LIM-U–LED-850 6
Contents
1. achievable with an integration time of 26ms and a frame rate of 9 fps Equation 4 shows the maximum dissipation power Poiss 6 Pty 2 Prser Pret 16 3W 4 8 2 Temperature Calculations Knowing the power dissipation and the thermal resistance of the LED and the PCB vias the estimated led junction temperature can be calculated Referring to the LED datasheet a maximum operating temperature of 125 C is allowed The thermal resistance from the LED die to the PCB pad is given as 9 K W The thermal resistance from the LED pads to the bottom side of the pcb is approximately 1 5 K W Therefore a maximum PCB temperature can be calculated Jeep Teo Poiss nen Rrrcs 5 125 C 2 9W 9 K W 1 5 K W 94 5 C To have a good margin and to increase the LED lifetime the ToF Security Chip turns the LED power supply off when the measured PCB temperature exceeds 80 C This value can be changed in the register settings of the safety chip The following drawing shows the used model for temperature calculations Bluetechnix Page 18 25 Hardware User Manual LIM U LED 850 2 9W 2 9W Ten Tuer E EN RrLED1 RrLED6 Ser den 09 0 9W O H Trser Trser amp R VIAl R VIA6 1 6 C W 1 6 C W R Rser1 OR i en i C W C W RGP RHS dr 0 33 C W 1 C W Se Tus 0 4W Tret O R FETI We Q Tame A A BLUE TECHNIX J Last change 3 October 2014 Version 2 5 0 4W2. 2 2W Total Power 16 4W Tret Tauck Tien 106 C REETZ RrBUCK Trap 83 C i C W i C W Tpce 79 C Tus 73 C Tames 55 C Figure 8 1 Thermal Power Calculation Model For this calculation example a MW40 33 heat spreader from Malinco is mounted to the PCB with a GP2500S20 thermal gap pad from Bergquist The maximum LED temperature is 125 C so in this configuration the LIM module could operate to fully load If the maximum performance is not needed smaller heat soreaders could be used or higher ambient temperatures are possible Note The LED life time is connected to the junction temperature A higher junction temperature E may decrease the LED life time significantly Bluetechnix Page 19 25 A BLUETECHNIX RA Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 9 Support 9 1 General Support General support for products can be found at Bluetechnix support site http support bluetechnix at Bluetechnix Page 20 25 Hardware User Manual LIM U LED 850 10 Ordering Information PON 150 2301 2 150 2302 2 150 2310 2 150 2311 2 150 2312 2 150 2320 2 150 2321 2 150 2322 2 Bluetechnix O Name LIM U LED 850 6 90 LIM U LED 850 3 90 LIM U LED 850 6 30 LIM U LED 850 6 60 LIM U LED 850 6 120 LIM U LED 850 3 30 LIM U LED 850 3 60 LIM U LED 850 3 120 BLUETEGHNIX AA Embedding Ideas Last change 3 October 2014 A Version 2 5
3. BLUETECHNIX Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 5 Connector Description 5 1 LIM Connector The following table shows the pin out of the 20 pin LIM connector Pin Type Signal name Description 1 PWR Vin Input Supply Voltage 2 PWR GND Power Ground 3 PWR Vin Input Supply Voltage 4 PWR GND Power Ground 5 PWR Vin Input Supply Voltage 6 PWR GND Power Ground 7 PWR Vin Input Supply Voltage 8 PWR GND Power Ground 9 PWR Vin Input Supply Voltage 10 PWR GND Power Ground 11 NC Not Connected 12 O PWM Fan Driver Signal 13 lO OWI One Wire Interface 14 PWR GND Signal Ground 15 MOD Negative Differential Modulation Signal 16 PWR 3V3 3 3V Logic Supply Voltage 17 MOD Positive Differential Modulation Signal 18 lO SDA DC Serial Data IO 19 NC Not Connected 20 SCL DC Serial Clock Input Table 5 1 Pin out of the LIM connector The mating Connector is a 20pin LSS connector from SAMTEC To achieve different stacking heights following connectors can be used Part Number Stacking Height LSS 110 01 F DV A 9 mm LSS 110 02 F DV A 12 mm LSS 110 03 F DV A 10 mm Table 5 2 Mating Connectors As this are hermaphrodite connectors please be aware that the pin numbering refers to the connector mounted on the LIM module Figure 6 2 The connector on the baseboard must be rotated by 180 See Figure 6 2 for the connector orientation Bluetechnix Page 13 25 BLUETECHNIX Embedd
4. Power consumption during ToF integration 35 W Vcc Logic supply voltage 30 38 3 6 V loc Logic supply input current 20 30 3007 mA Vor High level output voltage 2 8 oe V VoL Low level output voltage O 0 5 V Vin High level input voltage 2 31 V Vu Low level input voltage 1 15 V lo Output current on IO pins 100 100 mA Top Operating temperature on PCB 20 70 S Relative ambient humidity non condensing 1O 90 FITP Frame rate integration time product 10 Table 4 1 Electrical characteristics Note 1 Average power for a ToF modulation signal with 50 duty cycle with 6 LEDs mounted Note 2 Depends on current consumption on the IO pins Note 3 The Frame rate Integration time product indicates the power consumption based on integration time in milliseconds and frame rate FITP 4 ti fr The maximum value is valid without cooling Warning Do not operate this device with appropriate cooling An operation without appropriate cooling may cause permanent damage to the device 4 1 2 Absolute Maximum Ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device These are stress ratings only Operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied Exposure to absolute maximum rating conditions for extended periods may affect device reliability Symbol Parameter Min Max
5. Unit Vuen LED supply voltage 0 3 30 V Voc Logic supply voltage 0 3 3 6 V Vio Input or output voltage 0 3 3 6 V TAMB Ambient temperature 20 70 C Tsto Storage temperature 55 125 6 Relative ambient humidity 90 Table 4 2 Absolute maximum ratings Bluetechnix Page 11 25 A TT Ta av a ew N i VIF AN AN E Last change 3 October 2014 Version 2 5 Hardware User Manual LIM U LED 850 4 1 3 Input current The input current depends on the selected frame rate fps and the integration time tint The following figure shows typical values The values for the x axis shows the FITP which has been calculated with the following equation 1 FITP vs Power for LIM U LED 850 0 0215x 13 273 NO OT y 0 0196x 10 318 NO P 24V Vin inear Zone 12V Vin inear Zone Input Power W a 200 400 600 800 frame rate integration time product Figure 4 1 Input power depending on frame rate integration time product 4 1 4 ESD Sensitivity boards can discharge without detection Although this product features patented or proprietary protection circuitry damage may occur on devices subjected to high energy ESD Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality ESD electrostatic discharge sensitive device Charged devices and circuit Bluetechnix O Page 12 25 4
6. 3 MTT UME vr 14 6 1 TOD VION tara cass EE 14 82 BONN 14 JE 0 VIEW ARNIARNA 15 7 Assembly recommendatiOnsS raxrrnnrrnnrrnnrrnnrrnnvrnnvrnnvrnnnrnnnennnennnennnennnennnennnennnennnennnnnnnennuennuennuennne 16 GE 0 elle 0 ME 18 8 1 Power Calculations EE 18 8 2 Temperature Calculations cccccccsscccsseeceseeceeeecseeeeneetaneesaeeeeeeeeeetageetaneesaeesegeetegeetageeseeeeees 18 29 g EEE EA O ee 20 9 1 General EE 20 Bluetechnix N BLUETECHNIX N Embedding Ideas Be 10 Ordering fa 119140 hr O DE 21 11 PIOGUGL FISTO OE i a 22 11 1 Sl SIO aa 01 da IAL OW NE ENE 22 14 1 LEE 22 11 2 TONE sr 22 12 Document Revision History ke 23 13 EE 24 Est Or FUSS TA E 25 Bluetechnix A BLUETECHNIX AP Bluetechnix GmbH 2014 All Rights Reserved The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics Terms of delivery and rights of technical change reserved We hereby disclaim any warranties including but not limited to warranties of non infringement regarding circuits descriptions and charts stated herein Bluetechnix makes and you receive no warranties or conditions express implied statutory or in any communication with you Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a particular purpose Bluetechnix takes no l
7. 3 Applications 93D ToF Sensors IR Flash applications Bluetechnix O Page 7 25 A BLUETECHNIX Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 3 General Description 3 1 Functional Description The following image shows the block diagram of the LIM LED 850 3D Scene LIM U LED 850 Ss LED Driver IR Flash LE Ds Receiver 11V LED uC Temp Sensor vo own Figure 3 1 Hardware Architecture 3 2 Components 3 2 1 Power Supply The input voltage for the LEDs is variable from 12V to 30V An additional 3V3 power supply for the onboard logic is required Bluetechnix Page 8 25 BLUE TECHNIX A E Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 3 2 2 IR Flash LED Six LEDs are placed on the board three LEDs in two strings Two different types of LEDs can be assembled SFH4235 or SFH4236 The SFH4236 has a radiation angle of 40 These LEDs are not used for standard products but a custom assembling can be offered upon request The SFH4235 are default mounted option on the LIMs They have a radiation angle of 120 but exchangeable plastic lenses give the opportunity to adapt the module for the proper application Name Angle profile Assembling Order number RS FL 42 20 Clip on 720 8927 FL 54 125 butterfly Twist on 720 8958 FL 63S 30 lambert Twist on 720 8936 FL 66S 60 lambert Twis
8. 4 Figure 6 3 Side View with 90 Biel deel 15 Figure 7 1 Cooling plate mounmtimg RAKKAR 16 Figure 7 2 EMI shield mountmg rr 17 FOUR 7 3 ENTEN A Mi WE 17 Figure 8 1 Thermal Power Calculation Model 19 Tables Table 3 1 Available Lenses for the SFH4235 cccccssccccssecccssecceececeeeeseueeecaueecsausecsuseessueeesaueessageeesaeeessueessaaees 9 Table 4 1 Electrical characteristice 11 180642 ASLE HAT UT e dl Le CT 11 Table 5 1 Pin out of the LIM connector EE 13 Table 5 2 Mating Connectors nenne nnnnnennnnnnnnnnnnnnnnennnnnennnnnennnnnnnnnnnnnnnnennnnnnennnnne 13 Table 10 1 Order aire e EE 21 Table 11 1 Overview LIM U LED 850 product changes 22 Table 11 2 Product anomalies kk 22 Table 12 1 Revision history use een ernennen 23 Table T e ADD Fe e E 24 Bluetechnix Page 25 25
9. LED Amount Light Cone Angle Note 6 90 3 90 MOQ 100 pcs 6 30 6 60 6 120 3 30 MOQ 100 pcs 3 60 MOQ 100 pcs 3 120 MOQ 100 pcs Table 10 1 Order Information Page 21 25 A BLUETECHNIX RA Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 11 Product History 11 1 Version Information 11 1 1 LIM U LED 850 Version Description 1 0 0 First release 2 0 0 Enhanced support for EC and One Wire Interface Table 11 1 Overview LIM U LED 850 product changes 11 2 Anomalies Version Date Description V1 0 2014 03 06 No anomalies reported yet V2 0 2014 08 27 No anomalies reported yet Table 11 2 Product anomalies Bluetechnix Page 22 25 A BLUETECHNIX RA Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 12 Document Revision History Version 1 2 3 4 5 Bluetechnix Date 2014 03 06 2014 O7 25 2014 08 27 2014 09 19 2014 10 03 Document Revision First release V1 0 of the Document Added FIT P vs Power diagram Changes for hardware revision V2 0 Description for available shielding Changes to operating conditions Updated PONs Table 12 1 Revision history Page 23 25 BLUE TECHNIX Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 13 List of Abbreviations Abbreviation Description ADI Analog Devices Inc Al Analog Input AMS Asynchronous Memor
10. dline 1 The number indicates the step number of a certain procedure you are expected to follow Steps are numbered sequentially This sign gt indicates an expected result of your action References This symbol indicates a cross reference to a different chapter of this manual or to an external document 1 2 Certification X Grade Version X Grade version of the products are not intended for sale and have therefore no certifications The user is responsible for a correct usage in order with federal laws Bluetechnix Page 6 25 A BLUETECHNIX IR Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 2 Introduction 2 1 Overview The LIM LED 850 is a high power IR flash with 6 IR LEDs for the Bluetechnix Modular ToF KIT The wide input voltage range the possibility to assemble lenses for different fields of view and the option to assemble only the half of the LEDs makes the module ideal for a large variety of applications Base Board 3D Scene CONFIG LIM CPU Modul Ge TIM optional Digital Interfaces Figure 2 1 Bluetechnix ToF 3D Sensor System 2 2 Key Features Size 80 x 40mm 3 or 6 High Power IR Emitter Maximum peak optical output power 10W or SW with 3 LEDs Opening Angle 120 without lens Plastic lenses for different opening angles available 30 60 110 12V 30V LED supply 3V3 logic supply EMI shield clips 2
11. iability for any damages and errors causing of the usage of this board The user of this board is responsible by himself for the functionality of his application He is allowed to use the board only if he has the qualification More information is found in the General Terms and Conditions AGB Information For further information on technology delivery terms and conditions and prices please contact Bluetechnix http www bluetechnix com Warning Due to technical requirements components may contain dangerous substances Bluetechnix A BLUE TECHNIX AA Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 1 General Information This guide applies to the LIM LED 850 flash module from Bluetechnix GmbH Follow this guide chapter by chapter to set up and understand your product The document applies to the X Grade product 1 1 Symbols Used This guide makes use of a few symbols and conventions Warning Indicates a situation which if not avoided could result in minor or moderate injury and or property damage or damage to the device Caution Indicates a situation which if not avoided may result in minor damage to the device in malfunction of the device or in data loss A A Note i Notes provide information on special issues related to the device or provide information that will make operation of the device easier Procedures A procedure always starts with a hea
12. igh frequency radiation from the LEDs The following figures taken from the ToF Flash assembling guide shows the mounting of the shielding gt 6x M2 screws gt 3x M2 screws Bluetechnix Page 16 25 A BLUETECHNIX Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 Figure 7 2 EMI shield mounting Bluetechnix provides two shields for different applications 1 4mm shield height for LEDs with lenses 90 60 and 30 viewing angle 2 2mmshield height for LEDs without lenses 120 viewing angle Figure 7 3 EMI shield 4 mm Bluetechnix Page 17 25 BLUETECHNIX A R Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 8 Cooling 8 1 Power Calculations As the LED forward voltage and the mean current are known the electrical LED power can be calculated easily P eo Imean Ur 0 9A 3 2V 2 88W 1 The LEDs have an efficiency of at least 21 i e 79 of the electrical power will be converted in thermal power PtH Pier 0 21 2 28W 2 Port P eo 0 79 0 6W 3 Only the most power consuming parts are taken in consideration Compare to this parts the rest can be neglected This Parts are e 6 LEDs 2 28W each e 2 LED series resistors 0 9W each e 2 half bridge FETs 0 4W each e Buck Converter including all Parts 2 2W The worst case relation between integration time and read out time is 93
13. ing Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 6 Mechanical Outline All Dimensions in the drawings below are given in Millimeters 6 1 Top View 47 70 12 30 12 30 7 200 Ke deefe ER Ge 37 50 40 00 38 20 Ee ES xO ES ee zum EL E Lim am di d L gt 2000 er ewei 22 KK lt x COX I QAR RSS SSR SSS a Land min SE EMI Shield 54 50 80 00 6 2 Bottom View 4 00 40 00 e SS RR 00050 SS e ie RS RR d d d 3 00 4 00 Figure 6 2 Bottom Side Components bottom view Bluetechnix O Page 14 25 A BLUETECHNIX ANAN Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 6 3 Side View 1 Set tl FI RI ET ee LEI KI eee Lem 11 Im a PER 12 1 0 Herr ET f Figure 6 3 Side View with 90 Light cone Bluetechnix Page 15 25 BLUE N Embedding Ideas Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 7 Assembly recommendations For a good thermal performance the LIMs should be mounted to an electrical conductive cooling plate e g alum by using 6 screws For better EMI performance an EMI shield can be assembled afterwards with 3 screws Together the EMI shield and the cooling plate form a faraday cage which suppresses the h
14. t on 720 8939 FL 68D 1208 oval Twist on 720 8949 FL 68S 120 60 oval Twist on 720 8945 FL 69S 140 spot Twist on 720 8942 FL 70 119 spot Twist on 720 8933 FL 82 135 x80 x70 batwing Twist on 720 8951 FL 90 15 lambert Clip on 720 8923 Table 3 1 Available Lenses for the SFH4235 3 2 3 Continuous current and over temperature protection To prevent overheating and the LEDs from constant lighting in case of a false input signal there are two independent protection mechanisms e Temperature monitoring e LED current monitoring Both protections are realized with a customized MKLO4Z8VFK4 microcontroller from Freescale Refer to the ToF Safety Chip manual for further information 3 2 3 1 Continuous current protection The LED current monitoring is realized by measuring the LP filtered switching signal of the LEDs Each String will be individually monitored 3 2 3 2 Over temperature protection The temperature sensor ADT7408CCPZ from Analog Devices is used to monitor the PCB Temperature The sensor is connected via IC to the ToF Safety Chip The temperature levels for enabling the optional fan and for turning of the LED supply can be configured on the fly Bluetechnix Page 9 25 BLUETECHNIX A E Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 3 3 Interfaces The 20 pole connector on the bottom side of the PCB is not only used to power the module but has also several communica
15. tion signals a One Wire Interface a Two Wire Interface IC and the light modulation signals MOD and MOD 3 3 1 Modulation interface The modulation interface is a differential LVDS signal The signal is used to turn on off the LEDs Note Keep the connection between the TIM and LIM as short as possible If multiple LIMs are connected to one TIM then the modulation signals to each LIM must be length matched The MOD signals must be routed with a differential impedance of 100 Ohm 3 3 2 One Wire Interface OWI The One Wire Interface can be used to monitor the current PCB temperature and for the LIM module configuration Refer to the ToF Safety Chip datasheet for information about the protocol 3 3 3 PC The PC compatible Two Wire Interface is also routed to the ToF Safety Chip and can be used as alternative to the OWI 3 3 4 PWM The PWM signal is a standard 3 3V TTL Signal and can be used to drive a fan for active cooling The signal knows three states off on and 8Hz switching with 50 duty cycle Note The PWM signal cannot drive a fan directly Make sure that the fan is driven by an external N m channel MOSFET Bluetechnix Page 10 25 Hardware User Manual LIM U LED 850 BT A BLUETECHNIX iis Last change 3 October 2014 Version 2 5 4 Specifications 4 1 Electrical Specifications 4 1 1 Operating Conditions Symbol Parameter Min Typical Max Unit Vuen Inout supply voltage 12 30 V PLeD
16. va wN BLUE TECHNIX Embedding Ideas LIM U LED 850 6 Hardware User Manual Version 2 5 4 BLUETECHNIX ON Embedding Ideas Contact Bluetechnix Waidhausenstra e 3 19 A 1140 Vienna AUSTRIA office bluetechnix com http www bluetechnix com Date 2014 10 03 Bluetechnix y AA BLUETECHNIX 4 EN N 4 4 Table of Contents 1 EEN ege ne 6 T LE EE 6 GENea TR ee eee 6 e de ESE EE EE EE aa EE nun T Ga E e e 7 2A AE T 2 PN T HR ele a een 8 3 1 ge gele ps DESCON UON EEE ER MN 8 GER een leen REE EE 8 3 2 1 POWER EEN 8 BRENN ee 9 3 2 3 Continuous current and over temperature Drotechon 9 GE OS Ska a i VA P AE AAE A EE EE 10 3 3 1 Modulation interface r r rervnurernnnrernnnrvnnnnernnenernnenennnnnennnnvennnnernnenennnnnennnnnennnnvennanernnenenene 10 3 3 2 One Wire Interface QW 2222u0 20200220200nnnnn nenne nnnnn neuen nennen nnnnnnnnnne 10 Do TO EEE ee ee A eg 10 SE u PN 10 rege 11 4 1 Electrical Specifications cccecccccsseecceeeeceeeeeceeeecaueeecaueeesaueecsaeessueeeseueessaueessaueessaseessaeeessaes 11 4 1 1 CO Gl Ati Beie e gen EE 11 4 1 2 Absolute Maximum FEN en 11 4 1 3 Je 6 OU SIA E 12 Als GR EN EEE NE 12 5 Connector Description asks krk RL LR L REAL A RN KRR KARLAR K 13 5 1 ME NR 1
17. y Select AO Analog Output CM Core Module DC Direct Current DSP Digital Signal Processor eCM Enhanced Core Module External Bus Interface ESD Electrostatic Discharge GPIO General Purpose Input Output Input PC Inter Integrated Circuit I O Input Output ISM Image Sensor Module LDO Low Drop Out regulator MTBF Mean Time Between Failure NC Not Connected NFC NAND Flash Controller O Output OS Operating System PPI Parallel Peripheral Interface PWR Power RTOS Real Time Operating System SADA Stand Alone Debug Agent SD Secure Digital SoC System on Chip SPI Serial Peripheral Interface SPM Speech Processing Module SPORT Serial Port TFT Thin Film Transistor TISM Tiny Image Sensor Module TSC Touch Screen Controller UART Universal Asynchronous Receiver Transmitter USB Universal Serial Bus USBOTG USB On The Go ZIF Zero Insertion Force Bluetechnix Table 13 1 List of abbreviations Page 24 25 BLUETECHNIX Hardware User Manual LIM U LED 850 Last change 3 October 2014 Version 2 5 A List of Figures and Tables Figures Figure 2 1 Bluetechnix TOF 3D Sensor System 22uu002200000n0nnonnnnnonnnnnonnnnnnnnnnn nenne nnnnne nennen nnnnnnnennennennennnnnennnn 7 Figure 3 1 Hardware Architecture kA 8 Figure 4 1 Input power depending on frame rate integration time 4 12 Figure 6 1 Top side Ha ale EE 14 Figure 6 2 Bottom Side Components bottom view 1
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