Samsung SGH-X450 service manual
Contents
1. RST NC C18 el S ke R201 R202 5 _ wi 5 S zi em z 213 0501 500 E 00 5 lt gt 1 C ci 8 209 als elol le 211 78 6318 ez 313 EA ea 55 208 C 2 1218 8708 1211 oa 207 8 1217 5 5 NC13 S 8 c210 gt gt 1214 e R307 8505 C310 S C206 Tex ae aS gt 301 EEEE 8 5 B X 6221 a 420 021 Rou PES 5 WE SI 8508 lt 004 71008 2 R306 c 1007 2 lor 01059 81006781012 01023 ale J 100 U100 Um gie z 216 GND BUS 0 R813 C300 S 6514 R503 0513 8 to am a 8 8 006 102. wee SASASABASASASASA 5S 02 0 R1022 v1006 utoot 100K AVLC 5 02 0 lt ul to R1001 10 10 1 214 AOUTAP 9 9 A vs 1 34 1 SPKIP lt 9 2 NO1 2 AOUTAN Sio com gt SPKIN 25 24 23 22 21 20 19 18 17 _5 1 7 c2 4 AUDIO_AMP_EN 2299592592 6 5 26 e e 16 GND NC1 YMU SPKN 01 4 a mss 27 8 8 15 1007 062031 DO lt Do 8 8 sm 4 Lco R108 100NF V1008 CP 28 n uon AVLC 55 02 00 2 us 1000 1025 lt ics YMU762C QZE2 EQ 150PF 47K 30 12 lt d E 100NF 1 n 1003 Ri02 ZD701 of 10K IRD HPOUT 22NF 56K cin 32 HPOUT LMOB 10 10UF 3 4 1 10V 9 co C1033 2 C1005 C1028 aniy NC 100PF 100 8 1 9 a LJL 4 5 4 CLK13M_YMU 220PF mios C1008 C1007 10K C080D 8PF 50 YMU_LB pus 100 gt a f YMU_IFQ VV m T 4 MIC SCHX110 xz R1024 1011 22K Seer R1026 R107 a A A ir a 56 P C1030 cio
3. Q0030 9 00012 90014 00004 00038 00056 3 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Exploded view and its Part list 2 Cellular phone Parts list Location Description SEC CODE Remark 00001 FOLDER UPPER GH75 03608A 00002 FOLDER LOWER GH75 03609A 00003 MEC FRONT COVER GH75 03607A 00004 REAR COVER GH75 03610A 00005 KEYPAD GH75 04141 00006 UNIT METAL DOME GH59 01212A Q0007 LCD GH07 00490A 00008 MOTOR DC GH30 00077A 00009 SPEAKER 3001 001509 Q0010 PBA MAIN GH92 01595A 00011 WINDOW LCD MAIN GH75 04140A 00012 COVER IF CONN GH73 01844A 00013 RF COVER GH73 02975A 00014 55 GH30 00090 00015 UNIT GH59 01213A Q0020 ANTENNA GH42 00374A Q0026 MEC VOL KEY GH75 02846A Q0030 MPR SCREW CAP LEFT GH74 01466A 00031 MPR SCREW RIGHT GH74 01467A 00032 SUB WINDOW GH72 09526A Q0038 BATTERY 720 GH43 00940A Q0056 SCREW MACHINE 6001 001479 3 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Exploded view and its Part
4. pin l 2 3 4 of CN300 Check the SIM Card END 7 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting 4 Charging Part Abnormal charging operation The pin 17 18 of CN800 is TA VEXT 5V 7 The pin 7 of U301 is 3 2 4 2V The ICHRG 14V during charging and 180mV full charging 7 4 No Replace TA or Check CN800 1 Check the U301 No Solder again or change R306 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Flow Chart of Troubleshooting VCA VDD VCCDVCC 1 8A 9 C312 1 C323 22U 2242 4 7uF 6307 c310 c309 22UF 22UF 2 202 CN300 PC D6 A3 H3 6 ge 2 5 Tal au SM 10 C30 C300 GGGG 1 22F 100N 14918 7 C304 305 PE 33PF dd 100N VBATT VC m E 9 NC SIM_CLK C315 SIM RST 22
5. SIM VCC gt ver 49 50 51 48 29 30 28 J gt SIMRST m UP 8 i 9 won Suec 2 LS SIMDAR UPIO 5 41 z mio VBAT 4t AUXi vivos 2 0 051 55 ADC AUX2 TA vExi a Vis 1 Syvace viss PL VRT C320 VBAT 100NF woos LL 43 voog 4 E 46 36 8304 PWR ON a7 P WR SWIN vias fas 390K JIGO 13 PWR Sw2 VLAS RTCALARIE RTC ALMN PWR_KEEP 21 PWR_KEEP vLDo4a PSW1_BUF PSC2106A1WUSTD vons viDo3 39 C322 5i 100NF KEY COL E i VLDO2 R300 4 e 10 KEY ROW gt 144 RING_PWM A VLDO1 501 GND 10 UP SCLK GND X EE UP GND XOENA GNDD lt EN VPAQ YMU VIB EN 8 8 S 10NF 5 3 2 8 8 lt lt BACKLIGHT 2 BACKLIGHT veco vco R305 NC 4T uso 1 _ 8 TA vex 2 gt R306 GND _ACOR C gt 101 4 EN oso x ICHRG lt ISET E C38 100 GG GG 10 sm MAX1508ETA R308 ca 3K 1 470nF 63V R301 12K196 L BaT300 ML414R F9GE 7 5 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting 5 Mic
6. amp 05 100 ichange or resolder 0300 pin 39 change or resolder SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Flow Chart of Troubleshooting 9 DCS Receiver CONTINUOUS RX ON RF INPUT 698 5008 NORMAL CONDITION N Check soldered status of catch the channel gt C205 C204 L211 U201 CHECK NO CON1 pin 13 65dBm gt resolder or change 0201 CHECK 0201 pin 3 4 65dBm resolder change 9100 CHECK P C218 C219 L203 18 19 gt 65dBm resolder or change 0100 CHECK N OSC100 CHECK N pin 8 13MHz pina 13MHz OSC100 CHECK Vp p 860mv Vp p 950mv pin 4 clean 3V Y E S C118 R103 C108 OSC100 change or resolder resolder U100 CHECK N 0300 pin 39 pin 9 clean 3V check or resolder U100 pin 1 2 3 28 NO M U100 Vp p 100mv resolder or change CHECK U500 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting 10 DCS transmitter 0201 pin 8 about 2 3 dBm YES CON1 C215 check amp change 0200 change re
7. umm GSM THEPHONE SGH X450 SERVICE m GSM TELEPHONE CONTENTS Specification Circuit Description Exploded Views and Parts List Hectrical Parts List Block Diagrams PCB Diagrams Flow Chart of Troubleshooting 5 This Service Manual is a property of Samsung Hectronics Co Ltd Samsung Hectronics Co Ltd April 2004 Any unauthorized use of Manual can be punished under applicable Printed in Korea International and or domestic law Code No GH68 04745 BASIC 1 5 450 Specification 1 GSM General Specification GSM900 EGSM 900 DCS1800 Phase 1 Phase 2 Phase 1 Freq Band MHz 890 915 880 915 1710 1785 1850 1910 Uplink Downlink 935 960 925 960 1805 1880 1930 1990 0 124 amp ARFCN range 1 124 975 1023 512 885 512 810 spacing 45MHz 45MHz 95MHz 80MHz Mod Bit rate Bit Period 270 833kbps 270 833kbps 270 833kbps 270 833kbps 3 692us 3 692us 3 692us 3 692us Time Slot 576 9us 576 9us 576 9us 576 9us Period Frame Period 4 615ms 4 615ms 4 615ms 4 615ms Modulation 0 3GMSK 0 3GMSK 0 3GMSK 0 3GMSK MS Power 33dBm 13dBm 33dBm 5dBm 30dBm 0dBm 30dBm 0dBm Power Class Spel 15 19 Opel 15 Opel 15 Sensitivity 102dBm 102dBm 100dBm 100dBm TDMA Mux 8 8 8 8 Cell Radius 35Km 35Km 2Km 1 1 SAMSUN
8. PIN BAM PPI RX 1 Q MIN VD Progr annabl e RQ pi RXCN Peri pheral 1 O PAx RO CERE SERCK IF ARMTLM RSTB PAX a PSTB RFOVL DA X TAL RTC TAG J TAG DY RN 32 768 DN DO J TAG ICE E p in ARM KEYBONRD i 1 Audi o Part Keyed Audi o FLASH SCRAM ow LCD ROM 32M m 7 or JBDBD con Menary part 5 2 SAMSUNG Proprietary Contents may This Document can not be used withou change without notice Samsung s authorization 6 SGH 450 PCB Diagrams 1 Main PCB Top Diagram C2 S EIgls co 1070 511910 11914 gs 419 6 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization IN oH A S o 20 co e 5 C cD R910 CO lt gt gt gt SGH X450 PC
9. list 3 Test Jig GH80 00865A 3 1 RF Test Cable 3 2 Test Cable 3 3 Serial Cable GH39 00140A GH39 001274 3 4 Power Supply Cable 3 5 DATA CABLE 3 6 TA GH39 00143B GH44 00184 3 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 4 SGH 450 Hectrical Parts List SEC Code Desi gn LOC 1405 001082 V1001 0406 001083 ZD701 1405 001082 V1002 0406 001083 ZD800 1405 001082 V1003 0406 001083 ZD801 1405 001082 V1004 0406 001194 ZD802 1405 001082 V700 0501 000225 01000 1405 001082 V705 0504 001151 U503 1405 001082 V706 0504 000168 Q300 1405 001082 V800 0504 001012 Q900 1405 001082 V801 0504 001012 Q901 1405 001082 V802 0504 001012 Q902 1405 001082 V803 0504 001151 U501 1405 001082 V804 0504 001151 U502 1405 001082 V903 0601 001790 D900 1405 001082 V904 0601 001790 D901 1405 001082 V905 0601 001790 D902 1405 001082 V907 0601 001790 D903 1405 001082 V908 0601 001790 D904 1405 001082 V909 0601 001790 D905 1405 001082 V910 0601 001790 D906 1405 001082 V911 0601 001790 D907 1405 001093 V806 0601 001790 D908 1405 001093 V808 0601 001790 D911 1405 001108 V1005 0601 001790 D912 913 1405 001108 V1006 0601 001929 LED900 1405 001108 V1007 1001 001183 U1001
10. 02 R1022 HP PIR ps mer 2 seoa REE 588 20800 800 EEES 417 1 ca Pup EIDE RM 050400 IL EB 600 cn 1006 0100561028 CN1000 603 TIL QUU 5 508 R402 707 C406 515 6515 O 2 4 SPK R400 Z S amp 509 e EL C604 R401 r E1030 120 E SEBBE T m nu 8181286 3 MICI m amp ELE zum 07 3 EE S rms 8 C2 4 m a EC Res 08100 3 NC6 Sis R603 SEE R801 C411 S Reo o3 lo 40 1805 1417 409 705 701 NC5 6 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 7 SGH X450 How Chart of Troubleshooting 1 Power On The set is not Power On Check the current consumption No Current consumption gt 100 Check the VBATT Voltage No Voltage gt 3 3V lt Check the pin of 9300 No pin 11 of U300 gt 2 8V pin 39 of U300 2 8V Yes Check the clock signal at pin 3 of OSC100 Freq 13MHz Vrms z 300mV Check the ini
11. 0RF 1008 1008 VRF R105 R100 Cus 0 560 13MHZ B gt CLK13M_TR R102 Eh From 514205 200 SF 117 gt 05 100 gt CLK13M 1 4 z y en 3 8 10NF Rg 20 52 3 100 a gt CLK13M 2 e 214 6 20 119 10NF 7 16 This Document can not be used without Samsung s authorization SAMSUNG Proprietary Contents may change without notice
12. 137 C1003 2203 005061 C1007 2203 006201 C301 2203 005061 C1015 2203 006201 C309 2203 005061 C300 2203 006201 C310 2203 005061 C302 2203 006201 C316 2203 005061 C320 2203 006201 C903 2203 005061 C322 2203 006257 C306 2203 005061 C405 2404 001088 C307 2203 005061 C418 2404 001105 C212 2203 005061 C506 2404 001105 C318 2203 005061 C600 2404 001134 C207 2203 005061 C601 2404 001268 C1004 2203 005061 C701 2404 001268 C319 2203 005065 C1009 2404 001268 C800 2203 005065 C1032 2404 001305 C1016 2203 005065 C504 2503 001041 C705 2203 005288 C216 2503 001041 C706 2203 005288 C217 2703 002198 L218 2203 005288 C220 2703 002204 L214 2203 005288 C221 2703 002205 L216 2203 005450 C222 2703 002205 L900 2203 005450 C519 2703 002367 L217 2203 005482 C1031 2703 002485 L204 2203 005482 C113 2703 002544 L203 2203 005482 C209 2703 002636 L202 2203 005482 C512 2801 003856 OSC400 2203 005482 C715 2809 001266 OSC100 2203 005482 C900 2901 001268 F701 2203 005482 C901 2901 001268 F702 2203 005496 C128 2901 001268 F703 2203 005496 C211 2901 001268 F704 4 4 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 5 450 Hectrical Parts List 2901 001268 F705 2904 001480 F200 2909 001215 U201 3301 001659 L800 3705 001273 CON201 3709 001244 CN301 3710 001816 CN800 3711 005229
13. 1405 001108 V1008 1009 001010 SW900 1405 001108 V707 1109 001274 U600 1405 001108 V912 1201 002078 U200 1405 001108 V913 1203 002902 U 300 1405 001108 V914 1203 003105 U900 2007 000138 R103 1203 003109 U301 2007 000140 R1018 1204 001984 U500 2007 000140 R802 1204 002161 U1013 2007 000140 R803 1205 002433 U100 2007 000140 R804 1404 001256 TH401 2007 000140 R805 1405 001019 V805 2007 000140 R806 1405 001082 V1000 2007 000140 R811 4 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Hectrical Parts List 2007 000140 R812 2007 000171 R600 2007 000140 R813 2007 000171 R603 2007 000140 R814 2007 000171 R807 2007 000141 R1011 2007 000171 R911 2007 000141 R1024 2007 000172 R101 2007 000148 R1005 2007 000172 R300 2007 000148 R1006 2007 000172 R407 2007 000148 R1012 2007 000172 R601 2007 000148 R1019 2007 000172 R700 2007 000157 R1025 2007 000566 R810 2007 000157 R305 2007 000947 R302 2007 000157 R400 2007 000758 R303 2007 000157 R402 2007 001119 R1010 2007 000157 R800 2007 001292 R919 2007 000157 R801 2007 001292 R920 2007 000157 R808 2007 001305 R918 2007 000159 R1021 2007 001308 R102 2007 000159 R1023 2007 001325 R1007 2007 000162 R1014 2007 001333 R1017 2007 000162 R1022 2007 00
14. 2797 R100 2007 000162 R504 2007 003001 R1001 2007 000162 R505 2007 003001 R1002 2007 000162 R506 2007 003010 R900 2007 000162 R910 2007 003010 R901 2007 000167 R304 2007 003010 R902 2007 000171 R1003 2007 003010 R903 2007 000171 R1013 2007 003010 R904 2007 000171 R1027 2007 003010 R905 2007 000171 R1028 2007 003010 R906 2007 000171 R1029 2007 003010 R907 2007 000171 R105 2007 003010 R908 2007 000171 R200 2007 003010 R917 2007 000171 R201 2007 003010 R921 2007 000171 R203 2007 003010 R922 2007 000171 R204 2007 007107 R405 2007 000171 R205 2007 007137 R301 2007 000171 R310 2007 007142 R306 2007 000171 R501 2007 007142 R403 4 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 5 450 Hectrical Parts List 2007 007200 R502 2203 000254 C513 2007 007200 R503 2203 000254 C514 2007 007308 R404 2203 000254 C515 2007 007308 R406 2203 000254 C604 2007 007480 R408 2203 000254 C700 2007 007538 R401 2203 000278 C1020 2007 008263 R308 2203 000359 C1000 2203 000233 C1005 2203 000386 115 2203 000233 1028 2203 000386 C414 2203 000233 C1030 2203 000386 C416 2203 000233 C127 2203 000425 C503 2203 000233 C129 2203 000438 C1014 2203 000233 C130 2203 000438 C1021 220
15. 3 000233 C131 2203 000438 C1022 2203 000233 C132 2203 000438 C707 2203 000233 C313 2203 000585 C1006 2203 000233 C324 2203 000628 C802 2203 000233 C602 2203 000679 C406 2203 000233 C801 2203 000812 C126 2203 000254 C117 2203 000812 C206 2203 000254 C118 2203 000812 C303 2203 000254 C119 2203 000812 C304 2203 000254 C120 2203 000812 C305 2203 000254 C314 2203 000812 C501 2203 000254 C400 2203 000812 C507 2203 000254 C401 2203 000812 C518 2203 000254 C402 2203 000812 C520 2203 000254 C403 2203 000812 C710 2203 000254 C407 2203 000812 C711 2203 000254 C409 2203 000854 C125 2203 000254 C410 2203 000854 C210 2203 000254 C411 2203 000995 C1039 2203 000254 C412 2203 000995 C215 2203 000254 C417 2203 001072 C1010 2203 000254 C508 2203 001072 C1011 2203 000254 C509 2203 001259 C1008 2203 000254 C510 2203 001405 C408 2203 000254 C511 2203 001412 C116 4 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Hectrical Parts List 2203 001598 C311 2203 005496 C213 2203 001598 C312 2203 005496 C214 2203 001598 C315 2203 005496 C404 2203 002677 C218 2203 005496 C413 2203 002677 C219 2203 005496 C505 2203 005052 C1023 2203 005509 C703 2203 005061 C1001 2203 006053 C902 2203 005061 C1002 2203 006
16. B Diagrams 2 PCB Bottom Diagram
17. CN1001 3722 001715 CN1000 4302 001157 BAT 300 4 5 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 5 SGH X450 Block Diagrams 1 RF Solution Block Diagram PCS RX 1930 1990 MHz Si4205 U100 F200 SAW FILTER DCS 1805 1880 LNA EGSM 925 960 RF Front Conector End CSP1093 CON201 Module U201 VCTCXO U500 A A OSC100 DCS TX 1710 1785 MHz PCS TX 1850 1910 MHz Dual PAM U200 EGSM TX 880 915 MHz 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Block Diagrams 2 Base Band Solution Block Diagram PO ER X TAL LDO CHARGER 13McE SIM CPRS TRIDENT AC TX P CSP1093 TX 10 5 16000 RN lO TXON RF sau CN PS232 ea Rv D
18. ED1_ 0 2 and can be programmed to sink from 15mA to 60mA in 7 5mA steps LED2 DRV is controlled via LED2 0 2 and can be programmed to sink from 5mA to 40mA in 5mA steps Both LED drivers are capable of sinking their maximum output current at a worst case maximum output voltage of 0 6V For efficient use the LEDs is connected between the battery and the LED_DRV output 4 Vibrator Motor Driver The vibrator motor driver is a low side programmable voltage source designed to drive a small dc motor that silently alerts the user of an incoming call The driver is controlled by VIB 0 1 and can be programmed to maintain a motor voltage of 1 3V 2 0V or 2 5V relative to VBAT while sinking up to 100mA For efficient use the vibrator motor should be connected between the main battery and the VIB_DRV output 2 Connector 1 LCD Connector LCD is consisted of main LCD color 65K UFB LCD Chip select signals of EMI part in the trident CLCD_EN can enable main LCD LED_EN signal enables white LED of main LCD and EL_EN signal enables dimming mode of main LCD These two signals from IO part of the DSP in the trident RST signal from 2106 initiates the initial process of the LCD 16 bit data lines D 0 D 15 transfers data and commands to LCD through emi filter Data and commands use A 2 signal If this signal is high Inputs to LCD are commands If it is low Inputs to LCD are data The signal which informs the input or output state to LCD i
19. G Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Specification 2 GSM TX power class TX Power TX Power TX Power control level PEEN control level PESIIN control level 5 33 2 dBm 0 30 2 dBm 0 30 2 dBm 6 31 2 dBm 1 28 3 dBm 1 28 3 dBm 7 29 2 dBm 2 26 3 dBm 2 26 3 dBm 8 27 2 dBm 3 24 53 dBm 3 24 53 dBm 9 2542 dBm 4 22 3 dBm 4 22 3 dBm 10 2342 dBm 5 20 3 dBm 5 20 3 dBm 11 2142 dBm 6 18 3 dBm 6 18 3 dBm 12 19 2 dBm 7 16 3 dBm 7 16 3 dBm 13 1752 dBm 8 14 53 dBm 8 14 3 dBm 14 15 2 dBm 9 12 4 dBm 9 12 4 dBm 15 13 2 dBm 10 10 4 dBm 10 10 4 dBm 16 11 3 dBm 11 8 4dBm 11 8 4dBm 17 9 3dBm 12 6 4 dBm 12 6 4 dBm 18 7 3 dBm 13 4 4 dBm 13 4 4 dBm 19 5 3 dBm 14 2 5 dBm 14 2 5 dBm 15 0 5 dBm 15 0 5 dBm 1 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 2 SGH 450 Circuit Description 1 SGH X450 RF Circuit Description 1 RX PART 1 ASM U201 gt Switching Tx Rx path for EF GSM900 DCS1800 and PCS1900 by logic controlling 2 ASM Control Logic 0501 0502 0503 gt Truth Table VCI 2 GSM Tx Mode H L L DCS PCS Tx Mode L H L PCS Rx Mode L L H GSM DCS Rx Mode L L L 3 FILTER To convert Electromagnetic Field Wave to Acoustic Wave and then pass t
20. M LNA IN P SKY77324 Tx j c2 LLE 00 Ti 2228 E sven Ea 585 ithe En slpacena 3 ami L3 P 0635 TK BAND sE DCS PCSIN e 2 5850 90 yo bl Bi ed E IL loci 9 DPCS PAM IN nm cau C20 7 0 Tour 220NF 220NF GsM PAM iN 63 7 15 This Document can not be used without Samsung s authorization SAMSUNG Proprietary Contents may change without notice SGH 450 Flow Chart of Troubleshooting gt 13MHZ_BB 1900 3 9rH vv lt 7 GSM PAMN C125 39PF VF o gt DPCS_PAM_IN C126 33PF pas 28 27 26 25 24 23 22 5222 WU ox m 2m 21 No x gU m GSM LNA IN Ale 5575 56 lt RXQN Moa RFI GSM LNA ie 2 19 lt 0100 RFID DCS LNA imi RXIN C 3 RXN 614205 RFIIP 18 ncs LNA i 4 17 TXIP RFIN im 5 TXIN Rrip PCS LNA IR TXaP GND 15 7 TXAN 2 127 x c 100PF 59 182 93 4 CLK13M RF VF 1 C128 IRE s SERDAT SEROK ms SERLE 51 T C130 C131 C129 ci 10
21. U201 CHECK NO CON1 pin 13 65dBm gt resolder or change U201 CHECK NO U201 pin 6 65dBm resolder or change U100 CHECK N near parts of F200 or pin 16 17 65dBm gt 218 2191203 resolder or change U100 CHECK NO 056100 CHECK NO OSC100 CHECK 8 pin 3 LAMP pin 4 clean Vp p 860mV Vp p 950mv C118 R103 C108 OSC100 Change or resolder 0100 0300 pin 39 pin 9 clean 3V check or resolder U100 pin 1 2 3 28 NO M U100 Vp p 100mv resolder or change CHECK U500 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting 12 PCS transmitter 0201 pin 8 about 2 3 dBm YES CON1 C215 check amp change 0200 change resolder U201 pin 9 3 V 5 0200 amp 0100 check amp change NO U500 U502 check amp change R201 check amp change YES NO U300 pin 39 change or resolder NO U500 change YES U100 pin 8 13MHz Vp p 950 y YES U100 pin 10 12 13 14 3V 0100 pin 4 5 6 7 1 7V yes U100 change or resolder U100 pin 9 230 2 check or chang
22. alert drivers aid in reducing both board area and system complexity A four wire serial interface unit SIU provides access to control and configuration registers This interface gives a microprocessor full control of the PSC2106 and enables system designers to maximize both standby and talk times Error reporting is provided via an interrupt signal and status register Supervisory functions including a reset generator an input voltage monitor and a thermal monitor support reliable system design These functions work together to ensure proper system behavior during start up or in the event of a fault condition low microprocessor voltage insufficient battery energy or excessive die temperature 2 Battery Charge Management A battery charge management block incorporating an internal PMOS switch and an 8 bit ADC provides fast efficient charging of single cell Li Ion battery Used in conjunction with a current limited voltage source this block safely conditions near dead cells and provides the option of having fast charge and top off controlled internally or by the system s microprocessor 2 2 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Circuit Description 3 Backlight LED Driver The backlight LED driver is a low side programmable current source designed to control the brightness of the keyboard and LCD illumination LED1_DRV is controlled via L
23. and commercial channel that combines texts images and sounds and others The hardware sequencer of YMU762MA3 directly interprets and plays blocks relevant to systhesis playing music and reproducing ADPCM with FM synthesizer that are included in data distributed in SMAF 5 Memory This system uses SHARP s memory LRS1828 It is consisted of 128M bits flash memory and 32M bits SCRAM It has 16 bit data line D 0 15 which is connected to trident LCD or CSP1093 It has 22 bit address lines A 1 22 They are connected too CP_CSROMEN and 5 2 signals chip select signals in the trident enable two memories They use 3 volt supply voltage VCCD During wrting process CP_WEN is low and it enables writing process to flash memory and SCRAM During reading process CP_OEN is low and it output information which is located at the address from the trident in the flash memory or SCRAM to data lines Each chip select signals in the trident select memory among 2 flash memory and SCRAM Reading or writing procedure is processed after CP_WEN or CP_OEN is enabled Memories use FLASH_RESET which is buffered signal of RESET from PSC2106 for ESD protection A 0 signal enables lower byte of SCRAM and UPPER BYTE signal enables higher byte of SCRAM 6 Trident Trident is consisted of ARM core and DSP core It has 20K 16bits RAM 144K 16bits ROM in the DSP It has 4K 32bits ROM and 2K 32bits RAM in the ARM core DSP is consisted of timer one bit inpu
24. e 05 100 13MHz Vp p 950mv Y YES OSC100 pin 4 QUE U300 ichange or resolder 7 14 CONTINUOUS TX ON CONDITION CH 698CH DCS 660CH PCS TX POWER CODE 350 CODE Aplied RBW 100KHz VBW 100KHz SPAN 10 2 REF LEV 10dBm ATT 20dB U500 check NO NO OSC100 change or resolder 0300 pin 39 change or resolder SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Flow Chart of Troubleshooting CON201 KMS 5G c A 6 606 L 1 2 C204 9 c26 un J0nH NC l ens amr F200 c216 umb FAR F6EB 1G9600 B2BW ou gt PCS LNA IN N GSM TX ANT pos AHS mL 4 L202 sx 5 ev Em PCS RX E A ves 2 See JS Gp pA MES 4 gt PCS INA IN P ie et EGSM 2 DCSPCS TX c C205 7 14 14 15 6 5 218 PEE gt DCS LNA IN N 21 LMG003W 5076A C219 1525 R20 R201 gt DCS LNA IN P 0 0 TXPOWER c220 R202 NC gt 95 LNA IN 1 E ie l Nm gt Gs
25. e signals decide the color of LED service indicator Nine key LED use the VBATT supply voltage These are connected to BACKLIGHT signal in the PSC2106 This signal enables LEDs with current control FLIP_SNS informs the status of folder open or closed to the trident This uses the hall effect IC A3210ELH A magnet under main LCD enables A3210ELH which is on the main PCB 4 EMI Filtering This system uses the EMI Filter to reduce noise from LCD part Some control signals are connected to LCD without EMI filtering 3 IF connetor It is 23 pin connector and uses 18 pin at present They are designed to use SDS DEBUG DLC DETECT JIG_ON VEXT VTEST VF VBATT and GND They connected to power supply IC microprocessor and signal processor IC 4 Audio AOUTAP AOUTAN from CSP1093 is connected to the speaker via analog switch AOUTBP and AOUTBN are connected to the ear mic speaker via ear jack MICIN and MICOUT are connected to the main MIC And AUXIN and AUXOUT are connected to the Ear mic YMU762MA3 is LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decorder that are included in this device As a synthesis YMU762MA3 is equipped 16 voices with differenttones Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer various sampled voices can be used as sound effects Since the play data of YMU762MA3 are interpreted a
26. ence interface signals After channel selection the digital output is scaled with a digital PGA which is controlled with the DGAIN DACs drive a differential analog signal onto the RXIP RXIN RXQP RXQN pins to interface to standard analog input baseband IC 2 1 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 5 450 Circuit Description 2 TX PART Baseband IQ signal fed into offset PLL this function is included inside of U100 chip 14205 chip generates modulator signal which power level is about 1 5dBm and fed into Power Amplifier U200 The PA output power and power ramping are well controlled by Auto Power Control circuit We use offset PLL below GSM 354 200kHz offset 30 kHz bandwidth DCS 35dBc PCS 35dBe GSM 66dBc s 400kHz offset 30 kHz bandwidth DCS 65dBc PCS 66dBc GSM T5dBc 600kHz 1 8MHz offset 30 kHz bandwidth DCS 68dBc PCS 75dBe 2 Baseband Circuit description of SGH X450 1 PSC2106 1 Power Management Seven low dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life A programmable LDO provides support for 1 8V 3 0V SIMs while a self resetting electronically fused switch supplies power to external accessories Ancillary support functions such as two LED drivers and two call
27. he specific frequency band GSM FILTER C220 C221 L204 gt For filtering the frequency band between 925 960 MHz DCS FILTER C218 C219 L203 gt For filtering the frequency band 1805 and 1880 MHz PCS SAW FILTER F200 gt For filtering the frequency band between 1930 and 1990 MHz 4 TC VCXO OSC100 To generate the 13MHz reference clock to drive the logic and RF After additional process the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock mode for GPRS high class operation 5 SI 4205 U100 This chip integrates three differential input LNAs The GSM input supports the E GSM DCS input supports the DCS1800 PCS input supports the PCS1900 The LNA inputs are matched to the 200 ohm differential output SAW filters through eternal LC matching network Image reject mixer downconverts the RF signal to a 100 KHz intermediate frequency IF with the RFLO from frequency synthesizer The RFLO frequency is between 1737 8 1989 9 MHz The Mixer output is amplified with an analog programmable gain amplifier PGA which is controlled by AGAIN The quadrature IF signal is digitized with high resolution A D converts ADC Also this chip down converts the ADC output to baseband with a digital 100 KHz quadrature LO signal Digital decimation and IIR filters perform channel selection to remove blocking and refer
28. ime is reached the control portion of the event timing and control register will start the baseband receive section converting I and Q sample pairs The samples are stored in a double buffered register until the register contains 32 sample pairs CSP1093 then notifies the DSP which has ample time to read the information out before the next 32 sample pairs are stored The voice band ADC converter issues an interrupt to the DSP whenever it finishes converting a 16 bit PCM word The DSP then reads the new input sample and simultaneously loads the voice band output DAC converter with a new PCM output word The voice band output can be connected directly to a speaker via AOUTAN and AOUTAP pins and be connected to a Ear mic speaker via AOUTBN and AOUTBP pins 8 X TAL 3MHz This system uses the 13MHz TCXO TCO 9141B Toyocom AFC control signal form CSP1093 controls frequency from 13MHz x tal It generates the clock frequency This clock is fed to CSP1093 Trident YMU762 and Silab solution 2 6 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 3 SGH 450 Exploded View and its Parts list 1 Cellular phone Exploded View 00007 00032 00002 2 00008 00031 00011 00056
29. lder It has JTAG control pins TDI TDO TCK for ARM core and DSP core It recieves 13MHz clock in CKI pin from external TCXO and receives 32 768KHz clock from XIRTC ADC Analog to Digital Convertor part receives the status of temperature battery type and battery voltage And control signals DSP INT DSP IO and DSP RWN for DSP core are used It enables main LCD with DSP IP pins 7 CSP1093 CSP1093 integrates the timing and control functions for GSM 2 mobile application with the and DAC functions The CSP1093 interfaces to the trident via a 16 bit parallel interface It serves as the interface that connects a DSP to the RF circuitry in a GSM 2 mobile telephone DSP can load 148 bits of burst data into CSP1093 s internal register and program CSP1093 s event timing and control register with the exact time to send the burst When the timing portion of the event timing and control register matches the internal quarter bit counter and internal frame counter the 148 bits in the internal Register are GMSK modulated according to GSM 2 standards The resulting phase information is translated into I and Q differential output voltages that can be connected directly to an RF modulator at the TXOP and TXON pins The DSP is notified when the transmission is completed For receiving baseband data a DSP can program CSP1093 s event timing and control register with the exact time to start receiving I and Q samples through TXIP and TXIN pins When that t
30. rophone Part Microphone does not work Is the assembled status of Reassemble the microphone microphone O K Lor Check the reference voltage on Mic path No Solder the microphone again or Replace around Mic Circuit C1009 R1010 R1009 R1006 R1008 lt Is microphone ok E END 0500 7 6 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Flow Chart of Troubleshooting 6 Speaker Part There is sound from Speaker Yes Is the terminal of Speaker O K at the pin 20 of 1001 Are there any signals Check U1001 Replace the Speaker Are there any signals Check LCD or Replace CN1001 pin 19 of CN1001 The type of sound from Speaker is Melody Yes Are there signals at the pin 2 and pin 10 of U1001 at the 5 and pin 7 of U1001 Check U1000 Check 4500 ew 7 7 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting
31. s required But this system is not necessary this signal So CP_WEN signal is used to write data or commands to LCD Power signals for LCD are VBATT and VCCD SPK1P and SPKIN from CSP1093 are used for audio speaker And YMU_VIB_EN from MA 3 enables the motor 2 JTAG Connector Trident has two JTAG ports which are for ARM core and DSP core DSP16000 So this system has two port connector for these ports Pins initials for ARM core and pins initials for DSP core DSP_ CP TDI and DSP TDI signal are used for input of data CP TDO and DSP TDO signals are used for the output of the data and DSP signals are used for clock because JTAG communication is a synchronous TMS and DSP TMS signals are test mode signals The difference between these is the RESET INT signal which is for ARM core RESET 2 3 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 5 450 Circuit Description 3 Keypad connector This is consisted of key interface pins in the trident KEY ROW 0 4 and KEY_COL 0 4 These signals compose the matrix Result of matrix informs the key status to key interface in the trident Some pins are connected to varistor for ESD protection And power on off key is seperated from the matrix So power on off signal is connected with PSC2106 to enable PSC2106 SVC_GREEN SVC_RED and SVC_BLUE are from OCTL of CSP1093 Thes
32. solder U201 pin 9 3 V 5 0200 amp 0100 check amp change NO U500 U502 check amp change R201 check amp change YES NO U300 pin 39 change or resolder YES U100 pin 8 13MHz Vp p 950mv y YES U100 pin 10 12 13 14 3V 0100 pin 9 32 0500 yes U100 change or resolder check or change 5 100 pin 3 13MHz Vp p 950mv Y YES OSC100 pin 4 QUE U300 ichange or resolder 7 12 CONTINUOUS TX ON CONDITION CH 698CH DCS 660CH PCS TX POWER CODE 350 CODE Aplied RBW 100KHz VBW 100KHz SPAN 10 2 REF LEV 10dBm ATT 20dB U500 check NO NO OSC100 change or resolder 0300 pin 39 change or resolder SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Flow Chart of Troubleshooting 11 PCS Receiver CONTINUOUS RX ON RF INPUT 698 5008 NORMAL CONDITION N Check soldered status of catch the channel gt C205 C204 L211
33. solder 0100 pin 1 2 3 28 N O Vp p 100mv U100 resolder or change CHECK U500 7 9 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting 8 EGSM transmitter about 2 3 dBm U201 pin 8 Y ves 1 C215 check amp change YES Between R201 amp U200 1 2V YES U200 change NO U201 AN 5 0500 0501 amp 5 0200 amp 0300 amp R201 check amp change YES NO YES U300 pin 39 change or resolder U100 pin 8 13MHz Vp p 950 y YES 9100 pin 10 12 13 14 BV YES U100 pin 5 6 7 8 1 7V 5 0500 0100 ichange resolder NO 0100 pin 9 3 0500 check change pin 3 13MHz Vp p 950mv NO OSC100 Y YES 05 100 pin 4 U300 change or resolder 7 10 rcd NO NO CONTINUS TX CONDITION TX POWER DAC 500 CODE APPLIED CH 62 RBW 100 2 VBW 100KHz SPAN 10 2 REF LEV 10dBm ATT 20dB 0500
34. t anytime through FIFO the length of the data playing period is not limited so the device can flexiblysupport application such as incoming call melody music distribution service The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones Moreover the registers of the FM synthesizer can be operated directly for real time sound generation allowing for example utilization of various sound effects when using the game software installed in the portable telephone 2 4 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Circuit Description YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW SPVDD 3 6V The device is also equipped with conventional function including a vibartor and a circuit for controlling LEDs synchornous with music For the headphone it is provided with a stereophonic output terminal For the purpose of enabling YMU762MA3 to demonstarte its full capablities Yamaha purpose to use SMAF Synthetic music Mobile Application Format as a data distribution format that is compatible wiht multimedia Since the SMAF takes a structure that sets importance on the synchronization between sound and images various contents can be written into it including incoming call melody with words that can be used for traning karaoke
35. t output unit BIO JTAG EMI and HDS Hardware Development System ARM core is consisted of EMI PIC Programmable Interrupt Controller reset power clock unit DMA controller TIC Test Interface Controller peripheral bridge PPI SSI Synchronous Serial Interface ACCs Asynchronous communications controllers timer ADC RTC Real Time Clock and keyboard interface DSP_AB 0 8 address lines of DSP core and DSP_DB 0 15 data lines of DSP core are connected to CSP1093 A 0 20 address lines of ARM core and D 0 15 data lines of ARM core are connected to memory LCD and YMU762 ICP Interprocessor Communication Port controls the communication between ARM core and DSP core CSROMEN CSRAMEN and CSIN to CS4N in the ARM core are connected to each memory WEN and OEN control the process of memory External IRQ Interrupt ReQuest signals from each units such as Ear jack Ear mic and CSP1093 need the compatible process 2 5 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization 5 450 Circuit Description Some PPI pins has many special functions CP_KB 0 9 receive the status from key FPCB and are used for the communicatios using data link cableeDEBUG_DTR RTS TXD RXD CTS DSR And UP CS SCLK SDI control signals for PSC2106 are outputted through PPI pins It has signal port for charging CHG DET SIM RESET and FLIP_SNS with which we knows open closed status of fo
36. tial operation END 7 1 Download again Charge the Battery Check U300 and C310 Check U300 and C309 Check the clock generation circuit related to OSC100 SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH 450 Flow Chart of Troubleshooting 2 Initial Initialization Failure Check the U300 If it has some problem adjust it Check the U300 If it has some problem adjust it Check the U400 No The pin 9 of U300 the pin 11 of U300 2 825V ea No Is the pin 19 of U300 Low gt High 32 768kHz wave forms at m 2 the C414 and C416 g N The pin 22 of U300 is 2 High Check the U300 The Voltage is High at the C307 Check the U300 LCD display is Check the LCD Part Yes No Yes END 7 2 Check the Audio Part SAMSUNG Proprietary Contents may change without notice This Document can not be used without Samsung s authorization SGH X450 Flow Chart of Troubleshooting 3 SIM Part Insert SIM is displayed on the LCD No Are there any Signals at gt pin 52 53 54 of 9300 Check the U400 Yes No Are there any Signals at Check the U300
37. u 105 10052 1NF 100NF R1010 680 p M 4 C1016 C1031 CN100 33UF 02 828P0 53BKA EAR SPK N AOUTBN _SPK EAR_MICN 5 22K 4 1 x JACK IN ROR 1032 2 10K 1UF EAR_SPK_P aoure t EAR E R1013 AL L ven 040205 1508 lt 1021 C1022 2 E Wwe E we 8 9 S 8 5 5 5 5 C1019 8 8 8 8 LS 8 8 8 8 1016 8 8 8 8 S 5 5 5 vecD D R1017 R108 0100 1K 25 4617 _ R1019 10K 7 8 This Document can not be used without Samsung s authorization SAMSUNG Proprietary Contents may change without notice 5 450 Flow Chart of Troubleshooting 7 EGSM Reciever CONTINUOUS RX ON RF INPUT 62CH P 50dBm NO Check soldered status of NORMAL CONDITION p C205 C204 L211 catch the channel CON1 resolder or change YES CHECK 5 N gt 0201 65dBm 7 resolder or change y YES NO U100 CHECK C220 C221 L204 pin 20 21 gt 65dBm resolder or change U100 CHECK NO OSC100 CHECK NO pin38 13MHz p pin 3 13MHz p OSC100 CHECK Vp p 860mv Vp p 950mVv pin 4 clean 3V OSC100 change or CHISRTO3 C108 resolder U100 CHECK NO gt U300 pin 39 pin 9 clean 3V check or re
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