4865 4883 E e d A 400808000080 0 CH3_PIRQA_N Ot J 4885 12 NIA X 2 NN UGA_HSYNC UGA_YSYNC UGA_RED UGA_GREE UGA_ BLU UIDEO_RSET gt UGA_DDCCLK v 48D1 4864 XO Y 48D1 4864 48C1 4883 48C1 4883 48C1 4883 4864 X 4864 ae A wees ct TS YGA RED L 7 29 2 Je T2 cms YGA_GREEN Z
106. 48 MHz 3V66 66 MHz REFO 4 318 MHz USB 48 MHz APIC 33 MHz 3 3 9 Power Supply Requirements The Intel E7501 Scalable Performance Board uses a WTX power supply The power supply and power cord are included in the development kit 3 4 Battery Requirements A type 2032 3V lithium coin cell battery is included on the evaluation board 38 Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel Hardware Reference Hardware Reference 4 This section provides reference information on the hardware including locations of evaluation board components connector pinout information and jumper settings Figure 7 Board Layout Diagram 27 J1 U66 intel 29 mm JP24 wea cg 25 J17 42 J7 J3 99 45 JP26 J15 ma J71 J16 JP7 JP39 E 44 428 951 453 422426 e 557 emen 14101 4102 9627 03 Inte E7501 Scalable Performance Board Development Kit User s Manual 39 Hardware Reference 4 1 Chipset Components Table 5 lists the chipset and other major components on the evaluation board Table 5 Chipset and Major Board Components Component Designator Component Description U66 Intel RGE7501MC Memory Controller Hub MCH U14 U15 Intel 82870P2 PCI PCI X 64 bit Hu
107. 5 88 CHANDLER B 73 CHRND 85226
108. 88 M CHANDLER B 54 CHAND 48B8 47C7 BIOS WRITE PROTEC ENAB WRITE ENABLE lt UCC Ns Ss NIC TSOP ON 1 3 4 5 6 13 14 10n3 42C3 aca eca S 30 42c3 42c3 PB AA RAKAN AKA KAKAK AAKA KAN 7 41C5 57557575757 INTEL CORPORATION NUMBER PAG 5 88 CHANDLER B 55 CHAND Rs 85226 POPULATE CONNEC 8 CB 4888 4283 8 8 8 8 et Of 9 JEN1 GP4 1 ls G AI NS NT NE NC NE FDC_PP DDRC GP43 2 aaa MS JIRZINIT SLCTTN 2 0001 4010 18 DARA 203 504 RXZ IRQS N FAN TACHZ _ OCK SMC_SYS PT PC_SMI_N STOCLKRUN lt BDATA lt BCLK MSDATA MSCLK 1CH3_RCTN_N
109. Board Development Kit User s Manual intel About This Manual 1 1 1 Inte E7501 Scalable Performance Board Development Kit User s Manual This manual tells you how to set up and use the evaluation board and other components included in your Intel E7501 Scalable Performance Board Development Kit Content Overview Chapter 1 About This Manual This chapter contains a description of conventions used in this manual and instructions for obtaining literature and contacting customer support Chapter 2 Getting Started Provides complete instructions on how to configure the evaluation board and processor assembly by setting jumpers connecting peripherals providing power and configuring the BIOS Chapter 3 Theory of Operation This chapter provides information on the system design Chapter 4 Hardware Reference This chapter provides a description of jumper settings and functions and pinout information for each connector Chapter 5 BIOS Overview This chapter describes how to configure the BIOS for your system configuration A summary of all BIOS menu options is provided Chapter 6 P64H2 Riser Card This chapter provides installation instructions for the P64H2 Riser Card an optional item which may be included in this development kit Appendix A Bill of Materials This appendix contains the bill of materials for the evaluation board Appendix B Schematics This appendix contains s
110. C21 SCDAP lt 7 gt SCDAM lt 7 gt D21 LUSCDOM ares ends LUSCDBP 12 SCDBP 12 SCDBM lt 12 gt PS LUSCDBMI12 LUSCDAPG 821 SCDOP 65 SCDAM lt 6 gt 821 LUSCDRMO eek LUSCUBP11 D6 ISCDBP lt 1 1 gt SCDBM 11 CB LUSCDBMII LUSCDAPS C20 SCDAR lt 5 gt SCDAM lt 5 gt 220 LUSCDAMS e LUSCUBP1 SCDBP 10 SCHBM lt 10 gt AG LUSCDBMIO E LUSCDAP4 SCDAP lt 4 4 B20 LYSCDAM4 LUSCDBPS 05 SCDBP 9 SCDBM 9 LUSCDBMS ejas esca LUSCDAP3 C19 SCDOP 3 5SCHRM lt 3 gt LUSCDAM3 LUSCDBP8 BS SCDBP 8 SCDBM 8 AS LUSCDBMB 2 813 SCDOP 2 819 LUSCDAM2 ud 7 G1 SCDBP 7 SCDBM lt 7 gt G2 LUSCDBM new LUSCDAP 1 C18 SCDOP 1 SCDAM lt 1 gt DIG LUSCDF11 PEON LUSCDBPO SCDBP 65 SCDBM 6 G4 LUSCDBMO po LUSCDRP 818 SCDOP 0 SCDAM lt gt BIB _ LVUSCDR1 LUSCDBPS 1 SCDBP 5 SCDBM 5 2 LUSCDBMO ey LUSCDBP4 3 SCDBP lt 4 gt SCDBM lt 4 gt 4 LUSCDBMA LUSCDAPHP 817 SCDAPHP H SCDAPH Bi LUSCDRPHI1 m LUSCDBP3 J1 SCDBP 3 SCDBM 3 LVSCDBM3 LUSCDAPLP SCDAPLP f SCDAP B22 LUSCDAPLM LUSCDBP2 J3 SCDBP 2 SCDBM 2 14 LUSCDBM2 LUATNAP C22 ATNA 022 fae 6564 LYSCDBP1 SCDBP lt 1 gt SCDBM 1 5 ejes esci LUBSYAP A23 BSYAP BSYA LUB
111. CAPS CLOSE TO FMPTY C63 PINS 804 AAS ADL e 33 UF ESSOR 2523 REV 0 5 SKT INTEL CORPORATION DOCUMENT NUMBER PRGE REU 2 7343 117 XEON 604 Ja 604 GND lt 1625 Er UCC lt 152 gt UCC lt 81 gt GND lt 151 gt conceo 1109 1 HS H2 UCC 1861 gt 23 e GND lt 15 gt 79 EE H3 n UCC lt 16 gt lt 79 gt o 5 i 8 ULL GND lt 159 gt 78 vem n n n n ES H24 ucc lt 159 IS NE1617A GND lt 158 gt GND lt 77 gt e H29 n UCC lt 158 gt m GND lt 157 gt GND lt 76 gt lt t 5 27 2 c UCC 157 lt 75 gt Z GND lt 156 GND lt 75 gt e X H25 M is Na G5 UCC 156 GND lt 155 GND lt 74 gt 1 UCC lt 155 gt eS e GND lt 154 gt 9 et TENE G3 305 7d e GND lt 153 gt GND lt 72 gt o0 3 Gag UCC lt 153 gt 0759 GND lt 152 gt 7 gt e Loin 25277 UCC 152 7 gt L GND lt 151 gt GND lt 70 Se e 4 GND 158 G3 lt gt GND 149 68 ed oe E UCC 149 C 6 FY
112. EOM MCR03EZ J 106 CORPORATION 2 R522 R525 RESN_603 13K ROM MCR03EZ F 1302 4 R83 R84 R93 R94 RESN_ 603 150 CORP MICS CR10 1500F K ROHM 1 R423 RESN_603 17 4K SEHR MCR03EZ F 1742 RES D 0603 18 20 1 R374 AVX CR10 18R2F K 6 R452 R693 R694 R936 R948 R1047 RESN_603 1K owe MCR03EZ F 1001 R693 R694 R936 R948 B CORPORATION Inte E7501 Scalable Performance Board Development Kit User s Manual 81 of Materials Table 35 Bill of Materials Sheet 12 of 17 Quantity Reference Description Description Manufacturer Manufacturer P N R9 R12 R16 R41 R42 R82 R116 R1 49 R150 R182 R183 R187 R188 R214 R217 R220 R221 R222 R223 R230 R231 R234 R235 R237 R238 R239 R242 R244 R245 R246 R247 R274 7 R276 R280 R281 R379 R380 R383 RESN_603 1K CR06J102TR R466 R467 R483 R488 R491 R497 R520 R532 R559 R562 R649 R650 R652 R659 R662 R688 R689 R700 R709 R773 R774 R832 R835 R900 R908 R909 R910 R937 R938 R960 R1019 R1037 R1040 R13 R14 R15 R17 R18 R19 R20 R2 1 0 R32 R38 R39 R40 R43 R44 R181 RESN_603 1K R184 R207 R252 R253 R677 R921 R922 3 R429 R455 R813 RESN_603 1M ROHM MCR03EZ J 105 9455 CORPORATION 4 R398 R399 R400 R401 RESN_603 2 2K BOHM MCR03EZ J 222 R399 R400 _603 2 CORPORATION ROHM 1 R658 RESN_603 2 49K MCR03EZ F 2491 2 R560 R678 RESN_603 2 7K OM MCRO3EZ J 272 _603 2 CORPORATION R70 R71 R72 R73 R74 R75
113. I O Controller Hub ICH3 S Datasheet 290733 Intel E7501 Chipset Memory Controller Hub MCH Specification Update 251928 Intel 82870P2 PCI PCI X 64 bit Hub 2 P64H2 Specification Update 290735 Intel 82801CA Controller Hub ICH3 S Specification Update 290739 Intel 82802AB 82802AC Firmware Hub 290658 Intel 82802 Firmware Hub Random Number Generator 298029 Intel Architecture Software Developer s Manual Volume 1 Basic Architecture 243190 Intel Architecture Software Developer s Manual Volume 2 Instruction Set Reference Manual 243191 Intel Architecture Software Developer s Manual Volume 3 System Programming Guide 243192 Intel Pentium 4 and Xeon Processor Optimization 248966 Intel Applied Computing System Firmware Library User s Guide 273261 Intel Applied Computing System Firmware Library Reference Manual 273260 Intel Xeon Processor with 533 MHz System Bus at 2 0 GHz to 2 8 GHz Datasheet 252135 Intel E7500 E7501 E7505 Chipset Thermal Design Guide 298647 Inte E7501 Scalable Performance Board Development Kit User s Manual 13 Getting Started ntel Getting Started 2 2 1 Note 2 2 This chapter identifies the Intel E7501 Scalable Performance Board Development Kit s key components features and specifications It also tells you how to set up the board for operation Overview The development kit contains a baseboard with two Intel Xeon Processors with 512 Kbyte L2 cache two Low Volt
114. J 100 i CORPORATION RES 47 OHM 1 16W 5 0 R841 R843 0603 SMD DIGI KEY RR08Q47DCT ND 0 R2006 R2008 RESN_603 33 2 1 603 ROHM MCRO3EZ F 33R2 32 POSITION PLCC 1 XU69 SOCKET AMP 822472 3 CONN HDR 2 X 1 J13 13 PLG VT 2MM SMT KP BERG 61698 302TR 26 IC EEPROM SOIC 2 000 1 U64 MHZ 512X8 ATMEL AT93C66 10SC 2 7 2 No Ref Des s Solder down Anchor s CONN MISC 2 FOXCONN HB96030 K for Location U66 PHEADER ANCHOR ELECTRONICS INC Inte E7501 Scalable Performance Board Development Kit User s Manual 87 Schematics Schematics 88 Schematics are provided for the following items listed below Schematics are available from the Intel Developer s web site at http developer intel com design intarch System Block Diagram Processor Connector 0 Processor Connector 1 Processor Decoupling ITP VREF MCH System Bus MCH HUB I F MCH Power Ground DDR A Series Resistors DDR A DIMMs DDR A Term DDR B Series Resistors DDR B DIMMs DDR B Term P64H2 1 P64H2 2 P64H2 1 PCI Pullups P64H2 2 PCI Pullups PCI X Slots hot plug logic PCI X Slots power control Slots A D hot plug logic PCI X slots power control Slots A D hot plug bus switches PCI X slots 1 2 A 82808AA PCI X Slot D ICH3 ICH3 USB IDE connectors 32 bit PCI slot debug Video Power connectors VID VRD control logic Inte E7501 Scalable Performance Board De vel
115. Jumper No Jumper Unsupported No Jumper No Jumper 133 MHz Inte E7501 Scalable Performance Board Development Kit User s Manual 69 P64H2 Riser Card ntel Table 34 Channel Jumper Settings 42 43 JP5 Frequency No Jumper Default 100 MHz Jumper 133 MHz Note two cards are plugged in to slots J2 and 13 BIOS will default run the slots at 100 MHz 6 3 2 Hot Plug and Bootable Devices Hot plug and bootable devices are not supported on the P64H2 Riser Card 70 Inte E7501 Scalable Performance Board De velopment Kit User s Manual intel Bill of Materials Bill of Materials A This appendix includes the latest bill of materials as of this printing To obtain the latest version of the bill of materials go to http developer intel com design intarch Table 35 Bill of Materials Sheet 1 of 17 Quantity Reference Description Description Manufacturer Manufacturer P N J4 J6 J8 J14 J15 J19 J22 J26 J28 J P1 JP2 FOXCONN 08 JP7 JP26 JP29 JP31 JP33 JP34 1 102276 001 ELECTRONICS BIG JP42 JP3 JP4 JP24 JP25 JP28 JP32 JP3 INCO 11 2 2 1X3HDR_TH 102276 003 ELECTRONICS 146225 3 1X3HDR_TH1MT 201581 WIESON 3 J51 J52 J53 2366 888 001 TYCO 1 J27 1X4HDR_TH 201558 001 ELECTRONICS 640456 4 CORPORATION 2X15HDR 2MT 201418 FOXCONN 1 J43 030 ELECTRONICS HL17156
116. Quantity Reference Description Description Manufacturer Manufacturer P N 4 R101 R103 R108 R113 RESN_ 603 499 CORP IS CR10 4990F K R270 R275 R965 R966 R967 R968 ROHM Le R969 R970 R971 R972 R973 R974 RESN_603 5 6K CORPORATION MCRO3EZ J 562 R7 R22 R23 R24 R25 R26 R27 R29 R35 R46 R48 R49 R52 R53 R77 30 R78 R79 R80 R81 R248 R249 603 51 oo CR10 510J K R250 R251 R1012 R1013 R1023 R1024 R1027 R1028 R1090 ROHM 1 R473 RESN_ 603 510 MCR03EZ J 511 4 R8 R10 R261 R510 603 56 CORP CS CR10 560J K ROHM 1 R529 RESN_603 6 04K MCRO3EZ F 6041 PANASONIC 2 R523 R526 RESN_603 6 98K fee ERJ3EKF6981A 0 R396 603 68 2 R11 R939 RESN_ 603 680 AV XCERAMICS CR10 681J K CORP 2 R392 R395 RESN_603 68K PONM MCR03EZ J 683 CORPORATION 4 R86 R461 R462 R463 RESN_ 603 75 CORP CS CR10 75ROF K 0 R84 RESN_603 75 AVXCERAMICS CR10 75ROF K CORP ROHM 1 R477 RESN_603 75K u MCR03EZ J 753 2 R208 R258 RESN_603 78 7 AVX CR10 61R9F K ROHM 1 R424 RESN_603 8 06K MCRO3EZ F 8061 KOA SPEER RK73H1JTDD8201 4 R932 R933 R978 R1053 RESN_603 8 2K E R128 R129 R133 R137 138 R142 R146 R152 R154 R160 R165 R167 R169 R171 R173 R178 R189 R190 R197 R200 R201 R205 R206 R211 R218 R219 R225 R227 R228 53 R233 R236 R241 R243 R262 R263 RESN_603 8 2K OU RON MCR03EZ J 822 R264 R265 R359 R360 R362 R565 R568 R576 R578 R798 R977 R1005 R1006 R1042 R1043 R3079 R3148 R3799 R130 R131 R132 R139 R140 R141 0 R153 R155 R166 R168 R170 R172
117. RP16 6 RP167 RP168 RP169 RP170 RP17 1 RP172 RP173 RP174 RP175 RP17 6 RP177 RP178 RP179 RP180 RP18 1 RP182 RP183 RP184 RP185 RP18 6 RP198 RP199 RP200 RP201 RP20 2 RP203 SCHOTTKY_SM 1 CR74 UNKNOWN ONSEMI MBR0530IT1 CHALLENGE 1 SP1 SPKR_TH 201826 001 ELECTRONICS DBX 05A SWSPST PB SM SM 3 8 S9 SW1 672681 002 E SWITCH TL3304AF160QJ 2 RT1 RT2 POLYSWITCH SMT 2 600A LITTELFUSEINC 1812L260MR THERMISTOR_1812 RAYCHEM 1 Gis 657448 003 CORPORATION MINISMDC110 2 SEMTECH 2 U70 U71 TLV431A_SM 704239 001 CORPORTION SC431LC5SK 1TR TYCO 2 J17 J18 ELECTRONICS 1489691 1 CORPORATION 1 Y1 XTAL4P_SM 619601 001 RALTRON 619601 001 RES 2 R209 R259 0 0603 332 0000 1 00 AVX CR10 3320F K 926 1 16W 1 R356 RESN_603 78 7 KOA 86 E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 17 of 17 Bill of Materials Quantity Reference Description Description Manufacturer Manufacturer P N Q24 Q26 Q28 Q29 Q61 Q62 Q63 Q MOSFETN_3PIN_TH 8 64 UNKNOWN VISHAY SUP85N03 04P 4 R61 R64 R66 R68 RESN_603 84 5 AVX CR10 84R5F K 6 R87 R134 R135 R136 R156 R157 RESN_603 39 2 Corp CERAMICS CR10 39R2F CONN MISC DDR 184 4 J1 J2 J7 J9 P SOCKET25DEG 0628 MOLEX 87623 0101 1 XU8 SOCKET 44PIN PLCC AMP 822275 1 1 R358 RESN 603 825 1 603 AV XCERAMICS CR10 8250F K CORP 0 R115 R120 R524 R527 RESN_603 10 ROHM MCR03EZ
118. Thermal Management The objective of thermal management is to ensure that the temperature of each component is maintained within specified functional limits The functional temperature limit is the range within which the electrical circuits can be expected to meet their specified performance requirements Operation outside the functional limit can degrade system performance and cause reliability problems The development kit is shipped with fansink thermal solutions to be installed on the processors a heatsink to be installed on the MCH and heat spreaders installed on the P64H2s This thermal solution has been tested in an open air environment at room temperature and is sufficient for evaluation purposes The designer must ensure that adequate thermal management is provided for any customer derived designs System Features The Intel E7501 Scalable Performance Board Development Kit is designed to support the Intel Xeon processor with 512 Kbyte L2 cache and the Low Voltage Intel Xeon processor The architecture of the chipset provides the performance and feature set required for dual processor based servers in the entry level and mid range front end and general purpose server market segments A new chipset component interconnect the Hub Interface 2 0 HI 2 0 is designed into the E7501 chipset to provide more efficient communication between chipset components for high speed I O Each HI 2 0 provides up to 1 066 Gbytes s bandwidth for high spe
119. U m U AGB N hc Wes U UW 0 A gt lt NI gt 4 AFS 16 9 UWA UB U1 gt lt AK2 gt lt UN VW DATA GROUP U UT AKS gt H gt lt DDDxUuUuUuUOoOuOU 2000 MW 166 E 7 1 FSB_HREQ lt 4 gt _N C 486 686 EQx 2 2 FQx lt 1 ani 1 EQx 0 AB2 TRDY TRUY_N TS aea na CPUUCC LOCK_N HITMx 45 asa scs T HI TX 991 IIN sos cns 1416W 2 43 FF 1 gt 1 49 9 EF AF 4 2557 1 CUREF 6 EF lt 2 gt EF 1 gt 8 EF lt gt CS MCH_GTL_URE N Dx lt 63 gt 18 63 BT ite eno Dk lt 62 gt KRS 62 DK lt 61 gt KIS HD lt 63 gt T Dx 60 KIS Dx 59 PKU 58 I Dx lt 58 gt 58 HD lt 57 gt 57 5 Dx lt 56 gt 56 5 55 gt 55 lt 54 N3 54 x Dx 53 S3 Dx lt 52 gt L2 52 Dx lt 51 gt PH2 51 T Dx 50 58
120. a OU HHUU 22 gt 09 D 7 HHUU ANG THO IISOU lt 11 50 ETN HSUU eT UN TOUHWO set GcOU HHUU 52200 amp G gadu tori sere 9290 HHUU 92 gt 04 lt T gt B eG vort suse Save 2200 HHUU Qe 1 lt 22 gt 90 ZUG ON ECOU HHUU IKE gt SOQ HNUU HHUU lt T gt Ez TON HSUU e282 sasa 5cOU HHUU 227 lt 6c gt 0d lt gt CUW aaqa varieoss svez sare UEOU HHUU 26200 EUH HHUU ravi suse svee save LEOU HHUU EET 200 FON clsou HHUU lt 2 656 ZE GEN HHUU 5 gt 0 TON port rise PEOU HHUU E Od ZON HHUU seee sare HHUU 26 1 lt 6 gt 290 Sew 2 ron save GEOU HHUU 29 lt SE gt C Je H ravivoss svez sasa FEOU HHUU QI O TEN vart evez Seve SEOU HHUU oft 9 4 lt TT gt B
121. a pre programmed set of configuration data to CMOS Shortcuts In addition to using the Exit Setup screen to choose your method of leaving the setup utility you can also use function keys noted above from any point inside the setup utility Updating the BIOS AMI provides an MS DOS utility that may be used to replace the BIOS on your E7501 board with a newer version The utility may be invoked via MS DOS command line with one parameter being the rom file that represents the new BIOS image The rom file may be located in any location in the system accessible from MS DOS This utility along with instructions is available for download from AMT s website http www ami com Although the name of the actual executable file changes from release to release this tool is packaged under the name AMIFLASH Troubleshooting Error Messages In some situations you may be faced with error messages from the BIOS AMIBIOS Error Messages pdf describes some of the messages you may see This document along with others is available online from AMI s website http www ami com support doclib cfm Status Codes During the boot process the E7501 BIOS communicates its progress to the user by writing status codes to an I O port 80h These status codes may be monitored by installing a POST diagnostic card in the short debug PCI slot Documentation on the status codes that are sent to port 80h is in the file AMIBIOS codes pdf which is availabl
122. be prompted to load default CMOS data and continue or enter the setup utility Press to enter the setup utility or press F2 to load default values into CMOS and continue Inte E7501 Scalable Performance Board Development Kit User s Manual 57 BIOS Overview ntel 5 1 2 5 1 4 5 1 4 1 58 After the IDE devices are displayed the current hardware configuration is shown and the boot device is chosen Then control is handed over to the boot loader on the selected boot device BIOS Setup Configuration The E7501 BIOS provides a setup utility to customize your board At any point during the display of the first splash screen pressing the lt DEL gt key will enter BIOS setup The BIOS Setup utility has been functionally divided into five sections to categorize the setup options Main Advanced PCI PNP not discussed here Boot Security not discussed here Chipset Exit These sections can be navigated using all four arrow keys The UP and DOWN keys toggle between setup options in any given section The LEFT and RIGHT keys switch between main BIOS setup sections Each of these sections will be discussed briefly in turn Help on Options It should be noted that not all setup options are documented in this guide The setup utility in the BIOS contains brief help descriptions for almost every setup option available When any given setup option is highlighted selected by moving the c
123. can make full use of another node s file system servers hardware resources etc Qnet provides fault tolerant networking load balancing on the fly extensible architecture and transparent distributed processing Unlike some operating systems that try to squeeze monolithic designs or bulky windowing systems into embedded environments the QNX RTOS was designed to reduce the cost and component count of your products On custom Intel Architecture target systems for example you can eliminate the expense of a BIOS since QNX doesn t rely on BIOS calls QNX was also designed to keep RAM requirements to an absolute minimum For instance it supports execute in place XIP which allows applications to run directly out of ROM or flash And since its system image is actually a simple read only file system QNX allows applications to start without a separate file system manager or command interpreter Device Drivers Made Easy Across Platforms From the beginning drivers for the QNX RTOS were designed to be source code identical across CPUs and boards In fact the same binaries for a CPU can run on different boards no more BSP nightmares sorting out the complexity of custom board and processor specific code To reduce the time required to write your own device drivers QNX provides a resource manager framework and C functions that handle the default behaviors common to most devices all you need worry about are the low level details specific to yo
124. gt PBTRQ lt 5 gt 82 2 1 Sica Sb 2 AB3 PBAD lt 2 gt PBTRQ lt 4 gt 2 1 4 P 1 PBAD lt 1 gt PBTRQ lt 3 gt 1 PBAD lt gt PBIRQ lt 2 gt D3 1 IR 2 dica PBTRQ lt 1 gt 3 ZF L TROL bici PBIRQ lt gt 3 2 1 21058385 PBPLOCKx YS P64H2 PB_PLOCK_N DU Dy es sn FOR VALIDATION ONLY 2229 1228 PROTOCOL MAX FREQ 9 il No 7 No i ue JUMPER lt MHZ Pi RT NO AND LAN CONIROLLER JUMPER PIN 1 2 JUMPER PIN 2 3 INTEL CORPORATION DOCUMENT NUMBER PAGE 27 JUMPER 2 3 f 9 99 014 G1 CCSREF HIUSWING SREF HIUREF HIRCOMP N CLK200 m CK200 36 CL K200 1 ST U ps Lit 5 BPCLK100 BPCLK133 1 N CEN 3767 ec BU 214 SCLK 35c BU Jit SDTA PWROK RST IN CH3_PIRQA 4 BT INTR
125. lt 1 gt SUCC33 lt gt 006 00000 D CC 16 MS CC LIC CC CC UC C 3 1 YCCS lt o gt VCC CC TS UC C 3x65 LIC A S lt S gt UC C dcn COS gt MEC 345 CCS 1 01 260 60666 INTEL CORPORATION NUMBER PAG 5000 CHANDLER 64 CHAND 85226 SCSI CORE UCC T N 668 6408 gt XAGND 1 Cit j SI DCGND1 cu axu O SAN WA PCAYCC331 PAGUARDG PCAVCC332 PZU33 PAGUARDYU AGND lt 5 gt AGND lt 4 gt AGND lt 3 gt AGND lt 2 gt AGND lt 1 gt AGND lt gt STAGARDG SRAGARDG STRGRRDU SRAGARDU e 23 ALIC7S902_TERMPWRA IFRNMPMRB 2 AICT SH2_TERMPWRB LO 9 O lt 8 gt LO lt gt 046 LOC O lt 4 gt LO 3 LO 1 LO 0 M M M M M M M M M sa 90 2 TESTS AIC7992_TEST3 RTC792_TEST 1 AICTOB2 TEST 00000000020 7 6SC4 65C3 6583 902 9 9 7902 7902 AAA 4 7K IC AND R1011 OR LATER STEPPINGS 2 INTEL CORPORATION NUMBER PAG 5000 CHANDLER B 65 CHANDLER 85226 ES LN YCC3 OI
126. package and contains the following functionality System Bus Features Supports dual processors at 400 533 MT s System bus bandwidth of 3 2 4 3 Gbytes s Supports 36 bit system bus addressing model 12 deep in order queue two deep defer queue Memory Bus Features 144 bit wide DDR 200 266 memory interface Memory bandwidth of 3 2 4 3 Gbytes s Supports x72 ECC registered DDR 1600 2100 DIMMs using 64 Mbit 128 Mbit 256 Mbit and 512 Mbit DDR SDRAM Supports a minimum of 256 Mbytes and a maximum of 16 Gbytes of memory evaluation board contains eight slots populated in pairs the system has been validated with up to 6 Gbytes memory Supports up to 32 simultaneous open pages Features Provides 1 5 connection for ICH3 S Hub Interface 266 Mbytes s point to point connection for ICH3 S with parity protection 8 bit wide 66 MHz base clock 4X data transfer Parallel termination mode for longer trace lengths 64 bit inbound addressing 32 bit outbound addressing Provides 3 HI 2 0 connections for P64H2s Hub Interfaces C and D 1 066 Gbytes s point to point connection for I O bridges with ECC protection 16 bit wide 66 MHz base clock 8X data transfer Parallel termination mode for longer trace lengths 64 bit inbound addressing 32 bit outbound addressing Inte E7501 Scalable Performance Board Development Kit User s Manual 33 Theory of Operation
127. s Manual ntel Contents Contents 1 About This Manual 9 LL Conen lt i 9 1 2 10 149 2 asme a ean 12 1 3 1 Electronic Support Systems uuu 12 1 3 2 Additional Technical Support eene nnns 12 1 44 Product Literature RR 12 1 5 Belated DOCUMENIS ii 13 2 Getting Started asar es 14 EE 14 2 2 Evaluation Board 4 8 080 14 23 Included Hardware 15 2 4 Software Key Features 16 241 Embedded ges aa 16 2 4 2 Operating Systems 17 25 You Beglii eene ten 21 2 6 Setting up the Evaluation Board 22 27 QGConfiguring the BIOS uu unu ttr Certes Font ia 29 3 Theory of Operatio iren a eerie De P a n 30 3 1 1 RE EI 30 3 2 Thermal Management uu Lettere t bnt tn ba exe e e pede 31 33 System Feat reS 31 3 3 1 Intel Xeon Processor i 31 3 3 2 Intel
128. that do not line up and re position them d Place the plastic processor retention mechanisms atop the board lining them up above the holes astride sockets J17 and J18 Insert screws through the processor retention mechanisms into the standoffs below Figure 4 shows one completely assembled processor assembly rear and one partially assembled front e Insert remaining screws into the standoffs from the top of the board Figure 3 Mounting Hardware Installation Order Standoff Stand ol WWW Lock Washer Screw A9682 01 Inte E7501 Scalable Performance Board Development Kit User s Manual 25 Getting Started intel 7 Install fansinks You must install a fansink on each processor Remove the green cap that is covering the thermal interface material on the bottom of the fansink Place the fansink on top of the processor fitting it within the plastic processor retention mechanisms Install a metal bracket on each side of the fansink affixing the metal rim of the fansink base to the processor retention mechanism Repeat for the other fansink Connect the 3 pin fansink power connectors to connectors J52 and J53 on the evaluation board Make sure to use the proper retention clips for the Intel Xeon processors or the Low Voltage Intel Xeon processors Figure 4 Processor Assembly Components Metal Fansink Brackets Processor in Socket Processor Retention Mechanisms amtii 26
129. 0047 VAS lt 47 gt lt 1 27 DDRB_BAL_R a DDRB_DQ45 HIGH NIBBLE BR_B lt gt K256 DDRB_BR_R DDRB_DO45 AB32__ DQ_B lt 45 gt DATA GROUP 6 DDRB_DOQ44 Y28 B AA 0 00514 DOGS lt 14 gt 0055 DES R527 DDRB DQ43 AD31 lt 435 E DURB_UQ41 2833 DQ_B lt 41 gt GROUP 6 CS Bx T ry YO r E DDSE DO38 DS BS CE BK 8 DAES DDRB_CS5_N_R VTT DDR 5_ 5 EE DUTY 13K DQ_B lt 38 gt 5 lt 4 gt MPE CS4_N_ 5 1 49 9 DDRB_DQ37 AD32 DQ_B lt 37 gt DATA GROUP 5 CS lt 3 gt RE21 DDRB_CS3_N_R pr 2 5U Q_B lt 36 gt p CS Bx 2 DDRB_CS2_N_R UTT DDR 090513 1005 CS Bx 1 p 8K32 1 pru A DDRB_ 0954 FES B 4 gt CS Bk lt gt 29 NR MA 5 1 49 9 OHM al DDRB_DQ35 25 2 LOW NIBBLE R120 5 z jo DDRB DO33 RE33 DQ_B lt 33 gt GROUP 5 E eee iG M osa DDRB DO32 27 m N38 DDRB RCU EN IN 2198 2 LOODI NOPOP Ys Yes NOS DDRB_DQ31 T25 0568 0030 R28 HIGH NIBBLE _ EPPTY DDRB DQ29 PSI
130. 01 PBRH lt 5 gt PBREQk lt 4 1 PB 4 8 8 PBRD lt 49 gt 35 H2 2 1 z PBAD lt 48 gt PBREQ 2 gt 26 _ 1 PB 2 Sam c PBAD lt 47 gt PBREQx lt 1 gt 1 KEG TZ 1 2 i PBAD lt 46 gt PBREQx gt 557 Pb4H2 1 PB HEQO arose PBAD lt 45 gt e 3 0 PBAD lt 44 gt PBPRR54 PE64H2_1_PB_PARG4 PBAD lt 43 gt PBPRR AB 2 1 sur gus PBAD lt 42 gt PBSTOP Po4H2 1 PB STOP PBAD lt 41 gt PBPERR u BD enn PBAD lt 48 PBSERRx 7 SERR PBIRDYx 64 2 1 slice des esc PBAD lt 38 gt PBTRHY 2 1 PB PBAD lt 37 gt MABI PE4He_1_PB_FRAME_N M PBAD lt 36 gt PBDEUSEL SHCB__ 54H PB_UEUSEL_N PBAD lt 35 gt PBRD lt 34 gt PBC BEx lt 7 2 1 PBAD lt 33 gt PBC BEx lt 882 64 2 1 _PB_CBEG_ PBAD lt 32 gt PBC BEx lt 5 lt 2 OEE TEBAT DES E 31 gt PBC BEx lt 4 gt 7392 1 4 Sa SPAS as PBAD lt PBC BEx lt 39011 1 PBAD lt 29 gt PBC BEx lt ADS 1 2 PBAD lt 28 gt PBC BEx lt 1
131. 044 NF FAIRCHILD FDS6690S 01 02 03 04 05 06 07 08 09 01 IC DS FET 12 7 FAIRCHILD FDS7760A MH1 MH2 MH3 MH4 MH5 MH6 MH MTG_HOLE_TH 7 MH8 MH9 MH10 MH11 MTG_SPOKE_PKG IC LIN TEMP 2 U7 U11 SENSE PHILEIES NE1617A 4 041 048 066 067 NPN SOT23 108969 001 PHILIPS PMBT3904 448 66 COMPONENTS OSC CX0 4 SMD 1 U76 80 000MHZ 100PPM 3 3v NEL FREQUENCY 2920 80 000 CONTROLS CMO gt ASSY IC CHIPSETS RG N 2 U14 U15 1222 INTEL 82870P2 TYco 5 J20 J21 23 J24 J25 PCI X TH 201082 292 ELECTRONICS 145168 2 CORPORATION 1 J12 082 FOXCONN 107 3 0 5 2 POT1 POT2 UNKNOWN TYCO 1 J40 277 ELECTRONICS 84405 1 CORPORATION SEMICONDUCTOR IC DS PNP 1 Q68 DS COMPONENTS PZT751T1 XSTR SOT223 PZT751T1 ROUSSE 3 U3 U16 U17 QS3384_SOIC UNKNOWN IDT IDTQS3384Q IC FAN 80KHZ 1 U104 FAIRCHILD FAN5066 4 R736 R737 R738 R739 RESN 1206 22 VISHAY EMEA 1 R454 1206 4 02 VISHAY CRCW12064R02J N VISHAY DALE CRCW12064R7JR 0 R427 R428 RESN_1206 4 7 5 1206 6 EECTRONICS INC Ts 1 R814 2010 01 IRC LR2010 01 R010 F RES D 2512 5 00 WSL2512R005JR8 1 mOHM 5 00 1W METFLM VISHAY 6 R60 R63 R89 R96 R117 R124 R125 R127 R254 R271 R272 R277 R278 R329 R330 R336 R337 R342 R343 R433 R434 R435 R436 R458 A V X CERAMICS 34 R478 R673 R674 R675 R676 R768 FESN 603 0 CORP GJ40 000 K R770 R771 R815 R920 R929 R956 R957 R962 R963 R976 R2001 R200 2 R2003 R2005 0 R163 R
132. 06011 PC W CONVGAEDGE TH FOXCONN J29 648546 003 ELECTRONICS 1 Y2 CRYSTAL SM 630770 003 RALTRON 630770 003 XTAL HC49S 25 0000 MHZ 1 Y3 RALTRON 630770 011 SEMICONDUCTOR 4 CR4 CR7 CR26 CR79 DIODE_SM 201375 601 COMPONENTS MBRS130T3 INDUSTRIE 1 DIODE SM 201593 002 ITT SEMI 1N4148W 1 CR45 MMBD914LT1 CENTRAL 5 CR3 CR5 CR6 CR78 CR80 DIODE_SOT23 693508 SEMICONDUCTOR CMPSH 3 001 CORP SEMICONDUCTOR 2 CR46 CR47 7 27 COMPONENTS MBRD320T4 INDUSTRIESLLC Inte E7501 Scalable Performance Board Development Kit User s Manual 77 of Materials Table 35 Bill of Materials Sheet 8 of 17 In Quantity Reference Description Description Manufacturer Manufacturer P N 4 CR37 CR38 CR39 CR40 DIOSOT23C_SOT23C PHILLIPS BAT54C235 BAT54C DIOSOT23C_SOT23C PHILIPS 3 CR1 CR2 CR72 BAV70LT1 COMPONENTS BAV70 DIOSOT23S_SOT23S PHILIPS 5 CR49 CR50 CR51 CR52 CR53 545 DALLAS 6 U93 U94 U95 U96 U97 U98 MSE SEMICONDUCTOR DS2119MET amp R DSUB25TALL TH 3MT FOXCONN 1 J31 DSUB ELECTRONICS DM11356 R1 DSUB9_TH 2MT 302921 FOXCONN J35 001 ELECTRONICS DT10126 R9 ASSY IC CHIPSETS RG N 1 U66 INTEL RG82861 QC47 7064 PLCC 644134 ALTERA 1 U8 EPM7064LC44 7 TDKCORPORATION ACA3216M4 120 1 FB17 FBPAK4L_SM 657300 001 Oc AMERICA 022 023 025 027
133. 10SC 2 7 CHIA TSE 1 BH1 TERMINAL B7566BP5R ACC HOLDR THM CR2032 NDUSTRY GO LT 1 C712 CAP P 3216 2 2 KEMET T491A22M006QAS 710 711 1390 1391 1392 1393 1394 1395 1396 1397 293D475X0010A2 18 C1435 C1436 C1437 C1438 C1439 CAP P_3216 4 7 VISHAY SPRAGUE w C1440 C1566 C1600 C706 C709 C881 C1410 C1411 C1414 C1415 C1416 1419 C1421 C1422 1423 C1424 C1425 C1426 32 C1427 01428 C1429 C1430 C1431 06M016AS C1432 C1433 C1434 C1441 C1589 VEO Maie de C1601 1606 1627 C1628 C1629 C1630 C1631 C756 C757 C758 C759 C760 C761 C762 C763 C764 C765 C766 C767 27 C768 C769 C770 C771 C772 C773 6032 100 KEMET T491C107006AS C774 C775 C1567 C1568 C1569 1570 1590 1591 1592 1 776 6032 22 AVX KYOCERA TAJC226M016R 2 C656 C657 10000 4 20 KEMET T510E108M004AS 530 531 532 533 1555 155 CAPS AL P E X 180 000 8 6 1557 1558 UF 4 000V 4 20 gt PANASONIC C681 682 C686 C687 C690 C691 14 C694 C695 01400 C1401 C1402 CAP P 7343 22 0 VISHAY SPRAGUE lt C1403 C1543 C1544 4 C664 C665 C666 C667 CAP P_7343 33 0 KEMET s 0 C63 C64 CAP P_7343 33 0 KEMET 2 658 659 _7343 3300 AVXCERAMICS TAJE387M010SNJ 1442 1443 1444 1445 1446 SANYO VIDEO B C1447 C1479 C1577 COMPONENTS 72 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 3 of 17 Bill of
134. 1522 1528 1529 1597 1661 1662 1663 1664 1665 1666 1667 1668 1669 Ref Des Cont C311 C514 C542 C543 C544 C545 C546 C547 C548 C549 C550 C551 552 553 554 555 556 557 558 559 560 561 562 563 564 565 566 567 568 569 570 571 572 573 574 575 576 577 578 579 580 581 582 583 584 585 586 587 C588 CAPN_603 1UF 1243 1564 CAPN_603 22UF TDKCORPORATION OF AMERICA C1608Y5V1C224Z T009N 1377 1502 1641 1642 CAPN_603 1 0UF A V X CERAMICS CORP 0603ZG105ZT4A 619 1584 1585 603 10 X CERAMICS 06035A100JAT4A 40 437 438 439 440 441 442 443 444 635 642 648 649 650 651 1272 1273 1274 1279 1281 1282 1283 C1284 C1285 C1286 C1287 C1288 1290 1301 1302 1303 1339 1340 1449 1560 1575 1576 1602 1603 1604 1605 CAPN_603 1000PF TDKCORPORATION OF AMERICA C1608X7R1H102K T009A 10 C632 C633 C634 C639 C640 C641 1505 1559 1562 1565 603 100 MURATA ELEC NORTH AMERICA GRM39C0G101J05 0AJ C1626 CAPN_603 1500PF AVX 06033C152KAT2A Inte E7501 Scalable Performance Board Development Kit User s Manual 75 of Materials Table 35 Bill of Materials Sheet 6 of 17 Intel
135. 176 R194 RESN 603 0 AVXCERAMICS cJ10 000 K CORP 80 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Bill of Materials Table 35 Bill of Materials Sheet 11 of 17 Quantity Reference Description Description Manufacturer Manufacturer P N AV X CERAMICS 0 R961 RESN 603 0 pee CJ10 000 K KOA SPEER 3 R474 R763 R764 RESN_603 1 25 RM73B1JTDD1R0J 2 R692 R695 RES D 0603 1 05K 1 VISHAY DALE a R053F ROHM 1 R85 RESN_603 1 5K MCR03EZ J 152 3 R421 R460 R817 RESN_603 10 NORM MCR03EZ J 100 R460 CORPORATION ROHM 1 R98 RESN 603 100 CO PORATION MCR03EZ F 1000 R273 R279 R331 R338 R344 R350 15 R404 R430 R472 R651 R679 R740 RESN_603 100 2 oe CR10 101J K R759 R1020 R1036 2 R653 R801 RESN 603 100K m MCR03EZ J 104 CORPORATION 0 R930 R931 RESN 603 10K R144 R145 R199 R213 R368 R748 A V X CERAMICS 8 Ero dodi RESN 603 10K CORE CR10 1002F K 0 R123 R204 R371 R917 R1004 RESN_603 10K R57 R59 R174 R216 R353 R354 R355 R375 R378 R381 R382 R385 R386 R389 R405 R422 R431 H468 R469 R470 R482 R489 R530 R531 R534 R535 R538 R539 R569 R570 R571 R572 R574 R646 63 R714 R747 R752 R765 R766 R790 RESN_603 10K 277 CR10 103J K R792 R793 R794 R799 R800 R803 R804 R805 R934 R940 R1007 R100 8 R1009 R1010 R1021 R1022 R102 9 R1030 R1031 R1035 R1038 R1039 R2015 0 R537 R650 RESN_603 10K AV X CERAMICS GR10 103J K CORP 2 R376 R377 RESN 603 10M
136. 2 BOARD EDGE SE 2 1 UGA CONN er GPIOO 3 coms BLUE CH3 DEUSEL N UTUEO_PERR_N ICH3 SERR N UIDEO_STNDBYC UIDEO_CLK14 Y 2 Ole GND lt GND lt GND lt GND lt GND lt GND lt GND lt 1 GND lt 9 gt GND lt 8 gt GND lt r gt GNU gt GNU gt GND lt 4 gt GND lt GND lt 2 gt GND lt 1 gt GND gt N N N 244 Yrs 0 2 2 OC DOSL 48D1 48 5 2020202 48D1 4 5 OOD GND_MEM3 CONNEC C628 4 PF INTEL CORPORATION NUMBER PAG 5 88 M CHANDLER B 48 CHAND 85226 04 100 0000000000 TO lt gt SOT P lt 34 gt P lt 33 gt P lt 32 gt Pod o P lt 34 gt P lt 29 gt P lt 28 gt P lt 26 gt pio 24 gt gt 22 gt 2555555955 JNNWW UP lt 1 gt UP lt gt U1 O1 O O S OI U1 S UT S INTEL CORPORATION NUMBER PAG 5888 CHANDLER 49 CHAND 85226 4 s 6852656 aucc 111064 EQ NAB ODR
137. 2 Riser Card for your development kit you can utilize that card in this slot See Chapter 6 for additional details on the P64H2 Riser Card PCI Slot There is one 32 bit 33 MHz PCI connector on the evaluation board for debug purposes only Post Code Debugger An on board Post Code Debugger is not implemented directly on the evaluation board However post code debugging can be accomplished through the use of a port 0080H PCI card In Target Probe ITP The evaluation board contains an in target probe ITP connector for an TIP32B You must use an ITP32B which is specific to Intel Xeon n processors and Intel Pentium 4 processors Other ITPs such as the ITP32F for Intel Pentium III processors will not work Clock Generation The clock synthesizer on the baseboard generates and distributes the clocks used by the entire system System Clocks The CK408B Clock Synthesizer is the primary source of clock generation for most of the clocks on the baseboard The following clock groups are found on the Intel E7501 Scalable Performance Board Development Kit For more information on these clocks see the Intel Xeon Processor and Intel E7500 E7501 Chipset Compatible Platform Design Guide order number 251929 Inte E7501 Scalable Performance Board Development Kit User s Manual 37 Theory of Operation ntel Table 4 System Clocks Clock Name Clock Speed CPU 100 133 MHz PCI 33 MHz 48 MHz
138. 2 e 22 4 2 Dx lt 5 gt lt 22 gt DE 5 CPU1_GTL_VREF 1 e GTLREF lt 3 gt 1 ABS CPU1_BSEL 1 e ad Dx lt 49 gt 21 gt GTLREF 2 __ S 2 Dx 48 E CPU1_GTL _UREF 2 GTLREF 1 seca AAS CPU1_BSEL ED lt 195 45 015 1B CPU LINT1 NMI Y12 7295 1 LINTI 1106 u u 45 5 us wa 17 meso ICHS LINTO INTR C 44 2 552425 prere 2 16 FSB_DSTBN lt 3 gt _N E D 7 4203 1 42 QE 1O 2 14 zm ye y DSTBN1 UGGS 41 2 54 a 13 13 sspr ecz TN ICHS INIT N YS 40 eee lt 12 gt 12 21 39 7 Dx lt 39 gt lt 11 gt 11 CAPS CLOSE TO PINS 1165 ec4 38 AD13 PY 3 10 FQ WS F23 W23 bonis psrses 1 1 3 37 ABISH 7 9 FSB_RS lt 2 a gt _N Pa mM LGD lt 36 2 ARGES 7 E Ae Oe PN M VAY LA 2 FSB_DSTBP lt 3 gt _N E13 gt 34 ACL 4 2 2 8 5 51 psrBeix V 1 33 2816 gt lt ua axes 8 5 ED ICH3 CPUPWRGD BC5 4203 PWRGOOD 3 d iis FSB_CPURST_N on b rece ec4 TN gt RESET 29 1 PS necs CPUI TES
139. 208 RP211 RP212 RP28 KOA SPEER 5 RPAK4C 4R_SM 2 7K E CNK1J4TDD272J RP213 RP214 RP215 RP216 RP21 7 RP218 RP219 RP220 RP221 RP2 22 RP223 RP224 RP225 RP226 RP 227 RP228 RP229 RP230 RP231 R P232 RP233 RP234 RP235 RP236 RP237 RP238 RP239 RP240 RP24 59 1 RP242 RP243 RP244 RP245 RP2 12 2 _ PANASONIC 46 RP247 RP248 RP249 RP250 RP 9515107 Nelwo 251 RP252 RP253 RP254 RP255 R P256 RP257 RP258 RP259 RP260 RP261 RP262 RP263 RP264 RP26 5 RP266 RP267 RP268 RP269 RP2 70 RP271 KOA SPEER 3 RP207 RP209 RP210 RPAK4C 4R_SM 33 Ne CNK1J4TDD330J KOA SPEER 3 RP280 RP288 RP289 RPAK4C 4R_SM 4 7K CNK1J4TDD472J Inte E7501 Scalable Performance Board Development Kit User s Manual 85 of Materials Table 35 Bill of Materials Sheet 16 of 17 Intel Quantity Reference Description Description Manufacturer Manufacturer P N KOA SPEER 3 RP119 RP196 RP204 RPAK4C 4R_SM 5 6K ELECTRONICS CNK1J4TDD562J RES 1206 680 00 1 RP277 OHM 5 0096 1 4W RPAK KOA CNK1J4TDD681J gt 1 RP279 RPAK4C 4R_SM 75 ROHM MNR14 OABJ750 CORPORATION RP9 RP10 RP120 RP121 RP122 RP123 RP124 RP125 RP126 RP12 7 RP128 RP129 RP130 RP131 RP13 2 RP133 RP134 RP135 RP136 RP13 7 RP138 RP140 RP141 RP142 RP14 4 RP145 RP146 RP147 RP148 RP14 9 RP150 RP153 RP154 RP155 RP15 6 SPEER 71 57 RP158 RP159 RP160 RP16 RPAK4C 4R_SM 8 2K ELECTRONICS CNK1J4TDD822J RP162 RP163 RP164 RP165
140. 3 1703 1803 1903 2203 1703 1803 1903 2203 1703 1803 1903 2203 1703 1803 1903 2892 1703 1803 1903 PLAC A A 1 8 gt AVA 094 DDRA_DQS RA_DQS_R AN e IA a 20 SS V io bas 20 2 SS Q 0 d 63 2 5 2 5U 5U nx e A x A A 2 s Zm L tog S SG CK A 3 Z V QJ e tu QJ e EN L eli L SS 5 zo Z S OZS ISSOTS m Ow U 90JL0I LO a 5 d e Qu EQ 1 X S aS Pa SS CS 7 ze O aAA f SE E ur e 9 ms O X 20 5 aS SS L O AALO ak a e e e 5 e Ob os EQ g ms Se Passes d Q AR X N 2 m e EN a m 00 m L 0 Dax 20 T ND m S SD SD S
141. 38 LUSCDB CK coca cacy LUSCDAPHP 5 WY 5441739 LUSCBDAPHM USCDBPHP 5 39 LUSCDB 5 6 40 LUSCDBPO 6 40 LUSCDB ets LUSCDAPI 7 WY 5441741 LUSCHBP1 7 41 LUSCDB irit LUSCDAP2 8 42 _LUSCDAM2 LUSCDBP2 8 42 LUSCDB LUSCDAP3 9 wT 43 LUSCDAM3 LUSCDBP3 9 4 43 LUSCDB LUSCDRPA 44 LUSCDAM4 4 10 lt lt 44 LUSCDB we ers SCDRP5 11 45 LUSCDAMS LUSCUBP5 11 45 LUSCDB EE Mo 6 LUSCDAPE 12 e 46 _ LVSCDRI5 12 46 LUSCDB 6 IS Le 47 LYSCDAM LUSCDBP 7 47 LYSCDB Baci asd LUSCDAPLP 14 48 LUSCDAPLM LUSCDBPLP 14 48 LOSCDB PS 15 49 15 64 n 49 a DIFFSENSEB R 16 9 9 DIFFSENSEB R 16 50 ea 17 Os eis 0 52 9 is 3 19 53 O e LURTNAP 21 55 LUATNA LUATNBP 21 SS LUATNB esca O 21 402 25 02 OEE e jm LUBSYAP 23 57 UBSYBP 23 er LVBSYB eani esca _UACKAP 24 58 LUACKA UACKBP 24 v 58 LUACKB E secs LURSTRP 25
142. 5 DDRBE DQSI0 29 ITQS_B lt 1 gt O CMDCLK J28DDRB CMDCLKO no e e r 7521 49 9 OHM DDRB_DQS1 31 1006 41 Bax AJ28DDRB_CMDCLR _N 3 DDRB_DG11 P25 lt 115 E is DDRB DO1O 130 8118 LON NIBBLE la DDRB DOS K32 DQ B 9 GROUP 2 ACH 733 8 n M 880 520 0 68 006 23 T a HIGH NIBBLE Su 623 SRB Daa Nee 002 N33 VREF 9 DQ_B lt 4 gt DDRUREF B 3 CIN foes secr DDRB DQSS 31 DQS B 9 DDRUREF B 2 926 ER 0 350 5 DDRUREF B 1 AUC 2 2 2 i n DO B lt 3 gt NIBBLE 9 DDRYREF B lt 0 gt AC25 cu 1 DD K30 DQ B 1 DATA GROUP 1 1UF aS f 4 E CB_B lt gt DDRB CB5 _ 6 gt HIGH NIBBLE CBS 427 B 5 CHECK BITS RSO DDRB_CB4 J28 B 4 RESERUED3 E30 1 2 e i DD 0951 duo 284 7 5 g EMPTY DD 0058 29 5_ gt DDRB_CB3 BASS RESERYUP DS M25 1 Rol 2 J DDRB_CB2 CB LOW NIBBLE DEG me CB_B lt 1 gt CHECK BITS CB_B lt gt 4 OF 7 N PORATION DOCUMENT NUMBER PAGE u INTEL CORPO IO 0 5 NO STUFF FOR E7S 1 5008 CHANDLER BLUD CHANDLER A 85226 U66 5 1 D 300 D lt
143. 5200 Nn 2590 HHUU 1 lt 2 gt GOH 4 55 9 H USOU HHUU 09 9d 55 8e 1900 HHUU 929 20n CODU HHUU BIT 29200 22n 7 ur uu LT 91594 2 1 lt 9T gt sod 024 5 ae E A save zane 1908 1099 1720 sect sena TN gt DDR DIMM PCA OSES M l B MM REV NUMBER PAGE DOCUMENT 22 Bl LER 85226 N INTEL CORPORATION 2000 MW CHAN CHAN ER T 0 gos eave 8212 eave gg suse eave z zz eave gave eazz 2992 gave guse eazz suse eave euse gave Egg euse use gave eui gave Egg gave Egg Egg euse gave use gave E gg aos Egg use gave aos ose vare E gg vare vare
144. 7501 Scalable Performance Board Development Kit User s Manual 59 BIOS Overview ntel 5 1 5 2 5 1 6 5 1 7 5 1 7 1 5 1 7 2 60 Onboard Device Configuration The Advanced Setup section allows limited configuration of non chipset devices The onboard Gigabit Ethernet controller and onboard SCSI controller may be enabled or disabled here If either device is not used it is recommended that they be disabled to Improve boot time Boot Setup The Boot Setup section contains options that controls boot devices boot order and other aspects of the boot process Most of these options will not be documented here Quick Boot The Quick Boot option determines whether or not a complete memory test is performed by the BIOS during boot Enabling this option will speed up boot time of large memory configurations greatly It is disabled by default Chipset Setup This setup section contains options that allow the user to configure various parameters that are specific to the chipset silicon present on the board The following silicon is configurable through this setup section E7501 P64H2 ICH3 not discussed here E7501 Setup Memory Remapping A configuration option is available to toggle the state of memory remapping support in the chipset Memory remapping allows physical memory behind legacy ROM and PCI memory to be utilized Enabling this feature allows that memory to be accessed at a region above the top of physic
145. 91 9021 yest gg EST 291 gg gg 291 291 vede vadat ZT vost bua 21 7291 ZT vast vaat 521 7291 9021 291 sast 291 snzT saat gt saat sast rast Suae saat 5021 9 ge saat szT 9291 ge saat szT suae saat sast 091 suae 5021 ge saat szT SnzT ge edat SnzT 3997 snzT uae saat bua saat snzT 9991 9021 9021 bua saat bua 9021 9991 sogg 9891 9021 9891 9891 9021 9891 9891 sogg s041 9891 9021 9891 9021 9891
146. B THRM DC SU T e ee ee F26 CPU DUT THERMTRIP DREN ene IND 2 caps CLOSE TO PINS 11 B_B 2 F SB_ IT_N ana 505 1195 CC HE AAS 16 C666 C51 4 TUH cle sw 20 FSB_BNR_N CBT gt e sos 1 UCCIOPLL s 5 ec Jo ucciopPP x 4 TUH IND 18 F SB_DBSY_ CED ue id VID UCE topje e 18 FSB_DRDY 7 DRDYx NE RTN i106 ET m PDI we 20 280 1 OF 5 BY REV 0 5 skT INTEL CORPORATION 5000 CHANDLER BLVD CHANDLER A 85226 GND lt 1625 GND lt 81 gt GND lt 8 gt GND lt 79 gt GND lt 78 gt GND lt 77 gt GND lt 76 gt GND GND GND GND GND lt 71 gt GND lt 70 gt GND lt 69 gt GND lt 68 gt GND lt 67 gt GND lt 55 gt GND lt 55 gt GND lt 54 gt GND lt 53 gt GND lt 52 gt GND lt 51 gt GND lt 5g gt GND 59 GND lt 58 gt GND lt 5 gt GND lt 55 gt GND lt 55 gt GND lt 54 gt GND lt 53 gt GND lt 52 gt GND lt 51 gt GND lt 5 gt GND lt 49 gt GND lt 48 gt GND lt 47 gt GND lt 46 gt GND lt 45 gt GND lt 44 gt GND lt 43 gt GND lt 42 gt GND lt 41 gt GND lt 48 gt GND 39 GND 38 GND 37 GND 36 GND lt 35 gt GND lt 34 gt GND lt 33 gt
147. BUS 0 VSBY5 JP39 SMBUS 1 VCC3 These headers are used to connect to the SMBUS See JP40 SMBUS 2 VCC3 Section 4 5 1 for pinouts JP41 SMBUS 3 VCC3 Short 1 2 Intel processor JP42 Loadline Select Open Low Voltage Xeon processor 4 5 1 SMBUS Headers The SMBUS headers are used to connect the SMBUSes Refer to Table 20 through Table 23 for pinout information Table 20 SMBUS 0 VSBY5 JP38 Pin Pin Description 1 bus 0 data 2 Ground 3 12 bus 0 clock Table 21 SMBUS 1 VCC3 JP39 Pin Pin Description 1 I2C bus 1 data 2 Ground 3 bus 1 clock 52 Inte E7501 Scalable Performance Board De velopment Kit User s Manual intel Table 22 Table 23 4 6 Table 24 4 7 Figure 8 Inte E7501 Scalable Performance Board Development Kit User s Manual Hardware Reference SMBUS 2 VCC3 JP40 Pin Pin Description 1 bus 2 data 2 Ground 3 2 bus 2 clock SMBUS 3 VCC3 JP41 Pin Pin Description 1 bus 3 data 2 Ground 3 bus 3 clock Buttons The evaluation board has power and reset buttons Refer to Table 24 for descriptions of the buttons Buttons Switch Reference i a Designator Switch Description 58 Power Button S9 Reset Button Peripheral Connectors The evaluation board contains a number of connectors for external system devices and peripherals P
148. C823 C824 C825 CAPN_603 1UF TDK CORPORATION OF AMERICA C1608Y5V1E104ZT 009N 400 62 289 290 291 292 293 294 295 296 297 298 C299 C300 C301 C302 C305 C306 C307 C308 C309 C310 C336 C337 338 339 340 341 342 343 C344 C345 C347 C348 C349 C350 C351 C352 C353 C354 C355 C356 C405 C406 C407 C408 C409 C410 411 412 413 414 415 416 417 418 419 420 421 422 423 424 425 426 427 428 429 430 431 432 433 434 435 436 499 500 501 502 503 504 505 506 507 508 C509 C510 C513 C515 C516 C517 C518 C615 C616 C646 C826 C827 828 829 830 831 832 833 C834 C835 CAPN_603 1UF TDK CORPORATION OF AMERICA C1608X7R1C104K 009 402 C836 C837 C838 C839 C840 C841 C842 C843 C844 C845 C846 C847 C848 C849 C850 C851 C852 C853 C854 C855 C856 C857 C858 C859 860 861 862 863 864 865 866 867 868 869 870 871 C872 C873 C874 C875 C876 C883 C884 C885 C886 C887 C888 C893 894 895 921 922 923 924 925 926 927 928 929 930 931 932 933 934 935 936 937 938 939 940 941 942 943 944 945 946 947 948 949 950 951 952 953 954 C955 C956 C957 C958 C959 C960 C961 C962 C963 C964 C965 C966 C967 C968 C969 C970 C971 C972 C973 C974 C975 C976 C977 C978 C979 C980 C981 C982 C983 C984 C985 C986 C987 C988 C989 C990 991
149. CAPN_805 1UF 1090 1091 1093 1094 1095 C1096 C1097 C1098 C1099 C1100 1101 1106 1107 1108 1110 1111 1125 1126 1548 1549 1550 1552 1553 TDKCORPORATION C2012X7R1C474K 2 C1127 C1128 805 47UF A 1 76 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 7 of 17 Bill of Materials Quantity Reference Description Description Manufacturer Manufacturer P N C41 C42 C43 C44 C45 C46 C47 C4 8 C49 C50 C51 C52 C53 C54 C55 C5 6 C65 C66 C67 C68 C303 C304 C335 C346 C456 C457 C458 C459 C527 MURATA ELEC GRM40X7R105K01 64 C528 C882 C904 C1045 C1046 CAPN_805 1 0UF NORTH AMERICA 6AK C1047 C1048 C1049 C1050 C1051 C1052 C1057 C1058 C1059 C1060 C1061 C1062 C1063 C1064 C1078 C1079 C1080 C1112 1113 C1114 C1115 C1124 C1134 C1135 C1136 C1137 C1506 C1547 C1551 C1554 4 C1571 C1572 C1573 C1574 CAPN_805 1UF KEMET 1 C455 805 22 AVX 08055A220JAT4A FOXCONN 1 J10 GON2XUSB_TH 642575 ELECTRONICS UB11123 5D1 125 INC CONN CEDG 184P DIMM V 6 J1 J2 J3 J5 J7 J9 1 BERG 55635 23302 CONN22 WTX TH 1 J101 57 MOLEX 39 29 9222 CONN24 WTX 1 J100 22 MOLEX 39 29 9242 CONN8_WTX DIG TH 1 J102 2 MOLEX 39 29 9082 TYCO 1 J71 ELECTRONICS 1 146134 4 CORPORATION FOXCONN 1 Jt CONPCI TH 201082 060 ELECTRONICS EH
150. CHAN 2200 1958 1720 secr sone TT gt UREF DDR DIMM ok EMPTY A 2 M 0 2222 edat z041 2322 edat 2021 edat 2021 edat 2021 2202 z041 edat edat EnzT 2202 EnzT 2202 EzT Bogg edet EnzT edet EnzT 1091 gg Eat PST edat awaz edat edat yest edat EnzT 1291 gg edat EzT 1291 Eugg yest ugg Eugg edat ugg vast Eugg edat EnzT vast Eugg edat E ZT yest ugg 9021 yest 21 2 Eugg vyst 2002 vast yzT 2
151. D 8 H 2 45 P21 4 AD lt 7 gt O 3 3 3 i AD lt 6 gt Q 05 2 D lt 5 gt 21 1 61341 C616 0 lt 4 Lee 1UF 2 1 K3 I_STB 22 1CH3_PSTRBS 1 1 ie 74 aD a HT_STB 4723 1CH3_PSTRBF K AD lt 1 gt ICOMP F ICH3 HICOMP 22 apnea TERM L19 ICH3 HITERM 7 7 REF 120 TCHS e e e P ACE C615 AND C616 ICH3_CBE3_ R2 N CLOSE TO R357 AND R361 lt ba CBE lt gt 2 2 4 RESPECTIVELY 3_CBE1_ CBE gt K lt 1 gt SERTRGQ UCC3 ne 1CH3_CBE _ 54 lt 0 gt BTRQR Bl _ _ 6141 C615 DIRQBx Cl TCH3_PTRQB_N NS 35261 iCH3 DEUSEL N DEYSEL n o TRQC 5 2 ICH3 1 1 9 _ RAME_N 02 _ _ TCH3_TRDY_ 3954 TRDY Y L IRQ 15 MAIS TCH3_TRQ15 4383 2 al ICH3_TRDY TRDY Y IRQ lt 14 gt 8814 14 e e cond oa lt _5 _ 24 STOP d PTCCLK 319 CH3_APICCLK PM 7 ICH3_PAR GS PAR APICD lt 1 gt J21 _ tba dees 2 A PERR APICD lt gt 720 sac ICH3_CLK33 TS PCICLK HH GPIO2 PIRQEx AG _ 5 PLACE C613 AND C614
152. D lt D lt 69 gt D lt D lt 68 gt D lt 0467 D lt D lt 66 gt D lt D lt 65 gt D lt 64 gt D lt 63 gt 0462 046 D lt 44 a3 G2 CD LO C9 LO POICO CS 910 0 NVEMWAUIOIN J BUONO UO NYO V V V VV V V V D lt 58 gt 0457 0456 0455 0454 0453 WIN WIO 0 0 2 N OF 4 TRY 2 INTEL CORPORATION NUMBER PAG 5888 UW CHANDLER 46 CHAND 85226 ER UIE De COTES RQH_GP IOS GPIO3 RGG_GPTO4 _ 2 7C7 4283 2885 Ol J 4105 4806 3703 4003 4107 VO er CH3_P IRQB_N 4209 CAPS NEAR CONNECTOR PCI33_PRSNT 1 PCI33 PRSNT2 UIQQTOX OX X X G USB 55 6 4 4 L3S32 LK33 JAR 6100 01 7 47B8 4287 7 4794 4287 110 0 CUM are 7
153. D41 A39 3 3V B39 LOCK A85 AD40 B85 GND A40 SDONE B40 PERR A86 AD38 B86 AD39 A41 SBO B41 3 3V A87 GND B87 AD37 A42 GND B42 SERR A88 AD36 B88 3 3V A43 PAR B43 3 3V A89 AD34 B89 AD35 A44 AD15 B44 C BE1 A90 GND B90 AD33 A45 3 3V B45 AD14 91 AD32 B91 GND A46 AD13 B46 GND A92 Reserved B92 Reserved 47 AD11 B47 AD12 A93 GND B93 Reserved A48 GND B48 AD10 A94 Reserved B94 GND 4 2 3 Hub Interface 2 0 Extension Table 9 shows the signals assigned to the Hub Interface HI 2 0 extension Table 9 2 0 Extension Pinout 412 Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name 95 GND B95 GND A113 GND B113 GND A96 CLK200 B96 CLK66 A114 HI11 B114 PUSTRBF A97 CLK200 B97 GND A115 GND B115 GND A98 GND B98 Reserved A116 HI9 B116 HI10 A99 Reserved B99 HI_RESET A117 GND B117 GND A100 PWR_GD B100 HCA_PRES A118 HI20 B118 HI8 A101 GND B101 GND A119 GND B119 GND A102 Reserved B102 Reserved A120 HI6 B120 HI7 A103 Reserved B103 USE_CLK200 A121 GND B121 GND A104 GND B104 GND A122 PSTRBS B122 HI5 A105 HI19 B105 HI18 A123 GND B123 GND A106 HI16 B106 HI17 A124 HI4 B124 PSTRBF A107 GND B107 GND A125 GND B125 GND A108 HI15 B108 HI21 A126 HI2 B126 109 GND B109 GND A127 GND B127 GND A110 HI13 B110 HI14 A128 HIO B128 HI1 A111 GND B111 GND A129 GND B129 GND A112 PUSTRBS B112 HI12 Inte E7501 Scalable Performance Board
154. DALTIDAx ges 8 2 _ 1 5688 IC R768 UCC3 33 IC 4 TK 4 7K 2 NUMB INTEL CORPORATION DOCUMENT 5000 W CHANDLER BLU D lt 72 gt 0471 D lt gt D lt 69 gt D lt 68 gt 0467 0466 0465 D lt 64 gt 0463 1 529 0461 D 60 04589 0458 0457 0456 0455 0454 53 gt 0451 D 50 D lt 4 D lt 4 D lt 4 D lt 46 D 45 D 4 D lt 4 D lt 4 D lt 4 D lt 4 D lt 39 gt D lt 38 gt D lt 37 gt D lt 36 gt 352 D lt 34 gt D4333 Le 325 0431 D lt D lt 29 gt D lt 28 gt D lt 27 gt D lt 26 gt DASS 245 4235 D4225 DEALS D lt 20 gt D lt D lt D lt D lt D lt D lt lt gt 8 lt 8 lt 8 lt 8 lt 8 lt 8 lt SES 1 2 20 1426 2020202 20 50000000 078 SYCCA2545 gt SUCCA25 lt 4 gt 5 25 1 gt lt 5000000 2545 MC 2 gt SVCCB25 2 gt 15 30000006 00000 00000 OR I2 842 841 B lt gt QNOOaG ee 5000 SUCC33
155. DD 20 5 DDRCOMP_A KAHL DDRA_DRCOMP e DD 0026 AM2l DQ a lt 26 gt LOW NIBBLE DDRCUOH_ _AKI DDRCUOH_ e e DD 19 DQ_A lt 25 gt DATA GROUP 4 2203 DD DQ24 AFIS D 82245 C3 DDRCUOL_ 1 2 mu a 00 0923 1 DOG 6235 e 1 ALI hQ_ lt 22 gt HIGH NIBBLE _AELS 1 RHY 2 DDRA CKE PU EMPTY Maya S SECT UC Sale In OUT m Ee 43 DQ_A lt 21 gt DATA GROUP e i B DON 0 2 RESERVEDS 2 2 DD QS IT AKI8 Aas ATT 75 1 a 583 EMPTY DD 0092 RG18 lt gt en 9 DG 6 13 NIBBLE S DD 0018 RN17 lt 18 CMDCLK _RE25 OD e DD 051 r 219 17 gt DATA GROUP CMDCLK_ASx 24 e e R212 DD 0616 AKIS a 16 CMDCLK_A2 RG26 DDRA_CMDCLK2 OUT in VTT_DDR alia 7588 DD DG15 AJ22 DOAK I gt TES CMDCLK_A2x Al 25 DDRA_CMDCLK2_N A 7501 24 9 DD 0014 22 4 NIBBLE CMDCLK 8725 DDRA_CMDCLK i b 1 gt C778 DD 0613 DQ_A lt 13 gt GROUP 2 59 CMDCLK_Alx 48H25 DDRA_CMDCLK 1 E DDRR_DG12 AM25 64125 CMDCLK G24 DDRA_CMDCLK pn 0 LUF DDRR_DQS 1 RIK23 05 A lt 12 gt CMHDCLK_ P8623 DDRA_CMDCLK _N 85 623
156. DRA_MALL_R 5 ione ions DD 0057 AL6 05 MA_A lt 1 gt 8724 DDRA_MALG_R quae DD DOSS DA 59 D MA_A lt g gt up oca en sns DD DQS8 _ 58 gt LOW m MA_A lt B gt GK28 PPI ss DD 005 7 809 DQ A lt 57 gt DATA GROUP 2 29 DDRR_FIR7_R pm DD 0656 DQ_A lt S6 gt 0 lt 6 8 28 DDRA_MAG_R irae dene DD 0055 AME DO ASS gt MA_A lt S gt H2B DDRA_MAS_R andi Lens ons DD 0554 AMS DQ_8 lt 54 gt HIGH NIBBLE 4 2827 DDRA_MA4_R DD 0653 AF 12 DQ_A lt S3 gt GROUP 7 MA_A lt 3 gt 8727 DDRA_MAS_R UTT DDR DD 0052 AG12 52 MA_A lt 2 gt DDRA_MA2_R E HERS DD 09515 1005 a 15 MA_A lt 1 gt GK26 1 290847921 DD 0056 DQS MA_A lt gt RF24 SNS 4254 IERA DD DQ51 ANS 51 C1669 DD RG11 LOW NIBBLE 2 le DD 2049 11 DQ_A lt 49 gt GROUP DD 0048 12 48 603 UF DD 004 DQ_A lt 47 gt BR_R lt 1 gt DDRA_BAL_R PETS DDRR_DQ45 12 DA HIGH NIBBLE Balac ALSI DDRa_Ba _R Onl C1668 DD 0645 AF13 DQ_A lt 45 gt GROUP 6 e DD 0044 RE 15 DQ_A lt 44 gt DDRA_DQS14 AK12 DOS n lt 14 gt 503 UF DDRR_DQS5 12 1005 a 5 DD DQ43 ACET
157. DTG lt 2 gt 1 4 VCC3 lt 3 gt USBY3 3 l L__ 12U DIG 1 15 UCC3 2 o Vogais 10 1 RESL UCC3 lt 5 gt USBY3_3 L 9 GND lt 4 X8 GND lt 3 gt e 5 5 6 lt 7 gt GND lt 2 gt z A X6 GND lt 1 gt 245 UCC_SENSE UCC3 SENSE SLEEP E 21 12C BUSO ON ONLY 18 Hg cak 58 i lt yy CONN PS ON d e f c448 C505 C552 1000PF 107 580 5 503 1 PC 1 8 2307 2297 C651 1000PF 10 500 503 AAA LA N SS SN U57 12 UID MOTCH N 3 2 E 57 GND N 2 1004 N 24 U UCODa 4 og URD GND INTEL CORPORATION NUMBER PAG 5888 N CHANDLER 52 CHANDLER 85226 COIL P12U CPU 9 dx m UGATE 1 UCC_P an an 7 BOOT 2 an an UCC_P UCC12 4 J 4 J 6 uCC12 BIS jUCCI2 GATE eau al iM GNH 1 5 2 GATE 3300 PP WG 1SEN1 PWM 1 ISEN2 ISENS 12 PWM3 1 6301 Es 4 if 3t 6301 SEN4 PWM4
158. Development Kit User s Manual 15 Getting Started ntel 2 4 2 4 1 Note Two Intel Xeon Processors with 512 Kbytes L2 cache at 2 4 GHz with 533 MHz PSB installed on board Two Low Voltage Intel Xeon Processors at 1 6 GHz with 400 MHz PSB Two fansink thermal solutions and metal attachment brackets Two sets of plastic processor retention mechanisms four pieces for the 2 4 GHz processors Two retention clips for the 1 6 GHz processors One MCH heatsink and attachment clip Two 256 Mbytes DIMMs registered with ECC IDE hard disk drive pre loaded with QNX RTP 40 pin IDE cable for the hard disk drive cable will support two IDE devices Hardware to attach the board and the hard drive to the stand 42 screws 6 32 diameter x 7 16 length 19 female female standoffs 6 32 diameter x 5 8 length 19 lock washers size 6 Optionally your kit may include a P64H2 Riser Card with installation hardware see Chapter 6 Software Key Features The software in the kit was chosen to facilitate development of real time applications based on the components used in the evaluation board The software tools included in your kit are described in this section Software in the kit is provided free by the vendor and is only licensed for evaluation purposes Refer to the documentation in your development kit for further details on any terms and conditions that may be applicable to the granted li
159. Development Kit User s Manual 43 Hardware Reference ntel 4 2 4 Note 4 2 5 4 2 6 4 3 Table 10 44 Processor Sockets There are two mPGA604 processor sockets on the evaluation board For a single processor implementation socket J18 CPUO must be populated and socket 717 CPU1 must be empty The processor is keyed so that it fits into the socket in one particular orientation The socket is released by lifting the cam lever Do not force the processor into the socket or you may damage the processor and or socket The evaluation board is designed to support future processor speeds You must use identical type and speed Intel Xeon processors or Low Voltage Xeon processors in both sockets If you have any questions about what processors to use contact your Intel field sales representative or local distributor Firmware Hub FWH BIOS Socket The Firmware Hub FWH or BIOS flash memory part fits into the 32 pin socket U69 giving you the option to remove and reprogram it without the use of soldering equipment There is only one correct orientation for the FWH part to be placed into its socket Line up the circular marking on the FWH part denoting pin 1 with the circular marking on the evaluation board Pin numbering proceeds clockwise around the chip from pin 1 Battery A type 2032 3V lithium coin cell battery is used in socket BH1 on the evaluation board The battery holder is beveled such that the batter
160. EV 5000 CHANDLER BLVD CHANDLER A 85226 45 FERS US DRQx 1 4 ICH3S LDRGI N SMLINK lt 1 gt DRQx lt gt 512 ICH3 LDRQO N X SML FWH4 LFRAMEx U1 _N OOT INTRUDER FWHO LADG Vi 2 11 5 NO FWHL LADI U3 1 7198 SMBCLK FWHeE ZLAD2 7188 lt c SMBDATA 9 FWH3 LAD3 L028 027 O25 PDDREQ 1024 PDDACK O LOLS PIORDYx PDRSTB PWDMARDYx O22 PDIOR K PDWSTB PRDMARDY gt ACLS 1021 PDOINx PDSTOP 12 DCS ISk O19 DCS3 018 DA lt 2 gt L DA lt 1 gt AC an D 15 ac AC AB WS ACS ARS INTR_N SAFE_MODE PD PD PD PD PD p p p p p p p S SH S SDIORx SDWSTBZ SRDM SDIOWK S 2 A UU UJ UJ UJ UJ LU LJ LU LU UJ UJ UJ lt gt SHD lt gt 2 INTEL CORPORATION NUMBER PAG 5 88 M CHANDLER B 43 CHAND 85226 AT K ZLPCPDx SUS UGATE URMPWRGD AN_RST gt lt D DD D D D 53 53 2 53 e 53 e 53 e 83 e N3 N3 DD 8 lt 1 gt 8 9 8 8 846 845 844 843 842 841
161. IERR ES ix ARR Dx lt 7 gt RESERUED lt 6 gt _ 2 1 8 os TN gt CPU_STPCLK_N STPCLKx ed N 753 DX 6 RESERVED lt S gt FSB HTBDY N LOCK x FSB_HLOCK_N 55 0 lt 5 RESERUED 4 sea TRDY b 4 Dx lt 4 gt RESERUED 3 ND F SB_BERR_N 1186 i M gt an 3 25 54 Dx lt 3 gt RESERVED lt 2 gt ITP_TRST_N TRST x 0 n AES 4 Dx 2 BESERUEDS1 gt CPU_PROC_HOT_N 4308 72 5 m va DXc1 rece saa IN CBU1_SKToCG_N E Dx 2 SKT ot 7208 2 5 ED ITP TDI P1 tpi ee CUD REV 0 5 SK SMB PRT AEA CPU1_SF1B_PRT OU es sca 2 584 Lees TIP_TIUO_ 1 Tpo zi U2 158 Y27 CPU1L_THRM_DR e F FC SO CMIS e CPU1 ucca terc Y28 CPU1 THRM DC 5 I il 5 OUT Le e OUT sss SHE CPU_THRM_TRIP_N Lene 4 UH 580 CPUL_USSA TAB 4 1j C58 1 2 USSA 52 665 7343 2 BINIT 11 FSB_BINIT_N 1166 t cs 592 IND UF 1 2 1175 J C L4 CPUL_VCCIOPLL E 4 T UH E E ip 2 18 FSB DBSY Lias IND SD 4 TUH E18 FSB_DRDY Jan DRDY P DY 1106 CAD NOTE DH mO Lape UCCPLL
162. INTB A55 AD4 B55 AD5 A8 5V B8 INTD A56 GND B56 9 Reserved B9 PRSNT1 57 AD2 B57 GND A10 3 3V B10 Reserved A58 AD0 B58 AD1 A11 Reserved B11 PRSNT2 A59 3 3V B59 3 3V A12 KEY B12 KEY A60 REQ64 B60 ACK64 A13 KEY B13 KEY A61 5V B61 5V A14 3 3Vaux B14 Reserved A62 5V B62 5V A15 RST B15 GND KEY KEY A16 3 3V B16 CLK KEY KEY A17 GNT B17 GND A63 GND B63 Reserved 18 GND B18 REQ A64 C BE7 B64 GND A19 PME B19 3 3V A65 C BE5 B65 C BE6 A20 AD30 B20 AD31 A66 3 3V B66 4 21 3 3V B21 AD29 A67 PAR64 B67 GND A22 AD28 B22 GND A68 AD62 B68 AD63 23 AD26 B23 AD27 A69 GND B69 AD61 A24 GND B24 AD25 A70 AD60 B70 3 3V A25 AD24 B25 3 3V A71 AD58 B71 AD59 A26 IDSEL B26 C BE3 A72 GND B72 AD57 A27 3 3V B27 AD23 A73 AD56 B73 GND A28 AD22 B28 GND A74 AD54 B74 AD55 A29 AD20 B29 AD21 A75 3 3V B75 AD53 A30 GND B30 AD19 A76 AD52 B76 GND A31 AD18 B31 3 3V A77 AD50 B77 AD51 A32 AD16 B32 AD17 A78 GND B78 AD49 A33 3 3V B33 C BE2 A79 AD48 B79 3 3V A34 FRAME B34 GND A80 AD46 B80 AD47 A35 GND B35 IRDY A81 GND B81 AD45 A36 TRDY B36 3 3V A82 AD44 B82 GND A37 GND B37 DEVSEL A83 AD42 B83 AD43 42 Inte E7501 Scalable Performance Board De velopment Kit User s Manual n Hardware Reference Table 8 64 bit 3 3V PCI X Connector Pinout 420 J21 J23 J24 425 412 Sheet 2 of 2 Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name A38 STOP B38 PCIXCAP A84 3 3V B84 A
163. ITS TIEN HSUU nro LEOU HHUU 2zT lt 28 gt 04 ZT ett H rose aves save H HEOU 1 lt 86 gt 90 ETEDON lt IS c5 HWUU yor suse lt 61 gt 509 KUSH 857 HWNUU L eee ayaa lt gt OC cgo Lu 77 suce save you CUR ggu NELI I save erot HHUU 89 lt tr gt 00 S JM add sve save EPOU HHUU lt Et gt 0 522011 GSOU asut 79 S SO0d 4 ODN IT OU asud eet DON crot HHUU GT lt Sr gt og O20n Grou HHUU 9 200 0931 EFT LVOU HHUU 3200 O20n Get PISOU lt IT gt GOH O20n grou HHUU 22 O2On HHUU DON GOU HHUU 1 lt 06 gt 90 96 1500 HHUU 1 lt 16 gt 290 O20n 24 9590 HHUU 8 9 SO0d j DOIN CGOU HHUU set CcoO 4 OO r6 EGOU lt S gt oq 0D0N GE GOU HHUU Ooon GGOU HHUU TIT ODDAT ST SISGOU HHUU 1 lt 51 gt 690 558 cg OSO 4 SON 2300 HHUU r8 1 lt 2G gt OQ SON HHUU 78 296 gr 500 HHUU 88 6
164. Igel PM 2 1 m gt 23 2 2 gt i 2 gt mw 7 u O Yt Jy 10 Y Z CAD ASTE Y O l 26 2 al W 2 EVE Z NL Hin UO VALT vast east eaat 9291 baLT yaar v POET SALT Su8T Sui vast vast yaar v vaat vaat saat Sui saat suet Sui SALT suet Sui vaat vaat t aaar lt Laat 2 2 aaar lt aaar lt aaar aaar lt aaar lt lt 8891 2421 scat 2 812041 2 ET SALT SWAT sui 812041 edat nt gt EnT eaat sast vast Sat Sgt saat nar 1BA4 17A4 13B4 Cu Cu vaat saat saat edat saat saat saat saat vast lt D saat 812041 4d8t 2 saat saat EnzT eger eae PHzT vast vae va vae saat Sui Sui SALT ORAT TON CORI N LON RMINA B
165. Intel E7501 Scalable Performance Board Development Kit User s Manual February 2003 Order Number 273844 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving life sustaining applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel E7501 may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest spe
166. L PWR 1 00U_ PANASONIC 4 L7 L8 L12 L22 NDUSTRIAL INC FTQP6F1R2HFA INDCT54 00 920 000 1 L19 IA IU 206 MURATA LQH31HN54NK01 INDUCTOR TH 1 L17 VITEC 55P9323 INDUCTOR TH 4 L13 L14 L15 L16 VITEC 55 9263 INDUCTOR_UP4 1 L18 9 COILTRONICS UP4 1R5 2 U2 U119 pot ung PA LINEAR LT1587CM 1 5 LED DISPLAY 10P TH HEWLETT HEWLETT HDSP 717483 001 PACKARDCOMP 7803 STANLEY 2 CR9 CR68 LED_SM 716805 001 ELECTRIC SALES PG1112H CR OF AMERICA STANLEY 2 CR10 CR81 LED SM 716805 002 ELECTRIC SALES AA1112H TR OF AMERICA 1 U103 IC AMPL DUAL LOW PWR NATIONAL LM2904M nes LPC47B27_PQFP 724051 LPC47B272 or 001 LPC47B272QFP IC LIN SOT 1 U84 223 LT1118CS8 2 SW LINEAR LT1118CS8 IC LIN SOT23 LT1761ES5 1 U18 T UREC LINEAR LT1761ES5 1 8 1 U83 LINEAR LT1764EQ IC PWR TRPL 1 U59 LINEAR LTC1326CMS8 2 U44 U115 LINEAR LTC1735CS 1 1 SO16 LTC1929 SSOP LINEAR ui UNKNOWN TECHNOLOGY SEMICONDUCTOR 6 032 033 053 060 065 012 4 2 MBT3904DW1T1 INDUSTRIE SEMICONDUCTOR 3 Q11 Q12 Q20 07a755 001 COMPONENTS MGSF1NO2LT1 INDUSTRIES LLC Inte E7501 Scalable Performance Board Development Kit User s Manual 79 of Materials Table 35 Bill of Materials Sheet 10 of 17 In Quantity Reference Description Description Manufacturer Manufacturer P N 2 043
167. Materials Quantity Reference Description Description Manufacturer Manufacturer P N 24 208 209 210 211 212 213 214 215 216 217 218 219 C220 C221 C222 C223 C224 C225 C226 C227 C1475 C1476 C1477 C1478 CAPA 560 000 UF 8X13 4 000V 20 TH UNITED NIPPON 4PS560MAH11 1481 1482 1483 1484 CAP P_RDL 820UF UNITED NIPPON CHEMICON 4FP820MAE5 702 703 704 705 CAPN_1206 10 0UF A V X CERAMICS CORP 12066D106MAT4A 13 C445 C446 C447 C448 C449 C450 C897 C898 C899 C900 C901 C902 C903 CAPN_1210 10UF TDK CORPORATION OF AMERICA C3225Y5V1C106Z 059 65 1 2 4 5 6 7 9 10 11 12 13 14 15 16 17 1 8 19 20 21 22 23 24 25 2 6 C27 C28 C29 C30 C31 C32 C33 C3 4 35 36 37 38 39 40 57 5 8 520 521 522 523 524 680 C683 C684 C685 C688 C689 C692 693 700 701 1398 1399 1404 1405 1531 1546 1587 1588 CAPN_1210 22UF TDKCORPORATION OF AMERICA C3225X5R0J226M T009N 1496 1497 1498 1499 1643 1644 CAPN_508 1UF TDKCORPORATION OF AMERICA C1220X7R1C104K T009N 22 C589 C590 C595 C596 C597 C598 613 614 620 621 1450 153 0 1607 1608 1609 1610 1611 1612 1619 1620 1621 1622 CAPN_603 01UF MURATA ELEC NORTH AMERICA GRM39X7R103K05 0AJ C630 CAPN_603
168. N ra x a ver pedet gt UH gt 500 ON31343 2N 8 S CL 38382 ON PE CMS cae ET EB YUE gt GT lt 2 2288 81085 TU vast sy TOU UHUC lt 260 lt 1 gt 28 TUS B e e 11 Hu croa oadd OTT 151200 12205 EBT cus TU MO raat vest M OISOGd gya 401 lt 2 SoO 6 vast past vast ogrod Uddd lt 9T gt 00 2 25 26 X D EST1 S TD AID 0057555 at U vaad dS 20n r8 Sea HOSTS US s 61200 I3 5 ZO UH lt zage vuar vast vost x ecol uuaa c Sou d c gg vast vost J ocol oxda lt Ac gt od 3 92 N st 2502 vast vast vost Ieo gyda Te od V hl vast BT UNO ce o NH Coon 9 a eeoa oadd SETA ANI TAO wes ron 14119309 Tur H veod gudd rood 4 250 DUNS YAU e ress ran kS _ EE caet lt gt GAT os vve vue 9 vast rast yos a XD TEE GU i gt svoe vvar vos uaz raat Poor Sust EE cou lt g gt ON TE
169. NDLER BLUD CHANDLER A 85226
170. NUMBER 5000 N CHANDLER BLVD LON SLES RESIS ORD o sMINATION NL OA FL AND BMC CONNECTORS SPORE INTEL CORPORATION JOCUMENT NUMBER PAG 5000 CHANDLER B 2 133MHZ PCI X PIN XEON 604 PIN XEON PROCESSOR PROCESSOR 1 1Q QMHZ PCI X 133MHZ PCI X IDE PORTS CONNECTOR 2 INTEL CORPORATION NUMBER PAG 5000 CHANDLER 3 Rs
171. OHM 1 R1015 RESN 603 340K MCR03EZ F 3403 4 R102 R104 R109 R114 RESN_ 603 392 PEU ELE CR10 3920F K 4 R820 R821 R822 R823 RESN_603 4 3K MCR03EZ J 432 21 822 603 4 CORPORATION 2 R750 R751 RESN 603 4 7 AN XGERAMICS CR10 4R7J K CORP 0 R797 RESN_603 4 7 R369 R384 R390 R471 R475 R485 R486 R487 R490 R494 R495 R496 R499 R682 R683 R697 R704 R757 39 R758 R760 R761 R772 R775 R776 RESN_603 4 7K OR MCR03EZ J 472 R777 R778 R779 R780 R781 R782 R788 R789 R1011 R1018 R1032 R1033 R2000 R2010 R2011 0 R684 685 RESN 603 4 7K 1 R681 RESN_603 4 99K AVXCERAMICS CR10 4991F K CORP 2 R202 R818 603 402 VISHAY DALE 5 R894 R895 R896 R897 R898 RESN_603 43 7 CR10 430J K 4 R99 R106 R110 R112 603 453 2 42 10 4530 R266 R267 R484 R493 R509 R511 ROHM 19 R824 R828 R913 R2012 CORPORATION MCROSEZ 471 ROHM 1 R536 603 475 MCR03EZ F 4750 ROHM 1 R479 RESN_603 47K MCR03EZ J 473 R1 R2 R3 R4 R5 R6 R30 R34 R55 R58 R62 R65 R67 R69 R9 7 R148 R185 R521 R528 R545 R546 ROHM 4D R547 R548 R549 R550 R665 Re66 PESN_603 49 9 CORPORATION MCR03EZ F 49R9 R667 R668 R669 R670 R671 R672 R753 R754 R841 R843 R1025 R312 5 R3157 0 R147 R186 RESN 603 49 9 Inte E7501 Scalable Performance Board Development Kit User s Manual 83 of Materials Table 35 Bill of Materials Sheet 14 of 17 Intel
172. OS contains two more options to control the bus segments behind the P64H2 that is contained on the Intel P64H2 riser card which may be inserted into the HI Riser Card Connector slot designated HIC in the setup options The E7501 BIOS contains support for the Intel P64H2 riser card Exit After BIOS setup modifications have been done you have several choices for leaving the setup utility which are displayed on the Exit Setup screen Save and Exit F10 No Save and Exit Discard Changes F7 Load Optimal Defaults F8 Load Failsafe Defaults F9 Save Changes and Exit This option can be chosen to save all changes made to CMOS configuration since entering BIOS setup utility and rebooting the system All changes made in the setup utility will take affect on the subsequent boot Discard Changes and Exit This option can be chosen to exit the setup utility without saving any CMOS configuration changes that have been made Choosing this option will allow the boot to continue from where it left off before entering the setup utility Discard Changes If you have made changes that you wish to undo this option can be used to restore the CMOS buffer to the same state it was in at setup utility entry Inte E7501 Scalable Performance Board Development Kit User s Manual 61 BIOS Overview ntel 5 1 8 4 5 1 8 5 5 2 5 3 5 3 1 5 3 2 5 3 3 62 Load Optimal Failsafe Defaults Both of these options load
173. On HSUU lt 200 0221 UGOU 62 lt S gt od 0221 96 ISOU HHUU Gg lt TS gt od 0221 24 9500 HHUU 8 9 SO0d jJ 0221 cSou lt G 2O 4 OOOn HO EGOU HSUU oer lt eS gt od 0221 GOU HSUU 21 lt 5200 0221 ec SOU HHUU TIT 155200 OOOn GTSOU HHUU KSI Sod SGOU HHUU cg lt 95 gt 0 On 2500 HSUU rpg lt 45200 DDN BGOU HHUU 8 lt B gt 221 5GOU HHUU gg lt 6S gt o0d 2921 g 2500 HHUU 98 lt SOC j 221 HHUU lt 29 gt 00 221 ISOU SIT lt TS gt od On 8 HSUU 841 lt 9200 SSA H ESOU HHUU 1459200 cene save sezs SISOU HHUU ZIT 9T SOd 3386 ie Sie YVETNNOO A CU G1 1 aane 1986 1886 1788 UREF DDR DIMM f CHAN ER 2000 MW CHAN 9 0 Lo use ZUTE gaez E gg use Egg Egg eaee Egg use gaez Egg suse eos Egg eose eazz eazz vaee eazz vae
174. P54H2_2_PB_ TRG1 NM PBIRQ O P54H2_2_PB_ TRG mE PBPLOCK gt X piss Pe4H2 2 PB PLOCK N aec 3gc 4ec 4188 2 OF 5 Le 5 2 A DIETS 20030 INTEL CORPORATION 5008 MW HANDLER BLUD E a 5226 DOCUMENT NUMBER PAGE REV ENES UCCSREF 2 HIUSWING G12 2_UVSWING 19 HTUREF 2_VREF HIRCOMP 2_RCONP CLK2 1 CLK200 CLK66 BPCLK100 BPCLK133 ROSERR N 017 4 RaSERR x yi e prre I CS 37 s 2c BUS Dif SCLK 37 2C_BUS PWROK C R8TINX INTR APICCLK APICD1 APICDA 2 HI 15 0 0000 lt lt lt lt lt lt lt lt lt lt lt lt i I I I I I I I I I HPB SORRx HPB_SOR HPB_SOLR 50 PB 500 PB_SOC ES lt SIL HPB_SID HPB_SIC Sc 2 INTEL CORPORATION JOCUMENT NUMBER PAG 5000 W CHANDLER B 32 CHAND 85226 JP LC GSS P54H2R A UCCK 24 gt UCC3 49 gt
175. PCI PCI X Cards into the Slots on the Riser 66 12 Installing the P64H2 Riser 67 13 Installing the Bracket accesses sues 68 14 Inserting the PCI PCI X Card into Slot 23 69 Inte E7501 Scalable Performance Board Development Kit User s Manual 5 Contents ntel Tables 1 Related Documents 13 2 Additional teet te eee E 21 3 Jumper 5 5 iater el 22 LEE Ic c 38 5 Chipset and Major Board Components 40 6 Expansion Slots and 4 4 40 7 32 bit 5V PCI Connector Pinout J11 41 8 64 bit 3 3V PCI X Connector Pinout J20 J21 J23 424 J25 912 42 9 HI2 0 Extension Pinout ISK creck esalet edle pane 43 10 On Board Gonnectors LEER E 44 11 WTX Main Power Connector 100 45 12 WTX Additional Power Connector 9101 46 13 WTX 12VDIG VRM D2D Output Power Connector J102 a 46 14 68 pin Single Ended Low Voltage Differential SCSI Connector Pinout J37 J38 47 15 IDE Connector Pinout 16 48 16 Floppy Drive Connector Pinout J34
176. PRH lt 55 gt 3 gt PL2O_P64H2_1_PR_GNT3_ B 512 603 CH Sj PRRD lt 54 gt PAGNTX lt 2 gt rS 18 d HDR 8 PARSD lt 53 gt 1 622 T x a AAT 8 _ PAAD lt 52 gt 5619 1 _PA_GNTO_ DUTY So Iw PRD lt 51 gt PAREQx lt 5 gt PL24 2_1_ _ _ dics Qe 8 PAAD lt 5 gt PAREQx lt 4 gt E21 PE4H2_1_PA_REG4_ SSO 1 7 PAAD lt 49 gt 2 P lt F 19 PE4H2_1_PA_REG3_ Mi Y m 7 PAAD lt 48 gt PAREQx lt 2 PKG24_PE4H2_1_PA_REG2_ em f PAAD lt 47 gt epus POREQx 1 621 1 REGI de 2 PAAD lt 46 gt MR DOREQx 0 G18 1 PB REQO L PAAD lt 45 gt C 6 44 21 P64H2_1_PR_PRR 4 5_ PAAD lt 43 gt PAPAR P64H2_1_P_PR 6 PARD lt 42 gt R24 2_1_ _5 _ 5_ PAAD lt 41 gt PRPERR R21 PE4H2_1_PA_PERR 5 paap lt 40 gt P4R20 PE4H2_1_PA_SERR_ 5 PAAD L P23 P64H2_1_PA_IRDY_ S PAAD lt 38 gt PATRDY x P4P20 PB4H2_1_PR_TRDY S PARD lt 37 gt N18 1 4 PAAD lt 35 gt v PADEVSEL Pe4H2 1 PR DEUS sabe sted 4 PAAD lt 35 gt 4 PAADK 34 gt lt 7 gt Wee 64 2 1 PO 4 PAADK 33 gt PAC BEx lt 6 gt 739021 P64He_t_PA_CB 4
177. PUO BSELO COD us 52 4 s excea EEA 24 o CPU LINT1 NMI G23 Y12 265 y 3 1106 51 AE A Bytes PSC I2 23 1 5 1 uM COS LINTE INTR HOA p DSTBN3x 58 ace Deso exco PSBIL 22 22 PF 22PF 22 PF 5 15 2 FSB_DSTBNx3 gt _N5S PS A lt 49 lt 21 21 224 488 224 244 iC IN gt CH3_ IGNNE_N AN reNNEx e Dx 48 gt Ax lt 20 gt 20 2 LIS 1 Y 47 Dx lt 47 gt 19 9 19 603 5a3 CH3_INIT_N DE A Jak DSTBN1 vd vccs aa 29 Dx lt 46 98 2 18 CAPS CLOSE PINS EE y el 2 17 WS F23 W23 2 Fel C E 44 gt Ax lt 16 gt a 1 022 S1 PyT11 3 io A iO lt 43 gt 15 gt s 15 2 R126 1 PSB_RS lt 225 0 E21 7 TS C18 14 x 4 eran cus 5813 13 2 BS Re Dx 40 gt 98 5 i 49 9 1 CPUPWR 1 Dx lt 39 lt 11 gt 5 42c3 IN gt GD ABT PRGOOD us D lt 38 gt lt 1 gt DSTBP o EC AE Dx lt 37 gt exc 5 u 1 YB ox
178. R76 R8 ROHM 9 jue RESN 603 200 AAE MCR03EZ J 201 4 R702 R708 R1016 R1017 RESN_603 20K BOHM MCRO3EZ J 203 8708 E CORPORATION R551 R552 R899 R958 R2006 R200 ROHM 6 RESN 603 22 COBPORATIGN MCR03EZ J 220 2 R2013 R2014 RESN_603 220 AVXCERAMICS CR10 221J K CORP 4 R232 R257 R357 R361 RES D 0603 2610HM 1 VISHAY 2 R226 R229 RESN_603 22K OM MCR03EZ J 223 CORPORATION R90 R91 R100 R105 R107 R111 AV X CERAMICS 10 Be io eels REGO RESN 603 24 9 AVX CR10 24R9F 0 R212 R215 603 24 9 1 R88 RESN_603 27 4 AVXCERAMICS GR10 27R4F K CORP ROHM 1 R1014 RESN_603 3 74K CORPORATION MCR03EZ F 3741 6 R492 R512 R661 R663 R830 R831 RESN_603 300 2 CR10 301J K 3 R28 R92 R95 603 301 AVXCERAMICS GR10 3010F K CORP 82 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 13 of 17 Bill of Materials Quantity Reference Description Description Manufacturer Manufacturer P N R33 R255 R387 R397 R540 R541 R542 R543 R544 R553 R586 R587 R588 R589 R680 R755 R756 R949 ROHM 32 R951 R952 R953 R954 R955 Ro59 RESN_603 33 CORPORATION MCR03EZ J 330 R996 R997 R998 R999 R1000 R100 1 R1002 R1003 5 R224 R256 R648 R735 R935 603 330 OHM MCRO3EZ J 331 R256 R648 R735 4 R393 R394 R459 R816 RESN_603 33K NORN MCRO3EZ J 333 R394 R459 E CORPORATION R
179. RESN_603 8 2K R177 R179 R191 R195 R196 R268 2 R453 R819 RESN_ 603 806 VISHAY DALE s 2 R210 R260 603 825 AVX CR10 7500F K 84 Inte E7501 Scalable Performance Board De velopment Kit User s Manual In Table 35 Bill of Materials Sheet 15 of 17 Bill of Materials Quantity Reference Description Description Manufacturer Manufacturer P N R500 R501 R502 R503 R504 R505 ROHM 8 RESN 805 330 MCR10 amp ZH J 331 RES 7 68K OHM 1 10W 1 1 R476 2 PANASONIC ERJ 6ENF7681V 0 R151 RESN_SM 002 RES D 2512 2 00 WSL2512R002JR8 2 R425 R426 ROMS ERR I 0 R481 RES_603 2K 5 603 E AVX CERAMICS CR10 202J K CORP 0 R480 RES_603 330 5 603 E AVX CERAMICS CR10 331J K CORP ROHM 0 RES 603 620 MCRO3EZ J 621 TYCO 1 J39 ELECTRONICS 406549 4 CORPORATION 0 RP273 RPAK4C 4R_SM 0 NORM MNR14E0ABJ000 4 RP205 RP274 RP275 RP282 RPAK4C 4R_SM 1 0K 22 CNK1J4TDD102J RP13 RP14 RP15 RP16 RP17 RP1 8 RP19 RP20 RP21 RP22 RP23 RP 24 RP25 RP26 RP27 RP28 RP29 R P30 RP31 RP32 RP33 RP34 RP35 KOA SPEER 46 RP66 RP67 RP68 RP69 RP70 RP7_ RPAK4C 4R_SM 10 ELECTRONICS ene pipe 1 RP72 RP73 RP74 RP75 RP76 RP 77 RP78 RP79 RP80 RP81 RP82 R P83 RP84 RP85 RP86 RP87 RP88 1 RP276 RPAK4C 4R_SM 100 mM MNR14 0ABJ101 1 RP197 RPAK4C 4R_SM 10K CNK1J4TDD103J RP206 RP
180. SBO B41 3 3V A11 Reserved B11 PRSNT2 A42 GND B42 SERR A12 GND B12 GND A43 PAR B43 3 3V A13 GND B13 GND A44 AD15 B44 C BE1 A14 3 3Vaux B14 Reserved A45 3 3V B45 AD14 A15 RST B15 GND A46 AD13 B46 GND A16 5V B16 CLK A47 AD11 B47 AD12 17 GNT B17 GND A48 GND B48 AD10 A18 GND B18 REQ A49 AD9 B49 GND A19 PME B19 5V 50 50 20 AD30 B20 AD31 A51 KEY B51 KEY A21 3 3V B21 AD29 A52 CBEO B52 AD8 A22 AD28 B22 GND A53 3 3V B53 23 AD26 B23 AD27 A54 AD6 B54 3 3V A24 GND B24 AD25 A55 AD4 B55 AD5 A25 AD24 B25 3 3V A56 GND B56 AD3 A26 IDSEL B26 C BE3 A57 AD2 B57 GND A27 3 3V B27 AD23 58 ADO B58 AD1 A28 AD22 B28 GND A59 5V B59 5V A29 AD20 B29 AD21 A60 REQ64 B60 ACK64 A30 GND B30 AD19 A61 5V B61 5V 1 AD18 B31 3 3V A62 5V B62 5V 4 2 2 64 bit PCI X Connectors Table 8 shows the signals assigned to the 64 bit PCI X connectors Intel E7501 Scalable Performance Board Development Kit User s Manual 41 Hardware Reference n Table 8 64 bit 3 3V PCI X Connector Pinout J20 J21 J23 J24 J25 J12 Sheet 1 of 2 Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name A1 TRST B1 12V A49 AD9 B49 M66EN A2 12V B2 TCK A50 GND B50 GND A3 TMS B3 GND A51 GND B51 GND A4 TDI B4 TDO A52 CBEO B52 AD8 A5 5V B5 5V A53 3 3V B53 AD7 A6 INTA B6 5V A54 AD6 B54 3 3V A7 INTC B7
181. SR DB9 66 DB9 DB9 33 SR DB10 67 DB10 DB10 34 SR DB11 68 DB11 DB11 Inte E7501 Scalable Performance Board Development Kit User s Manual 47 Hardware Reference 4 3 3 IDE Connector Table 15 shows the signals assigned to the IDE connector Table 15 IDE Connector Pinout J16 Pin Signal Pin Signal 1 Reset IDE 21 DRQ3 2 Ground 22 Ground 3 Host Data 7 23 Write 4 Host Data 8 24 Ground 5 Host Data 6 25 Read 6 Host Data 9 26 Ground 7 Host Data 5 27 IOCHRDY 8 Host Data 10 28 Ground 9 Host Data 4 29 DACK3 10 Host Data 11 30 Ground 11 Host Data 3 31 IRQ14 12 Host Data 12 32 Reserved 13 Host Data 2 33 Addr1 14 Host Data 13 34 Primary IDE Cable Detect 15 Host Data 1 35 Addr 0 16 Host Data 14 36 Addr 2 17 Host Data 0 37 Chip Select 0 18 Host Data 15 38 Chip Select 1 19 Reserved 39 Activity 20 Key 40 Ground 4 3 4 Floppy Drive Connector Table 16 shows the signals assigned to the floppy drive connector Table 16 Floppy Drive Connector Pinout J34 Sheet 1 of 2 Pin Signal Pin Signal 1 Ground 2 Drive Enable 0 3 Ground 4 Reserved 5 Key 6 Drive Enable 1 7 Ground 8 Index 9 Ground 10 Motor Enable A 11 Ground 12 Reserved 48 Inte E7501 Scalable Performance Board De velopment Kit User s Manual n Hardware Reference Table 16 Floppy Drive Connector Pinout J34 Sheet 2 of 2
182. SYR LUSCDBPO SCDBP lt gt SCDBM gt 4 VSCDBMO A f B24 isis LURSTAP A26 RESETAP RESETA LYRSTA USCDBPHP 2 SCDBPHP SCDBPH 3 USCDBPHM aia ese UMSGaP Bes SGAP SGA C24 LUMSGA USCDBPLP F3 SCDBPLP SCDBP USCDBPLM USEL PB C26 GEFLRP SELA B26 USELR YATNBP ATNBP ATNB s LUATNB UCDAP 026 CDA C25 LUCDAM BSYBP BSYHP BSYB E4 UBSYB M LURE QRP 024 REQAP REQA 025 LUREQA PNIS LUACKBP CKBP ACKB E2 YACKB LUTOAP 25 Toa E26 UTORM MEN LURSTBP 02 RESE TBP RESETB 03 LURSTB D UMSGBP C2 SGBP SGB 01 LUMSGB 55 Gens BI DIFFSENSER_R1 AR EE 2 DIFFSENSER H25 DIFFSENSEO UREXT1 C9 4 15 LUSELBP Bl SELBP SELB Ci LVSELB a res 4 amp UREXT2 BS BRA LUCDBP B2 CDBP CDB LUCDBM sce x 603 ADL A PRST gt x RSUH1 1 LURE QBP B3 REQBP REQB LUREGB a 2 RST N i HDR 8 12 12 LUIOBP CA B4 LUIOBM PENA K23 RESUS PCIRSTOU 26 mm DIFFSEN DIFFSENSEB D9 DIFFSENSEB LEDB 1525 _ 719 724 LEDAx K24 EXPOCTB STPWCTLB 24 CHB_TERIEN OUT 26 M24 IDDATB WIDEPSBx 3 23 R255 STPWCTLA 225 CHA_TERMEN _ STT es LDALTIDBx PL23 AIC_CLKNP gt WIDEPSA AJ23 3 GF d 2 B18 SCLKINM L
183. THIO AES TESTHI6 UID lt S gt 28 2 Dx lt 28 gt AP Lk FSB_AP1_N a CPUI TESTHIS ADS TESTHIS VIDE a gt B3 4 lt pea 3 CPUL_TESTHI4 3 28 2 Dx lt 26 gt DBTx lt 3 gt 1106 EE 15 TESTHT3 VID lt 2 gt D3 2 CPU1_ UID lt 4 25 5 24 OAIB peoa 1 9 FSB_DBT lt 3 gt _N 51 CPUI TESTHII ae 2 Dx 23 DBI lt gt eo RG CPU DES 10 TESTHIO Dx 22 55 Dx 21 DPx 3 lt BI gt 686 1186 e UTTPWRGD CCSENSE Bev raha Dx lt 28 gt Dex 2 UM 18 DPX l 27 FSB DP 3 0 N PS ws TN gt EPS TMS USSSENSE 026 CPUI 055 SENS D 18 DP 17 3 ha p xc B mw m TRES 928 Fears 16 pc 4 I E27 CPU_FERR_N 15 BOIS uas Moni 3 s TS SB_ RSP_N 14 REQS 2 FSB HREQ 4 0 06 rorcepre CALS CPU_FORCEPR_N e IU D lt 13 gt REQX lt 1 gt 20 SLEW_CTRL ARD Dx 12 REQ lt gt 0 b TCHS HIT ES FSOBZHII N 682 1103 gi 0 11 gt gt SLPx I 12 PAE 96089 FSB HITM N S o DUO i m TN gt CPU1 SIL N SMIx EU DOO UCCS 8 lt Dx 8 RESERUED lt gt 90
184. U UF B HIDRU CNTR UID4 PARGDx VTT YID3 JDR 1393 148 1788 C1641 C1542 1 1 UF 10 180 180 E 3 S 5 gt lt QUI 2 503 e 503 1363 146 J Sec 1788 2288 23B8 2488 2678 1 1 D C702 C704 18 BUF 18 BUF 10 BUF ES A ad 10 10 10 10 5 Ea 6 30 6 39 5 6 39 5 6 39 S x7R x7R X7R 5 C 1225 1225 1225 1225 3 C1112 9 PF 10 LACE TW UR PINS 2 3 10 1311 37 12 1 3426 2 S TEL 5 00 GOOD TNH LA SM META 28 2 INTEL CORPORATION 5000 W CHANDLER B CHAND 5 35226 CAPS CLOSE TO FET e e e C52g 5311 C532 1894 PLACE as 1 8U PGOOD mn BT 1 89 000 Tee 1123 10 C1243 e Lee 22UF 20 TND 169 623 SUPPLY MONITOR iaeor SA Sau STANDBY 503 S_PMROK_1 e 2 LJ re 74LUC14 SYS PWROK_2 Ol J 2885 3285 44c AES Q wmlTN gt UTT_DDR_PGOOD NUMBER 51 ORAT ION INTEL COR PNROK GENERA 5000 N CHANDLER B 85226 CHANDLER POWER CONNECTORS CONN24_WTX_MAIN JB CONNB_WTX_ DIG 12U DIG 3 VCC3 9 UCC3 4 4 12 _
185. Z IEC OUP INTE CORPORATION JOCUMENT NUMBER x 5000 W CHANDLER B 9 CHAND 5 85226 UREF 2 2 694 405 ana 694 10 DEBUG PORT DEBUG POR R INTEL CORPORATION NUMB 5 88 CHANDLER B CHAND Rs 85226 CPUUCC 1 ROS ix 301 1 603 1 16 2 1410 RIL 2 603 1 MCH_XORMODE_N CLKINN C29 V U3 CLKINP HRCOMP GS 1 2 XRCOMP V YSWING KS XSWING YB 51BN lt 3 gt JSTBP lt 3 gt 2 301 1 503 1 1 U 5C4 FSB RS 2 0 CG IGSTB 1 0 3 FSB JBI 3 0 FSB DP 3 0 505 402 5985 5183 402 402 gcB 5C4 605 592 505 492 505 492 585 4C6 585 4C6 UU UZ R4 N 1264 Bo gt P3 N 7454 HG SB_RSP_N BB
186. _PA_CBE _ PAAD lt 33 gt PAC BEx lt 6 gt 39021 P54H _ _ PH_CBE6_ e PAAD lt 32 gt PAC BEx lt 5 gt F HB 1 P64He_2_PA_CBES_ Merete PAADK lt 31 gt PAC BEx lt 4 gt 5621 2_2_ _ _ Mc PAAD 32 gt PAC BExK lt P4LO2 P64H2_2_PA_CBE3_ 29 gt PAC BEx lt 2 gt 2 2 ois PAAD lt 28 gt PAC BEx lt 1 3124 _ P64He_2_PA_CBE 1 _ mE PAAD lt 27 gt x PAC BEx lt gt 24 PE4H2_2_PA_CBEG_ eS PAAD lt 26 PAADK 25 gt 917 2 2 PLACE SERIES RESISTOR PAAD lt 24 gt 1 WITHIN 1 INCH OF P64H2 23 PAPCLKO lt 6 gt 23 Po4H2 2 PRRD 22 gt PAPCLKO lt 5 gt 22 33 PAAD lt 21 gt PAPCLKO lt 4 gt 20 PAAD lt PAPCLKO lt 3 gt 19 PAADK 195 PAPCLKO lt 2 gt 124 PAADK 18 gt PAPCLKO lt 1 gt 723 R PAAD 75 PaPCLIKO gt 121 2 i 29932 P54H2_2_PR_PCLK OUD PAAD lt 16 gt 33 PAAD lt 15 gt PRPCTRST E24 2 OUT PAADK 14 gt PAAD lt 13 gt PATRQ lt 15 gt P64He_2_PA_IRQIS sce PAAD lt 12 gt PRTRQ lt 14 gt 4 P64H2_2_PR_TRG14 MK PAAD lt 11 gt PAIRQ lt 13 gt F5 P64H2_ _PR_TRG13 PAAD 1 gt O PATRO lt 12 gt PB4H2_2_PA_IRQ12 m PAAD lt 9 gt PRTRQ lt 11 gt 1 Do P64H2 2 PR IRQG11 PAAD lt 8 gt PATRQ lt 1 gt _ Co P64H2 2 PA IRQ1 sce PRRD
187. a legacy PS 2 keyboard may be required for BIOS setup 1 Connect the network cable s Connect a CatS cable with an RJ 45 connector to the Gigabit Ethernet port Connect the other end of the cable to your network e g hub switch network port Note Standby voltages will be applied to the board whenever AC power is supplied To completely power down the board make sure to unplug the power supply from the wall Depending on how the board was last powered off it may turn on when the AC power is connected with no need to push the power button 14 Connect the power supply Make sure the power supply is turned off and unplugged Connect the three WTX power supply cables to connectors J100 J101 and J102 on the evaluation board Next plug the power cord into the power supply and the wall 15 Power up the system Turn on the monitor then turn on the evaluation board The on board power on off button is located at S8 The on board reset button is located at S9 28 Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel Getting Started Caution Ensure that the fansinks on the processor are operating If they are not turn off the power immediately and verify that the fansinks are connected to the board correctly see Step 6 If the fansinks are still not operating contact your Intel field sales representative or local distributor 2 7 Configuring the BIOS An AMI BIOS is pre loaded on the eval
188. ade Wem wei E H UTOU HEU ED esse vave eose DDR 4 wm cu usuu E T DU LL eee rce eose cade gt SOUS TEL ass oe sace save aE 5 I gt groo asuu e E LED a reez vave rose B gt 4120 gt 1 7 9522 0 H EDZAN M 255 9 0 2929 420 i 8922 5 nie CU Sieb duc 5 i save Z O H 3 f e d 2022 f T i Z ngon Y n WES sazz q gt SES O E 9 Lo OQ QU 2 sazz save resa C O q 2 T sazz aav svsz E220 L gt LJ Ane uM e S O N suze 11 EX Ee 499 hi LJ gt 2 5229 T gt C n Q Bae al ee Laes qez save 1982 u 22802 0 und I ares SED ni 6782 poem ul ANT ANT E dez Lave suse Tod 0 2689 gt M ANT Ant Ant rn sazz saez save vsz a Al A al E 8582 2582 9582 a a ANT ANT eave u 4 u
189. age Intel Xeon Processors Intel E7501 chipset and other system board components and peripheral connectors Also included in the kit are a hard drive power supply and a board component stand Various software and documentation are also included in the kit The evaluation board is shipped as an open system with a stand allowing for maximum flexibility in changing hardware configuration and peripherals in a lab environment Since the board is not in a protective chassis the user is required to observe extra precaution when handling and operating the system Some assembly is required before use Evaluation Board Features The evaluation board features are summarized below CPU e Supports dual Intel Xeon processors with 512 Kbytes of L2 cache and dual Low Voltage Intel Xeon processors Supports 400 533 MHz Processor System Bus PSB at 3 2 4 3 Gbytes s Chipset Intel E7501 chipset RGE7501MC Memory Controller Hub Two Intel 82870P2 PCI PCI X 64 bit Hubs 2 P64H2 Connected to MCH via 16 bit Hub Interface 2 0 HI 2 0 at 1 066 Gbytes s with ECC Supports PCI X to 133 MHz PCI to 66 MHz Intel 82801CA I O Controller Hub 3 ICH3 S Connected to MCH via 8 bit Hub Interface 1 5 HI 1 5 at 266 Mbytes s Built in MAC 8 Mbit 82802AC Firmware Hub FWH PCI 32 5133 MHz Two IDE controllers supporting Ultra ATA 100 66 33 IDE protocol only one connector is available on the evaluation boa
190. al memory in the system If your E7501 system is to be operated with 4 GByte or more of memory this option must be enabled P64H2 Setup PCI X Frequency Control The P64H2 setup section allows some control over the PCI X bus frequencies on the bus segments behind all P64H2 devices in the system The BIOS is pre programmed to cap the frequencies that all PCI X bus segments on the E7501 board can run at In the event that it is desired to control the frequency of the PCI X bus segments each segment is represented by a setup option that can be set according to the following Inte E7501 Scalable Performance Board De velopment Kit User s Manual intel BIOS Overview Table 31 P64H2 Setup Options 5 1 8 5 1 8 1 5 1 8 2 5 1 8 3 Setting Meaning The BIOS will set the frequency of the PCI X bus segment according to the capabilities Auto reported by all devices on the bus segment not to exceed the pre programmed BIOS maximum for that segment 33 The BIOS will program the frequency of the PCI X bus segment to 33 MHz 66 The BIOS will program the frequency of the PCI X bus segment to 66 MHz 100 The BIOS will program the frequency of the PCI X bus segment to 100 MHz 133 The BIOS will program the frequency of the PCI X bus segment to 133 MHz Although the E7501 board only comes populated with two P64H2 devices allowing four PCI X bus segments designated HIB and HID in the setup options the BI
191. ard Gigabit Ethernet controller On board SCSI controller Single floppy controller support Primary IDE interface secondary IDE interface not implemented on board One serial port One parallel port Two USB ports port PS 2 keyboard and mouse ports Please refer to Figure 7 for locations of on board connectors sockets and jumpers and refer to Figure 8 for the locations of the back panel connectors Intel 82544EI Gigabit Ethernet Controller The Intel 82544EI Gigabit Ethernet Controller with integrated PHY is Intel s single chip Gigabit Ethernet solution It supports PCI X up to 133 MHz for faster network performance It is capable of supporting 1000 Mbit s 100 Mbit s and 10 Mbit s data rates To use this controller on the evaluation board utilize the built in RJ 45 port with a Cat5 cable Inte E7501 Scalable Performance Board Development Kit User s Manual 35 Theory of Operation ntel 3 3 4 2 3 3 4 3 3 3 4 4 3 3 4 5 3 3 4 6 3 3 4 7 3 3 4 8 3 3 4 9 3 3 5 36 Adaptec AIC7902 SCSI Controller The Adaptec AIC7902 provides Ultra320 320 Mbytes s SCSI via PCI X 133 MHz There are two on board SCSI connectors each of which will support up to eight SCSI devices For additional information on SCSI refer to Section 4 3 2 Floppy Disk Drive Support One 34 pin floppy connector is provided on the evaluation board which will support up to two floppy drives IDE Device Support
192. asteners instead of the processor retention mechanisms included in the kit The parts part number SP2307 can be ordered from Pencom at 650 593 3288 This should not be considered a recommendation or product endorsement by Intel Corporation Inte E7501 Scalable Performance Board Development Kit User s Manual 23 Getting Started ntel Figure 1 Assembled Board Component Stand Front View Figure 2 Assembled Board Component Stand Top View i Il To attach the board to the stand use the following mounting hardware that is included in your kit 24 Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel Getting Started 38 screws 19 female female standoffs 19 lock washers The kit includes four additional screws that you will use to attach the hard drive to the stand in a later step See Figure 3 for a diagram of the mounting hardware To install the board on the stand use the following steps To avoid damaging the board and stand take caution not to overtighten the screws a Fit a lock washer on one screw and insert it through the bottom of the top shelf of the stand b Using a hex wrench screw the standoff onto the screw from the top of the shelf Repeat for all holes in the shelf c Place the board atop the standoffs lining up the standoffs with the holes in the board If all the holes do not line up correctly loosen the standoffs
193. b 2 P64H2 U45 Intel 82801CA Controller Hub 3 ICH3 S U78 Adaptec AIC7902 SCSI Controller U79 Intel 82544EI Gigabit Ethernet Controller 4 2 Expansion Slots and Sockets Table 6 lists the expansion slots and sockets on the evaluation board Table 6 Expansion Slots and Sockets Slot Socket Description J11 32 33 PCI Slot J12 64 66 PCI X Slot with HI 2 0 Extension Slot D J20 64 133 PCI X Slot Slot 1 Bus A J21 64 100 PCI X Slot Slot 2 Bus B J23 64 66 PCI X Slot Slot A J24 64 66 PCI X Slot Slot B J25 64 66 PCI X Slot Slot C J17 Processor 1 Socket J18 Processor 0 Socket U69 Firmware Hub FWH BIOS Socket BH1 Battery 40 Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel Hardware Reference 4 2 1 32 Bit PCI Slot Connector Table 7 shows the signals assigned to the 32 bit PCI slot connector Table 7 32 bit 5V PCI Connector Pinout J11 Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name A1 TRST B1 12V A32 AD16 B32 AD17 A2 12V B2 TCK A33 3 3V B33 C BE2 A3 TMS B3 GND A34 FRAME B34 GND A4 TDI B4 TDO A35 GND B35 IRDY A5 5V B5 5V A36 TRDY B36 3 3V A6 INTA B6 5V A37 GND B37 DEVSEL A7 INTC B7 INTB A38 STOP B38 GND A8 5V B8 INTD A39 3 3V B39 LOCK A9 CLKRUN B9 PRSNT1 A40 SDONE B40 PERR A10 5V B10 Reserved A41
194. boot ensure that the included hard drive is installed as the primary master Master slave settings are determined by a jumper on each IDE device Consult the device label documentation to verify that the jumper is set correctly for any configuration you choose A CD ROM drive or additional hard drive may be installed as a primary slave device To install the included hard drive on the evaluation board a Verify that the jumper on the hard drive is set correct for single or master depending on your configuration b Connect the short end of the IDE cable to the IDE connector J16 on the board Ensure that the tracer on the cable is aligned with pin 1 of the connector c Connect the middle connector of the cable to the hard drive Again ensure that the cable tracer is aligned with pin 1 of the connector Note Failure to properly align the IDE cable may damage the evaluation board and or the hard drive d Connect a large 4 pin power connector from the power supply to the hard drive Inte E7501 Scalable Performance Board Development Kit User s Manual 27 Getting Started ntel e Install the CD ROM drive optional CD ROM drive is not included in the kit and is not required but you may find it useful in loading additional software You must furnish your own CD ROM drive To install it on the evaluation board Verify that the jumper on the CD ROM drive is set for slave Connect the unused end of the IDE cabl
195. c AIC7902 SCSI Controller on the evaluation board Connector J37 is for Channel A and connector J38 is for channel B Each channel will support up to 15 SCSI devices The SCSI controller supports speeds up to Ultra 320 and you must use a cable at least as fast as the devices you wish to support on a given channel A terminator is required on each channel Each device on a channel must have a unique SCSI ID 0 15 Table 14 68 pin Single Ended Low Voltage Differential SCSI Connector Pinout J37 J38 Pin Signal Name SE LVD Pin Signal Name SE LVD 1 SR DB12 35 DB12 DB12 2 SR DB13 36 DB13 DB13 3 SR DB14 37 DB14 DB14 4 SR DB15 38 DB15 DB15 5 SR DBP1 39 DBP1 DBP1 6 SR DBO 40 080 080 7 SR DB1 41 DB1 DB1 8 SR DB2 42 DB2 DB2 9 SR DB3 43 DB3 DB3 10 SR DB4 44 DB4 DB4 11 SR DB5 45 DB5 DB5 12 SR DB6 46 DB6 DB6 13 SR DB7 47 DB6 DB6 14 SR P_CRCA 48 DBP P_CRCA 15 GND GND 49 GND GND 16 DIFFSENSE 50 GND GND 17 TPWR TPWR 51 TPWR TPWR 18 TPWR TPWR 52 TPWR TPWR 19 Reserved Reserved 53 Reserved Reserved 20 GND GND 54 GND GND 21 SR ATN 55 ATN ATN 22 GND GND 56 GND GND 23 SR BSY 57 BSY BSY 24 SR ACK 58 ACK ACK 25 SR RST 59 RST RST 26 SR MSG 60 MSG MSG 27 SR SEL 61 SEL SEL 28 SR C D 62 C D C D 29 SR REQ 63 REQ REQ 30 SR I O 64 O l O 31 SR DB8 65 DB8 DB8 32
196. ce Board Development Kit User s Manual 45 Hardware Reference 46 Table 12 WTX Additional Power Connector J101 Pin Signal Name Function 1 5 VsENsE 5 V power supply sense line 2 3 3VsENsE 3 3 V power supply sense line 3 Reserved 4 com Ground 5 com Ground 6 12Vio 7 12V 8 Clock signal for IC interface 9 FanC Signal to control fan speed in power supply 10 PS OK Signal indicating all power supply outputs are within limits 11 Reserved 12 5 VsENsE RTN Return path for 5 V power supply sense line 13 3 3VsENsE Return path for 3 3 V power supply sense line 14 Reserved 15 com Ground 16 12 17 12 18 Sleep 19 data Data signal for interface 20 FanM Signal indicating fan speed status in power supply 21 PS on Signal to enable disable power supply 22 Reserved Table 13 WTX 12 VRM D2D Output Power Connector J102 Pin Signal Name Function 1 12Vple 12 V digital 2 12Vpie 12 V digital 3 12Vpie 12 V digital 4 Reserved 12 V power supply digital sense line 5 com Ground 6 com Ground 7 com Ground 8 Reserved Return path for 12 V power supply digital sense line Inte E7501 Scalable Performance Board De velopment Kit User s Manual n Hardware Reference 4 3 2 SCSI Connectors Table 14 shows the signals assigned to the two SCSI connectors for the Adapte
197. censes Customers using tools that work with other third party products must have licensed those products Any targets created by those tools should also have appropriate licenses Software included in the kit is subject to change Refer to http developer intel com design intarch devkits for details on additional software from other third party vendors Embedded BIOS The evaluation board is pre installed and licensed with a copy of AMIBIOS8 developed by Intel Refer to Chapter 5 for a detailed product description and instructions on using the BIOS setup Inte E7501 Scalable Performance Board De velopment Kit User s Manual In 2 4 2 2 4 2 1 Getting Started Operating Systems Wind River Tornado Development Platform Wind River introduces Tornado Development Platform the optimized solution for the Intel E7501 Scalable Performance Board Development Kit The Tornado Development Platform includes VxWorks the most widely adopted real time operating system RTOS in the embedded industry as well as Tornado Tools a comprehensive suite of core and optional cross development tools and utilities and a full range of communications options for the target connection to the host VxWorks is flexible with more than 1800 powerful application program interfaces APIs scalable from the simplest to the most complex product designs reliable used in mission critical applications ranging from anti lock braking systems to inter planeta
198. chematics for selected connectors and subsystems for the evaluation board About This Manual 1 2 intel Text Conventions The following notations may be used throughout this manual Variables Instructions Numbers Units of Measure A Gbyte GHz Kbyte KQ mA Mbyte MHz mW ns pF us The pound symbol appended to a signal name indicates that the signal is active low Variables are shown in italics Variables must be replaced with correct values Instruction mnemonics are shown in uppercase When you are programming instructions are not case sensitive You may use either upper or lowercase Hexadecimal numbers are represented by a string of hexadecimal digits followed by the character H A zero prefix is added to numbers that begin with A through F For example FF is shown 0FFH Decimal and binary numbers are represented by their customary notations That is 255 is a decimal number and 1111 1111 is a binary number In some cases the letter B is added for clarity The following abbreviations are used to represent units of measure amps amperes gigabytes gigahertz kilobytes kilo ohms milliamps milliamperes megabytes megahertz milliseconds milliwatts nanoseconds picofarads watts volts microamps microamperes microfarads microseconds Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel About This Manual LW mic
199. cifications and before placing your product order Copies of documents which have an ordering number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or by visiting Intel s website at http www intel com AlertVIEW AnyPoint AppChoice BoardWatch BunnyPeople CablePort Celeron Chips CT Connect CT Media Dialogic DM3 EtherExpress ETOX FlashFile Hyper Threading 1386 i486 i960 iCOMP InstantIP Intel Intel logo Intel386 Intel486 Intel740 IntelDX2 IntelDX4 IntelSX2 Intel Create amp Share Intel GigaBlade Intel InBusiness Intel Inside Intel Inside logo Intel NetBurst Intel NetMerge Intel NetStructure Intel Play Intel Play logo Intel SingleDriver Intel SpeedStep Intel StrataFlash Intel TeamStation Intel Xeon Intel XScale IPLink Itanium LANDesk LanRover MCS MMX MMX logo Optimizer logo OverDrive Paragon Dads PC Parents PDCharm Pentium Pentium Xeon Pentium Xeon Performance at Your Command RemoteExpress Shiva SmartDie Solutions960 Sound Mark StorageExpress The Computer Inside The Journey Inside TokenExpress Trillium VoiceBrick Vtune and Xircom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries Other names and brands may be claimed as the property of others Copyright Intel Corporation 2003 2 Inte E7501 Scalable Performance Board Development Kit User
200. d kernel object management Stack overflow detection Advances in the host development environment include a new multitasking debugger as the standard Tornado debugger a new operating system object inspector replacing the browser enhancements throughout the IDE and command line to support the development of protection domains within VxWorks AE simplification of host target access management and various other improvements in the host GUI Inte E7501 Scalable Performance Board Development Kit User s Manual 17 Getting Started 2 4 2 2 Tornado 3 and Tornado AE offer Intel Xeon processor and Hyper Threading technology support 36 bit addressing Shared memory object Integrated booting strategy so users can create boot images in MP environment Industry accepted wind microkernel Protection domain management Resource tracking and management System overrun protection Powerful loader facilities Efficient deterministic task management Fast interrupt and exception handling Optimized floating point support Dynamic memory management Networking support including large network stacks to choose from Fast flexible I O and local file system Advanced integrated Tornado tools development environment For more information refer to the Wind River documentation included in the development kit QNX Realtime Platform RTP Built from over 20 years of expertise in RTOS development the QNX Realtime OS a core technology o
201. deep which keeps it executing instructions all the time The execution unit can view 126 instructions in flight and up to 48 loads and 24 stores in the pipeline Thanks to an advanced branch prediction algorithm the number of branch mis predictions has been reduced 33 over the P6 generation Enhanced Floating Point and Multimedia Engine The floating point registers have been expanded to a full 128 bits and an additional register has been added for data movement This improves performance of floating point and multimedia applications Streaming SIMD single instruction multiple data Extensions 2 SSE2 SSE2 extends the SIMD capabilities in MMX by introducing 144 new instructions which reduces the number of instructions required to execute particular program tasks thereby increasing performance This accelerates a broad range of applications including video speech image processing encryption and financial engineering and scientific applications The Intel Xeon processor and Low Voltage Intel Xeon processor also feature Hyper Threading Technology which provides two logical processors in one physical package Hyper Threading increases the performance of multi tasking and multi threaded applications achieving up to a 24 increase in performance The two logical processors have their own architectural state data registers segment registers control registers debug registers and most model specific registers fetch and deliver unit
202. e for download from AMT s website http www ami com support doclib cfm Fatal Error Codes Some memory configurations may cause the system to stop because the BIOS can no longer function These conditions are specific to the E7501 board adaptation and are not documented with the reset of the POST codes in the AMI documentation The following table details the possible board specific fatal error codes that may be observed Inte E7501 Scalable Performance Board De velopment Kit User s Manual BIOS Overview Table 32 Board Specific Fatal Error Codes POST Code Name Description E1 Memory Not Present Make sure memory is populated in the system If memory has been populated in the system it is possible that the BIOS to skipped DIMMs that are not valid for the current board configuration and had no valid DIMMs to initialize E2 Memory Type Mismatch Memory has been placed in the system that is not Registered ECC x72 DDR Check all DIMMs E3 Memory Width Error The silicon on the board doesn t support the DRAM width of one of the DIMMs populated on the board Check the width of all DIMMs and replace any non supported DIMMs E4 Memory Channel Mismatch At least one DIMM pair channel A and channel B do not match or only one DIMM is populated in the socket pair EA Memory Timing Error At least one DIMM has been placed in the system that is not fast enough to run in the current config
203. e three 12V fan connectors on the evaluation board Use connectors J53 and J52 for the CPUO and CPU1 fansinks respectively If you install another 12V fan or fansink on your evaluation board you may use the auxiliary fan connector J51 4 3 8 BMC Connector The evaluation board contains a baseboard management controller BMC connector used in validation The following pins must be shorted with jumpers for proper system operation 5 6 7 8 9 10 17 18 19 20 29 30 4 4 DDR SDRAM Slots The evaluation board contains eight DIMM slots for DDR SDRAM Table 18 DDR SDRAM Slots DDR SDRAM Slot Description J1 DIMM 1 Channel B J2 DIMM 1 Channel A J7 DIMM 2 Channel B J3 DIMM 2 Channel A 99 DIMM 4 45 DIMM 4 Channel The six DIMM slots parallel on two channels dual channel configuration you must populate channels and together with identical DIMMs starting at the outermost DIMM slots those furthest from 066 For example you must populate slots 75 and 79 DIMM 4 on Channels A and B first and they must contain memory of exactly the same type and size You would next populate slots J4 and J8 Pairs of DIMM slots may differ in size You may use DIMMs of 128 Mbytes through 2 Gbytes All DIMMs must be ECC registered memory Do not mix component types you must use all x4 or all x8 DIMMs on the evaluation board For a single channel support you must popu
204. e you already attached to the evaluation board to the CD ROM drive Ensure that the cable tracer is aligned with pin 1 of the CD ROM drive connector Connect a large 4 pin power connector from the power supply to the CD ROM drive f Install the floppy drive optional A floppy disk drive is not included in your kit and is not required but you may find it useful in loading additional software You must furnish your own floppy drive s and cable To install a floppy drive on the evaluation board Connect the floppy cable to the floppy connector 134 Ensure that the tracer on the cable is aligned with pin 1 of the connector Connect the other end of the floppy cable to the floppy drive Connect a power cable to the floppy drive Ensure that the tracer on the cable is aligned with pin 1 of the connector g Install storage devices on the stand Screws are included only for the hard drive Place the devices on the stand as shown in Figures 1 and 2 Insert screws through the bottom of the stand into the holes on the bottom of each device 11 Connect the monitor Connect the monitor cable to the VGA port 1 N Connect the keyboard and mouse Connect a PS 2 mouse and keyboard to the stacked PS 2 connector on the evaluation board The bottom connector is for the mouse and the top is for the keyboard Alternatively you can plug a USB keyboard and a USB mouse into one or both of the USB connectors on the evaluation board Note that
205. ed I O which can be connected to a P64H2 The system bus used to connect the processor with the E7501 chipset utilizes 400 533 MT s transfer rate for data transfers delivering 3 2 4 3 Gbytes s The E7501 chipset architecture supports a 144 bit wide 200 266 MHz DDR memory interface also capable of transferring data at 3 2 4 3 Gbytes s In addition to these performance features E7501 chipset based platforms also provide the RASUM Reliability Availability Serviceability Usability Manageability features required for entry level and mid range servers These features include Intel x4 SDDC with StrongARM Technology for memory ECC for high performance I O out of band manageability through SMBus target interfaces on all major components memory scrubbing and auto initialization processor thermal monitoring and hot plug PCI Intel Xeon Processor The Intel E7501 chipset is coupled with these Intel Xeon processors ntel Xeon processor with 512 Kbytes L2 cache 533 MHz system bus with a VID of 1 5 V and a TDP of 65 W at 2 4 GHz Low Voltage Intel processor with a VID of 1 3 V and a TDP of 30 W at 1 6 GHz This generation of processors delivers performance levels that are significantly higher than previous generations of IA 32 processors The Intel Xeon processor supports a 3 2 4 3 Gbytes s data transfer rate on the processor system bus PSB and has 512 Kbytes of L2 cache Uni or dual processor support is available
206. eripheral Connectors Parallel Port Gigabit Ethernet VGA A9622 01 53 Hardware Reference ntel 4 7 1 Dual Stacked USB Connector Table 25 shows the signals assigned to the dual stacked USB connector Table 25 USB Connector Pinout Pin Signal 1 5 Power fused 2 6 USBP0 USBP1 3 7 USBP0 USBP1 4 8 Ground 4 7 2 PS 2 Style Mouse and Keyboard Connectors Table 26 shows the signals assigned to the PS 2 style keyboard and mouse connectors The keyboard port is on the top and the mouse port is on the bottom Table 26 PS 2 Style Mouse and Keyboard Pinout Pin Signal 1 7 Data 2 8 Reserved 3 9 Ground 4 10 5 V fused 5 11 Clock 6 12 Reserved 4 7 3 VGA Port Table 27 shows the signals assigned to the VGA port Table 27 VGA Port Signals Sheet 1 of 2 Pin Signal Red Green Blue Ground Ground Analog Ground Analog Ground Analog Ground Ground Ground Reserved DDC Data o N 8 N E 54 Inte E7501 Scalable Performance Board De velopment Kit User s Manual n Hardware Reference Table 27 Port Signals Sheet 2 of 2 Pin Signal 13 Horizontal Sync 14 Vertical Sync 15 DDC Clock 4 7 4 Parallel Port Table 28 shows the signals assigned to the parallel port connect
207. f the QNX RTP provides a powerful massively scalable reliable foundation for embedded systems QNX Realtime OS offers the following features Flash File System Manager Features wear leveling on the fly decompression random writes fault recovery and other characteristics unique to implementing a file system in flash memory CD ROM File System Manager Implements the ISO 9660 Rock Ridge media standard and allows CD ROMs and DVDs to be readily used CIFS File System Manager Implements the Microsoft Common Internet File System standard and allows Windows network file access NFS File System A popular network file system for enterprise wide heterogeneous networking NFS lets you transparently access files on most UNIX and Linux systems and many non UNIX systems including Windows Choice of TCP IP Stacks QNX gives you a choice of TCP IP stacks Choose the Tiny TCP Manager which provides a small implementation of TCP IP including ftp ftpd telnet telnetd and more Tiny TCP also supports PPP and 802 3 networking Or you can use the full BSD 4 4 stack which adds features such as routing IP filtering and multicasting USB Stack Featuring hot swap and plug and play capabilities this bus standard provides a low cost method for adding peripheral devices to your system The QNX RTOS implementation follows the USB 1 1 specification and supports OHCI and UHCI chips Inte E7501 Scalable Performance Board De velopment Kit User s Ma
208. gE 8 E RED LED indicating no external connected B1248 01 Flashing red LED CR6 shows that the supplemental power is not connected to the board and is holding the board in reset Inte E7501 Scalable Performance Board Development Kit User s Manual 65 P64H2 Riser Card ntel 6 2 Hardware Installation The P64H2 Riser Card hardware includes a steel bracket designed to support the weight of PCI PCI X cards connected to the riser card Refer to Figure 7 Board Layout Diagram on page 39 and follow these steps to install the hardware 1 Attach a free hard drive power cable 12 V and 5 V to the back of the riser card Note Without a power supply attached to card the system will be held in reset 2 Insert one two or three PCI PCI X cards into the slots on the riser card See item on Figure 11 Figure 11 Inserting PCI PCI X Cards into the Slots on the Riser Card 66 E7501 Scalable Performance Board Development Kit User s Manual i ntel P64H2 Riser Card 3 If you are using slots J24 or J25 on the evaluation board insert PCI PCI X cards into those slots before installing the P64H2 Riser Card as shown item 2 of Figure 12 If you are using slot J23 ensure that this slot is empty until step 6 of this installation procedure 4 Plug the P64H2 Riser Card into slot J12 of the evaluation board the largest slot on the board See item 3 in Figure 12 N
209. gnals and scheduling It can also be smoothly extended to support POSIX message queues file systems networking and other OS level capabilities with off the shelf service providing modules The QNX RTOS architecture offers unprecedented scalability You can link your application code directly against the QNX Neutrino microkernel to create a single multi threaded image for small embedded systems as you would with a realtime executive Or you can run the process manager for all the advantages of a full process model and the ability to add thousands of applications all running in MMU protected memory Or applications can be run over a distributed network of SMP clusters for the ultimate in large scale configurations Whatever your configuration tiny medium massive or distributed recoding is never an issue since the API remains consistent throughout QNX Neutrino is the world s first microkernel engineered from the ground up for the latest POSIX 1003 1 standards and drafts including realtime and thread options QNX Neutrino s POSIX implementation means portability of your application code and your software developers Programmers familiar with UNIX or Linux won t need any training to feel right at home in this POSIX environment This built in POSIX compatibility also comes without the penalty of extra code Even after the process manager is added to include services like process creation pathname space management and memory protectio
210. ivers protocols and Qnet Embeddable QNX File System Manager Provides essential services including hard links long file names etc of a POSIX 1003 1 file system in a low overhead implementation Before You Begin Table 2 lists additional hardware you may need for your development kit Table 2 Additional Hardware Sheet 1 of 2 Monitor You can use any standard or greater resolution monitor Keyboard You can use a keyboard with a PS 2 style connector or adapter Mouse You can use a mouse with a PS 2 style connector or adapter You can connect up to two IDE devices to the evaluation board One IDE hard drive and IDE Devices cable are included in your kit The cable accommodates the included hard drive and one other IDE device such as a CD ROM drive or another hard drive There are two on board SCSI connectors one for each channel Each connector will SCSI Devices support up to 15 SCSI devices No SCSI devices or cables are included in the development kit For additional information on SCSI refer to Section 4 3 2 Floppy Drive You can connect up to two floppy drives to the connector on the evaluation board No floppy drives or cables are included in the development kit You can use the on board video adapter supplied with your kit or you may install your own Video Adapter PCI video adapter You must procure and install the correct drivers for any additional video adapters
211. late channel A 50 Inte E7501 Scalable Performance Board De velopment Kit User s Manual 4 5 Jumpers Hardware Reference The evaluation board has a number of jumpers that control various functions of the system Refer to Table 19 for descriptions of the jumpers and their settings Table 19 Jumpers Sheet 1 of 2 Reference Designator Functional Description Settings NOTE For groups of jumpers with multiple options the default setting is noted with italics Open default Normal mode Shorted Forces processors to operate at lowest internal JP1 Safe Mode frequency For debug only Refer to the Intel 82801CA I O Controller Hub 3 ICH S Datasheet order number 290733 for more information Open default Normal mode Shorted The ICH3 supports a Top Block Swap mode wherein the ICH3 swaps the top block the boot block in the FWH with JP2 Top Swap another location This allows for safe update of the boot block Refer to the Intel 82801CA I O Controller Hub 3 ICH S Datasheet order number 290733 for more information Short 1 2 One processor Short 2 3 Two processors JP3 ITP Select inia Use the appropriate setting for the number of processors populated on the evaluation board Short 1 2 default Normal mode JP4 CMOS Clear Short 2 3 To clear all CMOS settings power down short pins 2 3 for several minutes move the jumper back to 1 2 and b
212. lowing documents are available to overview the high level features of AMIBIOSS Amibios8 pdf AMIBIO8Brochure pdf AboutAMIBIOSS pdf These files and others are also available for download from AMI s website http www ami com support doclib cfm 5 1 Power On and Configuration 5 1 1 Power On Upon power on the E7501 BIOS will initialize the board hardware and peripherals communicating its progress by writing status codes to an I O port 80h These status codes may be monitored by installing a POST diagnostic card in the short debug PCI slot Documentation on the status codes that are sent to port 80h is available in the file AMIBIOS codes pdf This file can be downloaded from AMT s website http www ami com support doclib cfm After most of the hardware has been configured including video whether it be on board or PCI the user is presented with a splash screen This splash screen displays the following information BIOS information such as build time and version e CPU configuration Number of CPUs in the system Speed of the CPUs Brand string Family Model Stepping Microcode update loaded of memory is then tested and the progress of the test is displayed on the screen This memory test may be skipped by pressing the lt ESC gt key at any time during the test Following the memory test IDE devices are detected If CMOS memory has been corrupted or is otherwise invalid you will
213. lt 126 gt 2 CC lt 1265 lt 45 i UCC 169 GND lt 175 A24 GND lt 125 gt UCC 125 GND 174 We GND lt 124 gt CC lt 124 gt UCC 167 GND lt 173 GND 123 GND 42 9 ECLA 3 EE CC lt 123 gt 2 UCC lt 166 GND lt 172 GND lt 1225 GND lt 41 gt e Bei Did BS UCC lt 122 gt UCC 165 GND lt 171 GND lt 121 gt GND lt 40 o0 3 GND lt 128 UCC 121 UCC lt 164 gt GND 17 gt UCC lt 12 gt 05 GND 169 GND lt 119 gt 929 UCC lt 119 gt 3 GND 168 GND lt 118 gt GND lt 117 gt GND lt 116 gt UCC 118 3 UCCZUTT 9 GND 167 7 T 025 CC lt 11 gt UCCZUTT 8 GND 166 GND lt 115 GND lt 114 gt GND lt 113 GND lt 1425 0 0 UCC 116 35 p UCCZUTT 7 GND 165 3 UCC lt 115 gt 3 UCC UTT lt 6 gt GND lt 164 UCC 114 3 lt lt gt CND lt 163 US UCC lt 113 gt 32 UCC UTT lt 4 gt UCC lt 112 gt 3 0 3 UCC UTT lt 3 gt UCC lt 111 gt 3 C UCC UTT lt 2 gt UCC lt 11 gt QU l UCCZUTT 1 0 GND lt 112 gt GND lt 111 gt GND lt 11 gt EMEN UCC 189 5 UCC 108 lt 9 9 el NS AD UCC
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216. mm 2500 lt 18 E gt EOL GA gecon lt 18 D gt oor w H ocon usuu lt 18 96 uHuu lt 18 CD eoram y H EEOT lt 18 gt H CHO lt 182 gt ST 2 H BE 187 gt E EHO 187 GED gt aada g ZE 187 gt s 187 gt 187 96 s ESOT usuu lt 18 y 182 gt LJ Y 2 on MEE E go semen pozz vace vave sg B 5 on i X ezee 0 24 vaez al AAA n N
217. n a QNX based system is extremely small and efficient which is crucial for ROMable systems Conventional RTOSs use a single flat memory architecture where hard to detect programming errors like corrupt C pointers can cause programs to overwrite each other or the kernel The inevitable result is system failure A QNX based system however can intelligently recover from software faults even in drivers and other critical programs without rebooting because every OS component runs in its own MMU protected address space More importantly because of the QNX RTOS s design full MMU protection does not come at the expense of performance With fast context switch speeds and low latencies QNX delivers reliable realtime performance Inte E7501 Scalable Performance Board Development Kit User s Manual 19 Getting Started ntel Ever evolving standards and changing customer demands can shorten the life cycle of your product With QNX you can dynamically upgrade and maintain your product in the field Since all drivers applications and OS modules reside in their own memory protected space you can easily add new features or fix problems without interrupting service With QNX micronetworking Qnet you can transparently access any resource in your system local or remote Qnet extends the message based architecture of the QNX RTOS integrating your entire network into a single homogeneous set of resources Even the smallest memory constrained device
218. ntel 3 3 2 2 3 3 2 3 34 Intel 82801CA I O Controller Hub ICH3 S The Intel 82801CA ICH3 S provides the legacy I O subsystem for E7501 chipset based platforms Additionally it integrates many advanced I O functions The ICH3 S includes the following features Provides HI 1 5 Connection to MCH 266 Mbytes s point to point connection for ICH3 S with parity protection 8 bit wide 66 MHz base clock 4X data transfer Parallel termination mode for longer trace lengths 64 bit inbound addressing 32 bit outbound addressing Two Channel Ultra ATA 100 Bus Master IDE Controller only one channel is utilized on the board Three Universal Host Controller Interface UHCI USB host controllers capabilities for six ports only two ports are provided on the board SMBus 2 0 Controller LPC Interface AC 97 2 2 Interface audio capabilities are not utilized this board PCI 2 2 Interface 32 bit 33 MHz Integrated 10 100 Mbit Ethernet MAC not utilized on the board Intel 82870P2 PCI PCI X Hub 2 P64H2 The P64H2 provides the PCI X high performance I O capability on E7501 chipset based platforms The P64H2 component includes 2 0 Connection to 1 066 Gbytes s point to point connection for I O bridges with ECC protection 16 bit wide 66 MHz base clock 8x data transfer Parallel termination mode for longer trace lengths 64 bit inbound addre
219. nual In tel Getting Started PCI Device Manager Provides PCI services for all managers in your system The PCI Manager makes it possible to transparently access all PCI services Serial Manager Provides standard POSIX TTY device control while supporting extensions for efficient realtime protocol management PCMCIA CardBus Server Ideal for small rugged memory constrained devices such as digital cameras the PCMCIA CardBus standard is fully supported under the QNX RTOS The server manages host resources memory windows I O ports and IRQs and provides utilities to start and stop processes as cards are inserted and removed to display server status and to show card CIS data QNX Networking Infrastructure Platform This platform is a comprehensive suite of tools and protocol stacks for OEMs building IP optical and storage networking equipment It includes Qnet micronetworking for network distributed applications symmetric multiprocessing SMP QNX High Availability Toolkit QNX System Analysis Toolkit plus support for a rich suite of protocol stacks MPLS OSPE etc and tools modeling software measurement etc Microkernel Architecture at its Best Tiny yet powerful the QNX Neutrino microkernel lies at the heart of the QNX RTOS Neutrino delivers core realtime services for embedded applications including message passing POSIX thread services mutexes condition variables semaphores si
220. oot the system Open default Normal TCO timer reboot functionality reboot JP7 No Reboot after second timeout Short Disables TCO timer system reboot feature J19 Test Header Used during manufacturing only Open All blocks write enabled hort 1 2 default Top block wri i J27 FWH Write Protect Short default Top ock write protected Short 3 4 Blocks 2 8 write protected Short 1 2 and 3 4 All blocks write protected JP24 JP25 JP26 JP27 Mode MHz Open Open Open Open PCI X 133 ion p PCI X Slot 1 Bus Mode Short Open Open Open PCI X 100 dem der Short Open Short Open PCI X 66 Short Short Short Open PCI 66 Short Short Short Short PCI 33 JP28 JP29 JP30 Mode MHz Open Open Open PCI X 100 JP28 JP29 JP30 PCI X Slot 2 Bus B Mode Open Open Short PCI X 66 Open Short Short PCI 66 Short Short Short PCI 33 Inte E7501 Scalable Performance Board Development Kit User s Manual 51 Hardware Reference n Table 19 Jumpers Sheet 2 of 2 Reference Designator Functional Description Settings JP31 JP32 JP35 Mode MHz PCI X 133 ub cm SCSI PCI PCI X Mode Open Short Open PCI X 100 Open Short 1 2 PCI X 66 Open Short 2 3 66 Short Short 2 3 PCI 33 JP33 JP34 Mode MHz JP33 JP34 PCI X Slots Mode Open Open PCI X 66 Open Short 66 Short Short PCI 33 J36 Test Header Used for validation purposes only JP38 SM
221. opment Kit User s Manual ntel 2 Schematics Voltage regulators reset control CK 408B FWH LPC connector debug SIO Legacy LAN SCSI Front panel connector BMC connector SMBus mux logic Spare gates mounting holes Inte E7501 Scalable Performance Board Development Kit User s Manual 89 DUAL INTEL XEON PROCESSOR E7501 CHIPSET EVALUATION KIT BOARD SCHEMATICS REV SUBJEC O CHANG SC ATICS ARI PROVIDED AS ARRAN S ATSOLEVER NCLUDING ANY ANTY OF MERCHANTABILITYs FITNESS UR ARTICULAR JRPOSE OR ANY WARRANTY RWISE ARISING OUT OF PROPOSAL SPEC OR 5 RMATION I 5 DOCUMEN S PROVIDED IN CONNECTION WITH INTE PRODUCTS NO SEs EXPRESS OR IMPI BY ESTROPPI OR lt ERWISE ANY INTELLECTURL PROPERTY S IS GRA BY THIS DOCUM CEPT AS PROVIDED IN PEL S TERMS AND CONDITIONS SA FOR SUCH PRODUCTS ASSUMES AB LIY WHATSOEVER AND INTI SCLAIMS ANY EXPRESS OR IMP 1 Y NG TO SALE ANDZOR USE 0 NTE SLUDING LIABILITY OR S RELATING TO LINESS FOR A PARTICULAR ASS RCHAN TAB OR INFRINGM 1 OR OTHER D ROPERT RIGHT ARE NOT NTENDED FOR US JICA OR SUSTAINING APPLICATIONS NII MAY CHANGES SPECTF LEAT EONS 1 PTIONS AT ANY OU INTE CORPORATION JOCUMENT
222. or Table 28 Parallel Port Connector Pinout Pin Signal Pin Signal 1 Strobe 14 Auto Feed 2 Data Bit 0 15 Fault 3 Data Bit 1 16 INIT 4 Data Bit 2 17 SLC IN 5 Data Bit 3 18 Ground 6 Data Bit 4 19 Ground 7 Data Bit 5 20 Ground 8 Data Bit 6 21 Ground 9 Data Bit 7 22 Ground 10 ACK 23 Ground 11 Busy 24 Ground 12 Paper end 25 Ground 13 SLCT Inte E7501 Scalable Performance Board Development Kit User s Manual 55 Hardware Reference ntel 4 7 5 Serial Ports Table 29 shows the signals assigned to the serial port connector Table 29 Serial Port Connector Pinout Pin Signal DCD Serial In SIN Serial Out SOUT DTR Ground DSR RTS CTS RI N 4 7 6 Gigabit Ethernet RJ 45 Connector Table 30 shows the signals assigned to the gigabit Ethernet RJ 45 connector CatS cable with an RJ 45 connector is required to connect this Ethernet adapter to your network Table 30 Gigabit Ethernet RJ 45 Connector Pinout Pin Signal Data 0 Data 0 Data 1 Data 1 Data 2 Data 2 Data 3 Data 3 56 Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel BIOS Overview BIOS Overview 5 The E7501 BIOS was created using AMIBIOS8 technology created by AMI The fol
223. ote Plug PCI PCI X cards into the evaluation board first then plug in the Riser Card Figure 12 Installing the P64H2 Riser Card Inte E7501 Scalable Performance Board Development Kit User s Manual 67 P64H2 Riser Card ntel 5 Install the P64H2 steel bracket by first attaching it to evaluation board baseboard using 1 6 32 x 3 8 screw 1 6 32 nut and 1 6 32 washer See item 4 in Figure 13 6 Attach the faceplates of the PCI cards to the bracket using 3 6 32 x 3 8 screws as shown in item 5 of Figure 13 Figure 13 Installing the Bracket 68 Inte E7501 Scalable Performance Board Development Kit User s Manual i ntel P64H2 Riser Card 7 If you are using slot J23 you can insert a PCI PCI X card by sliding it through the bracket enclosure and plugging it into the evaluation board See item 6 in Figure 14 Note When possible assemble any PCI PCI X cards to the mainboard before attaching the P64H2 riser card Figure 14 Inserting the PCI PCI X Card into Slot J23 6 3 Hardware Configuration 6 3 1 Jumper Settings There are two sets of jumpers that control the speed of the PCI X buses Table 33 describes the jumper settings for Channel A one 133 MHz slot and Table 34 describes the jumper settings for Channel B two 100 MHz slots Table 33 Channel A Jumper Settings J1 JP1 JP2 Frequency No Jumper Jumper Default 66 MHz Jumper Jumper 33 MHz
224. pave v ve voez pave vave voez vaez 2212 adve suse adve Suse save vuse 2212 save adve Save save Save Save SOEE Save vose saez Save use Save vose Save sag Save eotz vose Save sag sos Save adve Suez adve sos adve Suez Sos adve Suez sos adve SnEg ose adve adve SUEZ adve adve Suez aaez vuse adve Suez 9972 adve adve 9972 vuse sag adve 9972 adve Suez adve 9972 adve SnEg 9972 av Saez 2212 Love Suez 9972 Love Lave LEZ
225. rd Inte E7501 Scalable Performance Board De velopment Kit User s Manual intel Getting Started Memory Support Two channel DDR 200 266 memory interface at 3 2 4 3 Gbytes s bandwidth four slots per channel Registered ECC memory only Two to six DDR 1600 1200 DIMMs 256 Mbytes to 12 Gbytes total memory the system has been validated with up to 6 Gbytes of memory Flash System BIOS ROM AMI system BIOS Power Supply WTX power supply System I O On board Intel 82544EI Gigabit Ethernet controller On board Adaptec AIC7902 SCSI controller On board video with one built in VGA connector One floppy connector supporting one floppy drive One Ultra ATA 100 66 33 IDE connector supporting up to two IDE devices One built in 16550 fast UART compatible serial port connector Built in Standard EPP ECP parallel port connector Two built in Universal Serial Bus USB connectors Built in PS 2 keyboard and PS 2 mouse 6 pin mini DIN connectors Peripheral Connectors One 64 bit 133 MHz PCI X slot One 64 bit 100 MHz PCI X slot Four 64 bit 66 MHz PCI X slots one contains a HI 2 0 extension One 32 bit 33 MHz PCI slot for debug and legacy support only 2 3 Included Hardware The following hardware is included in the development kit Board component stand and mounting hardware Evaluation board baseboard with battery WTX power supply BIOS Image from AMI FWH installed on board Inte E7501 Scalable Performance Board
226. rd measures 9 00 x 7 50 Note The figure is not drawn to scale 64 Inte E7501 Scalable Performance Board De velopment Kit User s Manual P64H2 Riser Ca Figure 10 P64H2 Riser Card Topology Note rd RISER CARD Copyright 2002 s nn a OM noon ri rn c rn d Sie 100MHz pears 133MHz la 1 ne muna m m m Ser 1 aa Intel P64H2 Controller B E E PJ5 5 ln 5 Intel F P64H2 2 Controller E SESE 5 2B AE External onoono he e Power mE I 1 HH 12 and i 1 e a one NOT FCC APPROVED INTEL CONXIDENTIAL
227. rowatts Signal Names Signal names are shown in uppercase When several signals share common name an individual signal is represented by the signal name followed by a number while the group is represented by the signal name followed by a variable n For example the lower chip select signals are named CSO CS1 CS2 and so on they are collectively called CSn A pound symbol appended to a signal name identifies an active low signal Port pins are represented by the port abbreviation a period and the pin number e g P1 0 Intel E7501 Scalable Performance Board Development Kit User s Manual 11 About This Manual ntel 1 3 1 3 1 1 3 1 1 1 3 2 1 4 Technical Support Electronic Support Systems Intel s site on the World Wide Web http www intel com provides up to date technical information and product support This information is available 24 hours per day 7 days per week providing technical information whenever you need it Online Documents Product documentation is provided online in a variety of web friendly formats at http developer intel com design intarch Additional Technical Support If you require additional technical support please contact your field sales representative or local distributor Product Literature You can order product literature from the following Intel literature centers 1 800 548 4725 U S and Canada 708 296 9333 U S from overseas 44 0 1793 431155 Europe
228. ry exploration compatible with numerous industry standards and available on all popular CPU platforms The VxWorks RTOS comprises the core capabilities of the wind microkernel along with advanced networking support powerful file system and I O management and C and other standard run time support These core capabilities can be combined with add on components available from Wind River and its more than 600 WindLink partner companies Tornado AE includes VxWorks AE a new protected operating system as well as Tornado Tools 3 0 significant advances in the Tornado host development environment and host target middleware Foremost among the VxWorks AE enhancements is the introduction of protection domains an MMU based feature of the kernel that provides for several types of protection against unintentional mistakes or errant code A protection domain may be thought of as a container for code data and system objects including tasks Protection domains offer the following types of protection Protection of the kernel from errant application code Run time isolation of applications from each other Inter application linkage protection Text and read only data protection Automatic resource reclamation Additional VxWorks AE enhancements include Fully integrated virtual memory based memory management Physical memory management support An ELF section oriented loader that supports out of order loading Improved win
229. s reorder and retire units and xAPIC eXtended Advanced Programmable Interrupt Controller They share the rapid execution resources and caches firmware and system bus interface and therefore all external system resources e g memory To Hyper Threading enabled operating systems and software the two logical processors appear as two distinct physical processors The evaluation board contains two 604 pin sockets for two Intel Xeon processors or two Low Voltage Intel Xeon processors 32 Inte E7501 Scalable Performance Board De velopment Kit User s Manual n Theory of Operation 3 3 2 Intel E7501 Chipset The Intel E7501 chipset consists of three major components the Intel RGE7501MC Memory Controller Hub MCH the 82801CA I O Controller Hub ICH3 S and the Intel 82870P2 64 bit Hub 2 P64H2 Additionally the Intel 82802AC Firmware Hub FWH is connected to the ICH3 S The chipset components communicate via hub interfaces HIs The MCH provides four hub interface connections one Hub Interface 1 5 HI 1 5 for the ICH3 S and three HI 2 0s for high speed I O connections to P64H2s The hub interfaces are point to point and therefore only support two agents the MCH plus one I O device Therefore the MCH supports a total of three P64H2s The evaluation board contains two P64H2s 3 3 2 1 Intel RGE7501MC Memory Controller Hub MCH The Intel RGE7501MC MCH is a 1005 ball FC BGA flip chip ball grid array
230. ssing 32 bit outbound addressing Two independent 64 bit PCI X Interfaces PCI X 1 0 specification compliant PCI 2 2 specification compliant PCI PCI Bridge 1 1 compliant One IOxAPIC per PCI X bus segment PCI peer to peer write capability between PCI ports SMBus target for Out of Band access to all internal PCI registers 16 external 18 internal interrupts Inte E7501 Scalable Performance Board De velopment Kit User s Manual In 3 3 2 4 3 3 3 3 3 4 3 3 4 1 Theory of Operation Intel 82802AC Firmware Hub FWH The Firmware Hub FWH stores system BIOS and video BIOS as well as an Intel Random Number Generator RNG The Intel RNG provides truly random numbers to enable stronger encryption digital signing and security protocols The FWH is key to enabling future security and manageability infrastructures for the PC platform Intel 82802 FWH features include 32 Pin PLCC package 8 Mbit Flash memory Symmetrically blocked Flash memory array 64 Kbytes memory sections Pin and register based block locking Integrated hardware RNG Single byte read write Five General Purpose Inputs GPIs Operates with 33 MHz PCI clock and 3 3 I O Boot ROM The system boot ROM is installed the Intel 32802 FWH device socketed at U69 The FWH is addressable on the LPC bus off the ICH3 System I O The evaluation board contains the following I O devices On bo
231. strained embedded environments Running in an extremely small memory footprint QNX Photon delivers sophisticated functionality including multimedia support and connects seamlessly to the QNX RTOS s message passing architecture 20 Inte E7501 Scalable Performance Board De velopment Kit User s Manual 2 5 Getting Started QNX Photon also gives you exceptional connectivity between windowing systems With Photon s remote user interface RUI technology you can view and control the GUI of QNX embedded system from a window on a Windows or UNIX desktop RUIs are baud rate aware and can run across a serial or network link For embedded systems this can give you a graphical interface into your consoleless black box With the Citrix ICA client you can access Windows applications from your QNX based set top box network computer or any other thin client in your system Boot Modules Perform platform and processor dependent initialization for embedded systems at startup releasing occupied memory after initialization Boot modules are supplied in full source for custom hardware adaptations Process Manager Extends services to include support for processes containing threads protected memory and pathname space management The pathname space can then be populated by other processes that are visible to application threads Network Manager Coordinates messages between local and remote nodes The network manager module runs network dr
232. t 55 gt dz lt PE4He_2 _PA_GNT 3_ 2 lt PAAD lt 54 PRGNT lt 2 gt PST 18 315 NO JUMPER 10 133 PRRD lt 53 gt lt 1 73622 doy 1 2 PCI X 66MHZ Max PAAD lt 52 gt 73619 2 OU Ty sess HDR rS 2 3 O PCI X PAAD lt 51 gt PAREQK lt S gt 4224 2 2 REQS A snc men Q Q O 50 gt PAREQk lt 4 lt 21 PO4H2 2 PR REQA bos E x PAAD lt 49 gt 2 PRREQ lt 3 gt PKEIS 64 2 2 ma PAAD lt 48 gt PAREQ lt 2 gt 362 2_2_ _ 2_ 84 020 PAAD lt 47 gt aly PAREQx lt 1 gt 3521 2 2 1 x PAAD lt 46 gt HA PAREQx lt gt G18 P64H2_2_PR_REG _ E L PAAD lt 45 gt e PAAD lt 44 gt 21 P64H2_2_PR_PRR 4 PAAD lt 43 gt PAPAR R18 P64He_2_PA_PAR dies PAAD lt 42 gt PRSTOP R24 6412 2 5 rm Le C PAAD lt 41 gt PRPERR RE P64H2_2_PA_PERR 20 30 LAM PAAD lt 40 gt PRSEFRR 5828 2 g fs uo PAAD lt PAIRDYxX _ P54H2_2_P_TRDY_ ma s203 PAAD 38 gt P20 2 PAAD lt 37 gt PAF RAMEDK 18 P64H2_2_PA_FRAME_N sini ia PAAD lt 36 gt PRHEUSEL P19 P64He_2_PA_DEVSEL_ 3556 5563 PAAD lt 35 gt PAAD lt 34 gt PAC BEx lt 7 gt haa _ PE4H2_2
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234. uation board You may need to make changes to the BIOS to enable hard disks floppy disks and other supported features You can use the Setup program to modify BIOS settings and control the special features of the system Setup options are configured through a menu driven user interface On first boot you may want to use the BIOS setup program to verify the date time and boot device Chapter 5 BIOS Overview contains a description of BIOS options BIOS updates may periodically be posted to the Intel Developer web site at http developer intel com design intarch Inte E7501 Scalable Performance Board Development Kit User s Manual 29 Theory of Operation Theory of Operation 3 1 Block Diagram Figure 6 Block Diagram 133 MHz PCI X Intel 82544EI 100 MHz PCI X Adaptec AIC7902 SCSI Controller 133 MHz PCI X PCI X Slot B J24 PCI X Slot C J25 PCI X Slot D HI 2 0 J12 Extension PS 2 KB Mouse Super I O Processor 0 400 533 MHz PSB Gigabit HI 2 0 Ethernet Controller Intel RGE7501MC MCH HI 1 5 32 bit PCI Slot for debug only J11 LPC Intel 82802AC FWH Serial Parallel Floppy Processor 1 DDR DIMM DDR DIMM SMBus sue USB Ports IDE Port BMC for validation only B0958 01 30 Inte E7501 Scalable Performance Board De velopment Kit User s Manual 3 3 3 3 1 Theory of Operation
235. ur device And because each QNX driver runs as a standard process rather than as part of the kernel itself you can test changes in driver code without having to go through the time consuming task of rebuilding the kernel To do so recompile and restart the driver on a running system A Host of Functionality and Development Options QNX Software Systems has developed an efficient suite of embedding tools and run time software components to provide everything from cross platform connectivity to a full featured embeddable windowing system QNX RTOS development is supported under the industry standard GNU tool chain Depending on your project you can choose self hosted QNX development or cross development from Windows and Solaris workstations Whatever tools you choose the QNX RTOS offers a number of productivity advantages for debugging and testing Software faults can be immediately identified at the exact instruction so problems that often take weeks or months to fix can take only days You can also drastically reduce testing time since only changed modules need to be retested Any field tested modules drivers OS extensions or applications can be easily reused across products No other realtime OS scales so easily just plug in the modules or drivers you need Extend the functionality of your application with any of the following modules Embeddable QNX Photon microGUI Offers a highly functional windowing system for resource con
236. uration Inspect and replace slow DIMMs EE Memory Size Not Supported The size of at least one DIMM is not supported by the BIOS Inspect and replace any unsupported DIMMs EF DIMM Population Order Error Mixed single rank and double rank DIMMs have been populated in the wrong order Reorder the DIMMs such that any of the double rank DIMMs are farther from the MCH than any of the single rank DIMMs Note The BIOS contained on your board may not generate all of the error codes listed above Inte E7501 Scalable Performance Board Development Kit User s Manual 63 P64H2 Riser Card ntel P64H2 Riser 6 6 1 Introduction The P64H2 Riser is an optional component of the Intel E7501 Scalable Performance Board Development Kit The Intel RGE7501MC Memory Controller Hub MCH supports up to three HI 2 0 connections The board contains two Intel P64H2 components connected via HI 2 0 expansion slot The riser card enables you to use the third HI 2 0 to provide a third P64H2 on the board The P64H2 Riser Card consists of one P64H2 component and three 3 3V PCI X connectors Bus A contains one PCI X connector running up to 133 MHz and Bus B contains two connectors running up to 100 MHz Figure 9 depicts the block diagram Figure 9 P64H2 Riser Card Block Diagram PCI X 100 MHz J3 Figure 10 depicts the riser card s dimensions and the placement of the components on the board The riser ca
237. ursor to the item with the arrow keys a brief description of that option is displayed in a pane on the right hand side of the screen Main Setup The Main BIOS setup screen contains mostly informative information on the BIOS The following information is displayed BIOS version BIOS build date BIOS ID Please use this information when engaging with Intel customer support Time and Date The Main Setup section contains fields to control the date and the time of the system These should be set the first time the setup utility is entered Inte E7501 Scalable Performance Board De velopment Kit User s Manual intel 5 1 5 5 1 5 1 BIOS Overview Advanced Setup The Advanced BIOS setup screen contains various menu items that allow you to configure the following system components CPU DE not discussed here Floppy not discussed here ACPI not discussed here Event Log not discussed here Super I O not discussed here USB not discussed here Onboard Devices CPU Configuration CPU Frequency Multiplier The E7501 board adaptation allows for the user to set the operating frequency of the processors in the system The CPU Frequency Multiplier field accepts a decimal number representing the processor s internal clock multiplier ratio The following equation defines how this field affects processor operating frequency Processor Frequency CPU Frequency Multiplier FSB Frequency 4
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239. with installing and configuring hardware for a PC or server system Refer to Figure 7 on page 39 for locations of connectors jumpers and other board components and to Figure 8 on page 53 for locations of the peripheral connectors 1 Ensure a safe work environment Make sure you are in a static free environment before removing any components from their anti static packaging The evaluation board is susceptible to electrostatic discharge which may cause product failure or unpredictable operation Caution Connecting the wrong cable or reversing a cable can damage the evaluation board and may damage the device being connected Since the board is not in a protective chassis use caution when connecting cables to this product 2 Verify kit contents Inspect the contents of your kit and ensure that everything listed in Section 2 3 is included Check for damage that may have occurred during shipment Contact your sales representative if any items are missing or damaged 3 Gather tools You will need a Phillips head screwdriver and a 6 32 hex wrench for installation 4 Check jumper settings Verify that the following jumpers are set correctly For detailed descriptions of all jumpers please refer to Section 4 5 Table 3 Jumper Settings Sheet 1 of 2 Jumper Function Default Setting JP1 Safe Mode Open JP2 Top Swap Open ds ripened JP4 CMOS Clear Short 1 2 JP7 No Reboot Open J19 Test Header Open
240. y fits into it in one particular orientation The battery is held in place by a metal arm To remove the battery bend the arm slightly toward the SCSI connector On Board Connectors Table 10 lists connector reference designators that correspond to the connectors on the board On Board Connectors Connector Reference Designator Connector Description J100 WTX Main Power Connector J101 WTX Additional Power Connector J102 WTX 12Vpig VRM D2D Output Power Connector J37 SCSI Channel A Connector J38 SCSI Channel B Connector J16 IDE Connector J34 Floppy Connector J13 ITP32B Connector J43 Front Panel Connector J51 Auxiliary Fan Connector J52 CPU1 Fan Connector J53 CPU0 Fan Connector 471 470 Debug Connector Inte E7501 Scalable Performance Board De velopment Kit User s Manual ntel Hardware Reference 4 3 1 WTX Power Connectors The following tables show the signals assigned to the three WTX power connectors Table 11 WTX Main Power Connector J100 Pin Signal Name Function 1 3 3V 2 3 3V 3 3 3V 4 3 3V 5 3 3V 6 com Ground 7 com Ground 8 com Ground 9 com Ground 10 com Ground 11 5V 12 5V 13 3 3V 14 3 3V 15 3 3V 16 3 3V 17 3 3VAUX 18 com Ground 19 com Ground 20 com Ground 21 com Ground 22 5VsB 23 5V 24 5V Inte E7501 Scalable Performan
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