LCD TV SERVICE MANUAL
Contents
1. 3 322135 22522 2 25 kssSEZICRSESECRE 40 42 NOD up p wp EFFEEF REDENN ecocoooooooooocce 8 85 POS T oo Doro pap rec 8 8 1 COD CREE a in 84042 B dem am ra mon bor oo Pern C e e CHP OT Oooo L4 CHER CHO 974 aa 5 5872258 2 252278 552524255252228 5 25 3522 4255 58 5 1858144578 E 255333 221238 0888 ooo 4 HO Seer eos _ __ ees 7 HD EDID Data CS 7AB5 3 FHD HDM2 EDID Data CS D739 B m L rara D ad B ra IST i duda c mw miO O TA 78 ped oP 5 35 312125422532 5 8 O ee i 14 Cs2. 2 8 i 2 THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET MODEL DATE ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR LG ELECTRONICS M THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics GHEET 5 N 5 4 Zla DDR3 1 5V By Place these Caps near Memory z DE z xo bes 4 e e e 5 fee 5 Ja H m i Ei VT EST OR T J TE 5 5 5 5 m Close to DDR Power Pin Close to DDR Power Pin saturam te _________________________ to satumam 1 5V_DDR 11201 R1215 1225 R1213 Sour ETE 10 2 2 I R1214 1202 A MA2 TMA2 11 MALL H5TO1G63BF
3. p noc wp p ap a aspas ecocoocoooooooooscocc SHENI Gears 1 1 2 1 451 1 1 1 12173 1172 1 1 B suwSSSEBRCSREROMS 6 9 an D L in 84242 B d esas a d bor S ra oo wll HPO r r z nen Cr P Ci CD Ti SRSAHSRRZISRESISS 4 a ma Fr h Ge 0 S E 3 52222220223805 m Seer 8 ASCII Code 4 HD RGB EDID Data CS 93 SRSRRASETEEEEEEEE SESSUSSSEEEEEEEE B EwSSEPESREEEEEEEE E B d 5 44444444 ERZZZZZSEEEEEEEE 4 ESZZCEEZEEEEEEEE Ez3s2225EEEEEEEE 8 EsUZEZSCEEEEEEEE s EZSSERSSZEEEEEEEE is Bs Da a i Da a e 2 43 45 42 45 425 425 LGE Internal Use Only 213 Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes 4 6 V COM Adjust Only LGD M S Module Why need Vcom adjustment A The Vcom Common Voltage is a Referenc
4. pes DQL3 DDR2 002 aio RXD1 I DDR3 2 004 DIM LLV7N RXD1 I FRC_CONF0 5 512 pors ppa2 220 Rxp2 snm dis I C MDQS C TMDQLG DDR3 DQL6 DDR2 D2M LLV8N RXD2 LOW ADR c wpos PRC AF19 C TMDQL7 C DDR3 DQL7 DDR2 005 D3P TCON3 RXD3 I 7 2 CONF1 FRC PWMO posu 57 C MDQSU 7 C TMDQL7 AE18 ara tf 1 SRAM 505 n C TMDQUO 00 2 boot from internal SRAM N i 2 arie e 3 d6 ot from BEPROM e a C TMDQU1 1 DDR2_DQ14 RXD4 96 0 C MDQL1 C TMDQL1 t form SPI flash C TMDQU2 02 2 0013 C MDMU C TMDQU3 03 2 0012 5 TMDQUA U4 DDR2 GPI00 TCON15 Gvpp_opp 04 2 0015 N15 H DD c TMDQUS ES DQUS DDR2 DQ9 P101 TCON14 VSYNC VDD anas DDR3_DQU6 DDR2_DQ10 2 597 2 C MDQL1 2 AUS _DDR3_DQU6 DDR2_DQ1 GP102 TCON7 LDE 22 224 1 C MDQL2 C TMDQU7 _DDR3_DQU7 DDR2_DOM1 GP103 TCON6 LCK G GCLK2
5. 16v 16V Bond 8 LPHBAFER mmm R754 0MINI 1908 2 OUT VGH_M AP 25V 6 WAFER HD 0 DIM oPT 767 NON_GIP 3 816 9 GSC GCLK3_I RXD4 0 NON_GIP R768 2 GOE GCLK1_I RXD3 6 a RXD3 RXA3 NON_G RXA3 1 LI R771 o NON GIP 4 R772 0 3 3K vs MINI_LVDS RXA4 RXD2 RXA4 RXD2 RXA2 RXA3 RXD1 RXA2 RXA3 RXD1 RxD0 RXA1 sex VDD_LCM RXACK RXDO 16 3 3V_Normal RXACK 104 254 3216 2 RXAO VDD LCM 20705 50v RXA2 RxC4 RXAO 4 1085 1105 MINI 1408 RXA2 09 424 0 16V 1 RXC3 R724 MINI LVDS LCM RXC3 MINI LVDS RXAO gt PANEL VCC e 8 BIT_SEL RXCCK 50v RXCCK MINI LVDS LVDS ohm R709 FER HD 10K 3 BIT_SEL_LOW RXC2 3 mm RXB4 RXC2 5 1 RXB3 RXC1 VCOM_IN sp Gvst_1 lt 8703 RXB3 RXC1 3 9K aan MINI GND e RXCO R745 0 NON GND vss 5729 0 GIP GMA18 GMA18 PIERS VGH EVEN VDD_EVEN GMA16 GMA16 RXBCK VGH_ODD vpp_opp ES GMA15 4 VGI P GMA13 e VGI_N GMA12 GMA10 LCM GMAS RXB2 gt GMA
6. E 726 R5020 16v NTSC 11 V id 55 R5025 004 4 7K RF AGC OPT TU SCL AS UNT 3 R501 SCL 5V_TU 5012 501 SDA 2318 50 50 85026 C IF_TP 85030 SIF NC VIDEO R502 3 3V_TU GND 41 2V 1 8V TU 3 3 TU 1 2V TU5O0017 3 TUNER RESET TDVJ HOO1F 3 3 NTSC_1INPUT_H_LGIT RESET IF_AGC_CNTL E 5003 9 DIF_1 NON OPT IF_N_MSTAR DIF 2 NON DEMON P IF_P_MSTAR N to the tuner SHIELD R5006 100 DEMOD rx R5007 00 V 1 3 3V_TU 15001 ge of chip type 091019 w s HABI ge of chip type Add of Tuner P N for NISC lINPUT 091116 w s jeong AZ1117H ADJTRE1 EH11A 1 2 1 8 TU INPUT gt 1608 Type w s Je 019 012 Type w ong 1116 2 ADD of TUNER P N w s Jeong 1116 5V Normal 45V TU 200mA 150 BLM18PG121SN1D c5029 Tour 43 3V Normal 3 3V_TU po NTROL ATTEN Am LE 5017 gt 16V T This was being applied to the o so this has to be deleted in both main and THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS
7. 12V 15V FROM LIPS POWER PANEL POWER 3 R488 5 5 100K 4 2 29 16408 Beas _ 42 5 E Sour item mage POWER_DET e 2 1416 1112 eat fl 5 1 ses 51 13 PANEL VCC 2 406 1 5 0443 amp 451 1 7K NORMAL EXPEPT 32 EI paos T 16 L RL_ON 10K 20020 245 24 das 22 2803052 22k 2 4 t L Es i 8 24V gq 201209 0120 12 p 72 01 P 1 2505 2450 227 127 43 GND n 2 10 POWER_ 20V POWER_ 18 26 405 8407 0 saze 052 32 28 22 2 2 a 1 359 23 PAN i 22K Tes be ES PANEL 1 2r em 1 AK10 D 4 POWER 9204 pOWER_ 18 5V INV QN 1 k Only for 32 37LED MODEL 5 C Power 12V 15V 3 3 3V_Normal Leet en ee oqa wi 4 DDR 1 5 13 3 so 3V_ Normal 16V 1074 mA _ qaod oet Eo e 4 4s Lee 8 405 1934 9 AOZ1073AIL 28 CIC21J501NE Vout 0 8 1 R1 R2 5 SS L424 q 449 L420 S ET Nn 21250 E 1 5 DDR 4 E B Ln 5 NR804
8. I f jen I I ep E neds E Did I 10 3401362715 Sort I GIP REF 50 75 18 I GIP I VGH I OPT I I 5 5 I I 2 R612 j T TN le is I I I 50v I R613 lt lt lt lt lt lt lt gt I FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 4 SYMBOL MARK OF THE SCHEMETIC SECRET BLOCK ISHET 7 7 ELECTRONICS GElectronics K 2 HDMI 1 HDMI 1 DET HDMI 1 HDMI 3 I 3 25 HPD1 R894 2sc3052 RED 10K 2 R859 22 2 8851 22 100 100 8852 0 o K _HDMI1 CK _HDMI3 z R816 0 821 9 DO _BDMI3 k 814 c I DO _HDMI1 9 DO _HDMI3 lt 5 1 _BDMI3 o R818 D1 _HDMI1 DIT HDMIS 2820 NP D2 _BDMI3 RB12 lt 9 D2 _HDMI1 9 2 HDMI3 JK804 5 HDMI 2 2 sv pst 2 SV_HDMI_4 5V_DET_HDMI_
9. Fe s 8 3 38 C MDQL3 mec 2 3 I x C MDQL 5 2819 1 2915 2 DART RX R336 DPM_A 8 C MDOL6 C MDOL5 C TMDQLS 9 CONFO MINI LUD poke 10 AC15 R300 l I AR308 2 D7 505 002 Y16 505 2 15 FRC_CONF1 4 I gt 16 4 23 C MDQU C TMDQUG 025 UART_FRC_ I 4 93 C MDQU3 820 vii e 0 R327 20 22 29 x DA 3 2 CM e 27 C MDQUA vig PRC REXT ais 2224 RIIS 22 wx xe I 2005 C MDQUS FRC_TESTPIN 12 opt 05 8 C MDQU7 C TMDQU7 e 5 5 pous c Mpou6 10 7302 5226 22 C MD0U7 DA 3 9 c TMbQL R33l 22 eRe C MDQUS C TMDQUS pr FRC I C MDQU3 TT 15 7 Apia 5 FRC_PWM1 ax Co THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION MODEL DATE vers ELECTRONS THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics
10. 92 2 E 5 15 12 82 rePro1 oNcarn 22 PEMOD OPT R29 2 soa 5 3 28 D1 HDMI2 BN TGP102 12C z3 TU SCL AVDD GND 3 640454 114 7 29 D2 _HDMI2 2 2C_sDA BE 2 II DVDD_NODIE 30 D2 HDMI2 B_RX2N L 5 1 2 26 27 o 90 310 DDCDB_DA GPIO26 II GND 2i ADC2P5 2 bebe CK GPIQ 5 201 VDD33 DVI 163mA ps 25 52 147 3 Normal DVI AVDD DMPLL 33 d 2 HOTPLUGB GPIO20 5 26244 27 GND_ Iz 38 M15 4 5 1207 1217 AVDD25 GND A2 84028 0 207 35 m16 RDMIA c_exce 814 pus 2 A 613 8296 100 29 _ RXCN 201 8 10178 spp 5 F AU25 5 X s AVDD euo 38 _ RXON USB GND B 39 wis 49 f ni3 HDMI4 RX1N BT_DP PVDD 1 GND amp uds 3 LIBI VDD2P5 15 41 D2 _HDMI4 RX2P um AVDD_DMPLL AVDD_NODIE 7 362mA pvpp_2 eub a2 11 SDa ppcpc_pA GPro28 DP P1 AVDD25 GND_ ns
11. R240 12401 R2401 BLM18PG121SNID 100 KEY1 10 12402 2402 beans ert HEY Y _ 4 12 82425 9 e 8 R2428 22 2413 1 5K IR 75 LED_B LG_LOGO 3 3 3K R2410 3 COMMERCIAL 3 5 R242 I 4 4 3 2 2nd ED R BUZZ e ooo I ise R2416 I e I R2422 I I cial US I e Zener Diode is I I m I I R2417 WIRELESS IR_PASS 82419 THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET 2 8 7 Lu ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR e LG ELECTRONICS THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics GHEET amp wf aii n S q S VE E S m M Slav
12. to IC AT24C02BN 10SU 1 8 WP 0 1uF 4 7 74 7 L JP811 R879 22 I 8880 22 5V_HDMI_4 5V_Normal 112 I o WP e 0 1uF JP812 R882 22 3 3V_Normal R854 R856 8 85 105 68K 57 GND GND CEC_ON OFF uL 4 3 5V R892 R883 R893 853 82 R85 10K e on CEC_REMOTE_NEC New Item Development EARPHONE BLOCK ouem o or oes II cinis I loss iv T 81125 d 01101 MMBT3904 F O i 8 2 zx 55 4 R1155 II C1119 Tour ie R1128 sex morer 1125 01 4 HOTEL 2 22 1 3 Normal RGB 5V_Normal PC AUDIO 1 a SPDIF OPTIC JACK 381112 1 5 15 Mstar Circuit Application PO 5 I lt B TERMINALI e I SPDIF OUT xus PCORON 2 816 R R1139 de R1142 2008 T m ox R1126 1_SPRING EDID_WP 2 e e 2 PC L IN 2 81 2 I RGB DD C1127 R1141 8
13. 100 SHE ELECTRONICS 535 K L R527 Por 4 SPEAKER_L R528 ai KL R529 42 SPEAKER_R R530 ak PK z536 SPK 1 ee 2537 0 SPK L ee R538 0 SPK_R ee y SPK R ee avptoctei SHEET NOT USING THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET THE CRITICAL COMPONENTS IN 188 N SYMBOL HARK OF THE scere LfaElectrorice LG ELECTRONICS BLOLK CHEET MODEL NON CI Region THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics LG ELELTRONILS NON ETHERNET ga eee EPHY_RXDO EPHY_RXD1 EPHY_TXD1 EPHY_TXDO EPHY REFCLK EPHY CRS DV EPHY MDIO ET RXER RST PHY EPHY MDC EPHY EN THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED F
14. AVDD_DDRO 55mA AVDD_DDR1 55mA c 1000p 5 4 Sci soc SOGIN1 MIC_DET_IN 4 5236 1 1 AVDD KE 5 2 MICIN s FRC_AVDD_MEMPLL GND_83 3 asynce cnp 19 R237 33 218 0 047 1 84 2 RIN2P AUCOM 1202 85 I R238 68 c219 0 047uF 2 915 8 0 85 i2 5 BLM18SG121TN1D 9 R239 c220 o o47uF AVDD_DDRO_D_1 cup S 2 3 6 GIN2P I AVDD_DDRO_D_2 GND_87 18 R240 8 c22il o o47uF c249 052 87 OMP2 Y GIN2M 3 88 I 2 WV es BIN2P AVDD DDRO D 4 euo BIN2M AVDD_DDRO_C sup 90 SOGIN2 ME P OUT suo 91 1203 5 6u z F16 vie 203 LOUT PRC 8 Avpp_ppR0 AVDD 1 92 2 1205 5 Te Roe RX AVDD_DDR_FRC 55mA LU 4 2 OUT 1 ROUT SN AVDD_DDR1_D_2 GND_93 i se 2 aeg 5 w R245 33 c226 o o47ur wc 2l AVDD DDR ER MVREF AVDD_DDR1_D_3 94 SC1_CVBS_IN 33 eman s mm s ps E AVDD D 4 eub 95 AV_CVBS_IN ET_
15. North Latin America http aic lgservice com Europe Africa http eic lgservice com Asia Oceania http biz lgservice com CHASSIS LTO1B MODEL 4210465 1210465 CAUTION BEFORE SERVICING THE CHASSIS READ THE SAFETY PRECAUTIONS IN THIS MANUAL 63141213 1008 0 Printed Korea CONTENTS CONTENTS uu u 2 PRODUCT SAFELY 3 SPECIFICATION 6 ADJUSTMENT INSTRUCTION 9 EXPLODED VIEW Ia a 15 SVO SHEET uu aussssswasssskawasasuskiquwaqswanasaaspasypkawasusapaqsaastakaskkaqawskawskastakaqup Copyright 2010 LG Electronics Inc All right reserved LGE Internal Use Only Only for training and service purposes SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety related characteristics These parts are identified by in the Schematic Diagram and Exploded View It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock Fire or other Hazards Do not modify the original design without permission of manufacturer General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated fro
16. SIDE USE HOTPLUGC GPIO21 L AVDB SMPLE H GND_ A2 s s s s eue HDMI3 2 _ 1 COMP2 DET GND AS GP10174 EET 3 u e 3 33 4 9 DO _HDMI3 AVDD_DVI_1 GND Normal 2 5V maa as DO _HDMI3 l 81 _BCK GPI0181 AUD ws 2 D1 _HDMI3 RX1P 5 wasrER H SMS AVDD3P3 CVBS GND 2 2 5 N YN AvbD DMPL AVDD3P3_cvas D1 _HDMI os RX1N 8 6 0182 84038 AUD_LRCH 2 AVDDAPS AVDD_DMPLL GND_ D2 _HDMI3 2 _OUT 1 6 0183 AMP_SCL GND 3 0 AU33 SDA_3 DDCDD DA GPI1030 S OUT SD3 GPIO185 MODEL OPT 5 ey AVDD GND Atel 07 HPD3 pe HOTPLUGD GPIO22 GND_ remore 6 05 mE 46435 GND_ vpp3 5 LINE IN OL AVDD33_ GND Ling 1m on 2 paw Em hs Mp e 84025 24 lt lt LINE IN gt 1 GND_ G6 424 rma AU25 2 5V_Norma AVDD25 33 LINE IN cos 2 1 9 5V_Normal 2025 2
17. d 22 R114 v T 22 1127 _ I 9 9 DSUB 81148 I D1114 5 DSUB_B DSUB_B DSUB_G m nes Ign T 5 4 3 3V_Normal 5 R1146 DSUB_DET R1147 DSUB_R R1137 Ius 75 U DSUB 4 ee e 9 NN JK1104 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics MODEL ce2_seturn7 DATE HERNI BLOCK common SHEET 2 RS232C RXD1 ANO RXI 0 PORA R1154 0 R1153 0 THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET THE CRITICAL COMPONENTS IN 188 N SYMBOL HARK OF THE scere LfaElectrorice LG ELECTRONICS BLOLK CHEET 0 H g m SIDEAV_CVBS_IN YL E LUG YL O SPRING SIDEAV_DET YL CONTACT WH 0 SPRING RD CONTACT RD O SPRING RD E LUG THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE
18. s e ea rp d e I 8 8 2 8 8 3 2 8 i 8 3001 1 MINI LVDS LVDS FRE 1 8 85 8 MODEL OPT 0 PIE 5202 MODEL 1 E 5i2MB DDR 256 eL och 2 OPT 2 R204 m c OPEM PM R210 MODEL_OPT_4 a gt 09 zs pis GIP NON_GIP 101 MODEL scbGEI107D S7M Divx Non RM D e MODEL 6 LcD N ormal Power 3 V 57 _ 8 X vpn3 mt S Sa 2 a 4 VDD33_T VDDP U3_VD33 2 a 2204 813 T E gt 2 BA ES BLM18PG121SN1D VPS 59 2 2 ee 229 15 EPC ES s E Close to MSTAR 8 8 212 vooc c257 0 1uF 4 8 8 5 5 Ej Ej Ej L SN L m 101 s mm DDC 1 2 lt 4 4 STM 9 838 5 5 21200 0 1uF R4002 5 E vppc_9 GND_9 2 216 0 1uF R4003 10 GND_10 15b x S F1 w2 _11 GND_11 CK _HDMIL S7M_DIVX vise ANALOG SIF Gub 12 F2 w AVDD_MEMPLL
19. vsso_s 1 Il DQU2 A MDQU2 A MDOL6 A TMDQL6 A TMDQLS DDR3 DQLS DDR2 B_DDR3_DOL5 DDR2 TMDQLS mo B MDQUA 6 E2 MDOL4 A TMDOL4 ina B MDQU5 vsso_7 DQU3 A MDQU3 DDR2_CKE B_DDR3_DQL6 DDR2_CKE TMDQLG B TIMDQUT7 B MDQU7 2 7 5 DDR2 2 MDQL7 B MDQU6 8 DQU4 A MDQU4 DDR2 DQ2 B_DDR3_DQL7 DDR2_D 017 B TMDQU3 B MDQU3 2 8 5 AR1206 h B MDQUT 9 Dous A MDQUS B TMDQUS B MDQUS 52 DQU6 A MDQU6 A MDQUT A TMDQU A TMDQUO __DDR3_DQUO DDR2_DQ15 B_DDR3_DQUO DDR2_DQ15 TMDQUO B TMDMU B MDMU DQU7 A MDQU7 A TMDQUI _DDR3_DQU1 DDR2_DQ9 B_DDR3_DQU1 DDR2_DQ9 1 To MDQUS A TMDQUS A TMDQU2 _DDR3_DQU2 DDR2_DQ B_DDR3_DQU2 DDR2_DQ8 TMDQU2 AR1218 A MDMU A TMDMU A TMDQU3 _DDR3_DQU3 DDR2_DQ11 B DDR3 DQU3 DDR2 DQll B TMDQU6 B MDQU 10 A TMDQU4 DDR3 DQU4 DDR2 DDR3 DQU4 DDR2 TMDQUA B TMDQUO B MDQUO AR120 A TMDQUS DDR3 DQUS DDR2 0012 B DDR3 DQUS DDR2 0012 TMDQUS 04 906 5 Satie A TMDQU6 A_DDR3_DQU6 DDR2_DQMO B_DDR3_DQU6 DDR2_DQMO TMDQUG A MDQUO A TMDQUT A_DDR3_DQU7 DDR2_DQ14 DDR3_DQU7 DDR2_DQ14 B TMDQU7 10 MDQU4 A TMDQU4 q 8 R1221 B TMDQUI B MDQUI 10 MDQU1 10K R1234 B MCKE R1233 10K A MCKE THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS
20. 5 arnb 5 Internal Normal lt M 31 UART3 TX 3 3V_Norma1 1 s A reer A atas gt PCM_A 3 LK M REMOTE PCM_A 2 GPIOG PMO INTO 27 Sm na paqa PCM j 0 GPIO10 PM4 2 1 FS 19 22 TEL opr aoe 12 PM6 I E RN 22 PM_SPI_CK GPI01 WAIT N S7M DIVX amp DD RESET jfrom CI SLOT jer n AA10 0 11 8 512MBIT yis wi TS DATA O 19 ES 255 25 _ R134 M23 150 05 1706 R135 N23 eS gt 1 05 f 2 4 Internal demod out 2 54 for 5 M22 l Externai demod in EEPROM amp URSA3 RIS N22 2 151 VLD FE TS DATA 0 7 BECAS wn 35 TS1 SYNC e NC 23 22 ppca_pazuanro DDCA CK UAR ET PRE FE TS DATAT2T FE_TS_ PWMO GPIO66 203 510 Region that support MS10 ex DTV Country 1 6 1067 51 PWM2 GPI _D
21. 7e NEC EEPROM SCL 0 sq COO R1008 m oH Daw 0208 NEC SDA 22 gt B ib H Me x oud m a 4 43 5V B 8 GP e a Va 8 R1044 10K MICOM MODEL s 8 2 T 2125 47 B MODEL OPTION n geo Be p See un i E 1 7 MODEL OPT O 8 5 1 LED 8 1 LAMP E 4 5 MODEL_OPT_1 11 022 LED LED I R1003 0 CEC_ON OFF MODEL_OPT_2 30 TOUCH_KEY TACT_KEY Ws Oe MODEL_OPT_3 31 GPIO_LE NON_GPIO_LED I 8 a 3 28 z WE E MODEL_OPT_D 1 3 Sea lt lt oe E HIGH LO HIGH 19 22 26LE3300 5500 HIGH HIGH LOW 32 37 42 47 551 5300 10 Low HIGH Low Lc 10420 HIGH 1 LOW HIGH LE7300 HIGH HIGH THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS GElectronics BLOCK _ SHEET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 4 SYMBOL MARK OF THE SCHEMETIC ELECTRONICS CONTROL amp LED
22. EXPLODED VIEW IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety related characteristics These parts are identified by in the Schematic Diagram and EXPLODED VIEW It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X RADIATION Shock Fire or other Hazards Do not modify the original design without permission of manufacturer Stand body Stand Base Set Stand 00 Copyright 2010 LG Electronics Inc All right reserved 15 LGE Internal Use Only Only for training and service purposes I I uua dm amu amis asss Tm LGE107D S7M Divx_Non RM r3 CHIP Config AUD LRCH v Doa z AR101 DIVX STM DIVX PCM_A 6 lt care Config F_RB AUD_SCK AUD_MASTER_CLK 1 ae 22 DE d hs 1
23. 1 RD2 O SPRING_1 2 RD2 E LUG S R IN RD2 E LUG S l R3829 BL2 O SPRING BL2 O SPRING COMP2_L_IN ix BL2 E LUG S BL2 E LUG S 5 1 GN2 CONTACT pu 2 Pre GN2 CONTACT lx 33812 GN2 O SPRING Pr GN2 0 SPRING GN2 E LUG GN2 E LUG 4 2 1 2 R380 COMP2_Y D3804 I R3814 30v e comp2_y e SC1 COMP1_DET AV_CVBS_DET RESULT HIGH HIGH SC1 COMP1_DET HIGH LOW SC1 COMP1_DET LOW HIGH AV_CVBS_DET LOW LOW THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 4 SYMBOL MARK OF THE SCHEMETIC MODEL ce2_saturn7 MODEL DATE 1 2 1 sees SHEET LGElectronics ELECTRONICS LEFT Connector 60Pin Mini LVDS P701 1040 0 6017 MINI LV Right FFC Connector 60Pin Mini LVDS 51Pin LVDS Connector For FHD 60 120Hz 1702 120 ohm WAFER FHD P703 05 515 WAFER FHD p amp o 41Pin LVDS Connector For FHD 120Hz 2704 30Pin LVDS Connector For HD 60Hz Normal
24. 255 R Cut 64 64 64 128 G Cut 64 64 64 128 B Cut 64 64 64 128 Caution Color Temperature COOL Medium Warm One of Gain G Gain should be kept on 0 0 and adjust other two lower than CO when R G B Gain are all CO it is the FULL Dynamic Range of Module 4 2 Manual W B process using adj R C After enter Service Mode by pushing ADJ key Enter White Balance by pushing c EZ ADJUST 0 Tool Option1 White Balance 1 Tool Option2 _ 2 Tool Option3 gt 3 Tool Option4 B Gain 2 4 Country Group R Cut 5 ADC Calibration G Cut X T B Cut White Balance Test Pattern 7 Test Pattern Reset 8 EDID D L 9 Sub After done all adjustments Press In start button and compare Tool option and Area option value with its BOM if it is correctly same then unplug the AC cable If it is not same then correct it same with BOM and unplug AC cable For correct it to the model s module from factory model Push The IN STOP KEY after completing the function inspection LGE Internal Use Only 4 3 DDC EDID Write RGB 128Byte Connect D sub Signal Cable to D Sub Jack Write EDID DATA to EEPROM 24 02 by using DDC2B protocol Check whether written EDID data is correct or not For SVC main Ass y EDID have to be downloaded to Insert Process in advance 4 4 DDC EDID Write HD
25. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 4 SYMBOL MARK OF THE SCHEMETIC SECRET ODEL ELECTRONICS LGElectronics BLOCK SHEET 2 Z 8 FLASH S ed 1 1401 3V_Normal MX25L8005M21 15G THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY SPECFIED PARTS BE USED FOR e LG ELECTRONICS THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics BLOCK s F1as GHEET 23 CAN H N TUNER for US amp KOR amp BRAZIL amp TAIWANS amp AUS 45V TU OPTION BOOSTER IL m ux 1 5001 209 0120P N2 OPTION RF S W OOSTER OPT EUS OO TDTR TO35F NTSC_2INPUT_H_LGIT e RF_SWITCH_CTL TER OPT ER e Hone ege eee as 2920 LA TN DVB 1 H LGIT 7 oosTER 5 TU5001 2 50010 Ter t 2 FE 5V TU TER OPT J 5V_TU ANT_PWR OPT s 55029 BST_CNTL RF_S W_oPT 3 3V_TU R5032 a mum B O TDVJ H031F
26. 10774 52228 26892 32 22LD350 DB 20513 10774 3076 26892 32 26LD350 DB 12289 10774 3076 26892 32 32LD350 DB 16385 10774 3076 26892 32 22LE5300 DA 8417 8714 52260 26892 3104 26LE5300 DA 12513 18954 52260 26892 3104 4 Completed selecting Tool option Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes 10 Adjust Sequence aa0000 Enter Adjust Mode xb0040 Componenti Input 480i ad0010 Adjust 480i 1 0060 RGB Input 1024x768 ad0010 Adjust 1024x768 RGB aa0090 End Adjust Mode Required equipment Adjustment R C 3 2 Function Check 1 Check display and sound Check Input and Signal items cf work instructions 1 TV HDMI PC Audio In Display and sound check is executed by remote control 3 4 RGB PC 1024 x 768 60hz 5 6 LGE Internal Use Only 4 Total Assembly line process 4 1 Adjustment Preparation W B Equipment condition CA210 CH 9 Test signal Inner pattern 851 Above 5 minutes H run in the inner pattern power on key of adjust remote control 4 1 3 Auto adjustment Map RS 232C RS 232C COMMAND MIN CENTER MAX CMD ID DATA DEFAULT Cool Mid Warm Cool Mid Warm jg Ja jd 00 172 192 192 255 Cool 13 000k K 0 269 0 002 All 0 273 0 002 Test Signal Medium 9 300k 0 285 0 002
27. AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET MODEL DATE ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR LG ELECTRONICS THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics PODER spect SHEET WIRELESS READY MODEL JK2601 KJA PH 3 016 Wireless power From wireless I2C to micom I2C OPT amp 3 3V Normal R2602 10K WIRELE 4 88 24 4 6 3 3V_Normal ETECT 22K 2602 NTERRUPT 5 R2612 G R2617 R2603 id MP_SDA e e WIRELESS_SDA WIRELESS PWR EN 02601 2 UART_RX WIRELESS_RX UART_TX WIRELESS je 6 IR_PASS WIRELESS ND_6 R2611 0 3 5V ST 3 Normal oPT R2618 0 R2608 WIRELESS IC2601 Reon 20 MC14053BDR2G WIRELESS_DL_RX WIRELESS TX 5 RS232C amp Wireless 7_TXD1 TX S7 1 52522 WIRELESS_SW_CTRL SELECT PIN STATUS WIRELESS 82619 is HIGH 1 1 21 WIRELESS Dongle connect WIRELESS RS232 5 LOW 20 WIRELESS Dongle Dis con 57 RS232 822 2620 0 WIRELESS WIRELESS_SW_CTRL Ver 1 2 1 3 wireless opt change 090818 hongsu THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION SECRET 6 ELECTRONICS MUDEL THE CRITICAL COMPO
28. BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics MODEL saturnzm DATE LG ELECTRONICS SHEET PANASONIC MN 844323 ISDB T 1 2 DE 43 3 DE R2910 22 FE AL ERR ISDB DEMOD R2911 22 FE_TS_SYNC 1SDB_DEMOD R2912 22 ISDB_DEMOD nz 81 0599 3 3V_DE FE TS DATA 0 7 _12 HAVE PULL UP R2914 R2915 2 2K 2 2K ISDB DEMOD C2926 0 1uF 9 4 DEMOD_SCL 6 DEMOD_SDA 1 2 9 01 5 _ 5_ 7 eco 9 MN884433 1 von Ispa pemon ISDB DEMOD coll 6 4 IF N EXT ISDB DEMOD P EXT os DEMOD RESET R2906 10K ISDB ISDB DEMOD 1508 DEMOD 2910 0 1uF THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 4 SYMBOL MARK OF THE SCHEMETIC GElectronics ELECTRONICS BLOCK SHEET Panasonic Demodulator Power 5 3 1 27 ISDB_POWER IC3001 5 421515 3 3V_DE 3 3V_Normal 3 3V_DE 1 2V_DE DB POWER R3004 3 3 BITK ISDB POWER ISDB PO i 4 C3001 C3002 Lt Ti m NER 63008 __
29. GND_ 5 LINE IN 2L SIDEAV_L_IN VDDP 3 gt 68 205 4 13 UD 2 2uF gt ol 212 L219 VDDP GND_ e GINOP LINE_IN_3L 2 COMP2_L_IN k 5 2 68 C207 0 047uF T6 C243 2 2uF zl 4 v20 9 GINOM LINE_IN_3R COMP2_R_IN e GND e C2084 40 047uF 3 05 C244 2 2uF I 820 BINOP LINE_IN_4L PC_L_IN AU25 Jm AVDD25 GND c2os o oa7ur 22 18 4 ys Peres U25 10mA 028 BINOM LINE_IN_4R PC_R_IN 5 GND o c2lolliooopF J1 06 246 2 2uF VDD 019 L LINE IN 5L 02 2 AVDD_RSDS_1 Sc 2 2uF 5 AVDD_RSDS GND uen S 4 ag L C AVDD 508 3 GND 8 84 1_R COMPL asa ga Ling_out_2u 51 FRC_LPLL 7 AVDD_LPLL GND_ e vemm E d la onus LINE OUT 7020 d AVDD MPLL GND 5 0 047uF D E C1_G COMP ernie LINE OUT 0 78208 DDR3 L 5WV gt VDD33 R25 68 C2l4 o o47uF FRC_VDD33 Y14 Sc1 G cowP l INIM LINE OUT DD33 DD GND R257 33 215 0 047 091 28 A SC1_B COMP1_I LINE_OUT_3R e 81 GND no 258 68 216 0 0470 26 4 AVDD_DDR0 eem lt
30. Inner pattern Y 0 293 0 002 216gray 85IRE Warm 6 500k 0 313 0 002 Y 0 329 0 002 Cool 9 300k 0 285 0 002 Only 2210350 0 293 0 002 lt Test Signal gt Medium 8 000k X 0 295 0 002 Inner pattern Y 0 305 0 002 216gray 85IRE Warm 6 500k 0 313 0 002 Y 0 329 0 002 4 1 1 Connecting picture of the measuring instrument On Automatic control Inside PATTERN is used when W B is controlled Connect to auto controller or push Adjustment R C POWER ON gt Enter the mode of White Balance the pattern will come out Full White Pattern i CA210 COLOR ANALYZER TYPE CA 210 RS 232C Communication 4 1 2 Auto control interface and directions 1 Adjust in the place where the influx of light like floodlight around is blocked illumination is less than 10ux 2 Adhere closely the Color Analyzer CA210 to the module less than 10cm distance keep it with the surface of the Module and Color Analyzer s Prove vertically 80 100 3 Aging time After aging start keep the power on no suspension of power supply and heat run over 15minutes Using no signal full white pattern or the others check the back light on Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes GGain jh Jb je 00 172 192 192 255 B Gain ji Jc jf 00 192 192 172
31. POWER 2026 mA 5V_USB ETE 1 413 12 15 p placed bar ITE AREE 1481 82 1 5 DDR 15453 MAX 2000mA RL VD MP8706EN C247 LF Z dab Raia IN GND IC403 22K 18 24K 18 MP2212DN Close to IC gx veo Tr l idi 30v FB EN SYNC R445 OWER ON OFF2 1 R410 E POWER ON OFF2 ae 5k S iyaw R7 pon se 3 6uH 15 4 NR8040T3R6N R487 R411 Placed SMD TOP TN iid 22 ok Bs vee _ 1 coy E 7055 Placed SMD TOP 5V USB tov NR8040T3 9 Vout 1 R1 R2 0 8 D THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics ELECTRONICS MODEL BLOCK SHEET 5 8 7 e 8 8 5 8 o x x g Hm 4 st R1091 5 GND m for Debugger o a Piel 3 5V ST S n gt E lt 2 L 5 oM d 1 5 10
32. Range This specification sheet is applied to all of the LCD TV with LTO1A B chassis 2 Designation 1 The adjustment is according to the order which is designated and which must be followed according to the plan which can be changed only on agreeing Power Adjustment Free Voltage Magnetic Field Condition Nil Input signal Unit Product Specification Standard Reserve after operation Above 5 Minutes Heat Run Temperature at 25 5 Relative humidity 65 10 Input voltage 220V 60Hz 6 Adjustment equipments Color Analyzer CA 210 or CA 110 Pattern Generator MSPG 925L or Equivalent DDC Adjustment Jig equipment SVC remote controller 7 Push The IN STOP KEY For memory initialization O1 G Case1 Software version up 1 After downloading S W by USB TV set will reboot automatically 2 Push In stop key 3 Push Power on key 4 Function inspection 5 After function inspection Push I n stop key Case2 Function check at the assembly line 1 When TV set is entering on the assembly line Push In stop key at first 2 Push Power on key for turning it on gt you push Power on key TV set will recover channel information by itself 3 After function inspection Push In stop key 3 Main PCB check process APC After Manual Insert executing APC Boot file Download 1 Execute ISP program Mstar ISP Utility and then click Config tab 2 Set as below
33. and the circuit board to prevent excessive component temperatures Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a ju
34. and then click Auto Detect and check OK message If Error is displayed Check connection between computer jig and set 3 Click Read tab and then load download file XXXX bin by clicking Read Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes weed a filexxx bin Vim iain Chea a a T mama Pow 1 Tm USB manana papam mee Tumani 4 Click Connect tab If Can t is displayed check connection between computer jig and set Uae Seas an Las aq hae C SOL um QE V usa m agenda Pack Daten Please Check the Speed To use speed between from 200KHz to 400KHz 5 Click Auto tab and set as below 6 Click Run 7 After downloading check OK message LGE Internal Use Only USB DOWNLOAD epk file download 1 Put the USB Stick to the USB socket 2 Automatically detecting update file in USB Stick If your downloaded program version in USB Stick is Low it didn t work But you
35. the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead 3 Keep the soldering iron tip clean and well tinned 4 Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25 cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F b Heat the component lead until the solder melts c Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuit board printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the compone
36. 0 19 ar13 IRINT BLM18SG700TN TESTPIN J9 1223 STPIN F MIUIVDDC GND_FU 1 121 A RESET AV_CVBS_IN2 EU TP211 U3 RES FRC 3 Normal 1226 U3 RESET 05 BLM18SG700 x 22 NO 5 R4018 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS ESSENTIAL THAT ONLY MANUFATURES SP THE CRITICAL COMPONENTS IN THE 1 WHEN SERVICING IF IS ECFIED PARTS BE USED FOR SYMBOL MARK OF THE SCHEMETIC SECRET LGElectronics ELECTRONICS MODEL sez LOCK SHEED Ver SS eS IC301 1 1 H5TQ1G63BFR H9C 5 DDR ROT DDR3 1 5V By CAP Place these Caps near Memory 5 03 DDR DDR 1333 1 5V_FRC_DDR M8 eo 1301 NEMES K 5 55 mi VREFDQ Leza T 01690 5 8 5 cuu 22 10v 0 R8 L8 Close to DDR Power Pin _ 2 2 2 17 0
37. 0 1 0 10 TV L 2 E AGC SELECTION THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION 111111 is ELECTRONICS THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics GHEET 3 3V Normal 3 3V Normal 2 DET SCART OPTION BLOCK l Y T COMP1_R_IN se lee 855 L_IN JK3802 PPJ239 01 001 AR23 pee NON CI 4 5 60 sci cowei RD1 E LUG R3805 5 DTV MNT_VOUT RD1 O SPRING 2 RD1 CONTACT 2 WH1 O SPRING JK3801 RD1 CONTACT 1 PPJ238 01 NON CI 30 RD1 O SPRING 1 R3848 SC1_R COMP1_Pr RD1 E LUG 4 P 2 w R3817 RD1 E LUG S ls RD1 O SPRING 1 SC1 R COMPl Pr BL1 0 SPRING QM RD1 CONTACT B COMPI B3815 BL1 E LUG S I i WH1 O SPRING 2 5 1 Pb R3860 GN1 CONTACT 7 ore 0 YL1 CONTACT 5V_Normal R385 GN1 O SPRING o YL1 O SPRING He 6K e GN1 E LUG aiiz YL1 E LUG EX XV CVBS IN2 9 OPT R3852 RD2 E LUG 4 7K 55 5V_Normal RD2 E LUG 5 ais R3859 R3854 RD2 O SPRING_2 82 B RD2 O SPRING_2 2 MEE RD2 CONTACT ET 21 RD2 CONTACT WH2 O SPRING R3861 Ei WH2 O SPRING mm 0 lx ye 5 1 RD2 O SPRING
38. 01 or Main Board Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 3 Analog TV Video Check RF Cable amp Signal No Check Tuner 5V Power Replace IC401 L5002 Check IC401 Replace L5002 No Check Tuner 3 3V Power L5003 Replace L5003 Check Tuner 1 2V Power Check CVBS Signal 11 d 2 Bad Tuner Replace Tuner Check Mstar LVDS Output gt Replace Mstar IC101 or Main Board Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 4 AV Video Check input signal format Is it supported Check AV Cable for damage for damage or open conductor Check JK3801 JK3302 No CVBS Signal Line Replace Jack R246 R4016 Check CVBS_DET Signal 2 Replace R3802 or R3803 No Check Mstar LVDS Output Replace Mstar IC101 or Main Board 5 Component Video Check input signal format Is it supported Check Component Cable for damage or open conductor Check JK3801 IPS Y PB PR signal Line epiac Check COMP_DET Signal 2 Replace R3804 or R3805 No Check Mstar LVDS Output o3 Replace Mstar IC101 or Main Board Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 6 RGB Video Check input signal format Is it supported Check RGB Cable conductors for da
39. 073R6N c amp 885 POWER 22 VIN lxi e R485 R457 R1 3 POWER 20 7 eem m zs z 0 DIM 8453 IC407 10K 1 4 AGND EN ud OS MODULE PIN MBA T 4 DIM MP2212DN o IC 22 FB 22 PIN No PSU CMO AUO SHARP IPS FB EN SYNC 64 2 18 a or LIPS PSU PSU PSU PSU PuM_PULL DOWN POWER_ON OFF1 gasa 22008 E o SCAN BLKl1 OPC OUT 1423 689 18 INV_ON A DIM INV_ON INV ON INV ON opt su_2 4 pu 4 GET NR8040T3R6N 20 VBR A NC Err out Err out Li OPCW placed on SMD T0P 4 23 ESOUR2 POWER 20 ERROR OUT 0 luF NC 2437 100 Bs 22 DIM PWM DIM NC S Vout 1 R1 R2 0 8 Ede 26 32 52 GND POWER 24 ERROR OUT OUT gt Tile Ses 24 INV_ON DIM PWM DIM 5 0 2 55 0 23 GND GND GND GND GND 10 465 1 108 Iu 4 5bwv Normal 2 MAX 1A wa AOZ1072A1 2 5V 1 8V ix 2 3 3v_Normal _ lt 3 Teros VIN A22940D 2 5TRE1 I AT AGND EN c 477 300 mA u Less L z 10 2 I gt rs OLP E daa 25V V 12K als 403 c440 o 1uF Vout 0 8 14 R1 R2 ie 1 5V_FRC opt S7M core l 26V volt m 3 5 ST
40. 1 Ta D B m IS r gt ID ri A udo am BR UPS a D ER Ee d 5 1 22125424524 4 a 2 25 5 EZSSSEEWDTASESSEK g ad T Dd aim COODOngqn nrc 12225 228 3 288888 ccc SSSSSESREEEEEEEE gz nzssSsSkEkttttEE 5 8 HdzssssREEEEEEEE 5 2 ESzSSS amp dEEEEEEEE 8 5 5 S 4 23223238 838088 ooo oo ooo SSeS See ee ees 6 HD HDMI2 EDID Data CS 7AD5 2 FHD HDMI EDID Data CS D739 B m ee T4 k Ta ra B r gt C lal D Ta a s s Ce B d SSSZERRRGZESHE RR 5
41. 24mA AU33 31mA AVDD 60mA 6 a CK _HDMI1 VIFM Close to MSTAR MIUOVDDC GND_13 62 Zo LUE S UDA 2 5V_Norma xis DO _HDMI1 8933 2 5V Normal RC AVDD DVDD GND_14 D0 RDMIl I 1 HDMIL Mi TA 119 o GND ei Normal 5 imis D1 _HDMI1 ii 1227 s FRc_vppc_1 GND_ D2 HDMIl z BLM18PG121SN1D 18 2 1 2 N18 5 ori 116 E 5 9 DDCDA_DA GP1024 55 caosa Close to MSTAR 4 GND_ CDA CK GPIQ2S R4019 5 18 GND 6 v HOTPLUGA GPIOl9 84020 5 19 6 GND_ 33 DDR 50mA 219 35 10K FRC MP 20 7 GND_ CK HDMI2 _ VDD33 FRC_VDD33_DDR 8 GND R4032 _ c ELE D 84033 0 4 teri 20 0220 1206 122 12 0 HDMI2 2 Ui R291 _ 2 Tey B MISPG1218N1D BLM18PG12 FRCVDDC U3 DVDD DDR GND D0 HDMI2 B_RXON TGPIOO UPGAIN DEMoD scil 3 GND z2 gt u
42. 4 R828 n d 10 8803 0 1uF R837 _ iow I 2 9 22 22 22 ani R815 100 HDMI_CEC 100 831 A 0 HDMI2 _ 0 dcus R807 R822 0 2 DO _BDMI4 R832 0 8809 0 D0 _HDMI2 DO _HDMI4 1 R829 TEN R811 Dl1 _BDMI4 R823 0 item D2 _HDMI2 D2 HDMI4 R833 o 5 5 R808 0 p2 _upur2 D2 _BDMI4 pm 5 2 THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC GElectronics ELECTRONICS Por cl HDMI SEG BLOCK SHEET 5V HDMI 1 5v Normal W 2838 1112 D821 o EDID_WP R884 R888 4 7K 4 7K 586 R875 22 lt lt 0822 R885 4 7K 4 7K 810 rim DDC SCL 2 8878 22 pp R877 22 5V_HDMI_3 5V_Normal 202
43. 4 e e A MDMU A MDOL3 A TMDQL3 A TMDQSLB DDR3 DQSLB DDR2 B_DDR3_DQSLB DDR2_DQSBO B TMDQSLB rm B MDOL E MS 78 A MDML A TMDML T B MDQL1 1 A TMDQU2 B MDQL2 E pane PERTEN MDQU2 A TMDQU A TMDQSU DDR3 DOSU DDR2 DQSU DDR2 DOSB1 080 52 F5 A MDQLl TMDQSUB _DDR3_DQSUB DDR2_DQS1 __DDR3_DQSUB DDR2_DOQS1 B TMDQSUB B TMDQL7 B MD0L7 B MDQL3 B MDOL4 2 0012 A MDQL2 B TMDOL5 5 M 25 DQL3 A MDQL3 TMDML _DDR3_DML DDR2_DQ13 B_DDR3_DML DDR2_D013 TMDML B MDQLS 25 A MDQL4 MDQL7 TMDMU __DDR3_DMU DDR2_DQ6 B DDR3 DMU DDR2 006 TMDMU TO B Moore us T9 B MDOL 0015 A MDQLS er AR1216 d Bl 4 DOL6 A MDQL6 A TMDQLO DDR3 DQLO DDR2 B DDR3 DQLO DDR2 p24 TMDQLO B B MDQLO 57 ss 4 5 56 583 Met B MDQUO vss DQL7 A MDQLT A TMDQLI DDR3 DQL1 DDR2 007 DDR3 0051 0082 007 TMDQLl SENA cibus cs s 51 A TMDQL2 DDR3 DQL2 DDR2 DQL2 DDR2 TMDQL2 TMDQL6 B MDQL 01 vsso_3 5 JOLO TMDOLC N anes cna MDQL3 B MDQU2 vss DQUO A MDQUO A TMDQL3 __DDR3_DQL3 DDR2_DQ10 DQL3 DDR2 DQ10 45 TMDQL3 B TMDOL4 B MDOL4 9 880 4 gt 1 DQU1 A MDQU1 MDQL2 A TMDOLZ A TMDQL4 DDR3 DQL4 DDR2 004 B DDR3 DQL4 DDR2 004 TMDQLA T
44. 5 PWM3 GPIO6 Nc_21 amp DD Region that support only Dolby Digital ex AISA Analog KOREA TO 5 1 4 6 70 j c DETL se SARO GPI031 s d 5 MODEL SAR1 GPI032 CS N C PiF sPI cS 1 02 S7M NON DIVX NON DIVX DD S7T DIVX amp MS10 57 _ DD S7T NON DIVX MS10 s7T NON DIVX DD tODEL_oPT_ SARI GE _ PIF SPI I SAR2 GP1033 1 01 o0 19 17 NC 16 ne 3583 61034 MPIF_BUSY SAR4 GPI035 E12 1 MPIF_D1 MPIF D2 MPIF D3 URSA degug port UART FRC FRC_SCL gt UART_FRC_TX Pe SSS 57 MS10 57 S7 NON DIVK MS10 57 NON DIVX DD 125 Normal EEPROM yy porma HDCP EEPROM 3 3V_Normal Tm l z yi si De 0 x en 10K 1 104 iis M24M01 HRMN6TP I 4 7K 0 1uF IL R128 22 1 LD650 Scan 22 PRC_PWMI R129 22 SDA spa 22 100 FRC_PWMO sare z 5 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
45. 5 E2 Dl C TMWEB Z DDR2_BA0 A15 10 aN 55 R310 COP LLVOP BLUE 5S AE2 AE25 c2 E2 e 2 GINSAD MRASB C TMRASB C TMRESETB ETB DDR2_A3 COM LLVON BLUE 4 N 10 AF2 1P LLVI1P BLUE 3 AR305 AF25 A2 F9 R30 1M LLVIN BLUE 2 C TMCASB 2 AF24 1 T DOSL DDR2 0050 C2P LLV2P BLUE 1 J M i ADS g 2 AF2 A3 2 meee TMDQSL C_DDR3_DQSLB DDR2_DQSBO C2M LLV2N BLUE O 7 PE TMWEB AF23 VDDQ_3 x Sz BAO 2 AD22 7508 4 C TMDOSU E C DOSU DDR2 AF9 AE22 rae C TMDQSUB C DOSUB DDR2 1 35 Raut CaM LLVSN dim C MDQSL c 11 vppo 10 AF6 _DDR3_DML DDR2_D VDDQ 8 C MRASB 6 DDR3 DMU DDR2 apis C MDQSLB c AD 9 cas C MCASB mo 10 PM AES RXDCK R333 R313 TMDQLO _DDR3_DQLO DDR2_DQ6 ue RXDCK TMDQLl _DDR3_DOL1 DDR2_DO0 21 AD6 x 21 C TMDQL _DDR3_DQL2 DDR2_D DOM LLV EIE AD12 5 03 CHIP Config C MDQSUB
46. 50 gt 24V Check Mstar AUDIO MASTER 1 1 gt Replace Mstar IC101 or Main Board TP502 Check AMP 12C Li In gt Check signal line Or replace Mstar IC101 Check Mstar 128 Output 8504 EOE gt Check signal line Or replace Mstar IC101 No Check Output Signal P501 1 i EJ Replace Audio AMP IC IC501 Replace connector Check Connector amp P501 if found to be damaged Check speaker resistance No k and connector damage ep ace speaker Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 9 Digital TV Audio Check RF Cable amp Signal No Check Tuner 5V Power No Replace 1 401 L5002 Check 1 401 Replace L5002 No Check Tuner 3 3V Power L5003 RET Replace L5003 No Check Tuner 1 2V Power Check IF_P N Signal TU5001 17 18 Pin 2 Bad Tuner Replace Tuner Follow procedure 8 All source audio trouble shooting guide Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 10 Analog TV Audio Check RF Cable amp Signal No Check Tuner 5V Power No Replace 1 401 L5002 Check 1 401 Replace L5002 No Check Tuner 3 3V Power 15003 Replace L5003 No Check Tuner 1 2V Power Check CVBS Signal 11 d 2 Bad Tuner Replace Tuner Follow procedu
47. 76 22 m o m TS 81078 pp p22 NEC_ISP_Rx da lt 1010 44422 x 1 R1081 22 20522 N ANN EDID_WP i IEIR gt mi a m R1013 22 Lud R1002 10K INE P60 SCLO 4 P140 PCL INTP 2 m L ON MT P61 SDAO0 2 M 3 5 ST UR P62 EXSCLO 3 1 10 0 i 1006 10K NEC ISP Tx P63 4 P130 090 22 NEC_EEPROM_SDA C1002 WIRELESS SW Rx TUNES P33 TI51 TO51 INTP4 5 gt P20 ANIO 1055 10K 10K REMOTE NEC SCART1_MUTE 1013 10K Key had P75 1 2 ET ei NOM 6 UPD78F0513AGA GAM AX 30962 7 R1067 22 P74 7 ANI2 P22 25453 T _ MODEL1_OPT_2 R10 22 P73 KR3 8 23 i MODELI 0 POWER ON OFF1 R1023 22 P72 KR2 4 24 Ya awas R10 22 P71 KR1 5 25 gt SIDE_HP_MUTE EEPROM for Micom R10 22 P70 KRO ANI6 P26 3 5V_ST KEY2 R1059 22 P32 INTP3 OCD1B 17 27 IC1001 Agree NON_M_REMOTE 9 icd M24C16 WMN6T 810 22 8 49 9 55 agn TTL O O X X OX x gt 9 HM AN P lt 43 54 ST 9 6 Rioso E 557
48. 9 N 7 2 4 Yo emm 5 DDR i s 2 S7M_DIVX N8 Seida 2 LGE107D S7M Divx Non RM 1 2 TE 2 vonas c 150 5 C MA9 C TMAS 2 A0 DDR2_NC KP RLV3P RED 3 RXBCK JDDG 2 2 _DDR3_A1 DDR2_A6 KM RLV3N REDI2 RXBCK 026 1 MA0 C TMAO _DDR3_A2 DDR2_A7 AOP RLVOP RED 9 x c 7 5 025 33 7 C MBA2 2 C TMA 514 0083 A3 DDR2 1 AOM RLVON REDIS 7 014 dep es NE CLose to DDR3 aM C TMA4 2 _DDR3_A4 DDR2_CASZ ALp RLVIP RED 7 _9 2252 ee ee C TMAS _DDR3_A5 DDR2_A10 A1M RLVIN RED 6 2 AF15 25 E C TMA6 _DDR3_A6 DDR2_AQ A2P RLV2P RED 5 6 TMA6 AF2 v24 29 A7 DDR2 A5 A2M RLV2N RED 4 C MA4 4 15 C_DDR3_A8 DDR2_A2 A3P RLV4P RED 1 26 9 pis FRC DDR3_A9 DDR2_A A3W RLV4N REDIO g M AD16 5 17 mem E TS e C TMA10 apis PRC DDR3_A10 DDR2_A12 A4P RLV5P GREEN 9 16 _DDR3_A11 DDR2_A4 A4M RLV5N GREEN 8 C TMA10 C TMA12
49. A4 B TMA6 SCMBAS 7 5 8 AR1201 A TMAT DDR3 A7 DDR2 DDR3 A7 DDR2 A S 0083 7 0082 _DDR3_A7 DDR2_A3 Ex Bi 1 e A MRESETB A TMRE _DDR3_A8 DDR2_A6 _DDR3_A8 DDR2_ n m 2 4 9 A TMBA2 TMA9 A_DDR3_A9 DDR2_A12 B DDR3 A9 DDR2 A12 B TMA9 TD B MCK N 4 3 A 10 _DDR3_A10 DDR2_RASZ B_DDR3_A10 pDR2_RaSz 55 B TMA10 R1222 ici 1 SV DDR A TMAll _DDR3_A11 DDR2_A11 pons Al1 bDR2 A11 222 B TMA11 B TMCK UN B MBA2 TO A TMA12 _DDR3_A12 DDR2_A0 _DDR3_A12 DDR2_A0 12 30 li 27 A8 2 A13 ars EAS ANA hen is 13 223 oor o A MBA2 do A 51206 k A TMA13 _DDR3_A13 DDR2_ B_DDR3_A13 DDR2_ B TMA1 ees zs 25 4 AL 41543 A MCK A TMCK 292 5 es 1 ed 1 1 3 E B MCKE _2 R1207 1220 02 X e onda PILAE TMCKB 84 i5 5 CHER 5 TMBAO DDR3_BAO DDR2_BA2 B_DDR3_BA0 DDR2_BA2 B TMCASB B MCASB p2 E MCKE 351202 DDR3 F1 A_DDR3_BA1 DDR2_CASZ B_DDR3_BA1 DDR2_CASZ B TMODT 53 MCKB A MRASB A TMRA A2 R26 DDR B MRASB 4906 2 DDR3_BA2 DDR2 B_DDR3_BA2 DDR2_A5 B TMBA2 B TMWEB B MWEB V
50. C DDR3 A12 DDR2 gt FRC_DDR_1600 C TMA12 5 N c AC26 3 C MVREFC VREFCA ao c mao 13 6 11 RXACK C MAL C TMA11 M TCON12 GREEN O RXACK 2 BOP RLV6P GREEN 7 N2 AR304 T suni A EP S cases 3325 32 C MVREFDQ VREFDQ C TMBAO FEET _DDR3_BA0 DDR2_BA2 BOM RLV6N GREEN 6 cs 4122 04 come _DDR3_BA1 DDR2_ODT B1P RLV7P GREEN S 1 52 HAM AB2 1 5 MAS C TMBA2 DDR3_BA2 DDR2_A12 BIM RLV7N GREEN 4 oo 25 F ne 6 ANN B2P RLV8P GREEN 3 J Bota 240 R2 C TMRESETB ADI 21 25 F2 240 35 C MAT c _DDR3_MCLK DDR2_MCLK B2M RLV8N GREEN 2 2012 15 xs 58 CIMA C TMCKE Es C DDR3 CKE DDR2 RASZ B3P TCON11 BLUE 9 5 RXA3 DOL3 1 AD26 99 as DDR3 MCLKZ DDR2 MCLK B3M TCON10 BLUE 8 2222 RXA3 17 77 19 10 10 B42 TCON9 BLUE L7 RXA4 83 ECHO R308 BAM TCONS BLUE 6 RXA4 2 C MA12 C MCKB TMCKB C DDR3 ODT DDR2 B C MA12 ron e C TMRASB _DDR3_RASZ DDR2 8309 AF4 C TMCASB k 2 2 2 ui 2
51. DDQ 6 DDR3_ DDR3_ E A MCASB A TMCASB T 7200 7 A M MODT A TMODT D26 1232 13 43 858 A MRASB K A_DDR3_MCLK DDR2_M B_DDR3_MCLK DDR2_MCLK B TMCK R1219 10K VDDQ 8 1 5 DDR A TMWEB 025 TMDQSL B MDQSL Sonate 3 A MCASB B DDR3 MCLKZ DDR2 MCLKZ B_DDR3_MCLKZ DDR2_MCLKZ B TMCKB 5 10 4 0 5 MRES 81231 H E _DDR3_CKE DDR2_DQ5 B_DDR3_CKE DDR2_ B R1220 9 R1208 B TMDQSLB B MDQSLB ES MDQSL 10 L9 s 10 i E iis T 3 T _DDR3_ODT DDR2_ODT B_DDR3_ODT DDR2 123 B TMbQSU B MDQSU p 10 A TMRASB _DDR3_RASZ DDR2_WEZ B_DDR3_RASZ DDR2_wEZ B TMRASB 10 B MDOSUN Msn DES DURS B MCAS R1218 A MDQSL R1211 A TMCASB _DDR3_CASZ DDR2_BA1 DDR3 CASZ DDR2 B TMCASB A mandei c A9 A MDQSU A TMDQSU TMWEB _DDR3_WEZ DDR2_BAQ B_DDR3_WEZ DDR2_BAO B TMWEB 10 B7 B3 513212 B MDQSUB 2 25 1 e A MDQSUB A TMDQSUB _DDR3_RESETB B_DDR3_RESETB B TMRESETB B TMDQL1 B MDQL1 G8 B MDML A MDQSUB TMDQL3 B D3 32 B MDMU 5 ys B TMDML B MDML 28 5 TMDQ 51 er SV DOR DOSL BD 4 5 A TMDQL1 A TMDQSL 5 _DDR3_DQSL DDR2_DQSO DR3_DQSL DDR2_poso 7 B TMDOSL B TMDQU2 B MDQU2 4
52. ET7 1 blog Seo RD PN T I I ee Y I NAMUR 131 ST SS Ser up comer sapipi E M E pope 640 oP OPEN I I I I I R640 p b I 1 SHEET SHEET 31 11 I Hp 1 d 31 11 1 1 1 1 m T Du qe 7 TUS I I 4 tol KS SS SSeS ey i sm SS I VCOM FEED BACK I VCOM BACK I I I VCOM FEED BACK VCOM FEED BACK I I 1 n 8601 OPEN I I R601 OPEN bee 31 j ee 1111 l I 1 I 1 I 42 I I I ere EE IEEE I I R640 OPEN TCON CN 47_FHD_60_LAMP R641 4 R610 4 R611 4 8636 5 3887 R641 6 E n ni TCON_47_FHD_60_LAMP TCON_47_FHD_60_LAMP ERE TCON 47 TCON 55 FEED sack p BRE BE co eae VCOM FEED BACK VCOM FEED BACK SHEET7 l s
53. LVDS CEC_REMOTE P701 2 S7T USB Power 500mA DDR3 Address 0 13 IC1 01 DDR3 Data 0 15 EEPROM DDC_SCL SDA AT24C02BN 10SU LGE1 05 Ce TMDS 0 7 1 801 GMA 8 bit HVDD 802 HDMI w TMDS 0 7 _ 0 7 _SCL SDA SIDE_HDMI2 x JK803 gt KEY1 2 lt h RGB CAT24WC08W T LED_R BUZZ 1C103 LED B LG LOGO 2 RGB DDC SCL SDA LED i 102 DDC_SCL1 SDA1 SCL SDA AT24CO2BN 10SU 1C110 PI JK1102 AUDIO IR_OUT RGB PC In L R IR_PASS Ce 8 COMPONENT In amaya tin za a n n P5301 E JK3801 2 AUDIO COMP L R CVBS1 L R CVBS2 mnm SIDE AV2 In AUDIO CVBS2 L R MAIN JK3302 Ss ATV DTV 1103 AUDIO OUT SPDIF SPDIF OUT 0 SCL1 SDA1 L ROUT JK3301 AUDIO OUT SIDE_HEADPHONE Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only
54. MI 256Byte Connect HDMI Signal Cable to HDMI Jack Write EDID DATA to EEPROM 24C02 by using DDC2B protocol Check whether written EDID data is correct or not For SVC main Ass y EDID have to be downloaded to Insert Process in advance 4 5 EDID DATA 1 All Data HEXA Value 2 Changeable Data Serial No Controlled Data 01 Month Controlled Data 00 Year Controlled sum Auto Download EZ ADJUT 0 Tool 1 Tool 2 2 Tool Option3 3 Tool Option4 4 Country Group 5 ADC Calibration 6 White Balance 7 Test Pattern EDID D L HDMI HDMI2 EDID D L HDMI1 HDMI2 9 Sub B C Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes Manual Download Caution 1 Use the proper signal cable for EDID Download Analog EDID Pin3 exists Digital EDID Pin3 exists 2 Nerver connect HDMI amp D sub Cable at the same time 3 Use the proper cables below for EDID Writing 4 Download HDMI1 separately because each data is different For Analog EDID D sub to D sub For HDMI EDID DVI D to HDMI or HDMI to HDMI Item Condition Data Hex Manufacturer ID GSM 1 6 Version Digital 1 01 Revision Digital 3 03 LGE Internal Use Only 5 HD HDMI1 EDID Data CS 7AD5 1 FHD RGB EDID Data CS 1D T473
55. NENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC LGElectronics THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC e lt gt lt gt ao USE DIODES IC1450 AP21915G 13 5V USB MLB 201209 0120P N2 120 ohm C1451 22uF iov R1451 47 0004 JK1450 R1453 0 SIDE USB DM KJA UB 4 R1452 0 e SIDE USB DP WV3uls 8510 1 01452 CDS3COSHDMII CDS3CO5HDMI1 5 6V 5 6V OPT OPT e 1451 RST_HUB SIGN6409 Zo o o 8 D D D D ELECTRONICS Block p gt mi ala pi En Y mms Vya m s r s s snnTa I 3 7 4 2 6 I 4 2 Without 60Hz Lamp I Il VGH I I I VGH I I a I I jit oar om a SHEET sHE
56. OR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC SECRET LGElectronics ELECTRONICS BLOCK F RNE SHEET 7 NON Motion Remocon Region I I I I I I I I sol ES I I e xus I I M TON I I I I I I I J THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET THE CRITICAL COMPONENTS IN 188 N SYMBOL HARK OF THE scere LfaElectrorice LG ELECTRONICS BLOLK HEET MODEL NON CHINA HOTEL AMP_MUTE_BOTEL e TT e Dum l 3 THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET THE CRITICAL COMPONENTS IN 188 N SYMBOL HARK OF THE scere LfaElectrorice LG ELECTRONICS BLOLK CHEET THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET IE ue Fere LG ELECTRONICS BLIK EHEET 77 MODEL ce2_saturn7 DATE LG Electronics Inc 1 Power up boot check No ok Check stan
57. R H9C B TMAl MAL AR1208 IC1201 11 H5TO1G63BFR H9C B TMA6 B MA6 5 1 N 10 B MAO E B MVREFCA MAS AR1214 6 2 ES I 1203 VREFDQ B MVREFDO MAL 01 B TMA5 B MA5 EO 2 MBAO A TMBAO jii LGE107D 57 Divx Non RM 7 B MAS VREFDQ MA3 A TMA3 35 R1226 3 B MAG A6 1 MA4 5 apas 7M DIVX T MA7 29 Rives MAS 4 B MA4 B 6 T A TMAO _DDR3_A0 DDR2_A13 B_pDR3_A0 pDR2_A13 227 B TMA0 Pee sins N 240 AR 1 _DDR3_A1 DDR2_A8 5 DDR3 Al DDR2 A8 1 B MBA1 17 4 AMAT TMA2 _DDR3_A2 DDR2_A B_DDR3_A2 DDR2_A9 gt B TMA2 B TMA10 10 ALO AP E Mig MA12 TMA3 DDR3 A3 DDR2 1 0083 0082 Al 10 M A MBA 5 8 12 2 Lon TMA4 A_DDR3_A4 DDR2_A2 B_DDR3_A4 DDR2_A2 gt lt B TMA4 12 8 5 10 MAS E ORIASI AON 5 5 8 13 A13 e 5 _DDR3_AS DDR2_A10 DDR3 AS DDR2 A10 o B TMAS SMRESER 4 e A TMA6 _DDR3_AG DDR2_A4 B_DDR3_A6 DDR2_
58. RXD0 EPHY_RXDO 3 AVDD DD gt 5 B sIDEAV_cvas_in 33 p re lt 853 ET TXDO eub 91 2 c229 0 047uF 16 f EA t 27 2 S 1 254 JE UNE E E 5 ET 1 EL LN EPHY 1 B 5 s FRC_AVDD DDR DI GNb 99 81731781 81 5 FRC_AVDD_DDR_D GND_101 oe e _ _ _ _ ND gt _REFCLK 8 AVDD DDR D 4 102 5 12210 ovr EN 2 2 51 33 N gt DEVOMNTUVOUR urb E 2 0 a AVDD_DDR_C SND 103 yig CVBS OUT2 MDC Y MDC 1 OUT ET MD D23 H GND 104 ET_MDI _MDIO 3 GND 05 68 R285 5 5 Power 105 1 15 9 VCOMO ND 10 1 2 _ 106 EGE s MIUDVDDC 107 Close to MSTAR _vppc FRCVDDC IVREF 615 D17 e 108 gt 228 09 e BLM18SG700TN1D L225 0
59. SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE IN SYMBOL MARK OF THE SCHEMETIC LGElectronics MODEL DATE ELECTRONICS LIL L sss 3 3V_Normal RSDS Power OPT Ds VDDC 1 264 MODEL You nabs Sema VDDC 2026 p e k MODEL OPTION VDD RSDS 5 x x x PIN NAME IN NO HIGH LOW x 85 8 oh 8 T 1213 8 8 GD E LOW BLM18PG121SN1D 8 A 5 E EXE 2 619 FRC NO FRC INTEBNAL LOW I 11 5L e eu 34 ogo 8 0 27 087 TERNAL HIGH Ue af aj 22 2 832 032 3 E18 S 50 608 1405 PWIZ TCON with LG FRC HIGH HIGH VDD33 BLM18PG121SN1D
60. Service HDMI EEPROM LGE1 01 AT24CO2BN 10SU TMDS_SCL SDA JK802 0 7 SIDE JK803 RGB RGB PC In HDMI EEPROM AT24C02BN 10SU TMDS_SCL SDA SCL SDA P1102 nba SCL1 SDA1 PC EDI D EEPROM AT24CO2BN 10SU mum 1 1105 JK1102 AUDIO RGB PC In L R SPDIF CMOS COMPONENT In AVI In NL17SZOODFT2G oos 1 1104 JK3801 2 AUDIO M COMP L R CVBS1 L R le cas SIDE AV2 In AUDIO CVBS2 L R JK3302 4 1103 AUDIO OUT SPDIF SPDIF_OUT HP L ROUT JK3301 AUDIO OUT SIDE HEADPHONE Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes IF_AGC_MAIN 30PIN LVDS FOR 60Hz DDR3 Address 0 13 DDR3 Data 0 15 0 71 CAT24WC08W T 1C103 SCL SDA SPI TU CVBS TU SIF SCL1 SDA1 ATV DTV 12V Panel HD 60Hz Panel LVDS P705 NEC EEPROM SCL SDA KEY1 KEY2 LED R BUZZ LED B LG LOGO IR IR_OUT IR_PASS TUNER HNIM LGE Internal Use Only LD450 Block Diagram gt EN2 Y VDD LCM VCC LCM Full HD 60Hz Panel LVDS GCLK 6bit GSP GVST GVDD EVEN ODD P701 2 RX TX Mini LVDS TX p 4 60PI Mini LVDS MICOM EEPROM EU SCL SDA MICOM SCL SDA 16Kbit 1C1001 MiniA
61. T RXB1 GMA6 RXB1 PANEL VCC GMA3 RXBO GMAl 3 R7130 SCAN_BLK2 _ C715 NON ooo 50v 16v 3D 3D SCAN_BLK1 OPC_OUT 8705 R72 0 PWM_DIM 3 SEL HIGH Ig SELL 3D FPGA RESET _ RESET R710 10K SEL LOW I2C_SDA THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE 1 SYMBOL MARK OF THE SCHEMETIC SECRET GElectronics ER ELECTRONICS BLOCK SHEET 3 3V_Normal 3 3V_Normal 80 1504 Ei AMP RESET N s 2 AUD_MASTER_CLK 21 8 c509 z 0 1uF 1502 BLM18PG121SN1D BLM18PG121SN1D R503 R504 R505 R506 3 R507 3 THE 1 SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC GElectronics THERMAL AMP MUTE HOTEL R526 2s R524 e e is 1 iso 12 24 e R513 POWER_DET
62. XGA Copyright 2010 LG Electronics Inc All right reserved s LGE Internal Use Only Only for training and service purposes 8 HDMI Input PC DTV Only for training and service purposes 8 1 DTV Mode No Resolution H freq kHz V freq Hz Pixel clock MHz Proposed Remark 1 720 480 31 469 31 5 59 94 60 27 00 27 03 SDTV 480 2 720 576 31 25 50 54 SDTV 576 3 1280 720 37 500 50 74 25 HDTV 720P 4 1280 720 44 96 45 59 94 60 74 17 74 25 HDTV 720 5 1920 1080 33 72 33 75 59 94 60 74 17 74 25 HDTV 10801 6 1920 1080 28 125 50 00 74 25 HDTV 10801 7 1920 1080 26 97 27 23 97 24 74 17 74 25 HDTV 1080 8 1920 1080 33 716 33 75 29 976 30 00 74 25 1080 9 1920 1080 56 250 50 148 5 HDTV 1080P 10 1920 1080 67 43 67 5 59 94 60 148 35 148 50 HDTV 1080 8 2 Resolution H freq kHz V freq Hz Pixel clock MHz Proposed Remark 1 720 400 31 468 70 08 28 321 HDCP 2 640 480 31 469 59 94 25 17 VESA HDCP 3 800 600 37 879 60 31 40 00 VESA HDCP 4 1024 768 48 363 60 00 65 00 VESA XGA HDCP 5 1280 768 47 78 59 87 79 5 WXGA HDCP 6 1360 768 47 72 59 8 84 75 WXGA HDCP 7 1280 1024 63 595 60 0 108 875 SXGA HDCP 8 1920 1080 67 5 60 148 5 WUXGA HDCP Copyright 2010 LG Electronics Inc All right reserved LGE Internal Use Only ADJUSTMENT INSTRUCTION 1 Application
63. cement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 Bend the two remaining leads perpendicular y to the circuit board 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components
64. d and follow the SAFETY PRECAUTIONS page 3 of this publication NOTE unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power Source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Do not spray chemicals on or near this receiver or any of its assemblies 4 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 90 95 99 strength CAUTION This is a flammable mixture Unles
65. d by Voltage Main B D 3 5V Line P403 or P404 9 12pin 3 5V_ST Check Power connector Short Check Replace Power board P403 37inch 42inch Model P404 26inch 32inch Model Check Micom Voltage No 02 pin 48 3 5 Check 1002 clock 32 KHz Replace X1 002 No No Check penne Re download Micom software Replace Micom IC1002 or Main board Check Multi Voltage Board 20V Voltage is dependent on Model P403 2 pin 20V 17 pin 12V 13 ep ace oar 2610350 gt 24V P404 2 pin 20V 17 pin 12V Check 1C402 3 5 7 Output Voltage 402 2 5V No IC403 1 26V ee Replace IC402 3 5 7 405 3 3V IC407 1 5V Check X201 Clock No LJ Replace X201 No Check LVDS Power Voltage 0409 12V Replace Q409 No Check Mstar LVDS Output pe Replace Mstar IC101 or Main Board Check Inverter Control amp Error Out P403 or P404 18 pin High P403 or P404 24 pin Low Change Module Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 2 Digital TV Video Check RF Cable amp Signal No Check Tuner 5V Power Replace IC401 L5002 Check IC401 Replace L5002 No Check Tuner 3 3V Power L5003 RET Replace L5003 Check Tuner 1 2V Power Check IF_P N Signal TU5001 17 18 Pin 2 Bad Tuner Replace Tuner Check Mstar LVDS Output 2 Replace Mstar IC1
66. e Address OxE8h AO Pin GND um lt lt lt lt lt lt lt lt lt 11 p I Lo E I I 10 _ 129 I I 5 1 I I R659 R667 I 8 2 2 129 RXA3 4 9 ak 6v K RXD3 GSP GVST_I GCLK2 I I T I R669 1 SDA GMA6 vob 33 THERMAL gt GMAS TX 50 R685 50V GMA12 8 I NON_GIP Reg IC601 GMA4 RXD3 AL I lt i GMA 2 2 NON 9668 T 8 I fs z GSP_R MINI_LVDS El I 5 0 I 25 50v I mE 1 z R696 8 amp E R664 z I ton I 0 0 3 RXDCK jE GC RXA4 I es R658 GOE GCLK1_1 GMA3 25v 1 T 16V 5 15 EN2 GND_2 I I I GND_1 R615 0 VGI_N 0609 600 I I GIP I 0 R662 R666 I 2110 5 10 FB R605 100v I I RXA4 I 605 AGND GIP 5 e 47K I R617 E I I I T 251 42 LAMP rCON 42 60 LAMP 2 42 200 ose q I i d SEU TTL ROS VGL 1 153 14 R1 R2 2 L ee I kesi For P Gamma Data Do
67. e Voltage of Liquid Crystal Driving gt Liquid Crystal need for Polarity Change with every frame Block Data Input Power Input lt Press the PIP key of th ADJ remote control This PIP key is hot key to enter the VCOM adjusting mode Or After enter Service Mode by pushing ADJ key then Enter V Com Adjust mode by pushing key at 10 V Com As pushing the right or the left key on the remote control and find the V COM value which is no or minimized the Flicker If there is no flicker at default value Press the exit key and finish the VCOM adjustment Push the key to store value Then the message Saving OK is pop Press the exit key to finish VCOM adjustment Saving OF Press te save Visual Adjust and control the Voltage level V COM default value is different from module 1 32LD450 417 2 37LD450 432 3 42LD450 433 Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes 14 4 7 Outgoing condition Configuration When pressing IN STOP key by SVC remocon Red LED are blinked alternatively And then Automatically turn off Must not AC power OFF during blinking 4 8 Internal pressure Confirm whether is normal or not when between power board s ac block and GND is impacted on 1 5 kV dc or 2 2 kV dc for one second LGE Internal Use Only
68. ethod 1 Performance LGE TV test method followed 2 Demanded other specification Safety CE IEC specification EMC CE IEG Copyright 2010 LG Electronics Inc All right reserved 6 LGE Internal Use Only Only for training and service purposes 6 Component Video Input Y No Specification Bs Resolution H freq kHz V freq Hz 1 720x480 15 73 60 00 SDTV DVD 480i 2 720x480 15 63 59 94 SDTV DVD 480i 3 720x480 31 47 59 94 480p 4 720x480 31 50 60 00 480p 5 720x576 15 625 50 00 SDTV DVD 625 Line 6 720x576 31 25 50 00 HDTV 576p 1280 720 37 50 50 00 HDTV 720p 8 1280x720 44 96 59 94 HDTV 720p 9 1280x720 45 00 60 00 HDTV 720p 10 1920 1080 28 125 50 00 HDTV 10801 11 1920 1080 33 75 60 00 HDTV 10801 12 1920 1080 33 72 59 94 HDTV 10801 13 1920 1080 56 250 50 1080 14 1920 1080 67 43 67 5 59 94 60 1080 7 No Specification Proposed Resolution H freq kHz V freq Hz Pixel Clock MHz 1 720 400 31 468 70 08 28 321 For only DOS mode 2 640 480 31 469 59 94 25 17 VESA y TE gt 640 480 60Hz Display 3 800 600 37 879 60 31 40 00 VESA 4 1024 768 48 363 60 00 65 00 VESA XGA 5 1280 768 47 78 59 87 79 5 WXGA 6 1360 768 47 72 59 8 84 75 WXGA 7 1280 1024 63 595 60 0 108 875 SXGA 8 1920 1080 66 587 59 93 138 625 WU
69. m the AC power line Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks It will also protect the receiver and it s components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation If any fuse or Fusible Resistor in this TV receiver is blown replace it with the specified When replacing a high wattage resistor Oxide Metal Film Resistor over 1 W keep the resistor 10 mm away from PCB Keep wires away from high voltage or high temperature parts Before returning the receiver to the customer always perform an AC leakage current check on the exposed metallic parts of the cabinet such as antennas terminals etc to be sure the set is safe to operate without damage of electrical shock Leakage Current Cold Check Antenna Cold Check With the instrument AC plug removed from AC source connect an electrical jumper across the two AC plug prongs Place the AC switch in the on position connect one lead of ohm meter to the AC plug prongs tied together and touch other ohm meter lead in turn to each exposed metallic parts such as antenna terminals phone jacks etc If the exposed metallic part has a return path to the chassis the measured resistance should be between 1 and 5 2 When the exposed metal has no return path to the chassis the reading must be infinite An
70. mage or open conductor Check EDID amp EEPROM IC1105 12 Signal 2 Replace the defective IC or re download EDID data R1141 R1143 SDA SCL Check JK1104 MA era Sync R G B Signal Line CheckDSUB Replace R1146 or R1147 ok Check Mstar LVDS Output gt Replace Mstar IC101 or Main Board Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 7 HDMI Video Check input signal format Is it supported Check HDMI Cable conductors for damage or open conductor Check EDID amp EEPROM 10801 IC804 gt Replace the defective IC or re download EDID data 12 Signal HDMI1 HDMI2 No Check JK802 JK903 eJ Replace Jack Replace 1802 4804 8830 896 0802 gt Replace R835 R837 R862 R897 Q803 HDMI1 HDMI2 Check HDCP Key NVRAM IC103 Power amp 12 Signal Check HDMI Signal Check other set gt Replace Main Board If no problem check signal line Check Mstar LVDS Output Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 8 All Source Audio Off Check the TV Speaker Menu Menu gt Sound gt TV Speaker Toggle teuer No a gt Check Regulator IC404 20V Voltage is dependent on Model Check AMP IC IC501 Power 20V 3 3 1 8 26103
71. mper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges LGE Internal Use Only SPECIFICATION NOTE Specifications and others are subject to change without notice for improvement 1 Application range This specification is applied to the LCD TV used LT01B chassis 2 Requirement for Test Each part is tested as below without special appointment 1 Temperature 20 C 5 C 77 F 9 F CST 40 C 5 C 2 Relative Humidity 65 10 3 Power Voltage Standard input voltage AC 100 240 V 50 60 Hz Standard Voltage of each products is marked by models 4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM 5 The receiver must be operated for about 5 minutes prior to the adjustment 3 Test m
72. nt lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush LGE Internal Use Only IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and Solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board 3 Bend into a U shape the repla
73. other abnormality exists that must be corrected before the receiver is returned to the customer Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes Leakage Current Hot Check See below Figure Plug the AC cord directly into the AC outlet Do not use a line Isolation Transformer during this check Connect 1 5 K 10 watt resistor in parallel with a 0 15 uF capacitor between a known good earth ground Water Pipe Conduit etc and the exposed metallic parts Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms volt or more sensitivity Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part Any voltage measured must not exceed 0 75 volt RMS which is corresponds to 0 5 mA In case any measurement is out of the limits specified there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer Leakage Current Hot Check circuit AC Volt meter Good Earth Ground such as WATER PIPE CONDUIT etc L When 25A is impressed between Earth and 2nd Ground for 1 second Resistance must be less than 0 1 Q Base on Adjustment standard To Instrument s 0 15 uF exposed METALLIC PARTS lt 1 5 Kohm 10W LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda rea
74. oved to prevent potential shock reasons prior to applying power to the unit under test Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes 24 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as
75. r downloaded version is High USB data is automatically detecting 8 Show the message Copying files from memory 4 Updating is staring 5 After updating is complete The TV will restart automatically 6 If TV turns on check your updated version and Tool option refer to the next page about tool option If downloading version is higher than your TV have TV can lost all channel data In this case you have to channel recover If all channel data is cleared you didn t have a DTV ATV test on production line After downloading have to adjust Tool Option again 1 Push IN START key in service remote controller 2 Select Tool Option 1 and Push OK button 3 Punch in the number Each model has their number 3 1 ADC Process 1 ADC Enter Service Mode by pushing ADJ key Enter Internal ADC mode by pushing G key at 6 ADC Calibration CU c a i 1 4 1 aT Caution Using power on button of the Adj R C power TV ADC Calibration Protocol RS232 No CMD1 CMD2 Data0 Enter Adjust Mode A A 010 2 ADC Adjust A D 010 Model Tool optiont Tool option2 option3 Tool option4 Tool option5 32LD450 DA 16417 10774 52228 26892 32 37LD450 DA 20513 10774 52228 26892 32 42LD450 DA 24609
76. re 8 All source audio trouble shooting guide Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 11 AV Audio Check AV Cable for damage for damage or open conductor No Check JK3801 JK3302 Signal Line eplace Jac Follow procedure 8 All source audio trouble shooting guide 12 Component Audio Check Component Cable for damage or open conductor Check JK3801 amp Signal Line 2 Replace Jack Follow procedure 8 All source audio trouble shooting guide 13 RGB Audio Check Cable conductors for damage or open conductor No Check JK1102 8 Signal Line fev gt Replace Jack Follow procedure 8 All source audio trouble shooting guide Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only 14 EARPHONE Audio Check AV Cable for damage for damage or open conductor N amp Signal Line eplace Jac Follow procedure 8 All source audio trouble shooting guide Copyright 2010 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only LD350 Block Diagram RX gt 00000 RS232 P1101 RX NEC EEPROM _SCL SDA MICOM EEPROM M24C16 WMN6T 16Kbit 1C1001 SCL SDA CEC REMOTE USB Power 500mA S7 SIDE USB DP DM IC101 Only
77. s specified otherwise in this service manual lubrication of contacts in not required 5 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 6 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 7 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last 8 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be rem
78. wnload I 0 I Gvpp_opp_r I 2700 I I I PANEL_VCC ss 15 5 gt oe 500 I R660 OPT I I T m I 1 T 1 GIP 1 I D I 8655 I I 0 R661 I 1 I I RXD4 I 4 1 j 1 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION I LEVEL Shift Block I POWER Block 2607 I I I EN2 I I I I I I R632 I 8 I I 22982 8 I uhe g 8 824 I m I I THERMAL ET EVEN 1 2 R627 88836 EVEN EVEN I I m I 25802 I I uM MAX17119DS D WE I I I PANEL vec I 5 MAX171138TL a LK4 MINI_LVDS 524 I I I R629 R631 I ds 8 LK GIP 1 i our I I I VGH_FB I I R622 i x I Mi 8 83 I ud H 1 GCLE2 1 I TCON 42 60 I I GOE GCLK1_I CLKL I 2 I I I I I I I I 1 623 R624
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