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Intel S1155 User's Manual

1. QOOOQOOOOQOOOOOQOQOOOOOOOOQOOQOQOOOQOOOQOQO 00000000 LOLLL 00000000 QOCOOQOOQ QOOOOOOQ QOOOOCOQO 00000000 LLO 666666 COCO QOOCOO QOOOOOOQOQ COO QOOOOCOOQ OQOOCOOQCOQOQ 00000000 LOLLO QOOOOOCOQO QOOOOCOOQ QOOOOCOQOQ 222225052 QOOOQOOOOCOQOOOOOQQCOOCOOQOQO0O0QOQ CQOOOOOOCOQOQOQO CQOOQOOQOOCOOCOOQOOQOO OOOOOOOO OOOOOOO 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Thermal Mechanical Specifications and Design Guidelines 17 Table 2 4 18 Package Mechanical amp Storage Specifications Processor Storage Specifications Table 2 4 includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity These conditions should not be exceeded in storage or transportation Storage Conditions Parameter Description Min Max Notes TABSOLUTE STORAGE The non operating device storage temperature Damage latent or otherwise may occur when 55 9C 125 1 2 3 subjected to for any length of time TsusrAINED STORAGE The ambient sto
2. ENT DTS uris 45 1 0 300 0 300 44 0 0 341 0 324 43 0 0 379 0 347 42 0 0 417 0 369 41 0 0 454 0 391 40 0 0 492 0 413 39 0 0 530 0 436 38 0 0 567 0 458 37 0 0 605 0 480 36 0 0 643 0 502 35 0 0 680 0 524 34 0 0 718 0 547 33 0 0 756 0 569 32 0 0 793 0 591 31 0 0 831 0 613 30 0 0 869 0 636 29 0 0 906 0 658 28 0 0 944 0 680 Thermal Mechanical Specifications and Design Guidelines 51 e n tel Thermal Specifications Table 6 9 Thermal Solution Performance above Tcowrno for the Intel Xeon Processor E3 1260L 45W Sheet 2 of 2 Yea at at 1 CA CA TAMBIENT DTS 2 DTS 13 27 0 0 982 0 702 26 0 1 019 0 724 25 0 1 057 0 747 24 0 1 095 0 769 23 0 1 132 0 791 22 0 1 170 0 813 21 0 1 208 0 836 20 0 1 245 0 858 Notes 1 ambient temperature is measured at the inlet to the processor thermal solution 2 This column be expressed as a function of by the following equation 0 3 45 1 0 0377 3 This column be expressed as a function of by the following equation 0 3 45 1 0 0222 Table 6 10 Thermal Solution Performance above for the Intel Xeon Processor E3 1220L 20W Sheet 1 of 2
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4. 116 C 2 Socket Mechanical Drawing Sheet 2 of 4 117 C 3 Socket Mechanical Drawing Sheet of 4 118 C 4 Socket Mechanical Drawing Sheet 4 4 119 D 1 Processor Package Drawing Sheet 1 of 2 122 D 2 Processor Package Drawing Sheet 20 2 123 Thermal Mechanical Specifications and Design Guideline Tables 1 1 1 2 2 1 2 2 2 3 5 1 6 1 6 7 6 8 6 9 Reference Documehts aki deta tate a CE RAW R ed a DR RR ER 10 Terms and Descriptions eese oe n v dea RE ede 10 Processor Loading Specifications 4 2 15 Package Handling 6 66 15 Processor 5 t rar UR ER RR dn RE 16 Storage CONdItIONS nie 18 Socket Component Mass 1 11 nennen
5. 48601081 38 LON AV SLI NI 035070514 SI NOLLVIWHOJNI TVLLN3GIJNOO NOLLVHOdHOO 131NI 8 SIHL 8 V 100990673 mum 2 v S 9 1 8 intel Figure B 19 1U ILM Standard 6 32 Thread Fastener 114 Socket Mechanical Drawings intel C Socket Mechanical Drawings Table C 1 lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 Thermal Mechanical Specifications and Design Guidelines m e n tel Socket Mechanical Drawings Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 SOCKET LGAII55 REVISION HSTORY THE GNMENT E TO THE TO OF THE ALI 116 Thermal Mechanical Specifications and Design GuidelinesDocument Number 448776 Rev 2 0 Socket Mechanical Drawings n tel Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 2 L 2
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7. Components Co Ltd Item I ntel PN Foxconn Molex Tyco Lotes LGA115x ILM G12451 001 012 1000 5377 475973003 1 2134503 1 ACA ZIF 127 cover only P01 LGA115xILM Back E36143 002 44 19 6401 475969930 2069838 2 DCA HSK 144 Plate with 09 screws 1U ILM Back Plate E66807 001 44 18 6401 N A N A DCA HSK 157 with Screws Supplier Contact I nformation Supplier Contact Phone Email Kai Chang 86 755 3366 8888 kai_chang avc com tw Asia Vital x63588 Delta William Bradshaw 1 510 668 5570 WBradshaw delta corp com 86 136 8623 1080 Foxconn Julia Jiang 1 408 919 6178 juliaj foxconn com for socket and ILM 1 512 670 2638 ray wang foxconn com Ray Wang for heatsink ITW Fastex Chak Chakir 1 512 989 7771 Chak chakir itweba com Lotes Co Ltd Windy Wong 1 604 721 1259 windy lotestech com Molex Carol Liang 86 21 504 80889 x3301 carol liang molex com Nidec Karl Mattson 1 360 666 2445 karl mattson nidec com Tyco Billy Hsieh 81 44 844 8292 billy hsieh tycoelectronics com The enabled components may not be currently available from all suppliers Contact the supplier directly to verify time of component availability Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings Table B 1 Mechanical Drawings Table B 1 lists the mechanical drawings included in this appendix Mechanical Drawing List D
8. 3215 T b NL MOTIOHXOH ANIS 1 sun 80 8440 SOF X 6118 29096 VO VINVS 28 panni aav 6 186 80 60 40 3931100 NOISSIW 0022 AN3NIMVasQ 1601 SLYYd ON WAL ALO 982 6906 9 301 REV 1 SHT E49059 DWG NO SSANWOIHL 3sva e evo 88 sz 80060 xv 1 1 C 9 SSANLV14 9 00 7 1 1 vo se e sroFs4 0 95 96 S1 909 8 GANIVLINIVW 38 11116 LSNW TIVH3AO 15 TWHNLONUYLS 3SV3HONI OL 40 5 4 1 NO NOLLO3NNOO ONIHOLILS TVOINVHO3MW 2 7IVLS3O3d LV3H NO L 0070 WW 920 INOZ SSANLV14 79907 ATHWSSSV ONY H3 L3V S1IN3ATOS S3SV3H9 S3903 dHVHS 5 3AOWSM NOILS399nS SHarTddns NO SHaldAVvsvd E NOISNAWIG NOILONN OL E SHSLSNITIIW GALVLS SNOISNAWIG 2 3svav
9. 13 Vd 39V ld 934 3190 1 9 ATBIN3SSV ONY ONINIHOVW 59 149 SLN3A10S S3SV3HO9 S3903 dYVHS SYYN TIY SAOWSY 7 NOISN3WIQ OL SHONI NI 91915 SNOINS3WIG SH3 L3NTTTIW NI GALVLS SNOISNAWIG Z 5 aanaans a SIHL NO S3ON3S3T01 SNOISN3WIG TIV asvaviva ae aariddns NI CASN OL SIHL L visaaas N 4955 E N 5310 20 02 60 aivadn 8 z 09420 asyn TELNI 40 GASOTOSIG LON AVN Mem am S N3INOO NI 03501951 LI NOLLVWHOJNI 131NI SNIVLNOD SIH L AHOLSIH NOISIA3H Thermal Mechanical Specifications and Design Guidelines 100 2 intel 30 3799 LON 1 26 SILON 33S S3lON33s i WALW 6906 9 5 423
10. DTS 29 a ore 50 0 2 018 1 375 49 0 2 103 1 425 48 0 2 187 1 475 47 0 2 272 1 525 46 0 2 357 1 575 45 0 2 442 1 625 44 0 2 526 1 675 43 0 2 611 1 725 42 0 2 696 1 775 41 0 2 781 1 825 40 0 2 865 1 875 39 0 2 950 1 925 38 0 3 035 1 975 37 0 3 119 2 025 36 0 3 204 2 075 35 0 3 289 2 125 34 0 3 374 2 175 33 0 3 458 2 225 32 0 3 543 2 275 31 0 3 628 2 325 30 0 3 713 2 375 29 0 3 797 2 425 52 Thermal Mechanical Specifications and Design Guidelines Thermal Specifications n tel Table 6 10 Thermal Solution Performance above Tcowrno for the Intel Xeon Processor E3 1220L 20W Sheet 2 of 2 Ton prs 2 28 0 3 882 2 475 27 0 3 967 2 525 26 0 4 052 2 575 25 0 4 136 2 625 Notes 1 ambient temperature is measured at the inlet to the processor thermal solution 2 This column can be expressed as a function of by the following equation 0 45 68 5 0 0847 3 This column can be expressed as a function of by the following equation 0 45 68 5 X 0 05 Table 6 11 Thermal Solution Performance above for the Intel Xeon Processor E3 1200 95W with I ntegrated Graphics 5 2 br 45 1 0 290 0 289 44 0 0 310 0 301 43 0 0 328 0 312
11. 111 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings intel Figure B 17 Thermocouple Attach Drawing L dO I33HS 37725 LON OQ 816853 ONIMV3IQ HOVLLV AIdNODOWYSHL 3070S 3043 SHI 0911 V91 3IONV Q3AO3ddV NMV3IG V66l WS Y JWSV add 101 ANY 139 deal NI 100 0 500 50 X SI XILNIO 1Y OS10 0 IHL SAANG dO 3924 dd OL JAY 53003 9 NMOHS SY SI JO NOILVIN3IIO NOILO3IG IND WdddOO 1 1 TAADIN SI SHI HSINIJ TIIW 38 OL 53 5 GANIHOVW 5710 501114 ON AXA NYTIO JNIHOVW ONINIHOVW C3ZIWINIW XX 92088 VNOZRIV 2HTONVHO jau 8002 0 6 38 ISNW SHI JHL TVW3ON 71 OATRHTKINVHO M 0005 Ne 5 ava SNOIN 9391512348 38 SSIINN SALON 1 61 2 1 91 31725 1
12. 52 Thermal Solution Performance above TCONTROL for the Intel Xeon Processor E3 1200 95W with Integrated Graphics 53 DTS 1 1 Thermal Solution Performance above emm HH 72 Boundary Conditions and Performance Targets 75 Comparison between TTV Thermal Profile and Thermal Solution Performance for Intel Xeon Processor E3 1280 95W 27 Fan Power and Signal 5 1 3 1 86 Use Conditions Board Level ne Fe egeta 89 Collaboration Heatsink Enabled Components 1U Server 93 Reference Heatsink 93 Reference Heatsink Components mmm 93 LGA1155 Socket and Components 4 a a 93 Supplier Contact Information eles la EAR 94 Mechanical Drawing List rex a cran a Rusa ei 95 Mechanical Drawing aea zr tla Gace 115 Mechanical Drawing 6 dares ex ke xen Dr la eda 121 Thermal Mechanical Specifica
13. SEGIONTIW IN few 0 NOISSIM oz pn 271902110505 ISMANI asn sLuvd 1009953 COL e 20 15 ONN EE QV3H Nvd WOISAHd 9892 353035 1001 NI m NIW WZ 53934 XHOL 05 1 LNIOd 5270 ww OL b E SEO ww p o 3ONVHSIO1 328 1 4 a 8 TALNI GAISIGON Q3NOISN3WIOND 2 T3XOIN HOWE NIWNOMOIWZ ONUVId 9 SEZ lt WLS HLONSYLS 4 028 SS3NGHVH 558 NIN 18315 Nogsvo 9 DWRBIVW 1531 133 01 33v OL 123805 53983 JO SS3NdHVHS 319 NOLLONn OL 38V NI SV 30193 Q3NOISN3WIONn SNOISN3WIQ NO S3ONVH3T1OL GALON 3SIMH3HLO SSIINN 4 aariddns SIH L NO 0 101 SNOISNANIG TIY 41 NOLLONNPNOO NI 5 38OLSIONIMVHOSIHL S310N H SNIV ONV 2 80 10 11 WUNI NOILVHOdHOD 131 30 1N3SNOO 3H LNOHLIM IQOW
14. SHUNA 9 40504809 3TIBISIA ON ALIGINNH 9800 __ 68 SP 1931 8530049 ONLY Id IOVI 218 NIN Z ONV d 8 56 SS3NOMVH NIN 19919 MOT NouoNnd o1 E 0018 NI SV NO O3LON SSTINN Z DVL SIHL NO SNOISNAWIO F114 3 1 NOLONDENOO NI 0380 38 01 SIHL L SILON us 100 890673 pum e v S 9 2 8 113 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings Thermal Mechanical Specifications and Design Guidelines D a z v s 9 1 8 13349 25 LON 00 5310 335 S310N 335 T g 100990673 L3 a y gt 525 LAY P 2 E SONY 2 9 021 HOS sor sony EM 80 02 50 vann Ozone OLN TV E
15. X 0 0105 Thermal Solution Performance above for the Intel Xeon Processor E3 1200 80W Sheet 1 of 2 ENT DTS si o pr is 45 1 0 300 0 300 44 0 0 323 0 314 43 0 0 344 0 326 42 0 0 366 0 339 41 0 0 387 0 351 40 0 0 408 0 364 39 0 0 429 0 376 38 0 0 450 0 389 37 0 0 472 0 401 36 0 0 493 0 414 35 0 0 514 0 426 34 0 0 535 0 439 33 0 0 556 0 451 Thermal Mechanical Specifications and Design Guidelines Thermal Specifications n tel Table 6 8 Thermal Solution Performance above Tcowrno for the Intel Xeon Processor E3 1200 80W Sheet 2 of 2 TAMBI ENT DTS pr s is 32 0 0 578 0 464 31 0 0 599 0 476 30 0 0 620 0 489 29 0 0 641 0 501 28 0 0 662 0 514 27 0 0 683 0 526 26 0 0 705 0 539 25 0 0 726 0 551 24 0 0 747 0 564 23 0 0 768 0 576 22 0 0 789 0 589 21 0 0 811 0 601 20 0 0 832 0 614 Notes 1 ambient temperature is measured at the inlet to the processor thermal solution 2 This column be expressed as a function of by the following equation 0 3 45 1 0 0212 3 This column can be expressed as a function of by the following equation 0 3 45 1 X 0 0125 Table 6 9 Thermal Solution Performance above Tcontrox for the Intel Xeon Processor E3 1260L 45W Sheet 1 of 2
16. intel Socket Processor Keepout Zone Secondary Side for 1U Bottom 0925 0552 801 IN3NOdWOO 5 y 2 4 0801 20 0 1 200 0860 o lIVL3G 3 5 8 E 7 NMOHS SY 2891 89d NO 9 6 9 aav ola Fo 3903 ON WAZZV WRIWIXVW L3SNI NYO 434409 53116 WII dod JAIS ASVWIHd NO QVd Y3dd09 10 TV Adis dol NO ONOZv 0 XE 53015 AHVQNOO3S 9 541 0 ONILNNOW 89d 50 0 EL 009 xe 39 dol 008 GSHOLVINN Mechanical Drawings Figure B 4 99 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings intel 1U Collaboration Heatsink Assembly Figure B 5 L 1 5 LON bb IOS S31ON33S SALON 33S 6906r4 2 3215 M E pe NOI LO3rOMHd NL
17. P gt Power limit 2 Short duration turbo lt 10msec exceedence power limit Power limit 2 Long duration turbo power limit Power limit 1 4 Turbo Algorithm Response Time 2 Time N 6 4 3 6 4 4 Power Plane Control The processor core and graphics core power plane controls allow for customization to implement optimal turbo within voltage regulator thermal limitations It is possible to use these power plane controls to protect the voltage regulator from overheating due to extended high currents Power limiting per plane cannot be guaranteed below 1 second and accuracy cannot be guaranteed in all usages This function is similar to the package level long duration window control Turbo Time Parameter Turbo Time Parameter is a mathematical parameter units in seconds that controls the processor turbo algorithm using an exponentially weighted moving average of energy usage During a maximum power turbo event of about 1 25 x TDP the processor could sustain Power Limit 2 for up to approximately 1 5 the Turbo Time Parameter If the power value is changed during runtime it may take a period of time possibly up to approximately 3 to 5 times the Turbo Time Parameter depending on the magnitude of the change and other factors for the algorithm to settle at the new control limits Thermal Mechanical Specifications and Design Guidelines 61 62 Thermal Specifications Thermal Mechanical Specifica
18. T ITEM 229 THICKNESS 4 gt D 110 Thermal Mechanical Specifications and Design Guidelines intel Mechanical Drawings Figure B 16 Heatsink Backplate Stud dO 1 3190 LON 5 SalON 225 100 590673 2 325 52 E 7 CYIHL MOTIOHXO4 S OXEIN 3 anas suu 80 0L VO 50 mm ENG 6118 25056 VO VINVS ou Hs asva ma son 61189 XOG Od S0 0L VO YE o mwa aome 4 1S1 S14Yd Lava ON wau ALD 2 dol 1938 9 9 S O X EN 5 8 5 8 zi 9 1 ses 3 3 8 x gt 4 005 NOISO3HOO 3 18ISIA ON ALIGINNH 9688 O 88 SHH 8 NOISONYOD ONILW 1d 8 NOISNANIG NOILONN 01 2
19. 22 3 2 Attachment to Motherboard 22 3 39 Socket Components DANSE AGES 23 3 39 1 Socket Body HOUSING rr rhe RR a RR A An 23 3 3 2 Solder RU RR 23 3 38 RT 23 3 3 4 Pick and Place nes sx dn exa 23 3 4 Package Installation Removal nani n RR RA 24 3 4 1 Socket Standoffs and Package Seating 25 3 5 Durability sciigas snake se D Fa C DEN RE 25 BiG LINDE 25 3 7 Component Insertion 5 eee resta eer x 26 3 8 SOCcket S ZE 26 4 Independent Loading Mechanism 27 44 DESIGN CONGCE PU 27 4 1 1 ILM Assembly Design Overview 27 4 1 2 ILM Back Plate Design 28 4 1 3 Shoulder Screw and Fasteners Design Overview 29 4 2 Assembly of ILM to a eee eee
20. 6 10 Power 21 21 Notes 1 Please refer to Table 6 5 for discrete points that constitute the thermal profile 2 Refer to Chapter 9 and Chapter 11 for system and environmental implementation details Table 6 5 Thermal Test Vehicle Thermal Profile for ntel Xeon Processor E3 1220L 20W Power W CC Power W CC 0 68 5 12 73 9 2 69 4 14 74 8 4 70 3 16 75 7 6 71 2 18 76 6 8 72 1 20 77 5 10 73 0 Thermal Mechanical Specifications and Design Guidelines 47 m e n tel Thermal Specifications 6 1 5 Intel Xeon Processor E3 1200 95W with Integrated Graphics Thermal Profile Figure 6 5 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 95W with Integrated Graphics thermal profile Yz0 29xP 445 1 Temp Case 0 10 20 30 10 50 60 70 80 90 100 Power W Notes 1 Please refer to Table 6 6 for discrete points that constitute the thermal profile 2 Refer to Chapter 11 for system and environmental implementation details Table 6 6 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 95W with Integrated Graphics Sheet 1 of 2 Power W CC Power W C 0 45 1 50 59 6 2 45 7 52
21. A8 T 199 1 MOTIOHXOG4 90 X EW 5 5 S 80 02 20 m Y sun Oe 6118 29096 VO VHV1O VINVS m 661 9 PLA SIS HLIM XONVOHOO2V NI 61186 O d PS Seva 80 02 20 Ag 3931109 NOISSIIN 0022 isn sluvd 853111 ON WALI ALD 989084 301 1 NOILO3S sm 99 ssv1o tsz avos vid 885 S 90 0 cez 90 1 LS JWS 21 3HVvnos LSNW 5 SIHL ye ems 2 E50686 DWG NO 1 4 NS aros 799 891 99 Va EN 33s Lv vs v visa SNOILLVOO1 NI H313AVIG 14 6 LOSdSNI 8661 2 9 8 18 3INSV NOISN3WIQ NOILONN OL AGT NI 02 5587 LON 38 TIVHS
22. OL ISd 000 09 HLONSYLS 3TIISN21 WOWINIW LN3TIVAIDO3 HO 23i POESNS SIP SOE POE EE ISIV 218316 SSH INIVLS 8 81 SHONI NI GALV LS SNOINS3WIG SH3 LSNITTIW NI 16 SNOISNSWIG AHVWIHd 2 3svavilva aaridans SAO SIHL SNOISNSWIG TIY a ESVEVLVG NI 38 OL SIHL L S310N 9 usAma CGASSSOIY 55040 1 9 90 2 9 NIN 220 SION 2 LivHS ALO SV NOISIA3H 60 61 10 80 02 20 TANI JO IN3SNOO LNOHLIM GISOTOSIG LON AVN SLI SONAGIANOD 095070514 SI LI NOLLVINHOANI TVLLNSQIINOO NOLLVHOHOO TALNI SNIV LNOO Thermal Mechanical Specifications and Design Guidelines L 2 5 v intel 1U Heatsink Screw Figure B 9 104 Mechanical Drawings i n te Figure B 10 Heatsin
23. 0 36 Li 0 34 088 E 5 0 32 8 0 0008CFM 0 0113 0 6 8 a 0 3 amp z 3 0 4 al 0 28 0 26 0 24 0 5 10 15 20 25 30 35 40 45 Air Flow CFN This 1U Reference thermal solution ca mean 3sigma is computed to 0 353 C W at the airflow of 15 5 CFM which just meets Intel Xeon processor E3 1280 95W TTV thermal profile specification when T is 40 C Thermal Solution The reference thermal solution consists of two assemblies heatsink assembly amp back plate Heatsink is designed with extruded Aluminum which volumetrically is 95x95x24 85 mm with total 43 fins Please refer to Appendix B for detailed drawings Heatsink back plate is a 1 8 mm thick flat steel plate with threaded studs for heatsink attach A clearance hole is located at the center of the heatsink backplate to accommodate the ILM back plate An insulator is pre applied Heatsink back plate herein is only applicable to 1U server Desktop has a specific heatsink back plate for its form factor 10 Thermal Solution intel 9 3 3 9 4 Assembly The assembly process is same as the way described in Section 9 2 3 please refer to it for more details Geometric Envelope for 1U Thermal Mechanical Design Figure 9 5 KOZ 3 D Model Top in 1U Server 9 5 9 6 9 5mm Maximum 1 6mm Maximum Component Height 2 places 2 07mm Maximum Component Height 1 place 1 2mm Ma
24. 61 Interface RR Tee FF 63 7 1 Platform Environment Control Interface 63 AAA IntroductlODi RE 63 Sensor Based Thermal Specification Design Guidance 65 8 1 Sensor Based Specification Overview DTS 1 0 65 8 2 Sensor Based Thermal Specification 1 ennemi 67 8 21 TIV Thermal Profile exe her esteso cese ekz ERR 67 8 2 2 Specification When DTS value is Greater than 68 8 3 Thermal Solution DESIGN Process senesni exe nennen nea aa 68 8 3 1 Boundary Condition Definition 68 8 3 2 Thermal Design and Modelling n 69 8 3 3 Thermal Solution Validation ciiin nene en nan nar n nen 69 8 4 Fan Speed Control FSC Design eene 69 8 4 1 DTS 1 1 A New Fan Speed Control Algorithm without TAMBIENT Data 71 8 5 System Validation 44 xiu E eund e aaa PU ATA 73 LU Thermal Solution 75 9 1 Performance Targets des saa ca a RUN re 75 9 2 10 Collaboration enne tnb ai
25. NO SLIATT LINN 300301 MO 138 300301 HO HIVYO AILS WHOJ3Q LON LSNW 54116 SICON 3imiv 02 OL INOYOL a l szoa S 9 see 481001 lt 80404 1n0Hsnd sanis HOWLLV 1 e 520 000 SOW UNS SIHL OL sanis Tiv TIVLSNI V NOISNAWIG 01 E SHONI NI 03118 SNOINSAWIG 03 1340 veia NI GALVLS SNOISN3IG 3svaviva aanddns o o IVL SIHL NO S3ON3H3101 SNOISNAWIG TIV 1 ae aariddns NI 38 01 SIHL L 153104 lt 9 6268 Bonzio 1N3W3MInO3H 9 2 80 02 20 aivaan 8010170 ISYY wu awa NOISIA3H 9 9226 a 131NI LN3SNOO 38 LON AWN SI NOLLVINHO NI TALNI SNIVLNO9 SIHL Thermal Mechanical Specifications and Design Guidelines intel Figure B 13 Heatsink Bac
26. Other thermal loads in the system In the same system under test run real applications that are representative of the expected end user usage model and verify the following Verify fan speed response vs expectations as done using Power Thermal Utility SW e Validate system boundary condition assumptions Trise venting locations other thermal loads and adjust models design as required Thermal Mechanical Specifications and Design Guidelines 73 74 Sensor Based Thermal Specification Design Guidance Thermal Mechanical Specifications and Design Guidelines 10 Thermal Solution n tel 9 Note 9 1 Table 9 1 9 2 9 2 1 10 Thermal Solution The thermal mechanical solution information shown in this document represents the current state of the data and may be subject to modification The information represents design targets not commitments by Intel This section describes the overall requirements for enabled thermal solutions designed to cool the Intel Xeon Processor E3 1200 product family including critical to function dimensions operating environment and validation criteria in 1U server system Intel has developed two different collaboration reference 1U thermal solutions to meet the cooling needs in this document Performance Targets Table 9 1 provides boundary conditions and performance targets for a 1U heatsink to cool processor in 1U server These values are used to provide guidance for heatsink
27. and DTS 1 as a function of inlet to heatsink Between these two defined points a linear interpolation can be done for any DTS value reported by the processor The fan speed control algorithm has enough information using only the DTS value and TAMBIENT to command the thermal solution to provide just enough cooling to keep the part on the thermal profile In the prior thermal specifications this region DTS values greater than Was defined by the processor thermal profile This required the user to estimate the processor power and case temperature Neither of these two data points are accessible in real time for the fan speed control system As a result the designer had to assume the worst case and drive the fans to accommodate that boundary condition Thermal Solution Design Process Thermal solution design guidance for this specification is the same as with previous products The initial design needs to take into account the target market and overall product requirements for the system This can be broken down into several steps Boundary condition definition Thermal design modelling Thermal testing Boundary Condition Definition Using the knowledge of the system boundary conditions such as inlet air temperature acoustic requirements cost design for manufacturing package and socket mechanical specifications and chassis environmental test limits the designer can
28. markings must be visible after the is assembled on the motherboard 115XLM and the manufacturer s insignia can be ink stamped or laser marked on the side wall Thermal Mechanical Specifications and Design Guidelines Independent Loading Mechanism ILM n tel 4 5 I LM Cover Intel has developed an ILM Cover that will snap onto the ILM for the LGA115x socket family The ILM cover is intended to reduce the potential for socket contact damage from operator and customer fingers being close to the socket contacts to remove or install the pick and place cap The ILM Cover concept is shown in Figure 4 6 The ILM Cover is intended to be used in place of the pick and place cover once the ILM is assembled to the motherboard The ILM will be offered with the ILM Cover pre assembled as well as offered as a discrete component ILM Cover features Pre assembled by the ILM vendors to the load plate It will also be offered as a discrete component The ILM cover will pop off if a processor is installed in the socket and the Cover and ILM are from the same manufacturer ILM Cover can be installed while the is open e Maintain compatibility between validated ILM vendors for LGA115x socket with the exception noted below The ILM cover for the LGA115x socket will have a flammability rating of V 2 per UL 60950 1 Note The ILM Cover pop off feature is not supported if the ILM Covers are interchanged
29. 1 1 1 4 44 4 4 1 6 nnns 80 9 5 KOZ 3 D Model Top in 1U Server ecciesie sape e 81 9 6 TTV Die Size and Orientation 441 1 1 6 82 Thermal Mechanical Specifications and Design Guideline 5 ntel 10 1 Mechanical Representation of the 5 1 4 83 10 2 Physical Space Requirements for the Solution side 84 10 3 Physical Space Requirements for the Solution top 85 10 4 Fan Power Cable Connector Description 2 2 nmm 86 10 5 Baseboard Power Header Placement Relative to Processor 86 10 6 Active Tower Heatsink Airspace Keepout Requirements side 87 B 1 Socket Heatsink ILM Keepout Zone Primary Side for 10 96 B 2 Socket Heatsink ILM Keepout Zone Secondary Side 10 Bottom 97 B 3 Socket Processor ILM Keepout Zone Primary Side for 10 98 B 4 Socket Processor ILM Keepout Zone Secondary Side for 10 Bottom 99 5 10 Collaboration Heatsink 7 1 44 4 4 4 4 4 1 2 1 100 6 10
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31. 1 These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface 2 This is the minimum and maximum static force that can be applied by the heatsink and it s retention solution to maintain the heatsink to IHS interface This does not imply the Intel reference TIM is validated to these limits 3 Loading limits are for the LGA1155 socket 4 This minimum limit defines the static compressive force required to electrically seat the processor onto the socket contacts The minimum load is a beginning of life load 5 Dynamic loading is defined as a load a 4 3 m s 170 in s minimum velocity change average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 500 gm 1 102 Ib with 50 g acceleration table input and assumed 2X Dynamic Acceleration Factor DAF The dynamic portion of this specification in the product application can have flexibility in specific values The ultimate product of mass times acceleration plus static heatsink load should not exceed this limit The maximum BOL value and must not be exceeded at any point in the product life The minimum value is a beginning of life loading requirement based on load degradation over time The maximum removal force is the flick up removal upwards thumb force measured at 450 not applicable to SMT operation for system assembly Only the minimum removal force is applicable to vertical removal in SMT
32. 16 Processor Materials Table 2 3 lists some of the package components and associated materials Processor Materials Component Material Integrated Heat Spreader IHS Nickel Plated Copper Substrate Fiber Reinforced Resin Substrate Lands Gold Plated Copper Processor Markings Figure 2 3 shows the topside markings on the processor This diagram is to aid in the identification of the processor Processor Top Side Markings Sample QDF GRP1LINE1 i M C YY 8 Y GRP1LINE2 INTEL CONFIDENTIAL GRP1LINE3 ES SPEED 4 COUNTRY OF ORIGIN GRP1LINE1 GRP1LINE2 GRP1LINE5 FPO e4 GRPILINES Production SSPEC GRPACINES GRP1LINE1 if M C YY GRP1LINE2 BRAND PROC GRP1LINE3 SSPEC SPEED GRP1LINE4 COUNTRY OF ORIGIN GRPILINES FPO 4 S N Thermal Mechanical Specifications and Design Guidelines m e Package Mechanical amp Storage Specifications n tel 2 1 9 Figure 2 4 Processor Land Coordinates Figure 2 4 shows the bottom view of the processor package Processor Package Lands Coordinates AY AW AU AT AR AP gt AF gt gt lt lt gt Ome 6 RS 2050 2085 CLL Ce LLL QOOOQOOCOQOOOOOQOQOOCOQOOOOOQOQOQOOCOOOQOQOQOQ QOOQOOOOOOQGOOOOOQOOOCOQOOQOOOOQOOCOOCOOQOQOQO
33. 40 6 1 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1280 95W 43 6 2 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 80W 44 6 3 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1260L 45W 46 6 4 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1220L 20W 47 6 5 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 95W with Integrated Graphics 48 6 6 Case Temperature TCASE Measurement 54 6 7 Frequency and Voltage eene nene 56 6 8 Package Power TEM OX 61 8 1 Comparison of Case Temperature vs Sensor Based 66 8 2 Intel Xeon Processor E3 1280 95W TTV Thermal Profile 67 8 3 DTS 1 1 Definition 1 11 1 1 1 nnn 72 9 1 10 Collaboration Heatsink Performance 1 mms 76 9 2 10 Collaboration Heatsink Performance 1 204 77 9 3 10 Collaboration Heatsink Assembly 1 1 1 1 79 9 4 10 Reference Heatsink Performance
34. MOTIOHXO4 5INIS 1 ASSY 5 5 0 A8 p suu 80 51 20 LoF x SZONVESIOL 6118 26096 VLNVS NI SNOISNIWIO 6189 xoa o4 80 51 10 3ONVILOOOY NI EI ioc 1811 1 ON WALI ALD 690673 3401 QVO T3Hd 53 9 288684 4 v 3AOOHO INWZ ONINIV L3 ONIH 888684 Z NOILNALSY 6 v AL MOTIOHXOH 6s06v3 L MOTIOHXOH S OXEW 6 MIYOS 989084 S v 8 8 TISMASNOH WWSEXSEXSZ O INLL 9 L Ly 3199 v visa 520 E 020 2 48106 30404 HSNd WOWINIW 2 MINIS LV3H 40 SOVIYNS 401 OL HSM14 14 55889 9 NOLLVOIJINOVIW X0 LV SI LVHL LN3NVINH3d H3HLO HO AVN S3SV 1I VIADINI NY 38 NYO IHL 8 MIYOS 1X31 MOTIOS LO TIVO MO T38 NMOHS 1 JO NI 23dS 31901
35. OL 300901 J8TNI 02 lt 381001 LNNOW HSN14 Lid SS3d SO3dS aunivi4 NIW 965 HLONSHIS NIW VdW SEZ TIIA 1vIH3LVW S 853140100 669 WLSV 31VWOHHO HV319 OLLATOHLO3TT3 ONIZ HSINIA ATSWASSV NO QALS IYNTIVA LIAW LSNW TAILS 5 NI 9 1915 SNOINS3WI 131250 viii SH3LLSNITTIW NI GALVLS SNOISNAWIG 3svaviva aariddns SIHL NO S3ON333 101 SNOISNAWIG TIV 3svav va aariddns NI 5 OL SIHL L SALON 2 LHOISH 8 2 AMOLSIH NOISIA3H JO IN3SNOO a3s010Sld 38 LON AVW S1N31NOO 3ON3QINOO NI 035070510 SI NOLLVWHOJNI TINI SNIVINOO SIHL v
36. Thermal Mechanical Specifications and Design Guidelines 37 Table 5 3 5 4 38 LGA1155 Socket and ILM Electrical Mechanical and Environmental Specifications Loading Specifications The socket will be tested against the conditions listed in Chapter 11 with heatsink and the ILM attached under the loading conditions outlined in this section Table 5 3 provides load specifications for the LGA1155 socket with the ILM installed The maximum limits should not be exceeded during heatsink assembly shipping conditions or standard use condition Exceeding these limits during test may result in component failure The socket body should not be used as a mechanical reference or load bearing surface for thermal solutions Socket amp ILM Mechanical Specifications Parameter Min Max Notes ILM static compressive load on processor IHS 311 N 70 Ibf 600 N 135 Ibf 3 4 7 8 Heatsink static compressive load 0 Ibf 222 50 Ibf 1 2 3 Total static compressive Load 311 N 70 Ibf 822N 185 Ibf 3 4 7 8 ILM plus Heatsink Dynamic Compressive Load N A 712 160 Ibf 1 3 5 6 with heatsink installed Pick amp Place cover insertion force N A 10 2 2 3 Ibf Pick amp Place cover removal force 2 2N 0 5 Ibf 7 56 N 1 7 Ibf 9 Load lever actuation force N A 20 9 4 7 Ibf in the vertical direction 10 2 2 3 Ibf in the lateral direction Maximum heatsink mass N A 500g 10 Notes
37. 119 e n tel Socket Mechanical Drawings 120 Thermal Mechanical Specifications and Design GuidelinesDocument Number 448776 Rev 2 0 Package Mechanical Drawings D Package Mechanical Drawings Table D 1 lists the mechanical drawings included in this appendix Table D 1 Mechanical Drawing List Drawing Description Figure Number Processor Package Drawing Sheet 1 of 2 Figure D 1 Processor Package Drawing Sheet 2of 2 Figure D 2 Thermal Mechanical Specifications and Design Guidelines 121 Package Mechanical Drawings Processor Package Drawing Sheet 1 of 2 9NIMVHO IVOINVHO3W su3Lan Tiu dcl 34105 12 Ul T A INV T aS SHI DSH 3 2 m T 9 H 5 u nu 4 2 1 881 eg E u 00500005 922000009
38. Tease that exceeds the specified maximum temperature and may affect the long term reliability of the processor In addition a thermal solution that is significantly under designed may not be capable of cooling the processor even when the TCC is active continuously Refer to the appropriate Thermal Mechanical Design Guidelines for information on designing a compliant thermal solution The Thermal Monitor does not require any additional hardware software drivers or interrupt handling routines The following sections provide more details on the different TCC mechanisms used by the processor Frequency VI D Control When the Digital Temperature Sensor DTS reaches a value of 0 DTS temperatures reported via may not equal zero when PROCHOT is activated see Section 6 2 2 5 for further details the TCC will be activated and the PROCHOT signal will be asserted This indicates the processors temperature has met or exceeded the factory calibrated trip temperature and it will take action to reduce the temperature Upon activation of the TCC the processor will stop the core clocks reduce the core ratio multiplier by 1 ratio and restart the clocks All processor activity stops during this frequency transition which occurs within 2 us Once the clocks have been restarted at the new lower frequency processor activity resumes while the voltage requested by the VID lines is stepped down to the minimum possible for the particular frequency R
39. and point at DTS 1 The point at DTS 1 defines the minimum required at TDP considering the worst case system design Tambient design point TcASE max Tambient target TDP For example for a 95 TDP part the Tcase max is 72 6C and at a worst case design point of 40C local ambient this will result in 72 6 40 95 0 34 C W Similarly for a system with a design target of 45 C ambient the at DTS 1 needed will be 0 29 C W The second point defines the thermal solution performance at TcowrROL Figure 8 1 lists the required for various TDP processors These two points define the operational limits for the processor for DTS 1 1 implementation At the fan speed must be programed such that the resulting Vcais better than or equivalent to the required listed in Table 8 1 Similarly the fan speed should be set at DTS 1 such that the thermal solution performance is better than or equivalent to the requirements at Tambient Based on the processor temperature the fan speed controller must linearly change the fan speed from DTS to DTS 1 between these points Figure 8 3 gives a visual description on DTS 1 1 Thermal Mechanical Specifications and Design Guidelines 71 intel Sensor Based Thermal Specification Design Guidance Figure 8 3 DTS 1 1 Definition Points TDP Tcase max Design Pt
40. design Boundary Conditions and Performance Targets Thermal Altitude Design 2 Air Flow3 4 power Yea Drop Intel Xeon Sea Level 95W 40 09 0 353 C W 15CFM 0 383 processor E3 1280 95W Intel Xeon Sea Level 80W 40 89 0 353 C W 15CFM 0 383 processor E3 1200 80W Intel Xeon Sea Level 45W 42 7 0 353 C W 15CFM 0 383 processor E3 1260L 45W Intel Xeon Sea Level 20W 67 0 C 0 527 C W 10CFM 0 123 processor E3 1220L 20W Notes 1 The values in Table 9 1 are from preliminary design review 2 Max target mean 3 sigma for thermal characterization parameter 3 Airflow through the heatsink fins with zero bypass 4 target for pressure drop dP measured in inches H5O 1U Collaboration Heatsink Heatsink Performance For 1U collaboration heatsink see Appendix B for detailed drawings Figure 9 1 shows pressure drop for the 10 collaboration heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph 75 m e n tel 1U Thermal Solution Figure 9 1 1U Collaboration Heatsink Performance Curves Performance Curve 12 0 34 Mean Test 0 0824 0 7418 0 4450 0 0049 C W 1 0 32 0 3 0 8 0 0004 0 0104 5 028 8 MEE 23 02
41. ernestov therm x com The vendor part number is XTMS1565 Processor Thermal Features Processor Temperature A new feature in the processors is a software readable field in the IA32 TEMPERATURE TARGET register that contains the minimum temperature at which the will be activated and PROCHOT will be asserted The TCC activation temperature is calibrated on a part by part basis and normal factory variation may result in the actual TCC activation temperature being higher than the value listed in the register TCC activation temperatures may change based on processor stepping frequency or manufacturing efficiencies Adaptive Thermal Monitor The Adaptive Thermal Monitor feature provides an enhanced method for controlling the processor temperature when the processor silicon exceeds the Thermal Control Circuit TCC activation temperature Adaptive Thermal Monitor uses TCC activation to reduce processor power via a combination of methods The first method Frequency VID Thermal Mechanical Specifications and Design Guidelines m Thermal Specifications n tel 6 2 2 1 control similar to Thermal Monitor 2 TM2 in previous generation processors involves the processor reducing its operating frequency via the core ratio multiplier and input voltage via the VID signals This combination of lower frequency and VID results in a reduction of the processor power consumption The second method clock modulation known as Ther
42. processor E3 2011B 20 12 5 5 45 E 21 12601 45W 5 Intel8 processor 2011A 18 10 5 20 12201 20W Intel8 1200 95W 2011D 28 22 5 5 95 Figure 6 3 with integrated graphics Notes 1 The package C state power is the worst case power in the system configured as follows Memory configured for DDR3 1333 and populated with 2 DIMM per channel DMI and PCIe links are at L1 2 Specification at Tj of 50 C and minimum voltage loadline 3 Specification at Tj of 35 C and minimum voltage loadline 4 These values are specified at Vcc and for all other voltage rails for all processor frequencies Systems must be designed to ensure the processor is not to be subjected to any static and combination wherein Vccp exceeds Vccp at specified Iccp Please refer to the loadline specifications in the datasheet 7 5 Thermal Design Power TDP should be used for processor thermal solution design targets TDP is not the maximum power that the processor can dissipate TDP is measured at DTS 1 TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel 6 Not 100 tested Specified by design characterization 7 When the Multi monitor feature is enabled running 4 displays simultaneously there could be corner cases with additional system thermal impact on the SA and VCCP rails lt 1 5W maximum of 1 5W measured on 16 lane
43. 0007295 T 026234 II HOSS3OOMd 8 183206 SSL L 9811 V91 6082596 VO VaIYTO VINVS 3931102 NOISSIN 0022 04 anayasa Mechanical Drawings O1 8 OL 319NV N3dO 9 5 1 QHVOSHSHLOW SS320V H3ONIJ AHVONDOS ON NI SNOISN3WIQ 3GISNI OL N9IS3Q TIVHS SH3dO TJA3Q 1445205 SNIOHVIA JONVHV3TO NI 144205 40 3GIS1010 JHL OL 1534 TIVHS SH3dOT3A3d AN3NOdWOO TVOINVHO3W TVWH3HL SHSONVH3IOL 3215 304 SHONVMOTTV ANY TIVNIWON 13320S JHL SSVdWOON3 134205 OL ANG S39NVHO 3dVHS NOILLO3 1430 S3ONV33101 WNOISNAWIG 144205 S3SSVdWOON 3491 WOLLOg NOLLISOd 133 201 139008 NI
44. 60 2 4 46 3 54 60 8 6 46 8 56 61 3 8 47 4 58 61 9 10 48 0 60 62 5 12 48 6 62 63 1 14 49 2 64 63 7 16 49 7 66 64 2 18 50 3 68 64 8 20 50 9 70 65 4 22 51 5 72 66 0 48 Thermal Mechanical Specifications and Design Guidelines e Thermal Specifications n tel Table 6 6 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 95W with I ntegrated Graphics Sheet 2 of 2 Power W CC CC 24 52 1 74 66 6 26 52 6 76 67 1 28 53 2 78 67 7 30 53 8 80 68 3 32 54 4 82 68 9 34 55 0 84 69 5 36 55 5 86 70 0 38 56 1 88 70 6 40 56 7 90 71 2 42 57 3 92 71 8 44 57 9 94 72 4 46 58 4 95 72 6 48 59 0 6 1 6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds During operation when the DTS value is greater than the fan speed control algorithm must drive the fan speed to meet or exceed the target thermal solution performance shown in below tables e Table 6 7 for the Intel Xeon Processor E3 1280 95W Table 6 8 for theIntel Xeon processor E3 1200 80W Table 6 9 for the Intel Xeon processor E3 1260L 45W e Table 6 10 for the Intel Xeon processor E3 1220L 20W e Table 6 11 for the Intel Xeon processor E3 1200 95W with integrated graphics To get the full acoustic benefit of the DTS specif
45. 68 5 38 56 5 80 69 1 40 57 1 Thermal Mechanical Specifications and Design Guidelines 45 intel Thermal Specifications 6 1 3 Intel Xeon Processor E3 1260L 45W Thermal Profile Figure 6 3 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1260L 45W thermal profile 60 56 Y 0 30xP 45 1 Temp TTY Case NN 2 ENT d e e 20 25 30 35 40 Power W Notes 1 Please refer to Table 6 4 for discrete points that constitute the thermal profile 2 Refer to Chapter 9 and Chapter 11 for system and environmental implementation details Table 6 4 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1260L 45W Power W CC Power W C 0 45 1 24 52 3 2 45 7 26 52 9 4 46 3 28 53 5 6 46 9 30 54 1 8 47 5 32 54 7 10 48 1 34 55 3 12 48 7 36 55 9 14 49 3 38 56 5 16 49 9 40 57 1 18 50 5 42 57 7 20 51 1 44 58 3 22 51 7 45 58 6 46 Thermal Mechanical Specifications and Design Guidelines Thermal Specifications intel 6 1 4 Intel Xeon Processor E3 1220L 20W Thermal Profile Figure 6 4 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1220L 20W TTV thermal profile Y 0 45xP 68 5 Case Temp 68
46. ALE BASRA ARRA 1 ESET E S 3 2 AS N LJ LII 7 Tor wur 3 oF CO DETAIL CALE DETAIL F SCALE CALE 118 GuidelinesDocument Number 448776 Rev 2 0 Thermal Mechanical Specifications and Design Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 GENER Y sos 1 w 1 alle 5 I8 lg 12 3 X rE TT E p e B Thermal Mechanical Specifications and Design Guidelines
47. ATHA3SSV 39VXOVd _ 8 8 1390S S3HSIT8VLS3 LHOISH Ni daay 134008 2 cre SNI d32 LN3NOdWOO WALWG 09 067 HOS ALIAVO ONISNOH 137205 40 N31N32 SS3NXOIHL 89d dAL 0080 OlHi3WO39 WOUS 134908 9 2281 081 S3LON 897 n 085 NOILISOd JSHOLVINN p T 7 92 82 04 t osz SL 2 5 EM 5 z 9 d 052 6612 T i 8661 5 0 48 NOLLOW i ONINAdO oes 0629 091 1 5 Y Y 5 9282 2701 3ONVHV310 LN3NOdWOO 341 AYYONO93S 19 N 1N3NOdWOO 6 AYYNIYd rede Y Y 9 56 926 TBAVHL YIM sre 8 OL 5 NOLLOW NIN lt gt 9181 12998 2 1 amm 4018 OL Adis dol 3944 Socket Processor Keepout Zone Primary Side for 1U Top intel Figure B 3 Thermal Mechanical Specifications and Design Guidelines 98 5 186 FVS ONO r 05515
48. Definition Of 10 2 Package Mechanical amp Storage 13 2 1 Package Mechanical Specifications 1 1 13 2 1 1 Package Mechanical 1 11 141 14 1 nnne 14 2 1 2 Processor Component Keep Out 2 14 2 1 3 Package Loading Specifications 8 15 2 1 4 Package Handling Guidelines 2 trennen 15 2 1 5 Package Insertion 5 5 1 nene 15 2 1 6 Processor Mass 5 nnne emen enne 15 2 1 7 Processor Materials ed recie ira opera ER daa TAPA Rss D Rd PS 16 2 1 8 Processor Markinigs enter Rn nd na ada A 16 2 1 9 Processor Land eorn 17 2 2 Processor Storage Specifications 18 3 EGATI55 Socket oou oes ees noatri cs seen Per idee 19 3 1 SPP 20 3 1 1 Suggested Silkscreen Marking for Socket
49. Mechanical Specifications and Design Guidelines intel Figure B 7 102 intel Mechanical Drawings 1U Reference Heatsink Figure B 8 30 1334S 9NIMVEG 37925 ION 00 8310 335 5310 335 3807 553 1 73 100 005563 2 0 510 0127 3194 18 03 0844 T LV3H NOLESSEOMA 3ivd 8 0342382 01 10 70 01 auc oce 1 6119 25066 VJ VEVI VINVS 5 ______31 70 18 Navyo EDO EE suus 03 Vy GA1B 3931102 NOISSIM 0022 1N3JNI1UY430 31 2 48 03 91534 1811 51 4 4270317566 4 0 0119192530 B3GNhN Luvd Will ALO 401 4 sc 403 834 48108 32803 100 WOWINIM 752345 38n12W40NVA 38 11 130 3215 3108 6 1 909 mnNimniv 1 1831 8 1 QJNIVINIVN 39 11115 150 1H913H 13 11 ALITIAVIS 20815 Nid ISVIYJNI 247 441 01 WNISIV3H 30 32818105 401 Q3MO11Y NOII23NNOO NO 9 21115 1V2INYHO3M L Tv1S303d WNIS 1V3H NO 03831432 00 0 WW 910 3907 55381914 1 201 9 ATON3SSV 13 ONY ss e SNINIHOVW B314V 51434705 S3SW3H9 752903 dEVHS Saang 17 ONIMVHO 5181 NI 0381310 Su313WVNVd NIJ 77 19153034 6 0 5 2 5 NOISNIWIG 0112 03 OL 77211182 SSINWDIHL
50. NOWDATOUd SONY 80 0 v0 mNnr mow Gor _ eror a 80 000 anor SNOISNSINIG 1384881 1 tul 6118 29096 VO VINVS 6118S O d 3931102 NOISSIW 0022 1 1801 818 4 1 ALO id 100 090673 401 2 a3lVidMOva SH 100 2906 3 YOLVINSNI 31V 1dMOV8 SH L00 8S06y3 2 0 ASOGNVLS 3l1VvldMOV8 SH 100 6906 4 v sm E49060 001 18 9719 v iad lt 2 avaa 1238 4 2 8 xv 1 YALAY 02 lt 9 50 9 8889 SLNSWNSNInOSH NOISONHOO 6 ANY 9 5 40 3344 38 LSNW NOLVINSNI IHL 8 NOISOHMOO 3 18ISIA ON ALIGINNH 9688 2 98 SHH 860 Xv DS NOLLWINSNI 340439 ATSWASSV 31V 1dXOV8 3Sv3N930 11 v 38 30 ON 9 NOLLNSIMLSIG VWOIS
51. Note 1 Socket and motherboard are included for reference and are not part of processor package 2 For clarity the ILM not shown Thermal Mechanical Specifications and Design Guidelines 13 e n tel Package Mechanical amp Storage Specifications 2 1 1 Package Mechanical Drawing Figure 2 2 shows the basic package layout and dimensions The detailed package mechanical drawings are in Appendix D The drawings include dimensions necessary to design a thermal solution for the processor These dimensions include 1 Package reference with tolerances total height length width and so on IHS parallelism and tilt Land dimensions Top side and back side component keep out dimensions A U N Reference datums 6 All drawing dimensions are in mm Figure 2 2 Package View e 5 2 EN 37 5 2 44 Processor Component Keep Out Zones The processor may contain components on the substrate that define component keep out zone requirements A thermal and mechanical solution design must not intrude into the required keep out zones Decoupling capacitors are typically mounted to either the topside or land side of the package substrate See Figure B 3 and Figure B 4 for keep out zones The location and quantity of package capacitors may change due to manufacturing efficiencies but w
52. PCIe card The integrator should perform additional thermal validation with Multi monitor enabled to ensure thermal compliance 8 Guidelines provide a design target for meeting all planned processor frequency requirements For more detailed definition please refer to latest processor Datasheet 42 Thermal Mechanical Specifications and Design Guidelines Thermal Specifications intel 6 1 1 Intel Xeon Processor E3 1280 95W Thermal Profile Figure 6 1 Thermal Test Vehicle Thermal Profile for ntel Xeon Processor E3 1280 95W TIV thermal profile 80 19 10 3 C Temp TTY or Y 0 30xP 45 1 Notes 1 Please refer to Table 6 2 for discrete points that constitute the thermal profile 2 Refer to Chapter 9 and Chapter 11 for system and environmental implementation details Table 6 2 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1280 95W Sheet 1 of 2 Power W TcasE C Power W TcasE 0 45 1 50 60 1 2 45 7 52 60 7 4 46 3 54 61 3 6 46 9 56 61 9 8 47 5 58 62 5 10 48 1 60 63 1 12 48 7 62 63 7 14 49 3 64 64 3 16 49 9 66 64 9 18 50 5 68 65 5 20 51 1 70 66 1 22 51 7 72 66 7 24 52 3 74 67 3 26 52 9 76 67 9 28 53 5 78 68 5 Thermal Mechanical Specifications and Design Guidelines 43 m e n tel Thermal Specifications Table 6
53. Profile For the sensor based specification the only reference made to a case temperature measurement is on the TTV Functional thermal validation will not require the user to apply a thermocouple to the processor package or measure processor power functional compliance testing will be based on fan speed response to the reported DTS values above AS a result no conversion of TTV Tease to processor Tease will be necessary A knowledge of the system boundary conditions is necessary to perform the heatsink validation Section 8 3 1 will provide more detail on defining the boundary conditions The TTV is placed in the socket and powered to the recommended value to simulate the condition See Figure 8 2 for an example of the Intel processor E3 1280 95W TTV thermal profile Intel Xeon Processor E3 1280 95W TTV Thermal Profile thermal profile 80 Y 0 30xP 45 1 70 6 60 50 ap 1 0 10 20 30 40 50 60 10 80 90 100 TTV Power 1 Thermal Mechanical Specifications and Design Guidelines 67 n tel Sensor Based Thermal Specification Design Guidance 8 3 8 3 1 Note 68 This graph is provided as a reference the complete thermal specification is in Chapter 6 Specification When DTS value is Greater than The product specification provides a table of values at DTS
54. and I LM Electrical Mechanical and ntel Environmental Specifications This chapter describes the electrical mechanical and environmental specifications for the LGA1155 socket and the Independent Loading Mechanism 5 1 Component Mass Table 5 1 Socket Component Mass Component Mass Socket Body Contacts and PnP Cover 10g ILM Cover 29g ILM Back Plate 38 g 5 2 Package Socket Stackup Height Table 5 2 provides the stackup height of a processor in the 1155 land LGA package LGA1155 socket with the ILM closed and the processor fully seated in the socket Table 5 2 1155 land Package and LGA1155 Socket Stackup Height Component Stackup Height Note Integrated Stackup Height mm From Top of Board to Top of IHS 7 781 0 335 mm Socket Nominal Seating Plane Height 3 4 0 2 mm Package Nominal Thickness lands to top of IHS 4 381 0 269 mm Notes 1 This data is provided for information only and should be derived from a the height of the socket seating plane above the motherboard after reflow given in Appendix C b the height of the package from the package seating plane to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor data sheet 2 The integrated stackup height value is a RSS calculation based on current and planned processors that will use the ILM design
55. be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink TsA The system ambient air temperature external to a system chassis This temperature is usually measured at the chassis air inlets 8 Thermal Mechanical Specifications and Design Guidelines 11 12 Introduction Thermal Mechanical Specifications and Design Guidelines m Package Mechanical amp Storage Specifications n tel 2 2 1 Figure 2 1 Package Mechanical amp Storage Specifications Package Mechanical Specifications The processor is packaged in a Flip Chip Land Grid Array package that interfaces with the motherboard via the LGA1155 socket The package consists of a processor mounted on a substrate land carrier An integrated heat spreader IHS is attached to the package substrate and core and serves as the mating surface for processor thermal solutions such as a heatsink Figure 2 1 shows a sketch of the processor package components and how they are assembled together Refer to Chapter 3 and Chapter 4 for complete details on the LGA1155 socket The package components shown in Figure 2 1 include the following 1 Integrated Heat Spreader IHS Thermal Interface Material TIM Processor core die Package substrate N Capacitors Processor Package Assembly Sketch Core die TIM o Substrate gt mma o M _ Capacitors LGA1155 Socket System
56. constraints imposed by Tsusramep STORAGE aNd customer shelf life in applicable intel box and bags 8 Thermal Mechanical Specifications and Design Guidelines LGA1155 Socket n tel 3 LGA1155 Socket This chapter describes a surface mount LGA Land Grid Array socket intended for the processors The socket provides I O power and ground contacts The socket contains 1155 contacts arrayed about a cavity in the center of the socket with lead free solder balls for surface mounting on the motherboard The contacts are arranged in two opposing L shaped patterns within the grid array The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints Socket loading specifications are listed in Chapter 5 Figure 3 1 LGA1155 Socket with Pick and Place Cover Thermal Mechanical Specifications and Design Guidelines 19 Figure 3 2 3 1 20 LGA1155 Socket Contact Numbering Top View of Socket PPPPPPRPPPPPPPPA 38 Y A 7 A 2 2 A Y A A A 7 A 2 AC EG J L R U AA AC AEAG AJ AL AN AR AU AW B D F HK MP T V Y AB AD AF AH AK AM AP AT AV AY Board Layout The land pa
57. g ll deleted a 5 did N 2 x CRA etit 2 N 5 l 1 2 5 A m Thermal Mechanical Specifications and Design Guidelines 117 intel Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 Socket Mechanical Drawings 0000000000000000 3 2 o 5 900000000 00000000 a a 0000000008 o o 5 Lloa U _ 5 5 00000000588 o a 3 e o o o o 27 3 5 3 Hi 8 9 H 5 o Y 8 4 2 a 3 foe 1 goo 8 8 8 o 2 2 2 o o 2 o o 9 o o o 9 9 o 00000000000 5 8 r1 t o ern o 90000000009 8 8 900000009000000008 9o o o de o o j o 1 ed RABY ARR EN FPR lI 2l PPPPPPPPPPPPPPP N 722 X PPPPPPPP 444444444 ve VIEW
58. in worst case system ambient targets Point 1 Linear Fan Speed Ramp based on CPU Tj Fan Speed Point 2 Minimum allowed Speed at Tcontrol Example ca 0 564C W Tcontrol Table 8 1 DTS 1 1 Thermal Solution Performance above TcowrRoL at at Vca at at DTS 1 At DTS 1 At DTS 1 At Processor TDP DTS System System System 11 gt 2 ambient ambient ambient max 40C 45C 50C 95W no graphic 0 569 0 354 0 300 0 248 95W with graphic 0 564 0 343 0 291 0 238 80W no graphic 0 620 0 364 0 300 0 238 45W with graphic 0 869 0 413 0 301 0 191 20W no graphic 3 713 1 875 1 625 1 375 Notes 1 72 at DTS Teontrol is applicable to systems that has Internal Trise Troom temperature to Processor cooling fan inlet of less than 10 In case your expected Trise is grater than 10 a correction factor should be used as explained below For each 1 Trise above 10 the correction factor CF is defined as 1 7 Processor TDP Example For A Chassis Trise assumption of 12 C for a 95W TDP processor 1 7 95 W 0 018 C For Trise 10 C at Tcontrol Value listed in Column 2 Trise 10 CF 0564 12 10 0 018 20 528 C W In this case the fan speed should be set slightly higher equivalent to YCA 0 528C W Thermal Mechanical Specifications and Design Guide
59. operation for system assembly 10 The maximum heatsink mass includes the heatsink screws springs rings and cups This mass limit is evaluated using the heatsink attach to the PCB Electrical Requirements LGA1155 socket electrical requirements are measured from the socket seating plane of the processor to the component side of the socket PCB to which it is attached All specifications are maximum values unless otherwise stated for a single socket contact but includes effects of adjacent contacts where indicated Thermal Mechanical Specifications and Design Guidelines LGA1155 Socket and ILM Electrical Mechanical and Environmental Specifications n tel Table 5 4 Electrical Requirements for LGA1155 Socket Parameter Value Comment Mated loop inductance Loop 3 6 nH The inductance calculated for two contacts considering one forward conductor and one return conductor These values must be satisfied at the worst case height of the socket Socket Average Contact Resistance EOL 19 mOhm The socket average contact resistance target is calculated from the following equation sum Ni X LLCRi sum Ni LLCRi is the chain resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain Niis the number of contacts within a chain Iis the number of daisy chain ranging from 1 to 119 total number of daisy chains The
60. rotation of ILM cover assembly with respect to socket The result is a specific Pin 1 orientation with respect to ILM lever Thermal Mechanical Specifications and Design Guidelines 31 i n tel Independent Loading Mechanism ILM Figure 4 5 1 and ILM Lever 4 3 Note 4 4 32 Alignment Features Shoulder Screw shown for clarity Load Lever ILM I nterchangeability ILM assembly and ILM back plate built from the Intel controlled drawings are intended to be interchangeable Interchangeability is defined as an ILM from Vendor A will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A B or C ILM assembly and ILM back plate from all vendors are also interchangeable The ILM are an integral part of the socket validation testing ILMs from each vendor will be matrix tested with the socket bodies from each of the current vendors The tests would include manufacturability bake and thermal cycling See Appendix A for vendor part numbers that were tested ILMs that are not compliant to the Intel controlled ILM drawings can not be assured to be interchangeable Markings There are four markings on the ILM 115XLM Font type is Helvetica Bold minimum 6 point 2 125 mm Manufacturer s insignia font size at supplier s discretion Lot identification code allows traceability of manufacturing date and location Pin 1 indicator on the load plate
61. surface ILM Independent Loading Mechanism provides the force needed to seat the 1155 LGA land package onto the socket contacts PCH Platform Controller Hub The PCH is connected to the processor via the Direct Media Interface DMI and Intel Flexible Display Interface Intel FDI LGA1155 socket The processor mates with the system board through this surface mount 1155 land socket The Platform Environment Control Interface PECI is a one wire interface that provides communication channel between Intel processor and chipset components to external monitoring devices CA Case to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as Tj A Total Package Power The heat source should always be specified for measurements Yes Case to sink thermal characterization parameter A measure of thermal interface material performance using total package power Defined as Tcase Ts Total Package Power Ysa Sink to ambient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as Ts T Total Package Power Tease Tc The case temperature of the processor measured at the geometric center of the topside of the TTV IHS 10 Thermal Mechanical Specifications and Design Guidelines m e Introduction n tel Table 1 2 Terms and De
62. the rated frequency To take advantage of the available TDP headroom the active cores can increase their operating frequency To determine the highest performance frequency amongst active cores the processor takes the following into consideration Thermal Mechanical Specifications and Design Guidelines m Thermal Specifications n tel Note 6 3 2 6 4 The number of cores operating in the CO state e The estimated current consumption The estimated power consumption The temperature Any of these factors can affect the maximum frequency for a given workload If the power current or thermal limit is reached the processor will automatically reduce the frequency to stay with its TDP limit Intel Turbo Boost Technology processor frequencies are only active if the operating system is requesting the PO state Intel Turbo Boost Technology Graphics Frequency Graphics render frequency is selected by the processor dynamically based on the graphics workload demand The processor can optimize both processor and integrated graphics performance through managing total package power For the integrated graphics this could mean an increase in the render core frequency above its base frequency and increased graphics performance In addition the processor core can increase its frequency higher than it would without power sharing Enabling Intel Turbo Boost Technology will maximize the performance of the processor c
63. the pre applied insulator on the ILM is approximately 106 Thermal Mechanical Specifications and Design Guidelines m Independent Loading Mechanism ILM n tel Figure 4 2 4 1 3 Note Back Plate Die Cut Insulator Assembly Orientation Feature Pierced amp Extruded Thread Features Shoulder Screw and Fasteners Design Overview The shoulder screw is fabricated from carbonized steel rod The shoulder height and diameter are integral to the mechanical performance of the ILM The diameter provides alignment of the load plate The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts The design assumes the shoulder screw has a minimum yield strength of 235 MPa A dimensioned drawing of the shoulder screw is available for local sourcing of this component Please refer to Figure B 18 for the custom 6 32 thread shoulder screw drawing The standard fasteners can be sourced locally The design assumes this fastener has a minimum yield strength of 235 MPa Please refer to Figure B 19 for the standard 6 32 thread fasteners drawing The screws for Server ILM are different from Desktop design The length of Server ILM screws are shorter than the Desktop screw length to satisfy Server secondary side clearance limitation Server ILM back plate to use black nickel plated screws whereas desktop ILM back plate to use clear plated screws Unique part number
64. 000 100 0 _ ii 222 WO4 Q3ON322433 0100 09070 Ll Tezo 201 1 90 3OWIOWd 200 01004 XZ 80 08 520 90008 1600 610 6 0 S3HOLION 1 OL3AILVT33 3AOOO Q3TIIW 40 NOILO3IC 31ON 1 01 vos g To W TIT S 1000 05100 s393 y 80 0 182 0 JOVXOVd 00 OF 020 0 80 0 190 NOILV2Od3IOO TALNI dO IN3SNOO XOl d O3HIGOW GASOTOSIC 38 LON SIN3INOO SLI ONY NI 35012510 SI 1I NOILVW3OHNI TVILN3GIJNOO NOILV3IOd3OO 131 SNIVINOD ONIMVAG SIHL Thermal Mechanical Specifications and Design Guidelines 112 intel Mechanical Drawings Figure B 18 1U ILM Shoulder Screw L e v S 9 2 8 46 Od ep ava SSIONSHS 63108346 a 100 52906 3 73 S LN WII Y3AYIS MOTIOHXOS 0 61 80 _awvanriazonsstounn T VEN VINVS SONVONODOVNI jeu 0573 80 61 50 SNOISNGNIO 13866111 303109 NOISSIN 007Z mE 03
65. 0348 1snsiuva 27221 NOS 1 8 WII 4 401 soo 7379 gt OL 1 60 01 90 9 01 419 O 2345 SNu va 5 OL WL 8 2 asyay ava E ANOISIH NOISIASH 5919 2 9 0586 800 928 1 VOFSE L Y NIN WWZ NYA 02 1 1804 v 800 36210 NOLLVHOdHOO TALNI 40 LN3SNOO LNOHLIM 1 38 LON AV SLI NI 83601061 SI TVLLN3GIJNOO SNIV LNOO SIHL V0 90 X 0 900 X Sr SE0 SYMV TIO 40 334 O35v3u30 TVHS 1 8 15 S3903 TIV 1 1831 01 O1 1937805 S3903 40 SSINdUVHS 30 3003
66. 2 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1280 95W Sheet 2 of 2 Power W C CC 30 54 1 80 69 1 32 54 7 82 69 7 34 55 3 84 70 3 36 55 9 86 70 9 38 56 5 88 71 5 40 57 1 90 72 1 42 57 7 92 72 7 44 58 3 94 73 3 46 58 9 95 73 6 48 59 5 6 1 2 Intel Xeon Processor E3 1200 80W Thermal Profile Figure 6 2 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 80W TIV thermal profile Y 0 30xP 45 1 Temp Power W Notes 1 Please refer to Table 6 3 for discrete points that constitute the thermal profile 2 Refer to Chapter 9 and Chapter 11 for system and environmental implementation details 44 Thermal Mechanical Specifications and Design Guidelines Thermal Specifications intel Table 6 3 Thermal Test Vehicle Thermal Profile for ntel Xeon Processor E3 1200 80W Power W Power W Max C 0 45 1 42 57 7 2 45 7 44 58 3 4 46 3 46 58 9 6 46 9 48 59 5 8 47 5 50 60 1 10 48 1 52 60 7 12 48 7 54 61 3 14 49 3 56 61 9 16 49 9 58 62 5 18 50 5 60 63 1 20 51 1 62 63 7 22 51 7 64 64 3 24 52 3 66 64 9 26 52 9 68 65 5 28 53 5 70 66 1 30 54 1 72 66 7 32 54 7 74 67 3 34 55 3 76 67 9 36 55 9 78
67. 3SY8 2 0TS G SUILINI TTIW NI 031V1S SNOISN3NIO ABYHIBd Ek 18988140 03114405 X340 32N303238d ONIMYBO SIHI NO S32NY8310 SNO SN3MIO 718 38984190 06 03114415 HIM NOILONNCNOD NI 0350 38 Ol ONIMVYC 5161 253108 52 03498 vz 1 9 JWS 11130 v 00130 12 256 NE311Vd 3104 0 5 2 Nu3liVd 110 12 0 0 WOLLOD 13 3015 10 SS3NN2IHL 001108 31001 30 SS3NWDIHL SI OFZ IXZ 61 OFL OXI 401 13 301 10 553 1 1 01 13 170018 10 551892181 St OFT 1X2 617039 0 1 3 LP ZIX 4 2114 NIJ 31001 22723 0 oust avon 8 10110790 13883738 NOI 14152531 1 4 131N AMOLSH NOISIA3H 1 S1N31NO2 11 32N10 4NO2 NI 036012 330 112 52 066 61 2 30 1N3SNO2 RM rg ANOHLIM 031 3100 BO 034 14510 03200044384 tii NOI1VWNOJNT 18118301 305 011 80480 gt 131NI 330 102 12 62 0TS1X2 v3uv 430 1n2 89721 035012510 38 LON SNIVINOD 9NIMYHO 5 103 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings L 4 v L 30 1 1H3HSENIMWHG LON 87705 SHIONH3S SALON 385 989093 EO 3216
68. 42 0 0 346 0 322 41 0 0 364 0 333 40 0 0 383 0 343 39 0 0 401 0 354 38 0 0 419 0 364 37 0 0 437 0 375 36 0 0 455 0 385 35 0 0 473 0 396 34 0 0 491 0 406 33 0 0 510 0 417 32 0 0 528 0 427 31 0 0 546 0 438 30 0 0 564 0 448 29 0 0 582 0 459 28 0 0 600 0 469 27 0 0 618 0 480 26 0 0 637 0 491 25 0 0 655 0 501 24 0 0 673 0 512 23 0 0 691 0 522 22 0 0 709 0 533 21 0 0 727 0 543 20 0 0 746 0 554 Thermal Mechanical Specifications and Design Guidelines Figure 6 6 Note 6 2 6 2 1 6 2 2 54 Thermal Metrology The maximum TTV case temperatures can be derived from the data in the appropriate TTV thermal profile earlier in this chapter The TTV is measured at the geometric top center of the TTV integrated heat spreader IHS Figure 6 6 illustrates the location where temperature measurements should be made See Figure B 17 for drawing showing the thermocouple attach to the TTV package TTV Case Temperature TcAsg Measurement Location Measure at E the geometric center of the 9 35 The following supplier can machine the groove and attach a thermocouple to the IHS The supplier is listed below as a convenience to Intel s general customers and the list may be subject to change without notice THERM X OF CALIFORNIA Inc 3200 Investment Blvd Hayward Ca 94545 Ernesto B Valencia 1 510 441 7566 Ext 242
69. 5 5 61 7 20 51 1 46 4 70 66 1 62 3 22 51 7 47 0 72 66 7 63 0 24 52 3 47 7 74 67 3 63 6 26 52 9 48 3 76 67 9 64 2 28 53 5 48 9 78 68 5 64 9 30 54 1 49 6 80 69 1 65 5 32 54 7 50 2 82 69 7 66 2 34 55 3 50 8 84 70 3 66 8 77 intel 1U Thermal Solution Table 9 2 Comparison between TTV Thermal Profile and Thermal Solution Performance for Intel Xeon Processor E3 1280 95W Sheet 2 of 2 Thermal Thermal Power W ys MAX 4 Power W E MAX Solution C C C 36 55 9 51 5 86 70 9 67 4 38 56 5 52 1 88 71 5 68 1 40 57 1 52 8 90 72 1 68 7 42 57 7 53 4 92 72 7 69 3 44 58 3 54 0 94 73 3 70 0 46 58 9 54 7 95 73 6 70 3 48 59 5 55 3 9 2 2 Thermal Solution The collaboration thermal solution consists of two assemblies heatsink assembly amp back plate Heatsink is designed with the Aluminum base and Aluminum stack fin which volumetrically is 95x95x24 85 mm The heatpipe technology is used in the heatsink to improve thermal conduction Heatsink back plate is a 1 8 mm thick flat steel plate with threaded studs for heatsink attach A clearance hole is located at the center of the heatsink backplate to accommodate the ILM back plate An insulator is pre applied Note Heatsink back plate herein is only applicable to 1U server Desktop has a specific heatsink back plate for its form factor 78 m 10 Thermal Solut
70. 6 5 104 0 24 102 0 22 02 1 0 10 15 20 25 30 35 40 Air Flow Collaboration thermal solution mean 3sigma is computed to 0 3199 C W at the airflow of 15 As the Table 9 1 shown when T is 40 C equation representing thermal solution of this heatsink is calculated as 0 319 40 Processor Tease Value X Processor Power Value W Table 9 2 shows thermal solution performance is compliant with Intel Xeon processor E3 1280 95W thermal profile specification At the 95W with local ambient of 40 there is a 3 39 margin 76 10 Thermal Solution Figure 9 2 Table 9 2 1U Collaboration Heatsink Performance Curves Temperature 0 0 5 10 15 20 TTV thermal profile Y 0 30 X 45 1 Collaboration heatsink Y 0 319 X 40 40 45 50 55 60 65 70 75 80 85 90 95 Power Comparison between TTV Thermal Profile and Thermal Solution Performance for Intel Xeon Processor E3 1280 95W Sheet 1 of 2 Thermal Power W E MAX pr Power w b darn m Solution C case C 0 45 1 40 0 50 60 1 56 0 2 45 7 40 6 52 60 7 56 6 4 46 3 41 3 54 61 3 57 2 6 46 9 41 9 56 61 9 57 9 8 47 5 42 6 58 62 5 58 5 10 48 1 43 2 60 63 1 59 1 12 48 7 43 8 62 63 7 59 8 14 49 3 44 5 64 64 3 60 4 16 49 9 45 1 66 64 9 61 1 18 50 5 45 7 68 6
71. Active Tower Heatsink Power Supply 85 10 4 Cooling Requirements i eerte suse a REC 87 Thermal Mechanical Specifications and Design Guideline 11 Thermal Solution Quality and Reliability 5 89 11 1 Reference Heatsink Thermal 89 11 2 Mechanical Environmental Testing cece ee eee esee 89 11 2 1 Recommended Test 90 11 2 2 Post Test Pass Criteria OL de ERAT tone RR 90 11 2 3 Recommended BIOS Processor Memory Test 90 11 3 Material and Recycling Requirements 111 1 91 Component 5 Orb 93 B Mechanical Drawings 5 oe ead E EE AERA E CREE 95 Socket Mechanical Drawings 00 2 2 22 115 D Package Mechanical Drawings 121 Figures 2 1 Processor Package Assembly 4 0022 13 2 2 oU E C DT 14 2 3 Processor Top Side Markings 2 1 nene memes 16 2 4 Processor Pack
72. Collaboration 1 1 2 2 2 2 101 B 7 10 Reference Heatsink Assembly lt lt lt RR RANA RR RR NR 102 8 10 Reference 51 103 B 9 19 104 B 10 Heatsink Compression Spring nemen nnne 105 B 11 Heatsink Load O 106 B 12 Heatsink Retaining reb recen ke a next ese n AR ERR ARR RR RR 107 B 13 Heatsink Backplate Assembly 2 4 nnn 108 B 14 Heatsink Backplate eere rr nenne Hia e KIA 109 B 15 Heatsink Backplate Insulator ierit htt nnn diva dn RO CR pe ex I d RT 110 B 16 Heatsink Backplate Stud eben i a ERR ERE 111 B 17 Thermocouple Attach Drawing dena una schau a Pa nau 112 B 18 1U ILM Shoulder Screw os edente xh 113 B 19 10 Standard 6 32 Thread lt 114 C 1 Socket Mechanical Drawing Sheet 1 of 4
73. Guidelines 21 e n tel LGA1155 Socket Figure 3 4 3 2 Figure 3 5 22 Suggested Silkscreen Marking for Socket dentification Intel is recommending that customers mark the socket name approximately where shown in Figure 3 4 Suggested Board Marking LT 14884195 Add Silkscreen Sr se in this location Attachment to Motherboard The socket is attached to the motherboard by 1155 solder balls There are no additional external methods that is screw extra solder adhesive and so on to attach the socket As indicated in Figure 3 1 the Independent Loading Mechanism ILM is not present during the attach reflow process Attachment to Motherboard Load plate Frame Load Lever Shoulder Scre Back Plate Thermal Mechanical Specifications and Design Guidelines LGA1155 Socket 3 3 3 3 1 3 3 2 3 3 3 3 3 4 Socket Components The socket has two main components the socket body and Pick and Place PnP cover and is delivered as a single integral assembly Refer to Appendix C for detailed drawings Socket Body Housing The housing material is thermoplastic or equivalent with UL 94 V 0 flame rating capable of withstanding 260 for 40 seconds which is compatible with typical reflow rework profiles The socket coefficient of thermal expansion in the XY plane and cre
74. I ntel Xeon 9 Processor E3 1200 Product Family and LGA 1155 Socket Thermal Mechanical Specifications and Design Guidelines April 2011 Document Number 324973 001 Notice This document contains information on products in the design phase of development The information here is subject to change without notice Do not finalize a design with this information NFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving life sustaining critical control or safety systems or in nuclear facility applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
75. L STD 810E Method 508 4 must be performed to determine material performance Material used shall not have deformation or degradation in a temperature life test Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards The following definitions apply to the use of the terms lead free Pb free and RoHS compliant Lead free and Pb free Lead has not been intentionally added but lead may still exist as an impurity below 1000 ppm RoHS compliant Lead and other materials banned in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an approved pending exemption applies RoHS implementation details are not fully defined and may change 8 Thermal Mechanical Specifications and Design Guidelines 91 92 Thermal Solution Quality and Reliability Requirements Thermal Mechanical Specifications and Design Guidelines Component Suppliers A Note Table A 1 Table A 2 Table A 3 Table A 4 Component Suppliers The part numbers listed below identifies the reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier These vendors and devices are listed by Intel as a convenience to Intel s general customer base but Intel does not make any representations or warranties whatsoever regarding quality reliability functionality or compatibility of these device
76. OS Processor Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses with the thermal mechanical enabling components assembled The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered Testing setup should include the following components properly assembled and or connected Appropriate system baseboard e Processor and memory All enabling components including socket and thermal solution parts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors Intel PC Diags is an example of software that can be utilized for this test Thermal Mechanical Specifications and Design Guidelines m Thermal Solution Quality and Reliability Requirements n tel 11 3 Note Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as PVC formulations certain polyurethane compositions such as polyester and some polyethers plastics which contain organic fillers of laminating materials paints and varnishes also are susceptible to fungal growth If materials are not fungal growth resistant then MI
77. Profiles retentu ida n 48 6 1 6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL rana adnate ce des TE 49 6 1 7 Thermal Metrology a DIENES 54 6 2 Processor Thermal Features 54 6 2 1 Processor Terriperat re a a Era 54 6 2 2 Adaptive Thermal 4 2 1 1 1 nene nn 54 2 9 58 6 3 Intel Turbo Boost Technology caviar EE D nid 58 6 3 1 Intel Turbo Boost Technology 58 6 3 2 Intel Turbo Boost Technology Graphics 59 6 4 Thermal Considerations nua ad DR ER 59 6 4 1 Intel Turbo Boost Technology Power Control and Reporting 60 6 4 2 Package Power Control rante ede ena De utr rna OR Rada ka da ERR dea ERR ERR E 61 6 4 3 Power Plane Control 61 6 4 4 Turbo Time Parameter eie ev cx ERA
78. YS 1195 108 27 70418 3931102 KOISSIM 0022 1 13 1817 81 1141 2534 D lt lt 7 95498 001 1 1 1192 7 12 9 1v130 335 402 Hid 38706 12801 100 HS d 1 XNIS 1V3H 30 32838105 401 01 5013 411 402 113 55384 79 NO11V21 3INDYW 071 1V 31880838 1 1VHl INJNYMYJd 83 10 ANY NO HON d 81581 38 JHE 381 NI 9 300801 41825 030N3HWO23U 21 31 MO1103 FHL 3OY d 10011v2 BIGWNN 1894 MO138 NMOHS 3H3HM 18 4 30 301 3 113 v3uv 218 011 2345 300801 ONY YIBMAN 18 4 12814 wuvw 2345 100801 ONY H38W N 1594 s A18W3SSV 14 ONY 83137 SINJATOS YO ONY 51583180 53903 duvHS 58808 JAONIY r NOISN3HIQ OL 1 211182 1 Su313H T1IN 031 15 58401583810 AUYNI Yd ISVGVLVG 03114405 810 12841032384 JNV ONIMYHO SIHI NO 533 83101 ONY SMOISN3MIQ 11V 3Sv8vivO GE 03114405 0350 38 01 ONIMVED SIEL 01710770 15 3138 vo 14142534 E MO IVBOdBOD 131 30 1N3SMOD N311 48 HO Nd LMOHLIM 03111006 034714510 03200084384 035012510 38 10M S1N31N02 11 329301 102 035012510 1 11 MOIIVMHO4KI 1 301 INOJ MOl1YBOdHOO 13181 SNIVINOD DwimvuO SIMI Thermal
79. ackage processor core and graphic core powers are estimated using architectural counters and do not rely on any input from the platform The behavior of turbo is dictated by the following controls that are accessible using MSR MMIO or PECI interfaces POWER LIMIT 1 TURBO POWER LIMIT MSR 610h bits 14 0 This value sets the exponentially weighted moving average power limit over a long time period This is normally aligned to the TDP of the part and steady state cooling capability of the thermal solution This limit may be set lower than TDP real time for specific needs such as responding to a thermal event If set lower than TDP the processor may not be able to honor this limit for all workloads since this control only applies in the turbo frequency range a very high powered application may exceed POWER LIMIT 1 even at non turbo frequencies The default value is the TDP for the SKU POWER LIMIT 1 TIME TURBO POWER LIMIT MSR 610h bits 23 17 This value is a time parameter that adjusts the algorithm behavior The exponentially weighted moving average turbo algorithm will use this parameter to maintain time averaged power at or below POWER LIMIT 1 POWER LIMIT 2 TURBO POWER LIMIT MSR 610h bits 46 32 This value establishes the upper power limit of turbo operation above TDP primarily for platform power supply considerations Power may exceed this limit for up to 10 mS The default for this limit is 1 25 x TDP The follow
80. age Lands Coordinates 17 3 1 LGA1155 Socket with Pick and Place Cover 19 3 2 LGA1155 Socket Contact Numbering Top View of 2 20 3 3 LGA1155 Socket Land Pattern Top View of Board 21 3 4 Suggested Board Marking 22 3 5 Attachment to Motherboard 1 2444 4 2 4444 1 22 3 6 Pickand Place 2 TCR SU UMP 24 3 7 Package Installation Removal 25 4 1 ILM Assembly with Installed Processor 28 4 2 Plate RU RN 29 4 3 Shoulder 255548 122 5 18 eei RR RECON 30 LC MEIN FCIRE 3 31 425 Pind and 120 Ra 24443644 onan 32 4 6 ILM COVE gem 34 4 7 ILM Cover and PnP Cover Interference 1 1 35 5 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology
81. an speed RPM by one of two methods The first and preferred is pulse width modulation PWM signal compliant to the 4 Wire Pulse Width Modulation PWM Controlled Fans specification The alternative is varying the input voltage to the fan As a result the characterization data needs to also correlate the RPM to PWM or voltage to the thermal solution fan The fan speed algorithm developer needs to associate the output command from the fan speed control device with the required thermal solution performance Regardless of which control method is used the term RPM will be used to indicate required fan speed in the rest of this document 8 4 Fan Speed Control FSC Design Process The next step is to incorporate the thermal solution characterization data into the algorithms for the device controlling the fans As a reminder the requirements are Thermal Mechanical Specifications and Design Guidelines 69 m e n tel Sensor Based Thermal Specification Design Guidance 70 e When the DTS value is at or below the fans be slowed down just as with prior processors e When DTS is above FSC algorithms will use knowledge of and VS RPM to achieve the necessary level of cooling DTS 1 1 provides another option to do fan speed control without the Tambient data Please refer to Section 8 4 1 for more details This chapter will discuss two implementations The first is FSC system t
82. ar on the pick and place cap e Manufacturer s insignia font size at supplier s discretion Lot identification code allows traceability of manufacturing date and location Thermal Mechanical Specifications and Design Guidelines 25 e n tel LGA1155 Socket 3 8 26 All markings must withstand 260 C for 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1155 and the manufacturer s insignia are molded or laser marked on the side wall Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces The socket must be designed so that it requires no force to insert the package into the socket Socket Size Socket information needed for motherboard design is given in Appendix C This information should be used in conjunction with the reference motherboard keep out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components Thermal Mechanical Specifications and Design Guidelines m Independent Loading Mechanism ILM n tel 4 Note 4 1 4 1 1 I ndependent Loading Mechanism ILM The ILM has two critical functions deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load ev
83. cations 6 2 3 6 3 6 3 1 58 transitioning to the minimum frequency and corresponding voltage using Freq VID control Clock modulation is not activated in this case The TCC will remain active until the system de asserts PROCHOT Use of PROCHOT in bi directional mode can allow VR thermal designs to target maximum sustained current instead of maximum current Systems should still provide proper cooling for the VR and rely on PROCHOT only as a backup in case of system cooling failure The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power THERMTRI P Signal Regardless of whether or not Adaptive Thermal Monitor is enabled in the event of a catastrophic cooling failure the processor will automatically shut down when the silicon has reached an elevated temperature refer to the THERMTRIP definition in the EDS At this point the THERMTRIP signal will go active and stay active as described in the EDS THERMTRIP activation is independent of processor activity If THERMTRIP is asserted processor core voltage Vcc must be removed within the timeframe defined in EDS The temperature at which THERMTRIPZ asserts is not user configurable and is not software visible I ntel Turbo Boost Technology Intel Turbo Boost Technology is a feature that allows the processor to opportunistically and automatically ru
84. changes to them The processor chipset and LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Requires a system with Intel Turbo Boost Technology capability Consult your PC manufacturer Performance varies depending on hardware software and system configuration For more information visit http www intel com technology turboboost Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or by visiting Intel s website at http www intel com Intel Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries Other names and brands may be claimed as the property of others Copyright 2011 Intel Corporation Rights Reserved 2 Thermal Mechanical Specifications and Design Guidelines Contents 1 UNEKOGUCTION ata gs 9 1 1 Referentes aa a EE E R 10 1 2
85. chanical Drawings Figure D 2 Processor Package Drawing Sheet 2of 2 Thermal Mechanical Specifications and Design Guidelines 124 Package Mechanical Drawings Thermal Mechanical Specifications and Design Guidelines
86. da iu tia des ena 75 9 2 1 Heatsink 75 9 2 2 Thermal i n dak ER na dade Debt 78 9 2 3 Assembly xad siia 79 9 3 10 Reference rhe i net nn i C E n a 80 9 3 1 Heatsink eei cipe 80 9 3 2 Thermal Sol tioM ree rie o A EO AE 80 ENCACMEMU gc 81 9 4 Geometric Envelope for 10 Thermal Mechanical 81 9 5 Thermal Interface Material ce tete etn ern dana ea enda na dura ea aa RA ER 81 9 6 Heat Pipe Thermal Consideration 81 Active Tower Thermal Solution 83 10 1 2 83 10 2 Mechanical Specifications 84 10 2 1 Cooling Solution Dimensions 2 4 4 1 2 2 1 4 4 6 84 10 2 2 Retention Mechanism Heatsink Attach Clip Assembly 85 10 3 Electrical Requirements nas neta dae i bake repe te Deka gas awe RE KE ERG ERR 85 10 3 1
87. eee eene nennen nene 30 4 3 ILM Interchangeabllity 32 MEM DEEST mtm 32 4 5 SLM COVER sei 33 5 LGA1155 Socket and ILM Electrical Mechanical and Environmental Specifications 37 5 1 Component irei oerna nea o O 37 5 2 Package Socket Stackup lt 1 6 37 5 3 hoading Specifications ERR 38 5 4 Electrical 5 38 5 5 Environmental Requirements nin 39 6 Thermal Specifications cente enira dat d dur Reda Pa ad 41 6 1 Thermal Specifications E ka nene 41 6 1 1 Intel Xeon Processor E3 1280 95W Thermal 43 6 1 2 Intel Xeon Processor E3 1200 80W Thermal 44 6 1 3 Intel Xeon Processor E3 1260L 45W Thermal Profile 46 Thermal Mechanical Specifications and Design Guideline 3 10 6 14 Intel Xeon Processor E3 1220L 20W Thermal 47 6 1 5 Intel Xeon Processor E3 1200 95W with Integrated Graphics Thermal
88. enly through the socket solder joints The mechanical design of the ILM is integral to the overall functionality of the LGA1155 socket Intel performs detailed studies on integration of processor package socket and ILM as a system These studies directly impact the design of the ILM The Intel reference ILM will be build to print from Intel controlled drawings Intel recommends using the Intel Reference ILM Custom non Intel ILM designs do not benefit from Intel s detailed studies and may not incorporate critical design parameters There is a single ILM design for the LGA1155 socket and LGA1156 socket Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM assembly and back plate To secure the two assemblies two types of fasteners are required a pair 2 of standard 6 32 thread screws and a custom 6 32 thread shoulder screw The reference design incorporates a T 20 Torx head fastener The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM The Torx head fastener is also less susceptible to driver slippage Once assembled the ILM is not required to be removed to install remove the motherboard from a chassis I LM Assembly Design Overview The ILM assembly consists of 4 major pieces ILM cover load lever load plate and the hinge frame assembly of the pieces i
89. ep properties must be such that the integrity of the socket is maintained for the conditions listed in Chapter 5 The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems Solder Balls A total of 1155 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard The socket solder ball has the following characteristics Lead free SAC SnAgCu 305 solder alloy with a silver Ag content between 3 and 4 and a melting temperature of approximately 217 The alloy is compatible with immersion silver ImAg and Organic Solderability Protectant OSP motherboard surface finishes and a SAC alloy solder paste Solder ball diameter 0 6 mm 0 02 mm before attaching to the socket lead The co planarity profile and true position requirements are defined in Appendix C Contacts Base material for the contacts is high strength copper alloy For the area on socket contacts where processor lands will mate there is a 0 381 15 pinches minimum gold plating over 1 27 um 50 pinches minimum nickel underplate No contamination by solder in the contact area is allowed during solder reflow Pick and Place Cover The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology SMT manufacturing line The cover remains on the socket during reflow to hel
90. hat is not provided the information and a FSC system that is provided data on the current Either method will result in a thermally compliant solution and some acoustic benefit by operating the processor closer to the thermal profile But only the aware FSC system can fully utilize the specification for optimized acoustic performance In the development of the FSC algorithm it should be noted that the is expected to change at a significantly slower rate than the DTS value The DTS value will be driven by the workload on the processor and the thermal solution will be required to respond to this much more rapidly than the changes in Tayprent An additional consideration in establishing the fan speed curves is to account for the thermal interface material performance degradation over time Thermal Mechanical Specifications and Design Guidelines Sensor Based Thermal Specification Design Guidance n tel 8 4 1 DTS 1 1 New Fan Speed Control Algorithm without Data In most system designs incorporating processor ambient inlet data in fan speed control adds design and validation complexity with a possible BOM cost impact to the system A new fan speed control methodology is introduced to improve system acoustics without needing the processor inlet ambient information The DTS 1 1 implementation consists of two parts requirement at
91. he end user environment the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume Some general recommendations are shown in Table 11 1 The Intel reference heatsinks will be tested in an assembled to the LGA1155 socket and mechanical test package Details of the Environmental Requirements and associated stress tests can be found in Table 11 1 are based on speculative use condition assumptions and are provided as examples only Table 11 1 Use Conditions Board Level Test Requirement Pass Fail Criteria Mechanical Shock 3 drops each for and directions in each of 3 Visual Check and perpendicular axes that is total 18 drops Electrical Functional Profile 50 g Trapezoidal waveform 4 3 m s 170 in s Test minimum velocity change Random Vibration Duration 10 min axis 3 axes Visual Check and Frequency Range 5 Hz to 500 Hz Electrical Functional 5 Hz 0 01 g2 Hz to 20 Hz 0 02 g2 Hz slope up Test 20 Hz to 500 Hz Q 0 02 02 flat Power Spectral Density PSD Profile 3 13 g RMS Thermal Cycling 259 to 100 C Ramp rate 8C minute Cycle time 30 Visual Check minutes per cycle for 500 cycles Thermal Performance Test Notes 1 It is recommended that the above tests be performed on a sample size of at least ten assemblies from multiple lots of material 2 Additional pass fail criteria may be added at the di
92. ication ambient temperature monitoring is necessary Table 6 7 Thermal Solution Performance above for the Intel Xeon Processor E3 1280 95W Sheet 1 of 2 TAMBI ENT DTS ore a 45 1 0 300 0 300 44 0 0 320 0 312 43 0 0 337 0 322 42 0 0 355 0 333 41 0 0 373 0 343 40 0 0 391 0 354 39 0 0 409 0 364 38 0 0 427 0 375 Thermal Mechanical Specifications and Design Guidelines 49 intel Table 6 7 Table 6 8 50 Thermal Solution Performance above for the Intel Xeon Processor E3 1280 95W Sheet 2 of 2 Thermal Specifications ENT DTS Pun pr s 37 0 0 445 0 385 36 0 0 462 0 396 35 0 0 480 0 406 34 0 0 498 0 417 33 0 0 516 0 427 32 0 0 534 0 438 31 0 0 552 0 448 30 0 0 569 0 459 29 0 0 587 0 469 28 0 0 605 0 480 27 0 0 623 0 491 26 0 0 641 0 501 25 0 0 659 0 512 24 0 0 676 0 522 23 0 0 694 0 533 22 0 0 712 0 543 21 0 0 730 0 554 20 0 0 748 0 564 Notes 1 The ambient temperature is measured at the inlet to the processor thermal solution 2 This column be expressed as a function of by the following equation 0 30 45 1 0 0178 3 This column can be expressed as a function of by the following equation 0 30 45 1
93. ign Guidelines 9 Table 1 1 Introduction References Material and concepts available in the following documents may be beneficial when reading this document Reference Documents Document Location Notes Intel Xeon Processor E3 1200 Family Data Sheet Volume One http www intel com Assets PDF datasheet 324970 pdf Intel Xeon Processor E3 1200 Family Datasheet Volume Two http www intel com Assets PDF datasheet 324971 pdf Intel Xeon Processor E3 1200 Family Specification Update http www intel com Assets PDF specupdate 324972 pdf 4 Wire Pulse Width Modulation PWM Controlled Fans Available at http www formfactors org 1 2 Definition of Terms Table 1 2 Terms and Descriptions Sheet 1 of 2 Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface CTE Coefficient of Thermal Expansion The relative rate a material expands during a thermal event DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS
94. ill remain within the component keep in This keep in zone includes solder paste and is a post reflow maximum height for the components 14 Thermal Mechanical Specifications and Design Guidelines Package Mechanical amp Storage Specifications 2 1 3 Table 2 1 2 1 4 Table 2 2 2 1 5 2 1 6 Thermal Mechanical Specifications and Design Guidelines intel Package Loading Specifications Table 2 1 provides dynamic and static load specifications for the processor package These mechanical maximum load limits should not be exceeded during heatsink assembly shipping conditions or standard use condition Also any mechanical system or component testing should not exceed the maximum limits The processor package substrate should not be used as a mechanical reference or load bearing surface for thermal and mechanical solution Processor Loading Specifications Parameter Minimum Maximum Notes Static Compressive Load 600 N 135 Ibf 1 2 3 Dynamic Compressive Load 712 N 160 Ibf 1 3 4 Notes 1 These specifications apply to uniform compressive loading in a direction normal to the processor IHS 2 This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface 3 These specifications are based on limited testing for design characterization Loading limits are for the package only and do not include the limits of the process
95. ing considerations and limitations apply to the power monitoring feature Calibration applies to the processor family and is not conducted on a part by part basis Therefore some difference between actual and reported power may be observed Power monitoring is calibrated with a variety of common realistic workloads near Tj max Workloads with power characteristic markedly different from those used during the calibration process or lower temperatures may result in increased differences between actual and estimated power In the event an uncharacterized workload or power virus application were to result in exceeding programmed power limits the processor Thermal Control Circuitry TCC will protect the processor when properly enabled Adaptive Thermal Monitor must be enabled for the processor to remain within specification Illustration of Intel Turbo Boost Technology power control is shown in the following sections and figures Multiple controls operate simultaneously allowing for customization for multiple system thermal and power limitations These controls allow for turbo optimizations within system constraints Thermal Mechanical Specifications and Design Guidelines m Thermal Specifications n tel 6 4 2 Package Power Control The package power control allows for customization to implement optimal turbo within platform power delivery and package thermal solution limitations Figure 6 8 Package Power Control
96. ion n tel 9 2 3 Assembly Figure 9 3 1U Collaboration Heatsink Assembly 1U Collaboration Heatsink p Thermal Interface Materi Honeywell 45 IHS Integrate Heat Spreader Threaded Stud Back Plate The assembly process for the 1U collaboration heatsink with application of thermal interface material begins with placing back plate in a fixture The motherboard is aligned with fixture Next is to place the heatsink such that the heatsink fins are parallel to system airflow While lowering the heatsink onto the IHS align the four captive screws of the heatsink to the four holes of motherboard Using a 2 Phillips driver torque the four captive screws to 8 inch pounds This assembly process is designed to produce a static load compliant with the minimum preload requirement 26 7 Ibf for the selected TIM and to not exceed the package design limit 50 Ibf 79 m e n tel 1U Thermal Solution 9 3 9 3 1 Figure 9 4 9 3 2 Note 80 1U Reference Heatsink Heatsink Performance For 1U reference heatsink see Appendix B for detailed drawings Figure 9 4 shows pressure drop for the 10 reference heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph 1U Reference Heatsink Performance Curves Performance Curves Mean Test 0 0442 0 7293 7 0 0066
97. ion Design Guidance The sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation The sensor based specification utilizes the Digital Thermal Sensor information accessed via the PECI interface This chapter will review thermal solution design options fan speed control design guidance amp implementation options and suggestions on validation both with the TTV and the live die in a shipping system A new fan speed control implementation scheme is called DTS 1 1 introduced in Section 8 4 1 Sensor Based Specification Overview DTS 1 0 Create a thermal specification that meets the following requirements Use Digital Thermal Sensor DTS for real time thermal specification compliance Single point of reference for thermal specification compliance over all operating conditions Does not required measuring processor power and case temperature during functional system thermal validation Opportunity for acoustic benefits for DTS values between Tcontro and 1 Thermal specifications based on the processor case temperature have some notable gaps to optimal acoustic design When the ambient temperature is less than the maximum design point the fan speed control system FSC will over cool the processor The FSC has no feedback mechanism to detect this over cooling this is shown in the top half of Figure 8 1 The sensor based specification will a
98. iva dariddns 1 SIHL NO SSON33 01 SNOISN3IWIO 0459 aariddns NI Q3Sn OL Y sroFsz i sono WYO 20 02 60 aon 8 z os 80 60 40 3SV3I3H NOLLVHOdHOO TALNI 30 IN3SNOO HOIHd O3lIGOW 5 38 LON AVIN ama Noto SLNALNOO 038070514 SI NOLLVWHOJNI TVLLN3GIHNOO NOLLVHOdHOO TALNI SNIVINOO SIHL AHOLSIH NOISIA3H 1U Collaboration Heatsink 2 v Mechanical Drawings Figure B 6 101 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings 1U Reference Heatsink Assembly 51 08 335 48 03421345 01 10 20 ni war Ag NAYHO n1 A8 Q3N9 530 0 013 4 MOISS3HdNOD ONINHdS 288684 WIG 3 0089 WMZ C ONINIVI3H ONIY NO 1N313H 9 1845 412 219160 030081 3 010049 XNIS 1 3 WOTIOHXOS G OXEM 301 81825 T13443NOH WwcE GEXGZ 0 011 01710790 3170 auu 6118 26066 v2 vav12 VIN
99. k Compression Spring SPRING COMPRESSION PRE LOAD REVISION HISTORY SECTION Thermal Mechanical Specifications and Design Guidelines 105 m n tel Mechanical Drawings Figure B 11 Heatsink Load Cup TS SHEET T GF CUP SPRING RETENTION A E ES A 7777 SEE DETAIL 106 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings n tel Figure B 12 Heatsink Retaining Ring SHEET T GF T REVISION HISTORY RING RETAINING 32MM GROOVE DIA gt Thermal Mechanical Specifications and Design Guidelines 107 Mechanical Drawings 2 1 30 1 1 31 25 LON vos 5 SILON 336 5 100 0906 3 2 HSINI _ T 3215 MOTIOHXOS SH 31V 1d MOVE ASSY 4
100. kage substrate has orientation notches along two opposing edges of the package offset from the centerline The socket has two corresponding orientation posts to physically prevent mis orientation of the package These orientation features also provide initial rough alignment of package to socket e The socket has alignment walls at the four corners to provide final alignment of the package Thermal Mechanical Specifications and Design Guidelines LGA1155 Socket n tel Figure 3 7 Package Installation Removal Features Package Orientation Pin 1 Notch Indicator 2 Places Finger Tool Access Alignment 2 Places Post Pin 1 2 Places Chamfer 3 4 1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C Similarly a seating plane on the topside of the socket establishes the minimum package height See Section 5 2 for the calculated IHS height above the motherboard 3 5 Durability The socket must withstand 20 cycles of processor insertion and removal The max chain contact resistance from Table 5 4 must be met when mated in the 1st and 20th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and removal 3 6 Markings There are three markings on the socket LGA1155 Font type is Helvetica Bold minimum 6 point 2 125 mm This mark will also appe
101. kplate Assembly 108 Mechanical Drawings n tel Figure B 14 Heatsink Backplate ce d x o 2 2 x 5 z As m 5 lt 4 x Ne r 5 A ES 5 5 5 n E ME z E d ale EE 5 5 510 5 2 1 L1 ral 522 o ly i lt a 5 PN 74 340 25 6 X 851 X RS Z p 68 840 25 6 I rT xy ATABASE 3 1 80 05 THICK 60 0 25 50 1540 146 Thermal Mechanical Specifications and Design Guidelines 109 intel Figure B 15 Heatsink Backplate nsulator Mechanical Drawings REV NUMBER 24 INSULATOR BACK PLATE HS FOXHOLLOW P NIME 1 1 LETS SIZE DRAWING SCALE 1 1 PARTS LIST NOTES ART NUMBER
102. larify relative dimensioning Figure 10 2 Physical Space Requirements for the Solution side view 104 4 09 130 5 12 10 1 403 27 1 06 84 Thermal Mechanical Specifications and Design Guidelines m Active Tower Thermal Solution n tel Figure 10 3 Physical Space Requirements for the Solution top view 10 2 2 10 3 10 3 1 95 3 74 3 74 LGATISS MAX VOLUMETRIC GAUGE Note Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation Retention Mechanism and Heatsink Attach Clip Assembly The thermal solution requires a heatsink attach clip assembly to secure the processor and fan heatsink in the baseboard socket Electrical Requirements Active Tower Heatsink Power Supply The active tower heatsink requires a 12 V power supply A fan power cable will be with solution to draw power from a power header on the baseboard The power cable connector and pinout are shown in Figure 10 4 Baseboards must provide a matched power header to support this Table 10 1 contains specifications for the input and output signals at the heatsink connector The active tower heatsink outputs a SENSE signal which is an open collector output that pulses at a rate of 2 pulses per fan revolution A baseboard pull up resistor provides VOH to match the system board mounted fan speed monitor requirements if applicab
103. le Use of the SENSE signal is optional If the SENSE signal is not used pin 3 of the connector should be tied to GND The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL The active tower heatsink requires a constant 12 V supplied to pin 2 and does not support variable voltage control or 3 pin PWM control Thermal Mechanical Specifications and Design Guidelines 85 intel Active Tower Thermal Solution The power header on the baseboard must be positioned to allow the fan power cable to reach it The power header identification and location should be documented in the platform documentation or on the system board itself Figure 10 5 shows the location of the fan power connector relative to the processor socket The baseboard power header should be positioned within 110 mm 4 33 inches from the center of the processor socket Figure 10 4 Fan Power Cable Connector Description Pin Signal Straight square pin 4 pin terminal housing with 1 GND polarizing ribs and friction locking ramp 2 412V 0 100 pitch 0 025 square pin width 3 SENSE 4 CONTROL Match with straight pin friction lock header on mainboard 1111 1234 Table 10 1 Fan Power and Signal Specifications Description Min Typ Max Unit Notes 12V 12 volt fan power supply 9 0 12 0 13 8 V 1 Maxim
104. lines Sensor Based Thermal Specification Design Guidance n tel 8 5 System Validation System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and data the case of DTS 1 0 as well as any other device being monitored for thermal compliance Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted Tampient additional TTV based testing in the chassis is not necessary Once the heatsink has been demonstrated to meet the TTV Thermal Profile it should be evaluated on a functional system at the boundary conditions In the system under test and Power Thermal Utility Software set to dissipate the TDP workload confirm the following item Verify if there is TCC activity by instrumenting the PROCHOT signal from the processor TCC activation in functional application testing is unlikely with a compliant thermal solution Some very high power applications might activate TCC for short intervals this is normal Verify fan speed response is within expectations actual RPM is consistent with DTS temperature and Verify RPM versus PWM command or voltage output from the FSC device is within expectations e Perform sensitivity analysis to asses impact on processor thermal solution performance and acoustics for the following Other fans in the system
105. llow the FSC to be operated at the maximum allowable silicon temperature or T for the measured ambient This will provide optimal acoustics for operation above Tcowrnor See lower half of Figure 8 1 Thermal Mechanical Specifications and Design Guidelines 65 Sensor Based Thermal Specification Design Guidance Figure 8 1 Comparison of Case Temperature vs Sensor Based Specification 66 30 2 0 292 Power TDP Current Specification Case Temp 0 448 2 m Tcontrol 30 Sensor Based Specification DTS Temp Thermal Mechanical Specifications and Design Guidelines Sensor Based Thermal Specification Design Guidance n tel 8 2 8 2 1 Figure 8 2 Sensor Based Thermal Specification The sensor based thermal specification consists of two parts The first is a thermal profile that defines the maximum TTV as a function of TTV power dissipation The thermal profile defines the boundary conditions for validation of the thermal solution The second part is a defined thermal solution performance as a function of the DTS value as reported over the bus when DTS is greater than This defines the operational limits for the processor using the TTV validated thermal solution TTV Thermal
106. lt gt lt gt le LEGEND H o E z gt z E t 2 gt KEEPIN BOARD PRIMARY SIDE 96 Thermal Mechanical Specifications and Design Guidelines Mechanical Drawings intel Figure B 2 Socket Heatsink Keepout Zone Secondary Side for 10 Bottom ROUTING KEEPOUTS KEEPINS COMPONENT VOLUMETRIC pos scr 4 i 8 EE co 88 X SE V X B XN 2 lt BOARD SECONDARY SIDE x NS N N NN x OOOO SOCKET amp PROCESSOR VOLUMETRIC KEEP IN INTEL PN E21320 LEGEND 54MM UT ONENT HEIGHT 2 ONENT KEE O Thermal Mechanical Specifications and Design Guidelines 97 25 1
107. make informed thermal solution design decisions For the thermal boundary conditions for system are as follows 35 C This is typical of a maximum system operating environment Trise 5 Tamprent 40 C 5 Based the system boundary conditions the designer can select a and to use in thermal modelling The assumption of a has a significant impact on the required needed to meet TTV Tcasemay at TDP A system that can deliver lower assumed Can utilize a design with a higher which can have a lower cost If the assumed is inappropriate for the intended system environment the thermal solution performance may not be sufficient to meet the product requirements The results may be excessive noise from fans having to operate at a speed higher than intended In the worst case this can lead to performance loss with excessive activation of the Thermal Control Circuit TCC Thermal Mechanical Specifications and Design Guidelines Sensor Based Thermal Specification Design Guidance n tel 8 3 2 Thermal Design and Modelling Based on the boundary conditions the designer can now make the design selection of the thermal solution components The major components that can be mixed are the fan fin geometry heat pipe or air duct design There are cost and acoustic trade offs
108. mal Monitor 1 or TM1 in previous generation processors reduces power consumption by modulating starting and stopping the internal processor core clocks The processor intelligently selects the appropriate TCC method to use on a dynamic basis BIOS is not required to select a specific method as with previous generation processors supporting TM1 or TM2 The temperature at which Adaptive Thermal Monitor activates the Thermal Control Circuit is factory calibrated and is not user configurable Snooping and interrupt processing are performed in the normal manner while the TCC is active When the TCC activation temperature is reached the processor will initiate TM2 in attempt to reduce its temperature If TM2 is unable to reduce the processor temperature then TM1 will be also be activated TM1 and TM2 will work together clocks will be modulated at the lowest frequency ratio to reduce power dissipation and temperature With a properly designed and characterized thermal solution it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable An under designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment may cause a noticeable performance loss and in some cases may result in
109. n faster than its rated operating core and or render clock frequency when there is sufficient power headroom and the product is within specified temperature and current limits The Intel Turbo Boost Technology feature is designed to increase performance of both multi threaded and single threaded workloads The processor supports a Turbo mode where the processor can utilize the thermal capacitance associated with the package and run at power levels higher than TDP power for short durations This improves the system responsiveness for short bursty usage conditions The turbo feature needs to be properly enabled by BIOS for the processor to operate with maximum performance Since the turbo feature is configurable and dependent on many platform design limits outside of the processor control the maximum performance cannot be guaranteed Turbo Mode availability is independent of the number of active cores however the Turbo Mode frequency is dynamic and dependent on the instantaneous application power load the number of active cores user configurable settings operating environment and system design Intel Turbo Boost Technology may not be available on all SKUs I ntel Turbo Boost Technology Frequency The processor s rated frequency assumes that all execution cores are running an application at the Thermal Design Power TDP However under typical operation not all cores are active Therefore most applications are consuming less than the TDP at
110. n the ILM assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel The hinge frame is plated The frame provides the hinge locations for the load lever and load plate An insulator is pre applied to the bottom surface of the hinge frame The ILM assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly The nominal gap of the load plate to the board is 1 mm When closed the load plate applies two point loads onto the IHS at the dimpled features shown in Figure 4 1 The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints A pin 1 indicator will be marked on the ILM assembly Thermal Mechanical Specifications and Design Guidelines 27 e i n tel Independent Loading Mechanism ILM Figure 4 1 4 1 2 Note Caution Note 28 ILM Assembly with I nstalled Processor Hinge Frame Assy Fasteners Load Load Lever Plate Pin 1 Indicator Shoulder Screw I LM Back Plate Design Overview The back plate is a flat steel back plate with pierced and extruded features for ILM attach A clearance hole is located at the center of the plate to allow access to test poin
111. nnn nnns 37 1155 land Package and LGA1155 Socket Stackup 37 Socket amp ILM Mechanical Specifications 4 42 2 0 11 38 Electrical Requirements LGA1155 Socket 39 Processor Thermal 5 5 2 1 6 nnne 42 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor 1280 95W 43 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 80W 45 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1260L 45W 46 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1220L 20W 47 Thermal Test Vehicle Thermal Profile for Intel Xeon Processor E3 1200 95W with Integrated Graphics 48 Thermal Solution Performance above TCONTROL for the Intel Xeon Processor E3 1280 95W 49 Thermal Solution Performance above TCONTROL for the Intel Xeon Processor E3 1200 BOW 50 Thermal Solution Performance above TCONTROL for the Intel Xeon Processor E3 1260L 45W eee nene nennen aan 51 Thermal Solution Performance above TCONTROL for the Intel Xeon Processor E3 1220L 20W
112. of the Critical Temperature Flag being set PROCHOT Signal An external signal PROCHOT processor hot is asserted when the processor core temperature has exceeded its specification If Adaptive Thermal Monitor is enabled note it must be enabled for the processor to be operating within specification the TCC will be active when PROCHOT is asserted The processor can be configured to generate an interrupt upon the assertion or de assertion of PROCHOT Although the PROCHOT signal is an output by default it may be configured as bi directional When configured in bi directional mode it is either an output indicating the processor has exceeded its TCC activation temperature or it can be driven from an external source such as a voltage regulator to activate the TCC The ability to activate the can provide a means for thermal protection of system components As an output PROCHOT Processor Hot will go active when the processor temperature monitoring sensor detects that one or more cores has reached its maximum safe operating temperature This indicates that the processor Thermal Control Circuit TCC has been activated if enabled As an input assertion of PROCHOT Z by the system will activate the for all cores TCC activation when PROCHOT is asserted by the system will result in the processor immediately Thermal Mechanical Specifications and Design Guidelines 57 m e n tel Thermal Specifi
113. on different vendor s ILMs Thermal Mechanical Specifications and Design Guidelines 33 34 i n tel Independent Loading Mechanism ILM Figure 4 6 ILM Cover Step 1 PnP Cover installed during ILM assembly Step 2 Remove PnP Cover As indicated in Figure 4 6 the pick and place cover should remain installed during ILM assembly to the motherboard After assembly the pick and place cover is removed and the ILM mechanism with the ILM cover installed closed to protect the contacts The ILM Cover is designed to pop off if the pick and place cover is accidentally left in place and the ILM closed with the ILM Cover installed This is shown in Figure 4 7 Thermal Mechanical Specifications and Design Guidelines m Independent Loading Mechanism ILM Figure 4 7 Cover and PnP Cover Interference As indicated in Figure 4 7 the pick and place cover cannot remain in place and used in conjunction with the ILM Cover The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place The ILM cover will also interfere and pop off if the ILM is closed with a processor in place in the socket 8 Thermal Mechanical Specifications and Design Guidelines 35 36 Independent Loading Mechanism ILM Thermal Mechanical Specifications and Design Guidelines LGA1155 Socket and ILM Electrical Mechanical and Environmental Specifications 5 LGA1155 Socket
114. on temperature If the temperature continues to increase and exceeds the TCC activation temperature by approximately 5 9C before the lowest ratio VID combination has been reached then the processor will immediately transition to the combined TM1 TM2 condition The processor will remain in this state until the temperature has dropped below the TCC activation point Once below the TCC activation temperature TM1 will be discontinued and TM2 will be exited by stepping up to the appropriate ratio VID state Critical Temperature Flag If TM2 is unable to reduce the processor temperature then TM1 will be also be activated TM1 and TM2 will then work together to reduce power dissipation and temperature It is expected that only a catastrophic thermal solution failure would create a situation where both TM1 and TM2 are active If TM1 and TM2 have both been active for greater than 20ms and the processor temperature has not dropped below the TCC activation point then the Critical Temperature Flag in the IA32 STATUS MSR will be set This flag is an indicator of a catastrophic thermal solution failure and that the processor cannot reduce its temperature Unless immediate action is taken to resolve the failure the processor will probably reach the Thermtrip temperature see Section 6 2 3 Thermtrip Signal within a short time In order to prevent possible permanent silicon damage Intel recommends removing power from the processor within gt second
115. or socket 4 Dynamic loading is defined as an 50g shock load 2X Dynamic Acceleration Factor with a 500g maximum thermal solution Package Handling Guidelines Table 2 2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate These package handling loads may be experienced during heatsink removal Package Handling Guidelines Parameter Maximum Recommended Notes Shear 311 N 70 Ibf 1 4 Tensile 111 N 25 Ibf Torque 3 95 N m 35 Ibf in 4 Notes 1 A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface 2 Atensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top 4 surface These guidelines are based on limited testing for design characterization Package nsertion Specifications The processor can be inserted into and removed from an LGA1155 socket 15 times The socket should meet the LGA1155 socket requirements detailed in Chapter 5 Processor Mass Specification The typical mass of the processor is 21 5 g 0 76 oz This mass weight includes all the components that are included in the package 15 e n tel Package Mechanical amp Storage Specifications 2 1 7 Table 2 3 2 1 8 Figure 2 3
116. ore and the graphics render frequency within the specified package power levels Compared with previous generation products Intel amp Turbo Boost Technology will increase the ratio of application power to TDP Thus thermal solutions and platform cooling that are designed to less than thermal design guidance might experience thermal and performance issues since more applications will tend to run at the maximum power limit for significant periods of time Thermal Considerations Intel Turbo Boost Technology allows processor cores and Processor Graphics cores to run faster than the baseline frequency During a turbo event the processor can exceed its TDP power for brief periods Turbo is invoked opportunistically and automatically as long as the processor is conforming to its temperature power delivery and current specification limits Thus thermal solutions and platform cooling that are designed to be less than thermal design guidance may experience thermal and performance issues since more applications will tend to run at or near the maximum power limit for significant periods of time Thermal Mechanical Specifications and Design Guidelines 59 e n tel Thermal Specifications 60 I ntel Turbo Boost Technology Power Control and Reporting When operating in the turbo mode the processor will monitor its own power and adjust the turbo frequency to maintain the average power within limits over a thermally significant time period The p
117. p prevent contamination during reflow The cover can withstand 260 for 40 seconds typical reflow rework profile and the conditions listed in Chapter 5 without degrading As indicated in Figure 3 6 the cover remains on the socket during ILM installation and should remain on whenever possible to help prevent damage to the socket contacts Thermal Mechanical Specifications and Design Guidelines 23 Figure 3 6 3 4 24 n tel LGA1155 Socket Cover retention must be sufficient to support the socket weight during lifting translation and placement board manufacturing and during board and system shipping and handling PnP Cover should only be removed with tools to prevent the cover from falling into the contacts The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body This should allow the PnP covers to be compatible between socket suppliers As indicated in Figure 3 6 a Pin 1 indicator on the cover provides a visual reference for proper orientation with the socket Pick and Place Cover Pick amp Place Cover ILM Installation Package Installation Removal As indicated in Figure 3 7 access is provided to facilitate manual installation and removal of the package To assist in package orientation and alignment with the socket The package Pini triangle and the socket Pini chamfer provide visual reference for proper orientation e The pac
118. peed control management purposes the PECI 3 0 commands that are commonly implemented includes Ping GetDIB GetTemp and TjMax TCC read The and TCC read command can be implemented by utilizing the RdPkgConfig command Fan Speed Control with Digital Thermal Sensor Processor fan speed control is managed by comparing DTS temperature data against the processor specific value stored the static variable When the DTS temperature data is less than Tcontrot the fan speed control algorithm can reduce the speed of the thermal solution fan This remains the same as with the previous guidance for fan speed control Please refer to Section 6 1 6 for guidance where the DTS temperature data exceeds The DTS temperature data is delivered over PECI in response to a GetTemp command and reported as a relative value to TCC activation target The temperature data reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit TCC activation as indicated by the PROCHOT signal Therefore as the temperature approaches TCC activation the value approaches zero degrees Thermal Mechanical Specifications and Design Guidelines 63 64 PECI Interface Thermal Mechanical Specifications and Design Guidelines Sensor Based Thermal Specification Design Guidance n tel 8 8 1 Sensor Based Thermal Specificat
119. profile Thermal solutions not designed to provide this level of thermal capability may affect the long term reliability of the processor and system For more details on thermal solution design please refer to the Chapter 9 The processors implement a methodology for managing processor temperatures which is intended to support acoustic noise reduction through fan speed control and to assure processor reliability Selection of the appropriate fan speed is based on the relative temperature data reported by the processor s Digital Temperature Sensor DTS The DTS can be read via the Platform Environment Control Interface PECI as described in Chapter 7 Alternatively when PECI is monitored by the PCH the processor temperature can be read from the PCH via the SMBUS protocol defined in Embedded Controller Support Provided by Platform Controller Hub PCH The temperature reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit TCC activation as indicated by PROCHOT see Section 6 2 Processor Thermal Features Systems that implement fan speed control must be designed to use this data Systems that do not alter the fan speed only need to ensure the case temperature meets the thermal profile specifications A single integer change in the PECI value corresponds to approximately 1 change in processor temperature Although each processors DTS is factory calibrated the accuracy of the DTS will
120. rage temperature limit in 40 shipping media for a sustained period of time um RHeystainep STORAGE The maximum device storage relative humidity 5 5 for sustained period of time 60 24 5 6 TIMEsustainep STORAGE A prolonged or extended period of time typically 6 associated with customer shelf life Months Months Notes 1 Refers to a component device that is not assembled a board or socket that is not to be electrically connected to a voltage reference or I O signals 2 Specified temperatures are based on data collected Exceptions for surface mount reflow are specified in by applicable JEDEC standard Non adherence may affect processor reliability 3 TassoiurE storace to the unassembled component only and does not apply to the shipping media moisture barrier bags or desiccant 4 Intel branded board products are certified to meet the following temperature and humidity limits that are given as an example only Non Operating Temperature Limit 40 to 70 Humidity 50 to 90 non condensing with a maximum wet bulb of 28 Post board attach storage temperature limits are not specified for non Intel branded boards 5 JEDEC J JSTD 020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag 6 Nominal temperature and humidity conditions and durations are given and tested within the
121. rawing Description Figure Number Socket Heatsink ILM Keepout Zone Primary Side for 1U Top Figure B 1 Socket Heatsink ILM Keepout Zone Secondary Side for 1U Bottom Figure B 2 Socket Processor ILM Keepout Zone Primary Side for 1U Top Figure B 3 Socket Processor ILM Keepout Zone Secondary Side for 1U Bottom Figure B 4 1U Collaboration Heatsink Assembly Figure B 5 1U Collaboration Heatsink Figure B 6 1U Reference Heatsink Assembly Figure B 7 1U Reference Heatsink Figure B 8 1U Heatsink Screw Figure B 9 Heatsink Compression Spring Figure B 10 Heatsink Load Cup Figure B 11 Heatsink Retaining Ring Figure B 12 Heatsink Backplate Assembly Figure B 13 Heatsink Backplate Figure B 14 Heatsink Backplate Insulator Figure B 15 Heatsink Backplate Stud Figure B 16 Thermocouple Attach Drawing Figure B 17 1U ILM Shoulder Screw Figure B 18 1U ILM Standard 6 32 Thread Fastener Figure B 19 Thermal Mechanical Specifications and Design Guidelines 95 m e n tel Mechanical Drawings Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 10 Top IN ACE KEEP OU 222 ENT KEE T ENT HEIGHT 1 1 156 amp 155 SOCKET KEEP INS ENT HEIGHT NT HEIGHT 7 NENT HEIGHT 7 TING SURFACE TR gt
122. s Customers are responsible for thermal mechanical and environmental validation of these solutions This list and or these devices may be subject to change without notice Collaboration Heatsink Enabled Components 1U Server Item Intel PN AVC 1U Collaboration heatsink Assembly E49069 001 Q41900001 1U Reference Heatsink Assembly E95498 001 5000500001 Heatsink Back Plate Assembly E49060 001 P209000071 Reference Heatsink Workstation Item Intel PN Delta Foxconn Nidec DHA A Heatsink Assembly E41759 002 DTC DAA07 1A01C7TOO F90T12MS1Z7 Active DHA 02 64A01A1 DHX B Socket H Compatible E88216 001 n a 1A01GQ110 DHX n a Xtreme Edition Reference Heatsink Components Workstation Item Intel PN AVC ITW DHA A Heatsink Clip E36830 001 A208000389 n a DHA A Fastener E49060 001 n a Base C33389 Cap C33390 LGA1155 Socket I LM Components Sheet 1 of 2 Item Intel PN Foxconn Molex Tyco Lotes LGA1155 Socket E52846 002 PE115527 475962032 2069570 1 N A 4041 01F LGA115x ILM E36142 002 PT44L61 6401 475969911 2013882 3 ACA ZIF 078 without cover YO2 LGA115x ILM with G11449 001 PT44L81 6401 475968711 2013882 5 ACA ZIF 078 cover Y17 Thermal Mechanical Specifications and Design Guidelines 93 Table 4 Table 5 94 intel LGA1155 Socket and ILM Components Sheet 2 of 2 Component Suppliers
123. s please refer to Appendix A The reference design incorporates a T 20 Torx head fastener The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM Thermal Mechanical Specifications and Design Guidelines 29 i n tel Independent Loading Mechanism ILM Figure 4 3 Shoulder Screw Cap 6 32 thread Shoulder 4 2 Assembly of I LM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board See Figure 4 4 for step by step assembly sequence 1 Place the back plate in a fixture The motherboard is aligned with the fixture 2 Install the shoulder screw in the single hole near Pin 1 of the socket Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds 3 Align and place the ILM assembly over the socket 4 Install two 2 6 32 fasteners Torque to a minimum and recommended 8 inch pounds but not to exceed 10 inch pounds The thread length of the shoulder screw accommodates a nominal board thicknesses of 0 062 30 Thermal Mechanical Specifications and Design Guidelines Independent Loading Mechanism ILM n tel Figure 4 4 Assembly Step 3 Step 4 Note Here ILM assembly shown in figure is without ILM cover preinstalled As indicated in Figure 4 5 the shoulder screw socket protrusion and ILM key features prevent 180 degree
124. scretion of the user Thermal Mechanical Specifications and Design Guidelines 89 m e n tel Thermal Solution Quality and Reliability Requirements 11 2 1 11 2 2 11 2 3 90 Recommended Test Sequence Each test sequence should start with components that is baseboard heatsink assembly and so on that have not been previously submitted to any reliability testing Prior to the mechanical shock amp vibration test the units under test should be preconditioned for 72 hours at 45 9C The purpose is to account for load relaxation during burn in stage The test sequence should always start with a visual inspection after assembly and BIOS Processor memory test The stress test should be then followed by a visual inspection and then BIOS Processor memory test Post Test Pass Criteria The post test pass criteria are 1 No significant physical damage to the heatsink and retention hardware 2 Heatsink remains seated and its bottom remains mated flatly against the IHS surface No visible gap between the heatsink base and processor IHS No visible tilt of the heatsink with respect to the retention hardware No signs of physical damage on baseboard surface due to impact of heatsink No visible physical damage to the processor package Successful BIOS Processor memory test of post test samples Thermal compliance testing to demonstrate that the case temperature specification can be met Recommended
125. scriptions Sheet 2 of 2 Term Description TCASE_MAX The maximum case temperature as specified in a component specification TCC Thermal Control Circuit Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and or operating frequency and input voltage adjustment when the die temperature is very near its operating limits TcoNTROL Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point for fan speed control When DTS Tcontrol the processor must comply to the TTV thermal profile TDP Thermal Design Power Thermal solution should be designed to dissipate this target power level TDP is not the maximum power that the processor can dissipate Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature Thermal Profile Line that defines case temperature specification of the TTV at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink V Thermal Test Vehicle A mechanically equivalent package that contains a resistive heater in the die to evaluate thermal solutions Ti A The measured ambient temperature locally surrounding the processor The ambient temperature should
126. shows a mechanical representation of the active tower thermal solution Drawings in this chapter reflect only the specifications on this active tower thermal solution These dimensions should not be used as a generic keep out zone for all cooling solutions It is the system designers responsibility to consider their proprietary cooling solution when designing to the required keep out zone on their system platforms and chassis Refer to the desktop processor thermal mechanical design guide for further guidance on keep in and keep out zones Figure 10 1 Mechanical Representation of the Solution NN N 2 2 2 2 7 2 2 7 22 7 Z Z N NN Thermal Mechanical Specifications and Design Guidelines 83 m n tel Active Tower Thermal Solution 10 2 Mechanical Specifications 10 2 1 Cooling Solution Dimensions This section documents the mechanical specifications Figure 10 1 shows a mechanical representation of the solution Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling The physical space requirements and dimensions for the processor with assembled thermal solution are shown in Figure 10 2 Side View and Figure 10 3 Top View The airspace requirements for this active tower heatsink must also be incorporated into new baseboard and system designs Note that some figures have centerlines shown marked with alphabetic designations to c
127. specification listed is at room temperature and has to be satisfied at all time Max Individual Contact Resistance EOL 100 mOhm The specification listed is at room temperature and has to be satisfied at all time Socket Contact Resistance The resistance of the socket contact solderball and interface resistance to the interposer land gaps included Bulk Resistance Increase lt The bulk resistance increase per contact from 25 to 100 C Dielectric Withstand Voltage 360 Volts RMS Insulation Resistance 800 MO 5 5 Environmental Requirements Design including materials shall be consistent with the manufacture of units that meet the following environmental reference points The reliability targets in this section are based on the expected field use environment for these products The test sequence for new sockets will be developed using the knowledge based reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 1 Thermal Mechanical Specifications and Design Guidelines 39 n tel LGA1155 Socket and ILM Electrical Mechanical and Environmental Specifications Figure 5 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the Develop Speculative market expected use stress conditions based on environment for the historical data content technolog
128. the cooling efficiency and decreases fan life Figure 10 6 illustrate an acceptable front airspace clearance for the fan heatsink which is recommended to at least 15 mm or larger The air temperature entering the fan should be kept below 40 9C Again meeting the processor s temperature specification is the responsibility of the system integrator Figure 10 6 Active Tower Heatsink Airspace Keepout Requirements side view Thermal Mechanical Specifications and Design Guidelines 87 88 Active Tower Thermal Solution Thermal Mechanical Specifications and Design Guidelines m Thermal Solution Quality and Reliability Requirements n tel 11 Thermal Solution Quality and Reliability Requirements 11 1 Reference Heatsink Thermal Verification Each motherboard heatsink and attach combination may vary the mechanical loading of the component Based on the end user environment the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume The Intel reference thermal solution will be evaluated to the boundary conditions in Chapter 5 The test results for a number of samples are reported in terms of a worst case mean value for thermal characterization parameter using the 11 2 Mechanical Environmental Testing Each motherboard heatsink and attach combination may vary the mechanical loading of the component Based on t
129. the customer can make To aide in the design process Intel provides TTV thermal models Please consult your Intel Field Sales Engineer for these tools 8 3 3 Thermal Solution Validation 8 3 3 1 Test for Compliance to the TTV Thermal Profile This step is the same as previously suggested for prior products The thermal solution is mounted on a test fixture with the TTV and tested at the following conditions e TTV is powered to the TDP condition Maximum airflow through heatsink at the boundary condition from Section 8 3 1 The following data is collected TTV power TTV and and used to calculate which is defined as Tease Power This testing is best conducted on a bench to eliminate as many variables as possible when assessing the thermal solution performance The boundary condition analysis as described in Section 8 3 1 should help in making the bench test simpler to perform 8 3 3 2 Thermal Solution Characterization for Fan Speed Control The final step in thermal solution validation is to establish the thermal solution performance Y c4 and acoustics as a function of fan speed This data is necessary to allow the fan speed control algorithm developer to program the device It also is needed to asses the expected acoustic impact of the processor thermal solution in the system The fan speed control device may modulate the thermal solution f
130. the frequency is increased Refer to Figure 6 7 for an illustration of this ordering Frequency and Voltage Ordering Frequency VID fax VIDE VIDf PROCHOT Clock Modulation Clock modulation is a second method of thermal control available to the processor Clock modulation is performed by rapidly turning the clocks off and on at a duty cycle that should reduce power dissipation by about 50 typically a 30 50 duty cycle Clocks often will not be off for more than 32 microseconds when the TCC is active Cycle times are independent of processor frequency The duty cycle for the TCC when activated by the Thermal Monitor is factory configured and cannot be modified It is possible for software to initiate clock modulation with configurable duty cycles Thermal Mechanical Specifications and Design Guidelines m Thermal Specifications n tel 6 2 2 3 6 2 2 4 6 2 2 5 A small amount of hysteresis has been included to prevent rapid active inactive transitions of the TCC when the processor temperature is near its maximum operating temperature Once the temperature has dropped below the maximum operating temperature and the hysteresis timer has expired the TCC goes inactive and clock modulation ceases Immediate Transition to combined TM1 and TM2 As mentioned above when the TCC is activated the processor will sequentially step down the ratio multipliers and VIDs in an attempt to reduce the silic
131. tions and Design Guideline 7 intel Revision History Document Number Description Date 324973 001 Initial release of the document April 2011 8 Thermal Mechanical Specifications and Design Guideline Introduction n te 1 Introduction This document is intended to provide guidelines for design of thermal and mechanical solution Meanwhile thermal and mechanical specifications for the processor and associated socket are included The components described in this document include e The thermal and mechanical specifications for the following Intel server workstation processors Intel Xeon processor E3 1200 product family e The LGA1155 socket and the Independent Loading Mechanism ILM and back plate The collaboration reference design thermal solution heatsink for the processors and associated retention hardware The Intel Xeon Processor E3 1200 product family has the different thermal specifications When required for clarity this document will use Intel Xeon processor E3 1280 95W Intel Xeon processor E3 1200 80W Intel Xeon processor E3 1200 series 95W with integrated graphics Intel Xeon processor E3 1260L 45W Intel Xeon processor E3 1220L 20W Note When the information is applicable to all products the this document will use processor or processors to simplify the document Thermal Mechanical Specifications and Des
132. tions and Design Guidelines PECI Interface 7 7 1 7 1 1 7 1 1 1 intel Interface Platform Environment Control I nterface Introduction PECI uses a single wire for self clocking and data transfer The bus requires no additional control lines The physical layer is a self clocked one wire bus that begins each bit with a driven rising edge from an idle level near zero volts The duration of the signal driven high depends on whether the bit value is a logic 0 or logic 1 also includes variable data transfer rate established with every message In this way it is highly flexible even though underlying logic is simple The interface design was optimized for interfacing to Intel processors in both single processor and multiple processor environments The single wire interface provides low board routing overhead for the multiple load connections in the congested routing area near the processor and chipset components Bus speed error checking and low protocol overhead provides adequate link bandwidth and reliability to transfer critical device operating conditions and configuration information The PECI bus offers e A wide speed range from 2 Kbps to 2 Mbps CRC check byte used to efficiently and atomically confirm accurate data delivery Synchronization at the beginning of every message minimizes device timing accuracy requirements For single processor temperature monitoring and fan s
133. ts and backside capacitors if required An insulator is pre applied A notch is placed in one corner to assist in orienting the back plate during assembly The Server ILM back plate is different from the Desktop design Since Server secondary side clearance of 3 0 mm 0 118 inch is generally available for leads and backside components so Server ILM back plate is designed with 1 8 mm thickness and 2 2 mm entire height including punch protrusion length Intel does NOT recommend using the server back plate for high volume desktop applications at this time as the server back plate test conditions cover a limited envelope Back plates and screws are similar in appearance To prevent mixing different levels of differentiation between server and desktop back plate and screws have been implemented For ILM back plate three levels of differentiation have been implemented e Unique part numbers please refer to part numbers listed in Appendix A Desktop back plate to use black lettering for marking versus server ILM back plate to use yellow lettering for marking Desktop back plate using marking 115XDBP versus server ILM back plate using marking 115XSBP When reworking a BGA component or the socket that the heatsink battery ILM and ILM Back Plate are removed prior to rework The ILM back plate should also be removed when reworking through hole mounted components in a mini wave or solder pot The maximum temperature for
134. ttern for the LGA1155 socket is 36 mils X 36 mils X by Y within each of the two L shaped sections Note that there is no round off conversion error between socket pitch 0 9144 mm and board pitch 36 mil as these values are equivalent The two L sections are offset by 0 9144 mm 36 mil in the x direction and 3 114 mm 122 6 mil in the y direction see Figure 3 3 This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket designs from the multiple vendors Thermal Mechanical Specifications and Design Guidelines LGA1155 Socket Figure 3 3 LGA1155 Socket Land Pattern Top View of Board intel C E G J L R U AA AC AE AG AJ AL AN AR AU AW B D F H K MP T V Y AB AD AF AH AK AM AP AT AV AY 8 22 2 222222 222288 2222 2 2 22 2222308 9 25 3195 52 59585 52 5125 2 2 519 99 2 5 998 01212621616 6 90 4 2 ic NN 222 36mil 0 9144 8 90100100 29 5 e s 23 0099090990098 ____ 558558550 20 99 000000000000 17 QO 599 5 15 17 99990999900 550502555558 14 OO 5602026 09009990008 11 ae 229229292041 122 6 mil 3 1144mm a 11 99988388885 0989389898988 7 52 3 38 34 32 Thermal Mechanical Specifications and Design
135. um fan steady state current draw 1 2 A e Maximum fan start up current draw 3 0 A SENSE SENSE frequency 2 pulses per fan 1 revolution CONTROL 21 25 28 kHz 2 3 Notes 1 Baseboard should pull this pin up to 5V with a resistor 2 Open drain type pulse width modulated 3 Fan will have pull up resistor for this signal to maximum of 5 25 V Figure 10 5 Baseboard Power Header Placement Relative to Processor Socket R110 4 33 86 Thermal Mechanical Specifications and Design Guidelines m Active Tower Thermal Solution n tel 10 4 Cooling Requirements The processor may be directly cooled with a fan heatsink However meeting the processor s temperature specification is also a function of the thermal design of the entire system and ultimately the responsibility of the system integrator The processor temperature specification is found in Chapter 6 of this document The active tower heatsink is able to keep the processor temperature within the specifications see Table 6 1 in chassis that provide good thermal management For fan heatsink to operate properly it is critical that the airflow provided to the heatsink is unimpeded Airflow of the fan heatsink is into the front of fan and straight out of the heatsink rear side Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked Blocking the airflow to the fan heatsink reduces
136. unning the processor at the lower frequency and voltage will reduce power consumption and should allow the processor to cool off If after 1ms the processor is still too hot the temperature has not dropped below the TCC activation point DTS still 0 and PROCHOT is still active then a second frequency and voltage transition will Thermal Mechanical Specifications and Design Guidelines 55 m e n tel Thermal Specifications Figure 6 7 6 2 2 2 56 take place This sequence of temperature checking and Frequency VID reduction will continue until either the minimum frequency has been reached or the processor temperature has dropped below the TCC activation point If the processor temperature remains above the TCC activation point even after the minimum frequency has been reached then clock modulation described below at that minimum frequency will be initiated There is no end user software or hardware mechanism to initiate this automated TCC activation behavior A small amount of hysteresis has been included to prevent rapid active inactive transitions of the TCC when the processor temperature is near the TCC activation temperature Once the temperature has dropped below the trip temperature and the hysteresis timer has expired the operating frequency and voltage transition back to the normal system operating point via the intermediate VID frequency points Transition of the VID code will occur first to insure proper operation as
137. vary from part to part and may also vary slightly with temperature and voltage In general each integer change in PECI should equal a temperature change between 0 9 C and 1 1 C Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods Intel recommends that complete thermal solution designs target the Thermal Design Power TDP instead of the maximum processor power consumption The Adaptive Thermal Monitor feature is intended to help protect the processor in the event that an application exceeds the TDP recommendation for a sustained time period For more details on this feature refer to Thermal Mechanical Specifications and Design Guidelines 41 Thermal Specifications Section 6 2 To ensure maximum flexibility for future processors systems should be designed to the Thermal Solution Capability guidelines even if a processor with lower power dissipation is currently planned Table 6 1 Processor Thermal Specifications Max Max Max TTV Power Power Power Thermal Min Maximum Product Guidelines8 Package Package Package Design C TTV TCASE ce Power C W 1 2 6 1 2 6 1 3 6 4 5 7 Intel8 Fi 6 1 Processor E3 2011D 28 22 5 5 95 Ree 6 2 1280 95W Intel Xeon processor 20110 28 22 5 5 80 Figure 227 1200 80W Intel8
138. ximum Component Height 1 place 2 5mm Maximum Component Height 6 places Y Thermal I nterface Material A thermal interface material TIM provides conductivity between the IHS and heatsink The collaboration thermal solution uses Honeywell PCM45F which pad size is 35x35 mm TIM should be verified to be within its recommended shelf life before use Surfaces should be free of foreign materials prior to application of TIM Heat Pipe Thermal Consideration The following drawing shows the orientation and position of the 1155 land LGA Package TTV die this is the same package layout as used in the 1156 land LGA Package TTV The TTV die is sized and positioned similar to the production die 81 inte Figure 9 6 TTV Die Size and Orientation 37 5 Die Centerline 76 01 476 lt gt 10 94 Drawing Not to Scale All Dimensions in mm 82 m Active Tower Thermal Solution 1 n te 10 10 1 Note Note Active Tower Thermal Solution I ntroduction This active tower thermal solution is intended for system integrators who build systems from baseboards and standard components This chapter documents baseboard and system requirements for the cooling solution It is particularly important for OEMs that manufacture baseboards for system integrators Unless otherwise noted all figures in this chapter are dimensioned in millimeters and inches in brackets Figure 10 1
139. y experts and literature search Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at ftp download intel com technology itj q32000 pdf reliability pdf 40 Thermal Mechanical Specifications and Design Guidelines m Thermal Specifications n tel 6 Thermal Specifications The processor requires a thermal solution to maintain temperatures within its operating limits Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system Maintaining the proper thermal environment is key to reliable long term system operation A complete solution includes both component and system level thermal management features Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader IHS This chapter provides data necessary for developing a complete thermal solution For more information on a thermal solution design please refer to Chapter 9 6 1 Thermal Specifications To allow the optimal operation and long term reliability of Intel processor based systems the processor must remain within the minimum and maximum case temperature specifications as defined by the applicable thermal

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