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1. O 1UF READY d SV MOD J701 d I KOCN DS 3 0062 25 7 p p p ovi we SECH 58 T i E gt 3 3V PL E m M D VINI GNO A R R R sste 2 7 lt gt 3 3VD 2 os e Sei d yank Tur zer u un R505 5 1 v na D 10V es Y3M7A CNDR a H e 3CcLKOUTP A CLKOUTM A Poos EN 12 V2P A 13 vam u 9 RED A READY En GNDG e 1 8VD 1 2 14 L35 u A732 33 710 C605 s ros t 9 CI D SDAA 1 2 19v 15507 zz 220UF ki iv 16V 47 A s CO GRANA 1 2 GNOB 18 YOP A 19 YOM A R730 68 9 o HSYNC 2 20 y3P 8 gt gt gt gt at v3 9 BLU A 4 2 3v34 8 22 CLKOUTP B ipu E CLKOUTM B 173 B o VSYNC A728 33 ad 9 D SCLAl1 2 B729 470 9 ST DET 1 2 u x 8 EE E o y a N o g 8 TA ril N a o N x N DS a Tu o o E 5 L5 J703 Gees SMW200 11 Tm 4 2 Svs svst1 2 5v won C713 O tur 602 Tee c602 4CE01 3 e 2 a 0 01uF100uF e g 16 MODON gt omg A525 100 9 LIPS DFC 4 2 m uw o amp SCALER PWM 1000hm LIPS PWM CONTROL 2 konm g g svsti
2. SECRET MODEL iie iero Aa ae LGBlectronics BLOCK su SHEET X DATE FEB 2009 P NO MFL61926814 Printed in China
3. TROUBLE IN U201 Waveforms 11 H SYNC Tek SIE us 1798 Acqs Aa ar roov 10 055 Chi 200V 5 apr 2006 09 08 11 2 v SYNC E Tek SEE 25 0ks s 57 Acqs t 60V Mine RI 3 28 V s apr 2006 09 11 14 CHECK H V SYNC LINE Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 17 LGE Internal Use Only WIRING DIAGRAM 30P 44P EAD57188301 6631T20023T 6P zu Se RN 6631900011J Copyright 652007 LG Electronics Inc All right reserved 18 Only for training and service purposes LGE Internal Use Only EXPLODED VIEW 19 an 2 Wow 3 SEN 3 di 22 q g 9 i gt gt El p sz 3 3vD0 1 ale A510 4 x 0 9518 470 100 ST DET 1 ale 9 S 9 y 0 WO INVON SI
4. 470 10K DDET 9 s m 9 2 a5 2 d 4 e 58 2 1 VD i 5 c512 E t9 JF 16V oL Ej x501 a o m aul ulol 9 H svs 1 2 2 id 14 318MHz EL az 9 Weg a a naaa nd Xon X NS ONIS x E 5 wimi GR od SISIN lid pu Om W o ojo olola alsa A524 nam aa TE E EECH DECHE SUN a 3 3V PL 3 3V PLI1 2 O aloloal ojojojojojoljoljojojojo OI OlGi i lzioiololoiololoioilcolot Iol it olal gt SIslalalalalalalalalalalaln 2 S o O 5 2 x x 06 O O O O O O O O O OT O gt gt D SDAB 2 DDCD SCL BYPASS 7 7 9 CND 1 GND_9 LI HX2P LVBOM j ps ale YoM B oer HX2N LVBOP Do EI yor 8 2 GND_2 GND_8 RX1P VDDP_4 AXi 4 B RAN ENSIN RX1 2 Mise 2l AVDD 33 1 LVB1P VDVI l e 9 viP B 2 RXOP LVB2M Rxot 4 2ll M e 4 2 RXON LVB2P Rxo 1 zl y2P 8 la 2 GND 3 L VBCKM CLKOUTM B HXCKP LVBCKP RXC4 CLKOUTP B Ase2 RXCKN LVB3M 4 7K RXC 1 2 0 Y3M 8 AVOD_33_2 LVB3P avs 1 2 REXT VDDC_3 SE ES 38 3 3V PL 4 2 4 R509 390 P se E AVDD 33 3 LVAOM x 4 2 B501 7 T C YOM A 2 LAMPADI 100 Eau P BINOM LVAOP 8S 5j Gus I 1 2 51 auala e PS 56 C59 0 oen D BINOP LVA1M E 5 eo 6501 5 I KST3904 NE 047UF GINOM LVA1P EN E S H 2 PM R504 56 O47uF e G NOE 20 22 Wide LVA2M VENA na Treos 1K CB moer e SOGINO By 1680X1050 LVAeP TENI 2j E conj o o47ur RINOM TSUMUSSEWHI L VACKM A KOT ER 4 h R507 56 E RINOP 5g LVACKP 5 CLKOUTP A 4 AVDD_33_4 57 GND 7 REFM 56 VODP 3 z lC Ch READY ro Ip REFP 55 LVA3M
5. EP an Ze oa 22 2 s ISYNCO 54 LVA3P l 93v 2 HSYNC Se 2 VSYNCO MODE 1 l 503 l VSYNC s GND 4 MODE O M I I DDCA_SDA AS232_TX VDDC_2 i l Vy L anmnyonoonagos pe l l mommmmnmmnnm R520 N c re ES x uD0 oloonN r e miu alal alal aulo l T lololololujajlgajlols szzi alololzlaol lalolalalzs slalal z s a lo SDATAC2 199 m D SDAA alsizjalz i II al2ls z R521 olalo a QN o O O OjO O O X X Q 0 l 33 I E WE 40d als alala o sim D SCLA UY SO aja Hlela D ala I a ao 6 6 NINIS 6 aja l Es 1 1 AA E E E NEE en a j O afa ojo E oO rH aja rin Ke L 7 a i aja olo O06 x rt 3 3v pLl1 2 8 es 1 U502 a 2 W25X20AVSNIG 13 3VD 4 es vec MODON 4 2 I 9 4 BD 4 SPOS 9 m Ree CLK 13 3V PL 4 2 IN u s neck 4 7K R517 gres am Geen 3 Er T j SDI mu C919 Ka x 0 ur READY DON vu N ey 58 SB 59 dee fi Se Sale D A d THE SYMBOL MARK OF THIS SPECIAL FEATURES IMPORTANT FILRE AND ELECTRICAL SHOCK HAZARDS WHEN ESSENTIAL THAT ONLY MANUFATURES SPECFIED THE CRITICAL COMPONENTS IN THE A SYMBOL SCHEMETIC DIAGRAM INCORPORATES FOR PROTECTION FROM X RADIATION SERVICING IF IS PARTS BE USED FOR MARK OF THE SCHEMETIC SECRET EPROM LGElectronics LG ELECTRONICS MODEL w43 DUAL MSTAR MODEL ws ou usar DATE 20080017 BLOCK sewer SHEET Y 2 707 svS 1 alien En 10034HA 30 C714
6. 9 1 INVON 2 5 ER D n 35 _ X DIMADJ 2 2 g 8709 g N 1 LAMPADJ 4 2 amp J706 C704 Jee C706 GH11121 DNO D 4 215VS o 1uF Tur Ei i 2 SCALER PWM 100pF LIPS PWM iuF D 2 D 2 2 2 2 95 BVH gze4 SS Ai ax 4 SCI ES L c DDCSVD Ee D SCLB UBW2012 601F x 9 d 1 2 Iie lt 2 704 a Re15 O gzes 30V 5VS 4 SMn200 06 JD SDAB 4 2 ps 184 L e DDET el 803 UBW20 12 60 4F Ee M24C02 AMNST GEN ay o Ces 3 3VD 1 d LED AM 3 ans ANID x Bis GEES 1 2 NETTES BE d Ee RXC R704 o 4 2 707 cyos el s EEPROM 4 2 bd bd ein 2 orl kobpr ages EIERN e R705 I lt ISVHPD RU ES 6 10 C DDC5VD 4 C 0 SDAB 4 2 TOKEYO 1 2 E c709 ID ow KEY1 LED BL 8 et Jor T 4 2 i 2 di A 700 d THE ZA SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR e LG ELELTRONILS THE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC LGElectronics er EA cr o MODEL gn DATE sa iGEectoncs UG ELECTRONICS BLOCK SHEET 7
7. an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead 3 Keep the soldering iron tip clean and well tinned 4 Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F b Heat the component lead until the solder melts c Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts c Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the ci
8. feed back to the primary through photo transistor Copyright 22007 LG Electronics Inc All right reserved 11 Only for training and service purposes LGE Internal Use Only ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP WinEDID V 1 0 CS Port Setup Windows 98 gt Doesn t need setup Windows 2000 XP gt Need to Port Setup This program is available for LCD Monitor only 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button C Click Write button c Remove all default number d Add 300 3FF e Click Start button f Click Exit button Copyright 2007 LG Electronics Inc All right reserved 12 Only for training and service purposes SEET SERVICE OSD 1 Turn off the power switch at the right side of the display 2 Wait for about 5 seconds and press MENU POWER switch for 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a CLEAR ETI To initialize using time c Auto Color W B balance and Automatically sets the gain and offset value p
9. x 864 V Lines 75 000 900 864 1 3 32 9 H Pixels 108 0 63 981 1688 1280 48 112 248 1280 x 1024 V Lines 60 02 1066 1024 1 3 38 10 H Pixels 119 64 674 1840 1680 48 32 80 1680 x 1050 V Lines 59 883 1080 1050 3 6 21 11 H Pixels 146 25 65 290 2240 1680 104 176 280 1680 x 1050 V Lines 59 954 1089 1050 3 6 30 12 H Pixels 148 50 67 50 2200 1920 88 44 148 1920 x 1080 V Lines 60 1125 1080 4 5 36 Copyright 2007 LG Electronics Inc All right reserved es LGE Internal Use Only Only for training and service purposes DISASSEMBLY Set 1 Change your lock on the product as it follows and turn it in the arrow direction 1 2 3 Separate the stand after separating 2 screws by using 1 Pull the front cover upward a driver as figure 2 Then let the all latches are separated 3 Putthe front face down 5 Disassemble back cover Copyright 2007 LG Electronics Inc All right reserved 8 Only for training and service purposes LGE ER BLOCK DIAGRAM A3 a npow ASTI NE E NEE ZHNSTE TT WO yselg jeysA15 10 2 19U95 19019 928JJ91UI jueure uequug euin 9ued esuodsay SOA NEE WOAd33 195 vas au bug 998J19 U NEE ena au 6ug Buisse 0Jd Ae ds q T d1 T48SNWASL sduie EFE Jo 8 5 a Bojeuy LGE Internal Use Only Copyright 6 2007 LG Electronics Inc All right reserved Only for t
10. Digital 3 2 Video Input Signal 1 Type R G B Analog 2 Voltage Level 0 0 7 V 3 Input Impedance 75Q 3 3 Operating Frequency Horizontal 30 83kHz Vertical 56 75Hz Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 4 MAX RESOLUTION Analog Digital 1920 x 1080 60Hz 1920 x 1080 60Hz 5 POWER SUPPLY 5 1 Power Adaptor Built in Power Input AC 100 240V 50 60Hz 1 0A 5 2 Power Consumption MODE H V SYNC VIDEO POWER CONSUMPTION LED COLOR less than 45 W max POWER ON NORMAL ON ON ACTIVE RED less than 42 W typ STAND BY OFF ON OFF less than 1 W FLICKER SUSPEND ON OFF OFF less than 1 W FLICKER DPMS OFF OFF OFF OFF less than 1 W FLICKER POWER S W OFF less than 1 W OFF 6 ENVIRONMENT 6 1 Operating Temperature 10 C 35 C 50 F 95 F 6 2 Relative Humidity 1096 8096 Non condensing 6 3 MTBF 50 000 HRS with 9096 Confidence level Lamp Life 50 000 Hours Min 7 DIMENSIONS with TILT Width 516 4 mm 20 33 Depth 198 mm 7 80 Height 396 mm 15 59 8 WEIGHT with TILT SWIVEL Net Weight 8 8 kg 8 44 Ibs Gross Weight 5 32 kg 11 82 Ibs 2 LGE Internal Use Only PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are important for safety These parts are marked on the schematic diagram and the replace
11. N2 CHECK CRYSTAL X501 PULSE yes CHECK U201 Waveforms 1 U605 5 6 2 IC1 3 3 IC1 1 D U201 2 Tek Run 10 0kS s Sample Tek Run 10 0kS s Sample Tek Run 10 0kS s Sample Tek SUJE 4 006575 36 Acqs E T 1 E F S E er d E T 1 Sat sun CERT pr ee Sat TA O 1 V uak ad Y V t t n 1 Mi Si V E NE Gore NEN EC CER EE an non EE apr aid Cory rooms GER CRT s apr 2006 ur are rm citet OR 5 Apr 2006 id ee Copyright 2007 LG Electronics Inc All right reserved pyright 9 14 LGE Internal Use Only Only for training and service purposes 2 NO RASTER OSD IS NOT DISPLAYED LIPS 2 NO RASTER OSD IS NOT DISPLAYED CHECK P605 VOLTAGE PIN5 6 5V YES CHECK P605 PIN9 YES CHECK P605 PIN10 CHECK PULSE AS CONTACTING PROBE TO THE LAMP WIRE OF THE YES REPLACE LCD MODULE Waveforms NO NO CHECK POWER BOARD LIPS NO CHECK U201 INVERTER ON OFF PORT NO 1 CONFIRM BRIGHTNESS OSD CONTRL STATUS 2 CHECK MICOM DIM ADJ PORT gt POWER BOARD LIPS WE iv 1 P605 5 6 Tek Run 10 0kS s Sample E Mio 0ms Glitch Chi 2 P605 10 lek Kun 50 0K87s Sample E ty 5 Apr 2006 08 49 27 mee ti
12. RIC SHOCK If you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE CONDUIT etc To Instrument s exposed METALLIC PARTS W 1 5 Kohm 10W LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE f unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard
13. Website http biz LGservice com E E mail http www L GEservice com techsup html COLOR MONITOR CHASSIS NO LM91G MODEL FLATRON W2243S W22435 V Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL CONTENTS SPECIFICATIONS EEN 2 ADJUSTMENT ae a bii aii 14 SE 4 TROUBLESHOOTING GUIDE enne 16 TIMING CHART een B WIRING DIAGRAM nennen 19 DISASSEMBLY espais 9 EXPLODED VIEW 20 BLOCK DIAGRAM RemecppI cet tstentieereaeaes 11 REPLACEMENT PARTS LIST erte 22 DESCRIPTION OF BLOCK DIAGRAM 12 SCHEMATIC DIAGRAM erret 26 SPECIFICATIONS 1 LCD CHARACTERISTICS Type TFT Color LCD Module Active Display Area 22 inch diagonal Pixel Pitch 0 285 H x 0 285 V Size 459 4 H x 296 4 V x 16 5 D Color Depth 16 2M 6bit Hl FRC color Electrical Interface LVDS Surface Treatment Operating Mode Backlight Unit Anti Glare Hard Coating 3H Normally White 4 CCFL N OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio gt 5 Left 80 min 85 Typ Right 80 min 85 Typ Top 80 min 85 Typ Bottom 80 min 85 Typ 2 2 Luminance 180 Typ Typ 30 sRGB 220 min 300 Typ 6500K 150 min 9300K 2 3 Contrast Ratio 500 min 1000 Typ DFC 30000 1 Typ ce SIGNAL Refer to the Timing Chart 3 1 Sync Signal Type Separate Sync SOG
14. d Discharging the picture tube anode 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage 4 Do not spray chemicals on or near this receiver or any of its assemblies 5 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 1096 by volume Acetone and 9096 by volume isopropyl alcohol 9096 9996 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 6 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 7 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 8 Always connect th
15. e test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the as
16. er nnns BN LIOV Che Sb oni Msn CHEN BEOMV 26 May 2006 Chi san 08 05 02 3 LAMP CURRENT Tek BIER 10 0MS s 878 Acqs E F DEEN a 17 0 V Cl Freg 48 135kH2 VI CHT 12V 5 Apr 2006 09 12 50 Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 15 LGE Internal Use Only 3 NO RASTER OSD IS NOT DISPLAYED MAIN NO RASTER OSD IS NOT DISPLAYED CHECK U201 NO PIN51 3 3V PIN53 1 8V YES U201 NO CHECK U201 1 8V U601 3 3V 1 PIN 1 2 14 3MHZ YES CHECK U201 PIN16 H SYNC AND NO 1 CHECK PIN 1 2 SOLDERING CONDITION 2 CHECK X501 3 TROUBLE IN U201 PIN17 V SYNC IS PULSE APPEARED AT SIGNAL PINS YES TROUBLE IN CABLE OR LCD MODULE Waveforms 4 U2014H Tek BEE 4 000875 36 Acgs t la 3 46 v Ier 350 v tren 14 3369MHz Logg M25 0ms CHT S200 s Apr 2006 09 00 08 CHECK CONNECTION LINE FROM D SUB TO U201 Copyright 2007 LG Electronics Inc All right reserved 16 Only for training and service purposes LGE Internal Use Only 4 TROUBLE IN DPM TROUBLE IN DPM 2 SYNC PULSE YES CHECK R619 AND R612 SYNC NO APPEARED YES 1 CHECK U201 PIN16 17 NO CHECK PC PC IS GOING INTO DPM MODE
17. ment parts list It is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or electric shock as this will result in damage to the Screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel A CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes A WARNING BE CAREFUL ELECT
18. opper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges LGE Internal Use Only TIMING CHART Video Sync MODE H V ES Eus N Frequency Period Active Dun Mation Foch ne Resolution E Time A D C B 1 H Pixels 28 321 31 468 900 720 18 108 54 720 X 400 V Lines 70 08 449 400 12 2 35 2 H Pixels 25 175 31 469 800 640 16 96 48 640 x 480 V Lines 59 94 525 480 10 2 33 3 H Pixels 31 5 37 5 840 640 16 64 120 640 x 480 V Lines 75 500 480 1 3 16 4 H Pixels 40 0 37 879 1056 800 40 128 88 800 x 600 V Lines 60 317 628 600 1 4 23 5 H Pixels 49 5 46 875 1056 800 16 80 160 800 x 600 V Lines 75 0 625 600 1 3 21 6 H Pixels 65 0 48 363 1344 1024 24 136 160 1024 x 768 V Lines 60 0 806 768 3 6 29 7 H Pixels 78 75 60 123 1312 1024 16 96 176 1024 x 768 V Lines 75 029 800 768 1 3 28 8 H Pixels 108 0 67 500 1600 1152 64 128 256 1152
19. poses LGE Internal Use Only LIPS Board Block Diagram 50 60Hz EMI INPUT RECTIFIER ENERGY Britt OUTPUT RECTIFIER COMPONENTS AND FILTER TRANSFER AND FILTER LINE 100 240V PWM PHOTO SIGNAL CONTROL COUPLER Collection CIRCUIT ISOLATION ION PRIMARY SECONDARY Operation description Power EMI components This part contains of EMI components to comply with global marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor and of course the primary protection fuse 2 Input rectifier and filter This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized and also the over power protection is also monitor by this part 5 Photo Coupler isolation This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage 6 Signal collection This part function is to collect the any change from the DC output and
20. raining and service purposes DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is from 28MHz to 148MHz in W2243S case 28MHz to 148MHz In W2243S CASE This part consists of the Scaler ADC convertor TMDS receiver and LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1920 X 1080 resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V and one 1 8V regulators to convert power which is provided 5V in Power board 22V is provided for inverter 5V is provided for LCD panel and micom in W2243S case Also 5V is converted 3 3V and 1 8V by regulator Converted power is provided for IC in the main board The inverter converts from DC22V to AC 700Vrms and operates back light lamps of module in W2243S case 3 MICOM Part This part is include video controller part And this part consists of EEPROM IC which stores control data Reset IC and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in EEPROM Copyright 2007 LG Electronics Inc All right reserved 10 Only for training and service pur
21. rate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the c
22. rcuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board 3 Bend into a U shape the replacement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection Power Output Transistor Device Removal Replacemen
23. ress key for over 3 sec AGING Select Aging mode on off Module To select applied module NVRAM INIT EEPROM initialize 24C16 press key for over 3 sec R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually 9 R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B Gain value manually Analog Only d b d e o a WH Video Signal Generator OR Ac OOoOoeoooooooeoeo 9 O OJO O O O O O OD PARALLEL PORT OFF e ON DV Power inlet required Control Line Power Select Switch ei i le ON 110V 220V WEISSE 4 Power LED 080 Sech z lt E V Sync On Off Switch Switch must be ON Figure 1 Cable Connection Copyright 2007 LG Electronics Inc All right reserved 13 Only for training and service purposes EGE imemal Use Only TROUBLESHOOTING GUIDE 1 NO POWER NO POWER POWER INDICATOR OFF CHECK POWER BOARD H CHECK P605 VOLTAGE NO AND FIND OUT A SHORT PIN5 PING 5V POINT AS OPENING EACH POWER LINE 2 IS IC1 PIN3 1 8V NO CHECK IC1 1 8V 3 IC1 PIN1 3 3V IC1 3 3V LINE ves NO 4 CHECK U201 PI
24. sembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device LGE Internal Use Only General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F 2 Use
25. t 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 Bend the two remaining leads perpendicular y to the circuit board 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures LGE Internal Use Only Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to sepa
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