ICP-RIE
Contents
1. My Profile l My Accounts 2 E 8 00 18 30 E 18 00 18 30 Contact Manager 18 30 19 00 x 18 30 19 00 a EE 9 00 19 30 5 9 00 19 30 SMEL 5 19 30 20 00 19 p 19 30 20 00 EE User Forum a 20 00 20 30 20 00 20 30 i Te TG ye SR Z 20 30 21 00 20 30 21 00 A NANO RESEARCH FACILI 21 00 21 30 00 21 21 00 21 30 E 3 21 30 22 00 3 21 30 22 00 22 00 22 30 22 00 22 30 E z 30 23 00 3 22 30 23 00 5 23 00 23 30 E 23 00 23 30 E A 3 30 00 00 23 30 00 00 Oxford Plasmalab 100 User Log Book Required With Any Use _ NANO RESEARCH FACILITY 2 Vent Loadlock e Under Cycling Loadlock Pumping Click Stop then Vent e Wait until Vent Time Left is O secs 150 sec total vent time e Open the Loadlock chamber door Washington University in St Louis SCHOOL OF ENGINEERING amp APPLIED SCIENCE User PUMP CONTROL E N NANO RESEARCH FACILITY a 3 Insert Wafer e Add wafer to Loadlock with the flat edge between the pins and close lid e Click Stop gt Evacuate in the Loadlock panel e Enter a Wafer Name In the Load Wafer or pump loadlock pop up window gt click OK Load Wafer or pump loadlock Was 4 Recipe e Input your recipe temperature in the temperature control box e Push the T button gt use the arrow keys to select a Temperature Setpoint gt input a new te2. AN NANO RESEARCH FA ICP RIE Oxford Plasmalab 100 Basic User Manual 3 Edition September 2012 NR ON NANO RESEARCH FACILITY soem _ _S 1 ICP RIE System Overview Gas Sensors Gas Leak Alarm f a a a m f Te ICP RIE Temperature Loadlock Control Box NNIN NRF Logon RIE Oxford Plasmalab on FOM System gt C D nninseas wustl edu fom schedule equipid 18 Notes from instrument manager Contact Nathan Reed 24 hours in advance for RIE Start Up and availability Instrument Schedule RIE Oxford Plasmalab N R P RIE Oxford Plasmalab is now Available Time on server Your user level on this instrument is Instrument Manager Monday Apr 8 15 04 41 02 11 02 18 02 25 03 04 03 11 03 18 03 25 04 01 Today Apr 8 2013 Mon 04 08 ue 0409S iri 04112 Admin Home Click to show sessions from midnight to 09 00 User Home 09 00 09 30 09 00 09 30 09 00 09 30 09 00 09 30 RIE Oxford Plasn x 09 30 10 00 09 30 10 00 09 30 10 00 09 30 10 00 09 30 10 00 Apply new instrur yog0 40 30 PESE SR E 3 10 30 11 00 Deparments 44 00 11 30 Supervisors SEER a Previous user comment DEE EINS Service Work in PO 031513 01 n a ae Consumables Users Admin Eman iist Confirm instrument logon Collaborate amp Service i Usage Records e j Purchase Supplies Documents 16 E User Report
3. EP TEST 03 MEP TEST 02 Laser End Point Test OPT 1 min pump PTB MPTP Soak Test Step lstep3 TRAINING STEP 1 PTP TRAINING STEP 2 02 PLASMA TRAINING STEP 3 COOLING zzz Poly Si HBr Step 1 zzz Poly Si HBr Step 2 zzz dac demo 1 zzz dac demo 2 zzz dac pump demo3 ANANO RESEARCH FACILITY panngonUakesiy morto Recipe cont e In the Process Step Editor input Step Name Step Time Process Gas flows Chamber Pressure Helium Backing Pressure RF Generator Forward Power and ICP Generator Forward Power e Click OK when done or if button Is grayed out press Enter on the keyboard press Esc to cancel e In the Recipe screen give the recipe a new name and click Save SCHOOL OF ENGINEERING amp APPLIED SCIENCE Use STEP EDIT START STOP PAUSE JUMP STEP TIME LOG INTERVAL IGNORE TOLERANCE T PUMP TO PRESSURE aa LOW PRESSURE STRIKE Strike Pressure De Bias Minimu WATER TEMPERATURE Loadlock NRF 5 Etch Process e During the etch process the chamber screen will display the recipe progress and all input gas power and pressure settings e When the etch process Is complete a Yellow Alert window will pop up to notify you of the process completion gt click Continue It iS normal for this alert to remain active in the right hand corner of the screen NANO RESEARCH FACILITY Wash
4. ington University in St Louis SCHOOL OF ENGINEERING amp APPLIED SCIENCE START STOP PAUSE JUMP STEP TIME LOG INTERVAL 00 00 00 ismoretoresance 7 No Recipe Running lt No Wafer gt ig pe TO ia Sra E 7 50e 098 1 55e 06 Torr APC CONTROLLER Set Position TE HELIUM BACKING Pressure Controller red 0 0 Torr LOW PRESSURE STRIKE Flow Meter Strike Pressure Oc Bias Minimum Fiamp Rate Set Pressure Seem Helium RF AUTOMATCH ICP GENERATOR ICP AUTOMATCH CAPACITOR 1 CAPACITOR 2 WATER TEMPERATURE Process Gas Out ENDPOINT LiReflectance O o Plot pu sas da 0 0 g acy Signal smoothing time secs Etch Mode Endpoint closed time 0 secs Endpoint capture time 0 secs Endpoint Threshold value 0 Normalisation level 0 Normalisation time O secs Overetch level O Overetch time Derivative gain factor 0 1 Derivative smoothing 0 ma 00 00 us 00 00 05 00 00 a 1 114 4 4444 1134 4144 4040 49040404 System Oy Utilities User System Process J u unnes Comment Process Control Evacuating Chamber Loading wafer to Loadlock OP PAUSE JUMP STEP TIME 1 fee FTZ a gt Wna W 1 f Alarm active at 21 03 2011 15 24 24 ESP No WAFER Process Gas Out ENDPOINT Signal smoothing time ser Gas 2 Endpo
5. int closed time sei Endpoint capture time se Gas 3 E Threshold value Normalisation level Gas 4 Normalisation time sei Overetch level LA NANO RESEARCH FACILITY Etch Process cont e In the pop up window Wafer has finished processing Ready to be removed click OK e Click Stop gt Vent in the Loadlock panel and wait for the vent cycle to finish e Remove your wafer and insert another gt repeat steps starting on page 11 Washington University in St Louis SCHOOL OF ENGINEERING amp APPLIED SCIENCE PUMP CONTROL 6 Shut down Load Wafer or pump loadlock e When done using the instrument remove your OXFORD sample close the Loadlock door and click Stop gt Evacuate in the Loadlock panel NNIN
6. mperature using the number Keypad if needed gt push OK e In the PC2000 software go to Process gt Recipes ser PUMPCONTROL NANO RESEARCH FACILITY estingom Unte pa m Recipe cont em e Click Load and choose a recipe from the list e When the temperature control box reaches the desired temperature start the etch process by clicking Run recipes should include a pump step before PTP and after the etching step PTB to automatically pump down the Loadlock move the wafer into the process chamber pump Use RECIPES SA down the process chamber after etching and move the wafer Fr Recipe Mame EP02 O O O E back to the Loadlock Data Log Interval Created SJan 11 9 58 57 pm Save Recipe Length 0000 20 00 Jarah F 2 EPTESTOZ A NANO RESEARCH FACILITY Recipe cont e You may edit a recipe that has been loaded by clicking on a step in the list on the left and choosing Edit Step e Make a new recipe by clicking New gt in pop up window Clear current recipe click OK gt then Click in the recipe step box on the left and choose Insert Step or click and drag a preprogrammed step from the Step Library list on the right into the recipe box and choose Edit Step 1 Washington University in St Louis SCHOOL OF ENGINEERING amp APPLIED SCIENCE e tep Library 5 a y ave Process Chamber
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