User`s Manual
Contents
1. Substrate Interface Diameter PCB Interface Diameter 0 1 SolderBallMak st Solder Ball Material Name Solder Ball Mesh Controls Number of Elements Through Height 1 Mesh Seed Constraint C FREE 8 FINER C FIXED Include Quad Partitions YES 9 NO Cancel Solder Ball Attributes Ball Mame SolderBall Square Solder Ball Height TRE Solder Ball Width 0 14 Solder Ball Material Mame SolderBallmat Solder Ball Mesh Controls Solder Ball Element Size 0 1 Number of Elements Through Height i Mesh Seed Constraint FREE 8 FINER 2 FIXED Cancel 32 9 4 3 MD Metal Deposition Solder Ball Editor M Solder Ball Definition MD Solder Ball Geometry Solder Ball Attributes SolderBal MD Substrate Pad jo ubstrate Pa Solder Ball Height EE Diameter Substrate Pad Substrate Interface Thickness Diameter Solder Ball Diameter 0 09 Substrate Interface Diameter 0 08 PCB Interface Diameter 0 07 EEE Solder Ball Material Mame SolderBallMat aa Solder Ball Solder Ball Diameter Height Solder Ball Mesh Controls Solder Ball Element Size 0 1 A PCB Pad Diameter PCB Pad Thickness Number of Elements Through Height 2 PCB Interface Diameter Mesh Seed Constraint OC FREE 8 FINER C FIXED PCB Pad Attributes Substrate Pad Attributes tr S PCB Pad Thickness 10 004 Substrate2. Circuit Board Modeler 115 ABAQUS For ABAQUS Version 6 6 EF1 O 2007 ABAQUS Inc User s Manual rn pt A el ra LE de m n b wm ni ag de de Er ML M tn err ua on ap Ca a Pal F x EU Pa Pu rrr 7 8 PaP ar FF Pero T T ae LT BF FJ rer rer E Farm gap HU Table of Contents BACKS TONA tec ai tte E E a ton 4 Key PCB Modeler Features and Benefits ssa rc reme t pee os ote o etus reete tou Peter udo snute 4 SUS de HC e 4 DEE Importe na et med need ie 5 ADC MOHE A a E nahata 6 A PCB Mander Boards TDN GH 6 411 BO ase itor NADU Lara pia ali 6 2 12 Board Editor Outline Taba sia kanalaid caen 7 4 1 5 Board Editor Cutout Fab Sie dt nie datant 7 4 LA Board Editor Holes Lab MD KUTT E 7 4 1 5 Board Editor Component Placement Ta ii AA eti ee ttai ed dece 7 4 16 Board Editor Mesh Controls Taba A dise RD xe qu bed E Ads 8 42 PCB Manasef Component Library TD seede 8 4 2 1 Component Activation Deactuvation roi AR 8 222 MA ASM 8 d 2 2C omponcnt EN NN 9 45 PCB Manager Solder Ball Library Tab aise nas AA os 11 A Sl Older Ball Selec isis atte es pu ida een 12 252 Ro SOIR BAIE 12 NPR 14 As E 15 A Square older Bilvrak 16 REIR US PTT nn E a ai 17 SA Model Import and Mesh GEN a ois sont iie sdero Ge 17 23 2 Solder Ball Array GENOMA teories 17 O Installation or BUS as 17 TOMT SPONSE 17 A ES ocu NR EE EE ue ET etat Un 18 2 Appendix PCB Modeler Dial E 19 9 1 PCB Manacer DAG
3. Allow the number of elements to increase only C2 Do not allow the number of elements to change Component Level Meshing Algorithm gt Advancing Front 9 Medial Axis Note For components with large arrays of solderballs Advancing Front is preferred Component Lewel Activation Activate Component 30 9 3 3 Component Editor Solder Balls Tab M Edit PCB Component Substrate Solder Mask solder M ask SM Dip Li Substrate Component Pad Solder Mask Solder Ball Interface Solder Mask Thick mes s Solder Ball Options Include solder balls Solder Ball Location Method 0 Rectangular Grid Tabular Solder ball name SolderBal Round Pitch in x direction 04 Pitch in y direction 0 6 Number of solders ball in x direction 5 Number of solders ball in v direction 2 Fill location table From pitch data 9 4 Solder Ball Editor Dialogs 9 4 1 Round Solder Ball Editor M Solder Ball Definition Round Solder Ball Geometry Substrate Interface Diameter Solder Ball Diameter hol q Height FCE Interface Diameter 9 4 2 Square Solder Ball Editor M Solder Ball Definition Square Solder Ball Geometry Solder Ball Width Solder Ball Height Solder Ball Attributes Se AE older Ball Name SolderBall Round Solder Ball Height os Solder Ball Diameter EE
4. Lar 19 Odd PCB Manacer Boards Tab Lavrans 19 912 PCB Manager Component bb ion er al l a ic EP 20 9 15 PEB Manager Solder Ball Library npo Mab tum raduno a ead ae 21 DZ serie Editor Ital OOS une M o 22 9 2 T1 Board Editor ADS Fab ass nn vUa but vm O am aa 22 9 2 2 Board Editor Ouine Lo Dies uiu da alia ia 23 9 2 9 BENET 24 22 4 Board Editor Holes Lab sj 25 9 2 5 Board Editor Component Placement Tab VU 26 92 0 Bord Editor Mesh Controls Taba tia aub Peter PS 21 9 5 Component Editor Dialogs uas na Poor A ins 28 9 5 1 Component Editor Attributes Fab A etienne 28 9 5 2 Component Editor Geometry PAD RS 20 93 59 Component Editor Mesh Controls TaD asa RS e Musee et ats NEU deute 30 9 3 3 Component Editor Solder Balls Tabo a tenons 3l 94 Solder Ball Editor DASS 2535024 aiii nao 32 9 4 1 Round Solder Ball Editor erre nnnm errar raise renan 32 9 4 2 Square Solder Ball Editor 9 4 3 MD Metal Deposition Solder Ball Editor 9 4 4 SMD Solder Metal Deposition Solder Ball Editor 1 Background This documentation describes the use of the PCB Modeler plug in for Abaqus CAE developed and supported by Abaqus South Inc The plug in is used to generate printed circuit board models by importing information stored in the Intermediate Data Format IDF The printed circuit board information is stored in two files a board file bdf and component file df Th
5. the PCB Manager dialog itself is submitted 4 2 1 Component Activation Deactivation The PCB Manager dialog shown in Appendix 9 1 2 contains a table of the components imported into Abaqus CAE sorted by component volume In Abaqus terminology these are the parts that were created during the import step Multiple part instances of these components can be placed onto the board The table permits the deactivation and activation any component The deactivation of a component results in the deac tivation of all the resulting component instances within Abaqus CAE Deactivation of components or compo nent instances does not result in the deletion of the component or instance The performance of the deletion of parts and part instances within Abaqus CAE is significantly degraded in models containing a large number of part instances hence it is recommended to deactivate components as opposed to removing them 4 2 2 Material Assignment Assignment of material properties to the components is most efficiently done from the PCB Manager dialog Multiple components can be selected from the table and assigned a single material definition simultaneously All components placed onto the board and the board itself must be assigned material properties before the 8 PCB Manager can be submitted and the model generated Submission of the material assignment dialog from the PCB Manager occurs upon submission In other words the material assignments are applied im mediat
6. 5 0 0325 0 0325 AMD 83 Sort by volume Sort by Name Cancel 26 9 2 6 Board Editor Mesh Controls Tab IM Board Editor Board ESI Attributes Placement Element Geometric Order Linear C Quadratic Element Shape Controls Hex COHex dominated Tet Board Level Component Constraints e Tie Components to Board C Merge Components with Board Note Choosing to merge all components may lead very small gaps between components which in turn may lead to meshes that are so large they can not be generated Board Level Mesh Sizes Board element size Component element size Number of elements through board thickness v Number of elements through component thickness E Board Level Mesh Seed Controls 8 allow Ehe number of elements to increase or decrease C2 Allow the number of elements to increase only C3 Do not allow the number of elements to change Board Level Meshing Algorithm Advancing Front 0 Medial Axis Cancel 27 9 3 Component Editor Dialogs 9 3 1 Component Editor Attributes Tab M Edit PCB Component Es Attributes E Geometry Mesh Controls Solder Balls Component Identification Component Mame Bead Component Number 001 Component Attributes lerecTpical Component type ELECTRICAL hul Material name BeadMat a Component height 0 25 CO
7. MPONENT Component tes NSM E 6 A R 5 Possible asia Purus Thickness edad Possible Solder Masks 28 9 3 2 Component Editor Geometry Tab M Edit PCB Component Solder Balls EE EE a ROO EEE 5 Define outline C Define cylinder Graphical Stored on Database Tabular Representation Z Coord Y Coord Angle Segment Type degrees 1 START POINT 0 0 0 0 0 0 2 LIME SEGMENT zl 0 0 0 0 LINE SEGMENT zl 1 0 0 0 4 LIME SEGMENT 0 0 1 0 0 0 5 LINE SEGMENT 0 0 0 0 0 0 Note Angle only applies to arc segment 4 positive angle indicates an arc in the clack wise direction 4 negative angle indicates an arc in the counter clock wise direction The last point must have Ehe same coordinates as the First Plot Current Outline 29 9 3 3 Component Editor Mesh Controls Tab M Edit PCB Component Attributes Geometry Mesh Controls Solder Balls Ino a 2 sures EET a a man a dar rm Rom m a a mn Component Level Constraints 5 Tie Component to Board Merge Component with Board Component Lewel Element Controls Element size 0 1 Number of elements through component thickness 2 Component Lewel Mesh Seed Controls Ce Allow the number of elements to increase or decrease
8. Pad Thickness 0 005 ace r PCB Pad Diameter 10 07 Substrate Pad Diameter 0 085 Pee ee ee uml Pcb Pad Material Mame PcbPadMat w Substrate Pad Material Name SubstratePadMat e 33 9 4 4 SMD Solder Metal Deposition Solder Ball Editor Bl Solder Ball Definition SMD Solder Ball Geometry Substrate Pad Diameter Substrate Pad Substrate Interface Thickness Diameter Solder Ball Solder Ball Diameter Height Id 11 41 1 13 111 1 4 1 1 l LIEILILILTILITIJOIIJIIII PCE Pad Diameter Thickness PZE Pad Diameter PCE Pad Attributes PCB Pad Thickness 10 004 PCB Pad Diameter 10 075 Pcb Pad Material Name PcbPadmat Solder Ball attributes SolderBall SMD Solder Ball Height Eos Solder Ball Diameter 0 09 Substrate Interface Diameter 0 08 FCE Interface Diameter 0 07 Solder Ball Material Mame SolderBallmat Solder Ball Mesh Controls Solder Ball Element Size 0 1 Number of Elements Through Height 2 Mesh Seed Constraint FREE 9 FINER FIXED Substrate Pad Attributes 0 005 0 085 Substrate Pad Material Name SubstratePadMat s t Substrate Pad Thickness Substrate Pad Diameter Cancel 34
9. S NS NE se EM ed UE Sep rom ads a a O a a LEN A a EE DB DDS LS Le De bP CER OS OE E Kd 3 Ex ls Eg OL E EI ES CES CEN OS 2 E E CO 6 0 0 9 0 0 6 6 6 26 86 0 0 DU OO 0 oO OOO OD 6 06 6 6 of 7 a 08 Q 080 QG 6 6 6 2 Oo 0 2 0 0 0 0 6 0 G 0 0 o 0 E3 E JS EX O E 814 El 56 1 E di EN El 2 BB E EE a tele laele liselt L3 SD LK OO Ky 2 a HB Bo GS LX GM Ba ES dc 0 Be 0 0 ae esma Be Ey 1094081 ER OS 2 a oOo DN 0 0 9 09 DN 6 6 OO Oo 0 0 Figure 4 2 2 3 4 Component Solder Ball Array Plot 4 3 PCB Manager Solder Ball Library Tab 11 The Solder Ball tab provides the tools to create a library of solder balls A variety of solder balls are available Once created they can be referenced from within the Component Dialog to specify the solder ball array The solder balls stored in the library can be edited copied and deleted When a solder ball is modified or deleted the plug in will scan through all of the components to see if the solder ball is used within the component If it is used the solder ball will be modified or removed from within the component This will require the component to be regenerated thus the operations of editing or deleting a solder ball can be time consuming for components with large arrays of solder balls 4 3 1 Solder Ball Selection Selecting the Create button form the solder ball library tab will bring up a dialog requiring the choice of solder balls Choosing a solder ball type and selecting Continue will bring up d
10. Substrate Solder mask Material Mame SubstratePadmMat ww SolderBall SolderMask Interface Mesh 9 Merge Independent Figure 4 2 2 3 1 Component Solder Mask Options The Component Editor provides for the specification of a solder ball array in two ways rectangular grid and tabular The grid approach requires a uniform spacing in the x and y direction although the spacing may bar and requires a single type of solder ball throughout If more than one type of solder ball is required or the spacing of the layout is not uniform then the tabular approach is required The filling of the table of solder ball locations can be facilitated in two ways Firstly if the cursor is placed in the first row and column of the blank table then a right click of the mouse will enable the table to be filled by importing a text file of locations The three columns of the text file must be separated by commas Often this type of text file is easily made available from CAD tools The second way to fill the table is to propagate the rectangular grid definition into the table by selecting the Fill gt button This button populates the table from the rectangular grid definition Once the table is populated individual entries can be modified accordingly Solder Ball Options Include solder balls Solder Ball Location Method Rectangular Grid C Tabular Solder ball name SolderBall MD Pitch in x direckian Pitch in y direction Number of solders bal
11. ard models The first two entries of the import dialog allow the user to select the board and component files The browse button automatically filters the files based on the bdf and ldf suffixes The next option is the choice of the unit of length The header of the board file specifies the unit of length for all of the information contained within the board file This means that board definition as well as the component placement information are defined using the same unit of length For every component defined in the component file the component geometry and the corresponding unit of length is specified This unit of length may differ from component to component and from the board s unit of length Typically the units of length of the board and component files are consistent throughout but the Pub Model plug in requires the user to specify the unit of length so that all information translated from these files will be translated into a single consistent unit of length The final option on the import dialog allows the user to filter out componenis based on volume A board model typically contains hundreds if not thousands of components and component placement component instance definition During this step the plug in generates an Abaqus part and an Abaqus part instance for every component definition and placement definition respectively If every component is imported this can result in very large models which are very cumbersome if not im
12. are fairly small but test all of the plug in functionality itis recommended that these be run and experimented with in order to familiarize oneself with the workings of the plug in Multiple tests may be selected to be run The QA scripts runs the tests compares to baseline results stored with the application and brings up a dialog summarizing the comparison An Abaqus CAE model named PcbTestModel is created and saved of the last test chosen Thus if a particular feature is of interest the user can scan through the test descriptions and run the test that best uses the feature of interest The resulting model PcbTestModel will be created and readily available for editing and testing Ly 8 References IDF Specification by Dave Kehmeier Intermedius Design Integration www intermedius com ABAQUS References ABAQUS Version 6 6 EF1 e Analysis Users Manual e ABAQUS Scripting User s Manual e ABAQUS GUI Toolkit User s Manual 18 9 Appendix PCB Modeler Dialogs 9 1 PCB Manager Dialogs 9 1 1 PCB Manager Boards Tab ME PCB Manager Enards i i Active Name Ed Activate All Deactivate All Skip meshing of boardis Cancel 19 9 1 2 PCB Manager Component Library ME PCB Manager Boards Active El s x El El S S El Lomponent Component Name JRe1UTU394Hx351 VHDMSROYW TH HIC Mat
13. at was imported The IDF has been developed and supported by Intermedius Design This format has become the most widely used data format for the transfer of printed circuit assembly data between PCB layout and mechanical design systems The first wide scale use of the IDF began in 1992 when version 2 0 was released Subsequent versions 3 0 and 4 0 were released in 1996 and 1998 respectively and have continued to be used as a de facto non proprietary standard format to the CAD industry Most major CAD systems support import and export of printed circuit board information to the IDF Component file ldf The component file contains a description of the geometry of all of the components that may be used on the board Components defined in this file are not necessarily placed onto the board This file is simply a library file that defines the geometry of all components that may be placed onto the board Board file bdf The board file contains the attributes of the board including the outline thickness cutouts and drilled holes Also included in this file are the placements of the components onto the board Multiple instances of an individual component can be placed onto the board Placement of the components involves translation and rotation of the component and whether it is to be positioned on the top or bottom of the board The import step reads the component and board files and generates the appropriate geometry within Abaqus CAE During th
14. d more All infor mation imported from the board and component files is made available for modification or correction from the PCB Manager dialog or other dialogs available from it 4 1 PCB Manager Boards Tab Selecting the Boards tab of the PCB Manager provides of the table of boards available in the model as shown in appendix 9 1 1 More than one board can be activated in a model The boards can be edited copied renamed and deleted The instance names of the individual boards must be unique to the board oelecting the Edit button from the PCB Manager brings up the Board Editor dialog as shown in appendix 9 2 1 4 1 1 Board Editor Attributes Tab The board material total board thickness and solder mask layers are defined under the attributes tab as shown in appendix 9 2 1 The inclusion of solder mask layers on the top and or the bottom of the board is optional If a solder mask is included the material and thickness must be chosen for each mask The PCB Modeler will subtract the thickness of the masks from the total board thickness and will partition the board at the interface between the solder mask and board then assign the appropriate material properties to both regions The use of solder masks is generally combined with solder ball creation However the solder masks may be included by themselves on the board and the components as shown in Figure 4 1 1 When used with solder balls the solder geometry will be cut out of the solder mask
15. e model resulting from the import of these data files will be geometry based fully meshed and ready for application of loads boundary conditions and other attributes required for the analysis Figure 1 1 Printed Circuit Board Photo Key PCB Modeler Features and Benefits e Fully integrated with Abaqus CAE 1 All model creation controls available from a single GUI 2 Selective merging of component and board geometries 3 Selective creation of tied constraints between components and board 4 Volume filters for import and activation of components 5 Automated mesh and region creation 1 Minimum diameter filter for import and activation of drilled holes e Versatile mesh controls hierarchy 1 Instance level overrides component level which overrides board level mesh controls 2 Controls include option to tie or merge component to board component element size mesh seed constraints elements thru thickness meshing algorithm and component activation e Solder ball array support 1 Four solder ball types in library 2 Automatic geometry mesh and section assignments of solder balls 3 Can define solder ball positions based on spacing or via a table 2 Summary The creation of a printed circuit board model using the PCB Modeler plug in consists of a two step process The first step is the import of the component and board files generated from the various CAD packages and written in the IDF The second step is to mesh the geometry th
16. ely upon submission of the material dialog and not delayed until submission of the PCB Manager Material orientations are assigned to each component and follow along with the component as it is translated and rotated onto the top or bottom of the board The orientation assignments are made regardless of whether the component is tied or merged to the board 4 2 2 Component Editor Occasionally the component information imported may be invalid For example the component file may have mistakenly assigned an invalid thickness of zero to a component The PCB Manager allows the component information to be modified by clicking on a component in the table and selecting the Edit button The Com ponent dialog as shown in Appendix 9 3 1 is brought up allowing the modification of all the attributes of the component including the thickness The Component dialog may also be brought up by selecting the Pick Edit button This option simply allows the picking of the component from the assembly as opposed to the selection from the table The model must be shown at the assembly level for this option to be available Since there are often upwards to a thousand component definitions it is usually easier to pick components of interest rather than select them from the component table 4 2 2 1 Component Editor Geometry Tab A plot of the outline of the component is shown to help diagnose potential errors in the outline Corrections to the outline may be made in the d
17. erial 1 IR34T00H181541 VPBSDWS TH CONFP Material 1 8641752 1 100M ATO BGAX I10 810 Material 1 JROGOTOGS4 0982 CPCI 13 SPEED TF Material 1 IR152502504 2500 MICTOR 152 5M R Material 1 CSxz50vY750z5650P CAP P RDL EEVFE1 Material 1 JRIOLSOSHOSS2LED RJ45 SM 2LED Material 1 1E 3015054055 RJ45 SM AMP Material 1 Material 83 Sort by volume C2 Sort by Name Activate All Deactivate All C Min Volume To Activate Appt Note Min vol 0 0001296 Max vol 3 37073536 volume j 3 8 3536 24360732 2 07929702 0 712429776 0 4725 0 404303125 2581896 2472348 Skip meshing of boardis AM Note Abagus model is out of date with PCB database Upon submission of this dialog the abaqus model will be regenerated d Cancel Pick tediti 20 9 1 3 PCB Manager Solder Ball Library MM PCB Manager Boards Component Library Saler Bal LS Felli BA TYRE SolderBall MD MD SolderBall MD 2 MD SolderBall Round SolderBall RounaPartitioned SalderBall 5MD SolderBall SMD 2 SolderBall Square Skip meshing of boardis Copy Y Rename Cancel 2 9 2 Board Editor Dialogs 9 2 1 Board Editor Attributes Tab IM Board Editor Board Component Mesh Attributes Placement Controls ttributes Attributes Cutline Board Mame Board 1 Board thickness 0 1 Board Solde
18. f magnitude smaller than the components themselves Since the meshing algorithm would be forced to fit at least a single element spanning the gap the resulting mesh density in the area would be very high resulting in an overly large mesh The alternative would be to set the component constraint for the instances in question to tie thus avoiding the unnecessarily fine mesh between the components Other examples of the mesh controls scheme might include the requirement for fine meshes on particular instances which reside in critical locations while other instances derived from the same component reside in less critical locations 4 2 PCB Manager Component Library Tab Since the creation of the mesh consumes most of the model creation time a toggle is available to allow crea tion of the geometry of the model but disallow the creation of the mesh This provides an efficient method to run through a number of model generation iterations in order to determine adequate component and compo nent instance activations If modifications are made to the board or components a note is posted on the PCB Manager dialog that the database is out of date with the current model Changes to components or the board are performed through separate dialogs which are described in more detail later When these changes are submitted through the respective dialogs the changes are immediately submitted to the data base The model is not regenerated and made up to date until
19. ialog and viewed before submission of the dialog by clicking the Plot Cur rent Outline button 4 2 2 2 Component Editor Mesh Controls Tab The component level controls are available by selecting the Mesh Controls tab of the Component Editor The available options are shown in Appendix 9 3 3 Component level mesh controls are also available from the Component dialog and are discussed in more detail in Section 4 1 6 4 2 2 3 Component Editor Solder Balls Tab A number of options related to solder balls are available through the Component Editor An option is available to include a solder mask between the component and the board A material and thick ness is assigned to the solder mask This option is available regardless of whether or not solder balls are included If solder balls are included then the solder ball geometry is cut out of the component solder mask If the component geometry is selected to be merged with that of the board then an option is available to ei ther merge the solder mask geometry with the solder balls or allow the interface between the two to remain independent Merging the geometry implies that the mesh of the mask and solder ball share the same nodes at the interface shown in red in Figure 4 2 2 3 1 Substrate Solder Mask solder Mask SH DOM O Substrate Component Solder Mask Solder Mask Solder Ball Interface Thickness Include solder mask on substrate component Substrate Solder Mask Thickness 0 005
20. ialogs specific to each type of solder ball Each dialog is shown in Appendix 9 lll Solder Ball Creation Solder Ball Mame 5 Choose Solder Ball Type SPD MD Square Continue Cancel Figure 4 3 1 Solder Ball Library Tab Each solder ball type has a different geometry The Square solder ball consists of a simple geometry which is quickly generated This type is intended for larger arrays of solder balls since the resulting solder ball may consist of a single element The SMD and MD are more complex solder balls containing board and substrate pads Because of the more complex geometries finer meshes are required and thus they are not suitable for large arrays of solder balls The Round solder ball is simple in that it does model board or substrate pads thus it can be used for larger arrays of solder balls Each type of solder ball can generate on boards and substrates with or without solder masks The geometry of the solder ball will be modified if a solder mask exists The sections below show illustrations of how each type of solder ball will be generated with and without solder masks 4 3 2 Round Solder Ball The most commonly used type of solder ball is a simple round solder ball It can be used in large arrays of coarsely meshed balls or can be meshed more finely to accurately capture the shape of a solder ball 12 The shape of the round solder ball will vary depending on whether the circuit board or the substrate con
21. is first step the Abaqus parts are generated based on the component definitions and the Abaqus instances are generated and positioned based on the placement information contained in the board file The second step of the process involves setting the controls to specify mesh characteristics board element size component element size minimum hole diameter to be included and more The options available through the plug in implement already existing underlying capabilities within Abaqus CAE The plug in simplifies the use of theses capabilities by putting them all in one place and automatically applying them to hundreds or perhaps thousands of components at a time These easy application modification and removal of mesh controls is an essential aspect of this plug in since multiple iterations of the model generation step are usually required to obtain a satisfactory model Figure 2 1 Finite Element Model 3 IDF File Import Step 1 The first step of importing the component and board files begins with the dialog shown in Figure 3 which is brought up from the menu item Plug ins gt PCB Modeler gt Step 1 Import The information from the import step will be stored on the mdb customData object of the Abaqus CAE model and is stored to be model specific In other words the PCB information is imported into the current model and will not be available once the current model has changed Consequently individual models may contain separate circuit bo
22. l El El El El El El Cancel 24 9 2 4 Board Editor Holes Tab IM Board Editor Board Component Mesh Attributes Placement Controls Drilled Cutout Holes Outline Partition Coord Coord Breuer Center Point Center Point FAIRE enes 0 3 0 3 0 25 1 5 4 7 0 3 0 25 1 5 Cutouts Activate All Deactivate All Min Diameter To Activate 0 2 Apply Note Min Dia 0 25 Max Dia 0 25 Note mesh partition will be created around the holes The Partition Diameter Ratio defines the ratio of the partition diameter to the hole diameter Partitions are created on the top and bottom surface of board to Facilitate boundary condition and load application partition diameter ratio of 1 0 indicates no partitions will be created AE most Ehe first 100 holes are listed in order From largest diameter to smallest diameter Activation of Ehe holes not shown will be based on the min diameter value Cancel 25 9 2 5 Board Editor Component Placement Tab IM Board Editor Mesh Controls Component Instance Activation Activation ad NESE UNIS NIRE Es S Name BotLeft BotMid MidLeft MidMid MidRight Top2Right TopLeft TopMid Component Name Bead Bead Bead Bead Bead Bead Bead Bead Lomponent Number 001 001 001 001 001 001 001 001 Yolume 0 0325 0 0325 0 0325 0 0325 0 0325 0 032
23. l in x direction Number of solders ball in y direction 15 Fill location table From pitch data 10 Figure 4 2 2 3 2 Solder Ball Array by Pitch Solder Ball Options Include solder balls Solder Ball Location Method Rectangular Grid Tabular Solder Ball Mame 0 2 1 2 SolderBall SMD 0 2 0 8 SalderBall 5MD 0 6 0 2 SolderBall MD 0 6 0 8 SolderBall MD 1 0 0 2 SolderBall Square 1 0 0 8 SolderBall Square X Coord Y Coord Figure 4 2 2 3 3 Solder Ball Array by Table Since the geometry creation of solder balls can be very time consuming it s important to define the layout of the solder balls properly the first time To ensure the layout is correct clicking the Plot Current Outline button from the Geometry tab will plot the outline of the component in black along with the outline of each solder ball in blue as shown in Figure 4 2 2 3 4 This plot is based on the current information in the dialog not the information stored on the database 0 OUR E UE E o e 8 8 2008 oo gt 9 0 0 80 oOo 60 GG 99 a E UE RD EN ET EN EB e tro CR El oD 2 2 0 0 9 0 8 0 dc du 2 0 HE GE EE EE BABE GE Ho Oo G Bb 090 BE Es Ex 99 0 D G T ER o Kk gd L3 Be eae 0 C 63 Be KM MA e EE ee EO Ek Eg eelnes a la As HS EM CIT EIE OO 6 6 0 9 006 6600 0 0 0 of lt 9 a oO fo OO 6 6 6 OG a 0 9 TU 0 0 0 0 6 60 6 06 0 9 0 DU ob oo oe C D D m c r SA E HE GE AE 6 EB 200 mt 3 on a a ss E ce era aa aa m ep GS M
24. ng modified mesh is shown in Figure 4 3 2 5 Solder Ball Mesh Controls Solder Ball Element Size Number of Elements Through Height Mesh Seed Constraint FREE 9 FIMER FIXED Include Quad Partitions YES NO Figure 4 3 2 4 Option to Partition Round Solder Ball 1 ad sa Figure 4 3 2 5 Round Solder Ball Geometry Mesh With Quad Partitions 4 3 3 SMD Solder Ball 14 The Solder Metal Deposition SMD solder ball is a more complex solder ball which models the pads between the solder ball and substrate and board Because of this added complexity this type of solder ball is generally not used in large arrays of solder balls Figure 4 3 3 1 shows an SMD solder ball without solder masks Figure 4 3 3 2 shows an SMD solder ball with solder masks The solder masks are colored green and the pads are in blue Figure 4 3 3 1 SMD Solder Ball Geometry 3 E Figure 4 3 3 2 SMD Geometry with Solder Masks 4 3 4 MD Solder Ball The Metal Deposition MD solder ball is similar to the SMD solder ball in that it includes the board and substrate pads The substrate pad is modeled in the same way as the SMD ball but the board pad is modeled differently Instead of the solder ball resting on the board pad as in the case of the SMD solder ball the solder wraps around the board pad in the case of the MD solder ball 15 Figure 4 3 4 1 MD Solder Ball Geometry Figure 4 3 4 2 MD Geometry with Solde
25. ough and others for soldering components to the board The diameters of the holes range from those which can significantly affect the behavior of the model such as board mounting holes to those the size of pin holes which would have no affect on the model If all of the holes were included the model creation within Abaqus CAE would be unacceptably slow since the resulting model would be immense An option is provided to set the minimum diameter of the holes to be included as shown in Appendix 9 2 4 Boards are often constrained at mounting points using screws and washers A column has been included in the holes table to specify the size of a partition to be created surrounding a hole The partition simplifies the creation of regions to be used for boundary conditions or load applications A value of 1 0 default for this entry will signify that no partition is to be created 4 1 5 Board Editor Component Placement Tab All of the component instances that are imported from the board file are made available for editing in the form of an instance table as shown in appendix 9 2 5 They can be edited copied deleted renamed activated and deactivated When a component instance is selected for editing the Instance dialog box is opened This allows all attributes of the instance to be modified An offset from the board value is imported from the board file for each component instance Currently this value is ignored When a component instance is deacti
26. possible to work with It is recommended that the volume filter be used to reduce the number of components and thus the number of instances imported into Abaqus CAE Once the import step is completed the user can not go back and re import specific components that were initially filtered out A complete import would need to occur However after the first import step components may be deactivated in order to avoid including them in the generation of the model So it is recommended to filter out those components that are certain not to be needed in the model and to proceed with the import of components that may or may not be required in the model since they can later be deactivated if necessary Ell Pcb Layout Import PCB Layout Files Board Layout bd CiMyDocuments Projects board bdf Component Layout df C MyDocuments Projects board ld Import Controls Units to convert Eo INCH inches vi E Minimum component volume to import 001 1 Figure 3 1 IDF File Import Dialog 4 PCB Model Edit Step 2 The second step of the process of creating a printed circuit board model is to bring up the PCB Manager dia log invoked from Plug ins PCB Modeler Step 2 Edit This dialog shown in Appendix Figure 9 1 1 provides the user with options required in the building of the finite element model Options include selection of mesh con trols element types components to merge or tie to the board solder ball array creation an
27. r Mask Geometry Cutouts Board Material Name BoardMat Hales dex Top Solder Mask Thickness Bother Solder Mask Thickness Solder Mask Include solder mask on top of board Top solder mask thickness 0 005 Top solder mask material name topPchSolderMaskMat v SolderBalliSolderMask interface mesh 9 Merged C Independent Include solder mask on bottom of board Bottom solder mask Ehickness 0 005 ms ee Bottom solder mask material name batPcbSolderMaskMat v SolderBall SoldermMask interface mesh 9 Merged C Independent 22 9 2 2 Board Editor Outline Tab IM Board Editor Board Component Mesh Attributes Placement Controls Cutouts Holes Tabular Representation Segment A Angle Type Jena degrees START POINT Dn 0 0 LINE SEGMENT 11 i 0 0 LIME SEGMENT aU i 0 0 LINE SEGMENT 0 0 0 0 LINE SEGMENT D 0 0 Note Angle only applies to arc segment positive angle indicates an arc in the clock wise direction A negative angle indicates an arc in the counter clack wise direction The last point must have the same coordinates as the First Plot Current Outline 23 9 2 3 Board Editor Cutouts Tab IM Board Editor Board Component Mesh Attributes Placement Controls Attributes Cutouts Outline teate Copy Rename Fil TopLeft Hole TopRight Hole Ll Activate All Deactivate Al A E
28. r Masks 4 3 5 Square Solder Ball The Square type of solder ball is a simple solder ball which does not model any of the pads It s intended for use in vary large arrays since it can consist of a single element 16 Figure 4 3 5 Square Solder Ball Geometry 5 Usability Issues 5 1 Model Import and Mesh Generation Most difficulties which will arise when using the PCB Modeler plug in stem from the sheer size of the models being generated Even smaller models can easily reach upwards to a million degrees of freedom The potentially large model sizes can cause the graphic interface of the plug in as well as Abaqus CAE to be slowed significantly Creation of overly large meshes may consume all of the memory on the machine resulting in aborts during mesh creation and the raising of an pc connection error The following tips may help to improve success in using the plug in Use the minimum volume criteria during the import The reduced number of part instances in Abaqus CAE will dramatically improve the speed of the plug in GUI as well as the speed of the model generation Care must be taken not to try to merge components which are very close together The resulting mesh could be so fine that Abaqus CAE uses all of the memory on the machine and hangs up or aborts during mesh creation Avoid trying to merge components to the board using hex elements if there is any overlap between the components Any overlap will disallow creation of a hex me
29. s 6 Figure 4 1 1 Board and Component with Solder Masks Green 4 1 2 Board Editor Outline Tab The outline of the board is shown graphically under the Outline tab as shown in appendix 9 2 2 The outline is plotted in black and the cutouts in read If any changes are made to outline or to the cutouts the modified outline can be readily viewed before submission of the Circuit Board dialog by clicking the Plot Current Outline button 4 1 3 Board Editor Cutout Tab All of the cutouts that are imported from the board file are made available for editing in the form of a cutout table as shown in Appendix 9 2 3 They can be edited deleted renamed activated and deactivated When a cutout is selected for editing the Cutout dialog box is opened A plot of the cutout outline provides a graphical representation to assist in recognizing problems Any changes to the outline can be readily viewed before submission of the cutout dialog by selecting the Plot Current Outline button Since cutouts can define a circular outline they can be confused with holes when viewing the resulting geometry A circular cutout and a drilled hole are imported and accessed differently in the plug in but once made part of the model provide the same circular cutout of the board 4 1 4 Board Editor Holes Tab Printed circuit boards typically contain thousands of holes Some holes are used for mounting the board to the chassis others for running wires or devices thr
30. sh and require meshing with tetrahedral elements 5 2 Solder Ball Array Generation When generating models with large arrays of solder balls use the Round or Square solder balls and use the Advancing Front meshing option Test problems 7 1 through 7 4 provide some examples of obtaining large arrays of solder balls 6 Installation of Plug in When you start ABAQUS CAE it searches for plug in files in the following directories and all their subdirectories abagus dihcaetabagus plugins where abaqus dir is the ABAQUS parent directory home dihabaqus plugins where home dir is your home directory current dihabagus plugins where current dir is the current directory ABAQUS CAE will import any files in these directories that match the naming convention plugin py Thus if It is preferred that any user in question who has access to the ABAQUS installation be allowed access to the plug in then a folder named pcb should be created under the abaqus dihcaetabagus plugins folder and the pyc files installed under that pcb folder If the plug in should be made available only on a user by user basis then a folder named pcb should be created under a folder named home dihabaqus plugins in the user s home directory and the pyc files installed under that pcb folder T QA Test Problems A number of QA problems have been included with the plug in The dialog is brought up through the menu item Plug ins PCB Modeler Test Cases Since these tests
31. tains a solder mask Figure 4 3 2 1 shows the cross section of a possible round solder ball mesh without any solder masks present 3 E Figure 4 3 2 1 Round Solder Ball No Masks The presence of a solder mask changes the shape of the solder ball resulting in thin slivers of elements on either the top or bottom of the solder balls Because these thin slivers of elements can significantly increase the mesh density of the ball it is not recommended to use solder masks when generating large arrays of solder balls Figure 4 3 3 2 shows the cross section of a possible round solder ball mesh with the solder masks colored in green 3 LE Figure 4 3 2 2 Round Solder Ball With Masks The round solder ball contains only a horizontal partition dividing the ball into a top and bottom portion No vertical partitions are made in the solder ball by default This has the advantage that coarser meshes can be applied to the solder ball but the disadvantage of less control over the mesh as shown in Figure 4 3 2 3 13 Figure 4 3 2 3 Possible Geometry Mesh of Round Solder Ball An option is available to partition the solder ball into four quadrants This forces a more uniform shape of the solder ball elements This can however increase the geometry and mesh creation times and increase the size of the mesh The option to nclude Quad Partitions is available on the Round Solder Ball Dialog as shown in Figure 4 3 2 4 and the resulti
32. vated it does not get deleted during model generation Abaqus CAE simply activates or deactivates the part instance in question Only when attributes of the component instance other than the activation flag are changed does the instance get deleted and recreated 4 1 6 Board Editor Mesh Controls Tab The mesh controls tab as shown in Appendix 9 2 6 provides controls that will be applied to every component in the model With the exception of element shape and element interpolation all controls may be overridden for any given component as described in section on controls hierarchy Allowing variations in element shape and element interpolation would require tie constraints between varying regions Mesh controls are applied using a hierarchy from broad to specific board level to component level to instance level The available controls are e Component constraint to board tied or merged e Component element size e Number of elements through thickness e Mesh seed constraint free fixed or increase only e Meshing algorithm Advancing Front or Medial Axis e Activation Instance level controls override component level controls which in turn override board level controls As a default component and instance level controls are all turned off upon import An example of a useful application of this control scheme would be if the components are chosen to be merged with the board However assume the gap between a pair of components is orders o
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