LAURELL 650M SPIN COATER USER MANUAL
Contents
1. Improper installation of two simultaneous o rings on the fragment adapter 4 Close the lid 5 Press START key to start a program The program will not start until the vacuum hold down requirement is met the seal purge requirement is satisfied exhaust flow is correct if needed and the lid is closed The program will stop automatically if the lid is opened or the N2 motor seal purge is not satisfied lt 60 PSI or exhaust drops or increases beyond the set point or the vacuum requirement for hold down is not maintained The remaining process time will be maintained 6 Done will be displayed when the process is completed and the lid has not yet been opened for wafer removal Restarting the same sequence on the same wafer is not allowed until the lid is opened or the EDIT key is pressed then the RUN key 7 Clean up after yourself see cleaning section on the last page PLEASE NOTE Regarding Vacuum Chucks Maximum spin speed is dependent on substrate size shape and weight in conjunction with chuck diameter vacuum holding area and weight All substrates regardless of size or shape MUST BE CENTERED ON THE VACUUM CHUCK Off centered substrates will cause vibration at high spin speeds and may cause a loss of vacuum Examples A small fragment may be able to spin up to 12krpm if the proper sized fragment adapter is used A 100mm 150mm wafer should be limited to 6krpm if a small chuck is used Th2. LAURELL 650M SPIN COATER USER MANUAL Can spin up to 6 wafers or 5 x5 samples at 12 00rpm max A KEYPAD All operator actions are initiated through the membrane switch keypad figure 3 5 Title Bar 10 13 12 14 15 Figure 3 5 KEYPAD STOP ian flood or spray solvent such as acetone or any other t of cleaner directly onto the keypad surface Doing so may cause keypad failure Always wet a wipe or cloth with the solvent and gently wipe the keypad surface B RUNNING THE SPIN COATER 1 Press SELECT PROCESS key 2 Press RUN MODE key to enter a selected program 3 Open the lid Check the o ring for any damage or chemical build up Ensure that there is no chemical beyond the o ring going into the vacuum path If necessary wet a cleanroom wipe with IPA and gently clean the o ring DO NOT SPRAY CHEMICALS ANYWHERE NEAR THE SPIN COATER Place and align a substrate on the chuck for wafers use the align tool Press the VACUUM key to activate the vacuum valve YOUR SAMPLES MUST COMPLETELY COVER THE O RING USE THIS CHUCK FOR SAMPLES 2 6 IN DIAMETER ti USE THIS ADAPTER CHUCK FOR SMALLER SAMPLES LIKE GLASS SLIDES The fragment adapter must be installed with a single o ring for fragments The inside o ring is for fragments 2 11mm x 11mm The outside o ring is for fragments 2 20mm x 20mm Only 1 size o ring should be installed in the adapter at any one time gt
3. e same size wafers may be spun faster if the chuck is the same diameter as the wafer 200 300mm wafer depending on chuck size should be limited to 2 5 3 5krpm if smaller than wafer C PROGRAMMING THE SPIN COATER 1 Turn on the spin processor The 650 will initialize and default to the Select Process screen 2 If editing an existing program highlight the desired program If creating a new program highlight the empty line Press the Edit Mode key If this is a new program a program name will be assigned The program name will appear on the title line 3 Use the navigation keys to move from line to line or the tab lt or tab gt key to move to field to field The TAB key enables the field to be editable Make changes to the field by using the UP or DOWN arrow keys 4 Add or delete steps by highlighting the steps field with the Tab key and increase or decrease the number 5 Move from step to step by using the FWD or REV keys 8 When finished press the Run Mode key to run the program Example Program Program Coat_1 Valve Identification 4 aa oOo e W NO gt FIG H 1500 Spin off excess material Spin speed same as step 1 Dispense for 1 5 sec G H 2000 OY film Se D CLEANING THE SPIN COATER 1 Cover the vacuum chuck with a dummy sample or plastic blank provided clear plastic 2 di
4. sk Again be sure the sample completely covers the o ring 2 Wet a cleanroom wipe with acetone and wipe out the chamber be sure to get all of the photoresist out If you spilled any photoresist on the outside chamber lid or display wipe them off as well Dispose of the wipes in the appropriate waste container 3 Dry out the chamber with dry cleanroom wipe CAUTION 1 The vacuum path is not designed for any pressure Air pressure or any liquid forced or drawn into the vacuum chuck will very likely damage the vacuum sensor seals motor and electronics This type of damage is not covered by our warranty 2 DO NOT FLOOD THE AREA BETWEEN THE STATIONARY SEAL AND THE ROTATING SEAL THIS CAN CAUSE MOTOR OR ELECTRONICS DAMAGE See Fig 4 1 COVERED CHUCK FOR CLEANING WAFER CHUCK ROTATING SEAL STATIONARY SEAL DO NOT FLOOD IN THIS AREA Figure 4 1 3 Care should be taken not to flood the process chamber during cleaning 4 It is VERY important not to allow chemicals or chemical cleaners to enter the vacuum path 5 NEVER flood or spray solvent such as acetone or any other type of cleaner directly onto the keypad surface DOING SO MAY CAUSE KEYPAD FAILURE Always wet a wipe or cloth with the solvent and gently wipe the keypad surface
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