Intel Chipper 945GC User's Manual
Contents
1. pue 31 25 8 11 130 3 vao 9 90 X ONNOUY HUNG ON s00 5921 9 lego X SP 1 soi su Y 600 069 9 80 83 0 HO 1 0121 09622 21 69 Y Lies SI XZ 99 19945 XLV 10 3uisjeeH HOW 9 4 EE sauljapind uBiseg pue AINO 39343438 SNOISNAWIG LINN ABYQNOO3S TIY Lt WIG WNN Luvd 31viud OuddY ONY SILNI ATLN3NVIWH3d 38 11 ONY 7131NI 30 A183d Oud 3H138 TIVHS 1999 01 ONITOOL 91 XVI du VHS SY NMOHS 3903 91 ANO 39N383338 NMOHS 34133 31 9 535508 Nid NOILO3P3 TY NOILOnH LSNOO 1001 01 1YA S 131NI SLUISNI 9NI1001 ONY ONILV9 535508 Nid NOIIO3P3 tl 8 0 0339X3 01 LON HO IV ASIA 3NI 9NILBVd L 92 0 OL HSN14 w 010303 XVW S70 NIS LL 8170 8 13 OL 318V1d300V 553038 31V9 NIM 31V9 SS3NYOIH1 TWUNLONULS 0138 SE 0 O1 5 13 31 930 6 Q3AON3H 310N 8 3 38 NM OHS SNOISN3IIQ NY 2 NOISN3NIQ N OILOND 01 YOILIHD 9 ovg 3N314H13A10d 8 935 34 268591 QUVONV LS2. SOF 919 06071 D 112 A vv Nonoas 9 esri 904 WS a A i 06 Luo iH dAL ey H 5 i ew T seg 9 aS Y A pen soi a SOF ez C aas uva IY _ 16102 0971 SOT D 1 suuojeld XLV 10 ursjeeH HOIW 5 LT 91 4 9jui Je iueu ey pue 08 600 520 14100800 27 TM LA e S Sf 6l PA a A EE M 020150 0108 E 82 21007 1 re 1901 20596 R 7 TH 606 Bt 2 ux 400 982 91 j iF 60 8r 940 2 9 06 T LEE 61 Jr M 53945 1 03 81 988 a 28g tp SNOISNAWIG OL VOI LIHO 3903 duVHS ANY 59 9 8 7 TIVHS 09120 NOI LV9I3I93dS LN3 N3un908d 1 SALON suuogmeld X18 pe uejeg 5 HDIN D ST 4 5 5 e i
3. 33 Figure 15 G MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1 34 Figure 16 G MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 2 35 Figure 17 G MCH Reference Heatsink for ATX Platforms Wire Preload Clip 36 Figure 18 G MCH Reference Heatsink for Balanced Technology Extended BTX PIAGIONINS i iii 37 Figure 19 G MCH Reference Heatsink for Balanced Technology Extended BTX PIAETO RIS 38 Figure 20 G MCH Reference Heatsink for Balanced Technology Extended BTX Platforms Heatsink Assembly 39 Table 1 Loading 5 1 12 Table 2 G MCH Case Temperature Specifications 13 Table 3 G MCH Thermal Design Power 14 Table 4 Reference Thermal Solution Environmental Reliability Requirements 24 Table 5 ATX Intel Reference Heatsink Enabled 25 Table 6 G MCH Balanced Technology Extended BTX Intel Reference Heatsink Enabled Suppliers ______________ 26 Thermal and Mechanical Design Guidelines Revision History Revision Description Number Initial Release May 2005 Added Intel 82945PL specifications O
4. Spectral Density PSD Profile 3 13 RMS Thermal e 40 C to 85 C 900 cycles Thermal Cycling Performance Unbiased 85 relative humidity 55 C 500 hours Visual Check Humidity NOTES 1 The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material 2 Additional Pass Fail Criteria may be added at the discretion of the user 24 Thermal and Mechanical Design Guidelines Enabled Suppliers n tel Appendix A Enabled Suppliers Current suppliers for the Intel 945G 945GZ 945GC 945P 945PL Express chipset G MCH reference thermal solution are listed in Table 5 and Table 6 Table 5 G MCH ATX Intel Reference Heatsink Enabled Suppliers Supplier Intel Part Vendor Part Contact I nformation Number Number C85366 001 00C863501A Monica Chih 886 2 heatsink 29952666 C85370 001 334C863501A monica chih gccic com tw Chaun Choung Harry Lin 714 739 5797 Technology Corp retainer hlinack aol com 334C863502A 85373 001 wire clip C85376 001 G2100C888 143 Rick Lin 886 2 WiesonElectronic Co anchor 26471896 ext 6342 rick wieson com tw C85366 001 27802 016 Jack Chen 714 626 1233 heatsink Jack chen foxconn com Foxconn HonHai 85370 001 77 002 Precision retainer 3KS02 066 C85373 001 wire clip Foxconn HonHai C85376 001 22802 015 Jack Chen 714 626 1233 Precision
5. Je xiueu ey pue jeuueu 0 1883 LN3N39 17103 10H 21273815 QuvOgu3HL OI WING 92 8323 01 LON LHOIH LN3NOdINOO INSLV3H Z C199 19 616050 TALNI 62839 o 1 153101 or 4 9 10130 EL S Zu 19H LN3NOdNOO 00142 1 92 boe oz 918 xr eu us x or 952 Xe 43130 1N3NOdIO0 SIHL S LNINOdIO9 ON 1n0d334 39vullocolzr 7 X8 960 260 X8 S ANN NN SAY 022 oz 8619 X18 10 4 JUBUOdWOD 9 4 jJe iueu ey pue 1531 133W 01 Q38In O3H 01 193rens 3903 30 SSANdHWHS 1uvd 30 u3laWiluad 3903 dY YHS HO Suung Tiv HL 38 TIVHS SNOISN3IIO TY OL AINO 328383438 804 SNOISNAWIG LINN 0 0235 11 6 31viddOlddY ONY IWYN q A1IN3NYINH3d 38 TI
6. ono 94 GG 4 99959 On emm drm orm omo AAA LLL ii CUCL LLL Aaa 666 0690 j LEE aad 90660966009 60799900090 52 29asseeaane 007660006 00096770699 0052505559 9209220902992009 524255 52599 9999992996043 e 3392585222922222 899999929999299455 Yoa 990 az 09979999909 e mom ooo 598 3 ee 7 RT EX E a E Non standard grid ball pattern Minimum pitch 0 8mm 0 03111 2 2 Package Loading Specifications Table 1 provides static load specifications for the chipset package This mechanical maximum load limit should not be exceeded during heatsink assembly shipping conditions or standard use conditions Also any mechanical system or component testing should not exceed the maximum limit The chipset package substrate should not be used as a mechanical reference or load bearing surface for the thermal and mechanical solution Table 1 G MCH Loading Specifications NOTES 1 These specifica
7. 131NI 434 NOISIA3H ONY Nid 13 NI XH VI S 3383 031 830108 AINO NIL 00100070 5111 830108 SNILVId 0 139IN 9030000 HSINI3 LOVINOD 131NI NOdN IN30VAIO3 55 58 10V INOO 66 NVX3139 338 2 18 0 IN OILSWId ILYN OGHYIAT Od OLYTNSNI STVIBILYN 50 8319NV 80 BV3NIT lt 53715 38n1v34 10 WNOL gt 53215 38n1v33 804 NI SNOISN3AIQ 031219345 351 MH3H10 5831 1 35 5 ONY 03 015 3 10 NO S32NYU3101 2 351 MH3H10 0131 210 SS3Nn 31 15 GANIVHLSNOONN 3383 LEVd 1Y 318VOl1ddY 3uv 3113 03114405 0 39N30393Ud 33 1 MYY SIHLNO S39NYH3101 SNOISNAWIG TY 3113 35 8 1 0 03114408 NOILONNPNOD NI ISN 38 01 9NIMYHO SIHL 8310N NOI1dO 583114405 30V 4831NI HOLVINSNI O1 LOVINOD U33I VHD soo ssi SLUT 76 XZ NIN Z0 X Sh AN GS ON Y Qe 1 1 200 000 20 10 0 0 290 9 i007 0201 9093 90 XZ eoo 0607 KOF LL0 002 95 920 1970 o 9 r i i voo 667 XZ 1 amp 0 9 20581 902 502 9 us 1 2 1 080 a 919 i 1 JL 1 so 860 i d so T 0061 29 91
8. XLV 10 4uisjeaH HIW D 4 5 ubiseg pue AINO 434 SNOISN3INIO LINN ABYONOO3S 11 741 WAGWAN 18vd 40844 ONY S131NI 4 38 TIVHS 1311 30 A183d Od 38 TIVHS 1UVd SIHL 010380038 9 100179 8 du VHS SY NMOHS 53903 SI AINO 39N38343U 3UV NMOHS S3Uf1v34 31V9 838808 Nid 0112373 TIY NOILONYLSNOD 1001 01 BOlBd 1YAOHddY S 131NI 3uin O38 SLYSNI 9NI1001 ONILVO 535508 Nid 0112373 91 9270 0339X3 01 LON HOLVWSIW INI 9NILBYd El 980 OL HSNI 8012373 Zl 52 CANIS LL 6170 HSW14 Ol 3399 53034 31 9 UO 113M 3179 uniongls 0138 60 OL HS014 31V930 6 310N 8 3 38 TIVHS NMOHS SNOISNSIHIO 11 72 NOISNAWIG NOILONN4 01 1721 192 9 16699 QU YONV1S 83d NMOHS 383H M 3009 31VQ ANY Y39WNN ALIAVO NOISIA3U 131NI 18Vd S 434 SWYY 9 91 2 LHOI3 M WW 0I809 60 9621 3 181551 92 QNIg93H 0 66 39 434 MOVIE 9NILVIIXOHddY 80102 9 9 951 8 31VH 1 01 431 1305 AOF 911 8690 WLS SNINGOW 7 14 9 lt 8690 WISV LY NOILV9NO 3 3115831 15 lt 690 W1SV HLON3HLS Q713IA
9. BGA Ball Grid Array A package type defined by a resin fiber substrate where a die is mounted and bonded The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound FC BGA Flip Chip Ball Grid Array A package type defined by a plastic substrate where a die is mounted using an underfill C4 Controlled Collapse Chip Connection attach style The primary electrical interface is an array of solder balls attached to the substrate opposite the die Note that the device arrives at the customer with solder balls attached Intel ICH7 Intel 1 O Controller Hub 7 The chipset component that contains the primary PCI interface LPC interface USB ATA and or other legacy functions GMCH Graphic Memory Controller Hub The chipset component that contains the processor and memory interface and integrated graphics device Memory Controller Hub The chipset component that contains the processor and memory interface It does not contain an integrated graphics device The measured ambient temperature locally to the component of interest The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink The measured case temperature of a component For processors Tc is measured at the geometric center of the integrated heat spreader IHS For other component types it is generally measured at the geometric center of the die o
10. 3TSN31 401123135 TWIHALVN LNSTVAINOS HOS 68311834084 1 1 1VOINVHO3I 10011190 8 684 8300 NYX31 39 434 A Oud dV 131NI NOdN LN31Y AI WO OILSV1d OWB3H 1 INVITdWOO 3dA 97 553 9 a e 0 8319NV 8r T uv3Nn WNWOS lt 53215 1Y34 0r 09 Sc N33M138 53215 38 1 34 804 80 7 92 01 M138 53215 38n1V33 gt S3ZIS 9313NITII N NI SNOISN3NIO 031319995 3SI MH 3H10 5531 5380 1733 Q3NOISN3WIOND Q3NOISN3NIQ NO S39NYU3101 2 38I MB3H10 03LYJIONI SSHINN 31V1S GANIVHLSNOONN 3383 LYYd LY 318 91198 3uv 3114 13114415 H3AO 329N30323Hd SIHLNO S39NYH3101 ONY SNOISN3NIQ TV 3113 3S 06 03114405 NOILONAPNOD G3SN 38 OL SIHI SALON 130 339 640 E 00 1 1 1 WILL _ 9 1Y130 33 ES 9 1919 i 6421 5 Fl i 1 I A Tori 5622 si VIE xe er B T 19945 duiey 40 JUIS EOH HOIN 9 ST 4 91u l SE sauljapind uBiseg pue 8 8 011235 La 9 sx 1 zsz 9 Ln 9 6 0
11. corresponds to Tc Measuring Tc requires special care to ensure an accurate temperature reading Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce error in the measurements The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package heat loss by radiation and or convection conduction through thermocouple leads or contact between the thermocouple cement and the heatsink base if a heatsink is used To minimize these measurement errors a thermocouple attach with a zero degree methodology is recommended 3 1 1 Thermocouple Attach Methodology 1 Mill a 3 3 mm 0 13 in diameter hole centered on bottom of the heatsink base The milled hole should be approximately 1 5 mm 0 06 in deep 2 Milla 1 3 mm 0 05 in wide slot 0 5 mm 0 02 in deep from the centered hole to one edge of the heatsink The slot should be in the direction parallel to the heatsink fins see Figure 3 3 Attach thermal interface material TIM to the bottom of the heatsink base 4 Cut out portions of the TIM to make room for the thermocouple wire and bead The cutouts should match the slot and hole milled into the heatsink base 5 Attach a 36 gauge or smaller calibrated K type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement During this step make sure no contact is pres
12. rancho Jack chen foxconn com Note These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality availability reliability functionality or compatibility of these devices This list and or these devices may be subject to change without notice Thermal and Mechanical Design Guidelines 25 intel Enabled Suppliers Table 6 G MCH Balanced Technology Extended BTX Intel Reference Heatsink Enabled Suppliers Supplier Intel Part Vendor Part Contact I nformation Number Number C57359 001 00C863401A Monica Chih 886 2 Chaun 29952666 Choung monica_chih ccic com tw Technology Corp Harry Lin 714 739 5797 hlinack aol com C57359 001 5909700001 David Chao 886 2 2299 AVC Asia Vital 6930 x619 Components david Foxconn HonHai C57359 001 2Z802 010 Jack Chen 714 626 1233 Precision Jack chen foxconn com Thermal and Mechanical Design Guidelines Mechanical Drawings intel Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document Drawing Name Page Number G MCH Package Drawing 28 G MCH Component Keep Out Restrictions for ATX Platforms 29 G MCH Component Keep Out Restrictions for Balanced Technology E
13. the needs of current and future applications Specifications The G MCH is estimated to dissipate the Thermal Design Power values provided in Table 3 when using two DIMMs of 667 MHz 553 MHz for the 82945PL 82945GZ dual channel DDR2 with a 1066 MHz 800 MHz for the 82945PL 82945GZ 82945GC processor system bus speed For the 82945G 82945GZ 82945GC GMCH the graphics core is assumed to run at 400 MHz FC BGA packages have limited heat transfer capability into the board and have minimal thermal capability without thermal solutions Intel requires that system designers plan for an attached heatsink when using the G MCH G MCH Thermal Design Power Specifications System Bus Speed Memory Frequency TDP Value 82945G GMCH 1066 MHz 667 MHz 22 2W 82945GZ GMCH 800 MHz 533 MHz 22 2 W 82945GC GMCH 800 MHz 667 MHz 22 2W 82945P MCH 1066 MHz 667 MHz 15 2W 82945PL MCH 800 MHz 533 MHz 15 2W Thermal and Mechanical Design Guidelines Thermal Metrology n te 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system Intel has established guidelines for proper techniques of measuring G MCH component case temperatures 3 1 Case Temperature Measurements To ensure functionality and reliability the G MCH is specified for proper operation when is maintained at or below the maximum temperature listed in Table 2 The surface temperature at the geometric center of the die
14. 31 25 9 i 1 Lise Doc 9 995 1 02 3125 Y TV130 x2 i 892 59 Low t 19945 suuopeld XLV 10 5 9 e4n614 5 ubiseg pue 9 AINO 30N3H333H FHV SNOISN3WIO ABVINOO3S 11 8 38 TIVHS NMOHS SNOISNAWIG TIY 2 3903 dHVHS 11 3AOW3H 9 3N314H13A10d 8 03S 834 6679 QHVONV 15 131NI H3d NOISIA3H ONY N d 131NI NOISN3NIO NOILONN4 01 1VOI1IHO 01 249 012 859 N1sv smnaow 913 596 lt 8690 WLS HLON3HLS OTIIA 31ISN31 N0I10313S 1VIH31VW 1N31VAIn 303 5311939099 1 1 TVOINVHOAW 1vO1LIHO 8 131NI 1N31VAIn HO 13 51 31 0319913 ONI1V1d Le 812 3UI M OISNW 822 WLSY 3dAL V tT S319NV 8201 WV3NIT S3ONVHE3101 Su313WITIIW NI SNOISNAWIC 1031319345 381 MH3H10 5531 538 1 33 GANOISNAWIGNN GANOISNAWIG NO 530 3101 2 381 MH3H10 Q31VOIQNI 8531 91915 Q3NIVHISNOONn 3383 1HVd 1v 9189 3uv 3114 03114405 H3AO 39 V1 NO S39NYH3101 SNOISNAWIG TV 3113 3SV8V1VO 06 03114405 NOI 1v13HHOO 5 38 01 9NIMVHO SIHL 1 SJ LON
15. 4 399 299 VIY 1 WH vuv ADLI 7044 504 3713 310 OL 83334 MO NAYAT SI 2 IN3S3Nd3N LON 5300 IN s Aa BNE I UIST cu m A E 3 S HJN 6 1910 6c sauljapind uBiseg pue 9291 seb n 30v4uns quvoguaH ION 1HOI3H IN3NOdAOO 330X3 01 ION 1 XNIS LV3H 72 1000711 52 Xv 691 95710 67676 131NI Had 1 _ HON NON NOLLVOIH8V IN3A30V d 1 1H9I3H 1N3NOdAOD SALON 0507721 RX SQV LNSNOdNOO 1nod33 3ovuL os0 ev 7 WN 860 4606 x8 1573 s SINN 86621 QQ QQ 26 09 1 N 8 315 AU 80 0 2 1 86921 rerez 21 220 v8 1 XOX egre 3 j 4 KX ooz 9 9 Xb RAS NC 809 XP x E 15901 p 6 92 SIH S IN3NOdWOO ON 9 0691 87 978 Xv 98621 909 gt HLYON 10 3no deeyxy JUBUOdWOD HIW D OT 4 5
16. ERR UE REX RM E NE 14 2 4 3 14 Thermal gees 15 3 1 Case Temperature Measurements 15 3 1 1 Thermocouple Attach 15 3 2 Airflow Characterization n ee mp x RR COR AO EUCH D ETE 16 Reference Thermal 5 1 6 0 19 4 1 Operating EnVvIFOnment ENE 19 4 1 1 ATX Form Factor Operating Environment 19 4 1 2 Balanced Technology Extended BTX Form Factor Operating Enviroriment certes ie reip cesa Iud or Lara 20 4 2 Mechanical Design 2 21 4 3 Thermal Solution reas 21 4 4 Environmental Reliability Requirements 24 Enabled Suppli amp rs oorr or er Er eese trees 25 Mechanical Drawings oer ouch 27 Thermal and Mechanical Design Guidelines 3 Tables Figure 1 Non Grid 0 41 1 12 Figure 2 0 Angle Attach Methodology t
17. HEATSINK NOT SHOWN MEASURE AIR TEMPERATURE HERE AIRFLOW 2 LIUM 5 MM HEATSINK 1 0 IN SUBSTRATE SIDE VIEW Airflow velocity should be measured using industry standard air velocity sensors Typical airflow sensor technology may include hot wire anemometers Figure 4 provides guidance for airflow velocity measurement locations These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the G MCH The user may have to adjust the locations for a specific chassis Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result Measurements should be taken with the chassis fully sealed in its operational configuration to achieve a representative airflow profile within the chassis 8 Thermal and Mechanical Design Guidelines 17 18 Thermal Metrology Thermal and Mechanical Design Guidelines Reference Thermal Solution n tel 4 Reference Thermal Solution The reference component thermal solution for the G MCH for ATX platforms uses two ramp retainers a wire preload clip and four custom MB anchors The Intel Balanced Technology Extended BTX reference design uses a Z clip attach for the G MCH heatsink This chapter provides detailed information on operating environment assumptions heatsink manufacturing and
18. Intel 945G 945GZ 945GC 945P 945PL Express Chipset Family Thermal and Mechanical Design Guidelines TMDG For the Intel 82945G 82945GZ 82945GC Graphics Memory Controller Hub GMCH and Intel 82945P 82945PL Memory Controller Hub February 2008 Document Number 307504 004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS OTHERWISE AGREED IN WRITING BY INTEL THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising fro
19. Y L QIOAVO L SINN Wiid WOH3 031 1001 0 38 TIYHS 939 101 33H SNOISNAWIG LINN 6 3NON HSINH Z 3SIMH3HIO C3LVOICNI SS3INn 31 15 LSNOONQ 3303 LW TI gvonddV uv ONY 3113 09905 83 0 30 301323 4 IAV S3ONVH3TOL ONY SNOISN3IAI 313 3Sv8V1VO Ze AIN ddNS HUM NOLLONQITNOO ISl AROLA S m Ajquiassy 5 suuogeld X18 pepue1x3 53 HDIN D 02 eJn614 91 u 5
20. YHS ONY 131NI 30 A1H3d Od 38 TIVHS LUVd SIHL 01 O38InO3U 9 1001 8 SY NMOHS 5390371 REUS ALL NOISNAWIG NOILONN4 01 9 16679 QUVONYIS SNIXEVH T3 LNI U3d N MOHS 3U3H A aei XOHdd NOISIA3H ONY N d T31NI 18 Vd 5 m urn ANON HSINId t WANINNTY S 1 909 7VIB3LVI Li 495 30NV83101 Esp n po SYILINITIN NI 38Y SNOISNANIC 9 03131034 351 3 10 5831840 5 1 33 1130338 ONY G3NOISNAWIG NO S32NY83101 Z x 3S MY3HLO 031 210 xL SS31Nn 31 15 3343 LUVd 1Y 3IBVOLlddV 8 335 5 ONY 3113 03114403 830 30303038 d ANVL wW E NO 101 ONY SNOISN3HI 1Y 3113 5 8 LYO ILL 080314405 NOILONNPNOD NI 3 38 01 SIHL 1 i 153100 2 lt BEHHBS 28885 1 B iei Lose f 9 8269 x 1 x gt EH 1 BHBBHH i A EHBHBHB N NC 9NIOVdS BHEHBHH UNO TNO D mE N D ma so er 0981 o rn 8611 L zoez suuogeld XLV 10 53 H W 9 4 5
21. ctober 2005 Added Intel 82945GZ specifications 2005 004 Added Intel 82945GC specifications February 2008 Thermal and Mechanical Design Guidelines 5 Thermal and Mechanical Design Guidelines T intel 1 Introduction As the complexity of computer systems increases so do power dissipation requirements The additional power of next generation systems must be properly dissipated Heat can be dissipated using improved system cooling selective use of ducting and or active passive heatsinks The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements Operation outside the functional limit can degrade system performance cause logic errors or cause component and or system damage Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component The goal of this document is to provide an understanding of the operating limits of the Intel 82945G 82945GZ 82945GC Graphics and Memory Controller Hub GMCH and Intel 82945P 82945PL Memory Controller Hub MCH and discuss a reference thermal solution The simplest and most cost effective method to improve the inherent system cooling characteristics of the G MCH is through careful des
22. ent between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading It is critical that the thermocouple bead makes contact with the die see Figure 2 6 Attach heatsink assembly to the G MCH and route thermocouple wires out through the milled slot Thermal and Mechanical Design Guidelines 15 n te Thermal Metrology Figure 2 0 Angle Attach Methodology top view not to scale DIE THERMOCOUPLE WIRE CEMENT THERMOCOUPLE SUBSTRATE BEAD Figure 3 0 Angle Attach Heatsink Modifications generic heatsink side and bottom 3 2 16 view shown not to scale 1 3 MM 0 05 IN 0 5 MM 0 02 IN DEPTH 3 3 MM 0 13 IN DIA 1 5 MM 0 06 in DEPTH Airflow Characterization Figure 4 describes the recommended location for air temperature measurements measured relative to the component For a more accurate measurement of the average approach air temperature Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm 1 0 in apart Locations for both a single thermocouple and a pair of thermocouples are presented Thermal and Mechanical Design Guidelines Thermal Metrology j n te Figure 4 Airflow Temperature Measurement Locations LOCATION FOR T C PAIR N 25 MM 1 0 IN 3 PLACES 13 MM LOCATION FOR SINGLE T C NH 13 MM 0 5 IN LOCATION FOR TOP VIEW
23. ign and placement of fans vents and ducts When additional cooling is required component thermal solutions may be implemented in conjunction with system thermal solutions The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 82945G 82945GZ 82945GC GMCH or 82945P 82945PL MCH Properly designed solutions provide adequate cooling to maintain the G MCH case temperature at or below thermal specifications This is accomplished by providing a low local ambient temperature ensuring adequate local airflow and minimizing the case to local ambient thermal resistance By maintaining the G MCH case temperature at or below those recommended in this document a system designer can ensure the proper functionality performance and reliability of these components Note Unless otherwise specified the information in this document applies to the Intel 82945G 82945GZ 82945GC Graphics and Memory Controller Hub GMCH and the Intel 82945P 82945PL Memory Controller Hub MCH The term G MCH refers to the 82945G GMCH 82945GZ GMCH 82945GC GMCH 82945P MCH and 82945PL MCH Note Unless otherwise specified 7 refers to the Intel 82801GB ICH7 and 82801GR ICH7R 1 0 Controller Hub 7 components Thermal and Mechanical Design Guidelines 7 n I ntroduction 1 1 Terminology
24. ly on extensive knowledge of the past chipset power dissipation behavior along with knowledge of planned architectural and process changes that may affect TDP Knowledge of applications available today and their ability to stress various components of the chipset is also included in the model Since the number of applications available today is beyond what Intel can test only real world high power applications are tested to predict TDP The values determined are used to set specific data transfer rates The projection for assumes operation at The TDP estimate also includes a margin to account for process variation Post Silicon Once the product silicon is available post silicon validation is performed to assess the validity of pre silicon projections Testing is performed on both commercially available and synthetic high power applications and power data is compared to pre silicon estimates Post silicon validation may result in a small adjustment to pre silicon TDP estimates Application Power Designing to the TDP can ensure that a particular thermal solution meets the cooling needs of future applications Testing with currently available commercial applications has shown that the components may dissipate power levels below the published TDP specification in Section 2 4 3 Intel strongly recommends that thermal engineers design to the published TDP specification to develop a robust thermal solution that will meet
25. m future changes to them The Intel 82945G 82945GZ 82945GC GMCH and Intel 82945P 82945PL MCH may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Intel Pentium and the Intel logo are trademarks of Intel Corporation in the U S and other countries Other names and brands may be claimed as the property of others Copyright 2005 2008 Intel Corporation All rights reserved 2 Thermal and Mechanical Design Guidelines Contents Appendix A Appendix B 7 1 1 Terminology 8 1 2 Reference Documents 141 2 1 ess ene nnne 9 Product SpecifiCabiOnis DM EPI TE RP RU PU LEPIDE EMT 11 2 1 Package Description irit ER ERA ARAS FARE deis 11 2 1 1 Non Grid Array Package Ball Placement 11 2 2 Package Loading Specifications sss 12 2 3 Thermal Specificatlons turre ett 13 2 4 Thermal Design Power nenne 13 2 4 1 Methodology RR HERR RIA 14 2 4 2 Application
26. mechanical reliability requirements for the G MCH 4 1 Operating Environment The operating environment of the G MCH will differ depending on system configuration and motherboard layout This section defines operating environment boundary conditions that are typical for ATX and BTX form factors The system designer should perform analysis on the platform operating environment to assess any impact to thermal solution selection 4 1 1 ATX Form Factor Operating Environment In ATX platforms an airflow speed of 0 76 m s 150 Ifm is assumed to be present 25 mm 1 in in front of the heatsink air inlet side of the attached reference thermal solution The system integrator should note that board layout may be such that there will not be 25mm 1in between the processor heatsink and the G MCH The potential for increased airflow speeds may be realized by ensuring that airflow from the processor heatsink fan exhausts in the direction of the G MCH heatsink This can be achieved by using a heatsink providing omni directional airflow such as a radial fin or X pattern heatsink Such heatsinks can deliver airflow to both the G MCH and other areas like the voltage regulator as shown in Figure 5 In addition the G MCH board placement should ensure that the G MCH heatsink is within the air exhaust area of the processor heatsink Note that heatsink orientation alone does not ensure that 0 76 m s 150 Ifm airflow speed will be achieved The system in
27. n differs from the BTX reference solution because a BTX platform requires a Support and Retention Mechanism SRM that helps to meet the mechanical requirements listed in Table 4 Thermal and Mechanical Design Guidelines 21 22 n tel Reference Thermal Solution Figure 7 ATX GMCH Heatsink Installed on Board Thermal and Mechanical Design Guidelines Reference Thermal Solution Figure 8 Balanced Technology Extended BTX GMCH Heatsink Installed on Board LL IUE TELNI Thermal and Mechanical Design Guidelines 23 i n te Reference Thermal Solution 4 4 Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 4 These should be considered as general guidelines Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements Table 4 Reference Thermal Solution Environmental Reliability Requirements Test Requirement Pass Fail Criteria Mechanical 3 drops for and directions in each of 3 Visual Electrical Shock perpendicular axes i e total 18 drops Check eProfile 50 G trapezoidal waveform 11 ms duration 4 3 m s 170 in s minimum velocity change eSetup Mount sample board on test fixture Include 550 g processor heatsink Random eDuration 10 min axis 3 axes Visual Electrical Vibration Check Frequency Range 5 Hz to 500 Hz
28. ntegrators should ensure no board or chassis components would intrude into the volume occupied by the G MCH thermal solution Thermal Solution Assembly The reference thermal solution for the G MCH for an ATX platform is shown in Figure 7 and Appendix B and is an aluminum extruded heatsink that uses two ramp retainers a wire preload clip and four custom motherboard anchors The heatsink is attached to the motherboard by assembling the anchors into the board placing the heatsink over the G MCH and anchors at each of the corners and securing the plastic ramp retainers through the anchor loops before snapping each retainer into the fin gap The assembly is then sent through the wave process Post wave the wire preload clip is assembled using the hooks on each of the ramp retainers The clip provides the mechanical preload to the package A thermal interface material Chomerics T710 is pre applied to the heatsink bottom over an area that contacts the package die The reference thermal solution for the G MCH for a BTX platform is shown in Figure 8 The heatsink is aluminum extruded and uses a Z clip for attach The clip is secured to the system motherboard via two solder down anchors around the G MCH The clip helps to provide a mechanical preload to the package via the heatsink A thermal interface material Chomerics T710 is pre applied to the heatsink bottom over an area in contact with the package die The ATX reference thermal solutio
29. of the G MCH and does not represent a specific software application TDP attempts to account for expected increases in power due to variation in G MCH current consumption due to silicon process variation processor speed DRAM capacitive bus loading and temperature However since these variations are subject to change the TDP cannot ensure that all applications will not exceed the TDP value The system designer must design a thermal solution for the G MCH such that it maintains Tc below for a sustained power level equal to TDP Note that the Specification is a requirement for a sustained power level equal to and that the case temperature must be maintained at temperatures less than when operating at power levels less than TDP This temperature compliance is to ensure G MCH reliability over its useful life The TDP value can be used for thermal design if the G MCH thermal protection mechanisms are enabled Intel chipsets incorporate a hardware based fail safe mechanism to help keep the product temperature within specifications in the event of unusually strenuous usage above the TDP power limit Thermal and Mechanical Design Guidelines 13 n te Product Specifications 2 4 1 2 4 1 1 2 4 1 2 2 4 2 2 4 3 14 Table 3 Methodology Pre Silicon To determine TDP for pre silicon products in development it is necessary to make estimates based on analytical models These models re
30. op view not to 5 16 Figure 3 0 Angle Attach Heatsink Modifications generic heatsink side and bottom view shown not to 16 Figure 4 Airflow Temperature Measurement Locations 17 Figure 5 Processor Heatsink Orientation to Provide Airflow to G MCH Heatsink on an ATX Platf RR 20 Figure 6 Processor Heatsink Orientation to Provide Airflow to Heatsink on Balanced Technology Extended BTX 21 Figure 7 ATX GMCH Heatsink Installed on 22 Figure 8 Balanced Technology Extended BTX GMCH Heatsink Installed on Board 23 Figure 9 Package Drawing 1 28 Figure 10 Component Keep Out Restrictions for ATX Platforms 29 Figure 11 G MCH Component Keep Out Restrictions for Balanced Technology Extended BTX 11211111 30 Figure 12 Reference Heatsink for Platforms Sheet 1 31 Figure 13 G MCH Reference Heatsink for ATX Platforms Sheet 2 32 Figure 14 Reference Heatsink for ATX Platforms Anchor
31. r case The maximum case die temperature with an attached heatsink This temperature is measured at the geometric center of the top of the package case die The minimum case die temperature with an attached heatsink This temperature is measured at the geometric center of the top of the package case die Thermal Design Power TDP is specified as the highest sustainable power level of most or all of the real applications expected to be run on the given product based on extrapolations in both hardware and software technology over the life of the component Thermal solutions should be designed to dissipate this target power level Thermal Interface Material TIM is the thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance Case to ambient thermal characterization parameter Psi This is a measure of thermal solution performance using total package power It is defined as Tc Ta Total Package Power Heat source size should always be specified for measurements 8 Thermal and Mechanical Design Guidelines I ntroduction 1 2 Reference Documents Document Comments Intel 945G 945GZ 945P 945PL Express Chipset Family Datasheet Intel 1 O Controller Hub 7 7 Datasheet Intel 1 O Controller Hub 7 ICH7 Thermal Design Guidelines Intel Pentium 4 Processor 670 660 650 640 and 630 and Intel Pentium 4 Processor Extreme Edition Data
32. r thermal module Since the processor thermal module provides lower inlet temperature airflow to the processor reduced inlet ambient temperatures are also often seen at the G MCH as compared to ATX An example of how airflow is delivered to the G MCH on a BTX platform is shown in Figure 6 The local ambient air temperature Ta at the G MCH heatsink in the Intel micro BTX reference design is predicted to be 45 The thermal designer must carefully select the location to measure airflow to get a representative sampling These environmental assumptions are based on a 35 system external temperature measured at sea level The local ambient air temperature is a projection based on anticipated power increases on a 2005 platform and may be subject to change in future revisions of this document Thermal and Mechanical Design Guidelines Reference Thermal Solution n te Figure 6 Processor Heatsink Orientation to Provide Airflow to G MCH Heatsink on a 4 2 4 3 Balanced Technology Extended BTX Platform Balanced Technology Extended BTX Thermal Module Assembly Over Processor Airflow Direction Top View Proc_HS_Orient Mechanical Design Envelope The motherboard component keep out restrictions for the G MCH on an ATX platform are included in Appendix B Figure 10 The motherboard component keep out restrictions for the G MCH on a BTX platform are included in Figure 11 System i
33. sheet Intel Pentium 4 Processors 570 571 560 561 550 551 540 541 530 531 and 520 521 Supporting Hyper Threading Technology Datasheet Intel Pentium D Processor 840 830 and 820 Datasheet Intel Pentium 4 Processor on 90 nm Process in the 775 Land LGA Package Thermal and Mechanical Design Guidelines Intel Pentium D Processor and Intel Pentium Processor Extreme Edition 830 Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Various System Thermal Design Suggestions Thermal and Mechanical Design Guidelines http developer intel com des ign chipsets datashts 307502 htm http developer intel com de sign chipsets datashts 30701 3 htm http developer intel com de sign chipsets designex 30701 5 htm http developer intel com design pentium4 datashts 306382 htm http developer intel com design Pentium4 datashts 302351 htm http developer intel com design PentiumD datasht s 307506 htm http developer intel com design Pentium4 guides 3 02553 htm http developer intel com design pentiumXE designe x 306830 htm http developer intel com design pentium4 guides 3 02666 htm http www formfactors or g 10 I ntroduction Thermal and Mechanical Design Guidelines Product Specifications n te 2 Product Specifications This chapter provides the package description and loading
34. specifications The chapter also provides component thermal specifications and thermal design power descriptions for the G MCH 2 1 Package Description The G MCH is available in a 34 mm 1 34 in x 34 mm 1 34 in Flip Chip Ball Grid Array FC BGA package with 1202 solder balls The die size is currently 9 6 mm 0 378in x 10 6 mm 0 417in A mechanical drawing of the package is shown in Figure 9 Appendix B 2 1 1 Non Grid Array Package Ball Placement The G MCH package uses a balls anywhere concept The minimum ball pitch is 0 8 mm 0 031 in but ball ordering does not follow a 0 8 mm grid Board designers should ensure correct ball placement when designing for the non grid array pattern For exact ball locations relative to the package contact your Field Sales Representative Thermal and Mechanical Design Guidelines 11 i n te Product Specifications Figure 1 G MCH Non Grid Array 22249 93323342323 POF PPP peo do PoP oon gt FIFI ay FOF 32222335527 09856 o 6696069906 990026960066 4 6aanascaaseet ten 0999902099 9 999 9220933265 RIGRRIGIARHDS 93323 22202999 922229200094 99 6550965502609 6 3944069330880 5 299999999909 PH 522259532096 84040445004 9990000000
35. tegrator should use analytical or experimental means to determine whether a system design provides adequate airflow speed for a particular G MCH heatsink The local ambient air temperature T at the G MCH heatsink in an ATX platform is assumed to be 47 C The thermal designer must carefully select the location to measure airflow to get a representative sampling These environmental assumptions are based on a 35 C system external temperature measured at sea level Thermal and Mechanical Design Guidelines 19 te Reference Thermal Solution Figure 5 Processor Heatsink Orientation to Provide Airflow to G MCH Heatsink on an 4 1 2 20 Note ATX Platform uonoeig Airflow Direction Airflow Direction G MCH Heatsink Omi Directional Flow Processor Heatsink Fan Not Shown Airflow Direction TOP VIEW Proc HS Quent ATK Other methods exist for providing airflow to the G MCH heatsink including the use of system fans and or ducting or the use of an attached fan active heatsink Balanced Technology Extended BTX Form Factor Operating Environment The operating environment for the G MCH in typical BTX systems has not been profiled This section provides operating environment conditions based on what has been exhibited on the Intel micro BTX reference design On a BTX platform the G MCH obtains in line airflow directly from the processo
36. tions apply to uniform compressive loading in a direction normal to the G MCH package 2 This is the maximum force that can be applied by a heatsink retention clip The clip must also provide the minimum specified load on the G MCH package 3 These specifications are based on limited testing for design characterization Loading limits are for the package only 12 Thermal and Mechanical Design Guidelines Product Specifications n te 2 3 Thermal Specifications To ensure proper operation and reliability of the G MCH the temperature must be at or below the maximum value specified in Table 2 System and component level thermal enhancements are required to dissipate the heat generated and maintain the G MCH within specifications Chapter 3 provides the thermal metrology guidelines for case temperature measurements The G MCH must also operate above the minimum case temperature specification listed in Table 2 Table 2 G MCH Case Temperature Specifications Parameter Value 82945G 82945GZ 82945GC GMCH 99 C To TEM 82945P 82945PL MCH 103 C NOTE Thermal specifications assume an attached heatsink is present 2 4 Thermal Design Power TDP Thermal design power TDP is the estimated power dissipation of the G MCH based on normal operating conditions including Vcc and while executing real worst case power intensive applications This value is based on expected worst case data traffic patterns and usage
37. ueu e y pue 9019 8 9 10130335 ev Z E y 480 mu em ely TON SS T OULOTT NLW d s SNOISN3NO NOLONDHOLWONIUD 7 E NN 1217 HLONTI38IM WLOL E 4200181 FAM OISNIN 822 WISV M HL VI A 1 SUUNE ONY 39 Q3d UV HS ONIYI SILON GRUT 6e SZIF 188 i 00 ims 2 je 8 IWS omi ux Wide i EOL 4 a 88 1006 er sorz FF 929 00 CC J NOLVNI ESL ose 1 m 305 un roe lt c sm 1 9 06 X 3 H 066 Ga 2 i Se uo 30683 OY 10 1 10 53 9 6 4 1910 6 pue 208 1600780 1 xl 872 100221 8856 9 1 30 341031084 318VAON3H NMOHS 383HM VIN 30V 383 LNEIVINHHL HOV LL V 9 NMOHS 3H3HM XOBddY Nd HLM 380 1 A18 assy 9 330991 Ag ONY 38 TIVHS 19 T INI SWIL Y 5 NOILVONN
38. xtended 30 BTX Platforms G MCH Reference Heatsink for ATX Platforms Sheet 1 31 G MCH Reference Heatsink for ATX Platforms Sheet 2 32 G MCH Reference Heatsink for ATX Platforms Anchor 33 G MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1 34 G MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 2 35 G MCH Reference Heatsink for ATX Platforms Wire Preload Clip 36 G MCH Reference Heatsink for Balanced Technology Extended BTX 37 Platforms G MCH Reference Heatsink for Balanced Technology Extended BTX 38 Platforms Clip G MCH Reference Heatsink for Balanced Technology Extended BTX 39 Platforms Heatsink Assembly NOTE Unless otherwise specified all figures in this appendix are dimensioned in millimeters Dimensions shown in brackets are in inches Thermal and Mechanical Design Guidelines 27 Je xiueu ep pue jeuueu r 8c 5 p t ENE viaaa fe Sagas 19131 aval 7 nm E 2 Ad 03 ILL NI HA dol JIA 4015 8 10 2 gt K ic ud 58 9 px Y 1130 0500 B3L3ADTUM NI 031412325 3SIAB3HIU SSI 3NUZ IND 433
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