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1. 41 4 2 Human Machine Interface Hardware 42 4 2 1 System Status Beacon 42 4 3 HMI Menu Structure 42 44 ManMenu 44 4 4 1 Auto StopButton 44 4 4 2 AlarmsArea 45 4 4 3 Temperature Humidity Indicators 46 444 History Button 46 4 4 5 ReportsButton 46 4 4 6 System Settings Button 46 44 7 EvritButton 46 448 Utilities Indicators 47 4 4 9 Context Sensitive Help Area 47 4 4 10 Module Status Selection 47 4 4 11 Conveyor 50 4 5 Module Status Screens 51 4 5 1 Stack Module Status Screen 51 4 5 2 Cleaner and Developer Module Status Screen 53 4 5 3 Substrate Coating Module Status Screen 55 4 54 Resist Curing Module Status Screen 57 4 5 5 Sputtering Module Status Screen 59 aan Manual Technical Data K VI Contents SQL 4 6 History Screens 62 4 6 1 Alarms Tab 62 4 6 2 EventssTab 63 4 6 3 Temperature Humidity Tab 64 4 6 4 TimelineTab
2. 65 4 6 5 Job History Tab 65 Contents K M3 Operator Manual Technical Data HUMAN MACHINE INTERFACE 4 1 General This chapter provides a definition of the facilities provided at the Human Machine Interface HMI for the operation and control of SQM system The description is limited to the features that are intended for use by an operator during normal production with the SQM system Details of the functions provided for fault diagnosis and process control are provided in the separate SQM Service Manual Operator Manual Human Machine Interface Page 45 15 1 06 SQL Page 46 4 2 Human Machine Interface Hardware The HMI consists of 15 touchscreen that is mounted on a rail to allow it to be moved along the length of the machine A separate keyboard with trackerball is provided with the system This keyboard can be connected to system using the USB port located on the touchscreen Touchscreen USB port for connection of keyboard 4 2 1 System Status Beacon A beacon is located on top of the machine to provide an indication of the status of the system as follows RED LAMP LIT One or more of the system modules is in an alarm condition and can no longer accept glass substrates for processing ORANGE LAMP LIT The system is able to continue with production but operator intervention is required for example an empty box should be loaded at the Stack module
3. NG SQM Installation Manual Provides information regarding the preparation of a mastering system prior to the installation of the SQM system Also provides instructions for the placement of the machine and connection to the required supplies Operator Manual About This Manual ZA MO Page iii 12 12 05 SQL Operator Manual About This Manual 12 12 05 Page iv YA M3 SON 1 SAFETY INFORMATION LIST OF TOPICS 11 AA AA 3 1 2 Purpose and LimitationsofUse 4 1 3 Definition of User Levels 4 14 General Safety Regulations 5 1 4 1 Technical Standards 5 1 4 2 Adherence to Regulations 5 14 3 TrainingofPersonnel 5 1 4 4 Cleanliness and Good Housekeeping 5 1 4 5 Access for Authorized Personnel Only 5 1 4 6 Unauthorised Modifications 5 1 4 7 Transportation and Installation 6 1 4 8 Removal of Safety Features 6 1 4 9 Testing after Maintenance and Service 6 1 4 10 Supplies 6 1 4 11 Location of the Operating Instructions 6 1 4 12 Local Regulations 6 1 5 SafetyFeatures 7 1 5 1 Emergency Stop Button 7 1 5 2 Fume Evktraction 7 1 5 3 Stack Loader D
4. y Today J 7 days 4 weeks Number V CO002 Resist Empty Figure 4 8 Example Alarms Tab Page 66 Other period 07 30 am 07 32 am The screen shows all of the alarms generated by the module during the specified period A different period can be specified by either checking the Today 7 days or 4 weeks box or by checking the Other period box and selecting the date range JU M2 Operator Manual Human Machine Interface 15 1 06 SQL 4 6 2 Events Tab An example of the events tab is shown below Cal Values H Measurements Timeline Job History 4 weeks Other penod 29 08 2005 3 15 pm Script CLEAN modified by User M2service Figure 4 9 Example Alarms Tab The screen shows all of the events that occurred for module during the specified period A different period can be specified by either checking the Today 7 days or 4 weeks box or by checking the Other period box and selecting the date range Operator Manual Human Machine Interface LL v2 Page 67 15 1 06 SQL 4 6 3 Temperature Humidity Tab An example of the temperature humidity tab is shown below agi Cal Values Job History 4 weeks Other period Temperature ME Tempensiure wanao Humidity 9 Humidiky variation Figure 4 10 Example Temperature Humidity Tab The screen shows a plot of the temperature and humidity of the clean air supply to the SQM measured over the specifi
5. 4 5 4 Resist Curing Module Status Screen An example of the status screen for the Resist Curing Module RCM is shown below and a definition of the information given is provided in the table that follows ____Status WO List Cal Values 8 Setpoint temperature 90 0 C Measured temperature 89 8 C Disc on module JJ Current process Process step Time to go complete process Job name ADHESIVE BAKING Disc on conveyor Comms OK e 48 Volt present JI BAKING 78 0 ADVD12345 CLOSE Figure 4 6 Resist Curing Module Status Screen Operator Manual Human Machine Interface 15 1 06 ZA NG Page 61 OQU Table 4 4 Resist Curing Module Status Information STATUS ITEM DENINITION Setpoint temperature The temperature to which the hot plate should be heated in accordance with the system settings Setpoint temperature GANA Kara Measured temperature The measured temperature of the hot plate Measured temperature 095 OC Current process The process being carried out in the module Process step The sub step within the process currently being carried Current process ADHESIVE BAKING out Process step BAKING Time to go complete process 78 0 Time to go complete process The remaining time seconds until processing of the substrate on the module will be finished Job name ADVD12345 Job name The name of the job assigned to the substrate by the system sche
6. Shows the position and movement of the arm used for the dispensing of photo resist 90 mm is the centre of the substrate 180 mm is the outside edge of the substrate Dispensing of photo resist is shown by the appropriate tube in the arm being displayed in green 500 RPM Rotation Table Shows the speed of rotation and the presence of a substrate on the rotation table Current process RESIST COATING Process step DISPENSING Time to go complete process 40 Job name AD VD12345 Page 60 Current process The process being carried out in the module Process step The sub step within the process currently being carried out Time to go complete process The remaining time seconds until processing of the substrate on the module will be finished Job name The name of the job assigned to the substrate by the system scheduler JA Operator Manual Human Machine Interface 15 1 06 STATUS ITEM DENINITION Disc on module iw Disc on conveyor iw Comme OK w Motor alarm b3 Disc on module A substrate is present on the rotation table in the module Disc on conveyor A substrate is present on the conveyor chuck presently located at the module position Comms ok The communication between the module and the system controller is working correctly Motor alarm An error has occurred with one of the motors within the module An appropriate alarm message will also be displayed
7. A The box contains a substrate that was aborted failed during processing There is no box present inside the machine and the fork is in the retracted default position This is the condition when the machine is initially started The fork used to load unload boxes is inside the stack The fork used to load unload boxes is inside the stack and a box with blank substrate is present in side the machine A box containing a blank substrate has been opened ready for loading of the substrate onto the conveyor An open box is present inside the machine ready for receipt of a completed master Page 56 ISI Operator Manual Human Machine Interface 15 1 06 OQU STATUS ITEM DENINITION Door Lit to indicate that the stack is in a safe condition for opening of the door Home position The stack is at the home default position following initialisation Disc on module A box containing a substrate is present at the load Disc on conveyor Mi Disc on conveyor A substrate is present on the conveyor chuck Comme OK I presently located at the stack module position Motor alarm v Comms ok The communication between the stack module and the system controller is working correctly Motor alarm An error has occurred with the stack lift motor An appropriate alarm message will also be displayed When checked The stack module door can be opened for the All unloading of completed mast
8. Operator Manual Version 1 0 DO261734 OQU ABOUT THIS MANUAL This manual provides guidelines and instructions for operators of the SQM CD DVD glass mastering system The manual is divided into 7 chapters containing the following information CHAPTER TITLE CONTENTS 1 Safety Information Important guidelines and information relating to personal and equipment safety This chapter must be read before attempting to operate the SQM system 2 Technical Data Information regarding identification and the environmental aspects of the system 3 System Description A general description of the SQM system and an overview of the glass mastering process 4 Human Machine Interface An overview of the functionality and facilities provided at the Human Machine Interface used for operation and control of the system 5 Operating Procedures Instructions for the correct and safe operation of the system 6 Chemical Preparation Procedures Instructions for the mixing of the chemical process solutions used during the mastering process 7 Routine Maintenance Procedures Description of the routine maintenance tasks that can be carried out by an operator Pr Manual About This Manual ZA MO Page i SQL CONVENTIONS USED IN THE MANUAL The following conventions are used in this manual to highlight important information 2 NG Warning A warning within an instruction is used to indicate that the risk of per
9. Waiting for error clear An error occurred in the module that requires rectification before the module can continue e g an empty chemical tank 4 4 10 2 Stack Box Status The status of the substrate boxes present in the stack loader is indicated by the colour in which the box is displayed as follows The box contains a blank substrate ready for processing Black Gray The box contains a blank substrate ready for processing The box contains a successfully completed master Green Red The box contains a substrate that was aborted failed IN Operator Manual Human Machine Interface 15 1 06 Dark Blue Light Blue Yellow Yellow spiral Green spiral Grey spiral 000000 SQL 4 4 10 3 Substrate Indicator The status of a substrate present on the module is shown as follows The status of the substrate changes as soon as the applicable process is started The plain glass substrate has been loaded into the system but has not yet been cleaned The substrate has been cleaned and adhesive coated in the Cleaner and Developer module The substrate has been coated with photo resist in the Substrate Coating module The substrate has been recorded in the Laser Beam Recorder The substrate has been developed in the Cleaner and Developer module The substrate has been metallised in the Sputtering module Operator Manual Human Machine Interface P 15 1 06 SOL 4 4 11 Conveyor Screen dumps requi
10. OK J presently located at the module position Motor alarm b3 Comms ok The communication between the module and the system controller is working correctly Motor alarm An error has occurred with one of the motors within the module An appropriate alarm message will also be displayed 4 5 3 Substrate Coating Module Status Screen An example of the status screen for the Substrate Coating Module SCM is shown below and a definition of the information given is provided in the table that follows Manual E I O List Cal Values 90 00 mm 399 RPM Disc on module 9 Current process RESIST COATING Disc on conveyor Comms OK 2 Process step DISPENSING Motor alarm Enough for Masters Time to go complete process 40 Job name ADVD12345 CLOSE Figure 4 5 Substrate Coating Module Status Screen Operator Manual Human Machine Interface LL vo Page 59 15 1 06 mn OQU Table 4 3 Substrate Coating Module Status Information STATUS ITEM DENINITION Enough for Masters Photo resist Tank Shows the level of solution in the tank as a percentage of the full level The number of masters that can still be produced from the chemical remaining in the tank is also shown Waste Bottle Shows the level of solution in the photo resist waste bottle tank as percentage of the full level Photo Resist Valve Grey Valve closed Green Valve open 30 00 mm Dispense Arm
11. Operating Instructions Page 7 p u p ing ucti Z M2 age 75 15 1 06 SAN 10 Confirmation that SQM control software has been successfully started is provided by display of the lt Main Menu a Temperature C IFiF Humidity 26 56 0 Haay hoe disk Ready tor disk Ready for disk Heady tor disk Handy foe disk Ready tor disk Caps off 1 08 PM 1 7 3 4 8 a T a a 16 11 if ia is H 1 5 11 Check that there are no alarm messages displayed and that the utilities indicators at the left of the screen are all lit The lt Circuit breaker and lt Emergency stop indicators should be extinguished 12 Confirmation that all modules are ready for production is provided by display of the text lt Ready for disk gt above each module The Stack Module STM 1 will show the text lt Waiting gt 13 Switch on the external Media Input System computer and start the scheduler program as detailed in the Eclipse documentation provided with the system 14 Load the jobs to be mastered as detailed in the Eclipse documentation 15 The SQM system is now ready to start production and can be set into the automatic mode by selection of the lt Auto gt button at the top of the screen After Auto mode has been selected the button text will change to lt Stop gt Page 76 JA VID Operator Manual Operating Instructions 5 4 SON Loading Unloading Substrates The glass substrates to be used for mastering and
12. Part 1 Laser Guards ZA ND Page 21 SQ 2 4 Dimensions and Weight All dimensions are shown in mm 2000 rhm 2400 mm Figure 2 1 Dimensions of the SQM Mastering System Table 2 1 Weights ASSEMBLY WEIGHT SQM System including LBR Approximately 1600 kG SQM Laser Beam Recorder Approximately 45 kG Page 22 Operator Manual Technical Data 15 1 06 SON 2 5 Type Variants The SQM system can be supplied in the following configurations KG CD Only version Fitted with 10 x Laser Beam Recorder NG Entry Level CD DVD version Fitted with 6x 2R Laser Beam Recorder KG Standard CD DVD version Fitted with 10x 4R Laser Beam Recorder KG High Volume CD DVD version Fitted with 10x 5R Laser Beam Recorder 2 6 System Performance Data The output capability of the various configurations is follows 2 6 1 CD Only Version NG 135 CD Masters per 24 Hours 2 6 2 Entry Level CD DVD Version PN 5o 80 CD Masters per 24 Hours NG 36 DVD Masters per 24 Hours 2 6 4 High Volume CD DVD Version NG 135 CD Masters per 24 Hours NG 85DVD Masters per 24 Hours Operator Manual Technical Data LL vo Page 23 15 1 06 a SQL Page 24 2 7 Environmental Data The following paragraphs provide important technical details of the machine when operated under normal production conditions 2 7 1 Machinery Noise The airborne noise generated by the machine during normal operating conditions does not
13. RCM MODULE CDM SCM LBR Operator Manual System Description 15 1 06 SQ 3 3 1 Stack Module STM The 180 mm glass substrates used with the SQM system are loaded into the system in individual boxes These boxes protect the glass substrates from damage and contamination The Stack Module has the capacity for the simultaneous loading of 20 substrate boxes Completed masters are returned into a box at the stack module for easy and protected removal from the system If required an additional stack loader can be fitted into the system to further reduce the requirement for operator intervention 3 3 2 Cleaner Developer Module CDM The cleaner developer module is used for the initial cleaning of loaded glass substrates coating of the adhesive layer and the developing of the substrate following recording Cleaning is carried out by DI water flushing and the action of a small brush The dispensing of the used chemicals is carried out through a single arm having separate tubes for each of the chemical solutions The dispense arm is driven by a stepper motor that allows programming of the dispense position for each of the chemicals Each chemical line is fitted with a suck back valve that prevents the possibility of dripping at the end of the dispense cycle The developer module has a quality measurement arm that facilitates the measurement of the asymmetry value over the complete substrate surface following developing In t
14. Stack Module STM CD Cleaner and Developer Module CDM CO Resist Coating Module RCM HP Resist Curing Module RCM LB Laser Beam Recorder LBR SM Sputter Module SPM BF Conveyor When the alarm condition has been rectified the alarm message can be removed 1 from the displayed list by touching the sAlarm Clear button Page 80 II Operator Manual Operating Instructions M2 ji SQL 5 7 Chemical Replenishment Waste Vessel Emptying A number of the chemical solutions used during the mastering process and the basic chemicals from which they are mixed are flammable and can cause skin eye and mucous membrane irritation Always observe the following precautions NG Always prepare all chemicals at the chemical preparation bench with the fume extraction fan switched on Never prepare the chemicals in the room in which the system is installed NG Always wear protective clothing gloves and safety glasses when handling chemicals NG Avoid breathing in fumes vapours and sprays NG Avoid contact with the skin or eyes KG Always wash hands thoroughly after working with the chemicals The tanks for the process chemicals used during the mastering process and the container for collection of the waste photo resist are located in a single compartment at the bottom of the machine The tanks are located on a retractable base plate that can be pulled out of the machine for easy access Operator Manual Operating
15. The SQM system is provided for the production of CD and DVD photo resist masters The system should be used only for the purpose for which it was intended Any unauthorised use or modification could present safety risks and in addition will invalidate the warranty of the equipment The system meets the current industrial standards for safety during operation It has been designed to be easy to operate and requires the minimum of maintenance Operators must comply with the safety guidelines provided in this manual The system should be operated only in a technically perfect condition by specifically trained staff 1 3 Definition of User Levels The following user levels are defined for access to the SQM system OPERATOR LEVEL Normal operating procedures start up etc Limited cleaning tasks TECHNICIAN LEVEL Routine maintenance tasks Adjustment procedures including modification of process parameters Component replacement SERVICE LEVEL Intended for M2 Engineering personnel Fault finding and repair tasks Page 4 These user levels are reflected in the access structure of the facilities provided at the Human Machine Interface Operator Manual Safety Information Z M2 i SON 1 4 General Safety Regulations 1 4 1 Technical Standards The SQM system is manufactured according to the latest technical standards and is designed for safe operation The system can however present a hazard if operated b
16. Allow the liquid in the filter to drain into the beaker 3 Remove the upper tube from the filter and remove the filter from the mounting bracket 4 Transfer the couplings from the old filter onto the replacement filter Page 106 Operator Manual Routine Maintenance SQL 5 Fit the replacement filter into the mounting bracket and re connect the upper and lower tubes 6 Re apply pressure to the appropriate tank or re apply the Dl water pressure and check that there are no leakages at the tube connections T Unscrew the vent valve at the top of the filter to remove any air trapped in the filter This completes the procedure Operator Manual Routine Maintenance U vo Page 107 15 1 06 SQL Figure 7 1 Air Bearing Buffer Tank Page 108 7 5 Inspection of Laser Beam Recorder Air Buffer The rotation unit of the Laser Beam Recorder is fitted with an air bearing that has an air buffer tank between the main compressed air supply and the bearing This tank is provided to protect the bearing against damage in the event of a failure of the main compressed air supply The tank should be inspectede every six months for signs of damage or fatigue The tank can be accessed from the rear of the machine If there is no person within the mastering facility that can carry out this inspection then an external authority should be engaged to carry out the inspection 7 6 Precautions to be Taken During Service All other ser
17. GREEN LAMP LIT The system is in normal production without any problems and so no operator intervention is required 4 3 HMI Menu Structure The functions commands and setting that can be selected at the HMI are organised with a menu structure as shown in Figure 4 1 A description of the menus is provided in the paragraphs that follow I Mvo Operator Manual Human Machine Interface 15 1 06 SYSTEM SETTINGS C4 RECORD wep TF Ch DEVELOP dept A C cunn ep C E METALIZE map 10 C UN CO COAT ONLY Figure 4 1 HMI General Menu Structure Operator Manual Human Machine Interface amp vo Page 47 15 1 06 SQL 4 4 Main Menu The Main Menu provides an overview of the complete system in which the location of the glass substrates and status of the individual processiong modules is shown The layout of the Main Menu is shown below and a description of the displayed items is provided in the sub paragraphs that follow Temperature Humidity Sensors Auto Stop Button Alarm Area History Button emperature C 21 2 Print E saa Button onveyor System Settings Button Ready for disk Ready for disk Ready for disk KA AA AA I Ready for disk Ready for disk Exit Button 3 Module i Status i Selection ON ae 2 Utilities 2 SPM1 LBR
18. Photo Resist Microposit R EC Solvent Flammable Developer OCG 809 Irritant 5 7 2 Emptying the Waste Vessel The requirement for emptying of the photo resist waste vessel is provided by the display of an alarm message at the HMI The waste bottle is fitted into a neck holder that has as shut off valve to prevent drips and fumes Remove the waste bottle by tilting it forwards and pulling it away from the neck holder Page 84 JA VID Operator Manual Operating Instructions a SQ 5 8 Shutdown Procedures 5 8 1 Normal Shutdown To shutdown the system at the end of a shift or production period proceed as follows 1 Operator Manual Operating Instructions 15 1 06 At the HMI select the lt Stop gt button All modules will finish process and loaded substrates and the substrates will be unloaded to the conveyor When all substrates have been unloaded to the conveyor select the lt Exit gt icon to close down the HMI application Confirm the request to exit when prompted Close down Windows using the normal procedure Remove the power from the SQM using the power switch located on the left hand side panel of the machine Turn off the DI water and compressed air supplies to the machine Close off the argon gas supply to the machine ZA M2 Page 85 SQL Page 86 5 8 2 Longer term Shutdown If the system is to be shutdown for a period exceeding 2 days then it is strongly recommended to tak
19. Unit The SQM is supplied with a self contained Clean Air Unit that provides a constant supply of conditioned air to the SQM The air unit provides precise control of the air temperature and humidity and this ensures that the correct environmental conditions within the system are maintained ZA The technical aspects operating instructions and maintenance procedures for the Clean Air Unit are contained in the separate Weiss Enet documentation provided with the unit Operator Manual System Description K MO Page 31 15 1 06 SQL PICK amp PLACE STACK MODULE SPUTTER STM MODULE SPM Figure 3 2 SQM System Layout Page 32 3 3 SQM Technical Description The SQM system has a modular construction with process modules positioned in line within a rectangular frame The system has been designed so that it can be easily expanded by the fitting of additional modules for increased capacity or alternative functionality The substrates used for the glass mastering process are transported through the system by a central conveyor system Each process module has a pick and place handler for the transfer of substrates to and from the central conveyor The general layout of the system is shown in the figure below and the individual modules are described in the sub paragraphs that follow CONVEYOR DISC RECOGNITION HANDLER MODULE hud WLU CLEANER SUBSTRATE RESIST CURING LASER BEAM DEVELOPER COATING MODULE RECORDER MODULE MODULE
20. ZA M2 Page 25 SQL Page 26 Operator Manual Technical Data 15 1 06 SON 3 SYSTEM DESCRIPTION LIST OF TOPICS 3 1 General 25 3 2 Scope of Supply 26 3 2 1 MedialnputSystem 26 3 2 2 CleanAirUnit 27 3 3 SQM Technical Description 28 3 3 1 Stack Module STM 0 000005 29 3 3 2 Cleaner Developer Module CDM 29 3 3 3 Resist Coating Module RCM 30 3 3 4 Resist Curing Module Disc Recognition Module 30 3 3 5 Laser Beam Recorder LBR 31 3 3 6 Sputtering Module 31 3 3 7 Chemical Compartment 32 3 3 8 Conveyor 32 3 3 9 Human Machine Interface 33 3 4 Mastering Process Description 33 3 5 Glass Substrates 34 3 5 1 Substrate Inspection 35 392 Clean AA AA 35 3 5 3 Adhesive Coating 35 3 5 4 Adhesive Baking Cooldown 35 3 5 5 Photo Resist Coating 36 3 5 6 Resist Curing 36 3 5 7 Laser Beam Recording 37 3 5 8 Developing 37 35 9 Sputtering MI IAA 38 oe Manual System Description amp VI Content
21. and extract 5 ml of silane using the droplet counter or pipette Close the bottle immediately to prevent moisture from entering the bottle 6 Transfer the silane drop by drop into the Erlenmeyer flask Do not add in large quantities as this will cause a polymer to be formed in the liquid after which it cannot be used in the system T Extract a further 5 ml of silane from the bottle and again add this to the stirring solution drop by drop Operator Manual Chemical Preparation INC SQ 8 Close the silane bottle tightly and immediately return to the refrigerator 9 Allow the solution in the Erlenmeyer flask to continue stirring for 1 minute 10 Transfer the prepared solution into the SQM adhesive tank 11 Repeat the procedure to make any additional solution required 12 When all required solution has been prepared thoroughly clean all used glassware and the stirring magnet with Dl water A small amount of DI water should be left in the Erlenmeyer flask Operator Manual Chemical Preparation A MO Page 93 15 1 06 SAN 6 4 Photo Resist Preparation Special Precautions Preparation must be carried out at the chemical bench with the yellow light switched on Ensure that the fume extraction for the bench is switched on The photo resist and solvent used must be at room temperature before preparation Required Chemicals 180 ml S1818 Photo resist 189 grams 820 ml Microposit EC Solvent 789 gra
22. and pressure gauge for the compressed air supply are located behind the panel on the left hand side of the machine The pressure should be set to 5 to 6 bar Operator Manual Operating Instructions Page 74 LA VI SQL CLEAN AIR Check that the associated clean air unit is switched on and set for the correct conditions inside the SQM system Refer to the Weiss Enet documentation provided with the unit air system is switched on DI WATER Check that the external DI water system is switched on 2 io Pressure 2 to 5 bar NG Temperature 20 to 21 C EXHAUST Check that the central exhaust system is switched on 5 2 2 General Checks before Starting Production Before starting production carry out a quick check that there are no tools or other obstructions remaining in the machine and that all doors and windows are closed 5 3 Start up Procedures 5 3 1 Power up Procedure The procedure that follows is applicable to the starting up of the system following a complete removal of the power 6 Switch on the main power switch of the SQM located on the left hand side of the machine T Wait for approximately 30 seconds and then press the blue reset button also located on the left hand side panel 8 Switch on the HMI computer located on the top of the machine The HMI computer will be booted and the Windows desktop will be displayed 9 Select the SQM icon to start the SQM control program Operator Manual
23. is required for example an empty box should be loaded at the Stack module GREEN LAMP LIT The system is in normal production without any problems and so no operator intervention is required 5 5 2 Monitoring at the HMI A full description of the screens provided at the HMI for monitoring of the SQM system is provided in Chapter 4 Human Machine Interface 5 6 Responding to Alarm Messages If an error is detected during operation of the system an alarm message is displayed at the top of the screen CO002 Resist Tank Empty 07 45 am CD001 Developer Level Low 07 47 am IG CD012 Water Pressure too low 06 13 pm S SL021 Alarm on servo 04 45 pm The messages are categorised as either warnings Orange Text during which the module continues processing or as errors Red text which result in production in the module being suspended until rectification of the error If the number of active errors exceeds the display error then a scroll bar is provided to allow movement within the complete alarm list When an alarm is highlighted in the list a small amount of help text is displayed 2 in the context sensitive help area at the bottom of the display More detailed help a information can be obtained by touching the sAlarm Help button Operator Manual Operating Instructions Page 7 SQL Each alarm message has a unique code where the first two characters indicate the module that generated the alarm as follows SL
24. of help text is displayed 2 in the context sensitive help area at the bottom of the display More detailed help A information can be obtained by touching the lt Alarm Help gt button Each alarm message has a unique code where the first two characters indicate the module that generated the alarm as follows SL Stack Module STM CD Cleaner and Developer Module CDM CO Resist Coating Module RCM HP Resist Curing Module RCM LB Laser Beam Recorder LBR SM Sputter Module SPM BF Conveyor When an alarm condition has been rectified the alarm message can be removed from the displayed list by touching the lt Alarm Clear gt button Operator Manual Human Machine Interface LA VID Page 49 15 1 06 uo SQL 4 4 3 Temperature Humidity Indicators This area of the screen provides a constantly updated readout of the temperature Temperature C 21 2 NO a Humidity 26 56 0 and humidity within the system ZA The temperature and humidity are measured at the associated clean air unit that provides the conditioned air supply to the SQM system 4 4 4 History Button Touching the lt History gt button results in display of a further menu from which details of the system usage alarm messages etc can be accessed 4 4 5 Reports Button The lt Reports gt button allows the definition and printing of a system report This feature is not currently implemented 4 4 6 System Settings Button The SQM system
25. of the SQM system Operator Manual Safety Information M2 i SQL 1 5 Safety Features The following safety features are incorporated into the design of the SQM system WARNING It is prohibited to remove or override the safety features of the system unless this is absolutely necessary for service purposes All safety devices must be re instated before the system is returned to normal production 1 5 1 Emergency Stop Button A single Emergency Stop Button is located at the Human Machine Interface Activating this button results in the immediate stopping of all mechanical movements within the system The Emergency Stop button should not be used for a normal production stop as this results in all substrates that were being processed when the button was used being aborted Additionally an extended time is required to re start the system following an emergency stop and this will lead to a loss of production 1 5 2 Fume Extraction A fume extraction connection is provided within the system to ensure the safe removal of the potentially dangerous solvent vapours that are produced during the mastering process Provision of the extraction fan is the responsibility of the SQM customer The fan should meet with the following specification Capacity 1200 m3 per Hour Static Pressure 200 pa A sensor is fitted in the fume extraction pipe and this prevents the system from being used if it is detected that the fume extraction is not
26. operating correctly oo Manual Safety Information K MO Page 7 SQMI 1 5 3 Stack Loader Door Interlock The door to the Stack module is fitted within an interlock device that prevents the door from being opened until the stack lift mechanism has been moved to the default position and has fully stopped Movement of the stack lift mechanism to the safe default position is activated using the push button located next to the Stack module door EJ ai a be 1 5 4 Door Locks Mechanical locks are fitted to the lower doors behind which the power supply modules are located These doors should be kept locked unless access is specifically required for service purposes The key used to opening these doors should be held by a person in authority 1 5 5 Window Interlocks All windows are fitted with locking devices that prevent them from being opened during operation of the machine The windows can only be opened following use of the window lock button and after all movements in the machine have stopped Page 8 Operator Manual Safety Information SQL 1 6 Hazardous Areas The figure below highlights the areas within the SQM system where a potential hazard exists if the safety instructions are not correctly observed These areas are indicated on the SQM system by the placement of the standard safety labels WARNING These labels must never be removed or covered The labels should be immediately replaced if they becom
27. prepared clean the measuring cylinder and the cap thoroughly with Dl water A small amount of Dl water should be left in the measuring cylinder Operator Manual Chemical Preparation Page 98 amp VI SON f ROUTINE MAINTENANCE LIST OF TOPICS 7 1 General III AUWAWA 101 7 2 Monthly Cleaning Procedures 102 7 2 1 General Cleaning 102 7 2 2 Process Bowl Cleaning 102 7 2 3 Cleaning the Sputtering Module Masks 103 7 3 BrushReplacement 104 74 Filter Replacement 105 74 1 FilterReplacement 105 7 5 Inspection of Laser Beam Recorder Air Buffer 108 7 6 Precautions to be Taken During Service 108 oo Manual Technical Data K M2 Contents SQL Contents Operator Manual Technical Data 15 1 06 ROUTINE MAINTENANCE 7 1 General This chapter provides instructions for the limited number of routine maintenance tasks that can be carried out by an operator of the SQM system WARNING All other maintenance and repair of the SQM system is considered beyond the scope of a normal operator and should only be carried out by M2 Engineering personnel or personnel who have attended an official SQM service training course Operator Manual Routine Maintenance Page 101 15 1 06 SAN 7 2 Monthly Cleaning Procedures In order to maintain the
28. provides the facility for the specification of scripts that define the way in which a substrate is processed within the system Touching the lt System Settings gt button results in the display of a further menu from which these scripts can be created and edited A description of this feature is provided in the SQM Service manual 4 4 7 Exit Button Touching the lt Exit gt button closes the SQM application and returns to the Windows desktop Page 50 JU Operator Manual Human Machine Interface a 15 1 06 Temperature Humidity Water Argon Comp Air Downtlow Exh aust Stack Box Status Ready foridisk i 2 3 4 5 6 7 a a 1 SON 4 4 8 Utilities Indicators The utilities required for correct operation of the SQM are continuously monitored and these indicators are used to verify that the correct supplies and services are present lamp lit In the event of a failure of any of the utilities or services the indicator lamp will be extinguished The Circuit breaker and Emergency stop indicators are lit when the main circuit breakers is tripped or the Emergency Stop Button is activated A failure in any of the utilities also results in the display of an alarm message 4 4 9 Context Sensitive Help Area This area is used for the display of help text for atrium messages and tips and advice on the use of the functions provided within the control software When a specific button or function is selected the text fo
29. should be left in the measuring cylinder Operator Manual Chemical Preparation Page 96 amp VI Operator Manual Chemical Preparation 15 1 06 SAN 6 5 Developer Preparation Special Precautions None Required Chemicals 200 ml OCG 809 LSI Developer 100 800 ml Dl water Required Equipment Calibrated Measuring Cylinder 1000 ml Squeegee Container with Dl water Storage after Preparation 1 week at room temperature or 2 weeks if stored in a refrigerator Preparation Procedure To prepare 1 liter of the process solution used in the SQM proceed as follows 1 Remove the remaining solution from the SQM developer tank and rinse the tank with Dl water 2 Clean the measuring cylinder to be used with Dl water 3 Pour 800 ml of Demi water into the clean measuring cylinder The last bit should be added using a squeegee container the bottom of the meniscus should be used as the reference Page 97 4 Add 200 ml of OCG 809 LSI Developer into the measuring cylinder to give a total volume of liquid of 1000 ml in the cylinder the bottom of the meniscus must not deviate more than 2 ml 5 Seal the cylinder using the cap hold the cap firmly and turn the cylinder upside down and back again slowly about 10 times to thoroughly mix the solution 6 Transfer the prepared solution into the SQM developer tank T Repeat the procedure to make any additional solution required 8 When all required solution has been
30. substrate TON cleaning 90 mm is the centre of the substrate 180 mm is the outside NG edge of the substrate Quality Measurement Arm 180 00 mm Shows the position and movement of the order measurement arm used for quality control 90 mm is the centre of the substrate 180 mm is the a outside edge of the substrate When the laser is switched on this is indicated by the display of the green beams Rotation Table ea Shows the speed of rotation and the presence of a substrate on the 500 RPM rotation table Page 58 fi Operator Manual Human Machine Interface 15 1 06 OQU STATUS ITEM DENINITION Current process The process being carried out in the module cleaning adhesive coating or developing Current process CLEANING g g ping Process step BRUSHING Process step The sub step within the process currently being carried Time to go complete process 15 0 out Job name AD VD12345 Time to go complete process The remaining time seconds until processing of the substrate on the module will be finished Job name The name of the job assigned to the substrate by the system scheduler If no jobs have been started at the Media Input System then the substrate will be shown as unassigned Disc on module A substrate is present on the rotation table in the Disc on module iw module Disc on conveyor A yor Disc on conveyor A substrate is present on the conveyor chuck Comms
31. the finished masters produced by the SQM system are loaded and unloaded at the Stack Module STM The substrates and finished masters are contained in the special boxes provided with the system 5 4 1 Substrate Loading To load a box es containing a substrate to be used for mastering proceed as follows Operator Manual Operating Instructions 15 1 06 Press the small button at the Stack module The indicator in the button will flash slowly while the stack is moved to the correct position for opening of the door When the indicator within the button starts to flash quickly then the door can be opened to gain access to the stack slots Load the box es containing the substrates to be used for mastering into the slots Confirmation that the box contains a blank substrate will be provided by the display of the letter O on the indicator to the left of the slot When all of the required substrates have been loaded into the slots close the stack module door The substrates will be automatically loaded into the system as required by the process The following general status information is provided by the stack module slot indicators O Box contains a blank substrate ready for processing b The box from the slot is currently being loaded unloaded or is inside the machine E The box is empty d The box contains a completed master The Job name is shown to the right of the box A The box contains a substrate t
32. yield of the system it is very important to the keep the machine clean It is recommended that the following procedures are carried out at least once per month 7 2 1 General Cleaning Clean all parts of the machine using a lint free cloth wetted with Dl water Any photo resist stains can be removed using Microposit EC solvent The drawer of the chemical compartment should be cleaned of any chemical spillages 7 2 2 Process Bowl Cleaning To clean the process bowls of Cleaner and Developer module CDM and Resist Coating module RCM proceed as follows 1 Press the window release button to allow the windows to be opened The windows can be opened when the lamp in the button flashed guickly 2 Open the windows to gain access to the process bowis 3 Remove the outer ring of the process bowl Operator Manual Routine Maintenance Page 102 amp VI SON 4 Remove the inner ring of the process bowl 5 Transfer the rings to the chemical bench and clean as follows Cleaner and Developing rings DI water and a soft brush Resist Coating rings Microposit EC solvent or Acetone 6 Clean the inside of the process bowls as follows Cleaner and Developer bowl Dl water and a soft brush Resist Coating bowl Microposit EC solvent or Acetone T Refit the inner and outer rings into the process bowl 7 2 3 Cleaning the Sputtering Module Masks To be advised Operator Manual Routine Maintenance U vo Page 103 15 1 0
33. 1 Indicators gt 9 Circuitbreaker Emergency stop Caps off 1 08PM Context Sensitive Help Area Figure 4 2 Main Menu 4 4 1 Auto Stop Button The lt Auto Stop gt button is used for starting and stopping the processing of substrates within the system The button has a toggle function If the AUTO text is displayed on the button then touching the button will start the automatic production within the system If the text STOP is displayed on the button then touching the button will stop the production all modules will complete any process being carried out and then the system will stop Page 48 II Operator Manual Human Machine Interface f 15 1 06 SQL 4 4 2 Alarms Area The Alarms Area at the top of the screen is used for the display of the alarm messages that are generated in the event of a system error condition CO002 Resist Tank Empty 07 45 am CD001 Developer Level Low 07 47 am Ii CD012 Water Pressure too low 06 13 pm aS A SL021 Alarm on servo 04 45 pm The messages are categorised as either warnings Orange Text during which the module continues processing or as errors Red text which result in production in the module being suspended until rectification of the error If the number of active errors exceeds the display error then a scroll bar is provided to allow movement within the complete alarm list When an alarm is highlighted in the list a small amount
34. 6 SQMI 7 3 Brush Replacement The small foam brush at the Cleaning and Developing module should be replaced at least once every 6 months Proceed as follows 1 Press the window release button to allow the windows to be opened The windows can be opened when the lamp in the button flashed quickly 2 Prepare the new brush pad by allowing it to soak in Dl water for 30 minutes 3 Lift the brush mechanism and release the 2 screws to remove the pad retaining plate 4 Position the new pad and secure the retaining plate using the 2 screws previously removed Operator Manual Routine Maintenance Page 104 amp NID SAN 7 4 Filter Replacement The chemical filters used in the SQM should be replaced at least once every 6 months A decrease in the yield of the system due to visual defects or data errors BLER E32 PIE POF etc may indicate the requirement for more frequent replacement The filters are located in the chemical compartment in the lower part of the machine 1 Dl water Filter 2 Adhesive Filter 3 Developer Filter 4 Photo resist Filter 7 4 1 Filter Replacement To replace each filter proceed as follows 1 Remove the pressure to the appropriate tank or turn off the Dl water pressure using the pressure regulators Operator Manual Routine Maintenance LY vo Page 105 15 1 06 2 Place a beaker below the lower connection of the filter to be replaced and release the lower tube
35. 6 Resist Curing The resist coated substrate is returned to the Resist Curing module where it is again baked to remove all solvent from the photo resist layer to produce a stable layer ready for the subsequent recording process step RESULT SOLVENT EVAPORTED FROM LAYER 550 550551 Photo resist Layer Glass Substrate Operator Manual System Description 15 1 06 Page 40 amp NID SQ 3 5 7 Laser Beam Recording The program to be mastered is recorded onto the substrate in the Laser Beam Recorder by the exposure of the photo resist layer by a switched laser beam Acid is formed at the exposed areas and these areas become more soluble by the developer solution used in the subsequent developing process The exposed area become the pits in the finished master whereas the unexposed areas are unaffected during developing and become the lands space between the pits RESULT Acid Formed at Exposed Areas Photo resist Layer Glass Substrate 3 5 8 Developing The developing process is carried out in the Cleaning and Developing module During developing a chemical is dispensed onto the surface of the rotating substrate This solution has the effect of dissolving the area of the photo resist that where exposed in the Laser Beam Recorder to leave pits within the photo resist layer The unexposed areas are unaffected and become the lands within the series of pits and lands Following the formation of the pits a meas
36. 8 Shutdown Procedures 85 5 8 1 Normal Shutdown 85 5 8 2 Longer term Shutdown 86 oo Manual Technical Data K MO Contents SQL Contents Operator Manual Technical Data 15 1 06 OPERATING INSTRUCTIONS 5 1 General This chapter provides instructions on the general operation of the SQM CD DVD mastering system The following standard operator tasks are described NG Carrying out the required pre start checks before beginning with production NG Starting up the system KG Loading substrates and removing finished masters NG Monitoring the system during operation NG Responding to alarm messages NG Re filling the process solutions used in the system NG Shutting down the system WARNING The system should only be operated by personnel who have attended an official SQM training course and who are familiar with the general safety precautions as detailed in Chapter 1 of this manual Operator Manual Operating Instructions Page 73 15 1 06 SQL 5 2 Pre start Checks This section describes the checks that should be carried out before starting production with the SQM system 5 2 1 Supplies The following supplies are required for the correct operation of the system ARGON GAS The argon supply bottle is located outside of the SQM system The argon pressure set at the gas bottle should be 1 0 to 2 5 bar COMPRESSED AIR The connection
37. Instructions A vo Page 81 15 1 06 SQL 5 7 1 Refilling the Chemical Tanks An indication that any of the chemical tanks requires refilling is provided by the display of an appropriate alarm message at the HMI To refill the tank proceed as follows 1 Pull the drawer out of the chemical compartment 2 Identify the correct tank to be refilled by the tags provided on the tank 3 Close off the compressed air supply to the tank at the appropriate regulator Page 82 Operator Manual Operating Instructions SON 4 Remove the compressed air quick connector from the tank blue hose 5 Remove the liquid quick connector from the tank black hose 6 Remove the tank to the electroforming room or other area where the chemical solutions are prepared and add the required quantity of solution into the tank The procedures for preparation of the process solutions are contained in Chapter 5 Chemical Preparation T Return the tank to the SQM chemical compartment and refit the quick connectors 8 Re apply the air pressure to the tank to complete the procedure Pan Manual Operating Instructions ZA vo Page 83 SAN In the event of an accident involving the process solutions the following Material Safety Data Sheets are applicable Table 5 1 Process Solutions Safety Details PROCESS SOLUTION SAFETY CATEGORY APPLICABLE MSDS Adhesive N 2 Aminoethyl 3 Aminopropyl Trimthoxy Silane A0700CD Irritant
38. being carried out in the module Process step The sub step within the process currently being carried out Time to go complete process The remaining time seconds until processing of the substrate on the module will be finished Job name The name of the job assigned to the substrate by the system scheduler Disc on module je Disc on conveyor w Comme OK je Argon present w Disc on module A substrate is present on the rotation table in the module Disc on conveyor A substrate is present on the conveyor chuck presently located at the module position Comms ok The communication between the module and the system controller is working correctly Argon present Confirms the presence of the Argon gas supply required for the sputtering process Operator Manual Human Machine Interface 15 1 06 K WD Page 65 SQL 4 6 History Screens Each module has a history section that allows the viewing of the details applicable to the module The history information is further sub divided between the separate tabs as described in the sub paragraphs that follow An overall history section providing details of the complete machine can be accessed from the main menu by touching the lt History gt button 4 6 1 Alarms Tab An example of the alarms tab is shown below Status l E Measure g I O List Cal Values Alarms Events Temp Humidiy Measurements Timeline Job History
39. duler Disc on module A substrate is present on the rotation table in the Disc on module iw module Disc on conveyor wv Disc on conveyor A substrate is present on the conveyor chuck Comms OK w presently located at the module position 45 Yolt present iw Comms ok The communication between the module and the system controller is working correctly 48 Volt present The 48 Volt power supply used by the hot plate is present Page 62 IS Operator Manual Human Machine Interface 15 1 06 4 5 5 Sputtering Module Status Screen An example of the status screen for the Sputtering Module SPM is shown below and a definition of the information given is provided in the table that follows I O List zA i 50o Ma Oh Vent Valve 23710 mbar P 100 ma __50 11560 i Roughing Valve 0 Angle Valve Argon Supply Current process Process step Time to go complete process Job name METALLISING SPUTTERING 95 0 ADVD12345 Disc on module Disc on conveyor Comms OK o Argon present JJ CLOSE Figure 4 7 Sputtering Module Status Screen Operator Manual Human Machine Interface 15 1 06 ZM2 Page 63 OQU Table 4 5 Sputtering Module Status Information STATUS ITEM DENINITION The disc lift is in the lowered position and the sputtering chamber is open The disc lift is in the raised position and the sputtering chamber is closed Details of the s
40. e illegible Figure 1 1 SQM System Hazardous Areas ee Manual Safety Information ZA MO Page 9 SQL A definition of the warning labels and the hazards indicated by them is provided in Table 1 2 Table 1 2 Definition of Warning Labels Hazards LABEL HAZARD PRECAUTIONS Potentially lethal electrical power supplies are located behind the panel or door Access should be restricted to suitably qualified personnel The Sputtering module within the system produces strong electromagnetic fields that can present a hazard to persons with cardiac pacemakers Any personnel having a pacemaker or other implanted device should keep a safe distance of at least 5 metres from the system when it is in operation The system is fitted with a laser device that can present a hazard to the eyes if the correct precautions are not observed refer to Paragraph 1 8 Laser Beam Recorder Air Buffer on Page 1 11 for more detailed information The chemical vessel to which the label is affixed contains a flammable solution The chemical vessel to which the label is affixed contains a solution that can be irritating to the skin and eyes The Resist Curing module is fitted with a hot plate that gets sufficiently hot to cause injury The hot plate is always switched on and takes time to cool down after the power is removed from the system Never place flammable materials on the hot plate Page 10 Op
41. e precautions to prevent contamination of the chemical circuits due to crystallisation or drying out of the chemicals remaining in the circuits The chemical tanks should be empties and then filled with the following cleaning solutions NG Adhesive Tank Demi water KG Developer Tank Demi water NG Photo Resist Tank Microposit EC Solvent The tanks should then be re fitted into the chemical compartment and the manual commands provided at the HMI should be used to thoroughly flush the chemical circuits with the cleaning solutions The cleaning solutions should be allowed to remain in the circuits during the shutdown period When re starting after a longer shutdown the cleaning solutions in the circuits should first be flushed out and replaced with the appropriate process solution before re starting production Operator Manual Operating Instructions cm2 gt pa SON 6 CHEMICAL PREPARATION LIST OF TOPICS 6 1 General 23 ka ANG AG KA KALA KANE NA KNA 85 6 2 Safety Precautions 85 6 2 1 Accidents Involving Chemicals 86 6 3 Adhesive Preparation 87 6 4 Photo Resist Preparation 90 6 5 Developer Preparation 93 oo Manual Technical Data K M2 Contents SQL Contents Operator Manual Technical Data 15 1 06 CHEMICAL PREPARATION 6 1 General This chapter provides instructions on
42. ed period A different period can be specified by either checking the Today 7 days or 4 weeks box or by checking the Other period box and selecting the date range PAN The sensors used for these measurements are located in the clean air unit that is included in the SQM scope of supply Page 68 SIT y Operator Manual Human Machine Interface 15 1 06 SQL 4 6 4 Timeline Tab This function is not currently implemented 4 6 5 Job History Tab An example of the Job History tab is shown below Status History Manual E Measure J 1O List GJ Direct Control Cal Values E Alarms Evens Temp Humidity y Today i days 4 weeks SJebname ACDmaster05 CD ADVDmaster05 DVD 5 Figure 4 11 Example Job History Tab Measurements Timeline Job History Other penod Asy Recorded Time 7 Current Status 29 07 05 3 15pm Completed 13 1 25 07 05 4 20pm Completed This tab provides a listing of all substrates that have been processed in the module during the specified period A different period can be specified by either checking the Today 7 days or 4 weeks box or by checking the Other period box and selecting the date range The following information is provided Job Name The master ID entered during loading of the job at the media input system Format The type of master CD DVD 5 or DVD 9 RPM The speed used during the photo resist coating process to create the correct layer thickness entered at the
43. erator Manual Safety Information Z M2 i SQL 1 7 Gas Bottles The Sputtering module uses potentially dangerous Argon Gas All operating personnel should be aware of the potential hazards involved in the use and handling of the associated gas bottles WARNING Danger of explosion fire poisoning and severe damage Mounting assembly and handling of the pressure gas bottles and their equipment must be carried out in accordance with national and local regulations Pressure reducing valves must be installed in the gas supply lines with an adjustable pressure Pout for the SQM system of 1 5 bar 1 8 Laser Beam Recorder Air Buffer The rotation unit of the Laser Beam Recorder is fitted with an air bearing that has an air buffer tank between the main compressed air supply and the bearing This tank is provided to protect the bearing against damage in the event of a failure of the main compressed air supply The tank should be inspectede every six months for signs of damage or fatigue The tank can be accessed from the rear of the machine If there is no person within the mastering facility that can carry out this inspection then an external authority should be engaged to carry out the inspection Figure 1 2 Air Bearing Buffer Tank eee Manual Safety Information ZA MO Page 11 SQL Laser Beam Recorder 1 9 Laser Safety Precautions The Laser Beam Recorder module is fitted with a laser device of the following type NG semi co
44. ers ow unloading When unchecked The stack module door is locked and cannot be opened 4 5 2 Cleaner and Developer Module Status Screen An example of the status screen for the Cleaner and Developer Module CDM is shown below and a definition of the information given is provided in the table that follows 30 00 mm PED 500 RPM Disc on module J Current process CLEANING Disc on conveyor Comms OK 9 Process step BRUSHING pened 9 Enough for Enough for Masters Masters Time to go complete process 1 5 0 Job name ADVD12345 CLOSE Figure 4 4 Cleaner and Developer Module Status Screen Operator Manual Human Machine Interface YA v2 Page 57 15 1 06 p a SAN Table 4 2 Cleaner and Developer Module Status Information STATUS ITEM DENINITION Chemical Tanks Shows the level of solution in the tank as a percentage of the full level The number of masters that can still be produced from the chemical remaining in the tank is also shown Enough for Masters Valves Grey Valve closed Green Valve open Dispense Arm 30 000 rm Shows the position and movement of the arm used for the dispensing of chemicals 90 mm is the centre of the substrate 180 mm is the outside edge of the substrate The chemical being dispensed is shown by the appropriate tube in the arm being displayed in green Brush 30 00 mm Shows the position and movement of the brush used for
45. exceed lt 70 dBA and so hearing protection devices are not required 2 7 2 Machine Vibration When operated under normal operating conditions the machine complies with the acceptable vibration conditions outlined in Machinery Directive EAC 825 EN 264 2 7 3 Gas Vapour and Dust Emissions The following waste vapour is produced by the system NG Vapour Solvent polluted air 2 NG Waste Vapour Pressure 0 1 bar above atmosphere ZA This vapour is safely exhausted to the outside of the building JU Operator Manual Technical Data 1V 15 1 06 Operator Manual Technical Data 15 1 06 SQ 2 8 Waste Products 2 8 1 Targets Spent Nickel Vanadium targets produced by the machine must be disposed of in accordance with local regulations 2 8 2 Waste Adhesive Developer The waste adhesive and developer solution produced by the system are automatically deposited into the waste water treatment system of the associated electroforming system 2 8 3 Waste Photo resist The waste photo resist produced by the system is collected in a container within the machine When full this container should be emptied into a larger sealable container which should in turn be treated as solvent waste in accordance with local regulations 2 8 4 Cleaning Materials Waste cleaning materials su ch as isopropanol and acetone used for machine cleaning must be treated as chemical waste and disposed of in accordance with local regulations
46. hat is engraved on each substrate Operator Manual System Description 15 1 06 INC SON 3 3 5 Laser Beam Recorder LBR The Laser Beam Recorder LBR is the module where the program or data to be mastered is written onto the glass substrate by exposure of areas of the photo resist using a switched laser beam The full optical path including the laser diode is fitted in a self contained writing module that can be exchanged as a complete unit so eliminating the requirement for optical path alignment Writing Module 3 3 6 Sputtering Module The function of the Sputtering Module is to apply a thin layer of Nickel Vanadium onto the surface of the recorded and developed glass master This metal layer provides the electro conductive surface required during the subsequent electro forming process The vacuum required by the Sputtering Module is developed by the combination of a roughing pump and a turbo molecular pump Roughing Pump located in base of machine Turbo molecular Pump oe Manual System Description ZA VI Page 35 3 3 7 Chemical Compartment The tanks filters and other components for the chemical solutions used during the mastering process are located in the chemical compartment in the bottom part of the machine The tanks are mounted on a drawer that can be pulled out from the machine for easy access Chemical Compartment 3 3 8 Conveyor Glass substrates are transported through the system by the o
47. hat was aborted failed during processing ZA M2 Page 77 5 4 2 Removing Finished Masters When a master has been completed it will be automatically returned to an empty box at one of the stack slots Confirmation that the slot contains a completed master is indicated by the display of the letter d next to the slot __ The identification job name of the completed master s is provided on the Stack AG module status screen at the HMI AC12457 CL aom To remove a completed master s proceed as follows 1 Press the small button at the Stack module The indicator in the button will flash slowly while the stack is moved to the correct position for opening of the door 2 When the indicator within the button starts to flash guickly then the door can be opened to gain access to the stack slots 3 Unload the box es containing the finished masters 4 When all of the required masters have been removed from the slots close the stack module door Operator Manual Operating Instructions Page 78 K VID SQL 5 5 Monitoring the System During Production 5 5 1 Status Beacon The beacon located on top of the machine provides a real time indication of the status of the system as follows RED LAMP LIT One or more of the system modules is in an alarm condition and can no longer accept glass substrates for processing ORANGE LAMP LIT The system is able to continue with production but operator intervention
48. he event that a correctable change in asymmetry is detected the system parameters are automatically modified to correct the deviation This method of feed forward process control ensures maintenance of the process window and makes the system more tolerant to operator errors environmental changes etc Substrate Rotation Table Quality Measurement Arm Brush Mechanism Dispense Arm O tor M I System D ipti P perator Manual System Description amp VI age 33 15 1 06 SQL Hot Plate Page 34 3 3 3 Resist Coating Module RCM The Resist Coating Module is the module in which the photo resist layer is applied onto the surface of the glass substrate The photo resist layer is applied by first dispensing photo resist onto the surface and then accelerating the substrate to the correct rotational speed to achieve a layer of the correct thickness and uniformity Substrate Rotation Table Dispense Arm 3 3 4 Resist Curing Module Disc Recognition Module This module consists of a hot plate onto which a substrate is placed at various stages during the mastering process to be heated up The hot plate has the same surface area as the substrate This ensures an even curing of the entire surface and prevents possibly destructive stresses from occurring in the glass due to uneven heating A camera Disc Recognition Module is positioned above the hot plate for inspection of the glass substrates and reading of the unique serial number t
49. ing process will not adhere to the surface of the glass substrate and so it is first necessary to apply a thin layer of adhesive to the substrate surface The adhesive is applied by means of a spin coating process during which a small amount of adhesive is dispensed onto the rotating substrate The substrate speed is then accelerated to spin off the majority of the adhesive and leave only a very thin layer on the surface RESULT Adhesive layer 3nm Glass Substrate 3 5 4 Adhesive Baking Cooldown Following adhesive coating the glass substrate is transported to the Resist Curing module where the adhesive layer is baked to give a flat surface Following baking the glass substrate remains on the conveyor for a pre defined period to allow the substrate to cool down Operator Manual System Description P ene P A IVI2 ZA SQ 3 5 5 Photo Resist Coating The application of the photo resist layer onto the surface of the glass substrate is carried out in the Substrate Coating module A small amount of photo resist is dispensed onto the stationary substrate The substrate is then rotated so that the photo resist forms a layer over the complete substrate surface The rotation speed is then accelerated to the speed required to obtain the correct layer thickness different speed are used for CD and DVD masters Finally the substrate is spun dry RESULT Photo resist Layer CD 160nm DVD 130 nm Glass Substrate 3 5
50. ist Microposit R EC Solvent Flammable Developer OCG 809 Irritant Page 90 i Operator Manual Chemical Preparation ZM2 i 6 3 SQL Adhesive Preparation Special Precautions To avoid exposure of the concentrated silane supply to moisture only allow the bottle to be open for as long as is absolutely necessary The silane bottle should be immediately returned to the refrigerator following preparation of the solution Required Chemicals 10 ml Concentrated Silane 990 ml Demi water Required Equipment Magnetic Stirrer with Magnet Erlenmeyer Flask 1000 ml Droplet Counter or Pipette Squeegee Container with Demi water Storage after Preparation Maximum 2 days at room temperature Preparation Procedure Operator Manual Chemical Preparation 15 1 06 To prepare 1 liter of the process solution used in the SQM proceed as follows Remove the remaining solution from the SQM adhesive tank and rinse the tank with Dl water Thoroughly clean the Erlenmeyer flask the funnel and the stirring magnet with Dl water K M2 Page 91 Page 92 3 Add 990 ml of DI water into the Erlenmeyer flask The last bit should be carefully added using a squeegee container Add the stirring magnet 4 Place the Erlenmeyer flask onto the magnetic stirrer Switch on and adjust the speed to create a vortex of about 1 3 of the water level No air bubbles should be present 5 Open the silane bottle
51. l System Description P 7 SQMI 3 5 Glass Substrates The input for the glass mastering process is a glass disc substrate The substrates used in the SQM system have a unique serial number that is used for substrate identification and recognition purposes The substrates are loaded and unloaded using special protective boxes provided with the system The general form of the glass substrates is shown in the figure below 180 mm 1 2 mm Thick Tapered Metal Hub Centring and Clamping Glass Serial Number Box for Loading Unloading Figure 3 4 SQM Glass Substrate Details Page 38 Operator Manual System Description 15 1 06 SON 3 5 1 Substrate Inspection A loaded substrate is first transported to the Resist Coating module where a camera is used to inspect the glass for defects and to read the unique serial number engraved on the substrate If a defect is detected then the glass will be rejected and automatically returned into the box at the Stack Loader module 3 5 2 Cleaning A substrate that passed the inspection is first cleaned in the Cleaner and Developer module Cleaning is carried out by flushing with DI water and the action of a small brush that sweeps to and from the centre of the substrate The cleaning process will only remove dust from the substrate surface and will not remove dirt or finger prints 3 5 3 Adhesive Coating The photo resist used as the recording surface during photo resist master
52. late affiked at the left side of the SOM system provides important information about the machine The details provided on the type plate should be quoted in all correspondence or other communication with M2 Engineering The following information is provided on the type plate STOCKHOLM SWEDEN TYPE SQM SERIAL NO SQM003 05 POWER 230 VAC 16A Hz 50 60Hz C KW 50 60Hz YEAR OF MANUFACTURE 2005 Page 20 x VID Machine type Unique serial number of the machine The CE mark that indicates that the machine conforms to the requirements of the European Machinery Directive with regards to health safety and environmental aspects Specification of the electrical supply to be connected to the system Year in which the machine was built Operator Manual Technical Data 15 1 06 Operator Manual Technical Data 15 1 06 SQL 2 3 Conformance to Standards The SQM system conforms to the following european directives and harmonised standards Directives s Machinery Directive 98 37 EC NG EMC Directive 89 336 EEC Applicable Harmonized Standards so NEN EN 294 Safety of machinery safety distances to prevent danger zones being reached by the upper limbs o NEN 1010 Electrical installations o NEN EN 12626 1997 Safety of machinery Laser processing machines Safety requirements ISO 11553 1996 modified KG NEN EN IEC 60825 4 1998 Safety of Laser Products
53. m In the case of inhalation move the victim into the fresh air and seek immediate medical advice NG The process chemicals used in the machine are contained in constant pressure vessels Always release the pressure using the valve provided before attempting to open any of the vessels 1 13 Safety Apparatus Safety apparatus should be provided at the site of the machine in accordance with local regulations It is recommended that at least the following apparatus is provided in the vicinity of the machine NG Fire detection system providing automatic equipment shutdown and acoustic alarms io Smoke detectors KI CO fire extinguishers WARNING Never use water for fire extinguishing NG Eye flushing equipment NG Water spray for dowsing NG First aid kit NG Protective clothing Page 14 Operator Manual Safety Information M2 i Operator Manual Safety Information 15 1 06 SON 1 14 Precautions to be Taken During Service The following safety precautions should be taken when carrying out service on the system NG Always remove the main power supply to the system when carrying out any maintenance on the electrical system Lock the main power switch and place a label next to the main power switch indicating that service is being carried out NG Disconnect the Uninteruptible Power Supply from the system when carrying out maintenance or service ZA WD Page 15 SQL Operator Manual Safety Information Page 16
54. media input system Write Power The laser intensity that was used during recording of the master in the Laser Beam Recorder entered at the media input system Measured Assy The asymmetry that was measured by the quality measurement arm following developing of the substrate Recorded Time The time that the master was recorded in the Laser Beam Recorder Current Status The status of the Job completed processing aborted etc Operator Manual Human Machine Interface K MO Page 69 15 1 06 SQL Operator Manual Human Machine Interface 15 1 06 Page 70 x v2 SON 5 OPERATING INSTRUCTIONS LIST OF TOPICS On General AA 73 5 2 Pre starttChecks 74 5 2 SUPPIES HAUWI Aa 14 5 2 2 General Checks before Starting Production 15 5 3 Start up Procedures 75 5 3 1 Power upProcedure 15 5 4 Loading Unloading Substrates 77 5 4 1 Substrate Loading 77 5 4 2 Removing Finished Masters 78 5 5 Monitoring the System During Production 19 5 5 1 StatusBeacon 79 5 5 2 Monitoring atthe HMI 19 5 6 Responding to Alarm Messages 19 5 7 Chemical Replenishment Waste Vessel Emptying 81 5 7 1 Refilling the Chemical Tanks 82 5 7 2 Emptying the Waste Vessel 84 5
55. ms Required Equipment Calibrated Measuring Cylinder 1000 ml Squeegee Container with Microposit EC Solvent Storage after Preparation Maximum 2 weeks at room temperature Preparation Procedure To prepare 1 liter of the process solution used in the SQM proceed as follows 1 Remove the remaining solution from the SOM photo resist tank and rinse the tank with Microposit EC Solvent 2 Clean the measuring cylinder to be used with Microposit EC solvent Operator Manual Chemical Preparation Page 94 Z NID SQ 3 Add 820 ml of EC solvent into the measuring cylinder The last bit should be added using a squeegee container to obtain the required accuracy the bottom of the meniscus should be used as the reference 4 Shake the photo resist bottle and add 180 ml into the measuring cylinder to give a total volume of liquid of 1000 ml in the cylinder the bottom of the meniscus must not deviate more than 2 ml 5 Seal the cylinder using the cap hold the cap firmly and turn the cylinder upside down and back again slowly about 10 times to thoroughly mix the solution Operator Manual Chemical Preparation IN Page 95 15 1 06 SQMI 6 Transfer the prepared solution into the SQM photo resist tank T Repeat the procedure to make any additional solution required 8 When all required solution has been prepared clean the measuring cylinder and the cap thoroughly with Microposit EC solvent A small amount of solvent
56. nductor Diode Class IIIB Device NG Maximum Output Power 5 5 mW NG Wavelength 405 nm The following precautions must be observed at all times NG There are no replacement parts within the Laser Beam Recorder All service should only be carried out by M2 Engineering authorised personnel NG The cover of the self contained writing module should never be removed NG Never look directly into the laser light or at the scattering laser light from any reflective surface Never sight down the beam into the source NG The laser warning signs and labels should be maintained at all times WARNING Damage to the eyes caused by laser light is permanent and will not heal Page 12 1 10 Glass Breakage Hazard The glass substrates used during the mastering process are rotated at extremely high speeds in the Laser Beam Recorder module 6000 RPM The window of the Laser Beam Recorder must always be closed when a substrate is rotated as this protects against the hazards presented by a glass breakage Operator Manual Safety Information amp i2 i i SQ 1 11 Chemical Safety A number of the chemical solutions used during the mastering process and the basic chemicals from which they are mixed are flammable and can cause skin eye and mucous membrane irritation Always observe the following precautions NG Always prepare all chemicals at the chemical preparation bench with the fume extraction fan switched on Never prepare the chemical
57. ng The system must only be installed or re located by M2 Engineering personnel or an authorised agent of M2 Engineering Details for the lifting and positioning of the system are contained in the assoaciated SQM Installation Manual 1 4 8 Removal of Safety Features It is prohibited to remove or override the safety features of the system interlocks safety switches etc unless this is absolutely necessary for service purposes All safety devices must be re instated before the system is returned to normal production 1 4 9 Testing after Maintenance and Service Following maintenance or service work the whole safety system of the SQM system must be tested e g interlocks to ensure it operates faultlessly Especially after electrical installation or service work the protective measures have to be tested e g protection earth insulation resistivity etc The system may not be operated again until successful tests have been performed 1 4 10 Supplies It must be possible to easily isolate all supply lines of compressed air argon gas as well as the main electrical supply to the system Supplies must be separately routed and protected against any mechanical damage or stress 1 4 11 Location of the Operating Instructions This manual must always be available at the SQM system at a clearly defined place 1 4 12 Local Regulations National and local safety regulations must always be observed with respect to the installation and operation
58. oor Interlock 8 t94 Door LOCKS oi mana AA ode ee se KG wee AG 8 1 5 5 Window Interlocks 8 1 6 HazardousAreas 9 1 7 Gas Bottles 11 aa Manual Safety Information amp VI Contents SQL 1 8 Laser Beam Recorder Air Buffer 11 1 9 Laser Safety Precautions 12 1 10 Glass Breakage Hazard 12 1 11 Chemical Safety 13 1 11 1 Accidents Involving Chemicals 13 1 12 General Safety Precautions 14 1 13 Safety Apparatus 14 1 14 Precautions to be Taken During Service 15 Contents x VID Operator Manual Safety maana SAFETY INFORMATION 1 1 General This chapter provides important safety information regarding the use and maintenance of the SQM mastering system The information provided should be carefully read and fully understood before attempting to work with the system The safety guidelines provided should be observed at all times when operating or maintaining the SQM WARNING Failure to observe the relevant safety precautions may result in serious injury to operating and maintenance personnel Operator Manual Safety Information Page 3 15 1 06 SQL Table 1 1 Definition of User Levels 1 2 Purpose and Limitations of Use
59. peration of a motor driven conveyor Substrates are loaded and unloaded from the conveyor by the operation of individual pick and place handlers located at each of the process modules Pick and Place Handler Conveyor Operator Manual System Description 15 1 06 Page 36 amp VID SQL 3 3 9 Human Machine Interface The Human Machine Interface HMI for the system is provided by a 15 touch screen A keyboard with tracker ball is also provided for the entry of data The touch screen is mounted on a rail that allows the screen to be moved along the length of the system The facility is provided for the connection of a keyboard and mouse for data entry etc The interface software provides all of the functions for operation of the system together with comprehensive features for process control and data management The interface software is implemented on the Windows XP platform 3 4 Mastering Process Description The process steps carried out during the production of a glass disc master in the SQM system are shown in the figure below and a description of the individual steps is provided in the sub paragraphs that follow ADHESIVE COATING EO ae Glass Substrate CLEANING Deae gt PHOTO RESIST PHOTO RESIST CURING lt lt COOLDOWN COATING ADHESIVE 4 BAKING RECORDING gt DEVELOPING Ea O Glass Master Figure 3 3 SQM Mastering Process Flow Diagram Operator Manua
60. puttering chamber V Voltage being used during the process mA Current being used during the process W Power being used during the process J Total energy expended during the process in joules Valves Vent Valve Grey Valve closed Green Valve open Roughing Valve Angle Valve Mass Flow Controller Shows the degree to which the mass flow controller used for regulating the argon supply to the chamber Is open Argon Supply Turbo Pump Shows the status and speed of the turbo molecular pump used to develop the vacuum in the sputtering chamber Pump shown in green Pump switched on Pump shown in grey Pump off The speed as indicated as a percentage of the maximum pump speed that can be obtained Page 64 IN Operator Manual Human Machine Interface 15 1 06 STATUS ITEM OQU DENINITION The cylinder valve used to isolate the turbo pump from the sputtering chamber is in the closed position Pump running but isolated from chamber The cylinder valve used to isolate the turbo pump from the sputtering chamber is in the open position Pump running and evacuating the chamber zi 2310 mbar Vacuum Gauge Shows the current level of vacuum within the sputtering chamber Current process Process step Job name ADHESIVE BAKING BAKING Time to go complete process 78 0 AD VD12345 Current process The process
61. r the button or function is automatically displayed 4 4 10 Module Status Selection The module status selection area allows the menu structure for a particular module to be selected by touching within the module area Module Status Legend Ready for disk Ready for disk Ready for disk Ready for disk Ready for disk Substrate Indicator Operator Manual Human Machine Interface ZA v2 Page 51 15 1 06 SQL Page 52 4 4 10 1 Module Status Legend The status legend above each module provides a constant updated indication of the status of the module as follows Ready for disk The module is inactive but is in the correct state to receive a substrate for processing Loading disk A substrate is being loaded into the module from the conveyor Processing disk A substrate is being processed Processing done Module has finished processing the substrate and the substrate has been positioned over the conveyor by the pick and place robot Unloading disk The module pick and place robot is placing the substrate onto the conveyor Not operational A problem in the module is preventing the module from operating normally Aborted The module was aborted due to a fatal error The substrate will automatically transported into an empty box at the Stack module Not connected Indicates that there is no TCP IP connection between the module and the s system controller Probably due to a disconnected cable or power supply problem
62. red disc details process routing Page 54 IS Operator Manual Human Machine Interface 15 1 06 Manu SON 4 5 Module Status Screens A module status screen can be accessed by touching the appropriate module in the Main Menu The lt Close gt button can be used to return to the Main Menu A description of the status screens for each of the individual modules is provided in the sub paragraphs that follow 4 5 1 Stack Module Status Screen An example of the status screen for the Stack module STM is shown below and a definition of the information given is provided in the table that follows al a I O List Cal Values g ADVD456 AC1245 BLCD45RTY V4 Allow unloading Disc on module 9 Disc on conveyor Door Comms OK e Q Motor alarm 9 Q Home position C LO S E Figure 4 3 Stack Module Status Screen Operator Manual Human Machine 15 1 06 nterface F Z M2 wa SON Table 4 1 Stack Module Status Information STATUS ITEM DENINITION Provides an indication of the status of each slot within the stack module The indicators on the left show the status of each box present in the QC as stack as follows D E O Box contains a blank substrate ready for processing CT j b The box is currently being loaded unloaded or is inside the machine aaa Ld BLCD45RTY E The box is empty d The box contains a completed master The Job name is shown to the right of the box
63. s SQL Contents Operator Manual System Description 15 1 06 SYSTEM DESCRIPTION 3 1 General The SQM from M2 Engineering is an automatic system for the production of photo resist masters for the following formats of pre recorded optical media io CD Audio ROM VCD etc KG DVD 5 KG DVD 9 Layer O and Layer 1 masters KG DVD 10 KG DVD 14 18 Operator Manual Machine Description Page 29 15 1 06 SAN 3 2 Scope of Supply The SQM scope of supply comprises the SQM system itself and the associated ancillary equipment as detailed in the sub paragraphs that follow 3 21 Media Input System This is the system that is used for the loading and processing of the data to be mastered The complete media input system consists of an external server to which a CD ROM DVD ROM and DLT drive are connected for the loading of the jobs to be mastered The encoder that provides the signal to switch the laser in the Laser Beam Recorder LBR on and off is built into the SQM system below the LBR The way in which the media input system is connected to the SQM system is shown in the diagram below On board Encoder includes built in pulse manipulation Figure 3 1 Media Input System SQM Configuration Page 30 gt ENCODER Remote Scheduler PC with Networking Hard Disk server CD ROM Reader DVD ROM Reader DLT Tape Drive Operator Manual System Description 15 1 06 SQM 3 2 2 Clean Air
64. s in the room in which the system is installed NG Always wear protective clothing gloves and safety glasses when handling chemicals NG Avoid breathing in fumes vapours and sprays NG Avoid contact with the skin or eyes KG Always wash hands thoroughly after working with the chemicals 1 11 1 Accidents Involving Chemicals In the event of an accident involving any chemical solution or cleaning agent reference should be made to the chemical manufacturers Material Safety Data Sheet MSDS In the event of an accident involving the prepared solutions the following Material Safety Data Sheets are applicable Table 1 3 Process Solutions Safety Details PROCESS SOLUTION SAFETY CATEGORY APPLICABLE MSDS Adhesive N 2 Aminoethyl 3 Aminopropyl Trimthoxy Silane A0700CD Irritant Photo Resist Microposit R EC Solvent Flammable Developer OCG 809 Irritant ee Manual Safety Information K VI Page 13 SQL 1 12 General Safety Precautions KG Do not smoke or use any naked flames in the vicinity of the machine NG The hot plate is constantly switched on at a temperature of approximately 90 C 194 F Do not touch the hot plate or attempt to handle a glass disc that has recently been heated NG Always ensure that the vapour extraction system is switched on as this prevents the build up of potentially dangerous solvent vapours KG Avoid any physical contact with the argon gas used in the syste
65. sonal injury exists if the specified precautions are not observed For example WARNING Always wear protective clothing gloves and safety glasses when handling chemicals NG Caution A caution within an instruction is used to indicate that the risk of damaging the machine exists if the specified precautions are not observed For example CAUTION Do not over tighten the connectors as this may result in damage to the threads Page ii II M2 Operator Manual About This Manual 12 12 05 SQL Associated Documentation The following additional documentation is also provided for use with the SQM system nG SQM Customer Drawings Provided for use by suitably qualified technicians Contains information for the correct ordering of spare parts NG Electrical Schematic Diagrams Provided for use by suitably qualified technicians NG User Manual for Media Input System Instructions for the use of the system used for the loading and processing of the programs to be mastered in the SQM system o User Manual for Clean Air Unit Instructions for the use and maintenance of the Clean Air Unit used for maintaining the correct environmental conditions within the SQM system NG User Manual for Glass Disc Recycling Machine Instructions for the use and maintenance of the Glass Disc Recycling machine used for cleaning the glass substrates used in the SQM system if included in the scope of supply
66. the preparation of the chemical solutions used in the SQM system The instructions for the removal and refitting of the SQM chemical tanks are provided in Chapter 5 Operating Instructions 6 2 Safety Precautions A number of the chemical solutions used during the mastering process and the basic chemicals from which they are mixed are flammable and can cause skin eye and mucous membrane irritation Always observe the following precautions NG Always prepare all chemicals at the chemical preparation bench with the fume extraction fan switched on Never prepare the chemicals in the room in which the system is installed NG Always wear protective clothing gloves and safety glasses when handling chemicals NG Avoid breathing in fumes vapours and sprays NG Avoid contact with the skin or eyes KO Always wash hands thoroughly after working with the chemicals Operator Manual Chemical Preparation Page 89 15 1 06 SAN 6 2 1 Accidents Involving Chemicals In the event of an accident involving any chemical solution or cleaning agent reference should be made to the chemical manufacturers Material Safety Data Sheet MSDS In the event of an accident involving the prepared solutions the following Material Safety Data Sheets are applicable Table 6 1 Process Solutions Safety Details PROCESS SOLUTION SAFETY CATEGORY APPLICABLE MSDS Adhesive N 2 Aminoethyl 3 Aminopropyl Trimthoxy Silane A0700CD Irritant Photo Res
67. urement arm is used to scan the surface and to measure the volume of the pits The measured results are displayed at the Human Machine Interface and if necessary the process is automatically adjusted to compensate for any deviations from the pre defined values RESULT f Pits formed in Photo resist Layer Photo resist Layer Glass Substrate ooo Manual System Description ZA MO Page 41 SQL 3 5 9 Sputtering The glass master produced in the SQM system is further processed in an electroforming process to produce the nickel stamper that is subsequently used for the mass production replication of CDs or DVDs The electrofroming process requires that the surface of the master is conductive and so it is necessary to apply a thin metal onto the pattern of pits and lands within the photo resist layer The metal layer is applied onto the photo resist in the Sputtering module During the sputtering process Nickel Vanadium is derived from a source within the module target and is deposited onto the photo resist surface to precisely map the pattern of pits and lands RESULT Nickel vanadium layer 50 nm Photo resist Layer Glass Substrate Following sputtering the master is complete and is unloaded from the system for transfer to the electroforming department where the stamper is produced Operator Manual System Description 15 1 06 Page 42 x M2 SQL 4 HUMAN MACHINE INTERFACE LIST OF TOPICS 4 1 General
68. vice of the SQM system should only by carried out by an engineer of M2 Engineering or an authorised represenative The following safety precautions should be taken when carrying out service on the system NG Always remove the main power supply to the system when carrying out any maintenance on the electrical system Lock the main power switch and place a label next to the main power switch indicating that service is being carried out NG Disconnect the Uninteruptible Power Supply from the system when carrying out maintenance or service If carrying out service on the metalliser or laser beam recorder modules then it is advised to remove the door from its hinges to gain better access INC Operator Manual Routine Maintenance SAN Operator Manual Routine Maintenance WA vo Page 109 15 1 06 SQL Operator Manual Routine Maintenance Page 110 x VI
69. x M2 2 SQL TECHNICAL DATA LIST OF TOPICS 21 GONGCIAl IAA eres ENEA EE 19 2 2 System Identification 20 2 3 Conformance to Standards 21 2 4 Dimensions and Weight 22 2 5 Type Variants 23 2 6 System Performance Data 23 2 6 1 CD Only Version 23 2 6 2 Entry Level CD DVD Version 23 2 6 3 Standard CD DVD Version 23 2 6 4 High Volume CD DVD Version 23 2 7 EnvironmentalData 24 2 1 Machinery Noise 24 2 7 2 Machine Vibration 24 2 3 Gas Vapour and Dust Emissions 24 2 8 Waste Products 25 ZO WalQCls EIA IAEA 25 2 8 2 Waste Adhesive Developer 25 2 8 3 Waste Photo resist 25 2 8 4 Cleaning Materials 25 Operator Manual Technical Data 15 1 06 Sif WD Contents SQL Contents Operator Manual Technical Data 15 1 06 IL NP TECHNICAL DATA 2 1 General This chapter provides Information regarding the identification performance and the environmental aspects of the SQM mastering system Operator Manual Technical Data Page 19 15 1 06 SOL 2 2 System Identification The type p
70. y untrained personnel or used for purposes other than that for which it was intended 1 4 2 Adherence to Regulations Correct use of the system includes conforming to the regulations for correct installation initial commissioning application operation maintenance and service M2 Engineering will not accept any responsibility for any damages arising from the incorrect use of the system 1 4 3 Training of Personnel Only well trained personnel should be allowed to install operate run maintain or service the SQM system These personnel must be instructed with respect to the hazards that can be caused by the system 1 4 4 Cleanliness and Good Housekeeping It is important that the system and the surrounding area are kept clean and clear of any obstructions which could create a hazard for personnel working in the area of the system 1 4 5 Access for Authorized Personnel Only Access to the system must be limited to trained personnel WARNING Persons with cardiac pacemakers must be informed of the hazard presented by the system due to the strong electromagnetic fields produced by the Sputtering module in the system 1 4 6 Unauthorised Modifications Any modifications or changes to the system that could affect the safety or reliability of the system are prohibited oo Manual Safety Information XK MO Page 5 SQL Page 6 1 4 7 Transportation and Installation The SQM system must only be transported in its original packi

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