SB300 FOSB (Front Opening Shipping Box) for 300 mm
Contents
1. SB300 FOSB FOR 300 MM WAFERS Recommendations The primary hold down is for use in applications where the FOSB advances forward to engage the feature The secondary hold down can be used in load port as well as AMHS applications Use of the hold down features is recommended to ensure the FOSB cannot be removed from process equipment prior to process cycle completion and to prevent the FOSB from falling or being knocked off of transport equipment Related Specifications and Documents e SEMI E47 1 Sensor Pads Sensor pads are used to verify FOSB presence and proper placement Recommendations For accurate operation use only the recommended sensor pads Related Specifications and Documents e SEMI E1 9 E47 1 FEOL and BEOL Pads FEOL front end of line and BEOL back end of line pads are used to prevent FEOL pods from being processed on BEOL load ports and vice versa to prevent cross contamination of wafers Recommendations Use of a pin on equipment to provide a physical obstruction in the FEOL or BEOL positions is rec ommended rather than a presence sensor Related Specifications and Documents e SEMI E1 9 E47 1 E15 1 ENTEGRIS INC General Use Instructions Manual Assembly Proper manual assembly of the door to SB300 FOSB is accomplished by aligning the right or left vertical edge of door to the shipper box opening see Figure 6 EA Figure2. 415 8 mm 16 37 39 3 mm 385 2 mm 15 16 1 55 e 363 7 mm 14 32 I 258 0 mm 10 16 4 Bii 25 5 mm 1 00 T 330 13 0 165 2 mm I 332 8 mm 13 1 a 65 Facial 336 8 mm 13 26 ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS SB300 FOSB FOR 300 MM WAFERS Equipment Interface The 58300 FOSB provides interoperability across a variety of equipment This section provides an overview of one of the most common interfaces Door a load port and then discusses the door interface registration features and interfacing recommendations il L Port door K Latch keys Load Port Interface Primary hold down A load port is a piece of equipment commonly used to provide an interface between a FOSB and a piece of process equipment Basic load port features are provided below Kinematic couplin Features pins Most load ports incorporate many of the same basic features These general features defined in SEMI standard E15 1 include Door registration pins e Kinematic coupling pins Port door atch keys Primary hold down
3. Standard Operation Basic load port operation is outlined below Operation of individual load port models will vary e The FOSB is placed on the load port and located by the kinematic coupling pins e The load port advances the FOSB to the port door engaging the primary hold down to retain the FOSB on the load port The door registration pins locate the FOSB door The latch keys turn 90 to unlatch the FOSB door The port door and FOSB door are removed leav ing the wafers accessible to the process tool This basic procedure is reversed after the process tool replaces the wafers in the FOSB 10 ENTEGRIS INC Door Interface Points Registration Hole and Slot The registration hole and slot are used to properly locate the door Registration pins on load ports interface with the round registration hole and angled slot to ensure correct door location The hole and slot must both be used to properly locate the door See SEMI E62 Automated Key Slots Automated key slots are used for automated actua tion of door latches and for retention of the door The key slots accommodate standard T type keys The keys are inserted into the key slot and rotated 90 counterclockwise as viewed from the FOSB to unlatch the door In this position the keys securely hold the door for removal When the door is replaced in position rotating the keys 90 clockwise as viewed from the FOSB side of the in
4. Standard Two pack The standard package for SB300 delivery from our factory to the customer with unattached accessories is shown in Figure 1 All parts are single bagged Outer Box Entegris part FLA 054 01 Dimensions 680 mm L x 415 mm W x 365 mm H 26 77 L x 16 34 W x 14 37 H Corrugated pad Entegris part FLA 052 03 Dimensions 398 7 mm L x 337 82 mm 15 5 L x 18 3 W This package was designed to fit a standard pallet size of 1100 mm x 1100 mm without overhang Pallet layers contain eight units maximizing utiliza tion of pallet space NOTE This secondary packaging is not designed to ship the SB300s with wafers 4 ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Assembly Instructions 58300 Options Auto Flange To install the auto flange Shell opening 1 Locate tab on auto flange part number SP300 1003 2 Insert auto flange on the top of SB300 with tab facing to the SB300 door opening 3 Pull push the auto flange until the snap is through the opening on the SB300 shell Side Handles To install 30 degree handles 1 Locate the snap detail on the side handle part number SP300 0900 2 Place the side handle so both the snap detail and the leading tab of the handle are under the support loops of the shell 3 While supporting the front of the SB300 push the handle further into the support loops on the shell until the snap detail has locked into position To install 90 degree hand
5. 6 Grip the door and shipper box along the vertical edge pivot edge with one hand and rotate the door until the wafer cushion contacts the wafers Latch the lock on the pivot edge first by rotating the cam counter clockwise 90 using the tabs available manual latch keys or optional D rings Apply inward pressure to the opposite side of the door until it is flush to the shipper box opening and latch closed using the same procedure It is possible to assemble the SB300 when seated on a horizontal Kinematic Coupling plate how ever to aid in assembly Entegris recommends that the shipper box be placed on an angled surface of 15 75 degrees as shown in Figure 7 Support to prevent tipping Figure 7 ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Both the bottom Kinematic Coupling surface and back surfaces of the shipper box should be sup ported when on the angled work surface Selection of most suitable angle to be used is dependent on the height of the assembly workstation By using this method of assembly errors are greatly minimized However it is also required that a visual inspection be performed after each assem bly to make sure that the wafers are properly engaged with the cushion in the door This is most easily done when viewing the wafers and cushion through the center of the door Note Assembly of the door should never be attempted with the shipper box on its back with the wafers in a completely ve
6. and design are up to the carrier maker The features of the FOSB that mate with an E62 FOSB door opener are defined by the Entegris design specification In general this compatibility involves proper clearance around and location relative to the E62 FOSB door opener features Since the force required to attach the door to the shell is greater than the door closure force designated by SEMI E62 the SB300 is designated as FIMS compatible SEMI M31 0999 Provisional Mechanical Specification for Front Opening Shipping Box FOSB used to Transport And Ship 300 mm Wafers SEMI M31 0999 is a standard that partially speci fies the FOSB used to ship 300 mm wafers from wafer suppliers to their customers typically IC manufacturers In this standard only the physical interfaces for the FOSB are specified no material requirements or micro contamination limits are given This standard assumes that the FOSB is used in the last process in wafer manufacturing in acceptance and inspection and in transferring the wafers from a FOSB to a FOUP Front Opening Unified Pod or open cassette inside an IC manu facturing process The FOSB is not intended to be used in IC manufacturing processes SEMI E106 Provisional Overview Guide for Physical Interfaces and Carriers for 300 mm Wafers SEMI E106 describes the complex interdependen cies among SEMI standards for 300 mm physical interfaces and carriers and explains how standards apply to specific p
7. today to learn what Entegris can do for you Visit www entegris com and select the Customer Service link for the center nearest you Terms and Conditions of Sale All purchases are subject to Entegris Terms and Conditions of Sale To view and print this information visit www entegris com and select the Legal Notices link from the footer Product Warranties For Product Warranties visit www entegris com and select the Legal Notices link from the footer Entegris the Entegris Rings Design and Creating a Material Advantage are trademarks of Entegris Inc Viton is a trademark of DuPont Dow Elastomers L L C SEMI is a trademark of Semiconductor Equipment and Materials International Corporation ENTEGRIS INC Corporate Headquarters 129 Concord Road Billerica MA 01821 USA Customer Service Tel 1 952 556 4181 Customer Service Fax 1 952 556 8022 In North America 800 394 4083 www entegris com Entegris 2013 Entegris Inc All rights reserved Printed in USA 5550 7429ENT 0713 creating a material advantage
8. MICROENVIRONMENTS e Entegris I Ip User manual Table of Contents Introduction 2 eod ee err e SEES RRR aS So MUR M FIMS Compatibility eese Automated Ergonomic Handling Identification e Gleanability reri Secondary Packaging Standard Two pack se Assembly Instructions 58800 0 asinna Datum Orientation Horizontal Datum Facial Talit Bilateral Datum ee X Y and Z Dimensions DUPUGUUPE evi ER e pain SEMI Standards reete ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Specifications ss sss sss s esse eee e sees seene 9 Equipment Interface 10 Load Port 10 Features eesesseeeee Hen 10 Standard Operation 10 Door Interface Points 11 Bottom Interface Points 1 General Use Instructions 13 Manual ASsoembly 18 D ring 18 For More Information 14 Terms and Conditions 14 P
9. les shown in view to the right Locate the snap detail on the side handle Place the side handle against the SB300 so that the snap detail at the base of the handle is under the lower KC plate side support loop of the SB300 Move the handle downward so that the snap detail at the top of the handle is under the upper support loop Move the handle upward until the snap detail at both top and bottom of the handle are locked into position EA Info Pad To install the info pads 1 Locate the flat side of the info pad part number 01 031822 2 Align the flat portion of the info pad with the flat portion on the KC plate info pad hole 3 Place the snap features into the desired info pad hole and push the info pad into position until an audible snap is heard The info pad will sit flush with the surface of the KC plate after installation ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Datum Orientation Horizontal Datum The horizontal datum is located near the bottom of the carrier Figure 1 Frame location for the purpose of automated transfer in and out of the cassette is defined in the Z direction relative to this datum Facial Datum The facial datum is a vertical plane centered on the film frame and oriented left to right It is used as a reference for front to back Y dimensions Bilateral Datum The bilateral datum is a vertical plane centered on the wafers and orie
10. lifetime identification and traceability e Clear polycarbonate door and shell allow visual observation of wafers nfo pads to detect FOSB differences e Built in horizontal RFID holder in KC plate Vertical RFID holder optional Colored door panels optional Cleanability Designed for liquid flow through and drying Complete door assembly can be cleaned without disassembly ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Components and Materials Door Number Component Material Quantity 1 Wafer strip Thermoplastic elastomer TPE 1 9 Wafer cushion Polycarbonate PC 1 3 Gasket Thermoplastic elastomer TPE 1 4 Corner guides Catalogue POM 4 5 Door housing Polycarbonate PC 1 6 Lift arms PTFE filled polycarbonate white 4 7 Latch arms Acetal POM 4 8 Latch cams PTFE filled polycarbonate white 2 9 Latch cover Polycarbonate PC 2 AO ENTEGRIS INC 3 SB300 FOSB FOR 300 MM WAFERS Shell Number Component Material Quantity 1 GM NEL du _ RM M E d 7 1 Shell housing Polycarbonate PC 1 2 Polybutylene 1 t terephthalate PBT 3 KC plate Polycarbonate PC 1 4 Filter housing Polycarbonate PC 1 5 O ring Viton 1 6 Filter media Electrostatic media 1 7 Auto flange Black polycarbonate 1 optional PC 8 Side handles Black polycarbonate 2 optional PC 9 Info pads Black polycarbonate 4 optional PC Secondary Packaging
11. matic coupling pins protrude through the horizontal datum A FOSB cannot be effectively opened closed loaded or unloaded unless it is properly positioned on a kinematic coupling Datum Orientation Relative to an SB300 FOSB The base of the SB300 FOSB is located slightly above the horizontal datum Figure 5 The bilateral datum and facial datum intersect the FOSB vertically ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Front of Pod 120 mm 4 72 c Facial datum B m 2 80mm P 3 15 BA E a 2 15 Aba m i Figure 4 Top view of kinematic coupling puce T Bilateral Facial datum datum Horizontal datum Figure 5 Datums and kinematic coupling SB300 FOSB FOR 300 MM WAFERS SEMI Standards Provided below is a brief description of each applicable SEMI standard and how it applies to the SB300 Please contact your local Entegris representative for information on specific SEMI standard compliance issues SEMI E62 Provisional Specification for 300 mm Front Opening Interface Mechanical Standard FIMS SEMI E62 describes the features and basic function of the FOSB door opening mechanism E62 is a very specific standard for the configuration of the equipment including registration pins seal zones and latch key shape position motion and torque The 300 mm FOSB must function with these features but the precise mating feature size position
12. nted front to back It is used as a reference for left to right X dimensions X Y and Z Dimensions X dimensions are horizontal left to right Y dimensions are horizontal front to back Z dimensions are vertical Structure Datum Orientation Relative to the First Wafer All 800 mm wafers when fully seated in the shipper are nominally centered on the vertical line formed by the intersection of the bilateral datum and the facial datum Figure 2 The bot tom of the first wafer located in the lowest pocket of the FOSB is located nominally at 44 mm above the horizontal datum Wafer Spacing Each wafer above the first wafer is located nominally at 10 mm spacing The tolerance for vertical wafer location is 0 5 mm for each wafer Figure 3 The tolerance is non accumulative Left to right Front to back Y X TY Bilateral Facial datum datum Nom c n Figure 1 Datum orientation Bilateral Facial datum datum L Horizontal datum Figure 2 Datum structure Bilateral datum Figure 3 Wafer spacing and tolerance X Up Z 44mm 0 5 mm 0 5 mm ENTEGRIS INC Kinematic Coupling Pins Relative to All Datum The horizontal datum is defined by the kinematic coupling Figure 4 The machine side of the kine matic coupling consists of three pins of a specified shape in a specified pattern relative to the bilateral datum and facial datum The kine
13. roduct Warranties 14 1 SB300 FOSB FOR 300 MM WAFERS Introduction The SB800 is an innovative 300 mm shipper designed to offer the benefits associated with manual and FIMS compatible automation handling in a FOSB The dual functionality of the door allows users to easily move from manual operation to FIMS Features Terminology s FIMS Front Opening Interface Mechanical Standard is the specification characterizing the automated interface between a FOSB and related equipment as defined by SEMI9 E62 e FOSB Front Opening Shipping Box is a wafer shipping box with a front opening interface as defined by SEMI M31 FIMS Compatibility Provides FIMS automation benefits in a FOSB Reduces labor costs associated with manual door operation Allows maximum 300 mm loadport interoperability e Ensures accurate equipment interaction Secure Wafer Protection Automated operation minimizes potential contamination from human interaction e Wafer plane accuracy Ultrapure low outgassing materials provide superior protection for wafer shipment e Protects wafers during 1 5 m drop tests e All plastic assembly prevents metallic contamination and corrosion Ergonomic Manual Handling Door design allows safe and easy opening and closing in manual mode e Ergonomically designed side handles allow safe carrying of the box Identification Innovative insert molded barcode ensures
14. roducts SEMI E47 1 Provisional Mechanical Specification for Boxes and Pods used to Transport and Store 300 mm Wafers SEMI E47 1 is a standard that applies to various types of 300 mm pods The outside shape and over all pod size are limited by this standard Equipment automation and human interface features are also defined by the standard SEMI E57 Provisional Mechanical Specification for Kinematic Couplings used to Align and Support 300 mm Wafer Carriers SEMI E57 describes the equipment side of the kine matic coupling that is the universal equipment interface for all types of 300 mm wafer carriers This standard describes very specifically the shape and position of three pins The 300 mm carrier must have features which register with these pins but the shape of these features is up to the carrier maker to design The test of a wafer carrier s compliance to E57 can only be made by placing that carrier on a fixture that is compliant to SEMI E57 and measuring the locations of features relative to the resulting datum structure ENTEGRIS INC Specifications Wafer size 300 mm 11 81 diameter e Wafer capacity 25 Wafer spacing 10 mm 0 40 Wafer carrier type FOSB Overall dimensions Height from horizontal datum plane including auto top flange 336 93 mm 13 265 Width 385 17 mm 15 164 Width with handles 415 369 mm 16 369 Depth 332 77 mm 13 101
15. rtical position as this can result in cross slotting and wafer break age see Figure 8 Figure 8 D ring Handles Manual D ring handles are used for manually disengaging the door latches and for retention of door The D ring handles also incorporate automated key slots for automated operation The D rings are simply lifted and then rotated 90 clockwise to unlatch the door In this position the D rings provide a secure handle for removing and replacing the door When the door is replaced in position rotating the D rings keys 90 counter clockwise engages the door latches Recommendations Make sure the door is properly seated before engaging the latches Environmental Conditions The SB 300 FOSB is packaged to meet industry accepted cleanroom protocols This packaging can be used for storage until ready for use Storage temperature should not exceed 70 C 158 F Utilize your cleanroom protocol as a guide for removing Entegris packaging material Product Reuse If the FOSB is properly handled and maintained it is capable of being reused In order to maximize the number of reuses the following guidelines should be followed Door and shell should be thoroughly cleaned after each use e The door gasket wafer cushion and wafer strip should be replaced after each use e Thoroughly inspect the FOSB for damage or excess wear prior to reuse For More Information Please call your Regional Customer Service Center
16. terface engages the door latches and allows the keys to be removed To operate properly the FOSB must be advanced so it is within 0 5 mm of the load port bulkhead see SEMI E62 Torque required for key operation is 4 4 Newton meters maximum ENTEGRIS INC SB300 FOSB FOR 300 MM WAFERS Bottom Interface Points Kinematic Coupling The kinematic coupling is used to precisely locate the FOSB on equipment It incorporates kinematic coupling grooves that accommodate both standard inner and outer kinematic coupling pins Recommendations The kinematic coupling is the only acceptable interface mechanism for FOSBs and equipment load ports The primary outer pins offer increased stability and accuracy and are therefore recom menced for load port interface The inner pins are less accurate and are recommended for use only in AMHS applications Related Specifications and Documents e SEMI E57 Hold Down Features The hold down features are used to retain the FOSB in position Two sets of features are pro vided The primary hold down feature located on the front of the FOSB is a passive restraint that engages when the FOSB is advanced The second ary hold down feature is an active restraint utilizing a keyway slot that accommodates a stan dard t shaped key The key is inserted into the keyway slot and rotated 90 in either direction to hold the FOSB in place
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