Sony ICX418ALB User's Manual
Contents
1. Use Restrictions e The Products are intended for incorporation into such general electronic equipment as office products communication products measurement products and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time You should not use the Products for critical applications which may pose a life or injury threatening risk or are highly likely to cause significant property damage in the event of failure of the Products You should consult your Sony sales representative beforehand when you consider using the Products for such critical applications In addition you should not use the Products in weapon or military equipment e Sony disclaims and does not assume any liability and damages arising out of misuse improper use modification use of the Products for the above mentioned critical applications weapon and military equipment or any deviation from the requirements set forth in this specifications book Design for Safety e Sony is making continuous efforts to further improve the quality and reliability of the Products however failure of a certain percentage of the Products is inevitable Therefore you should take sufficient care to ensure the safe design of your products such as component redundancy anti conflagration features and features to prevent mis operation in order to avoid accidents resulting in injury or death fir2. v E 6 n J k 6 0 65 70 75 90 95 100 105 110 115 120 125 136 195 146 Example L VsuB 9 0V DC Characteristics cunet so 100 ma SONY ICX418ALB Clock Voltage Conditions we onl loo E e Readout clockvotase w ss so a Loos o oos v 2 Wewa 2 as vw 90 p 2 erica vance cox ven por ve um 2 SSS Res GK Wwe os v 2 Reve Wwe v 2 We V tomen Aue Kar mua Ma oo Reset gateciock Yoe as se ss e 4 dockvotage Vane 280 80 pp s _ Input the reset gate clock without applying a DC bias In addition the reset gate clock can also be driven with the following specifications Waveform m De eee o Reset gate clock Vat Cs Vora 85 90 95 Vpp 4 SONY ICX418ALB Clock Equivalent Circuit Constant Capacitance between vertical transfer clock 2700 BEN ___ 8 Capacitance between vertical transfer clocks 820 Capacitance between horizontal transfer clock Con 10 Capacitance between horizontal transfer clocks Capacitance between r
3. Protective transistor bias L Substrate bias circuit supply voltage VpsuB 14 55 15 45 Vl C T Subatral lock 1 o 1 VL setting is the voltage of the vertical transfer clock waveform the same supply voltage as the VL power supply for the V driver should be used When CXD1267AN is used 2 Do not apply a DC bias to the substrate clock pin because a DC bias is generated within the CCD m j oo Bias Conditions 2 when used in substrate bias external adjustment mode Output circuit supply voltage Vo 55 55 3 V Protective transistor bias 3 MESE Substrate bias circuit supply voltage 4 we v Substrate voltage adjustment range Substrate voltage adjustment precision AVsuz 3 3 VL setting is the voltage of the vertical transfer clock waveform or the same supply voltage as the VL power supply for the V driver should be used When CXD1267AN is used 4 Connect to GND or leave open 5 The setting value of the substrate voltage Vsus is indicated on the back of the image sensor by a special code When adjusting the substrate voltage externally adjust the substrate voltage to the indicated voltage The adjustment precision is 3 However this setting value has not significance when used in substrate bias internal generation mode Reset drain voltage 6 0 VsuB code one character indication Code and optimal setting correspond to each other as follows
4. e eas kum a BUM RDUM s e ee LO e T AI gt gt MM MM Pr iL Cc Tf Unit us 16 Drive Timing Chart Vertical Sync FLD VD BLK HD O LO CON st LO e LO O O LO LO O N N q CN cO cO N N LO LO N N N N N V1 V2 V4 lt 493 S 21476 I IL LU 494 3151 U 1155 OUT 1494 lee 112121 Ll 1 l 1 et 493 ee OL L l 21416 ANOS 1 Drive Timing Chart Horizontal Sync HD BLK H1 H2 RG V1 V2 V3 V4 SUB 760 COr N LO 10 20 30 40 TAM 10 20 ANOS 1 SONY ICX418ALB Notes on Handling 1 Static charge prevention CCD image sensors are easily damaged by static discharge Before handling be sure to take the following protective measures a Either handle bare handed or use non chargeable gloves clothes or material Also use conductive shoes When handling directly use an earth band Install a conductive mat on the floor or working table to prevent the generation of static electricity lonized air is recommended for discharge when handling CCD image sensor For the shipment of mounted substrates use boxes treated for the prevention of static charges b C d e lt S 2 Soldering a Make sure the package temperature does no
5. 0 5 LE transfer We During Horizontal transfer clock parallel on Hee conversion When draining ee le 1 When vertical transfer clock driver CXD1267AN is used 2 tf gt if 2ns two ltem Symbol Unit Remarks pas pus Pues we m 3 The overlap period for twh and twl of horizontal transfer clocks mE and He is two _ 410 SONY ICX418ALB Image Sensor Characteristics Ta 25 C Min Unit Measurement Remarks aaan Sapa Smear m os Fos fess w ee JT i Ta 60 Dark signal shacing aver 1 m 6 Ta 60 FT 2 7 i lw T Ts s P Zone Definition of Video Signal Shading Ata 768 H l 494 V Zone 0 1 10 M Ignored region 10 Effective pixel region 11 SONY ICX418ALB Image Sensor Characteristics Measurement Method Measurement conditions 1 u In the following measurements the device drive conditions are at the typical values of the bias and clock voltage conditions when used with substrate bias external adjustment set the substrate voltage to the value indicated on the device In the following measurements spot blemishes are excluded and unless otherwise specified the optical black level OB is used as the reference for the signal output which is taken as the value of Y signal output or chroma sign
6. 10 Lag Adjust the signal output value generated by strobe light to 200mV After setting the strobe light so that it strobes with the following timing measure the residual signal Vlag Substitute the value into the following formula Lag Vlag 200 x 100 FLD V1 Light Strobe light timing signal output 200mV Ylag lag Output i 3 13 Drive Circuit 1 substrate bias internal generation mode 15V O XSUB gt XV1 gt XSG1 gt xus gt XSG2 gt XV4 gt Ho1 gt Ho2 gt RG e 20 19 100k mm c 7 Qon S LL CMT eee TTS y ME 5 NEN TTA i 0 01 mi gt A CCD OUT ANOS 41820 Drive Circuit 2 substrate bias external adjustment mode 15V O XSUB gt XV2 gt XV1 gt XSG1 gt XV3 gt XSG2 gt XV4 gt Hoi gt gt uL P 15k Yo exe 39k 1 35V 15 1 35V 100 27k 0 1 1 35V 27 0 1 0 L4 1 3 3 20V J gt PA 7 CCD OUT 0 01 3 9k RG gt 7 7 ANOS 1 ICX418ALB SONY Spectral Sensitivity Characteristics Excludes lens characteristics and light source characteristics osuodsay 700 800 900 1000 Wave Length nm 600 500 Sensor Readout Clock Timing Chart LO CN LO cN LO CN eed eee CN Ny DR ret
7. al output of the measurement system Definition of standard imaging conditions x Standard imaging condition I Use a pattern box luminance 706cd m2 color temperature of 3200K halogen source as a subject Pattern for evaluation is not applicable Use a testing standard lens with CM500S t 1 0mm as an IR cut filter and image at F8 The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity Standard imaging condition II Image a light source color temperature of 3200K with a uniformity of brightness within 296 at all angles Use a testing standard lens with CM500S t 1 0mm as an IR cut filter The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm Sensitivity Set to standard imaging condition I After selecting the electronic shutter mode with a shutter speed of 1 250s measure the signal output Vs at the center of the screen and substitute the value into the following formula _ 250 S Vs x4 mV Saturation signal Set to standard imaging condition II After adjusting the luminous intensity to 10 times the intensity with average value of the signal output 200mV measure the minimum value of the signal output Smear Set to standard imaging condition II With the lens diaphragm at F5 6 to F8 adjust the luminous intensity to 500 times the intensity with average value of th
8. e or other social damage as a result of such failure Export Control f the Products are controlled items under the export control laws or regulations of various countries approval may be required for the export of the Products under the said laws or regulations You should be responsible for compliance with the said laws or regulations No License Implied e The technical information shown in this specifications book is for your reference purposes only The availability of this specifications book shall not be construed as giving any indication that Sony and its licensors will license any intellectual property rights in such information by any implication or otherwise Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third party rights due to the same It is therefore your sole legal and financial responsibility to resolve any such problems and infringement Governing Law This Notice shall be governed by and construed in accordance with the laws of Japan without reference to principles of conflict of laws or choice of laws All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance Other Applicable Terms and Conditions The terms and conditions in the Sony additional specifications which will be made available to you when yo
9. e signal output 200mV When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings measure the maximum value VSm mV of the signal output and substitute the value into the following formula VSM 1 200 500 Sm 20 x log x 1 dB 1 10V method conversion value Video signal shading Set to standard imaging condition II With the lens diaphragm at F5 6 to F8 adjust the luminous intensity so that the average value of the signal output is 200mV Then measure the maximum Vmax mV and minimum Vmin mV values of the signal output and substitute the values into the following formula SH Vmax Vmin 200 x 100 _ 12 SONY ICX418ALB 5 Dark signal Measure the average value of the signal output Vdt mV with the device ambient temperature 60 and the device in the light obstructed state using the horizontal idle transfer level as a reference 6 Dark signal shading After measuring 5 measure the maximum Vdmax mV and minimum Vdmin mV values of the dark signal output and substitute the values into the following formula AVdt Vdmax Vdmin mV 7 Flicker Set to standard imaging condition II Adjust the luminous intensity so that the average value of the signal output is 200mV and then measure the difference in the signal level between fields AVf mV Then substitute the value into the following formula Fy AVf 200 x 100
10. eset gate clock and GND Capacitance between substrate clock and GND H1 R3 Vertical transfer clock series resistor Vertical transfer clock ground resistor Rew 68 Vo2 C v12 Ro H 1 Hoe Covi Cove ud Covat Cov23 C H ND Cova C v4 j Vo4 V 3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit s oN ICX418ALB Drive Clock Waveform Conditions 1 Readout clock waveform 2 VVHL 1 2 Vvu4 2 Vov Vvun Vvin n 1 to 4 SONY ICX418ALB 3 Horizontal transfer clock waveform tr twh tf VHL 4 Reset gate clock waveform tr twh tf twl VORG RG waveform VI 3 tease S s s ei SOS S s s sss SS SK waveform 42 DV VRGLH is the maximum value and VRaLL is the minimum value of the coupling waveform during the period from Point in the above diagram until the rising edge of RG In addition VRGL is the average value of VRGLH and VRGLL VRGL VRGLH VRGLL 2 Assuming VRGH is the minimum value during the period twh then VoRG VRGH VRGL Negative overshoot level during the falling edge of RG is VRGLm 5 Substrate clock waveform SONY ICX418ALB Clock Switching Readout clock clock Vr 23 ES 25 25 E
11. ip size 7 40mm H x 5 95mm V e Unit cell size 8 4um H x 9 8um V e Optical black Horizontal H direction Front 3 pixels rear 40 pixels Vertical V direction Front 12 pixels rear 2 pixels e Number of dummy bits Horizontal 22 Vertical 1 even fields only e Substrate material Silicon Sony reserves the right to change products and specifications without prior notice This information does not convey any license by any implication or otherwise under any patents or other right Application circuits shown if any are typical examples illustrating the operation of the devices Sony cannot assume responsibility for any problems arising out of the use of these circuits des E01908A41 SONY ICX418ALB USE RESTRICTION NOTICE December 1 2003 ver This USE RESTRICTION NOTICE Notice is for customers who are considering or currently using the CCD products Products set forth in this specifications book Sony Corporation Sony may at any time modify this Notice which will be available to you in the latest specifications book for the Products You should abide by the latest version of this Notice If a Sony subsidiary or distributor has its own use restriction notice on the Products such a use restriction notice will additionally apply between you and the subsidiary or distributor You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products
12. me ICX418ALB Diagonal 8mm Type 1 2 CCD Image Sensor for EIA B W Video Cameras Description The ICX418ALB is an interline CCD solid state 16 pin DIP Ceramic image sensor suitable for EIA B W video cameras with a diagonal 8mm Type 1 2 system Compared with the current product ICXO38DLB basic characteristics such as sensitivity smear dynamic range and S N are improved drastically This chip features a field period readout system and an electronic shutter with variable charge storage time Also this outline is miniaturized by using Original package This chip is compatible with the pins of the ICX038DLB and has the same drive conditions Features e High sensitivity 5 0dB compared with the ICXO38DLB e Low smear 5 0dB compared with the ICXO38DLB e High D range 2 0dB compared with the ICXO38DLB e High S N Optical black position High resolution and low dark current Top View e Excellent antiblooming characteristics e Continuous variable speed shutter e Substrate bias Adjustment free external adjustment also possible with 6 to 14V e Reset gate pulse 5Vp p adjustment free drive also possible with O to 9V e Horizontal register 5V drive e Maximum package dimensions 13 2 Device Structure Interline CCD image sensor e Optical size Diagonal 8mm Type 1 2 e Number of effective pixels 768 H x 494 V approx 380K pixels Total number of pixels 811 H x 508 V approx 410K pixels e Ch
13. ormal using condition consult our company 5 Exposure to high temperature or humidity will affect the characteristics Accordingly avoid storage or usage in such conditions 6 CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks _ 19 Package Outline Unit mm AUOS 16 pin DIP 300mil 3 29 0 3 12 0 0 15 12 35 0 3 26 175 _ 12 0 0 15 12 35 0 3 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT e 0 3 Ceramic GOLD PLATING LEAD MATERIAL PACKAGE MASS 42 ALLOY 0 90g DRAWING NUMBER AS B4 01 E p 5 6 7 8 Center of the package The center is halfway between two pairs of opposite sides A is the center of the effective image area The point B of the package is the horizontal reference The point of the package is the vertical reference The bottom C of the package is the height reference The center of the effective image area relative to the center of the package is H V 0 0 0 15mm The rotation angle of the effective image area relative to H and V is 1 The height from the bottom C to the effective image area is 1 41 0 15mm The tilt of the effective image area relative
14. t exceed 80 C b Solder dipping in a mounting furnace causes damage to the glass and other defects Use a ground 30W soldering iron and solder each pin in less than 2 seconds For repairs and remount cool sufficiently c To dismount an image sensor do not use a solder suction equipment When using an electric desoldering tool use a thermal controller of the zero cross On Off type and connect it to ground 3 Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt Clean glass plates with the following operations as required and use them a Perform all assembly operations in a clean room class 1000 or less b Do not either touch glass plates by hand or have any object come in contact with glass surfaces Should dirt stick to a glass surface blow it off with an air blower For dirt stuck through static electricity ionized air is recommended c Clean with a cotton bud and ethyl alcohol if grease stained Be careful not to scratch the glass d Keep in a case to protect from dust and dirt To prevent dew condensation preheat or precool when moving to a room with great temperature differences e When a protective tape is applied before shipping just before use remove the tape applied for electrostatic protection Do not reuse the tape 4 Do not expose to strong light Sun rays for long periods For continuous using under cruel condition exceeding the n
15. to the bottom is less than 60um The thickness of the cover glass is 0 75mm and the refractive index is 1 5 as measured from B B ANOS 41820
16. u order the Products shall also be applicable to your use of the Products as well as to this specifications book You should review those terms and conditions when you consider purchasing and or using the Products SONY ICX418ALB Block Diagram and Pin Configuration Top View Note Photo sensor VDSUB Pin Description Symbol Pin No Symbo 1 E an Vertcalregistertransterciock 10 vee Vertical registertransterciock GND Substrate cock Reetdanbas _ vor Ver 10 11 12 13 14 15 16 i SONY ICX418ALB Absolute Maximum Ratings Substrate clock GND osto s0 V Vpp VpsuB Vout GND 0 3 to 18 Supply voltage NON lt Veo Voss 5500 V _ Von v v ven V Clock input voltage Ven Ves Ves Vor osus toato Voltage difference between vertical clock input pins m Voltage difference between horizontal clock input pins 04407 e f c em V GND owes V TRU 40 V V Pins other than GND and VL O3t V f Operating temperature 10t0460 ef 1 427V Max when clock width lt 10us clock duty factor lt 0 1 L I I lt lt lt lt lt lt lt SONY ICX418ALB Bias Conditions 1 when used in substrate bias internal generation mode
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