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User Guide - Diltronic

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1. ccccccssseeeeeecesseeeeesaeeeeeeeeeas 20 Table 4 1 3D MagIC Pin Assignments ccccceeccceceeeceecaeeceeeeeeeeeecaueceesseeeeessuaeeeeseeeeesaaes 25 Table 4 2 SPI Timing Specifications cc cccccccseccccceseceeceeeeceseeeeeeeceeeceeseeeeeesseeeeeseeeeesaees 29 Table 5 1 Cycle Count Register COMMANAS ccccccssseceeecesseceecceeeseceeeeaeeeeeesesaeeeeeeeeeas 31 Table 5 2 SAM Axis Select Bits 0 0 0 0 ccccccccssccccceeeeeeeeeeeeeceeeeeeeseaeceeseeeceesseeeeessageeesseeeesseees 33 Table 5 3 MAM Axes Select Bits rrrrrrrrrnnrrorrnnrrorrnnnnrrnnnnnronnnnnrenrnnnnrnnnnnnrnnnnnnsennnnssennnnnsennnnn 35 Table 6 1 Legacy Period Select Bits rrrrrrnnrnnrrrrrnnnnrrrnnnnrrnnnnnnenrnnnnrnnnnnnrennnnnnennnnsnennnnnsennnnn 39 Table 6 2 Legacy Axis Select Bits rrrrrnnrrerrnnrnrrrnnnnrrrnnnnrrnnnnnnenvnnnnrnnnnnnrnnnnnnrennnnssennnnnssnnnnn 39 Table 6 3 Clock Divide Bits rrrrrrrrnnnnnrrrnnnnrornnnnnrnnnnnnrvnnnnnrnnnnnnnennnnnnnnnnnnnennnnnnennnnsennnnnnsennnn 41 Table 6 4 Enhanced Legacy Mode with CD 1 rrrrnnnnnnnnnornnnnnnonnnnnnrnnnnnnvnnnnnnnennnnnnennnnnnennnnn 42 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 3 of 42 1 Copyright amp Warranty Information Copyright PNI Sensor Corporation 2010 All Rights Reserved Reproduction adaptation or translation without prior written permission is prohibited except as allowed under copyright laws Revised Apr
2. cccccccsccceceseeeeeeeeeeeeeeeeseeeeeeeseaaaess 20 Figure 4 1 RM3000 reference schematic Standard Mode rernnrrnnnnnnnnnnnnnrrnnnnnnnnnnnnnnnnnnnn 21 Figure 4 2 LR Oscillator Circuit Biasing DiaQram ccccccccssseseeeeceeeeeeeeeeseeeeeeeessaeeeeesesaaees 22 Figure 4 3 RM3000 North East Down NED Sensor Layout rrrrernnnnnrrvvrnrnnnrrrvnnrnnvrreennnnnn 23 Figure 4 4 SPI Timing Diagram cccccssssccecccssseececceeesseeecceeasseeeesseaseeessseaeeeesseuageeeesssaaaes 28 Figure 5 1 SPI Activity Sequence Diagram for SAM Operation rrnnnnrrrnvvvnnrnnnnnnrrnvernnnnnnnn 32 Figure 5 2 SPI Activity Sequence Diagram for MAM Operation rrnnnnnnnnnnnnnrrrnnnnnnnnnrnnnnnnnn 34 Figure 6 1 SPI Activity Sequence Diagram for Legacy Operation rrrrnrvnnnnnnnnnnrrrvvrnnnnnnnnn 38 List of Tables Table 3 1 RM Sensor Suite Performance r rrnnnnrnnnnnnnnnnnnnnrnnnnnnnnnnnnnsnnnnnnnrnnnnnnsennnnnsennnnsnsennnn 6 Table 3 2 Sen XY and Sen Z Absolute Maximum Ratings rernnnnnoonnnnnnornnnnnrnnnnnnnennnnnnennnnn 7 Table 3 3 Sen XY and Sen Z Characteristics cccccccecccccseeceeceeceeseeseceeceeeceesseeeeesseeeeeeeaees 7 Table 3 4 3D MagIC Absolute Maximum Ratings ccccccccccccesecceceeseceeceeeceeseeeseesseeeeseaees 8 Table 3 5 3D MagIC Recommended Operating Conditions ccccccccccecseeeeeseeeeeeeeeeeeseeees 8 Table 3 6 Recommended Solder Processing Parameters
3. Master Input Slave Output RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 25 of 42 MODE The MODE pin establishes whether communication with the 3D MagIC will comply with Standard Mode protocol see Section 5 or Legacy Mode protocol see Section 6 The MODE pin should be grounded connected to DVSS to operate in Standard Mode and set HIGH connected to DVDD to operate in Legacy Mode SCLK SPI Serial Clock Input SCLK is a SPI input used to synchronize the data sent in and out through the MISO and MOSI pins SCLK is generated by the customer supplied master device and should be 1 MHz or less One byte of data is exchanged over eight clock cycles Data is captured by the master device on the rising edge of SCLK Data is shifted out and presented to the 3D MagIC on the MOSI pin on the falling edge of SCLK except for the first bit MSB which must be present before the first rising edge of SCLK SSN SPI Slave Select This signal sets the 3D MagIC as the operating slave device on the SPI bus The SSN pin must be LOW prior to data transfer in either direction and must stay LOW during the entire transfer The SSN pin must transition from HIGH to LOW prior to initiating a multi axis measurement MAM command and prior to reading or writing to the Cycle Count Register or Clock Divide Register It must stay LOW for the remainder of the operation After communication between the 3D MagIC and master device is finished
4. User Manual RM3000 amp RM2000 Reference Magnetic Sensor Suite NI SENSOR CORPORATION Table of Contents COPYRIGHT amp WARRANTY INFORMATION mnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnnennnnnnnnnnnnnnennnnnnnn 4 INTRODUCTION se 5 UG FING sinosus eaaa aaO EEEE EEA AEE ESEE aiia 6 3 1 RM SENSOR SUITE CHARACTERISTICS rrrnnnnrnnnrrnnnnnnnnvvnnnrrnnnnnnnnrvnnnvnnnnnn 6 3 2 SEN XY AND SEN Z CHARACTERISTICS ccccccssseeeeeeeeeeeeeeeseeeeeeeeeeeaes 7 3 3 3D MAGIC CHARACTERISTICS rrrrnnnnrrnnrrrnrrrnnnnnnnnrnnnnrrnnnnnnnnsnnnnnnnnnnnnnnsnnnnn 8 3 4 TYPICAL SENSOR SUITE OPERATING PERFORMANCE eeee 9 3 5 DIMENSIONS AND PACKAGING errnnnvnnvrrnnnnnnnnvvnnvrrnnnnnnnsvrnnnrrnnnnnnnssennnnnnnnnn 13 3 5 1 Sen XY Dimensions amp Packaging rrrerrnnnvrvvvnrnnnervvenrnnnerrennnnnnereeenn 13 3 5 2 Sen Z Dimensions amp PaCkaQing ccccccceeeeeeeeeeeeeeeeeeeeeeeeeeeeeeaaaees 14 3 5 1 Sen Z Shield Dimensions amp PaCkaQing ccccccecssseeeeeeeeeeeeeeeeeees 16 3 5 2 3D MagIC Dimensions and PackagIng ccccccseseeeesseeeeeseeeeeeneees 17 3 6 SOLDERING nnn a eee ee ee ee eee ee eee 19 RM SENSOR SUITE OVERVIEW amp SET UP ennnnnnnnnnevnnnnnnnnnnnnnennnnnnnnnnnnnnnnnnnnnnnnnnnr 21 4 1 MERE 21 4 2 GE EE EEE EEE 23 4 2 1 Sensor Orientation rrrwrunnrannrnnnrnnevnnernnevnnevnnevnnevnnevnnevnnernnevnnennnennne 23 4 2 2 Local Magnetic Field Considerations cccccseeeeeee
5. the Product or to credit Customer s account PNI warrants any such repaired or replacement Product to be free from defects in material and workmanship on the same terms as the Product originally purchased Except for the breach of warranty remedies set forth herein or for personal injury PNI shall have no liability for any indirect or speculative damages including but not limited to consequential incidental punitive and special damages relating to the use of or inability to use this Product whether arising out of contract negligence tort or under any warranty theory or for infringement of any other party s intellectual property rights irrespective of whether PNI had advance notice of the possibility of any such damages including but not limited to loss of use revenue or profit In no event shall PNI s total liability for all claims regarding a Product exceed the price paid for the Product PNI neither assumes nor authorizes any person to assume for it any other liabilities Some states and provinces do not allow limitations on how long an implied warranty lasts or the exclusion or limitation of incidental or consequential damages so the above limitations or exclusions may not apply to you This warranty gives you specific legal rights and you may have other rights that vary by state or province PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 4 of 42 2 Introduction
6. the SPI bus can be freed up SSN pin set HIGH to communicate with other slave devices while the 3D MagIC takes a measurement or is idle MISO SPI Serial Out MISO is a SPI output that sends data from the 3D MagIC to the master device Data is transferred most significant bit first and is captured by the master device on the rising edge of SCLK The MISO pin is placed in a high impedance state if the 3D MagIC is not selected 1 e if SSN 1 MOSI SPI Serial In MOSI is a SPI input that provides data from the master device to the 3D MagIC Data is transferred most significant bit first Data must be presented at least 50 ns before the rising edge of SCLK and remain valid for 50 ns after the edge New data typically is presented to the MOSI pin on the falling edge of SCLK PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 26 of 42 DRDY Data Ready DRDY is used to ensure data is read from the 3D MagIC only when it is available After initiating a sensor measurement DRDY will go HIGH when the measurement is complete This signals the host that data is ready to be read The DRDY pin should be set LOW prior to initiating a measurement This is done automatically in Standard Mode and by toggling the CLEAR pin in Legacy Mode Note If a new command sequence is started before the previous measurement has completed before DRDY goes HIGH the previous command will be overwritten This w
7. Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 36 of 42 6 3D MagIC Operation Legacy Mode Note This section discusses how to operate the 3D MagIC in Legacy Mode For a description of operation in Standard Mode see Section 5 The 3D MagIC will operate in Legacy Mode when pin 12 Is held HIGH connected to DVDD The intent of Legacy Mode is to enable the user to easily substitute PNI s 3D MagIC for PNI s legacy 11096 ASIC p n 12576 If the user wishes to simply duplicate the performance of the 11096 ASIC Legacy Operation then a measurement is made by sending the Legacy Command Byte This command byte is the same as for the 11096 ASIC The Legacy Command Byte initiates a sensor measurement on a single sensor and sets up the 3D MagIC to output the measured values on the MISO line Legacy Operation is covered in Section 6 1 If the user wishes to derive the lower power consumption advantages of the 3D MagIC and is willing to make some code changes but cannot make hardware changes then Enhanced Legacy Operation allows for this If the user can make both code and hardware changes then operation in Standard Mode is recommended For Enhanced Legacy Operation the user first will write to the Clock Divide Register and after this follow the same process as for Legacy Operation Please review both Sections 6 1 and 6 2 as Section 6 1 still applies and Section 6 2 covers the additional steps required for E
8. Legacy Operation SPI Activity SeQuence rrnnnrnnnnnnnnennnnnnnnnnnnnnene 38 6 1 2 Legacy Command Byte rrronnnrnrnnnnronnnnnnrnrnnnnennnnnnvennnnnnennnnnnnnnnnnnnen 38 6 1 3 Making a Legacy Measurement rrrrnennnnnnrrvvnnrnnvrrrrnrnnnerrernnnnnerreenn 39 6 2 ENHANCED LEGACY OPERATION cccccceccsseseeeeeeeeeeeeeeeeeeeeeeseeeeaaeeeees 40 6 2 1 Clock Divide Command Byte ccccccsececceecseeeeeeeeeaeeeeeeeeseeeseeeeeeas 41 6 2 2 Clock Divide Register rrrrrnnrnrnnnnnnrrnnnnnrvnvnnnnrnvnnnnrnnnnnnsenvnnnnrnnnnnnsene 41 6 2 3 Command Sequence for Setting Clock Divide Value 42 6 2 4 Changes to the Period Select Value rrrrnnnnnnnnnnnrvrnnnnnvnrnnnrrnnnnnnnen 42 List of Figures Figure 3 1 Sample Rate vs Resolution Standard MOde cccccceceeseeeeeeeeeeeeeeaeeseeeeeeees 9 Figure 3 2 Gain vs Cycle Counts Standard amp Legacy Modes rrrrrrrrvvrnrrnnnnnrrrrrrrrnnnnnnnn 10 Figure 3 3 Single Axis Sample Rate vs Cycle Counts Standard amp Legacy Modes 10 Figure 3 4 Gain vs Cycle Counts Standard MOde ccccccccsseeeeeeeeeeeeeeeeeseeeeeeseeesaeeeees 11 Figure 3 5 Single Axis Sample Rate vs Cycle Counts Standard Mode cc ccseeees 11 Figure 3 6 Current Consumption vs Cycle Counts Standard Mode c ccseseeeeeeeeeees 12 Figure 3 7 Sen XY Sensor Dimensions ccccceeecceeeeeeeeeeeeeeeesee
9. is clocked into the 3D MagIC on the MOSI pin Simultaneously the 3D MagIC will present a fixed 9Ay on the MISO pin Once the 8 bits have clocked in the 3D MagIC will execute the command i e take a measurement e The SSN input may be returned HIGH at this point to free up host communication with another device if desired This will not affect the measurement process e A measurement is taken e At the end of the measurement the DRDY pin is set HIGH indicating data is ready and the 3D MagIC is placed in Idle Mode e The SSN input should be set LOW if it is not already to read the data e The data is clocked out on the MISO pin with the next 24 clock cycles If another measurement is immediately made SSN can remain LOW and the process repeated Otherwise it is recommended that SSN is set HIGH to release the SPI bus RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 33 of 42 5 3 Multi Axis Measurement MAM Operation An initial MAM Command Byte initiates a sensor measurement for up to 3 sensors After the measurements are made and the DRDY line goes HIGH another MAM Command Byte sets up the 3D MagIC to output the measured values on the MISO line 5 3 1 MAM SPI Activity Sequence The SPI timing sequence is given below for MAM operation SPI timing is discussed in Section 4 4 The Return Byte is 9Ay The number of data bytes will be determined by the number of axes that are to be measured Each axis is comprised of 3
10. lt MX 1854 0 Y 1057 8 TRST i p XDRVN AVSS 5 TIM x 1854 0 Y 860 05 X 0 0 Y 760 1 7 n gy _XINN Moan ZDRVP X 1854 0 Y 653 55 X 0 0 Y 514 425 fe og XINP X 1854 0 Y 408 6 ZINP p XDRVP VERE SEVEN MX 1854 0 Y 202 1 X 0 0 Y 159 05 8 9 10 11 12 13 14 o o je a VE ES o o o o MS Fe ae 1 I I o II gt gt gt gt en Pole lo R I IK gt O IN JN LO Oo Sud ie we eae wsl v Wil t Slo IR ZF g ealo Ol zl g Zin S o n zyn Oyu alu gap N x Nx gt x gt x x gt x gt x NOTES The origin 0 0 is the lower left coordinate of the center pads The chip size 2080 0 um x 2080 0 um is calculated using pad to scribe distance Bond pad coordinates are to the center of the bond pad Bond pad openings are 68 um x 68 um except for AVDD AVSS ZDRVP ZDRVN YDRVP YDRVN XDRVP and XDRVN which are 68 um x 136 um Figure 3 18 3D MagIC Die Pad Layout Doc 1015673 r06 Page 18 of 42 SSN MOSI MISO SCLK DVDD REXT DRDY CLEAR AVDD DVSS 3D MagIC Die XDRVN XINN AVSS ZDRVP XINP ZINP ZINN ZDRVN YDRVP YINP MODE YINN YDRVN XDRVP Figure 3 19 Example Wire Bonding Layout for Legacy 11096 ASIC Applications Note
11. noise are established cleanly by the number of cycle counts In comparison fluxgate and MR technologies require expensive and complex signal processing to obtain similar resolution and noise and in many respects the Reference Magnetic Sensor Suite s performance simply cannot be matched Also the output from the 3D MagIC is inherently digital and can be fed directly into a microprocessor eliminating the need for signal conditioning or an analog digital interface between the sensor and a microprocessor The simplicity of the Reference Magnetic Sensor Suite combined with the lack of signal conditioning makes it easier and less expensive to implement than alternative fluxgate or magneto resistive MR technologies For more information on PNI s magneto inductive sensor technology see PNI s whitepaper Magneto Inductive Technology Overview at http www pnicorp com technology papers Note PNI s Sen Z Shield is available as an option to provide mechanical protection to the Sen Z sensor since the solder joint that attaches the Sen Z to the user s PCB may break if the Sen Z is impacted The Sen Z shield generally should not be required in a well controlled high volume production environment but may be advisable for product development and testing or in less controlled production environments RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 5 of 42 3 Specifications 3 1 RM Sensor Suite Characteristics Table 3 1 RM
12. value for the Cycle Count Registers is 512D but this was chosen for legacy reasons and is an inefficient value otherwise The Cycle Count Registers establish the number of sensor oscillation cycles that will be counted for each sensor in both the forward and reverse bias directions during a measurement sequence Increasing the cycle count value increases measurement resolution but system noise limits the useable resolution such that the maximum efficient cycle count value generally is around 200 300 cycle counts Lowering the cycle count value reduces acquisition time which increases maximum achievable sample rate or with a fixed sample rate decreases power PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 30 of 42 consumption See Figure 3 4 Figure 3 5 and Figure 3 6 to estimate the appropriate cycle count value for your application Once the Cycle Count Registers are set they do not need to be repopulated unless the user wants to change the values or the system is powered down in which case the default values would populate the register fields when powered up again To initiate a read to or write from the Cycle Count Register the command byte 1s defined as e 7 e s a e2 1 o vave 1 Aw o 0 apna abre ADR ADRO R W Read Write HIGH signifies a Read operation from the addressed register LOW signifies a Write operation to the addressed register ADRO ADR3 R
13. 1 Meets IPC JEDEC J STD 020 profile recommendations Sen XY and Sen Z classified as moisture sensitivity level 1 3D MaglC MLF classified as moisture sensitivity level 3 PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 20 of 42 4 RM Sensor Suite Overview amp Set Up 4 1 Overview Figure 4 1 provides a basic schematic for implementing the RM3000 Sensor Suite in Standard Mode The 3D MagIC is at the center of the schematic as it ties the user s host controller on the left to the three Reference Magnetic Sensors on the right To implement the RM2000 simply do not connect the Sen Z sensor The 3D MagIC also can operate only one sensor if desired Unused sensor connections should remain floating To implement either Reference Magnetic Sensor Suite in Legacy Mode the Mode pin pin 12 should be connected to DVDD rather than tied to ground Note RM3000 and RM2000 Reference Magnetic Sensor Suites typically are used in compassing applications where each channel represents a Cartesian coordinate axis x y or z For this reason the term axis generally is used instead of channel Rpjas 6 places 15 wn liz x axis 3D Magle a ho Host Controller moo ann 3 i y axis i 6 y 2en 2 3 i z axis AV55 DV55 MODE REAT Figure 4 1 RM3000 reference schematic Standard Mode The Sen XY and or Sen Z sensors serve as the inductive element in a simple LR rela
14. Figure 3 1 plots typical gain determined resolution as a function of the single axis sample rate The plot starts at 300 Hz since the usable resolution is limited by best case system noise of 15 nT The plot stops at 2400 Hz because this represents a cycle count of 30 and operating at cycle counts much lower than this introduces significant quantization error The number of cycle counts is determined by the user as explained in Sections 5 1 and 6 2 OT NO Gain determined Resolution nT 3 3 QD 300 600 900 1200 1500 1800 2100 2400 Single Axis Sample Rate Hz Figure 3 1 Sample Rate vs Resolution Standard Mode Usable resolution will be limited by system noise at lower sample rates The plots below are representative of performance as a function of the number of cycle counts which is a parameter directly controlled by the user The first two plots show performance for operation in both Standard Mode and the default Legacy Mode out to 10 000 cycle counts The maximum number of cycle counts in Legacy Mode is 4096 In Standard Mode the maximum cycle counts is 65 5k but there s rarely a reason to operate in Standard Mode much beyond 200 cycle counts as discussed in the following paragraph Figure 3 4 Figure 3 5 and Figure 3 6 show performance when operating in Standard Mode out to 200 cycle counts Operation in Standard Mode at more than 200 cycle counts usually is inefficient since more time and power i
15. Sensor Suite Performance Parameter Min Typical Max Units Field measurement range 1100 1100 uT Gain 200 Cycle Counts counts uT Noise 200 Cycle Counts nT Maximum Sample Rate Single Axis 450 Hz 200 Cycle Counts 1100 1100 OO gt gt Linearity best fit over 200 uT a oo oe Jao of 200 uT ce aden EE Bias Resistance Re EEYLSSY s 2 External Timing Resistor for Clock Rex 38 ko Circuit Oscillation Frequency ae kHz High Speed Clock Frequency mr MHz Operating Temperature 40 485 C Footnotes 1 Specifications subject to change Unless otherwise noted performance characteristics assume the user implements the recommended bias resistors and external timing resistor for the high speed clock as indicated in Figure 4 1 the DC supply voltage is 3 3 V and the 3D MagIC is operated in Standard Mode Other bias resistors external timing resistors and operating voltages may be used but performance may differ from the values listed 2 Field measurement range is defined as the monotonic region of the output characteristic curve 3 Gain and noise are related to useable resolution Below 200 cycle counts the gain setting dominates the usable resolution resolution 1 gain while above 200 cycle counts the system noise dominates The user establishes the gain value by setting the Cycle Count Register value See Figure 3 4 for the typical relationship between cycle counts gain and reso
16. Thank you for purchasing PNI Sensor Corporation s RM2000 or RM3000 Reference Magnetic Sensor Suite pn 90042 and pn 90043 respectively The RM2000 is comprised of two Sen XY Reference Magnetic Sensors pn 12683 and a 3D MagIC ASIC MLF controller pn 12927 and this forms the basis for a 2 axis horizontal digital compass The RM3000 is the same as the RM2000 but adds a Sen Z Reference Magnetic Sensor pn 12779 such that compassing measurements are not constricted to the horizontal plane When implementing an RM3000 or RM2000 Reference Magnetic Sensor Suite each Reference Magnetic Sensor serves as the inductive element in a simple LR relaxation oscillation circuit with the sensor s effective inductance proportional to the magnetic field parallel to the sensor axis The LR circuit is driven by the 3D MagIC ASIC Since the LR circuit s oscillation frequency varies with the strength of the magnetic field parallel to the sensor the 3D MagIC s internal clock is used to measure the circuit s oscillation frequency cycle counts and hence the magnetic field The 3D MagIC also contains an interface circuitry to communicate with a host microprocessor on an SPI bus The 3D MagIC can control and measure up to three PNI Reference Magnetic Sensors with each sensor individually selected for measurement and individually configured for measurement gain resolution Since the Reference Magnetic Sensor Suite works in the frequency domain resolution and
17. ation in Legacy Mode see Section 6 The 3D MagIC operates in Standard Mode when pin 12 is held LOW grounded to DVSS The basic functions to be performed when operating the 3D MagIC are e Setting the values in the Cycle Count Registers and e Taking sensor measurements The user should first establish the number of cycle counts to be measured for each sensor by writing to the Cycle Count Registers This is followed by sending a command or series of commands to make the sensor measurements Assuming the user will use the same number of cycle counts for subsequent measurements it 1s not necessary to rewrite to the Cycle Count Registers for subsequent sensor measurements In Standard Mode the 3D MagIC provides two methods to take sensor measurements which are discussed later in this section e Single axis measurement SAM and e Multi axis measurement MAM The SAM Command Byte initiates a measurement for one sensor and sets up the 3D MagIC to write the measured values out on the MISO line The MAM Command Byte initiates a sensor measurement for up to 3 sensors and a later Command Byte sets up the 3D MagIC to write the measured values out on the MISO line for up to 3 sensors For two or three axis systems normally it is more efficient to operate using the MAM Command Byte 5 1 Cycle Count Registers Prior to sending a command to take a sensor measurement it is necessary to write values to the Cycle Count Registers The default
18. bytes of data so for a 3 axis measurement 9 total bytes would be clocked out to receive all the data The Command Byte and Axes Select Byte are discussed below Initiate Measurement Retrieve Data SY ED X Unspecified Figure 5 2 SPI Activity Sequence Diagram for MAM Operation 5 3 2 MAM Command Byte The MAM Command Byte either initiates a sensor measurement or initiates placing the measurement results on the MISO line for the host to read The MAM Command Byte is 821 to initiate a sensor measurement and is C9y to retrieve the data Note Measurement results are stored in registers within the 3D MagIC If SCLK continues to run after the appropriate number of data bytes for the defined number of axes to be measured then the information on the MISO line will have little meaning SCLK should be stopped once the measurements are clocked out PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 34 of 42 5 3 3 MAM Axes Select Byte The MAM Axes Select Byte establishes which axes are to be measured and is defined as follows a o e Js a e eo vaue 0 o o an am o o 1 Table 5 3 MAM Axes Select Bits Axes Measured AAX1 AAXO0 X Y and Z o o X and Y oe 1 X only 0 No axis measured 1 5 3 4 Making a Multi Axis Measurement The steps to make a multi axis sensor measurement are given below The 3D MagIC will return the result of a complete forward reverse measu
19. d line PNI company identifier lg 4 5 440 1 F 0 1st number in lot code a GA assembly country code yf SY GA or KA Philippines S China de PE 3rd line 2805 remainder of lot code l l 10 year of manufacture Side View Figure 3 16 3D MagIC MLF Mechanical Drawing RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 17 of 42 PNI Sensor Corporation RM3000 amp RM2000 Sensor Suite User Manual April 2011 1 5 0 1 0 0 8 00 2 00 05 SEE NOTE 3 4 00 SEE NOTE 1 50 MIN 0 30 05 TT R 0 3 MAX 5 90 05 SEE NOTE 3 Bo 12 0 t 3 Ko 5 thousand per reel Notes 1 10 sprocket hole pitch cumulative tolerance 0 2 Ao 5 25 Tolerances Unless Noted 2 Camber in compliance with EIA 481 Bo 5 25 IPL 2 3 Pocket position relative to sprocket hole measured as Ko 1 10 2PL 10 true position of pocket not pocket hole All dimensions in millimeters Figure 3 17 3D MagIC MLF Tape Dimensions Dimensions in um microns LO LO LO LO N N 5 k eTR fg S ls dB LO 4 Tt LO 00 Tt LO w or EEE Ii 1 I ad 3 1 gt gt EEE er lie Te gt N N N LO oO 3 jz 19 19 9 o U8akwJ 6 3 la OJN XD a So Z a eT ha Om Olu Sn of au alu S x A x Al lt x ax Al ax ojx MOSI g 22 28 27 26 25 24 23 pp DO NOT CONNECT X 0 0 Y 1694 65 DO NOT CONNECT A S LO NOT CONNECT SSN mo om DO NOT CONNECT X 0 0 Y 1274 05 DVSS O no 775553
20. e Rate mA 0 05 0 00 20 40 60 80 100 120 140 160 180 200 Cycle Counts Figure 3 6 Current Consumption vs Cycle Counts Standard Mode PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 12 of 42 3 5 Dimensions and Packaging 3 5 1 Sen XY Dimensions amp Packaging FRONT VIEW SIDE VIEW 6 00 2 10 236 O83 2 21 MAX O 087 MAS BOTTOM VIEW Dimensions mm inches 079 J 1 40 Dimensions mm inches 055 Figure 3 8 Sen XY Solder Pad Layout RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 13 of 42 160mm Min CHIPS 330mm Min Te BLANK BLANK Dimensions mm Full reel is 5 000 pcs Smaller quantities on cut tape Tape amp Reel meets ANSI EIA standard EIA 418 B Figure 3 9 Sen XY Tape and Reel Dimensions 3 5 2 Sen Z Dimensions amp Packaging om 5 75 MAX 418 227 MAX 3 00 118 Top View Front View 0 70 BOTH PADS a Dimensions mm inches 1 79 BOTH PADS Bottom View Figure 3 10 Sen Z Sensor Dimensions PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 14 of 42 1 40 1 40 E 055 055 2 40 HH i 2 60 102 a Dimensions mm inches 4 00 ot Figure 3 11 Sen Z Solder Pad Layout ao Co Og oO p F r 80 m COMPONENTS sau i klore o 5 8 BLANK 160m
21. eeeeaeeeeeeeeeueeeeeessaeeeeeessagess 13 Figure 3 8 Sen XY Solder Pad Layout cccccssssccccccseeeeeeeceeeeeeeecseeeeeeeeeseeeeeeessaageeeeesaaaaes 13 Figure 3 9 Sen XY Tape and Reel Dimensions rrrvvrrrnnnrrvvvnrnnnervrnrnnnnerernnrnnnerernnrnnerreennnnn 14 Figure 3 10 Sen Z Sensor DIMENSIONS ccccseeecceccceseeeeecceeeeeeeecsaaeseeeeeseaeeeeeesauaeeeesssaaees 14 Figure 3 11 Sen Z Solder Pad Layout rrnrnnnnnnnnnnnnnnvvnnrrrnnnnnnnnrnnnrrrnnnnnnnsrennnrnnnnnnnsnsrnnnnnnnnnn 15 Figure 3 12 Sen Z Tape and Reel Dimensions rrrrrrnnnrrrovrrnnnnnrvnrrnnnnnrennrnnnnrrrnnrnnnnnrennnnnn 15 Figure 3 13 Sen Z Shield Sensor Dimensions rrrrrrrnrrrnnnnnnnnvvnnrrrnnnnnnnsrnnnrrrnnnnnnnnsrnnnnnnnnnn 16 Figure 3 14 Sen Z Shield Solder Pad Layout rrrrnnrnnnnrnnnnnnnnnrrnnrrrnnnnnnnnrennnnrnnnnnnnnsrnnnnnnnnnn 16 Figure 3 15 Sen Z Shield Tape and Reel Dimensions rrrrrrrrrrrnnnnnrrnrvnnrrrnnnnnnnnrrnnnnnnnnnn 17 Figure 3 16 3D MaglC MLF Mechanical Drawing ccccccseesceeeeseeeeeeeeeeeeeeeesaeaeeeeeeesaaees 17 Figure 3 17 3D MagIC MLF Tape Dimensions r rrrnnnrrrvvnnnnrvnnnnnrenvnnnnennnnnnrnnnnnnrennnnenennnnsne 18 Figure 3 18 3D MagIC Die Pad Layout rrrrnnnnnonnrnnnnnrrnnrnnnnnrenvrnnnnnrnnnrnnnnnrnnnrnnnnnrennrnnssnrennnnnn 18 Figure 3 19 Example Wire Bonding Layout for Legacy 11096 ASIC Applications 19 Figure 3 20 Recommended Solder Reflow Profile
22. eeeeeeeeeeeeeees 23 4 2 3 Other Layout Considerations cccccccccccccssseeceeecseseeeeeeaeeeeeeeenaaess 24 4 3 3D MAGIC PIN OUT eee 24 4 4 SPITIMING REQUIREMENTS Lupen eee 28 4 5 DEE MODE se EEE sg sess eee hace alc coca EEA 29 3D MAGIC OPERATION STANDARD MODE mennnnnnnnnnnnnnnnnnnnnnnnnnennnnnnnnnnnnnenennnnnnn 30 5 1 CYCLE COUNT REGISTERS rrnnnnnnnrrnnnnnnnnvvvnnvrnnnnnnnnnrnnnnrnnnnnnnnnrennnnnnnnnnnnnee 30 5 2 SINGLE AXIS MEASUREMENT SAM OPERATION sseeeeeeeeees 32 5 2 1 SAM SPI Activity Sequence rrrrrnnnrrnnnnnnnnnvrnnnrnnnnnnnnsrnnnrrnnnnnnnnsennnn 32 5 2 2 SAM Command Byte ccccccccccssssssseceeeeeeeaeeeeeeeeeeeeeeseeseeeeeeeeessaas 33 5 2 3 Making a Single Axis Measurement r rrarrnnnnnrrnnnnrnnnnnrnnnnnnnnnnrnnnnnr 33 5 3 MULTI AXIS MEASUREMENT MAM OPERATION cccccccesseeeeeeeeees 34 5 3 1 MAM SPI Activity SeQuence rmmrrrnnnnnennrnnnnnornrrnnnnnrennnnnnnnnennnnnnnnennne 34 5 3 2 MAM Command Byte cccccccccccsssseseceeeeeeeaeeeeeeeeeeeesseaeeeeeeeeeeessaas 34 5 3 3 MAM Axes Select Byte rrrrrrrrrrrrrrrrnnnnnnrorrrnnrrrnnnnnnnrrrnnrrnnnnnnnnsennnn 35 5 3 4 Making a Multi Axis Measurement rrennnnnvrnvnnnnnnvrvvnnnnnnervrnnnnnnereeenn 35 3D MAGIC OPERATION LEGACY MODE nuunnevvvnnnnnnnnnnnnnnnnnnnnnnnnnnevvnnnnnnnnnnnneennnnnnn 37 6 1 LEGACY OPERATION brecocsestecccccsasctemedanecttcetexcunesceccessaesaqntstenatedsetenqeetionseedies 37 6 1 1
23. egister Address Bits Establishes which register will be written to or read from Each sensor is represented by two registers with addresses defined as follows Table 5 1 Cycle Count Register Commands Read Command Write Command Register Description Byte Byte X Axis Cycle Count Value MSB C3h 83H X Axis Cycle Count Value LSB 844 Y Axis Cycle Count Value MSB 85H Y Axis Cycle Count Value LSB C6y 864 Z Axis Cycle Count Value MSB C7y 874 Z Axis Cycle Count Value LSB C8y 881 Since the registers are adjacent it 1s not necessary to send multiple Command Bytes as the 3D MagIC automatically will read write to the next adjacent register A sample command sequence is provided below which sets the cycle count value to 100p 64p for all 3 axes This is purely for illustrative purposes and the value could be different and or the number of axes to be addressed could be different e Start with SSN set HIGH then set SSN to LOW e Send 83y this is the Write Command Byte to address the MSB for the X axis RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 31 of 42 e Send 0 value for the MSB for the X axis e Send 64y value for the LSB for the X axis pointer automatically increments e Send 0 value for the MSB for the Y axis pointer automatically increments e Send 64y value for the LSB for the Y axis pointer automatically increments e Send 0 value for the MSB for the Z axis pointer automatically increm
24. ents e Send 64y value for the LSB for the Z axis pointer automatically increments e Set SSN to HIGH 5 2 Single Axis Measurement SAM Operation The SAM Command Byte initiates a sensor measurement on a single sensor and sets up the 3D MagIC to output the measured values on the MISO line Generally SAM operation is not as efficient as MAM operation except when only one sensor in total is to be measured 5 2 1 SAM SPI Activity Sequence The SPI activity sequence for SAM operation is given below SPI timing is discussed in Section 4 4 The Return Byte is 9Ay Three 3 data bytes will be clocked out for a single axis measurement The Command Byte is discussed below Initiate Measurement Retrieve Data av I y sax ML N SS MOSI X Command Be X X e MISO Return Byte Data Bytes H DRDY f X Unspecified Figure 5 1 SPI Activity Sequence Diagram for SAM Operation PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 32 of 42 5 2 2 SAM Command Byte The SAM Command Byte is defined as follows 5 2 3 Making a Single Axis Measurement The steps to make a single axis sensor measurement are given below The 3D MagIC will return the result of a complete forward reverse measurement of the sensor in a 24 bit 2 s complement format range 8388608 to 8388607 e SSN pin is set LOW This enables communication with the master device e The SAM Command Byte
25. glect of care alteration accident or unauthorized repair THE ABOVE WARRANTY IS IN LIEU OF ANY OTHER WARRANTY WHETHER EXPRESS IMPLIED OR STATUTORY INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL SPECIFICATION OR SAMPLE PNI NEITHER ASSUMES NOR AUTHORIZES ANY PERSON TO ASSUME FOR IT ANY OTHER LIABILITY If any Product furnished hereunder fails to conform to the above warranty Customer s sole and exclusive remedy and PNI s sole and exclusive liability will be at PNI s option to repair replace or credit Customer s account with an amount equal to the price paid for any such Product which fails during the applicable warranty period provided that i Customer promptly notifies PNI in writing that such Product is defective and furnishes an explanation of the deficiency ii such Product is returned to PNI s service facility at Customer s risk and expense and iii PNI is satisfied that claimed deficiencies exist and were not caused by accident misuse neglect alteration repair improper installation or improper testing If a Product is defective transportation charges for the return of the Product to Customer within the United States and Canada will be paid by PNI For all other locations the warranty excludes all costs of shipping customs clearance and other related charges PNI will have a reasonable time to make repairs or to replace
26. h software and hardware changes then operation in Standard Mode is recommended as it allows for multi axis measurement operation and finer granularity in establishing the number of cycle counts The 3D MagIC incorporates a Clock Divide Register that effectively divides the 3D MagIC s high speed internal clock by some integer value Clock Divide Value In Legacy Mode the default is 16 as this results in performance matching that of the 11096 ASIC at similar Period Select values But for the most efficient operation the value should be 1 since this gives the greatest time based resolution If a legacy user cannot set pin 12 to DVSS to operate in Standard Mode but can make code changes it is possible to significantly reduce power consumption see Table 6 4 by over writing the Legacy Mode default Clock Divide Value and using a smaller Period Select value In this case the user first will write to the Clock Divide Register and after this follow the same process as for Legacy Operation except with a different Period Select value For example if a user operates in default Legacy Mode and sets the Period Select value to 5 the cycle count will be 1024 and the effective clock speed with be 2 8 MHz By changing the Clock Divide value from 16 Legacy Mode default to 1 the effective clock speed increases to 45 MHz With this significantly higher clock speed the Period Select value can be reduced to 1 64 cycle counts such that the gain remains uncha
27. he 3D MagIC s pin out is summarized in Table 4 1 Pin numbers run counterclockwise when looking from the top starting at the Pin designator as shown in Figure 3 16 PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 24 of 42 Table 4 1 3D MagIC Pin Assignments MLF Die Pin Description Pin Pad Name MOSI SPI interface Master Output Slave Input Serial Data ss 2 Do not connect 3 SSN SPI interface Active low to select port 4 Supply voltage for analog section of ASIC 5 Ground pin for analog section of ASIC 6 6 Zm Z sensor drive output 7 Z sensor measurement input 8 RERA Z sensor measurement input 9 O 9 Zaw Z sensor drive output 10 Y sensor drive output 11 Y sensor measurement input 12 Mode Select tie to DVss for Standard DVpp for Legacy 13 Y sensor measurement input 14 Y sensor drive output 15 X sensor drive output 16 X sensor measurement input 17 X sensor measurement input 18 X sensor drive output 19 Ground pin for digital section of ASIC N Do not connect NO NO oO MO MO NMI NMI NMNINMI NMINM NMI N NIJ Do not connect Z 2 ss Do not connect 3 CLEAR Clear Command Register 4 DRDY Data ready command NO N 24 5 Do not connect 25 6 External timing resistor for high speed clock 26 7 Supply voltage for digital section of ASIC 27 8 SPI interface Serial clock input 28 9 SPI interface
28. il 2011 for the most recent version visit our website at www pnicorp com PNI Sensor Corporation 133 Aviation Blvd Suite 101 Santa Rosa CA 95403 USA Tel 707 566 2260 Fax 707 566 2261 Warranty and Limitation of Liability PNI Sensor Corporation PNI manufactures its Products from parts and components that are new or equivalent to new in performance PNI warrants that each Product to be delivered hereunder if properly used will for ninety 90 days following the date of shipment unless a different warranty time period for such Product is specified i in PNI s Price List in effect at time of order acceptance or ii on PNI s web site www pnicorp com at time of order acceptance be free from defects in material and workmanship and will operate in accordance with PNI s published specifications and documentation for the Product in effect at time of order PNI will make no changes to the specifications or manufacturing processes that affect form fit or function of the Product without written notice to the Customer however PNI may at any time without such notice make minor changes to specifications or manufacturing processes that do not affect the form fit or function of the Product This warranty will be void if the Products serial number or other identification marks have been defaced damaged or removed This warranty does not cover wear and tear due to normal use or damage to the Product as the result of improper usage ne
29. ill also stop the measurement cycle If you try to send a new command during the readout phase after DRDY goes HIGH the command will be ignored until all 16 bits have been clocked our or the CLEAR pin is set HIGH then LOW again CLEAR Clear Command Register To initiate a clear command in Legacy Mode the CLEAR pin must be toggled LOW HIGH LOW CLEAR is usually LOW CLEAR will reset the DRDY pin to LOW CLEAR can be used to stop any sensor measurement in progress CLEAR has no effect on the SPI register state Note The CLEAR pin is similar to the RESET pin on PNI s legacy ASIC However in Standard Mode the 3D MagIC automatically resets the DRDY line so it is not necessary to use the CLEAR pin when operating in Standard Mode AVDD and DVDD Supply Voltages AVDD and DVDD should be tied to the analog and digital supply voltages respectively The recommend voltages are defined in Table 3 5 and the maximum voltages are given in Table 3 4 DVDD must be on whenever AVDD is on so DVDD should either be brought up first or at precisely the same time as AVDD AVDD can be turned off when not making a measurement to conserve power since all other operations are supported with DVDD Under this condition register values such as those in the Cycle Count Register will be retained as long as DVDD is powered Also AVDD must be within 0 1 VDVDD when AVDD is on AVSS and DVSS Ground Pins AVSS and DVSS should be tied to the analog and digita
30. ke readings only when the field is in a known state For instance if a motor will be running part of the time take readings only when the motor is in a known state e g off e If you are uncertain about the effect a specific component may have on the system the RM3000 Evaluation Board can be used to help ascertain this Place the RM3000 Evaluation Board on a firm surface and gradually bring the component in question close to the board then note when the magnetic field starts to change If the component cannot be moved then gradually move the RM3000 Evaluation Board towards the component however it is necessary to ensure the orientation of the board remains constant while doing this If an RM3000 Evaluation Board is not available gradually bring the component in question closer to one of the Reference Magnetic Sensors and observe when the sensor reading starts to change Note that the affect of a local magnetic distortion drops off as 1 distance 4 2 3 Other Layout Considerations Other design considerations include e To minimize the effect of gradients in the magnetic field position the sensors as close to each other as possible e To reduce coupling to and from other signals keep the two traces from the 3D MagIC to each sensor as close as possible to each other The 3D MagIC can be located up to 0 5 m away from the sensors e Keep capacitors especially tantalum capacitors far away from the sensors 4 3 3D MagIC Pin Out T
31. l ground respectively Assuming the ground plane is clean they may share a common ground They may have their own ground planes if this is more convenient from the standpoint of the user s circuit layout DVSS and AVSS should be within 0 1 V of each other RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 27 of 42 Rexr External Timing Resistor Rext ties to the external timing resistor for the high speed clock The recommended value for the resistor and associated clock speed are defined in Table 3 1 Sensor Drive and Measurement Pins The various sensor drive and measurement pins should be connected to the Reference Magnetic Sensors For a north east down NED reference frame the connections should be as defined in Figure 4 3 4 4 SPI Timing Requirements When implementing a SPI port whether a dedicated hardware peripheral port or a software implemented port using general purpose I O also known as Bit Banging the timing parameters defined below in Figure 4 4 and specified in Table 4 2 must be met to ensure reliable communication Note that Standard Mode and Legacy Mode timing requirements are identical with the exception of Legacy Mode utilizing the CLEAR line The SPI clock SCLK should run at 1 MHz or less Generally data is considered valid while SCLK is HIGH and data is in transition when SCLK is LOW The clock polarity used with the 3D MagIC is zero exclusively CPOL 0 Data is present on MISO or should be
32. lution Above 200 cycle counts noise is relatively constant and there are diminishing returns in usable resolution as the cycle count value increases Also performance will vary from sensor to sensor 50 of the sensors will have performance greater than Typical and 50 less than Typical 4 The maximum sample rate and gain resolution are inversely related so higher sample rates can be obtained by reducing the number of cycle counts but this also results in reduced gain and resolution Also see Figure 3 4 and Figure 3 5 5 Operating at reduced cycle counts reduces current consumption but also reduces resolution Operating at greater cycle counts increases current consumption but due to system noise does not significantly increase useable resolution Also see Figure 3 6 PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 6 of 42 3 2 Sen XY and Sen Z Characteristics Table 3 2 Sen XY and Sen Z Absolute Maximum Ratings Parameter Minimum Maximum Units Input Pin Current 25 C Storage Temperature CAUTION Stresses beyond those listed above may cause permanent damage to the device These are stress ratings only Assuming operation with the 3D MagIC per the guidelines in this manual these maximum ratings will not be violated Table 3 3 Sen XY and Sen Z Characteristics Parameter Min Typical Max Inductance 400 600 uH Resistance versus C tempe
33. m MIN BLANK 7 Dimensions mm Full reel is 1200 pcs Smaller quantities on cut tape Tape amp Reel meets ANSI EIA standard EIA 418 B Figure 3 12 Sen Z Tape and Reel Dimensions RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 15 of 42 3 5 1 Sen Z Shield Dimensions amp Packaging 4 10 i 4 10 0 161 ee 6 10 0 240 Front View Side View 5 70 0 224 Dimensions in mm inches Bottom View Figure 3 13 Sen Z Shield Sensor Dimensions 1 25 2 00 2 00 1 25 0 049 0 079 0 079 0 049 Shield Pads Sensor Pads 4 00 4 00 en 6 50 bog Figure 3 14 Sen Z Shield Solder Pad Layout PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 16 of 42 16 3 MAX 12 00 4 00 A PITCH PITCH 01 50 585 m pe pm p ole g 01060 200o Gt bog Bet 0 50 men 100 0 MIN TRAILER COMPONENTS PEER SEE NOTE 3 SECTION A A REEL WINDING DIRECTION 41 30 MAX X 20 MAX OPTIONAL SECTION B B Dimensions mm Full reel is 600 pcs Smaller quantities on cut tape Tape amp Reel meets ANSI EIA standard EIA 418 Figure 3 15 Sen Z Shield Tape and Reel Dimensions 3 5 2 3D MagIC Dimensions and Packaging 0 625 0 125 fr 0 24 0 06 ss MG Pin 1 PNIOGA 5 0 40 15 280510 05 0 06 i om Top View Bottom View Dimensions in mm Product labeling Istline 12927 PNI part number 2n
34. nged but the time to take the measurement and hence power consumption 1s dramatically reduced PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 40 of 42 6 2 1 Clock Divide Command Byte The Command Byte to initiate reading or writing to the Clock Divide Register is defined as follows R W Read Write When HIGH signifies a Read operation from the Clock Divide Register When LOW signifies a Write operation to the Clock Divide Register 6 2 2 Clock Divide Register The Clock Divide Register is defined as follows Table 6 3 Clock Divide Bits Clock Divide Value CD2 CD1 CDO Standard Mode default po 0 po fo po 1 po fa Legacy Mode default ro 0 oao RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 41 of 42 6 2 3 Command Sequence for Setting Clock Divide Value A sample command sequence is given below which sets the Clock Divide Value to 1 e Set SSN to LOW e Send 804 this is the Command Byte to write to the Clock Divide Register e Send 0 this sets the Clock Divide Value to 1 e Set SSN to HIGH 6 2 4 Changes to the Period Select Value Since the high speed clock is running faster the time resolution of the measurement is increased Consequently the number of cycle counts required to achieve a desired magnetic field resolution is substantially reduced and the Period Select value in the Legacy Command By
35. nhanced Legacy Operation 6 1 Legacy Operation In Legacy Mode a sensor measurement is initiated with the Legacy Command Byte and this command also sets up the 3D MagIC to output measurement data on the MISO line once this data becomes available Note the 3D MagIC s high speed clock runs at nominally 45 MHz but the 11096 ASIC runs at nominally 2 MHz Consequently when the 3D MagIC is in default Legacy Mode the clock speed is divided by 16 thus reducing the clock speed to 2 8 MHz At an effective clock speed of 2 8 MHz the gain of the 3D MagIC circuit will closely match the gain of the 11096 ASIC circuit operating at 2 MHz The effective clock speed of the 3D MagIC is not 2 MHz for gain matching because of differences in the circuit oscillation frequency between the 3D MagIC and the 11096 ASIC circuits As such the performance of the 3D MagIC closely matchs that of the 11096 ASIC circuit with no software coding or hardware changes on the user s part But performance is sub optimized and specifically power consumption can be reduced by up to 90 with software changes on the user s part as discussed in Section 6 2 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 37 of 42 6 1 1 Legacy Operation SPI Activity Sequence The SPI activity sequence is given below for Legacy operation SPI timing is discussed in Section 4 4 The Return Byte is 9By Two 2 data bytes will be clocked out for a Legacy measurement The Command By
36. pin is set HIGH then LOW This is not required but is optional to maintain compatibility with the legacy 11096 ASIC e A command byte is clocked into the 3D MagIC on the MOSI pin Simultaneously the 3D MagIC will present a fixed 9By on the MISO pin Once the 8 bits have clocked in the 3D MagIC will execute the command 1 e take a measurement RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 39 of 42 e The SSN input may be returned HIGH at this point to free up host communication with another device if desired This will not affect the measurement process e A measurement is taken which consists of forward biasing the sensor and making a period count then reverse biasing the sensor and counting again and then taking the difference between the two directions and presenting this value e At the end of the measurement the DRDY pin is set HIGH indicating data is ready and the 3D MagIC is placed in Idle Mode e The SSN input should be set LOW if it is not already to read the data e The data is clocked out on the MISO pin with the next 16 clock cycles If another measurement is to be made immediately the SSN pin can remain low and the process repeated Otherwise it generally is recommended to set the SSN pin HIGH to release the SPI serial bus 6 2 Enhanced Legacy Operation Note Enhanced Legacy Operation involves improving performance of a legacy system by implementing only software changes If the user can make bot
37. presented on MOSI before the first low to high clock transition exclusively CPHA 0 Standard Mode Timing Legacy Mode Timing SSN prssennsenn SSN vanskene lt tsc SCLK FETT TG ek lt temn CLEAR H seenennnnnn MOSI me MOSI MISO Figure 4 4 SPI Timing Diagram PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 28 of 42 Table 4 2 SPI Timing Specifications Symbol Description Min Max Units tsc Time from SSN to CLEAR awo fo ns temin CLEAR duration 0 ns tsspv Time from SSN to Command Byte on MOSI Aa US tossk Time to setup data before active edge 50 fo ns toasH Time to setup data after active edge 50 fo ns tsypz Time from SSN to data tri state time me 100 ns 4 5 Idle Mode The 3D MagIC incorporates an Idle Mode to reduce power consumption in which the circuit automatically idles when it is not exchanging data or taking a measurement The 3D MagIC starts in the Idle Mode at power up and remains in Idle Mode until a measurement is needed Note The 3D MagIC starts in Idle Mode when powered on This is different from the legacy 11096 ASIC which required cycling through one measurement request operation to put it into Idle Mode RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 29 of 42 5 3D MagIC Operation Standard Mode Note This section discusses how to operate the 3D MagIC in Standard Mode For a description of oper
38. rature i Sen XY 0 06 0 002 m oz ii sen 0 002 __ gm oz sez 00000009 omi Operating Temperature 40 85 C Footnote 1 1 V peak to peak across the coil 100 kHz sinewave No DC bias resistance Measured orthogonal to Earth s magnetic field RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 7 of 42 3 3 3D MagIC Characteristics Table 3 4 3D MagIC Absolute Maximum Ratings Parameter Minimum Maximum Units Analog Digital DC Supply Voltage AVpp amp DVpp VDC Inout Pin Voltage VDC Input Pin Current 25C mA Storage Temperature C CAUTION Stresses beyond those listed above may cause permanent damage to the device These are stress ratings only Operation of the device at these or other conditions beyond those indicated in the operational sections of the specifications is not implied Table 3 5 3D MaglC Recommended Operating Conditions Parameter Symbol Min Max Units Difference DVpp AVpp Analog Unpowered DVpp 0 1 DVpp 0 1 VDC High level input voltage Va 07 DVeo DV VDO Low level input voltage Vi ioe J 0 3 DVpp VDC High level output current loH a ae a ae mA Low level output current lot aa a mA Leakage Current DVpp pin 100 H AVpp AVss DVss 0V DVpp 3 6V Operating Temperature Top 40 85 C PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 8 of 42 3 4 Typical Sensor Suite Operating Performance
39. rement of each sensor in a 24 bit 2 s complement format range 8388608 to 8388607 e Start with SSN set HIGH then set SSN to LOW e Initiate a sensor measurement by sending 824 MAM Command Byte to write to the Mode Register followed by Oly Mode Register Word to initiate measurement on the MOSI pin The 3D MagIC will now take the prescribed measurements e Return SSN to HIGH This will not affect the measurement process but will free up the host to communicate with other devices and ensure the next Command Byte sent to the 3D MagIC is interpreted properly e A measurement is taken e At the end of the measurement the DRDY pin is set HIGH indicating data is ready and the 3D MagIC is placed in Idle Mode e When the host is ready to read the measured values set SSN to LOW If SSN already is LOW then toggle SSN from LOW to HIGH to LOW RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 35 of 42 e Send C94 MAM Command Byte to read from the on the MOSI pin to initiate reading the measurement values Data is clocked out on the MISO pin Each sensor reading consists of 3 bytes of data clocked out MSB first X axis data is presented first then y axis data then z axis data The first nine 9 bytes represent a complete 3 axis measurement e Return SSN to HIGH to free up the host to communicate with other devices and to ensure the next Command Byte sent to the 3D MagIC is interpreted properly PNI Sensor Corporation
40. represents the direction of travel or pointing Positioning of the sensors is not critical other than ensuring they are not positioned close to a magnetic component such as a speaker Figure 4 3 RM3000 North East Down NED Sensor Layout If the Sen Z sensor is flipped to the bottom of the board such that the curved portion of the sensor still points forward then to retain NED the Sen Z s ZDRVN and ZDRVP pads should be as shown above except on the bottom of the board Since the pads on the Sen Z have switched positions the connections to the Sen Z sensor will be reversed 4 2 2 Local Magnetic Field Considerations Since the sensors measure magnetic field it 1s important to consider what items in the vicinity of the sensors can affect the sensor readings Specifically e The sensors have a linear regime of 200 uT Earth s field is 50 uT To ensure the sensors operate in their linear regime do not place the sensors close to large electric currents large masses of ferrous material or devices incorporating permanent magnets such as speakers and electric motors e Locate the sensors away from changing magnetic fields While it is possible to calibrate the sensors to accommodate local magnetic distortion that is fixed RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 23 of 42 relative to the sensors changing local magnetic fields generally cannot be accommodated When the local magnetic field will change try to ta
41. s consumed per measurement with diminishing returns in usable noise limited resolution RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 9 of 42 10000 Standard Mode a 1000 Legacy Mode default config 100 Gain counts uHT 10 100 1000 10000 Cycle Counts Figure 3 2 Gain vs Cycle Counts Standard amp Legacy Modes Resolution 1 Gain to the system s noise limit lt 10000 Standard Mode cc 4 Legacy Mode default config 1000 Q N 2 x lt 100 p Q O N 10 gt gt 1 10 100 1000 10000 Cycle Counts Figure 3 3 Single Axis Sample Rate vs Cycle Counts Standard amp Legacy Modes PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 10 of 42 50 45 40 35 30 25 20 Gain counts uT 15 10 O 20 40 60 80 100 120 140 160 180 200 Cycle Counts Figure 3 4 Gain vs Cycle Counts Standard Mode Resolution 1 Gain to the system s noise limit 3000 2 00 2400 2100 1800 1500 1200 900 600 300 Maximum Single Axis Sample Rate Hz oO 20 40 60 80 100 120 140 160 180 200 Cycle Counts Figure 3 5 Single Axis Sample Rate vs Cycle Counts Standard Mode RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 11 of 42 0 40 0 35 0 30 0 25 0 20 0 15 0 10 Current Consumption 35 Hz Single Axis Sampl
42. te is discussed below Initiate Measurement Retrieve Data sw LU DI 1 CLEAR yy 5 sax FAM Mn Mos X Command Byte X Xx EE SS MISO wor I S X Unspecified Figure 6 1 SPI Activity Sequence Diagram for Legacy Operation 6 1 2 Legacy Command Byte The command byte to initiate a sensor measurement is defined as follows vae 0 Pse esi pen o 0 AST Aso PSO PS2 Period Select Selects the number of sensor circuit oscillation cycles cycle counts to be counted while simultaneously using the internal fixed reference clock to measure the time to obtain this count PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 38 of 42 Table 6 1 Legacy Period Select Bits Period Select Value Cycle Counts PS2 a me fo fol de fr fo N O1 B WY P ASO AS1 Axis Select Determines the sensor to be measured Table 6 2 Legacy Axis Select Bits Axis Measured AS1 No axis measured 0 0 X axis ae 1 Y axis 0 Z axis 1 6 1 3 Making a Legacy Measurement The steps to make a sensor measurement are given below In Legacy Mode the 3D MagIC returns the result of a complete forward reverse measurement of the sensor in a 16 bit 2 s complement format range 32768 to 32767 Note this is different from Standard Mode where a 24 bit value 1s returned e SSN pin is set LOW This enables communication with the master device e CLEAR
43. te should be altered Generally speaking the best performance will be obtained with the Clock Divide Value set to I Table 6 4 Enhanced Legacy Mode with CD 1 Default Legacy Enhanced Legacy with CD 1 Period Cycle Equivalent Cycle Power Gain Select Counts Period Select Counts Consumption O MN NO Sh R Footnote 1 Equivalent Period Select is defined as the Period Select Value that provides equivalent gain to the default Legacy Mode If the Equivalent Period Select Value cannot be reduced i e is at 0 then the improvement in Gain is shown PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 42 of 42
44. that Figure 3 19 is for illustrative purposes only The sample bond pad layout was taken from a PNI product that incorporates the 3D MagIC die The customer s bond pad layout will vary as will the best layout for the customer s application 3 6 Soldering Figure 3 20 and Table 3 6 provide the recommended solder reflow profile and processing parameters for RM3000 components After soldering PNI components to a board it is possible to wave solder the opposite side of the PCB IMPORTANT PNI sensors require the use of halide free solder pastes and processes for reflow and cleaning Please contact PNI if you would like recommendations RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 19 of 42 280 260 240 Ramp down 200 180 160 140 ac Preheat gt 120 100 P O t 25 C to Peak cj ____ Time tv ws Figure 3 20 Recommended Solder Reflow Profile Table 3 6 Recommended Solder Processing Parameters Parameter Symbol Value Preheat Temperature Minimum T smin 150 C Preheat Temperature Maximum lema 200 C Preheat Time TsmintO Tsmax 60 180 seconds Solder Melt Temperature gt 218 C Ramp Up Rate Tsmax to T1 3 C second maximum Peak Temperature lt 260 C 6 minutes maximum 60 120 seconds 10 20 seconds 4 C second maximum Time from 25 C to Peak Tp Time above T Soak Time within 5 C of Tp Rampdown Rate Footnote
45. ween the forward and reverse bias directions is output from the 3D MagIC and this number is directly proportional to the strength of the local magnetic field in the direction of the sensor Note that only one sensor can be measured at a time and the number of cycle counts is individually set for each sensor Also the greater the number of cycle counts the higher the resolution of the measurement to the noise limit and the longer the sample time Figure 4 2 below provides a detail of the biasing circuit For additional information on PNI s magneto inductive sensor technology please refer to the Magneto Inductive Technology Overview white paper found on PNI s website gt 5 gt Forward Bias Reverse Bias N Figure 4 2 LR Oscillator Circuit Biasing Diagram Since the Reference Magnetic Sensor Suite works in the frequency domain resolution is cleanly established by the number of cycle counts Also the output from the 3D MaglC is inherently digital and can be fed directly into a microprocessor which eliminates the need for signal conditioning or an analog digital interface between the sensor and host processor PNI Sensor Corporation Doc 1015673 r06 RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 22 of 42 4 2 Layout 4 2 1 Sensor Orientation Figure 4 3 indicates how the three Reference Magnetic Sensors in a RM3000 Suite should be oriented for a system referenced as north east down NED The arrow
46. xation oscillation circuit which is composed of an external bias resistor along with digital gates and RM3000 amp RM2000 Sensor Suite User Manual April 2011 Page 21 of 42 a comparator internal to the 3D MagIC The sensor s inductance varies with respect to the magnetic field As such the frequency of oscillation of the circuit varies with the strength of the total magnetic field parallel to the sensor To make a measurement one side of the sensor 1s grounded while the other side is alternately driven with positive and negative current through the oscillator The circuit is driven for a user specified number of circuit oscillations the cycle counts and the time to complete the specified number of cycle counts is measured using the 3D MagIC s internal high speed clock The 3D MagIC next switches the bias connection to the sensor and makes another measurement The side that was previously grounded is now charged and discharged while the other is now grounded Since the total magnetic field represents the sum of the external magnetic field and the circuit induced magnetic field and since the circuit induced magnetic field has the same magnitude but opposite direction for the two bias polarities the external magnetic field is proportional to the difference in the time to complete the user defined number of cycle counts i e the difference in the total measured magnetic field The difference in the number of high speed clock oscillations bet

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