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Intel Computer Hardware Express Chipset User's Manual

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1. n tel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit Use two 6 32 screws to partially tighten the rear end of the heatsink to the board and the SRM as shown in Figure 9 The screw uses the threaded holes of the SRM for retention Figure 9 Tighten the heatsink on the SRM and board Intel Q965 Express Chipset October 2007 DM 37 Order Number 315664 002US Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset n tel Use two 6 32 nuts and two bolts to secure the front side of the heatsink to the SRM The screw can be dropped from the top and use a nut at the bottom or the screw can be inserted from the base of the SRM into the heatsink based on the accessibility of the system Figure 10 Secure the front side of the heatsink to the SRM Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 38 intel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit Tighten the screws at the rear end of the heatsink as shown in the figure below Figure 11 Secure the read end of heatsink to the SRM E Note Please make sure all the screws are tightened before using the system 8 Plug the processor heat sink fan into J 3TH 9 Connect the SATA drive through SATA cable into J 24LB SATA 0 Connect a power cable to the SATA drive 10 Optional Plug the floppy disk drive
2. Boot Devices Includes Fixed media and removable media Not that critical since consoles should be up at this point OxBF is unrecoverable error OxCO OxCF Reserved for future OxD0 0xDF Boot Device Selection OxFO OxFF OxFF processor exception OxEO OxEE Miscellaneous codes See below OxEF boot S3 resume failure OxBO OxBF OxEO OxFF Intel Q965 Express Chipset DM October 2007 47 Order Number 315664 002US Error Messages and Beep Codes l ntel Q965 Express Chipset l n tel Table 26 October 2007 Port 80h Progress Code Enumeration Port 80 code Progress Code Enumeration Power on initialization of the host processor Boot Strap Processor 0x11 Host processor Cache initialization including APs 0x12 Starting Application processor initialization SMM initialization 0x24 Programming timing parameters in the memory controller and the DIMMs 0x25 Configuring memory 0x26 Optimizing memory settings 0x27 Initializing memory such as ECC init Testing memory 0x50 Enumerating PCI busses 0x51 Allocating resources to PCI bus 0x52 Hot Plug PCI controller initialization 0x53 0x57 Reserved for PCI Bus Resetting USB bus Reserved for USB ATA ATAPI SATA Resetting PATA SATA bus and all devices 0x5B Reserved for ATA LOCAL CONSOLE Intel Q965 Express Chipset DM Order Number 315664 002US 48 n tel Intel Q965 Express Chipset Error Messages and Beep Codes Port 80 code
3. Dynamic data such as event detection and error logging Non Plug and play operating systems such as Microsoft Windows NT require an additional interface for obtaining the SMBIOS information The BIOS supports an SMBIOS table interface for such operating systems Using this support an SMBIOS service level application running on a non Plug and Play operating system can obtain the SMBIOS information Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system s USB drivers are not yet available Legacy USB support is used to access the BIOS Setup program and to install an operating system that supports USB Legacy USB support operates as follows 1 When you apply power to the computer legacy support is disabled 2 POST begins 3 Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu 4 POST completes 5 The operating system loads While the operating system is loading USB keyboards and mice are recognized and may be used to configure the operating system After the operating system loads the USB drivers all legacy and non legacy USB devices are recognized by the operating system and Legacy USB support from the BIOS is no longer used To install an operating system that supports USB follow the operating system s installation instructions Boot Options In the BIOS Setup program the u
4. Supports external PCI Express x16 graphics card Audio Intel High Definition Audio subsystem 8 channel 7 1 audio subsystem and two S PDIF digital audio outputs using the ADI audio codec Legacy O Control Port Angeles 3 0 Super I O controller for diskette drive serial parallel and PS 2 ports October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 12 n tel Intel Q965 Express Chipset Development Kit Hardware Features Table 3 Development Kit Features Summary Sheet 2 of 2 Form Factor 4 Layer uBTX 10 5 inches x 10 4 inches Six SATA 1 5 3 0 Gb s ports Ten Universal Serial Bus USB 2 0 ports Three front panel headers for support of six front panel ports and four back panel ports Three 1394a PCI controller 2 front headers for support of two ports and one back panel port Disabled in this Development Kit PS 2 style keyboard and PS 2 mouse 6 pin mini DIN connectors One VGA connector provides access to integrated graphics Six analog audio connectors Line in Line out MIC in Surround L R Surround L R Rear Center and two digital audio connectors driven by Intel High Definition Audio One parallel port One diskette drive interface Peripheral Interfaces Gigabit 10 100 1000 Mbits s LAN subsystem using the Intel 82566DM Gigabit LAN Support Ethernet Controller Support for Advanced configuration and power interface ACPI plug
5. ssssssssssss Hee seen nnns 33 4 3 1 Memory ConfigUratlOns aient rere kk ea UG E o ER RH RU Ha d OR o 40 4 4 Audio Subsystem Configurations mese ne nnn nnns 43 4 4 1 Eight Channel 7 1 Audio Subsystem sssssssssssssse mmm 43 4 5 LAN Subsystem Configurations cece eee ener mme nemen nne 44 4 5 1 Gigabit LAN Subsystem iacere dna ehh ene aa eden ce asada E Fra ee ae 44 4 5 2 RJ 45 LAN Connector with Integrated LEDs ssssssesee me 45 4 6 Software Kit InstallatiQni iicoeseet rettet ERR RRRRRRRRIEYERRERRRRRRRERARESEXRRAPR RR ZRRERYRXE 45 Intel Q965 Express Chipset DM 3 October 2007 315664 002US Intel Q965 Express Chipset i n te 4 6 1 Installation of a new Operating System cssssssssse me 45 4 6 2 Drivers Installaatio sinisini ecu hern t mp Reg Rn n ort Rc Kg RO gue NR healt m Rn 45 5 0 Error Messages and Beep Codes ccc ene een nee meer nnns 46 5l Speaker erg H ERRARE EE oc RRREXRRRINFERRAXERRINIRRRAR ERRARE g amp GGGg ede danas a E Lada s 46 5 2 BIOS Beep Cod6Gs iis esr RRERIRRRA YER NR RRYX PR RDURIERSRR Y XX EE RA RE AX 4G n SR EFE E Y eaten 46 5 3 BIOS Error Messages s secca extern ter R gen RATE NEU NR n koe Pi Ko ROT SR KR KR DR 46 5 4 Port 80h POST GO0 65 co eere ee di Garhi acd adea e ERROR ETC d TR RO asa 47 Figures 1 Dev Kit Board Main Components Headers and Jumper Locations sess 14 2 Rear Panelil O CONNCCtOrS
6. 2 12V 12V 3 12V 12V 4 GND GND 5 SMCLK JTAG2 6 SMDAT JTAG3 7 GND JTAG4 8 3 3V JTAG5 9 JTAG1 3 3 V 10 3 3 Vaux 3 3V 11 WAKE PWRGD Key 12 RSVD GND 13 GND REFCLK Intel Q965 Express Chipset DM Order Number 315664 002US 20 intel Intel Q965 Express Chipset Development Kit Hardware Features Table 10 PCI Express x1 Pinout Pin Number Side B Side A 14 HSOPO REFCLK 15 HSONO GND 16 GND HSIP1 17 PRSNT2 HSIN1 18 GND GND Note End of x1 Connector 2 3 8 Front Panel Header Power up amp Reset This development kit board use front panel header J 28LB for powering up and board reset Refer to Table 11 for the front panel header lists The front panel header is a 2x5 header designated as J 28LB The following table outlines the pin out and functionality of this header Table 11 Front Panel Jumper Setting Pin Signal Name Description 1 HDD LED Anode HDD LED Anode 2 Green Power LED 3 HDD LED Cathode HDD LED Cathode 4 Yellow Power LED 5 Ground 6 Switch On 7 Reset 8 Ground 9 Power VCC 10 KEY No pin 2 3 9 Front Panel USB Header The front panel USB header is a 2x5 header designated as J 14LB J15LB or J 16LB The following table outlines the pin out and functionality of this header Table 12 Front Panel USB Header Sheet 1 of 2 Pin Signal names Description I VREG FP USBPWR Front panel USB power Por
7. Chipset DM October 2007 23 Order Number 315664 002US Development Kit Hardware Features l ntel Q965 Express Chipset l n tel 2 3 13 SATA Pinout Table 17 SATA Pinout Pin Signal Name 1 GND 2 TXP 3 TXN 4 GND 5 RXN 6 RXP 7 GND 2 3 14 Fan Connectors Table 18 Fan connectors Pin Signal Name 1 GND 2 12V 3 RPM 4 Control 2 4 Thermal Considerations The development kit is shipped with a BTX TYPE heatsink fan thermal solution for installation on the processor BTX systems are designed so that all the high power components are in line and can be cooled using a single continuous airflow stream The BTX Thermal Module Assembly TMA provides airflow to the central processing unit microprocessor and its voltage regulation VR which is located at the front of the system and then to the memory controller G MCH Input Output controller ICH and the add in card AIC in the first slot position This same airflow supply pattern is available in all BTX system designs The Thermal Module Assembly TMA consists of 4 main parts The 92mm four wire fan The plastic duct assembly black The heatsink copper and aluminum The metal retention clip for holding the heatsink to the plastic duct assembly Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 24 m n tel Intel Q965 Express Chipset Development Kit Hardware Features F
8. Considerations vii iieri reas a ket ERE RR AAN NEA AE RERTNRRE RR RRRPYRR IER 24 3 0 Development Kit Software and BI OS Features cece teeter emen 26 2 1 Software Key Features iere aarin eann rE Gand Re a EO RR UR FERAT KE EE RU Dd adea d dak 26 3 2 BIOS Feature oa toco od anes tan Lanes nho Uc S33 crar RU syed ede Urt UL DU RC sea p UU 26 3 2 1 BIOS OVervVIGW iicsisesseso spe ER ERRRARRRERRR denied XPRGERRERRRERERRRrR atid REY PRRRRR eiii 26 3 2 2 Resource ConflgUraltiOn sicci RR REF RURERXP EDO DU E RN FERREA REG 27 3 2 3 System Management BIOS SMBIOS ssssssssssseem mmn 27 3 2 4 Legacy USB SUppOTt e rt REOR RECHQO FERRE ERE RERSERIDRIRERIRERRERU ER UMEN IUE 28 3 2 5 Boot Options osse skpeerbe se RR RURRRERERTRRKRPRRRX ERR REXZREBRRIRERRRRRRRKRRY PR RRERERT PRA REG 28 3 2 0 BIOS Security Features oic eer ERE n a EEEE NEEE ERE AR DE DER 29 3 3 Graphics DFrIVGES cuente tr eer rege Dub eek e datar AAA EEE E Ue R4 o REA RUE d Rx Y been 29 3 4 Intel Active Management Technology sssee eee nennen 30 3 5 Intel Quiet System Technology etatem pnt era terne tint bir a d ee 31 4 0 Setting Up amp Configuring the Development Kit sssssssseseenm 32 4 1 ONGIVIGW a ieieseeise exin RREXRRRAR EXER SERRA R RERIN ER EAn EAA ERR RR ER RTER ER E E RR M PREX EXER Ria 32 4 2 Additional Hardware amp Software Required sess menm 33 4 3 Setting Up the Evaluation Board
9. Once the image is loaded onto the platform and the clean build of OS is done Install all the relevant drivers Intel Chipset Software Installation Utility Chipset INF files needs to be installed first Intel Embedded Graphics Drivers or Intel Graphics Media Accelerator Drivers Intel PRO Network Connections LAN Driver Others optional HECI driver AMT Serial Over LAN Intel Management Engine Interface Driver QST Intel Matrix Storage Manager After installation go to device manager and make sure there are no Yellow bangs on the devices Intel Q965 Express Chipset DM October 2007 45 Order Number 315664 002US Error Messages and Beep Codes I ntel Q965 Express Chipset l n tel 5 0 5 1 5 2 Table 23 5 3 October 2007 Error Messages and Beep Codes This chapter describes the various progress codes that are reported by the BIOS and the corresponding LED Codes The LED codes are 8 bit quantities and can be used as Port 80 codes if the platform supports Port 80 capturing device The higher nibble alone is used for a 4 bit LED The Status code driver is responsible for translating the Standard Progress Error code into a one byte value The particular enumeration scheme is set up so that the Port 80 code values will typically increase during the boot process The early codes are for subsystems closer to the processor and the later codes are for peripherals Typically the order of initi
10. Progress Code Enumeration 0x31 Crisis Recovery has initiated by software corrupt flash 0x34 Loading recovery capsule Handing off control to the recovery capsule Ox3F Unable to recover Table 27 Typical Port 80h POST Sequence Sheet 1 of 2 Port 80 code Progress Code Enumeration Initializing a chipset component Reading SPD from memory DIMMs 0x23 Detecting presence of memory DIMMs 0x25 Configuring memory Loading recovery capsule Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 50 n tel Intel Q965 Express Chipset Error Messages and Beep Codes Table 27 Typical Port 80h POST Sequence Sheet 2 of 2 0x13 SMM initialization Enumerating PCI busses Ox5A Resetting PATA SATA bus and all devices Detecting the presence of the keyboard Intel Q965 Express Chipset DM October 2007 51 Order Number 315664 002US Error Messages and Beep Codes I ntel Q965 Express Chipset l n tel Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 52
11. This interface is not electrically compatible with the previous digital display channel DVO For the 82Q965 GMCH it will be multiplexed on a portion of the x16 graphics PCI Express interface SDVO Device Third party codec that uses SDVO as an input May have a variety of output formats including DVI LVDS HDMI TV out etc SERR System Error An indication that an unrecoverable error has occurred on an I O bus SMI System Management Interrupt SMI is used to indicate any of several system conditions such as thermal sensor events throttling activated access to System Management RAM chassis open or other system state related activity SOL Serial Over LAN SPI Serial Peripheral Interface SST Simple Serial Transport October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 10 intel Table 1 1 4 1 4 1 1 4 2 1 5 Table 2 Intel Q965 Express Chipset About This Manual Glossary of Terms and Acronyms Sheet 3 of 3 Term Description A unit of DRAM corresponding to eight x8 SDRAM devices in parallel or four x16 SDRAM Rank devices in parallel ignoring ECC These devices are usually but not always mounted on a single side of a DIMM UMA Unified Memory Architecture Describes an IGD using system memory for its frame buffers Note 1 Intel virtualization Technology Intel VT and Intel 64 Architecture require a c
12. and play and BIOS SMBIOS AMI system BIOS One PCI bus connectors papse cu One PCI Express x16 bus add in card connector apabilities Two PCI Express x1 bus add in card connectors Trusted Platform Module TPM 1 2 support Manageability Engine ME support ME Enabled LED red blink Intel Active Management Technology Intel AMT with System Defense support Intel Quiet System Technology Intel QST support Intel Matrix Storage technology with RAID 0 1 5 10 support Piezo speaker for BIOS POST codes PORT 80 Display Thermal Diode header BIOS configuration jumper Additional Clear CMOS header Features Force On header XDP SSA connector Internal I O headers e 2x5 Front Panel I O header 2x7 Front Panel audio header 1x2 Chassis intrusion header 3four wire fan headers 2x5 Serial port header 2x8 High Definition audio header e 20 pin LPC header 2 3 Board Layout Figure 1 shows the location of the major components headers and jumpers Intel Q965 Express Chipset DM October 2007 13 Order Number 315664 002US Development Kit Hardware Features l ntel Q965 Express Chipset Figure 1 Dev Kit Board Main Components Headers and Jumper Locations J13LB DS2EV Jing 312LB DSJEV J1TM J7LH J8AU JAMY J2MY J3MY J4MY 2 3 1 Core Components Table 4 Core Components Reference Component Description Designator J1PR LGA775 processor socket U1UB Intel
13. contact your nearest Intel representatives for the QST OEM Bring up Guide Intel Q965 Express Chipset DM 31 October 2007 Order Number 315664 002US m Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset n tel 4 0 Setting Up amp Configuring the Development Kit This chapter identifies the evaluation kit basic board s set up and operation Please refer to Chapter 2 0 for the board layout jumper setting location and the component reference designator 4 1 Overview The following hardware is included in the development kit One Intel Q965 Express Chipset Development Kit reference board One Intel Core 2 Duo processor E6400 2 13GHz One BTX Type Thermal Module Assembly TMA CPU fan heatsink One Support and Retention Module SRM heatsink mounting plate Two 512 Mbyte DDR2 667MHz unbuffered DIMMs One Pre programmed and installed 2 MB SPI Flash Figure 5 Development Kit Board Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 32 m n tel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit 4 2 Additional Hardware amp Software Required Before you set up and configure your evaluation board you may want to gather some additional hardware and software VGA or LCD Monitor You can use any standard VGA or multi resolution LCD monitor The setup instructions in this chapter assume that you are using a standa
14. si scsisc cctiaeensicparie EP ERR AR SER RRRERER aa E ena ida CINERE TREE E eaa 17 3 BTX Type Thermal Module Assembly TMA sssssssssssseemm Hmm 25 4 Mer Barr re ee RRERLER EPRMRRE TRERIXRERERITUREERKFK Y IRRRER RR RETRER IR GG tea ene E Xin ae Ra es 26 5 Development Kit BOard vised iscsi ehm E ER seeds tea YERRXNRRRG RU EATER Ganka WERTE ERR Raga P FRRRAG ER 32 6 Align the Development Kit Board and SRM ssssssssssse Hmmm 34 4 Assembled SRM and bo amp rd icis ek REX RR ERRRRRRR R3NR RERPA RR kinaden IR XAR FaRRY Ia bags 35 8 Align the heatsink with holes on the SRM and board sssssssee eee ete eaees 36 9 Tighten the heatsink on the SRM and DOAMr cece eee eee memes 37 10 Secure the front side of the heatsink to the SRM sssssssssssee mene 38 11 Secure the read end of heatsink to the SRM ssssssssssse menn 39 12 Memory Channel and DIMM Configuration isssssssss Hen mene 40 13 Dual Channel Interleaved Mode Configuration with two DIMMS ssseseenR 41 14 Dual Channel Interleaved Mode Configuration with three DIMMS sess 41 15 Dual Channel Interleaved Mode Configuration with four DIMMs sse 42 16 Single Channel Asymmetric Mode Configuration with one DIMM sse 42 17 Single Channel Asymmetric Mode Configuration with 3x DIMMS ccce 43 18 Back Panel Audio Connector Options for Eight channel Audio Subsystem s
15. through the ribbon cable into J 4LH Connect a power cable to the floppy drive 11 Insert the two DDR2 memory enclosed in the kit are two 512 Mbyte DDR2 667MHz unbuffered DIMMs into slots J 1MY and J 3MY Optional to insert DDR2 memory into slots J 2MY and J 4MY 12 Insert a USB CD or DVD into one of the USB ports J 17LB at the back panel Optional to plug a SATA CD or DVD into J 22LB 13 Connect a PS 2 Keyboard into J 5LH purple connector at the back panel Optional to connect a USB keyboard into J 17LB 14 Connect a PS 2 Mouse into J 5LH green connector or a USB Mouse into one of the USB ports J 17LB at the back panel 15 Optional to connect a PCI Express x16 graphics card into J 6UB Optional to install a MEC card into J 6UB 16 Plug the front panel header cable into J 28LB 17 Plug the monitor into the VGA connector J 4UB or Plug the monitor into the add in graphics card s video connector 18 Optional to connect the audio speakers to J4AU and J5AU Please refer to Chapter 2 0 for details Intel Q965 Express Chipset DM 39 October 2007 Order Number 315664 002US Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset l n tel 19 Optional to connect an Ethernet cable to LAN Magjack connector at J 18LB 20 Connect a standard recommended BTX power supply to the board Plug the BTX 2x12 connector into J 2BV power supply header Plug the BTX 2x2 12V connector into J 1BV 21
16. 2 BTX Power COnDneCctOr eeessiueemateseu renti o dace doe KEIRA R RE Un RT KR Ra E GU Rae E nal ate 23 16 2x2 Auxiliary 12V Power Connector esses nnns nnne nnn nn nnn 23 I7 SATA JPinol ine uk rir em rbd ED Ed ehia pad RN E UI RA 24 18 Fan connectors sssi ciadain p RE REY GGG GRO R RXRRG KRRRGAG PAGAR RD A RRIX ERER X GRGY RR RRaG PARS ae ERR Pad 24 19 BIOS Setup Program Menu Bar siccis rentre eO RR XR RE EEPRER RR E TOE ERIEE XXI YGyU E Fe xR E denen 27 20 BIOS Setup Program Function Keys cece eene eee sehen nennen nnne nnn 27 21 Back panel task Audio 5m ree e tr ee PREFEO ERI E IER EK REPRE De DL I ERN REF RUN 44 22 LAN Connector LED Stats hone n ipae hr e Ek ante RE REIR ERR XU E pentane KEMAR RE KR ange dada 45 October 2007 315664 Intel Q965 Express Chipset DM 002US 4 n tel Intel Q965 Express Chipset Beep CodeS icri ere veg nia ea e ERA E DU EF VERDE E aa ip a eo aa b 46 Lists of error messages and brief description of each sssssssssssee nne 47 Port 80 POST Code RINGES cei cene oer ra ae De X patina dea eR adc aca aed 47 Port 80h Progress Code Enumeration sssssssssssseeen mne eee eee nnn 48 Typical Port 80h POST Sequence iios reser ker try nne ce n isda dada Sab E ee Eva ek bars Fere d d 50 Intel Q965 Express Chipset DM 5 October 2007 315664 002US Intel Q965 Express Chipset l n tel Revision History Date Revision Descriptio
17. 4 IntelSX2 Intel Core Intel Inside Intel Inside logo Intel Leap ahead Intel Leap ahead logo Intel NetBurst Intel NetMerge Intel NetStructure Intel SingleDriver Intel SpeedStep Intel StrataFlash Intel Viiv Intel vPro Intel XScale IPLink Itanium Itanium Inside MCS MMX Oplus OverDrive PDCharm Pentium Pentium Inside skoool Sound Mark The Journey Inside VTune Xeon and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries Other names and brands may be claimed as the property of others Copyright 2007 Intel Corporation All Rights Reserved Intel Q965 Express Chipset DM October 2007 2 Order Number 315664 002US n tel Intel Q965 Express Chipset Contents 1 0 About This Mariual orco etri dr pcena ar paene Fn RR PER LUE RA UAR RERERE ERU PRX T EUR a 7 l L Content OVervIGW ciceeieisena eara XA ED PLA E GU E EO OE EAR a ED ea c le aa TER 7 1 2 TextConventlons 23 0 pr tet A KE R RA DO RUE REOR ong ERR RT CEU R e e RO NE Rd e 7 1 3 Glossary of Terms and Acronyms ssssssssssssssensen eene enne nnne nnn nnn 8 1 4 Support ODELOFRS itx rex eee dedicada Eid e RR o aD UR RR ON pas wae n di 11 1 4 1 Electronic Support SYSTEMS rrisin ene ee enna nnn nnns 11 1 4 2 Additional Technical Support ir serienn eeann Ens Henne 11 1 5 Product Literat le iiiieesss e eser ERERRERERRRR E RRRR gREXPRARERREREXRERRERRRR RP RI XR a
18. B2 SATA and other I O functions It communicates with the G MCH over a proprietary interconnect called DMI Intel amp QST Intel Quiet System Technology Intel amp Smart Memory Access Optimizes functions for reducing wait time moving data and accelerating out of order execution keep the pipeline full improving instruction throughput and performance Intel Q965 Express Chipset DM 9 October 2007 Order Number 315664 002US m About This Manual I ntel Q965 Express Chipset l n tel Table 1 Glossary of Terms and Acronyms Sheet 2 of 3 Term Description Intel VT Intel Virtualization Technology Intel VT allows one hardware platform to function as multiple virtual platforms For businesses Intel VT Technology Intel VT offers improved manageability limiting downtime and maintaining worker productivity by isolating computing activities into separate partitions Intel Wide Dynamic Execution Improves execution speed and efficiency delivering more instructions per clock cycle Each core can complete up to four full instructions simultaneously IGD Internal Graphics Device LCD Liquid Crystal Display LVDS Low Voltage Differential Signaling A high speed low power data transmission standard used for display connections to LCD panels MEBx Management Engine BIOS Extensions MEC Media Expansion Card Provides digital display opt
19. D PER3 or PERn3 NC 31 PRSNT2 SDVO CtriData GND GND 32 GND GND RSVD RSVD End of x4 Connector 33 PET4 or PETp4 NC RSVD RSVD October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 18 intel Table 9 Intel Q965 Express Chipset Development Kit Hardware Features Intel amp SDVO to PCI Express connector mapping for MEC cards Sheet 2 of 3 mm Side B Side A 34 PET4 or PETn4 NC GND GND 35 GND GND PER4 or PERp4 NC 36 GND GND PER4 or PERn4 NC 37 PETS or PETp5 NC GND GND 38 PETS or PETn5 NC GND GND 39 GND GND PER5 or PERp5 NC 40 GND GND PER5 or PERn5 NC 41 PET6 or PETp6 NC GND GND 42 PET6 or PETn6 NC GND GND 43 GND GND PER6 or PERp6 NC 44 GND GND PER6 or PERn6 NC 45 PET7 or PETp7 NC GND GND 46 PET7 or PETn7 NC GND GND 47 GND GND PER7 or PERp7 NC 48 PRSNT2 ADD2 _Enable PER7 or PERn7 NC 49 GND GND GND GND End of x8 Connector 50 PET8 or PETp8 SDVOC_CIk RSVD RSVD 51 PET8 or PETn8 SDVOC Clk GND GND 52 GND GND PER8 or PERp8 NC 53 GND GND PER8 or PERn8 NC 54 PET9 or PETp9 SDVOC Blue GND GND 55 PET9 or PETn9 SDVOC Blue GND GND 56 GND GND PER9 or PERp9 NC 57 GND GND PER9 or PERn9 NC 58 PET10 or PETp10 SDVOC_Green GND GND 59 PET10 or PETn10 SDVOC_Green GND GND 60 GND GND feign NC 61 GND GND dii
20. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them Intel processor numbers are not a measure of performance Processor numbers differentiate features within each processor family not across different processor families See http www intel com products processor number for details The Intel Q965 Express Chipset may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Hyper Threading Technology requires a computer system with an Intel Pentium 4 processor supporting HT Technology and a HT Technology enabled chipset BIOS and operating system Performance will vary depending on the specific hardware and software you use See http www intel com products ht Hyperthreading more htm for additional information Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or by visiting Intel s website at http www intel com BunnyPeople Celeron Celeron Inside Centrino Centrino logo Core Inside Dialogic FlashFile i960 Instantl P Intel Intel logo Intel386 Intel486 Intel740 IntelDX2 IntelDX
21. J15LB USB Front Panel Header J16LB USB Front Panel Header jam uec BUS Header TPM True um T m JiFW 1394a Front Panel Header Disabled J2FW 1394a Front Panel Header Disabled J9LB Power Button J8LB Reset Button yc xor ssa uo dle 2 3 5 Back Panel Connectors Figure 2 shows the location of the back panel connectors for boards equipped with the 8 channel 7 1 audio subsystem The back panel connectors are color coded The figure legend lists the colors used when applicable October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 16 n tel Intel Q965 Express Chipset Development Kit Hardware Features Figure 2 Rear Panel I O Connectors Table 8 Back panel connectors po Tom Designator Description A J5LH PS 2 mouse port Green B J5LH PS 2 keyboard port Purple C J1AU S PDIF Digital audio output D J2AU S PDIF Digital audio input E J6LH Parallel port Burgundy F J4UB VGA Port ina nM H JAILN RJ 45 LAN connector l J3FW 1394 Port present but disabled J J5AU Rear Speaker Out K J5AU Side Speaker Out L J18LB Back Panel USB Ports 3 and 4 Overlapping with LAN Mag ack JALLN M J5AU Center channel and Subwoofer audio out N J4AU MIC In O J4AU Audio Line In P J4AU Audio Line Out Front Speaker Out 2 3 6 PCI Express x16 MEC Slot The PCI Express x16 slot is following the industry PCI Express x16 connector stand
22. KR eRaees 11 2 0 Development Kit Hardware Features sssssssssssssessesse mensem 12 MENO UT 12 2 2 Intel Q965 Express Chipset Development Kit Features Summary ses 12 2 3 Board Layout ti hbiei e E enii enni RRRRRARERRR ER nannini enai eeii 13 2 3 1 Core Components sisse reb ert eur dea EERE ER RO DEDERE 14 2 3 2 Jumper Settings and Descriptions cece cette eee eee eee eee a teeta eaten tas 15 2 3 3 LED D SGHIPUONS isses nne iE HR RC R REX OR ERREUR KR ANE RP RS RIDRIRRRITERGERR ERE UMEN TUN 15 2 3 4 Header and Connector Descriptions ssssssse mmn 15 2 3 5 Back Panel Connectors srini siin E E aE E EN ERE RERUCER aE EA 16 2 3 6 PCI Express x16 MEC Slot sssssssssssseeeneeemenmeeme nemen nnn nnn 17 2 3 7 JPCLEXDress X Tenian cinereae ed eterni ELEM EEEE E stadia k QURE FERE E REIR ER 20 2 3 8 Front Panel Header Power up amp Reset ssssssssssssee mmn 21 2 3 9 Front Panel USB Header iecit a tnn tae d a RETE KG E T NAA X cals 21 2 3 10 Front Audio Header iieenssix esi thee t ek nga Rie EXER ane RELIER REOR E EUER REX RR E ERA 22 2 3 11 High Definition Audio Header ssssssssssse mmm nen 22 2 3 12 BTX Power GOnrectO s isin iex Enae EINEN Kee PEDE ODE ERR EENE ERN IRE 23 2 3 13 SATA PIDOUE d etie inire tie Rerke x RATE I ERU Rada E REX RARE ENA 24 2 3 14 Fan CONNECTS ei ex eet nae NIRE ERR RERUOERERNREE Y DEI ERR AE ORE ete 24 2 4 Thermal
23. Press the J9LB Power Button to power up the board Turn on the power to the monitor and evaluation board Ensure that the fan sink on the processor is operating 4 3 1 Memory Configurations The Intel Q965 MCH supports two types of memory organization Dual channel Interleaved mode This mode offers the highest throughput for real world applications Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal If different speeds DIMMs are used between channels the slowest memory timing will be used Single channel Asymmetric mode This mode is equivalent to single channel bandwidth operation for real world applications This mode is used when only a single DI MM is installed or the memory capacities are unequal Technology and device width can vary from one channel to the other If different speeds DIMMs are used between channels the slowest memory timing will be used Figure 12 Memory Channel and DI MM Configuration Channel A DIMM 0 Channel A DIMM 1 Channel B DIMM 0 Channel B DIMM 1 Intel Q965 Express Chipset DM October 2007 40 Order Number 315664 002US n tel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit 4 3 1 1 Dual Channel Interleaved Mode Configurations Figure 13 shows a dual cha
24. Progress Code Enumeration Resetting the VGA controller 0x71 Disabling the VGA controller Enabling the VGA controller 0x9 Detecting the presence of the keyboard 0x9 Enabling the keyboard 0x9 Clearing keyboard input buffer 0x9 Instructing keyboard controller to run Self Test PS2 only Mouse PS2 OR USB 0x98 Resetting mouse 0x99 Detecting mouse OxB3 Enabling configuring a fixed media Removable Media Resetting removable media Disabling removable media Detecting presence of a removable media IDE CDROM detection etc Enabling configuring a removable media Trying boot selection y y 0 to 15 PEI Core Started dispatching PEIMs emitted on first report of EFI SW PC INIT BEGIN EFI SW PEI PC HANDOFF TO NEXT Permanent memory found OxE1 0xE3 Reserved for PEI PEIMs OxEO Intel Q965 Express Chipset DM October 2007 49 Order Number 315664 002US Error Messages and Beep Codes I ntel Q965 Express Chipset l n tel Port 80 code Progress Code Enumeration DXE Core Entered DXE phase Started dispatching drivers Started connecting drivers 0xE7 Waiting for user input OxE8 Checking password OxE9 Entering BIOS setup OxEA TBD Flash Update OxEB Calling Legacy Option ROMs OxEE TBD Calling Int 19 One beep unless silent boot is enabled OxEF TBD Unrecoverable Boot failure S3 resume failure PEI MS RECOVERY Crisis Recovery has initiated per User request Port 80 code
25. Q965 G MCH U1LB Intel ICH8DO U1LN Intel 82566DM Gb LAN chip U1CK Clock Generator CK505 U1LH Super I O Port Angles U1AU Audio Codec U2LB Primary SPI Flash stuffed with 16 Mb Note There will be 2 SPI footprints on the board Firmware Hub will not be supported The primary SPI flash footprint is at XU3LB and stuffed with a 16 Mb 2 MB SPI flash U2LB The secondary SPI flash footprint is at XU5LB and unstuffed October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 14 n tel Intel Q965 Express Chipset Development Kit Hardware Features 2 3 2 Jumper Settings and Descriptions Table 5 Jumper Settings Jumper Default Description Notes 1 2 Normal J7LB 1 2 BIOS Config Recovery 2 3 Config Mode Off Recovery 1 2 Normal J6LB 1 2 Clear CMOS 2 3 Clear CMOS 1 2 Normal J 8LH 1 2 Power On Forcing 2 3 Force On Sets CPU presence bit may not always force board power on 2 3 3 LED Descriptions Power LEDs are on the board to indicate when standby and core power is being applied to the planes When on they indicate that no devices should be inserted or removed Please refer to Figure 2 for the LED locations Caution Inserting or removing devices when the Standby Power LEDs are on could result in device or board damage Table 6 LED Description LED Description Notes CR5BV 5 Volt Sta
26. UD VOL MUTE Audio Mute 13 AUD VOL DWN Audio Volume Down 14 GND Ground High Definition Audio Header The High Definition Audio header is a 2x8 header designated as J7AU The following table outlines the pin out and functionality of this header High Definition Audio Header Sheet 1 of 2 Pin Signal Name Description AUD LINK BCLK HDR GND Ground AUD LINK RST HDR VCC3 Power AUD LINK SYNC HDR GND Ground SN oO oO AJ w NI eB AUD LINK SDO HDR Order Number 315664 002US Intel Q965 Express Chipset DM 22 n tel Intel Q965 Express Chipset Development Kit Hardware Features Table 14 High Definition Audio Header Sheet 2 of 2 Pin Signal Name Description 8 VCC3 Power 9 AUD LINK SDIO 10 12V Power 11 AUD_LINK_SDI1 12 KEY No Connect 13 TP AUD LINK SDO 1 HDR 14 V_3P3_STBY G 3 3V Standby 15 AUD_LINK_SDI2_R 16 GND Ground 2 3 12 BTX Power Connectors Table 15 2x12 BTX Power Connector Pin Signal Name Pin Signal Name 1 3 3V 13 GND 2 3 3V 14 PS_ON 3 GND 15 GND 4 5V 16 GND 5 GND 17 GND 6 5V 18 5V 7 GND 19 5V 8 PWDGD 20 5V 9 5 VSB 21 5V 10 12V 22 5V 11 3 3V 23 5V 12 12V 24 GND Table 16 2x2 Auxiliary 12V Power Connector Pin Signal Name 1 GND 2 GND 3 12V 4 12V Intel Q965 Express
27. XE boot Network drive or remote CD boot Serial over LAN OOB diagnostics Remote control Remote BIOS update Proactive alerting that decreases downtime and minimizes time to repair Programmable policies Operating system lock up alert Boot failure alert Hardware failure alerts Third party non volatile storage that prevents users from removing critical inventory remote control or virus protection agents Nonvolatile storage for agents Tamper resistant Remote hardware and software asset tracking that eliminates time consuming manual inventory tracking which also reduces asset accounting costs E Asset Tag HW SW inventory For details of the AMT configurations please contact your nearest Intel representatives for the Intel AMT OEM Bring up Guide Intel Quiet System Technology Intel 1CH8 incorporated a new integrated Intel Quiet System Technology Intel QST interface to provide a low cost solution for a better system thermal acoustic management solution Intel QST architecture consists of a Simple Serial Transfer SST bus Platform Environment Control Interface PECI four TACH pins and three Pulse Width Modulation PWM output pins to monitor control and manage the system target temperature through a sets of thermal sensors QST is run by the manageability engine ME residing in MCH and requires SPI flash to host the QST firmware Detailed of the QST configurations please
28. adi com Eight Channel 7 1 Audio Subsystem Figure 18 shows the back panel audio connector for the eight Channel 7 1 Audio Subsystem The eight channel 7 1 audio subsystem includes the following Intel 82801G I O Controller Hub ICH8DO ADI1988 audio codec Back Panel Audio Connector Options for Eight channel Audio Subsystem Intel Q965 Express Chipset DM 43 October 2007 Order Number 315664 002US Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset Table 21 describes the lists of back panel task Table 21 Back panel task Audio Symbols Task C S PDIF Out D S PDIF In K Gray Side Speaker Out J Black Rear Speaker Out M Orange Center channel and Subwoofer audio out O Light Blue Audio Line In P Green Audio Line Out Front Speaker Out N Pink Mic In 4 5 LAN Subsystem Configurations The LAN subsystem consists of the following Physical layer interface device The development kit include the following LAN devices Intel 82566DM for Gigabit 10 100 1000 Mbits sec Ethernet LAN connectivity RJ 45 LAN connector with integrated status LEDs 4 5 1 Gigabit LAN Subsystem The Gigabit 10 100 1000 Mbits sec LAN subsystem includes the Intel 82566DM controller and a RJ 45 LAN connector with integrated status LEDs The Intel 82566DM Gigabit Ethernet Controller supports the following features PCI Expres
29. alization is Processor gt Memory gt Busses gt Output Input Devices gt Boot Devices or Processor gt Memory gt Recovery gt Busses gt Output Input Devices gt Boot Devices The sequence of POST is platform specific Speaker The board mounted speaker provides audible error code beep code information during POST For information about the location of the onboard speaker refer to Figure 1 BIOS Beep Codes Whenever a recoverable error occurs during POST the BIOS beep as described in the following table Table 23 Beep codes Type Pattern Frequency Memory error Three long beeps 1280 Hz Thermal warnin Four alternating beeps High tone 2000 Hz g High tone low tone high tone low tone Low tone 1600 Hz BIOS Error Messages Table below show the lists of BIOS error messages and brief description of each Intel Q965 Express Chipset DM Order Number 315664 002US 46 tel Intel Q965 Express Chipset Error Messages and Beep Codes Table 24 Lists of error messages and brief description of each Error Message Explanation CMOS Battery low The battery may be losing power Replace the battery soon The CMOS checksum is incorrect CMOS memory may have been corrupted CMOS Checksum Bad Run Setup to reset values Memory size has decreased since the last boot If no memory was removed Memory Size Decreased then memory may be bad No Boot dev
30. ard Table 2 7 shows the signals for PCI Express x16 or MEC SDVO Intel Q965 Express Chipset DM October 2007 17 Order Number 315664 002US Development Kit Hardware Features l ntel Q965 Express Chipset intel Table 9 Intel SDVO to PCI Express connector mapping for MEC cards Sheet 1 of 3 EC Side B Side A Po Express SDVO MEC Function PC ExPress Soyo MEC Function Function Function 1 12V 12V PRSNT1 NC 2 12V 12V 12V 12V 3 RSVD RSVD 12V 12V 4 GND GND GND GND 5 SMCLK NC JTAG2 TCK NC 6 SMDAT NC JTAG3 TDI JTAG3 TDI 7 GND GND JTAG4 TDO JTAG4 TDO 8 3 3V 3 3V JTAG5 TMS NC 9 JTAG1 TRST NC 3 3V 3 3V 10 3 3 Vaux 3 3 Vaux 3 33 V 3 33 V 11 WAKE WAKE PERST PERST Key 12 RSVD RSVD GND GND 13 GND GND REFCLK REFCLK 14 PETO or PETpO PETO or PETpO REFCLK REFCLK 15 PETO or PETnO PETO or PETnO GND GND 16 GND GND PERO or PERpO PERO or PERpO 17 PRSNT2 SDVO_CtrIClk PERO or PERNO PERO or PERNO 18 GND GND GND GND End of x1 Connector 19 PET1 or PETp1 NC RSVD RSVD 20 PET1 or PETn1 NC GND GND 21 GND GND PER1 or PERp1 NC 22 GND GND PER1 or PERn1 NC 23 PET2 or PETp2 NC GND GND 24 PET2 or PETn2 NC GND GND 25 GND GND PER2 or PERp2 NC 26 GND GND PER2 or PERn2 NC 27 PET3 or PETp3 NC GND GND 28 PET3 or PETn3 NC GND GND 29 GND GND PER3 or PERp3 NC 30 RSVD RSV
31. computer For enhanced security use different passwords for the supervisor and user passwords Valid password characters are A Z a z and 0 9 Passwords may be up to 16 characters in length Graphics Drivers The Intel Q965 Express Chipset will work with the Intel GMA3000 Extreme graphics driver or the Intel Embedded Graphics Driver IEGD Intel Q965 Express Chipset DM 29 October 2007 Order Number 315664 002US Development Kit Software and BIOS Features I ntel Q965 Express Chipset l n tel EGD is created specifically for embedded platforms offering an adaptable alternative to drivers designed for the desktop market segments EGD offers Intel s embedded customers extended life support that correlates with the extended life support of Embedded 1A 32 silicon products IEGD differentiates itself through its configurability and support of unique embedded market segment requirements including an unprecedented support of advanced display combinations non standard display dimensions and embedded operating systems such as Microsoft XP Embedded and WePOS The Intel Graphics Media Accelerator GMA is designed for mainstream desktop usage models focusing on 3D performance and ease of use When working with external graphics drivers the internal graphics will automatically disable When a discrete graphics card is plugged into to the graphics port PEG the integrated graphics will be disabled Note that this does n
32. e To take advantage of the high capacities typically available today hard drives are automatically configured for Logical Block Addressing LBA and to PIO Mode 3 or 4 depending on the capability of the drive You can override the auto configuration options by specifying MANUAL CONFIGURATION in the BIOS setup program This board only supports Serial ATA drives System Management BIOS SMBI OS SMBIOS is a Desktop Management Interface DMI compliant method for managing computers in a managed network The main component of SMBIOS is the Management Information Format MIF database which contains information about the computing system and its components Intel Q965 Express Chipset DM 27 October 2007 Order Number 315664 002US Development Kit Software and BIOS Features I ntel Q965 Express Chipset l n tel 3 2 4 Sie 3 2 5 1 October 2007 Using SMBIOS a system administrator can obtain the system types capabilities operational status and installation dates for system components The MIF database defines the data and provides the method for accessing this information The BIOS enables applications such as third party management software to use SMBIOS The BIOS stores and reports the following SMBIOS information BIOS data such as the BIOS revision level Fixed system data such as peripherals serial numbers and asset tags Resource data such as memory size cache size and processor clock frequency
33. e over to lt BOOT gt and then arrow down to Boot Device Priority and then select which device you would like to boot first and second Please follow the instructions on the right side of the BIOS screen to navigate and change BIOS settings BI OS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer with the following restrictions The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program This is the supervisor mode The user password gives restricted access to view and change Setup options in the BIOS Setup program This is the user mode If only the supervisor password is set pressing the Enter key at the password prompt of the BIOS Setup program allows the user restricted access to Setup f both the supervisor and user passwords are set users can enter either the supervisor password or the user password to access Setup Users have access to Setup respective to which password is entered Setting the user password restricts who can boot the computer The password prompt will be displayed before the computer is booted If only the supervisor password is set the computer boots without asking for a password If both passwords are set the user can enter either password to boot the
34. formation for connectors and overall development kit board capability Chapter 3 Development Kit Software and BIOS Features This chapter provides an overview of development kit software and BIOS features Chapter 4 Development Kit Board Setup This chapter provides instructions on how to configure the evaluation board and processor assembly by setting jumpers connecting peripherals providing power and configuring the BIOS Chapter 5 Error Messages and Beep Codes This chapter describes the various progress codes that are reported by the BIOS and the corresponding LED Codes Text Conventions The following notations may be used throughout this manual The pound symbol appended to a signal name indicates that the signal is active low Intel Q965 Express Chipset DM 7 October 2007 Order Number 315664 002US About This Manual I ntel Q965 Express Chipset Variables Instructions Numbers Units of Measure Signal Names intel Variables are shown in italics Variables must be replaced with correct values Instruction mnemonics are shown in uppercase When you are programming instructions are not case sensitive You may use either upper case or lower case Hexadecimal numbers are represented by a string of hexadecimal digits followed by the character H A zero prefix is added to numbers that begin with A through F For example FF is shown as OFFH Decimal and binary numbers are represe
35. gital display options for an Intel Graphics Controller It plugs into an x16 PCI Express connector but uses the multiplexed SDVO interface This Advanced Digital Display Card will not work with an Intel Graphics Controller that supports DVO and ADD cards ACPI Advanced Configuration and Power Interface ASF Alert Standard Format BLT Block Level Transfer Core The internal base logic in the G MCH CRT Cathode Ray Tube DBI Dynamic Bus Inversion DDR2 A second generation Double Data Rate SDRAM memory technology DMI Direct Media Interface DVI Digital Video Interface Specification that defines the connector and interface for digital displays FSB Front Side Bus FSB is synonymous with Host or processor bus Full Reset Full reset is when PWROK is de asserted Warm reset is when both RSTIN and PWROK are asserted GMCH Graphics Memory Controller Hub component that contains the processor interface DRAM controller x16 PCI Express Graphics port typically the external graphics interface and integrated graphics device IGD It communicates with the I O controller hub ICH8DO and other I O controller hubs over the DMI interconnect In this document GMCH refers to the 820965 GMCH component GMA 3000 Intel amp Graphic Media Accelerator 3000 Host This term is used synonymously with processor IDER IDE Redirect INTx An interrupt re
36. ice available System did not find a device to boot 5 4 Port 80h POST Codes During the POST the BIOS generates diagnostic progress codes POST codes to I O port 80h If the POST fails execution stops and the last POST code generated is left at port 80h This code is useful for determining the point where an error occurred The following tables provide information about the POST codes generated by the BIOS Table 25 lists the Port 80h POST code ranges Table 26 lists the Port 80h Progress Code Enumeration Table 27 lists the Port 80h POST sequence Table 25 Port 80h POST Code Ranges Range o o Sesystem 00 0x00 OxOF HE AEN GHEEEENNEN codes Can be used by any PEIM driver for debug Blocked on production builds per DFT rule Not covered in the EPS 0x10 Ox1F Host Processors Ox1F is unrecoverable CPU error 0x20 Ox2F Memory Chipset Ox2F is no memory detected or no useful memory detected 0x30 Ox3F Recovery Ox3F indicated recovery failure 0x40 OxaF Ox4F Reserved for future 0 for future 0x50 0x5F 1O Busses PCI USB ISA ATA etc 0x5F is unrecoverable error Start with PCI 0x60 Ox6F Reserved for future for new busses 0x70 Ox7F Output Devices All output consoles Ox7F is unrecoverable error 0x80 Ox8F Reserved for future new output console codes 0x90 Ox9F Input devices Keyboard Mouse Ox9F is unrecoverable error OxAO OxAF Reserved for future new input console codes
37. igure 3 BTX Type I Thermal Module Assembly TMA Intel Q965 Express Chipset DM October 2007 25 Order Number 315664 002US Development Kit Software and BIOS Features I ntel Q965 Express Chipset l n tel Note Note 3 2 3 2 1 Figure 4 October 2007 Development Kit Software and BIOS Features This chapter provides an overview of development kit software and BIOS features Software Key Features The software in the kit was chosen to facilitate development of real time applications based on the components used in the evaluation board The driver CD included in the kit contains all of the software drivers necessary for basic system functionality under the following operating systems Windows 2000 XP XP Embedded and Linux While every care was taken to ensure the latest version of drivers were provided on the enclosed CD at time of publication newer versions may be available Updated drivers for Intel components can be found at http developer intel com design intarch software driver index htm q965 For all third party components please contact the appropriate vendor for updated drivers Software in the kit is provided free by the vendor and is only licensed for evaluation purposes Refer to the documentation in the evaluation kit for further details on any terms and conditions that may be applicable to the granted licenses Customers using the tools that work with Microsoft products must lice
38. intel Intel Q965 Express Chipset Development Kit User Manual October 2007 Order Number 315664 002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATI NG TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTI ES RELATING TO FITNESS FOR A PARTI CULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving life sustaining critical control or safety systems or in nuclear facility applications Intel may make changes to specifications and product descriptions at any time without notice Intel Corporation may have patents or pending patent applications trademarks copyrights or other intellectual property rights that relate to the presented subject matter The furnishing of documents and other materials and information does not provide any license express or implied by estoppel or otherwise to any such patents trademarks copyrights or other intellectual property rights Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined
39. ions for an Intel Graphics Controller that supports MEC cards Plugs into an x16 PCI Express connector but utilizes the multiplexed SDVO interface Adds Video In capabilities to platform Will not work with an Intel Graphics Controller that supports DVO and ADD cards Will function as an ADD2 card in an ADD2 supported system but Video In capabilities will not work PCI Express Graphics PCI Express Graphics is a high speed serial interface whose configuration is software compatible with the existing PCI specifications The specific PCI Express implementation intended for connecting the G MCH to an external Graphics Controller is a x16 link and replaces AGP PECI Platform Environmental Control Interface Primary PCI The Primary PCI is the physical PCI bus that is driven directly by the ICH8DO component Communication between Primary PCI and the G MCH occurs over DMI Note that the Primary PCI bus is not PCI Bus 0 from a configuration standpoint Processor Intel Core 2 Duo processor E6400 QST Quiet System Technology SATA Serial ATA Specification SCI System Control Interrupt SCI is used in ACPI protocol SDVO Serial Digital Video Out SDVO SDVO is a digital display channel that serially transmits digital display data to an external SDVO device The SDVO device accepts this serialized format and then translates the data into the appropriate display format i e TMDS LVDS and TV Out
40. n October 2007 002 Change SDVOB to SDVOC in pins 58 59 62 and 63 in Table 9 Intel amp SDVO to PCI Express connector mapping for MEC cards on page 18 October 2006 001 Initial public release October 2007 315664 002US Intel Q965 Express Chipset DM 6 m n tel Intel Q965 Express Chipset About This Manual 1 1 1 2 About This Manual This user s manual describes the use of the Intel Q965 Express Chipset Development Kit This manual has been written for OEMs system evaluators and embedded system developers All jumpers headers LED functions and their locations on the board along with subsystem features and POST codes are defined in this document For the latest information about the Intel Q965 Express Chipset Development Kit reference platform visit http developer intel com design intarch devkit index htm For design documents related to this platform such as schematics and layout please contact your Intel Representative Content Overview Chapter 1 Development Kit Users Manual Content overview This chapter contains a description of conventions used in this manual The last few sections explain how to obtain literature and contact customer support Chapter 2 Development Kit Hardware Features This chapter provides information on the development kit features and the board capability This includes the information on board component features jumper settings pin out in
41. ndby Power Display LED Green DS1EV Port 80 Display Right DS2EV Port 80 Display Left CR7BV ME Enabled LED Red Blink 2 3 4 Header and Connector Descriptions Table 7 Header and Connector Descriptions Sheet 1 of 2 Header Description Notes J5LB Intruder Header J7LH Serial Port Header J3AU ATAPI CD Header J 7AU High Definition Media Interface Header J 8AU Front Panel Audio Header J28LB Front Panel Header J3TH CPU Fan J 4TH Chassis Fan J 5TH Chassis Fan J2BV 2x12 Standard Power Connector J1BV 2x2 12V Power Connector J29LB Power LED header J24LB SATA connector SATA HDD port 0 Intel Q965 Express Chipset DM October 2007 15 Order Number 315664 002US Development Kit Hardware Features l ntel Q965 Express Chipset Table 7 Header and Connector Descriptions Sheet 2 of 2 Header Description Notes j22LB SATA connector SATA HDD port 1 J23LB SATA connector SATA HDD port 2 J21LB SATA connector SATA HDD port 3 J19LB SATA connector SATA HDD port 4 J20LB SATA connector SATA HDD port 5 J1MY DIMM connector Channel A DIMM 0 J2MY DIMM connector Channel A DIMM 1 J3MY DIMM connector Channel B DIMM 0 J4MY DIMM connector Channel B DIMM 1 J4LH Floppy connector J6UB X16 PCI Express Graphics slot For Graphics cards J11LB X1 PCI Express slot PCI Express port 4 J12LB X1 PCI Express slot PCI Express port 5 J13LB PCI slot J14LB USB Front Panel Header
42. nnel configuration using two DIMMs In this example the DI MM 0 sockets of both channels are populated with identical DIMMs Figure 13 Dual Channel Interleaved Mode Configuration with two DI MMs Channel A DIMM 0 Channel A DIMM 1 Channel B DIMM 0 Channel B DIMM 1 Figure 14 shows a dual channel configuration using three DIMMs In this example the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM O socket of Channel B Figure 14 Dual Channel Interleaved Mode Configuration with three DI MMs Channel A DIMM 0 Channel A DIMM 1 Channel B DIMM 0 Channel B DIMM 1 Intel Q965 Express Chipset DM October 2007 41 Order Number 315664 002US Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset l n tel Figure 15 shows a dual channel configuration using four DIMMs In this example the combined capacity of the 2x DIMMs in Channel A equals the combined capacity of the 2x DIMMs in Channel B Also the DIMMs are matched between DIMM 0 and DIMM 1 of both channels Figure 15 Dual Channel Interleaved Mode Configuration with four DI MMs Channel A DIMM 0 Channel A DIMM 1 Channel B DIMM 0 Channel B DIMM 1 4 3 1 2 Single Channel Asymmetric Mode Configurations Figure 16 shows a single channel configuration using 1x DIMM In this example only the DIMM 0 socket of Channel A is po
43. nse those products Any targets created by those tools should also have appropriate licenses Software included in the kit is subject to change Refer to http developer intel com design intarch devkit for details on additional software from other third party vendors BIOS Features BIOS Overview This development kit ships pre installed with Intel BIOS The BIOS provides an industry standard BIOS platform to run most standard operating systems including Windows 2000 XP XP Embedded Linux WEPOS and others The BIOS is stored in a 16 Mb SPI flash at the primary SPI flash footprint at XU3LB and can be updated using a BIOS flash programming tool FWH will not be supported The BIOS displays a message during POST identifying the type of BIOS and a revision code The BIOS Setup program can be used to view and change the BIOS settings for the computer The BIOS Setup program is accessed by pressing the lt DELETE gt key after the Power On Self Test POST memory test begins and before the screen goes black before booting any device The menu bar is shown below Menu Bar MAIN ADVANCED lt PCIPnP gt lt BOOT gt SECURITY lt CHIPSET gt EXIT Intel Q965 Express Chipset DM Order Number 315664 002US 26 n tel Intel Q965 Express Chipset Development Kit Software and BI OS Features Table 19 Table 20 3 2 2 3 2 2 1 3 2 2 2 Note 3 2 3 Table 19 lists the BIOS setup pr
44. nted by their customary notations That is 255 is a decimal number and 1111 1111 is a binary number In some cases the letter B is added for clarity The following abbreviations are used to represent units of measure A amps amperes Gbyte gigabytes Kbyte kilobytes K kilo ohms mA milliamps milliamperes Mbyte megabytes MHz megahertz ms milliseconds mW milliwatts ns nanoseconds pF picofarads Ww watts V volts uA microamps microamperes uF microfarads us microseconds uW microwatts Signal names are shown in uppercase When several signals share a common name an individual signal is represented by the signal name followed by a number while the group is represented by the signal name followed by a variable n For example the lower chip select signals are named CSO CS1 CS2 and so on they are collectively called CSn A pound symbol appended to a signal name identifies an active low signal Port pins are represented by the port abbreviation a period and the pin number e g P1 0 1 3 Glossary of Terms and Acronyms This section defines conventions and terminology used throughout this document October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 8 intel Intel Q965 Express Chipset About This Manual Table 1 Glossary of Terms and Acronyms Sheet 1 of 3 Term Description ADD2 Card Advanced Digital Display Card second Generation This card provides di
45. ogram menu features BIOS Setup Program Menu Bar Man ADVANCED PCI PnP BOOT SECURITY CHI PSET EXIT Sets Saves or roc ssorand advanced Setup for Selects boot passwords PM discard p PCI and PCI options and and changes to RAOT feautesand Express configurations securit major setup program configurations settings p g y components Up prog features options Displays Configures BIOS Setup Program Function Keys BI OS Setup Program Selects a different menu screen moves the cursor left or right Selects an item moves the cursor up or down Selects a field not implemented Enter Executes command or selects the submenu Load the optimal default configuration values for the current menu Save the current values and exits the BIOS setup program Resource Configuration PCI Auto Configuration When a PCI card is added and the system is turned on the BIOS automatically configures interrupts the I O space and other system resources Any interrupts set to AVAILABLE in Setup are considered to be available for use by add in card There is one 32 33 PCI add in card socket on the board SATA Drive Configuration If you select AUTO in the BIOS Setup program the BIOS automatically sets up the SATA drive configuration with independent I O channel support The interface also supports second generation Serial ATA drives The BIOS determines the capabilities of each drive and configures them to optimize capacity and performanc
46. omputer system with a processor chipset BIOS enabling software and or operating system device drivers and applications designed for these features Performance will vary depending on your configuration Contact your vendor for more information Support Options Electronic Support Systems Intel s site on the World Wide Web http www intel com provides up to date technical information and product support This information is available 24 hours per day 7 days per week providing technical information whenever you need it Additional Technical Support If additional technical support is required please contact your field sales representative or local distributor Product Literature Product literature can be ordered from the following Intel literature centers I ntel Literature Centers Location Telephone Number U S and Canada 1 800 548 4725 U S from overseas 708 296 9333 Europe U K 44 0 1793 431155 Germany 44 0 1793 421333 France 44 0 1793 421777 Japan fax only 81 0 120 47 88 32 Intel Q965 Express Chipset DM 11 October 2007 Order Number 315664 002US Development Kit Hardware Features l ntel Q965 Express Chipset l n tel 2 0 Development Kit Hardware Features 2 1 Overview This chapter provides information on the development kit features and the board capability For detailed platform features please refer to the Platform Design G
47. on 4 2 is gathered follow the steps below to set up the evaluation board This manual assumes you are familiar with the basic concepts involved with installing and configuring hardware for a personal computer system Note To locate items discussed in the procedure below please refer to Chapter 3 0 1 Create a safe work environment 2 Make sure you are in a static free environment before removing any components from their anti static packaging The evaluation board is susceptible to electrostatic discharge damage and such damage may cause product failure or unpredictable operation Inspect the contents of your kit Intel Q965 Express Chipset DM October 2007 33 Order Number 315664 002US m Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset n tel 3 Check for damage that may have occurred during shipment Contact your sales representative if any items are missing or damaged Caution Connecting the wrong cable or reversing the cable can damage the evaluation board and may damage the device being connected Since the board is not in a protective chassis use caution when connecting cables to this product Caution Standby voltage is constantly applied to the board Therefore do not insert or remove any hardware unless the system is unplugged Note The evaluation board is a uBTX form factor A uBTX chassis may be used if a protected environment is desired 4 Check the jumper settings refer
48. ot apply to an ADD2 card which is intended to work in conjunction with integrated graphics EGD allows support of external discrete graphics cards in conjunction with integrated graphics when a discrete graphics card is plugged into the PCI Express x1 or PCI at the ICH If you have a discrete graphics card plugged into the PCI Express it will work in conjunction with the integrated graphics Note that GMA drivers will not support this only the I EGD drivers 3 4 Intel Active Management Technology Intel Active Management Technology AMT offers tamper resistant and persistent management capabilities Specifically Intel AMT is a hardware based solution that offers encrypted and persistent asset management and remote diagnostics and or recovery capabilities for networked platforms With Intel AMT IT organizations can easily get accurate platform information and can perform remote updating diagnostics debugging and repair of a system regardless of the state of the operating system and the power state of the system Intel AMT enables IT organizations to discover heal and protect all of their computing assets regardless of system state in the manner described below 1 Discovering hardware and software computing assets ntel AMT stores hardware and software asset information in non volatile memory and allows IT to read the asset information anytime even if the PC is off Users cannot remove or prevent IT organization access
49. pulated Channel B is not populated Figure 16 Single Channel Asymmetric Mode Configuration with one DIMM Channel A DIMM 0 Channel A DIMM 1 Channel B DIMM 0 Channel B DIMM 1 Intel Q965 Express Chipset DM October 2007 Order Number 315664 002US 42 n tel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit Figure 17 4 4 4 4 1 Figure 18 Figure 17 shows a single channel configuration using 3x DIMMs In this example the combined capacity of the 2x DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM O socket of Channel B Single Channel Asymmetric Mode Configuration with 3x DIMMs Channel A DIMM 0 Channel A DIMM 1 Channel B DIMM 0 Channel B DIMM 1 Audio Subsystem Configurations The board supports the Intel High Definition Audio subsystem based on the ADI1988A or 1988B audio codec The ADI1988 series provides eight channels of DAC Digital to Analog Converter that simultaneously support 7 1 sound playback The board contains audio connectors on the back panel and two channels of independent stereo sound output at the side of the board The functions of the back panel audio connectors are dependent on the eight channel audio subsystem as described in Chapter 2 0 For more information such as specification schematic layout and driver on the ADI 1988 audio codec please refer to the ADI website at www
50. quest signal where x stands for interrupts A B C and D Intel 64 Architecture Intel 64 Architecture Formerly known as Intel EM64T enables the processor to access larger amounts of virtual and physical memory Intel Advanced Digital Media Boost 128 bit SSE instructions are now issued one per clock cycle effectively doubling their speed of execution over previous generation processors This benefits a broad range of applications including video audio encryption engineering and scientific with improved performance Intel AMT Intel Active Management Technology Intel Advanced Smart Cache The shared L2 cache is allocated to each processor core based on workload up to the full amount of total cache This is more efficient than today s dual core processor Sharing the cache significantly reduces the time needed to retrieve frequently used data improving performance Intel DVO Digital Video Out port Term used for the first generation of Intel Graphics Controller s digital display channels Digital display data is provided in a parallel format This interface is not electrically compatible with the 2nd generation digital display channel discussed in this document SDVO Intel ICH8DO Eighth generation I O Controller Hub component that contains additional functionality compared to previous ICHs The I O Controller Hub component contains the primary PCI interface LPC interface US
51. rd VGA monitor Keyboard You will need a PS 2 style or USB keyboard Mouse You will need a PS 2 style or USB mouse Hard Drives Floppy Drives and SATA or USB Optical Disk Drives You can connect up to six SATA drives to the evaluation board A floppy drive or compact disc drive may be used to load the OS No drives or cables are included in the kit the user must provide them as necessary All the storage devices may be attached to the board simultaneously Video Adapter Integrated video is provided via the back panel of the system board Alternately users can choose to use any standard external PCI Express x16 graphics card or MEC It is user responsibility to install the appropriate drivers and correctly configure any software for video adapters used Check the BIOS for the proper video settings Power Supply The evaluation board is recommended to power up using a standard desktop BTX ATX 12 V Rev 2 2 power supply that support enhanced BTX system thermal performance It is recommended the power supply have a minimum of 500 W output and active PFC power factor correction The power supply selected must also provide an auxiliary 2x2 12 V connector Other Devices and Adapters The evaluation board functions much like a standard desktop computer motherboard Most PC compatible peripherals can be attached and configured to work with the evaluation board 4 3 Setting Up the Evaluation Board Once the hardware described in Secti
52. s link 10 100 1000 IEEE 802 3 compliant Compliant to IEEE 802 3x flow control support TCP IP UDP checksum offload Transmit TCP segmentation Advanced packet filtering Full device driver compatibility PCI Express Power Management Support Jumbo frame support Intel Active Management Technology Alert Standard Format ASF 2 0 October 2007 Order Number 315664 002US Intel Q965 Express Chipset DM 44 n tel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit 4 5 2 RJ 45 LAN Connector with I ntegrated LEDs Two LEDs are built into the RJ 45 LAN connector as shown in Figure 19 Table 22 describes the LED states when the board is powered up and the Gigabit LAN subsystem is operating Figure 19 LAN Connector LED locations Green LED n Green Yellow LED OM16513 Table 22 LAN Connector LED status LED Color LED State Condition Off LAN link is not established Left Green On LAN link is established Blinking LAN activity is occurring N A Off 10 Mbits sec data rate is selected p Green On 100 Mbits sec data rate is selected Right Yellow On 1000 Mbits sec data rate is selected 4 6 Software Kit I nstallation 4 6 1 I nstallation of a new Operating System The user will required to install a new operating system on a SATA hard disk using an optical drive or loading an image to the hard disk 4 6 2 Drivers Installation
53. s d NC 62 PET11 or PETp11 SDVOC Red GND GND 63 PET11 or PETn11 SDVOC Red GND GND 64 GND GND E NC 65 GND GND acie d NC 66 PET12 or PETp12 SDVOB Clk GND GND 67 PET12 or PETn12 SDVOB CIk GND GND 68 GND GND ci NC Intel Q965 Express Chipset DM 19 October 2007 Order Number 315664 002US m Development Kit Hardware Features l ntel Q965 Express Chipset n tel Table 9 2 3 7 Table 10 October 2007 Intel SDVO to PCI Express connector mapping for MEC cards Sheet 3 of 3 Pin i Number Side B Side A PER12 or 69 GND GND PERn12 NC 70 PET13 or PETp13 SDVOB_Blue GND GND 71 PET13 or PETn13 SDVOB Blue GND GND PER13 or 72 GND GND PERp13 NC PER13 or 73 GND GND PERn13 NC 74 PET14 or PETp14 SDVOB_Green GND GND 75 PET14 or PETn14 SDVOB_Green GND GND PER14 or 76 GND GND PERp14 NC PER14 or 77 GND GND PERn14 NC 78 PET15 or PETp15 SDVOB_Red GND GND 79 PET15 or PETn15 SDVOB_Red GND GND PER15 or 80 GND GND PERpI5 NC PER15 or 81 PRSNT2 NC PERn15 NC 82 RSVD RSVD GND GND Note End of x16 Connector PCI Express x1 The PCI Express x1 connectors allow the use of any industry standard PCI Express device The pin configuration of the connectors is given below PCI Express x1 Pinout Pin Number Side B Side A 1 12V PRSNT1
54. ser can choose to boot from a diskette drive hard drive CD ROM or from the network The default setting is for the Hard Drive to be the first and the CD ROM to be the second There is no third or fourth boot option CD ROM Boot Booting from CD ROM is supported in compliance to the El Torito bootable CD ROM format specification Under the Boot menu in the BIOS Setup program CD ROM is listed as a boot device Boot devices are defined in priority order Accordingly if there is not a bootable CD in the CD ROM drive the system will attempt to boot from the next defined drive Intel Q965 Express Chipset DM Order Number 315664 002US 28 n tel Intel Q965 Express Chipset Development Kit Software and BI OS Features 3 2 5 2 3 2 5 3 3 2 5 4 Note 3 2 6 3 3 Network Boot The network can be selected as a boot device This selection allows booting from the on board LAN or a network add in card with a remote boot ROM installed In order to boot from the LAN you will have to enter the BIOS and select LAN boot as your first boot device Booting without Attached Devices For use in embedded applications the BIOS has been designed so that after passing the POST the operating system loader is invoked even if the following devices are not present Video adapter Keyboard Mouse Changing the Boot Device Pressing the Delete key during POST causes the BIOS menu to be displayed Using your arrow keys mov
55. sss 43 19 LAN Connector LED locationis aa a TEE ERA SA N tied ek ga cce d Ead ERR UR 45 Tables 1 Glossary of Terms and Acronyms coristi irec Eee mese nee enean nnn nnn 9 2 ntel Literature Centers se dede eaae nde Suh wane ants inenga ennaii ch dle Ro CR BUR nh iR ORE adt on enc 11 3 Development Kit Features Summary sssssssssssssseen eene nnne enn nnne nn nnn 12 4 Core Components asc e en Rx ns r GG XGEYABG G4 KG RR DE SYN GG d XY V XX A PES Gk KGG Bea eee Kobe a ne e 14 5b Jumper Settiligs eecsexss esate oet nba rnn eann RR Ra E ERPE REX RRELR KD ARR IEEE SENE RAT RAN EUREM dees 15 LED DESCriptiON siri RERUM 15 7 Header and Connector Descriptions sssesssesseeene eene nemen mene nemen nnn 15 8 Back panel connectors iier ter peti Pecan ER ECRR Petes ERR EERAERDERFUNEXIR nein DR ERE INA Pb re Ng ogg 17 9 Intel SDVO to PCI Express connector mapping for MEC cards sssessssseeneee 18 TO PCI Express X1 Pinot 5 eeoerie ree iri tx ern er e ese aaa eere ve iih on bre de e al 20 lI Front Panel urmiper Setting xti cit rra trit et bh nec RR ht EARRE PD RR EDI RR RE ERE REGERE RR ves 21 12 Front Panel USB Header read hi dines e rana E Cupra a e adc ea Ee eg her FRA UE a e Fa eR Ir d 21 13 Front Audio Header ueteri tiae ner nf nianna en node Mtr enna m NOR ON QU RR RU A GR A RUN KA RR Rn 22 14 High Definition Audio Header csssssssssssssssseen nennen mese esee enn nn nnn 22 15 2x1
56. to Chapter 3 0 Jumper J 6LB is used to clear the CMOS memory Make sure this jumper is set for normal operation 5 Insert the processor enclosed in the kit is Intel Core 2 Duo processor E6400 into the LGA775 socket 6 Attach the BTX Thermal Module Assembly TMA over the processor to the Support and Retention Module SRM by following procedures described below 7 Place the uBTX board on the Support and Retention Module SRM so that the holes A B C and D on the PCB line up with the corresponding locations on the SRM see Figure 6 Figure 6 Align the Development Kit Board and SRM Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 34 m n tel Intel Q965 Express Chipset Setting Up amp Configuring the Development Kit The board and SRM assembly should look like the figure below Figure 7 Assembled SRM and board Intel Q965 Express Chipset DM October 2007 35 Order Number 315664 002US Setting Up amp Configuring the Development Kit I ntel Q965 Express Chipset n tel Place the heatsink on top of the processor The heatsink should align with the holes on the SRM and board as shown below in Figure 7 Please clean the surface of the processor with isopropyl alcohol before attaching the heatsink Align the heatsink with holes on the SRM and board Figure 8 Intel Q965 Express Chipset October 2007 DM 36 Order Number 315664 002US
57. to the information because it does not rely on software agents 2 Healing systems remotely regardless of the operating system or system state ntel AMT provides out of band diagnostics and recovery capabilities for IT organizations to remotely diagnose and repair PCs after software operating system or hardware failures Alerting and event logging help IT organizations detect and diagnose problems quickly to reduce end user downtime 3 Protecting the enterprise against malicious software attacks ntel AMT helps IT organizations keep software versions and virus protection consistent and up to date across the enterprise Version information is stored in non volatile memory for access anytime by third party software to check and if necessary wake a system to perform off hours updates 4 The key features of Intel AMT include Secure Out of Band OOB system management that allows remote management of PCs regardless of system power or operating system state Intel Q965 Express Chipset October 2007 DM Order Number 315664 002US 30 n tel Intel Q965 Express Chipset Development Kit Software and BI OS Features 3 5 SSL3 1 TLS encryption HTTP authentication TCP IP HTTP web GUI XML SOAP API Remote troubleshooting and recovery that can significantly reduce desk side visits and potentially increase efficiency of IT technical staff System event log DE Redirection or P
58. ts 0 1 5 V or 5 V Dual Note 2 VREG FP USBPWR Front panel USB power Ports 0 1 5 V or 5 V Dual 3 USB FP PO Front panel USB Port 0 negative signal 4 USB FP P1 Front panel USB Port 1 negative signal 5 USB FP PO Front panel USB Port 0 positive signal 6 USB FP P1 Front panel USB Port 1 positive signal 7 Ground Intel Q965 Express Chipset DM 21 October 2007 Order Number 315664 002US Development Kit Hardware Features l ntel Q965 Express Chipset Table 12 Note 2 3 10 Table 13 2 3 11 Table 14 October 2007 Front Panel USB Header Sheet 2 of 2 Pin Signal names Description 8 Ground 9 Key 10 USB FP OCO Front panel USB over current signal Ports 0 1 5 V Dual switches between 5 V and 5 V Standby depending on the current board state Front Audio Header The front panel Audio header is a 2x7 header designated as J8AU The following table outlines the pin out and functionality of this header Front Audio Header Pin Signal Name Description 1 AUD PORT 1 R Port 1 Audio Right 2 GND Ground 3 AUD PORT 1L Port 1 Audio Left 4 AUD FP PWR Front Panel Audio Power 5 AUD PORT 2 R Port 2 Audio Right 6 AUD FP RET R Front Panel Audio Return Right 7 AUD FP JS Front Panel Jack Sense 8 No Connect Key Pin 9 AUD PORT 2 L Port 2 Audio Left 10 AUD FP RET L Front Panel Audio Return Left 11 AUD VOL UP Audio Volume Up 12 A
59. uide for or datasheet for the chipset and the Intel Core 2 Duo processor Thermal and Mechanical Design Guidelines 2 2 Intel Q965 Express Chipset Development Kit Features Summary This section summarizes the development kit features Table 3 Development Kit Features Summary Sheet 1 of 2 Form Factor 4 Layer uBTX 10 5 inches x 10 4 inches Processor Intel Core 2 Duo processor E6400 Supports 1066 MHz front side bus 2M Shared L2 Cache Supports Intel 64 Architecture Supports Intel Wide Dynamic Execution Intel amp Smart Memory Access Intel Advanced Smart Cache Intel Advanced Digital Media Boost Intel virtualization Technology Memory DDR2 dual channel system memory interface Four 240 pin DDR2 SDRAM DIMM sockets two per channel supporting dual channel interleaved mode Support for 533MHz 667MHz 800MHz unbuffered non ECC DDR2 SDRAM modules Supports 128 MB to 8 GB of system memory 256 Mbit 512 Mbit or 1 Gbit Technology Chipset Intel Q965 Express Chipset consisting of Intel 82Q965 Graphics Memory Controller Hub G MCH Intel 82801GB I O Controller Hub ICH8DO Video Option of either using integrated graphics system or external PCI Express graphics Intel GMA3000 integrated graphics subsystem Supports ADD2 and Intel Media Expansion Card MEC also known as ADD2 for additional digital display such as DVI LVDS etc depending on the media expansion card features

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