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HP ProLiant MicroServer Gen8 Maintenance and Service Guide

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Contents

1. 25 Remove the front bezel 26 Remove the chassis cover 27 Install the chassis cover 28 Remove the system board assembly 29 Install the system board assembly 31 Drive carrier 31 LFF non hot plug drive 32 Optical drive blank 34 Optical drive 34 Flash backed write cache procedures
2. 64 Contents 4 HP Insight Diagnostics survey functionality 64 HP Insight Remote Support software 64 HP ROM Based Setup Utility 65 Integrated Management Log 65 USB support and functionality 65 USB support 65 Internal USB functionality 66 External USB functionality 66 Automatic Server Recovery 66 Component identification
3. 35 FBWC module 35 Capacitor pack 36 Recovering data from the flash backed write cache 38 Front I O module assembly 38 Ambient temperature sensor cable 41 LFF non hot plug drive cable assembly 42 System fan 46 Integrated power supply 47 Expansion board 48 DIMMs
4. 49 Heatsink 50 Processor 52 System board 54 System battery 61 HP Trusted Platform Module 62 Troubleshooting 63 Troubleshooting resources 63 Diagnostic tools 64 Product QuickSpecs 64 HP Insight Diagnostics
5. 67 Front panel components 67 Front panel LEDs and buttons 68 Rear panel components 69 Rear panel LEDs and buttons 70 System board components 70 DIMM slot locations 72 System maintenance switch 72 NMI functionality 73 Drive numbering 73 FBWC module LED definitions
6. 79 Power supply cabling 80 Specifications 81 Environmental specifications 81 Server specifications 81 Power supply specifications 81 HP 150 W Integrated Power Supply specifications 82 HP 200 W Integrated Power Supply specifications 82 Acronyms and abbreviations 83 Documentation feedback 85 Index
7. 74 Fan location 75 T 10 T 15 Torx screwdriver 75 Cabling 76 Cabling overview 76 Four bay LFF non hot plug drive cabling 76 Capacitor pack cabling 77 Optical drive cabling 78 Front I O assembly cabling 78 Ambient temperature sensor cabling 79 System fan cabling
8. 15 Mechanical components 15 System components 18 Removal and replacement procedures 22 Required tools 22 Safety considerations 22 Preventing electrostatic discharge 22 Symbols on equipment 22 Server warnings and cautions 23 Preparation procedures 23 Power down the server 24 Open the front bezel
9. If installed remove the expansion board Expansion board on page 48 8 Remove the front panel cover a Remove the front panel cover screws b Starting from the bottom side and moving upward release the rear side latches from their metal tabs Removal and replacement procedures 39 c To detach the cover from the chassis push the latches toward the front 9 Remove the power button LED module a Release the module cable from the top chassis clips b Remove the module bracket screw c Remove the module bracket Removal and replacement procedures 40 d Press the two module latches together and then pull the module from the chassis 10 Remove the front USB module a Remove the USB module screw b Pull the USB module out of the chassis 11 Remove the front I O module assembly a Pull the blue loop to disconnect the front I O module cable from the system board b Release the cable from the two chassis cable clips located on the underside of the drive cage Removal and replacement procedures 41 c Release the cable from the left side cable clip d Pull the module cable out through the top chassis opening e Pull the entire assembly out of the front USB module chassis opening To replace the component reverse the removal procedure Ambient temperature sensor cable To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC s
10. WARNING To reduce the risk of personal injury from hot surfaces allow the drives and the internal system components to cool before touching them CAUTION To avoid damage to the processor and system board only authorized personnel should attempt to replace or install the processor in this server IMPORTANT If installing a processor with a faster speed update the system ROM before installing the processor To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Remove the system board assembly on page 29 6 Remove the heatsink Heatsink on page 50 CAUTION To avoid damage to the processor do not touch the bottom of the processor especially the contact area CAUTION The pins on the processor socket are very fragile Any damage to them may require replacing the system board 7 Open the processor locking lever and then open the processor retaining bracket 8 Grasp the processor by the edges and then lift it out of the socket To replace the component Removal and replacement procedures 53 CAUTION Failure to completely open the processor locking lever prevents the processor from seating during installation leading to hardware damage CAUTION THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED To avoid damage to the sys
11. HP ProLiant MicroServer Gen8 Maintenance and Service Guide Abstract This document is for an experienced service technician It is helpful if you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions Part Number 718901 002 July 2014 Edition 2 Copyright 2013 2014 Hewlett Packard Development Company L P The information contained herein is subject to change without notice The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services Nothing herein should be construed as constituting an additional warranty HP shall not be liable for technical or editorial errors or omissions contained herein Microsoft and Windows are U S registered trademarks of Microsoft Corporation Intel Celeron Pentium and Xeon are trademarks of Intel Corporation in the U S and other countries Contents 3 Contents Customer self repair 5 Parts only warranty service 5 Illustrated parts catalog
12. SATA serial ATA SD Secure Digital SPP HP Service Pack for ProLiant TPM Trusted Platform Module UDIMM unregistered dual in line memory module USB universal serial bus Documentation feedback 85 Documentation feedback HP is committed to providing documentation that meets your needs To help us improve the documentation send any errors suggestions or comments to Documentation Feedback mailto docsfeedback hp com Include the document title and part number version number or the URL when submitting your feedback Index 86 A ambient temperature sensor cable 41 ambient temperature sensor cabling 79 Automatic Server Recovery ASR 66 B battery 61 bezel opening 25 bezel removing 26 C cabling drive cage 76 cabling FBWC 77 cabling front I O 78 cabling internal power 80 cabling optical drive 78 cache module 35 74 capacitor pack 36 capacitor pack cabling 77 Care Pack 64 chassis cover installing 28 chassis cover removing 27 clearing NVRAM 72 CMOS 72 components front panel 67 components mechanical 15 components rear panel 69 components system board 70 crash dump analysis 73 customer self repair CSR 5 D data recovery 38 diagnostic tools 64 66 dimensions and weight 81 DIMM slot locations 72 documentation feedback 85 drive cabling 76 drive carrier 31 drive LEDs 68 drive numbering 73 drive removing 32 drives determining status of 68 E electrostatic dis
13. 140 F Relative humidity non condensing Operating maximum wet bulb temperature of 28 C 82 4 F 10 to 90 Non operating maximum wet bulb temperature of 38 7 C 101 7 F 5 to 95 All temperature ratings shown are for sea level An altitude derating of 1 C per 304 8 m 1 8 F per 1 000 ft to 3048 m 10 000 ft is applicable No direct sunlight allowed Server specifications Specification Server Height 23 25 cm 9 15 in Depth 24 50 cm 9 65 in Width 23 00 cm 9 06 in Weight minimum one drive power supply and processor installed 7 40 kg 16 31 lb Weight maximum all drives power supply and processor installed 9 80 kg 21 60 lb Power supply specifications Depending on the installed options and or the regional location where the server was purchased the server is configured with one of the following power supplies HP 150 W Integrated Power Supply non hot plug non redundant HP 150 W Integrated Power Supply specifications on page 82 HP 200 W Integrated Power Supply non hot plug non redundant HP 200 W Integrated Power Supply specifications on page 82 Specifications 82 HP 150 W Integrated Power Supply specifications Specification Value Input requirements Rated input voltage 100 V AC to 240 V AC Rated input frequency 50 Hz to 63 Hz Rated input current 3 5 A at 100 V AC Rated input power lt 192W at 100 V AC lt 185 W
14. 60 C 140 F Do not disassemble crush puncture short external contacts or dispose of in fire or water Replace only with the spare designated for this product To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 If installed remove the expansion board Expansion board on page 48 6 Locate the battery on the system board System board components on page 70 7 Remove the battery IMPORTANT Replacing the system board battery resets the system ROM to its default configuration After replacing the battery reconfigure the system through RBSU To replace the component reverse the removal procedure For more information about battery replacement or proper disposal contact an authorized reseller or an authorized service provider Removal and replacement procedures 62 HP Trusted Platform Module The TPM is not a customer removable part CAUTION Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet Upon locating a broken or disfigured rivet on an installed TPM administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data If you suspect a TPM board failure leave the TPM installed and remove the system board Remove the sy
15. 86 Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair CSR parts to minimize repair time and allow for greater flexibility in performing defective parts replacement If during the diagnosis period HP or HP service providers or service partners identifies that the repair can be accomplished by the use of a CSR part HP will ship that part directly to you for replacement There are two categories of CSR parts Mandatory Parts for which customer self repair is mandatory If you request HP to replace these parts you will be charged for the travel and labor costs of this service Optional Parts for which customer self repair is optional These parts are also designed for customer self repair If however you require that HP replace them for you there may or may not be additional charges depending on the type of warranty service designated for your product NOTE Some HP parts are not designed for customer self repair In order to satisfy the customer warranty HP requires that an authorized service provider replace the part These parts are identified as No in the Illustrated Parts Catalog Based on availability and where geography permits CSR parts will be shipped for next business day delivery Same day or four hour delivery may be offered at an additional charge where geography permits If assistance is required you can call the HP Technical Support Center and a technician
16. Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar Customer Self Repair CSR para minimizar el tiempo de reparaci n y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos Si durante la fase de diagn stico HP o los proveedores o socios de servicio de HP identifica que una reparaci n puede llevarse a cabo mediante el uso de un componente CSR HP le enviar dicho componente directamente para que realice su sustituci n Los componentes CSR se clasifican en dos categor as Obligatorio componentes para los que la reparaci n por parte del usuario es obligatoria Si solicita a HP que realice la sustituci n de estos componentes tendr que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio Opcional componentes para los que la reparaci n por parte del usuario es opcional Estos componentes tambi n est n dise ados para que puedan ser reparados por el usuario Sin embargo si precisa que HP realice su sustituci n puede o no conllevar costes adicionales dependiendo del tipo de servicio de garant a correspondiente al producto NOTA Algunos componentes no est n dise ados para que puedan ser reparados por el usuario Para que el usuario haga valer su garant a HP pone como condici n que un proveedor de servicios autorizado realice la sustituci n de estos componentes Dichos componentes se identifican con la palabra No e
17. ROM USB 3 0 ports are not functional before the OS loads The native OS provides USB 3 0 support through appropriate xHCI drivers Legacy USB support provides USB functionality in environments where USB support is not available normally Specifically HP provides legacy USB functionality for the following POST Diagnostic tools 66 RBSU Diagnostics DOS Operating environments which do not provide native USB support Internal USB functionality An internal USB connector is available for use with security key devices and USB drive keys This solution provides for use of a permanent USB key installed in the internal connector avoiding physical access to secure data External USB functionality HP provides external USB support to enable local connection of USB devices for server administration configuration and diagnostic procedures For additional security external USB functionality can be disabled through RBSU Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs such as a blue screen ABEND does not apply to HP ProLiant DL980 Servers or panic A system fail safe timer the ASR timer starts when the System Management driver also known as the Health Driver is loaded When the operating system is functioning properly the system periodically resets the timer However when the operating system fails the timer expires an
18. ces pi ces l intervention peut ou non vous tre factur e selon le type de garantie applicable votre produit 3No Non Certaines pi ces HP ne sont pas con ues pour permettre au client d effectuer lui m me la r paration Pour que la garantie puisse s appliquer HP exige que le remplacement de la pi ce soit effectu par un Mainteneur Agr Ces pi ces sont identifi es par la mention Non dans le Catalogue illustr 1Mandatory Obbligatorie Parti che devono essere necessariamente riparate dal cliente Se il cliente ne affida la riparazione ad HP deve sostenere le spese di spedizione e di manodopera per il servizio 2Optional Opzionali Parti la cui riparazione da parte del cliente facoltativa Si tratta comunque di componenti progettati per questo scopo Se tuttavia il cliente ne richiede la sostituzione ad HP potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto 3No Non CSR Alcuni componenti HP non sono progettati per la riparazione da parte del cliente Per rispettare la garanzia HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato Tali parti sono identificate da un No nel Catalogo illustrato dei componenti 1Mandatory Zwingend Teile die im Rahmen des Customer Self Repair Programms ersetzt werden m ssen Wenn Sie diese Teile von HP ersetzen lassen werden Ihnen die Versand und Arbeitskosten f r diesen Service berechnet 2
19. da HP n o s o projetadas para o reparo feito pelo cliente A fim de cumprir a garantia do cliente a HP exige que um t cnico autorizado substitua a pe a Essas pe as est o identificadas com a marca No N o no cat logo de pe as ilustrado Illustrated parts catalog 21 Removal and replacement procedures 22 Removal and replacement procedures Required tools You need the following items for some procedures T 10 T 15 Torx screwdriver on page 75 HP Insight Diagnostics on page 64 Safety considerations Before performing service procedures review all the safety information Preventing electrostatic discharge To prevent damaging the system be aware of the precautions you need to follow when setting up the system or handling parts A discharge of static electricity from a finger or other conductor may damage system boards or other static sensitive devices This type of damage may reduce the life expectancy of the device To prevent electrostatic damage Avoid hand contact by transporting and storing products in static safe containers Keep electrostatic sensitive parts in their containers until they arrive at static free workstations Place parts on a grounded surface before removing them from their containers Avoid touching pins leads or circuitry Always be properly grounded when touching a static sensitive component or assembly Symbols on equipment The fol
20. server on page 24 3 Transfer the drives from the failed server to the recovery server 4 Perform one of the following o If the array controller has failed remove the cache module and capacitor pack from the failed array controller and install the cache module and capacitor pack on an identical array controller model in the recovery server o If the server has failed remove the controller cache module and capacitor pack from the failed server and install the controller cache module and capacitor pack in the recovery server 5 Power up the recovery server If there was data in the cache at the time of the controller or server failure a 1792 POST message appears stating that valid data was flushed from the cache This data is now stored on the drives in the recovery server You can now transfer the drives and controller if one is used to another server If the drives are migrated to different drive positions or there are volumes present in the recovery server a 1724 POST message appears stating that logical drive configuration has been updated automatically Front I O module assembly To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the front bezel on page 26 5 Remove the chassis cover on page 27 6 If installed remove the optical drive Optical drive on page 34 7
21. servi o postal a ser utilizado Para obter mais informa es sobre o programa de reparo feito pelo cliente da HP entre em contato com o fornecedor de servi os local Para o programa norte americano visite o site da HP http www hp com go selfrepair Servi o de garantia apenas para pe as A garantia limitada da HP pode incluir um servi o de garantia apenas para pe as Segundo os termos do servi o de garantia apenas para pe as a HP fornece as pe as de reposi o sem cobrar nenhuma taxa Customer self repair 11 No caso desse servi o a substitui o de pe as CSR obrigat ria Se desejar que a HP substitua essas pe as ser o cobradas as despesas de transporte e m o de obra do servi o Customer self repair 12 Customer self repair 13 Customer self repair 14 Illustrated parts catalog 15 Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair on page 5 1 Chassis cover 724494 001 Mandatory1 2 Optical drive blank 724499 001 Mandatory1 3 LFF non hot plug drive carrier 691585 001 Mandatory1 4 Front bezel assembly 724490 001 Mandatory1 5 System board tray 724500 001 Mandatory1 6 Heatsink 724501 001 Optional2 When no drive is installed in the non hot plug drive carrier it serves as a blank for a non hot plug drive configuration 1Mandatory Parts for which customer self repair is mandatory If you request HP t
22. symbols on power supplies or systems indicate that the equipment is supplied by multiple sources of power WARNING To reduce the risk of injury from electric shock remove all power cords to completely disconnect power from the system Server warnings and cautions WARNING To reduce the risk of personal injury from hot surfaces allow the drives and the internal system components to cool before touching them WARNING To reduce the risk of personal injury electric shock or damage to the equipment remove the power cord to remove power from the server The front panel Power On Standby button does not completely shut off system power Portions of the power supply and some internal circuitry remain active until AC power is removed CAUTION Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure CAUTION Do not operate the server for long periods with the chassis cover open or removed Operating the server in this manner results in improper airflow and improper cooling that might lead to thermal damage CAUTION When installing hardware or performing maintenance procedures requiring access to internal components HP recommends that you first back up all server data to avoid loss Preparation procedures To access some co
23. will help you over the telephone HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP In cases where it is required to return the defective part to HP you must ship the defective part back to HP within a defined period of time normally five 5 business days The defective part must be returned with the associated documentation in the provided shipping material Failure to return the defective part may result in HP billing you for the replacement With a customer self repair HP will pay all shipping and part return costs and determine the courier carrier to be used For more information about HP s Customer Self Repair program contact your local service provider For the North American program refer to the HP website http www hp com go selfrepair Parts only warranty service Your HP Limited Warranty may include a parts only warranty service Under the terms of parts only warranty service HP will provide replacement parts free of charge For parts only warranty service CSR part replacement is mandatory If you request HP to replace these parts you will be charged for the travel and labor costs of this service R paration par le client CSR Les produits HP comportent de nombreuses pi ces CSR Customer Self Repair r paration par le client afin de minimiser les d lais de r paration et faciliter le remplacement des pi ces d fectueuses Si pendant la p riode de diagno
24. During the server startup sequence press the F9 key to access RBSU 2 Select the Advanced Options menu 3 Select Service Options 4 Select Serial Number The following warning appears Warning The serial number should ONLY be modified by qualified service personnel This value should always match the serial number located on the chassis 5 Press the Enter key to clear the warning 6 Enter the serial number and press the Enter key 7 Select Product ID The following warning appears Warning The Product ID should ONLY be modified by qualified service personnel This value should always match the Product ID located on the chassis 8 Enter the product ID and press the Enter key 9 Press the Esc key to close the menu 10 Press the Esc key to exit RBSU 11 Press the F10 key to confirm exiting RBSU The server automatically reboots Removal and replacement procedures 61 System battery If the server no longer automatically displays the correct date and time then replace the battery that provides power to the real time clock Under normal use battery life is 5 to 10 years WARNING The computer contains an internal lithium manganese dioxide a vanadium pentoxide or an alkaline battery pack A risk of fire and burns exists if the battery pack is not properly handled To reduce the risk of personal injury Do not attempt to recharge the battery Do not expose the battery to temperatures higher than
25. Optional Optional Teile f r die das Customer Self Repair Verfahren optional ist Diese Teile sind auch f r Customer Self Repair ausgelegt Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen m chten k nnen bei diesem Service je nach den f r Ihr Produkt vorgesehenen Garantiebedingungen zus tzliche Kosten anfallen 3No Kein Einige Teile sind nicht f r Customer Self Repair ausgelegt Um den Garantieanspruch des Kunden zu erf llen muss das Teil von einem HP Servicepartner ersetzt werden Im illustrierten Teilekatalog sind diese Teile mit No bzw Nein gekennzeichnet Illustrated parts catalog 20 1Mandatory Obligatorio componentes para los que la reparaci n por parte del usuario es obligatoria Si solicita a HP que realice la sustituci n de estos componentes tendr que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio 2Optional Opcional componentes para los que la reparaci n por parte del usuario es opcional Estos componentes tambi n est n dise ados para que puedan ser reparados por el usuario Sin embargo si precisa que HP realice su sustituci n puede o no conllevar costes adicionales dependiendo del tipo de servicio de garant a correspondiente al producto 3No No Algunos componentes no est n dise ados para que puedan ser reparados por el usuario Para que el usuario haga valer su garant a HP pone como condici n que un proveedor de servicios autorizad
26. actual support agreement HP ROM Based Setup Utility RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration activities that can include the following Configuring system devices and installed options Enabling and disabling system features Displaying system information Selecting the primary boot controller Configuring memory options Language selection For more information on RBSU see the HP ROM Based Setup Utility User Guide on the Documentation CD or the HP RBSU Information Library http www hp com go rbsu docs Integrated Management Log The IML records hundreds of events and stores them in an easy to view form The IML timestamps each event with 1 minute granularity You can view recorded events in the IML in several ways including the following From within HP SIM From within operating system specific IML viewers o For Windows IML Viewer o For Linux IML Viewer Application From within the iLO user interface From within HP Insight Diagnostics on page 64 USB support and functionality USB support HP provides standard USB 2 0 support standard USB 3 0 support and legacy USB support Standard support is provided by the OS through the appropriate USB device drivers Before the OS loads HP provides support for USB 2 0 devices through legacy USB support which is enabled by default in the system
27. ard To replace the system board 1 Install the system board CAUTION Failure to completely open the processor locking lever prevents the processor from seating during installation leading to hardware damage CAUTION To avoid damage to the processor do not touch the bottom of the processor especially the contact area Removal and replacement procedures 57 2 Open the processor locking lever and then open the processor retaining bracket 3 Remove the processor socket cover CAUTION THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED To avoid damage to the system board Do not touch the processor socket contacts Do not tilt or slide the processor when lowering the processor into the socket Removal and replacement procedures 58 4 Install the processor Use the notches on both sides of the processor to properly align it into the socket CAUTION Be sure to close the processor socket retaining bracket before closing the processor locking lever The lever should close without resistance Forcing the lever closed can damage the processor and socket requiring system board replacement 5 Close the processor retaining bracket and then secure the processor locking lever 6 Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab Allow the alcohol to evaporate before continuing Removal and replacement procedures 59 7 Apply all th
28. at 200 V AC Efficiency minimum 79 Power supply output Rated steady state power 150 W at 100 V AC 150 W at 200 V AC Maximum peak power 150 W at 100 V AC 150 W at 200 V AC Rated output power 150 W HP 200 W Integrated Power Supply specifications Specification Value Input requirements Rated input voltage 100 V AC to 240 V AC Rated input frequency 50 Hz to 63 Hz Rated input current 3 5 A at 100 V AC Rated input power lt 243 W at 100 V AC lt 237 W at 200 V AC Efficiency 81 5 Power supply output Rated steady state power 200 W at 100 V AC 200 W at 200 V AC Maximum peak power 200 W at 100 V AC 200 W at 200 V AC Rated output power 200 W Acronyms and abbreviations 83 Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery CSR Customer Self Repair DDR3 double data rate 3 FBWC flash backed write cache HP SIM HP Systems Insight Manager iLO Integrated Lights Out IML Integrated Management Log LFF large form factor LV DIMM low voltage DIMM NMI nonmaskable interrupt Acronyms and abbreviations 84 NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power On Self Test PSU power supply unit RBSU ROM Based Setup Utility RDIMM registered dual in line memory module SAS serial attached SCSI
29. bles are not in a position where they can be pinched or crimped Four bay LFF non hot plug drive cabling The four bay LFF non hot plug drive cable assembly consists of the drive power and Mini SAS cables attached to a bracket If either the drive power or Mini SAS cable becomes defective the entire cable assembly will need to be replaced spare PN 724493 001 Mini SAS cable connected to the system board Item Description 1 4 pin power cable connected to the PSU P2 cable 2 Mini SAS cable Cabling 77 Mini SAS cable connected to controller board Item Description 1 4 pin power cable connected to the PSU P2 cable 2 Mini SAS cable Capacitor pack cabling Cabling 78 Optical drive cabling Item Description 1 4 pin power connector connected to the PSU P3 cable of the optical drive SATA Y cable 2 Common end of the optical drive SATA Y cable 3 SATA connector of the optical drive SATA Y cable Front I O assembly cabling Cabling 79 Ambient temperature sensor cabling System fan cabling Cabling 80 Power supply cabling Item PSU cable marker Description 1 P3 4 pin optical drive power cable 2 P2 4 pin drive power cable 3 P1 24 pin system board power cable Specifications 81 Specifications Environmental specifications Specification Value Temperature range Operating 10 C to 35 C 50 F to 95 F Non operating 30 C to 60 C 22 F to
30. cache modules designed for other controller models because the controller can malfunction and you can lose data Also do not transfer this cache module to an unsupported controller model because you can lose data CAUTION In systems that use external data storage be sure that the server is the first unit to be powered down and the last to be powered back up Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server Removal and replacement procedures 36 4 Remove the chassis cover on page 27 CAUTION When connecting or disconnecting the capacitor pack cable the connectors on the cache module and cable are susceptible to damage Avoid excessive force and use caution to avoid damage to these connectors 5 Disconnect the capacitor pack cable from the cache module 6 Remove the cache module To replace the component reverse the removal procedure Capacitor pack CAUTION In systems that use external data storage be sure that the server is the first unit to be powered down and the last to be powered back up Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up To remove the component 1 Power down the serve
31. charge 22 environmental specifications 81 error messages 63 expansion board 48 external USB functionality 66 F fan cabling 79 fan location 75 FBWC module 35 FBWC module LEDs 74 flash backed write cache procedures 35 38 front bezel 25 front I O assembly 38 front I O cabling 78 front panel buttons 68 front panel components 67 front panel LEDs 68 H health driver 66 health LED 68 heatsink 50 HP Insight Diagnostics 64 HP Insight Diagnostics survey functionality 64 HP Insight Remote Support software 64 HP Systems Insight Manager SIM 64 65 HP technical support 5 humidity 81 I illustrated parts catalog 15 iLO connector 69 Integrated Lights Out iLO 65 Integrated Management Log IML 65 integrated power supply 47 internal USB connector 70 internal USB functionality 66 Index Index 87 K Kensington security slot 69 L LED system power 68 LEDs drive 68 LEDs FBWC module 74 LEDs front panel 68 LEDs NIC 68 70 LEDs rear panel 70 legacy USB support 65 M maintenance 22 mechanical components 15 mechanical specifications 81 memory dump 73 microSD card slot 70 N NIC connectors 69 NMI functionality 73 NMI header 70 73 non hot plug drive cable assembly 42 non hot plug drives removing 32 O operating system crash 66 73 operating systems supported 64 optical drive 34 optical drive blank 34 optical drive cabling 78 P part numbers 15 POST error messages 63 power down procedure 24 po
32. cliente opcional Essas pe as tamb m s o projetadas para o reparo feito pelo cliente No entanto se desejar que a HP as substitua pode haver ou n o a cobran a de taxa adicional dependendo do tipo de servi o de garantia destinado ao produto OBSERVA O Algumas pe as da HP n o s o projetadas para o reparo feito pelo cliente A fim de cumprir a garantia do cliente a HP exige que um t cnico autorizado substitua a pe a Essas pe as est o identificadas com a marca No N o no cat logo de pe as ilustrado Conforme a disponibilidade e o local geogr fico as pe as CSR ser o enviadas no primeiro dia til ap s o pedido Onde as condi es geogr ficas permitirem a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional Se precisar de aux lio entre em contato com o Centro de suporte t cnico da HP para que um t cnico o ajude por telefone A HP especifica nos materiais fornecidos com a pe a CSR de reposi o se a pe a com defeito deve ser devolvida HP Nos casos em que isso for necess rio preciso enviar a pe a com defeito HP dentro do per odo determinado normalmente cinco 5 dias teis A pe a com defeito deve ser enviada com a documenta o correspondente no material de transporte fornecido Caso n o o fa a a HP poder cobrar a reposi o Para as pe as de reparo feito pelo cliente a HP paga todas as despesas de transporte e de devolu o da pe a e determina a transportadora
33. d restarts the server ASR increases server availability by restarting the server within a specified time after a system hang At the same time the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system You can disable ASR from the System Management Homepage or through RBSU Component identification 67 Component identification Front panel components Item Description 1 USB 2 0 connectors 2 Optical drive optional 3 Drive bays inside 4 Front bezel Component identification 68 Front panel LEDs and buttons Item Description Status 1 Power On Standby button and system power LED Solid green System on Flashing green 1 Hz cycle per sec Performing power on sequence Solid amber System in standby Off No power present 2 NIC status LED Solid green Link to network Flashing green 1 Hz cycle per sec Network active Off No network activity 3 Drive status LED Solid green System on Flashing green Drive activity Off System in standby or no power present 4 Health LED Solid blue Normal Flashing amber System degraded Flashing red 1 Hz cycle per sec System critical Fast flashing red 4 Hz cycles per sec Power fault Facility power is not present power cord is not attached no power supplies are installed power supply failure has occurred or the power button cable is disconnected To identify components in a degrad
34. drive blank release latches and then pull the blank out of the drive bay To replace the component reverse the removal procedure Optical drive CAUTION To prevent improper cooling and thermal damage do not operate the server unless all bays are populated with either a component or a blank To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Disconnect the optical drive cable from the drive Removal and replacement procedures 35 6 Press the optical drive release lever and then push the drive out of the bay To replace the component reverse the removal procedure Flash backed write cache procedures The following types of procedures are provided for the FBWC option Removal and replacement of failed components o Removing the cache module FBWC module on page 35 o Removing the capacitor pack Capacitor pack on page 36 Recovery of cached data from a failed server Recovering data from the flash backed write cache on page 38 CAUTION Do not detach the cable that connects the battery pack or capacitor pack to the cache module Detaching the cable causes all data in the cache module to be lost FBWC module CAUTION The cache module connector does not use the industry standard DDR3 mini DIMMs Do not use the controller with
35. e HP Dans les documents envoy s avec la pi ce de rechange CSR HP pr cise s il est n cessaire de lui retourner la pi ce d fectueuse Si c est le cas vous devez le faire dans le d lai indiqu g n ralement cinq 5 jours ouvr s La pi ce et sa documentation doivent tre retourn es dans l emballage fourni Si vous ne retournez pas la pi ce d fectueuse HP se r serve le droit de vous facturer les co ts de remplacement Dans le cas d une pi ce CSR HP supporte l ensemble des frais d exp dition et de retour et d termine la soci t de courses ou le transporteur utiliser Pour plus d informations sur le programme CSR de HP contactez votre Mainteneur Agr e local Pour plus d informations sur ce programme en Am rique du Nord consultez le site Web HP http www hp com go selfrepair Service de garantie pi ces seules Votre garantie limit e HP peut inclure un service de garantie pi ces seules Dans ce cas les pi ces de rechange fournies par HP ne sont pas factur es Dans le cadre de ce service la r paration des pi ces CSR par le client est obligatoire Si vous demandez HP de remplacer ces pi ces les co ts de d placement et main d uvre du service vous seront factur s Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilit nella sostituzione di parti difettose i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttame
36. e grease to the top of the processor in the following pattern to ensure even distribution CAUTION Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs in an X pattern Do not overtighten the screws as this can damage the board connectors or screws Use the wrench supplied with the system to reduce the possibility of overtightening the screws 8 Install the heatsink a Position the heatsink on the processor backplate b Tighten one pair of diagonally opposite screws halfway and then tighten the other pair of screws c Finish the installation by completely tightening the screws in the same sequence CAUTION When returning a damaged system board to HP always install all processor socket covers to prevent damage to the processor sockets and system board Removal and replacement procedures 60 9 Install the processor socket cover on the failed system board 10 Install the system board assembly on page 31 11 Install the DIMMs 12 If removed install the expansion board 13 Install the chassis cover on page 28 14 Connect the power cord to the server 15 Connect the power cord to the AC power source 16 Press the Power On Standby button The server exits standby mode and applies full power to the system The system power LED changes from amber to green After you replace the system board you must re enter the server serial number and the product ID 1
37. e klant optioneel is Ook deze onderdelen zijn ontworpen voor reparatie door de klant Als u echter HP verzoekt deze onderdelen voor u te vervangen kunnen daarvoor extra kosten in rekening worden gebracht afhankelijk van het type garantieservice voor het product 3No Nee Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen Deze onderdelen worden in de ge llustreerde onderdelencatalogus aangemerkt met Nee 1Mandatory Obrigat ria Pe as cujo reparo feito pelo cliente obrigat rio Se desejar que a HP substitua essas pe as ser o cobradas as despesas de transporte e m o de obra do servi o Illustrated parts catalog 17 2Optional Opcional Pe as cujo reparo feito pelo cliente opcional Essas pe as tamb m s o projetadas para o reparo feito pelo cliente No entanto se desejar que a HP as substitua pode haver ou n o a cobran a de taxa adicional dependendo do tipo de servi o de garantia destinado ao produto 3No Nenhuma Algumas pe as da HP n o s o projetadas para o reparo feito pelo cliente A fim de cumprir a garantia do cliente a HP exige que um t cnico autorizado substitua a pe a Essas pe as est o identificadas com a marca No N o no cat logo de pe as ilustrado Illustrated parts catalog 18 System components Item Description Spare part number Customer se
38. e system fan and then remove the fan To replace the component reverse the removal procedure Removal and replacement procedures 47 Integrated power supply WARNING To reduce the risk of personal injury from hot surfaces allow the power supply or power supply blank to cool before touching it To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 If installed remove the optical drive Optical drive on page 34 6 Disconnect all power supply cables a Disconnect the PSU P1 cable from the system board and then release it from the left side chassis cable clip b If installed remove the optical drive Optical drive on page 34 c Disconnect the PSU P3 cable from the 4 pin optical drive power cable d Disconnect the PSU P2 cable from the 4 pin drive power cable 7 Remove the power supply a Remove the three screws from the rear side of the power supply b Remove the one screw from the front side of the power supply Removal and replacement procedures 48 c Remove the power supply To replace the component reverse the removal procedure Expansion board To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remo
39. ed or critical state see the iLO BIOS logs and the server troubleshooting guide Component identification 69 Rear panel components Item Description 1 Kensington security slot 2 Power supply 3 Serial number iLO information tag 4 Power cord connector 5 Dedicated iLO connector 6 Video connector 7 USB 3 0 connectors 8 USB 2 0 connectors 9 NIC connector 2 10 NIC connector 1 shared iLO connector 11 System fan The serial number iLO information tag shows the server serial number and the default iLO account information The same information is printed on separate labels located on the rear panel Component identification 70 Rear panel LEDs and buttons Item Description Status 1 NIC link LED Solid green Link exists Off No link exists 2 NIC status LED Solid green Link to network Flashing green 1 Hz cycle per sec Network active Off No network activity System board components Component identification 71 Item Description 1 Fan connector 2 DIMM slots 3 Front I O connector 4 Processor socket 5 TPM connector 6 System battery 7 Mini SAS connector 8 Optical drive SATA connector 9 Ambient temperature sensor connector 10 24 pin system board power connector 11 Internal USB 2 0 connector 12 microSD card slot 13 NMI header 14 PCIe2 x16 8 4 1 slot 15 System maintenance switch Component identification 72 DIMM slot l
40. eile sind nicht f r Customer Self Repair ausgelegt Um den Garantieanspruch des Kunden zu erf llen muss das Teil von einem HP Servicepartner ersetzt werden Im illustrierten Teilekatalog sind diese Teile mit No bzw Nein gekennzeichnet 1Mandatory Obligatorio componentes para los que la reparaci n por parte del usuario es obligatoria Si solicita a HP que realice la sustituci n de estos componentes tendr que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio 2Optional Opcional componentes para los que la reparaci n por parte del usuario es opcional Estos componentes tambi n est n dise ados para que puedan ser reparados por el usuario Sin embargo si precisa que HP realice su sustituci n puede o no conllevar costes adicionales dependiendo del tipo de servicio de garant a correspondiente al producto 3No No Algunos componentes no est n dise ados para que puedan ser reparados por el usuario Para que el usuario haga valer su garant a HP pone como condici n que un proveedor de servicios autorizado realice la sustituci n de estos componentes Dichos componentes se identifican con la palabra No en el cat logo ilustrado de componentes 1Mandatory Verplicht Onderdelen waarvoor Customer Self Repair verplicht is Als u HP verzoekt deze onderdelen te vervangen komen de reiskosten en het arbeidsloon voor uw rekening 2Optional Optioneel Onderdelen waarvoor reparatie door d
41. er on page 27 7 Open the left and right side chassis cable clips to allow the drive cable removal o Right side cable clip o Left side cable clip 8 Disconnect the drive power cable a If installed remove the optical drive Optical drive on page 34 Removal and replacement procedures 44 b Pull the drive power cable out from the top chassis opening c Disconnect the drive power cable from the PSU 4 pin drive power connector d Pull the drive power cable out from the right side chassis opening 9 Release the Mini SAS cable from the chassis Removal and replacement procedures 45 a Disconnect the Mini SAS cable from the system board or from a storage controller b Pull the Mini SAS cable out from the left side chassis opening toward the right side one until the cable is released from the chassis 10 Remove the non hot plug drive cable assembly a Remove the bracket screws b To release the bracket from the chassis tabs pull it up and move it backward Removal and replacement procedures 46 c Pull the cable assembly out of the chassis To replace the component reverse the removal procedure System fan To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Disconnect the fan cable 6 Remove the screws securing th
42. er up the server Remove the system board assembly 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 It is recommended that you take a picture of the current system board cable connections for reference during server reassembly 6 If the drive cage is connected to a storage controller board disconnect the Mini SAS cable from the board 7 Disconnect all cables connected to the system board o 24 pin system board power supply cable o SATA cable only if an optical drive is installed o Mini SAS cable only if the drive cage is connected to the system board o Front I O cable pulling up the blue loop to disconnect the cable o Fan cable o Ambient temperature sensor cable pulling up the brown loop to disconnect the cable In the following system board illustration the gray connectors correspond to the system board cables that you must disconnect Removal and replacement procedures 30 8 Press the system board tray latch 9 Slide the system board assembly completely out of the chassis Removal and replacement procedures 31 Install the system board assembly 1 Slide the system board assembly into the chassis 2 Connect all cables disconnected from the system board and or expansion board Drive carrier CAUTION To prevent improper cooling and therma
43. ge 27 Removal and replacement procedures 27 5 Slide the release tab upward to unlock the front bezel from the chassis 6 Open the front bezel 7 Release the bezel hinges from the front panel Remove the chassis cover 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Disconnect all peripheral cables from the server 5 If a Kensington security cable is installed disconnect it from the rear panel See the security cable documentation for instructions 6 Loosen the rear thumbscrews that secure the chassis cover Removal and replacement procedures 28 7 Slide the chassis cover toward the rear panel and then lift it to remove it from the chassis Install the chassis cover 1 Align the installation markers on the chassis cover with those located on the front edge of the chassis and then slide the chassis cover back onto the server 2 Tighten the rear thumbscrews to secure the chassis cover in place 3 Connect the peripheral devices to the server 4 If a Kensington security cable was removed connect it to the rear panel See the security cable documentation for instructions 5 Connect the server to the network Do one of the following o Connect the Ethernet cable o Connect the server to the switch 6 Connect the power cord to the server Removal and replacement procedures 29 7 Pow
44. hat are supported by the server For operating systems supported by the server see the HP website http www hp com go supportos If a significant change occurs between data gathering intervals the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration Survey functionality is installed with every Intelligent Provisioning assisted HP Insight Diagnostics installation or it can be installed through the SPP HP Insight Remote Support software HP strongly recommends that you register your device for remote support to enable enhanced delivery of your HP Warranty HP Care Pack Service or HP contractual support agreement HP Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis and automatic secure submission of hardware event notifications to HP which will initiate a fast and accurate resolution based on your product s service level Notifications may be sent to your authorized HP Channel Partner for onsite service if configured and available in your country For more information see HP Insight Remote Support and Insight Online Setup Guide for ProLiant Gen8 Servers and BladeSystem c Class Enclosures on the HP website http www hp com go enterprise docs Diagnostic tools 65 HP Insight Remote Support is available as part of HP Warranty HP Care Pack Service or HP contr
45. hen Wenn HP oder ein HP Servicepartner bei der Diagnose feststellt dass das Produkt mithilfe eines CSR Teils repariert werden kann sendet Ihnen HP dieses Bauteil zum Austausch direkt zu CSR Teile werden in zwei Kategorien unterteilt Zwingend Teile f r die das Customer Self Repair Verfahren zwingend vorgegeben ist Wenn Sie den Austausch dieser Teile von HP vornehmen lassen werden Ihnen die Anfahrt und Arbeitskosten f r diesen Service berechnet Optional Teile f r die das Customer Self Repair Verfahren optional ist Diese Teile sind auch f r Customer Self Repair ausgelegt Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen m chten k nnen bei diesem Service je nach den f r Ihr Produkt vorgesehenen Garantiebedingungen zus tzliche Kosten anfallen HINWEIS Einige Teile sind nicht f r Customer Self Repair ausgelegt Um den Garantieanspruch des Kunden zu erf llen muss das Teil von einem HP Servicepartner ersetzt werden Im illustrierten Teilekatalog sind diese Teile mit No bzw Nein gekennzeichnet CSR Teile werden abh ngig von der Verf gbarkeit und vom Lieferziel am folgenden Gesch ftstag geliefert F r bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verf gbar Wenn Sie Hilfe ben tigen k nnen Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen Den Materialien die mit einem CSR Ersatz
46. ink a Loosen one pair of diagonally opposite screws halfway and then loosen the other pair of screws b Completely loosen all screws in the same sequence c Remove the heatsink from the processor backplate To replace the component 1 Clean the old thermal grease from the processor with the alcohol swab Allow the alcohol to evaporate before continuing Removal and replacement procedures 51 2 Remove the thermal interface protective cover from the heatsink CAUTION Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs in an X pattern Do not overtighten the screws as this can damage the board connectors or screws Use the wrench supplied with the system to reduce the possibility of overtightening the screws 3 Install the heatsink a Position the heatsink on the processor backplate b Tighten one pair of diagonally opposite screws halfway and then tighten the other pair of screws c Finish the installation by completely tightening the screws in the same sequence 4 Install the system board assembly on page 31 5 Install the chassis cover on page 28 6 Connect the power cord to the server 7 Connect the power cord to the AC power source Removal and replacement procedures 52 8 Press the Power On Standby button The server exits standby mode and applies full power to the system The system power LED changes from amber to green Processor
47. l damage do not operate the server unless all bays are populated with either a component or a blank To remove the component 1 Open the front bezel on page 25 2 Remove the drive carrier To replace the component slide the component into the bay until it clicks Removal and replacement procedures 32 LFF non hot plug drive CAUTION To prevent improper cooling and thermal damage do not operate the server unless all bays are populated with either a component or a blank To remove the component 1 Back up all server data on the drive 2 Power down the server on page 24 3 If the front bezel is not secured from inside the chassis open the bezel 4 If the front bezel is secured from inside the chassis do the following a Disconnect the power cord from the AC source b Disconnect the power cord from the server c Remove the chassis cover on page 27 d Open the front bezel Removal and replacement procedures 33 e Release the bezel hinges from the front panel 5 Remove the drive 6 Remove the drive from the carrier To replace the component reverse the removal procedure Removal and replacement procedures 34 Optical drive blank To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Press the optical
48. lashing 1 Hz Off A backup is in progress Off On Off The current backup is complete with no errors Flashing 1 Hz Flashing 1 Hz Off The current backup failed and data has been lost Flashing 1 Hz Flashing 1 Hz On A power error occurred during the previous or current boot Data may be corrupt Flashing 1 Hz On Off An overtemperature condition exists Flashing 2 Hz Flashing 2 Hz Off The capacitor pack is not attached Flashing 2 Hz Flashing 2 Hz On The capacitor has been charging for 10 minutes but has not reached sufficient charge to perform a full backup On On Off The current backup is complete but power fluctuations occurred during the backup On On On The cache module microcontroller has failed Component identification 75 Fan location The server has one system fan located at the rear of the server T 10 T 15 Torx screwdriver The server includes a T 10 T 15 Torx screwdriver located on the front panel Use this screwdriver to loosen screws during hardware configuration procedures Cabling 76 Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance For information on cabling peripheral components refer to the white paper on high density deployment at the HP website http www hp com products servers platforms CAUTION When routing cables always be sure that the ca
49. lf repair on page 5 7 LFF non hot plug drive cable assembly 724493 001 Mandatory1 8 Capacitor pack 671353 001 Mandatory1 9 Front I O module assembly 724492 001 No3 10 SATA DVD RW optical drive 9 5 mm 0 37 in 724498 001 Mandatory1 11 LFF non hot plug 6G SATA drives 8 89 cm 3 5 in a 500 GB drive 659571 001 Mandatory1 b 1 TB drive 659569 001 Mandatory1 c 1 TB drive 779802 001 Mandatory1 d 2 TB drive 659570 001 Mandatory1 e 3 TB drive 628183 001 Mandatory1 12 Power supplies a HP 150 W Integrated Power Supply 724496 001 Mandatory1 b HP 200 W Integrated Power Supply 724497 001 Mandatory1 13 System battery 3 3 V lithium 234556 001 Mandatory1 14 System board include alcohol pad and thermal compound 724495 001 Mandatory1 15 Processors include alcohol pad and thermal compound a 2 30 GHz Intel Celeron G1610T processor 2C 2 MB 35 W 730232 001 Optional2 b 2 30 GHz Intel Xeon E3 1220L v2 processor 2C 3 MB 17 W 686687 001 Optional2 Illustrated parts catalog 19 Item Description Spare part number Customer self repair on page 5 c 2 50 GHz Intel Pentium G2020T processor 2C 3 MB 35 W 731127 001 Optional2 16 DIMMs a 2 GB single rank x8 PC3 12800E 11 684033 001 Mandatory1 b 2 GB single rank x8 PC3L 10600E 9 664694 001 Mandatory1 c 4 GB dual rank x8 PC3 12800E 11 684034 001 Manda
50. lowing symbols may be placed on equipment to indicate the presence of potentially hazardous conditions This symbol indicates the presence of hazardous energy circuits or electric shock hazards Refer all servicing to qualified personnel WARNING To reduce the risk of injury from electric shock hazards do not open this enclosure Refer all maintenance upgrades and servicing to qualified personnel This symbol indicates the presence of electric shock hazards The area contains no user or field serviceable parts Do not open for any reason WARNING To reduce the risk of injury from electric shock hazards do not open this enclosure Removal and replacement procedures 23 This symbol on an RJ 45 receptacle indicates a network interface connection WARNING To reduce the risk of electric shock fire or damage to the equipment do not plug telephone or telecommunications connectors into this receptacle This symbol indicates the presence of a hot surface or hot component If this surface is contacted the potential for injury exists WARNING To reduce the risk of injury from a hot component allow the surface to cool before touching This symbol indicates that the component exceeds the recommended weight for one individual to handle safely WARNING To reduce the risk of personal injury or damage to the equipment observe local occupational health and safety requirements and guidelines for manual material handling These
51. mponents and perform certain service procedures perform one or more of the following procedures Power down the server on page 24 Before removing a non hot plug component from the server you must power down the server Open the front bezel on page 25 Removal and replacement procedures 24 Remove the front bezel on page 26 Remove the chassis cover on page 27 Remove the system board assembly on page 29 Power down the server Before powering down the server for any upgrade or maintenance procedures perform a backup of critical server data and programs WARNING To reduce the risk of personal injury electric shock or damage to the equipment remove the power cord to remove power from the server The front panel Power On Standby button does not completely shut off system power Portions of the power supply and some internal circuitry remain active until AC power is removed IMPORTANT When the server is in standby mode auxiliary power is still being provided to the system To power down the server use one of the following methods Press and release the Power On Standby button This method initiates a controlled shutdown of applications and the OS before the server enters standby mode Press and hold the Power On Standby button for more than 4 seconds to force the server to enter standby mode This method forces the server to enter standby mode without properly exiti
52. n el cat logo ilustrado de componentes Seg n la disponibilidad y la situaci n geogr fica los componentes CSR se enviar n para que lleguen a su destino al siguiente d a laborable Si la situaci n geogr fica lo permite se puede solicitar la entrega en el mismo d a o en cuatro horas con un coste adicional Si precisa asistencia t cnica puede llamar al Centro de asistencia t cnica de HP y recibir ayuda telef nica por parte de un t cnico Con el env o de materiales para la sustituci n de componentes CSR HP especificar si los componentes defectuosos deber n devolverse a HP En aquellos casos en los que sea necesario devolver alg n componente a HP deber hacerlo en el periodo de tiempo especificado normalmente cinco d as laborables Los componentes defectuosos deber n devolverse con toda la documentaci n relacionada y con el embalaje de env o Si no Customer self repair 9 enviara el componente defectuoso requerido HP podr cobrarle por el de sustituci n En el caso de todas sustituciones que lleve a cabo el cliente HP se har cargo de todos los gastos de env o y devoluci n de componentes y escoger la empresa de transporte que se utilice para dicho servicio Para obtener m s informaci n acerca del programa de Reparaciones del propio cliente de HP p ngase en contacto con su proveedor de servicios local Si est interesado en el programa para Norteam rica visite la p gina web de HP siguiente http www hp com g
53. ng applications and the OS If an application stops responding you can use this method to force a shutdown Use a virtual power button selection through iLO This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode Before proceeding verify the server is in standby mode by observing that the system power LED is amber Removal and replacement procedures 25 Open the front bezel If the front bezel is not secured from inside the chassis open the bezel If the front bezel is secured from inside the chassis do the following Perform steps 1 to 3 only if the server is turned on 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Slide the release tab upward to unlock the front bezel from the chassis Removal and replacement procedures 26 6 Open the front bezel Remove the front bezel If the front bezel is not secured from inside the chassis open the front bezel and then release the hinges from the front panel If the front bezel is secured from inside the chassis do the following Perform steps 1 to 3 only if the server is turned on 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on pa
54. nte dal cliente CSR Customer Self Repair Se in fase di diagnostica HP o un centro di servizi o di assistenza HP identifica il guasto come riparabile mediante un ricambio CSR HP lo spedir direttamente al cliente per la sostituzione Vi sono due categorie di parti CSR Obbligatorie Parti che devono essere necessariamente riparate dal cliente Se il cliente ne affida la riparazione ad HP deve sostenere le spese di spedizione e di manodopera per il servizio Opzionali Parti la cui riparazione da parte del cliente facoltativa Si tratta comunque di componenti progettati per questo scopo Se tuttavia il cliente ne richiede la sostituzione ad HP potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto NOTA alcuni componenti HP non sono progettati per la riparazione da parte del cliente Per rispettare la garanzia HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato Tali parti sono identificate da un No nel Catalogo illustrato dei componenti Customer self repair 7 In base alla disponibilit e alla localit geografica le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente La consegna nel giorno stesso o entro quattro ore offerta con un supplemento di costo solo in alcune zone In caso di necessit si pu richiedere l assistenza telefonica di un addetto del centro di supporto tecnico HP Nel materiale fornito con una parte di
55. o realice la sustituci n de estos componentes Dichos componentes se identifican con la palabra No en el cat logo ilustrado de componentes 1Mandatory Verplicht Onderdelen waarvoor Customer Self Repair verplicht is Als u HP verzoekt deze onderdelen te vervangen komen de reiskosten en het arbeidsloon voor uw rekening 2Optional Optioneel Onderdelen waarvoor reparatie door de klant optioneel is Ook deze onderdelen zijn ontworpen voor reparatie door de klant Als u echter HP verzoekt deze onderdelen voor u te vervangen kunnen daarvoor extra kosten in rekening worden gebracht afhankelijk van het type garantieservice voor het product 3No Nee Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen Deze onderdelen worden in de ge llustreerde onderdelencatalogus aangemerkt met Nee 1Mandatory Obrigat ria Pe as cujo reparo feito pelo cliente obrigat rio Se desejar que a HP substitua essas pe as ser o cobradas as despesas de transporte e m o de obra do servi o 2Optional Opcional Pe as cujo reparo feito pelo cliente opcional Essas pe as tamb m s o projetadas para o reparo feito pelo cliente No entanto se desejar que a HP as substitua pode haver ou n o a cobran a de taxa adicional dependendo do tipo de servi o de garantia destinado ao produto 3No Nenhuma Algumas pe as
56. o replace these parts you will be charged for the travel and labor costs of this service Illustrated parts catalog 16 2Optional Parts for which customer self repair is optional These parts are also designed for customer self repair If however you require that HP replace them for you there may or may not be additional charges depending on the type of warranty service designated for your product 3No Some HP parts are not designed for customer self repair In order to satisfy the customer warranty HP requires that an authorized service provider replace the part These parts are identified as No in the Illustrated Parts Catalog 1Mandatory Obligatoire Pi ces pour lesquelles la r paration par le client est obligatoire Si vous demandez HP de remplacer ces pi ces les co ts de d placement et main d uvre du service vous seront factur s 2Optional Facultatif Pi ces pour lesquelles la r paration par le client est facultative Ces pi ces sont galement con ues pour permettre au client d effectuer lui m me la r paration Toutefois si vous demandez HP de remplacer ces pi ces l intervention peut ou non vous tre factur e selon le type de garantie applicable votre produit 3No Non Certaines pi ces HP ne sont pas con ues pour permettre au client d effectuer lui m me la r paration Pour que la garantie puisse s appliquer HP exige que le remplacement de la pi ce soit effectu par un Mainteneur Agr Ce
57. o selfrepair Servicio de garant a exclusivo de componentes La garant a limitada de HP puede que incluya un servicio de garant a exclusivo de componentes Seg n las condiciones de este servicio exclusivo de componentes HP le facilitar los componentes de repuesto sin cargo adicional alguno Para este servicio de garant a exclusivo de componentes es obligatoria la sustituci n de componentes por parte del usuario CSR Si solicita a HP que realice la sustituci n de estos componentes tendr que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio Customer Self Repair Veel onderdelen in HP producten zijn door de klant zelf te repareren waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is Deze onderdelen worden CSR onderdelen Customer Self Repair genoemd Als HP of een HP Service Partner bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR onderdeel verzendt HP dat onderdeel rechtstreeks naar u zodat u het defecte onderdeel daarmee kunt vervangen Er zijn twee categorie n CSR onderdelen Verplicht Onderdelen waarvoor reparatie door de klant verplicht is Als u HP verzoekt deze onderdelen voor u te vervangen worden u voor deze service reiskosten en arbeidsloon in rekening gebracht Optioneel Onderdelen waarvoor reparatie door de klant optioneel is Ook deze onderdelen zijn ontworpen voor repara
58. ocations DIMM slots are numbered sequentially 1 through 4 for the processor The supported AMP modes use the letter assignments for population guidelines System maintenance switch Position Default Function S1 Off Off iLO security is enabled On iLO security is disabled S2 Off Off System configuration can be changed On System configuration is locked S3 Off Reserved S4 Off Reserved S5 Off Off Power on password is enabled On Power on password is disabled S6 Off Off No function On ROM reads system configuration as invalid S7 Reserved S8 Reserved S9 Reserved S10 Reserved S11 Reserved S12 Reserved To access the redundant ROM set S1 S5 and S6 to on When the system maintenance switch position 6 is set to the On position the system is prepared to erase all system configuration settings from both CMOS and NVRAM Component identification 73 CAUTION Clearing CMOS and or NVRAM deletes configuration information Be sure to properly configure the server or data loss could occur NMI functionality An NMI crash dump creates a crash dump log before resetting a system which is not responding Crash dump log analysis is an essential part of diagnosing reliability problems such as failures of operating systems device drivers and applications Many crashes freeze a system and the only available action for administrators is to restar
59. or inside separate antistatic bags To remove the system board 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Remove the system board assembly WARNING To reduce the risk of personal injury from hot surfaces allow the heatsink to cool before touching it CAUTION Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs in an X pattern Do not overtighten the screws as this can damage the board connectors or screws Use the wrench supplied with the system to reduce the possibility of overtightening the screws 6 Remove the heatsink Removal and replacement procedures 55 a Loosen one pair of diagonally opposite screws halfway and then loosen the other pair of screws b Completely loosen all screws in the same sequence c Remove the heatsink from the processor backplate CAUTION To avoid damage to the processor do not touch the bottom of the processor especially the contact area 7 Open the processor locking lever and then open the processor retaining bracket 8 Grasp the processor by the edges and then lift it out of the socket 9 Remove all DIMMs DIMMs on page 49 10 If installed remove the expansion board Expansion board on page 48 Removal and replacement procedures 56 11 Remove the failed system bo
60. ource 3 Disconnect the power cord from the server 4 Remove the front bezel on page 26 5 Remove the chassis cover on page 27 Removal and replacement procedures 42 6 Remove the ambient temperature sensor cable a Open the left side chassis cable clip b If more working room is required disconnect the following cables from the system board System board power cable Optical drive SATA cable Mini SAS cable c Pull the brown loop to disconnect the sensor cable from the system board d Detach the cable end with the rubber stopper from the chassis e Remove the rubber stopper from the sensor cable To replace the component reverse the removal procedure LFF non hot plug drive cable assembly The four bay LFF non hot plug drive cable assembly consists of the drive power and Mini SAS cables attached to a bracket If either the drive power or Mini SAS cable becomes defective the entire cable assembly will need to be replaced spare PN 724493 001 Removal and replacement procedures 43 To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Open the front bezel on page 25 5 Remove all drives LFF non hot plug drive on page 32 and drive carriers Drive carrier on page 31 6 If the chassis cover was not removed in step 4 remove it Remove the chassis cov
61. r on page 24 Removal and replacement procedures 37 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 If the existing cache module is connected to a capacitor pack observe the FBWC module LEDs o If a backup is in progress wait for the backup to complete o If the backup is complete or if the cache has failed remove the controller from the server and then continue with the next step 6 Disconnect the capacitor pack cable from the cache module 7 Open the capacitor pack holder 8 Remove the capacitor pack To replace the component reverse the removal procedure Removal and replacement procedures 38 Recovering data from the flash backed write cache If the server fails use the following procedure to recover data temporarily stored in the FBWC CAUTION Before starting this procedure read the information about protecting against electrostatic discharge Preventing electrostatic discharge on page 22 1 Perform one of the following o Set up a recovery server using an identical server model Do not install any internal drives or FBWC in this server HP recommends this option o Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration 2 Power down the failed server Power down the
62. rdeel en kiest HP zelf welke koerier transportonderneming hiervoor wordt gebruikt Customer self repair 10 Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP Informatie over Service Partners vindt u op de HP website http www hp com go selfrepair Garantieservice Parts Only Het is mogelijk dat de HP garantie alleen de garantieservice Parts Only omvat Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen Voor de Parts Only garantieservice is vervanging door CSR onderdelen verplicht Als u HP verzoekt deze onderdelen voor u te vervangen worden u voor deze service reiskosten en arbeidsloon in rekening gebracht Reparo feito pelo cliente Os produtos da HP s o projetados com muitas pe as para reparo feito pelo cliente CSR de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substitui o de pe as com defeito Se durante o per odo de diagn stico a HP ou fornecedores parceiros de servi o da HP concluir que o reparo pode ser efetuado pelo uso de uma pe a CSR a pe a de reposi o ser enviada diretamente ao cliente Existem duas categorias de pe as CSR Obrigat ria Pe as cujo reparo feito pelo cliente obrigat rio Se desejar que a HP substitua essas pe as ser o cobradas as despesas de transporte e m o de obra do servi o Opcional Pe as cujo reparo feito pelo
63. ricambio CSR HP specifica se il cliente deve restituire dei componenti Qualora sia richiesta la resa ad HP del componente difettoso lo si deve spedire ad HP entro un determinato periodo di tempo generalmente cinque 5 giorni lavorativi Il componente difettoso deve essere restituito con la documentazione associata nell imballo di spedizione fornito La mancata restituzione del componente pu comportare la fatturazione del ricambio da parte di HP Nel caso di riparazione da parte del cliente HP sostiene tutte le spese di spedizione e resa e sceglie il corriere vettore da utilizzare Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona Per il programma in Nord America fare riferimento al sito Web HP http www hp com go selfrepair Servizio di garanzia per i soli componenti La garanzia limitata HP pu includere un servizio di garanzia per i soli componenti Nei termini di garanzia del servizio per i soli componenti HP fornir gratuitamente le parti di ricambio Per il servizio di garanzia per i soli componenti obbligatoria la formula CSR che prevede la riparazione da parte del cliente Se il cliente invece richiede la sostituzione ad HP dovr sostenere le spese di spedizione e di manodopera per il servizio Customer Self Repair HP Produkte enthalten viele CSR Teile Customer Self Repair um Reparaturzeiten zu minimieren und h here Flexibilit t beim Austausch defekter Bauteile zu erm glic
64. s pi ces sont identifi es par la mention Non dans le Catalogue illustr 1Mandatory Obbligatorie Parti che devono essere necessariamente riparate dal cliente Se il cliente ne affida la riparazione ad HP deve sostenere le spese di spedizione e di manodopera per il servizio 2Optional Opzionali Parti la cui riparazione da parte del cliente facoltativa Si tratta comunque di componenti progettati per questo scopo Se tuttavia il cliente ne richiede la sostituzione ad HP potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto 3No Non CSR Alcuni componenti HP non sono progettati per la riparazione da parte del cliente Per rispettare la garanzia HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato Tali parti sono identificate da un No nel Catalogo illustrato dei componenti 1Mandatory Zwingend Teile die im Rahmen des Customer Self Repair Programms ersetzt werden m ssen Wenn Sie diese Teile von HP ersetzen lassen werden Ihnen die Versand und Arbeitskosten f r diesen Service berechnet 2Optional Optional Teile f r die das Customer Self Repair Verfahren optional ist Diese Teile sind auch f r Customer Self Repair ausgelegt Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen m chten k nnen bei diesem Service je nach den f r Ihr Produkt vorgesehenen Garantiebedingungen zus tzliche Kosten anfallen 3No Kein Einige T
65. se http www hp com support ProLiant_EMG_v1_sc Diagnostic tools 64 Diagnostic tools Product QuickSpecs For more information about product features specifications options configurations and compatibility see the product QuickSpecs on the HP website http www hp com go qs HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool available in both offline and online versions that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations troubleshoot problems and perform repair validation HP Insight Diagnostics Offline Edition performs various in depth system and component testing while the OS is not running To run this utility boot the server using Intelligent Provisioning HP Insight Diagnostics Online Edition is a web based application that captures system configuration and other related data needed for effective server management Available in Microsoft Windows and Linux versions the utility helps to ensure proper system operation For more information or to download the utility see the HP website http www hp com servers diags HP Insight Diagnostics Online Edition is also available in the SPP HP Insight Diagnostics survey functionality HP Insight Diagnostics on page 64 provides survey functionality that gathers critical hardware and software information on ProLiant servers This functionality supports operating systems t
66. stem board assembly on page 29 Contact an HP authorized service provider for a replacement system board and TPM board Troubleshooting 63 Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide Volume I Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification issue resolution and software maintenance on ProLiant servers and server blades To view the guide select a language English http www hp com support ProLiant_TSG_v1_en French http www hp com support ProLiant_TSG_v1_fr Spanish http www hp com support ProLiant_TSG_v1_sp German http www hp com support ProLiant_TSG_v1_gr Japanese http www hp com support ProLiant_TSG_v1_jp Simplified Chinese http www hp com support ProLiant_TSG_v1_sc The HP ProLiant Gen8 Troubleshooting Guide Volume II Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades To view the guide select a language English http www hp com support ProLiant_EMG_v1_en French http www hp com support ProLiant_EMG_v1_fr Spanish http www hp com support ProLiant_EMG_v1_sp German http www hp com support ProLiant_EMG_v1_gr Japanese http www hp com support ProLiant_EMG_v1_jp Simplified Chine
67. stic HP ou ses partenaires ou mainteneurs agr s d termine que la r paration peut tre effectu e l aide d une pi ce CSR HP vous l envoie directement Il existe deux cat gories de pi ces CSR Customer self repair 6 Obligatoire Pi ces pour lesquelles la r paration par le client est obligatoire Si vous demandez HP de remplacer ces pi ces les co ts de d placement et main d uvre du service vous seront factur s Facultatif Pi ces pour lesquelles la r paration par le client est facultative Ces pi ces sont galement con ues pour permettre au client d effectuer lui m me la r paration Toutefois si vous demandez HP de remplacer ces pi ces l intervention peut ou non vous tre factur e selon le type de garantie applicable votre produit REMARQUE Certaines pi ces HP ne sont pas con ues pour permettre au client d effectuer lui m me la r paration Pour que la garantie puisse s appliquer HP exige que le remplacement de la pi ce soit effectu par un Mainteneur Agr Ces pi ces sont identifi es par la mention Non dans le Catalogue illustr Les pi ces CSR sont livr es le jour ouvr suivant dans la limite des stocks disponibles et selon votre situation g ographique Si votre situation g ographique le permet et que vous demandez une livraison le jour m me ou dans les 4 heures celle ci vous sera factur e Pour b n ficier d une assistance t l phonique appelez le Centre d assistance techniqu
68. t the system Resetting the system erases any information which could support problem analysis but the NMI feature preserves that information by performing a memory dump before a system reset To force the system to invoke the NMI handler and generate a crash dump log do one of the following Use the iLO Virtual NMI feature Short the NMI header System board components on page 70 For more information see the HP website http www hp com support NMI Drive numbering The server supports four LFF non hot plug SATA drives Component identification 74 FBWC module LED definitions The FBWC module has three single color LEDs one amber and two green The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing 1 Amber 2 Green 3 Green Interpretation Off Off Off The cache module is not powered Off Flashing 0 5 Hz Flashing 0 5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller Off Flashing 1 Hz Flashing 1 Hz The cache module is powering up and the capacitor pack is charging Off Off Flashing 1 Hz The cache module is idle and the capacitor pack is charging Off Off On The cache module is idle and the capacitor pack is charged Off On On The cache module is idle the capacitor pack is charged and the cache contains data that has not yet been written to the drives Off F
69. teil geliefert werden k nnen Sie entnehmen ob das defekte Teil an HP zur ckgeschickt werden muss Wenn es erforderlich ist das defekte Teil an HP zur ckzuschicken m ssen Sie dies innerhalb eines vorgegebenen Zeitraums tun in der Regel innerhalb von f nf 5 Gesch ftstagen Das defekte Teil muss mit der zugeh rigen Dokumentation in der Verpackung zur ckgeschickt werden die im Lieferumfang enthalten ist Wenn Sie das Customer self repair 8 defekte Teil nicht zur ckschicken kann HP Ihnen das Ersatzteil in Rechnung stellen Im Falle von Customer Self Repair kommt HP f r alle Kosten f r die Lieferung und R cksendung auf und bestimmt den Kurier Frachtdienst Weitere Informationen ber das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort Informationen ber das CSR Programm in Nordamerika finden Sie auf der HP Website unter http www hp com go selfrepair Parts only Warranty Service Garantieservice ausschlie lich f r Teile Ihre HP Garantie umfasst m glicherweise einen Parts only Warranty Service Garantieservice ausschlie lich f r Teile Gem den Bestimmungen des Parts only Warranty Service stellt HP Ersatzteile kostenlos zur Verf gung F r den Parts only Warranty Service ist das CSR Verfahren zwingend vorgegeben Wenn Sie den Austausch dieser Teile von HP vornehmen lassen werden Ihnen die Anfahrt und Arbeitskosten f r diesen Service berechnet Reparaciones del propio cliente
70. tem board Do not touch the processor socket contacts Do not tilt or slide the processor when lowering the processor into the socket 1 Install the processor Use the notches on both sides of the processor to properly align it into the socket CAUTION Be sure to close the processor socket retaining bracket before closing the processor locking lever The lever should close without resistance Forcing the lever closed can damage the processor and socket requiring system board replacement 2 Close the processor retaining bracket and then secure the processor locking lever 3 Clean the old thermal grease from the heatsink with the alcohol swab Allow the alcohol to evaporate before continuing Removal and replacement procedures 54 4 Apply all the grease to the top of the processor in the following pattern to ensure even distribution 5 Install the heatsink Heatsink on page 50 6 Install the system board assembly on page 31 7 Install the chassis cover on page 28 8 Connect each power cord to the server 9 Connect each power cord to the power source 10 Press the Power On Standby button The server exits standby mode and applies full power to the system The system power LED changes from amber to green System board CAUTION To avoid ESD damage when removing electrostatic sensitive components from the failed system board place the components on a static dissipating work surface
71. tie door de klant Als u echter HP verzoekt deze onderdelen voor u te vervangen kunnen daarvoor extra kosten in rekening worden gebracht afhankelijk van het type garantieservice voor het product OPMERKING Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen Deze onderdelen worden in de ge llustreerde onderdelencatalogus aangemerkt met Nee Afhankelijk van de leverbaarheid en de locatie worden CSR onderdelen verzonden voor levering op de eerstvolgende werkdag Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden indien dit mogelijk is gezien de locatie Indien assistentie gewenst is belt u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen HP vermeldt in de documentatie bij het vervangende CSR onderdeel of het defecte onderdeel aan HP moet worden geretourneerd Als het defecte onderdeel aan HP moet worden teruggezonden moet u het defecte onderdeel binnen een bepaalde periode gewoonlijk vijf 5 werkdagen retourneren aan HP Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal Als u het defecte onderdeel niet terugzendt kan HP u voor het vervangende onderdeel kosten in rekening brengen Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onde
72. tory1 d 4 GB dual rank x8 PC3L 10600E 9 664695 001 Mandatory1 e 8 GB dual rank x8 PC3 12800E 11 684035 001 Mandatory1 f 8 GB dual rank x8 PC3L 10600E 9 664696 001 Mandatory1 17 System fan 724491 001 Mandatory1 18 Ambient temperature sensor cable 725205 001 No3 Not shown 1Mandatory Parts for which customer self repair is mandatory If you request HP to replace these parts you will be charged for the travel and labor costs of this service 2Optional Parts for which customer self repair is optional These parts are also designed for customer self repair If however you require that HP replace them for you there may or may not be additional charges depending on the type of warranty service designated for your product 3No Some HP parts are not designed for customer self repair In order to satisfy the customer warranty HP requires that an authorized service provider replace the part These parts are identified as No in the Illustrated Parts Catalog 1Mandatory Obligatoire Pi ces pour lesquelles la r paration par le client est obligatoire Si vous demandez HP de remplacer ces pi ces les co ts de d placement et main d uvre du service vous seront factur s 2Optional Facultatif Pi ces pour lesquelles la r paration par le client est facultative Ces pi ces sont galement con ues pour permettre au client d effectuer lui m me la r paration Toutefois si vous demandez HP de remplacer
73. ve the chassis cover on page 27 5 Disconnect all cables connected to the expansion board 6 To open the expansion slot cover retainer latch press it 7 If the expansion board is secured with a screw remove the screw Removal and replacement procedures 49 8 Remove the expansion board To replace the component reverse the removal procedure DIMMs To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Open the DIMM slot latches 6 Remove the DIMM To replace the component reverse the removal procedure Removal and replacement procedures 50 Heatsink To remove the component 1 Power down the server on page 24 2 Disconnect the power cord from the AC source 3 Disconnect the power cord from the server 4 Remove the chassis cover on page 27 5 Remove the system board assembly on page 29 WARNING To reduce the risk of personal injury from hot surfaces allow the heatsink to cool before touching it CAUTION Heatsink retaining screws should be tightened or loosened in diagonally opposite pairs in an X pattern Do not overtighten the screws as this can damage the board connectors or screws Use the wrench supplied with the system to reduce the possibility of overtightening the screws 6 Remove the heats
74. wer supply 47 power supply cabling 80 power supply specifications 81 82 powering down 24 power on password 72 preparation procedures 23 processor option 18 52 processor socket cover 52 Q QuickSpecs 64 R rear panel buttons 70 rear panel components 69 rear panel LEDs 70 recovering the data from the cache 38 re entering the server serial number 54 removal and replacement procedures 22 replacement procedures 22 required tools 22 requirements environmental 81 ROM Based Setup Utility RBSU 65 S safety considerations 22 SATA drives 15 18 serial number 69 serial number iLO information tag 69 server warnings and cautions 23 spare part numbers 15 specifications environmental 81 specifications power supply 81 specifications server 81 static electricity 22 symbols on equipment 22 system battery 61 system board 18 54 system board assembly 15 system board assembly installing 31 system board assembly removing 29 system board components 70 system board replacement 54 system components 18 67 system configuration settings 72 system fan 46 75 system fan cabling 79 system maintenance switch 72 T T 10 T 15 Torx screwdriver 75 technical support 5 temperature requirements 81 TPM connector 70 troubleshooting resources 63 Trusted Platform Module TPM 62 Index 88 U USB connector 70 USB support 65 utilities 64 V video connector 70 W warnings 23 weight 81

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