MC68EC030 32-Bit Embedded Controller User`s Manual
Contents
1. lt 0 51 0 020 T X9 v z 0 0 20 0 008 T _ v z gt C R m J Ew AAPA AE LE MEME UE UE AERE MEAE EAE MEE E EAE AE EAE AE LN v _ 0 0 10 0 004 Roe 12 SEATING PLANE Na lt D 132 PL EN G K lt 6 020 0 008 T 7 MILLIMETERS INCHES NOTES DIM MIN MAX MIN MAX 1 DIMENSIONING AND TOLERANCING PER ANSI Y14 5M 1982 A 2185 2286 0 860 0 900 2 CONTROLLING DIMENSION INCH 2185 2286 0 860 0 900 3 DIM A AND B DEFINE MAXIMUM CERAMIC BODY DIMENSIONS C 394 431 0155 0170 INCLUDING GLASS PROTRUSION AND MISMATCH OF CERAMIC D 0 204 0 292 0 0080 0 0115 BODY TOP AND BOTTOM G 0 64 BSC 0 025 BSC 4 DATUM PLANE W IS LOCATED AT THE UNDERSIDE OF LEADS H 064 088 0025 0 035 5 WHERE CENTER LEADS 4 2 x T m S EXIT PACKAGE BODY AT DATUM W L 2032 REF 0800 REF 6 DIM S AND V TO BE DETERMINED AT SEATING PLANE DATUM T MI F m F 7 DIMA AND B TO BE DETERMINED AT DATUM PLANE W R 064 0025 S 2731 2755 1075 1 085 V 2731 2755 1075 1 085 MOTOROLA MC68EC030 USER MANUAN ADDENDUM For More Information On This Product Go to www freescale com Voc Voc D31 D30 29 D28 GND D27 D26 D25 D24 Vcc D23 D22 D21 D20 GND D19 D18 D17 D16 GND D15 D14 D13 D122. Box 20912 Arizona 85036 1 800 441 2447 JAPAN Nippon Motorola Ltd 4 32 1 Nishi Gotanda Shinagawa ku Tokyo 141 Japan HONG KONG Motorola Semiconductors H K Ltd Silicon Harbour Center No 2 Dai King Street Tai Po Industrial Estate mr SEMICONDUCTOR PRODUCT INFORMATION wh For More Information On This Product Go to www freescale com
3. Freescale Semiconductor Inc Order this document by MC68EC030UMAD AD REV 2 MC68EC030 Addendum MC68EC030 32 Bit Embedded Controller User s Manual April 17 1996 This addendum to the initial release of the MC68EC030 User s provides additional information not included in the original or corrections to the original text This document and other information on this product is maintained on the AESOP BBS which can be reached at 800 843 3451 from the U S and Canada or 512 891 3650 Configure modem for up to 14 4 Kbaud 8 bits 1 stop bit and no parity Terminal software should support VT100 emulation Internet access is provided by telneting to pirs aus sps mot com 129 38 233 1 or through the World Wide Web at http pirs aus sps mot com Incorporate the following information into the manual This addendum contain information on junction temperatures for the pin grid array package and 132 lead ceramic surface mount package A pinout and the case package is also given for the 132 lead ceramic surface mount and 144 lead TQFP PV Suffix package This document contains information on a product under development Motorola reserves the right to change or discontinue this product without notice m SEMICONDUCTOR PRODUCT INFORMATION ww MOTOROLA 1996 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc The following tables define the maximum junction temperature for the PPGA and FE package
4. GND D11 D10 D9 D8 Voc NC Lu CL gt co oo Freescale Semiconductor Inc NC Do not connect to this pin oale S S S a 9 o o eio Q S s O lt OQ wo cw a Cq acd Za zm ox d lt lt X Od GTT IIIa 656 lt 2 MOTOROLA MC68EC030 USER MANUAN ADDENDUM For More Information On This Product Go to www freescale com Freescale Semiconductor Inc CASE 918 02 144 TQFP 0 20 0 008 H L M N 6 0 20 0 008 H L M N 144 ett DETAIL A B DETAIL B F gt T D c lt 2 2 DETAIL A BASE METAL 73 ROTATED 90 Y 144 PL 10 080 003 T L M N 36 NOTES DIMENSIONING AND TOLERANCING PER ANSI Y14 5M 1982 CONTROLLING DIMENSION MILLIMETER 3 DATUM PLANE H IS LOCATED AT BOTTOM OF LEAD AND COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE 4 DATUMS L M AND N TO BE DETERMINED AT DATUM PLANE H C PES 6 e Z DETAIL C IMENSIONS S AND V TO BE DETERMINED AT SEATING NE T lt y
5. Max Watts Air Flow in linear feet minute 3 6 e a e v Lm os s m9 m Typical junction temperature C for operations at TA Max above FE with heatsink Frequency PD Typical Air Flow in linear feet minute Maximum Power Dissipation vs Frequency FE Package Max at MHz TA 0 Watts 1 20 Theta JA vs Airflow FE Package with heatsink estimated Air Flow in linear feet minute Natural Convection The following figures provide a pinout and the mechanical dimensions for the 132 Lead Surface Mount FE Suffix and 144 Lead Thin Quad Flat Pack TQFP PV Suffix 4 MC68EC030 USER MANUAN ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc FE SUFFIX PACKAGE CASE 831 01 lt S gt 0 20 0 009 T v z lt A gt 0 51 0 020 x 9 _v z PIN ONE INDENT HIA AC G S a K Lr Lj Lr L 3 L 4 Lr Caa Lr l J Y L 3 C r r r m L 3 y E OO
6. pecifically disclaims any and all liability including without limitation consequential or incidental damages Typical parameters can and do vary in different applications All operating parameters including Typicals must be validated for each customer application by customer s technical experts Motorola does not convey any license under its patent rights nor the rights of others Motorola products are not designed intended or authorized for use as components in systems intended for surgical implant into the body or other applications intended to support or sustain life or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur Should Buyer purchase or use Motorola products for any such unintended or unauthorized application Buyer shall indemnify and hold Motorola and its officers employees subsidiaries affiliates and distributors harmless against all claims costs damages and expenses and reasonable attorney fees arising out of directly or indirectly any claim of personal injury or death associated with such unintended or unauthorized use even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part Motorola and are registered trademarks of Motorola Inc Motorola Inc is an Equal Opportunity Affirmative Action Employer Literature Distribution Centers USA EUROPE Motorola Literature Distribution P O
7. s for the MC68ECO030 Maximum Junction Temperature for PPGA Package TJ Max 115 G Maximum ambient temperature vs airflow and rated frequency PPGA without heatsink Frequency PD Max at Ty TT MHz Max Watts Air Flow in linear feet minute Typical Air Flow linear feet minute Maximum Power Dissipation vs Frequency PPGA Package PD Max at MHz TA 0 Watts 1 20 Theta JA vs Airflow PPGA Package without heatsink estimated Natural Convection 2 MC68EC030 USER MANUAN ADDENDUM MOTOROLA For More Information On This Product Go to www freescale com Freescale Semiconductor Inc Maximum Junction Temperature for FE package without heatsink TJ Max 115 G Maximum ambient temperature C vs airflow and rated frequency FE without heatsink eun 200 400 500 F S s Frequency Pp Typical Maximum Power Dissipation vs Frequency FE Package PD Max at MHz TA 0 Watts 1 20 Theta JA vs Airflow FE Package without heatsink estimated Natural Convection MOTOROLA MC68EC030 USER MANUAN ADDENDUM 3 For More Information On This Product Go to www freescale com Freescale Semiconductor Inc Maximum Junction Temperature for FE package with heatsink TJ Max 115 G Maximum ambient temperature C vs airflow and rated frequency FE with heatsink Frequency PD Max at TJ dnd MHz
8. v Y MENSIONS AND DO NOT INCLUDE MOLD PROTRUSION LLOWABLEPROTRUSION IS 0 25 0 010 PER SIDE MENSIONS A AND B DO NOT INCLUDE MOLD ISMATCH AND ARE DETERMINED AT DATUM LINE H MENSION D DOES NOT INCLUDE DAMBAR PROTRUSION LLOWABLEDAMBAR PROTRUSION SHALL NOT CAUSE HE D DIMENSION TO EXCEED 0 35 0 014 L 0 08 0 003 DETAIL B SEATING _ MILLIMETERS INCHES PLANE MIN MAX MIN Al 10 00 BSC 0 394 BSC B 2000BSC 0 790 BSC_ c2 0 394 BSC 0 063 0 006 4 D 017 027 0007 001 C1 Jer gt r gt 3 0 09 020 0 004 0 008 0 25 BSC 0 010 BSC HAE ERE BSC 0 966BSC S1 11 00 BSC 0 433 BSC Lv 2200855 DETAIL C MOTOROLA MC68EC030 USER MANUAN ADDENDUM For More Information On This Product Go to www freescale com Freescale Semiconductor Inc DSACK1 Vcc Ae TOP VIEW A22 MC68EC030PV GND 21 a REFILL L_ NC Do not connect to this pin Motorola reserves the right to make changes without further notice to any products herein Motorola makes no warranty representation or guarantee regarding the suitability of its products for any particular purpose nor does Motorola assume any liability arising out of the application or use of any product or circuit and s
Download Pdf Manuals
Related Search