Philips TDA5051A User's Manual
Contents
1. tactive min IDD RX IDD IDD PD 0 MGK845 Fig 14 Power saving by dynamic control of power down 1999 May 31 14 Philips Semiconductors Home automation modem TEST INFORMATION Product specification TDA5051A pulse generator TDA5051A 300 Hz RATA to be tested 50 302 DATA td dem su td dem h MGK838 Fig 15 Test set up for measuring demodulation delay 1999 May 31 15 Philips Semiconductors Product specification Home automation modem TDA5051A coupling CISPR16 network 2 network 4 TXOUT 10 uF 33 nF 47 pH gt Il 1 gt 250 nF TDA5051A 33 nF 47 uH 12 5 g AGND DGND APGND 50 pH 13 3 11 i 150 2 DATA VDDA VDDD VDDAP a P 250 nF 1 2 5V POWER a SUPPLY 50 uH SPECTRUM ANALYSER 50 500 77 77 gt MGK839 1 2 3 4 Square wave TTL signal 300 Hz duty factor 50 for measuring signal bandwidth see spectrum Fig 3 DATA n LOW for measuring total harmonic distortion see spectrum Fig 3 Tuned for fo 132 5 kHz 4 The CISPR16 network provides a 6 dB attenuation Fig 16 Test set up for measuring THD and bandwidth of the TXour signal 1999 May 31 16 Philips Semiconductors Product specification Home automation modem TDA5051A COUPLING SPECTRUM NETWORK ANALY2. 100 105 f Hz 106 Resolution bandwidth 9 kHz top 0 dBV RMS 120 dBuV RMS marker at 5 dBV RMS 115 dBuV RMS the CISPR16 network provides an attenuation of 6 dB so the signal amplitude is 121 dBuV RMS Fig 3 Carrier spectrum 1999 May 31 8 Philips Semiconductors Product specification Home automation modem TDA5051A 1500 Hz RN 4 dBV RMS 60 117 5 132 5 f kHz 147 5 Resolution bandwidth 100 Hz B 20ag 3000 Hz 2 x 1500 Hz Fig 4 Shaped signal spectrum modulated sine wave 122 dBuV amplitude 0 t Gacc t B 8 68 dB 4 AGC range 6 dB ar te AGC lt AGC time constant MGKO11 Fig 5 AGC time constant definition not to scale 1999 May 31 9 Philips Semiconductors Home automation modem TIMING Configuration for clock Product specification TDA5051A GND For parameter description see Table 1 OSC1 OSC1 CLKQUT 7 fosc MICRO XTAL CONTROLLER TDA5051A DGND GND T MGK835 For parameter description see Table 1 Fig 6 External clock C1 OSC2 CLKIn i MICRO CONTROLLER TDA5051A Rp XTAL E Il Fig 7 Typical configuration for on chip clock circuit MGK836 1999 May 31 10 Philips Semiconductors Product specific
3. 47 22 74 8000 Fax 47 22 74 8341 Pakistan see Singapore Philippines Philips Semiconductors Philippines Inc 106 Valero St Salcedo Village P O Box 2108 MCC MAKATI Metro MANILA Tel 63 2 816 6380 Fax 63 2 817 3474 Poland UI Lukiska 10 PL 04 123 WARSZAWA Tel 48 22 612 2831 Fax 48 22 612 2327 Portugal see Spain Romania see Italy Russia Philips Russia Ul Usatcheva 35A 119048 MOSCOW Tel 7 095 755 6918 Fax 7 095 755 6919 Singapore Lorong 1 Toa Payoh SINGAPORE 319762 Tel 65 350 2538 Fax 65 251 6500 Slovakia see Austria Slovenia see Italy South Africa S A PHILIPS Pty Ltd 195 215 Main Road Martindale 2092 JOHANNESBURG P O Box 58088 Newville 2114 Tel 27 11 471 5401 Fax 27 11 471 5398 South America Al Vicente Pinzon 173 6th floor 04547 130 SAO PAULO SP Brazil Tel 55 11 821 2333 Fax 55 11 821 2382 Spain Balmes 22 08007 BARCELONA Tel 34 93 301 6312 Fax 34 93 301 4107 Sweden Kottbygatan 7 Akalla S 16485 STOCKHOLM Tel 46 8 5985 2000 Fax 46 8 5985 2745 Switzerland Allmendstrasse 140 CH 8027 Z RICH Tel 41 1 488 2741 Fax 41 1 488 3263 Taiwan Philips Semiconductors 6F No 96 Chien Kuo N Rd Sec 1 TAIPEI Taiwan Tel 886 2 2134 2886 Fax 886 2 2134 2874 Thailand PHILIPS ELECTRONICS THAILAND Ltd 209 2 Sanpavuth Bangna Road Prakanong BANGKOK 10260 Tel 66 2 745 4090 Fax 66 2 398 0793 Turkey Yukari Dudullu Org San B
4. 48 MHz DATA 300 Hz duty factor 50 see Fig 4 Reception mode analog input signal RMS value DC level at pin RX n RX n input impedance AGC range td dem su AGC time constant demodulation delay set up time fosc 8 48 MHz see Fig 5 fosc 8 48 MHz see Fig 15 ta dem h demodulation delay hold time fosc 8 48 MHz see Fig 15 Baet 1999 May 31 detection bandwidth bit error rate fosc 8 48 MHz fosc 8 48 MHz 600 baud S N 35 dB signal 76 dBuV see Fig 17 Philips Semiconductors Product specification Home automation modem TDA5051A SYMBOL PARAMETER CONDITIONS Power up timing delay between power up XTAL 8 48 MHz and DATA in C1 C2 27 pF transmission mode Rp 2 2 MQ see Fig 10 delay between power up XTAL 8 48 MHz and DATAour in reception C1 C2 27 pF mode Rp 2 2 MQ fRXIN 132 5 kHz 120 dBuV sine wave see Fig 11 Power down timing delay between PD 0 and fog 8 48 MHz DATA n in transmission see Fig 12 mode delay between PD 0 and fog 8 48 MHz DATAoufr in reception fax n 132 5 kHz mode 120 dBuV sine wave see Fig 13 tactive min minimum active time with fosc 8 48 MHz T 10 ms power down frxin 132 5 kHz period in reception mode 120 dBuV sine wave see Fig 14 MGK834 lt 132 5 kHz Vo rms dBV
5. Indonesia PT Philips Development Corporation Semiconductors Division Gedung Philips JI Buncit Raya Kav 99 100 JAKARTA 12510 Tel 62 21 794 0040 ext 2501 Fax 62 21 794 0080 Ireland Newstead Clonskeagh DUBLIN 14 Tel 353 1 7640 000 Fax 353 1 7640 200 Israel RAPAC Electronics 7 Kehilat Saloniki St PO Box 18053 TEL AVIV 61180 Tel 972 3 645 0444 Fax 972 3 649 1007 Italy PHILIPS SEMICONDUCTORS Piazza IV Novembre 3 20124 MILANO Tel 39 02 67 52 2531 Fax 39 02 67 52 2557 Japan Philips Bldg 13 37 Kohnan 2 chome Minato ku TOKYO 108 8507 Tel 81 3 3740 5130 Fax 81 3 3740 5057 Korea Philips House 260 199 Itaewon dong Yongsan ku SEOUL Tel 82 2 709 1412 Fax 82 2 709 1415 Malaysia No 76 Jalan Universiti 46200 PETALING JAYA SELANGOR Tel 60 3 750 5214 Fax 60 3 757 4880 Mexico 5900 Gateway East Suite 200 EL PASO TEXAS 79905 Tel 9 5 800 234 7381 Fax 9 5 800 943 0087 Middle East see Italy For all other countries apply to Philips Semiconductors International Marketing amp Sales Communications Building BE p P O Box 218 5600 MD EINDHOVEN The Netherlands Fax 31 40 27 24825 Philips Electronics N V 1999 a worldwide company Netherlands Postbus 90050 5600 PB EINDHOVEN Bldg VB Tel 31 40 27 82785 Fax 31 40 27 88399 New Zealand 2 Wagener Place C P O Box 1041 AUCKLAND Tel 64 9 849 4160 Fax 64 9 849 7811 Norway Box 1 Manglerud 0612 OSLO Tel
6. 1 mH 1 lt 7v5 t 1 3 W 68 Q 2W A 1N4006 77 5 V MICRO CONTROLLER XTAL 27 pF for 115 2 kHz for a XTAL 7 3728 MHz standard crystal 7 3728 MHz TDA5051A 77 OSC2 DGND APGND AGND 27 pF 47 nF X2 250 V AC F 47 uH low Rs 47 nF 63 V H 47 uH PL SA5 0A MGK843 Fig 22 Application diagram without power line insulation with improved sensitivity 68 dBuV typ 1999 May 31 21 Product specification Philips Semiconductors TDA5051A Home automation modem 250 V AC T 630 mA _L 470 nF x2 max MOV 1000 250 V AC 250 V AC 0 5 W rene low Rs 4 NEWPORT 230 V 76250 2 Zn 5 O T u 6 1v en 1 5 5 V ny 6V RI 100 Q N 1 78L05 2 lt 0808 f j Ai 100 nF 470 uF A F 2 16 V il 63V dern o 22 uH 77 _ 1uF T 16 V 5 V 10 k2 14150 nF kQ 10nF CONTROLLER TDA5051A TXout Bosa JH H t 33 Je IE OSC2 DGND APGND AGND 7 77 2 2MQ XTAL t 7 3728 MHz al SA5 0A A a 77 27pF 27 pF MGK844 77 77 for 115 2 kHz for a XTAL 7 3728 MHz standard crystal Fig 23 Application diagram with power line insulation with improved sensitivity 68 dBuV typ 1999 May 31 22 Philips Semico
7. IEC 134 SYMBOL Vpp PARAMETER MIN MAX UNIT supply voltage 4 5 5 5 V fosc oscillator frequency Tstg storage temperature 50 Tamb 12 MHz 150 C HANDLING ambient temperature 10 80 C Tj junction temperature 125 C Inputs and outputs are protected against electrostatic discharge in normal handling However to be totally safe it is desirable to take normal precautions appropriate to handling MOS devices 1999 May 31 Philips Semiconductors Product specification Home automation modem TDA5051A CHARACTERISTICS Vooo Vppa 5 V 45 Tamb 0 to 70 C Vppp connected to Vppa DGND connected to AGND SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Vpp supply voltage Ipp Rx Tx tot _ total analog digital Vopn 5 V 45 supply current TX or RX mode DD PD tot total analog digital Vpop 5 V 45 supply current PD HIGH Power down mode IpD PAMP power amplifier supply Vpop 5 V 5 current Z 30 Q DATA n LOW in transmission mode IDD PAMP max Maximum power amplifier Von 5 V 5 supply current Z 19 DATA n LOW in transmission mode DATA and PD inputs DATAgyt and CLKour outputs Vin HIGH level input voltage 0 2Vpp 0 9 Vpp 0 5 V LOW level input voltage 0 5 ean a HIGH level output voltage loy 1 6 mA VoL LOW level output voltage lo 1 6 mA OSC1 input and OSC2 output OSC2 only used for driving external quartz cr
8. INTEGRATED CIRCUITS DATA SHEET TDA5051A Home automation modem Product specification 1999 May 31 Supersedes data of 1997 Sep 19 File under Integrated Circuits IC11 Philips PHILIPS Semiconductors DH LI p Philips Semiconductors Product specification Home automation modem TDA5051A FEATURES Full digital carrier generation and shaping Modulation demodulation frequency set by clock adjustment from microcontroller or on chip oscillator High clock rate of 6 bit A D Digital to Analog converter for rejection of aliasing components Fully integrated output power stage with overload protection Automatic Gain Control AGC at receiver input 8 bit A D Analog to Analog converter and narrow digital filtering Digital demodulation delivering baseband data Easy compliance with EN50065 1 with simple coupling network Few external components for low cost applications SO16 plastic package QUICK REFERENCE DATA APPLICATIONS e Home appliance control air conditioning shutters lighting alarms and so on e Energy heating control e Amplitude Shift Keying ASK data transmission using the home power network GENERAL DESCRIPTION The TDA5051A is a modem IC specifically dedicated to ASK transmission by means of the home power supply network at 600 or 1200 baud data rate It operates froma single 5 V supply SYMBOL Vpp PARAMETER supply voltage CONDITIONS MIN TYP MAX UNIT
9. SER 1 502 WHITE NOISE GENERATOR TDA5051A COUPLING NETWORK PARAMETERS to be tested 12 AGND DGND APGND 1 600 BAUD PSEUDO RANDOM SEQUENCE 29 1 BITS LONG V24 TTL V24 SERIAL DATA INTERFACE ANALYSER MGK840 1 See Fig 16 Fig 17 Test set up for measuring Bit Error Rate BER 1999 May 31 17 Philips Semiconductors Product specification Home automation modem TDA5051A APPLICATION INFORMATION en T 630 mA A L zur 47 nF x2 Aso ne 250 V AC T 250V AC 68 Q h 2W 47 uH low Rg 47 nF 45V i mH 63 V 1N4006 ht T a 1 3 W A 1N4006 47 uH 77 1 uF MICRO CONTROLLER Fig 18 Application diagram without power line insulation TDA5051A for 115 2 kHz for a XTAL 7 3728 MHz standard crystal 16V MGK841 1999 May 31 18 Philips Semiconductors Product specification Home automation modem TDA5051A MBH907 20 XN 7 C 103 gain N Be E dB N u N L 0 N 7 input N impedance h W F 9 20 h 4 l Uf L X l 7 40 L4 y 102 3 li N Wy 60 N H _ IO Ad i H vou 80 Y Ws 100 19 10 102 103 104 105 108 f Hz 107 Main features of the c
10. TDA5051A NOTES 1999 May 31 27 Philips Semiconductors Argentina see South America Australia 34 Waterloo Road NORTH RYDE NSW 2113 Tel 61 2 9805 4455 Fax 61 2 9805 4466 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 1 60 101 1248 Fax 43 1 60 101 1210 Belarus Hotel Minsk Business Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 20 0733 Fax 375 172 20 0773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 68 9211 Fax 359 2 68 9102 Canada PHILIPS SEMICONDUCTORS COMPONENTS Tel 1 800 234 7381 Fax 1 800 943 0087 China Hong Kong 501 Hong Kong Industrial Technology Centre 72 Tat Chee Avenue Kowloon Tong HONG KONG Tel 852 2319 7888 Fax 852 2319 7700 Colombia see South America Czech Republic see Austria Denmark Sydhavnsgade 23 1780 COPENHAGEN V Tel 45 33 29 3333 Fax 45 33 29 3905 Finland Sinikalliontie 3 FIN 02630 ESPOO Tel 358 9 615 800 Fax 358 9 6158 0920 France 51 Rue Carnot BP317 92156 SURESNES Cedex Tel 33 1 4099 6161 Fax 33 1 4099 6427 Germany HammerbrookstraBe 69 D 20097 HAMBURG Tel 49 40 2353 60 Fax 49 40 2353 6300 Hungary see Austria India Philips INDIA Ltd Band Box Building 2nd floor 254 D Dr Annie Besant Road Worli MUMBAI 400 025 Tel 91 22 493 8541 Fax 91 22 493 0966
11. able PLCC SO SOJ suitable LOFP QFP TQFP not recommended SSOP TSSOP VSO not recommended Notes 1 All surface mount SMD packages are moisture sensitive Depending upon the moisture content the maximum temperature with respect to time and body size of the package there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them the so called popcorn effect For details refer to the Drypack information in the Data Handbook IC26 Integrated Circuit Packages Section Packing Methods 2 These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink at bottom version can not be achieved and as solder may stick to the heatsink on top version 3 If wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners 4 Wave soldering is only suitable for LQFP TQFP and QFP packages with a pitch e equal to or larger than 0 8 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 65 mm 5 Wave soldering is only suitable for SSOP and TSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm DEFINITIONS Data sheet status Objective specification This da
12. ard smaller than 1 27 mm the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board The footprint must incorporate solder thieves at the downstream end For packages with leads on four sides the footprint must be placed at a 45 angle to the transport direction of the printed circuit board The footprint must incorporate solder thieves downstream and at the side corners During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications Manual soldering Fix the component by first soldering two diagonally opposite end leads Use a low voltage 24 V or less soldering iron applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification Home automation modem TDA5051A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE REFLOW BGA SQFP not suitable HLQFP HSQFP HSOP HTSSOP SMS not suit
13. ation Home automation modem TDA5051A Table 1 Clock oscillator parameters OSCILLATOR CLOCK OUTPUT FREQUENCY CARRIER eae FREQUENCY EXTERNAL COMPONENTS fosc S Vofose 6 080 to 9 504 MHz 95 to 148 5 kHz 3 040 to 4 752 MHz C1 C2 27 to 47 pF Rp 2 2 to 4 7 MQ XTAL standard quartz crystal Table 2 Calculation of parameters depending on the clock frequency SYMBOL PARAMETER CONDITIONS fosc oscillator frequency with on chip oscillator frequency of the crystal quartz with external clock frequency of the signal applied at OSC1 foLKOUT clock output frequency carrier frequency digital filter tuning frequency v ofosc Y 64fosc set up time ofthe shaped burst hold time ofthe shaped burst tw Di min minimum pulse width of DATA signal 23 1472 or 1 tsu F cr minimum burst time of Vo pc signal AGC time constant tw burst min tc AGC tw lt Di min th tsu demod demodulation set up time th demod demodulation hold time 1999 May 31 11 Philips Semiconductors Product specification Home automation modem TDA5051A TXQUT w burst tw burst min Vo DC DATA 1 2 3 MGK837 1 twp gt twipiy min 1 2 twionmin teu 7 cr 3 twioiymin lt tsu Wrong operation Fig 8 Relationship between DATA and TXour see Table 3 Table 3 Rela
14. ese situations reflow soldering is often used Reflow soldering Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Several methods exist for reflowing for example infrared convection heating in a conveyor type oven Throughput times preheating soldering and cooling vary between 100 and 200 seconds depending on heating method Typical reflow peak temperatures range from 215 to 250 C The top surface temperature of the packages should preferable be kept below 230 C Wave soldering Conventional single wave soldering is not recommended for surface mount devices SMDs or printed circuit boards with a high component density as solder bridging and non wetting can present major problems To overcome these problems the double wave soldering method was specifically developed 1999 May 31 24 Product specification TDA5051A If wave soldering is used the following conditions must be observed for optimal results e Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit bo
15. g 6 the clock signal must be applied at pin OSC1 pin 7 OSC2 pin 8 must be left open circuit Fig 7 shows the use of the on chip clock circuit 1999 May 31 Product specification TDA5051A DATAIN DATAQuT VDDD CLKoUT DGND TDA5051AT SCANTEST OSC1 OSC2 Fig 2 Pin configuration All logic inputs and outputs are compatible with TTL CMOS levels providing an easy connection to a standard microcontroller O port The digital part of the IC is fully scan testable Two digital inputs SCANTEST and TEST1 are used for production test these pins must be left open circuit in functional mode correct levels are internally defined by pull up or pull down resistors Transmission mode To provide strict stability with respect to environmental conditions the carrier frequency is generated by scanning the ROM memory under the control of the microcontroller clock or the reference frequency provided by the on chip oscillator High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance The data modulation is applied through pin DATA and smoothly applied by specific digital circuits to the carrier shaping Harmonic components are limited in this process thus avoiding unacceptable disturbance of the transmission channel according to CISPR16 and EN50065 1 recommendations A 55 dB Total Harmonic Disto
16. lg 2 Cad Nr 28 81260 Umraniye ISTANBUL Tel 90 216 522 1500 Fax 90 216 522 1813 Ukraine PHILIPS UKRAINE 4 Patrice Lumumba str Building B Floor 7 252042 KIEV Tel 380 44 264 2776 Fax 380 44 268 0461 United Kingdom Philips Semiconductors Ltd 276 Bath Road Hayes MIDDLESEX UB3 5BX Tel 44 181 730 5000 Fax 44 181 754 8421 United States 811 East Arques Avenue SUNNYVALE CA 94088 3409 Tel 1 800 234 7381 Fax 1 800 943 0087 Uruguay see South America Vietnam see Singapore Yugoslavia PHILIPS Trg N Pasica 5 v 11000 BEOGRAD Tel 381 11 62 5344 Fax 381 11 63 5777 Internet http www semiconductors philips com SCA65 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 295002 25 02 pp28 Philips Semiconductors Date of release 1999 May 31 Document order number 9397 750 05035 Let make things better S PHILIPS
17. nductors Home automation modem PINNING SYMBOL PIN DESCRIPTION DATAN 1 digital data input active LOW DATAout 2 digital data output active LOW 3 digital supply voltage 4 clock output DGND 5 digital ground SCANTEST 6 test input LOW in application 7 oscillator input 8 oscillator output 9 analog ground for power amplifier 1 11 analog supply voltage for power amplifier FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on chip reference oscillator connected to a crystal This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter thus making the performance totally independent of application disturbances such as component spread temperature supply drift and so on The interface with the power network is made by means of an LC network see Fig 18 The device includes a power output stage that feeds a 120 dBuV RMS signal ona typical 30 Q load To reduce power consumption the IC is disabled by a power down input pin PD in this mode the on chip oscillator remains active and the clock continues to be supplied at pin CLKour For low power operation in reception mode this pin can be dynamically controlled by the microcontroller see Section Power down mode When the circuit is connected to an external clock generator see Fi
18. nductors Product specification Home automation modem TDA5051A PACKAGE OUTLINE S016 plastic small outline package 16 leads body width 7 5 mm SOT162 1 Q Ag A ty pin 1 index 5 Re ee Z AH ai l i detail X b 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions A UNIT max Ar A2 As bp c DM EM e He 10 5 7 6 10 1 7 4 0 41 0 30 0 40 0 29 2 65 inches 0 10 Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT162 1 075E03 MS 013AA 2 4 en ISSUE DATE 1999 May 31 23 Philips Semiconductors Home automation modem SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our Data Handbook IC26 Integrated Circuit Packages document order number 9398 652 90011 There is no soldering method that is ideal for all surface mount IC packages Wave soldering is not always suitable for surface mount ICs or for printed circuit boards with high population densities In th
19. nversion is then performed followed by digital band pass filtering to meet the CISPR normalization and to comply with some additional limitations met in current applications LIMITING VALUES Product specification TDA5051A After digital demodulation the baseband data signal is made available after pulse shaping The signal pin RX n is a high impedance input which has to be protected and DC decoupled for the same reasons as with pin TXour The high sensitivity 82 dBuV of this input requires an efficient 50 Hz rejection filter realized by the LC coupling network which also acts as an anti aliasing filter for the internal digital processing see Fig 18 Data format TRANSMISSION MODE The data input DATA is active LOW this means that a burst is generated on the line pin TXout when DATAN pin is LOW Pin TXour is in a high impedance state as long as the device is not transmitting Successive logic 1s are treated in a Non Return to Zero NRZ mode see pulse shapes in Figs 8 and 9 RECEPTION MODE The data output pin DATAour is active LOW this means that the data output is LOW when a burst is received Pin DATAour remains LOW as long as a burst is received Power down mode Power down input pin PD is active HIGH this means that the power consumption is minimum when pin PD is HIGH Now all functions are disabled except clock generation In accordance with the Absolute Maximum Rating System
20. oupling network 50 Hz rejection gt 80 dB anti aliasing for the digital filter gt 50 dB at the sampling frequency 2fosc Input impedance always higher than 10 Q within the 95 to 148 5 kHz band Fig 19 Gain curve 1 and input impedance curve 2 of the coupling network fer 115 2 kHz L 47 uH C 47 nF MBH908 dBuV 120 110 Ziine 2 Fig 20 Output voltage as a function of line impedance with coupling network L 47 uH C 47 nF 1999 May 31 19 Philips Semiconductors Product specification TDA5051A Home automation modem 250 V AC ER L470 nr x2 max sy an l 250 V AC 250 V AC 0 5 W 3 47 uH low Rs NEWPORT 230 V L 76250 1 VA NN 100 Q 4 1 78L05 t Conos 7 Al 100 nF 470 pF ve k jp 16 V 63 V 22 uH 1uF T 16V 5 V MICRO CONTROLLER TDA5051A A OSC2 DGND APGND AGND SA5 0A 2 2 MQ al XTAL 7 3728 MHz t 4 27 pF 27 pF 77 77 MGK842 for 115 2 kHz for a XTAL 7 3728 MHz standard crystal Fig 21 Application diagram with power line insulation 1999 May 31 20 Philips Semiconductors Home automation modem Product specification TDA5051A 250 V AC T 630 mA max MOV 250 V AC 1N4006 y It 2 uF 250 V AC
21. rtion TDH is reached when the typical LC coupling network or an equivalent filter is used Philips Semiconductors Home automation modem The DAC and the power stage are set in order to provide a maximum signal level of 122 dBuV RMS at the output The output of the power stage TXour must always be connected to a decoupling capacitor because of a DC level of 0 5Vpp at this pin which is present even when the device is not transmitting This pin must also be protected against overvoltage and negative transient signals The DC level of TXour can be used to bias a unipolar transient suppressor as shown in the application diagram see Fig 18 Direct connection to the mains is done through an LC network for low cost applications However a HF signal transformer could be used when power line insulation has to be performed CAUTION In transmission mode the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed In this mode the gain chosen before the beginning of the transmission is stored and the AGC is internally set to 6 dB as long as DATAN is LOW Then the old gain setting is automatically restored Reception mode The input signal received by the modem is applied to a wide range input amplifier with AGC 6 to 30 dB This is basically for noise performance improvement and signal level adjustment which ensures a maximum sensitivity of the ADC An 8 bit co
22. ta sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale 1999 May 31 25 Philips Semiconductors Product specification Home automation modem TDA5051A NOTES 1999 May 31 26 Philips Semiconductors Product specification Home automation modem
23. tionship between DATA y and TXout PD DATAN TXout 1 x0 high impedance high impedance after tn active with DC offset Note 1 X dont care tw burst MGKO10 Fig 9 Pulse shape characteristics 1999 May 31 12 Philips Semiconductors Product specification Home automation modem TDA5051A Timing diagrams 90 Vpp VDD 7 CLKoUT gt NOT DEFINED CLOCK STABLE DATAIN y HIGH ta puy Tx MGKO15 DATA is an edge sensitive input and must be HIGH before starting a transmission Fig 10 Timing diagram during power up in transmission mode 90 VpD VDD 7 CLKQUT gt NOT DEFINED CLOCK STABLE RXIN gt NOT DEFINED DATAgyt td puy RX td dem h gt MGKO16 Fig 11 Timing diagram during power up in reception mode 1999 May 31 13 Philips Semiconductors Product specification Home automation modem TDA5051A PD DATAIN TXour l ta pd TX normal operation _ gt _ wrong operation TXoyjr delayed by PD gt MGK017 Fig 12 Power down sequence in transmission mode RXIN gt gt DATAgyt ae td dem su ER eee DATAgyt delayed by PD MGK018 Fig 13 Power down sequence in reception mode RXIN gt gt y k DATAQUT
24. total supply current reception mode Ip tot transmission mode DATA n 0 power down mode fosc 8 48 MHz Z 302 carrier frequency oscillator frequency note 1 V mA mA mA kHz 9 504 output carrier signal on CISPR16 load RMS value fer fosc Vo rms input signal RMS value 122 MHz dBuV total harmonic distortion on CISPR16 load with coupling network BR Tamb Vi rms THD ambient temperature 55 load impedance 1 30 baud rate 600 1200 122 dBuV dB Q bits s 70 C Notes 1 frequency Frequency range corresponding to the EN50065 1 band However the modem can operate at any lower oscillator 2 The minimum value can be improved by using an external amplifier see application diagrams Figs 22 and 23 1999 May 31 Philips Semiconductors Product specification Home automation modem TDA5051A ORDERING INFORMATION mE PACKAGE NUMBER NAME DESCRIPTION VERSION TDA5051AT S016 plastic small outline package 16 leads body width 7 5 mm SOT162 1 BLOCK DIAGRAM DGND AGND VDDA VDDD VDDAP 12 13 modud power DRIVE TX ROM CZ DIA ATG OUT PROTECTION 1 DAC clock APGND 10 DATAIN TDA5051A filter clock PD CLKOUT OSC1 OSCILLATOR OSC2 DIGITAL DIGITAL DATAQUT DEMODULATOR BAND PASS RXIN FILTER DETECT MGK832 TESTI SCANTEST Fig 1 Block diagram 1999 May 31 3 Philips Semico
25. ystal must be left open circuit when using an external clock generator HIGH level input voltage Vin Vit LOW level input voltage HIGH level output voltage loy 1 6 mA VoL LOW level output voltage lo 1 6 mA oscillator frequency on ratio between oscillator 64 FE and carrier frequency cr f ratio between oscillator 2 osc f and clock output frequency CLKOUT Transmission mode fer carrier frequency fosc 8 48 MHz 132 5 tsu set up time of the shaped fosc 8 48 MHZ 170 burst see Fig 8 th hold time of the shaped fosc 8 48 MHZ 170 burst see Fig 8 1999 May 31 6 Philips Semiconductors Home automation modem SYMBOL PARAMETER CONDITIONS Product specification TDA5051A tw DI min Dl minimum pulse width of DATA signal output carrier signal RMS value power amplifier maximum output current peak value fosc 8 48 MHz see Fig 8 Z CISPR16 DATA n LOW Z 18 DATA n LOW lo max Zo output impedance of the power amplifier output DC level at pin TXout Vo THD total harmonic distortion on CISPR16 load with the coupling network measured on the first ten harmonics bandwidth of the shaped output signal at 20 dB on CISPR16 load with the coupling network Volrms 121 dBuV on CISPR16 load fosc 8 48 MHz DATA n LOW no modulation see Figs 3 and 16 Vo rms 121 dBuV on CISPR16 load fosc 8
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