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LED LCD TV SERVICE MANUAL

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2. CI SLOT 5V CI ON CI DATA 0 7 C S NPU ec 9 pan FE TS DATA 7 5V Normal T MD 7 7 FE TS DATA 6 C1906 o as TiO MDI 6 C FE TS DATA S uF o 10V MDI 5 C FE TS DATA 4 e oc EAG41860102 a CI MDI 4 C 1 D man P1901 5 jo TS 3 2 FEI CD1 e CI MDI 3 C_ FE TS DATA 2 e 10067972 0001 MDII2 C FE TS DATATI 0 1uF m CI_MDI 1 lt __ FE_TS_DATATO CI_MDI 0 lt R1908 100 36 CI DATA 3 m 37 3 CI DATA A4 N in CI DATA 5 aa
3. rc Y f d em d A 5 Pe DDR3 1 5V By CAP Place these Caps near Memor VCC 1 5V DDR n Ge O i se A z T p Y DDR3 1 5V By CAP Place these Caps near Memory A ad sd N 2 ae aS 54 HM ri E x z B H e C gt A MVREFD 2 9 e i gt A MVREFCA e e B MVREFCA lt l m e B MVREFDQ lt e a oe E a Q 5 oe S E o LU 5 ECRIRE obits DNE FEAST ia by Do o A S E ans S 5 T e SL
4. C24 NC_29 LGE107D S7M Divx Non RM PF_CEO ee um E r3 CHIP Config AUD LRCH x L NAND Flash m NUS PCM A 0 7 a xS TC101 PF_CE1 et Boot from SPI flash 1 b0 PCM DI0 7 Ho 16 bit ps 0 7 4 NC 26 Boot from NOR flash 1 91 Lo 8 bit x x 5 B AR101 S7M DIVX OS 1 07 PCM A 7 5 6 1 06 PCM DO GPIO143 TCONO DET 1 E PCM D I ase PCM Dl GPIO145 TCON2 SV_DET_HDMI_2 o 9 lt T3 CHIP Config gt PCM_D 2 T22 L22 z d R B 1 05 PCM D2 GPIO147 TCONA4 5V DET HDMI 4 F RB AUD SCK AUD MASTER CLK PWM1 PWMO PCM D 3 AB18 L2 E RE PCM D3 GPIO149 TCON6 DET HDMI 3 RE I 04 PCM D 4 AC18 i P2 OE gt PV V v MIPS_no_EJ_NOR8 4 h3 MIPS as host No EJ PAD Byte mode NAND flash acis 4 GPIO151 TCON8 SIDEAV DET CE NC 25 22 MIPS NOR8 4 h4 MIPS as host EJ use PAD1 Byte mode NAND flash PCM 5 PF_CEO e M
5. A DDR3 1 5V By CAP Place these Caps near emory AVCC1 5V_U3_DDR 1 5 FRC DDR FRC DDR 1333 AO VREFCA e e P7 L301 A1 P3 ey I iu iu iu I fy fey fy fy fy fy fy fy Ee 9 A2 Sah 0 3 an 3 3 n 3 3 o 3 o 3 a 3 qw s 3 o 3 n 3 5 CL o 3 a Sq 5 coim N2 c o o o o o o m us N N N N A3 VREFDQ O a e foc foc foc tfo foc 4 qe fom 0 toc foc fo tfo 55 uff foc ana en C324 C325 P8 O o o 10uF ow 0 1uF P2 i 1 16 AS A6 aw Close to DDR Power Pin R2 as T T8 A8 R3 A9 D_1 E E E E H E E Ld g A10 AP D 2 R7 V A11 D 3 ii i 7 A13 D 5 VCC1 5V 03 DDR 2 v Am VCC1 5V 03 DDR D 6 A s 57 d oe 2 8 o a E oe MT E Em S7M DIVX 8 m MX n 3 C MVREFD T s ni n E 8 e 7 n gt C MVREFCA
6. N H amp ENKMC2838 T112 D821 mcum c um M m c m m 7 7 5 1 5V DET 1 H M 3 1 HDMI ail A A 9 EDID WP SVECHDMTUS vu A 5V DET 3 AT24CO2BN 10SU 1 8 ps XM co zo e nd g e AO vcc SHIELD R864 0802 R830 0804 B R896 2563052 HPD1 R894 25653052 3 20 e 10K e 10K Al WP 1K E so 253 1K E C806 R884 R888 C802 9 9 c804 0 1u 4 7K gt 4 7K R804 R838 ae 0 1UF e 16 E e e x 16V A2 SCL JESUT 1 8K m 1 8K og e 561 1 Sen JP 803 mcm JP807 R876 22 P 22 fe R859 22 m Ree gt DDC_SDA_3 ux PRS DDC SDA 1 x Maie RED MOSS e DDC SDA 1 R826 22 R851 22 501 1 gt
7. 4 B o o wn N Es N N D T T AS S e au 7 mO g 7 e El Uu Uu A 8 X1002 2 T E E a 32 768KHz 9 E T H H H H R1034 z 9 e 4 7M oo e o o id 43 5V ST R1091 10K N f d io sr t for Debugger GND 5 5 sw1001 e E JIP 1127WEM P1001 e a t 1 12505WS 12AO00 3 SV_ST C1003 O H A 0 1UF O S R E X H O 1uF 5 aks d 2 e MICOM RESET o c 5 TS gt Bus O g FA 5 R1076 22 EE due O S nis e O X Ea Oo Qi EH Deu Ay REVS 2 gt NEC ISP Rx c din H AIN E BR Z R1047 20K R1010 22 X X FA 1 16W gt o v BH N 1 t Ce o R1081 22 QOO UILNI NI gt EDID WP OCD1B HOS N C J Fd mn SP SPI Ge ad gt gt minit Q1001 R1013 22 lt eine 2563052 E R1002 10 T P60 SCLO 4 PLAO PCEZINTES esa z NEC 801 gt RL ON Dp Dp I E P61 SDAO 5 POO TIOOO MET NE
8. Stand body Stand base Copyright 2010 LG Electronics Inc All rights reserved s LGE Internal Use Only Only for training and service purposes 10102 HY27UF082G2B TPCB NAND FLASH MEMORY 3 3V Normal
9. HP LOUT EXCEPT CHINA HOTEL OPT 9 9 8 9 C1118 2 X19 10uF 16V C1115 1000pF ae R1125 C e E JK3301 3 3V Normal KJA PH 0 0177 MMBT3904 F e z or GND 5 e c e e 9 1x Gd L 4 e d 43 5V ST R1155 a 1K DETECT 3 m TIO ond HP_ROUT EXCEPT CHINA HOTEL OPT HE DET nid R 1 nU e e e QH C1119 o E 2 X19 10uF C1116 1000pF 5 E m 50V 1102 B R1128 Q E SET 1K MMBT3904 F 390 B SPK_R _HOTEL E2150 B Q1103 Fares E 2 X19 SIDE_HP_MUTE C Q1106 e e e 2503052 SPK_R _HOTEL 2 X19 us ee 3 3V_Normal RGB P C 5V Normal PC AUDIO TT A SPDIF OPTIC JACK ENKMC2838 T112 JK1102 Ai PEJO27 01 5 15 Mstar Circuit Application T RING ape IC1104 R1152 NL17SZ00DFT2G _TERMINAL1 4 7K e e TERMINAL1 SPDII QUT WE Iz R1140 J c H o 161105 e e R IN 2 516 ino Ele 215 ae B C1129 Didok R1107 R1112 nos t p 4 7K i0 0 1uF RING 61107 15K 0 16V n 1 AMOTECH I00pF SR1102 UM e Sa 5 6V 50V
10. MOBEL OPPITION A VDDC 1 26V VDD RSDS 88mA VDDC 2026mA 9 9 e e e MODEL OPTION SDT VDD_R DS e x Ox PIN NAME PIN NO HIGH LOW e e 35 MEC L213 ume e tah EL WW sA 8 o 2 5V_Normal BLM18PG121SN1D 5 E 2 a N a E a Oo MODEL 0 G19 FRC NO FRC TH e e a a Bx 9027T of dor Zapf Ba 1214 7 gt a a T9 3 g Ag x MODEL OPT 1 c5 MINI LVDS LVDS VDD33 BLM18PG121SN1D 3 E A a o 5 5 N 4 S a z aan e N i e o 2 o o e o o lt 3 3 lt MODEL OPT 2 7 DDR 512MB DDR 256MB S7M C4005 g 2 S e x e 2 ky 9 IF_AGC_SEL lt Ro e 1 MODEL OPT 0 0 1ur TT e e LNA2 CTL lt R202 a e MODEL 1 MODEL OPT 3 B6 FHD HD RF SWITCH CTL R03 E99 9 MODEL 2 lies ud R204 100 ES BT ON OFF C e MODEL OPT 3 MODEL 4 E18 100 1208z LVDS 50 60Hz LVDS M M R210 100 3D_POWER_EN lt e MODEL 4 T R213 3D 100 MODEL_OPT_5 18 GIP NON GIP IC101 3D_FPGA_RESET 2 e MODEL 5 qase vppc GE 10 7D S7M Divx Non RM e MODEL OPT 6 MODEL OPT 6 F9 OLED LCD
11. d l PEEVE SHITE Role ek i POWER Block D607 MMSD4148T1G ODI RGN i A EN2 16V 100V A eat CHECK Value 3 3V e e e e 9 R635 R640 LCc628 910K 470K opt C622 1 15 e e 9 625 42 FHD 60 LAMP42 60 we 0642 C653 REED 100 e e 50v iuF 22uF n 50V 25V GIP C636 e R642 1 ce29 C638 C640 1 8W R636 R641 e 47uF C600 AAA STOR 23K OPT luF 50V LL iuF BUY 33K 1 1 OPT 25V 50V e i gt DISCHG i NON GIP 42 FHD 60 LAMP42 2m 60 LAMP o EA VDD LCM p ae e L602 16V C625 D605 MBRA340T3G40V 22UH A 4705 i 50 I NON GIP 27pF 50V D608 MBRA340T3G40V 2 8A C654 NON GIP e 22uF ROOK R688 25 d m 33K C626 R642 C645 BE GIP NON GIP R647 2 2 Ul Ol o e E F 10K 560pF al o E 1000pF 907 a gt R OPT R689 1 R689 VGH NON GIP D606 s 0 2 7K 25V GIP c acl m m VGH MMSD4148T1G GIP NON GIP A i QW 25V EN2 VGH M GVDD ODD gt VDD ODD A 00V A 3 UT R692 0 Lena PANEL VCC THERMAL D602 A NON_GIP 12V GVDD EVEN 29 4 7uF 50V 3216 R627 KDS226 TUE A gt VDD_EVEN R693 0 1 7 50v T m T C 4 coer NON_GIP C615 0 2 GSP GVST_ gt VST k S S 6 7 tee EN R656 alee ae uF A 0 47uF 3 GCLK6 I CLK6 S 9 E 9
12. ADJ GND T 3Vd 1 4V 1 P 120 mA 2 E OUT C421 C446 B mm 0 TATE 10uF 0 1uF 16V 10V 16V E 24V A e e e e e 4 5SPK L D501 C540 OPT 1N4148W R519 R526 L507 aro O1UF 50V 00V 12 12 9060 6536 R527 R535 opt 35 oe b R531 OPT 3 3 4 7K C529 50V 3 3 e 390pF C009 OPT e o Ls 9 9 SPEAKER L C521 C547 1s 1 50V OPT C515 C519 E 0 01uF R532 0 hur 0 1uF oe 50V 530 537 ad V V F 3 3V_Normal 50V D502 y 50 15uH R528 CU BT A 1N4148W R520 R524 4 7K 0 01uF a 50V 100V 12 12 z C514 PT zooo eeeee 8 e e e 9 e e C O sPK L H d 5 53580 d F D L504 v P ee z L z Qu N a Qd d ldem d d de 29 m i a mo mo I la m ius M mim m n uuu 6 9 5 5 5 5 5 8 8 3 A AMP_RESET_N id N Eam maojlo aja jalmiooJjn na m C506 n POST p BST1A f 0522 e e 9 gt SPK_R AUD_MASTER_CLK C512 25VluF e VDR1A 2 HERMAL VDR2A C 52 5 e 25v RESET 2 57 PETIA 22000pF ae 1 8V_AMP tie R521 R525 C542 OPT C509 AD PGND2A 2 1N4148W 12 12 L506 0 1uF e DGND_ 5 PGND2A_1 A AD 9060 5 L6538 R529 Be S cup 1 1 OUT2A 2 C531 5 E 0 1uF 4 7K R533 OPT e e 390pF ALLJ C535 A e cLK 1 OUT2A 1 50 27uF 3 3 SPEAKER
13. couv Em I R646 ej o i e i C665 0 P 3 R652 AMP SDA i i 15pF GVDD EVEN GVDD EVEN I mo q z 50V GIP s i R607 i z R652 Hen OLE i 7 5K Coes 0 P GIP C 50V R661 SET RXD4 gt SOE e gt VCOMR 0 655 i 566 i VCOM e gt VCOML oe 1 l i i 50V cD dA GE aa b dam GOD apap GOD THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET S LG ELECTRONICS LOCK HEET JDEL Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only HDMI EEPROM SV_HDMI_1 5V_Normal
14. Software Version V1 11 1 Programme Edit Booster 10 Software Update Off Diagnostics 5 1 Signal TABLE CMD LENGTH ADH ADL CMD AOh LENGTH 85 94h 1 16 bytes ADH EEPROM Sub Address high 00 1 F ADL EEPROM Sub Address low 00 FF Data Write data CS CMD LENGTH ADH ADL Data 1 4 Data n Delay 20ms DATA_1 Data_n 5 DELAY 5 2 Command Set EEPROM WRITE bytes Wil n 1 49 Description FOS Default write lt 7mode data write Vtotal V Frequency Sync_Polarity Htotal Hstart Vstart O Phase Data write Model Name and Serial Number write in EEPROM 5 3 Method amp notice A Serial number D L is using of scan equipment B Setting of scan equipment operated by Manufacturing Technology Group C Serial number D L must be conformed when it is produced in production line because serial number D L is mandatory by D book 4 0 LGE Internal Use Only Manual Download Model Name and Serial Number If the TV set is downloaded by OTA or Service man Sometimes model name or serial number is initialized Not always There is impossible to download by bar code scan so It need Manual download 1 Press the instart key of ADJ remote controller 2 Go to the menu 5 Model Number D L like below photo 3 Input the Factory model name ex 42LD450 ZA or Serial number like photo EDID Version HDMI V01 01 Maker 99
15. 9 BO ANA 33 AOZ1073AIL NE E o das 3 CIC21J501NE dA Vout 0 8 1 R1 R2 L424 T L421 2 Mor m 2503052 R427 L420 5 vedi CIC21J501NE ni 10K l ex 5 POWER 18 A DIM OPT l 5V DDR 35 eU hd o CO 9 5 E a 0 Replaced Part E Om gt R451 TS NR8040T3R6N Le Sane x POWER 22 A DIM R e R485 8457 X R1 e e X m e PONE MS UM POWER_ON OFF2_2 i 10K 12 C469 C473 0485 z POWER 20 DIM R453 o IC407 ae du I e R456 OS MODULE PIN MAP gt 9 PORER 24 RWM DIM R484 PWM_DIM MP2212DN Close to Ic C457 0459 10K 10v 16V 16v R472 0 0 TERQUE COMP T K V 25v 9 e I AUO TT RA71 EN SYNC R464 9 1K e e PIN No LGD CMO 09 SHARP L DIM sors 12 osi pru OE ONISE DK 2200pF OP Tame C416 C419 Rao o SCAN BLK1 OPC OUT L423 38 C464 Ei ELE T D 0 1uF 3 6uH 18 INV A DIM INV ON INV ON luF OPT SW 2 e r 9 e 9 a OPT wR8040T3R6N OPC QUT 3o E BR R470 0 SW 1 P R 20 VBR A NC Err out Err out SCLK E 3 3V Normal praced oncsSMD IOR e E P C472 C476 POWER_20_ERROR_OUT a pc 22uF Bs pax 10V S 22 PWM DIM PWM DIM NC PWM DIM R437 0 OM gt Wer C467 en ipium M usu Sud VoutetlcERlZZRZ 0 9 EL as 22uF E t POWER_24_ERROR_OUT ERROR_OUT 109 SUV Placed on SMD TOP 24 rrou TNV ON PWM DIM GND Su L gt C E R455 0 23 MOSIN R452 i 10 C4
16. C gt RXCO 10 A7 gt C MBA1 C1P LLV1P BLUE 3 a5 gt RXC1 m gt C MBA2 ion AFS C1M LLV1N BLUE 2 gt RXC1 A B8 Al gt C MCK erMORSD gt COIMERSB C TMDQSL E _DDR3_DQSL DDR2_DQS0 C2P LLV2P BLUE 1 EOE gt RXC2 5 A3 A HOS T SC IMSDI C TMDOSLB FRC DDR3 DOSLB DDR2 DQSBO C2M LLV2N BLUE 0 gt RXC2 el Ted 3 C O RXC3 E AE9 AD22 pe gt C MCKB VOMBAU C TMDQSU mum _DDR3_DQSU DDR2_DQS1 C3M LLV4N 1 7 gt RXC3 10 De gt C MCKE C TMDQSUB _DDR3_DQSUB DDR2_DQSB1 C4P LLV5P EU gt RXC4 E9 R311 C4M LLV5N gt RXC4 B C MDOSL NIS Lo 5 C TMDQSL AE11 5 C MODT 10 C TMDML are E _DDR3_DML DDR2_DQ7 Zs gt C MRASB R312 C TMDMU FRC_DDR3_DMU DDR2_DQ11 355 H9 ANNIS d gt C TMDQSLB gt C MCASB 5 DCKP TCON5 gt RXDCK rege VCC1 5V_U3_DDR 10 AE6 AE19 er C MWEB R333 aD cS R313 C TMDOLO arii FRC PPR3 DOLO DDR2 506 DCKM TCON4 1757 RXDCK 10K c MDQSU C gt Nw L C TMDQSU C TMDOL1 ape PRC PDR3_DOL1 DDR2_DQ0 DOP LLV6P gt RXDO J9 10 E c d 2 6 ike cee nace C TMDQL2 apio PRC DPR3_DOL2 DDR2_DQ1 DOM LLV6N 1 1 5 RXDO U3 CHIP Config C MDQSUB C gt gt C TMDQSUB C TMDQL3 mene FRC_DDR3_DQL3 DDR2_DQ2 D1P LLV7P ND gt RXD1 i 1 10 C TMDQL4 FRC DDR3 DOL4 DDR2 504 D1M LLV7N 1 56 FRC CONF O T7 R315 2 T gt C MDOSL A ea
17. SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics Eri MODEL I LG ELECTRONICS BLOCK eoero SHEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only USBI OPTION USB IVC R EAs 3 3V_Normal IC2301 5V USB L2301 MIC2009YM6 TR R2303 A T E B 4 7K LB 201209 0120P m pu e CR 120 ohm C2303 R2306 LOGE C2304 C2302 8 Trov 0 1uF e 10uF Q USB1_CTL E e e o R2307 53 OK m d R2302 47 USB1_OCD o e z R2305 0 Y 9 e SIDE USB DM E p eq R2304 0 o SIDE USB DP ral z D2301 D230 CDS3CO5HDMI1 CDS3CO5HDMI1 5 6V 5 6V OPT pas e e 10230109 3 551 8v8 G OLI ILI Il I LI WII ee clu IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF 15 SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR IHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEME
18. AR1213 F2 ee A MDQU2 gt A TMDQU2 A TMDQSU oe DR3_DQSU DDR2_DQSB1 B_DDR3_DQSU DDR2_DQSB1 B TMDQSU et eg B MDQL2 ate M9 E B MDQL3 xe ANDONI 10 A TMDQSUB DR3_DQSUB DDR2_DQS1 B_DDR3_DQSUB DDR2_DQS1 B TMDOSUB B TMDQL7 lt __ B MDQL7 H3 gt A MDQL2 ARIZA AT e B TMDQL5 lt B MDQL5 nd H8 E A MCKE L gt A TMCKE A TMDML aie 2 DPR3_DML DDR2_D913 _DDR3_DML DDR2_DQ13 B TMDML 905 C G2 gt A MDQL4 A MDQL7 L gt A TMDQL7 A TMDMU A_DDR3_DMU DDR2_DQ6 _DDR3_DMU DDR2_DQ6 B TMDMU 10 B MDQL6 C H7 T9 Anati A MDQL5 gt A TMDQL5 RRISTE B MDOL7 C 1 C18 L25 gt A MDQL6 A TMDQLO BIS DR3_DQLO DDR2_DQ3 B_DDR3_DQLO DDR2_DQ3 F24 B TMDOLO B TMDQLO B MDQLO D7 ee 10 A TMDQL1 aa DR3_DQL1 DDR2_DQ7 B_DDR3_DQL1 DDR2_DQ7 om B TMDOLI B TMDQL2 C B MDQL2 B MDOUO S c3 BT APLAUS A TMDQL2 as DR3_DOQL2 DDR2_DQ1 B_DDR3_DQL2 DDR2_DQ1 B TMDQL2 B TMDOL6 lt 7 B MDORG B MDQU1 C c8 B9 xtMBOUO A MDQLO 5 A TMDQLO 3 e DR3 DQL3 DDR2 DQ10 DDR3 DQL3 DDR2 DQ10 B TMDQL3 B TMDOL4 C EOMDOEA B MDQU2 C E pi S A MDQL2 L A TMDQL2 A TMDQL4 DR3 DOL4 DDR2 4 B DDR3 DOL4 DDR2 504 B TMDQL4 ES B MDQU3 C am BS mee Ree A MDQL6 gt A TMDOL A TMDQLS a DR3_DOL5 DDR2_DQ0 B_DDR3_DQL5 DDR2_D00 5 B MDQU4 x E2 E Aion A MDQL4 gt A TMDQL4 A TMDQL6 PT DR3_DQL6 DDR2_CKE B_DDR3_DQL6 DDR2_CKE B TMDQL6 eae ree B MDQUS
19. Data Input Power Input Aug 9 9 Liquid mu Crystal Adjust sequence Press the PIP key of th ADJ remote control This PIP key is hot key to enter the VCOM adjuting mode Or After enter Service Mode by pushing ADJ key then Enter V Com Adjust mode by pushing gt key at 10 V Com As pushing the right or the left key on the remote control and find the V COM value which is no or minimized the Flicker If there is no flicker at default value Press the exit key and finish the VCOM adjustment Push the OK key to store value Then the message Saing OK is pop Press the exit key to finish VCOM adjustment S 440 S 440 Visual Adjust and control the Voltage level 4 6 Outgoing condition Configuration When pressing IN STOP key by SVC remocon Red LED are blinked alternatively And then Automatically turn off Must not AC power OFF during blinking 4 7 Internal pressure Confirm whether is normal or not when between power board s ac block and GND is impacted on 1 5 kV dc or 2 2 kV dc for one second 245 5 Model name amp Serial number D L e Press Power on key of service remocon Baud rate 115200 bps Connect RS232 Signal Cable to RS 232 Jack Write Serial number by use RS 232 Must check the serial number at the Diagnostics of SET UP menu Refer to below Serial No
20. E8 a 2 B MDQU6 gt A MDQUA 10 A TMDQL7 DR3_DQL7 DDR2_DQ2 B_DDR3_DQL7 DDR2_DQ2 B TMDQL7 B TMDQU3 C B MDQU3 ees A3 gt A MDQUS5 a5 Bae B TMDQUS lt B MDQUS5 Sa CO A MDQU6 A MDQU LL A TMDQU A TMDQUO M DR3_DQU0 DDR2_DQ15 DDR3 DQUO DDR2 5015 B TMDQUO B TMDMU B MDMU 65 gt A MDQU7 A MDQU3 A TMDQU3 A TMDQU1 ey DR3 DQU1 DDR2 DQ9 B DDR3 DQUI1 DDR2 DQ9 En B TMDQUI 10 A MDQUS C gt A TMDQUS A TMDQU2 rS DR3 DQU2 DDR2 08 B DDR3 DQU2 DDR2 DO8 B TMDQU2 AR1218 e A MDMU A TMDMU A TMDQU3 DR3 DQU3 DDR2 9011 B DDR3 DQU3 DDR2 DQ11 EY B TMDQU3 B TMDQU6 lt B MDQU6 eas e 10 A TMDQUA 218 DR3_DQU4 DDR2_DQM1 B_DDR3_DQU4 DDR2_DQM1 m B TMDQU4 B TMDQUO X B MDQUO ARI207 A TMDQUS na DR3_DQU5 DDR2_DQ12 B_DDR3_DQU5 DDR2_DQ12 B TMDQUS5 B TMDQU4 B MDQU4 A MDQU6 L gt A TMDQU6 A TMDQU6 E DR3 DQU6 DDR2 DQMO B DDR3 DQU6 DDR2 DOMO B TMDQU6 A MDQUO L gt A TMDQUO A TMDQUT A_DDR3_DQU7 DDR2_DQ14 B_DDR3_DQU7 DDR2_DQ14 B TMDQU7 10 A MDQUA gt A TMDQU4 R1221 B TMDQU1 4 A AA amp B MDQUI 10 10 R1210 A MDQUI 2 VwNA j gt A TMDQU1 10 10K R1234 E e R1233 OK Jr A MCKE lt THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION ttt SECRET BERI THE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC GElectronics I OLK HEET Copyright 2010 LG Electronics Inc All ri
21. FE TS DATA 0 7 CI_TS_DATA 4 lt 38 4 Pai wis CI_DATA 5 39 5 aa 6 40 6 CI 7 CI MISTRT FE TS SYNC CI TS DATA 7 4 41 7 R1919 47 e 7BCM CE CI MIVAL ERR FE TS VAL ERR s 42 8 CI ADDR 10 R1905 10K e 43 9 CI OE ci McLKi FE TS CLK 44 0 CI ADDR 11 CI IORD 45 1 CI ADDR 9 CI IOWR 46 2 CI ADDR S8 Ine nec CPI TIR CI ADDR 13 CI MDI O 47 3 PS CI ADDR CI MDI 1 48 4 CI_MDI 2 49 5 EA CI WE 100 CI MDI 3 S 50 6 gt PCM IRQA C1905 luF 51 7 e STE 0 52 8 R1916 0 I ND 61909 OPT 0 1uF CI_MDI 4 OPT 53 E CI MDI S se CI HOS F 55 CI_ADDR 12 CI MDI 7 56 CI ADDR 7 R1906 10K 57 CI ADDR 6 Ae D D R1902 47 PCM_RST 58 CI_ADDR 5 l R1901 47 PCM WAIT 59 CT_ADDR 4 Tut 60 CI ADDR 3 i CI TS CLK 4 61 CI ADDR 2 CI TS VAL 4 62 CI ADDR I CI TS SYNC C 63 CI ADDR O i S CI DATA 0 65 CI DATA 1 CI ADDR 0 14 i CI TS CI 2 ICI DATA 1 X _1 67 i CI TS DATA 2 C 3 e 68 e CI TS DATA 3 AR1903 NS i gt CI_DET R1907 100 ae IC1902 CI_CD2 e 3 E 3 3V_CI 5V_Normal GND C1913 0 1uF i S 16 GND i TOSHIBA 1A1 R1904 GND PCM_A 0 01T0742440D 10K C1904 tur 2Y4 1 1 er l CI
22. Normal Power 3 3V us S g ey Noam 3 H11 G18 e a o 5 9 GND_1 15 a E N Q a 6 2 uus VDD33 T VDDP U3 VD33 2 47mA sss v GND_2 115 9 a Fn foes 25 al eee DS NES BLM18PG121SN1D nia GND_3 i16 9 SI 4a Na e e o SEN e V GND_4 e 2 ou D D a nO E y H15 H19 Close to MSTAR DTV IF hl i 5 5 5 5 E 3 EE 5 7 5 e e e e e e R288 100 C257 0 1uF pas S 5 5 Y V GND 6 hd 8289 100 C258 0 1uF trpvstar E 5 5 a E E E e i IC101 L IF N MSTAR S rat ame J14 V GND 7 318 B a a foes come S z m H OVD 67M Day XENO RM pn ST S l S f 5 5 5 JE zs E Le M C250 0 1uF R4002 47 TU SIF SI Ass Mi o V GND 9 9 251 0 1 4003 47 9e e p 5 a C luF R A v GND_10 e SSS Sa E Le Lis R meee bet pe F1 W2 Oae A K11 p E Us cE HD ee Close to MSTAR lh MEMPLL 24mA AU33 31mA FRC AVDD 60mA MIDOUDDG H16 ae K12 e 9 K13 DO _HD ES RXOP BUS VDDS3 PRC_AVDD MIU1VDDC D_14 e DO _HD RXON D_15 e H3 V1 L215 LSZ L19 K15 D1 _HD RX1P 6 9 zm dd Nord BLM18PG121SN1D BLM18PG121SN1D p WB D EUG D1 HD arxan F A mM SEE E EN E T nis ee 9 D2 _H
23. i A Test Option External ADC TAL 8 Spread Spectrum Model Number D 9 OLS 0 Model Name GP DVB 1 Serial Number SKJY1107 1 Serial Number SKJY11 Press to sav 4 Check the model name Instart menu gt Factory name displayed ex 42LD450 ZA 5 Check the Diagnostics DTV country only gt Buyer model displayed ex 42LD450 Copyright 2010 LG Electronics Inc All rights reserved 14 LGE Internal Use Only Only for training and service purposes BLOCK DIAGRAM lN3NOdMNOO Jigs L4 JIS Sg d TLE daun L Joy J Nd AI 10O HT d c 4 0 SQALE eU6 Ll 520 v 1C SE as C O V IST SL 1555 0 HOUV 12 2 0 w Woe 551 ONYN 1 ND LO i Aowa EHI d L 6 Jo ka i pnos LOEO LSA l13IHS 13 131 eolSSSdl 3 LTWETE gogol PPO US 3 HGB VBS ST TX RX c pa LHT RGB H Vsyn 410d LAG A NHNLVS LO LOI TA 1 IUD ns c D s SJEA SOA INI it GECEXVIN LOL LO TMDS 0 7 3 3 0 20NL 8 ed E gt LL INOOIN 23N eU LH el oo E 4 Lu of Ei ci on el on gt a F 7 wee OO hee 15 iv a aowe gga LOZLOI Amie EHO VAAD d HOSA HR SMA 1 8 y CDM
24. DDR3 A8 DDR2 A6 B TMA9 L Rd b iam M2 A MBA2 gt A TMBA2 A TMA9 3 A9 DDR2 A12 B DDR3 A9 DDR2 A12 7 B TMA9 TO B MCK lt _ NS A Ri A MA13 gt A TMA13 A TMA10 3 A10 DDR2 RASZ B_DDR3_A10 DDR2_RASZ ie B TMA10 R1222 or B MBAI C M3 oe e 1 5 DDR R9 gt A MBAO A MA9 gt A TMA9 A TMA11 S A 3 A11 DDR2 A11 B DDR3 A11 DDR2 A11 eee B TMA11 B TMCK C B MCK 12404 S B MBA2 C A c res D 10 A TMA12 523 A DDR3_A12 DDR2_A0 B DDR3 A12 DDR2 A0 B TMA12 19 z J7 se R1223 o N 0 01uF gt A MBA2 R1206 A TMA13 A 3 A13 DDR2 A7 B DDR3 A13 DDR2 A7 B TMA13 B IMCKB C B MCKB 25V F ee 7 A a 1209 A MCK gt A TMCK l 5 10 2 A8 AR1220 B MCKE lt em x dE R1207 B MCKB ci Nola 25V A MCKB gt A TMCKB E B TMRASB B MRASB T e uw S 10 B e A MCKE er A TMBAO Ali 5083 2 B_DDR3_BA0 DDR2_BA2 B TMBAO B TMCASB C B MCASB i D2 e E A TMBA1 a23 5083 CASZ B DDR3 BA1 DDR2 CASZ B TMBA1 B TMODT lt __ B MODT B MODT za Ae A MRASB A TMRASB i E A TMBA2 A 3 BA2 DDR2 A5 B DDR3 BA2 DDR2 A5 B TMBA2 B TMWEB B MwEB VCC_1 D B MRASB C 3 F1 A MCASB gt A TMCASB 10 B MCASB lt gt A MODT L3 A MODT gt A TMODT Al2 D26 R1232 4 A MRASB ycc 1 DDR A TMCK exi DR3 MCLK DDR2 MCLK B DDR3 MCLK DDR2 MCLK E B TMCK R1219 10K B MWEB ALIM A MWEB gt A TMW
25. LGE Internal Use Only 45 Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes GIP Model 0 1nOQW O QGdO N3A3 JOA I3NVd AEE NOT DOA WOT AOA TOA M07 IH 520 gd HUS 13 31 QGO N3A3 AQA IND 1 GGA Att AS ISA SCAT ININ c0Zd LOZd Z 0NOGW zr o0lviN 9 WOT DOA WZNYNLVS LOLOI 195 VIS f 545 o g o o e 0 0 0 0600000000000000000000000000000000000000009 o UO 72 D D JJ o co T ASS INO T OO AIEWOT dd H3MOd Old VININVO d LGE Internal Use Only 215 Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes EXPLODED VIEW IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety related characteristics These parts are identified by A in the Schematic Diagram and EXPLODED VIEW It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X RADIATION Shock Fire or other Hazards Do not modify the original design without permission of manufacturer
26. 3 Bend into a U shape the replacement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 Bend the two remaining leads perpendicular y to the circuit board 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replac
27. 5 5 B B B Bots LU Abs Abs abs absa Nm WS 25 Nu aha sha she sha 1Lo 10503 2 abs do jeu 3LS sho jm Zu IL 5 R 2 M 3 ze z zi 1 A 1 ny 1 IEN 1 1 A ty a 1 1 N 1 1 Ne ems Cl N N N N N N N S S N Q N q N ren d a 5 o ada ex MS o coloeo leo ocooeoc ooloo 9oo o DAD Ser pacer LO PAO cO S SS uve SC Cf Cf 5 oe 09 ce eC 6 SC SC o Mp N a 5 D d N a a4 oO oO oO bd 9 Close to DDR Power Pin Close to DDR Power Pin z CLose to DDR3 J CLose to Saturn7M p 2 V CLose to Saturn7M IC CLose to DDR3 J m AVCC_1 5V_DDR 1 5V_DDR L1201 R1215 SER hd B TMAO L A N B MAO 10 C1228 R1216 R1213 10uF L0 1uF pare a mao COW O A TMAO 10V 16V B TMA2 Oed 10 AR1211 ved B TMA11 lt B MA11 Toe ma2 Ow a a B yee s H5TQ1G63BFR H9C 10 B TMA1 B MA1 E AR1208 X209 B TMA8 lt B MA8 H5TQ1G63BFR H9C See B TMA6 C B MA6 r A MA1 gt A TMA1 N 10 B MAO lt AO VREFCA B MVREFCA el es es a ame P A MA8 gt A TMA8 AR1214 Hm E e p M A MA6 C gt A TMA6 B TMBAO 4
28. VCOM GMA2 VCOM 4 7 S CO GMA4 i VGH GIP C673 E PANEL VCC Pre am LOPE 12V l 50V aj al R696 R698 a o TEY TT E 0 1M R614 o gt ver_p S A A NON_GIP GIP 2 5 R665 R664 a e e R1 0 0 C652 C659 C661 RXDCK4 gt RXA4 GCLK5 I R609 ol PIER ES R658 ZR657 GOE GCLK1 I E VCOM FBO X e 9 gt GMA3 10uF 25V 3216 190K Qe 22pF 8 22uF 2 10ur 6 2K 6 2K VGL GIP id C674 u qea FHD 60 LAMP 0V LOM HON OPT OPT 5V C675 15 t VDD_LCM 610 u 501 9 A R671 50V 10uF 10uF 4 7K l5pF OPT z lt Z 50V d S 2 ee e d NON GIP a d C602 C603 e R615 0 aj e 0 1uF 0 1uF e R672 GIP MESS 05 0 2 IC600 50V 50V LANA R662 R666 e i TPS62110RSAR 10 e e 0 deinen ced 0 R605 MINI LVDS INI LVDS R2 j Gon RXDCK RXA4 gt GCLK6_I e 5V C672 C EP C671 Li L 47K RETO Rett A R617 15pF 15pF m m OPT R616 C639 33K 100K 50V 50V H 5 10K 2 2uF i 1 0 NON GIP OPT Op 16V HD 60 LAMP 42 FHD 160 LAMP sons O um z S a 4 i Vo 1 153 1 R1 R2 DISCHG 7 VGL_I 5 R653 VCC_LCM i For P Gamma Data Download E GET 0 3 3V l n608 GVDD ODD gt GVDD ODD I A P700 10 i GIP E 12505WS 03A00 l PANEL VCC e C669 o m A 15pF OM gt H C649 luF 50V CO a 50V am 9 R606 R660 5 l gt AMP SCL i 20K RXD4 gt POL
29. o OPT 16V R1914 e 7uF 16V R1912 22K ev 10K mE 33 ARLI OPE CI_ADDR 12 lt PCM A 12 gt 9 CI ADDR 13 4 PCM A 13 CI_ADDR 14 lt PCM_A 14 R1922 REG PCM_REG 2 2K i R1913 s R1911 10K 01901 5 AR1909 PCM SV CTI 9 25050532 CI OEC PCM OE R1924 s CI PCM WE 10K CI IORD PCM_IORD CI_IOWR lt _ PCM_IOWR i ROUES a rea CS 8 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics Eri MODEL I LG ELELTRONILS BLOCK ecce SHEET Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only NON ETHERNET CE rite aM i i P2 NE EPHY RXDO 2102 0 L EPHY_RXD1 i i Pp o EPHY TXD1 i TES v EPHY_TXDO i l P2 gt EPHY REFCLK P2 v gt EPHY CRS DV 2 v EPHY MDIO i TP2 T gt ET RXER IP2 o RST PHY i IP2 o EPHY MDC i 2 19 EPHY_EN l ep emm emm emm emm emm D D D D GD GD D GP m THE SYMBOL MARK OF THIS SCHEMETIC DIAG
30. 1024 x 768 3 60 Hz HDMI PC Audio In Display and Sound check is executed by Remote control COMPONENT 480i LGE Internal Use Only 4 Total Assembly line process 4 1 Adjustment Preparation W B Equipment condition CA210 CH 9 Test signal Inner pattern 85IRE Above 5 minutes H run in the inner pattern power on key of adjust remote 13 000 X 0 X 0 269 0 002 002 Y 0 002 lt Test Signal Inner pattern 216gray 85IRE Medium 9 300 X 0 285 0 002 0 285 0 X 0 285 0 002 Y 0 293 0 002 X 0 313 0 002 Y 0 329 0 002 Connecting picture of the measuring instrument On Automatic control Inside PATTERN is used when W B is controlled Connect to auto controller or push Adjustment R C POWER ON gt Enter the mode of White Balance the pattern will come out Full White Pattern COLOR ANALYZER TYPE CA 210 RS 232C Communication Auto control interface and directions 1 Adjust in the place where the influx of light like floodlight around is blocked illumination is less than 10 lux 2 Adhere closely the Color Analyzer CA210 to the module less than 10 cm distance keep it with the surface of the Module and Color Analyzer s prove vertically 80 100 3 Aging time After aging start keep the power on no suspension of power supply and heat run over 5 minutes Using no signal or full white pattern or the
31. 8 AO 60 LVDS SEL Rise Q Q gt SCAN BLK2 epe ES C713 C714 C715 SCA 10uF 1000p 0 1uF NON SCAlR 721 0 3 3V_Normal gt OPC_EN A 16 50V 16V OPT OPT 3D 3D 7 0 gt SCAN BLK1 OPQ OUT S dia R705 PWM_DIM OPT SE LVn SEL HIGH 3 FPGA RESET R706 R 3 RESET R710 e E 240Hz 10K 10 3 I2C_SCL LVDS SEL LOW 240Hz 3D ER nu 70 3 I2C SDA d 240Hz 3D C 104 3 3D POWER EN 3D TH SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics Eri I L6 ELECTRONICS BLUE wes SHEET Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only 1 8V_AMP A 3 3V_Normal IC404 AP1117E18G 13 mE
32. DDC_SCL_3 JP804 B JP808 R824 100 HDMI_CEC R860 100 HDMI_CEC 5V_HDMI_2 5V_Normal e R847 R852 m 0 CK HD a 2 gt CK _HDMI3 N x e ENKMC2838 T112 5 Y Y 55 9 CK R846 p eg CK R816 8 9 H CK _HDM O Bl gt x g gt DO R845 p D0 R821 9 2 gt D0 HD gt 0 HDMI3 IC802 DO_GND DO_GND AT24CO2BN 10SU 1 8 e EDID WP Do oss DO F R814 See m DO _HD DO _HDMI3 i ey xnl RS A E D1 D1 R819 R843 p an 0 D1 HDMI3 D1 GND D1_GND E i 0 055 UB C807 R885 R889 D1 D1 R818 R842 Six d 0 DiR Ww 4 7K2 4 7K D2 R850 0 D2 R820 p A2 SCL JP810 D2 _HD gt D2 _HDMI3 e DDC 561 2 D2 GND D2_GND R878 22 GND SDA D2 R848 p Sis its Dek R812 DDC_SDA_2 C gt R877 22 X 1 P co z JK802 2 JK804 a I 5V_HDMI_3 5V_Normal S zi lt A ENKMC2838 T112 D823 9 HDMI 3 2 IC803 AT24C02BN 10SU 1 8 EDID WP x Q o a AO co os rP M T BRon E a a mero oai V cec A e A rS es Le ee Al C808 R886 gt R890 0 1uF 4 7K24 7K A2 JP811 9 5601 3 R879
33. G North Latin America http aic lgservice com Europe Africa http eic lgservice com Asia Oceania http biz lgservice com LED LCD TV CHASSIS LD01A MODEL 26LE3300 26LE3300 ZA 26LE3308 26LE3308 ZA 26LE330N 26LE330N ZA CAUTION BEFORE SERVICING THE CHASSIS READ THE SAFETY PRECAUTIONS IN THIS MANUAL m A pq P NO MFL62863040 1003 Printed in Korea CONTENTS e ug pp 2 PRODUCT SAFETY 2 oiunedcids Ue P EN dEus Chua CIcUcE MER M SENE 3 DPE CIPIC ATION 6 ADJUSTMENT INSTRUCTION eere rennen nennen 9 BLOCK DIAGRAM nUcsunin ER 15 EXPLODED ee EROS 17 nesesanewaansxeesadsaaennnacacnaenssanneemsene Copyright 2010 LG Electronics Inc All rights reserved us LGE Internal Use Only Only for training and service purposes SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety related characteristics These parts are identified by A in the Schematic Diagram and Exploded View It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock Fire or other Hazards Do not modify the original design without permission of manufacturer General Guidance An isolation Transformer should always be us
34. 1SN1D SIDE_AV_OPT SA YL E LUG D3301 30V 4A YL O SPRING IDE AV OPT R3301 75 VU 3 3 Normal SIDE AV O 10K R3302 EST SIDE AV OPT R3305 1K ii I C3304 100pF OPT gt SIDEAV_CVBS_IN Y E CONTACT SIDE_AV_OPT D3 302 dq few C3301 100pF gt SIDEAV DET gt SIDEAV L IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF 15 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR IHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes SECRET LGElectronics ae SIDE_AV_OPT 4B wH O SPRING 22d b 36 SIDE AV OPT SIDE AV OPT L3301 BLM18PG121SN1D R3306 C RD O SPRING e e SIDE OPT 10K e un 4 R3303 SIDE_AV_OPT SIDE_AV_OPT RD E LUG B3302 470K C3302 R3308 SIDE AV OPT 100pF 12K 3 e SIDE_AV_OPT JK3302 BLM18PG121SN1D R3307 SIDE_AV_OPT e hd SIDE AV OPT SIDE AV SIDE AV OPT D3304 SIDE OPT C3303 R3309 5 6V 100pF 12K 50V SIDEAV R IN LG ELECTRONICS MODEL BLOCK 5 av SHEET LGE Internal Use Only WIRELE
35. 5 are ll _DDR3_DQL5 DDR2_NC D2P LLV8P 55 gt RXD2 WI GH dw ACAD SNe gt C MDQOSLB 10 C TMDOL6 _DDR3_DQL6 DDR2_DQ3 D2M LLV8N eas gt RXD2 LOW I2C ADR B4 AR306 C TMDOL7 FRC_DDR3_DQL7 DDR2_DQ5 D3P TCON3 gt RXD34 i CO cm p3u Tcox2 Rxb3 FRC CONF1 FRC FRC PWMO DOSU C MDQL7 gt C TMDQL7 uso AE10 j AE18 RXD4 3 a5 boot f int 1 SRAM i F DDR3_DQU0 DDR2_DQ8 D4P TCON1 gt boo rom interna El C MDQL3 gt C TMDQL3 zudem AFT i AF18 i Dude dE E T RRB ROM F DDR3 DQU1 DDR2 DQ14 D4M TCONO d C MDQL1 gt C TMDQL1 AD11 z bQUl ve LECO 3 d7 boot form SPI flash C gt C MDML PE OTUNKE C TMDQU2 E FRC_DDR3_DQU2 DDR2_DQ13 ve gt C MDMU To C TMDQU3 apio FRC PPR3 DQU3 DDR2 012 ws AR307 C TMDQU4 Ap PRC DDR3_DQU4 DDR2_DQ15 GPIO0 TCON15 HSYNC VDD ODD Fon L gt GVDD ODD 3 3 Normal M1 i 5 gt C MDQLO C MDQLO C TMDOLO C TMDQUS Ario FRC PPR3 DOU5 DDR2 509 GPIOI TCON14 VSYNC VDD EVEN 155 GVDD EVEN gt C MDQL1 C MDOL2 m C TMDQL2 C TMDQU6 aps P _DDR3_DQU6 DDR2_DQ10 GPIO2 TCON7 LDE GCLK4 RGIS gt GCLK4 as 55 gt C MDQL2 C MDOL6 S C TMDOL6 C TMDQU7 DDR3 DQU7 DDR2 GPIO3 TCON6 LCK GCLK2 GCLK2 o hee er pu N e Tj gt C MDQL3 C MDQL4 gt C TMDQL4 D SQ ME i gt C MDQLA 10 vt F T9 AB16 UART_FRC_RX H gt C MDQL5 R316 FRC GPIO0 UART RX POE 8336 E
36. C1610 009r EU OPT CHINA HOTEL OPT 1000pF gt AUDIO R R1665 m C1665 6 9 50V ost OPT R4217 33K 0 01uF 22K EU OPT CHINA HOTEL OPT R1668 EU OPT CHINA HOTEL OPT 10K 7 8 R1655 C1655 ae 2 2K 33pF amp es ee ee EH EU OPT CHINA HOTEL OPT OB EU OPT CHINA HOTEL OPT C1645 1661 10uF 470K 16V IE B Ji E EU OPT CHINA HOTEL OPT STATIS COMPONENT To R1612 10K R1615 1K EU Not Using 9 cowP2 D1613 3 5 6V China Using mai p POR ESD 5 EMI GN E LUG OPT EU Not Using NV R1619 C1613 uavpeisv i pF IN CASE OF SMALL 15V GN O SPRING 50V T SCART PIN 8 D1612 Crane dede neum m LSCART AUDIO MUTE peo T oben R4205 10K FOR ESD amp EMI S Ras0s 2 2K 19 22 BL E LUG S 50 y D1614 30V COMP2 Pb EU Using 10pF M i R4214 75 C1614 EU_OPT BL O SPRING R1620 opr R1687 gt COMP2_Pb 35 EU OPT EU OPT FOR ESD amp EMI K R1690 R4202 China NotUsin E g RD E LUG S r 50 OPT B EU OPT 10pF R1675 EU_OPT e e Q1615 0 75 C1615 2K R1677 RDJO SPRING l oe ram Rie2t ort A 3 5V_8T 10K EU_OPT gt COMP2_Pr zi R1695 R4207 E D1615 Sae 30V an WH O SPRING EU_OPT C DTV MNT 1 OUT lt R1633 R1637 MNT_L_ opt R1680 i gt REC 8 RD CONTACT e COMP2 L IN EU OPT R1652 SC REl e 1K P C1616 QL607 EU OPT 10K p1616 R
37. EA BH G o 0 22 Z 7e WY H ps pde 3 N dio Ala o e Ay Ay d A 5 a A 3 5V_ST ae A JE Gu a c a mj m O R1044 10 o 3 5V ST A B d J es MICOM MODEL OPTION x a e H 3 e R1045 10K a 9 OPT x ae P E 2 a 5 5 MODEL OPTION S N X se 9 Sus T n uo ad DS NS do PIN NAME e o 5 PIN NO HIGH LOW o o o o e Fa x S 8 5 5 5 AMP RESET N lt SS m e MODEL1_OPT_0 MODEL OPT 0 8 OLED 3D LCD PDP es i x a d R1083 10K PANEL CTL C rog 9 MODEL1 OPT 1 PRU CTED OPT e UE 2 1 11 BUZZ GPIO LED R1003 0 OPT_ CEC_ON OFF X e p j U MODEL1 3 MODEL 2 30 TOUCH KEY TACT KEY LB e a a ee moder geh E im is Q E MODEL 3 31 PDP 3D LCD OLED i 3 EC me 2 a H d E A Z A 7 oe n n ls 9 lt E 5 Bi YN nu H E Ei 5 a E 4 Zz z 8 E oie 2 Ho Ho MS Ho e 3 5 el gt z 1 9 e I IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION MODEL DATE LG ELELTRONILS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC GElectronics Copyright O 2010 LG Electroni
38. IC101 a 6 D a LGE107D S7M Divx Non RM IE N x e 3 Bt S z SS e i o o o 7 Gx A lt m d ag 5 MIx AR301 m no AE1 W26 2 m MA9 C TMA9 o C MA C TMAO arig l DDR3 A0 DDR2 NC ACKP P RED 3 8 gt RXBCK L2 C MA2 m C TMA2 C TMA1 AFL FRC DDR3_A1 DDR2_A6 ACKM RED 2 C O RXBCK 2 1 E C MAO gt C TMAO C TMA2 FRC DDR3 A2 DDR2 A7 AOP RLVOP RED 9 gt RXBO J3 C MBA2 gt C TMBA2 C TMA3 apia F DDR3 A3 DDR2 A1 AO0M RLVON RED 8 E gt RXBO m 3 t CLose to DDR3 CLose to Saturn7M M C TMA4 x55 DDR3 A4 DDR2 CASZ A1P RLV1P RED 7 TS RXB1 d A C TMA5 FRC_DDR3_A5 DDR2_A10 A1M RLV1N RED 6 gt RXB1 C MA8 C TMA8 AF15 25 C TMA6 FRC_DDR3_A6 DDR2_A0 A2P RLV2P RED 5 gt RXB2 C MA6 C TMA6 AF2 V24 T2 C TMA7 FRC_DDR3_A7 DDR2_A5 A2M RLV2N RED 4 gt RXB2 C MA4 C TMA4 AE15 W24 C TMA8 FRC DDR3 A8 DDR2 A2 A3P RLV4P RED 1 gt RXB3 C MBA1 gt C TMBA1 AD2 Y26 Er C TMA9 FRC DDR3 A9 DDR2 A9 A3M RLV4N RED 0 gt RXB3 IC301 10 AD16 Y25 F3 H5TO1G63BFR 12C C TMA10 xpis _DDR3_A10 DDR2_A11 A4P RLV5P GREEN 9 gt RXB4 G3 Q RROD C TMA11 ATS FRC DDR3 A11 DDR2 A4 A4M RLV5N GREEN 8 5 RXB4 VuMATV L C TMA12 FRC DDR3 A12 DDR2 A8 FRC DDR 1600 C MA12 5 C TMA12 c7 M8 C MA1 C TMA1 AC26 C MVREFCA VREFCA AO gt C MAO ia BCKP TCON13 GREEN 1 gt RXA
39. R849 p Q gt D2 _HDMI4 DN 0 xcd R857 D2 GND D2_GND 68K OPT D2 R833 p D2 R808 p R858 D2 HDMI2 gt 521 HDMI4 A e e u mpe e CEC REMOTE S7 Lx Y J H JK801 JK803 2 3 0806 eo BSS83 cs E o8 B ud 9 a C805 L0 1uF z 16 GND GND L 1 ON OFF 68K 43 5 ST 9 R892 Se ge IMP eae PCI ty Set fevers any a Sees ees a M F Mer 2y 0 pes R853 10K 68k OPT HDMI_CEC e e e nre lcEC NEC H T Q805 ny BSS83 H Aag OPT 3 e 5 p D aol E 16V ae THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics MODEL BLOCK Ss SHEET LG ELECTRONICS I Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only COMMON AREA New Item Development EARPHONE BLOCK
40. TU SCL A 33 R3736 pem ere e TUSSDA R3751 R3752 F TP C3711 220 220 EL LER 18pF 18pF q 50V C3702 Jciose to TUNER e gt TU CVBS E 0M iur 7 R3749 0 en R3750 B 03703 EO 1K c ISA1530AC1 34 3V EU OPT 1 2V 1 8V_TU 3 3V_TU A c 7 cee A B2 1 2V CHINA OPT R3733 F AGC MAIN Tans 3705 03707 C3708 1098 Aus cee 100 0 1uF l00uF x 0 1uF e TUNER RESET should be ded b d LA 100pF guarde y groun 3 5 16 16v 16 C3710 m LUB 3 3V_TU ET E E IF AGC CNTL 0 R3742 R3744 R3704 EU_OPT 4 7K 4 7K CHINA_OPT CHINA_OPT DIF 1 sry CHINA_OPT R3738 100 DEMOD 861 CHINA OPT z DIE 2 s 0 CHINA R37 100 e DEMOD SDA close to IF line CHINA OPT jm Lesne mem Vp mud nud A nnd Y C3712 C3714 22pF 22pF 22pF 22pF 50V 50V 50V 50V OPT QET CHINA_OPT CHINA_OPT EU_OPT oe 9 R3760 IF N MSTAR F P MSTAR R3761 XK ee EUSOET 1 should be guarded by ground 2 No via on both of them 3 Signal Width gt 12mils Signal to Signal Width 12mils l Ground Width 24mils 343V TU EU_OPT TDFR C155D Close to the tuner AZ1117H ADJTRE1 EH11A EU_OPT x 1 2 1 8 TU INPUT ADJ GND A a EU_OPT i R3768 1 2K R1 e R3703 150 OPT IVO EU OPT SCA2151STRT Ramee 1 10w 1 2V 4 1 8V_TU 380
41. UART USB1_CTL WE PWMO E 7 WE 170 hd PCM AT12 PCM A11 GPIO8 HP DET T ate gee R190 gt coNTROL ATTEN OR z NC 11 1 00 HR UO m A PCM A 13 mis emos F9 0 R110 NP 7 PCM A13 GPIO10 MODEL OPT B Q101 e E 8 LV VV 22 Be reni PCM A 14 Was in a PF WP e KBGTOdS Ness spolo afs PCM A14 GPIO11 PM5 PM UART RX E UE MODEL OPT 1 ng t OPT NC 13 NC 18 o Wo PM SPI CS1 GPIO12 E S PCM_REG lt PCM_REG_N PM SPI WP1 GPIO13 FS FLASH WP Neate E T PM SPI WP2 GPIO14 PM8 MODEL_OPT_2 15 16 L St be u vta 7 45 Seu des P i PCM OE X PCM_OE_N GPIO15 ae gt TUNER_RESET 7 i PCM wa PM SPI CS2 GPIO16 PM10 ais gt DEMOD_RESET PCM IORD vai PCM TORD_N GPIO17 PMI1 INT3 AVZCVBS DET PCM PCM GPIO18 PM12 INT4 R132 uum gm AA20 D9 33 R147 e 10K PCM_CE C 723 PCM CE_N PM SPI CK GPIOl SPI SCK T R133 PCM_IROA 523 PCM_IROA_N GPIO00 PM SPI CZ 5 gt sPI CS le EG 7 TOE PCM_CD u25 PCMLCD_N PM SPI DI GPIO2 zs ns lt jeri 501 or SERIAL FLASH PCM_WAIT 522 PCM WAIT_N PM SPI DO GPIOS3 SPI SDO M mr n MI D PCM RESET p come mem Satie Sete AR104 T star d AA CI TS VAL m OPT TS HY27US08121B TPCB NAND
42. whether written EDID data is correct or not For SVC main Assembly EDID have to be downloaded to Insert Process in advance 4 3 DDC EDID Write HDMI 256Byte Connect HDMI Signal Cable to HDMI Jack e Write EDID Data to EEPROM 24C02 by using DDC2B protocol Check whether written EDID data is correct or not For SVC main Assembly EDID have to be downloaded to Insert Process in advance 4 4 EDID DATA 1 All Data HEXA Value 2 Changeable Data Serial No Controlled Data 01 Month Controlled Data 00 Year Controlled e Oheck sum LGE Internal Use Only Auto Download 1 HD RGB EDID data After enter Service Mode by pushing ADJ key Je 2 s 4 s e z e e B ec p E F Enter EDID D L mode 00 oo FF FF FF FF FF FF oo tE e 0 ro o or os es vs v 78 oa cr 74 s sv 46 80 25 a oo ss 1 A os oo sr co er ao s qo s 4o os or feo o or for or or or es 21 so eo 51 oo 18 ao 1 o se oo ve a2 oo oo t ot ro oo ve 51 to E 20 so se ze ss oo ze a 40 oo oo oo vo oo oo aa ae 1E 4s 10 00 oa 2020 20 20 20 20 O Enter START by pushing OK key EDID D L 0 Tool Opt ont 1 Tool Option 2 Tool Option3 3 Tool Option4 4 Country Group 5 ADC Calibration 6 White Balance 7 Test Pattern 8 EDID D L E 70 Foo o e
43. 0 designated and which must be followed according to the plan which can be changed only on agreeing Please Check the Speed To use speed between from 200KHz to 400KHz 2 Power Adjustment Free Voltage 3 agne Condition Ad ae 5 Click Auto tab and set as below 4 Input signal Unit Product Specification Standard 6 Click Run 5 Reserve after operation Above 5 Minutes Heat Run Temperature at 25 C 5 C 7 After downloading check OK message Relative humidity 65 10 MStar ISP UH VEO Z Input voltage 220 V 60 Hz 6 Adjustment equipments Color Analyzer CA 210 or CA 110 DDC Adjustment Jig equipment SVC remote control j 7 Push The STOP KEY For memory initialization F Multi Flashes 7 Verity Erase Device Exit ISP f Chip Case1 Software version up 1 After downloading S W by USB TV set will reboot automatically 2 Push In stop key USB DOWNLOAD 3 Push Power on key 7 4 Function inspection 1 Put the USB Stick to the USB socket 5 After function inspection Push In stop key 2 Automatically detecting update file in USB Stick 08562 Function check at the assembly line If your downloaded program version in USB Stick is Low 1 When TV set is entering on the assembly line Push it didn t work But your downloaded version is High USB In stop key at first data is automatically detecting 2 Push Power on key for
44. 0 R_GND ab OPT sc1_R COMP1_Pr R4221 D2B_OUT e EU_OPT R1601 et dp G_OUT EU OPT e e e 2561 G COMP1 Y D2B_IN ere gt REC_8 EU_OPT 30V R1604 C1603 R4224 R1602 10pF EU_OPT 1716 6 GND 0 75 R1669 hd sc1 G COMP1 Y 0 ID e em ID EU OPT B OUT D1618 EU OPT e e e L gt sci 4 6 554 R1623 PERTE Ton r3 n 30V 15K R1629 _L_ D1606 3 9K 30v B_GND 75 E e 25961 B COMP1 Pb AUDIO GND e AUDIO L OUT R1603 R1617 10K AUDIO R IN e e e Y gt SC1 COMP1 L IN L1604 AUDIO OUT D1607 R1606 OPT 120 ohm C1611 R1630 5 6V 470K C160 330pF 12K OPT 50V PSCOO8 01 JK1602 RIELS e TS 7 sc1 COMP1_R_IN 11603 1609 120 ohm C1612 5 6V out R1631 OPT e d C1605 330pF 12K ee 50 LM324D EU OPT CHINA HOTEL OPT E EU OPT CLOSE TO MSTAR 1 4 E ovr lt at ae EU_OPT TER DTV MNT_L_OUT R1664 E n 33K D1608 EU OPT 1 EU OPT EU OPT JL TOUR RT pur Bis LO POEZISNIS ey foe CLOLe cleo R4218 470K EU OPT OPT 1000pF 4700pF 12V 15V 0 01uF 22K R1667 gt EU OPT EU OPT 10K ES R1657 C1654 5 6K pF SCART1_Lout gt A R4219 100 4 1 9 ZEB DTV MNT OUT C1642 EU_OPT CHINA_HOTEL_OPT EU_OPT R1658 EU OPT oper 9 07 EU OPT a 0 1uF 5 6K 5 0 H 5 6V m C1619 DE 50V SCART1 Rout R4216 100 dd BLM18PG121SN1D T
45. 00 ps Digital EDID Pin3 exists 2 Never connect HDMI amp D sub Cable at the same time Detail EDID Options are below 3 Use the proper cables below for EDID Writing Product ID 4 Download HDMI1 HDMI2 separately because HDMI1 is different from HDMI2 Model Name HEX EDID Table DDC Function For Analog EDID For HDMI EDID HD Model 0000 00 00 Analog Digital D sub to D sub DVI D to HDMI or HDMI to HDMI Serial No Controlled on production line Month Year Controlled on production line ex Monthly 02 gt 02 Year 2009 gt 13 Model Name Hex a j MODEL MODEL NAME HEX 00 00 00 FC 00 4C 47 20 54 56 OA 20 20 20 20 20 20 20 Data Hox TEOR Checksum Changeable by total EDID data Digital 1 Vendor Specific HDMI INPUT MODEL NAME HEX HDMI1 65030C001000011D HDMI2 65030C00200001 1D HDMIS 65030C00300001 1D Copyright 2010 LG Electronics Inc All rights reserved 12 LGE Internal Use Only Only for training and service purposes 4 5 V COM Adjust Only LGD M S Module Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes Why need Vcom adjustment The Vcom Common Voltage is a Reference Voltage of Liquid Crystal Driving gt Liquid Crystal need for Polarity Change with every frame Circuit Block Gamma Reference V oltage Control signal Gamm a Reference Volta ge
46. 09 T gt e A RT1P141C T112 A03407A T A td i 0402 e No a p EE Fe C474 o PANEL VCC Q SE tm 0 1uF R406 T Cd S 3 d ye Lo 3 4 7uF NORMAL_EXPEPT_32 NORMAL_32 Gas e R401 2 P403 P404 16 _ RL ON 10K TY FW20020 248 FM20020 24 24V e e 9 5 3052 n R431 ox C451 24V ve SC oa 100K L407 D E a 1C409 8 MLB 2 01209 0120P N2 Spe ae OMS go OPT POWER 424V spes i POWER F20 V NCP803SN293 PD 412V C AN e R430 pues R480 L404 C418 C426 TOE 9407 R405 4 R407 100 MLB 201209 0120P N2 e sour BE 28C3052 3 2 2K lt 2 2K e a V C e M cq di R429 R435 E 16V POWER 424V9 9S m de 40155 C406 C408 PANEL CTL Aik B 22K ud S E POWER 20v e 0e TuE ee BAY 0 1 AK10 PANEL_DISCHARGE_RES i 16V 16v 5yncge x 9 V SYNC a PANEL_DISCHARGE_RES INV QN P Power DET A DIM 12V 15V P DIMI 8 dom d L402 Err 8 MUN 2 e E A gi cosi a mud C407 9 Jo POWER 18 INV CTL 1K 3 5V ST S M D D uu te ps far lt 3 rr i R l 5VI 3 3 Normal 13 3 Normal 00uF 1u z pe 16V 16v 16V 4 Du m En 1074 mA i B SLIM 32 52 a D Z X R P401 ae Seeds ome a em a min t oH Ec smaw200 H2482 AMET te i _ or t sa R421 m 5 A IC405 1934 mA v 4
47. 1625 R1636 28C3052 EU OPT E 5 6V 1000pF 12K RTIP141C T112 OPT E RD O SPRING 2 470K P R1648 1 510 R1676 28653052 2K e 560 RD E LUG 9 9 SCART1_MUTE EU OBSS e R1632 R1638 3 R E nis E 10K 0 DTV MNT OUT EU ODE SC RE2 e Q e COMP2 R IN EU OPT C1636 2863052 PPJ234 01 EU_OPT JK1603 7 D1617 C1617 1634 91608 0 1uF R1681 E 5 R1626 1000pF Re 2803052 Rd e 470K Ri pe LG ELECTRONICS BLOCK L 95 JSBEET LGE Internal Use Only NOT USING B T BT_ON OFF BT_DM BT_DP BT_LOUT THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only LG ELECTRONICS BLOCK svt GHEET CI Region
48. 2 HIS e 2i L207 L217 D25 REF e AA2 G14 R4028 a ROP SEDI INZGEROIS 0 OPT AMP SDA BLM18PG121SN1D BLM18PG121SN1D Mie e am AA1 G13 R296 100 CONS e SER M17 CK _HDMI4 _RXCN SPDIF_OUT GPIO178 5 SPDIF_OUT e ABl C287 o AU25 ig E DO _HDMI4 adn RXOP um mus umen E loup zB 3 3 5 2 e p od od H jo a Roar oath F 1 DO _HDMI4 _RXON B T USB Sp seme e AB3 B7 O oo oon0 o o z D1 _HDMI4 RX1P BT_DM AB2 A7 9 AVDD2P5 qus 3 e D1 HD 4 RX1N BT DP 9 Ac2 U 2 AVDD2P5 Y15 N14 D2 _HDMI4 uu _RX2P xus AVDD DMPLL AVDD NODIE 7 362mA S o D2 _HDMI4 C_RX2N SIDE_USB_DM asa AE17 AVDD25_PGA U8 N16 DDC SDA 4 DDCDC DA GP1028 SIDE USB D25 PGA hd AAA 7 DDC SCL 4 n DDCDC CK GPIO27 L SIDE USB e P10 HPD4 lt HOTPLUGC GPIO21 22 AVDD DMPLL M8 Pll 9 1256 IN BCK GPIO A2 n F13 M SX DENODIE P12 CK _HDMI3 m RXCP I2S IN SD GPIO COMPZ DET 9 P13 125 IN WS GPIO SCL M D SS Ss Ss VDD33 DVI ii m e DO _HD RXOP ae D20 ee eee Normal 2 5V P9 D DVI 1 SHE hd DO _HDMI3 _RXON I2S_OUT_BCK GP E20 gt AUD_SCK rus D_DVI_2 9 Dl 3 ES RX1P I2S_OUT_MCK GP D AUD MASTER H AVDD DMPLL xe D
49. 22 GND e DDC SDA 3 R880 22 HDMI 2 S IDE_HDMI 5V_HDMI_4 5V_Normal A 5V_HDMI_2 A 5V DET HDMI 2 A 5V HDMI 4 A DET 4 W y Vv ENKMC2838 T112 SHIELD R828 JACKK_GND R862 lt D824 Q801 B 10K 9803 B HPD4 3 R895 28C3052 HPD2 R897 28C3052 HDMI_SIDE e 10K 106804 1K 9 E 1K E AT24CO2BN 10SU 1 8 nel csoi 503 2 ES R803 1uF R837 1 aSo e Ld e 116v e 2 Ss to JM 1 8K EG JP802 Orem JP805 e sm ui 9 ur ER um ER DDC SDA 4 DDC_SDA_2 _SDA_ 22 i gt Al WP C809 R887 lt R891 R806 R840 22 gt DDC_SCL_2 DbC SCL 4 0 1uF 4 7K4 4 7K px JP806 A2 SCL JP812 JP801 DDC_SCL_4 R815 100 oup eae R841 100 E 881 22 Si S GND SDA o R 0 o R 0 e DDC_SDA_4 m CK _HDMI2 _SDA_ alo i gt E L gt R882 22 B EN mi H e a 3 a CK R834 n CK R807 m o 0 0 lt E CET HDMIZ gt CK H E E DO R822 p D0 HDMI2 A DO R817 p 5 zm gt DO _HDMI4 DO_GND DO_GND DO R832 p R809 p P i DO _HDMI2 gt gt DO _HDMI4 3 3V_Normal D1 R827 D1 R813 p m D1 _HDMI2 gt D1 _HDMI4 68K D1_GND D1_GND R854 D1 R829 p D1 R811 E For CEC SN D2 R823 p D2
50. 3052 LNA2 CTL e o CHINA OPT R3727 0 TU3702 TA i C3709 E The pull up down of LNA2_CTL 50010 TDFR C S35D o orur 25V GPIO must be added for FE_BOOSTER_CTL CHINA_OPT TDFR C035D close to TUNER 45V TU LL VL ILLI m i ANT PWR PT W P 2 p O E ERES M 4 RF AGC C3731 oso a IA OPENS CHINA OPT P uL LULA LEE WELL BST CNTL ssT ere eem 16 J C3703 a TONBE pa Soest GPIO t b dded wove EU mus Eoo e B 5V Bae bp R3754 i E i 7 Q3704 B 10K ROT 22 PE_AGC_SPEED_CTL 3 3V_TU 470 R3758 NC RF_AGC RF_AGC 25503052 OPT IF_AGC_SEL 82 R3707 0 gt TU_SIF E E OPT R374 1208 R3 B ISA1530AC1 d 35 f paises R3735 1 2K TU 4 7K e
51. 3P3_CVBS 9 zu P8 P17 D1 _HDMI3 _RX1N I2S_OUT_SD GP 5 EPEE TE gt AUD_LRCH 2 5V_ ormal AVDDAPS AVDD2BS D DMPLL e D2 _HDMI3 cs D RX2P 128 OUT SD1 GP E gt SCL 9 L211 R11 D2 _HDMI3 D_RX2N 128 OUT SD2 GP gt MODEL OPT 4 R4022 zm 20UT Dis gt BLM18PG121SN1D 0 AU33 R12 9 DDC_SDA_3 DA GPIOS30 125 OUT SD3 GP T MODEL OPT 5 ZEE 9 D AU33 9 U7 R13 DDC_SCL_3 lt __ DPCDD_cK GP 1029 I2S_OUT_WS GP AUD_LRC 5 1 10W zi D EAR33 e v m e 2 5 R14 HPD3 pe HOTPLUGD GPI022 gt hd CEC REMOTE S7 CEC GPIOS f N C236 2 2uF N D x VDD33 R16 M 1 0 SC1 COMP1 L IN O c e lt q e 9 i m m OR SC1 COMP1_R_IN V q 22 G5 P C238 2 2uF R8 R18 DSUB HSYNC e R4025 HSYNCO 1 AV L I D 9 2 G6 P2 C239 2 2uF R9 T10 DSUB_VSYNC e eu IR AV_R_I 2 5V_Normal AU25 2 5V_Normal AVDD25_PGA e R228 33 C2044 0 047uF m P4 0640509 2 2uF iw A A T8 T11 DSUB RINOP LT SIDEAV L IN e a eee R229 68 C205940 047uF L3 5 C4060 2 2uF qe qs 54 L212 L219 T12 7 R230 33 c206 0 047uF a K3 2 C242 NER P BLM18PG121SN1D BLM18PG121SN1D T4 hg DSUB_G GINOP DET COMP2_L_IN TE e e 9 a R231 68 C207940 047uF K2 T6 C243 2 2uF z 5 5 v20 T14 DSUB_G GINOM 3R COMP2 IN
52. 470K R1110 E a i OPT 10K R1126 alc 22 VINPUT mi 8 EDID_WP 5 z R1108 OPT C1131 RMINAL 15K 1121 e e e e PC L IN 21516 S UF 100pF BGB DDeSCL R1113 16V P RMINAL2 D1102 C1108R1103 50v e e RGB DDC SDA lose 100pF S470K 5 6V 50V R1111 c1127 C1128 R1141 OPT 10K 18pF 55 18pF le 22 R1143 50V 50v 22 E R1127 0 L 9 DSUB_vsync RI150 0 e 5505 HSYNC C TET C1122 0 Lens D1113 D1116 D1109 D1114 68pF 68pF 30V 5 SON OPT 5 9V OPT OPT 30V OPT DSUB_B lt e e h OPT C1123 R1133 D1110 75 ORT I 30V DSUB B lt __ e ost H E e DSUB G lt e R1135 ORT D1111 C1124 30V OPT DSUB_G lt 3 3V_Normal S A H il R1146 Y 10K e gt DSUB DET R1147 1K DSUB_R lt e T E D1112 l C1125 D1117 pe DET lv 5 6V DSUB R lt C oo E a oo e il 55 a Zl AJW Q Wj H Z z o n Oo Oo oO adaz zla z IZ zial lolo n lm imi mH lo OQ anm o mH Qa z oj o m zimi elal lldio lz aj na vl 9 9 0 09 mimz 5ooonan e 5 a b o P UO Ss E SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONL
53. 65 AM ior 2 5V Normal 12V 15V IC406 MAX 1A 5V_Normal F A n AOZ21072AI a L422 T D 3 6uH id zm T e ee D em eam H NR8040T3R6N 1C402 2 5V Normal AZ2940D 2 5TRE1 A e e l POWER_ON OFF2_ Spies so e 300 mA 2 1 15456 c460 m uF a l0uF GND r 9 ur a e ee ee SN d T 1 U e 16V 2200pF C466 5 a aP 103 C440 i oe 0u O 1luF is mas R 1 Um Vout 0 8 1 R1 R2 dels 1 5V DDR 1 5V FRC DDR A A qu 0408 95 38 FRC a 4 To SH o l za A GED ia b OPT ane o Y 4 7uF 10V S7M core 1 260V volt Qm 43 5 ST A r POWER ON OFF2 1 2026 mA H or mo too S B O du oV_U sae ii 12V 15V Replaced Part A m 45V USB Vout 0 8 1 R1 R2 e r a MAX 2000mA R1 1 26V VDDC ICA401 A EN LF Z 35 MP8706EN C247 LF OM T o Dc e e SP UN 22K 1 24K 15 H IC403 j OPT MP2 212D Close to IC a am Paes C482 z Tun 100pF TAZA 10K i BONS 50V He 44
54. 9 EN SYNC o R445 c405 i 100bF C420 C424 C428 NINN n POWER ON OFF2 1 ZZ 10uF R410 R1 B 22 S2o 1ur 9 S0 1ur L415 25V i 10K e 10v 16V 16V Sas 3 6uH L e oT 9 e ap ap EN SYNC POWER ON OFF2 1 py NR8040T3R6N oe E E SW 1 X m Placed on SMD TOP e e A C453 C456 em C486 Du 22uF 0 1uF T0 iuF R2 f C448 C430 zs ot E L406 T 1 UP Placed on SMD TOP 3 6uH 5V USB V PEN NR8040T3R6N R441 0 R436 sk 9 Vout 1 R1 R2 0 8 10 C444 1 10W am luF z 18 10V Eri TH SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics I 5 ELECTRONICS BLOCK ower SHEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only FLMDO
55. 9v 295 EDN ROS XDLOIB 4 269 15 D pe m P FHD_LAMPS R691 5 IC603 i GCLK5_ gt CLK5 LIESDI B EEZ e e a692 saa PANEL_VCC i 9 shi 6 MAX17113ETL 631 12V a NON R i GCLK4_ gt CLK4 9 R6292 R631 VDD_LCM e S20 NON ES 7 MINI LVDS e A 1 z 10 1 C676 Tur NoN GIP i GSC GCLK yes IP GIP e C677 0 04TuH NON 220K 9 5 VGH_FB e e TCON 42 FHD LAMP e 9 1 EA m N fy N N z E gt i VGH_FB PS lI o L22ur i due ol l i T 25V 25V 622 AMI 11K R629 12 R631 1 e e cLK2 55 200 200 GCLK2 I 42 FHD LAMP NON GIP NON GIP GIP R686 gt CLK1 R695 1 GOE GCLK1_I WN GIP NON_GIP 7 i e GIP E VCC_LCM i 3 3V l L601 qnod C637 22UH 9 9 3 m d 0 luF 2 8A 0622 VCC LCM 9 s34 50V iuF C C c ll R626 10V 3 3V ez D604 06421 C648 0 1up e C655 E luF 10 A A MBRA340T3G6ZZ150pF 22uF ro OPT 50V GIP JREF 203 50V 10V Foy opt 5 1 GIP EL ELI GIP VGL R644 C630 3 6K Z2 tour R637 OPT e e 5V 16V C627 R639 R638 ET r A VGH 27K 1115 0 0 VGL 42 FHD 60 LAMP 50V C634 1 25V Se we A 75V 8 FB p D603 2200 A A 5 DS226 T 5 N R e m C632 NON GI
56. A 9 C217 1000pF 95 R4 ey VDD33 V SC1 SOG IN SOGIN1 MIC_DET_IN OPT A e J R236 0 T5 C234 2 2uF x R19 v8 MICCM et s AVDD DDRO AVDD DIARI E AVDD MEMPLL e NON EU R5 C235 2 2uF 5 z D W14 V9 r J is MICIN ae z Caen z E FRC AVDD MEMPLL um e xi HSYNC2 d m R237 33 C2184 0 047uF 3 T4 e e e vil COMP2 Pr R2 3B Fere avc gt RIN2P L202 AVDD_DDRO 9 5 COMP2 Pr u ranam BLM18SG121TN1D e z a aed UB o e N alea aala e ala a e D15 V12 R 33 c2204 0 047uF P mms 5 tes o5 c3 5 5 5 Mee 5 O S COMP2 Y4 u GINSB AY Ome 5 5 5 5 J C5 a 5 Bre vis e lo COMP2 Y RETO 8 0221 0 04 u T C233 258 ae 2 ooloolooloo los 9 o ob 5 o loo oo oec E15 v14 GIN2M 4 74 luF 0 1u 10uF 5 e R241 33 c2224140 047uF 12 R7 E16 V15 COMP2 BIN2P e e e 9 R242 68 C223440 047uF L1 P6 E17 V16 COMP2 Pb BIN2M e J R243 0 C224 1000 3 EMO OLORE RCT a V17 SOGIN2 zi RE H P OUT AVDD DDR1 hd HP_OUT_1L AT E i gt HP l 5V FRC DDR AVDD_DRRO EI e NES e T z F17 w7 SS m HP OUT 1R TS L gt HP_ROUT J A x AVDD_DDR_FRC 55mA e OVES R244 33 C225 0 047uF 4 CM2012F5R6KT s am 5 G16 ws e a R245 33 C226440 047uF 6 oe SE ES A
57. ADDR 7 4 gt CI_ADDR 0 cam 182 2A4 i CI MISTRT PCM A 1 PCM A 7 CI MIVAL ERR E 1Y2 CI ADDR 6 4 E gt CILADDR 1 CI_MCLKI gt i N Tre yc Se a a ee a x 2A3 PCM_A 2 a PCM A 6 sr H 1 3 CI ADDR 5 amp 4 ADDR 2 2A2 l PCM_A 3 PCM A 5 h Rer C DETEC i CI_ADDR 4 lt gt CILADDR 3 ee ee ee PE i 1 i 2A1 PCM A 4 3 3V Normal TRE VE 3 3V 3 3 CI i i i 1190 re CI_CD2 e BLM18PG121SN1D 3 s NE 3 o e Te e CI_cD1 s gt Y d oud 7 C1901 C1902 ES CI DATA O 33 R1907 PCM D O gt R1915 CI PCM O luF O luF p hd gt CI DET z CI_DATA 2 PCM_D 2 i d K 3 PCM 3 gt PCM i i a i Le eee at l e e CI DATA 5 PCM D 5 a i CI DATA 7 PCM D 7 e CI POWER ENABLE CONTROL PCM D 0 7 l CI DATA 0 7 C 5V_CI_ON 5V Normal A 91902 L1902 AR1912 RSR025P03 BLM18PG121SN1D 33 z CI_ADDR 8 lt PCM_A 8 9 e CU hd j CI_ADDR 9 lt PCM A 9 E CI_ADDR 10 lt PCM_A 10 o S 5 R1923 C1912 G ASER VUE CI_ADDR 11 lt PCM_A 11 A mme o 16v C191
58. B gt C MDQL6 C MDQL5 5 AA 1l1 C TMDQL5 FRC_GPIO1 Peer gt FRC CONFO MINI LVDS Es FRC CONFO 10 R300 0 M 1 gt C MDQL7 FRC GPIOS3 i Bt AR308 OPT e FRC_CONF1 Y16 En gt C MDQUO C MDQU2 gt C TMDQU2 FRC_GP1O8 FRC CONF1 e FRC_PWM1 l D1 _ gt eps C MDQU6 gt C TMDQU6 xxi FRC_GPIO9 UART_TX UART_FRC_TX b PRG PAMG ue gt C MDQU2 C MBOUO L C TMDQUO DDR3 NC DDR2 DOMO FRC GPIO10 om ills i E2 R317 TP301 o G MBOUS C MDQU4 5 C TMDQU4 85 6 R334 22 i a JN lt 9 a E8 10 Yii AA16 R327 gt FRC_SDA ie gt C MDQUA4 FRC_REXT FRC_I2CM_DA RYYY 22 MA e F9 AR309 Y19 AA15 R328 FRC SCL Spal of 3 gt C MDQUS5 e FRC TESTPIN FRC I2CM CK OPT EE EB G1 C MDQU7 gt C TMDQU7 0 B B C MDQU TP302 R326 G9 E Y10 22 FRC gt C MDQU7 FRC_I2CS_DA iili RYNA I2C SDA gt 22 S MD 1265 CK FRO 7 12C SCL 9 i C MDQU3 gt C TMDQU3 i 10 AB15 hd FRC_PWMO Foo gt FRC PWMO FRC_PWM1 gt FRC_PWM1 oY qnte VOIE quce CPP THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ODEL ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR LG FL TRONILS a M ee Oe ee M THE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC G
59. B MBAO B MA2 lt A2 A MVREFCA gt A MAO Z d XR B TMA3 C B MAS B MA3 lt __ A3 VREFDQ B MVREFDQ Al 5 A MA1 IC101 B TMA5 lt _ B MAS B MA4 lt ES A4 T A2 A MA2 cA A TMBAD LGE107D S7M Divx Non RM B TMA7 C B MAT B MAS C Ped as R1226 A MVREFDQ VREFDQ A3 gt A MA3 A MA3 gt A TMA3 10 B MA6 lt E AG E 5 gt A TMAS5 AR1215 A4 gt A MA4 S7M_DIVX B MAT R2 zs 240 R1203 A5 gt A MA5 A MA7 gt A TMA7 e ane B TMA4 lt B MA4 DH T8 13 SS A6 gt A MA6 10 A TMAO Em A DDR3 A0 DDR2 A13 3 A0 DDR2 A13 B B TMAO B TMA12 lt __ B MA12 R3 Ae 240 xs ROMS ARTZOA A TMA1 ag 2 P0R3 A1 DDR2_A8 DDR3 A1 DDR2 A8 B TMA1 B TMBA1 NG RL B MA9 C 17 Y A8 gt A MA8 E 0 AICTMAS A TMA2 aa DR3_A2 DDR2_A9 DDR3 A2 DDR2 A9 B TMA2 B TMA10 BCMEI B MA10 C ay 10 v a A9 gt A MA9 AMATZ A TMA12 A TMA3 DR3 A3 DDR2 A1 DDR3 A3 DDR2 A1 7 B TMA3 T B MA11 C an v 55 ABB gt AMATO A MBA1 gt A TMBA1 A TMA4 DR3 A4 DDR2 A2 DDR3 A4 DDR2 A2 B TMA4 ARS B MA12 5 1 2112 85 Y A11 O A MA11 ACTHAS aig 559PR3 A5 DDR2 SET0 DR3 A5 DDR2 A10 576 BERMAS B TMRESETB lt _ B MRESETB IEEE ns TE ee ere ro A TMA6 525 B DDR3_A6 DDR2_A4 _DDR3_A6 DDR2_A4 B TMA6 ws us 2 A13 gt A MA13 ALGO A TMAT c9 DDR3 A7 DDR2 A3 _DDR3_A7 DDR2_A3 7 B TMA7 E CPU N1 V A MRESETB gt A TMRESETB A TMA8 B TMA8 PET DR3_A8 DDR2_A6
60. C SDA 7 L_ gt OPC EN OPT 3 4 OV 1 43 5V ST P62 EXSCLO 3 P01 TI010 TO00 R1050 10K R1006 10K NEC EEPROM SCL OPT NEC EEPROM SDA I L gt WIRELESS SW CTRL R1072 10K e gt NEC ISP Rx R1084 P33 TI51 TO51 INTP4 5 C P20 ANIO MR 10K CEC NEC d gt SCART1_MUTE R1073 10K P75 ANI1 P21 CO ocpia R1065 22 E _ Im 056 22 POWER ON OFF2 1 N 6 UPD78F0513AGA GAM AX 3 MODEL1_OPT_3 Dp Dp R1005 10K AMP MUTE lt lt a P74 y ANI2 P22 BIB ue MODEL1 2 HA P73 KR3 g NEC MICOM ANI3 P23 3 P MODEL1 OPT 0 POWER ON OFF1 TT T P72 KR2 g ANI4 P24 UE COS soc nEsET C h 1 gt OLP 71 1g ANI5 P25 dr INV CTL C C gt SIDE HP MUTE EEPROM for Micom R1063 22 P70 KRO 11 ANI6 P26 433 5WV JST MODEL1 OPT 1 e KEY2 R1059 22 PS2 INTES OCDIB 45 ANI7 P27 9 KEY1 IC1001 ME NON M REMOTE M24C16 WMNO6OT R1060 22 cC O OO DW O AN sf RESETC 1 m eet oed A ce edo ce A N N N N N x X0 Oo I ox E NN A mo di m lh a or Q BIO XI x E Oz EH zz EH ER OO Qm S 3 5V T R1080 z zd de e aa se Se S SRL A NEC 561 dE mE LC OND a cC 22 5 7107 81008 H d Ay Ay Ay Ay Hd e EEPROM SDA
61. CK 5 C MA1 A TENE oe BCKM TCON12 GREEN 0 gt RXACK Al 10 AA26 E7 H3 A2 gt C MA2 AN BOP RLV6P GREEN 7 ARS gt RXAO C MVREFDQ VREFDQ A3 gt C MA3 ape C TMBAO EFIA FRC_DDR3_BA0 DDR2_BA2 BOM RLV6N GREEN 6 AA24 gt RXA0 A4 gt C MA4 qun C TMAS C TMBA1 Fer _DDR3_BA1 DDR2_ODT B1P RLV7P GREEN 5 e gt RXA1 i 5 E3 R303 A5 gt C MAS5 MR C TMBA2 3 BA2 DDR2 A12 B1M RLV7N GREEN 4 gt RXA1 L8 gt F7 A6 gt C MA6 od AS B2P RLV8P GREEN 3 mm gt RXA2 x De F2 BE AT C gt C MA7 SEER C TMCK nv _DDR3_MCLK DDR2_MCLK B2M RLV8N GREEN 2 gt RXA2 1 10 F8 7 A8 gt C MA8 C TMCKE e b _DDR3_CKE DDR2_RASZ B3P TCON11 BLUE 9 gt RXA3 H3 A9 gt C MA9 R307 C TMCKB FRC DDR3 MCLKZ DDR2 MCLKZ B3M TCON10 BLUE 8 ae gt RXA3 D9 C MCK L gt w C TMCK 8 aa A10 AP gt C MA10 10 BAP TCON9 BLUE 7 FEDT gt RXA4 ee All 5 C MA11 R308 dud B4M TCON8 BLUE 6 gt RXA4 D m gt z x x A12 BC gt C MA12 C MEKB i gt O TMCKB C TMODT Ses _DDR3_ODT DDR2_BA1 a C TMRASB _DDR3_RASZ DDR2_WEZ N1 R309 AF4 AD23 D7 A gt SSEMORRE C TMCASB AD _DDR3_CASZ DDR2_CKE CCKP LLV3P a gt RXCCK 10 C TMWEB _DDR3_WEZ DDR2_BAO CCKM LLV3N e gt RXCCK R1 C8 R310 AES COP LLVOP BLUE 5 gt RXCO E C2 uA c MBAO C MRASB D NN gt C TIMRASB C TMRESETB _DDR3_RESETB DDR2_A3 COM LLVON BLUE 4
62. D _RX2P SSIF SIFP BLM18PG121SN1D C4015 D 18 e H2 y1 Mo B 8 x K18 D2 HD ss A RX2N SSIF SIF li duo 5 19 e oe o 9 L9 DDC SDA DDCDA DA GPIO24 C4064 Close to MSTAR o D 20 9 F4 U3 TEES 5 5 20 L10 DDC SCL 1X zc 990 6 3 QP TP203 0 1uF Tk S D 21 e P18 L11 HPD1 lt HOTPLUGA GPIO19 Q TP204 R4020 ide FRC_VDD33_DDR 50mA P19 L12 5 re FRC LPLL 13mA FRC MPLL 4mA 255 9 CK _HDMI2 e RXCP IFAGC AGC MAIN VDD33 FRC LPLL FRC AVDD FRC_VDD33_DDR L13 e Y R4032 L14 CK HDMI2 Di RXCN RF_TAGC TP205 5 501 64065 R4033 0 a 0 022uF L206 L222 X12 L15 DO _HDMI2 _RXOP chan Ger Bon JaME SDA TU DEMOD I2C Trev BLM18PG121SN1D p a BLM18PG121SN1D p FRCVDDC 6 hd DO _HDMI2 _RXON TGPIOO UPGAIN gt DEMOD_SCL CE e 5 Ce 3 9 E2 U2 CHINA OPT R292 22 ES a E L17 D1 _HDMI2 RX1P TGPIO1 DNGAIN 53 e DEMOD l d Z e 11 M9 D1 _HDMI2 _RXIN TGPIO2 I2C CLK gt TU SCL D1P2 hd F3 T3 C40454 41uF L7 M10 D2 _HDMI2 _RX2P TGPIO3 I2C SDA TU SDA o SE o e zi D_NODIE D4 a 2 6261 27pF D M12 DDC SDA 2 DDCDB DA GPIO26 XTALIN hd ADC2P5 e bbc 551 DDCDB CK GPIO25 XTALOUT VDD ZA DME lt q aul e 5CL BE QS E MS 3 3V_Normal VDD33_DVI AVDD_DMPLL D2PS ADC l E Iz HPD2 CZ HOTPLUGB GPIO20 pu 27pF 4 A D2P5_ADC_
63. EB E AA lt lt B HZ A A TMCKB Ss DR3 MCLKZ DDR2 MCLKZ DDR3 MCLKZ DDR2 MCLKZ 57 B TMCKB B TMDOSL C 1 BMPSI 4 T2 10 E A MwEB R1231 A TMCKE DR3_CKE DDR2_DQ5 B_DDR3_CKE DDR2_DQ5 B TMCKE R1220 B MRESETB lt _ 1 TOK R1208 B TMDQSLB lt C A A NV B MDQSLB J9 A MDQSL 2 MAA gt A TMDOSL do gt A MRESETB 10 F3 Li R1209 AMONT c20 N25 x RI2ZIT B MDQSL lt DR3_ODT DDR2_ODT B_DDR3_ODT DDR2_ODT B TMODT B TMDQSU C A vy B MDQSU G3 L9 A MDOSLB 5 VM A TMDOSLB E A20 M26 B MDOSLB C 10 A TMRASB 550 DR3_RASZ DDR2_WEZ B_DDR3_RASZ DDR2_WEZ OA B TMRASB R1218 Eu gt A MDQSL R1211 A TMCASB uod 3 CASZ DDR2 BA1 B DDR3 CASZ DDR2 BAl 15 B TMCASB B TMDQSUB lt AAA lt __ B MDQSUB 7 A MDOSLB A MDOSU PV gt A IMDOSU A TMWEB DR3 WEZ DDR2 BAO B DDR3 WEZ DDR2 BAO B TMWEB 10 B MDOSU C ES xs AR1212 B MDQSUB C a R1212 C22 R25 gt a mposu gt A TMDQSUB A TMRESETB _DDR3_RESETB B_DDR3_RESETB B TMRESETB B TMDOL1 C B MDOQL1 T E B E z gt A MDQSUB anes B TMDQL3 lt B MDQL3 dum D3 E s B TMDMLC B MDML G6 gt A MDML A MDQL1 gt A TMDQL1 A TMDOSL sic 2 PPR3 DOSL DDR2_DOS0 B DOSL DDR2 DOSO B TMDOSL B IMDQU2 lt B MDQU2 E3 A MDMU A MDOL3 A TMDQL3 A TMDOSLB A 3 DOSLB DDR2 DQSBO B_DDR3_DQSLB DDR2_DQSBO B TMDQSLB 10 B MDQLO C ES J8 e a B MDQL1 lt A MDML gt A TMDML x
64. ENS iue NEC_SDA SCAN_BLK2 E bs EP R111 22 2 SCL NEG S E T b o 100 C FRC_PwM1 a OPT SDA R159 100 E132 22 I2C SDA C FRC_PWMO p OPT EY C106 SCAN BLK1 OPC OUT 1 AR eol 8pF 8pF qn es ERN IER ae AS ee Me ME MERE mi i i OPT OPT IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION SECRET LG ELECTRONICS ODEL THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC LGElectronics FLASH EEPROM GP HEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only 4 1 RSDS Power OPT 1 26V_VDDC 1 26V_VDDC 3 3V_Normal A
65. Electronics LULK HEET Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only 15V gt 3 6V 12V 15V 20V gt 3 5V A V eei de 24V 12V 15V 43 5V ST 3 5V ST 3 375V FROM LIPS amp POWER B D PANEL POWER i E 12V 3 58V uns 5 ST_3 5V gt 3 5V gt 3 375V S 100K a n oM e a TO S s E oe 00 Tee oma mo BAT Ad ort bed NCP803SN293 C438 C442 a 0436 0 148 10uF New item R402 OO EUR 16V T 16V am emm emm 4 l 100 NS 3 5V_ST OPT 04
66. FRC_VD33_2_1 hd R232 33 C2084140 047uF 4 23 a U5 C244 2 2uF 2 w20 FAR T15 DSUB_B BINOP 41 EC AU25 10mA AVDD25_PGA 13mA FRC VD33 2 2 e R233 68 C209 0 047uF J2 V5 C245 2 T16 DSUB B 4R ROI lt l y R234 0 C210g491000pF S 6 C246 2 2uF OPT o o VDDZRSDS U19 T17 l soemo 0 Pye eat s FRc_avpp_rsps_1 ar e u SCART1_RGB COMP1 9 e _5R FRC AVDD RSDS 2 e a te i V19 TFG SA S GA LE oIL re es a a ey ee ee eee ee ee ee FRC_AVDD_RSDS_3 SC1_ID HSYNC1 A HG UA w19 U11 SC1_FB VSYNC1 NE_OUT_OL gt BT_LOUT FRC_AVDD FRC_AVDD e R253 33 C211440 047uF K5 W3 c a 8 E U12 SC1_R COMP1_Pr RINIP NE OUT 2L gt SCART1_Lout ol FRC LPLL FRC_AVDD_LPLL 9 R254 68 C212440 047uF K4 casa WA vB 120 U13 501 R COMP1 Pr E 815 RINM NE OUT 3L 5 FRC_AVDD_MPLL hd 33 0 047uF Bl E U14 SC1_G COMP1_Y MT EE GINIP NE OUT 08 TP208 DDR3 1 5V ERC VEDAS HUE 9 SCT G07 COMP LYS e8 Sa GINIM NE_OUT_2R gt SCART1_Rout O a lt 114 E pee e R257 33 c215 0 047uF H4 m zn w5 t d U16 SC1_B COMP1_Pb PES E BINIP NE_OUT_3R TELUS E e R C216 uF J 2 AVDD_DDRO U17 SC1 B COMP1 Pb Cm RB ERA e AVDD_DDRO 55mA A AVDD_DDR1 55m
67. IPS_EJ2_NOR8 4 h5 MIPS as host EJ use PAD2 Byte mode NAND flash PCM D 6 AC20 d NC 7 NC 24 B51 Secure no scramble 4 hb 8051 as host Internal SPI flash secure boot no scramble PCM A 0 14 DIY AC21 PCM D6 2 ier C102 B51 Sesure scramble 4 hc 8051 as host Internal SPI flash secure boot with scarmble PCM D7 GPI036 UART3_RX 23 WIRELESS DL RX oon NC 8 NC 23 lO0uF L E WIRELESS ODI CIX for WIRELESS READY B 101 a e T 13 30 Normal PCM i GPIO37 UART3_TX 20 DL_ 0 1uF POOF vcc_2 PCM V21 PCM_AO GPIOS38 20 ET RXER Jeor ETHERNE PHY e PCM Al2 PCM A1 GPIO39 gt FRC RESET 3 3V Normal CI03 x22 20 58 1 2 PCM A2 GPIO40 SC1 COMP1_DET 0 1uF a o Je Jg Jg CM A 3 AA22 n G20 H N R105 NC_9 22 e Meg PCM A 4 R22 PCMAS GPio4l ERROR_OUT IK Qa PS T PCM ATS PCM A4 GPIO42 MODEL OPT 0 e ES x al R21 nds NC 10 NC 21 i AUD LRCH PCMLATO 223 5 ae Q I REMOTE PCM_A6 GPIO50 UART M REMOTE RX CLE NC 20 e lt AUD_SCK T24 4 F19 22 R149 PF_CE1 e AR102 PCM ATS Aa25 PCM A7 GPIO51 UART1_ ore gt M REMOTE TX Ho E a e ALE 1 03 AAT PCM A 3 e AUD MASTER CLK o ecu_as i A Om 4 PF_ALE E B WE PCM A9 GPIO6 PMO USB1_OCD 3 5V_ST WE 1 02 e PWM1 PCM A 10 ea a um R103 PF WEL PCM ATII 219 GPIO7 PM1 PM
68. O1GW3B2CN6E 7 AC17 TS0_CLK EAS CI TS SYNC 555 C SLO PF CEO 4 F CEOZ TSO_VLD PF_CE1 AB20 AA10 CI TS DATA 0 7 Cs UA PF CE1Z 50 SYNC PF OE 512MBIT 28 e Heel Pes a Bios 22 AB21 PRIORA AH CI TS DATA O 27 2 NC 28 AB19 BENE 50 0 f zca CI_TS_DATAT1 E ALE C 35d PF ALE rS0 D1 Y6 Cl_TS_DATAL2 NC_26 3 NC 27 PE_WP C PF_AD 15 50 D2 CI TS DATAT3 F RB 4 AA19 AA6 tS_ z NC 25 4 NC 26 22 F_RBZ 80 53 CI DATA 4 s ee 50 D4 1 07 5 1 07 E Aade oS Tue e Ss R134 22 M23 Sues pus CI TS DATA 6 S7 TXD UART TX2 GPIO65 50 D6 1 06 6 1 06 EIS 22 N23 2 EN EU CI TS DATA 7 S7 RXD UART RX2 GPIO64 50 D7 eae 1 05 RB 1 05 did erm PERS GUDCEER Internal demod out R136 22 M22 AC5 for SYSTEM HDCP I2C_SDA DDCR_DA GPIO71 S1 OLK FE TS SYNC External demod in 1 04 R 1 04 PE PROMSURSA3 R137 22 N22 AC6 E I2C SCLX CK GPIO72 S1 VLD anc FE TS DATA 0 7 NC 24 E NC 25 tom S NG Sees re R138 22 i5 RGB_DDC_SDA DDCA_DA UARTO_TX F 23 7 24 R139 22 BE DA E TS DATA O RGB DDC 5 DDCA_CK UARTO_RX NC 8 23 A E d rer FETZ DATATZ 2 VDD 1 VDD_2 ES K23 D2 faso FE_TS_DATAT3 lt FE PWMO G D3 XC FE TS DATA 4 VSS_2 VSS 1 VSS 2 PRIE c25 1 6 4
69. ON This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 5 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 6 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 7 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last 8 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging
70. OR THE CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC GElectronics IH Eri MODEL I LG ELELTRONILS BLOCK sevens cm tex SHEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only 51Pin LVDS Connector For FHD 60 120Hz PANEL VCC Right FFC Conn
71. OTEL OPT HOTEL OPT E R3406 0 SPK_R _HOTEL C 1 _ HOTEL_OPT R3405 0 SPK_R _HOTEL C 1 zv sl CLOSE TO THE EARPHONE IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION Up udo M A T RM SECRET Lg ELECTRONICS MODEL DATE THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes BLOCK cessor SHEET LGE Internal Use Only amp gt PIF_SPI_CS R6001 0 5 CHB CVBS IN THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics MODEL cp2_saturn7 DATE LG ELECTRONICS BLOCK son css SHEET ss 7 Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only LG Electronics Inc
72. P R612 150K DPM A EN2 42 FHD 60 LAMP A ke i e e e e iub T Change 1000hm gt 100hm R613 ew aD nm mm e 1 Slave Address OxESh A a d SU Sks 5 i o 9 f VDD_LCM 16V i OGC VCC_LCM l 3 3V E 1uF 50V 2012 R618 A pn e 10 1 8W R628 T6604 3 3K uF 50V i GIP R659 R667 R604 0 0 i RXA3 e gt FLK RXD3 gt GSP GVST I GCLK2 e gt GCLK2 I 10 NON GIP GIP LCM E ME E B pus 3 3V GMA6 SETY 5 15 O gt GMA13 BVDD ite 15pF 15pF THERMAL eee 6 8uH 1 8A A 50V TU sov R685 21 gt GMA12 6x6x2mm i NON GIP 0 NON GIP OPT DVDD IC601 GMA4 RXD3 man Es gt GMA NON_GIP C601 MAX9668ETP i MINI LVDS la R663 J AGND_AMP GMA3 GSP_R 0 1uF MINI LVDS 5 GMA6 ye 9 9 9 i GCLK4 e C gt GCLK4_I 50V
73. R a 4 1502 Sov e e z C508 PVDD2A 2 1s vv iE a 6504 1000pF EAN60969601 C532 a L501 50V DGND_PLL PVDD2A_1 S QURE E LOUPE 50 c539 R530 Toy 213 a 50V R508 AGND_PLL 10 PVDD2B_2 D504 15uH C543 OPT 1N4148W 0 0luF Bi E 3 3K L 11 7000 PVDD2B_1 or dm nos ee 4 7K IU d AVDD PLL OUT2B 2 9 9 e gt SPK R e e 12 9 e m 2B 1 CUN DVDD PLL 43 OUT2B_ 24V um ia e GND 1 PGND2B 2 A C501 C502 OPT 0 1uF TT 5993 0505 V uF 16V 0 1uF 10V lev ajal elx 1 ole e xS 4 8 SS SISSE 8 1 8V_AMP A mm AER i ajaja C528 al za 8 526 527 Lm F 0 1uF 0 1uF 35V 50V 50V OPT Em s a 10uF C513 e I 25V C524 Q0 1uF 10V TS mE 22000pF 50V R503 100 AUD_LRCH e R504 100 R513 AUD LRCK e 0 R505 100 e e POWER DET AUD SCK e R506 33 0316 OPT AMP_SDA 1000pF R507 33 5 861 3 5V_ST p C507 C546 C544 C545 B 18pF 18pF ZZ22pF ZIZ22prF ZZ22prF 9 50V 50V 50V 50V 50V GERE WAFER ANGLE OPT OPT OPT E R514 100 e e 2 10K C R536 A E R517 SPK_L B om 0501 AMP MUTE 28C3052 10K R537 0 E SPK_L 9 R538 SPK R4 R539 e SPK R i SPK SLIM SMAW250 04 P502 SPK NORMAL TH
74. RAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics MODEL 952 55 27 DATE LG ELECTRONICS BLOCK erserwer IBHEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only NON Motion Remocon Region 1025018 gt m nzvors 10250289 3 m 7x 102503 lt _RF_RESET 10250489 3 RF ENABLE 1 l l l I l l I l i l l L IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET L6 ELECTRONICS BLOCK SHEET MODEL sP2 saturn7 DATE Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only China HOTEL Option Chinese Hotel Option P3401 12505WS 09A00 HOTEL OPT R3404 o c3401 TO 1uF HOTEL_OPT HOTEL_OPT AMP_RESET_N R3 409 0 R3402 10K HOTEL OPT e MUTE HOTEL 6193401 T1C3904 T112 R3401 200 B TEL OPT MUTE HOTEL c a H
75. RS W 3 E n amp ireless S7_TXD1 0 1uF S7 TXIX e R2615 m EET WIRELESS SW CTRL SELECT PIN STATUS WIRELESS WIRELESS RX HIGH X1 Y1 2Z1 WIRELESS Dongle connect WIRELESS RS232 7 RXD A LOW XO YO Z0 WIRELESS Dongle Dis con S7 RS232 Y H o O Oo tO N pE R2620 e WIRELESS 7 Se WIRELESS_SW_CTRL Oo SI oO Mo N x Ver 1 2 gt 1 5 wireless opt change 090818 Iongsu IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET e G ELECTRONICS MUDEL DATE ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR IHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only BLOCK SHEET 1 5V DDR S a 1 5 DDR 1 5V DDR VCC 1 5V DDR
76. RXD0 RXA1 RXDO 16V 50V 3 3V Normal 25 p MINI LVDS LVDS A 26 10uF 25V 3216 HVDD C707 RXAO 27 RXC3 RXA1 5 qe s R712 VDD_LCM us 3 3K 28 RXC3 RXA14 TOAT 50V RXA2 I RCA RXAO 23 RXC2 BERE RXAO MING LVDS LVn SEL HIGH 30 c712 INI LVDS RXA2 p lt RXC4 e RXC2 RXAO E 31 101 25 3216 T R124 0 R711 oo RXB4 16V RXA1 m RXC3 OHC EN 10K 32 RXC1 RXB4 T Se AS 10uF C702 0 1uF LVOS_SEL_LOW VCC LCM RXA1 p lt RXC3 33 RXCO 16V lOuF soy RXB3 34 MINI LVDS MINI LVDS RXCO RXB3 RXAO 9 ee 35 MINI_LVDS sa PANEL_VCC e 8 cre C708 rxao BIT SEL C_J RXCCK e A e RXB2 0 1uF 0 01uF ied 37 RXB1 16V 50V C 38 MA INI LVDS INI LVDS 120 ohm R709 e WAFER HD 39 e RXBO 10K 40 RXBO ie RXB4 BIT loy LOW I RXC2 8 8 VCC_LCM 42 VER A RXB4 I RXC2 SOE qon s 5V VGL I A l POL RXB3 i rxc1 84 VCOML GSP GVST I R703 5 RXB3 p lt RXC1 45 gt VCOMLFB H_CONV 3 3K 4e MINI LVDS zr 47 VST NON_GIP R745 0 e z 48 8122 0 GIP URTA RXCOY 439 GH_EVHN VDD_EVE GMA16 RXBCK 50 VDD_ODD GMA15 51 VGI P GMA13 52 VGI N GMA12 RXB2 53 CLK6 GMA10 a VCC LCM RXB2 CLK5 A GMA9 z 55 CLK4 GMA7 RXB1 56 CLK3 GMA6 55 ETOI noe RXB1 PANEL_VCC P Tchk2 aes GMA4 58 CLK1 3 3K GMA3 RXBO L703 59 GMA1 120 ohm RXBO
77. SS READY MODEL JK2601 KJA PH 3 0168 LI e ess p OwWe I From wireless I2C to micom I2C VCC 24V 20V 17V 1 OPT VCC 24V 20V 17V 2 S EDS 13 3V Normal 10K VCC 24V 20V 17V 3 WIRELESS PWR EN 9 VCC 24V 20V 17V 4 e e OPT 2 oa VCC 24V 20V 17V _5 gt 24V e 2 VCC 24V 20V 17V 6 SET 2 e 3 3V Normal DETECT iz m Od R2604 cet ide BOE INTERRUPT Sx 5 2 2uF TP2601 ao 50V r e p S R2612 GND_ 2 e 10K lt G RESET e TP2602 R2605 02602 R2617 1K GNU ZTK D WIRELESS WIRELESS_DETECT lt e A03407A RAS e cba WIRELESS 6 I2CSCL dorem c WIRELESS SCL AMP_SDA lt e e WIRELESS SDA WIRELESS PWR EN B 1 4W I2C SDA 3216 WIRELESS SDA 02604 WIRELESS 92601 GND 3 FDV301N WIRELESS M 2603 e Qs UART RX o WIRELESS RX lt __ OPT UART TX e WIRELESS TX 4 AMP_SCL lt WIRELESS_SCL GND_4 a 9 e IR FDV301N IR_PASS GND_5 WIRELESS GND_6 R2611 0 R2613 9 WIRELESS 3 5V_ST 3 3V_Normal e obe OPT R2618 0 R2606 R2608 E 0 0 WIRELESS IC2601 R2601 9 MC14053BDR2G WIRELESS DL RX lt Y1 Pere S n
78. TIC e LG ELELTRUNILA ISLEIEK GHEE MODEL se2_saturn7 DATE Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only For EU amp CHINA Full cob Compl 3 3V Normal PPJ 230 01 JK1601 OPTION NAME AV_OPT CHINA_OPT EU_OPT TH Eri Composite SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR CRITICAL COMPONENTS IN THE N IHE I Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service pur
79. VDD DDR ERC MVREF sim s SC1_CVBS_IN un Caan ln E o9 S e R246 33 Cc227440 047uF L4 E21 Os aic TMS N oe H17 W10 e AV_CVBS_IN ET_RX gt EPHY RXDO e a mus du e 5 R4016 33 C4059 40 047uF L5 E22 R278 ETHERNET 33 m W11 SIDEAV_CVBS_IN ET TX EPHY TXDO e e 9 s R248 33 Cc2294140 047uF L6 z E di F W12 N CHB_CVBS_IN amp R249 33 c23041 0 047uF 4 D21 m m AAS pe ES dee 3 AVDB DDR FRC ABI W13 T amp AV CVBS IN2 RXD1 gt EPHY RXD1 trj E LS LS CS LS J a 3 lt q FRC_AVDD_DDR_D_1 9 R250 33 Cc231440 047uF 5 a F21 p280 ETHERNET 33 lt SoS Se XM AB12 z W16 TXD1 PHY TXD o e 5 d C203 R251 33 c232040 047uF 7 u H EIS oo S oloolooloo eS zsc o FRC AVDD DDR D 2 GND Wig 9 1000 b D EN o N FRC_AVDD_DDR_D_3 GND 9 gt ET REFCLK gt EPHY_REFCLK BI lt FRC_AVDD_DDR_D_4 GND e 9 BS OUT1 A EOS EPHY S i Bu 9 7 dm F22 p2g3 ETHERNET 33 0 o EIL LI ea es PRC_AVDD_DDR_C SNP 18 DIV MNT_VOUT Be MDE EPHY MDC e D23 R284 ETHERNET 33 B 0 i GND ANTS fm MDIO H R252 68 C233 40 047uF 5 F23 R285 ETHERNET 33 D DS Power OPT GND ABIS Ad VCOMO CRS gt EPHY_CRS_DV a 1 26V_
80. VDDC E 5 a AC13 GND Close to MSTAR A MIUOVEDS 1 26V_VDDC FRCVDDC MV REE G15 s F8 AVLINK P206 OPT L228 A en Betis X 7 BLM18SG700TN1D oi oe e IRINT e BLM18SG TN1D TESTPIN E fu a AA MIU1LVDDC i i i Y8 BLM18SG121TN1D e na Sone INZ RESET 777 SOC_RESET 3 7 4 PGA_VCOM Toye IP211 US enr OPT 3 3V Normal L226 o E e R205 A BLM18SG700TNID a T x 5 T FRC o x 5 a o e o Ns 22 10K 9 o S E lt o FRC RESET 5 s and 3 R4018 wes 0 A d M o o o E 5 T FRC m IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES L SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION SECRET Lc ELECTRONICS THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics I OLK HEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only IC301 1 H5TO1G63BFR H9C E VCC1 5V U3 DDR
81. Y MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics MODEL LG ELECTRONICS BLDEK common area GHEE gt Z Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF 15 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR IHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC Copyright O 2010 LG Electronics Inc All rights reserved Only for training and service purposes RSZaAs2 db 3 5V_ST ceca Reece E1102 0 1uF C1103 0 1uF C1104 IC1101 MAX3232CDR Dite IR our C R1122 0 R1123 100 R1124 100 D1107 D1108 CDS3C30GTH CDS3C30GTH 30V 30V 0 1uF C1105 0 1uF EAN41348201 3 5V_ST R1109 4 7K OPT R1114 4 7K OPT SPG09 DB 009 JK1101 R1157 0 gt S7 RXD1 R1156 9 gt NEC RXD e R1154 s7 TXD1 R1153 9 L_ gt NEC TXD SECRET LGElectronics MODEL BLOCK sss SHEET LG ELECTRONICS LGE Internal Use Only SIDE_AV New Item Developmen H 9 2mm SIDE_AV_OPT L3303 BLM18PG12
82. anual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Do not spray chemicals on or near this receiver or any of its assemblies 4 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 90 96 99 96 strength CAUTI
83. ces Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead 3 Keep the soldering iron tip clean and well tinned 4 Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25 cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F b Heat the component lead until the solder melts c Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuit board printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts c Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder fl
84. cs Inc All rights reserved Only for training and service purposes LGE Internal Use Only I BLOCK wzcow SHEET CONTROL IR amp LED 3 5V_ST A EYEQ TOUCH_KEY R NEC_EEPROM_SCL P2401 2411 100 e uda R2405 12507WR 12L 10K 10K C2408 5 6B 1 1 1000 2403 50V L240 OPT R2401 BLM18PG121SN1D 100 xd ue KEY1 lt e CE EYEQ TOUCH KEY R2402 L2402 100 AA BLM18PG121SNI1D Deto NEC_EEPROM_SDA aot R2412 5 6B KEY2 C2409 I ae AMOTECH D2404 C2401 C2402 1000pF 0 1uF 0 1uF 50V D2401 a OPT 5 6V z X AMOTECH 3 5V_ST A 3 5V_ST L2403 BLM18PG121SN1D 3 5V_ST 47K R2430 SC 10K iu e R2426 E 16v 2903052 3 3K R2431 OPT R2410 47K 100 02405 R2425 CS 8 47K R2428 22 3 5V_ST R2413 1 5K c e R2429 us 8 LED B LG LOGO T 28C3052 cD o enm o em o CD a LS 3 3V Normal 3 5V ST 50V COMMERCIAL A L2404 BLM18PG121SN1D R2427 3 5 ST SER e A7K A OPT R2403 Commercial_EU Re IR OUT lt AA 9 9 2405 c2406 Z SVRF 1 5K Commercial 47K Ogee 1000pF OPT 16 50v R2416 10K R2407Commercial Q2401 10K 28C3052 hd Commercial EU R2409 Commercial EU 47K Q2402 Commercial 29063052 Commercial
85. cubes R2422 0 Commercial_US Zener Diode is p 7 close to wafer WIRELESS Pav sor A 3 5V_ST 47K R2417 WIRELESS 22 IR_PASS lt e R2419 WIRELESS 47K R2418 WIRELESS Q2404 Q 10K 25653052 e WIRELESS WIRELESS R2421 47K 02403 WIRELESS 28C3052 WIRELESS a CED o ap ED D em GP GDP GD Gp SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics MODEL 16 ELECTRONICS BLOCK Ds eee SHEET De 7 Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only
86. e ee ee ere re ve ee gt o rer ro rere 2 HD HDMI EDID data o r aej a 4 s eo v e o A B C D E F ojrr rr rr rr rr FF o eje o oO U 01 03 80 73 41 78 oa CF 74 A3 57 4C BO 23 A1 os 00 81 CO 61 40 45 40 31 40 0 01 01 o1 01 66 21 50 BO 51 00 18 30 40 70 7E 8A 42 00 00 1E o1 1D 00 72 51 Do 1E 20 55 00 7E 8A 42 00 00 1E 00 00 OO FD 00 3A F 46 10 00 oa 20 20 20 20 20 20 0 Cin for f 1s for sofo s 0 re 16 ve 20 se 20 25 vo 7e ea a2 00 rao ae or 10 oo so st po ac eo 40 so as oo 7e F F F F F F F F Edid data and Model option download RS232 Download A A When transfer the Mode In Mode In Carry the command 6E 3E Download A E 10 Automatically Download The use of a internal pattern NIO UJO NIN O gt My 5 Manual Download OJAN gt 1E ec 0A Do 8A 20 Eo 2D 10 10 3E 96 00 Caution 7E 8A 42 00 00 18 o2 sa 80 18 71 38 2D 40 58 20 1 Use the proper signal cable for EDID Download EO 7E 8A 42 00 00 1E 01 1D 80 DO 72 1C 16 20 Analog EDID Pin3 exists Fo 10 2c 25 8o 7E 8a 42 00 oo 9 oo 00 00 00
87. ector A LEFT FFC Connector l 41Pin LVDS Connector 30Pin LVDS Connector i i n n m f nj gt 2 60Pin Mini LVDS En For FHD 120Hz For HD 60Hz Normal WAFER FHD P701 P702 4 9 4 3 P703 P704 P705 104060 6017 104060 6017 A Gel Alia IF05 51S e ITF05 41S FF10001 30 MINI LVDS MINI LVDS WAFER FHD WAFER FHD 120HZ WAFER_HD C700 C709 C710 10uF 1000p 0 l1uF 31 16 50V 16V n m OPT WAFER FHBAFER FHD 2c Dax 2 pee R754AAQMINI LVDS VGH M 3 8 25V R716 GMA3 e CLK1 A WAFER_HD 4 rs GMA4 4 e CLK2 I RXD4 R71 2 PWM DIM 5 G 5 GMA6 e CLK3 NON GIP e R767 0 GSC GCLK3_I I CL RXD44 R714 9 OUT R768 Q GOE GCLK1 I QE 7 pL GMA9 7 e CLK5 z C IRXD3 e slc 8 GMA10 e CLK6 NON GIP R769 0 olc VCC_LCM 9 P d VGL m RXD3 RXA3 GMA12 N R770 9 NON_GIP 5V 0 rs GMA13 0 e VGI P A RXA34 VGL I 1 rs GMA15 t e VDD ODD c RXDCK e E ate GMA16 i 9 VDD EVEN EET 9 NON GIP T GMA18 5 e RIES 712 Q NON GIP RxDcK RXACK 3 3 4 VST 5 lopr MINI LVDS 5 RXACK 6 H_CONV 6 gt VCOMRFB RXA4 I RXD2 9 7 GSP GVST I 7 VCOMR RaR ates ne 3 8 POL VCC LCM 8 3 SOE RXA3 I C RXD1 RXA2 20 e 21 RXA3 lt _ RXD1 e RXD1 e e 22 RXD1 e m RXD0 RXA1 2 Aud C701 C703 LVDS SEL 21 1LUF 0 01uF VDD_LCM RXACK I 1
88. ed component and adjacent components and the circuit board to prevent excessive component temperatures Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This techn
89. ed during the servicing of a receiver whose chassis is not isolated from the AC power line Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks It will also protect the receiver and it s components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation If any fuse or Fusible Resistor in this TV receiver is blown replace it with the specified When replacing a high wattage resistor Oxide Metal Film Resistor over 1 W keep the resistor 10 mm away from PCB Keep wires away from high voltage or high temperature parts Before returning the receiver to the customer always perform an AC leakage current check on the exposed metallic parts of the cabinet such as antennas terminals etc to be sure the set is safe to operate without damage of electrical shock Leakage Current Cold Check Antenna Cold Check With the instrument AC plug removed from AC source connect an electrical jumper across the two AC plug prongs Place the AC switch in the on position connect one lead of ohm meter to the AC plug prongs tied together and touch other ohm meter lead in turn to each exposed metallic parts such as antenna terminals phone jacks etc If the exposed metallic part has a return path to the chassis the measured resistance should be between 1 MQ and 5 2 MQ When the exposed metal ha
90. followed each drawing and specification by part number in accordance with BOM 5 The receiver must be operated for about 5 minutes prior to the adjustment I Module General Specification o Storage Environment Temp 20 deg 60 deg Humidity 10 96 90 NEN Power Consumption Power on Blue LCD Module Backlight LED nm fe Becki ELE 1 06 Billion FHD LGD 16 7 M others NEN NO ES EE E Copyright 2010 LG Electronics Inc All rights reserved 6 LGE Internal Use Only Only for training and service purposes 5 Module optical specification e e e TI itia o CIE Color Coordinates Blue 0 03 0 03 By White 1 Standard Test Condition The unit has been ON 2 Stable for approximately 30 minutes in a dark environment at 25 C x 2 C 3 The values specified are at approximate distance 50 cm from the LCD surface 4 Ta 25 C x 2 C VLCD 5 0 V fV 60 Hz Dclk 74 25 MHz EXTVan 8 100 96 6 Component Video Input Y CB PB CR PR TN Specification Resolution H freq kHz V freq Hz 1 vowm i oo l owowa 2 ree ise 4m T 67 5 60 HDTV 1080p Copyright 2010 LG Electronics Inc All rights reserved T7 LGE Internal Use Only Only for training and service purposes 7 RGB PC 31 469 e 94 25 17 VESA Inp
91. ghts reserved Only for training and service purposes LGE Internal Use Only 3 3V Normal 3 3V Normal A A S FLASH IC1401 MX25L8005M21 15G R1404 3 3V Normal A C1401 SPI_CS 0 1uF R1403 10K ip SPI SDO R1402 0 FLASH WP e C R1401 RIS SPI SCK SPI SDI KRC103S opt 0 IHE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics MODEL LG ELECTRONICS BLOCK 5 722555 ams GHEET Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes LGE Internal Use Only LGIT CAN NIM H N TUNER for EU amp CHINA N BOOSTER CHINA OPT 5V_TU A RF SWITCH CTL Tn T CHINA OPT M18PG121SN1D e Pull up can t be applied because of MODEL OPT 2 ar R3734 CHINA_OPT 0 R3743 close to TUNER 10K 03701 0 lc CHINA OPT OPT E ISA1530AC1 R3737 R3762 0 2 SOK l CONTROL ATTEN 9 J CHINA OPT C CHINA OPT dE 03702 B FE BOOSTER CTL 28C
92. ique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges 5 LGE Internal Use Only SPECIFICATION NOTE Specifications and others are subject to change without notice for improvement 1 Application range 3 Test method This specification is applied to the LED LCD TV used LDO1A 1 Performance LGE TV test method followed chassis 2 Demanded other specification Safety CE IEC specification 2 Requirement for Test SEMEN Each part is tested as below without special appointment 1 Temperature 25 C x 5b C 77 F 9 F CST 40 C x 5 C 2 Relative Humidity 65 96 x 10 96 3 Power Voltage Standard input voltage AC 100 240 V 50 60 Hz Standard Voltage of each products is marked by models 4 Specification and performance of each parts are
93. l data is cleared you didn t have a DTV ATV test on production line 3 1 ADC Process 1 ADC Enter Service Mode by pushing ADJ key Enter Internal ADC mode by pushing y key at 5 ADC Calibration ADC Comp 480i ADC Comp 1080p ADC RGB Se 4 MO lt Caution gt Using power on button of the Adjustment R C power on TV ADC Calibration Protocol RS232 Adjust Mode In A A When transfer the Mode In Carry the command ADC Adjust A 1 Automatically adjustment The use of a internal pattern Adjust Sequence aa 00 00 Enter Adjust Mode 00 40 Componenti Input 4801 ad 00 10 Adjust 480i Comp1 e xb 00 60 RGB Input 1024 768 ad 00 10 Adjust 1024 768 RGB aa 00 90 End Adjust mode Required equipment Adjustment R C 3 2 Function Check After downloading have to adjust Tool Option again 1 Push IN START key in service remote controller 2 Select Tool Option 1 and Push OK button 3 Punch in the number Each model hax their number Module Tool option1 Tool option2 Tool option3 Tool option4 Tool optin5 12961 189188 53284 26893 12969 18988 53284 26888 4 Completed selecting Tool option Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes Check display and sound Check Input and Signal items cf work instructions 1 TV RGB PC
94. lias FE TS DATA 5 PWM2 EE NC 22 NC 9 NC 22 prm eas P5 1c FE_TS_DATAT6 SC RE2 c21 PWM3 6 D r3 FE TS DATA 7 21 10 21 TO SCARTI SC RE1 C Baars 7 NC 20 20 6 D12 1 03 AL 1 03 DSUB DETL sc SARO G MPIF_CLK 1 02 W I 02 MODEL OPT 3 SAR1 G MPIF CS N gt PIF SPI CS PCM 5 SAR2 G A d CS E I O WP 1 0 RST PHYX ac SAR3 G MPIF BUSY 1 00 NC 11 1 00 RST HUBC SAR4 G E12 MPIF DO 9 12 9 E F12 NC_ NC_ NC_ ueir pi 5 18 NC 13 NC 18 MPIF D2 MPIF_D3 NC_17 NC_14 NC_17 NC_16 NC_15 NC_16 S7T DIVX 57 DIVX URSA deg UART_FRC_RX Cu FRC_SCL FRC_SDA UART_FRC_TX Tet 3 3 N 1 3 a ee ee eee i um ORE i a n DIMMING EEPROM t3 3V Normal e e e HDCP EEPROM 3 3V Normal A A Addr 10101 5 OM wx TI ST ST TM sro ST ON SION S7 NON DIVX S7T NON DIVX S7M NON DIVX MX MX mo 0i m AS rS R156 10K cios ENS Mad ae A DIM hd O 1uF IC103 IC104 R157 100 PWM2 CAT24WCO8W T C107 M24MO1 HRMNO6TP PWM_DIM lt e R113 0 1uF SDA AO MB SCT R155 e 111 7 Al WP R127 4 7K I2C_SDA 2 2uF OPT 2C_SCL WP lt _ 12 SCL A2 SCL 22 R128 LD650 Scan
95. mA A CHINA CHINA OPT R3748 R3764 CHINA OPT R3724 9g e e tow gt FE_TS_DATA 0 7 gt FE_TS_SYNC eal 1 pcd m CHINA OPT R3730 2598 CHINA OPT 0 e e FE TS VAL ERR c3717 1 Q TUE uas B CHINA OPT R3731 g d 5 C3729 63730 gt FE TS CLK alles DEMOD_RESET O adn JS R3747 lev our CHINA_OPT R3725 0 9 1K 10v This was being applied to the only china demod E TS DATA O Ex 5 TET so this has to be deleted in both main and ISDB sheet FE TS 1 e CHINA OPT R3728 0 FE TS DATA 3 CHINA OPT R3726 0 FE TS 4 CHINA OPT R3721 0 FE TS DATA 5 Normal 3 3Y_Normal 3 3V_TU FE TS DATA 6 200m L3702 L3703 BLM18PG121SN1D 60mA BLM18PG121SN1D INA OPT R3722 0 C C H HINA OPT R3723 6 FE TS 7 J t TE e AA e C3719 C3722 C3724 C3726 mM C227 FE TS DATA 2 Vo 0 8 1 R1 R2 CHINA_OPT R3729 0 22uF 22uF luF luF 0 1uF luF 16V 22uF 10V 10V 16V Lov 16 16 Close to the CI Slot SHIELD SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED F
96. others check the back light on Auto adjustment Map RS 232C RS 232C COMMAND CMD ID DATA Wb 00 White Balance Start Wb 00 White Balance End RS 232C COMMAND MIN CENTER emo omun Gre Wi Wam Gro Me Warm x M 0 we wr wr jg Gcan m ie 00 e toe Bae i x oie oe ve mo M 9 Sc e ea oe ecu 9 Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes sii Caution Color Temperature COOL Medium Warm One of R Gain G Gain B Gain should be kept on OxCO and adjust other two lower than CO when R G B Gain are all CO it is the FULL Dynamic Range of Module Manual W B process using adjusts Remote control After enter Service Mode by pushing ADU key Enter White Balance by pushing gt key at 6 White Balance After done all adjustments Press In start button and compare Tool option and Area option value with its BOM if it is correcty same then unplug the AC cable If it is not same then correct it same with BOM and unplug AC cable For correct it to the model s module from factory JIG model Push the IN STOP key after completing the function inspection And Mechanical Power Switch must be set 4 2 DDC EDID Write RGB 128Byte Connect D sub Signal Cable to D sub Jack e Write EDID Data to EEPROM 24C02 by using DDC2B protocol Check
97. ows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush LGE Internal Use Only IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Hemoval 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board
98. poses WHEN SERVICING IF I SYMBOL MARK OF THE SCHEMETIC SECRET GElectronics gt AV CVBS IN ng i C1643 C1648 oe R1654 47pF 220pF e SC1 COMP1_DET 75 SOY 30V 3 3 Normal R1614 OPT D1611 SOS 1K N CASE OF SMALL 15V T 5 6V 0 1uF EU opr 12V 15V D L1606 R1660 DET Dev EU OPT A JK1604 Tak 4210 mm E i EU_OPT PPJ233 01 B 5 1 SOG IN EU OPT EU OPT z AV CVBS DET EU OPT EU OT EU OP C1625 uWDigcrUe R1666 PUSOPBT ISA1530AC1 ae IR 1611 01601 SED 0 TUF yu hg D1624 B e 9 50V 50V e C1646 un i e 5 1 CVBS IN B RD O SPRING 0 1uF 16 EU OPT EU OPT EU_OPT EU_OPT C1608 Q1602 e R1641 je coe T2220pr EU OBT 2553052 7 EU OPT RD CONTACT L AV_DET 50V ku zr a C1621 1685 B 47uF R COM_GND Dred 9 WH C LUG 4 R16 7 9 e DTV MNT VOUT AL av_R_IN E 7 L1609 SYNC IN EU ORT EU OPT th CONTRAST 1611 01659 120 ohm C1663 o R R D1625 330pF ES SYNC OUT 390 Sieg ee pean EVEN 4 OPT A is i EU OPT H OP 50V EU_OPT EU_OPT R1642 FUR DA D1610 Rie28 RIS R1639 15K ces a SYNC_GND1 ds i 100uF Gain 1 R Rg i9 E 30V OPT 16 T T L1610 RGB IO OPT 120 ohm pees EU_OPT SC1_FB ain AV IN OUT R1627 9 scl_R COMP1_Pr EUZOPT 22 c1662 Ly RGB_GND 30V R1608 75 D1626 R1672 C1658 330pF Y T5 10pF z 5 6V 470K OPT pe 5
99. s no return path to the chassis the reading must be infinite An other abnormality exists that must be corrected before the receiver is returned to the customer Copyright 2010 LG Electronics Inc All rights reserved Only for training and service purposes Leakage Current Hot Check See below Figure Plug the AC cord directly into the AC outlet Do not use a line Isolation Transformer during this check Connect 1 5 K 10 watt resistor in parallel with a 0 15 uF capacitor between a known good earth ground Water Pipe Conduit etc and the exposed metallic parts Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms volt or more sensitivity Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part Any voltage measured must not exceed 0 75 volt RMS which is corresponds to 0 5 mA In case any measurement is out of the limits specified there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer Leakage Current Hot Check circuit AC Volt meter Good Earth Ground such as WATER PIPE To Instrument s CONDUIT etc exposed METALLIC PARTS 1 5 Kohm 10W When 25A is impressed between Earth and 2nd Ground for 1 second Resistance must be less than 0 1 Q Base on Adjustment standard LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service m
100. turning it on 3 Show the message Copying files from memory gt If you push Power on key TV set will recover channel information by itself After function inspection Push In stop key f Erase Area f Partial Erase 3 Main PCB check process APC After Manual Insult executing APC Boot file Download 1 Execute ISP program Mstar ISP Utility and then click Config tab MStar ISP Utiiny va 1 5 Device Load Read o Read filexxx bin Checksum Unused Bytes Start Addr ox0o0000 0x00 C OxFF End Addr axi FFFFF Batch File Elapsed Time mile USB 450KHz 2 Set as below and then click Auto Detect and check OK message If Error is displayed Check connection between computer jig and set 3 Click Read tab and then load download file XXXX bin by clicking Read 4 Click Connect tab If Can t is displayed check connection between computer jig and set Copyright 2010 LG Electronics Inc All rights reserved 9 LGE Internal Use Only Only for training and service purposes 4 Updating is staring 5 Uploading completed The TV will restart automatically 6 If your TV is turned on check your updated version and Tool option explain the Tool option next stage If downloading version is more high than your TV have TV can lost all channel data In this case you have to channel recover if all channe
101. ut 848 480 60 852 480 60 Hz amp 745 8 HDMI Input 1 DTV Mode Veg Piel dock vi 1 veers simis 59 0460 zroyros SDVANP 2 mows ss s SbVse Jo TA mwr 4 isoro 9645 59 0060 TANTTAPS HOWTRP s temo 997297 sosa10 atras howie e 25 5 soo ras mwi S 7 1eavwwo 2977 zara TANTTAGS howie e 19201000 397165375 29 076 6000 7428 horvir e seno fso Mes mwi 10 1ezvi8o 67 49 6758 59 8460 M899 4550 HOIVIMOP 2 PC Mode Lime se mm me o So a i m 6 1360768 4772 598 84755 HDCP O 8 14001050 64744 59948 101 00 WSXGA Not used Moniter Panel 9 16801050 6516 5994 14700 WSXGA Notused Moniter Panel Dx isos ess sos esa scores Copyright 2010 LG Electronics Inc All rights reserved 8 LGE Internal Use Only Only for training and service purposes ADJUSTMENT INSTRUCTION 1 Application Range IE This specification sheet is applied to all of the LED LCD TV FISK Iv Use USB with LDO1A chassis bem eue eee E s Base Addr o BC PIN PINi0 7i Auto Detect SPI Sewing A capaci MA m T USE SPI 3 2 Designation RT STI 1 The adjustment is according to the order which is Elapsed Time iac use sens Flash Situs Q
102. wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test Copyright 2010 LG Electronics Inc All rights reserved A Only for training and service purposes 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devi

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