4. Array course control
Contents
1. S E 851898 5 a 3 iid 9024 8 006597 L300 ax C328 mm 01 e SLED TP303 C302 C312 7150 o e C301 C313 o 1150 eo 8 E 7 0 302 915 C321 C303 0062 6155 TP300 d 20 R300 5 C500 9055 C309 C32 C304 9 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 2 Initial Initial Failure 0300 02 check the test point No Check the circuit related to reset Yes Check the 16bit data signal amp memory CE Yes END 9 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 00050 post TP206 NANDCEN DCLKN NAND CLE DDRCE EWP OEN MEMORY Large Block 1Gb NAND 512Mb DDRAM 2 c an J 504 zza QE E VP 223 227 TP220 ES C242 3 TP222 S E amp 218 5 5 z o 0040 C241 z za P218 E 9 4 SAMSUNG Proprietary Co2. lone mE 1103 lt 11 oom 1 9 TX x 5 6 esueno Rx Gsusstpoo mere l s rini Sa m lt ms 7 46 cus lt T 1120 9 23 Ri IbCspcs iN KEN las y cnc cu un 7 7 gt em 7 R107 out DCSJPCS OUT Hs d 22 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 7019 1105 C124 00 9 L101 L100 Q 1112 L109 1108 bd 9111 1117 lt L114 L113 ha 0 en C106 L118 C105 P at 5 00 107 108 _ 2 s 5 amp C101 g E 3 PAM10
3. 0923 B SR ered Sex rc 6 Ready 55230 4 5 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Array course control 5 Check the All Download amp Calset Click the Download Botton Downloader V5 51 ELY 5 0 Control MSMEB250 MSMEB 50A BRCM 133 MSMB275 MSMB280 MSMB290 C MSMB245 MSMB260 C 7200 1516410 Boot Change Full Download Master Rom Differences Only Boot re D2 5wS5230 DEV 0S WI3 R2 XXICBEWBOOTFILES CRCC Amss r i Tnm ram Apps 55230 Ds S5230_DEV_09_W13_R2_XxICBWapps_compressec 05380000 1 55230 D W WI3_R2_XXICBWAisrc_S5230_Open_Europe Commo 0 2400000 0 Rsrc2 55230 D3 95230 DEV 08 WT3 R2 XXICBWRsrc2 S5230 Low r 0 4400000 0 Factory FS v 55230 DW 2 XXICBWFactoryFs S5230 Open Europe Common 0 4200000 gp __ 6 Confirm the downloaded version name and etc 1234 Full Reset 0206 3855 4 6 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 10 Reference data 10 1 Referen
4. GSM TELEPHONE GT S5230 SERVICE GSM TELEPHONE CONTENTS 1 Safety Precautions Specification Product Function Array course control Exploded View and Parts list MAIN Electrical Parts List DU HA Gm oce dee ge Disassembly and Assembly Instructions 8 Block Diagrams 9 PCB Diagrams 10 Chart of Troubleshooting 11 Reference data SAMSUNG ELECTRONICS GSPN Global Service Partner Network Country Web Site North America service samsungportal com Latin America latin samsungportal com CIS cis samsungportal com Europe europe samsungportal com China china samsungportal com Asia asia samsungportal com Mideast amp Africa mea samsungportal com This Service Manual is a property of Samsung Electronics Co Ltd c Samsung Electronics Co Ltd Any unauthorized use of Manual can be punished under applicable International and or domestic law 2009 04 Rev 1 0 5 Exploded View and Parts List 5 1 Cellular phone Exploded View QLCO1 QLCOS3 1 QMO01 QSH01 1 0 01 1 TNE QSH02 QCR60 QVo01 QRE01 QCR91 5 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 2 Specification 2 1 GSM General Specification
5. Baud o21K Main Menu D Wzo0s i Woos SE SE Se Woos cr sasio avitaywo INFO 1 spul suu s c Rer All Download Calset Filename File Size Checksum How to use Download Mode 1 Turn off the target phone 2 Select COM Port USB or UART Baud Rate 3 Push the Start Button 4 Turn on the target phone 3 Execute the Downloader V5 51 ELY x 0 When Complete DL Bootloader Click the Port Search button 4 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Array course control Downloader 5 51 ELY 5 0 r Control MSM6250 MSM6250A C BRCM2133 MSMB275 MSMEB280 MSMB290 6245 260 C 7200 LSI6410 Boot Change Full Download Master Rom Differences Only E Amss r lip c gel Rsrcl Rsrc2 Factory FS 7 Toi rota r Is Port Search Download Ready 55230 4 Check the Full Download and Select the file s what you want to download click Boot to select a Boot folder drag in Bin Rc1 Rc2 Ffs files Click calset to select a Calset folder 4 4 SAMSUNG Proprietary Conten
6. s 2 o 2 fins 1011 60 25 9 24 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 18 Bluetooth part Bluetooth connection disable Yes Check BT function ON Enable BT function No Check the voltage of U300 is around 3 0V Check U300 and change Yes Check 26KHz Clock on BT100 J5 Check OSC116 Check the assembled status of ANT100 Resolder of change ANT100 Check UCP200 Yes END 9 25 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 2 2 L126 5 x C119 9055 8050 EC 20181 90131 104 N 8 5 5 N E o 3 0V_DIG C108 cut 1 8 MEM 3 0V DIG ANT100 1129 1 112 L123 L128 C126 1 C122 cus 85 BT WAKE TP103 2 BT WAKE GPIO 0 Fac HOST WAKES BT WAKE PCM CLK ua HOST WAKE GPIO 1 HES HOST WAKE PCM IN m BT_PRIORITY TX_REZ GPIO3 3 0V_DIG PCM_OUT TP Chops WLAN_ACTIVITYITX_CONFIRM GPIO_2 FE PCM SYNC PCM SYNC STATUS GPIO_4 FE m XTAL_PD GPIOSTX_PU_TDD 28 gt cLk 18 SCLITX
7. 2007 007528 R CHIP RK73H1ETP1501F R201 R202 2007 007981 R CHIP ERJ2RKF 1803X R305 2007 008275 R CHIP MCRO1MZP5F303 R203 2007 008401 R CHIP RC1005F754CS R302 2007 010071 R CHIP MCR10EZHFLR100 C179 C235 2203 000233 C CERAMIC CHIP GRP1555C1H101J C152 C157 C159 C315 2203 000254 C CERAMIC CHIP GRP 155R71C103K C340 2203 000254 C CERAMIC CHIP GRP 155R71C103K C151 C158 2203 000278 C CERAMIC CHIP GRP 1555C1H100D C143 C148 C149 C153 2203 000386 C CERAMIC CHIP GRP 1555C1H150J C154 C165 C167 C170 2203 000386 C CERAMIC CHIP GRP 1555C1H150J C124 C218 C316 C317 2203 000425 C CERAMIC CHIP GRP 1555C1H180J C130 C155 C168 C233 2203 000438 C CERAMIC CHIP GRP 155R71H102K C166 2203 000466 C CERAMIC CHIP GRP 1555C1H1RO0C C338 C342 2203 000489 C CERAMIC CHIP GRP 155R71H222K C227 2203 000679 C CERAMIC CHIP GRP 1555C1H270J C116 C122 C127 C142 2203 000812 C CERAMIC CHIP GRP 1555C1H330J C161 2203 000812 C CERAMIC CHIP GRP 1555C1H330J C232 2203 000854 C CERAMIC CHIP GRP 1555C1H390J C204 C215 C229 2203 000995 C CERAMIC CHIP GRP 1555C1H470J C146 C147 2203 001072 C CERAMIC CHIP GRP 1555C1H560JD01E C223 2203 001 101 C CERAMIC CHIP GRP 155R71E682KA01E 6 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List C178 C180 2
8. 0 01 QCK02 QCR101 QCR91 QFRO1 QIFO1 1 QLBO1 QLCO1 QLC03 QMOO01 1 2 1 05 01 QSH02 05 01 QVKO1 Qvooi Description INTENNA MAIN GT S5230 INTENNA BT GT S5230 ASSY COVER BATTERY EU ASSY CAMERA 3M MODULE GT S5230 CBF COAXIAL CABLE SCH W450 PMO KEY CAMERA EVA PMO KEY HOLD SCREW MACHINE SCREW MACHINE ASSY CASE FRONT PMO COVER IF ASSY KEYPAD EU SWEET PINK ASSY BRACKET LCD ELA MODULE 3 0 WQVGA GT S5230 TFT ASSY ASSY ETC LCD FPCB GT S5230 TOUCH PANEL GT_S5230 EU S PNK MOTOR DC SCHC250 A S ASSY PBA MAIN GT S5230 SVC KEY FPCB SUB KEY PBA GT S5230 ASSY CASE REAR ASSY COVER SHIELD CAN TOP ICT SHIELD CAN BTM MODULE SPEAKER GT S5230 KEY FPCB VOLUME KEY GT S5230 PMO KEY VOLUME SEC CODE GH42 02003A GH42 02041A GH98 13721C GH96 03801A GH39 01027A GH72 54573A GH72 54583C 6001 002005 6001 002260 GH98 11970C GH72 54582C GH98 11972C GH98 12528A GH96 03865A GH59 07300A GH59 07302C GH31 00323A GH82 03617A GH59 07301A GH98 11971C GH98 13258A GH70 04837A GH59 07536A GH59 07298A GH72 54584C
9. GSM900 GSM850 DCS1800 Phase 1 Phase 1 Phase 1 1300 Freq Band MHz 880 915 824 2 848 8 1710 1785 1850 1910 925 960 869 2 893 8 1805 1880 1930 1990 Uplink Downlink 0 124 amp 975 1023 128 251 512 885 512 810 Tx Rx spacing 45MHz 45MHz 95MHz 80MHz Mod Bit rate 270 833kbps 270 833kbps 270 833kbps 270 833kbps Bit Period 3 692us 3 692us 3 692us 3 692us 576 9 576 9us 576 9us 576 9us Period 4 615ms 4 615ms 4 615ms 4 615ms Modulation 0 3GMSK 0 3GMSK 0 3GMSK 0 3GMSK MS Power 33dBm 5dBm 33dBm 5dBm 30dBm 0dBm 30dBm 0dBm Power Class 5pcl 19pcl 5 19pcl Opcl 15pcl Opcl 15pcl Sensitivity 102dBm 102dBm 100dBm 100dBm TDMA Mux 8 8 8 8 Cell Radius 35Km 35Km 2Km 2 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Specliflcation 2 2 GSM Tx Power Class TX Power GSM850 TX Power TX Power control level GSM900 control level DESEE control level 525490 5 33 3 0 30 3 0 30 3 6 31 3 1 28 3 1 28 3 7 29 3 2 26 3 dBm 2 26 3 dBm 8 2713 dBm 3 24 3 dBm 3 24 3 dBm 9 25 3 dBm 4 22 3 dBm 4 22 3 dBm 10 233 dBm 5 20 3 dBm 5 20 3 dBm 11 2143 dBm 6 18 3 dBm 6 18 3 dBm 12 19 3 dBm 7 16 3 dBm 7 16 3 dBm 13 17 3 dBm 8 14 3
10. 16 L gt 30dBm Check ANT Switch control circuit Yes 8 Change or Resolder 0100 No Resolder or Change C117 C119 No PAM100 pin13 gt 30dBm Yes PAM100 pin5 Check PAM100 pin gt 4dBm 1 2 3 20 VBAT OK or Change PAM100 k VBAT of PAM C control signal Resolde Che Check UCP200 9 21 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 15 DCS PCS Transmitter TX ON 5Level No Resolder 0100 L105 C116 U100 17 gt 65dBm Yes No Check ANT Switch control circuit Check U100 10 H 2 6V 16 L Change or Resolder U100 3 Resolder or Change C124 C125 C126 U100 pin11 No gt 30dBm Yes PAM100 pin15 gt 30dBm Check 100 1 2 VBAL OKS Resolder or Change PAM100 Yes Check VBAT or PAM control signal PAM100 pin3 gt 4dBm No Check UCP200 9 22 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 4 m
11. D Tx Q 4 1059 VR SLED TP303 c302 312 C301 C313 E 2 Leo e S ix c 320 P302 910 C321 C303 0055 610 Q P300 o i 1269 R300 81 9 S g s TP400 C309 2024 C304 9 6 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 4 Sim Part Phone can t access SIM Card Check the SIMVCC 3 0V Check the circuit related to R316 C172 resolder or change CD100 Yes Check the circuit around CD100 input circuitry Yes END Check the related circuit of CD100 9 7 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting SIMVCC SIMRST SIMCLK SIM300 UL UL SIM CONNECTOR 9555 LEED C102 C423 B R222 C335 C334 C333 O0 INIS 9 8 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 5 Microphone Part Microphone does not work Yes No Check the connection Resolder MIC from MIC Check Check the circuit related to R142 Check the circuit Check the path from Ma
12. GRM155R60J105KE19D C347 C348 C349 C350 2203 006399 C CERAMIC CHIP GRM155R60J105KE19D C351 2203 006399 C CERAMIC CHIP GRM155R60J105KE19D C300 C301 C303 C312 2203 006562 05 5 105 10 C314 C323 2203 006562 05 5 105 10 150 164 203 205 2203 006872 C CERAMIC CHIP GRM 155R60J225ME 15D C219 C220 C222 C224 2203 006872 C CERAMIC CHIP GRM155R60J225ME 15D C307 C308 C319 C321 2203 006872 C CERAMIC CHIP GRM 155R60J225ME 15D C322 C324 C325 C326 2203 006872 C CERAMIC CHIP GRM 155R60J225ME 15D C329 C332 C333 C352 2203 006872 C CERAMIC CHIP GRM155R60J225ME 15D C327 C330 2203 006890 C CERAMIC CHIP CV105X5R106MO6AT TA301 2404 001339 C TA CHIP TEESVJ1A475M8R TA102 2404 001377 C TA CHIP F980J226MMA TA100 TA101 TA300 2404 001381 C TA CHIP F981A106MMA TA302 2404 001430 C TA CHIP TCSHL1A106MRAR 6 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List L109 L 113 2703 001729 INDUCTOR SMD LL1005 FH1N8S L119 L123 2703 001748 INDUCTOR SMD LL1005 FH5N6S L132 L133 2703 002201 INDUCTOR SMD CIHOST33NJNC C112 L104 L 107 2703 002203 IN
13. dBm 8 14 3 dBm 14 15 3 dBm 9 12 4 dBm 9 12 4 dBm 15 1343 dBm 10 10 4 dBm 10 10 4 dBm 16 11 5 dBm 11 8 4dBm 11 8 4dBm 17 9 5 dBm 12 6 4 dBm 12 6 4 dBm 18 7 5 dBm 13 4 4 dBm 13 4 4 dBm 19 5 5 dBm 14 2 5 dBm 14 2 5 dBm 15 0 5 dBm 15 0 5 dBm 2 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 2 3 GSM EDGE TX power class Only in Master TX Power 51800 PCS1900 control level control level control level 8 2713 dBm 2 26 3 dBm 2 26 3 dBm 9 2543 dBm 3 24 3 dBm 3 24 3 dBm 10 2343 dBm 4 22 3 dBm 4 22 3 dBm 11 21 3 dBm 5 20 3 dBm 5 20 3 dBm 12 19 3 dBm 6 18 3 dBm 6 18 3 dBm 13 17 3 dBm 7 16 3 dBm 7 16 3 dBm 14 15 3 dBm 8 12 3 dBm 8 12 3 dBm 15 133 dBm 9 10 3 dBm 9 10 3 dBm 16 11 5 dBm 10 1443 dBm 10 14 3 dBm 17 9 5 dBm 11 12 4 dBm 11 12 4 dBm 18 7 5 dBm 12 10 4 dBm 12 10 4 dBm 19 5 5 dBm 13 8 4dBm 13 8 44 14 6 4 dBm 14 6 4 dBm 15 4 4 15 4 4 2 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 3 Operation Instruction and Installation Main Function 3 2 Mega Pixel Camera 3 0 WQVGA 262K TFT TOUCH SCREEN TOUCH WIZ Full Touch UI BlueTooth V2 1 EDR USB 2 0 SMS MMS EMS OMA v1 2 MP3 AMR AAC AAC e
14. 0 R208 EN C310 J 200 w c Re 001241 NY 139 C153 TRIES 3E C148 a zlalala m 1 5 3 21375 gt Z w ae C143 R139 5 olo 2 Q2 R142 C174 R132 C178 C180 1128 8 ne aiii Gic 1 8 ge 2 2 6124 o amp S p ES Uu E n CAR 2 5 5 zi S 88 zig amp 104 rz 6 9 ger ange Se eR wun ON p SC105 a 0022 C235 R222 a 5 C226 1201 a R203 C207 E Q C229 C217 Q 5 R219 S S B U311 R206 91 R207 C214 518 215 C216 8 C236 g C208 231 SIS 162 R209 155 0 2 C16 E 915 515 I M RH2 qois E mo Ala E 2 9 R123 Ru 5 Se 5 craz 2161 SC109 UJ I LE SC101 SC107 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization This Document can not be used without Samsung s authorization 5 2 Cellular phone Parts list GT SS230DIAXEZ Design LOC QANO2 QCA01 0 01
15. 203 001153 C CERAMIC CHIP GRP 1555C1H680J C128 2203 001221 C CERAMIC CHIP GRP 155R71H821KD01E C119 2203 002668 C CERAMIC CHIP C1005CG1HORSBT C343 C344 2203 003054 C CERAMIC CHIP GRP1555C1H9ROC C117 2203 005056 C CERAMIC CHIP GRP1555C1H6R8CZ01E R112 2203 005288 C CERAMIC CHIP GRP1555C1H1ROBZ01E C132 2203 005344 C CERAMIC CHIP GRM155R71E223KA61D C123 C144 C160 C163 2203 005482 C CERAMIC CHIP GRP 155R61A104KA01E C171 C226 C236 2203 005482 C CERAMIC CHIP GRP 155R61A104KA01E C131 C133 C174 C201 2203 006048 C CERAMIC CHIP GRM155R71A104K C202 C207 C209 C210 2203 006048 C CERAMIC CHIP GRM155R71A104K C211 C212 C213 C216 2203 006048 C CERAMIC CHIP GRM155R71A104K C336 2203 006048 C CERAMIC CHIP GRM155R71A104K C162 C320 C334 2203 006208 C CERAMIC CHIP CM105X5R475MO6AT C134 C135 C136 C137 2203 006260 C CERAMIC CHIP GRM 155R61A224KE19E C139 C140 2203 006260 C CERAMIC CHIP GRM 155R61A224KE19E C304 2203 006324 C CERAMIC CHIP GRM 188R61A225KE19D C310 2203 006348 C CERAMIC CHIP CV105X5R105K25AT C138 C141 C145 C172 2203 006399 C CERAMIC CHIP GRM155R60J105KE19D C175 C206 C208 C214 2203 006399 C CERAMIC CHIP GRM155R60J105KE19D C217 C230 C231 C305 2203 006399 C CERAMIC CHIP GRM155R60J105KE19D C309 C311 C313 C328 2203 006399 C CERAMIC CHIP GRM155R60J105KE19D C339 C341 C345 C346 2203 006399 C CERAMIC CHIP
16. 4 R400 5 5 5 ss 5 ej sie 5 5 Rel lR 8 052 C502 5 sosa c PAM400 5 85 N ello 38 8 8 8 s s sie 29 js 5 8 5 8 8 6559 5 S 5 C413 g g 3 C414 9 12 3 SPK_N SPK_P EARSPK_R EARSPK_L SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 7 Key Data Input Check Initial Operation When one of the keys is No pushed Check the Dome sheet amp Key Pad is it displayed on LCD Yes When one of the keys is No pushed Replace the Key PBA KBIO signal is OK Yes END 3 2V KEY LIGHT 22 alt 1 Mic IN P i 4 3 3 Mic IN N KEY R505 1 5 2 KEY lt E 57 PONKEY KEY 2 KEY_COL 0 R506 js KEY ROW 1 34 12 1 KEY COL 1 KEY KEY ROW 2 36 14 13 15 KEY COL 2 KEY ROW 3 16 18 aT KEY COL 3 4 KEY ROW 4 20 T KEY COL 4 4 0502 H 4 4 os 6 EH A BABAR A D503 D500 E gt VOLUME KEY KEY CONNECTOR 9 13 SAMSUNG Proprietary Contents may change withou
17. 40 R CHIP RC1005J102CS R204 R205 2007 000141 R CHIP RC1005J222CS R208 R313 R314 2007 000143 R CHIP RC1005J472CS R128 R209 R211 R212 2007 000144 R CHIP RC1005J512CS R213 2007 000144 R CHIP RC1005J512CS R138 2007 000151 R CHIP RC1005J153CS R126 R127 R129 R130 2007 000157 R CHIP RC1005J473CS R121 R122 R132 R140 2007 000162 R CHIP RC1005J104CS R142 R223 R301 2007 000162 R CHIP RC1005J104CS R124 2007 000165 R CHIP RC1005J204CS R109 R115 R117 2007 000171 R CHIP WR0402X000JT R137 2007 000172 R CHIP RC1005J100CS 6 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Main Electrical Parts List R111 2007 001301 R CHIP MCRO1MZP5J680 R219 U311 2007 001319 R CHIP RC1005J122CS R136 2007 001333 R CHIP MCRO1MZP5J183 R125 R131 2007 002796 R CHIP MCRO1MZP5J51 1 R118 R119 2007 003010 R CHIP RC1005J200CS R206 2007 003014 R CHIP TSR16GJ244V R105 2007 003018 R CHIP RMC16S 430J TP R304 2007 007100 R CHIP RK73K1ETP106J R306 R312 2007 007107 R CHIP RC1005F1003CS R310 R311 2007 007 156 R CHIP RC1005J1ROCS R114 R116 2007 007189 R CHIP TSR16GJ9R1V R200 2007 007193 R CHIP TSR16GJ5R1V R217 2007 007312 R CHIP MCRO1MZP5F2002 R222 2007 007315 R CHIP MCRO1MZP5F3901 R308 R309 2007 007489 R CHIP RK73H1ETP1503F R123 R133 R134 R143
18. AAC WMA Quad Band EGSM900 DCS PCS EDGE MicroSD Card Support External Memory FM Radio Support Radio Data System Full Internet Browsing Accelerometer rotation Face Detection amp Smile Shot 3 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 4 Array course control 4 1 Software Adjustments On Off Solution Function Test Jig GH99 36900A Test Cable GH39 01160A RF Test Cable GH39 00985A Adapter GH99 38251A 4 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Array course control 4 2 Software Downloading 4 2 1 Pre requsite for Downloading e Downloader Program BCM213x1 Downloader v0 xx D Downloader Program Downloader V5 51 ELY x 0 GT S5230 Mobile Phone Data Cable BOOT file BIN file RC1 file RC2 file FFS file Calset file 4 2 2 S W Downloader Program Load the binary download program by executing the BCM213x1 Downloader v0 xx C 1 Select the connected serial port and the rate of speed 2 Select the check box Connect cable to phone after Click DL Bootloader Button 4 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Array course control B Disconnected BCM213X1 Downloader v0 77 C fX Configuration COM m
19. DUCTOR SMD CIHOST15NJNC C118 2703 002204 INDUCTOR SMD CIHO5T22NJNC L115 L117 2703 002206 INDUCTOR SMD CIHOST39NJNC L103 L108 L110 L112 2703 002208 INDUCTOR SMD CIHOST2N2SNC L101 2703 002267 INDUCTOR SMD CIHOSTAN7SNC L105 2703 002314 INDUCTOR SMD CIHOST47NJNC L120 L122 2703 002551 INDUCTOR SMD LQW15AN33NHO0D L114 L118 2703 003145 INDUCTOR SMD LQW15AN5N1B00D L134 2703 003476 INDUCTOR SMD LQG15HSR27J02D L300 L301 2703 003545 INDUCTOR SMD LQM2MPN2R2NGO OSC300 2801 004373 CRYSTAL UNIT CC7V T1A OSC200 2801 004815 CRYSTAL UNIT FCX05 LFHF F301 F302 F303 2901 001451 FILTER EMI SMD ICVE10054E250R500FR F101 2901 001544 FILTER EMI SMD AMLV 14S 03Q 012 300F F100 2909 001312 FILTER DUPLEXER LCB10B2450K3 U100 2911 000123 FILTER LMSP43NA 794 L125 L126 3301 001438 CORE FERRITE BEAD BLM15BB750SN1D L136 L200 L201 3301 001659 CORE FERRITE BEAD BLM15AG601SN1 L127 L129 3301 001729 CORE FERRITE BEAD BLM15AG102SN1D L302 L303 3301 001756 CORE FERRITE BEAD BLM15HG102SN1D L128 L131 3301 001812 CORE FERRITE BEAD BLM15HD102SN1 L124 3301 001970 CORE FERRITE BEAD BLM15BA330SN1 RFS100 3705 001448 CONNECTOR COAXIAL 20369 001E RFS101 3705 001503 CONNECTOR COAXIAL KMS 560 CN300 3708 002211 CONNECTOR FPC FFC PIC FF 12 21A R12BN D3 CD100 3709 001465 CONNECTOR CARD EDGE NDTF 6S8M 311 IFC100 3710 002681 CONNECTOR SOCKET HY20 AB0360 HEA301 3711 006028 CONNECTOR HEADER 14 5805 040 000 829 BTC300 3711 006924 CONNECTOR HEADER 2005 03 242 BAT300 4302 001 181 BATTERY ML414RU2 TT36
20. PU _ 6 jiy SDA TX GPIO7 RMO lt RIM VREGI HUSB DN es pe TM2 RFION RFIOP 24 UBRTS MS uART RTSN xu LE 72 Ker UBTX Bg _ 8 T 2 RETUNE 8 E BT RESET LPOIN CLK BT PWR X z Ts P E BT PWR ON VCTRIFP 121 R112 9 26 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 7 Block Diagrams BB amp RF PART ONE CHIP MODULE LCD AM LCD Camera Module 10 400 240 WQVGA 3 0 3M 16M Color TFT LSI Sensor 1 4 Memory SEC NAND 2Gbit DDRAM 1 Gbit BCM21332 12X12mm FBGA Audio AMP mes Headset GSM GPRS EDGE Class33 Headset Integrated RF Transceiver External 10 Interface 9 208 2 USB 2 0 1 USB2 0 480Mbps UARTS 3 6Mbps Bluetooth BCM2046 SIM Card V2 0 EDR 1 8V 3 0V Support 3 2M camera H 263 H264 WMV9 MPEG4 FM Radio 514705 125 IF RDS LARGE BLOCK MP3 AAC AAC eAAC WMA 64 Poly MIDI SPK AMP 400m W HEADSET AMP 100mW T Flash Card 4Bit RF Block SKY77344 PAM LMSP43NA 794 FEM INTENNA TSP Touch Screen Panel 12S SPI PCM USIM Interface Touch IC TSC2007 Volume Key PMU BCM59035 15ch LDO 2ch Step down DC DC I2C Interface TC Charge
21. S e e 8 2 4622 9024 R205 400 9 10 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 6 Speaker Part Melody Speaker does not work Is the terminal of speaker OK Check the SPK P SPK N HIGH Check the output circuit of U103 Audio AMP Yes Is speaker OK END 9 11 check the specker No Resolder SPK P R117 amp SPK N R115 Change or resolder around U103 Change speaker SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting VBAT 400 R400 5401 VV AAA C402 R402 AMP 71 INA _ INA2 HPL AAA C404 2 4 EAR L INB1 1005 C405 EAR RSS iNB2 s FM LouT SS 406 10 E FM ROUT ten Cao OV B2 pias E 3005 B3 2 gt SDA C408 SCL C409 C410 12 C41
22. TP1 6 4 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 9 Flow Chart of Troubleshooting 9 1 Power On Power does not work Yes No Check the current consumption gt Download again more than 100mA Check the VBAT more than 3 3V Check the Battery No C300 VBAT 3 0V e Check the related circuit Check the MEM_1 8V of U300 is more than 1 8V 4 8V Check the U300 Check U300 3 0 DIG 3 0V 3 0V_ANLG 3 0V heck the U300 and C352 C319 C333 1 2 1 2V Check CLK32K Freq 32KHz heck the clock 32KHz_DIGIT Check the initial operation Yes END 9 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting p ET gt ustorG vem gt e 5 E 4 p vue E ls mde Pix ms p pue reser 90 resen p savce Ite emn version e f E HA Fe Er 2
23. ce Abbreviate AAC Advanced Audio Coding Advanced Video Coding BER Bit Error Rate BPSK Binary Phase Shift Keying CA Conditional Access CDM Code Division Multiplexing Carrier to Interference DMB Digital Multimedia Broadcasting EN European Standard ES Elementary Stream ETSI European Telecommunications Standards Institute MPEG Moving Picture Experts Group PN Pseudo random Noise PS Pilot Symbol QPSK Quadrature Phase Shift Keying RS Reed Solomon SI Service Information TDM Time Division Multiplexing 15 Transport Stream 10 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 1 Safety Precautions 1 1 Repair Precaution Repair in Shield Box during detailed tuning Take specially care of tuning or test because specipicty of cellular phone is sensitive for surrounding interference RF noise Be careful to use a kind of magnetic object or tool because performance of parts is damaged by the influence of manetic force Surely use a standard screwdriver when you disassemble this product otherwise screw will be worn away Use a thicken twisted wire when you measure level A thicken twisted wire has low resistance therefore error of measurement is few Repair after separate Test Pack and Set because for short danger for example an overcurrent and furious flames of parts etc when you repair b
24. es Check UCP200 END 9 16 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 11 DCS Receiver RX ON Cell Power 60dBm No Resolder 0100 L105 C116 0100 17 gt 65dBm Yes U100 VCV1 VC2 2 68dBm No Check ANT Switch control circuit No Check U100 10 16 L Resolder 0100 Yes Resolder L109 L113 L110 L112 No 0100 13 gt 70dBm 5 6 2 70dBm Yes Check UCP200 9 17 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 12 PCS Receiver RX ON Cell Power 60dBm 0100 17 gt 65dBm Yes U100 VC1 VC2 gt 68dBm D No Resolder 0100 L105 C116 No Check ANT Switch control circuit No Check U100 10 16 L Resolder 0100 Yes 3 Resolder L106 L103 L108 No U100 pin 13 gt 70dBm pin 5 6 70dBm Check UCP200 END 9 18 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s autho
25. hey are prevented from static electricity You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board 1 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 6 MAIN Electrical Parts List SEC CODE Design LOC Description D301 0403 001749 DIODE ZENER PZU5 6B 20101 20102 20103 0404 001504 DIODE SCHOTTKY JDH2SO1FS ZD104 0404 001504 DIODE SCHOTTKY JDH2SO1FS D100 0406 001286 DIODE TVS PESD5VOLSUV D101 D102 D303 D304 0406 001288 DIODE TVS PESD5VOS1UL ZD301 ZD302 0406 001288 DIODE TVS PESD5VOS1UL Q300 0502 001322 TR POWER PBSS301PD U304 0801 003026 IC NC7WZ86L8X U200 0801 003130 IC NC7SV17L6X UME200 1108 000269 MEMORY K522H1HACA A060 0305 1201 002494 TPA6201A1DRBR PAM100 1201 002773 IC SKY77344 U103 1201 002864 IC MAX9877AERP T U301 1203 004604 IC AAT3169IFO U303 1203 005485 IC MIC5365 3 0YMT U300 1203 005562 IC BCM59035C1IFB5G U302 1203 005580 IC MIC5365 1 8YMT U104 1204 003026 IC S14709 B GMR U307 1205 003288 IC TSC2007IYZGR U106 1205 003754 IC BCM2070BOKUBXG UCP200 1205 003760 IC BCM21332IFBG U306 1209 001817 IC BMA020 VR200 1404 001221 THERMISTOR NCP15WB473J04RC R210 R307 2007 000138 R CHIP RC1005J101CS R113 R207 2007 0001
26. in IC to MIC from UCP200 to MIC Replace the MIC Yes 9 9 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting C423 FM VBAT 3 0V_DIG 1005 gt A R407 20400 IFC400 il 22 3 3 n 4 sE 1404 Y Y BLMISHDI02SNi KEARSPK R um H Ratt 3 AAA T T Laos 1 25 1 8 H P AA SE lt EARSPK L 10 9 u 12 5 5432 3 0V_DIG 4 if 15 16 1 lt Or R413 18 S AAA g EAR_SWITCH 19 18 20 20 1 2 _ gt UARTA J 5 24 gt 1 i UARTA gt _ _ TP400 26 I 2 Acc DET Nc 2L X UARTA TX J 3 7 lt UARTA SS BARES 4 8 TA402 ERE 3 0V_DIG 10 9 R414 B F400 JACK IN 5 o g N 8 8 amp z 9 2 s
27. ntents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 3 Charging Part Abnormal charging part Yes Check the circuit related to V EXT CHARGE Check the circuit related to AUX ON signal Check the U300 pin H11 No gt 5 0V TP304 pin ACC_DET No gt L Yes Check the U300 pin K11 No 1 25V 9 5 Resolder or replace 0300 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting gt E ussoro KK Ponkev lt pru pom sx s im ass wenn H a D a 03 E 92 pesen vsu gt gt cone mm E conse i EH Ft gt uour L2 pd 1 ER zu i Er ZEE 2 S 2 8188 5 gt C345 C310 m Lezo to 9024 lo o a a 8 0095 8 L300 R205 9260 C328
28. oard in condition of connecting Test Pack and tuning on Take specially care of soldering because Land of PCB is small and weak in heat Surely tune on off while using AC power plug because a repair of battery charger is dangerous when tuning ON OFF PBA and Connector after disassembing charger Don t use as you pleases after change other material than replacement registered on SEC System Otherwise engineer in charge isn t charged with problem that you don t keep this rules 1 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Safety Precautions 1 2 ESD Electrostatically Sensitive Devices Precaution Several semiconductor may be damaged easilly by static electricity Such parts are called by ESD Electrostatically Sensitive Devices for example IC BGA chip etc Read Precaution below You can prevent from ESD damage by static electricity Remove static electricity remained your body before you touch semiconductor or parts with semiconductor There are ways that you touch an earthed place or wear static electricity prevention string on wrist Use earthed soldering steel when you connect or disconnect ESD Use soldering removing tool to break static electricity otherwise ESD will be damaged by static electricity Don t unpack until you set up ESD on product Because most of ESD are packed by box and aluminum plate to have conductive power t
29. r USB TA 7 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 8 PCB Diagrams 8 1 Top 101533 90 0 R121 C152 BAT300 LNV 18 8 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization PCB Diagrams 8 2 Bottom C348 GG 50100 gota B EH C327 O Q Oscao 8 r Co 6 gt C352 c C329 mm 6321 C333 C323 C308 C322 C325 C324 315 vadit C309 Q 8 89 s R302 ET S a o g 8 D ia 4108 R202 R201 C23
30. rization Flow Chart of Troubleshooting 9 13 GSM850 Receiver RX ON Cell Power 60dBm 0100 17 gt 65dBm Yes U100 VC1 VC2 gt 68dBm D No Resolder 0100 L105 C116 No Check ANT Switch control circuit No Check U100 10 16 L Resolder 0100 Yes A 3 No Resolder L119 L123 L120 C126 U100 pin 13 2 70dBm pin 5 6 70dBm Check UCP200 END 9 19 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting GSM900RX A GSM850RX_B lt GSMB50RX A lt L118 L120 RFS100 GSM1800 1900 TX GSM850 900 TX ANT FEM 7018 E 5 8 8 42 LL 84 TP107 TP108 5 2 ad C101 8 m o 8 25 100 8 R103 4011 0195 9 20 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 14 GSM850 900 Transmitter TX ON 5Level 0100 Pin172 No Resolder 0100 1105 C116 65dBm Check U100 Yes U100 pin13 10 2 6V
31. t notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 8 Camera part Camera function does not work Yes Check the Camera Reconnect the camera module connector on PBA Is there another problem Replace the camera module 9 14 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 9 Radio part Radio does not work Yes Resolder C142 and Check PMU part Yes No Resolder L134 C130 When U104 operate and check U104 L134 C130 is OK Check signal related to U104 gt gt lt 125 ssck GPO2 INT 3 0V_DIG C104 CLK32K gt gt FM RADIO 9 15 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization Flow Chart of Troubleshooting 9 10 GSM Receiver RX ON Cell Power 60dBm 0100 17 gt 65dBm No Resolder 0100 L105 C116 Yes 0 Check ANT Switch Check MODULE 100 control circuit 10 16 L 0100 VC1 VC2 z 68dBm Resolder U100 No Resolder L114 L116 L118 U100 pin 13 70dBm pin 5 6 70dBm Y
32. ts may change without notice This Document can not be used without Samsung s authorization Array course control Downloader V5 51 ELY 5 0 C MSMB 250 MSMB 50A C BRCM2133 MSM6275 MSME6280 MSMB290 C MSMB245 MSMB260 MSMT200A 1516410 Select Boot Folder Boot Change 19 Full Download Master Rom Differences D WMODELWG T S5230WHHO Lei WCB 0323 WS5230_DEV_0 Boot r a x ie 0323 a mss r 2 5230_DEV_09_W13_R2_x gt ae r FE icy BOOTFILES CALSET Rsrcl r CDdL0324 a ELY TEST 4 0 SAMSUNG BO TEET amp 3 Gcr 1 Factory FS r an a Fem r CalSet r 14 SSS Port Search Download Ready 55230 Downloader V5 51 ELY 5 0 Control C 5 250 5 250 C 6275 6280 290 MSMEB245 MSMEB 260 C MSMT200A C 1516410 a LITE C 2133 Change Full Download Master Rom Differences Only Boot re WS5230 DEV 09 WIS_RZ_XNICBWEOOTFILES DDR CRC Amss Jr nes cmm tss 55230 DW eum ma ecd E TH E amp E TAD E88 Q 2 a Gea Er Factory FS 55230 D D WMODELNWGT S5230wHEOI L4 BIA CB 0323 55230 DEV 09 W13 R2 XXICB E 05 Fo a Tune Jr 2 CalSet 55230
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