Auteur: - Hitech Projects
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1. Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 TC10045 Rev A 4 9 Process Displays the name of the currently running process and the status of the process in the Process Status field The field will display the following Idle Cancelled Running Aborted Stopping Paused or Pending Elapsed Displays the time elapsed since the start of the current step Remaining Displays the time left to complete the current step Main Step Displays the name of the currently running step or the name of the step that was being run when the process was stopped It also displays the running step of the overall process 3 of 56 2 of 23 etc in the Step No field Status Displays the status of the process module Not Ready A transfer cannot occur at this time Ready To Load A wafer is ready to be loaded Motion is initialized and the vacuum levels are good Ready To Run A wafer is loaded and a process is ready to run Waiting To Run A partially processed yellow wafer is waiting to be run The Allow Partial Wafers To Run option on the Management Options tab must be selected for processing to continue from this state Running A process is currently running Ready to Unload The process is complete The wafer is ready to be moved back to the Loadlock Test Schedule Complete The CTC is checking that all schedule phases have been completed for this w2. Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Red An error has occurred NOTE Slot Number Slot Status Indicator NEXUS PVD 1 Systems User Manual TC10045 Rev A 4 11 VACUUM PRESSURE PANELS On the process control screen there are panels Figure 4 14 that display the pressure levels for the process module and FE loader and identify the pressure gauge reading pirani manometer or ion Figure 4 14 Vacuum Pressure Panels The trend bar indicates the amount of pressure change over time Green bars indicate that the pressure is decreasing while red bars indicate that the pressure is rising LOAD READY PANEL The Load Ready panel Figure 4 15 allows the user to prepare a load lock for processing substrates into the selected process module and it also provides load lock status information Figure 4 15 Load Ready Panel Load Ready Panel Item Description Load When clicked the load lock is automatically pumped down and mapped Ready Provides load lock status by color Yellow The load lock chamber is either being pumped down vented or the cassette is being mapped Green The load lock chamber is pumped down and the cassette is mapped Black The load lock chamber is not ready Red An error has occurred Indicates Active Pressure Gauge Reading P Pirani M Manometer lon Clicking the drop down ar
3. Druk op pumpdown Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Document Bedieningsvoorschrift Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF 5 Proces voorschrift 5 1 Lot build Plaza Blad nr 5 1 Epcode S31 Datum 26 11 2010 Indien er met vaste schedules gewerkt wordt zijn er vaste plaatsen in de Schedule voor het insputteren van de te gebruiken targets Dit is nodig om het zogenaamde eerste plak effect te vermijden Een voorbeeld volgt hieronder Lot pm5 TiW 20 nm Pm 6 W 5000 nm Conditionerings plakken zitten altijd onder in het lot met de volgorde van de systeem configuratie mee De slot nummering is van onder naar boven Slot Sequence Te gebruiken schaaltjes Slot 3 t m 10 Pm5 TiW 20nm Pm6 W 5000 nm Gebruik Ti W Schaaltje Slot 2 Pm6 W Condi Gebruik Ti W Schaaltje Slot 1 Pm5 TiW condi Gebruik Ti W schaaltje Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 Plaza RWV nr RWV 011 031 130 01 1 Blad nr 5 2 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 5 2 Standaard configuration of the system Normally this is the standard configuration of targets in the system Pm1 ZNO AL 2 Pm2 Mo Pm3 Al ALN geen A1203
4. Bedieningsvoorschrift Epcode S31 Hoofdstuk 3 Algemene werking Beheerder Documentenbeheerder TFF Datum 26 11 2010 3 1 1 Use of the system Men kan wafers processen met het systeem als de machine op het CTC scherm staat Standaard staat dit scherm aan de voorzijde van de machine Mocht dit niet zo zijn kan men door op het het toetsenbord 2x op de scroll lock te drukken de bediening van het scherm veranderen Men komt in het selectie systeem en gaat men met de pijltjes naar het CTC gedeelte en geeft enter Mocht het CTC gedeelte Rood kleuren dan staat het CTC scherm in de service ruimte actief Je moet deze dan eerst inactief maken door in de service ruimte een ander scherm actief te maken volgens bovenstaande procedure Bv pm1 3 1 2 Operating the system Standaard staat het systeem aan de voorzijde op het CTC Cluster Tool controller Scherm In het Main scherm 3 1 3 Log in Vul in achter de regel Login ID Veeco Vul in achter de regel Password 123456 Dit word weergegeven in sterretjes Druk daarna op de OK Knop foto login scherm Je hebt nu toegang tot het systeem O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 008 130 01 1 Bladnr 4 1 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 4 User Manual 4 1 Run with an excisting process 4 1 1 Prepara
5. Parameter Description Process Create Screen 3 8 TC10045 Rev A BIAS ETCH PARAMETERS PANEL The Bias Etch Parameters panel Figure 3 8 enables the user to set the parameters for the power supply to the chuck Bias Etch Parameters Use Source Power Regulation mode lo Bias Power Watts Bias Voltage V Matching Automatic b Network Mode 50 c 50 C2 si 4 gt Figure 3 8 Bias Etch Parameters Panel Bias Etch Parameters Panel Parameter Description Use Source When checked enables the source Regulation mode Sets the mode of operation Power or Voltage for the power supply The user selects the control mode by selecting the drop down arrow and then selecting the mode of operation from the list Bias Power Watts Enabled only when regulation mode is set to Power Sets the output of the power supply Bias Voltage V Enabled only when regulation mode is set to Voltage Sets the output of the power supply Matching Network Mode Enables the user to use stored preset Automatic values or to manually control Manual the capacitors The user selects the control mode by selecting the drop down arrow and then selecting Automatic or Manual from the list C1 C2 Enabled only when Matching Network Mode is set to Manual Enables the user to set the value for capacitors 1 and 2 To enter a value the user can enter the value or use the up and down arrows O Philips Research MiP
6. Automatically vent the load lock chamber by closing the turbo gate valve if installed shutting off the turbo pump closing the turbo foreline valve if installed and opening the vent valve Pump Down Automatically pumps down the load lock using the roughing pump and if installed the turbo or cryo pump Map Maps the cassette An automatic sequence maps the cassette and prepares the load lock for a schedule to process substrates Mapping assigns the status of unprocessed to all substrates in the cassette Home Brings the elevator to its home position or reference point All other positions are determined by referring to the home position Sub directory RunNo directory O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 19 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Log files for wafers processed Run number Time wafer started processing Time first wafer started Wafer number processing NEXUS PVD 1 Systems User Manual TC10045 Rev A 4 5 View Process Parameters Clicking View Process Parameters displays the process parameters panel Figure 4 7 This panel enables the user to view the real time parameters of the currently running process for any process module by clicking the desired process module Figure 4 7 Process Parameters Panel PVD 1 Mod
7. Line Button and Indicator This is both an indicator and button It displays the status of the process module and also enables the user to change the status of the process module by clicking on it When the process module is On Line the words On Line display and the indicator is green Off Line the words Off Line display and the indicator is yellow Note A module must be online for communication to occur between the PM and the CTC If a module is offline it cannot accept or return a substrate Entering a process module screen during active processing will cause a module to go offline To put the module back online you must do this manually by clicking the communication indicator Figure 2 18 for the module Fixture Displays the status of the chuck Motion Initialized when the display is green the chuck is at the transfer 0 position the shutter is in the open position and the PM is ready to receive or release a substrate Locked when display is green motion on the PM is suspended locked while the isolation valve is open Lift Table Position displays the height of the chuck from the transfer 0 position Wafer ID Displays the wafer ID for the wafer currently being processed NOTE On Off Line Button and Indicator Step No Field PM Selector NEXUS PVD 1 Systems User Manual Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 21
8. Process Pressure Tor Time In Seconds cuum Pressure Control Mode Step 20 Stes F Use Hivae Downstream Step_30 Step 31 5 Pressure Setpoint mTorr o E Position setpaint A up Step 53 setas Insert Delete Last Edit Dato 10712 2008 22137 PM Tan so TE Rotation Speed RPM Open stant Process Gas Values Open At Stabitize o Js A poop seem Open aena i PVDIs i Er 4242 Process Create GUI Screen Entered Figure 3 1 Process Create Screen il View Log Each step within the process details all the information needed by the system to perform the operation Once defined steps are inserted into a process Each process is assigned a unique name by the user and is permanently stored on the system s hard drive allowing the user access and editing functions The user also has the ability to select any set of steps and create any number of new processes for specific applications Once a new process is created it is also permanently stored and can be run by an operator through simple menu selection CAUTION Because the CTC hard drive stores process configurations and INI files it is important to back up these files AREAS OF THE PROCESS CONTROL SCREEN The Process Create screen consists of the Main Menu Process Area Panel User Defined Parameters and Values Panels Recipe Management Panel Process Create O Philips Research MiPlaza TL Company Restri
9. Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 17 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Quick Search Field Enter the name of the process list and as you type Quick Search will display only those files that match your input Process Area Panel Chapter 4 Process Control Screen INTRODUCTION All users are able to display the Process Control screen However access to sub menus and operations depend on assigned privilege levels The Process Control screen Figure 4 1 manages the operation of the load lock cassette elevator and robot arm enables the user to select and run a process and displays readbacks for the sources and wafer status It is made up of four areas Menu Bar Status Panels Graphical Display and Events and Alarm Panel Figure 4 1 Process Control Screen For information on the Events and Alarms Panel see EVENTS AND ALARMS PANEL on page 2 14 NOTE Graphical Display Events and Alarms Panel Menu Bar Status Panels Process Control Screen 4 2 TC10045 Rev A MENU BAR The menu bar Figure 4 2 provides access to the Main Menu PM Buttons Load Lock View Data Log and Process Parameters and Process Times dialogs Figure 4 2 Menu Bar Process Control Screen Main Menu Clicking Main Menu Figure 4 2 displays the Main Menu dialog Figure 4 3 Using the Main
10. Round or 150x 150mm square The maximum height is 8 mm incl covers O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 130 008 02 Bladnr 7 2 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 7 Instruction and test Beheerder Documentenbeheerder TFF Datum 26 11 2010 7 Instruction and test The only person who is allowed to carry out the instruction is the machine owner Normally the instruction will take about half an hour and will be given only after reading this manual First the construction major parts and possibilities of the machine will be explained with respect to running different substrate sizes After this the complete operating screen and the correct way to run a process will be explained on the basis of the Operating Manual as described in chapter 4 Subsequently the student will perform a complete sequence of setting and running the correct cleaning process based upon a substrate of its her own independently as a test Question 1 Perform a normal process run and tell the instructor what to do Question 2 what is de max load the system can handle size weight height O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 130 008 02 Document Bedieningsvoorschrift Hoofdstuk 7 Instruction and test Beheerder Documentenbeheerder TFF Answers Bladnr 7 3 Epcode S31 Datum 26 11
11. is from 0 transfer position Drop Down Lists NOTE Process Create Screen 3 10 TC10045 Rev A PROCESS CONTROL PANEL The Process Control panel Figure 3 12 allows the user to define the process Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Document Bedieningsvoorschrift Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF timing and how the step in a process will end Process Control Process Y Step Type M Data Tracing EN Sec Collection Interval Iv Stabilize M Power Down Process Time P Ends By i Hours Minutes Seconds ms rocess Ends By Time fo i 2 fo 1 067 Process Pressure Torr 82 000 Time In Seconds Figure 3 12 Process Control Panel Process Control Panel Parameter Description Bladnr 5 12 Epcode S31 Datum 26 11 2010 Stabilize When selected the gas flow and pressure will stabilize to their final value before the timer for that step starts Power Down When selected all power supplies will be turned off upon completion of the step Data Tracing When selected a data file will be created with all relevant process parameters at the time interval specified To enter or change the interval time select the current time and enter a new time Note The data is used for reviewing historical process data Step Type Specifies type of step Start or Process The user selects the step
12. new name Adding Previously Created Steps to a Process Step List 1 Click the process module button Figure 3 6 for the process module you want to add the step 2 Click Load in the Process List panel Figure 3 3 The Process List screen appears Figure 3 16 It lists all the previously created process lists for the module Figure 3 16 Process List Screen 3 Select the desired process list file name from the list and click OK Note that double clicking the file name automatically selects the process list without having to click OK You can also filter the list by using Quick Search Just type the name of the desired file in the Quick Search field and Quick Search will display only those files that match your input Then select the desired file as described above 4 Click Insert Figure 3 17 in the Process Area panel A screen appears listing all the previously created steps to choose from Quick Search Field Enter the name of the process list and as you type Quick Search will display only those files that match your input NEXUS PVD 1 Systems User Manual O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 M iPlaza f RWV nr RWV 011 031 130 01 1 Bladnr 5 16 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Quick Search Field Enter the name of the process list and as you
13. output to a positive voltage Pulse Rev Time pS Enables the user to set the length of time that the positive voltage exists on the output Time is displayed in pS Duty Cycle Enables the user to to set the calculated duty cycle for the percentage of time that a positive voltage is on the generator output Arc Counting Enable When selected it enables the arc counting feature Max Count Enables the user to set the number of arcs that can occur before an alarm is generated for a process step Reset Delay Enables the user to set the time between the detection of an arc which causes the generator output to be disabled and the reenabling of the generator output Target Rotation Rotation Speed RPM Enables the user to set the rotation speed of the target the change the speed the user can enter the value directly or use the up and down arrows Process Gas Values 1 2 3 4 Enables the user to set the gas flow for each channel The flow range levels Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 10 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 depend on the mass flow controllers installed for each channel To change the value of a gas channel the user enters the value in the field next to the desired channel Depo Parameters Panel Continued
14. posities Het proces wordt gestart Nadat het proces klaar is verschijnt het volgende scherm Q Vent LoadLockB CML Chamber Druk op Yes Het loadlock wordt belucht tot 7 4 E2 Open het load lock en neem de cassette eruit De plakken kunen eruit worden genomen eis Nexus Cluster Tool Controller Version _V2 08 139 Process Control View View Process View Process Data Log Parameters Times Main Menu o CML Run No 1 MEET CEN erator en CMR Run No 2 BENEDICTIONEM nn Class Engineering c Run RE Run Load Lock LLB CML LLA CMR prx ee Rough Pump is Being Used By 5E i 15 opui imu P ne REESE ENEN Events 45 55 44 TM LLA AutoSeq PumpDownBase Soft Roughing to Setpoint View o General mM Alarms Log O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 008 130 01 1 Blad nr 4 8 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Indien er nog een lot gestart moet worden Vul dan het Schedule CMR of Schedule CML in en laad een nieuwe cassette Wil je geen proces meer starten zet dan de lege casette in het load lock Pomp als volgt af Klik in het main menu op loadlock Druk op Stop in het schedule CML of CMR gedeelte De groene Run button wordt grijs en het loadlock scherm wordt actief
15. type Quick Search will display only those files that match your input PROCESS CREATE Quick Search Ag Xe 300V Stp Ag Xe 750V 1000A Stp Ag Xe 750V 100A Stp CI Ti Xe Stp Saad CI_Ti_Xe_1000 160 Stp Fe CI Ti Xe 300 100 Stp Step 32 Step 33 Step Edit Insert Delete Figure 3 17 Adding Steps to the Process List 5 Select the desired step file name from the list and click OK Note that doubleclicking the file name automatically selects the file without having to click OK You can also filter the list by using Quick Search Just type the name of the desired file in the Quick Search field and Quick Search will display only those files that match your input Then select the desired file as described above 6 Repeat this process until you are done creating the list 7 Click Save or Save As in the Process List panel Figure 3 3 to save the process list Clicking Save As allows you save the list with a new name How to Edit Steps 1 Click Load in the Step List panel Figure 3 3 A screen appears that lists all the previously created steps Figure 3 17 2 Select the desired step by double clicking on it The screen displays the parameters for the selected step 3 Edit the parameters as necessary 4 Click Save or Save As in the Step List panel Figure 3 3 to save the step Clicking Save Step As allows you save the step with a new name O Philips Research MiPlaza TL Company
16. type by selecting the drop down arrow and then selecting Start or Process from the list Process Ends By Specifies how by Time or Pressure a step in a process will end Time ends the step after the total time specified has elapsed in the running of the process Pressure ends the step when the chamber pressure reaches the designated pressure Pressure Enabled when Process Ends By is set to Pressure It is used by the user to set the process pressure The user enters the pressure setting by clicking in the field and entering the value Process Time Enabled when Process Ends By is set to Time It is used by the user to set the process timing The user enters the time using either the Hours Minutes Seconds and ms fields or the Time In Seconds field As you enter the time the time displays is both sets of fields NEXUS PVD 1 Systems User Manual TC10045 Rev A 3 11 VACUUM PANEL The Vacuum panel Figure 3 13 enables the user to set the type of control used for regulating the pressure inside the chamber during the step Vacuum Pressure Control Mode DownStream Y 5 Pressure Setpoint mTorr Iv Use HiVac o E Position setpoint Figure 3 13 Vacuum Panel Vacuum Panel Parameter Description Use HiVac O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Bladnr 5 13 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk
17. 2010 Question 1 show teacher how to operate the system in a correct way Question 2 Max load is 300 Gram Max Height is 10 mm max size is 150x150mm square or 200mm round O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 130 008 02 Blad nr 8 4 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 7 Instruction and test Beheerder Documentenbeheerder TFF Datum 26 11 2010 8 Gekwalificeerde personen lijst Datum wie Omschrijving 1 05 2007 Jeroen van Zijl System eigenaar 1 1 2008 Eddy Evens Back up systeem 5 05 2009 Wim Schram Operator O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31
18. 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Pressure Control Mode The user selects the control mode Absolute DownStream DownStreamFixed or Position by clicking the drop down arrow and selecting the control mode from the listing Absolute DownStream Uses a fixed gas flow set in the Depo Parameters panel and regulates the pressure in the chamber by actively controlling the position of the cryo pump gate valve DownStreamFixed Position The position of the cryo pump gate valve is set to a specific percentage 96 open thereby fixing the pumping speed of the cryo pump There is no active pressure regulation in this mode Pressure Setpoint mTorr Enabled when pressure control mode is set to Downstream Sets the pressure in the chamber for the step Position setpoint 7c Enabled when pressure control mode is set to Absolute DownStreamFixed or Position Sets percentage 96 open of the cryo pump gate valve for the step Process Create Screen 3 12 TC10045 Rev A Recipe Management Panel The Recipe Management panel Figure 3 14 displays information on when the process was created and last edited Recipe Management Created By Veeco Create Date n 6 1 2006 10 36 26 AM Last Edit By Veeco Last Edit Date 10 12 2006 2 21 17 PM Figure 3 14 Recipe Management Panel Recipe Management Panel Parameter Description Created By Identifies who created
19. Cassette Vent LoadLock Pump Down Home U NI 11 m Clear Line Events 16 55 14 Pm era ering Class n Select Run 2 B tor Schedule CMR Class Engine en am LLA CMR O Pump Down Rough Pump is Being Used By Load Ready Locked Motion Lift Table ECCE View Process View Process Parameters Times View Data Log Process Main Step BEE PCs 2 of 2 Pv Ss nm d Elapsed OREO Main Step Process iste Elapsed MORRO Remaining KOEK Main Step FFA Ps mn TM LLA AutoSeq PumpDownBase Soft Roughing to Setpoint Alarms O Philips Research MiPlaza TL Company Restricted View General Log Abort 4 4 S31 26 11 2010 Filenaam Operation manual S31 RWV nr RWV 011 008 130 01 1 Bladnr 4 5 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 4 1 3 Start proces with pumped loadlock We gaan er van uit dat het scherm op het main menu scherm staat Dit is dit scherm laxi View Process Times View Process Parameters View Data Log Schedule CML Run No 1 Schedule CMR Run No 2 m Class Engineering EN I GN Elapsed KRYEN Source ERTE GD PMS PM6 Load Lock ENTILECIONME o Main Step Gas EEZ PCS p ReadyTo Load Motio
20. Cycle 04 Process Gas Values Open At Stabitize Arc Counting o Ar 0 100 cem Open AtEnd F Enable o Ar 0 400 ccm SS 1100 Max Count 20 3 Ar 10 100 sccm 1 Reset Delay o jen 20 sccm fo rom P suns Process Control F Power Down Process Step Type Data Tracing Sec Collection Interval Process Time m s Hours Minutes Seconds ms iii dl cum cum ke je DET Process Pressure Torr 62 000 Time in Seconds Vacuum Pressure Control Mode F Use HiVac Downstream gt s Pressure Setpoint mTon o vj Position setpoint sl Quick View Figure 3 5 User Defined Parameters and Values Panels PROCESS MODULE BUTTONS The Process Module buttons Figure 3 6 enable the user to display the process create screen for the module they want to create a new step or process or revise an existing step or process Before creating or revising a step or process the user must select the desired process module O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Blad nr Document Bedieningsvoorschrift Epcode Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum PM1 PVD1s pA PADS Figure 3 6 Process Module Buttons User Defined Parameters and Values Panels Process Module Buttons DEPO PARAMETERS DG PANEL This panel Figure 3 7 enables the user to set the parameters for the
21. Menu the user can sign on and off the system and navigate to the other screens that make up the software For additional information see Main Menu on page 2 7 Figure 4 3 Main Menu PM Buttons The PM buttons Figure 4 2 display the PM panel for the process module Clicking the PM button for the PVD 1 displays the PM panel shown in Figure 4 4 This panel enables the user is able to control the processing of substrates in the process module and put the process module on or off line Figure 4 4 PM Panel PVD 1 Module PM buttons NEXUS PVD 1 Systems User Manual TC10045 Rev A 4 3 Load Lock Clicking Load Lock on the menu bar displays the Load Lock panel Figure 4 5 Using this panel the user is able to control various load lock operations Figure 4 5 shows a Load Lock panel for a tool with 2 load locks If tool has only I load lock O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 18 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 the LLB portion of panel is grayed out Figure 4 5 Load Lock Panel Tool with 2 Load Locks PM Panel Item Description Abort When Abort is selected the following occurs Current process stops running Time stops counting Plasma turns off Process gas turns off System goes off line End Current Step When se
22. RWV nr JerZij 2010 12 22 02V01 Bladnr 0 0 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 0 Inhoudsopgave Beheerder Documentenbeheerder TFF Datum 22 12 2010 Auteur J v Zijl wagp 5 16 Inhoudsopgave Blad nr Aant bladen 1 Changes compared to previous versions ennen enne venn veen rennen rennen 1 1 2 Saler 2 1 21 Safety of PEOple sinet ee bte 2 1 NAME Cu of the rcm 2 1 3 General PAER sasssa ae i oar ant aa a N aE UM OBEN UM EM S 3 1 del Veeco Neus BOD HT 3 1 3 1 1 Use of the Sy SII oio isei ie ia i ea a Ra cc alarme 3 2 3 1 2 Operating th ES MEN sesei anes eseina EEE EREE EEE EES 3 2 3 1 3 LOS E E nnen betnheeondideeenkendeddnnsadades 3 2 4 Hari HT i 4 1 4 1 Run with an excisting BEODPSS sued mapu EE eua i urit ier hes e epu RE E RU Cau que 4 1 4 1 1 Preparation MM MU 4 1 4 1 2 Start proces with vented loadlock ss sanerrrdernsensenserseneenernananvened ideen 4 1 4 1 3 Start proces with pumped Igadlock iei e eerie eneen 4 5 5 Proces VOOESODELBL scars tastes ede peciit p tiber ep ios o Ead EEE EAT ER 5 1 ME EE oun 5 1 5 2 Standaard configuration of the system sese enne 5 2 MERI S hy Do em n 5 2 5 4 Het maken van recepten level process engineer en hoger nennen 5 3 5 4 1 Process Create Screen jiicasccdiesincacdascv
23. Save An extension of Prc is automatically attached to the process name Process Steps Step 1 warm up Step 2 Step 3 Step 4 Step 5 Step 24 max 20 0 steps 2 Name the step e g warm up 3 Define the contents of the step by entering the desired values for the beam gas control shutter target and fixture parameters 4 After the values are entered into the step name a step list insert step into step list Repeat these steps for additional process steps TO CREATE A PROCESS STEP After all the steps are defined and inserted into the step list the process can be run on the system 1 Select the PM designator Process Create Screen 3 14 TC10045 Rev A How to Create a Step 1 Click the process module button Figure 3 6 for the process module you want to create the step O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 15 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 2 Click New in the Step List panel Figure 3 3 3 Enter the file name of the step in the dialog that appears 4 Click Save An extension of Stp is automatically attached to the step name 5 Enter the parameters for the step See User Defined Parameters and Values Panels on page 3 5 6 Click Save or Save As Clicking Save As allows you save the step with a
24. V 011 008 130 01 1 Bladnr 42 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 e Ga met de muis naar het schedule CMR of CML scherm afhankelijk welk Load lock gebruikt gaat worden e Klik op select een lijst net beschikbare schedules komt in beeld typ bv pml Al en er komt een lijst met daarin de processen die pml Al in de naam hebben e Selecteer het gewenste proces vb pm AI 1000nm pm1 AI 1000nm sch pm1 Al 100nm TiS sch pm1 AI 15nm sch pm1 Al 200nm sch LJprn1 Al 20nm sch prmn1 Al 250nm sch pmn1 Al 25nm sch pm1 Al 300nm sch pm1 AI 400nm sch pm1 Al 5000nm sch pm1 Al 500nm sch pm1 Al Condi sch pm1 AlSi 100nm sch pm1 AlSi 15nm sch pm1 AlSi 500nm sch pm1 Alsi condi sch pm1 AlSi1 1000nm sch pm1 AbOyNz 100nm sch LJpm1 MAM 50 500 50 Glas sch prn2 ets 3nm pm4 AI 250nm sch prn2 ets 3nm pm2 Mocr3 240nm sch prn2 ets 3nm sch PM1 100V 400V 10 70 sch PM1 100v 400V 30 60 sch PM1 102706 AlSi Burn sch PM1 2 400V 100V 10 70 sch anu Druk op ok Plaats de cassette in het load lock en trek de carriers terug in de achterste positie Sluit het loadlock Klik op run in het schedule CMR of CMR scherm deze kleur groen indien je dit niet doet gebeurd er niets e Druk op load Dit schem verschijnt x cancel
25. acdeorsucieavassadad an a E E 5 3 6 Rules M NIETO NRI ce aren 6 1 7 Forte gi ts 16 iiic mH M 7 2 8 Gekwalificeerde personen lijst sudes vastis s oi ee tam ppt ee antennen vane 8 4 Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 130 031 01 1 Bladnr 1 1 Document Bedienings Voorschrift Veeco Nexus 800 Epcode S31 Hoofdstuk 1 Wijzigingen t o v de vorige versie Beheerder Documentenbeheerder TFF Datum 26 11 2010 1 Changes compared to previous versions Date Page New Description number version 26 11 2010 perm HL First version with Document number O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 008 130 02 Document Bedieningsvoorschrift Hoofdstuk 2 Safety Beheerder Documentenbeheerder TFF 2 Safety 2 1 Safety of people Blad nr 2 1 Epcode S31 Datum 26 11 2010 De Veeco Nexus 800 is voorzien van diverse interlocks om een veilige werksituatie te cre ren Toch zijn er bepaalde risico s aanwezig die iedereen die met de Veeco werkt goed moet weten De risico s zijn 1 2 a Gassen Argon Zuurstof en stikstof zijn niet giftig of gevaarlijk bij normaal gebruik maar in afgesloten ruimten verdringen ze zuurstof Elektra Er zijn hoge spanningen aanwezig in het apparaat en de bijbehorende elektronica Een elektrische shock kan de dood tot gevolg he
26. afer Target Usage In KWH Displays the cumulative power dissipated on the tarrget Source Displays the status of various source interlocks Rotation When green indicates that the cathode is rotating Gas When green indicates gas is flowing in the chamber Depo When green indicates all deposition power supply interlocks are made Etch When green indicates all etch power supply interlocks are made Process Control Panel Continued Item Description Process Control Screen 4 10 TC10045 Rev A SUBSTRATE STATUS PANEL The substrate status panel Figure 4 13 one for each loadlock displays the status of each slot and substrate by color When Home is highlighted it indicates that the elevator is all the way up and cannot load or unload any substrates When a slot number is highlighted in blue it indicates that the slot is aligned with the opening of the isolation valve The arm is ready to pick up a substrate from that slot When slot status indicator is blinking it indicates that the processing of the substrate was interrupted Figure 4 13 Substrate Status Panel Substrate Status Color Code Color of Slot Status Indicator Description Black No substrate in the slot Blue Substrate is not processed Green Substrate is processed Yellow Substrate is being processed O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 22
27. bben Kom in geen geval aan de elektrische bedrading ook niet bij eenvoudige problemen Waarschuw bij slecht of niet funktioneren de Apparaat eigenaar of EE amp S Brandgevaar Het brandgevaar is erg laag In geval van brand druk op een van de grote rode knoppen met als opschrift EMO of emergency off en volg de algemene brand en evacuatie aanwijzingen op Mechanische risico s Buiten het load lock zijn alle mechanische bewegingen van onderdelen van het apparaat afgeschermd Het openen en sluiten van de load lock stopt indien er een voorwerp gedetecteerd wordt in het detectie veld boven de loadlock Straling Zichtbaar licht n v t Magnetisch veld Het magnetisch veld varieert van 1 gauss op 50 cm afstand van de kamer tot 15 gauss in de buurt van de depositiekamers Personen met een pacemaker is het verboden deze kamers te benaderen 2 2 Safety of the system Druk op de noodstop EMERGENCY OFF als er gevaar is of dreigt Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 008 130 01 1 Bladnr 3 1 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 3 Algemene werking Beheerder Documentenbeheerder TFF Datum 26 11 2010 3 General information 3 1 Veeco Nexus 800 De VeecoNexus bestaat uit de volgende onderdelen e Twee load lock s waarmee de cassettes in machine geladen kunnen worden e Een transferkamer met een robotarm waarmee de dep
28. cted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Document Bedieningsvoorschrift Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Panel and the Events and Alarms Panel MiPlaza Pir Blad nr 5 4 Epcode S31 Datum 26 11 2010 we Nexus Chater Tool Controller Version CTCflex_V2 06 76 Process Create Depo Parameters DC sone Parameters Recipe Management gt i e Sowce Created By Continuous m Power Parren es ALN 1000A 5mT 86mm rj Regulation o Bias Power Watts Process ALN I000A SmT 96mm Mode mevene neto Step ALN 1000A 6mT 96mm mH te etching 51 2006 103626 AM Step 8200 Power Wai ic v Network Mode Step 3 lo vein so Ba Te ERIN Step 4 omm feo i o LLL Sep 5 lo ie Sequence Mumher T Stage Last Edit Date er Step 7 cem fee E Suge H i immi 10 12 2006 22117 PM Step Ta CTS Step 9 S0 Frequency Mz Shutter Step 10 15 Paise Rev Time 5 so S Reston Spood RPM Open EENI Step 11 25 Duty Cycle 0 Process Gas Values Open At Stabilize Step_12 Asc Counting o 1 Ar p 100 sccm Open arena Step_13 r Step id hak NE Step 18 100 Max Count 20 3 Ar prom scom m Step 16 1___ Reset Deisy o je m 20 seem Step 17 Step 18 PRIME Process Control EX 19 F Power Down Process Step Type Step F Data Teacing 7 sec Cotlection Interval E Z Process Time T m lcm Step cds bom C am an NN Su 3 rac
29. deposition source rotation speed of the target and gas flow for each channel WARNING aUse caution when setting the pulse mode parameters as certain configurations can cause excessive arcing inside the chamber and lead to major particle generation and possible damage to the power supply Depo Parameters DC Bias Etch Parameters Iv Use Source Use Source Continuous SI Power Regulation Mode mode Power Fenlann 0 Bias Power Watts Mode i Ramp Time f Matching Power Watts Automatic Y Network Mode Voltage V 50 Sc Energy 50 C2 Sequence Number Stage p Pulsed Mode 96 v Stage Height mm Distance from target to chuck Frequency kHz Target Rotation 5 8 S31 26 11 2010 Pulse Rev Time uS Duty Cycle 4 m Mil ES r Arc Counting Enable Max Count Reset Delay 50 Z Rotation Speed RPM r Process Gas Values fo 1 Ar 0 100 scem fo 2 Ar 0 100 sccm 20 13 Ar 0 100 sccm o 4 N2 020 sccm Figure 3 7 Depo Parameters Panels DC and RF Depo Parameters Panel Parameter Description O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Bladnr 5 9 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Use Source When checked enables the sourc
30. e Control Mode Sets the mode of operation Continuous Timed Joules KiloJoules or Sequence for the power supply The user selects the control mode by clicking the drop down arrow and selecting the mode of operation from the list Regulation Mode Sets the output Power or Voltage of the power supply Ramp Time Sets the length of time for the power supply to ramp up Power Watts Enabled only when regulation mode is set to Power Sets the output of the power supply Voltage V Enabled only when regulation mode is set to Voltage Sets the output of the power supply Energy Enabled only when Control Mode is set to Joules or KiloJoules Sets the output of the DC power supply NEXUS PVD 1 Systems User Manual TC10045 Rev A 3 7 Sequence Number Enabled only when Control Mode is set to Sequence Sets the power supply to operate using one of the programmed sequences The user selects the sequence number by clicking the up or down arrow Note Sequences are preprogrammed Refer to the Power Supply User Manual for information on how to program sequences Pulsed Mode Enable When selected it enables a reversing voltage on the power supply output it is typically used for arc control in the system Note Pulsing parameters are controlled by the configuration software and are downloaded to the generator on startup Frequency kHz Enables the user to set the frequency at which the generator reverses the polarity of its voltage
31. fied name New Creates a new process list Delete Deletes the current process from the process list Quick View View an entire process in a spread sheet format Changes cannot be made to the recipe Quick Copy Copies entire process list to an external source such as a floppy disk Step List Panel Item Description Load Loads a previously created step to the step list Save Saves the current step to the step list Save As Saves the current step to the step list with a user specified name New Creates a new process step Delete Deletes the current step from the step list Process List Panel Step List Panel Process Create Screen 3 4 TC10045 Rev A O Philips Research MiPlaza TL MiPlaza 26 11 2010 Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Document Bedieningsvoorschrift Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Process Area Panel Plaza M W Bladnr 5 6 Epcode S31 Datum 26 11 2010 The Process Area panel Figure 3 4 displays the name of the process and lists the steps of the process It also enables the user to add or delete steps from the process When you click a step in the step list a box displays around the step and the step name also displays in the area above the process name ALN 1000A 5mT 86mm Process ALN 1000A 5mT 86mm L ALN_1000A_5mT_86mm Step Edit Insert Delete Figure 3 4 Process A
32. geef het lotnr in ddmmyy runnr Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 008 130 01 1 Blad nr Document Bedieningsvoorschrift Epcode Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum 5 Load oc e lx cancel druk op ok De machine zal vragen of je de wafers wil mappen Q Map Cassette in LoadLockB CML No Druk op Yes Pas daarna wordt het loadlock afgepompt tot 5 05 mBarr Check in het mapping scherm of de waferposities kloppen Het proces wordt gestart Nadat het proces klaar is verschijnt het volgende scherm Q Vent LoadLockB CML Chamber Druk op Yes Het loadlock wordt belucht tot 7 4 E2 Open het load lock en neem de cassette eruit De plakken kunen eruit worden genomen Zet de lege cassette terug in het loadlock Pomp als volgt af Klik in het main menu op loadlock Druk op Stop in het schedule CML of CMR gedeelte De groene Run button wordt grijs en het loadlock scherm wordt actief Druk op pumpdown Philips Research MiPlaza TL MiPlaza Te ie e 4 3 S31 26 11 2010 Company Restricted Filenaam Operation manual 31 RWV nr Document Hoofdstuk Beheerder RWV 011 008 130 01 1 Bedieningsvoorschrift 4 Bedienings voorschrift Documentenbeheerder TFF Blad nr Epcode Datum Main Menu PM1 Run No Class Select Run L LLB CML Load
33. h prn1 Al 15nm sch prn1 Al 200nm sch prn1 Al 20nm sch prn1 Al 250nm sch pm1 Al 25nm sch prn1 Al 300nm sch L pm1 Al 400nm sch prn1 Al 5000nm sch L pm1 Al 500nm sch pm1 Al Condi sch pm1 AlSi 100nm sch pm1 AlSi 15nm sch pm1 AlSi 500nm sch pm1 Alsi condi sch pm1 AlSi1 1000nm sch pm1 AbOyNz 100nm sch om1 MAM 50 500 50 Glas sch pm2 ets 3nm pm4 Al 250nm sch pm2 ets 3nm pm2 Mocr3 240nm sch pm2 ets 3nm sch PM1 100V 400V 10 70 sch PM1 100V 400V 30 60 sch JPM1 102706 AlSi Burn sch PM1 2 400V 100V 10 70 sch N A AN h Druk op ok Plaats de cassette in het load lock en trek de carriers terug in de achterste positie Sluit het loadlock Klik op run in het schedule CMR of CMR scherm deze kleurt groen indien je dit niet doet gebeurd er niets e Druk op load Dit schem verschijnt LoadLock B cancel Druk op ok De machine zal vragen of je de wafers wil mappen O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 008 130 01 1 Blad nr Document Bedieningsvoorschrift Epcode Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum Operator Input Request Q Map Cassette in LoadLockB CML Druk op Yes Pas daarna wordt het loadlock afgepompt tot 5 05 mBarr 4 7 S31 26 11 2010 Check in het mapping scherm of de waferposities kloppen aantal wafers en
34. laza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Bladnr 5 11 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 NEXUS PVD 1 Systems User Manual TC10045 Rev A 3 9 STAGE PANEL The Stage panel Figure 3 9 enables the user to move the chuck to a specific height Stage 86 5 Stage Height mm Distance from target to chuck Figure 3 9 Stage Panel SHUTTER PANEL The Shutter panel Figure 3 10 enables the user to set the position of the shutter Open or Close at 3 different points At Start At Stabilize and At End during the process The shutter position is set by selecting Open or Close from the drop down lists Shutter Open m At Start Open Y At Stabilize Open z At End Figure 3 10 Shutter Panel BACK SIDE GAS PANEL Displays only on process modules using back side gas to cool the substrate The Back side gas panel Figure 3 11 enables the user to set the pressure setpoint for the back side gas To enter a value select the current value and enter the new value Backside Gas o Torr Figure 3 11 Back Side Gas Panel Stage Panel Parameter Description Stage Height mm Used to move the chuck to a specific height To change the height the user enters a new value or uses the up and down arrows Note The value displayed represents the distance the chuck
35. lected ends the current step and immediately advances to the next step in the process Unload When selected initiates an unload sequence A log file is copied to the CTC On Line When selected places the process module on line Off Line When selected places the process module off line NOTE Process Control Screen 4 4 TC10045 Rev A View Data Log Clicking View Data Log Figure 4 2 displays the Data Log File Selector Figure 4 6 The Data Log File Selector displays the file location of data logs Double click the desired log and it will appear To close and return to the program click on the close icon Every day that the tool is used to process substrates a new sub directory is created with the current date In the sub directory are the RunNo_ directories for runs processed that day Note that the RunNo directories are named according to the run number and the time military time that the first wafer starts processing Each time another pallet is run the run number RunNo_ is incremented To view the log files for wafers run during a particular run double click the desired RunNo directory to display the log files for wafers processed in that run and then double click the txt file for the wafer Figure 4 6 View Data Log Load Lock Panel Item Description Load Cassette Automatically pumps down the load lock chamber maps the cassette and prepares the load lock for a schedule to process substrates Vent LoadLock
36. n 2 m 1 iz 4 KEZ PMCS Etch Process EM Elapsed KREEK Source EEE o pond Main Step TUEUSTECUEEN EZ PC Ready Toload Process EEN Elapsed KEEGIEOOKEN Source my Locked pmoetsanm _ Io 00000 Lift Table BKC Main Step pn ets nm WIPE NCS Se cic Elapsed ESSERE Source Rough Pump is i E A Being Used By Lift Table OKO Main Step Gas EEZ PCS I Clear Line IUBE pH Events View In General Astart 4 A A ENexus cluster To E Elevator Menu BE rwv 011 130 031 ERE 11 33am EE 46 09 34 Icrc129900 LoadLock State Idle Druk op de button Loadlock Selecteer bij CMR of CMR vent Het loadlock wordt belucht en je kan de deur openen Plaats de te sputteren substraten in de Casette e Ga met de muis naar het schedule CMR of CML scherm afhankelijk welk Load lock gebruikt gaat worden e Klik op select een lijst net beschikbare schedules komt in beeld typ bv pml Al en er komt een lijst met daarin de processen die pm1 Al in de naam hebben e Selecteer het gewenste proces vb pml Al 1000nm O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 MiPlaza RWV nr RWV 011 008 130 01 1 Bladnr 4 6 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 4 Bedienings voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 LLB Schedules I pm Al 1000nm sch pm1 AI 1000nm sch LJpm1 Al 100nm TiS sc
37. of the process selected will display in the window Schedule LLB displays only if tool has 2 load locks O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Blad nr Document Bedieningsvoorschrift Epcode Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum Figure 4 11 Schedule Run Panel Substrate in Chamber Green Process completed successfully Yellow Substrate is partially processed Blue Process has not started Red An error has occurred Color Status Schedule Run Panels Item Description Process Display Displays the name of the process being run Select Enables the user to select the schedule to run To select a schedule click Select and choose a schedule from the list that appears Run Click Run to run the schedule NOTE Process Display Process Display Process Control Screen 4 8 TC10045 Rev A PROCESS MODULE PANEL The Process Module panel Figure 4 12 enables the user to change the status On Line or Off Line view the status of the process module 5 20 S31 26 11 2010 For every process module on the tool there is a process module panel Only 3 process module panels can be displayed on the screen To view other process module panels click the PM selector to display the drop down list and and select the process module Figure 4 12 Process Control Panel Process Control Panel Item Description On Off
38. oses the wafer allocation panel Clear All Clears all substrates Wafer Allocation Panel Continued Item Description Process Control Screen 4 14 TC10045 Rev A O Philips Research MiPlaza TL 5 23 S31 26 11 2010 Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 130 008 02 Bladnr 6 1 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 6 Rules amp Regulations Beheerder Documentenbeheerder TFF Datum 26 11 2010 6 Rules amp Regulations 1 only trained personel may operate the system 2 In case of failures of the system during processing wafers the system owner will be informed Jeroen van Zijl tel 93083 or his Back up Eddy Evens tel 95975 to resolve the failure When they are not in You can call Patrick v Eerd tel 92602 A reset of the system by a person different then the system owner is not allowed This can lead to a non entrance procedure of the cleanroom 3 wafer trays to use in the system according to the system owner Set 1 Gold AU and adhesion layers to Au Cr Au Ti Au Mo Au Ta Au Set 2 Ti TiW TiWN Set 3 Mo MoCr 3at Al en AI203 Set 4 Cr Cr203 CrO2 Set 5 Ge4 Ge2 lagen Phase change materials Set 6 Ta TaN Ta205 Set 7 Si en Sio2 Set 8 Pt Ti Pt Ta Pt Set 9 PZT and adhesion layers to PZT Ti Ta PT In case of call system owner The maximum load at the wafertrays 1s 300 gr excl wafer tray De maximum Size is 200mm
39. ositie tafels getransporteerd kunnen worden e Drie proces kamers met hierin een shutter waarin de plakken ge tst worden Pm2 Pm3 en pm5 e 6 depositie kamers voor resp ZNO AL Mo AL Ti TiW W De Veeco Nexus 800 is een single wafer machine waarin de plakken een voor een bewerkt kunnen worden in een of meerdere proceskamers Nadat de cassette met de benodigde substraten in het load lock gezet is wordt het load lock afgepompt Vanuit het load lock gaat de plak via de transfer kamer naar een van de proces kamers Het sputteren van lagen gebeurd d m v recepten en scheduless die in de machine aanwezig zijn Als in de schedule vermeld staat dat de plakken voor depositie ge tst moeten worden dan gaat de plak eerst naar kamer Pm2 of Pm5 waar hij een sputterets krijgt Daarna wordt het substraat naar de betreffende depositiekamer gebracht waar het van een metaallaag wordt voorzien Voor eventuele meerdere metaallagen wordt het proces herhaald Hierbij wordt ditmaal de sputterets achterwege gelaten Na depositie plaatst de robotarm het substraat weer terug in het load lock op zijn beginpositie in de cassette Nadat alle plakken uit de cassette verwerkt zijn wordt de load lock belucht en kan de cassette weer terug naar buiten Het systeem wordt bediend m b v het toetsenbord aan de voorkant van het systeem Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 008 130 01 1 Bladnr 32 Document
40. processing pm4 Al Pm5 Ti10W90 Pm6 W 5 3 Targets available On request we wil place the next matrials in the system Additional time will be charged to the customer 4 Hours target Pml Pm2 MoCr3 MoNb2 Ni pm3 Pm4 Ti ALNd2 AlCul AlSi1 Cu Pm5 C Ti5W95 Pm6 Op aanvraag kunnen andere targets besteld worden via de systeem eigenaar O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr Document Bedieningsvoorschrift Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder RWV 011 031 130 01 1 TFF liPlaza Blad nr 5 3 Epcode S31 Datum 26 11 2010 5 4 Het maken van recepten level process engineer en hoger 5 4 1 Process Create Screen Introductie Only users with a privilege level of Process Engineer or above can access this screen Using the Process Create screen Figure 3 1 the user creates steps that detail system operating parameters and inserts them into a sequence called a process Eun E Inc Regeteton 40008 ST 86mm Power Regulesen Blas Power Watts o__ Bias ve ALN_1000A_5mT_86mm A Em A JAENCTOOGA Sm T mm o Ramp time s200 Power Wars Automatic tne sede fee Stage Stay ibt Darii udo get Rotation 2 0 100 seem 20 Ar 1001 sccm o Jane p20 sccm Process Control Process Step Type Step_21 F ata Tracing ME id EI u ES ES I Step 25 rarr
41. rea Panel Item Description Insert Click to insert a step Delete Click to delete a step O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Bladnr 5 7 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 User Defined Parameters and Values Panels These panels display the parameter values of the step They also enable the user set the parameters for new steps or change the parameters of an existing step A description of each panel is given on the following pages User Defined Parameters and Values Panels er Nexus Cluster Tool Controller Version CTCflex V2 08 7H Process Create PROCESS CREATE Depo Parameters DC Bias Etch Parameters Recipe Management F Use Source F Use Source Created By Control Continuous hd Mode Power a ora Power _ Requlation p al ae xx ar Create Dave jo Ramp Time 6 1 2006 103626 AM Power Wars Automatic gt Network Mode io Voltage V so 5 a Edit By jo Energy so Be Veo jo z Sequence Number Stage Last Edit Date Pulsed Mode es s Stage Height mm 10 12 2006 2 21 17 PM F Enable __Otstonce kom targotto chuck 160 Frequency kHz Target Rotation Shutter 5 Pulse Rev Time uS so TB Rotation Speed em Open latsun 25 Duy
42. row expands the panel to display the readings of all the gauges active and inactive Trend Bar Process Control Screen 4 12 TC10045 Rev A WAFER ALLOCATION PANEL The Wafer Allocation panel Figure 4 16 enables the user to override the default behavior of the system software The panel displays whenever you double click any of the areas shown To move a substrate there must be no schedules running or the schedules must be paused Figure 4 16 Wafer Allocation Panel Wafer Allocation Panel Item Description Location Specifies the location of the substrate Select from the drop down list Slot Specifies the slot number of the substrate Select from the drop down list Wafer ID Specifies the substrate ID number Select from the drop down list O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Blad nr Document Bedieningsvoorschrift Epcode Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum Status Displays the status of the wafer and enables the user to change the status of the wafer by selecting the new status from the drop down list Fault Tolerance Status Not supported Add Adds a substrate NOTE Wafer allocation panel Double click on any slot Double click on any of these areas or wherever a wafer is shown NEXUS PVD 1 Systems User Manual TC10045 Rev A 4 13 Clear Clears the substrate Close Cl
43. the recipe The information in this field is automatically created when the user clicks Save Create Date Identifies the date the recipe was created The information in this field is automatically created when the user clicks Save Last Edit By Identifies the person who last edited the the recipe The information in this field is automatically created when the user clicks Save O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RWV 011 031 130 01 1 Bladnr 5 14 Document Bedieningsvoorschrift Epcode S31 Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum 26 11 2010 Last Edit Date Identifies the date the recipe was last edited The information in this field is automatically created when the user clicks Save NEXUS PVD 1 Systems User Manual TC10045 Rev A 3 13 WORKING WITH THE PROCESS SCREEN Creating a Process Overview Shown below Figure 3 15 are the functions performed when creating steps and inserting them into a process Figure 3 15 Creating a Process How to Create a New Process A process consists of steps that define how a substrate is to be proceseed the following steps describe how to create a new process 1 Click the process module button Figure 3 6 for the process module you want to create the process 2 Click New in the Process List panel Figure 3 3 3 Enter the file name of the process in the dialog that appears 4 Click
44. tion Controleer of de machine en de te gebruiken targets Groen zijn Controleer of de bediening aan de voorzijde op het CTC scherm staat Gebruik de juiste schaaltjes zie Rules and regulations 5 1 Vul het electronisch logboek van het systeem in Check of alle modules online groen staan 4 1 2 Start proces with vented loadlock We gaan er van uit dat het scherm op het main menu scherm staat Dit is dit scherm ts Nexus Cluster Tool Controller Version CTCflex_V2 08 139 Process Control le x View Process Parameters View Data Log View Process Load Lock Times PM4 PM5 PM6 Schedule CMR Run No 2 ReadyToLoad _ Process Source Class Class con TM ao a Select BRUA _ Run NE nos lpm Al 20000 EEN CS TEEN Elapsed MORRO Source Motion Locked If pm2 Mocr3 onm NEM enses 0 00 00 0 Main Step fom Moc S0nm EEE PMCS HOEN Source emana KORTE z 12 of 2 rc roces Elapsed KOKRA Source Rough Pump is Moiion Locked f pm Cu200nm ono 0 00 00 0 Being Used By J i B pm Cu 200nm EZ Pv CS Du Clear Line Lr EA i Weense a Events 16 09 34 IcTc129900 LoadLock State Idle View E General gAstart 4 3 EN EgNexus cluster To E Elevator Menu Bil Jrwy 011 130 031 ri We T ETT O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual 31 RWV nr RW
45. ule View Process Times Clicking View Process Times displays the Wafer Processed Times panel Figure 4 8 This panel enables the user to view the wafer process times for either loadlock Figure 4 8 Wafer Processed Times Panel Process Control Screen 4 6 TC10045 Rev A GRAPHICAL DISPLAY General Information The graphical display consists of an animated screen that graphically displays the progress of substrate processing and status panels that display the status of the process and enable the user to perform various functions Figure 4 9 Graphical Display Process Control Screen Indicators During system operation the screen will display various operations options and processes Their status is indicated by the following colors Status Panels Animated Screen Color Status Panels Buttons and Indicators Green Denotes a valve is open or an ON state for a button Gray Denotes a valve is closed an OFF state for a button or an option is disabled Red Denotes an error state for the action being performed Yellow Denotes an intermediate state for a device being actuated Blue Gate or ISO valve is closed NEXUS PVD 1 Systems User Manual TC10045 Rev A 4 7 Status Panels OPERATOR PANEL The operator panel Figure 4 10 displays the current user Figure 4 10 Operator Panel SCHEDULE RUN PANELS The schedule run panels Figure 4 11 enable the user to select a previously created schedule and run it The name
46. z Process Presssrn Ton nz090 Theme la Seconds Step Vacuum PM2 Step 28 Presse Control Mode PVD1s Step 29 F Use HiVac DownStream Step Step x s Pressure Setpoint mTorr o E Positian setpoint A Figure 3 2 Areas of the Process Create Screen Main Menu Clicking Main Menu Figure 3 2 displays the Main Menu dialog Figure 2 8 Using this dialog the user can sign on and off the screen and navigate to the other screens For additional information see Main Menu on page 2 7 Events and Alarms Panel The Events and Alarms panel Figure 3 2 displays connection status events and alarms events log and enables the user to abort a process For additional information see EVENTS AND ALARMS PANEL on page 2 14 Process Create Panel The Process Create panel Figure 3 3 contains two subpanels Process List and Step List The functionality these panels provide is described in the following tables O Philips Research MiPlaza TL Company Restricted Filenaam Operation manual S31 RWV nr RWV 011 031 130 01 1 Blad nr Document Bedieningsvoorschrift Epcode Hoofdstuk 5 Proces voorschrift Beheerder Documentenbeheerder TFF Datum PROCESS CREATE STEP LIST amp Figure 3 3 Process Create Panel Process List Panel Item Description Load Loads a previously created process Save Saves the current process to the process list Save As Saves the current process to the process list with a user speci
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