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Panasonic Datasheet PAN1321

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1. mdx p i pnn i 60 150 sec o A E ds O ee 150 C L d i SSS 6 C sec 60 120 sec 3 C sec max pee gee L A SN ee eee 8 minutes max Time s LeadFree Solder Profile vsd Figure 16 Eutectic Leadfree Solder Profile User s Manual 39 Hardware Description Revision 3 3 2011 11 16 www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Assembly Guidelines At the reflow process each solder joint has to be exposed to temperatures above solder liquids for a sufficient time to get the optimum solder joint quality wnereas overheating the board with its components has to be avoided Using infrared ovens without convection special care may be necessary to assure a sufficiently homogeneous temperature profile for all solder joints on the PCB especially on large complex boards with different thermal masses of the components The most recommended types are therefore forced convection or vapour phase reflow Nitrogen atmosphere can generally improve solder joint quality but is normally not necessary The reflow profiles and other reflow parameters are dependent on the used solder paste The paste manufacturer provides a reflow profile recommendation for this product Additionally it is important not to overheat the PAN1321 module by a too large reflow peak temperature PAN1321 co
2. r 33 9 6 European R amp TTE Declaration of Conformity 0 0 00 s 33 9 7 Bluetooth Qualified Design ID llli 35 9 8 Industry Canada Certification 0 0 eee eee eens 35 9 9 Label Design of the Host Product 0c cc ee ee eens 35 9 10 Regulatory Test House eee eee eee 35 10 Assembly Guidelines 0 0 0 00 eee eee eens 36 10 1 General Description of the Module 0 0 ccc eee eee eee 36 10 2 Printed Circuit Board Design eee eee nes 36 10 3 Soler Paste PINUNO eura und sug Rod SR eee meh de baba be oe oe tebe ee ETE EUER EORR ER RR 36 10 4 ncs MP PERA 37 10 4 1 Component PIacemelll osos aede s Epor a ER ads URS als heads 37 10 4 2 uni eaae Gace pores eee sd eae one oneness oes ee oe eee eee ee ree ee hee wee ae os 37 10 4 3 PACKAGG 2 cad esa caGee oes dm bae ON 38 10 5 Soldering Profile 20 0 cc ee ee eee rrr 39 10 6 aio aa ee wea cou ae ware ae Seo wee ae eee ne deed E ee ego eee ee 40 10 6 1 Removal Procedure aw Pee ds OE eee ew eee Ee writ Boe Die ode d adidas 40 10 6 2 Replacement Procedure 00 ccc eee eee ees 40 10 6 2 1 Alternative 1 Dispensing Solder 0 0 ccc ee eee eens 40 10 6 2 2 Alternative 2 Printing Solder 1 0 0 rre 41 10 7 Jueces v 41 10 8 Component
3. ooooooor RR IRA caca 20 7 Electrical Characteristics anana aana aaa 21 7 1 Absolute Maximum Ratings 0 ee hh rss 21 7 2 Operating Conditions aaaea ee ee eee eas 21 7 3 DC Characteristics eee ee eens 22 7 3 1 Pad Driver and Input Stages 0 0 eee eee hrs 22 C332 PUN UDS ana PUM QOWNS s dear beaks dee d cq Re de i c eae oe be oh ae i a 24 7 3 3 musice mele cq rr 24 7 3 4 System Power Consumption 0 000 cc eee eee eens 25 7 4 AC CihalaclensuGs eau sms aia oras rs a oa 25 User s Manual 4 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Table of Contents 7 5 IRE PO ATE TT 25 7 5 1 Characteristics RF PET estaa arbe ole RU a a Bee cid br oe eter edgy ares ace ears ware 25 1 5 1 1 Bluetooth Related Specifications 0 0 eee ees 25 8 Package Information llle 29 8 1 Package Marking hh 29 8 2 FPrOGUGUON FOCKAGe conosco leerse ros Boo Be Bee cue RS Gee FEQ ER DEN drag eee 29 8 2 1 PMV T 30 9 Important Application Information o 31 9 1 Reference Design 10 ee ee eee eee tenes 31 9 2 FCC Class B Digital Devices Regulatory Notice llli 32 9 3 FCC Wireless Notice 2 62 ses A a Lew eU Erg 32 9 4 FCC Interference Statement 33 9 5 FUG IGCMING P
4. 46 8 564 725 50 Fax 46 8 760 01 10 sweden avnet embedded eu AVNET Embedded UNITED KINGDOM IRELAND Avnet Embedded 5a Waltham Park White Waltham Maidenhead Berkshire SL6 3TN Phone 44 1628 518900 Fax 44 1628 518901 uk avnet embedded eu All trademarks and logos are the property of their respective owners No guarentee as to the accuracy completeness or reliability of any information Subject to modifications and amendments 02 2013
5. Carrier frequency stability ci 75 kHz Carrier frequency stability wi w0 aa 15 kHz Carrier frequency stability w0 kHz DPSK RMS DEVM 8DPSK RMS DEVM oS os DPSK Peak DEVM 8DPSK Peak DEVM Eeh E DPSK 99 DEVM 8DPSK 99 DEVM VA o Differential phase encoding 20 o za 100 1st adjacent channel power 40 2 dBc 2nd adjacent channel power 20 dBm Carrier power measured at basic rate 3rd adjacent channel power 40 dBm Carrier power measured at basic rate Table 17 EDR Receiver Part Parameter Symbol Values Unit Note Test Condition Min Typ Max DQPSK Sensitivity 88 83 dBm Ideal wanted signal GDPSK Sensitivityl 83 T dBm Ideal wanted signal DQPSK BER Floor Sensitivity 84 60 dBm 8DPSK BER Floor Sensitivity 79 60 dBm DQPSK C I performance 53 40 dB 4th adjacent channel DQPSK C l performance 47 20 dB 3rd adjacent channel 1st adj of image DQPSK C I performance 31 7 dB 2nd adjacent channel image User s Manual Hardware Description Revision 3 3 2011 11 16 www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Electrical Characteristics Table 17 EDR Receiver Part cont d Parameter Symbol Values Unit Note Test Condition Min Typ Max DQPSK C I performance d
6. ONOFF P1 4 RTCK TP3 JTAG OFF 6 NC 7_NC co Zz e LEEPX REG gt to IBST TAG RST P1 0 TMS P1 3 TDO SLOT_STAT P4 2 TDI RF RCTIU UART1 TXD RXD UDDPCM ON OFF DDPCM a Zz e 7 NC QOOOC GUctuuuuo PAN13XX Power Sel Ext Int JAZ IZ JPL 1 2 2 3 b0 12 8 P 13 SC P0 0 PC P 1 PC P 5 UART EA GN G G 1IT1 0 OO NL C CJ b0 11 TX CO P0 14 TX CONF P 7 UARTCTS UDDURRT PO 4 UARTTX P 6 UARTRTS GND10 Function REACTIVE IX CONFO IX CONE1 Modul Connector SU2 BE ACTIUE UART_RTS TXD RXD UART_CTS UART CTS UDDUART TXD UART RTS JTAG Mode Selection ANTENNA UDDUART ON OFF UDDPCM ON OFF A gt e Use On Board regulator Connect directly to input PAN 13XX Application Board c02009 Panasonic TITLE Reference Design PAN13xx Document Number Date 19 08 2010 10 52 42 Sheet 1 1 Reference Design Schematics Figure 9 3 3 2011 11 16 Ision Rev 31 User s Manual Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Important Application Information ENW89811xxxF is intended to be installed inside end user equipment ENW89811xxxF is Bluetoooth qualified and also FCC certified and Industr
7. PAN1321 SPP supports power control according to the Bluetooth 2 0 EDR specification The output power can be controlled in up to 4 configurable steps PAN1321 SPP can work as a class 2 or 3 device depending on the settings Fine tuning can be used on the power steps e A default sub state power step can be set The power step configuration is set through BD DATA parameters The Inquiry output power can be programmed with the Write Inquiry Transmit Power Level command introduced in the 2 0 Bluetooth Core specification 6 2 2 3 Ultra Low Transmit Power For high security devices the output power can be reduced to a value that reduces the communication range to a few inches This mode is enabled with the HCI command Infineon TX Power Config User s Manual 20 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Electrical Characteristics 7 Electrical Characteristics 7 1 Absolute Maximum Ratings Table 5 Absolute Maximum Ratings Parameter MUNI Unit Note Test Condition Storage temperature C VSUPPLY supply voltage 0 3 6 0 V VDDUART supply voltage 0 9 V VDD1 supply voltage 0 9 4 0 V VREG 0 3 J 4 0 V VSUPPLY gt 4 V VREG 0 3 VSUPPLY V VSUPPLY lt 4 V Input voltage range V Output voltage range V 9 ESD kV According to MIL STD883D method 3015 7 Note Stresses above those listed here are likely t
8. Transmitter Ultra Low Power Mode Voltage Controlled Oscillator Wireless LAN Local Area Network 47 Hardware Description Terminology Revision 3 3 2011 11 16 www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF References 12 References 1 SPP AT Image Version 1 6 Release Note Rev1 0 2010 06 22 SPP AT Image Version 1 8 Release Note Rev1 0 2011 09 05 SPP AT Image Version 2 1 Release Note Rev1 0 2011 09 05 SPP AT Application User s Manual Software Description Always the latest revision as a zip file will be available under the link below SPP AT User s Manual Software Description Image Release Notes 2 PAN1321 Application Note Design Guide Always the latest revision as a pdf file will be available under the link below PAN1321 Application Note Design Guide 3 PAN1321 SPP User s Manual Data Sheet It is this document Always the latest revision as a pdf file will be available under the link below PAN1321 SPP Data Sheet User s Manual 48 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF References User s Manual 49 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu www avnet embedded eu AVNET EMBEDDED OFFICES DENMARK Avnet Embedded Avnet Nortec A S Ellekaer 9 2730 Herlev Phone 45 3678 6250 Fax 45 3678 6255 denmark avnet embedded eu FINLAND Avnet Embedded
9. Avnet Nortec Oy Pihatorma 1 B 02240 Espoo Phone 358 20 749 9 260 Fax 358 20 749 9 280 finlandeavnet embedded eu FRANCE Avnet Embedded Avnet EMG France SA Parc Club du Moulin Vent Bat 10 33 rue du Dr Georges L vy 69693 V nissieux Cedex Phone 33 4 78 77 13 92 Fax 33 4 78 77 13 97 bron avnet embedded eu Avnet Embedded Avnet EMG France SA 14 avenue Carnot 91349 Massy Cedex Phone 33 1 64 47 29 29 Fax 33 1 64 47 99 99 paris avnet embedded eu Avnet Embedded Avnet EMG France SA Les Peupliers Il 35 avenue des Peupliers 35510 Cesson S vign Phone 33 2 99 77 37 02 Fax 33299 77 37 01 rennes avnet embedded eu GERMANY AUSTRIA CZECH REPUBLIC HUNGARY POLAND SWITZERLAND Avnet Embedded Avnet EMG GmbH Gruber Stra e 60c 85586 Poing Phone 49 8121 775 500 Fax 49 8121 775 550 poing avnet embedded eu Avnet Embedded Avnet EMG GmbH L tscher Weg 66 41334 Nettetal Phone 49 8121 775 500 Fax 49 8121 775 550 nettetal avnet embedded eu ITALY PORTUGAL SPAIN Avnet Embedded Avnet EMG Italy SRL Via Manzoni 44 20095 Cusano Milanino Phone 39 02 660 92 1 Fax 39 02 660 92 498 milano avnet embedded eu NETHERLANDS BELGIUM LUXEMBOURG Avnet Embedded Avnet B V Takkebijsters 2 4817 BL Breda Phone 31 76 5722400 Fax 31 76 5722404 benelux avnet embedded eu SWEDEN NORWAY Avnet Embedded Avnet Nortec AB Esplanaden 3 D 172 67 Sundbyberg Phone
10. Max 81 Sensitivity Unit dBm kHz 50 ms kHz 50 ms kHz 50 ms Note Test Condition Ideal wanted signal C l performance 4th adjacent channel C l performance 3rd adjacent channel 1st adj of image dB C l performance 2nd adjacent channel image C l performance 1st adjacent channel C l performance co channel dB dB dB C I performance 1st adjacent channel dB C l performance 2nd adjacent channel dB C l performance 3rd adjacent channel Blocking performance 30 MHz 2 GHz Blocking performance 2 GHz 2 4 GHz Blocking performance 2 5 GHz 3 GHz dB dBm dBm dBm Some spurious responses but according to BT specification Blocking performance 3 GHz 12 75 GHz dBm Some spurious responses but according to BT specification User s Manual 26 Hardware Description Revision 3 3 2011 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENW89811xxxF Electrical Characteristics Table 15 BDR Receiver Part cont d Parameter Symbol Values Unit Note Test Condition Min Typ Max Intermodulation performance 39 34 dBm Valid for all intermodulation tests Maximum input level B dBm Table 16 EDR Transmitter Part Parameter Symbol Values Unit Note Test Condition m Min Typ Max Output power high gain 2 5 2 dBm Relative transmit power EE 1 dB PxPSK PGFSK
11. PAN1321 is packed in tape on reel according to Figure 14 VOF SZ 13 red from centreline of sprocket hole treline of pocket lative tolerance of 10 sprocket is 020 red from centreline of sprocket o centreline of pocket er material available toce Cum holes Meas hole Oth Meas ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED IV 111 SECTION X X O O O O p 2 O O O O O O O O O Forming format Flatbed 0 05 0 30 O JA Jr SECTION Y Y Figure 14 Tape on Reel User s Manual 38 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu Panasonic PAN1321 SPP ENW89811xxxF Assembly Guidelines 10 5 Soldering Profile Generally all standard reflow soldering processes vapour phase convection infrared and typical temperature profiles used for surface mount devices are suitable for the PAN1321 module Wave soldering is not possible Figure 15 and Figure 16 shows example of a suitable solder reflow profile One for leaded and one for leadfree solder Recommended temp profile lt 10 1s for reflow soldering 30 20 10s Temp C 235 C max lt lt 220 5 C 200 C 150 10 C os Time s Lead Solder Profile vsd Figure 15 Eutectic Lead Solder Profile Recommended temp profile for reflow soldering J STD 020C Temp C Pio lua E za NC 30 sec A
12. check corresponding release documents for latest information in chapter 12 item 1 The identifier about the software version will be visible on the module please refer to Figure 6 here it is the identifier SW There are actual 4 different firmware releases available in Table 2 Table 2 Firmware Releases as of 2011 11 16 SW FW Comment marking on firmware the module version 07 1 6 first standard release free of charge 08 1 8 second standard release free of charge should be used for new projects 20 2 0 first iPhone release special license fee is needed 21 2 1 second iPhone release special license fee is needed should be used for new projects User s Manual 13 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Basic Operating Information 2 Basic Operating Information 2 1 Power Supply PAN1321 SPP is supplied from a single supply voltage VSUPPLY This supply voltage must always be present The PAN1321 SPP chip is supplied from an internally generated 2 5 V supply voltage This voltage can be accessed from the VREG pin This voltage may not be used for supplying other components in the host system but can be used for referencing the host interfaces The GPIO s and the UART interface are supplied with dedicated independent reference levels via the VDD1 and VDDUART pins All other digital I O pins are supplied internally by either 2 5 V
13. quantity User s Manual 17 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Bluetooth Capabilities 6 Bluetooth Capabilities 6 1 Supported Features Bluetooth V2 0 EDR compliant Enhanced Data Rate up to 3 Mbit s e Adaptive Frequency Hopping AFH e All packet types e Authentication Pairing and Encryption e SPP Device A and B support 1 ACL link with stream or command mode e SPP Device A and B Visible while connected e SPP Device A and B Visible connectable when not connected SPP Device A and B Device Discovery capable after receiving OK on data transfer e Sniff mode is supported with above capabilities e 5 trusted devices stored in EEPROM e Enable DUT Crystal calibration e H4 with UART HW flow control RTS CTS e Security modes Modes 1 and Mode 3 e Master Slave role switch Quality of Service e Channel Quality Driven Data Rate change e Sniff Hold e Role Switch e RSSI and Power Control e Power class 2 and 3 e Standard Bluetooth test mode Active Tester Mode and RF Test Modes User s Manual 18 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Bluetooth Capabilities 6 2 PAN1321 SPP Specifics and Extensions 6 2 1 During Connection 6 2 1 1 Role Switch Only one role switch can be performed at a time If a role switch request is pending other role switch req
14. substances For information on the types in question please contact your nearest Panasonic Office Panasonic Electronic Devices may only be used in life support devices or systems with the express written approval of Panasonic Devices if a failure of such components can reasonably be expected to cause the failure of that life support device or system or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body or to support and or maintain and sustain and or protect human life If they fail it is reasonable to assume that the health of the user or other persons may be endangered www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF ENW89811xxxF Intel s BlueMoon Universal Platform Revision History 2011 11 16 Revision 3 3 Previous Version 3 2 Page Subjects major changes since last revision Rev1 0 Initial version Rev2 0 Due to better range with another ceramic antenna we have updated module height from 1 8mm to 2 8mm Changes made in Production Package on Page 29 If you need smaller height let us discuss your individual case Rev3 0 Releasing this document and correct the ordering code to ENW8981 1xxxF which is the 85 C version Rev3 1 Add the Chapter 9 Modified Figure 6 Package Marking on Page 29 and Figure 8 Top View and Bottom View on Page 30 Rev3 2 Fixed all pins for the product life time in Ch
15. 1 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENW89811xxxF LSB LT ADDR M MSB MSRS N NC NOP NVM OCF OGF RF ROM RSSI RTS RX RXD S SCO SIG SW SYRI User s Manual Least Significant Bit Byte Logical Transport Address Most Significant Bit Byte Master Slave Role Switch No Connection No OPeration Non Volatile Memory Opcode Command Field Opcode Group Field Power Amplifier Printed Circuit Board Pulse Coded Modulation Protocol Data Unit Packet Error Rate Personal Identification Number Packet Loss Concealment Phase Locked Loop Power Management Unit Power On Reset Packet Traffic Arbitration Packet Type Table Quality Of Service Random Access Memory Radio Frequency Read Only Memory Received Signal Strength Indication Request To Send UART flow control signal Receive Receive Data UART signal Synchronous Connection Oriented logical transport Special Interest Group Bluetooth SIG ooftware oynthesizer Reference Input 46 Hardware Description Terminology Revision 3 3 2011 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENW89811xxxF TBD TCK TDI TDO TL TMS TX TXD UART ULPM VCO WLAN User s Manual To Be Determined Test Clock JTAG signal Test Data In JTAG signal Test Data Out JTAG signal Transport Layer Test Mode Select JTAG signal Transmit Transmit Data UART signal Universal Asynchronous Receiver amp
16. 23 Table 12 Pull up and Pull down Currents lille 24 Table 13 Max Load at the Different Supply Voltages nananana cs 25 Table 14 BDR Transmitter Part 12 scarce aa aoa e Oe ae Re aae ido ox he ac og re XC ORC ROS 25 Table 15 DO INGCCEIVGI PAM eae ahs a bah arie Oy pu de er ass quc qo V RUE PE E o dem 26 Table 16 EDR Transmitter Part 2f Table 17 EDR RECEIVE Fall uu ceed cor na dis diano a a RIED OE dr dae us dd a ar dO a t alee ORs 2f Table NIONMEMEE S0 00 FETQTITTTOTIQOTL TRITT ee eS ee a ee eee eee eee eee ees 32 User s Manual 7 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF General Device Overview 1 General Device Overview 1 1 Features General e Complete Bluetooth 2 0 EDR solution Configurable for BT 1 2 e Ultra low power design in 0 13 um CMOS Temperature range from 40 C to 85 C e Integrates ARM7TDMI RAM and patchable ROM e On module voltage regulators External supply 2 9 4 1 V e On module EEPROM with configuration data e Reference clock included Low power clock from internal oscillator or external low power clock e g 32 768 kHz e Dynamic low power mode switching Interfaces AT command interface over UART configurable from 9600 baud up to 3 25 MBaud General purpose l Os with interrupt capabilities JTAG for boundary scan and debug RF e Transmit power typ 2 5 dBm default settings Receiver sensiti
17. Avnet Embedded AVWNET Support Around The Board SS Embedded DATASHEET Panasonic ideas for life PAN1321 SPP Date November 2011 www avnet embedded eu November 2011 ENWB89811xxxF Bluetooth QD ID B014433 End Product Listing FCC ID T7VEBMU IC ID 216QEBMU PAN1321 SPP Intel s BlueMoonUniversal Platform Wireless Modules Users Manual Hardware Description Revision 3 3 aa www avnet embedded eu Edition 2011 11 16 Published by Panasonic Electronic Devices Europe GmbH Zeppelinstrasse 19 D 21337 L neburg Germany 2011 Panasonic Electronic Devices Europe GmbH All Rights Reserved Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics With respect to any examples or hints given herein any typical values stated herein and or any information regarding the application of the device Panasonic Electronic Devices Europe GmbH hereby disclaims any and all warranties and liabilities of any kind including without limitation warranties of non infringement of intellectual property rights of any third party Information For further information on technology delivery terms and conditions and prices please contact your nearest Panasonic Office in Germany or one of our Distributor or write an e mail to wireless eu panasonic com Warnings Due to technical requirements components may contain dangerous
18. B 1st adjacent channel DQPSK C l performance dB co channel DQPSK C I performance dB 1st adjacent channel DQPSK C I performance dB 2nd adjacent channel DQPSK C I performance 3rd adjacent channel 8DPSK C I performance 4th adjacent channel IN e Co e I Qo Co o UJ 8DPSK C I performance dB 3rd adjacent channel 1st adj of image 8DPSK C I performance dB 2nd adjacent channel image 8DPSK C I performance dB 1st adjacent channel 8DPSK C I performance dB co channel 8DPSK C I performance 5 5 dB 1st adjacent channel 8DPSK C I performance 36 25 dB 2nd adjacent channel 8DPSK C I performance 46 33 dB 3rd adjacent channel Maximum input level dBm User s Manual 28 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Package Information 8 Package Information 8 1 Package Marking Please refer to Ordering Information on Page 17 PAN1321 HW SW Version Ordering Code ENW89811xxxF HW Hardware Version Date Code NYYWWDLL SW Software Version FCC ID FEC PAI SENE Machine readable 2D bar code Panasonic usage only 2 could be changed without 1 any notice Case PCB Figure 6 Packag
19. H Measurement Period command can be used to configure the duration of the AFH measurement period 6 2 1 4 Channel Quality Driven Data Rate Change CQDDR PAN1321 SPP supports channel quality driven data rate change according to the Bluetooth 2 0 EDR specification A device that receives an LMP preferred rate message is not required to follow all recommendations PAN1321 SPP normally at least follows the recommendation whether to use forward error correction FEC or not If possible recommendations about packet size and modulation scheme will be taken into account When PAN1321 SPP sends an LMP preferred rate to another device the proposal always includes preferences for all parameters The HCI commands Infineon Enable CQDDR Info Sending and Infineon Disable CQDDR Info Sending turn on and off sending of the Infineon CQDDR Info event This event provides information to the host every time a new CQDDR proposal is sent to a remote device User s Manual 19 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Bluetooth Capabilities 6 2 2 RSSI and Output Power Control 6 2 2 1 Received Signal Strength Indication RSSI PAN1321 SPP supports received signal strength measurements and uses LMP signaling to keep the output power of a remote device within the golden receive power range The range is set with the BD DATA parameters RSSI Min and RSSI Max 6 2 2 2 Output Power Control
20. Internal2 or 1 5 V Internal Section 1 4 provides a mapping between pins and supply voltages The I O power domains VDD1 and VDDUART are completely separated from the other power domains and can stay present also in low power modes 2 2 Clocking PAN1321 SPP contains a crystal from which the internal 26 MHz system clock is generated Also the low power mode clock of 32 kHz is generated internally which means that no external clock is needed User s Manual 14 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Interfaces 3 Interfaces 3 1 UART Interface The UART interface is the main communication interface between the host and PAN1321 SPP The interface consists of four UART signals and two wake up signals as shown in Figure 4 UARTTXD UARTTXD PAN1321 UARTRXD UARTRXD UARTRTS UARTRTS UARTCTS UARTCTS WAKEUP BT PO 14 input WAKEUP HOST PO O output Figure4 UART Interface 3 1 1 UART The UART Universal Asynchronous Receiver and Transmitter interface is compatible with standard UART H4 4 wire The lines UARTTXD and UARTRXD are used for commands events and data The lines UARTRTS and UARTCTS are used for hardware flow control A separate supply voltage VDDUART makes it easy to connect the UART interface to any system 3 1 1 1 Baud Rates The supported baud rates are listed in Table 3 together with the small deviation error that results from the inte
21. P1 4 P1 5 P1 6 P1 7 P1 8 7 3 3 11 6 0 17 Protection Circuits All pins have an inverse protection diode against VSS P0 10 has an inverse diode against Internal2 PO S UARTRXD has an inverse diode against VDDUART All other pins have no diode against their supply User s Manual Hardware Description 0 75 15 0 24 Conditions Pull up current measured with pin voltage 0 V Pull down current measured with pin voltage supply voltage Min measured at 125 C with supply 7 1 35 V Typ measured at 27 C with supply 2 5V Max measured at 40 C with supply 3 63 V Revision 3 3 2011 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF Electrical Characteristics 7 3 4 System Power Consumption Table 13 Max Load at the Different Supply Voltages Parameter Unit Note Test Condition Vsupply mA Peak current Note O currents are not included since they depend mainly on external loads 7 4 AC Characteristics 7 5 RF Part 7 5 1 Characteristics RF Part The characteristics involve the spread of values to be within the specific temperature range Typical characteristics are the median of the production All values refers to Infineon reference design All values will be updated after verification Characterisation 7 5 1 1 Bluetooth Related Specifications Table 14 BDR Transmitter Part Parameter Symbol Values
22. PSQRPPAOSTS SITAE escri 37 Figure 14 Tape on ING uade outcomes CX CRUS qp an X COR OH 809 78 ge RR LO SUUS de ade beet arate Head 38 Figure 15 Eutectic Lead Solder Profile llli llle 39 Figure 16 Eutectic Leadfree Solder Profile llle 39 Figure 17 Solder Printing 0 0 ccc RR Rss 41 Figure 18 X ray Picture Showing Voids Conforming to IPC A 610D llle 42 User s Manual 6 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF List of Tables List of Tables Table 1 PD SSCDUON acy pasa Gado a a oe ele eee Sw ah aU Eee Sd Be eRe nw cca 10 Table 2 Firmware Releases as of 2011 11 16 20 0 0 0 0 ne eee ees 13 Table 3 UART Baud Rates a ara dici ede np es de C gn am ie a Ga wn BG ae ac Gran wel WR we Se RA 15 Table 4 Order Gode as 012011511910 a sek chee el Gide ROO US as dna Ree eh owdaad oh eee dat os 17 Table 5 Absolute Maximum Ratings eee eee eee ene 21 Table 6 Operating Conditions ee ee ee ee eee 21 Table 7 Internal1 1 5 V Supplied Pins 0 0 0 0c eee nee eens 22 Table 8 Internal2 2 5 V Supplied Pins 0 0 0 cc ee ee eee eens 22 Table 9 VDDUART Supplied PIOS 54 wave crt a ide de Ree Gi a 22 Table 10 VDDT1 Supplied PINS 3 34 dod srg aeq 9e ded CRAT NER ge CUR ded CER a SOR o CS od C a KOC dr ac os 23 Table 11 ONOFF PIN cas sera enetan re henge EWESTIS ET PEE G3 aaa haa ORE E d V
23. Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Ordering Information 4 3 1 Apple Authentication Chip The below Figure 5 will give a rough overview how the hardware concept looks like in addition the init commands are shown to establish a link between PAN1311i 1321i and the Apple Device Apple PAN1321 Init Commands Authentication Coprocessor Controller PAN1321 EEPROM Ceramic 1 Antenna Filter Matching Voltage Regulator Figure5 Simplified Block Diagram when using an Apple Authentication Chip 9 Ordering Information This chapter shows the different order codes for the PAN1321 SPP In case there is no specific software version mentioned in the order we will always deliver the latest official software release which is downwards compatible Please refer also to Table 2 Firmware Releases as of 2011 11 16 on Page 13 Table 4 Order Code as of 2011 11 16 Order Code Description MOQ ENW89811K4CF PAN1321 SPP Bluetoth 2 0 Module with integrated Antenna anda 1500 standard SPP software ENW89811A6KF PAN1321 SPP Bluetoth 2 0 Module with integrated Antenna anda 1500 spezial SPP software which supports Apples iPhone 1 Abbreviation for Minimum Order Quantity MOQ The standard MOQ for mass production are 1500 pieces fewer only on customer demand Samples for evaluation can be delivered at any
24. Salvage scele eee hh hh hinh hne 41 10 9 Voids in ine Sold r JOINS 2 6 25 64 ues ex m om Ro sum BHR Sb See OES oS RR Sb RUE ER a EE XU ok d 42 10 9 1 Expected Void Content and Reliability llli llle 42 10 9 2 Parameters with an Impact on Voiding o o oooocoocoornr e 42 11 Terminology 2 4 20m heron da aa Remade bode eee eee eae eee Rema Bee ee 44 12 illia o m 48 User s Manual 5 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF List of Figures List of Figures Figure 1 Simplified Block Diagram of PAN1321 SPP 0 0 eens 9 Figure 2 Pin Configuration for PAN1321 SPP in Top View footprint 0 0 0 0 cee eee 9 Figure 3 Example of a Bluetooth System using eUniStone 0 0 ee 12 Figure 4 s SML crezca ideario saab ai 15 Figure 5 Simplified Block Diagram when using an Apple Authentication Chip 17 Figure 6 Package Malki secre issia oud rr is at dos e 29 Figure 7 Production Package seme rs e a ee e a a c end 29 Figure 8 Top View and Bottom View 0 0 6 rrr sas 30 Figure 9 Reference Design Schematics llle hr 31 Figure 10 Equipment Label hh 33 Figure 11 Declaration of ConforMity hrs 34 Figure 12 Pad Layout on the Module top view l l In 36 Figure 13 TIBIA es x verme spusta ea rEATPPUMRESRRST 9 9IL
25. Top View footprint User s Manual Hardware Description Revision 3 3 2011 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF 1 4 Pin Description All mentioned pins are fix for the product lifetime Pins not listed below shall not be connected Table 1 Pin Description Pin Symbol Input Supply Voltage During No Output Reset Reset A2 P1 6 I OD OD Internal1 Z Z A3 RESET Al Internal1 Input A8 P1 5 I O OD Internal1 Input Input B1 P1 7 I OD OD Internal1 PD Input B2 I D OD Internal1 PD B3 I O OD Internal2 PU B4 I O OD Internal2 Z B9 SLEEPX I O VDDUART PD H C2 P0 9 I O OD Internal2 Z Z C3 Internal2 C4 TRST Internal2 PD PD D1 P0 10 I O OD Internal2 Z Z D2 I O OD Internal2 D3 I O OD Internal2 D4 I O OD VDD1 D5 I O OD VDD1 E1 P0 12 SDAO I O OD Internal2 PU PU E2 P0 13 SCLO I O OD Internal2 PU PU E3 P1 3 I O OD Internal2 Z Z TDO E4 I O OD E5 I O OD EG P0 5 I O OD VDDUART Z Z UARTRXD F2 P12 I O OD Internal2 PU PU TDI F3 P0 11 I O OD Internal2 yA Z User s Manual Hardware Description General Device Overview Function Port 1 6 Hardware Reset active low Port 1 5 Port 1 7 Port 1 8 Port 1 0 or JTAG interface Port 1 4 or JTAG interface Connect to VDD1 and refer to chapter 12 item 2 oleep indication signal Port 0 9 Mode selection Port 1 0 JTAG 1 Port JTAG interface Port 0 10 P
26. Unit Note Test Condition Min Max Output power high gain 4 5 dBm Default settings Output power highest gain RR 4 5 dBm Maximum settings Power control step size 4 8 dB Frequency range fL EE 2401 3 MHz Frequency range fH 2480 7 2483 5 MHz 20 dB bandwidth mE 0 930 11 MHz 2nd adjacent channel power 20 dBm 3rd adjacent channel power OD 40 dBm gt 3rd adjacent channel power pom 40 dBm Max 2 of 3 exceptions 52 MHz offset might be used Average modulation deviation mE 140 156 175 kHz for 00001111 sequence Minimum modulation deviation 115 kHz for 01010101 sequence Ratio Deviation 01010101 0 8 1 Deviation 00001111 Initial carrier frequency 15 kHz tolerance foffset User s Manual 25 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu Panasonic PAN1321 SPP ENW89811xxxF Table 14 Parameter BDR Transmitter Part cont d Carrier frequency drift one slot fdrift Max Electrical Characteristics Unit Note Test Condition kHz Carrier frequency drift three slots fdrift kHz Carrier frequency drift five slots fdrift kHz Carrier frequency driftrate one slot fdriftrate Carrier frequency driftrate three slots fdriftrate Carrier frequency driftrate five slots fdriftrate OO BDR Receiver Part Symbol Table 15 Parameter Values Min Typ
27. W89811xxxF General Device Overview 1 5 System Integration PAN1321 SPP is optimized for a low bill of material BOM and a small PCB size Figure 3 shows a typical application example Keys Leds AT command interface SPP Serial Port Profile j RO Oscillato Osciator API om EEPROM Voltage Regulator VSUPPLY Antenna Example Application PAN 1311 vsd Figure3 Example of a Bluetooth System using eUniStone User s Manual 12 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF General Device Overview The UART interface is used for communication between the host and PAN1321 SPP The lines UARTTXD and UARTRXD are used for commands events and data The lines UARTRTS and UARTCTS are used for hardware flow control Low power mode control of PAN1321 SPP and the host can be implemented in by using the pins P0 14 and PO O P0 14 is used by the host to allow PAN1321 SPP to enter low power mode and P0 0 is used by PAN1321 SPP to wake up the host when attention is required Additionally the host could hardware reset PAN 1321 SPP using the RESET pin Power is supplied to a single VSUPPLY input from which internal regulators can generate all required voltages The UART and the GPIO s interfaces have separate supply voltages so that they can comply with host signaling 1 6 FW version PAN1321 SPP is available in different firmware FW versions Please
28. apter 1 4 Added Table 2 Firmware Releases as of 2011 11 16 on Page 13 and updated the Chapter 12 Rev3 3 Updated the following Chapter 12 Added the following Chapter 4 3 Apple iPhone Support on Page 16 Chapter 5 Ordering Information on Page 17 Trademark Information BlueMoon is a trademark of Intel Mobile Communications GmbH IPhone iPad iPad and Apple are trademarks of Apple Inc User s Manual 3 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Table of Contents Table of Contents Sabie OF CODIGOS ou uuo urea eias om a Soleo Ue DH eee eee eae ls eee Ae elle Soma ees 4 List OF Figures oos io bane a ai uds M d edt had abr 2 eae ond aha as ae Aa eas rio a ee oe 6 LIST Or DADIOS 42505 penes PERI eeeeues oes abe oo Ea aa I RUSEEPEQEES YI Pd mE P 7 1 General Device Overview 00 eee ee ees 8 1 1 A cq wvrrrrrrrrrTPTTE 8 1 2 sime aii ELT 9 1 3 Pin Configuration LGA 1 eee eee eee ens 9 1 4 FI DeScriDHODl 2 weweusnavereTeuumcAeeY 922PUONCEEd NE PR ded ess cence np E ES 10 1 5 system Integration ehh hh hane 12 1 6 PU VCISIOW encinas oasis parra ross cars iiem asar 13 2 Basic Operating Information s 14 2 1 POWEISUDDIV escribiera e tae aaa De 14 2 2 nn 14 3 ECES lt cosas asbesto ras eo be ada deo oe sas ans aa cara 15 3 1 B diio 79 203 sea voor ea aa asas 15 3 1 1 HART us ona o ed
29. atch concept used in PAN1321 is described below 4 2 1 Patch Support PAN1321 SPP contains dedicated hardware that makes it possible to apply patches to the code and data in the firmware ROM The hardware is capable of replacing up to 32 blocks of 16 bytes each with new content This area can be filled with any combination of code and data The firmware patch is stored in EEPROM and automatically loaded after startup This provides a flexible bugfix solution for the ROM part of the firmware 4 3 Apple iPhone Support The PAN1311i and PAN1321i support Bluetooth Apple iPhone connectivity An Apple authentication IC is required to exchange data with an Apple Device or access an Apple Device application The Bluetooth SPP profile capable of recognizing the Apple authentication chip along with the Bluetooth stack is stored and runs on the PAN13111 13211 Customers using the Apple authentication IC must register as developer to become an Apple certified MFI member License fees may apply for additional information visit http developer apple com programs which program index html Certified MFI developers receive technical specifications describing the iPod Accessory protocol the communication protocol used to interact with iPod iPhone and iPad Developers also gain access to the ordering information of the hardware connectors and components that are required to manufacture iPod iPhone and iPad accessories User s Manual 16
30. ctive R amp TTE The conformity assessment procedure used for this declaration is Annex IV of this Directive Product compliance has been demonstrated on the basis of EN 301 489 1 V1 8 1 m _ EN 301 489 17 V2 1 1 For article 3 1 b Electromagnetic Compatibility RAVA The technical contruction file is kept available at Panasonic Electronic Devices Europe GmbH Zeppelinstrasse 19 21337 Lueneburg Germany Issued on 31st of March 2010 Signed by the manufacturer Company name Panasonic Electronic Devices Europe GmbH fon PEA Signature EN Printed name Heino Kaehler Title Manager Wireless Modules Figure 11 Declaration of Conformity User s Manual 34 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Important Application Information 9 7 Bluetooth Qualified Design ID Panasonic has submitted End Product Listing EPL for PAN1321 based on Infineon eBMU plattform in the Qualified Product List of the Bluetooth SIG These EPL are referring the Bluetooth qualfication of the SPP AT application running on the eBMU chip under QD ID B014433 Manufacturers of Bluetooth devices incorporating PAN1321can reference the same QD ID number Bluetooth QD ID B014433 PAN1321 SPP BT2 0 9 8 Industry Canada Certification PAN1321 complies with the regulatory requirements of Industry Canada IC license IC 216Q EBMU Manufacturers of mobile fixed
31. e Marking 8 2 Production Package Production Package vsd Figure 7 Production Package All dimensions are in mm Tolerances on all outer dimensions height width and length are 0 2 mm User s Manual 29 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Package Information 8 2 1 Pin Mark Pin 1 A1 is marked on bottom footprint and on the top of the shield on the module according to Figure 8 Diameter of pin 1 mark on the shield is 0 15 mm PAN132122 07 000000000 um y e ee ee 0902401 000000 0 IO FCC ID T7 VEBMU 0000000090 Pin 1 marking top side Pin 1 marking bottom side Figure 8 Top View and Bottom View User s Manual 30 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP ENWS89811xxxF Important Application Information Panasonic Important Application Information 9 Reference Design 9 1 X3 F2 C6 100n Pouer Supply Section 2 V Suppl F250 X4 GND od f Serial Level Converter FOFF FORCEON INVALID READY R2IN R20UT RAIN R10UT T20UT T2IN T1O0UT TAIN VART CTS 330 R12 oT UART_RTS WAKEUP BT GND P1 6 RESET USUPPLY_1 USUPPLY_2 USUPPLY_3 GND1 P1 5 CLK32 GND2 WAKEUP HOST P1 7 WAKEUP_BT IMS P1 8 WAKEUP_HOST BICI
32. ementation There are no parts in ENW8981 1xxxF that can be modified by the user except modifications of the device BD data and loading of SW patches Any changes or modifications made to this device that are not expressly approved by Infineon may void the user s authority to operate the equipment 9 2 FCC Class B Digital Devices Regulatory Notice This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by 1 or more of the following measures e Reorient or relocate the antenna Increase the separation between the equipment and receiver e Connect the equipment into an outlet on a circuit different from that to which the receiver is connected e Consult the dealer or an experienced radio or television technician for help 9 3 FCC Wireless Notice This product emits radio f
33. ign solder printing process assembly soldering process rework and inspection 10 1 General Description of the Module PAN1321 SPP is a Land Grid Array LGA 6x9 module made for surface mounting The pad diameter is 0 6 mm and the pitch 1 2 mm All solder joints on the module will reflow during soldering on the mother board All components and shield will stay in place due to wetting force Wave soldering is not possible Surface treatment on the module pads is Nickel 5 8 um Gold 0 04 0 10 um Figure 12 shows the pad layout on the module seen from the component side 15 6 mm 1 0 1 2 5 0 A E F 4 UARTCTS VDDUART UARTIXD UARTRTS E 1 UARTRXD D1 c N 10 6 n B1 l SLEEPX A1 l RESET VSUPPLY VSUPPLY VSUPPLY GND Al A2 A3 A4 AS A6 AT A8 A9 Figure 12 Pad Layout on the Module top view 10 2 Printed Circuit Board Design The land pattern on the PCB shall be according to the land pattern on the module which means that the diameter of the LGA pads on the PCB shall be 0 6 mm It is recommended that each pad on the PCB shall be surrounded by a solder mask clearance of about 75 um to avoid overlapping solder mask and pad 10 3 Solder Paste Printing The solder paste deposited on the PCB by stencil printing has to be of eutectic or near eutectic tin leadfree lead composition A no clean solder paste is preferred since cleaning of the solder joints is difficult because of the small gap bet
34. ines Stencil thickness A thick solder paste stencil means more surface area to the air and thereby easier for the outgassing flux to leave the solder Temperature soldering profile Too short preheat time means that the flux does not get enough time to react and flux get entrapped in the solder and create voids Too long reflow time gives larger voids Too short reflow time gives a fraction of voids User s Manual 43 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu Panasonic PAN1321 SPP ENW89811xxxF 11 A ACK ACL AFH AHS ARQ B b B BALUN BD ADDR BER BMU BOM BT BW C CMOS COD CODEC CPU CQDDR CRC CTS CVSD CDCT CQDDR DC DDC DM DMA DH DPSK DQPSK DSP DUT User s Manual Terminology Acknowledgement Asynchronous Connection oriented logical transport Adaptive Frequency Hopping Adaptive Hop Sequence Automatic Repeat reQuest bit bits e g kb s Byte Bytes e g kB s BALanced UNbalanced Bluetooth Device Address Bit Error Rate BlueMoon Universal Bill Of Material Bluetooth Bandwidth Complementary Metal Oxide Semiconductor Class Of Device COder DECoder Central Processing Unit Channel Quality Driven Data Rate Cyclic Redundancy Check Clear To Send UART flow control signal Continuous Variable Slope Delta modulation Clock Drift Compensation Task Channel Quality Driven Data Rate Direct Current Device Data Control Data Medium Rate pac
35. ket type Direct Memory Access Data High Rate packet type Differential Phase Shift Keying modulation Differential Quaternary Phase Shift Keying modulation Digital Signal Processor Device Under Test 44 Hardware Description Terminology Revision 3 3 2011 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF E EDR EEPROM eSCO EV F FEC FHS FIFO FM FW GFSK GPIO GSM HCI HCI HEC User s Manual Enhanced Data Rate Electrically Erasable Programmable Read Only Memory Extended Synchronous Connection Oriented logical transport Extended Voice packet type Forward Error Correction Frequency Hop Synchronization packet First In First Out buffer Frequency Modulation Firmware Gaussian Frequency Shift Keying modulation General Purpose Input Output Global System for Mobile communication Host Controller Interface Infineon Specific HCI command set Header Error Check High quality Voice packet type Hardware Inter IC Control bus Inter IC Sound bus Inquiry Access Code IDentifier Institute of Electrical and Electronics Engineers Intermediate Frequency Industrial Scientific amp Medical frequency band Joint Test Action Group Local Area Network Lower Address Part Link Manager Link Manager Protocol Low Noise Amplifier Local Oscillator Low Power Mode s Low Power Oscillator 45 Hardware Description Terminology Revision 3 3 201
36. less voiding area area Figure 18 shows an example of void content at a module assembled at production site Normally you can see the whole spectra of void content variation within the same lot and occasion of assembly Voids_IPC_A_610D vsd Figure 18 X ray Picture Showing Voids Conforming to IPC A 610D 10 9 2 Parameters with an Impact on Voiding If the void content has to be reduced following parameters have an impact Solderability on module and PCB Bad solderability is often connected to oxidation and has therefore a major impact on voiding Flux will get entrapped on oxidized surfaces In general Ni Au pads show fewer voids than HASL and OSP Solder paste Higher activity of the flux will remove oxide rapidly and less flux will get entrapped Voiding increases with increasing solder paste exposure time since long exposure time will result in more oxidation and moisture pickup Pad size A large soldering pad means that the outgassing flux has a longer way to the surface of the solder and will thereby create more voids Solder paste Smaller powder size and higher metal load means more metal surface to deoxidize and thereby more entrapped flux and voiding Higher metal load does also mean higher viscosity and more difficult for outgassed flux to remove from the solder User s Manual 42 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Assembly Guidel
37. ndition Min Typ Max Input low voltage 0 3 0 45 Input high voltage 1 93 P0 10 Input high voltage 1 93 syo Other pins Output low voltage V IOL 5 mA Output low voltage IOL 2 mA Output high voltage V IOH 5 mA Output high voltage IOH 2 mA Continuous Load Pin Capacitance Magnitude Pin Leakage 0 25 0 15 2 0 2 1 0 01 Input and output drivers disabled 1 The totaled continuous load for all Internal2 supplied pins shall not exceed 35 mA at the same time Table 9 VDDUART Supplied Pins Parameter Symbol Values Unit Note Test Condition Min Typ Max Input low voltage 0 3 V Input high voltage 0 7 VDDUART Input high voltage User s Manual Hardware Description 0 7 VDDUART VDDUART 0 3 V PO S UARTRXD 3 6 V Other pins 22 Revision 3 3 2011 11 16 www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF Electrical Characteristics Table 9 VDDUART Supplied Pins cont d Parameter Symbol Values Note Test Condition Min Typ Max Output low voltage IOL 5 mA VDDUART 2 5 V Output low voltage IOL 2 mA VDDUART 2 5 V Output high voltage VDDUART IOH 5 mA 0 25 VDDUART 2 5 V Output high voltage VDDUART IOH 2 mA 0 15 VDDUART 2 5 V Continuous Load Pin Capacitance Magnitude Pin Leakage Input and output drivers disabled 1 The totaled continuous load for all VDDUART s
38. ntain several plastic packages and is there by sensitive of the moisture content level at the time of board assembly Overheating in combination with excessive moisture content could result in package delaminations or cracks popcorn effect The heating rate should not exceed 3 C s and max sloping rate should not exceed 4 C s PAN1321 shall be handled according to MSL3 which means a floor life of 168h in 30 C 60 r h The PAN1321 module can be soldered according to max J STD 020C curve assuming that all other conditions are followed stated in Product Specification Qualification Report and in Application Note Restriction is that PAN1321 can be soldered two times since one time is already consumed when soldering devices on Module 10 6 Rework 10 6 1 Removal Procedure 1 Heat the module with an appropriate heating nozzle according to the instruction of the equipment or on a hot plate about 225 C dependent on the board Hot plate can only be used if the board is single side assembled The temperature of the module shall be 200 220 C 2 Use grippers or a pair of tweezers to remove the module The module has to be gripped on two opposite edges of the module not on the shield 3 Remove excess solder by using solder sucker suction soldering irons or solder wick 10 6 2 Replacement Procedure Replacement can be done in two ways dependent of how the solder is applied Solder can be applied either by dispensing on the mother board o
39. o cause permanent damage to the device Exposure to absolute maximum rating conditions for extended periods may affect device reliability Maximum ratings are absolute ratings exceeding only one of these values may cause irreversible damage to the integrated circuit Maximum ratings are not operating conditions 7 2 Operating Conditions Table 6 Operating Conditions Parameter Symbol Values Unit Note Test Condition Min Typ Max Operating temperature 40 85 C Main supply voltage Vsupply 2 9 4 1 V VDDUART 1 35 3 6 VDD1 1 35 3 6 V User s Manual 21 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF 7 3 7 3 1 DC Characteristics Pad Driver and Input Stages For more information see Chapter 1 4 Electrical Characteristics Table 7 Internal1 1 5 V Supplied Pins Parameter Symbol Values Unit Note Test Condition Min Typ Max Input low voltage 0 3 0 27 V Input high voltage 1 15 3 6 V Output low voltage 0 25 IOL 1 mA Output high voltage IOH 1 mA Continuous Load Pin Capacitance V mA Magnitude Pin Leakage Input and output drivers disabled 1 The totaled continuous load for all Internal1 supplied pins shall not exceed 2mA at the same time Table 8 Internal2 2 5 V Supplied Pins Parameter Symbol Values Unit Note Test Co
40. oa oes os eee Se sown eee see eee ae ee vi ne eee oa 15 3 1 1 1 zl all c cargos ee rodas sae oe eee Re eee oe IPTE 15 4 General Device Capabilities 0 0 00 ee ee eee 16 4 1 nel as a Sears do tee Ses aa Geen oe Boe wie Bee yA ae ene Bee E EEE Rca ee 16 4 2 Firmware ROM PA IChING siiis ipang dente ove ed lt 9 664634600528 Sneed oie nee en re nct s 16 4 2 1 PACE ODDO P dee ss wae aa E ee eee ea coe arses eee re oe Ge eee ee ee eg 16 4 3 Apple iPhone Support 0 0 0 ccc eee eee eee nes 16 4 3 1 Apple Authentication Chip 0 0 0 eee eee eens 17 5 Ordering Information ee rs 17 6 Bluetooth Capabilities o o o o s 18 6 1 Supported Features ee hinh nes 18 6 2 PAN1321 SPP Specifics and Extensions 2 0 0 0 0c eee eens 19 6 2 1 During Connection uuo Suus toons Swap xe umso demo ded ii pu drei adici drm 19 6 2 1 1 so cEQUIeMECC TP 19 6 2 1 2 Dynamic Polling Strategy o ooooooooorr Rn 19 6 2 1 3 Adaptive Frequency Hopping AFH 0 0 0 ccc eee eee eee 19 6 2 1 4 Channel Quality Driven Data Rate Change CQDDR 0 2 002 c eee ee 19 6 2 2 RSSI and Output Power Control 0 0 0 0 aa cee ene 20 6 2 2 1 Received Signal Strength Indication RSSI eens 20 6 2 2 2 Ou tp t Power Control lt is ios se eiaa ICE ea eta we rede ORE 18 US RUE dc Do d ages 20 6 2 2 3 Ultra Low Transmit Power
41. or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and or RF exposure limits Users can obtain Canadian information on RF exposure and compliance from www ic gc ca This device has been designed to operate with the antennas listed in Table 18 above having a maximum gain of 4 0 dBi Antennas not included in this list or having a gain greater than 4 0 dBi are strictly prohibited for use with this device The required antenna impedance is 50 ohms The antenna used for this transmitter must not be co located or operating in conjunction with any other antenna or transmitter 9 9 Label Design of the Host Product It is recommended to include the following information on the host product label Contains transmitter Module FCC ID T VEBMU IC 216QEBMU 9 10 Regulatory Test House The test house used by Panasonic in the Bluetooth and Regulatory approvals for the module PAN1321 Eurofins Product Service GmbH Storkower Str 38c D 15526 Reichenwalde b Berlin GERMANY Tel 49 33631 888 0 Fax 49 33631 888 650 www eurofins com User s Manual 35 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Assembly Guidelines 10 Assembly Guidelines The target of this document is to provide guidelines for customers to successfully introduce the PAN1321 SPP module in production This includes general description PCB des
42. ort 0 8 Port 1 1 or JTAG interface Port 0 3 Port 0 2 I2C data signal I2C clock signal Port 1 3 or JTAG interface Port 0 0 LPM wakeup output Port 0 1 Port 0 5 or UART receive data Port 1 2 or JTAG interface Port 0 11 Revision 3 3 2011 11 16 www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF General Device Overview Table 1 Pin Description Pin Input Supply Voltage During Function No Output Reset F4 I O VDDUART Port 0 14 LPM wakup input F5 I O OD VDDUART Port 0 7 or UART CTS flow control F7 I O OD VDDUART Port 0 4 or UART transmit data F8 PO0 6 I O OD VDDUART PU PU Port 0 6 or UARTRTS UART RTS flow control A4 VSUPPLY S Power supply Ad A6 C1 VREG SO Regulated Power supply F6 VDDUART S UART interface Power supply C5 VDD1 S Power supply A1 VSS Ground AT AQ C8 C9 D7 D8 E8 E9 F1 F9 1 Fixed pull up pull down if JTAG interface is selected not affected by any chip reset If JTAG interface is not selected the port is tristate Descriptions of acronyms used in the pin list Acronym Description Input O Output OD Output with open drain capability Z Tristate PU Pull up PD Pull down A Analog e g Al means analog input S Supply e g SO means supply output User s Manual 11 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic EN
43. r by printing the solder paste directly on the module 10 6 2 1 Alternative 1 Dispensing Solder A dispenser with controlled volume must be used to assure the same volume on every pad The volume on each pad shall be about 0 04 mm 1 Dispense 0 04 mm on each LGA pad 2 Pick the module by a nozzle and place in the right position on the board 3 Reflow the solder User s Manual 40 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Assembly Guidelines 10 6 2 2 Alternative 2 Printing Solder To print solder on the module a fixture must be used The purpose of the fixture is to get a flat surface and fix the stencil and module for printing An example of how this fixture can be designed is shown in Figure 17 Solder paste stencil E Cavity of the module Tooling pins Vacuum holes Fixture B ottom Solder_Printing vsd Figure 17 Solder Printing 1 2 3 4 o 6 T 8 9 10 7 Inspection Automatic inspection of the solder paste printing before assembly is highly recommended to ensure high yield and good long term reliability Assemble the fixture to the bottom Place the module in the cavity with the LGA pads upwards Place the solder paste stencil on the fixture and make sure it fits to the tooling pins and the module Apply vacuum to fix the solder paste stencil Apply solder paste on the stencil and print by using a blade Tu
44. requency energy but the radiated output power of this device is far below the FCC radio frequency exposure limits Nevertheless the device should be used in such a manner that the potential for human contact with the antenna during normal operation is minimized To meet the FCC s RF exposure rules and regulations e he system antenna used for this transmitter must not be co located or operating in conjunction with any other antenna or transmitter User s Manual 32 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Important Application Information e The system antenna used for this module must not exceed 4 dBi Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance Manufacturers of mobile fixed or portable devices incorporating this module are advised to clarify any regulatory questions and to have their complete product tested and approved for FCC compliance 9 4 FCC Interference Statement This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation 9 5 FCC Identifier FCC ID T7VEBMU 9 6 European R amp TTE Declaration of Conformity Hereby Panasonic Electronic De
45. rn everything bottom fixture and stencil upside down oeparate carefully the bottom from the fixture Pick the module by a nozzle and place in the right position on the board Reflow the solder 10 8 Component Salvage If itis intended to send a defect PAN1321 module back to the supplier for failure analysis please note that during the removal of this component no further defects must be introduced to the device because this may hinder the failure analysis at the supplier This includes ESD precautions not to apply high mechanical force for component removal and to prevent excess moisture content in the package during salvage risk of pop corning failures Therefore if the maximum storage time out of the dry pack see label on packing material is exceeded after board assembly the PCB has to be dried 24h at 125 C before soldering off the defect component because otherwise too much moisture may have been accumulated User s Manual 41 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Em Panasonic ENW89811xxxF Assembly Guidelines 10 9 Voids in the Solder Joints 10 9 1 Expected Void Content and Reliability The content of voids is larger on LGA modules than for modules with BGA or leads At a LGA solder joint the outgassing flux has a longer way to the surface of the solder and it has a relatively small surface to the air The void content of the PAN1321 module conforms to IPC A 610D 25 or
46. rnal clock generation The default baud rate is 115200 Baud Table 3 UART Baud Rates Wanted Baud Rate Real Baud Rate Deviation Error 96 19200 19230 0 16 5 600 57522 0 14 230400 230088 0 14 921600 928571 0 76 3250000 3250000 0 User s Manual 15 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF General Device Capabilities 4 General Device Capabilities This chapter describes features available in the PAN1321 ENW89811xxxF core Actual feature set and how to access the features can be found in the AT Command document 1 Release specific performance characteristics like data speed is related in the SW Release Notes 1 4 1 HCI The PAN1321 module can be programmed over UART with a specific application for RF test purposes like TX continuous or TX burst mode This test application is controlled over the UART through Infineon specific HCI commands The commands supported by this test application are described in the document T8753 2 Infineon Specific HCl Commands 7600 paf 4 2 Firmware ROM Patching In any chip with complex firmware in ROM it is wise to support patching The risk of project delay is significantly reduced when problems can be solved without hardware changes Enhancements adaptations and bug fixes can be handled very late during design in even after the PAN1321 has been soldered in the final product The well proven p
47. uests on the same or other links are rejected If a role switch fails PAN1321 SPP will automatically try again a maximum of three times Encryption if present is stopped in the old piconet before a role switch is performed and re enabled when the role switch has succeeded or failed 6 2 1 2 Dynamic Polling Strategy In addition to the regular polling scheme PAN1321 SPP dynamically assigns unused slots to links where data is exchanged This adapts very well to bursty traffic and improves throughput and latency on the links 6 2 1 3 Adaptive Frequency Hopping AFH PAN1321 SPP supports adaptive frequency hopping according to the Bluetooth 2 0 EDR specification AFH switch and channel classification are supported both as master and slave Channel classification from the host is also supported A number of HCI commands and events are available to provide information about AFH operation The commands Infineon Enable AFH Info Sending and Infineon Disable AFH_Info Sending turn on and off the Infineon AFH Info events that provide detailed information about channel classification channel maps interferers etc If enabled by the Infineon Enable Infineon Events command the Infineon AFH Extraordinary RSSI event informs the host whenever extraordinary RSSI measurements in unused slots have been started This is done when the number of known good channels has decreased below a critical limit and periodically after a defined time The Infineon Set AF
48. upplied pins shall not exceed 35 mA at the same time Table 10 VDD1 Supplied Pins Parameter Symbol Values Unit Note Test Condition Min Typ Max Input low voltage 0 3 0 2 VDD1 V Input high voltage 0 7 VDD1 3 6 Output low voltage IOL 5 mA VDD1722 5V Output low voltage IOL 2 mA VDD1 2 5 V Output high voltage VDD1 IOH 5 mA 0 25 VDD1 2 5V Output high voltage VDD1 IOH 2 mA 0 15 VDD1 2 5 V Continuous Load Pin Capacitance Magnitude Pin Leakage 0 01 1 uA Input and output drivers disabled 1 The totaled continuous load for all VDD1 supplied pins shall not exceed 35 mA at the same time Table 11 ONOFF PIN Parameter Symbol Values Unit Note Test Condition Min Typ Max Input low voltage 0 7 V Input high voltage 1 7 VSUPPLY V Input current 1 0 01 1 uA ONOFF 0V User s Manual 23 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF 7 3 2 Table 12 Pin P0 12 P0 13 PO0 0 PO 1 P0 2 P0 3 Pull ups and Pull downs Pull up and Pull down Currents Pull Up Current Pull Down Current Min Typ Max 260 740 1300 22 130 350 Min Typ Max N A N A N A 23 150 Electrical Characteristics Unit uA P0 4 P0 5 P0 6 PO 7 P0 10 P0 8 P0 9 P0 11 P0 14 P0 15 42 24 68 3 0 20 P1 0 P1 1 P1 2 P1 3
49. vices Europe GmbH declares that the Bluetooth module ENW89811xxxF is in compliance with the essential requirements and other relevant provisions of Directive 1999 5 EC As a result of the conformity assessment procedure described in Annex IIl of the Directive 1999 5 EC the end customer equipment should be labelled as follows CE Figure 10 Equipment Label PAN1321 in the specified reference design can be used in the following countries Austria Belgium Cyprus Czech Republic Denmark Estonia Finland France Germany Greece Hungary Ireland Italy Latvia Lithuania Luxembourg Malta Poland Portugal Slovakia Slovenia Spain Sweden The Netherlands the United Kingdom Switzerland and Norway User s Manual 33 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Important Application Information Declaration of Conformity DoC 1999 5 EC We Panasonic Electronic Devices Europe GmbH High Frequency Products Business Group Zeppelinstrasse 19 21337 Lueneburg Germany declare under our sole responsibility that the product Type of equipment Bluetooth 2 0 EDR Module Brand name PAN1321 PAN1311 Model name ENW89811K4CF ENW89810K5CF to which this declaration relates 1s in compliance with all the applicable essential requirements and other provisions of the European Council Directive 1999 5 EC Radio and Telecommunications Terminal Equipment Dire
50. vity typ 86 dBm e Integrated antenna switch balun and antenna filter e Integrated LNA with excellent blocking and intermodulation performance e No external components except antenna Digital demodulation for optimum sensitivity and co adjacent channel performance Bluetooth e Bluetooth V2 0 EDR compliant e SPP Device A and B support 1 ACL link with stream or command mode SPP Device A and B Visible while connected e SPP Device A and B Visible connectable when not connected SPP Device A and B Device Discovery capable after receiving OK on data transfer e Sniff mode is supported with above capabilities e 5 trusted devices stored in EEPROM Testing e Enable DUT e Crystal calibration e H4 with UART HW flow control RTS CTS e Security modes Modes 1 and Mode 3 e Master Slave role switch User s Manual 8 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu Panasonic PAN1321 SPP ENWS89811xxxF 1 2 Block Diagram General Device Overview EEPROM VDD1 VDD UART 1 UART Filter GPIO Matching V supply Voltage Regulator Crystal 26 MHz PAN1321 Block Diagram vsd Figure 1 Simplified Block Diagram of PAN1321 SPP 1 3 Pin Configuration LGA Ol O 3 5 0 Ceramic Antenna 1 0 05 1 2 000090 ee 7 000000000 coo e ce 000000000 0000000090 H 0 0 0 O O O0 O0 O 40 6 Figure 2 Pin Configuration for PAN1321 SPP in
51. ween the module and the PCB Preferred thickness of the solder paste stencil is 100 127 um 4 5 mils The apertures on the solder paste stencil shall be of the same size as the pads 0 6 mm User s Manual 36 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Assembly Guidelines 10 4 Assembly 10 4 1 Component Placement In order to assure a high yield good placement on the PCB is necessary As a rule of thumb the tolerable misplacement is 150 um This means that the PAN1321 module can be assembled with a variety of placement systems It is recommended to use a vision system capable of package pad recognition and alignment that evaluates the pad locations on the package in contrast to outline centring This eliminates the pad to package edge tolerance The recommendation is to pick and place the module with a nozzle in the centre of the shield The nozzle diameter shall not be bigger than 4 mm 10 4 2 Pin Mark Pin 1 A1 is marked on bottom footprint and on the top of the shield on the module according to Figure 13 Diameter of pin 1 mark on the shield is 0 15 mm 1 00 mm Figure 2a Top View Figure 2b Bottom View Figure 13 Pin Marking User s Manual 37 Revision 3 3 2011 11 16 Hardware Description www avnet embedded eu PAN1321 SPP Panasonic ENW89811xxxF Assembly Guidelines 10 4 3 Package
52. y Canada approved and conforms to R amp TTE European requirements and directives with the reference design described in Figure 9 FCC certification is valid together with the following antennas having in mind that this module has the Johansson antenna included Table 18 Antennas Manufacturer Model Type Peak antenna gain Impedance GigAnt Titanis Swivel 4 dBi 50 ohm Tyco Electronics P N 1513151 1 Module 4 dBi 50 ohm Murata LDA312G7313F 237 Ceramic chip 0 dBi 50 ohm Infineon reference design Printed inverted F Antenna 4 dBi 50 ohm PIFA Johansson 2450AT43A100 Ceramic chip antenna 2 dBi 50 ohm Inwave BST 2450 Dipole antenna 2 dBi 50 ohm When using any of the above antennas installed in the appropriate manner it is possible to re use the approvals for the end product It is however required to have a written consent from Infineon Technologies AG to re use the regulatory approvals for the FCC Canada and Europe Manufacturers of mobile fixed or portable devices incorporating this device are advised to clarify any regulatory questions and to have their complete product tested and approved for compliance FCC or other when applicable When using other antennas a class ll permissive change is required for FCC approval The normal procedure is to first provide a technical test report showing that 4 dBi is not exceeded and to continue working with a regulatory test house to finalize the approval for a new antenna impl

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