Fairchild FPF2303 User's Manual
Contents
1. 8 22 25 29 33 37 40 44 48 51 55 SUPPLY VOLTAGE V Figure 11 Ron vs Temperature SO8 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 00 40 15 10 35 60 85 F ch wesch I ON RESISTANCE mOhms 8388838583 ON RESISTANCE mOhm Ty JUNCTION THVPERATURE C igure 8 Quiescent Current vs Temperature YOUMS yw 3ueJun 3ndino jenq 0 20 00 23d3 8 22 25 29 33 37 40 44 48 51 55 SUPPLY VOLTAGE V Figure 10 Roy vs Supply Voltage MLP 15 10 35 60 85 Ty JUNCTION TEMPERATURE C Figure 12 Roy vs Temperature MLP www fairchildsemi com Typical Characteristics CURRENT LIMIT mA ON RESISTANCE mOhm N O a A 8 amp ON THRESHOLD VOLTAGE V 8 ol 8 10 35 Ty JUNCTION TEMPERATURE C Figure 13 Ron vs Temperature SO8 yi Figure 15 ON High Voltage vs Temperature 1350 1340 1330 1320 1310 1300 1290 1280 1270 1260 1250 1 8 Figure 17 Current Limit vs Supply Voltage a O O O O O O O N A Oo O N 10 35 Ty JUNCTION THVPERATURE C 29 33 37 40 44 SUPPLY VOLTAGE V 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 32. gt w Oi o O O1 ON THRESHOLD VOLTAGE V o o GA O0 O O 18 22 25 29 33 37 40 44 48 51 55 SUPPLY VOLTAGE V Figure 14 ON Threshold Voltage vs Supply Voltage ON THRESHOLD VOLTAGE V o Oo A Oo O N CURRENT LIMIT mA 10 35 60 85 Ty JUNCTION TEMPERATURE C Figure 16 ON Low Voltage vs Temperature ILM Typ B Ty JUNCTION TEMPERATURE C Figure 18 Current Limit vs Temperature www fairchildsSemi com YOUMS yw UNI 3ndino jenq 0 20 00 23d3 Typical Characteristics 1000 20 F 18 S 400 m 14 lt gt 12 F T J 10 u lt 5 cs gt 10 Dc O Y 5 4 F 2 1 0 40 15 10 35 60 85 40 15 10 35 60 85 T JUNCTION TEMPERATURE C T JUNCTION TEMPERATURE C Figure 19 tpon tporr vs Temperature Figure 20 tpise teat Vs Temperature a 11 0 g 10 0 T 105 os E F 10 0 o 9 Z 90 S 95 9 0 m 85 o Z 85 Q 8 0 ao ou G P 75 i 75 i E O 70 0 70 40 15 10 35 60 85 40 15 10 35 60 85 Ty JUNCTION TEMPERATURE C T JUNCTION TEMPERATURE C Figure 21 ts ANK VS Temperature Figure 22 t amp srRT BLANK VS Temperature 620 0 600 0 IN A 2V DIV 580 0 Lu ON z gan 2V DIV Ee f 540 0 ART e Muss EE
3. ARE IN MILLIMETERS 0 406 1 04 C DIMENSIONS DO NOT INCLUDE MOLD i FLASH OR BURRS DETAIL A D LANDPATTERN STANDARD SOIC127P600X175 8M SCALE 2 1 E DRAWING FILENAME MO8AREV13 Figure 46 8 Lead SO8 Package Package drawings are provided as a service to customers considering Fairchild components Drawings may change in any manner without notice Please note the revision and or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision Package specifications do not expand the terms of Fairchild s worldwide terms and conditions specifically the warranty therein which covers Fairchild products Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings http www fairchildsemi com packaging 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 17 yojims HUTT zuN 3ndino jenq 0 20 00 24d3 Dimensional Outline and Pad Layout ces 2X PIN 1 QUADRANT TOP VIEW Clg 0 8 MAK 2X 0 Claalg at j SIDE VIEW SEATING PLANE 1 30 MAX BOTTOM VIEW NOTES A CONFORMS TO JEDEC REGISTRATION MO 229 VARIATION VEEC DATED 11 2001 B DIMENSIONS ARE IN MILLIMETERS C DIMENSIONS AND TOLERANCES PER ASME Y14 5M 1994 D FILENAME MKT MLPO8Drev2 AAA A A L KS KKK 9494949 9 5 Sh RRR AK SRE RK s S BSS S 0 65 S e ITT 0 65 TYP LL 0 42 TYP RECOMMEND
4. FLAGB A Downstream DV FLAGB B USB Port 33pF T YOUMS yw UNI 3ndino jenq 0 20 00 23d3 Downstream USB Port FPF2300 2 3 1uF OFF ON ONA OUTA OFF ON ONB GND OUTB Downstream E USB Port Figure 38 Self Powered 4 Port USB Hub Using a Single FPF230X FPF230X is designed to simplify USB port power design based capability per port required in actual power designs FPF230X on self powering USB host hub applications A self powering has 1 1A minimum current limit per output which can cover two USB port is powered by a local 5V power supply not by an ports as shown in Figure 38 Four USB ports can be imple upstream port Each port should supply at least 500mA to each mented with a single FPF230X part and current limiting is pro downstream function based on USB 2 0 specification Imple vided based on a two port basis for a cost effective solution mentation can depend on the number of USB ports and current Downstream Host FLAGB A B USB Port 5V FLAGB FPF2300 2 3 ONA OUTA 33pF ATs up OFF ON OFF ON Downstream ONB OUTB USB Port H 33yuF CT Downstream USB Port FLAGB A FLAGB B 33pF 1 FPF2300 2 3 ae OFF ON ONA OUTA 1uF ONB OUTB Downstream ad n USB Port u d Figure 39 Individual Port Power Management for Seit Powered A Port USB Hub In Figure 39 each USB port is connected with each output Current capability per port has more headroom up to a min
5. Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts have full traceability meet Fairchild s quality standards for handling and storage and provide access to Fairchild s full range of up to date technical and product information Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Status Definition BES UI specifications for product development Specifications may change Sammy mose vo he TREE d Sanson aa me lc ta Rd de ene OWN e e Udemm E See raura eeh En that is discontinued by Fairchild Semiconductor Rev 140 www fairchildsemi com 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 19
6. IN 5 5V e In IN Shutdown Curent Current N Shutdown Curent OMA OUTB Short to GND 3 UA IN 5 5V loir 200MA T4 25 C 75 140 On Resistance Sal A NES ELS mo IN 5 5V lour 200mA Ta 40 C to 85 C 10018 IN 1 8V mE RR V ON Input Logic Low Volt G d npu OGIC LOW Voltage KE S IN 5 5V ON Input Leakage Von IN or GND EM S IN 1 8V Is k 1mA 0 15 030 fra marr El SW ws OL ees YOY Vow ws meesme SY 8 mW Lee were eme Ee Te nT Ras e 1 Wee osne LI m tar Curent Lmt ae TES Moderate OverCuretCondton 20 vws Note 5 FPF2303 has a 10ms startup FLAGB blanking time when the part is turned on via the ON pin to ensure transient load currents settle 90 90 T I I ees 10 Ww 10 gt gt tR F l l l l l l l 9096 gt gt DON tbOFF ton tk toon torr tr orr Figure 6 Timing Diagram 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 5 YOUMS yw 3ueJun 3ndino jenq 0 20 00 23d3 Typical Characteristics Figure 7 Quiescent Current vs Supply Voltage o 8 UA K K 8 8 oO w 8 8 N 8 8 2 IN SHUTDOWN CURRENT uA N 8 G 8 O Ty JUNCTION TEMPERATURE C Figure 9 IN Shutdown Current vs Temperature ch _ ch 8388838583 ON RESISTANCE mOhms
7. T FAIRCHILD San a eel SEMICONDUCTOR June 2009 FPF2300 02 03 Dual Output Current Limit Switch Features Description B 1 8 to 5 5V Input Voltage Range The FPF2300 02 03 are dual channel load switches of Typical Roy 75mQ at IN 5 5V IntelliMAX family The FPF2300 02 03 consist of dual independent current limited slew rate controlled P B 1 3A Current Limit Typical Slew Rate Controlled channel MOSFET power switches Slew rated turn on l l prevents inrush current from glitching supply rails The m Reversed Current Blocking when Disabled input voltage range operates from 1 8V to 5 5V to fulfill m ESD Protected Above 4000V HBM today s USB device supply requirements Switch control m Independent Thermal Shutdown is accomplished by a logic input ON capable of m UVLO interfacing directly with low voltage control signal B RoHS Compliant For the FPF2302 if the constant current condition per sists after 10ms these parts shut down the switch and Applications pull the fault signal pin FLAGB LOW The FPF2300 has an auto restart feature that turns the switch on again after 504ms if the ON pin is still active For the FPF2303 m Peripheral USB Ports a current limit condition immediately pulls the fault signal m Networking USB Based Equiptment pin LOW and the part remains in the constant current mode until the switch current falls below the current limit For the FPF2300 through FPF2303 the current limit is typically 1 3A for each
8. exposure to stresses above the recommended operating conditions may affect device reliability The absolute maximum ratings are stress ratings only WE IN OUTA OUTB ONA ONB FLAGB A FLAGB B to GND Power Dissipation te snk Resistance E LE em ermal Resistance Junctuon to Ambien E se Human Body Model JESD22 A114 4000 ERE ESD Electrostatic Discharge Protection Charged Device Model JESD22 C101 2000 Notes 1 Two layer PCB of 2s0p from JEDEC STD 51 3 2 Four ayer PBD of 2s0p from JEDEC STD 51 7 3 Soldered thermal pad on a two layer PCB without vias based on JEDEC STD 51 3 4 Soldered thermal pad on a four layer with two vias connected with GND plane base on JEDEC STD 51 5 7 Recommended Operating Range The Recommended Operating Conditions table defines the conditions for actual device operation Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications Fairchild does not recommend exceeding them or designing to absolute maximum ratings pmo Parametr 0 4 1 We oar 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 4 YOUMS yw 3ueJn 3ndino jenq 0 20 00 23d3 Electrical Characteristics IN 1 8 to 5 5V T 40 to 85 C unless otherwise noted Typical values are at IN 3 3V and T4 25 C Symbol Parameter Condiions Min Typ Max Units Ww me TV ee EE VONA VONB 5 5V
9. switch to align with notebook computing applications FPF2300 02 03 is available in both SO8 and MLP 3X3mm 8 lead packages P amp Figure 1 8 Lead SOP Figure 2 8 Lead MLP 3x3mm m Notebook Computing Ordering Information Part Number pid Current Limit Auto ON Pin E e Blanking Time ECO Restart Activity 9 Limit Status FPF2300MX 1100mA Active LOW 8 Lead SO8 FPF2302MX 1100mA Active LOW Latch Off 8 Lead SO8 FPF2303MX 1100mA Active LOW pe 8 Lead SO8 8 Lead Molded Lead Active LOW less Package MLP FPF2302MPX 1100mA 10ms Green N A Active LOW Latch Off O PAG VOGGA EE dur less Package MLP FPF2303MPX 1100mA Oms Green Active LOW Constant 8 Lead Molded Lead Current less Package MLP 9 For Fairchild s definition of Eco Status please visit http www fairchildsemi com company green rohs_green html 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 yoajims HUTT zuN 3ndino jenq 0 20 00 24d3 Application Circuit FLAGB A FLAGB B FPF2300 2 3 IN 1 8V 5 5V ONA OUTA gt TOLOADA ONB GND OUTB TO LOAD B COUTA ij Figure 3 Typical Application Functional Block Diagram CONTROL REVERSE LOGIC A CURRENT BLOCKING CURRENT LIMIT A FLAGB A CONTROL REVERSE LOGIC B CURRENT BLOCKING CURRENT LIMIT B THERMAL PROTECTION B FLAGB B GND Figure 4 Block Diagram 2009 Fairchild Semicondu
10. 140 C If one switch is in normal operation and shutdown protection of second switch is activated the first channel continues to operate if the affected channel s heat stays confined The over temperature in one channel can shut down both switches due to rapidly generated excessive load currents resulting in very high power dissipation Generally a thermally improved board layout can provide heat sinking and allow heat to stay confined and not affect the second switch operation During an over temperature condition the FLAGB is pulled LOW and the affected switch is turned off If the temperature of the die drops below the threshold temperature the switch 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 12 automatically turns on again To avoid unwanted thermal oscillations a 10 C typical thermal hysteresis is implemented between thermal shutdown entry and exit temperatures If output of both switches are connected together and an excessive load current activates thermal protection of both the controller can shut down the switches after both FLAGB outputs go LOW and turn on both channels again This provides simultaneous switch turn on Thermal protection is for device protection and should not be used as regular operation Input Capacitor To limit the voltage drop on the input supply caused by transient inrush currents when the switch is turned on into discharged load capacitors or a short circuit an inpu
11. ED LAND PATTERN Figure 47 8 Lead Molded Leadless Package MLP Package drawings are provided as a service to customers considering Fairchild components Drawings may change in any manner without notice Please note the revision and or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision Package specifications do not expand the terms of Fairchild s worldwide terms and conditions specifically the warranty therein which covers Fairchild products Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings http www fairchildsemi com packaging 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 18 www fairchildsemi com yoajims HUTT 3ueJn 3ndino jenq 0 20 00 24d3 Mee FAIRCHILD Ee EE SEMICONDUCTOR TRADEMARKS The following includes registered and unregistered trademarks and service marks owned by Fairchild Semiconductor and or its global subsidianries and is not intended to be an exhaustive list of all such trademarks Auto SPM F PFS PowerTrench The Power Franchise Build it Now FRFET9 PowerXS the g CorePLUS Global Power Resource Programmable Active Droop wer CorePOWER Green FPS QFET TS CROSSVOLT Green FPS e Series Qs TinyBuck CTL Gmax Quiet Series TinyLogic Current Bene Logic GTO RapidConfigure TINYOPTO EcoSPARK In
12. N m pate L vn um OUT L Cour 0 14F 2V DIV R 25000 5000 ME 40 15 10 35 60 85 200us DIV T JUNCTION TEVPERATURE C Figure 23 tpsrRT VS Temperature Figure 24 toy Response 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 8 YOUMS yw 3ueJn 3ndino jenq 0 20 00 24d3 Typical Characteristics IN 2V DIV ON 2V DIV OUT 2V DIV 200us DIV Figure 25 torr Response ON 2V DIV FLAGB 2V DIV louT 1A DIV OUT 2V DIV 2ms DIV Figure 27 Startup FLAGB Blanking Time FPF2303 IN SV DIV ON SV DIV louT 1A DIV Cour gt 47uF 200us DIV Figure 29 Current Limit at Startup with Different Output Capacitor 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 ON 2V DIV FLAGB 2V DIV lout 1A DIV OUT SV DIV Figure 26 ON 2V DIV FLAGB 2V DIV louT 1A DIV OUT SV DIV 2ms DIV Over Current Blanking Time FPF2300 2 100ms DIV Figure 28 Auto Restart Time FPF2300 IN SV DIV ON SV DIV Cour 220pF 470uF 200us DIV Figure 30 Output Voltage at Startup with Different Output Capacitor www fairchildsemi com YOUMS yw 3ueJn 3ndino jenq 0 20 00 23d3 Typical Characteristics IN 5VIDIV E 1 E Cogra 100yF ON Mus EE Cour 100pF 2V DIV T f Ria Rig 10 OUTA 2V DIV OUTB 2V DIV 400us DIV Figure 31 Current Limit Response Time Both Cha
13. UT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which a are intended for surgical implant into the body or b support or sustain life and c whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury of the user ANTI COUNTERFEITING POLICY Fairchild Semiconductor Corporation s Anti Counterfeiting Policy Fairchild s Anti Counterfeiting Policy is also stated on our external website www fairchildsemi com under Sales Support 2 A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness Counterfeiting of semiconductor parts is a growing problem in the industry All manufacturers of semiconductor products are experiencing counterfeiting of their parts Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation substandard performance failed applications and increased cost of production and manufacturing delays Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts Fairchild strongly encourages customers to purchase Fairchild parts either directly from
14. ctor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 2 yoajims yw 3ueJn 3ndino jenq 0 20 00 23d3 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 3 Pin Configuration GND 1 3 FLacsa FLAGB A 8 IN EZB BE OUTA OUTA ONA 3 6 OUTB OUTB 6 ONA ONB 4 5 FLAGB B FLAGB B SO8 MLP 3X3mm 8 Lead Bottom View Figure 5 Pin Configurations Pin Description fee HN Supply Input Input to the power switch and the supply voltage for the IC 3 ONA ON OFF control input of power switch A Active LOW 4 ONB ON OFF control input of power switch B Active LOW 5 FLAGB B Fault Output B Active LO open drain output which indicates an over supply UVLO and thermal shutdown 06 OUTB Switch Output Output of the power switch B OUTA Switch Output Output of the power switch A FLAGB A Fault Output A Active LO open drain output which indicates an over supply UVLO and thermal shutdown 9 MLP Thermal Pad IC Substrate which can be connected to GND for better thermal performance Do not connect to other pins www fairchildsemi com YOUMS yw UNI 3ndino jenq 0 20 00 23d3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device The device may not function or be opera ble above the recommended operating conditions and stressing the parts to these levels is not recommended In addi tion extended
15. e The minimum current limit is set to 1100mA On Off Control The ON pin is active LOW for FPF2300 2 3 and controls the state of the switch Pulling the ON pin continuous to LOW holds the switch in the ON state The switch moves into the OFF state when the ON pin is pulled HIGH or if a fault is encountered For all versions an under voltage on input voltage or a junction temperature in excess of 140 C overrides the ON control to turn off the switch In addition excessive currents cause the switch to turn off in the FPF2300 and FPF2302 after a 10ms blanking time The FPF2300 has an auto restart feature that automatically turns the switch ON again after 504ms For the FPF2302 the ON pin must be toggled to turn on the switch again The FPF2303 does not turn off in response to an over current condition but remains operating in a constant current mode as long as ON is enabled and the thermal shutdown or UVLO is not activated The ON pin does not have a pull down or pull up resistor and should not be left floating Current Limiting The current limit ensures that the current through the switch doesn t exceed a maximum value while not limiting at less than a minimum value FPF230X family has dual output load switches being housed in one package The minimum current at which both switches start limiting the load current is set to 1100mA The FPF2300 and FPF2302 have a blanking time of 10ms typical during which the switch acts as a constant curre
16. erature Pp is power dissipation across the switch Roja is thermal resistance junction to ambient of the package Ta is ambient temperature For the example T j wAxy Normal operation for an SO8 package with T 25 C while both switches are delivering up to 1 1A is calculated as T j MAX NormalOperation 6 Pp MAX Normal Operation IN 5V X 125 25 78 4 C 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 14 If the part goes into current limit the maximum power dissipation occurs when the output of switch is shorted to ground For the FPF2300 the power dissipation scales with the auto restart time tastrt and the over current blanking time lou ANC In this case the maximum power dissipated for the FPF2300 is BLANK KING Ma X LIMMAX 7 Pp MAX CurrentLimit 2 X T BLANK RSTRT which results in 10 PD MAX CurrentLimit 2 302502 9 9 X 1 9 321mW 8 Note that this is below the maximum package power dissipation and the thermal shutdown feature protection provides additional safety to protect the part from damage due to excessive heating The junction temperature is only able to increase to the thermal shutdown threshold Once this temperature has been reached toggling ON has no affect until the junction temperature drops below the thermal shutdown exit temperature For the FPF2303 a short on both outputs causes both switches to operate in a constant current state and d
17. i Four USB ports can be implemented with two FPF230X parts mum of 1 1A per port Current limiting and control are provided based on a single port 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 13 ONA ONB 10KQ FLAGB A FLAGB B FPF2300 2 3 OUTA Downstream SANA USB Port GND Figure 40 Self Powered USB Port for High Current Demand High current over ZA is sometimes reguired to supply enough power to downstream functions As shown in Figure 40 a 2 2A minimum load current can be achieved by tying dual outputs together Power Dissipation During normal operation as a switch the power dissipation of the device is small and has little effect on the operating temperature of the part The maximum power dissipation for both switches while the switch is in normal operation occurs just before both channels enter into current limit This may be calculated using the formula Pp MAX Normal Operation 2 X ILimcminy X RoN MAX 3 For example for a 5V application maximum normal operation power loss while both switches delivering output current up to 1 1A can be calculated as PD MAX Normal Operation IN 5V 7 2 x 1 1 y x 0 14 338mW 4 The maximum junction temperature should be limited to 125 C under normal operation Junction temperature can be calcu lated using the formula below 5 Ty Pp x RgjA TA where Ty is junction temp
18. irchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 11 startup blanking feature that prevents current faults related to star tup transients from triggering the FLAGB output The startup blank ing feature is effective for the first 10ms typical following device turn on via ON pin The FLAGB outputs are two open drain MOSFETSs that require a pull up resistor on each FLAGB pin FLAGB can be pulled HIGH to a voltage source other than input supply with maximum 5 5V A 100KQ pull up resistor is recommended When the ON pin is inac tive the FLAGB is disabled to reduce current draw from the supply If the FLAGB is not used the FLAGB can be connected to ground on the PCB ON device wakeup IN device wakeup FLAGB RISE TIME 90 Mum OUT ILOAD wm Figure 35 FLAGB Assertion in Under Voltage Fault Lap RL ILM TT sees Over current condtion FLAGB fo a ee tRSTRT BLANK Figure 36 FPF2300 FLAGB Reports While Entering into an Over Current Condition Note 6 An over current condition signal loads the output with a heavy load current larger than l value www fairchildsemi com yojims HUTT JUNI 3ndino jenq 0 20 00 24d3 U Over i current condtion FLAGB i Startup FBLANK Figure 37 FPF2300 FLAGB While and Over Current Condition is Applied Note re An over current condition signal loads the output w
19. issipate a worst case power of Pmax 2 X IN Mad X ILIM MAX 2 X 5 5 x1 5 16 5 W 9 As both FPF2303 outputs are connected to GND This power dissipation is significant and activates both thermal shutdown blocks and the part can cycle in and out of thermal shutdown as long as the ON pin is activated pulled LOW and the output short is present www fairchildSemi com YOUMS yw UNI 3ndino jenq 0 20 00 23d3 PCB Layout Recommendations For the best performance all traces should be as short as possible To be most effective the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short circuit operation Using wide traces for IN OUTs and GND pins helps minimize parasitic electrical effects and the case to ambient thermal impedance Improving Thermal Performance Improper layout could result in higher junction temperature and triggering the thermal shutdown protection feature This concern is particularly significant for the FPF2303 where both channels operate in constant current mode in the overload conditions and during fault condition the outputs are shorted resulting in large voltage drop across switches In this case power dissipation of the switch Pp Vin Vout X luiwMAx could exceed the maximum absolute power dissipation of part The following techniques improve the thermal performance of this family of device
20. ith a heavy load current larger than l m r value Under Voltage Lockout UVLO The under voltage lockout feature turns off the switch if the input voltage drops below the under voltage lockout threshold With the ON pin active ON pin pulled LOW the input voltage rising above the under voltage lockout threshold causes a controlled turn on of the switch and limits current overshoot If a device is in UVLO condition both FLAGBs go LOW and indicate the fault condition The device detects the UVLO condition when input voltage goes below UVLO voltage but remains above 1 3V typical Reverse Current Blocking Each switch of FPF2300 2 3 has an independent reverse current blocking feature that protects input source against current flow from output to input For a standard USB power design this is an important feature that protects the USB host from being damaged due to reverse current flow on Vgus To activate the reverse current blocking the switch must be in OFF state ON pins inactivated so that no current flows from the output to the input The FLAGB operation is independent of the reverse current blocking and does not report a fault condition if this feature is activated Thermal Shutdown The thermal shutdown protects the device from internally or externally generated excessive temperatures Each switch has an individual thermal shutdown protection function and operates independently as adjacent switch temperatures increase above
21. ldsemi com FPF2300 02 03 Rev 1 1 3 15 YOUMS JWI 3ueJun 3nd3no jenq 0 20 00 23d3 FPF230X Evaluation Board The FPF230X evaluation board has components and circuitry to demonstrate FPF2300 2 3 load switch functions and features accommodating both the MLP 3x3mm and SO8 packages The state of the each channel can be configured using J1 and J2 jumpers In addition both channels can be controlled by ONA and ONB test pints Thermal performance of the board is improved using techniques in the layout recommendations section R3 and R4 resistors are used on the board to sink a light load current when switches are activated Figure 43 Top SST and AST Layers MLP 3x3mm and SOS Figure 45 Zoom In to Top Layer Releated Resources FPF2300 02 03 Evaluation Board User Guide Power Switch for USB Applications 2009 Fairchild Semiconductor Corporation www fairchildsemi com FPF2300 02 03 Rev 1 1 3 16 YSUMS JWI 3ueJun 3nd3no jenq 0 20 00 23d3 Dimensional Outline and Pad Layout 5 00 4 80 6 20 1 75 5 80 pe 5 60 il Pesan 127 al 0 33 aoa Slee L LAND PATTERN RECOMMENDATION YA SEE DETAILA 0 25 1 0 19 OPTION A BEVEL EDGE 0 50 jac x 45 RO 10 0 29 GAGE PLANE r OPTION B NO BEVEL EDGE 0 36 NOTES UNLESS OTHERWISE SPECIFIED 8 D V A THIS PACKAGE CONFORMS TO JEDEC MS 012 VARIATION AA ISSUE C 0 90 SEATING PLANE B ALL DIMENSIONS
22. nnels are in OC IN SV DIV ON SV DIV louT 500mA DIV OUT SV DIV 1ms DIV Figure 33 Inrush Response During Capacitive Load Hot Plug In Event 2009 Fairchild Semiconductor Corporation FPF2300 02 03 Rev 1 1 3 10 IN SV DIV COUTA E 100uF ON eee Coute 100pgF a RAS Rig 210 2V DIV FLAGB A 2V DIV FLAGB B 2V DIV 4 10ms DIV Figure 32 Startup FLAGB Blanking Time IN 5V DIV ON 5V DIV louT 2A DIV OUT SV DIV 200us DIV Figure 34 Inrush Response During Capacitive and Resistive Load Hot Plug In Event www fairchildsemi com YOUMS yw 3ueJn 3ndino jenq 0 20 00 23d3 Description of Operation The FPF2300 FPF2302 and FPF2303 are dual output current limit switches designed to meet notebook computer peripheral USB port and point of load POL application power requirements Dual output current can be used where dual or quad USB ports are powered by hosts or self powered hubs The FPF230X family offers control and protection while providing optimum operation current for a safe design practice The core of each switch is a typical 75mQ IN 5 5V P channel MOSFET and a controller capable of functioning over an input operating range of 1 8 5 5V The FPF230X family offers current limiting UVLO under voltage lockout and thermal shutdown protection per each switch In the event of an over current condition the load switch limits the load to current limit valu
23. nt source At the end of the blanking time the switch is turned off The FPF2303 has no current limit blanking period so it remains in a constant current state until the ON pin of the affected switch is deactivated or the thermal shutdown turns off the switch Fault Reporting Over current input under voltage and over temperature fault conditions are signaled out by the FLAGB pin going LOW A UVLO fault is reported on both FLAGB A and FLAGB B simultaneously while over current and over temperature condition faults are reported independently FPF2300 and FPF2302 have a current fault blanking feature that prevents over current faults shorter than the blanking time et ANk ryp 10ms from triggering the fault signal FLAGB output If the over current condition persists beyond the blanking time the FPF2300 pulls the FLAGB pin LOW and shuts the switch off If the ON pin is kept active an auto restart feature releases the FLAGB pin and turns the switch on again after a 504ms auto restart time tastrt If the over current condition persists beyond the blanking time the FPF2302 has a latch off feature that pulls the FLAGB pin LOW and shuts the switch off The switch is kept off and the FLAGB pin kept LOW until the ON pin is toggled The FPF2303 responds to an overload condition by immediately pulling the FLAGB pin LOW and the switch remains in constant current mode until the output overload condition is removed The FPF2303 has a 2009 Fa
24. s These techniques are listed in order of the significance of impact Figure 42 Proper Layout of Output and Ground 1 Thermal performance of the load switch can be improved Copper Area by connecting the DAP Die Attach Pad of MLP 3x3mm package to the GND plane of the PCB 2 Embedding two exposed through hole vias into the DAP pin 9 provides a path for heat to transfer to the back GND plane of the PCB A drill size of round 15 mils 0 4mm with 1 ounce copper plating is recommended to create appropriate solder reflow A smaller size hole prevents the solder from penetrating into the via resulting in device lift up Similarly a larger via hole consumes excessive solder and may result in voiding of the DAP UU 15mil 25mil AUL Figure 41 Two Through Hole Open Vias Embedded in DAP 3 The IN OUTs and GND pins dissipate most of the heat generated during a high load current condition Figure 42 illustrates a proper layout for devices in MLP 3x3mm packages IN OUTs and GND pins are connected to adequate copper so heat may be transferred as efficiently as possible out of the device The low power FLAGB and ON pin traces may be laid out diagonally from the device to maximize the area available to the ground pad Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation particularly during high load currents 2009 Fairchild Semiconductor Corporation www fairchi
25. t capacitor Ciy is recommended between IN and GND The FPF2310 2 3 3L features a fast current limit response time of 20us An inrush current also known as surge current could occur during the current limit response time while the switch is responding to an over current condition caused by large output capacitors A 10uF ceramic capacitor Cj is required to provide charges for the inrush current and prevent input voltage drop at turn on Higher values of Cw can be used to further reduce voltage drop Output Capacitor A O 1pgF to 1yF capacitor Cour should be placed between the OUT and GND pins This capacitor prevents parasitic board inductances from forcing output voltage below GND when the switch turns off This capacitor should have a low dissipation factor An X7R MLCC Multilayer Ceramic Chip capacitors is recommended For the FPF2300 and FPF2302 the total output capacitance needs to be kept below a maximum value Coytimax to prevent the part from registering an over current condition beyond the blanking time and shutdown The maximum output capacitance for a giving input voltage can be determined from the following ILiM MIN X IBLANK MIN 1 CouT MAX 7 IN For example in a SV application Cout max can be determined as 1 1A x 5ms 5 2 COUT MAX IN 5V 1 1mF www fairchildsemi com yoajims HUTT 3ueJn 3ndino jenq 0 20 00 24d3 Application Information Downstream USB Port Sour T Host
26. telliMAX CH TinyPower EfficentMax ISOPLANAR TM TinyPWM EZSWITCH MegaBuck Saving our world 1mW W kW at a time Tiny Wire mg E TM MICROCOUPLER SmartMax T F it Detect zo MicroFETTM SMART START Lobo dicis EN amp MicroPak SPM ec T MillerDrive STEALTH T Bas Fairchild MotionMax SuperFET ZZ Fairchild Semiconductor Motion SPM SuperSOT 3 Des FACT Quiet Series OPTOLOGIC SuperSOT 6 UHC FACT OPTOPLANAR SuperSOT 8 Ultra FRFET FAST SupreMOS UniFET FastvCore SyncFET VCX FETBench PDP SPM Sync Lock E VisualMax SYSTEM TM Bear Power SPMTM EIER XS yoajims HUTT JUNI 3ndino jenq 0 20 00 24d3 Trademarks of System General Corporation used under license by Fairchild Semiconductor DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY FUNCTION OR DESIGN FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS NOR THE RIGHTS OF OTHERS THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS SPECIFICALLY THE WARRANTY THEREIN WHICH COVERS THESE PRODUCTS LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHO
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