HP 11722A User's Manual
Contents
1. CAUTION Do not apply excessive torque to the Sensor Module s body when connecting or discon necting the type N RF input connector Do not apply excessive force to the Sensor Modules body from any axis when its input is connected to another instrument Particular care should be taken when the Sensor Module is suspended only by its RF input connector Model 11722A Exceeding the following energy and power levels may result in damage to the power meter system The absolute maximum RF signal level that may be applied to the Sensor Module is a Maximum Average Power 1W b Maximum Peak Power 100 or 300W us per pulse 13 Operating Characteristics For detailed information on the instrument s charac teristics refer to Table 1 Specifications and Table 2 Supplemental Characteristics Remote Operation The Sensor Module is designed to allow remote operation of the RF switching assem biy The control lines for each switch are contained within the sensor cable For information on connect ing the sensor cable refer to the measuring instrument s operating and service manual 14 PERFORMANCE TESTS Refer to the Caution in paragraph 6 In stallation that is concerned with the con nection of the Sensor Module to other devices 15 Calibration Factors A table of calibration factors is provided on the bot tom cover of the Sensor Module for easy reference These calibratio2. S l m APO TTT OTL EG E AAA FT P d EN CERTIFICATION Hewlett Packard Company certiftes that this product met its published specifications at the time of shipment from the factory Hewlett Packard further certifies that tts calibration measurements are traceable to the United States National Bureau of Standards to the extent allowed by the Bureau s calibration facility and to the calibration facilities of other International Standards Organization members WARRANTY This Hewlett Packard instrument product is warranted against defects in material and workmanship for a period of one year from date of shipment During the warranty period Hewlett Packard Company will at its option either repair or replace products which prove to be defective For warranty service or repair this product must be returned to a service facility designated by HP Buyer shall prepay shipping charges to HP and HP shall pay skipping charges to return the product to Buyer However Buyer shall pay all shipping charges duties and taxes for products returned to HP from another country HP warrants that its software and firmware designated by HP for use with an instrument will execute its programming instructions when properly installed on that instrument HP does not warrant that the operation of the instrument or software or firmware will be uninterrupted
3. 7 Initial Inspection Refer to the measuring instrument s operating manual for interconnecting instructions Inspect the shipping container If the container or packing material is damaged it should be kept until 9 Storage and Shipment the contents of the shipment have been checked mechanically and electrically If there is mechanical Environment The instrument should be stored in a damage or if the instrument does not pass the per clean dry environment The following environmental formance tests notify the nearest Hewlett Packard of limitations apply to both storage and shipment fice Keep the damaged shipping materials if any for inspection by the carrier and a Hewlett Packard a Temperature 25 to 75 C 13 to 167 F representative pM E b Relative Humidity less than 95 8 Interconnections c Altitude less than 7600 metres 25 000 feet NOTE Original Packaging Containers and materials identi For proper system operation the Sensor cal to those used in factory packaging are available Module should be connected to a compatt through Hewlett Packard offices If the instrument is ble power measuring instrument using only being returned to Hewlett Packard for servicing at the cables attached to the Sensor Module tach a tag indicating the type of service required re There are no extension cables available turn address model number and full serial number The sensor cable contains control lines for Also mark the
4. NORTH CENTRAL AFRICA Hewlett Packard S A 7 rue du Bois du Lan CH 1217 MEYRIN 1 Switzerland Tel 022 83 12 12 Telex 27835 hmea Cable HEWPACKSA Geneve ASIA Hewlett Packard Asia Ltd 47 26 Harbour Rd Wanchai HONG KONG G P O Box 863 Hong Kong Tel 3 Telex 76793 HPA HX Cable HPASIAL TD MEDITERRANEAN AND MIDDLE EAST Hewlett Packard S A Mediterranean and Middle East Operations Atrina Centre 32 Kifissias Ave Paradissos Amarousion ATHENS Greece Tel 682 88 11 Telex 21 6588 HPAT GR Cable HEWPACKSA Athens REGIONAL SALES AND SERVICE OFFICES EASTERN EUROPE Hewlett Packard Ges m b h Liebigasse 1 P O Box 2 A 1222 VIENNA Austria Tel 222 2500 0 Telex 1 3 4425 HEPA A NORTHERN EUROPE Hewlett Packard S A Uilenstede 475 P O Box 999 NL 1183 AG AMSTELVEEN The Netherlands Tel 20 437771 Telex 18 919 hpner nl SOUTH EAST EUROPE Hewlett Packard S A World Trade Center 110 Avenue Louis Casai 1215 Cointrin GENEVA Switzerland Tel 022 98 96 51 Telex 27225 hpser OTHER INTERNATIONAL AREAS Hewlett Packard Co Intercontinental Headquarters 3495 Deer Creek Road PALO ALTO CA 94304 Tel 415 857 1501 Telex 034 8300 Cabie HEWPACK EASTERN USA Hewlett Packard Co 4 Choke Cherry Road ROCKVILLE MD 20850 Tet 301 258 2000 MIDWESTERN USA Hewlett Packard Co 5201 Tollview Drive ROLLING MEADOWS IL 80008 Tet 312 255 9800 SOUTHERN
5. erue Model 11722A 1 GENERAL INFORMATION This Operating and Service Manual contains informa tion about initial inspection operation performance tests adjustments troubleshooting and repair of the HP Model 11722A Sensor Module 2 Specifications Instrument specifications are listed in Table 1 These specifications are the performance standards or limits against which the instrument can be tested The sup plemental characteristics listed in Table 2 are not specifications but are typical characteristics included as additional information for the user 3 Instruments Covered by Manual This instrument has a two part serial number The first four digits and the letter comprise the serial number prefix T he prefix is the same for all identical instruments 1t changes only when a change is made to the instrument The last five digits form a sequen tial suffix which is unique to each instrument The contents of this manual apply directly to instruments having the serial prefix listed under Serial Numbers on the title page An instrument manufactured after the printing of this manual may have a serial prefix that is not listed on the title page This unlisted serial prefix indicates that the manual for this instrument is supplied with a Manual Changes supplement that documents the differences Table 1 Spec Performance Limits Characteristic Power Range 20 to 30 dBm 10 uW to 1W Frequen
6. Connect the lead to pins 4 and 6 10 Measure the resistance between pins 2 and 3 and between pins 3 and 8 of A142U1 For each mea surement the resistance should be several hun dred times the resistance measured in step 8 11 Sensor Module 26 Repair CAUTION Refer to the Caution in paragraph 6 In stallation that is concerned with the con nection of the Sensor Module to other de VICES Cleanliness Do not handle the 41A2 Input Amplifier circuit board more than necessary If dirt or moisture from the hands comes in contact with the circuit side of the 1 2 board the circuits may become inoperative Do not use solder flux remover on the circuit board It is particularly important to keep the area around A1A2U1 clean Soldering Techniques The Power Sensor Al is a highly sensitive device and is affected by very small differences in temperature be tween its components Therefore after soldering on the unit allow several hours for A1 to reach thermal equilibrium before it is used or tested Capacitors ALA2C2 C3 C7 and C8 see Figure 4 Al Power Sensor Module Component Locations in Service Sheet 1 require low temperature soldering techniques The connections to these capacitors are gold film deposited on a ceramic base Molten solder forms a gold amalgam with the solder which removes some of the gold from its ceramic base Solder quickly and use a low temperature soldering iron a
7. 41937 51739 264480 26480 34480 28480 24346 24546 24546 14140 284030 espana 403480 28486 28400 24546 23480 20409 28400 29 AHAB D 905949 IAEA 2848090 26430 20450 21480 09600 28400 20480 ae Bath AAE 20400 2040 25480 20400 213480 See introduction to this section for ordering information Indicates factory selected value Model 117224 Mfr Part Number 11722 66004 2160 5772 8160 5772 08481 200159 ORDER BY DESCRIPTION 0841 2601 1 ORDER BY DESCRIPTION 2190 0049 3038 0333 ORDER BY DESCRIPTION 68401 209008 1460 1224 1251 3363 08481 02002 60481 50902 ORDER BY DESERTPTION 3048 4939 2040 6940 09402 60014 08402 60013 01860 05723 09 08051011 EE 1183856101160 0100 0394 0160 3074 0160 3079 OEE PAK An 0805166 AP 0180 2515 0130 2545 18054 0610 0757 0483 C3 t 8 T 3161 F C3 1 8 TO 315R F C3 1 8 T0 1021 F 1409 1 20 41R6G J 1813 6066 0390 1640 040 6798 3180 2702 3001 8174 L3 1 8 T0 1621 F 1172260005 15580 1159 11222 60008 131 1351 82 1138 6 12500 0716 131 147 30840 0305 08535 290973 00761 2027 00555 20094 2178 8104 ORDER BY DESCRIPTION 11722 6080 0240 5037 03480 80039 19851 0159 1901 0159 3130 9447 0368 9272 3130 9433 8150 8452 Model 117224 Sensor Module Table 5 Replaceable Parts Reference HP Part ic Oty Description Mfr
8. 6938 1231 5757 5001 0194 0698 7241 11722 680005 1230 1199 11722 66008 1256 0918 1259 0016 12750 0917 3048 0376 00555 2909 08761 2927 00595 29094 2179 6104 2250 0132 11722 60006 0340 9037 0340 0037 1901 015 1901 0157 3190 0447 03560 0272 3150 6453 8142 Qo CTSA zo O CO c to S co CO e op cn Pu c ii DI Lal oi yo gt xu o0 Table 5 Replaceable Parts Description A1 POWER SENSOR ASSEMBLY CAPACITON FDTHRU 022UF 180 0 CAPACITOR FDTHRU 3 7217 100 0 POWER SENSOR ASSEMBLY TOP COVER S CREW SKT HD CAP 0 80 1G8 IN LG POWER SENSOR ASSEMBLY BOTTOM COVE SCREW SKE HD CAP 0 80 188 IN LG SCREW SKF HD CAP 0 80 S IN LG SS WAGHER LK HLOL NO 9 06 IN 1D SCREW MISC ITEM FAPE INDL 5 iN W 003 IN T SIL XFR ADH END BELL SPRING CPRSN 080 1N 0D 1908 1N 0 NUT CONNECTOR MOUNTING SHIELD SHIELD MTO r PJ wd e SEREW SKT HD CAP 07 8 S EN LG SS CLAMP BLOCK BULKHEAD TYPE N POWER SENSOR BOARD 7 CAPACITOR FXD 39UPe 20xX TA CAPACTITOR FXD 1007 430 76 CAPACITOR FXD 10017 10 100YDt CAPACITOR FXD A 3UF 17 15UDUC TA CAPACITOR FXD 1UF 10 100017 C CAPACITOR FXD PHF 24 100UDC CAPACITOR FXD 10117 7 4 107 100UDC CAPACITOR FXD 1007 10 100VDC CAPACITOR FXD 47UF 20 GVD TA CAPAECITOR FXD 0 204 ANDE TA TRANSISTOR NPN ST T A
9. A1A2U1 is amplified approximately 700 times by an operational amplifier that consists of Al1A2Q1 and the first amplifier stage in the power measuring instrument See Figure 2 Simplified Op erational Amplifier With no signal applied to the sensor input a de volt age from the circuitry of the measuring instrument is POWER SENSOR Figure 1 Simplified Block Diagram Model 11722A used to cancel any de offset present in the power sen sor The de voltage is applied to the input of the Sampling Gate through a voltage divider formed by A1A2R1 and the series resistance of the thermocouple AIAITCH When the power sensor is used with certain measuring instruments resistor A1J1R1 Mount Resistor indi cates the type of power sensor in use The measuring instrument then automatically selects the proper mea surement range 20 to 30 dBm in this case 25 Troubleshooting CAUTION Refer to the Caution in paragraph 6 In stallation that is concerned with the con nection of the Sensor Module to other devices General Troubleshooting information assists in isolating the problem to a functional section within the Sensor Module The troubleshooting procedure normally does not attempt to isolate the fault to a specific compo nent but rather it verifies whether a particular circuit is functioning Both the circuits and the trouble shooting procedures are indexed using a check mark and an index number enclos
10. Part Number Designation Number 9 iiv22 00001 A 1 CHASSIS BECK PLATE 4390 1172250060601 2200 8153 2 4 SCREW MACH 4 40 S875 IN L6G PAN HDPE E 805040 ORDER BY DESCRIPTILUN 2250 9009 3 a NUT HEX U LKVUR 4 48 THD PAIN THE 0009 ORDER EY DESCRIPTION 11722 40281 7 t SENSOR MODULE TOP COVER hati a 11722 40801 524 0355 2 2 SORER TPD 4 20 3759 XN Li PAN HP P Hi 29006 ORDER BY DESCRIPTION Har 5 e SCOREW TPG 4 20 187 IN L6 PAN MD UOUZI 000090 ORDER EY DESCRIPTION 7121 2975 2 1 SENSOR MODULE LABEL ID 29480 7191 8976 11722 48002 i Bf 1 SENSOR MODULE BOTTOM COVER i 2840 11722 40002 7121 2300 2 1 LABEL INFORMAT TON 24080 7121 2309 7121 2514 0 1 LAREL PROTECTIVE COVER 47 6 MM UD 2904980 7121 2514 11722 20805 D i CABLE BRACKET TOP 28431 1172220094 3030 0603 7 1 SEREU BET 2 56 188 IN LG SMALL CUP PT 60900 ORDER EY DESCRIPTION 11722 20007 1 CABLE ERACKET HOTTON 284238 11722 26007 30230 00923 3 SEREW SKT HD CAP 2 56 625 IN L65 ALY STL 23489 30630 0057 2190 0045 3 WASHER LK HL CL NO 2 08 IN ID 284680 2190 0047 11722 40693 19 CABLE CLIPS NYLON 284809 11722 4009 11722 20005 1 CARLE SEMIRIGID A1 FO RE FLEX CABLE 20409 11722 29005 11722 60007 1 CARLE SEMIRIGED RF PLE 28400 11722 66007 11722 20801 i CABLE SEMIRIGID Al TO 1 49 4 11792 29001 11722 28002 1 CARLE SEMIRIGID ATi TG 62 E S348 11722 20067 11722 60801 i CABLE SEMIRIGID SENSOR CABLE E 05400 11722750001 See introduction to this section for ordering
11. and 9 through S1 and the slotted holes in MP1 Connect and tighten the lock nut on bolt 9 Connect termi nal lug 7 to screw 8 Connect and tighten the lock nut so the terminal lug is parallel to the side of MP1 The nut attaches to the plate side Pass W3 through the cut out in the deck plate and connect W3 to 2 Connect Attenuator AT1 to W3 Connect W4 to ATI so that WAP2 is turned to ward the power sensor mounting bracket on MP1 Pass W1 through the cut out in the deck plate and position it so that it passes between ATI and WAP2 Connect CPI to Jl and tighten Note that if J1 has been disassembled a conductive epoxy adhe sive such as HP part number 0470 0015 should be applied to the connection between the RF con nector contact J1MP2 and the contact jack JIMP4 See Figure 6 Sensor Module Exploded View Pass CP1 and 11 through the mounting hole in the deck plate and place lock washer J1IMP7 and hex nut JIMP8 over JIMP6 Connect and tighten CP1 to S1J1 Tighten hex nut J1MP8 and lock washer MP against the deck plate Connect W1 to 143 13 Sensor Module 1l 12 13 14 15 16 L5 18 19 14 In the following procedure when connect ing the power sensor to W4 rotate only the knurled connector nut on the bulkhead as sembly Rotating the power sensor body when the input is connected may damage the thermocouples Connect power sensor A
12. or error free LIMITATION OF WARRANTY The foregoing warranty shall not apply to defects resulting from improper or inadequate maintenance by Buyer Buyer supplied software or interfacing unauthorized modification or misuse operation outside of the environmental specifications for the product or improper site preparation or maintenance NO OTHER WARRANTY IS EXPRESSED OR IMPLIED HP SPECIFICALLY DISCLAIMS THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE EXCLUSIVE REMEDIES THE REMEDIES PROVIDED HEREIN ARE BUYER S SOLE AND EXCLUSIVE REMEDIES HP SHALL NOT BE LIABLE FOR ANY DIRECT INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES WHETHER BASED ON CONTRACT TORT OR ANY OTHER LEGAL THEORY ASSISTANCE Product maintenance agreements and other customer assistance agreements are available for Hewlett Packard products For any assistance contact your nearest Hewlett Packard Sales and Service Office Addresses are provided at the back of this manual SERIAL NUMBERS This manual applies directly to instruments with serial numbers prefixed 23204 For additional important information about serial numbers refer to Instruments Covered by Manual in Section I OHEWLETT PACKARD COMPANY 1983 EAST 24001 MISSION AVENUE TAF C 34 SPOKANE WASHINGTON U S A 99220 Operating Service Manual Part No 11722 90009 Operating amp Service Manual Microfiche Part No 11722 90004 Printed OCTOBER 1983
13. through path The connection to pin B switches S1 to the sensor path Connect a high impedance de coupled oscilloscope alternately to pin 1 green wire and to pin 2 blue wire of S1 For each connection toggle S1 several times as described in step 1 When pin B of W5P2 is grounded pin 1 of Si should go from OV to ap proximately 15V When pin B of W5P2 is ground ed pin 1 of 51 should remain at 0V The signal at pin 2 should be opposite to the signal at pin 1 Hint If the control voltages are correct but S1 fails to switch the solenoid switch contacts may need cleaning Refer to paragraph 27 for a contact cleaning procedure Check the insertion loss of the switch RF cables and attenuator with a signal source and level measuring device such as a power meter or oscillo scope If possible check the insertion loss from 100 kHz to 2 6 GHz Disassemble the Sensor Mod ule as necessary to perform this check The switch Model 11722A and semi rigid cables should have an insertion loss of 0 05dB or less The flexible RF cable W2 should have an insertion loss of 1 5 dB or less at 1 3 GHz The attenuator ATI should have an in sertion loss between 9 and 11 dB The following table charts the RF path as a function of the pin on S1 to which 15V is applied 15V Applied RFPah W5P2 pin 1 1 CP1 S1J1 C to S1J2 1 W3 AT1 W4 1 d 2 W5P2 pin 2 Ji CP1 S1
14. 1 HP 8902A HP 435A HP 436A A53TP1 A4TP4 A2TPAC 18 REPLACEABLE PARTS Table 5 lists all replaceable parts in alphanumeric order by reference designator Table 6 contains the names and addresses that correspond to the manufac turer s code numbers 19 Replaceable Parts List Table 5 Replaceable Parts is organized as follows a Electrical assemblies and their components in al phanumeric order by reference designation b Chassis mounted parts and mechanical parts in al phanumeric order by reference designation Sensor Module The following information is provided for each part a The Hewlett Packard part number b Part number check digit CD c The total quantity Qty is provided on the first entry of the part number d The description of the part e typical manufacturer of the part in a five digit code f The manufacturer s number for the part 20 Parts List Updating Change Sheet Production changes to the instrument made after the publication date of this manual are denoted by a change in the serial number prefix Changes to the parts list are recorded by serial prefix on a Manual Changes supplement Also errors in the manual are noted in the Errata portion of the Manual Changes supplement 21 Hlustrated Paris Breakdowns The components that compose the Sensor Module are illustrated in the component locations diagrams in Service Sheet 1 and in the exploded view di
15. 11722A Wo vene 4 MP1 ONTACT CONTACT CONTACT NAE R2 2 P Mee Nu 0 E 1 5112 141 143 igure 3 Sensor Module Component Locations Model 11722A A1A2 ATG A1C2 EZ FERRITE BEADS BENEATH MP25 C8 ON CIRCUIT SIDE Figure 4 Al Power Sensor Component Locations NOTES I UNLESS OTHERWISE INDICATED RESISTANCE IN OHMS CAPACITANCE IN FARADS 2 ALA BULKHEAD ASSEMBLY AND ATi ATTENUATOR NOT FIELD REPATRABLE AIA2UI TOP VIEW 00 0 O 9 o 2 o O 6 5 4 Aldi MATING SIDE 3 5 Ooo HIO OM OAD 5 O LO Oo o K 8 f 0 ZO CAUTION DO NOT FORCE LARGE DIAMETER TEST PRODS INTO THE PIN RECEPTACLES OF Ji THIS MAY PERMANENTLY DEFORid THE RECEPTACLES Li WDASDUT DIPDUIYIS 2111001 4osuag ang NOM HOSN3S 17 HiVd 45 HOSN AS 7108730 d Le ACO8 HOLIANNOS HOLY INA ONS 1 i wie aa S PE q I f GNNOYO l i SISSVH EN i i f n pt tL nap ni 0 2 62 99 asa ort HOISTS 802035 0780332 8035 i Tip 830 20 i cf 8 0001 K on CI 000 z s 99 O 08 i 9 2 31080 335 G0009 224 11 L YOLYNN
16. 6 31148 RESISTOR 316 1 OW F TO 04 100 RESIOTOR IK 1 POW F TO be 100 IG TO 8 PKG ALA MISCELLANEOUS THREADED INSGERT NUT 6 80 06 IN L CH PPER SPACER MOD CONNECTOR ASSEMELY 12 PIN GROUND CLIP RESISTOR 1 62K IA 09W F TZCZ 0 10 ATTENUATOR COAXTAL 10 DE CHASSIS PARTS ADAPTER COAX STR M SMA Mo SMA LOCK WASHER AND NUT NETRE CONN SERIES APC N GET RING RF CONNECTOR SERIES Ni 731 CONTACT RFP CONN SER aPC N HALE INSULATOR CONTACT JACK INGULATOR TEFLON BODY EIH KHEAD WASHER LK INTL T 7 15 IN 439 INM 1 1 1 1 1 E 1 1 SWITCH ASSEMBLY COAXIAL TERMINAL STUD DBL TUR PRESS HMTG TERMINAL BUSHING TEFLON MOUNTS PO DIODE PUR RECT APOY 750MA D 41 DIODE PWR RECT A00U 75054 D0 41 D WIRE 24AWG BK 300U PVC 737 7 TERMINAL SLDR LUG LK MTG FOR 4 S WERE 24AWG Ei 60 PUC 7X32 17 WIRE 24AWG E X00U PYC 7X32 BOC RF CONNECTOR AGGEMELY TYPE NCOINC HOV CER aay CER SST 382 R RT 512 T 300 AG T 306 CER CER EN CER CER EN RESISTOR SALK 1X 12538 F TO 0 109 RESISTOR 3 16K 1 OFW F TCO 08 100 RESISTOR 31 6 DA DSW PWW TO0 5040 250 E SST D LIDE S cD DONNECTOR RFE APC N H UNMTD 50 OHM ED NUT HEX DBE CHAM 7 16 28 THD 0 4 IN THK iN 20480 23480 20480 20400 00006 20400 00800 0 0 2604460 284830 00000 24489 24480 214489 28480 20480 20006 20480 29480 28480 naang 23480 1739 51959 20486 240 28480
17. Disconnect control wires 5 and 6 from switch S1 at terminals 1 and 2 Disconnect W4 from Attenuator AT1 by turning the attenuator nut counterclockwise Disconnect ATI from W3 by turning the nut on W3 counterclockwise Disconnect W3 from S1 Unscrew hex nut J1MP8 from RF connector J1 See Figure 6 Disconnect CP1 from Sl and remove CPI and J1 from the assembly Note that if J1 must be disas sembled a conductive epoxy adhesive HP part number 0470 0015 has been applied to the con nection between the RF connector contact of JiMP2 and the contact of JIMP4 Disconnect W1 from S1 5 Remove Sl from deck plate MP1 by removing bolts 8 and 9 from their respective nuts Sensor Module Reassembiy Procedure CAUTION When any RF connections within the Sen sor Module are disconnected the module should be recalibrated to assure measure ment accuracy 10 Sensor Module Take care to align the inner conductor con tacts when mating RF connectors Tighten SMA connectors to 0 8 to 1 1 Nem 7 to 10 in lbs NOTE When assembling the module do not tighten any cable connections until all ca bles have been connected except where otherwise indicated Place chassis deck plate MP1 against the back of switch Si Position the deck plate so that the mounting hole of RF connector 1 is in line with S1J1 the center input port of S1 See Service Sheet A Connect 81 to MP1 by inserting bolts 8
18. ILLY men r g A i zHOZZ 635 POL N s314no20Wmu3Hi A I Nen BEIAT INANI 3 0 8 ZHOEE Eg 0 YOSN3S ZHOZZ CERN SUN IS f j in EP HIVE LIN NL 2199 NITdAVS i 1 po a Ms i B bad i f i Hi d 351 TOMINOO Hid HONOUHL ATBNISSV 2 ALON 33 11 31 AAT LAdNI RIVE 20917 3 ING 7 Gu 90009 22211 Le a ee LE TE LI RRT _ Qi Y0009 33411 3557 HOSNIS YIMOd IV HOLIMS 18 PT HIVd o HONOWH L HIE HONGNHL u ZdZ eh 9311201 6 Sensor Module 18 1 DETAIL A Figure 6 Sensor Module Exploded ven View Model 11722A 07 Model 117224 2237400155 MADE IN USA 3 17 A1C2 12 26 27 28 A1A2 A101 1 23 22 21 20 18 A1C2 Figure 7 AI Power Sensor Part Locations 61 9110017 55 SUOIIDIOT MUD 3111001 LOSUIS TY g ainsig 311110111011100 un 1 1 1 veen DEED BI EE mer NIIS EH DEET TEE E DM werten 5 C RE OTTEN oo T enten ermm A nn Tann vette en tete d et a CN Ge K L
19. J1 C to S1J3 2 W1 02 Hint For fault isolation the continuity of the RF contacts of the switch as well as the center conduc tors of the RF cables can be checked with a conti nuity checker or ohmmeter v2 Power Sensor Check CAUTION Be careful when measuring across the gold wires They are delicate and easily damaged The field effect transistors FETS in 41421 are sensitive to electrostatic dis charge To avoid damage use anti static precautions when handling Ul Also note that the FETs are light sensitive Light will not damage them but dc levels will shift slightly when the FETs are exposed 1 Disassemble the Sensor Module so that an RF sig nal source can be connected to the input of the Power Sensor Set the signal generator to 50 MHz CW at 20 dBm Connect the generator s output to the input of the Power Sensor Do not connect the Sen sor Module s multiconductor sensor cable to any thing at this time Connect a high impedance de coupied oscilloscope to pin 1 of 1 2111 The voltage should be between 9 and 15 mVdc and should drop to OV if the RE is switched off Hint If the signal level is incorrect switch the RF off and carefully measure the de resistance of the thermocouples A1AITC1 by measuring the resist Sensor Module ance between pin 1 of A142U1 and chassis ground The resistance value should be between 232 50 and 257 59 Connect the Sensor Module s multicond
20. USA Hewlett Packard Co 2000 South Park Place P O Box 105005 ATLANTA GA 30348 Tel 404 955 1500 WESTERN USA Hewlett Packard Co 3939 Lankershim Blvd P O Box 3919 LOS ANGELES CA 91604 Tel 213 506 3700 CANADA Hewlett Packard Canada Ltd 6877 Goreway Drive MISSISSAUGA Ontario L4V 8 Tel 416 678 9430 Telex 610 492 4246 2 86 HP Part No 11722 90009 Printed in U S A
21. agram in Figure 6 22 Ordering Information To order a part listed in the replaceable parts table include the Hewlett Packard part number with the check digit and the quantity required Address the order to the nearest Hewlett Packard office The check digit will ensure accurate and timely processing of your order To order a part that is not listed in the replaceable parts table include the instrument model number in strument serial number description and function of the part and the quantity of parts required Address the order to the nearest Hewlett Packard office Sensor Module Reference Designation A1HP3 A1MP4 6 AIMP AMP 8 AIMP 1 18 5151 A142 221 ALARGA 3 ATARCS 816 L A1A2C7 414200 7 Ain2618 A16291 17 1 ALARRS AAR 4 ATASRTI ALAR Ai 1 AtJiRi ATi JiHBPI J1MP2 JEMPS JiMPA IMP J MP amp J1MP7 TIMPR 51 81 SCRA 141 GIW 51443 HP Part Number 11722 60804 0168 3772 0166 5772 08481 28015 2030 0422 88481 20011 3030 0422 3030 0436 2190 0049 3030 0333 0480 1282 08481 20608 1440 1224 1251 3363 00481 60902 08481 00002 3830 0436 3940 6937 5040 4940 02462 60014 013 482 02 55 0196 0305 0160 4306 0160 4306 8140 0594 0169 3094 9160 3879 0150 4506 0160 4305 0180 59 8190 2343 1854 6418 1757 0483 0678 7248 06598 7224 0698 7236 8811 3210 1613 0040 0590 1040 3040
22. container FRAGILE to assure careful the switch assembly that are not common handling In any correspondence refer to the instru to other power sensor cables ment by model number and serial number Sensor Module Other Packaging The following general instructions should be used for repackaging with commercially available materials a Wrap the instrument in heavy paper or plastic If shipping to a Hewlett Packard office or service cen ter attach a tag indicating the service required re turn address model number and full serial number b Use a strong shipping container A double wall car ton made of 2 4 MPa 350 psi test material is adequate c Use enough shock absorbing material 75 to 100 mm layer 3 to 4 in around all sides of the in strument to provide firm cushion and prevent movement in the container d Seal the shipping container securely e Mark the shipping container FRAGILE to ensure careful handling 10 OPERATION 11 Environment The operating environment for the Power Sensor should be as follows a Temperature 0 to 55 C 32 to 131 F b Relative Humidity less than 95 C Altitude less than 4600 metres 15 000 feet 12 Operating Precautions Before the Sensor Module is connected the following precautions must be observed BEFORE CONNECTING THE SENSOR MODULE TO ANOTHER INSTRU MENT ensure that the instrument and power meter are connected to the protec tive earth ground
23. cy Range 100 kHz to 2 6 GHz Sensor Module in addition to change information the supplement may contain information for correcting errors in the manual To keep this manual as current and accurate as possible Hewlett Packard recommends that you periodically request the latest Manual Changes sup plement The supplement is identified with the man ual print date and part number that appear on the title page Complimentary copies of the supplement are available on request from your nearest Hewlett Packard office For information concerning a serial prefix not listed on the title page or in the Manual Changes supple ment contact your nearest Hewlett Packard office 4 Description The HP Model 11722A Sensor Module is essentially an RF power sensor with an RF switch at its input The RF input to the Sensor Module can be remotely switched between its power sensor and a through path RF cable The power sensor is used to measure the av erage power from an external RF source In use the Sensor Module input is connected to an RF source The Sensor Module s two output cables are connected to a compatible power measuring instru ment such as the HP 8901B Modulation Analyzer or HP 89024 Measuring Receiver The power sensor input is a 500 load to the RF source The power mea suring instrument indicates the power dissipated in this load ifications Conditions 4 to 2 20 to 30 dBm Input SWR Sensor Module connected to a
24. ed in a hexagon for exam ple A1A2 PUT AMPLIEI E H rea ASSEMBLY SAMPLED AC INPUT 220 Hz C8 gt cg C10 i 1 RTI i R4 POWER SENSOR CABLE Sensor Module NOTE When any RF connections within the Sen sor Module are disconnected the module should be recalibrated to assure measure ment accuracy Equipment Multimeter km Reds HP 3455A OSCIHOSEODE Load e oe HP 1740A Power Measuring Instrument HP 8902A 8901B 438A 436A 435A or 435B Power Sunbird HP 6214A Signal Generator EE HP 8640B Vla Switch and Cables Check Using HP 89018 or 8902A NOTE This procedure checks the integrity of the switch If a problem is found in the RF por tion of the switch do not attempt a repair To assure the RF performance of the switch either replace the switch or send it to a Hewlett Packard office for repatr This procedure requires specifically an HP 8901B or 89024 If neither of these instru ments is available the switch can be checked using a 15V power supply 7 to below ams POWER MEASURING INSTRUMENT sem 15 VDC OUTPUT SHAPING lt NETWORK 15 VDE Figure 2 Simplified Operational Amplifier Sensor Module 1 Connect the Sensor Module s multiconductor sen 10 sor cable to an HP 8901B Modulation Analyzer or HP 8902 Measuring Receiver Switch the 11 or 8902A several times be
25. ent recommended to check adjust and troubleshoot the Sensor Module The Critical Specifications column describes the es sential requirements for each piece of test equipment If substitute equipment is used it must meet or exceed the critical specifications 6 INSTALLATION CAUTION 1 To prevent physical damage to the Sensor Module or device under test DUT pay careful attention to the mechanical setup The mechanical design of the Sensor Mod ule minimizes SWR However the weight and length of the module combined with the stiffness of the interconnect cables en ables the exertion of considerable leverage at the module s input connector To pre vent physical damage to the Sensor Mod ule the DUT and the mating connectors and to assure best electrical performance observe the following precautions 1 Do not permit the interconnect cables of the Sensor Module to extend out where anyone passing by could accidentally push and exert leverage on the cables This con sideration is especially important when the DUT is a light weight instrument that sits freely on a table 2 When possible lay the Sensor Module on a supportive surface This consideration is expecially important when rigid RF adapters are used to directly interconnect the Sensor Module to the DUT RF adapt ers lengthen the leverage arm of the Sensor Module and are often flimsy When level accuracy requirements permit use flexible cables to interconnec
26. es connecting the 181 Bulk head Assembly and the AlA2 Input Ampli Rer Assembly are extremely delicate and may be easily brohen Be careful when working around the gold wires Model 11722A Place printed circuit board A142 and connector A1Jl into the bottom cover See Figure 6 Sen sor Module Exploded View 2 Insert but do not tighten cap screws 21 22 24 25 27 and 28 See Service Sheet A Center the circuit board so there is equal distance between each side and the bottom cover Tighten screws 21 22 27 and 28 With small hole 12 below A1C2 carefully insert the gold leads from bulkhead assembly A1A1 through the holes of the plastic guide on the A1A2 input amplifier Insert and tighten screw 19 Position the ends of the gold wires over the pads on A1A2U1 The wires should not pass over the 10 11 Sensor 6 hole in the pad Lightly clamp the leads in place with spring clamp cap screw 20 and the small plastic cover DO NOT fully compress the spring Solder the white black blue wire 906 to A1C1 and the white brown green wire 915 to A1C2 Place the top cover in position oriented identi cally to the bottom cover and insert cap screws 17 18 23 and 26 Tighten 17 and 18 Tighten 23 24 25 and 26 Replace the magnetic shields around the power sensor body and secure with tape Orient the shields with the serial number on the top cover 15 ensor Module Model
27. information Indicates factory selected value Table 6 Code List of Manufacturers Code Manufacturer Name Address Zip Code 94008 ANY SATISFACTORY SUPPLIER MANCHESTER NH 03130 14140 EDISON ELEK DIV MCCRAU EDISUN BRADFORD PA 107 t1 24346 3 CORNING GLASS WORKS BRADFORD PALO ALTO C 942804 254890 f HEWLETT PACKARD CO CORPORATE HO SAN DIEGO Ca 92138 51959 VICLAN ING BERMAD TEN AER 910749 BMPHENOL SALES DIU GF BUNKER NAMO 23 SERVICE mended Test Equipment may be used in DAS place of the recommended instruments for d CAUTION troubleshooting the Sensor Module Refer to the Caution in paragraph 6 In stallation that is concerned with the con nection of the Sensor Module to other Service Sheet 1 component locations dia grams and Figure 6 Sensor Module Ex oN ak ploded View show the locations of the NOTE assemblies and mechantcal parts Service Sheet 1 schematic also shows the sche Test equipment which meets or exceeds the matie diagram Service Sheet A provides critical specifications in Table 4 Recom disassembly procedures Sensor Module 24 Principies of Operation 51 Switch The S1 Switch is a 500 low SWR edge line type It is used at the input of the Sensor Module to switch the RF path between the power sensor cir cuitry and a through path cable See Figure 1 Sim plified Block Diagram Control lines from the measuring ins
28. l to W4 Mount the Power Sensor onto the deck plate with allen screws 10 and 11 Include one lock washer and 1 flat washer with each screw Mount Al so that small hole 12 is below A1C2 Tighten screws 10 and 11 and tighten A1A1 to WA In the following procedure avoid applying excessive heat to feedthrough capacitors AICI and C2 or to the terminals on switch SI when soldering control wires Solder control wire 5 to A1C2 and terminal 2 on S1 Solder control wire 6 to A1C1 and terminal 1 on SI Solder ground wire 0 to the center drive terminal on S1 and ground lug 7 Connect sensor cable W5 to Al and tighten Connect RF flex cable W2 to Wi and tighten Tighten all cable connections W1 to S1J3 W3 to S1J2 AT1 to WA and W3 to ATI Connect cable brackets MP4 and MP5 around ca bles W2 and W5 Rotate the strain relief on W2 so that the side cut away is flush against the strain relief on W5 Tighten screws 14 15 and 16 and set screw 13 One lock washer should be in serted with each of screws 14 15 and 16 Insert the module assembly in plastic top cover MP2 Position the assembly so that the top half of cable bracket MP4 slides into the slot at the back of the cover Connect deck plate MP1 to the top cover with screws 3 and 4 Connect plastic bottom cover MP3 to the assem bly with the remaining four screws The two self tapping nickel screws screw into the bottom of the bottom cover Model 2 Disassemble the Po
29. n HP 8901B or Reflection Coefficient HP 8902A RF Power Tuned RF Level RF range 1 and 2 RF range 3 RF range 3 with Special Function 1 9 10 dB RF and RF amplifier inserted ihe ranges referred to are the RF ranges of the 8902A Sensor Module Table 2 Supplemental Characteristics Supplemental characteristics are typical but non warranted performance parameters They are only in tended to provide information which can be useful in determining instrument application RE INPUT Maximum Average Power 1 100 Waar OF 300W uS per pulse Maximum Peak Power input Impedance 502 nominal PHYSICAL CHARACTERISTICS Module Dimensions Depth overall 203 mm 8 in Height overall 51 mm 2 in Width overall 62 mm 2 5 in Weight 0 8 kg 1 75 ib Cable lengths RF cable Sensor cable 1730 mm 68 2 in 1707 mm 67 2 in The Sensor Module accurately measures power levels from 20 to 30 dBm 10 uW to 1W at frequencies from 100 kHz to 2 6 GHz Calibration factor Cal Factor data is provided on a label attached to the Sensor Module s bottom cover Worst case uncertainties of the Cal Factor data are listed in Table 3 Table 3 Uncertainty of Calibration Factor Data Root Sum of Worst Case Pre the Squares Uncertainty Wa Model 117224 5 Recommended Test Equipment Table 4 lists the test equipm
30. n factors have been individually deter mined to compensate for the response of the power sensing device within each module Refer to the measuring instrument s operating and service manual for specific calibration instructions Note however that the Operating Precautions de scribed previously must be observed 16 SWR Reflection Coefficient Performance Test The reflection coefficients for the Sensor Module are listed in the Specifications table For checking these measurements use the instruments recommended in Table 4 HP 8902A 8901B 438A 486A 435A or 435B or equipment which has measurement uncer tainties not exceeding those shown in Table 3 Uncer tainty of Calibration Factor Data Refer to each instrument s operating and service manual for the ap propriate performance tests Model 117224 17 ADJUSTMENTS FET Balance Adjustment The sampling gate balance 18 affected by the relative positions of the wires in the Sensor Module which connect to pins G and H of connector A1J1 See Service Sheet 1 One wire is black white 90 and the other is brown white 91 Once positioned care must be taken to maintain the placement of these wires To correctiy position these wires connect an oscillo scope to the following test point and move the wires until the displayed switching transient amplitude is less than the value shown Instrument Test 9 Switching Transient Model Point Amplitude Vpp HP 89018 A53TP
31. nd solder Discard the capacitors if unsoldered Replacing inte grated circuit A1A2U1 or transistor ALA2Q1 requires removing two of these capacitors and replacing them with new ones Use the following low temperature sol dering iron and solder a Hexacon Thermo O Trac soldering iron with J206X tip temperature 310 C 600 F b Low temperature solder Sn 62 HP part number 5090 0410 27 Cleaning the Control Line Contacts of S1 1 Remove 51 from the Sensor Module 2 Remove the two screws on the cover of S1 and re move the cover See Figure 3 Sensor Module Component Locations in Service Sheet 1 3 Saturate the edge of a sheet of durable paper with alcohol Do not allow the alcohol to run inside the switch assembly 12 Model 11722A 4 Insert the paper under one of the contacts and while pressing gently on the contact slide the paper through Do this several times and repeat for the other contact Do not allow the paper to shred 5 Saturate the edge of another sheet of paper with a freon type degreaser and repeat step 4 6 Remove any shreds of paper that may have lodged in the contacts 7 Reinstall the cover Note the orientation of the feedthrough terminals on the cover with respect to the switch contacts 28 Sensor Module Disassembly Procedure CAUTION When any RF connections within the Sen sor Module are disconnected the module should be recalibrated to assure measure ment accuracy af
32. ss between 9 and 11 dB The following table charts the RF path as a func tion of measurement mode RF Path J1 CP1 S1J1 C to S1J2 1 W3 ATI W4 ATA J1 CP1 S1J1 C to 5113 2 Wi W2 Measurement Mode RF Power Frequency Hint For fault isolation the continuity of the RF contacts of the switch as well as the center conductors of the RF cables can be checked with a continuity checker or ohmmeter Model 11722A Switch and Cables Check Using a Power Supply NOTE This procedure checks the integrity of the switch If a problem is found in the RF por tion of the switch do not attempt a repair To assure the RF performance of the switch either replace the switch or send it to a Hewlett Packard office for repair This procedure uses a 15V power supply to toggle the switch Follow when the measuring instrument with which the Sensor Module is normally used is available 1 Disconnect the Sensor Module from all other in struments Connect the lead of a 15V power sup ply to the connector body of W5P2 Connect the lead of the supply alternately to pin A and to pin B of W5P2 See Service Sheet 1 NOTES for pin locations The Sensor Module s RF switch should click each time the connection is moved to the other pin If this switching is audible continue with step 3 NOTE SI will not switch into a position it is in already Hint The connection to pin A switches S1 to the
33. t the Sensor Module to the DUT 3 Do not bend or coil the interconnect ca bles more than necessary to a diameter circumscribing less than 150 mm 6 in This precaution often applies when the in struments are rack mounted and intercon nected to rear panel connectors Repeated flexing of coiled interconnect cables can degrade SWR and increase RFI of the through path interconnect cable 4 Do not attempt to tighten the type N connector by twisting the body of the Sen sor Module Model 11722A Sensor Module Table 4 Recomended Test Equipment Instrument Type instrument Type Multimeter DVM Critical Specifications Suggested Model user Ohmmeter Range 10 to 100 kQ Accuracy 5 HP 42 Voltmeter Range 100 mVdc to 100 6 Input impedance 10 MQ Resolution 4 digit Accuracy 0 05 1 digit Bandwidth dc to 50 MHz Vertical Sensitivity 0 2V div Horizontal Sensitivity 1 ms div Oscilloscope HP 1740A A T Divider Probe 10 1 DC Power Supply Power Measurement Instrument input Impedance 10 MO HP 10004D 10 pF HP 6214A HP 8902A or HP 8901B or HP 438A or HP 436A or HP 435A or HP 435B HP 8640B Range 0 to 15 06 Reflection Coefficient gt to those shown in Table 1 Range 100 kHz to 2900 MHz 20 to lt 30 dBm Signal Source P Performance Tests A Adjustments T Troubleshooting
34. ter reassembly An individually prepared table of calibra tion factors is attached If more than one Sensor Module is disassembled be sure to match the proper cover with each module when it is reassembled 1 Remove four screws and plastic bottom cover MP3 from module assembly See Figure 6 Sensor Mod ule Exploded View 2 Remove plastic top cover MP2 by disconnecting screws 3 and 4 See Service Sheet A Disassembly Procedures 3 Loosen set screw 13 and remove screws 14 15 and 16 and their lock washers to remove cable brack ets MP4 and MP5 4 Disconnect RF flex cable W2 from Wi 7 turning the nut on W2 counterclockwise 5 Disconnect sensor cable W5 from Power Sensor Al 6 Disconnect Al from deck plate MP1 by removing allen screws 10 and 11 and their respective lock and flat washers Model 11722A d 8 9 10 1 12 14 29 CAUTION In the following procedure when discon necting the Power Sensor from W4 rotate only the knurled connector nut on bulk head assembly AIAI Rotating the power sensor body when the input is connected may damage the thermocouples Disconnect Power Sensor Al from W4 If Al must be disassembled refer to the Power Sensor Disassembly Procedure in paragraph 30 CAUTION In the following procedure avoid applying excessive heat to feedthrough capac tors AICI and C2 or to the terminals on switch S1 when desoldering control wires
35. trument such as the HP 8901B or HP 8902A to the switch enable the measuring instrument to remotely select the RF path through the Sensor Module The switch assembly has a pivoting armature which toggles two single throw double pole switches See Service Sheet 1 schematic The armature is actuated by one of two latching solenoids SIK1 or SIK2 As the armature pivots it first opens the connection be tween the common input port S1J1 and the output port either S1J2 or S1J3 and then closes the con tacts between the common input port and the other output port resulting in a break before make se quence In the same motion the armature opens the ground return to the energized solenoid and closes the ground path to the unenergized solenoid This action interrupts the current to the energized solenoid and enables the unenergized solenoid when the armature is thrown Permanent magnets latch the solenoid once it has been thrown To energize the unlatched solenoid 5 Vdc is applied to its coll The two solenoid drive lines come from the measuring instrument via two interconnecting control lines either wire 5 or 6 The source for the control line for each latching solenoid is contained within the sensor cable W5 The two control lines enter the Al Power Sensor Assembly at AlJ1 pass through feedthrough capacitors AlC1 and C2 mounted in the A1A1 Bulkhead Assembly then exit the power sensor to continue to the switch assembly where the
36. tween the RF power and frequency measurement modes The Sensor Mod ule s RF switch should click each time the measur ing instrument is switched between the two measurement modes If the switching is audible continue with step 3 Connect a high impedance de coupled oscilloscope alternately to pin 1 green wire and pin 2 blue wire of S1 For each connection toggle 81 several times as described in step 1 When switching into RF power pin 1 should go from OV to approxi mately 14V for 10 to 30 ms then decay to OV ap proximately 100 ms later When switching out of RF power pin 1 should remain at OV The signal at pin 2 should be the opposite of the signal at pin 1 Hint Faulty switch control voltages may be due to a fault in the 8901B or 8902A If the control volt ages are correct but 51 fails to switch the solenoid switch contacts may need cleaning Refer to para graph 27 for a contact cleaning procedure Check the insertion loss of the switch RF cables and attenuator with a signal source and level mea suring device such as a power meter or oscilloscope If possible check the insertion loss over the range 100 kHz to 2 6 GHz Disassemble the Sensor Module as necessary to perform this check The switch and semi rigid cables should have an insertion loss of 0 05 dB or less The flex ible RF cable W2 should have an insertion loss of 1 5 dB or less at 1 3 GHz The attenuator ATI should have an insertion lo
37. uctor sensor cable to a power measuring instrument Connect a high impedance de coupled oscilloscope to an end of the white black 90 wire that connects to the main printed circuit board Also connect the white brown 91 wire to the oscilloscope For each case the waveform should be a squarewave with a low amplitude of 0V and a high amplitude between 10 and 11V with a period between 4 2 and 4 9 ms Hint If the waveform 18 faulty the power measur ing instrument or interconnection is probably at fault Measure the collector voltage of A1A2Q1 by con necting the oscilloscope to the can of the transistor The voltage should measure between 100 and 40 mVde Hint If the voltage is incorrect the measuring in strument or interconnection may be at fault The fault may also be due to the Sampling Gate which is checked beginning with step 6 Remove the RF and interconnecting cables from the Power Sensor Measure the resistance between pins 1 and 2 and between pins 8 and 9 of A1A2UI1 For each mea surement the resistance should be between 14 250 and 15 750 Short pins 4 6 and 9 of ALA2U1 Measure the re sistance between pins 2 and 3 and between pins 3 and 8 of A1A2UI For each measurement the re sistance should be less than 40Q 9 Remove the short to pin 9 of A1A2U1 leave the short between pins 4 and 6 Set the power supply to 10V Connect the lead to pin 9 of 1 sensor s ground regulator line
38. wer Sensor in the se quence described below to prevent damage to the two gold wires between the A1A1 Bulkhead Assembly and the A1A2 Input Amplifier Assembly If these wires are damaged the AIA Bulkhead Assembly must be returned to Hewlett Packard for repair The gold wires connecting the A1A1 Bulk head Assembly and the AIA2 Input Ampli fier Assembly are extremely delicate and may be easily broken Be careful when working around the gold wires Remove the Power Sensor from the Sensor Module and orient the power sensor as shown in Figure 7 Al Power Sensor Part Locations of Service Sheet A Refer to Sensor Module Disassembly Procedure in paragraph 28 Remove the magnetic shields from around the power sensor body by unpealing the tape which binds them The tape can be reused Remove allen cap screws 17 18 23 and 26 Loosen screws 24 and 25 Remove the top cover from the power sensor Desolder the wires from AIC1 and C2 Remove spring clamp cap screw 20 and the plastic cover to free the gold leads which come from A1A1 Bulkhead Assembly Remove cap screw 19 Slide Bulkhead Assembly AlA1 straight out from the bottom cover Remove cap screws 21 22 24 25 27 and 28 Lift Input Amplifier AL 2 and connector A1J1 out of the bottom cover Refer to Repair that begins with paragraph 26 for handling precautions 31 Power Sensor A1 Reassembly Procedure CAUTION The gold wir
39. y connect to the drive terminals third terminal on the switch 1048 ATTENUATOR Model 11722A is connected to a ground wire to provide the common ground path for the solenoids ATi Attenuator The ATI Attenuator is a 10 dB pad placed between the switch and the input of the power sensor Attenuating the input signal by 10 dB before it is applied to the power sensor raises the sensor s measurement range by 10 dB 20 to 30 dBm Ai Power Sensor Assembly When the Sensor Mod ule is being used as a power sensing device the RF input signal is applied to the Al Power Sensor Assem bly The RF signal enters the power sensor through the AlA1 Bulkhead Assembly where it is dissipated in the thermocouples of ALAITC1 The RF signal ab sorbed by the Thermocouples generates a de voltage proportional to the RF input power Components AIA2E1 and E2 are ferrite beads placed in the block through which the wires from AlAI pass to A1A2 The beads minimize RF feedthrough to the A1A2 Input Amplifier Assembly by increasing the wire s self inductance The de output from the Bulkhead is applied to the two field effect transistors FETs in A1A2U1 These transistors form a sampling gate or chopper The sampling is controlled by a 220 Hz squarewave sup plied by the power measuring instrument via W5P2 The Sampling Gate output at pin 3 of A1A2UI is a 220 Hz squarewave with an amplitude proportional to the RF input power The output of
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