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HP RP7405/7410 User's Manual

1. nanen nonnerne 9 PCI Stot Types pas Poe a A Ba wi a eg ae eh DAs Deh Fee os 13 hp 1p7405 rp 7410 DIMMS ci wen oe is eee ed ae eee aa 32 Front Panel LEDS ise urlo ii NARA A bad ids Gade ae es 51 BPSLEDS ines ir de A AA E fies RR 52 PCT Power Supply LEDS miii ASA A A A AAA AA S aii 52 System Standby and I O Fan LEDSs o 53 SINC POS Webs aporia A et AS As 53 OLSLEDS IS A OE O a 54 OL LEDs States pane pe ta A aa a eds 54 MP Core VO LEDS 20 A A A RASS AAA ee Sas 54 EXANSCSTLEDS mr E A A a De lr tie tile 55 Front Smart Fan Assembly LED Indications ooooooo ooo ooo 69 Rear Smart Fan Assembly LED Indicati0NsS o ooo ooo ooo 71 Smart Fan Assembly LED Indications ooo ooooooo eens 73 PCI Power Module LED Indications o ooooooooorororo raro TT hp rp7405 rp7410 Field Replaceable Unit FRU List L oo 90 hp rp7405 rp7410 Server Dimensions and WeightS o ooooooooo o oo 94 hp rp7405 rp7410 Component Welghts LL 94 Power Cords ansia opa ride e ae 95 AC Power Specifications 00 ee EE T DEEL EEE DEA 96 System Power Requirements 96 Typical hp rp7405 rp7410 Configurations 98 Computer Room Environment 112 Effect of Humidity on ESD Charge Levels ooo oo o 114 Floor Loading Term Definitions LL 117 Typical Raised Floor Specificati0NsS ooo 118 vii
2. Cell Controller Processor 3 Processor 1 pr fi al AA N Fg Processor 2 A _ el Processor 0 DIMMs Each cell board can hold up to four quads or ranks of DIMMs A rank is a group of four DIMMs Each DIMM within a rank must be the same capacity The slots within each rank are numbered a b c d Install DIMMs in ascending order rack 0 1 2 and 3 It is not necessary to balance the number of DIMMs across both cell boards For Example one rank slots 0a Ob Oc and Od Valid Memory Configurations DIMMs must be loaded in sets of four at specific locations For best performance loading sets of 8 DIMMs is recommended Table 2 1 hp rp7405 rp7410 DIMMs DIMM Capacity Total Capacity Memory Component Density 512 Mbyte 16 GBytes 128 Mbit 1G Byte 32 Gbytes 256 Mbit The hp rp7405 rp7410 is capable of supporting as little as 2 Gbytes of main memory using four 512 MByte DIMMs and one cell board and as much as 32 Gbytes using all 16 DIMM slots on both cell boards with 1GB DIMMs 32 Chapter 2 Installation Unpacking the Server Different densities of main DIMMs can be mixed within a system but each set of four DIMMs must be identical A set of DIMMs is defined as the group of four DIMMs that must be loaded together on a cell board Each cell board has four sets of DIMM slots and they must be populated in order Figure 2 19 shows the order in which the DIMM slots must be populated Figure 2 19 DIMM L
3. a The temperature ranges stated are at 0 to 5 000 feet The maximum operating temperature must be de rated by 1 C 1 000 feet from 5 000 to 10 000 feet Air Conditioning System Installation All air conditioning equipment materials and installation must comply with any applicable construction codes Installation of the various components of the air conditioning system must also conform to the air conditioning equipment manufacturer s recommendations Humidity Level Maintain proper humidity levels High humidity causes galvanic actions to occur between some dissimilar metals This eventually causes a high resistance between connections leading to equipment failures High humidity can also have an adverse affect on some magnetic tapes and paper media 112 Appendix C Site Preparation Environmental Elements CAUTION Low humidity contributes to undesirably high levels of electrostatic charges This increases the electrostatic discharge ESD voltage potential ESD can cause component damage during servicing operations Paper feed problems on high speed printers are usually encountered in low humidity environments Low humidity levels are often the result of the facility heating system and occur during the cold season Most heating systems cause air to have a low humidity level unless the system has a built in humidifier Air Conditioning Ducts Use separate computer room air conditioning duct work If it is not separate from the rest
4. Table 3 3 PCI Power Supply LEDs Continued LED Driven By State Description Fault Each Supply Flash Yellow The temperature within the power supply is above the lower threshold On Yellow The temperature of the power supply is approaching the thermal limit Flash Red Power supply has shut down due to an over temperature condition a failure to regulate the power within expected limits or a current limit condition On Red Not Used Off No Faults System Standby and I O Fan LEDs There is a single three color LED on each System Standby and I O Fan Table 3 4 System Standby and I O Fan LEDs LED Driven By State Description Fan Status Fan On Green Normal Flash Yellow Predictive Failure Flash Red Failed Off No Power SINC POST LEDs The four SINC POST LEDs Green display the current state of the SINC firmware Table 3 5 SINC POST LEDs LED Driven By State Description SINC POST SINC Off 3 3V SB Off All On SINC is reset or dead 0x1 0xE SINC POST State Chapter 3 53 Troubleshooting Common Installation Problems OL LEDs Table 3 6 OL LEDs Location LED Driven By State Description Chassis Beside Cell Board Power Cell LPM On Green 3 3V SB and Cell Pwr_Good ila 3 3V SB off or 3 3V SB on and no Cell Pwr_Good Cell Attention SP via GPM Yellow See
5. 3 4 7 9 11 12 15 16 26 30 32 37 42 44 54 94 97 verifying presence 42 cell controller 7 circuit breaker 95 103 cm Command Menu command 42 co Console command 44 commands cm Command Menu 42 co Console 44 CTRL B 44 di Display 45 du display MP bus topology 42 lc LAN configuration 41 ls LAN status 41 vfp Virtual Front Panel 44 component power requirements 96 computer room safety fire protection 116 configuring LAN information 40 connecting AC 34 cooling 97 D data communications cables 109 di Display command 45 dimensions and weights 94 DIMM memory 3 7 8 9 32 33 90 removing and replacing 112 113 DIMMs 3 7 8 9 32 33 90 disk 50 63 64 84 86 113 internal 2 3 5 10 14 31 36 63 84 86 90 removing and replacing 63 64 84 86 Index du display MP bus topology command 42 ducts air conditioning 113 E electrical and environmental guidelines air distribution system 111 computer equipment grounds 106 computer room safety fire protection 116 dust and pollution contro 113 electrical conduit ground 106 grounding systems 106 lighting requirements 116 main building electrical ground 106 power distribution safety grounding 106 power panel grounds 106 power quality 104 sources of electrical disturbances 104 system installation guidelines 109 electrical specifications 95 environmental elements 110 acoustics 115 air
6. A screen similar to the following appears Figure 2 26 The du Command Screen MP CM gt DU The following MP bus devices were found sys PCI Bkpln Cells Domain 3 There will be an asterisk in the column marked MP 4 Verify that there is an asterisk for each of the cells installed in the cabinet by comparing what is in the Cells column with the cells physically located inside the cabinet Figure 5 9 shows that cells are installed in slots 0 and 1 In the cabinet there should be cells physically located in slots 0 and 1 Chapter 2 43 Installation Powering On the hp rp7405 rp7410 Server Powering On the hp rp7405 rp7410 Server After powering on the Management Processor MP 3 3 V HKP and checking that the MP detects the presence of the cell boards power up the server If using a LAN crossover cable with the laptop review server activity for each partition configured as it powers up and boots Windows can be opened for the complex and for each partition It is recommended that at least two windows be opened A window showing all activity in the complex Following the installation procedure in this manual will have a window open already on the laptop To display activity for the complex 1 If not already done open a separate Reflection 1 window and connect to the MP 2 From the MP Main Menu select the VFP command with the s option A window showing activity for a single partition To dis
7. Circuit Breaker Sizing It is always a good idea to derate power distribution systems for one or more of the following reasons e To avoid nuisance tripping from load shifts or power transients circuit protection devices should never be run above 80 of their root mean square RMS current ratings e Safety agencies derate most power connectors to 80 of their RMS current ratings Appendix C 103 Site Preparation Power Quality Power Quality This equipment is designed to operate over a wide range of voltages and frequencies It has been tested and shown to comply with EMC Specification EN50082 However damage can occur if these ranges are exceeded Severe electrical disturbances can exceed the design specifications of the equipment Sources of Electrical Disturbances Electrical disturbances sometimes called glitches affect the quality of electrical power Common sources of these disturbances are e Fluctuations occurring within the facility s distribution system e Utility service low voltage conditions such as sags or brownouts e Wide and rapid variations in input voltage levels e Wide and rapid variations in input power frequency e Electrical storms e Large inductive sources such as motors and welders e Faults in the distribution system wiring such as loose connections e Microwave radar radio or cell phone transmissions Power System Protection Computer systems can be protected from the sources of many
8. Error Comt 0 Last Error none Do you want to modify the configuration for the customer LAN Y7 N q MP CM gt NOTE The value in the IP address field has been set at the factory The customer must provide the actual LAN IP address 2 At the prompt Do you want to modify the configuration for the customer LAN enter y The current IP address is shown then the following prompt appears Do you want to modify it Y N 3 Enter y 4 Enter the new IP address The customer shall provide this address for network interface 0 5 Confirm the new address 6 Enter the MP Network name This is the host name for the customer LAN The name can be as many as 64 characters and include alpha numerics dash _ under bar period or a space It is recommended that the name be a derivative of the complex name For example Acme com_MP 7 Enter the LAN parameters for Subnet mask and Gateway address This information shall come from the customer 8 Once step 7 is completed the system will indicate the parameters have been updated and return to the MP Command Menu prompt MP CM gt 9 To check the LAN parameters and status enter the 1s command at the MP Command Menu prompt MP CM gt Chapter 2 41 Installation MP Core I O Connections 10 A screen similar to the following will appear allowing verification of the settings Figure 2 25 The ls Command Screen MP CM gt LS Current configuration of MP LAN interface
9. MAC address IP address Hostname Subnet mask Gateway Status AutoNegotiate 100 Mb s Half A none Data Rate Duplex Error Count Last Error CM gt 00 30 6e 05 09 24 15 99 83 215 Ox0f6353d7 quart z s 255 255 255 0 Oxffffff00 1 15 99 83 254 Ox0f63S3fe UP and RUNNING Enabled To return to the MP main menu enter ma To exit the MP enter x at the MP main menu Verifying Presence of the Cell Boards To perform this activity either connect to the management processor MP using a console or connect the CE Tool laptop to the RS 232 Local port on the MP After login to the MP verify that the MP detects the presence of all the cells installed in the cabinet It is important for the MP to detect the cell boards If it does not the partitions will not boot To determine if the MP detects the cell boards 1 At the MP prompt enter cm This displays the Command Menu Among other things the Command Menu allows one to view or modify the configuration and or look at utilities controlled by the MP To look at a list of the commands available enter he You may have to press Enter to see more than one screen of commands Use the Page Up and Page Down keys to view the previous or next screen of commands To exit the Help Menu enter q 2 From the command prompt MP CM gt enter du 42 Chapter 2 Installation MP Core I O Connections The du command displays the MP Bus topology
10. Partitions may be booted in any order 4 Return to the MP Main menu by typing ma from the MP Command menu 5 Exit the MP by typing co at the MP Main Menu Exiting the MP should automatically bring you to the Boot Console Handler Main menu Chapter 2 45 Installation Verifying the System Configuration using Boot Console Handler BCH Verifying the System Configuration using Boot Console Handler BCH From the BCH main menu type in to go the Information Menu Use the corresponding command from the menu to verify the type and quantity of processors memory and V O cards e PR Processors e ME Memory e IO Check the PCI Device Information to determine if the values match the devices installed in the server Once the parameters have been verified use the ma command to return to the BCH Main Menu 46 Chapter 2 Installation Booting HP UX using Boot Console Handler BCH Booting HP UX using Boot Console Handler BCH If Instant Ignition was ordered HP UX will have been installed in the factory at the Primary Path address If HP UX is at a path other than the Primary Path use the pa path command from the Configuration Menu to set boot path 1 Main Menu Enter command or Menu gt co 2 Configuration Menu gt pa pri xx xx xx 8 Configuration Menu gt ma Once the Primary Path has been set use the bo boot command from the Main Menu to boot HP UX 1 Main Menu Enter command or Menu gt bo pri 2 The following pro
11. Replacement Part Exchange Part FRU Description Number Number Assembly Front Bezel No NamePlate A6752 04066 Ballast J1479 1 per system J1479 60001 None Box DVD Filler A6752 67041 None Cable Management Arm 5065 5951 None Cable DVD Power A6752 67021 None Cable Intrusion Switch A6093 63025 None Cable Mass Storage Power 1 A6752 67019 None Cable Mass Storage Power 2 A6752 67020 None Cable PCI OLR Switch A6752 63027 None Cable SCSI Bundle A6752 63019 None Cable System Fan External A6752 67022 None Cable System Fan Internal A6752 67023 None DC to DC Converter 48V PCI VRM 0950 4352 None Filler Bulkhead Core I O A6752 04017 None Filler Internal Disk A6198 60002 None Harness Main Power A6752 67025 None Intrusion Switch 5040 6317 None Jumper PDU PDU 2 5m C19 C20 8120 6884 None Jumper UPS PDU 4 5m C19 C20 8120 6961 None Kit Removable Media Rail A6752 67011 None M Cable A6144 63001 None Nameplate rp7405 A7111 40001 Nameplate rp7410 A6752 40002 Panel PCI Upper Right Side A6752 67036 None A6752 67005 None PCA Front Panel Display PCA LAN SCSI Procurium A6794AX A6794 69001 PCA Mass Storage Backplane A6752 67003 None PCA MP SCSI Core IO A6793AX A6793 69001 PCA System Backplane A6752 60001 A6752 69001 Appendix A 91 Replaceable Parts
12. Tables viii Figures Figure 1 Declaration of Confoarmity LL xi Figure 2 Japanese REL ori onc os baa is takes Soe sea Oise ate a aes Pe ee eS xii Figure 3 Korean RFI brite ele E E adi xiii Figure 4 Taiwan Area EMCO an oa A A tt Ls xiv Fisure 5 C Tick Labels Rea o ivo da Lidi ia xvi Figure 1 1 hp rp7405 rp7410 Server front view 2 Figure 1 2 hp rp7405 rp7410 Server without front bezel o ooooooooocooooooo 3 Figure 1 3 hp rp7410 8 Way Block Diagram LL 6 Figure 1 4 Cell Controllers enire Gorla ani A I Pa 7 Figure 1 5 Cell Board ss cibi ipo ia pae an e ia 7 Figure 1 6 Memory SubsysteM ee en ee ene ee eens 8 Fig re 17 Internal Disks 905 delie eine A Fah are aa ek ke ata 10 Figure 1 8 System Backplane Block Diagram 0 cee 11 Figure 1 9 I O Subsystem Architecture LL 12 Figure 1 10 Right Front View of hp rp7405 rp7410 o oooooooooooooor oo 15 Figure 1 11 Left Rear View of hp rp7405 rp7410 eee eens 16 Figure 2 1 Removing the Polystraps and Cardboard 0 LL 19 Figure 2 2 Removing the Shipping Bolts and Plastic Cover oo ooo 20 Figure 2 3 Preparing to Roll Off the Pallet 0 o oooooooooorooooooooon oo 21 Figure 2 4 Securing the Cabinet 22 Figure 2 b RONI Liftet dodo gee Ga i e a E E FARA I 23 Figure 2 6 Server with Shipping Box Removed 0 0 o 23 Figure 2 7 Remove Cushions for L
13. 1994 A11 xvii xviii 1 Introduction The hp rp7410 is a member of Hewlett Packard s business critical computing platform family a mid range mid volume server positioned as an upgrade to the current N Class product in the PL 1X product line It provides increased performance over its predecessor but in a smaller volume Its shallower depth allows it to fit in a standard rack In addition to the hp rp7410 Hewlett Packard offers a series of cost effective servers based on the hp rp7410 with somewhat less performance See hp rp7405 Servers on page 5 Chapter 1 Introduction hp rp7405 rp7410 Overview hp rp7405 rp7410 Overview The hp rp7405 rp7410 is a 10U 8 way SMP rack mount server that accommodates up to 32 GB of memory 64 GB available at a later date PCI 4X I O and internal peripherals including disks and DVD tape Its high availability features include N 1 hot pluggable fans and power redundant power cords and hot pluggable PCI cards and internal disks It uses the PA8700 PA RISC processors Figure 1 1 hp rp7405 rp7410 Server front view 2 Chapter 1 Introduction hp rp7405 rp7410 Overview Figure 1 2 hp rp7405 rp7410 Server without front bezel Improvements over its predecessor N4000 include Better availability and up time Depth optimized shallower fewer racking issues Performance density increase Performance increase Internal removable media More internal disks Optimal power co
14. 1GB DIMM single A6098AX A6098 69001 240V N American UPS 4 5m C19 L6 30P 8120 8494 None 256MB DIMM single A6802AX A6802 69001 36GB 15K RPM SCSI Disk A6541 60001 A6541 69001 512MB DIMM single A6097AX A6097 69001 73GB 10K RPM SCSI Disk A6539 60001 A6539 69001 AC cord retention bracket A6752 00123 None AC Power Supply qty 2 per system 0950 4173 A6752 69013 Adaptor SCSI A6093 00239 None Anti tip Foot A6752 67042 None Assembly Cell PDH Riser A6094AX A6094 69003 Assembly Cover Left Side A6752 67034 None Assembly Cover Right Side A6752 67033 None Assembly Cover Top A6752 67035 None Assembly Front Bezel A6752 04003 None Assembly Front Panel Plastic A6752 67037 None Assembly Interlock Device 5065 5959 None Assembly Lift handle left panel A6752 04045 None Assembly Lift handle right panel A6752 04048 None Assembly PCI Card Cage A6752 67014 A6752 69014 Assembly PCI OLR A6093 67014 None Assembly PCI OLR Paddle A6093 40041 None Assembly PCI Separator W Light Pipe 5065 7443 None Assembly Slide rail left A6752 04058 None Assembly Slide rail right A6752 04059 None Assembly Smart Fan Front Rear qty 4 A6752 67029 None Assembly Smart Fan PCI C C qty 6 A6752 67030 None 90 Appendix A Table A 1 Replaceable Parts hp rp7405 rp7410 Field Replaceable Unit FRU List Continued
15. AC Power Specifications 95 Environmental Specifications 97 Temperature and Humidity LL 97 Cooling rire esa eda eri and lean 97 Typical Power Dissipation and Codling 0 0 0 ccc eee ee ee eee eens 98 Contents Acoustic Noise Specification creekien iE eee eee e ee ee ee eens 98 AI OW acs a iS ae eo Guede ta 98 C Site Preparation Electrical Considerations LL 102 Electrical Load Requirements Circuit Breaker Sizing LL 103 Pwer Qu Lari a Pera oe 104 Sources of Electrical Disturbances LL 104 Power System Protection 104 Distribution Hardware sss esa asui eee eee ee eee eee eee e aa ae 105 Wire Selection eiet e A TRE hh ata 105 Raceway Systems electrical conduits 1 0 cece eee een eens 105 Building Distribution A Sed a Sa ae ag BEG a ge Des 105 Power Routine soc ovest a ap ee Se de OP a eve ig BE st IE FA a WEP St oe 105 Grounding Systems 2 ii i aes ee Ae ha PER DB RE A ade ES 106 Power Distribution Safety Grouadag i 106 Cabinet Performance Grounding High frequency Ground 0 LL 106 Equipment Grounding Implementation Details 0 0 ooo enna 108 System Installation Guidelines 109 Waite CONNECT A gs ed Ad fd 109 Data Communications Cables 0 0 e nee e eee e eens 109 Environmental Elements aa E E O Aa B Ea a a E E al ea 110 Computer Room Preparation LL 110 Basic Air Conditioning Equipment Requirements ccc eee eens 110
16. Rear Smart Fan Assembly 72 Removing and Replacing a PCI Smart Fan Assembly oooooooorrr 73 Removing a PCI Smart Fan Assembly cc eee eee eee een enna 74 Replacing a PCI Smart Fan Assembly nee eee ene nen 74 Removing and Replacing a Bulk Power Supply LL 75 REMOVING ASB BO sito io Bea eg eae ete ane E A Mins i n 76 Replacing a BES assiale iaia i te Sone 76 Removing and Replacing a PCI Power Module Brick 0 0 cece eee eee 77 Removing a PCI Power Module Brick 0 0 0 0 0 0 ccc eens 78 Replacing a PCI Power Module Brick 0 0 eens 78 Removing and Replacing the PCI Voltage Regulator Modules ooooooooooooooooo 79 Removing PCIVRM so id ie E wea ieee lene ei de ete ae Sea iia a G 79 Replacing the PCIFVRM gt piau eee ed de in daria 79 Removing and Replacing a PCI Card 81 Removing and Replacing a PCI Card 81 Removing and Replacing the Mass Storage Backplane LL 84 Removing the Backplane LL 84 Replacing the Backplane i ili a te 86 Removing and Replacing a MP SCSI Board 87 Removing a MP SCSI board 88 Replacing a MP SGSI B ard i TRL eo ia de lel ee SS tate Se 88 A Replaceable Parts B System Specifications Dimensions and Weights ea o eee bE A A a a 94 Electrical Specifications ii sek obs haa ea PRA LR Ak RE i 95 Grondin siii e eat AE o dyed O ld 95 Circuit Breaker boh alia ia AS AA e aa 95 System
17. Runway Bus 0 Processor 0 COHERENCY CONTROLLER 8 Chapter 1 Introduction Detailed hp rp7405 rp7410 Description PDH Riser Board The PDH riser board is a daughter card for the cell board It contains a micro processor memory interface microcircuit processor dependent hardware PDH including the processor dependant code PDC Flash memory and a manageability micro controller called SINC with associated circuitry The PDH obtains cell board configuration information from cell board signals and from the cell s LPM See the PDH Riser Board ERS for operational details The memory interface microcircuit is the heart of the PDH It provides the CC access to the PDH space by a 4 bit 50 75 MHz bus This microcircuit also supports an interrupt mechanism to the CC that can interrupt a processor for the PDH It provides access to the FLASH ROM and scratch RAM memory chips together with the external registers and an interface to an I C micro controller SINC that monitors sensors throughout the system It also controls system reset and initialization signals as well as the low level debugger LDB port UART semaphore register and GPIO pins It is the primary master for a Serial Presence Detect bus The PDH supports up to 4 MB of address space for ROM FLASH to hold the PDC firmware The non volatile memory and scratch RAM have been combined and placed in a 512KB battery backed SRAM DIMMs Custom designed by Hewlett Packard each DIMM con
18. Step 2 Slide the cover toward the rear of the chassis Step 3 Lift the cover up and away from the chassis Replacing the Top Cover Step 1 Slide the cover into position It should easily slide into position however a slow firm pressure will be needed to properly seat the cover Step 2 Tighten the retaining screws securing the cover to the chassis 62 Chapter 4 Removal and Replacement Removing and Replacing a Disk Drive Removing and Replacing a Disk Drive The disk drives are located in the front of the chassis The nPartition must be shutdown to remove or replace the drive that serves as the boot disk Refer to Shutting Down nPartitions and Powering Off Hardware Components for more information The remainder of the internal disk drives are hot pluggable CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 3 Disk Drive Location Pg Ag Ag i Chapter 4 63 Removal and Replacement Removing and Replacing a Disk Drive Removing a Disk Drive Figure 4 4 Disk Drive Detail Step 1 Disengage the front locking latch on the disk drive by pushing the release tab to the right and the latch lever to the left Step 2 Pull forward on the front locking latch and carefully slide the disk drive from the chassis Replacing a Disk Drive NOTE Sometimes using the diskinfo and ioscan commands will
19. Table 3 7 PCI OL Board PCI Slot Power LBA On Green Slot is powered Off Slot is not powered PCI Slot Attention LBA Off Normal Yellow See Table 3 7 MP Core I O PCI Slot Power LBA On Green Core is powered sia Off Core is not powered PCI Slot Attention LBA Off Normal Yellow See Table 3 7 PCI Cell LED OL Table 3 7 OL LEDs States State i Attention Yellow Normal Operation powered On Off Fault Detected power on On Flashing Slot Selected power on NOT Ready for OL On On Power off or Slot Available Off Off Fault Detected power off Off Flashing Ready for OL Off On MP Core VO LEDs The MP Core I O LEDs are located on the MP Core I O Panel Table 3 8 MP Core I O LEDs LED Driven By State Description Management Processor 3 3SB On Green 3 3V SB is on ba Off 3 3V SB off 54 Chapter 3 Troubleshooting Common Installation Problems Table 3 8 MP Core I O LEDs Continued LED Driven By State Description Management Processor SP On Green Service Processor on this MP Active Core I O Board is managing box Off SP is not managing box Management Processor SP Off SP is reset or off POST 0x1 0xF Green SP POST Code MP LAN 100BT SP LAN Controller On Green SP LAN in 100BT Mode MP LAN 10BT SP LAN Controller On Green SP LAN in 10BT Mode MP LAN Link OK SP LAN Controller On Green SP LAN Link OK MP LAN Activity SP LAN Controlle
20. Table A 1 hp rp7405 rp7410 Field Replaceable Unit FRU List Continued FRU Description Reglacc ebano Eachanie Part PCI Filler Plate 5001 6892 None PCI Power Module Brick 0950 3819 A6093 69023 Power Cord C19 CEE 7 7 4 5m Black CA Assembly 8120 6899 None Power Cord C19 GB 1002 4 5m Black CA Assembly 8121 0070 None Power Cord C19 IEC 309 L6 20 4 5m Black CA Assembly 8120 6897 None Power Cord C19 ISI 32 2 5m Black CA Assembly 8121 0161 None Power Cord C19 L6 20 4 5m Black CA Assembly 8120 6903 None Power Cord C19 unterminated International Europe 8120 6895 None Processor Module 650 MHz A6443AX A6443 69001 Processor Module 750 MHz A644AX A6444 69001 Processor Module 875 MHz A6435 67001 A6435 69001 Removable DAT Tape Drive DDS4 C5686 67203 C5686 69203 Removable DVD Drive A5220 67003 None Socket PCX W 1253 0703 None VAC Value Added Chassis A6752 04002 None a Cable assembly is part of the FRU 92 Appendix A B System Specifications This chapter describes the basic server configuration and its physical specifications and requirements Appendix B 93 System Specifications Dimensions and Weights Dimensions and Weights This section provides dimensions and weights of the system components Table B 1 hp rp7405 rp7410 Server Dimensions and Weights Standalone Packaged Height Inches centimeters 17 3 43 9 35 75 90 8 Width Inches centim
21. again b Enter Admin at the password prompt This term is case sensitive Chapter 2 39 Installation MP Core I O Connections The MP Main Menu appears Figure 2 23 MP Main Menu MP login Admin MP password Welcome to the rp7410 Management Processor c Copyright 1995 2001 Hewlett Packard Co All Rights Reserved MP MAIN MENU Consoles Virtual Front Panel Command Menu Console Logs Show chassis Logs Help Exit Connection Configuring LAN Information for the MP To set the MP LAN IP address 1 At the MP Main Menu prompt MP gt enter cm From the MP Command Menu prompt MP CM gt enter lc for LAN configuration The screen displays the default values and asks if you want to modify them It is a good idea to write down the information as it may be required for future troubleshooting NOTE If the Command Menu is not shown enter q to return to the MP Main Menu then enter cm 40 Chapter 2 Installation MP Core I O Connections Enter lc and press the Return key The following screen appears Figure 2 24 The lc Command Screen MP CM gt LC This command modifies the LAN parameters Current configuration of MP LAN interface MAC address 00 30 6e 05 09 24 IP address 15 99 83 215 0x0 f6353d7 Hostname 1 quartz s Subnet mask 255 255 255 0 Oxfffff f00 Gateway 15 99 83 254 0x0 6353 fe Status UP and RUNNING AutoNegotiate Enabled Data Rate 100 Mb s Duplex Half
22. all major chip set clocks Therefore these circuits represent a system wide single point of failure I O Subsystem The cell board to I O path runs from the CC to the SBA from the SBA to the ropes from the ropes to the LBA and from the LBA to the PCI buses The CC on each cell board communicates with one SBA over the SBA link The SBA link consists of both an inbound and an outbound link with an effective bandwidth of approximately 1 GB sec The SBA converts the SBA link protocol into ropes The SBA can support up to 16 of these high speed bi directional rope links for a total aggregate bandwidth of approximately 4 GB sec The LBA acts as a bus bridge supporting either one or two ropes and capable of driving either PCI 2x Turbo 33 MHz x 64 bits or PCI 4 Twin Turbo 66 MHz x 64 bits respectively Chapter 1 11 Introduction Detailed hp rp7405 rp7410 Description Figure 1 9 VO Subsystem Architecture DD EA LBA 4 System Bus HP LBA6 HAX PCI Slot 5 Adapter SBA El BA 14 ME BALLBA 12_ 4X PCI Slot 3 ita LBA 10 laser LBAS H4XPCISIot1 Cell Board 0 SBA Link Cell Board 1 Cell SBA Link RL LBA4_ Controller System Bus t _ LBA6 HAX PCI Slot 5 cc Adapter SBA e p TBA 14_H4x Pcl Slot4 4__B_LBA 12_ 4X PCI Slot 3 LBA 10 H4X PCI Slot 2 LBA8 H4XPCISIot1 The server supports two internal SBAs The SBAs generate 32 rope busses 16 per SBA The 32 available internal rope busses
23. conditioning equipment requirements 110 air conditioning recommendations 111 air distribution systems 111 computer room considerations 110 dust and pollution control 113 electrostatic discharge prevention 114 humidity level 112 static protection measures 114 environmental specifications 97 ESD 114 F facility characteristics 117 facility guidelines characteristics 117 floor loading terms 117 operational space requirements 120 typical raised floor site 118 windows 119 fire protection 116 floor loading 117 raised floor 117 front panel display 39 G gateway address 41 grounding 95 106 grounding systems 106 electrical conduit ground 106 H housekeeping power 38 HP UX booting 47 humidity 97 humidity level 112 123 Index I I O Subsystem 4 11 12 installing server into the rack 28 IP address default 40 le Comand Screen 41 K Keystone system air ducts 99 environmental elements 110 power system protection 104 L LAN status 41 lc LAN configuration command 41 LED Attention 39 Bulk Power Supply 39 SP Active 39 Standby Power Good 39 lighting requirements 116 login name MP 39 ls LAN Status command 41 M MAC address 41 main building electrical ground 106 Management Processor MP 37 mass storage backplane 14 84 85 91 94 removing and replacing 84 memory subsystem 8 login name 39 password 39 MP Management Processor
24. connected to the appropriate power panel and should be sized per applicable codes based on circuit over current device ratings Cabinet Performance Grounding High frequency Ground Signal interconnects between system cabinets require high frequency ground return paths Connect all cabinets to site ground 106 Appendix C Site Preparation Grounding Systems NOTE In some cases power distribution system green green yellow wire ground conductors are too long and inductive to provide adequate high frequency ground return paths Therefore the server is shipped with a ground strap for connecting the system cabinet to the site grounding grid customer supplied When connecting this ground ensure that the raised floor is properly grounded Power panels located in close proximity to the computer equipment should also be connected to the site grounding grid Methods of providing a sufficiently high frequency ground grid are described in the next sections Raised Floor Grounding If a raised floor system is used install a complete signal grounding grid for maintaining equal potential over a broad band of frequencies The grounding grid should be connected to the equipment cabinet and electrical service entrance ground at multiple connection points using a minimum 6 AWG 16mm2 wire ground conductor Hewlett Packard recommends the following approaches e Excellent Add a grounding grid to the subfloor The grounding grid should be made of a
25. envelope e Use at least a 12 inch raised floor system for the most favorable room air distribution system underfloor distribution e Ensure a minimum ceiling height of 12 inches between the top of the server and the ceiling and that all ceiling clips are in place Basic Air Conditioning Equipment Requirements The cooling capacity of the installed air conditioning equipment for the computer room should be sufficient to offset the computer equipment dissipation loads as well as any space envelope heat gain This equipment should include e Air filtration e Cooling or dehumidification e Humidification e Reheating e Air distribution e System controls adequate to maintain the computer room within the operating range Lighting and personnel must also be included For example a person dissipates about 450 BTUs per hour while performing a typical computer room task 110 Appendix C Site Preparation Environmental Elements At altitudes above 10 000 feet 3048 m the lower air density reduces the cooling capability of air conditioning systems If your facility is located above this altitude the recommended temperature ranges may need to be modified For each 1000 feet 305 m increase in altitude above 10 000 feet up to a maximum of 15 000 feet subtract 1 5 F 0 83 C from the upper limit of the temperature range Air Conditioning System Guidelines The following guidelines are recommended when designing an air conditionin
26. kit lower case intended Follow the steps in this installation guide to determine where and how to place the server into the rack 28 Chapter 2 Installation Unpacking the Server Installing the Cable Management Arm CMA Once the server is installed in the rack the CMA must be installed on the rear of the server Follow the instructions for installing the CMA can be found in the installation guide hp J1530A rack installation kit lower case intended Cable Management Arm Figure 2 14 Cable Management Arm Step 1 Attach CMA to the rack using T 25 Torx screws Figure 2 15 Attaching CMA to Rack ts TALA TP Ta AA AE nl gt Chapter 2 29 Installation Unpacking the Server Step 2 Attach the other end of the CMA to the server using the thumb screws that came with the CMA WE i Installing Add On Products This section explains load orders and dependencies for add on products For physical installation procedures refer to that components replacement procedure in Chapter 4 Removal and Replacement If installing add on products to an existing server follow operating system backup and shutdown procedures before powering off the server Cell Boards The server requires at least one cell board to operate Install the first cell board slot 1 lower slot and the second cell board in slot 0 upper Cell Board 0 enables the PCI cards in Chassis 0 and Cell Board 1 enables the PCI cards
27. line current 12 A rms Maximum inrush current 30 A peak for 15 ms Per line cord Dropout carry through time at 20 ms minimum line voltage Circuit breaker rating 20A Per line cord Branch Circuit Breaker Size 20A slow trip delay Type type Power factor correction gt 0 97 269VAC At all loads of 50 100 of supply rating gt 0 93 262VAC At all loads Of 30 50 of supply rating Ground leakage current mA lt 3 0 ma Per line cord kVA rating 2 7 KVA Table B 5 System Power Requirements Power Required 50 60 Hz VA Comments Maximum configuration hp rp7405 rp7410 server PA8700 3000 Theoretical Typical configuration hp rp7405 rp7410 server PA8700 1700 Typical Future upgrades may increase the Maximum Theoretical System Power to 3400 VA Maximum power is the sum of the worst case power consumption of every subsystem in the box and should be used to size worst case power consumption for facility installation Typical power consumption numbers are what HP engineers have measured running power intensive applications These are generally lower than maximum power numbers due to the fact that getting all of the subsystems in the box to simultaneously draw maximum power for long durations being uncommon 96 Appendix B System Specifications Environmental Specifications Environmental Specifications This section provides the environmental power dissipation noise emission and air flo
28. logging in 38 powering on 38 MP core I O 4 9 10 11 12 13 14 15 30 31 36 37 54 59 MP network name 41 MP SCSI 4 11 12 13 15 30 36 87 88 91 removing and replacing 87 88 N noise emission specifications 98 null modem cable connectivity 38 part number 38 O operating environment 97 P password MP 39 PCI backplane 2 4 11 13 79 PDC 124 Processor Dependent Code 44 PDH riser board 9 power applying cabinet 44 cabinet switch 44 housekeeping 38 44 power considerations 104 power cords 95 power distribution hardware 105 power distribution safety grounding 106 power distribution system distribution hardware 105 power quality 104 power requirements component 96 power system protection 104 power wiring 105 109 Processor Dependent Code PDC 44 R raised floor ground system illustrated 108 Reflection 1 38 44 Ronl Lifter 23 S serial display device connecting 37 38 recommended windows 44 setting parameters 37 sources of electrical disturbances 104 space requirements 120 delivery space requirements 120 subnet mask 41 system backplane 4 8 11 12 13 15 59 91 94 97 system configuration verifying 45 system installation guidelines 109 data communications cables 109 wiring connections 109 system specifications 93 T temperature 97 U Unpacking 18 unpacking 18 inspecting for damage 18 upgrade server 5 to from rp7
29. of the building it might be difficult to control cooling and air pressure levels Duct work seals are important for maintaining a balanced air conditioning system and high static air pressure Adequate cooling capacity means little if the direction and rate of air flow cannot be controlled because of poor duct sealing Also the ducts should not be exposed to warm air or humidity levels may increase Dust and Pollution Control Computer equipment can be adversely affected by dust and microscopic particles in the site environment Specifically disk drives tape drives and some other mechanical devices can have bearing failures resulting from airborne abrasive particles Dust may also blanket electronic components like printed circuit boards causing premature failure due to excess heat and or humidity build up on the boards Other failures to power supplies and other electronic components can be caused by metallically conductive particles These metallic particles are conductive and can short circuit electronic components Use every effort to ensure that the environment is as dust and particulant free as possible Smaller particles can pass though some filters and over a period of time resulting in possible cause problems in mechanical parts Small dust particles can be prevented from entering the computer room by maintaining its air conditioning system at a high static air pressure level Other sources of dust metallic conductive abrasive an
30. of these electrical disturbances by using e A dedicated power distribution system e Power conditioning equipment e Over and under voltage detection and protection circuits e Screening to cancel out the effects of undesirable transmissions e Lightning arresters on power cables to protect equipment against electrical storms Every precaution has been taken during power distribution system design to provide immunity to power outages of less than one cycle However testing cannot conclusively rule out loss of service Therefore adherence to the following guidelines provides the best possible performance of power distribution systems for server equipment e Dedicated power source Isolates server power distribution system from other circuits in the facility e Missing phase and low voltage detectors Shuts equipment down automatically when a severe power disruption occurs For peripheral equipment these devices are recommended but optional e Online uninterruptible power supply UPS Keeps input voltage to devices constant and should be considered if outages of one half cycle or more are common Refer to qualified contractors or consultants for each situation 104 Appendix C Site Preparation Distribution Hardware Distribution Hardware This section describes wire selection and the types of raceways electrical conduits used in the distribution system Wire Selection Use copper conductors instead of aluminum as aluminum s co
31. points are free of paint or other insulating material and treated with a contact enhancement compound similar to Burndy Penetrox 108 Appendix C Site Preparation System Installation Guidelines System Installation Guidelines This section contains information about installation practices Some common pitfalls are highlighted Both power cable and data communications cable installations are discussed NOTE In domestic installations the proper receptacles should be installed prior to the arrival of Hewlett Packard equipment Refer to the appropriate installation guide for installation procedures Wiring Connections Expansion and contraction rates vary among different metals Therefore the integrity of an electrical connection depends on the restraining force applied Connections that are too tight compress or deform the hardware and causes it to weaken This usually leads to high impedance causing circuit breakers to trip CAUTION Connections that are too loose have a high resistance that cause serious problems such as erratic equipment operation A high resistance connection overheats and sometimes causes fire or high temperatures that can destroy hard to replace components such as distribution panels or system bus bars Wiring connections must be properly torqued Many equipment manufacturers specify the proper connection torque values for their hardware Ground connections must only be made on a conductive nonpainted surface Whe
32. redundancy capabilities it is important that each power cord plugs into its proper receptacle Also ensure that the cabinet power has been turned off before disconnecting any power cords Step 7 Perform the hardware removal and replacement procedure for the powered off component Step 8 If needed reconnect all power cords to the receptacles where they belong Chapter 4 59 Removal and Replacement Shutting Down nPartitions and Powering Off Hardware Components Step 9 Use the MP Command menu s PE command to power on the hardware component that you powered off Step 10 Use the MP Command menu s PS command to confirm the status of the newly replaced component NOTE You may need to allow time for some components to complete power on self tests POST before a complete status is available 60 Chapter 4 Removal and Replacement Removing and Replacing the Top Cover Removing and Replacing the Top Cover It is necessary to remove and replace one or more of the covers to access the components within the server chassis CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 1 Top Cover Chapter 4 61 Removal and Replacement Removing and Replacing the Top Cover Removing the Top Cover Figure 4 2 Top Cover Retaining Screws Step 1 Loosen the retaining screws securing the cover to the rear of the chassis
33. relative to the raised floor grid While Hewlett Packard cannot assume responsibility for determining the suitability of a particular raised floor system it does provide information and illustrations for the customer or local agencies to determine installation requirements The following guidelines are recommended e Because many raised floor systems do not have grid stringers between floor stands the lateral support for the floor stands depends on adjacent panels being in place To avoid compromising this type of floor system while gaining under floor access remove only one floor panel at a time e Larger floor grids bigger panels are generally rated for lighter loads CAUTION Do not install any raised floor system until you have carefully examined it to verify that it is adequate to support the appropriate installation Floor Loading Terms Table C 3 defines floor loading terms Table C 3 Floor Loading Term Definitions Term Definition Dead load The weight of the raised panel floor system including the understructure Expressed in 1b ft2 kg m2 Live load The load that the floor system can safely support Expressed in lb ft2 kg m2 Appendix C 117 Site Preparation Facility Characteristics Table C 3 Floor Loading Term Definitions Continued Term Definition Concentrated load The load that a floor panel can support on a 1 in2 6 45 cm2 area at the panel s weakest point typically the cent
34. screws on non component side Step 6 Lift up and gently pull from the socket Figure 4 18 Locating the VRMs on PCI Backplane VRM 1 VRM 0 Replacing the PCI VRM Step 1 Firmly seat the VRM into the socket being careful not to bend pins Step 2 Attach bracket to VRM using 2 screws removed earlier Step 3 Put PCI side panel back onto chassis Chapter 4 79 Removal and Replacement Removing and Replacing the PCI Voltage Regulator Modules Step 4 Put right side cover back onto chassis Step 5 Power server back up 80 Chapter 4 Removal and Replacement Removing and Replacing a PCI Card Removing and Replacing a PCI Card The PCI cards are located in the rear of the chassis in the PCI card cage PCI cards are hot swappable components CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 19 PCI Cards Removing and Replacing a PCI Card You can remove and replace a PCI I O card by using the SAM usr sbin sam application or by using Partition Manager opt parmgr bin parmgr This procedure describes how to perform an online replacement of a PCI card using SAM for cards whose drivers support online add or replacement OLAR IMPORTANT Some PCI I O cards cannot be added or replaced online while HP UX remains running For these cards you must shut down HP UX on the nPartition before performing the card replac
35. that controls 48v DC Before powering up the hp rp7405 rp7410 server for the first time 1 Verify that the AC voltage at the input source is within specifications for each hp rp7405 rp7410 being installed 2 If not already done so power on the serial display device The preferred tool is the CE tool running Reflection 1 To power up the MP set up a communications link and login to the MP 1 Connect the server to AC power 38 Chapter 2 Installation MP Core I O Connections On the front of the hp rp7405 rp7410 a solid green Standby Power a solid green MP Present and a flashing amber Attention light will illuminate after about 30 seconds Figure 2 22 Front Panel Display C Run C Fault C J MP Present __ Power __ Attention 7 Remote _ Standby Power 2 Check the bulk power supply LED for each BPS When on the breakers distribute power to the BPSs AC power is present at the BPSs e When power is first applied Note the BPS LEDs will be flashing amber e After 30 seconds has elapsed Note the flashing amber BPS LED for each BPS becomes a flashing green LED Refer to power cord policies to interpret LED indicators 3 Login to the MP a Enter Admin at the login prompt This term is case sensitive It takes a few moments for the MP prompt to appear If it does not make sure the laptop serial device settings are correct 8 bits no parity 9600 baud and na for both Receive and Transmit Then try
36. the PCI card to be removed Remove the top cover Flip the card slot s PCI gate to the open position Figure 4 20PCI Gate Detail UT er Da il IM l DMI Firmly pull up on the tabs on the PCI card separator Remove the card from the PCI slot Note that the card is defective for future reference Position the new replacement PCI card in the slot NOTE A slow firm pressure is needed to properly set the card into its connection PCI cards tend to be difficult to install Flip the card slot s PCI gate to the closed position Replace the top cover Chapter 4 Step 13 Step 14 Step 15 Step 16 Chapter 4 Removal and Replacement Removing and Replacing a PCI Card Connect all cables to the replacement PCI card In SAM s Replace Card window click the OK button SAM powers the PCI slot back on and turns off stops blinking the slot s attention indicator SAM also resumes the card s drivers Confirm that the replacement card is online and powered in using SAM s I O Cards screen Synchronize the PDH and I O card SCSI parameters 1 When powering up system go into CO console window When POST finishes running the system displays the Main Menu the system is at BCH at this point in time 2 From the Main Menu enter ser This takes you to the Service Menu 3 At the Service Menu prompt enter scsi default The system then informs you that it will clear reset all scsi paths and prompts you to enter
37. the pin end of the panel into the backside of the front rack mount ears on the chassis Figure 2 11 Inserting the Pins Into the Rack y VAR Step 5 Pull the spring plunger out move the handles apart and install the shoulder washer end of the panel into the keyway feature Figure 2 12 Lift Handles Mounted Chapter 2 27 Installation Unpacking the Server Step 6 Step 7 Step 8 Step 9 Step 10 Continue to pull the handles apart until the spring plunger snaps into final position The spring plunger will drop down into the recess position Check that the handles are secure by pressing the handles together and moving back and forth Check to see if lift handle panel breaks free of chassis Repeat the steps above for the other handle To lift the server rotate the handles 90 degrees to horizontal position NOTE If you are installing the system in a rack refer to the installation guide hp J1530A rack installation kit lower case intended After moving the server remove the lift handle panels from the chassis and reinstall the server covers and front bezel Refer to installation guide hp J1530A rack installation kit lower case intended Figure 2 13 Lifting the Server Installing Server Into the Rack Any hp rp7405 rp7410 server that is to be installed into a rack is shipped with equipment slides With every set of slides comes an installation guide installation guide hp J1530A rack installation
38. typical configuration with Hewlett Packard computer peripherals 2 DC versions of the product were tested in a typical configuration with a Hewdett Packard 68134 AC DC power source Roseville 12 1401 European Contact Your local Hewlett Packard Sales and Service Office or Hewlett Packard GmbH Department HO TRE Herrenberger Stra e 120 D 71034 B blingen FAX 49 7031 14 3143 USA Radio Frequency Interference FCC Notice The Federal Communications Commission in 47 CFR Part 15 subpart B has specified that the following notice be brought to the attention of the users of this product NOTE This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense The user is cautioned that changes or modifications not expressly approved by Hewlett Packard could result in the equipment being noncompliant with FCC Class A requirements and void the user s authori
39. 40n to rp7410 5 V verifying system configuration 45 W wiring connections 109
40. 5 Remove four bolts holding down the ramps and remove the ramps See Figure 2 2 Figure 2 2 Removing the Shipping Bolts and Plastic Cover 20 Chapter 2 Installation Unpacking the Server Step 6 Remove the six bolts from the base attaching the rack to the pallet See Figure 2 3 Figure 2 3 Preparing to Roll Off the Pallet WARNING Make sure that the leveling feet on the rack are raised before you roll the rack down the ramp and any time you roll the rack on the casters Use caution when rolling the cabinet off the ramp A single server in the cabinet weighs approximately 400 pounds It is strongly recommended that two people roll the cabinet off the pallet Chapter 2 21 Installation Unpacking the Server Securing the Cabinet Once in position secure and stabilize the cabinet using the leveling feet at the corners of the base and install the anti tip mechanisms on the bottom front and rear of the rack Figure 2 4 Securing the Cabinet OOO0O000 00009000 Unpacking a Non Racked Server NOTE Hewlett Packard recommends the use of a lifter such as a RONI Company model 17000 SP 400 lifting device when moving a non racked system shown in Figure 2 5 If no lifter is available install the lift handle panels provided with the system Unloading with a Lifter Use the following procedure to unload the server from the pallet using a lifter WARNING Use caution when using a lifter Because of the weig
41. A State Meaning On Green Fan is at speed and in sync or not at speed less than 6 seconds Flash Fan is not keeping up with speed sync pulse for greater than 6 seconds Yellow Flash Red Fan failed stalled or has run slow or fast for greater than 6 seconds Off Fan is not installed or no power is applied to fan Chapter 4 69 Removal and Replacement Removing and Replacing a Front Smart Fan Assembly Removing a Front Smart Fan Assembly Figure 4 9 Front Fan Detail Step 1 Push the Fan Release Pin away from the fan Step 2 Slide the fan away from the connector Step 3 Pull the fan away from the chassis Replacing a Front Smart Fan Assembly Step 1 Position the fan assembly on the chassis fan guide pins Step 2 Slide the fan into the connector Step 3 Verify that the Fan Release Pin is in the locked position NOTE The fan LED should show fan is operational green 70 Chapter 4 Removal and Replacement Removing and Replacing a Rear Smart Fan Assembly Removing and Replacing a Rear Smart Fan Assembly The Rear Smart Fan Assembly is located in the rear of the chassis The Fan assembly is a hot swappable component CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 10 Rear Smart Fan Assembly Locations FAN 2 FAN 3 Rear View LED LED Table 4 2 Rear Smart Fan Ass
42. Air Conditioning System Guidelines 111 Air Conditioning System Types 111 Basic Air Distribution Systems 111 Air Conditioning System Installation LL 112 Humidity Level ret A al dla Rn RA ro ia 112 Air Conditioning DU a a e a A 113 Dust and Pollution Control o o ooooooooorrr ene ene e eee e nee 113 Electrostatic Discharge ESD Prevention LL 114 ACOUSTICS ic o I ted 115 Computer Room Safety 116 Fire Protection a mito dei hinterland 116 Lighting Requirements for Equipment Servicing LL 116 Facility Characteristics trial aaa 117 EFloor Loadinpi atrio ieri Lea Lila Li alan 117 MIDdoWws praga oro eli AS AO 119 Space RegulrementSen eie li de ta ar 120 Delivery Space Requirements LL 120 Operational Space Requirements 0 cc eee eee eens 120 Zinc Particle Contamination a nai ii aea aiaia ieda a eaaa ae a a aee A aA 122 O AAA E nn Contents vi Table 1 Revisions Table 1 1 Table 1 2 Table 1 3 Table 1 4 Table 2 1 Table 3 1 Table 3 2 Table 3 3 Table 3 4 Table 3 5 Table 3 6 Table 3 7 Table 3 8 Table 3 9 Table 4 1 Table 4 2 Table 4 3 Table 4 4 Table A 1 Table B 1 Table B 2 Table B 3 Table B 4 Table B 5 Table B 6 Table C 1 Table C 2 Table C 3 Table C 4 Tables ESCI SCONTRI ISEE ROA Pa SON ded cent a aN viii hip Tp740D Servers a eee AI ae es el ates Mea 5 hp rp7405 to rp7410 Upgrades LL 5 hp rp7405 rp7410 DIMMS
43. Drive Removing a CD DVD Drive Figure 4 6 CD DVD Detail Step 1 To remove the CD DVD depress the front locking latch to loosen the drive from the chassis Step 2 Disengage the cables from the rear of the CD DVD Step 3 Slide the drive from the chassis Chapter 4 67 Removal and Replacement Removing and Replacing a CD DVD Drive Replacing a CD DVD Figure 4 7 CD DVD Detail A AAA serre LEFF LOR CS Step 1 Connect the cables to the rear of the CD DVD Step 2 Slide the drive in the chassis CAUTION Before attempting to install the drive into the chassis position the data cable over the top of the drive in order to avoid pinching the cable during installation Step 3 The drive easily slides into the chassis however a slow firm pressure is needed to properly seat the drive Step 4 Depress the front locking latch to secure the disk drive in the chassis 68 Chapter 4 Removal and Replacement Removing and Replacing a Front Smart Fan Assembly Removing and Replacing a Front Smart Fan Assembly The Front Smart Fan Assembly is located in the front of the chassis The fan assembly is a hot swappable component CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 8 Front Smart Fan Assembly Locations FAN 0 Front View LED LED Table 4 1 Front Smart Fan Assembly LED Indications LED
44. Series 1250 all steel access floor with bolt together stringers and 24 in 61 0 cm by 24 in 61 0 cm floor panels be used to support the server installation NOTE If the specific floor being evaluated or considered is other than a Tate Series 800 floor the specific floor manufacturer must be contacted to evaluate the floor being used Table C 4 lists specifications for the Tate Access Floors Series 800 raised floor system Table C 4 Typical Raised Floor Specifications Item Rating Dead load 7 lb ft 2 34 2 kg m2 Live load 313 lb ft 2 1528 3 kg m2 Concentrated load 1250 lb 567 kg 118 Appendix C Site Preparation Facility Characteristics Table C 4 Typical Raised Floor Specifications Continued Item Rating Ultimate load 4000 lb 1814 kg per panel Rolling load 400 lb 181 kg Average floor load 500 lb 227 kg a From Table C 3 on page 117 b With 0 08 in 0 2 cm of span maximum deflection Windows Avoid housing computers in a room with windows Sunlight entering a computer room may cause problems Magnetic tape storage media is damaged if exposed to direct sunlight Also the heat generated by sunlight places an additional load on the cooling system Appendix C 119 Site Preparation Space Requirements Space Requirements This section contains information about space requirements for an hp rp7405 rp7410 server This data should be used as the basic guideline for spa
45. T LAN RJ45 connector The primary LAN interface is located on the LAN SCSI board installed in the rightmost slot when viewing the system from the back Management Processor Access NOTE In order to access the Management Processor for the initial installation the M cable must first be connected to the DB25 connector located on the Primary MP SCSI board The Primary MP SCSI board is located in the lower MP SCSI board slot 36 Chapter 2 Installation MP Core I O Connections Setting Up the CE Tool PC The CE Tool is usually a laptop It allows communication with the Management Processor MP in the hp rp7405 rp7410 The MP monitors the activity of either a one partition or a multiple partition configuration During installation communicating with the MP enables such tasks as e Verifying that the components are present and installed correctly e Setting LAN IP addresses e Shutting down cell board power Communication with the MP is established by connecting the CE Tool to the Local RS 232 port on the MP Core VO card Setting CE Tool Parameters After powering on the CE Tool ensure the communications settings are as follows e 8 none parity e 9600 baud e na Receive e na Transmit Chapter 2 37 Installation MP Core I O Connections If the CE Tool is a laptop using Reflection 1 check or change these communications settings using the following procedure 1 From the Reflection 1 Main screen pull down the Connection
46. TE If you are installing the system in a rack refer to the hp J1530A Rack Integration Kit Installation Guide Chapter 2 25 Installation Unpacking the Server Unloading with Lift Handle Panels WARNING CAUTION Use this procedure only if no Hewlett Packard approved lift is available This procedure should only be attempted by two 2 authorized Hewlett Packard service people Before attempting this procedure it is recommended that you first remove all Cell Boards and AC power supplies Instructions for removing these components can be found in the Removal and Replacement chapter of the service manual Check with local safety regulations before attempting to move the system using the lift handle panels Failure to observe these precautions can cause serious injury to personnel or damage to equipment Unpack the server in an ESD safe environment Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Step 1 Remove both side covers If present remove the front panel Step 2 Locate lift handles and remove from storage plate Step 3 Orient lift handle panels such that when installed the handles hang downward at 90 degrees and lock in a horizontal position during lifting Figure 2 10 Positioning the Lift handles 26 yo MAA Chapter 2 Installation Unpacking the Server Step 4 With one handle in each hand install
47. User Guide hp rp7405 7410 Servers Third Edition invent Manufacturing Part Number A6752 96008 21102 USA Copyright 2002 Legal Notices The information in this document is subject to change without notice Hewlett Packard makes no warranty of any kind with regard to this manual including but not limited to the implied warranties of merchantability and fitness for a particular purpose Hewlett Packard shall not be held liable for errors contained herein or direct indirect special incidental or consequential damages in connection with the furnishing performance or use of this material Restricted Rights Legend Use duplication or disclosure by the U S Government is subject to restrictions as set forth in subparagraph c 1 11 of the Rights in Technical Data and Computer Software clause at DFARS 252 227 7013 for DOD agencies and subparagraphs c 1 and c 2 of the Commercial Computer Software Restricted Rights clause at FAR 52 227 19 for other agencies HEWLETT PACKARD COMPANY 3000 Hanover Street Palo Alto California 94304 U S A Copyright Notices Ocopyright 1983 2002 Hewlett Packard Company all rights reserved Reproduction adaptation or translation of this document without prior written permission is prohibited except as allowed under the copyright laws Contents 1 Introduction hp rp7405 rp7410 Overview 2 0 eee ee eee eee eee ees 2 Wells Board ais caste eas A at Be Ga MARNI ta
48. ail 4 bas ceed vas RA eee ea E 67 Figure 4 7 CD DVD Detail 3 0 4 4 04 4 it a dt e a dad a 68 Figure 4 8 Front Smart Fan Assembly Locations 69 Figure 4 9 Front Fan Detail ooo 70 Figure 4 10 Rear Smart Fan Assembly Locations LL 71 Figure 4 11 Rear Fan Detail ooooooorr eee EE 72 Figure 4 12 PCI Smart Fan Assembly Location LL 73 Figure 4 13 PCI Smart Fan Assembly Detail 74 Figure 4 14 BPS Locati0N oo sae a e ee aE a nee ee eee e ee eeeenenens 75 Fieure 4 15 BPS Detalla A A ee ee Lia 76 Figure 4 16 PCI Power Module Location 0 ccc erener erener 77 Figure 4 17 PCI Power Module Detail 0 0 o 78 Figure 4 18 Locating the VRMs on PCI Backplane 0 0 ce tes 79 Fisure 4 19 PCI Cards iii eee a WG e A as 81 Fisure 4 20 PCI Gate Detail respon ii A A ARA A al 82 Figure 4 21 Locating Internal Disks 0 0 0 0 ccc eee eens 84 Figure 4 22 Locating the Mass Storage Backplane 0 cece teens 85 Figure 4 23 Mass Storage Backplane ee eee eee n ene 85 Figure 4 24 MP SCSI Location 1 0 0 0 0 cc ee eee eee en nee 87 Figure 4 25 MP SCSI Detail 2 sc corti a a eg 88 Figure B 1 Airflow DiagraM LL 99 Figure C 1 Raised Floor Ground System 0 0 eee eee eens 108 Figure C 2 Cabinet Dimensions 120 FHipure C 3 Footprnt fosse A A OE PE EA ut SiON aa A oo Bee 121 Preface Revisi
49. and Replacing a MP SCSI Board Removing and Replacing a MP SCSI Board The MP SCSI board is located in the rear of the chassis The MP SCSI board is a hot pluggable component There may be up to two MP SCSI boards installed in a system CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 24 MP SCSI Location Chapter 4 87 Removal and Replacement Removing and Replacing a MP SCSI Board Removing a MP SCSI board Figure 4 25 MP SCSI Detail MP for Cell 0 MP for Cell 1 Partition 0 Step 1 Label and remove all cables connected to the MP SCSI board to be removed Step 2 Loosen the two retaining screws securing the MP SCSI board to the chassis Step 3 Securely grasp the handle on the MP SCSI board Step 4 Slide the MP SCSI board from the chassis Replacing a MP SCSI Board Step 1 Position the MP SCSI board in the chassis Step 2 The board slides easily into the chassis however a slow firm pressure will be needed to properly seat the connection Step 3 Tighten the two retaining screws securing the MP SCSI board to the chassis 88 Chapter 4 A Replaceable Parts Appendix A 89 Replaceable Parts Table A 1 hp rp7405 rp7410 Field Replaceable Unit FRU List Lol Replacement Part Exchange Part FRU Description Number Number 18GB 10K RPM SCSI Disk A6537 67001 A6537 69001
50. are divided in the following manner e Two ropes are routed as single rope bundles to support PCI 2x Turbo 264 MB sec bandwidth 64 bit transfers at 33 MHz for the MP Core I O boards for SCSI LAN e Two ropes are routed as single rope bundles to two LBAs to support two slots operating at PCI 2x for MP SCSI e The remaining 28 ropes are bundled in two rope pairs to 14 LBAs to support 14 slots operating at PCI 4x 528 MB sec 64 bit transfers at 66 MHz The hp rp7405 rp7410 uses Hewlett Packard s proprietary adaptive signaling concept also known as the Universal PCI slot concept not to be confused with the Universal PCI card Circuitry on the backplane senses a standard connector keyed for 5V to determine the type of the cards inserted The circuitry controls the voltage rail supplied to the connector for powering the card s I O pads VIO The card can either be of the 5V only or universal type 5V only cards require VIO to be 5V whereas universal cards operate 5V as well as 3 3V To take advantage of the 66 MHz potential of universal cards one must operate those cards at 3 3V The control circuitry on the backplane therefore provides 5V to the slot when a 5V only card is present or 3 3V when a universal card is present Firmware controls the setting of the slot s clock rate 12 Chapter 1 Introduction Detailed hp rp7405 rp7410 Description This concept allows maximum connectivity for mainstream 5V only 33 MHz 32 bit PCI 1x an
51. arth ground using green green yellow wire ground conductors Having these ground connections tied to metal chassis parts that may be touched by computer room personnel protects them against shock hazard from current leakage and fault conditions Power distribution systems consist of several parts Hewlett Packard recommends that these parts be solidly interconnected to provide an equipotential ground to all points Main Building Electrical Ground The main electrical service entrance equipment should have an earth ground connection as required by applicable codes Connections such as a grounding rod building steel or a conductive type cold water service pipe provide an earth ground Electrical Conduit Ground All electrical conduits should be made of rigid metallic conduit that is securely connected together or bonded to panels and electrical boxes so as to provide a continuous grounding system Power Panel Ground Each power panel should be grounded to the electrical service entrance with green green yellow wire ground conductors The green green yellow wire ground conductors should be sized per applicable codes based on circuit over current device ratings NOTE The green wire ground conductor mentioned above may be a black wire marked with green tape Computer Safety Ground Ground all computer equipment with the green green yellow wire included in the branch circuitry The green green yellow wire ground conductors should be
52. as part of the remove and replace procedure This section gives details on how to ensure that an nPartition is properly shut down and it also describes how to power off and power on hardware components Shutting Down an nPartition This procedure is for checking an nPartition s boot status and if needed shutting down HP UX on the nPartition Step 1 Step 2 Step 3 Step 4 Step 5 58 Advise the customer that the system one or more nPartitions must be shut down for repairs Ensure that the customer has a current backup and inform the customer of the anticipated downtime Login to the server s service processor MP Use the Virtual Front Panel VFP to view the current state of the nPartition that you will shut down From the MP Main menu enter VFP to access the Virtual Front Panel menu and select the nPartition whose boot state you want to view Type Control b AB to exit the VFP display e IfannPartition has booted HP UX or if it is in the process of launching HP UX you must shut down HP UX on the nPartition When HP UX is running on an nPar its VFP displays HP UX heartbeat with a blinking asterisk to indicate its interactivity In this case proceed with the next step e Ifthe nPartition is at its Boot Console Handler BCH interface then HP UX has already been shut down e Ifthe nPartition currently is booting then you should wait for it to reach the BCH interface and if necessa
53. card for cell 1 thus it can be accessed through the cell 1 nPartition only Figure 1 7 Internal Disks Drive 1 1 Path 1 0 0 3 0 6 Drive 1 2 Path 1 0 1 0 0 1 1 6 Removable media path DVD 1 0 0 3 1 2 Drive 0 2 DAT 1 0 0 3 1 3 Path 0 0 0 3 0 5 Drive 0 1 Path 0 0 0 3 0 6 10 Chapter 1 Introduction Detailed hp rp7405 rp7410 Description System Backplane The system backplane comprises the system clock generation logic the system reset generation logic DC to DC converters power monitor logic and two LBA link to PCI converter ASICs It also includes connectors for attaching the cell boards PCI backplane MP Core I O MP SCSI boards SCSI cables bulk power chassis fans front panel display intrusion switches and the system scan card Figure 1 8 System Backplane Block Diagram System backplane MP Core I O MP SCSI J L lt a PCI backplane __ lt a Cell board 0 MP Core I O E MP SCSI lt a Cell board 1 Cell boards are perpendicular j j to the system backplane Bulk power supply Only half of the MP Core I O board set connects to the system backplane The MP SCSI boards plug into the backplane while the LAN SCSI boards plug into the PCI backplane Clocks and Reset The system backplane contains reset and clock circuitry that propagates through the whole system The central clocks drive
54. cations LED A State Meaning On Green Fan is at speed and in sync or not at speed less than 6 seconds Flash Fan is not keeping up with speed sync pulse for greater than 6 seconds Yellow Flash Red Fan failed stalled or has run slow or fast for greater than 6 seconds Off Fan is not installed or no power is applied to fan Chapter 4 73 Removal and Replacement Removing and Replacing a PCI Smart Fan Assembly Removing a PCI Smart Fan Assembly Figure 4 13 PCI Smart Fan Assembly Detail Step 1 Securely grasp the two thumb holds on the fan assembly NOTE The two right side fans as viewed from the front are located very close to the chassis It may be necessary to use a tool such as a flatblade screwdriver to assist in removing them Step 2 Slide the fan upward from the chassis Replacing a PCI Smart Fan Assembly Step 1 Carefully position the fan assembly in the chassis Step 2 The fan easily slides into the chassis however a slow firm pressure will be needed to properly seat the connection NOTE A green fan LED indicates the fan is operational 74 Chapter 4 Removal and Replacement Removing and Replacing a Bulk Power Supply Removing and Replacing a Bulk Power Supply The bulk power supply is located in the front of the chassis The BPS is a hot swappable component CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions c
55. ce plan developments Other factors such as airflow lighting and equipment space requirements must also be considered Delivery Space Requirements There should be enough clearance to move equipment safely from the receiving area to the computer room Permanent obstructions such as pillars or narrow doorways can cause equipment damage Delivery plans should include the possible removal of walls or doors Figure C 2 Cabinet Dimensions Sde_id 041201 Operational Space Requirements Other factors must be considered along with the basic equipment dimensions Reduced airflow around equipment causes overheating which can lead to equipment failure Therefore the location and orientation of air conditioning ducts as well as airflow direction are important Obstructions to equipment intake or exhaust airflow must be eliminated The locations of lighting fixtures and utility outlets affect servicing operations Plan equipment layout to take advantage of lighting and utility outlets Do not forget to include clearance for opening and closing equipment doors Clearance around the cabinets must be provided for proper cooling airflow through the equipment 120 Appendix C Site Preparation Space Requirements The service area space requirements shown in Figure C 3 are minimum dimensions If other equipment is located so that it exhausts heated air near the cooling air intakes of the computer system cabinets larger space requi
56. d 64 bit PCI 2x cards as well as full I O bandwidth utilization through the use of 64 bit 66 MHz PCI 4x universal cards Table 1 4 PCI Slot Types Slot Device 0_1 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_2 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_3 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_4 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_5 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_6 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_7 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 0_8 PCI 2x Turbo 64 bit 33 MHz Adaptive Signaling 5V connector Hot Swap Slot 11 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 12 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 13 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 14 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 15 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 16 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 17 PCI 4x Twin Turbo 64 bit 66 MHz 3 3V only 3 3V connector Hot Swap Slot 138 PCI 2x Turbo 64 bit 33 MHz Adaptive Si
57. d by removing the left side cover The system backplane inserts by a guide insertion mechanism using a single large jack screw assembly SCSI ribbon cable assemblies route from the mass storage area to the backside of the system backplane and to the Procurium PCI MP Core I O card Chapter 1 15 Introduction Detailed hp rp7405 rp7410 Description Cell boards are accessed from the right side of the chassis behind a removable side cover Figure 1 11 Left Rear View of hp rp7405 rp7410 System backplane MP Core I O MP SCSIs 16 Chapter 1 2 Installation Chapter 2 Installation Unpacking the Server Unpacking the Server Hewlett Packard shipping containers are designed to protect their contents under normal shipping conditions After the equipment arrives carefully inspect each carton for signs of shipping damage A tilt indicator is installed on each carton shipped The beads in the indicator will roll to the upper position if the container has been tilted to an angle that could cause equipment damage The tilt indicator itself will have two windows and each window under normal conditions will show four beads present If a carton has been mishandled accidentally dropped or knocked against something the tilt indicator will indicate missing beads If damage is found document the damage with photographs and contact the transport carrier immediately Examine the server cabinet for visible shipping damage After unpacking t
58. d or microscopic particles can be present Some sources of these particulants are e Subfloor shedding e Raised floor shedding e Ceiling tile shedding These pollutants are not always visible to the naked eye A good check to determine their possible presence is to check the underside of the tiles The tile should be shiny galvanized and free from rust The computer room should be kept clean The following guidelines are recommended e Smoking Establish a no smoking policy Cigarette smoke particles are eight times larger than the clearance between disk drive read write heads and the disk surface e Printer Locate printers and paper products in a separate room to eliminate paper particulate problems e Eating or drinking Establish a no eating or drinking policy Spilled liquids can cause short circuits in equipment such as keyboards e Tile floors Use a dust absorbent cloth mop rather than a dry mop to clean tile floors Appendix C 113 Site Preparation Environmental Elements Special precautions are necessary if the computer room is near a source of air pollution Some air pollutants especially hydrogen sulfide H2S are not only unpleasant but corrosive as well Hydrogen sulfide damages wiring and delicate sound equipment The use of activated charcoal filters reduces this form of air pollution Electrostatic Discharge ESD Prevention Static charges voltage levels occur when objects are separated or rubbed together T
59. d to an nPartition then use the Virtual Front Panel VFP to view the current boot state of the nPartition HP UX on the nPartition must be shut down before you power off any of the hardware assigned to the nPartition Once you are certain the nPartition is not running HP UX you can power off components that belong to the nPartition Refer to the procedure Shutting Down an nPartition for details on determining the nPartition boot state and shutting down HP UX Step 3 Access the MP Command menu From the MP Main menu enter CM to access the Command menu Step 4 Use the MP Command menu s PS command to check details about the hardware component you plan to power off The PS command enables you to check the status of the cabinet system backplane MP Core I O PCI power domains or bricks in the I O card cage and cells Step 5 Use the MP Command menu s PE command to power off the hardware component Using the PE command you can power on or off the cabinet including all cells and 1 O in the cabinet individual cells or PCI power domains bricks Using the Command menu s PE command to manage cabinet power is equivalent to using the front panel power switch Step 6 If you need to disable all power in the entire cabinet you also must disconnect all power cords in order to disable all housekeeping power NOTE Ensure that all power cords are labeled to indicate which receptacle each cord plugs into Because of power
60. ee eee eens 45 Verifying the System Configuration using Boot Console Handler BCH 46 Booting HP UX using Boot Console Handler BCH 0 0 teenies 47 3 Troubleshooting Common Installation Problems 50 The Server Does Not Power On 51 The Server Powers On But Then Shuts Down with a Fault Light aaaea 51 hp rp7405 rp7410 LED Indicators 51 4 Removal and Replacement Shutting Down nPartitions and Powering Off Hardware Components oooooooooo oo 58 Shutting Down an nPartiti0on eee eee eee eens 58 Powering Off Hardware Components nasso assess rererere ereere 59 Removing and Replacing the Top Cover 61 Removing the Top CIU it a a 62 Contents Replacing the Top Covers si ae ii ita 62 Removing and Replacing a Disk Drive eee eens 63 Removing a Disk Drives sed oh 545 eee hee is ended Vc Rebeka At nai 64 Replacing a Disk Drives uni baia ie Bh ee Ses dere SOI A ts 64 Removing and Replacing a CD DVD Drive 66 Removing a CD DVD Drive 67 Replacins a CD DVDs vies flea re Aerie ah eee ERG ES Sete BR rh ER Bote BERD 68 Removing and Replacing a Front Smart Fan Assembly 0 0 00 ccc ccc eens 69 Removing a Front Smart Fan Assembly nannaa n nennen 70 Replacing a Front Smart Fan Assembly LL 70 Removing and Replacing a Rear Smart Fan Assembly Li 71 Removing a Rear Smart Fan Assembly 72 Replacing a
61. efficient of expansion differs significantly from that of other metals used in power hardware Because of this difference aluminum conductors can cause connector hardware to work loose overheat and fail Raceway Systems electrical conduits Raceways electrical conduits form part of the protective ground path for personnel and equipment Raceways protect the wiring from accidental damage and also provide a heatsink for the wires Any of the following types may be used e Electrical metallic tubing EMT thin wall tubing e Rigid metal conduit e Liquidtight with RFI strain relief most commonly used with raised floors Building Distribution All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors to provide ground continuity Conduit that is exposed and subject to damage should be constructed of rigid galvanized steel Power Routing Power drops and interface cables from the equipment are routed down from the power panel through a grommet protected opening beneath the floor level and under the floor panels Appendix C 105 Site Preparation Grounding Systems Grounding Systems hp rp7405 rp7410 servers require two methods of grounding e Power distribution safety grounding e High frequency intercabinet grounding Power Distribution Safety Grounding The power distribution safety grounding system consists of connecting various points in the power distribution system to e
62. either Yes or No 4 Enter y The system takes a few seconds to reset the scsi ports list all the ports with the reset values then displays the Service Menu prompt 5 Reboot the system 83 Removal and Replacement Removing and Replacing the Mass Storage Backplane Removing and Replacing the Mass Storage Backplane Removing the Backplane Step 1 Remove all internal disks Figure 4 21Locating Internal Disks Drive 1 1 Drive 1 2 Drive 0 2 Drive 0 1 Step 2 Remove the top and right side covers Step 3 Remove the PCI side panel Step 4 Disconnect all cables to the backplane 84 Chapter 4 Removal and Replacement Removing and Replacing the Mass Storage Backplane Ensure that you notice where each is removed so that they may be correctly reinstalled Figure 4 22Locating the Mass Storage Backplane Mass Storage Backplane Step 5 Unscrew the two captive screws and remove backplane bracket assembly Figure 4 23Mass Storage Backplane Captive Screws Chapter 4 85 Removal and Replacement Removing and Replacing the Mass Storage Backplane Replacing the Backplane Step Step Step Step Step Step 86 NN SR Align and press the backplane bracket assembly into its mount Fasten the two captive screws Connect all cables to the backplane Install the PCI side panel Install the top and right side covers Install all internal disks Chapter 4 Removal and Replacement Removing
63. embly LED Indications LED n State Meaning On Green Fan is at speed and in sync or not at speed less than 6 seconds Flash Fan is not keeping up with speed sync pulse for greater than 6 seconds Yellow Flash Red Fan failed stalled or has run slow or fast for greater than 6 seconds Off Fan is not installed or no power is applied to fan Chapter 4 71 Removal and Replacement Removing and Replacing a Rear Smart Fan Assembly Removing a Rear Smart Fan Assembly Figure 4 11 Rear Fan Detail Step 1 Push the Fan Release Pin away from the fan Step 2 Slide the fan away from the connector Step 3 Pull the fan away from the chassis Replacing a Rear Smart Fan Assembly Step 1 Carefully position the fan assembly on the chassis fan guide pins Step 2 Slide the fan into the connector Step 3 Verify that the Fan Release Pin is in the locked position NOTE A green fan LED indicates the fan is operational 72 Chapter 4 Removal and Replacement Removing and Replacing a PCI Smart Fan Assembly Removing and Replacing a PCI Smart Fan Assembly The PCI Smart Fan Assembly is located in the rear of the PCI cardcage The Fan assembly is a hot swappable component CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 12 PCI Smart Fan Assembly Location Table 4 3 Smart Fan Assembly LED Indi
64. ement or addition See Shutting Down nPartitions and Powering Off Hardware Components on page 58 Step 1 Run SAM usr sbin sam and from the main SAM Areas screen select the Peripheral Devices area then select the Cards area Step 2 From the I O Cards screen select the card you will replace and then select the Actions gt Replace menu item Chapter 4 81 Removal and Replacement Removing and Replacing a PCI Card Step 3 Wait for SAM to complete its critical resource analysis for the selected card and then review the Step 4 Step 5 Step 6 Step 7 Step 8 Step 9 Step 10 Step 11 Step 12 82 analysis results If no critical resources will be disabled by taking the selected card offline then click the OK button to suspend the card s driver and power off the card s PCI slot and then proceed with the next step If SAM detected that the selected PCI card cannot be taken offline you will not be able to click the OK button and cannot replace the card while HP UX remains running In this case you must shut down HP UX on the nPartition before replacing the defective card Locate the PCI slot where the selected card resides On the server you can view the PCI slots and slot LEDs from the rear of the cabinet The selected slot will be powered off its green power LED will be off and the slot s amber attention indicator a dark orange yellow LED will be blinking Label and remove the cable s connected to
65. er of the panel without the surface of the panel deflecting more than a predetermined amount Ultimate load The maximum load per floor panel that the floor system can support without failure Failure expressed by floor panel s breaking or bending Ultimate load is usually stated as load per floor panel Rolling load The load a floor panel can support without failure when a wheel of specified diameter and width is rolled across the panel Average floor load Computed by dividing total equipment weight by the area of its footprint This value is expressed in lb ft2 kg m2 Average Floor Loading The average floor load value defined in Table C 4 is not appropriate for addressing raised floor ratings at the floor grid spacing level However it is useful for determining floor loading at the building level such as the area of solid floor or span of raised floor tiles covered by the hp rp7405 rp7410 server footprint Typical Raised Floor Site This section contains an example of a computer room raised floor system that is satisfactory for the installation of an hp rp7405 rp7410 server Based on specific information provided by Hewlett Packard Tate Access Floors has approved its Series 800 all steel access floor with bolt together stringers and 24 in 61 0 cm by 24 in 61 0 cm floor panels In the event that the flooring is being replaced or a new floor is being installed Tate Access Floors recommends its
66. eters 17 5 44 4 28 0 71 1 Depth Inches centimeters 30 0 76 2 28 38 72 0 Weight Pounds kilograms 220 100 N A Shipping box pallet ramp and container adds approximately 50 lbs to the total system weight The size and number of miscellaneous pallets will be determined by the equipment ordered by the customer Table B 2 hp rp7405 rp7410 Component Weights Quantity Description Weight 1b kg lor 2 Cell board 19 81 9 0 1 System backplane 12 estimate 5 44 estimate 1 PCI backplane 20 4 9 25 2 Bulk power supply 18 8 2 1 Mass storage backplane 1 0 45 2 PCI DC to DC converters 5 2 27 94 Appendix B System Specifications Electrical Specifications Electrical Specifications This section provides electrical specifications for hp rp7405 rp7410 servers Grounding The site building shall provide a safety ground protective earth for each AC service entrance to all cabinets Install a PE protective earthing conductor that is identical in size insulation material and thickness to the branch circuit supply conductors The PE conductor must be green with yellow stripes The earthing conductor described is to be connected from the unit to the building installation earth or if supplied by a separately derived system at the supply transformer or motor generator set grounding point Circuit Breaker The Marked Electrical for the hp rp7405 rp7410 server is 12 am
67. f each PCI card Standby Cooling Several components within the chassis consume significant amounts of power while the system is in standby mode The system fans will be run at 1541 rpm or 38 of full speed during standby to remove the resulting heat from the cabinet The fans within the power supply will operate at full speed during standby Typical Power Dissipation and Cooling Table B 6 Typical hp rp7405 rp7410 Configurations Cell Memory pe Cards Hard c Bulk Typical Typical AS Per Cell Assumes DvDs Disk ore Power Prsa cena Boards 10 watts VO i Power Cooling Board Drives Supplies each Qty GBytes Qty Qty Qty Qty Qty Watts Watts 2 16 16 2 4 2 2 2000 6826 2 8 8 0 2 2 2 1810 6179 2 4 8 0 2 2 2 1757 5998 1 4 8 0 1 1 2 1148 3919 Acoustic Noise Specification The acoustic noise specification for the hp rp7410 server is 57 3 db sound pressure level at bystander position It is appropriate for dedicated computer room environments not office environments The LwA is 7 5 Bels Care should be taken to understand the acoustic noise specifications relative to operator positions within the computer room or when adding servers to computer rooms with existing noise sources Air Flow The hp rp7405 rp7410 servers require that the cabinet air intake temperature be between 68 F and 77 F 20 C and 25 C at 960 CFM 98 Appendix B System Specifications Environmental Specificati
68. faces the processors and memory to the off board I O Shown in Figure 1 4 is the CC This is the heart of the cell board The CC provides a crossbar connection which allows communication with other cell boards in the system It connects to the PDH and SINC hardware Each cell board holds up to 16 DIMMs There can be one or two cell boards installed in an system The cell boards have hot plug capability Figure 1 4 Cell Controller 2x144 bit DIMM 2x20 Bit Differential 500 MT s PA 8700 PA 8700 PA 8700 PA 8700 4X Runway2 64 bits 250MT s 4x36 bits 250 MT s Figure 1 5 Cell Board Chapter 1 Introduction Detailed hp rp7405 rp7410 Description The hp rp7405 rp7410 has a 48V distributed power system and receives the 48V power from the system backplane board The cell board contains DC to DC converters to generate the required voltage rails The DC to DC converters on the cell board do not provide N 1 redundancy The cell board contains several major buses including e Runway buses for each of the four processors e Two memory buses one going to each half of the main memory array e Incoming and outgoing I O bus that goes off board to a SBA chip e Incoming and outgoing crossbar bus that goes off board to the other cell boards e PDH bus that goes to the PDH SINC circuitry All of these buses come together at the CC chip Due to space limitations on the cell board the PDH SINC circuitry resides on a riser board t
69. facturer Dispose of used batteries according to the manufacturer s instructions and local disposal requirements IMPORTANT Switzerland Annex 4 10 of SR 814 013 applies to batteries Australian C Tick Label Figure 5 C Tick Label N279 xvi Laser Safety NOTE If a Fibre Channel I O card is present the following laser safety statement applies This product contains a laser internal to the Optical Link Module OLM for connection to the Fibre communications port In the USA the OLM is certified as a Class 1 laser product conforming to the requirements contained in the Department of Health and Human Services DHHS regulation 21 CFR Subchapter J The certification is indicated by a label on the plastic OLM housing Outside the USA the OLM is certified as a Class 1 laser product conforming to the requirements contained in IEC 60825 1 1993 and EN 60825 1 1994 including Amendment 11 1996 NOTE Ifa DVD is present the following laser safety statement applies This product contains a laser internal to the Digital Versatile Disc DVD housing In the USA the DVD is certified as a Class 1 laser product conforming to the requirements contained in the Department of Health and Human Services DHHS regulation 21 CFR Subchapter J The certification is indicated by a label on the DVD housing Outside the USA the DVD is certified as a Class 1 laser product conforming to the requirements contained in IEC 60825 1 1993 A1 and EN 60825 1
70. fy all cables and boards are securely plugged into the appropriate connectors or slots Remove all extra options such as disk drives one at a time checking its affect on the server Unplug the power cord wait 20 seconds plug the power cord in again and restart the server D oa A W If you suspect a hardware error follow these steps Log users off the LAN and power down the server b Extend the server out of the rack and remove the top cover c Simplify the hp rp7405 rp7410 to the minimum configuration The minimum configuration consists of the following e One cell e Two processors e One quad of memory DIMMS size 256MB or larger e One MP SCSI card e One LAN SCSI card e System Backplane e PCI Backplane e One BPS e Two PCI power modules e Two power cords 7 Remove all third party options and reinstall each one one at a time checking the server after each installation 8 Replace the top cover and reconnect the power cord and other cables 50 Chapter 3 Troubleshooting Common Installation Problems 9 Boot the server and if it does not function properly refer to the following procedures The Server Does Not Power On Use these steps to check for power related problems 1 Check each bulk power supply s BPS LED The LED is located in the lower left hand corner of the power supply face Table 3 2 shows the states of the LEDs 2 Check that the power supply and both power cords are plugged in to the chas
71. g system and selecting the necessary equipment e The air conditioning system that serves the computer room should be capable of operating 24 hours a day 865 days a year It should also be independent of other systems in the building e Consider the long term value of computer system availability redundant air conditioning equipment or capacity e The system should be capable of handling any future computer system expansion e Air conditioning equipment air filters should have a minimum rating of 45 based on AShRA Standard 52 76 Dust Spot Efficiency Test e Introduce only enough outside air into the system to meet building code requirements for human occupancy and to maintain a positive air pressure in the computer room Air Conditioning System Types The following three air conditioning system types are listed in order of preference e Complete self contained package unit s with remote condenser s These systems are available with up or down discharge and are usually located in the computer room e Chilled water package unit with remote chilled water plant These systems are available with up or down discharge and are usually located in the computer room e Central station air handling units with remote refrigeration equipment These systems are usually located outside the computer room e Scalable overhead distribution system This system distributes water overhead to air heat exchangers which cool the air locally o
72. gnaling 5V connector Hot Swap Slot MP SCSI MP Core I O Board The hp rp7405 rp7410 accommodates two sets of MP Core I O functionality Each MP Core I O board set consists of a MP SCSI board and a Procurium LAN SCSI board At least one MP SCSI board is required independent of partitions An additional MP SCSI board can be added as well and is required in a dual partition system Both MP SCSI boards are oriented vertically and plug into the system backplane The MP SCSI board incorporates a dual Ultra160 SCSI controller and is hot pluggable Procurium LAN SCSI Board At least one Procurium LAN SCSI board is required for the minimum system configuration two are required in a dual partition system The Procurium board is a standard PCI form factor card with PCI card edge connectors The PCI backplane has one slot location reserved for the required Procurium board and another that can accommodate either a Procurium board or any other supported add in PCI card The Procurium board is hot pluggable Chapter 1 13 Introduction Detailed hp rp7405 rp7410 Description Mass Storage Disk Backplane Internal mass storage connections to disks are routed on the mass storage backplane having connectors and termination logic All disks are hot pluggable The hp rp7405 rp7410 accommodates one internal removable media device Therefore only one power connector for a removable media device is required on the mass storage backplane The mass
73. hat plugs at a right angle into the cell board The cell board also includes clock circuits test circuits and de coupling capacitors Figure 1 6 shows a simplified view of the memory subsystem It consists of two independent access paths each path having its own address bus control bus data bus and DIMMs In practice the CC runs the two paths 180 degrees out of phase with respect to each other to facilitate pipelining in the CC Address and control signals are fanned out through register ports to the SDRAMs on the DIMMs Data transferred between the CC and SDRAM passes through custom VLSI circuits M2 that are bit sliced four form one 72 bit CC memory data bus These circuits perform speed and width conversion between the SDRAM and MID busses They also perform the write tag update portion of a read modify write RMW access The CC memory data busses are bi directional and run at 250 MT s million transfers per second These links are self clocked in that a pair of clock strobes is passed along with the data so that phase realignment can be done by the receiver Figure 1 6 Memory Subsystem D DIMM SLO 0D N33 DIMMISLOT 207 MIDI_1 a ki i MIDI 1 MIDI 2 35 18 i ess amp Control 53 36 35 18 a Control 53 36 AE E D O D D O 5 UE A po AA E MIDI 0 MIDI 3 MIDI 0 MIDI 3 17 00 FE T M2 71 54 17 00 Control 71 54 ae x DIMMI ES Ecm a DIMM SLOT ZA A q aa DICO gt MIN Kb IN ix
74. he cabinet check for damage that may have been obscured by the shipping container If damage is found after visual inspection document the damage with photographs and contact the transport carrier immediately If the equipment has any damage a damage claim form must be obtained by the customer from the shipping representative The customer should complete the form and return it to the shipping representative NOTE The server may come already racked or ready for rack installation Unpacking a Racked Server This section contains information pertaining to unpacking the cabinet WARNING Wear protective glasses while cutting the plastic bands around the shipping container These bands are under tension When cut they can spring back and cause serious eye injury NOTE Position the pallet allowing for enough space to roll the cabinet off the pallet before starting Remove the cabinet using the following procedure Step 1 Cut the polystrap bands around the shipping container Step 2 Lift the cardboard top cap from the shipping box See Figure 2 1 Step 3 Remove the corrugated wrap from the pallet Step 4 Remove the packing materials 18 Chapter 2 Installation Unpacking the Server CAUTION The plastic wrapping material should be cut off rather than pulled off Pulling the plastic covering off represents an ESD hazard Figure 2 1 Removing the Polystraps and Cardboard Chapter 2 19 Installation Unpacking the Server Step
75. he voltage level of a static charge is determined by the following factors e Types of materials e Relative humidity e Rate of change or separation Table C 2 lists charge levels based on personnel activities and humidity levels Table C 2 Effect of Humidity on ESD Charge Levels Personnel Activity Humidity and Charge Levels voltages 26 32 40 50 E walking A 6 150 V 5 750V 4 625V 3 700V linoleum floor Person walking across a carpeted 18 450 V 17 250 V 13 875V 11 100 V floor Person getting up from a plastic 24 600 V 23 000 V 18 500 V 14 800 V chair a Source B A Unger Electrostatic Discharge Failures of Semiconductor Devices Bell Laboratories 1981 b For the same relative humidity level a high rate of airflow produces higher static charges than a low airflow rate c Some data in this table has been extrapolated Static Protection Measures Follow these precautions to minimize possible ESD induced failures in the computer room e Install conductive flooring conductive adhesive must be used when laying tiles e Use conductive wax if waxed floors are necessary e Ensure that all equipment and flooring are properly grounded and are at the same ground potential e Use conductive tables and chairs e Use a grounded wrist strap or other grounding method when handling circuit boards e Store spare electronic modules in antistatic containers e Maintain recommended humidity level a
76. ht of the server it must be centered on the lifter forks before raising it off the pallet to avoid injury Never extend more than one server from the same cabinet while installing or servicing either an hp rp7405 rp7410 or another server product Failure to follow these instructions could result in the cabinet tipping over 22 Chapter 2 Installation Unpacking the Server Figure 2 5 RONI Lifter mir z 2 3 LI Li LI 3 Step 1 Follow the instructions on the outside of the server packaging to remove the banding and carton top from the server pallet Figure 2 6 Server with Shipping Box Removed Step 2 Remove all cartons from the pallet leaving only the server Chapter 2 23 Installation Unpacking the Server Step 3 Observe Figure 2 7 Remove the two foam cushion for lift access Figure 2 7 Remove Cushions for Lift Access Remove cushion Clearance for Ronl lift is 28 x5 Step 4 Insert the lifter forks under the server Step 5 Carefully roll the lift forward until it is fully positioned against the side of the server 24 Chapter 2 Installation Unpacking the Server Step 6 Slowly raise the server off the pallet until it clears the pallet cushions Figure 2 8 Raising a Server Off the Pallet E A Step 7 Roll the lifter and server away from the pallet Do not raise the server any higher than necessary when moving it over to the rack Figure 2 9 Lifting the Server to the Rack ET N NO
77. ic environment this product may cause radio interference in which case the user may be required to take adequate measures Canada RFI Statement This Class A digital apparatus complies with Canadian ICES 003 Notice relative aux interf rences radio lectriques Canada Cet appareil num ric de la classe A est conforme la norme NMB 003 du Canada xiii BSMI Taiwan Area This product is fully compliant to CNS 13438 CISPR 22 1993 Class A The EMC label is in the form shown in Figure 4 Figure 4 Taiwan Area EMC ESHA se FRANE EEEN PARAR OB Re SiE m HA TH Eimin E f ES Ae LEI NOTE Electrical practices and suggestions in this guide are based on North American practices For countries outside North America local electrical codes will take precedence over North American electrical codes An example would be the recommendation that the PE protective earthing conductor be green with yellow stripes This requirement is a North American directive and does not override the local code requirements for a country outside North America Throughout this manual the LAHJ acronym will be used to indicate Local Authority Has Jurisdiction Acoustics Germany Acoustic Noise A weighted Sound Pressure Level LpA measured at the bystander position normal operation to ISO 7779 LpA 59 dB Ger uschemission Deutschland L rmangabe Schalldruckpegel LpA gemessen am fiktiven Arbeitsplatz bei normalem Betrieb nach DIN 45635 Tei
78. ift Access 24 Figure 2 8 Raising a Server Off the Pallet 0 0 cece eee oo 25 Figure 2 9 Lifting the Server to the Rack 2 LL 25 Figure 2 10 Positioning the Lift handles LL 26 Figure 2 11 Inserting the Pins Into the Rack 2 0 cc eee eens 27 Figure 2 12 Lift Handles Mounted 0 0 cee ene enn nnn 27 Figure 2 13 Lifting the Server 28 Figure 2 14 Cable Management Arm 29 Figure 2 15 Attaching CMA to Rack 29 Figure 2 16 Attaching CMA to the Server 0 0 LL 30 Figure 2 17 Embedded Disks LL 31 Figure 2 18 Cell Board Two processors and CC Shown 0 0 cece eee eee eens 32 Figure 2 19 DIMM Loading Sequence 33 Figure 2 20 Power Cord Configuration 0 0 ccc ee eee e teen ene 34 Figure 2 21 Power Source vs Power Distributi0N o 000 cee eee eee eens 35 Figure 2 22 Front Panel Display ine bee GW as HS HAs Ss OR Maas Ga a ea 39 Figure 2 23 MP Main Menu 40 Figure 2 24 The le Command Screen ll 41 Figure 2 25 The ls Command Screen sr se nari eag ea aA ee eee e teen eens 42 Figure 2 26 The du Command Screen oooooororro eee eens 43 Fioure 4 1 Top Cover 0 et ot oe A A a LES a 61 Figures Figure 4 2 Top Cover Retaining Screws ooooooooorrroror nes 62 Figure 4 3 Disk Drive Location e ee nee 63 Figure 4 4 Disk Drive Detail 64 Figure 4 5 CD DVD Location 66 Figure 4 6 CD DVD Det
79. in Chassis 1 MP Core I O Cards MP Core I O consists of two cards that must be installed in pairs the MP SCSI and the LAN SCSI The first primary set of MP Core I O cards is installed as follows MP SCSI in MP SCSI slot 1 lower slot and LAN SCSI in PCI slot 8 of Chassis 1 from the rear the extreme right hand PCI slot The second set of MP Core I O cards is installed as follows MP SCSI in MP SCSI slot 0 and LAN SCSI in PCI slot 1 of Chassis 0 Cell Board 0 is required to enable the MP SCSI slot 0 upper slot and LAN SCSI slot 1 in Chassis 0 from the rear the extreme left hand PCI slot 30 Chapter 2 Installation Unpacking the Server Embedded Disks The hp rp7405 rp7410 server can operate in the diskless LAN boot mode If disks are to be installed the top two disks are driven by the primary MP Core I O set Install the first embedded disk in the top left location Install the second embedded disk in the top right location Figure 2 17 Embedded Disks Drive 1 1 Path 1 0 0 3 0 6 Drive 1 2 Path 1 0 1 0 0 1 1 6 Drive 0 2 Path 0 0 0 3 0 5 Drive 0 1 Path 0 0 0 3 0 6 Chapter 2 31 Installation Unpacking the Server Processors Each cell board can hold up to four processors Processor slots are numbered 0 3 Install processors in ascending order slot 0 1 2 and 3 It is not necessary to balance the number of processors across both cell boards Figure 2 18 Cell Board Two processors and CC Shown
80. ipment Over time very fine whiskers of pure metal can form on electroplated zinc cadmium or tin surfaces If these whiskers are disturbed they may break off and become airborne possibly causing failures or operational interruptions For over 50 years the electronics industry has been aware of the relatively rare but possible threat posed by metallic particulate contamination During recent years a growing concern has developed in computer rooms where these conductive contaminants are formed on the bottom of some raised floor tiles Although this problem is relatively rare it may be an issue within your computer room Since metallic contamination can cause permanent or intermittent failures on your electronic equipment Hewlett Packard strongly recommends that your site be evaluated for metallic particulate contamination before installation of electronic equipment 122 Appendix C A AC power specifications 95 acoustics 115 air conditioning 111 system recommendations 111 air conditioning ducts 113 air distribution system room space return air 111 air ducts 99 illustrated 99 average floor loading 118 B backplane mass storage 14 84 85 91 94 removing and replacing 84 PCI 2 4 11 13 79 system 4 8 11 12 13 15 59 91 94 97 basic air conditioning equipment requirements 110 basic air distribution systems 111 booting HP UX 47 BPS Bulk Power Supply 39 C cable management arm 29 cell board
81. l 19 LpA 59 dB IT Power System This product has not been evaluated for connection to an IT power system an AC distribution system having no direct connection to earth according to IEC 60950 TT TN C and TN C S Power Systems These products should not be connected to power systems that switch open the return lead when the return lead also functions as the protective earth PE A separate PE ground wire must be connected to the equipment at the designated PE terminal tie point xiv Installation Conditions See installation instructions before connecting this equipment to the input supply Voir la notice d installation avant de raccorder au r seau WARNING NORDIC Class 1 Equipment Denmark For tilslutning af de vrige ledere se medf lgende installationsvejledning WARNING NORDIC Class 1 Equipment Sweden Apparaten skall anslutas till jordat uttag n r den ansluts till ett n tverk Network Connected Equipment The installation must provide a ground connection for the network equipment CAUTION Sweden Apparaten skall anslutas till jordat uttang n r deb abskuts till ett n tverk CAUTION Norway Apparaten skall anslutas till jordat uttang nar deb abskuts till ett natverk XV Lithium Battery Caution WARNING Observe the correct polarity when changing the lithium battery There is a danger of explosion if battery is installed incorrectly Replace only with the same or equivalent type recommended by the manu
82. line sources Hazardous voltages and energy maybe present even after the removal of a single input source Trained service personnel must follow the service guidelines WARNING Do not stand in front of the equipment as it is rolled off the pallet onto the ramps When removing the equipment from the shipping pallet follow the guidelines specified in the Installation Procedures section of the appropriate equipment guides Figure 1 Declaration of Conformity DECLARATION OF CONFORMITY according to ISOAEC Guide 22 and EN 45014 Manufacturer s Name Hewlett Packard Company Internet amp Applications Systems Division Manufacturer s Address 8000 Foothills Blvd Roseville CA 95747 USA declares that the product Product Name HP Server rp7410 Regulatory Model RSVLA 0102 xx where xx is an optional suffix and x is any letter or blank Product Options All conforms to the following Product Specifications Safety IEC 60950 1991 A1 A2 A3 A4 EN 60950 1992 A1 A2 43 44 A11 IEC 60825 1 1993 41 EN 60825 1 1994 A11 Class 1 GB 4943 1995 CISPR 22 1997 EN 55022 1998 Class A 1 CISPR 24 1997 EN 55024 1998 IEC 61000 3 2 1995 EN 61000 3 2 1995 4 14 IEC 61000 3 3 1994 EN 61000 3 3 1995 GB 9254 1988 Supplementary Information The product herewith complies with the requirements of the Low Voltage Directive 73 23 EEC and the EMC Directive 89 336 EEC and carries the CE marking accordingly 1 The product was tested in a
83. lled a Protection Domain is a cell s running the same OS and sharing processes and memory space among the components Each nPartition must have one root cell and may have both The hp rp7405 rp7410 has only two possible nPartition configurations single or dual The additional cell that may be part of the nPartition does not require I O links nor MP Core I O cards Chapter 1 9 Introduction Detailed hp rp7405 rp7410 Description In the single nPartition case if two cells are present either cell may be the root cell assuming the both cells have MP Core I O functionality present If only one cell is present that cell is the root cell and should be cell 1 In the dual nPartition case two cells required each nPartition consists of one cell and each cell must be a root cell The ability to interconnect two cells in one nPartition or isolate the cells in a dual nPartition system provides system configuration flexibility System partitioning is configured by the system management processor Internal Disk Devices for hp rp7405 rp7410 As Figure 1 4 shows in an hp rp7405 rp7410 cabinet the top internal disk drives connect to cell 1 through the MP Core T O for cell 1 for 1 0 0 3 0 6 and the LAN SCSI card in slot 1_8 I O chassis 1 slot 8 for 1 0 1 0 0 1 1 6 Both of the bottom disk drives 0 0 0 3 0 6 and 0 0 0 3 0 5 connect to cell 0 through the MP core I O for cell 0 A CD DVD ROM drive or DAT drive connects to cell 1 through the core I O
84. luminum strips mounted to the subfloor The strips should be 0 032 in 0 08 cm thick and a minimum of 3 0 in 8 0 cm wide Connect each pedestal to four strips using 1 4 in 6 0 mm bolts tightened to the manufacturer s torque recommendation Appendix C 107 Site Preparation Grounding Systems e Good Use the raised floor structure as a ground grid In this case the floor must be designed as a ground grid with bolted down stringers and corrosion resistive plating to provide low resistance and attachment points for connection to service entrance ground and server equipment The use of conductive floor tiles with this style of grid further enhances ground performance Figure C 1 Raised Floor Ground System Floor panel Ground wire Pai to power panel gt x Grounding clamp Grounding braid Band and pedestal to computer equipment Siep 1300 Equipment Grounding Implementation Details If it has been determined to be necessary connect all Hewlett Packard equipment cabinets to the site ground grid as follows Step 1 Attach one end of each ground strap to the applicable cabinet ground lug Step 2 Attach the other end to the nearest pedestal base raised floor or cable trough ground point nonraised floor Step 3 Check that the braid contact on each end of the ground strap consists of a terminal and connection hardware a 1 4 in 6 0 mm bolt nuts and washers Step 4 Check that the braid contact connection
85. media bay Below the mass storage section and behind a removable bezel are two PCI DC to DC power converters The bulk power supply section is partitioned by a sealed metallic enclosure located in the bottom of the package This enclosure houses the 2N fully redundant BPSs 14 Chapter 1 Introduction Detailed hp rp7405 rp7410 Description Figure 1 10 Right Front View of hp rp7405 rp7410 PCI cards Front panel display board Cell boards PCI DC to DC converters Bulk powers supplie The PCI I O card section located towards the rear is accessed by removing the top cover The PCI OLR fan modules are located in front of the PCI cards These six 9 2 cm fans are housed in plastic carriers They are configured in two rows of three fans The MP SCSI MP Core I O boards are positioned vertically at the rear of the chassis The PCI card bulkhead connectors are located in the top rear portion of the product volume Four OLR system fan modules externally attached to the chassis are 15 cm 6 5 inch fans Two fans are mounted on the front surface of the chassis and two are mounted on the rear surface Redundant line cords attach to the floating AC connector module at the bottom rear Two 20 amp cords are required to power the server Two additional line cords provide redundancy A cable harness that connects from the rear of the BPSs to the system backplane provides DC power distribution Access the system backplane is accomplishe
86. menu and select Connection Setup 2 Select Serial Port 3 Select Com1 4 Check the settings and change if required Go to More Settings to set Xon Xoff Click OK to close the More Settings window al Click OK to close the Connection Setup window 6 Pull down the Setup menu and select Terminal under the Emulation tab 7 Select any HP terminal type Preferred types are HP70092 HP70096 or HP70094 HP70098 VT100 8 Click Apply This option is not highlighted if the terminal type you want is already selected 9 Click OK Connecting the CE Tool to the Local RS 232 Port on the MP This connection allows direct communications with the MP Only one window can be created on the CE Tool to monitor the MP When enabled it provides direct access to the MP and any partition Use the following procedure to connect the CE Tool to the Local RS 232 Port on the MP 1 Connect one end of a null modem cable 9 pin to 9 pin Part Number 5182 4794 to the M cable connector labeled CONSOLE 2 Connect the other end of the RS 232 cable to the CE Tool Standby Power and Logging in to the MP After connecting the serial device it is possible to login to the Management Processor MP Housekeeping power also known as standby power is generated as soon as AC power is applied to the server Because the MP uses standby power it is possible to login to the MP even when the power switch is in the OFF position The power switch is a DC power switch
87. mpt appears Do you wish to stop at the ISL prompt prior to booting y n Enter n NOTE If the partition fails to boot or if the server was shipped without instant ignition you may have to boot from a DVD that contains the operating system and other necessary software Chapter 2 47 Installation Booting HP UX using Boot Console Handler BCH 48 Chapter 2 3 Troubleshooting Chapter 3 49 Troubleshooting Common Installation Problems Common Installation Problems The following sections contain general procedures to help you locate installation problems CAUTION Replace the top cover before operating the server even for a short time Otherwise overheating can damage chips boards and mass storage devices However you can safely remove the PCI access panel while the server is running to remove and replace PCI hot plug boards For any other service activity requiring access to the processor baseboard or I O backplane power down the server and observe all safety precautions Most problems are the result of incorrect system and SCSI subsystem configurations To troubleshoot an installation problem perform the following checks in the order given m Check all cable and power connections including those in the rack etc 2 Ensure the server is configured properly Check the Setup Utility If the error is a network related problem determine if the server has enough memory and hard disk drive capacity Veri
88. n Run PDC SP via On Green One or more partition running GER Off No partition running or SP not installed or SP installed and not active Fault PDC SP via Flash Red One or more Partitions have reported a fault ome Off No Partitions running or SP not installed or SP installed and not active Bulk Power Supply LEDs There is a single three color LED on each bulk power supply Table 3 2 BPS LEDs LED Indication Description Blink Green BPS in standby state and no faults or warnings Green BPS in run state 48 volt output enabled and no faults or warnings Blink Yellow BPS in standby or run state and warning s present but no faults Yellow BPS in standby state and recoverable fault s present but no non recoverable faults Blink RED BPS state may be unknown non recoverable fault s present Red Not Used therefore BPS Failure Off BPS state unknown therefore BPS Fault or Failure PCI Power Supply LEDs There are three LEDs on the PCI power supply Green and yellow LEDs follow OL operation A multi color LED reports warnings and faults Table 3 3 PCI Power Supply LEDs LED Driven By State Description Power Each Supply On Green All output voltages generated by the power supply are within limits Off Output voltages are turned off Attention SP via PCILPM Yellow See Table 3 7 52 Chapter 3 Troubleshooting Common Installation Problems
89. n equipment vibration is present lockwashers must be used on all connections to prevent connection hardware from working loose Data Communications Cables Power transformers and heavy foot traffic create high energy fields Route data communications cables away from these areas Use shielded data communications cables that meet approved industry standards to reduce the effects of external fields Appendix C 109 Site Preparation Environmental Elements Environmental Elements The following environmental elements can affect an hp rp7405 rp7410 server installation e Computer room preparation e Cooling requirements e Humidity level e Air conditioning ducts e Dust and pollution control e Electrostatic discharge ESD prevention e Acoustics noise reduction Computer Room Preparation The following guidelines are recommended when preparing a computer room for an hp rp7405 rp7410 server system e Locate the computer room away from the exterior walls of the building to avoid the heat gain from windows and exterior wall surfaces e When exterior windows are unavoidable use windows that are double or triple glazed and shaded to prevent direct sunlight from entering the computer room e Maintain the computer room at a positive pressure relative to surrounding spaces e Usea vapor barrier installed around the entire computer room envelope to restrain moisture migration e Caulk and vapor seal all pipes and cables that penetrate the
90. nd airflow rates in the computer room 114 Appendix C Site Preparation Environmental Elements Acoustics Computer equipment and air conditioning blowers cause computer rooms to be noisy Ambient noise level in a computer room can be reduced as follows e Dropped ceiling Cover with a commercial grade of fire resistant acoustic rated fiberglass ceiling tile e Sound deadening Cover the walls with curtains or other sound deadening material e Removable partitions Use foam rubber models for most effectiveness Appendix C 115 Site Preparation Computer Room Safety Computer Room Safety Inside the computer room fire protection and adequate lighting for equipment servicing are important safety considerations Federal and local safety codes govern computer installations Fire Protection The national Fire Protection Association s Standard for the Protection of Electronic Computer Data Processing Equipment NFPA 75 contains information on safety monitoring equipment for computer rooms Most computer room installations are equipped with the following fire protection devices e Smoke detectors e Fire and temperature alarms e Fire extinguishing system Additional safety devices are e Circuit breakers e Anemergency power cutoff switch e Devices specific to the geographic location i e earthquake protection Lighting Requirements for Equipment Servicing Adequate lighting and utility outlets in a computer room
91. nto the backplane while the LAN SCSI boards plug into the PCI Backplane I O Subsystem All of the I O is integrated into the system by way of the PCI busses The CC on each cell board communicates with one SBA over the SBA link The SBA link consists of both an inbound and an outbound link with an effective bandwidth of approximately 1 GB sec The SBA converts the SBA link protocol into ropes SBA can support up to 16 of these high speed bi directional links for a total aggregate bandwidth of approximately 4 GB sec The LBA acts as a bus bridge supporting either one or two ropes and capable of driving either PCI 2x Turbo 33 MHz x 64 bits or PCI 4 Twin Turbo 66 MHz x 64 bits respectively 4 Chapter 1 Introduction hp rp7405 Servers hp rp7405 Servers Hewlett Packard offers a cost effective server based on the hp rp7410 by employing a reduced number of processors memory core I O or power supplies as indicated in Table 1 1 These servers provide a somewhat reduced performance than the fully functional hp rp7410 servers Table 1 1 hp rp7405 Servers Server Product Number Description rp7405 2 way system A7111A Includes rp7405 SMP base system two 650 MHz PA RISC processors 4 GB memory 2 x 2GB memory modules two 73 GB 10k internal disks one DVD drive one cell board one core I O and two power supplies rp7405 4 way system A7112A Includes rp7405 SMP base system four 650 MHz PA RISC processors 8 GB memor
92. oading Sequence Block 1 shows the minimum memory configuration per cell board Each cell board therefore could have up to four different density DIMMs if there were that many as long as each set of four are identical Box 2 and Box 4 show the more optimal memory configurations because loading DIMMSs in sets of eight takes advantage of the pipelined structure of the memory interface of the CC Chapter 2 33 Installation Connecting AC Input Power Connecting AC Input Power The hp rp7405 rp7410 has five line cord configurations All four line cords Cords A0 and Al only Cords BO and B1 only Cords AO and BO only Cords Al and B1 only A single line cord configuration is not allowed Figure 2 20 Power Cord Configuration ni ey CE The power cord configuration is passed to the operating system using the pwrgrd Power Grid command Each of the five selections in the pwrgrd command matches one of the configurations The appropriate option should be selected for the actual line cord configuration With the correct configuration selected the LEDs should be green when the pwrgrd command is invoked the following menu is displayed IMPORTANT Options 1 and 2 are for Hewlett Packard internal use only Do not select these options prompt gt pwrgrd Power grid configuration preference La Zi 34 4 5 Grid A only Cords A0 A1 required Grid B only Cords BO Bl required Grids A B Cords A0 A1 B0 B1 requi
93. on History Table 1 Revisions Revision Part Number Release Date Description Third A6752 96008 November 2002 Corrected power cord and power reqirements section Corrected DIMM oading order Other general corrections Second A6752 96002 August 2002 Changed title revised entire book First A6752 91001 February 2002 Initial release viii Notational Conventions WARNING CAUTION NOTE Warnings highlight procedures or information necessary to avoid injury to personnel The warning should tell the reader exactly what will result from what actions and how to avoid them A caution highlights procedures or information necessary to avoid damage to equipment damage to software loss of data or invalid test results A note highlights supplemental information Safety and Regulatory Regulatory Model RSVLA 0102 For your protection this product has been tested to various national and international regulations and standards The scope of this regulatory testing includes electrical mechanical safety radio frequency interference acoustics and know hazardous materials Where applicable approvals obtained from third party test agencies are shown on the product label Safety in Material Handling WARNING Do not lift the cabinet manually To avoid physical injury you must use a mechanical lifting device WARNING Use care when working with hazardous voltages This equipment may be configured with dual input
94. ons Figure B 1 illustrates the location of the inlet and outlet airducts on a single cabinet Figure B 1 Airflow Diagram Appendix B 99 System Specifications Environmental Specifications 100 Appendix B C Site Preparation Appendix C 101 Site Preparation Electrical Considerations Electrical Considerations Proper design and installation of a power distribution system for an hp rp7405 rp7410 server requires specialized skills Those responsible for this task must have a thorough knowledge and understanding of appropriate electrical codes and the limitations of the power systems for computer and data processing equipment In general a well designed power distribution system exceeds the requirements of most electrical codes A good design when coupled with proper installation practices produces the most trouble free operation The electrical factors discussed in this section are A detailed discussion of power distribution system design and installation is beyond the scope of this document However electrical factors relating to power distribution system design and installation must be considered during the site preparation process e Computer room safety e Electrical load requirements circuit breaker sizing e Power quality e Distribution hardware e System installation guidelines 102 Appendix C Site Preparation Electrical Load Requirements Circuit Breaker Sizing Electrical Load Requirements
95. ould result in damage to the server Figure 4 14 BPS Location BPS Locations IMPORTANT When a BPS is pulled from the server and then immediately re inserted the server can report an overcurrent condition and shut down Chapter 4 75 Removal and Replacement Removing and Replacing a Bulk Power Supply Removing a BPS Figure 4 15 BPS Detail Step 1 Pull the extraction levers located on the upper front outer portion of the BPS Step 2 Slide the BPS forward using the extractions levers to remove it from the chassis Replacing a BPS Step 1 Verify that the extraction levers are in the open position then insert the BPS into the empty slot NOTE The BPS easily slides into the chassis however a slow firm pressure will be needed to properly seat the connection Step 2 Ensure the BPS has seated by closing the extraction levers NOTE BPS LED should show BPS operational and no fault BPS LED should be GREEN 76 Chapter 4 Removal and Replacement Removing and Replacing a PCI Power Module Brick Removing and Replacing a PCI Power Module Brick The PCI power module is located in the front of the chassis The PCI power module is a hot pluggable component CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 16 PCI Power Module Location PCI Power Modules Table 4 4 PCI Powe
96. play activity for each partition as it powers up 1 Open a separate Reflection 1 window and connect to the MP 2 Select the VFP command and choose the partition desired to view There should be no activity on the screen at this point in the installation process NOTE More than one window cannot be opened using a serial display device To power on the server 1 a F WwW N 44 Switch the power switch at the front of the server to On The following events occur e Power is applied to the server e Processor Dependent Code PDC starts to run on each cell e Cell self test executes e Hardware initializes for the server e Console communication is established When activity on the Reflection 1 screen stops return to the MP Main Menu by typing Ctr1 B Enter co to enter console mode Enter the partition number of the partition to boot Press Enter Chapter 2 Installation Selecting a Boot Partition using the Management Processor Selecting a Boot Partition using the Management Processor At this point in the installation process the hardware is set up the Management Processor MP is connected to the LAN the AC and DC power have been turned on and the selftest is completed Now the configuration can be verified After DC is powered on and the selftest is complete use the MP to select a boot partition 1 From the MP Main Menu enter cm 2 From the MP Command Menu enter bo 8 Select the partition to boot
97. produce encached data To resolve this these commands should be run when the disk drive is removed Step 1 Before installing the disk drive enter the following command diskinfo v dev rdsk cxtxdx Step 2 Enter the following command ioscan f The response message after running this command is NO_HW Step 3 Make sure the front locking latch is open then position the disk drive in the chassis Step 4 Slide the disk drive into the chassis a slow firm pressure will be needed to properly seat the connection Step 5 Depress the front locking latch to secure the disk drive in the chassis Step 6 Spin up the disk by entering one of the following commands diskinfo v dev rdsk cxtxdx ioscan f 64 Chapter 4 Removal and Replacement Removing and Replacing a Disk Drive pvcreate vgcfgrestore Chapter 4 65 Removal and Replacement Removing and Replacing a CD DVD Drive Removing and Replacing a CD DVD Drive The CD DVD is located in the front of the chassis The system power to this component must be removed before attempting to remove or replace it Refer to Shutting Down nPartitions and Powering Off Hardware Components for more information CAUTION Observe all ESD safety precautions before attempting this procedure Failure to follow ESD safety precautions could result in damage to the server Figure 4 5 CD DVD Location CD DVD 66 Chapter 4 Removal and Replacement Removing and Replacing a CD DVD
98. ps The recommended circuit breaker size is 20 amps for North America For countries outside North America consult your local electrical authority having jurisdiction for the recommended circuit breaker size System AC Power Specifications Power Cords The supplied power cord length is 15 feet 457 4 cm Table B 3 lists the various power cables available for use with a hp rp7405 rp7410 system Each power cord is 15 feet 4 5 meters in length with a IEC 60320 1 C19 female connector attached to one end Table B 3 Power Cords Part Number Description Where Used 8120 6895 Stripped end 240 volt International Europe 8120 6897 Male IEC309 240 volt International 8121 0070 Male GB 1002 240 volts China 8120 6899 Male CEEE 7 7 240 volt Continental Europe 8121 0558 Male ISI 32 240 volts Israel 8120 6903 Male NEMA L6 20 240 volt North America Japan Appendix B 95 System Specifications Electrical Specifications System Power Specifications Table B 4 and Table B 5 list the AC power requirements for an hp rp7405 rp7410 server These tables provide information to help determine the amount of AC power needed for your computer room Table B 4 AC Power Specifications Requirements Value Comments Nominal input voltage 200 208 220 240 VAC Minimum Operating Voltage 180 VAC Maximum Operating Voltage 269 VAC Frequency range minimum 50 60 Hz maximum Number of phases 1 Rated
99. r Module LED Indications LED LED State Meaning Power LED Green Off Power module failure On Normal operation Fault LED Multi color Off Normal operation Blink amber Module internal failure Amber Module internal failure Bink red Module internal failure Chapter 4 77 Removal and Replacement Removing and Replacing a PCI Power Module Brick Removing a PCI Power Module Brick Figure 4 17 PCI Power Module Detail Step 1 Securely grasp the handle on the front of the power module Step 2 Firmly depress the securing thumb latch Step 3 Slide the module from the chassis Replacing a PCI Power Module Brick Step 1 Carefully position the power module in the chassis and depress the thumb latch Step 2 The module easily slides into the chassis however a slow firm pressure will be needed to properly seat the connection Step 3 Release the thumb latch NOTE PCI power module LED should show power module is operational and the green LED should be on 78 Chapter 4 Removal and Replacement Removing and Replacing the PCI Voltage Regulator Modules Removing and Replacing the PCI Voltage Regulator Modules Removing PCI VRM Step 1 Power down server IMPORTANT Power must be removed from both PCI Chassis 0 and PCI Chassis 1 to continue Step 2 Remove right side cover Step 3 Remove PCI side panel Step 4 Identify VRM to be replaced O or 1 Step 5 Unscrew VRM from bracket 2
100. r On Green SP LAN Data Activity System SCSI Diffsense System SCSI Controller On Green On LVD Off Single Ended System SCSI TermPower System SCSI Controller On Green Terminators are powered SelfTest On Yellow Yellow during POST of failure LAN SCSI PCI Slot LEDs The LAN SCSI LEDs are located on the PCI Panel Table 3 9 LAN SCSI LEDs LED Driven By State Description System LAN 1000BT System LAN Controller On Green System LAN in 1000BT Mode System LAN 100BT System LAN Controller On Green System LAN in 100BT Mode System LAN 10BT System LAN Controller On Green System LAN in 10BT Mode System LAN Link OK System LAN Controller On Green System LAN link OK System LAN Activity System LAN Controller On Green System LAN Data Activity System LAN Full Duplex System LAN Controller On Green System LAN in full duplex mode System SCSI Diffsense System SCSI On Green On LVD Off Single ended Controller System SCSI TermPower System SCSI On Green Terminators are powered Controller Chapter 3 55 Troubleshooting Common Installation Problems 56 Chapter 3 4 Removal and Replacement Chapter 4 57 Removal and Replacement Shutting Down nPartitions and Powering Off Hardware Components Shutting Down nPartitions and Powering Off Hardware Components When you remove and replace hardware you may need to shut down one or more nPartitions on the server In some cases you also will need to power off hardware components
101. rd quantity 2 min 4 max Enabled for cell hot plug dual partition dual and or redundant MP Core I O More PCI slots up to 16 Upgradeable to PCI X Superset of MP Core I O functionality Cell Board The cell board contains the processors main memory and the CC ASIC that interfaces the processors and memory to the off board I O The CC provides a crossbar connection which allows communication with other cell boards in the system It connects to the PDH and SINC hardware Each cell board holds up to 16 DIMMS There can be one or two cell boards installed in a server The cell boards have hot plug capability Chapter 1 Introduction hp rp7405 rp7410 Overview System Backplane The system backplane comprises the system clock generation logic the system reset generation logic DC to DC converters power monitor logic and two Local Bus adaptor LBA link to PCI converter ASICs It also includes connectors for attaching the cell boards PCI backplane MP Core I O MP SCSI boards SCSI cables bulk power chassis fans front panel display intrusion switches and the system scan card Unlike Superdome or the rp8400 there are no XBC chips on the system backplane The crossbar less back to back CC connection increases performance and reduces costs There are only two sets of cell board connectors because the server has only two cells Also only half of the MP Core I O board set connects to the system backplane The MP SCSI boards plug i
102. red Cords AO amp BO only Cords Al amp B1 only Select Option 34 Chapter 2 Installation Connecting AC Input Power If two separate power sources are available the two power supplies can be plugged into the separate power sources increasing system reliability should one power source fail Figure 2 21 Power Source vs Power Distribution 220 VAC 220 VAC 220 VAC 220 VAC Rear of Cabinet 180 269 VAC WARNING Voltage is present at various locations within the server whenever a power source is connected This voltage is present even when the main power switch is in the off position Failure to observe this warning could result in personal injury or damage to equipment NOTE System firmware will prevent boot when a single power cord configuration is detected Chapter 2 35 Installation MP Core I O Connections MP Core I O Connections Each hp rp7405 rp7410 can have up to two MP Core I O board sets installed This allows for two partitions to be operating or allows for MP Core I O redundancy in a single partition configuration Each MP Core I O board set consists of two boards the MP SCSI board and the LAN SCSI board The MP SCSI board is oriented vertically and accessed from the back of the server The LAN SCSI is accessed from the PCI expansion card bay Only the primary MP core I O board set MP SCSI slot 1 amp LAN SCSI slot 8 Chassis 1 is required for a single partition implementa
103. reduce the possibility of accidents during equipment servicing Safer servicing is also more efficient and therefore less costly For example it is difficult to see cable connection points on the hardware if there is not enough light Adequate lighting reduces the chances of connector damage when cables are installed or removed The minimum recommended illumination level is 70 foot candles 756 lumens per square meter when the light level is measured at 30 inches 76 2 cm above the floor 116 Appendix C Site Preparation Facility Characteristics Facility Characteristics This section contains information about facility characteristics that must be considered for the installation or operation of an hp rp7405 rp7410 server Facility characteristics are e Floor loading e Windows e Altitude effects Floor Loading The computer room floor must be able to support the total weight of the installed computer system as well as the weight of the individual cabinets as they are moved into position Floor loading is usually not an issue in nonraised floor installations The information presented in this section is directed toward raised floor installations NOTE Any floor system under consideration for an hp rp7405 rp7410 server installation should be verified by an appropriate floor system consultant Raised Floor Loading Raised floor loading is a function ofthe manufacturer s load specification and the positioning of the equipment
104. rements are needed to keep ambient air intake to the computer system cabinets within the specified temperature and humidity ranges Figure C 3 Footprint 24 0010 a ES Rack Rear 35 8 em isar Am Tip Food i With Balls ad tn Semice 35 0in 252 am i T S30 In 1299 om t j Senice 350 in PES 65 2cm 3 in aime gt Rack From Server Fully Extended m i E Space planning should also include the possible addition of equipment or other changes in space requirements Equipment layout plans should also include provisions for the following e Channels or fixtures used for routing data cables and power cables e Access to air conditioning ducts filters lighting and electrical power hardware e Power conditioning equipment e Cabinets for cleaning materials e Maintenance area and spare parts Appendix C 121 Site Preparation Zinc Particle Contamination Zinc Particle Contamination Metallic particulates can be especially harmful around electronic equipment This type of contamination may enter the data center environment from a variety of sources including but not limited to raised floor tiles worn air conditioning parts heating ducts rotor brushes in vacuum cleaners or printer component wear Because metallic particulates conduct electricity they have an increased potential for creating short circuits in electronic equipment This problem is exaggerated by the increasingly dense circuitry of electronic equ
105. ry interrupt auto boot when you see the Attempting to boot and To discontinue press any key within 10 seconds messages If the nPartition is at the BCH menu interface then HP UX is shut down Otherwise proceed with the next step to shut down HP UX From the MP Main menu enter CO and select the console for the nPartition you plan to shut down You should have access to the HP UX login prompt or command line when using the nPartition s console If you have no interactivity at the console HP UX may be halted or hung At the nPartition s console login to HP UX and shut down the operating system After making arrangements with the customer issue the shutdown command to shut down and halt HP UX on the nPartition Chapter 4 Removal and Replacement Shutting Down nPartitions and Powering Off Hardware Components For example the shutdown h 240 command will shut down and halt HP UX on the nPartition after waiting for a grace period of four minutes 240 seconds To reboot the nPartition after it is halted use the MP Command menu s RS command to restart the nPartition This allows the nPartition to reset and boot to its BCH interface if auto boot is configured it also boots HP UX Powering Off Hardware Components This procedure is for powering off and powering on components that are to be removed and replaced Step 1 Login to the server s service processor MP Step 2 Ifthe component you will power off is assigne
106. s ducted into the ceiling plenum from upflow air conditioning equipment located in the computer room or from an air handling unit remote The ceiling construction should resist air leakage Place perforated ceiling panels with down discharge air flow characteristics around the perimeter of the system cabinets The supply air emitted downward from the perforated ceiling panels is then available near the cooling air intake vents of the computer system cabinets Return air should be ducted back to the air conditioning equipment though the return air duct above the ceiling e Above ceiling ducted air distribution system Supply air is ducted into a ceiling diffuser system from upflow air conditioning equipment located in the computer room or from an air handling unit remote Adjust the supply air diffuser system grilles to direct the cooling air downward around the perimeter of the computer system cabinets The supply air is then available near the cooling air intake vents of the computer system cabinets Table C 1 Computer Room Environment dr Recommended Maximum Rate of Non Operating Parameter Operating Limits Operating Change per hour Ranges Range Temperature 41 95 F 68 77 F 20 C hour 40 C 70 C 5 35 C 20 25 C Humidity 15 80 40 55 RH 30 RH hour 90 RH with no condensation non condensing non condensing non condensing 40 55 recommended 65 C 149 F
107. sis The Server Powers On But Then Shuts Down with a Fault Light Use this checklist to check for the following problems when the server powers on and then off 1 Check that a conductive item has not been dropped or left inside the server chassis 2 Check the connections on all boards 3 Check the system backplane for bent pins hp rp7405 rp7410 LED Indicators The server has LEDs that indicate the health of the server This section defines those LEDs Front Panel LEDs There are seven LEDs located on the front panel Table 3 1 Front Panel LEDs LED Driven By State Description Bulk Power Good GPM On Green 48V Good LED works even if SP is not installed or installed and not active Off 48V Off Standby Power Good GPM On Green 3 3V SB Good LED works even if SP is not installed or installed and is not active Off 3 3V Off SP Active GPM On Green At least one SP is installed and Active Off No SPs are installed or at least one is installed but not active Remote SP via GPM On Green Dial in remote console enabled Off Dial in remote console is disabled or SP not installed or SP installed and not active Attention SP via GPM Flash Yellow Chassis log alert unread Off No alert or SP not installed or SP installed and not active Chapter 3 51 Troubleshooting Common Installation Problems Table 3 1 Front Panel LEDs Continued LED Driven By State Descriptio
108. ste A dea io nee ac tat OURO ene rt 3 System Backplane ci ile a a ayduadadly 4 TO Subsystemi sii cee Ses e a its ests he AE es wate Pande a e IN ia el bb Shs GUAGE waka ete 4 hp 1p 1405 Servers otro e rali GIS bed ob aes Pe eS S 5 Detailed hp rp7405 rp7410 Description 0 0 0 0 00 cc ee eee eens 6 Cell Board A O OR RN 7 Cells and nPartitions ju ter ie i al POR ia dea li ae 9 System Backplane aa iter le A A a Ani 11 VO Subsystem e erene aeea dea 11 Package Description ssi tire aa a a a 14 2 Installation Unpacking the Server ue Gloria ian ale ail Gl e eee i Pari 18 Unpacking a Racked Server eee eee eee een a 18 Unpacking a Non Racked Server 22 Installing Server Into the Rack 28 Installing the Cable Management Arm CMA ll 29 Installing Add On Products 30 Connecting AC Input Power 34 MP Core T O Connections 0 seca sia e Satta sO cece eo Hak we Oe Tes a a Rs Meee AEE da ds 36 MP SCSI Commecti0ns aat aie a aii a e ara aa a a a i E a a E E e aa 36 LAN SCSLConn ctions perio da e eina e E E ae AR ea A 36 Management Processor Access LL 36 Setting Up the CE Tool PO siii er si Ss 37 Standby Power and Logging in to the MP 38 Configuring LAN Information for the MP 0 0 ccc cece ene eens 40 Verifying Presence of the Cell Boards LL 42 Powering On the hp rp7405 rp7410 Server 44 Selecting a Boot Partition using the Management Processor 0 cc eee e
109. storage backplane incorporates a circuit that allows power to the internal removable media device to be programmatically cycled Package Description Dimensions The dimensions of the hp rp7405 rp7410 are as follows e Width 44 45 cm 17 5 inches constrained by EIA standard 19 inch racks e Depth Defined by cable management constraints to fit into standard 36 inch deep racks Rittal Compaq Rosebowl I 25 5 inches from front rack column to PCI connector surface 26 7 inches from front rack column to MP Core I O connector surface 80 inches overall package dimension including 2 7 inches protruding in front of the front rack columns e Height 10U 5 4 cm 43 91 cm 17 287 inches This is the appropriate height for a product that consumes 10U of rack height while allowing adequate clearance between products directly above and below this product Fitting four server units per 2 m rack and upgrade of current 10U height products in the future are the main height constraints System Chassis The mass storage section located in the front allows access to removable mass storage devices without removal of the bezel not shown This is especially helpful when the system is mounted in the lowest position in a rack The mass storage bay accommodates one 5 25 inch removable media device and up to four 3 5 inch hard drives The front panel display board containing LEDs and the system power switch is located directly above the 5 25 inch removable
110. tains 36x4 SDRAM memory components similar to PC 133 memory but qualified to run at 125MHz They have an low voltage TTL interface The CEC does not support traditional DRAMs The hp rp7405 rp7410 supports DIMMs with 128 256 512 and 1024 Mbit devices Table 1 3 shows each DIMM supported with its associated capacity the resulting total system capacity and the memory component density DIMMs must be loaded in sets of four at specific locations For best performance loading sets of eight DIMMs is recommended Table 1 3 hp rp7405 rp7410 DIMMs DIMM Capacity Total Capacity Memory Component Density 512 Mbyte 16 Gbytes 128 Mbit 1G Byte 32 Gbytes 256 Mbit Main Memory Performance Latency to main memory is an important parameter in determining overall system performance With memory busses running at 125 MHz the latency for a page hit is 8 5 cycles 68ns the latency for a page closed is 11 5 cycles 92ns and the latency for a page miss is 14 5 cycles 116ns Cells and nPartitions NOTE In the following discussion the term cell refers to a cell board A cell board that has an I O link to a bootable device and a console usually supplied by an MP Core I O card is a potential boot cell The cell that contains the boot console I O path is the called the root cell Both cells are potential root cells The primary or default root cell in a single nPartition system is the bottom cell cell 1 An nPartition also ca
111. tion Each cell area fan cooling is controlled by a smart fan control board embedded in the fan module plastic housing The smart fan control board receives fan control input from the system fan controller on the system backplane and returns fan status information to the system fan controller The smart fan control board also controls the power and the pulse width modulated control signal to the fan and monitors the speed indicator back from the fan The fan status LED is driven by the smart fan control board Bulk Power Supply Cooling Cooling for the bulk power supplies is provided by two 2 60mm fans contained within each BPS Air flows into the front of the BPS and is exhausted out of the top of the power supply though upward facing vents near the rear of the supply The air is then ducted out of the rear of the chassis with minimal leakage into the cell airflow plenum Appendix B 97 System Specifications Environmental Specifications PCIMass Storage Section Cooling Six 6 92mm fans located between the Mass Storage Devices and the PCI Card Cage provide airflow through these devices The PCI fans are powered off of housekeeping power and run at full speed at all times The air is pulled through the mass storage devices and pushed through the PCI Card Cage Perforation is provided between the PCI bulkheads to allow adequate exhaust ventilation and to help reduce the localized airflow dead spots that typically occur at the faceplate tail o
112. tion The secondary MP SCSI board is not necessary for full operation however without the secondary MP SCSI board only two internal disks can be accessed MP SCSI Connections The MP SCSI board is required to update firmware access the console turn partition power on off access all but one of the internal peripherals and utilize other features of the system Connections to the MP SCSI board include the following e DB25 Connector via the M cable This RS232 connector provides connections for a local console external modem and a UPS The server end of the M cable terminates in a DB25 connector The opposite side of the cable terminates in 3 DB9 connectors labeled CONSOLE UPS and REMOTE e 10 100 Base T LAN RJ45 connector for LAN and Web Console access This LAN uses standby power and is active when AC is present and the front panel power switch is off e Internal LVD Ultra 160 SCSI channel for connections to internal mass storage e Internal SE Ultra SCSI channel for connection to internal removable media device LAN SCSI Connections The LAN SCSI board is a PCI form factor card that provides the basic external I O connectivity for the system Connections to the LAN SCSI board include the following e PCI X to PCI X Bridge for multi device compatibility e Internal LVD Ultra 160 SCSI channel for connections to internal mass storage e External LVD Ultra 160 SCSI channel connected to a 68 pin VHDCI connector e 10 100 1000 Base
113. ty to operated the equipment Japanese Radio Frequency Interference VCCI This equipment is in the Class A category information technology equipment based on the rules of Voluntary Control Council For Interference by Information Technology Equipment VCCI When used in a residential area radio interference may be caused In this case user may be required to take appropriate corrective actions Figure 2 Japanese RFI costi DSAAMMAHLETT CORRE FMANTERT DL RENE AEREAS EF CORSA ADAME DE RENDTENGUES na xii Korean RFI Statement Certification Number E AAAAA BB CCCC e E EMC registration e AAAAA equipment codes RRL notice 2000 10 26 e BB certification year e CCCC registration number Figure 3 Korean RFI ABRA Mh A 7171 o AWE UFOS AAs ARDE We ALU we Be FA HE HE FUG AA APRO RE 37 vey ABBA WIE B i 717 Al AAS MARLLE 273 SAMIR BE 77124 PARA AA BL BE JAANA eet UFU Translation Class A Equipment Please note that this equipment has been approved for business purpose with regards to electromagnetic interference if purchased un error for use in residential area you may wish to exchange the equipment where you purchase it Class B Equipment Please note that this equipment has been approved for non business with regards to electromagnetic interference So this equipment can be allowed to use all area as well as residential area European Union RFI Statement This is a Class A product In a domest
114. ver the servers This system called DataCool density environments of 100 to 500 watts per square foot is primarily used in high Basic Air Distribution Systems A basic air distribution system includes supply air and return air An air distribution system should be zoned to deliver an adequate amount of supply air to the cooling air intake vents of the computer system equipment cabinets Supply air temperature should be maintained within the following parameters e Ceiling supply system From 55 F 12 8 C to 60 F 15 6 C e Floor supply system At least 60 F 15 6 C If a ceiling plenum return air system or a ducted ceiling return air system is used the return air grille s in the ceiling should be located directly above the computer equipment cabinets The following three types of air distribution system are listed in order of recommendation Appendix C 111 Site Preparation Environmental Elements e Underfloor air distribution system Downflow air conditioning equipment located on the raised floor of the computer room uses the cavity beneath the raised floor as plenum for the supply air Perforated floor panels available from the raised floor manufacturer should be located around the perimeter of the system cabinets Supply air emitted though the perforated floor panels is then available near the cooling air intake vents of the computer system cabinets e Ceiling plenum air distribution system Supply air i
115. w specifications for the hp rp7405 rp7410 server Temperature and Humidity The cabinet is actively cooled using forced convection in a Class C1 modified environment Operating Environment The system is designed to run continuously and meet reliability goals in an ambient temperature of 5 C 35 C at sea level The maximum allowable temperature is derated 1 C per 1000 feet of elevation above 5000 feet above sea level up to 30 C at 10 000 feet For optimum reliability and performance the recommended operating range is 20 C to 25 C Environmental Temperature Sensor To ensure that the system is operating within the published limits the ambient operating temperature is measured using a sensor placed near the chassis inlet between the cell boards Data from the sensor is used to control the fan speed and also to initiate system overtemp shutdown For more details see the platform management section Non Operating Environment The system is designed to withstand ambient temperatures between 40 C to 70 C under non operating conditions Cooling Cell Section Cooling The cabinet incorporates front to back airflow across the cell boards and system backplane Two 2 150mm fans mounted externally on the front chassis wall behind the cosmetic front bezel push air into the Cell section and two 2 150mm fans housed in cosmetic plastic fan carriers and mounted externally to the rear chassis wall pull air through the Cell sec
116. y 4 x 2 GB memory modules four 73 GB 10k internal disks one DVD drive two cell boards two core I O and two powers supplies rp7405 8 way system A7113A Includes rp7405 SMP base system eight 650 MHz PA RISC processors 16 GB memory 8 x 2 GB memory modules four 73 GB 10k internal disks one DVD drive two cell boards two core I O and two power supplies These servers may be upgraded with additional processors cell boards memory core I O etc according to the corporate price list In addition these servers may be upgraded to fully functional hp rp7410 servers with the kits given in Table 1 2 Table 1 2 hp rp7405 to rp7410 Upgrades Kit Description Upgrade Part Number Upgrade kit from 2 way rp7405 to rp7410 750 MHz upgrade A7144A 875 MHz upgrade A7145A Upgrade kit from 4 way rp7405 to rp7410 750 MHz upgrade A7146A 875 MHz upgrade A7T147A Upgrade kit from 8 way rp7405 to rp7410 750 MHz upgrade AT148A 875 MHz upgrade AT149A Chapter 1 5 Introduction Detailed hp rp7405 rp7410 Description Detailed hp rp7405 rp7410 Description Figure 1 3 hp rp7410 8 Way Block Diagram Cell Board 0 Cell Board 1 lt cc cc BULK POWER SUPPLIES PCI Backplane Disk Backplane 5 S Boards Chapter 1 Introduction Detailed hp rp7405 rp7410 Description Cell Board The cell board contains the processors main memory and the cell controller CC ASIC that inter

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