H330S LGA Series Module Hardware User Manual
Contents
1. sees ener eene eene 27 5 2 1 Pin Definition of Power on off Control Signal eos nimso 27 5 2 2 Power on Signal mi 27 5 2 3 Power Off SIGMA da 28 5 24 Reset Sigrial ci REIR ERR ROREM rie RR Er o REDI ED E PORERRU IHRE 28 5 3 Status Indicating SIOhial cesa A A Su MD uade c en ea MM dM DUE 30 ed VPG Signal ee ne N 30 5 3 2 SMLSignals ndo i bedeaade ede 30 H330S LGA Serials Module Hardware User Manual Page 5 of 45 FIDCCON 53 3 WAKE UP Sinai mana arte Hie mu tem Edid 30 5 39 4 Other Work Indications ipse ti tt ee itin qud Penes HH ER ERR E EET ten Ree 31 5 4 USB Iriterface rere eren a 32 5 4 1 USB Interface Definition essere 32 5 4 2 USB Interface App Calcio 32 5 5 UART Interface rore desit d ree EE P EE Rer ee E aii 34 5 5 1 UART Interface Description a eee better ide 34 5 5 2 UART Interface Applicatigom es 34 5 5 9 Ring Indicado teet mii e A epe etude ve 35 5 6 USIM Interface i iio alii ile 36 56 USIM BIDS ssl nan ct mte d a b d 36 5 6 2 SIM Desion eritis eene diga ee Ioannes cae HERES A Ee ne edades 36 5 6 3 Points for Attention in USIM Design eene nennen 37 5 6 4 USIM Hot Pl ggilig rrt eR di aii 37 5 7 Analog Audio Interface essent eene nennen anne nn nene nennen nennen 38 5 7 1 Definition of Audio Interface Signals serene nennen 38 5 7 2 Description of Audio Interface Application 38 5 8 Digital AUI ma a a a NU C2. 24dBm 123 50dBm 121 IWCDMA RMS WCDMA mA 24dBm 475 OdBm 131 Band1 2100 24dBm 121 50dBm 119 24dBm 384 OdBm 127 Band8 900 24dBm 123 50dBm 121 H330S LGA Serials Module Hardware User Manual Page 25 of 45 FIDCCON 5 1 3 VIO As the power supply for the digital circuit inside the module VIO can be used as the status indicator for the module VIO can be used as the reference level of the module s digital signals Parameter Minimum Value Recommended Value Maximum Value Unit VIO in operation 1 773 1 8 1 827 V 5 1 4 VRTC VRTC is the power supply of the RTC inside the module and it can be used as the backup power signal as well Parameters Minimum Value Recommended Value Maximum Value Unit VRTC output voltage 1 71 1 8 1 89 V VRTC input voltage 0 5 1 8 1 89 V RTC is in normal VRTC input current 1 0 uA RTC is in normal The reference design of VRTC circuit is as follows PP RS ee VRTG E a iur ish Figure 5 1 VRTC Reference Design Note e R8 is a current limiting resistor used to ensure the VRTC module works properly free from being affected by peripheral circuits R821k ohm e VRTC power consumption current 1uA e The value of C9 will affect the retaining time of RTC after VBAT powers off The retaining time of RTC can be roughly calculated by the following formula T 1 8 0 5 C 1 1 3C unit second Namely i
3. Note e POM interface can be configured as client server work mode e Support short frame synchronization at 16 32 48 and 64 bit mode e Support burst and continuous mode transmission e Suitable for various audio sampling frequencies 48KHz 44 1KHz 32KHz 24KHz 22 5KHz 16KHz 12KHz 11 025KHz and 8KHz 5 9 ADC Interface H3308 supports ADC detection including two channels ADC1 and ADC2 with precision of 10bit ADC input voltage is required to be 0 1 2V ADC signal description Pin Pin Name y o Description 50 ADC2 ADC detection channel 2 51 ADC1 ADC detection channel 1 5 10 Other Interfaces The module support GPIO port when reusing with other function ports but does not support MIPI MMC DAC ports yet H330S LGA Serials Module Hardware User Manual Page 41 of 45 FIDCCON 6 Electrical and Environmental Features 6 1 Electrical Features The table below lists the range of H330S s electrical characteristics Parameters Minimum Value Maximum Value Unit Power supply signal 0 4 5 V Digital signal 0 1 9 V 6 2 Environmental Features This table below shows the environmental features of H330S Parameters Minimum Value Maximum Value Unit Operational Temperature 30 75 C Restricted operating temperature 40 85 C Storage Temperature 40 85 C Notell for the temperature is out of the normal temperature range 30 C 75
4. some indexes may slightly deviate from the related 3GPP codes H330S LGA Serials Module Hardware User Manual Page 42 of 45 FIDCCONmM 7 RF Interface There are small differences between different models Please refer to the first table in chapter two 7 1 Operating Frequency Band 7 1 1 Frequency Range of Main Antenna Operating Band Tx Rx UMTS 2100 Band IMT 1920 1980 MHz 2110 2170 MHz UMTS 1900 Band II PCS 1850 1910 MHz 1930 1990 MHz UMTS 850 Band V CLR 824 849 MHz 869 894 MHz UMTS 900 Band VII GSM 880 915 MHz 925 960 MHz GSM 850 824 849 MHz 869 894 MHz GSM 900 880 915 MHz 925 960 MHz DCS 1800 1710 1785 MHz 1805 1880 MHz PCS 1900 1850 1910 MHz 1930 1990 MHz 7 2 RF PCB Design 7 2 1Wiring Principle Because H330S has no RF connector the user needs to connect a length of RF line to the antenna or design a connector on the board So it is recommended to use microstrip line for RF line It should be as short as possible with loss controlled below 0 2dB and impedance of 50 ohm Reserve a T circuit the earth terminals of the two parallel devices should be directly connected to the main ground between H330S module and the antenna connector or feed point for antenna tuning grs L2 L4 1 Figure 7 1rr type Circuit H330S LGA Serials Module Hardware User Manual Page 43 of 45 FIDCCON 7 2 21mpedance Design The impedance o
5. AUXI Auxiliary MIC input signal 21 AGND GND Analog GND Power supply input for the internal power 22 VSPK amplifier of audio codec chip Advise to connect VBAT 12S 11 1252_CLK1 O PD PD 1252 serial clock SCLK1 24 1252 CLKO O T T 1252 serial clock SCLKO Default CLKO 25 1252 WAO O T T 1252 field selection signal 26 1252 TX O T T 1252 serial data output 27 1252 RX T T 1252 serial data input USB 31 USB DP 1 0 USB data signal 32 USB_DM 1 0 USB data signal 33 USB_ID USB ID signal 34 VUSB USB Power Input 92 USB TEST USB TEST signal 12C H330S LGA Serials Module Hardware User Manual Page 17 of 45 FIDCCON 12C data signal line Internal 1K pull up 28 I2C_SDA 1 0 PU PU MEN resistor 28 2C SCL BU p I2C clock signal line Internal 1K pull up resistor UART1 35 UART1 RI O L L UART1 Ring Indicator 36 UART1_DSR T T UART1 DTE Ready 37 UART1_DTR O H H UART1 DCE Ready 38 UART1_DCD O L L UART1 Carrier Detect 39 UART1_CTS PU PU UART1 Clear To Send 40 UART1_RTS O L L UART1 Request To Send 41 UART1_TXD O PP PP UART1 Transmitted Data 42 UART1_RXD PU PU UART1 Received Data UART2 45 UART2 TXD O PP PP UART2 Transmitted Data 44 UART2 RXD PU PU UART2 Received Data ADC 50 ADC2 ADC2 input voltage range 0 1 2V 51 ADC1 ADC1 input voltage range 0 1 2V EINT 56 WAKE_UP PU PU Interrupt of external wak
6. Test conditions Minimum Value Typical Value Maximum Value Unit Bias voltage Without load 2 5 2 6 V Gain Programmable 16 dB H330S LGA Serials Module Hardware User Manual Page 38 of 45 FIDCCON stepping gain 2dB Designed load 2 2 Kohm impedance Audio channel 1 level features of EAR output interface Parameters Test conditions Minimum Value Typical Value Maximum Value Unit Output voltage Without load 1 4 Vpp Designed load 32 ohm impedance DC Bias voltage 1 V 5 7 2 2 Audio Channel 2 Audio channel 2 is a differential audio port for applicable to hands free calls Note Audio channel 2 s downlink can only be used when VSPK power supply is normal Generally VSPK is connected directly to VBAT Audio channel 2 level features of AUXI input interface Parameter Test conditions Minimum Value Typical Value Maximum Value Unit Bias voltage No load 2 5 2 6 V dh Programmable 0 39 de steps gain 2dB Load resistance 2 2 Kohm Audio channel 2 level features of AUXO output interface Parameter Test conditions Minimum Value Typical Value Maximum Value Unit Out voltage No load 3 8 Vpp Load resistance 8 ohm H330S LGA Serials Module Hardware User Manual Page 39 of 45 FIDCCON 5 8 Digital Audio H330S supports digital audio 12S interface that supports normal I2S
7. of Audio Interface Signals H330S wireless modules provide two channels of audio signal input and two channels of audio signal output Audio signal definition Pin Pin Name y o Description 13 AUXO O Audio channel 2 output signal 14 AUXO O Audio channel 2 output signal 15 EAR O Audio channel 1 earphone signal output 16 EAR O Audio channel 1 earphone signal output 17 MIC Audio channel 1 MIC input signal 18 MIC Audio channel 1 MIC input signal 19 AUXI Audio channel 2 auxiliary MIC input signal 20 AUXI Audio channel 2 auxiliary MIC input signal 21 AGND GND Audio GND Power supply input for audio codec chip s internal 22 VSPK power amplifier Recommended to connect to VBAT 5 7 2 Description of Audio Interface Application Audio input output signals are differential signals that have good performance in anti RF interference When connecting to the phone handle it is not necessary to add audio power amplifier As to PCB layout the wires should have the same length and should be parallel and as short as possible The wires should be wrapped with ground wire The input and output signals should be separated by grounding It would be best to add ESD protection to the audio signal port 5 7 2 1 Audio Channel 1 Audio channel 1 is a differential audio port for calls through phone handle Audio channel 1 level features of MIC input interface Parameters
8. 00 1900 850 900 1900 2100 Y 7 2 5 76 H330S A30 00 900 1800 900 2100 Y 7 2 5 76 H330S A50 00 900 1800 900 2100 Y 21 5 76 H330S A30 20 900 1800 900 2100 N 7 2 5 76 H330S A50 20 900 1800 900 2100 N 21 5 76 H330S Q50 20 850 900 1800 1900 850 900 1900 2100 N 21 5 76 H330S LGA Serials Module Hardware User Manual Page 4 of 45 FIDCCON Contents I FORGE WOM ea ia 8 VINO dtUCION oe Eee tI DEGREE ERNST itinere 8 1 2 Reference Stam ard Si 8 2 ProductiOvVvernviewW E II iii 9 DA T 9 22 Specifications e PENE Po M M M LUE EE 9 2 0 AN 8 8 Le o e O 12 SS CUBE EIS AA AA AAA 13 3 1 Dimension Diagram of Structures sm i nennen nene ener 13 3 2 PGB Layout Desidn sn n R E E E E 13 4 Hard ware Introduction 0000 A a 14 4 1 Hardware Block Diagram a eee E a E E E ES 14 Pi DEI nan nani a D DL LS 15 42 1 PIN o 15 4 2 2 Descriptiom of PINS vicio een REI e eee lt ie pere tins 16 5 Hardware Interface etitm A HR EE UR UE RAE RR EO URN DI ERE Ee Mite ee pde 22 5 1 Power lnterface 5 erede id HE DOR RUE D EHI poS E RE ELCHE er Ree RES 22 51 1 Power Supply 22 5 1 2 Power CONSUMPTION se ie ere n Fer i ree eie Ore Fo res 22 Ae stata eeepc tee cat atenen Su ee rues eet E nace 26 M B qo M 26 5 2 Power on off and Reset Signal
9. 013 09 13 Update Figure5 2 Figure5 4 H330S LGA Serials Module Hardware User Manual Page 2 of 45 FIDCCONmM Update description of RTC Add section 5 8 3 Update section 5 3 2 3 WAKE_UP V1 0 9 2013 10 12 Update description for ADC POWER OFF and RESET Modify I2S signal Pin in section 5 8 Add default status and idle status of GPIO V1 1 0 2013 12 18 Update downstream rate and upstream rate of GPRS Update the maximum operating voltage to 4 5V V1 1 1 2015 01 30 Update the range of operating temperature V1 1 2 2015 04 21 Add the description of Top View in PCB Layout Update the description of copyright and attention V1 1 3 2015 05 10 Update the translation of the whole document V1 1 4 2015 07 27 Update the info of H330S and the logo V1 1 5 2015 09 22 Update the 12C and 12S description of H330S XXX 20 H330S LGA Serials Module Hardware User Manual Page 3 of 45 FIDCCON Applicability Type No Type Note 1 H330S Q50 00 2 H330S Q30 00 3 H330S A30 00 4 H330S A50 00 5 H330S A30 20 6 H3308 A50 20 MiniPCle 7 H330S Q50 20 MiniPCle The difference of H330S series wireless module as listed below GSM GPRS EDGE HSDPA HSUPA Model No WCDMA Band MHz Voice Band MHz Mbps Mbps H330S Q50 00 850 900 1800 1900 850 900 1900 2100 Y 21 5 76 H330S Q30 00 850 900 18
10. 117 GND 118 GND 119 GND 120 GND H High Voltage Level L Low Voltage Level PD Pull Down PU Pull Up T Tristate OD Open Drain PP Push Pull Note the pin28 I2C_SDA and pin27 I2S2_RX of the H330S XXX 20 series is floating please don not use H330S LGA Serials Module Hardware User Manual Page 21 of 45 FIDCCON 5 Hardware Interface 5 1 Power Interface 5 1 1 Power Supply H330S modules require 3 3V 4 5V direct current power supply which can provide the maximum GSM emission current of 2A Input power supply requirements Parameter Minimum Value Recommended Value Maximum Value Unit VBAT 3 3 3 8 4 5 Points for attention in design 1 Supply voltage fluctuation shall be lower than 300mV 2 Minimum supply voltage drop shall be higher than 3 3V Filter capacitor of supply circuit is designed as follows Recommended Application Description capacitor Reduce power supply fluctuation during phone call 1000uF Supply capacitance The capacitance value bigger is better Filter the interference caused by clock and digital 10nF 100nF Digital signal noise signals 8 2pF 10pF 1800 1900 2100 MHz Filter RF interference 33pF 39pF 850 900 MHz Filter RF interference 5 1 2 Power Consumption Parameter Description Condition Typical Value Unit off RTC mode 60 uA GSM 13 mA idle Idle mode WCDMA 13 mA
11. 2 of 45 FIDCCON VUSB there must be input or it cannot recognize USB port USB DP and USB DM are the high speed differential signal line and their highest transmission rate is 480Mbps The following requirements should be followed in designing PCB layout e USB DP and USB DM signal lines should have the same length and should be parallel avoid right angle wiring e USB DP and USB DM signal lines should be wrapped with GND at the ends e USB2 0 differential signal line should be laid at the signal layer closest to the ground layer e Ensure impedance matching impedance is required to be 90ohm H330S LGA Serials Module Hardware User Manual Page 33 of 45 FIDCCON 5 5 UART Interface 5 5 1UART Interface Description H330S wireless modules provide two UART for the users one is standard 8 line serial port and the other 2 line serial port The 8 line serial port UART1 supports full serial port mode with flow control function and all the AT commands Users can download software or receive and dispatch AT through UART1 The 2 line serial port UART2 only supports part of the AT commands Note UART2 only supports the ordinary query function The definitions of UART1 and UART2 signal interfaces are as follows UART1 Pin Pin Name 1 0 Description 35 UART1_RI O UART1 Ring Indicator 36 UART1_DSR UART1 DTE Ready 37 UART1 DTR O UART1 DCE Ready 38 UART1_DCD O UART1 Carr
12. C DAC 32KHz XO Control DAC CLK in Ext Memory Interface VBACKUP 398J19 U JoloeuuoD v9 UId OZ L MIC EAR AUXI AUXO Vspeaker Ant_main RX Diversity FE Control 2G 3G TX 2G 3G RX H330S Module GSM GPRS EDGE WCDMA Ant div Figure 4 1 Block Diagram H330S LGA Serials Module Hardware User Manual Page 14 of 45 IiOCCON 4 2 Pin Definition 4 2 1 Pin Map De 7574 73 7274 ro 69 se 6 se 65 b4 3 e2 led fod or Jed bog fod fog fad ox fo Ba Ba B7 5 949 s N E e ki kd kd kd ki b kn kn ui En Jg m BEBBBEEUBHHERHR ss Hn E BEGG al S a ES ni BS JAGE po e1 ea e4 es ed 87 ee eg o 91 92 3 26 27 es 25 Bo 51 B3 Ba B4 BS 56 37 Ba TOP View e Li 2 3 4 3 6 L7 8 9 10 ii 12 13 14 17 18 19 21 w SII 3 8 Figure 4 2 Pin Diagram H330S LGA Serials Module Hardware User Manual Page 15 of 45 FIDCCON 4 2 2 Description of Pins The logic signal lever of H330S series is 1 8V Pins of H330S series are described in the table below Reset Idle Pin Pin Name 1 0 Description Value Value Power Supply 59 VBAT 60 VBAT Main power supply voltage range 3 3V 61 VBAT 4 5V 62 VBAT Test pin for power supply of RF
13. FIDCCON Perfect Wireless Experience H330S LGA Series Module Hardware User Manual Version V1 1 5 Date 2015 09 22 FIDCCON Copyright Copyright 2015 Fibocom Wireless Inc All rights reserved Without the prior written permission of the copyright holder any company or individual is prohibited to excerpt copy any part of or the entire document or transmit the document in any form Attention The document is subject to update from time to time owing to the product version upgrade or other reasons Unless otherwise specified the document only serves as the user guide All the statements information and suggestions contained in the document do not constitute any explicit or implicit guarantee Trademark FIDCCON The trademark is registered and owned by Fibocom Wireless Inc Versions Version Date Remarks V1 0 0 2012 05 30 Initial Version V1 0 1 2012 07 06 Update product model No V1 0 2 2012 08 08 Update Mechanical PCB Design Pin Out V1 0 3 2012 11 20 Modify Pin description and incorrect specifications V1 0 4 2013 01 09 Update the name of the document add reliability features V1 0 5 2013 01 24 Update the document name Update the name of the manual Add UART R1 V1 0 6 2013 05 02 Add model comparisons Update the current specification Add two models V1 0 7 2013 07 01 Add comparison on voice SMI is updated to a output pin update section 5 4 1 V1 0 8 2
14. IE 40 3rd Ae 40 ESNEA PO E 40 5 8 3 PCM Port Deseription eH a a E E ERESR 41 5 9 ADC Interface oo celi DUE RnuP toda ianteeiiantanieni une D Uer 41 5 10 Other Interface Seiseanan ener emet ntnennetr one re E a etne trennen ni trennen enne nnenen 41 6 Electrical and Environmental FeatureS sse nennen eene nennen nennen 42 6 1 ElectricallFeatures mm a ferite bett t Deeds 42 6 2 Environmental Features sese tnnt etre entente nennen tne nenne tenn ennt enne nenne 42 TREINteraCe PIU den into UTI E 43 7 1 Operating Frequency BIO a Alia 43 7 1 1 Frequency Range of Main Antenna eee eene nene enne 43 A E A CR 43 1 2 1 Wiring Principle teret terr tetuer ibi t enne eoe ERE iia 43 H330S LGA Serials Module Hardware User Manual Page 6 of 45 FIDCOCCON 7 2 2 Impedance Design eccaoin ae nettement ener enne treten a 44 TS Antenna Desighe A 44 7 3 1 Main Antenna Design Requirements sse 44 H330S LGA Serials Module Hardware User Manual Page 7 of 45 FIDCCON 1 Foreword 1 1 Introduction The document describes the electrical characteristics RF performance dimensions and application environment etc of H330S series wireless modules With the assistance of the document and other instructions developers can quickly understand the performance of H330S series wireless modules and develop products 1 2 Referen
15. Low power DRX 2 2 sleep mA mode DRX 5 2 H330S LGA Serials Module Hardware User Manual Page 22 of 45 FIDCCON DRX 9 2 5 230 10 80 GSM850 PCL 15 50 19 46 5 240 10 83 EGSM900 PCL 15 50 IGSM RMS 1 TX slot mA 1 Rx slot 0 156 5 71 DCS1800 PCL 10 49 15 46 0 165 5 70 PCS1900 PCL 10 50 15 46 5 355 10 216 GSM850 PCL 15 108 GPRS Class 19 94 33 IGPRS RMS 5 383 mA 4 TX slot 1 Rx slot 10 225 EGSM900 PCL 15 108 19 94 DCS1800 PCL 0 259 H330S LGA Serials Module Hardware User Manual Page 23 of 45 FIDCCON 5 180 10 103 15 95 0 266 5 182 PCS1900 PCL 10 103 15 95 8 522 GSM850 PCL 14 145 19 95 8 522 EGSM900 PCL 14 150 EGPRS Class 33 19 95 IEGPRs RMS mA 4 TX slot 2 484 1 Rx slot DCS1800 PCL 9 117 15 103 2 493 PCS1900 PCL 9 118 15 103 5 1655 10 473 GSM850 PCL 15 193 Peak current csM MAXx 19 148 mA During TX slot 5 1715 EGSM900 PCL 10 536 15 208 H330S LGA Serials Module Hardware User Manual Page 24 of 45 FIDCCON 19 147 0 1050 5 464 DCS1800 PCL 10 199 15 138 0 1100 5 489 PCS1900 PCL 10 203 15 139 24dBm 387 OdBm 127 Band5 850 24dBm 121 50dBm 119 24dBm 439 OdBm 130 Band2 1900
16. ce Standards The design of the product complies with the following standards 3GPP TS 27 007 v6 9 0 AT command set for User Equipment UE 3GPP TS 27 005 v6 0 1 Use of Data Terminal Equipment Data Circuit terminating Equipment DTE DCE interface for Short Message Service SMS and Cell Broadcast Service CBS 3GPP TS 23 040 v6 9 0 Technical realization of Short Message Service SMS 3GPP TS 24 011 v6 1 0 Point to Point PP Short Message Service SMS support on mobile radio interface 3GPP TS 27 010 v6 0 0 Terminal Equipment to User Equipment TE UE multiplexer protocol 3GPP TS 27 060 v6 0 0 Packet domain Mobile Station MS supporting Packet Switched services 3GPP TS 25 304 v6 10 0 User Equipment UE procedures in idle mode and procedures for cell reselection in connected mode 3GPP TS 25 308 v6 4 0 High Speed Downlink Packet Access HSDPA Overall description Stage 2 3GPP TS 25 309 v6 6 0 FDD enhanced uplink Overall description Stage 2 3GPP TS 23 038 v6 1 0 Alphabets and language specific information 3GPP TS 21 111 v6 3 0 USIM and IC card requirements 3GPP TS 31 111 v6 11 0 USIM Application Toolkit USAT 3GPP TS 45 002 v6 12 0 Multiplexing and multiple access on the radio path 3GPP TS 51 014 v4 5 0 Specification of the SIM Application Toolkit for the Subscriber Identity Module Mobile Equipment SIM ME interface 3GPP TS 51 010 1 v6 7 0 Mobile Station MS conformance specification Part 1 Co
17. ctromagnetic wave Gain is the combination of the antenna efficiency and antenna directivity It is recommended that antenna gain lt 2 50Bi 6 Interference In addition to antenna performance other interference from the PCB will also affect the module performance In order to ensure the high performance of the module the interference must be under control Suggestions keep speaker LCD CPU FPC wiring audio circuit and power supply away from the antenna add appropriate separation and shielding devices or conduct filtering on the path 7 TRP TIS TRP Total Radiated Power e W850 W900 W1900 W2100 gt 19dBm e GSM850 gt 28dBm H330S LGA Serials Module Hardware User Manual Page 44 of 45 FIDCCON GSM900 gt 28dBm DCS1800 gt 25dBm PCS1900 gt 25dBm TIS Total Isotropic Sensitivity H330S LGA Serials Module Hardware User Manual W850 W900 lt 102dBm W1700 W 1900 W2100 lt 103dBm GSM850 lt 102dBm GSM900 lt 102dBm DCS1800 PCS1900 lt 102dBm Page 45 of 45
18. e 9 of 45 FIDCCON Class 4 2W 850 900 MHz GSM Class 1 1W 1800 1900 MHz GSM Tx Power Class E2 0 5W 850 900 MHz EDGE Typical Value Class E2 0 4W 1800 1900 MHz EDGE Class 3 0 25W 850 900 1900 2100 MHz WCDMA Rx Sensitivity UMTS HSPA 109dBm Typical Value GSM 108dBm Interfaces Rf Interface Main Antenna 1 x USB 2 0 2 x UART MUX Over UART1 Function Multiple Profiles over USB Interface SPI Support Not supported yet 12C Support I2S Support PCM HSIC GPIO A D RTC Data Features Protocol Stack Embedded TCP IP and UDP IP protocol stack Multi slot class 33 5 Down 4 Up 6 Total EDGE Coding Scheme MCS1 9 Multi slot class 33 5 Down 4 Up 6 Total GPRS Coding Scheme CS1 4 CSD UMTS 14 4kbps GSM 9 6kbps USSD Support MO MT Text and PDU modes SMS Cell broadcast H330S LGA Serials Module Hardware User Manual Page 10 of 45 FIDCCON Analog Audio and Digital Audio Audio Voice coders EFR HR FR AMR Audio Frequency Gain Control Echo Cancellation Noise Suppression Sidetone Control IRA GSM Character Set UCS2 HEX FIBOCOM proprietary AT commands AT Commands GSM 07 05 GSM 07 07 Firmware Loader Tool over USB UART Accessories User Manual Developer Kit Note For the temperature is out of the norma
19. e SIM card slot should be close to the module to the largest extent e The filter capacitor on the SIM card signal circuit should be placed close to SIM card pin to the largest extent H330S LGA Serials Module Hardware User Manual Page 36 of 45 FIDCCON e ESD device like TVS shall be added to the SIM card signal circuit protection ESD device should be placed close to SIM card pin e USIM IO has been pulled up inside the module No need to pull it up again from the outside e USIM CD signal connection supports hot plugging active low If the module detects the signal at low level it means there is a card in the module 5 6 3 Points for Attention in USIM Design SIM card interface design is very important for the normal operation of the module and SIM card The following points need to be complied with during the design e SIM card layout and wiring must keep away from EMI interference source like RF antenna and digital switch signal e n order to ensure signal completeness the wire distance between the module and SIM card should not exceed 100mm e In order to avoid mutual interference USIM CLK and USIM IO signals should be separated in wiring It would be best to wrap them with ground wire respectively e SIM card signal line should be protected with ESD These protective devices should have small capacitance like Zener diode etc Users are recommended to select ESD devices with equivalent capacitance lower than 33pF D
20. e timing sequence control is shown in the diagram below VBAT POWER_OFF 300mS VDD 1V8 Figure 5 4 Timing Control The recommended design of POWER OFF signal is as follows Figure 5 5 POWER OFF Reference Design 5 2 4 Reset Signal H330S wireless modules support external reset function It is feasible to reset the module back to the original state by the Reset Signal When setting the Reset Signal low for 100ms the module will be reset and restarted When the user uses the Reset function the PMU inside the module will not lose power Note Reset signal is a sensitive signal line In designing PCB layout please keep the line away from RF interference and make it well wrapped with ground wire And it is advised to add an anti shaking capacitor at the place close to the module end H330S LGA Serials Module Hardware User Manual Page 28 of 45 FIDCCON The timing sequence requirements of its pulse are as follows Recommended design Figure 5 6 Reset Recommended Design H330S LGA Serials Module Hardware User Manual Page 29 of 45 FIDCCON 5 3 Status Indicating Signal The pins of status indicating signal as listed below Pin Pin Name Description 86 LPG Status indicating 89 SMI Sleep Status indicating 56 WAKE_UP Sleep wake up pin 1 VTRX Transceiver power supply signal indicating the power status of the transceiver 64 VPA Power supply signal of RF power amplifi
21. e up active low 57 EINT2 PU PU External interrupt active low USB HSIC 90 HSIC USB DATA HSIC USB data signal line not supported 91 HSIC USB STRB HSIC USB pulse signal line not supported Antenna 67 ANT MAIN Main antenna interface impedance requirement 50 ohm 71 ANT DIV Only supported by some models H330S LGA Serials Module Hardware User Manual Page 18 of 45 FIDCCON Others GPIO Used for HSIC IPC in special 3 DSP AUDIO IN1 H H software versions 54 CLKOUTO PP PP Digital audio clock output 89 SMI L Sleep Mode Indicator 86 LPG Status indicator NC 23 NC 55 NC 52 NC 53 NC 73 NC 74 NC 75 NC 76 NC 78 NC 79 NC 80 NC 81 NC 82 NC 83 NC 84 NC 85 NC 87 NC 88 NC 94 NC 95 NC 96 NC 101 NC 105 NC H330S LGA Serials Module Hardware User Manual Page 19 of 45 FIDCCON 106 NC 107 NC 108 NC GND 2 GND 12 GND 30 GND 43 GND 58 GND 63 GND 65 GND 66 GND 68 GND 69 GND 70 GND 72 GND 93 GND 97 GND 98 GND 99 GND 100 GND 102 GND 103 GND 104 GND 109 GND 110 GND 111 GND 112 GND 113 GND 114 GND H330S LGA Serials Module Hardware User Manual Page 20 of 45 FIDCCON 115 GND 116 GND
22. er 5 3 1 LPG Signal LPG signal description as listed below Status Mode idle unregistered 600ms high level 600ms low level idle registered 75ms high level 3S low level Voice communication Call low level Data communicating 75ms high level 75ms low level Sleep sleep mode high level Note High level voltage is 1 8V 5 3 2 SMI Signal SMI signal description as listed below Modes Description Sleep Mode 2 5S High 100ms Low repeat this Other Mode low level 5 3 3 WAKE UP Signal WAKE UP is for waking up the module from Sleep mode it is high level by default but low level is activated Module Mode WAKE UP Signal Description Low level Wake up the module from Sleep mode to Idle mode Sleep High level Keep the module in Sleep mode Idle Call Low High level Keep the module in Idle Call mode H330S LGA Serials Module Hardware User Manual Page 30 of 45 FIDCCON When the module is in Sleep mode the function of EINT1 WAKE_UP signal is as follows When EINT1 WAKE_UP is at low level under the control of MCU GPIO it will wake up the module to idle mode When EINT1 WAKE_UP is at high level under the control of MCU GPIO it will keep the module in sleep mode 5 3 4 Other Work Indications Pin Name Electrical Level Description VTRX 1 8V Work indication of RF Transceiver PMU VPA 0 5V In
23. f RF signal line of antenna interface needs to be controlled at 50 ohm 7 3 Antenna Design 7 3 1 Main Antenna Design Requirements 1 Antenna efficiency Antenna efficiency is the ratio of the input power and radiant power Because of the antenna s return loss material loss and coupling loss the radiant power is always lower than the input power The ratio is recommended to be gt 40 4dB 2 S11 or VSWR S11 shows the matching degree of the antenna s 50 ohm impedance which affects antenna efficiency to a certain extent It is feasible to use VSWR testing method to measure the index It is recommended that S11 lt 10dB 3 Polarization Polarization is the rotation direction of the electric field of the antenna at the direction of the largest radiation It is recommended to use linear polarization for diversity antenna it is recommended to use different polarization directions from that of the main antenna 4 Radiation pattern Radiation pattern refers to the electromagnetic field intensity at various directions in the far field of the antenna Half wave doublet antenna is the perfect terminal antenna In the case of built in antenna it is recommended to use PIFA e Antenna area H 6mm W 10mm L 100mm It is recommended to use PIFA or IFA e Antenna radiation direction Omni directional 5 Gain and directivity Antenna directivity refers to the electromagnetic field intensity at various directions of the ele
24. f the value of C9 is 100uF the retaining time of RTC will be around 130s H330S LGA Serials Module Hardware User Manual Page 26 of 45 FIDCCON 5 2 Power on off and Reset Signal 5 2 1 Pin Definition of Power on off Control Signal H330S wireless modules provide three control signals to start up shut down and reset the modules Pins definition as listed below Pin Pin Name Electrical Level Description 48 POWER_OFF CMOS 1 8V Power off signal 49 POWER_ON CMOS 1 8V Power on signal 77 RESET_ALL_N CMOS 1 8V External reset signal input 5 2 2 Power on Signal After the module is connected to the power supply the user can start up the module by setting low POWER_ON signal low Timing sequence requirement of the startup pulse The timing sequence control is shown in the diagram below VBAT POWER_ON 300mS VDD 1 V8 gt 8mS Ht Figure 5 2 Timing Control The recommended design of POWER ON signal is as follows EE A mp 10K_5 vw C im 1 POWER ON CONTROL y Bt E oa R22 E 47K 596 Figure 5 3 POWER ON Reference Design H330S LGA Serials Module Hardware User Manual Page 27 of 45 FIDCCON 5 2 3 Power off Signal When setting POWER_OFF signal low the module s PMU Power Management Unit will be reset Then the module will turn to shutdown state from operation state The timing sequence requirements of the pulse are as follows Th
25. ier Detect 39 UART1_CTS UART1 Clear to send 40 UART1_RTS O UART1 Request to send 41 UART1 TXD O UART1 Transmitted Data 42 UART1_RXD UART1 Received Data UART2 Pin Pin Name 1 0 Description 44 UART2_RXD UART2 Received Data 45 UART2 TXD O UART2 Transmitted Data 5 5 2UART Interface Application Connect UART1 of H330S wireless module DCE to PC and the signal direction of DTE is as follows MCU DTE application Signal Direction H330S module DCE RXD 4 UART1_TXD TXD gt UART1_RXD H330S LGA Serials Module Hardware User Manual Page 34 of 45 FIDCCON RTS _ UART1_CTS CTS MA UART1_RTS DSR n UART1_DTR DTR UART1_DSR RI 4 UART1 RI DCD lt UART1_DCD Connect UART2 of H330S w ireless module DCE to PC and the signal direction of DTE is as follows MCU DTE application Signal direction H330S module DCE RXD 4 UART2 TXD TXD UART2 RXD Note the high level of the module s UART interface is 1 8V interface it is necessary to switch the level In design it is recommended to use SN74LVC2G07 to switch the level from 1 8V to 3 3V During the communication between UART1 and PC firstly raise the level from 1 8V to 3 3V and then employ If it needs to connect it to 2 8V or 3 3V IO SP3238 to switch the leve
26. l During the communication between UART2 and PC firstly raise the level from 1 8V to 3 3V and then employ SPIEX3232EEA to switch the level Pay attention to the signal direction when switching the level 5 5 3Ring Indication UART1 RI signal is used to indicate the incoming calls and SMS and dispatch pulses to the host application Working modes Status Default status Low level Incoming call ring 1s high level and 1s low level repeat this New SMS 150ms pulse H330S LGA Serials Module Hardware User Manual Page 35 of 45 IiOCCON 5 6 USIM Interface H330S series wireless modules support USIM and high speed SIM cards For now they do not support 8 line intelligent USIM 5 6 1 USIM Pins Pin Pin Name 1 0 Function Description 5 USIM_VCC O USIM power supply signal 6 USIM_RST O USIM Reset signal 7 USIM_CLK O USIM clock signal 8 USIM_IO IO USIM data signal 12 GND GND USIM ground signal USIM Plug in detection signal The internal module has been pulled up 4 USIM CD High level indicates that SIM card is not inserted Low level indicates that card is inserted 5 6 2 USIM Design Reference Circuit Design NC c DATA sw2 USIM vec E gt i palak am USIM CD y RST 7 VSIM ae i o 1 s LL i i i SIM 8PIN Figure 5 8 USIM Interface Reference Circuit Note e In order to improve EMC performance th
27. l temperature range 30 C 75 some indexes may slightly deviate from the related 3GPP codes Note H330S XXX 20 serials module dose not support I2C I2S Analog Audio and Digital Audio H330S LGA Serials Module Hardware User Manual Page 11 of 45 f iOCCON 2 3 Appearance The product appearance of H330S series wireless module is shown as below Top view SOEEH Figure 2 1 Top View Bottom view Figure 2 2 Bottom View H330S LGA Serials Module Hardware User Manual Page 12 of 45 FIDCOCCON 3 Structure 3 1 Dimension Diagram of Structure 33 8 0 2 2 45 0 1 unit mm 0 8 0 1 0000000000000000000000 oo oo oo oo oa oo a aa aao aa oo oa oa oo aa a oo a ca a a a p00000000000000000000 ooo ooo 0000000 27 8 0 2 00000000000 COVER LABLE PINI TOP VIEW SIDE VIEW BOT VIEW PINI Figure 3 1 Dimension Diagram of Structure 3 2 PCB Layout Design recommended PCB layout 33 840 2 unit mm 32 5 30 6 5 6 3 16 8 27 8 0 2 Figure 3 2 Recommended PCB Layout Top View H330S LGA Serials Module Hardware User Manual Page 13 of 45 FIDCCON 4 Hardware Introduction 4 1 Hardware Block Diagram Power Supply 3 3 4 2V Power on Reset ALL N Reset PMU UART USIF USB CD w PR 7 MIPI E EZ 125 N e Ds uU Q Lo Digital RF SP Interface JTAG USIM MMC AD
28. mode and PCM mode 2S interface level is 1 8V on average 12S signal description Pin Pin Name 1 0 Description 24 1252_CLKO O Bit Clock 25 1252_WAO O Left and right channel clock LRCK 26 I282 TX O Serial data output 27 I2S2_RX Serial data input 28 I2C_DATA 1 0 12C control signal input output 29 I2C_SCL O 12C control clock signal 54 CLKOUTO O 26MHz main clock output 5 8 1 12S H330S Signal Direction Audio CODEC 12S Port I2S2 CLKO I2S CLK I2S2_WAO I2S_LRCK I282 RX I2S_SDIN 1252 TX HEEL I28 SDOUT CLKOUTO o I28 MCLK 5 8 212C H330S Signal Direction Audio CODEC I2C Port I2C SDA Wo I2C SDA I2C SCL I2C SCL Description e 2S interface can be configured as client server work mode e Suitable for various audio sampling frequencies 48KHz 44 1KHz 32KHz 24KHz 22 5KHz 16KHz 12KHz 11 025KHz and 8KHz H330S LGA Serials Module Hardware User Manual Page 40 of 45 FIDCCON 5 8 3PCM Port Description H330S Signal Direction Audio CODEC PCM Port I2S2_CLKO PCM CLK PCM clock signal gt PCM_CLK PCM clock signal I2S2_WAO PCM SYNC PCM frame gt PCM_SYNC PCM frame synchronization signal synchronization signal 1252_RX PCM_DIN PCM data input PCM DOUT PCM data output I282 TX PCM DOUT PCM data output PCM_DIN PCM data input
29. nformance specification 3GPP TS 22 004 v6 0 0 General on supplementary services 3GPP TS 23 090 v6 1 0 Unstructured Supplementary Service Data USSD Stage 2 3GPP TS 24 008 v6 19 Mobile radio interface Layer 3 specification H330S LGA Serials Module Hardware User Manual Page 8 of 45 FIDCCON 2 Product Overview 2 1 Description H330S series modules are 3G wireless modules with high integration density supporting GSM GPRS EDGE and UMTS HSDPA HSUPA HSPA 2 2 Specifications Specifications Operating Frequency Range UMTS WCDMA FDD 850 900 1900 2100 MHz or 900 2100MHz GSM GPRS EDGE 850 900 1800 1900 MHz or 900 1800MHz UMTS HSDPA HSUPA 3GPP release 7 HSUPA 5 76Mbps Cat 6 HSDPA 21Mbps Cat 14 or 7 2Mbps Cat 8 Characteristics Data Rate GSM 3GPP release 7 EDGE E GPRS multi slot class 33 296kbps DL 236 8kbps UL GPRS multi slot class 33 107kbps DL 85 6kbps UL Dimension 33 8 x 27 8 x 2 45mm Physical Interface LGA Weight lt 5 5 grams Environment Normal operating Temperature 30 C 75 C Restricted operating temperature 40 C 85 C Storage Temperature 40 C 85 C Consumption Typical Value Performance Operating Voltage 3 3V 4 5V Normal 3 8V Voltage 2mA Sleep Mode Current 3G Idle 13mA 3G Talk 500mA 2G Talk 260mA GSM PCL5 H330S LGA Serials Module Hardware User Manual Pag
30. power 64 VPA O amplifier ldle state in actual use Test pin for transceiver power supply 1 VTRX O Idle state in actual use 46 VIO O 1 8V voltage output inside the modules 47 VRTC 1 0 Backup battery input output Power ON OFF Signal Power off control signal internal 4 7K 48 POWER_OFF PU PU pull up resistor Power on control signal internal 200K 49 POWER_ON PU PU pull up resistor Reset Signal External reset signal input internal 200K 77 RESET ALL N PU PU pull up resistor USIM Interface Insert USIM card to test active low 4 USIM CD PU PU Internal 390K pull up resistor 5 USIM VCC USIM card power supply 1 8V or 3 0V 6 USIM RST O PP PP USIM card reset signal 7 USIM_CLK O PP PP USIM card clock signal USIM card data signal internal 4 7K 8 USIM_DATA 1 0 PU PU pull up resistor H330S LGA Serials Module Hardware User Manual Page 16 of 45 FIDCCON High Speed SIM Interface High speed SIM card USB signal 9 USIM_D Temporarily not supported m USIM _D High speed SIM card USB signal Temporarily not supported Audio Interface 13 AUXO O Speaker output signal 14 AUXO O Speaker output signal 15 EAR O Earphone signal output 16 EAR O Earphone signal output 17 MIC Main MIC input signal 18 MIC Main MIC input signal 19 AUXI Auxiliary MIC input signal 20
31. transmission output VCC 0 65V at the lowest power 5V at the largest power OV in the case of no transmission Note It is only used for indicating work conditions Keep it in the idle state in actual use It cannot be used for other purposes H330S LGA Serials Module Hardware User Manual Page 31 of 45 FIDCCON 5 4 USB Interface 5 4 1 USB Interface Definition Pin Pin Name y o Description 31 USB DP IO USB signal 32 USB DM IO USB signal 33 USB ID USB ID signal NC is recommended 34 VUSB USB power input 92 USB TEST USB TEST signal NC is recommended H330S wireless modules support USB 2 0 Before connecting it to PC it is necessary to install the related USB driver After inserting the H330S wireless modules to PC the USB interface will work with the driver and map seven ports on PC as follows e One 3G Modem AT port for initiating data traffic e Three ports for dispatching AT Command e Two ports for capturing LOG information of the software e One port reserved for future use 5 4 2USB Interface Application Reference Circuit Design J101 Figure 5 7 USB Interface Reference Circuit Design T101 and T102 shall be TVS with capacitance lower than 1pF there is no specific limitation for the capacitance of T103 VUSB pin supplies power for USB The recommended power supply range is 2 5V 5 25V In designing H330S LGA Serials Module Hardware User Manual Page 3
32. uring layout ESD device should be close to the SIM card interface 5 6 4 USIM Hot Plugging H3308 supports SIM card status detection function This function allows the hot plugging of SIM card 5 6 4 1 Hardware Connection SIM card hot plugging function needs to work with USIM CD signal USIM CD will be at high level without SIM card after inserting SIM card USIM CD will be at low level In fig 5 8 USIM CD signal line is connected to U2 s Pin8 SW2 and Pin7 SW1 is connected to the ground When the SIM card is not inserted SW2 will be at high level When the SIM card is inserted SW2 will be connected to SW1 and thus USIM CD level will be pulled down 5 6 4 2 Software Settings MSMPD configures AT command for the SIM card status detection function If set AT MSMPD 0 SIM card status detection function will be closed and the module will not detect USIM CD signal If set AT MSMPD 1 SIM card status detection function will be in operation and the module will detect if the SIM card is inserted by USIM CD Pin If USIM CD is at low level which indicates SIM card is inserted the module will automatically register it to the network If USIM CD is at high level or unconnected which indicates SIM card is not inserted the module will not register it to the network Note the default of MSMPD parameter is 0 H330S LGA Serials Module Hardware User Manual Page 37 of 45 FIDCCON 5 7 Analog Audio Interface 5 7 1 Definition
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