SMT PRECISION LEADTFREE REFLOW OVEN
Contents
1. parameter setting In the menu shown in Figure 5 press O to select the cooling phase then press O to enter the temperature setting menu Press O or O to change the value from 70 C to that of the previous phase and then press to save it or press to discard the modification 14 Repair Mode parameter setting In the standby menu shown in Figure 13 first press O to select Repair Mode then O to enter the temperature setting menu as shown in Figure 14 Press O or O to adjust the desired temperature then press O to save Repair Mode offers three temperature ranges For temperatures between 70 C and 150 C no time has to be set For temperatures between 150 C and 200 C the time range is 0 to 60 minutes For temperatures between 200 C and 250 C the time range is 0 to 5 minutes After the set time the oven will shut down automatically REPAIR TEMP TIME REPAIR TEMP TIME ES 200 C 10 00 ES 200 C 10 00 EXIT y y OK EXIT y y OK Figure 13 Figure 14 The soldering process With all parameters set the oven is ready to start the 5 phase reflow soldering process Place the circuit board s in the centre of the tray gently close the drawer and press to enter the working state as shown in Figures 15 1 and 15 2 The working indicator on the oven will light up and the screen will display Working with the temperature and time values being updated as the process evolves When the temperature reaches the use2. 4 3 1 1 5 217 99 3 0 7 227 95 5 240 Operation There are two working modes to select on the equipment Solder and Repair The Solder mode is designed to solder components onto pads or tracks on the circuit board the process comprising the phases displayed as PREH preheating HEAT heating SLDR soldering KEEP heat retention and COOL wait for the machine to cool down The Repair mode is designed to remove components from the circuit board This phase has only one temperature section Before you enter this mode make sure the correct parameters are set Parameters relevant to oven operation must be set on first time use or when the solder tin composition has been changed 1 Power on Apply line power to the equipment by operating the rocker switch on the rear panel The red light near the left corner top of the display will come on To enter the standby state press on the panel as shown in Figure 3 1 or 3 2 SOLDER TEMP TIME 150 C 02 00 RUN 00 Figure 3 1 Oven standby page in Text display mode PREH T 150 C 00 30 00 Figure 3 2 Oven standby page in Graphic display mode 10 2 System settings To enter the system setting mode turn on the line power switch then press and hold down the button while pressing the button As shown in Figure 4 1 the display shows the language and the LCD mode options Press the O or O button to sel
3. and even x ray support 2 Reflow curve pre testing a time consuming series of experiments may be required to arrive at a known good temperature curve for successful BGA soldering Users should be aware that the soldering BGA devices is a complex task and might fail if he she has little or no experience It is recommended to 1 Refrain from using BGAs for any initial or beginners level experiments with the oven 2 Attend a hands on seminar or workshop session on BGA soldering before trying the process on your own The substance of the Disclaimer on the second page of this manual is reiterated here 22 Warranty statement Definitions The Company shall refer to Elektor International Media B V The Package shall refer to the hardware software and other component parts of this product The Period shall be one year from the date of delivery Warranty The Company warrants that this Package is free from significant defects in materials and workmanship for the Period This warranty is not transferable and does not include software upgrades Checking your product This Package has been tested in the factory in accordance with the Company s quality guidelines We strongly recommend that you carry out your own tests with this product in accordance with the User Test guidelines available for the product which will confirm for you that this Package meets the specification for which it has been designed Exclusio
4. and reworking as well as SMD drying The performance and operation of the oven have been upgraded and improved from a previous version Main technical features Line voltage 230 VAC Line frequency 50 60 Hz Max power consumption 1650 W 10 A fused internally Heating methods infrared radiation and hot air mixed heating Menu languages English or German partly Readout LCD Text mode or Graphics mode Modes of operation automatic reflow soldering repair maintenance temp adjustable Temperature phases curve sections Preheat heat solder heat retention cool down Preheating temp time range 70 C 150 C 0 5 min Heating temp time range preheating temp to 220 C 0 5 min Soldering temp time range heating temp to 280 C 0 30 s 0 60 s below 260 C Heat retention temp time range soldering temp to soldering temp 0 to 50 C Effective soldering area 280x280 mm 11x11 inch Size 418x372x250 mm 16 5x14 6x10 inch Weight 16 7 kg net Case and finish steel high gloss gray lacquer finish CE compliant RoHS compliant Equipment description Case m Display Control buttons Power receptacle fuse and power on off switch on rear panel Drawer handle Drawer with SMT board tray Figure 1 Control button descriptions SOLDER TEMP TIME E 150 C 02 00 00 Figure 2 press to turn the equipment on or off It is not possible to switch th
5. manufacturer s production line It is certified to have successfully completed at least two complete reflow processes The test was performed using these parameters V Pre heating PREH 150 C for 60 seconds V Heating HEAT 220 C for 90 seconds V Soldering SLDR 260 C for 30 seconds Y Temp Retention KEEP 245 C Y Cool down COOL 150 C 300 PREHEATING HEATING OLDERING KEEPING COOLING DOWN 250 N So o TEMPERATURE C 3 a 50 0 30 60 90 120 150 180 210 240 270 300 TIME sec 20 Appendix C Tray temperature vs displayed temperature The temperature value you may read on the display is the oven s internal air temperature This can be slightly different from the temperature measured on the PCB tray The latter value is marginally lower in most cases For this reason it is strongly suggested to run a few dummy tests before starting volume production of boards The values given in Appendix A are good starting points allowing you to tune the various times for best results 21 Appendix D Ball Grid Array BGA soldering Although the equipment is suitable for soldering BGA devices this should be done with extreme caution and only if sufficient expertise and experience has been developed by the user s The most difficult aspects of BGA soldering include 1 Component placement this is extremely difficult by hand and really requires the use of specialized expensive optical equipment with camera
6. C and 180 C for example the Sn42 Bi58 and Sn43 Pb43 Bi14 alloys For mid temperature lead solder alloys set the temperature between 180 C and 220 C For high temperature lead free solder alloys the temperature should be set between 220 C and 250 C If you have reliable technical information on the solder material s the temperature of the heating phase can be set to about 10 C below the tin solder melting point for best results 3 Soldering phase This phase serves to finish the SMT soldering process It has the highest temperature in the soldering process hence components are easily damaged if the temperature and or time are set incorrectly The process is marked by substantial physical and chemical changes to the solder which determine to a large extent the success of the entire soldering process If you have reliable technical information on the solder material s in solid and liquid state the soldering temperature can be set 30 50 C above the melting point Solder material may be divided into three groups low temperature 150 180 C mid temperature 190 220 C high temperature 230 260 C Currently lead free solder materials for high temperature soldering are the widest used Low temperature lead free variants based on precious metals are also available for special requirements At present many lead free solder materials are no substitute for lead solder as mid temperature leaded solder has excellen
7. UDO 20 k HEAT 200 CUAD OOOO O 00000 Figure 9 Figure 10 Press the O button to save the temperature setting and proceed to the time setting As shown in Figure 11 press or to set a time between 0 and 5 minutes Then press 8 to save the setting and return to Mode Select or press to enter the standby state as shown in Figure 12 SOLDER TEMP TIME SOLDER TEMP TIME HEAT OO 1 00 bs PREH 150 C 02 00 EXIT y y OK RUN ya Y SET 00 00 Figure 11 Figure 12 Solder SLDR parameter setting In the menu shown in Figure 5 press O to select the soldering phase then press O to enter the temperature setting menu Press O or O to adjust the temperature to a value between heating temperature and 280 C Next press to save the setting and enter the time setting menu For temperatures between 250 C and 280 C a time span of 0 to 30 seconds is available For temperatures lower than 250 C a value between 0 and 60 seconds may be set Next press to save the setting or press Oo to discard the modification Retention KEEP parameter setting In the menu shown in Figure 5 press O to select the temperature retention phase then press SET to enter the temperature setting menu Press or to change the setting value and then press 8 to save it or press 8 to discard the modification The software prohibits setting a value smaller than 50 C below that of the previous phase Cooling COOL
8. a lektor wy electronics worldwide SMT PRECISION LEAD FREE REFLOW OVEN USER MANUAL Associated publications Elektor SMT Precision Reflow Oven Elektor October 2008 Before Baking Elektor October 2008 Baking Elektor October 2008 Elektor International Media 2008 www elektor com www elektor de www elektor es www elektor nl www elektor fr Disclaimer Elektor International Media b v shall not be liable in contact tort or otherwise for any loss or damage suffered by the purchaser s whatsoever or whosoever arising out of or in connection with the use of this equipment other than at the option of Elektor International Media to refund the purchaser money in respect of the equipment if purchaser s returns equipment in unused resalable condition after having obtained written approval to do so from Elektor International Media b v Any use of the oven not explicitly described in this manual is strongly advised against and will void purchaser s warranty Equipment not suitable for heating foodstuffs liquids or tissue Equipment must not be used in the vicinity of children animals or unqualified people Contents Introduction a ruido ss Geen ae eae aE aa ae eae Ra Wk ae eae 4 Main technical features o o o o oooo eee nae 4 Equipment description 1 0 ee eee 5 Control button descriptions 2 0 ee nae 5 Function of the temperature curve ooo ooo eens 6 Common allo
9. e oven OFF if it is working or if the temperature has not dropped to a safe level O or O press to change parameter settings press to run set parameters and save settings O press to run complete process exit running process or exit setting process Function of the temperature curve In the SMT production process the temperature curve should be adjusted according to different alloys of solder tin used as well as the solder paste used aiming to achieve the best quality of the finished product Usually reflow soldering comprises five temperature phases curve segments The temperature and the time of each phase can be set to satisfy the combined requirements of different circuit boards The various temperatures and their role for the reflow phases are described individually 1 Preheating phase Heating the PCB from room temperature to 120 150 C serves to evaporate moisture as well as to eliminate internal stresses and residual gasses of the PCB By setting a period of 1 to 5 minutes for this segment preheating is also a gradual transition to the next temperature phase the optimum time depending on board size and the number of the components 2 Heating phase Heating activates the liquid flux contained in tin alloy enabling it to remove oxide layers from SMDs in preparation for soldering For low temperature lead alloy solder and precious metal alloy solder tin the temperature in this phase should be set between 150
10. ect your preference then press o to confirm it and finally press to save the setting English V German GraphMode TextMode y 00 Figure 4 1 System setting Text mode TO IS MOR MO German D G gt GraphMode gt TextMode OK 00 Figure 4 2 System setting Graphic mode As shown in Figure 4 2 one of six curves can be selected The curve designated 0 is used for user defined operation allowing phase temperature and the time to be set The parameters of the other curves 1 through 5 are fixed You can find the parameters of each curve in the table in the Appendix 3 Select work mode Under the standby screen the display will be show the work state SOLDER or REPAIR Press the O button to select the work mode As shown in Figure 3 press to enter the work state or press to enter parameters settings Press the button to exit the operating system 11 4 Setting parameters In the standby menu press O to enter the parameter setting menu The mode column displays the current mode SOLDER The curve section column displays the currently selected section Press O or O to select the section you want to adjust Pressing o takes you back to the standby menu while O is used to enter the temperature setting state as shown in Figure 5 Note Functionally the operation using Graphics display mode is the same as with Text display mode Only the readout is different Preheatin
11. etal grille on the fan or block the air intake or outlet Do not place or use combustible or explosive materials in or near the machine Do not use the oven to dry materials or devices containing combustible gas es To avoid damaging the internal infrared heat pipe prevent objects from impacting the oven case If a heat pipe malfunction is detected turn off the power supply and request authorisation to return the unit for servicing Do not insert your hand s in the cabinet when the machine does not indicate that the inside has reached a safe temperature In case of doubt wear safety goggles and gloves To prevent blocking the air intake do not use the machine when stood on a tablecloth If the infrared heat pipe is damaged the replacement part must be authorised by the manufacturer to prevent damage and serious malfunctioning Appendix A Parameters of factory defined programmes Prog PREH HEAT SLDR KEEP COOL temp time temp time temp time temp temp C s C s C s C C 1 120 60 160 58 190 30 170 150 2 130 60 180 58 200 30 185 150 3 140 60 200 58 220 30 210 150 4 150 60 220 58 250 30 240 150 5 150 60 220 58 280 30 265 150 Note Prog programme PREH preheating HEAT heating SLDR soldering KEEP retention COOL cooling down Programme 0 user defined Appendix B Functional test at factory Your oven has been tested at the end of the
12. g PREH parameter settings Press O once to enter the Preheating settings menu as shown in Figure 5 Press O again to enter the temperature setting menu as shown in Figure 6 Press O or O to change the temperature between 70 C and 150 C Press the O button to save or press to discard changes SOLDER TEMP TIME OANE PREH MARKOTIK IEO R 150 C 02 00 e ie A AA 200 y SET OOOO O 00000 Figure 5 Selecting the PREH eat menu left Text mode right Graphic mode SOLDER TEMP TME NOM T 150 C NAER Be 150 CA i 200 i OK OOOO O 00000 Figure 6 Setting the preheat value left Text mode right Graphic mode 12 After the temperature setting press once to enter the time parameter setting state as shown in Figure 7 8 Press the or key to set the time between 0 and 5 minutes then press to save the value Next press to enter the standby state SOLDER TEMP TIME KOADE ai N LOS 00 30 PREH RIKO 00 i a v OK Figure 7 Figure 8 In Graphic display mode the curve will be redrawn automatically after returning to the standby state Heating HEAT parameter setting As illustrated in Figure 9 press the O key to select the heating phase When the screen displays HEAT press to enter the temperature setting As shown in Figure 10 you press O or O to set the temperature to a value between preheating temperature and 220 C SOLDER TEMP TIME SOLDER TEMP TIME ES HEAT P
13. ngerous Temperature Detecting Element Figure 16 Figure 17 2 Temperature detection failure When the temperature detecting device in the oven develops a fault condition the screen displays Detecting Element as shown in Figure 17 The buzzer is activated and the fan starts to operate You may press O or to quit and return to the standby menu 3 Heating element failure When the heating element in the oven SOLDER TEMP TIME e H 0 develops a fault condition the alarm will o ERROR 35 C 02 00 sound and the fan starts to work The Heating Element Fault screen displays Heating Element Fault as shown in Figure 18 You may press or to quit and return to the standby O menu Figure 18 When an alarm condition arises the oven will automatically enter the safe mode If the fan does not come on or the heating element continues to operate turn off the power immediately and check the fault Cautionary Notices 1 10 Do not connect other equipment on the same power outlet as used for the oven Make sure the outlet and the power cord maintain a proper protective earth PE connection and are rated for at least 10 A 230 VAC version The Infrared Reflow Oven should be placed horizontally with at least 20 cms 8 inch clearance to other equipment objects or walls Do not use the oven in wet or high temperature environments Do not use water to clean the oven case Do not insert anything in the m
14. ns This Package or parts of it should not be used in life critical applications This warranty does not apply in the following cases Where the Package has been damaged as a result of using it in ways other than for which it is intended Intended use is described strictly in the User Manual supplied with the Package Where the Package has been modified As a result of service by a person not authorized by the Company Where damage occurs through improper transportation or packaging Where the Package is damaged through improper physical handling Where parts of this Package are lost or damaged The Warranty does not apply to the consumable parts of this Package e g ICs or components supplied with this Package including IC s contained in programmable systems which can be damaged by erroneous use Disclaimer Except for the limited warranties made in this document the Company disclaims all other warranties expressed implied or statutory including but not limited to implied warranties of merchantability or fitness for a particular purpose In no event shall the Company be liable for any incidental special or consequential damages including but not limited to loss of business profits whether in action contract or tort or based on a warranty arising out of or in connection with the use or performance of this Package The only warranty offered is the repair or replacement of the Package or parts thereof at the Compa
15. ny s discretion The Company has the option to offer a refund at its own discretion under all circumstances Obtaining warranty service Subject to the provisions above you are entitled to service with respect to the Package with the following terms and conditions Claims will only be honoured if made within the Period Before making a claim please review the Package documentation supplied electronically and or on paper and contact relevant representatives of The Company If you have problems please contact the Company by telephone Your assistance will be required in running any diagnostic tests the Company may feel suitable to ascertain where the problem with the Package lies This will help in reducing the number of no defect found problems Where a diagnostic test by telephone identifies one component at fault the Company may send by post or courier at the Company s expense a replacement part Where a diagnostic fault determines that an upgrade of software is required then the Company reserves the right to send this using email Where it is not possible to determine the fault and repair it remotely the Package or parts of it will need to be returned to the Company Please provide proof of purchase and serial numbers for any parts of the Package as well as proof of shipment The company will seek to determine the fault with all returned Packages Where a returned Package is found to be defective in material
16. perature Lead Sn63 Pb37 130 150 170 180 230 240 80 150 mid temperature Lead Sn60 Pb40 130 150 170 180 230 240 80 150 mid temperature Lead Sn62 Pb46 Ag2 130 150 170 180 230 240 80 150 mid temperature Lead free 5n96 5 Ag3 5 130 150 180 190 240 250 240 150 mid temperature escri n87 Ag3 Cu3 In7 130 150 180 190 240 250 240 150 mid temperature peat ites 5n91 2n9 130 150 180 190 240 250 230 150 mid temperature Lsag iree sees 130 150 180 190 250 260 240 150 mid temperature 1 Cn1 5 Lead free Sn99 3 Cu0 7 130 150 180 190 270 280 260 150 mid temperature are 5n94 Ag3 Cu3 130 150 190 220 240 250 240 150 high temperature Leag tree Sn97 Cu3 130 150 190 220 270 280 250 150 high temperature dues Sn95 Sd5 130 150 190 220 270 280 250 150 high temperature Common alloy solder physical constants and characteristics Solder Alloy ina de Mechanical properties 5 sn Pb Ag Sb Au cu Zn ce cath es ai bere E MPa 63 37 183 61 45 16 6 11 0 60 40 183 10 90 299 41 45 12 7 8 2 5 95 312 30 46 12 0 78 62 36 2 179 64 39 16 5 113 1 97 5 25 309 31 50 9 5 7 2 96 5 3 5 221 45 55 13 13 4 97 5 2 5 304 30 52 9 0 8 8 95 5 245 40 38 13 3 11 9 43 43 163 55 57 14 8 0 42 138 77 20 30 19 3 5 0 48 117 11 83 5 11 7 15 5 157 17 58 5 13 0 20 80 280 28 118 75 96 5 3 5 221 20 73 40 14 0 87 3 7 3 221 45 60 14 9 0 91 9 199 95
17. r defined value the time starts to count down On completion of the count down the machine will enter the next phase When the machine finishes working the working lamp will flash or is turned off Using Graphics display mode the curve has a broken line as the time goes by as shown in Figure 15 2 If you want to exit the ongoing process when the machine is running press the button O may also be pressed to stop extractor fan activity for gas and fume removal and return to standby mode SOLDER TEMP TIME SOLDER PREH T 150 C 8 00 30 300 PREH 107 C 02 00 NAAA Working EXIT Figure 15 1 Text mode Figure 15 2 Graphic mode During the cooling phase the fan starts to assist with gas and fume removal On completion of the cooling phase the buzzer sounds and the status bar on the display shows Complete Press to repeat the process Fault Alarms 1 Dangerous temperature Highest safe temperatures values apply to each phase while the oven is working After you switch on the machine it will detect the current temperature If the temperature exceeds the safe temperature by 10 C the display will show Dangerous Temperature Figure 16 and blink First the buzzer sounds and then the extractor fan starts to work The alarm stops and the oven returns to normal operation when the temperature drops to the safe level SOLDER TEMP TIME SOLDER TEMP TIME r ERROR 172 C 02 00 gt ERROR C 02 00 A A AE Da
18. s or workmanship the Company will replace or repair the Package at its own expense Where no fault is found with a returned Package the Company reserves the right to make a reasonable charge to compensate the Company for the time taken to service the Package 23
19. t properties in terms of electrical conductance mechanical behaviour hot and cold impact resistance and the ability to act as an anti oxidant In this segment you can set the time according to several requirements discussed below After high temperature melting of the solder all SMDs effectively float on the surface of the liquid solder As a result of surface tension exerted by the flux and liquid components will be pulled to the centre of solder pads causing parts to be repositioned automatically The solder flux vapour solder tin and the metal surface of components together form an alloy layer that by infiltration yields structures ideal for soldering A large PCB surface area and large component pads on the PCB generally govern a relatively long soldering time 10 30 s However this stage should be kept as short as possible to protect the components from damage due to overheating 4 Heat retention phase This phase enables high temperature liquid solder to solidify into firm joints Solidification quality has a direct impact the crystal structure of the solder and mechanical properties If the solidification process is too fast rough crystalline will be formed causing a dull solder joint of reduced mechanical strength Under high temperature and mechanical impact such solder joints easily crack eventually causing mechanical and or electrical breakup and reduced product durability At slowly declining temperatures solder can solidif
20. y and crystallise properly Generally set the temperature 10 20 C below the solder point When the temperature has dropped to the set value natural cooling takes over 5 Cooling phase During this section of the temperature curve the temperature is reduced to a value that allows PCBs to be removed from the oven without the risk of scalding your hands To speed up the cooling you may also stop the process when the temperature drops below 150 C To avoid burns use tools pliers tweezers or heat resistant gloves to take out the PCB board 6 Note In general start from low temperature curves aiming to satisfy the soldering requirements as muchas possible to reduce the actual soldering temperature Also note that longer heat retention times allow shorter soldering times to be used this will help to protect low temperature components especially some types of connector and plug from melting or deforming Components that do not fit the soldering temperature requirement should be handled separately after reflow soldering Common alloy solder temperature curve adjustment parameters Preheat Heating Soldering Retain Solder Type Composition Keep Cool C min C min C 30s oC Lead Sn43 Pb43 Bi14 100 120 130 150 200 210 70 150 low temperature Leag ires Sn42 Bi58 100 120 120 130 180 200 50 150 ow temperature sii Sn48 In52 100 120 120 130 180 200 50 150 ow tem
21. y solder temperature curve adjustment parameters 8 Common alloy solder physical constant and characteristics 9 Operation so vs eed arash a otk Shae asks cata Bet Spel Se cates Stat he 10 The soldering process o o o oo oo morro 16 Faultdlanms iia oe eRe Ree RAY PRE ROSS ORE RAE Hee 17 Cautionary Notices 0 ce ee eee eee 18 Appendix A parameters of factory defined programmes 19 Appendix B functional test at factory 2 0 ee ee eee 20 Appendix C tray temperature vs displayed temperature 21 Appendix D Ball Grid Array BGA soldering o 22 Wartranty statements sii a ee Gus so Grae Ate GRE RLS Me arava alae tena 23 Introduction The Elektor SMT PRECISION LEADFREE REFLOW OVEN is an electrical appliance used for production and maintenance of circuit boards using SMT surface mount technology components The equipment employs far infrared heating elements as well as high quality temperature sensing devices and materials By means of accurate control exercised by an internal microcontroller temperature curves are obtained that closely match the requirements of circuit board production using SMT The temperature control curve of the equipment can be adjusted accurately allowing optimum use of a wide range of solder paste products with different material parameters The oven can shut down and supply fault alarms automatically Its functions cover PCB soldering
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