GE phoenix microme|x Brochure
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1. flaws phoenix x ray offers automated microfocus and nanofocus X ray inspection solutions for any package inspection task including but not limited to the following Standard IC packages DIP SOT VSOP P LCC QFP Flat Pack Cracked wire Wire destroyed by overvoltage 1C package top down view Any internal details such as bond wires inner and outer bonds die die attach lead frame and moulding can be examined for defects e g broken wires excessive wire sweep extraneous or crossing wires die attach voids and die tilt die cracks defective lid seals moulding voids P Wedge bond inspection Ball bond inspection entrapped particles and delaminations Wire bonded area array packages PBGA CSP etc ts a Shape deviations and opens Bridge between flip chip in flip chip bonds bonds The image gives a clear view of the integrity of the vias and lead tracks of the PCB and the quality of the solder joints Flip chip bonded area array packages s TA CBGA etc Die attach voids PEN H 5 E S ya N j Cracked die FC bonded IC top down view Applications include the inspection of microscopic solder joints connec ting IC and ceramic substrate as well as underfill inspection The most common defects are open solder joints missing solder joints solder bridges solder and underfill voids n a S O o y Image definition and contrast What is it that makes the difference Unrival2. radiation dose typically used in X ray inspection is only a thousandth of the dose rate that would cause da mage to semiconductor components phoenix x ray provides a variety of op tions for controlling and adjusting the dose rate e g e low dose mode e gutomated inspection routines AXI e collimated beams e self filtering target The Third Dimension Oblique or straight X ray inspection seen from a different perspective Sometimes when inspecting a sample it may become necessary to see your sample from a different angle An example of this would be an inspection via platings or wire loops phoenix x ray systems provide oblique views of up to 70 degrees using the unique ovhm technology Automatic isocentric manipulator movement locks the field of view during rotation and ovhm tilt in the image centre Examples N i d 7 eh Via inspection with Wire loop inspection with ovhm ovhm ovhm oblique views are an excellent means for gaining a max imum of information about the internal features of a sample At a tilt angle of 70 degrees the profile of CSP solder joints in cluding voids are clearly visible Unlike with a tilting angle of 45 degrees component and board parts can be clearly distin guished High resolution 3D imaging nano T Technology ovhm Oblique views at highest magnifications Conventional tilt techniques generate oblique views by simply tilting the sample to the side which invo
3. 11720 Fax 49 5031 172 299 E mail phoenix info ge com phoenix asia ge com Americas GE Sensing amp Inspection Technologies 50 Industrial Park Road Lewistown PA 17044 USA Tel 1 866 243 2638 toll free Tel 1 717 242 0327 E mail phoenix usa ge com www phoenix xray com GEIT 31102EN 11 09 2009 General Electric Company All Rights Reserved Specifications subject to change without prior notice nanotom and nanoCT are registered trademarks of General Electric Company Other company or product names mentioned in this document may be trademarks or registered trademarks of their respective companies which are not affiliated with GE
4. GE Sensing amp Inspection Technologies KG IN A GUIDE TO AY n 4 F THE INSPECTION AND ANALYSIS OF ELECTRONIC PACKAGES with phoenix x ray microfocus and nanofocus X ray systems source object detector high magnification low magnification insulator cathode filament grid anode deflection unit magnetic lens target Why can the collision protection be deactivated phoenix x ray systems come standard with a password protected anti collision feature to ensure the protection of your samples When inspecting certain samples it might become necessary to deactivate the collision protection e g with 25 um bond wires which even for magnifications of just 500 x need to be as close as 4mm to the tube head phoenix x ray provides the user the flexibility when dealing with small samples Unlike with conventional systems the X ray tube is located above the sample tray allowing the user to move the sample as close to the tube head as needed FAQs about X ray How X ray inspection works X ray starts with a sample being irradiated by an X ray source and projected onto a detector The geometric magnification M of the image is the ratio of focus detector distance FDD Focus object distance FOD M FDD FOD The smaller the focal spot the greater the resolution With the nanofocus technology a unique
5. detail detecta bility down to 0 2 microns can be achieved phoenix x ray systems reach geometric magnifications over 2 000x resulting in total magnifications beyond 24000x How X ray tubes work The heart of the X ray machine is an elec trode pair consisting of a cathode the fila ment and an anode that is located inside a vacuum tube Current is passed through the filament heating it up causing the filament to emit electrons The positively charged anode draws the electrons across the tube Unlike with conventional X ray tubes the electrons pass through the anode into a spe cifically designed set up of electromagnetic lenses where they are bundled and directed onto a small spot on the target a flat metal disc covered by a layer of tungsten When the electrons collide with the target they in teract with the ions in the tungsten causing X rays to be emitted Key to sharp crisp X ray images at micron or even submicron resolutions is the size of the focal spot meaning the ability to focus the electron beam in such way that the area on the target where the electrons hit be as small as pos sible an obstacle yet to be overcome by conventional X ray machines However phoenix x ray has mastered this challenge with its unique nanofocus tube providing detail detectabilities as low as 200 nanometers 0 2 microns FOD 4mm 500x Sample touching the tube Maximum magnification What makes an excellent X ray In additi
6. ed resolutions Image definition and contrast are both key to detecting With the nanofocus technology with detail detectabilities down l i a microfocus microfocus to 200 nanometers submicron resolutions and a fully digital Focal spot size 10 microns Focal spot size 5 microns high contrast detector that outperforms any image intensifier based image chain phoenix x ray is once more leading the way in X ray inspection technology High dynamic digital detectors nanofocus technology active temperature stabilization nanofocus focal spot lt 1 micron The image quality is essential for an optimal defect coverage of all 2D and 3D Inspection tasks The new active temperature stabilized GE DXR detectors ensure a very low noise live imag ing Due to its high dynamic the DXR detector shows a brilliant live image with 30 frames per second at full resolution Flip chip bonds 30 microns in diameter Technolo gy microfocus image F 5um _ nanofocus image What is the difference between nanofocus and microfocus tubes Superior contrast source Microfocus X ray tubes have focal high contrast detector spots that are as small as 3 microns object o Non conductive die attach in size But penumbra effects and as a consequence residual unsharp wo g s detector ness still occur With its nanofocus technology with focal spot sizes well microfocus system nanofocus system below 1 micron phoenix x ray has successf
7. lves moving one part of the sample further away from the X ray tube resulting in a decrease in magnifica tion The ovhm module was specifically designed to enable oblique views of up to 70 degrees and 0 to 360 degree rota tions without a decrease in magnification Magnification remains the same because the distance between focus and sample does not change while the detector is be ing tilted The proven and successful v tome x technology by phoenix x ray is also available as an add on for the nanome x system High power nanofo cus X ray technology paired with a fast reconstruction software deliver unrivaled highest quality inspection results with nanoCT image resolu tions This technology is especially suitable for the inspection and three dimensional analysis of smaller samples 2D images of a memory cube with stacked dies frontal and side view Deeper lying features are concealed making a thorough analysis impossible visible and can be examined for voids systems phoenix x ray offers a wide range of X ray systems in different configurations for a variety of inspection tasks in the electronics and semiconductor industries phoenix x ray s systems have superior specifications that are able to solve the highest demands nanome x the ultimate X ray solution This automated X ray system with superior specifications satisfies the highest demands The 180 kV 15 W high power nanofocus tube 4 in 1 covers the full ra
8. nge from submicron resolution to high intensity applications Due to the easy view configuration the X ray image displays the sample exactly as the operator sees it through the radiation protection win dow The digital realtime image chain with 4 MPixel camera provides an excellent contrast resolution and enables oblique views up to 70 degrees at magnifications well above 24000 x For samples of poor contrast the system may be equipped with a high dynamic fully digital high contrast detector as supplement to the image chain of fering unique performance and versatility Optionally the nanome x may be equipped with nanoCT capability pcblinspector high performance low maintenance nanotom highest resolution in three dimensions ocblinspector is the solution for process control on standard BGA SMD and planar solder joints Due to the maintenance free closed tube and the high quality image chain the ocbalinspector provides excellent defect recognition at medium magnifications Optional manipulation upgrades enable oblique views The nanotom comes standard with a 180 kV 15 W ultra high performance nanofocus tube and precision mecha nics for maximum stability With voxel resolution as low as 500 nanometer the nanotom is the inspection solution of choice for 3D CT applications in a wide range of fields With its small footprint the nanotom is suitable for even the smallest labs For many applicatio
9. ns the nanotom offers a viable alternative to synchro tron based computed tomography microme x automated solder joint inspection The microme x is a high resolution automated X ray inspection AXI system that is most suitable for failure analysis in the semiconductor and electronics industry It comes standard with an ultra high performance 180 kV 20 W x ray tube for sub micron feature recognition gt 0 5 um and a high resolution 2 MPixel digital image chain This system provides a total magnification of up to 23 320x without software zoom and oblique angle views of up to 70 degrees The microme x combines proven high resolu tion 2D and 3D CT X ray technology in one system With the new xjact package for CAD based AXI programming the microme x is the system of choice to en sure meeting zero defect requirements Technology Closed tube or open tube Closed tubes All tube components are contained in a sealed vacuum vessel container Closed tubes are maintenance free and are completely replaced at the end of their lifetime Open tubes All components and wear out parts are accessible and replacea ble the tube is continuously evacuated by a turbomolecular pump Open tubes yield higher resolution and magnifica Regional Contact Information Europe Asia Africa South America GE Sensing amp Inspection Technologies Niels Bohr Str 7 31515 Wunstorf P O Box 6241 31510 Wunstorf Germany Tel 49 503
10. on to resolution maximum voltage and power stability is very important for reliable results and highest up time One of phoenix x ray s key techno logy competen cies are tube design and manufacturing o S oO S O TS O oO g O Es oO wn FO time h e High power nanofocus X ray tubes up to 180kV and unipolar microfocus X ray tubes up to 300 kV maximum voltage e Up to 200nm 0 2 microns detail detecta bility e Dose rate stabilization the emitted intensity only varies by less than 0 5 within 8 hours see diagram e Anti arcing dedicated surface treatment during fabrication and automated warm up procedures prevent discharges e Self adjustment all tube adjustments are performed automatically during warm up to achieve optimum results e Plug in cathodes pre adjusted spare cath odes prevent malfunction due to wrong filament adjustment and minimize down time to less than 20 min e Target check target condition is checked automatically automatic target wear is indicated ee LY ll ee The View Inside What can X ray inspection tell us about package quality Electronic packages are sophisticated electronic devices with complex internal features In order to meet the quality require ments of the industry X ray inspection solutions must be capable of delivering detail detectabilities in the submicron range and detecting hidden defect
11. pection as a quick inspection aid c4 module flip chip inspection Software for the automated X ray analysis of microscopic solder joints even with back ground structures present The analysis runs fully automated and is extremely time sav ing The following c4 parameters can be in spected e Missing solder balls e Void size e Void percentage e Number of voids vc module voiding calculations Software designed for the automated void ing analysis of die attach and planar solder joints with versatile set up options e Calculation of the total voiding percent age e Calculation of the void count e Sorting voids according to variable thresholds e Definition of hot zones e Calculation of the minimum void diameter e Calculation of die tilt and rotation e Automated die inspection e Dimple solder joint correction e Inspection and analysis of multiple die packages xlact Ax with highest defect coverage As a solution for AXI with highest defect cov erage phoenix x ray provides calibrated high precision offline AXI systems including the unique x act software package for fast and easy offline CAD programming Small views with highest resolution of a few micrometers 360 rotation and oblique viewing up to 70 ensure to meet highest quality standards Among the automated X ray inspection the AXI system can be used for manual failure analysis or 3D computed tomography as well Technology The
12. ully managed to eliminate the penumbra effect even when us ing highest intensity X rays Test pattern W on Si with period 2 um m Focal spot Verification of resolution using a periodic test pattern If the sacle ast detectors enable inspection of low absorbing eatures icrons Focal spot 600nm 0 6 microns grid period is the same size as the focal spot the pattern van ishes Using nanofocus technology the bars are clearly visible proving that nanofocus tubes deliver detail detectabilities well below 1 micron proved with Jima Automated Inspection The efficient way of process control and rework AXI Efficient soldering process control requires the acquisition of statistical data on the solder joints of a larger number of samples phoenix x ray offers a range of plug in software modules for the automatic evaluation of standard solder joints like BGA QFP QFN or PTH For non typical interconnections appropriate modules can quickly be customized with the XE X ray image Evalu ation Environment software Together with the high precision CNC manipulation which comes standard with phoenix x ray systems these modules enable the automatic X ray inspection AXI of solder joints at minimum set up time due to teach in programming and auto setup routines An additional software package quality review is the perfect connection to rework phoenix x ray s inspection modules can also easily be activated during manual ins
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