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Intel D2550MUD2

1. inte Intel Desktop Board D2550MUD2 Technical Product Specification July 2012 Part Number G73745 001 The Intel Desktop Board D2550MUD2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications Current characterized errata are documented in the Intel Desktop Board D2550MUD2 Specification Update Revision History Revision Revision History Date 001 First release of the Intel Desktop Board D2550MUD2 Technical Product July 2012 Specification This product specification applies to only the standard Intel Desktop Board D2550MUD2 with BIOS identifier MUCDT10N 86A INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS OTHERWISE AGREED IN WRITING BY INTEL THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY O
2. 1 9 1 Audio Subsystem Software Audio software and drivers are available from Intel s World Wide Web site For information about Refer to Obtaining audio software and drivers Section 1 2 page 16 1 9 2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board The component side audio headers include front panel audio a 2 x 5 pin header that provides mic in and line out signals for front panel audio connectors OM23178 Item Description A Line in B Line out C Mic in Figure 5 Back Panel Audio Connectors A wgl NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only Poor audio quality occurs if passive non amplified speakers are connected to this output For information about Refer to The locations of the front panel audio header and S PDIF audio header Figure 11 page 43 The signal names of the front panel audio header and S PDIF header Section 2 2 2 1 page 45 27 Intel Desktop Board D2550MUD2 Technical Product Specification 1 10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management WfM specification The board has several hardware management features including the following e Thermal monitoring e Voltage monitoring 1 10 1 Hardware Monitoring 28 The hardware monitoring and f
3. 640 K 800 K A0000 C7FFF 160 KB Video memory and BIOS 639 K 640 K 9FCOO 9FFFF 1 KB Extended BIOS data movable by memory manager software 512 K 639 K 80000 9FBFF 127 KB Extended conventional memory OK 512 K 00000 7FFFF 512 KB Conventional memory 39 Intel Desktop Board D2550MUD2 Technical Product Specification 2 2 Uu 40 Connectors and Headers CAUTI ON Only the following connectors headers have overcurrent protection Back panel and front panel USB VGA serial and PS 2 The other internal connectors headers are not overcurrent protected and should connect only to devices inside the computer s chassis such as fans and internal peripherals Do not use these connectors headers to power devices external to the Computers chassis A fault in the load presented by the external devices could cause damage to the computer the power cable and the external devices themselves NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements even if no device is attached to the cable Use shielded cable that meets the requirements for full speed devices This section describes the board s connectors and headers The connectors and headers can be divided into these groups e Back panel I O connectors see page 41 e Component side connectors and headers see page 43 Technical Reference 2 2 1 Back Panel 2 2 1 1 Back Panel Connectors Figure 9
4. Table 11 TPM Header Table 12 Serial Port Headers Pin 1 DCD Data Carrier Detect 2 4 3 5 7 9 Signal Name CK 33M TPM DIP LFRAME PLTRST LAD3 3 3 V LADO No connection 3 3 VSB Ground LPCPD Signal Name TXD Transmit Data Ground RTS Request To Send RI Ring Indicator Pin 10 12 14 16 18 20 Pin 10 Signal Name Ground Key no pin No connection LAD2 LAD1 Ground No connection TPM SERRQ TPM CLKRUN No connection Signal Name RXD Receive Data DTR DSR Data Set Ready CTS Clear To Send Key no pin Data Terminal Ready 45 Intel Desktop Board D2550MUD2 Technical Product Specification 46 Table 13 LVDS Data Connector Pin 1 11 13 15 17 19 21 23 25 27 29 Signal Name LA CLKN Description LVDS Channel A diff clock output negative LA CLKP LVDS Channel A diff clock output positive EDID 3 3V Power for EDID ROM LA DATANO LVDS Channel A diff data output negative LVDS Channel A diff data output positive LVDS Channel A diff data output negative LA DATAPO LA DATAN1 LA DATAPI LVDS Channel A diff data output positive GND Ground LA DATAN2 LVDS Channel A diff data output negative LVDS Channel A diff data output positive LVDS Channel A diff data output negative LVDS Channel A diff data output positive 3 3 V 5 V 12 V Selectable LCD power output 3 3 V
5. Table 35 Acceptable Drives Media Types for BIOS Recovery Media Type N te Can be used for BIOS recovery Optical drive connected to the SATA interface Yes USB removable drive a USB Flash Drive for example Yes USB diskette drive with a 1 44 MB diskette No USB hard disk drive Yes NOTE Supported file systems for BIOS recovery e NTFS sparse compressed or encrypted files are not supported FAT32 FAT16 FAT12 ISO 9660 For information about Refer to BIOS update instructions http www intel com support motherboards desktop sb CS 022312 htm 69 Intel Desktop Board D2550MUD2 Technical Product Specification 3 6 2 Custom Splash Screen a Sal x During POST an Intel splash screen is displayed by default This splash screen can be augmented with a custom splash screen The Intel Integrator s Toolkit that is available from Intel can be used to create a custom splash screen NOTE If you add a custom splash screen it will share space with the Intel branded logo For information about Refer to Intel Integrator Toolkit http developer intel com design motherbd software itk 3 7 Boot Options In the BIOS Setup program the user can choose to boot from a hard drive optical drive removable drive or the network The default setting is for the optical drive to be the first boot device the hard drive second removable drive third and the network fourth 3 7 1 Optical Drive Boot Booting from the optical
6. Suspend to RAM sleep state While in the S3 sleep state the computer will appear to be off the hard drive s and fan will power off the front panel LED will blink When signaled by a wake up device or event the system quickly returns to its last known state Table 8 on page 32 lists the devices and events that can wake the computer from the S3 state The board supports the PCI Bus Power Management Interface Specification Add in boards that also support this specification can participate in power management and can be used to wake the computer 1 11 2 4 Wake from USB USB bus activity wakes the computer from an ACPI S3 state m p NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the operating system 1 11 2 5 PMEf Signal Wake up Support When the PMEf signal on the PCI bus is asserted the computer wakes from an ACPI 53 54 or S5 state with Wake on PME enabled in the BIOS 1 11 2 6 Wake from PS 2 Devices PS 2 keyboard activity wakes the computer from an ACPI S3 S4 or S5 state However when the computer is in an ACPI S4 or S5 state the only PS 2 activity that will wake the computer is the Alt Print Screen or the Power Key available only on some keyboards 1 11 2 7 WAKE Signal Wake up Support When the WAKE signal on the PCI Express bus is asserted the computer wakes from an ACPI S3 S4 or S5 state 1 11 2 8 Wake from Serial Port Serial Port activity wakes the compu
7. signal wake up support e 5V Standby Power Indicator LED LAN wake capabilities and Instantly Available PC technology require power from the 5 V standby line NOTE The use of Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support 1 11 2 1 Fan Header The function operation of the fan header is as follows e The fan is on when the board is in the SO state e The fan is off when the board is off or in the S3 S4 or S5 state e The system fan header supports closed loop fan control that can adjust the fan speed and is wired to a fan tachometer input e The fan header supports 12 V 3 wire fans at 1 A maximum For information about Refer to The locations of the fan header and thermal sensors Figure 6 page 29 The signal names of the system fan header Table 17 page 46 1 11 2 2 LAN Wake Capabilities LAN wake capabilities enable remote wake up of the computer through a network The LAN subsystem network adapter monitors network traffic at the Media Independent Interface The board supports LAN wake capabilities with ACPI in the following ways e By Ping e By Magic Packet Upon detecting the configured wake packet type the LAN subsystem asserts a wake up signal that powers up the computer 33 Intel Desktop Board D2550MUD2 Technical Product Specification 1 11 2 3 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI 53
8. 2 MINICARD WLAN Pin OLN oO w e Signal Name Port 1 Left channel Port 1 Right channel Port 2 Right channel SENSE_SEND Jack detection Port 2 Left channel Signal Name MIC_BIAS 12 V PWM controlled pulses Front Panel Wireless Activity LED Header Signal Name Ground PRESENCE Dongle present Port 1 SENSE RETURN Key no pin Port 2 SENSE RETURN Signal Name AUD GND AUD GND FP RETURN R KEY no pin FP RETURN L Table 22 Front Panel USB Header Pin OTN U wje Signal Name Ground KEY no pin Technical Reference Signal Name 5 VDC D D Ground No Connect Table 23 Front Panel USB Header with Intel Z U130 USB Solid State Drive or Compatible Device Support Pin Signal Name 1 5 VDC 3 D 5 D 7 Ground 9 KEY no pin Pin 2 4 6 8 10 Signal Name NC NC NC NC LED 49 Intel Desktop Board D2550MUD2 Technical Product Specification 2 2 2 2 Add in Card Connectors K r K r X 50 The board has the following add in card connectors e PCI Express Full Half Mini Card slot e Conventional PCI bus connector with riser card support for up to two PCI cards Note the following considerations for the Conventional PCI bus connector e The Conventional PCI bus connector is bus master capable e SMBus signals are routed to the Conventional PCI bus connector This enables Conventional PCI
9. 352 0 087 8012 OM23335 Figure 10 1 O Shield Reference Diagram 42 Technical Reference 2 2 2 Component side Connectors and Headers Figure 11 shows the locations of the component side connectors and headers Z Z O DO A NH O GERRERURURUURRRURREREN TITT LLLI TTTTTTI LLL Zu o m 388080008 O OM23183 Figure 11 Component side Connectors and Headers 43 Intel Desktop Board D2550MUD2 Technical Product Specification Table 10 lists the component side connectors and headers identified in Figure 11 Table 10 Component side Connectors and Headers Shown in Figure 11 Item callout from Figure 11 Description A LVDS inverter panel voltage selection jumper S PDIF header Processor core power connector 2 x 12 LVDS panel connector TPM header SATA connector SATA connector TO T mM O O O System fan header Front panel header Front panel USB 2 0 header Front panel wireless activity LED header Piezo monotonic speaker header PCI Express Full Half Mini Card slot Conventional PCI bus add in card connector Serial port header COMM 2 FPD brightness connector LVDS inverter power voltage selection jumper Front panel audio header Front panel USB header that supports an Intel Z U130 USB Solid State Drive or compatible device brown colored Serial port header COMM 1 N I O T JO Z Z T A 44 2 2 2 1 Technical Reference Signal Tables for the Connectors and Headers
10. 5 V 12 V Selectable LCD power output EDI D DDC clock signal LA DATAP2 LA DATAN3 LA DATAP3 EDID CLK Pin 10 12 14 16 18 20 22 24 26 28 30 Signal Name 2 O 2 O EDID_GND E O O 2 O 2 2 O z O O U 2 O 2 el GND 3 3 V 5 V 12 V 3 3 V 5 V 12 V EDID DATA Description Ground for EDID signaling Ground Ground Ground Selectable LCD power output Selectable LCD power output EDID DDC data signal Table 14 Voltage 3 3 V 5 V 12V Table 15 Technical Reference LVDS Panel Voltage Selection Jumper Jumper Setting Configuration Jumper position for 3 3 V default FPD Brightness Connector Jumper position for 5 V Jumper position for 12 V Pin Signal Name Description o o u m5jJu m mn Table 16 Voltage 5V 12V Backlight enable Backlight control Backlight inverter power Backlight inverter power Ground shared Ground shared Panel brightness increase Panel brightness decrease LVDS Inverter Power Voltage Selection Jumper Jumper Setting Configuration Jumper position for 5 V default Jumper position for 12 V 47 Intel Desktop Board D2550MUD2 Technical Product Specification 48 Table 17 System Fan Header Signal Name Ground Tach Table 18 SATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 19 Pin Signal Name 1 Ground
11. 6 7 inches 170 millimeters by 170 millimeters compatible with microATX Passively cooled soldered down Dual Core Intel Atom processor with integrated graphics and integrated memory controller e Two 204 pin DDR3 SDRAM Small Outline Dual Inline Memory Module SO DI MM sockets e Support for DDR3 1066 MHz DDR3 1333 MHz and DDR3 1600 MHz SO DIMMs Note DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz e Support for up to 4 GB of system memory on a single SO DI MM Passively cooled Intel NM10 Express Chipset Multi streaming 5 1 6 channel audio subsystem support based on the Realtek ALC662 high definition audio codec Onboard Intel graphics subsystem with support for e Analog displays VGA e Digital displays DVI D Flat Panel displays LVDS interface Winbond W83627DHG P based Legacy I O controller for hardware management serial parallel and PS 2 ports e Seven USB 2 0 ports Four back panel ports Two ports are implemented with a dual port internal header for front panel cabling One port is implemented with an internal header brown colored that supports an Intel Z U130 USB Solid State Drive or compatible device e Two Serial ATA SATA 3 0 Gb s connectors supporting IDE and AHCI mode e One parallel port connector on the back panel e Two serial port headers e PS 2 style keyboard mouse ports 10 100 1000 Mb s Ethernet LAN subsystem using an Intel 82574L Gigabit Ethernet Controller
12. Chipset is a centralized controller for the board s I O paths NOTE The board is designed to be passively cooled in a properly ventilated chassis Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness For information about Refer to The Intel NM10 Express chipset http www intel com products desktop chipsets index htm Resources used by the chipset Chapter 2 1 5 1 1 Video Memory Allocation Video memory is allocated from the total available system memory for the efficient balancing of 2 D 3 D graphics performance and overall system performance Dynamic allocation of system memory to video memory is as follows e 256 MB total RAM results in 32 MB video RAM e 512 MB total RAM results in 64 MB video RAM e 1 GB total RAM results in 128 MB video RAM e 2 GB total RAM results in 224 MB video RAM 1 5 1 2 Analog Display VGA The VGA port supports analog displays The maximum supported resolution is 1920 x 1200 WUXGA at a 60 Hz refresh rate The VGA port is enabled for POST whenever a monitor is attached regardless of the DVI D connector status 1 5 1 3 Digital Visual Interface DVI D 20 The DVI D port supports only digital DVI displays The maximum supported resolution is 1920 x 1200 at 60 Hz refresh The DVI D port is compliant with the DVI 1 0 specification Product Description 1 5 1 4 Flat Panel Interface LVDS The flat panel interface LVDS supports th
13. Compliance and Battery Disposal I nformation Russian B KayecTBe 4YacTU CBONX o6s3aTe IbCTB K okpyxarouiel cpene B Intel co34aHa nporpaMMa yTunnaaunn mpoayKkumn Intel Product Recycling Program ana npeaocraB IeHdMsi KOHEYHbIM Monb30BaTenam Mapok NPOAYKLIUN ntel BO3MOXHOCTH BO3BpaTa ucnonb3yemo NPOAYKLIUU B CAEUNANUN3UPOBAHHbIE NYHKTbI ANA JOMKHO yrAnu3auM Moxany cTa o6paTWTecb Ha Be6 calr http www intel com intel other ehs product ecology 3a uHbopMaunen o6 ston nporpaMMe npuHumaembIx riponykrax Mecrax Mpuema MHCTpyKUMAX o6 ornpaske NONOXKEHUAX N YCNOBUAX N T A T rkce Intel evre sorumluluguna bagimliliginin bir pargas olarak perakende t keticilerin Intel markali kullan lm s r nlerini belirlenmis merkezlere iade edip uygun sekilde geri d n t rmesini ama layan Intel r nleri Geri D n m Program n uygulamaya koymustur Bu programin r n kapsami r n iade merkezleri nakliye talimatlari kayitlar ve sartlar v s dahil b t n ayr nt lar n grenmek icin l tfen http www intel com intel other ehs product ecology Web sayfasina gidin 5 1 4 EMC Regulations Intel Desktop Board D2550MUD2 complies with the EMC regulations stated in Table 45 when correctly installed in a compatible host system Table 45 EMC Regulations Regulation Title FCC 47 CFR Part 15 Title 47 of the Code of Federal Regulations Part 15 Subpart B Radio Subpart B Frequency Devices USA ICES 003 Interf
14. Enumeration Keyboard PS 2 or USB 0x90 Resetting keyboard 0x91 Disabling the keyboard 0x92 Detecting the presence of the keyboard 0x93 Enabling the keyboard 0x94 Clearing keyboard input buffer 0x95 Instructing keyboard controller to run Self Test PS 2 only Mouse PS 2 or USB 0x98 Resetting mouse 0x99 Detecting mouse Ox9A Detecting presence of mouse Ox9B Enabling mouse Fixed Media OxBO Resetting fixed media OxB1 Disabling fixed media 0xB2 Detecting presence of a fixed media IDE hard drive detection etc 0xB3 Enabling configuring a fixed media Removable Media 0xB8 Resetting removable media 0xB9 Disabling removable media OxBA Detecting presence of a removable media IDE CDROM detection etc OxBC Enabling configuring a removable media DXE Core OxE4 Entered DXE phase BDS OxE7 Waiting for user input OxE8 Checking password OxE9 Entering BIOS setup OxEB Calling Legacy Option ROMs Runtime Phase EFI OS Boot OxF8 EFI boot service ExitBootServices has been called OxF9 EFI runtime service SetVirtualAddressMap has been called Table 43 Typical Port 80h POST Sequence POST Code 24 27 28 33 E4 50 51 92 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 00 A3 Description Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Enumerating PCI buses Allocating re
15. Express Full Half Mini Card slot connected via 802 11n protocol Load continuous read write benchmark on remote share e Riser card on conventional PCI slot populated with PCI LAN card running file transfer through local network to SATA hard drive 63 Intel Desktop Board D2550MUD2 Technical Product Specification e USB keyboard and mouse e Back and front panel host powered USB devices other than keyboard and mouse Load continuous read write activity on external drive peripheral e LAN linked at 1000 Mb s Load continuous read write benchmark on remote share e All on board peripherals enabled serial parallel audio Table 31 Maximum Load Configuration Current and Power Results 2 8 Reliability The Mean Time Between Failures MTBF prediction is calculated using component and subassembly random failure rates The calculation is based on the Telcordia SR 332 Method I Case 1 50 electrical stress 55 C ambient The MTBF prediction is used to estimate repair rates and spare parts requirements The MTBF data was calculated from predicted data at 55 9C The Intel Desktop Board D2550MUD2 has an MTBF of at least 293 676 hours 2 9 Environmental Table 32 lists the environmental specifications for the board Table 32 Intel Desktop Board D2550MUD2 Environmental Specifications Parameter Specification Temperature Non Operating 20 C to 70 C Operating 0 C to 50 C Shock Unpackaged 50 g trapezoida
16. Phase 0x44 Begin CPU SMM Init smm relocate bases 0x45 Smm relocate bases for APs 0x46 End CPU SMM Init continued Board Status and Error Messages Table 42 Port 80h POST Codes continued Port 80 Code Progress Code Enumeration CPU DXE Phase 0x47 CPU DXE Phase begin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed Ox4A Initialize strings to HII database 0x4B Initialize MP support 0x4C CPU DXE Phase End CPU DXE SMM Phase 0x4D CPU DXE SMM Phase begin 0x4E Relocate SM bases for all APs Ox4F CPU DXE SMM Phase end 1 O BUSES 0x50 Enumerating PCI buses 0x51 Allocating resources to PCI bus 0x52 Hot Plug PCI controller initialization USB 0x58 Resetting USB bus 0x59 Reserved for USB ATA ATAPI SATA Ox5A Resetting PATA SATA bus and all devices 0x5B Reserved for ATA BDS 0x60 BDS driver entry point initialize 0x61 BDS service routine entry point can be called multiple times 0x62 BDS Step2 0x63 BDS Step3 0x64 BDS Step4 0x65 BDS Step5 0x66 BDS Step6 0x67 BDS Step7 0x68 BDS Step8 0x69 BDS Step9 Ox6A BDS Step10 0x6B BDS Step11 0x6C BDS Step12 0x6D BDS Step13 Ox6E BDS Step14 Ox6F BDS return to DXE core should not get here continued 79 Intel Desktop Board D2550MUD2 Technical Product Specification 80 Table 42 Port 80h POST Codes continued Port 80 Code Progress Code
17. The maintenance menu is displayed Recovery None The BIOS attempts to recover the BIOS configuration See Section 3 7 for more information on BIOS recovery Technical Reference 2 4 Mechanical Considerations 2 4 1 Form Factor The board is designed to fit into a mini I TX or microATX form factor chassis Figure 16 illustrates the mechanical form factor for the board Dimensions are given in inches millimeters The outer dimensions are 6 7 inches by 6 7 inches 170 millimeters by 170 millimeters Location of the I O connectors and mounting holes are in compliance with the microATX specification 6 500 165 10 1 300 33 02 6 100 154 94 5 200 132 08 6 425 699 163 20 6 200 157 48 OM23184 Figure 16 Board Dimensions 57 Intel Desktop Board D2550MUD2 Technical Product Specification 2 5 Electrical Considerations 2 5 1 Fan Header Current Capability Table 28 lists the current capability of the fan header Table 28 Fan Header Current Capability Fan Header Maximum Available Current System fan 1 5A 2 5 2 Add in Board Considerations The board is designed to provide 2 A average of 5 V current for the Conventional PCI slot The total 5 V current draw for the Conventional PCI expansion slot total load must not exceed 2 A 2 6 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 C at the processor fan inlet i
18. drive is Supported in compliance to the EI Torito bootable CD ROM format specification Under the Boot menu in the BIOS Setup program the optical drive is listed as a boot device Boot devices are defined in priority order Accordingly if there is not a bootable CD in the optical drive the system will attempt to boot from the next defined drive 3 7 2 Network Boot 70 The network can be selected as a boot device This selection allows booting from the onboard LAN or a network add in card with a remote boot ROM installed Pressing the lt F12 gt key during POST automatically forces booting from the LAN To use this key during POST the User Access Level in the BIOS Setup program s Security menu must be set to Full Overview of BIOS Features 3 7 3 Booting Without Attached Devices For use in embedded applications the BIOS has been designed so that after passing the POST the operating system loader is invoked even if the following devices are not present e Video adapter e Keyboard e Mouse 3 7 4 Changing the Default Boot Device During POST Pressing the lt F10 gt key during POST causes a boot device menu to be displayed This menu displays the list of available boot devices as set in the BIOS setup program s Boot Device Priority submenu Table 36 lists the boot device menu options Table 36 Boot Device Menu Options Boot Device Menu Function Keys Description lt P gt or i Selects a default boot device Enter
19. of option ROM boot time 22 NOTE 72 It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen or a custom logo splash screen will not be seen Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen This boot time may be so fast that some drives might be not be initialized at all If this condition should occur it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments using the Hard Disk Pre Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program 3 9 Overview of BIOS Features BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer with the following restrictions The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program This is the supervisor mode The user password gives restricted access to view and change Setup options in the BIOS Setup program This is the user mode If only the supervisor password is set pressing the lt Enter gt key at the password prompt of the BIOS Setup program allows the user restric
20. shows the location of the back panel connectors OM23179 tem Description DVI D port Parallel port VGA port PS 2 keyboard mouse port USB ports LAN port USB ports Line in Line out Mic in EC G mm Oo D gt Figure 9 Back Panel Connectors A pi NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only Poor audio quality occurs if passive non amplified speakers are connected to this output 41 Intel Desktop Board D2550MUD2 Technical Product Specification 2 2 1 2 I O Shield The I O shield provided with the board allows access to all back panel connectors and is compatible with standard mini ITX and microATX chassis As an added benefit for system configurations with wireless PCI Express Mini Card solutions the I O shield also provides pre cut holes for user installation of up to two external wireless antennas Figure 10 shows an I O shield reference diagram 158 71 0 2 6 248 0 008 159 27 0 2 6 270 0 008 E 0 0 000 109 915 0675 34 5349 03 8 93 1007 27 77 22 9 4291 3602 0266 2106 0 118 0352 0396 1 093 5 6 22 0 03 0 087 _ vote i 0 087 912 0 4 0 000 917 DER 0157 5 92 0 361 0361 gop 1692 0233 28 15 10391 L 0666 1 108 ze 0 718 1 024 D 099 29 55 1 163 Q 0 22 22 43 748 35 47 893 Pg 0087 8912 2 945 1 396 0
21. well as attached devices in order to facilitate power supply rating estimates for specific system configurations 2 7 1 Minimum Load Configuration Minimum load refers to the power demand placed on the power supply when using a bare system configuration with minimal power requirement conditions Minimum load configuration test results are shown in Table 30 The test configuration was defined as follows e 2 GB DDR3 1066 MHz SO DIMM e USB keyboard and mouse e LAN linked at 1000 Mb s e DOS booted via network PXE system at idle e All on board peripherals enabled serial parallel audio Table 30 Minimum Load Configuration Current and Power Results 2 7 2 Maximum Load Configuration Maximum load refers to the incremental power demands placed on the power supply augmenting the minimum load configuration into a fully featured system that stresses power consumption from all subsystems Maximum load configuration test results are shown in Table 31 The test configuration was defined as follows e 4 GB DDR3 1066MHz SO DIMM e 14 1 inch LCD via LVDS e SATA DVD R W Load DVD playback e 3 5 inch SATA hard disk drive running Microsoft Windows Vista Home Basic Load continuous read write benchmark e 2 5 inch SATA hard disk drive Load continuous read write benchmark e Intel Z U130 USB Solid State Drive or compatible device on the USB flash drive header Load continuous read write benchmark e Wireless card on PCI
22. 06 95 EC a 2002 95 EC Slovenscina Izdelek je skladen z dolocbami evropskih direktiv 2004 108 EC 2006 95 EC in 2002 95 EC Svenska Denna produkt har tillverkats i enlighet med EG direktiv 2004 108 EC 2006 95 EC amp 2002 95 EC T rk e Bu r n Avrupa Birli i nin 2004 108 EC 2006 95 EC ve 2002 95 EC y nergelerine uyar 5 1 3 Product Ecology Statements 5 1 5 1 The following information is provided to address worldwide product ecology concerns and regulations 3 1 Disposal Considerations This product contains the following materials that may be regulated upon disposal lead solder on the printed wiring board assembly 3 2 Recycling Considerations As part of its commitment to environmental responsibility Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel s branded products to return used products to selected locations for proper recycling Please consult the http www intel com intel other ehs product ecology for the details of this program including the scope of covered products available locations shipping instructions terms and conditions etc hx EASON SEZ RA ERR OC Skit Intel Product ha Program XR Ii XD DA FAR SRR AR m S AE GSE HSE AP AREA ETE AM EE SR 5 http www intel ETTER ecology fiy ipXBE BEA P R2 eg I EN JER Tv AKA FA Deutsch Als Teil von Intels Engagement f r den Umweltschutz hat das Unternehmen das Intel Produkt Recyclingprogramm implement
23. 0MUD2 Technical Product Specification The amount of installed memory that can be used will vary based on add in cards and BIOS settings Figure 8 shows a schematic of the system memory map All installed system memory can be used when there is no overlap of system addresses PCI Memory Range 4 approximately 750 MB DRAM Range 38 DOS Compatibility Memory 4 GB Top of system address space FLASH APIC Reserved Upper d 4 GB of address space A gt 20 MB Top of usable DRAM memory visible to the operating system 1 MB 640 KB OFFFFFH OFOOOOH OEFFFFH 0E0000H ODFFFFH OCOOOOH OBFFFFH 0A0000H O9FFFFH 00000H gt Upper BIOS area 64 KB Lower BIOS area 64 KB 16 KB x 4 Add in Card BIOS and Buffer area 128 KB 16 KB x 8 Standard PCI ISA Video Memory SMM Memory 128KB DOS area 640 KB Figure 8 Detailed System Memory Address Map 1 MB 960 KB 896 KB 768 KB 640 KB OKB OM21736 Technical Reference Table 9 lists the system memory map Table 9 System Memory Map Address Range Address Range decimal hex Description 1024 K 4194304 K 100000 FFFFFFFF 4095 MB Extended memory 960 K 1024 K F0000 FFFFF 64 KB Runtime BIOS 896 K 960 K E0000 EFFFF 64 KB Reserved 800 K 896 K C8000 DFFFF 96 KB Potential available high DOS memory open to the PCI bus Dependent on video adapter used
24. 62 Tables to Feature Summary uu aan Ede 11 2 Board Components Shown in Figure L A 14 3 Supported Memory Configurations ann an rr 18 4 LAN Connector LED States nn ae ee 25 5 Audio Jack SOPP uu oL ik 26 6 Effects of Pressing the Power Switch 30 7 PowerStatesandlargetedSystemPower 3l 8 Wake up Devices and Events 32 9 System Memory Map EE 39 10 Component side Connectors and Headers Shown in Figure 11 44 11 TPM Gat ss ses rk ee ee eine 45 12 Seri l Port Headers racine naen era 45 13 LVDS Data elle EE 46 14 LVDS Panel Voltage Selection JUMP HR nennen nennen nenn 47 15 FPD Brightness CONNECT e 47 16 LVDS Inverter Power Voltage Selection Jumper 47 17 System Fan Header Lausanne 48 I8 SATA lee e EE 48 19 Front Panel Wireless Activity LED Header 48 20 Front Panel Audio Header for Intel HDAudio 48 21 Front Panel Audio Header for AC 97Audi0 48 Intel Desktop Board D2550MUD2 Technical Product Specification Front Panel USB Header une en 49 Front Panel USB Header with Intel Z U130 USB Solid State Drive or Compatible Device Support 49 POW Er Connie ctoE dirus ex cbr ss ka icli 51 Front Panel Hegel xiu en an AR AMORIS 52 States for a One Color Power LEID 53 BIOS Configuration Jumper Settings 56 Fan Heade
25. 9 Table 39 Front panel Power LED Blink Codes Type BIOS update in progress Off when the update begins then on for 0 5 seconds then off for 0 5 seconds The pattern repeats until the BIOS update is complete On off 1 0 second each two times then When no VGA option ROM is 2 5 second pause off entire pattern repeats found blink and pause until the system is powered off Memory error On off 1 0 second each three times then Note Video error Note 2 5 second pause off entire pattern repeats blinks and pause until the system is powered off Thermal trip warning Each beep will be accompanied by the following blink pattern 25 seconds on 25 seconds off 25 seconds on 25 seconds off This will result in a total of 16 blinks Note Disabled per default BIOS setup option 4 3 BIOS Error Messages Whenever a recoverable error occurs during POST the BIOS displays an error message describing the problem Table 40 lists the error messages and provides a brief description of each Table 40 BIOS Error Messages Error Message Explanation CMOS Battery Low The battery may be losing power Replace the battery soon CMOS Checksum Bad The CMOS checksum is incorrect CMOS memory may have been corrupted Run Setup to reset values Memory Size Decreased Memory size has decreased since the last boot If no memory was removed then memory may be bad No Boot Device Available System did not find a device t
26. CCUR Intel Corporation may have patents or pending patent applications trademarks copyrights or other intellectual property rights that relate to the presented subject matter The furnishing of documents and other materials and information does not provide any license express or implied by estoppel or otherwise to any such patents trademarks copyrights or other intellectual property rights Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them Intel Desktop Boards may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order Intel the Intel logo and Intel Atom are trademarks of Intel Corporation in the U S and or other countries Other names and brands may be claimed as the property of others Copyright O 2012 Intel Corporation All rights reserved Board I dentification Information Basic Desktop Board D2550MUD2 Identification Information AA Revision BIOS R
27. Exits the menu saves changes and boots from the selected device lt Esc gt Exits the menu without saving changes 3 8 Adjusting Boot Speed These factors affect system boot speed e Selecting and configuring peripherals properly e Optimized BIOS boot parameters e Enabling the new Fast Boot feature 3 8 1 Peripheral Selection and Configuration The following techniques help improve system boot speed e Choose a hard drive with parameters such as power up to data ready in less than eight seconds that minimizes hard drive startup delays e Select a CD ROM drive with a fast initialization rate This rate can influence POST execution time e Eliminate unnecessary add in adapter features such as logo displays screen repaints or mode changes in POST These features may add time to the boot process e Try different monitors Some monitors initialize and communicate with the BIOS more quickly which enables the system to boot more quickly 71 Intel Desktop Board D2550MUD2 Technical Product Specification 3 8 2 BIOS Boot Optimizations m2 Use of the following BIOS Setup program settings reduces the POST execution time e Inthe Boot Menu set the hard disk drive as the first boot device As a result the POST does not first seek a diskette drive which saves about one second from the POST execution time e n the Peripheral Configuration submenu disable the LAN device if it will not be used This can reduce up to four seconds
28. Ha 3rigHO MiCLIEBUX HOPM LUO PETYIIHOKTb OXOPOHY JOBKINNA Regulatory Compliance and Battery Disposal I nformation A UPOZORNENI V pripad vymeny baterie za nespr vny druh mize dojit E vybuchu Je li to moZne baterie by mely byt recyklov ny Baterie je tfeba zlikvidovat v souladu s mistnimi predpisy o ivotn m prost ed ETTEVAATUST Kui patarei asendatakse uue ebasobivat t pi patareiga v ib tekkida plahvatusoht T hjad patareid tuleb v imaluse korral viia vastavasse kogumispunkti T hjade patareide raviskamisel tuleb j rgida kohalikke keskkonnakaitse alaseid reegleid FIGYELMEZTET S Ha az elemet nem a megfelel tipusura cser li felrobbanhat Az elemeket lehet s g szerint jra kell hasznos tani A haszn lt elemeket a helyi k rnyezetv delmi el r soknak megfelel en kell kiselejtezni UZMAN BU Past v eksplozijas risks ja baterijas tiek nomain tas ar nepareiza veida baterij m Ja iesp jams baterijas vajadz tu nodot attiec gos pie em anas punktos Bateriju izme anai atkritumos j notiek saskan ar viet jiem vides aizsardz bas noteikumiem DEMESIO Naudojant netinkamo tipo baterijas irenginys gali sprogti Kai tik imanoma baterijas reikia naudoti pakartotinai Panaudotas baterijas ismesti b tina pagal vietinius aplinkos apsaugos nuostatus A ATTENZJONI Riskju ta splu joni jekk il batterija tinbidel b tip ta batterija mhux korrett Chatten g andhom ji u riciklati fein hu possibb
29. IOS Setup program menu features Table 33 BIOS Setup Program Menu Bar Clears Displays Configures Sets Configures Selects boot Saves or passwords and processor advanced passwords power options discards displays and memory features and security management changes to processor configuration available features features and Setup information through the power states program chipset options options Table 34 lists the function keys available for menu screens Table 34 BIOS Setup Program Function Keys BIOS Setup Program Function Key Description lt gt or lt gt gt Selects a different menu screen Moves the cursor left or right 1 or i Selects an item Moves the cursor up or down Enter Executes command or selects the submenu lt F9 gt Load the default configuration values for the current menu lt F10 gt Save the current values and exits the BIOS Setup program lt Esc gt Exits the menu 3 2 BIOS Flash Memory Organization The Serial Peripheral Interface Flash Memory SPI Flash includes a 16 Mb 2048 KB flash memory device 3 3 Resource Configuration 3 3 1 PCI Autoconfiguration The BIOS can automatically configure PCI devices PCI devices may be onboard or add in cards Autoconfiguration lets a user insert or remove PCI cards without having to configure the system When a user turns on the system after adding a PCI card the BIOS automatically configures interrupts the I O space and other system resou
30. PCI 0x60 Ox6F BDS 0x70 Ox7F Output devices All output consoles 0x80 Ox8F For future use 0x90 Ox9F Input devices Keyboard Mouse OxAO OxAF For future use OxBO OxBF Boot Devices Includes fixed media and removable media Not that critical since consoles should be up at this point OxCO OxCF For future use OxDO OxDF For future use 77 Intel Desktop Board D2550MUD2 Technical Product Specification 78 Table 42 Port 80h POST Codes Port 80 Code Progress Code Enumeration ACPI S States 0x00 0x01 0x02 0x03 0x04 0x05 Entering SO S2 S3 S4 or S5 state 0x10 0x20 0x30 Resuming from S2 S3 S4 or S5 state PEI before MRC PEI Platform driver 0x11 Set boot mode GPIO init 0x12 Early chipset register programming 0x13 Basic chipset initialization 0x14 LAN init 0x15 Exit early platform init driver PEI SMBUS 0x16 SMBUS driver init 0x17 Entry to SMBUS execute read write 0x18 Exit SMBUS execute read write Memory 0x21 MRC entry point 0x24 Detecting presence of memory DI MMs 0x25 Override Detected DIMM settings 0x27 Configuring memory 0x28 Testing memory PEI Ms Recovery 0x31 Crisis Recovery has initiated 0x33 Loading recovery capsule 0x34 Start recovery capsule valid capsule is found CPU Initialization CPU PEI Phase 0x41 Begin CPU PEI Init 0x42 XMM instruction enabling 0x43 End CPU PEI Init CPU PEl SMM
31. Parkway Hillsboro OR 97124 1 800 628 8686 This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures e Reorient or relocate the receiving antenna e Increase the separation between the equipment and the receiver e Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected e Consult the dealer or an experienced radio TV technician for help Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the user s authority to operate the equipment Tested to comply with FCC standards for home or office use Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio n
32. Pin Signal Name Pin Signal Name 1 3 3 V 13 3 3 V 2 3 3 V 14 12 V 3 Ground 15 Ground 4 5 V 16 PS ON power supply remote on off 5 Ground 17 Ground 6 5 V 18 Ground 7 Ground 19 Ground 8 PWRGD Power Good 20 No connect 9 5 V Standby 21 5 V 10 12 V 22 5 V 11 12 V 23 5 V 12 No connect 24 Ground 51 Intel Desktop Board D2550MUD2 Technical Product Specification 2 2 2 4 Front Panel Header This section describes the functions of the front panel header Table 25 lists the signal names of the front panel header Figure 12 is a connection diagram for the front panel header Table 25 Front Panel Header In In Pin Out Description Out Hard Drive Activity LED Power LED 1 HD PWR Out Hard disk LED 2 HDR BLNK GRN Out pull up to 5 V 3 HDA Hard disk active HDR BLNK YEL Out LED On Off Switch Reset Switch UT Not Connected Power Hard Drive RYK Activity LED Reset Switch 5VDC rv fee jo Iw Description Front panel green LED Front panel yellow LED Power switch Ground Not connected Single Dual colored colored Power LED Power LED Pa Power Switch No Connection OM20176 Figure 12 Connection Diagram for Front Panel Header 52 Technical Reference 2 2 2 4 1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or wr
33. an be turned off The operating system uses information from applications and user settings to put the system as a whole into a low power state Table 7 lists the power states supported by the board along with the associated system power targets See the ACPI specification for a complete description of the various system and power states Table 7 Power States and Targeted System Power Global States GO working state G1 sleeping State G1 sleeping state G2 S5 G3 mechanical off AC power is disconnected from the computer Notes Sleeping States SO working S3 Suspend to RAM Context saved to RAM 54 Suspend to disk Context saved to disk S5 Soft off Context not saved Cold boot is required No power to the system Processor States CO working No power No power No power Device States DO working state D3 no power except for wake up logic D3 no power except for wake up logic D3 no power except for wake up logic D3 no power for wake up logic except when provided by battery or external source Targeted System Power Note 1 Full power gt 30 W Power lt 5 W Note 2 Power lt 5 W Note 2 Power lt 5 W Note 2 No power to the system Service can be performed safely 1 Total system power is dependent on the system configuration including add in boards and peripherals powered by the system s power suppl
34. an control subsystem is based on the Winbond W83627DHG P device which supports the following e System ambient temperature monitoring e System fan speed monitoring e Power monitoring of 12 V 5 V 5 Vstdby 3 3 V and VCCP e SMBus interface Product Description 1 10 2 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan header LEN F d OM23180 Item Description A Remote thermal sensor B DTS located on the processor die C System fan header Figure 6 Thermal Sensors and Fan Header 29 Intel Desktop Board D2550MUD2 Technical Product Specification 1 11 Power Management Power management is implemented at several levels including e Software support through Advanced Configuration and Power Interface ACPI e Hardware support Power connector Fan header LAN wake capabilities Instantly Available PC technology Wake from USB Wake from PS 2 devices Power Management Event signal PME wake up support WAKEf signal wake up support 1 11 1 ACPI 30 ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer The use of ACPI with the board requires an operating system that provides full ACPI support ACPI features include e Plug and Play including bus and device enumeration e Power management control of individual devices add in boards some add in boards may requ
35. an open chassis Figure 17 shows the locations of the localized high temperature zones VUODUVODVUVODU EIDOEIEIUUEIEIDUE OM23185 Item Description A Processor voltage regulator area B Intel Atom processor C Intel NM10 Express Chipset Figure 17 Localized High Temperature Zones Table 29 provides maximum case temperatures for the board components that are sensitive to thermal changes The operating temperature current load or operating frequency could affect case temperatures Maximum case temperatures are important when considering proper airflow to cool the board 59 Intel Desktop Board D2550MUD2 Technical Product Specification Table 29 Thermal Considerations for Components Component Maximum Case Temperature Intel Atom processor 100 C Processor voltage regulator area 85 C Intel NM10 Express Chipset 113 C Memory SO DIMM 85 C For information about Refer to Processor datasheets and specification updates Section 1 2 page 16 2 6 1 Passive Heatsink Design in a Passive System Environment This section highlights important guidelines and related thermal boundary conditions for passive heatsink design in a passive system environment Passive heatsink describes a thermal solution without a fan attached Passive system environment describes a chassis with either a power supply fan or a built in system fan This information should be used in conjunction with the Thermal and Mechanical Design G
36. blObis ea en 5 1 5 ENERGY STAR 5 0 e Standby and ErP Compliance 5 1 6 Regulatory Compliance Marks Board Level 5 2 Battery Disposal ATOM ON en essere eee EES Contents Figures 1 Major Board Combpofriernits xor oes th o Per EE 13 2 Block RTE ie EE 15 3 Memory Channel and SO DIMM Configuration 19 4 LAN Connector LED Locations rurm out tos inne 25 5 Back Panel Audio Connectors yn a 27 6 Thermal Sensors and Fan Header 29 7 Location of the Standby Power Indicator LED 35 8 DetailedSystemMemoryAddressMap 38 9 Back Panel Connectors za Ae 41 10 OShieldReferenceDiagram 42 11 Component sideConnectorsandHeaders 43 12 ConnectionDiagramforFrontPanelHeader 52 13 Connection Diagram for Front Panel USB Header 54 14 Connection Diagram for Front Panel USB Header with Intel Z USB Solid StateDriveorCompatibleDeviceSupport 54 15 LocationoftheBIOSConfigurationJumperBlock 55 16 Board Dimensions EEN 57 17 LocalizedHighlemperatureZones 59 18 Fan Location Guide for Chassis Selection Chassis Orientation is Not E le WEE
37. bus add in boards with SMBus support to access sensor data on the board The specific SMBus signals are as follows The SMBus clock line is connected to pin A40 The SMBus data line is connected to pin A41 The Conventional PCI bus connector also supports single slot and dual slot riser cards for use of up to two bus master PCI expansion cards In order to support two PCI bus master expansion cards the riser card must support the following PCI signal routing e Pin All additional 33 MHz PCI clock e Pin B10 additional PCI Request signal e PREQ 2 e Pin B14 additional PCI Grant signal e GNT 2 NOTE BIOS IRQ programming for the second PCI slot on PCI riser card e ID SEL AD20 Device 4 e Second PCI slot INT Mapping INT Att A6 2 INT D of mother board PCI slot INT B t B7 2 INT AX of mother board PCI slot INT CH A7 2 INT B of mother board PCI slot INT DA B8 2 INT Cs of mother board PCI slot NOTE The Conventional PCI slot on this board does not support the PCI PHOLD function Due to this limitation errata certain PCI cards may experience performance or detection issues when DMA transfer is used as part of the PCI card operation PHOLD is the signal required to hold the bus during DMA transfers Technical Reference 2 2 2 3 Power Supply Connector The board has a 2 x 12 power connector see Table 24 This board requires a TFX12V or SFX12V power supply Table 24 Power Connector
38. chrony rodowiska PRECAUTIE Risc de explozie dac bateria este inlocuit cu un tip de baterie necorespunz tor Bateriile trebuie reciclate dac este posibil Depozitarea bateriilor uzate trebuie s respecte reglement rile locale privind protectia mediului BHMMAHME Mpun ucnonb30BaHNN 6aTapen HECOOTBETCTBYIOLUEFO TUTIA CYLUECTBYET PUCK ee B3PbIBA BaTapen JOJDKHblI bITb yTU1U3NPOBAHbI MO BOSMOXHOCTH YTUIN3ALUA 6aTapen ZOJDKHa IDOBOZMTCA MO TTIDaBH IaM COOTBETCTBYIOLYUM MECTHbIM Tpe60BaHMsM UPOZORNENI E Ak bat riu vymen te za nespr vny typ hroz nebezpecenstvo jej vybuchu Bat rie by sa mali podla mo nosti v dy recyklova Likvid cia pou it ch bat ri sa musi vykon va v s lade s miestnymi predpismi na ochranu ivotn ho prostredia POZOR Zamenjava baterije z baterijo druga nega tipa lahko povzro i eksplozijo e je mogo e baterije reciklirajte Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi n au A A 94 luna dg et ler ere ergeet ang ol ti l msiuumuatifienda ms TK E TE CH UYARI Yanl s t rde pil tak ld g nda patlama riski vardir Piller m mk n oldugunda geri d n st r lmelidir Kullan lm s piller yerel evre yasalar na uygun olarak at lmal d r OCTOPOTA BukopuctoByUTe 6aTapel mpaBunbHoro Tuny inakuie ICHyBaTUME PU3UK BUOYXY AKLJO MOXJIMBO BAKopucraHi 6arapei cr a yrunizyBaTu Yrunizayia BAKODUCTAHUX 6arapeli mae 6yTu BUKOHa
39. continued 11 Intel Desktop Board D2550MUD2 Technical Product Specification 12 Table 1 Feature Summary continued BIOS Instantly Available PC Technology Expansion Capabilities Hardware Monitor Subsystem Intel BIOS resident in the SPI Flash device Support for Advanced Configuration and Power Interface ACPI Plug and Play and SMBIOS Suspend to RAM support Wake on PCI PCI Express PS 2 serial front panel USB ports and LAN One Conventional PCI bus connector with riser card support for up to two PCI cards One PCI Express Full Half Mini Card slot Hardware monitoring through the Windbond I O controller Voltage sense to detect out of range power supply voltages Thermal sense to detect out of range thermal values One fan header One fan sense input used to monitor fan activity Fan speed control Product Description 1 1 2 Board Layout Figure 1 shows the location of the major components AA Z dE Y E X H BEE W V A T det OM23175 Figure 1 Major Board Components Table 2 lists the components identified in Figure 1 13 Intel Desktop Board D2550MUD2 Technical Product Specification 14 Table 2 Board Components Shown in Figure 1 Item callout from Figure 1 A TG mm S o m N lt x s lt ci gH nu l2 0 v o0 zlz riza gt Description LVDS inverter panel voltage selection jumper Back panel connectors S PDIF header Standby power LED Pr
40. e Sibel Ras 20 1 5 2 EN 22 1 53 BATA SUPPONE ee en a O TEE OE EEE T E 22 1 6 Real Time Clock SubDsystelm oer Eo en te t d ee eH a n a a Ru 23 1 7 Legacy I O Controller sise sila oe hr rra ei 23 1 8 LAN SUD RE NEEN ENNEN kerk Hae E 24 18 1 LAN Subsystem Drivers 24 1 8 2 RJ 45 LAN Connector with Integrated LEDS 25 1 9 Audio SUBSYSTEM av a rasen LAGA ee 26 1 9 1 Audio Subsystem Software ansees ales 27 1 9 2 Audio Connectors and Headers eese 27 1 10 Hardware Management Subsystem enn 28 1 10 1 Hardware Monitoring edere rer 28 1 10 2 Thermal Monitoring sic seis vases o di 29 1 11 Power Management 2 EE 30 JY Jb D ACP a eid ehe ue uae b 30 1 11 2 Hardware Support GEET 33 2 Technical Reference 2 1 Memory Map urn qi HE id ERROR ENEE 31 2 1 1 Addressable Memory ea rar Bk li ea le i 37 2 2 Connectors and Hesders ar s ost ded ZH Rei BR DER 40 2 1 Back Panels amele e ER M dee 41 2 2 2 Component side Connectors and Headers HR 43 2 3 BIOS Configuration Jumper Block u arena 55 2 4 Mechanical Considerations A 57 2 41 F OriYUUFaetore S sun PNL 57 2 5 Electrical Considerationsarn ausser sen ae ds Dema de 58 2 5 1 Fan Header Current Capability A 58 2 5 2 Add in Board Considerations sr nes ee ne 58 2 6 Thermal onsideratloriss ie a ER nt 58 2 6 1 Passive Heatsink Design in a Passive System Environment 60 vii Intel Desktop Board D2550MUD2 Technical Product Specification vi
41. e following 1 5 Panel support up to WXGA 1440 x 900 25 MHz to 112 MHz single channel 18 or 24 bpp TFT panel type Panel fitting panning and center mode CPIS 1 5 compliant Spread spectrum clocking Panel power sequencing Integrated PWM interface for LCD backlight inverter control Flat panel brightness control via front panel button input as well as Windows 7 Screen brightness adjustment slider 1 5 Configuration Modes For monitors attached to the VGA port video modes supported by this board are based on the Extended Display Identification Data EDID protocol Video mode configuration for LVDS displays is supported as follows Automatic panel identification via Extended Display Identification Data EDID for panels with onboard EDID support Panel selection from common predefined panel types without onboard EDID Custom EDID payload installation for ultimate parameter flexibility allowing custom definition of EDID data on panels without onboard EDID In addition BIOS setup provides the following configuration parameters for internal flat panel displays Screen Brightness allows the end user to set the screen brightness for the display effective through the Power On Self Test stage such as while showing the splash screen image and BIOS setup Windows 7 will ignore this setting in favor of the native screen brightness control provided by the operating system Brightness Steps allows the system integra
42. ems e PS 2 style keyboard and mouse ports e Intelligent power management including a programmable wake up event interface e Conventional PCI bus power management support The BIOS Setup program provides configuration options for the Legacy I O controller For information about Refer to The location of the headers Figure 11 page 43 The serial port headers signal mapping Table 12 on page 45 23 Intel Desktop Board D2550MUD2 Technical Product Specification 1 8 LAN Subsystem The LAN subsystem consists of the following e Intel NM10 Express Chipset e Intel 82574L Gigabit Ethernet Controller for 10 100 1000 Mb s Ethernet LAN connectivity e RJ 45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include e CSMA CD protocol engine e LAN connect interface that supports the Ethernet controller e Conventional PCI bus power management Supports ACPI technology Supports LAN wake capabilities 1 8 1 LAN Subsystem Drivers LAN drivers are available from Intel s World Wide Web site For information about Refer to Obtaining LAN drivers Section 1 2 page 16 24 Product Description 1 8 2 RJ 45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ 45 LAN connector shown in Figure 4 A B OM23177 Figure 4 LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the Ethernet LAN subsystem is operat
43. equirements International 83 Intel Desktop Board D2550MUD2 Technical Product Specification 5 1 2 European Union Declaration of Conformity 84 Statement We Intel Corporation declare under our sole responsibility that the product Intel Desktop Board D2550MUD2 is in conformity with all applicable essential requirements necessary for CE marking following the provisions of the European Council Directive 2004 108 EC EMC Directive 2006 95 EC Low Voltage Directive and 2002 95 EC ROHS Directive The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions L This product follows the provisions of the European Directives 2004 108 EC 2006 95 EC and 2002 95 EC e tina Tento v robek odpov d po adavk m evropsk ch sm rnic 2004 108 EC 2006 95 EC a 2002 95 EC Dansk Dette produkt er i overensstemmelse med det europ iske direktiv 2004 108 EC 2006 95 EC amp 2002 95 EC Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004 108 EC 2006 95 EC amp 2002 95 EC Eesti Antud toode vastab Euroopa direktiivides 2004 108 EC ja 2006 95 EC ja 2002 95 EC kehtestatud n uetele Suomi T m tuote noudattaa EU direktiivin 2004 108 EC 2006 95 EC amp 2002 95 EC maarayksia Francais Ce produit est conforme aux exigences de la Directive Europ enne 2004 108 EC 2006 95 EC amp 2002 95 EC Deutsch Dieses Produkt ent
44. er Line Out gt L Mic In lt lLine In S PDIF Header OM23176 15 Intel Desktop Board D2550MUD2 Technical Product Specification 1 2 Online Support 1 3 A To find information about Visit this World Wide Web site Intel Desktop Board D2550MUD2 http www intel com products motherboard index htm Desktop Board Support http www intel com p en US support iid hdr support Available configurations for the Intel http ark intel com Desktop Board D2550MUD2 Supported processors http processormatch intel com Chipset information http www intel com products desktop chipsets index htm BIOS and driver updates http downloadcenter intel com Tested memory http www intel com support motherboards desktop sb CS 025414 htm Integration information http www intel com support go buildit Processor The board has a passively cooled soldered down Dual Core Intel Atom processor with integrated graphics and integrated memory controller 7 NOTE 16 The board is designed to be passively cooled in a properly ventilated chassis Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness For information about Refer to Power supply connectors Section 2 2 2 3 page 51 Product Description 1 3 1 Intel D2550 Graphics Subsystem 1 3 1 1 Intel Graphics Media Accelerator 3650 Graphics Controller In
45. erence Causing Equipment Standard Digital Apparatus Canada EN55022 Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment European Union EN55024 Information Technology Equipment Immunity Characteristics Limits and methods of measurement European Union EN55022 Australian Communications Authority Standard for Electromagnetic Compatibility Australia and New Zealand CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment International CISPR 24 Information Technology Equipment Immunity Characteristics Limits and Methods of Measurement International VCCI V 3 V 4 Voluntary Control for Interference by Information Technology Equipment Japan KN 22 KN 24 Korean Communications Commission Framework Act on Telecommunications and Radio Waves Act South Korea CNS 13438 Bureau of Standards Metrology and Inspection Taiwan 87 Intel Desktop Board D2550MUD2 Technical Product Specification 88 FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules Operation is subject to the following two conditions 1 this device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation For questions related to the EMC performance of this product contact Intel Corporation 5200 N E Elam Young
46. evision Notes G73892 600 MUCDT10N 86A 0069 1 2 Notes 1 The AA number is found on a small label on the component side of the board 2 The Intel NM10 Express Chipset and D2550 processor used on this AA revision consists of the following component Device Stepping S Spec Numbers Errata Current characterized errata if any are documented in a separate Specification Update See http developer intel com products desktop motherboard index htm for the latest documentation Intel Desktop Board D2550MUD2 Technical Product Specification Preface This Technical Product Specification TPS specifies the board layout components connectors power and environmental requirements and the BIOS for the Intel Desktop Board D2550MUD2 It describes the standard product and available manufacturing options Intended Audience The TPS is intended to provide detailed technical information about the Intel Desktop Board D2550MUD2 and its components to the vendors system integrators and other engineers and technicians who need this level of information Itis specifically not intended for general audiences What This Document Contains Chapter Description 1 A description of the hardware used on the board A map of the resources of the board The features supported by the BIOS Setup program A description of the BIOS error messages beep codes and POST codes Regulatory compliance and battery disposal information U RUN Typograp
47. hical Conventions This section contains information about the conventions used in this specification Not all of these symbols and abbreviations appear in all specifications of this type Notes Cautions and Warnings A Sal 2 NOTE Notes call attention to important information E CAUTION Cautions are included to help you avoid damaging hardware or losing data Intel Desktop Board D2550MUD2 Technical Product Specification Other Common Notation vi GB GB s Gb s KB Kb kb s MB MB s Mb Mb s TDP xxh x x M Used after a signal name to identify an active low signal such as USBPO Gigabyte 1 073 741 824 bytes Gigabytes per second Gigabits per second Kilobyte 1024 bytes Kilobit 1024 bits 1000 bits per second Megabyte 1 048 576 bytes Megabytes per second Megabit 1 048 576 bits Megabits per second Thermal Design Power An address or data value ending with a lowercase h indicates a hexadecimal value Volts Voltages are DC unless otherwise specified This symbol is used to indicate third party brands and names that are the property of their respective owners Contents 1 Product Description EL OVerVIeW en II DAN erg 11 LEA Feature SUMMA NE 11 11 2 ee EE e TEE 13 1 1 3 Block Diagram vedr SNE 15 1 2 Online Support nee ee 16 ES Processor do a 16 1 3 1 Intel D2550GraphicsSubsystem 17 1 4 System Memory series 18 1 5 Intel NMIO Express ChipSet n
48. ie besteht Explosionsgefahr Die Batterie darf nur durch denselben oder einen entsprechenden vom Hersteller empfohlenen Batterietyp ersetzt werden Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore Per disfarsi delle pile usate seguire le istruzioni del produttore Regulatory Compliance and Battery Disposal I nformation AN PRECAUCI N Existe peligro de explosi n si la pila no se cambia de forma adecuada Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo Para deshacerse de las pilas usadas siga igualmente las instrucciones del fabricante A WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij Batterijen moeten zoveel mogelijk worden gerecycled Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving A ATENC O Haver risco de explos o se a bateria for substitu da por um tipo de bateria incorreto As baterias devem ser recicladas nos locais apropriados A eliminac o de baterias usadas deve ser feita de acordo com as regulamentac es ambientais da regi o A ASCIAROZZNASC IcHye pbi3bika Bbl6yxy Kani 3aMeHeHbl aKyMylaTap HerIpaBi bHara TbIny AkymynaTapb rlaBiHHbI Ma MarubiMacui nepe
49. ient temperature should be measured just upstream of the chassis inlet vent 60 Technical Reference 2 6 1 2 Thermal Specifications Guideline Terms Requirements Ta lt 50 C T lt 100 C Ya lt 3 85 C W TIM Honeywell PCM45F TDP 10 W Ta external lt 35 C 2 6 1 3 Heatsink Design Guideline Maximum heatsink size Note 87 x 52 x 29 mm Heatsink mass lt 63 6 grams Retention type Spring loaded fasteners 13 2 Ib Note Refers to the heatsink installed on the board Heatsink preload 2 6 1 4 Chassis Design Guideline The pin fin heatsink design used on this board will be able to dissipate up to 10 W of processor power in most of the passively enabled system chassis This board is targeted for 3 7 liters volumetric or larger desktop tower orientation mini ITX and microATX chassis with a system fan The recommended fan type is an exhaust fan For best thermal performance it is recommended that the system fan provide reasonable airflow directly over all the major components on the board The pin fin heatsink is designed to have the best thermal performance when airflow direction is parallel to the heatsink fins The processor on the board will generate the highest amount of heat leading to high ambient temperature within the chassis The system fan should be located near the board region in order to effectively regulate airflow see Figure 18 A system fan located further away from the board region i e at the
50. iert das Einzelhandelskunden von Intel Markenprodukten erm glicht gebrauchte Produkte an ausgew hlte Standorte f r ordnungsgem es Recycling zur ckzugeben Details zu diesem Programm einschlie lich der darin eingeschlossenen Produkte verf gbaren Standorte Versandanweisungen Bedingungen usw finden Sie auf der http www intel com intel other ehs product ecology 85 Intel Desktop Board D2550MUD2 Technical Product Specification 86 Espanol Como parte de su compromiso de responsabilidad medioambiental Intel ha implantado el programa de reciclaje de productos Intel que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado Consulte la http www intel com intel other ehs product_ecology para ver los detalles del programa que incluye los productos que abarca los lugares disponibles instrucciones de envio t rminos y condiciones etc Francais Dans le cadre de son engagement pour la protection de l environnement Intel a mis en uvre le programme Intel Product Recycling Program Programme de recyclage des produits Intel pour permettre aux consommateurs de produits Intel de recycler les produits us s en les retournant des adresses sp cifi es Visitez la page Web http www intel com intel other eh
51. igurations Table 46 ENERGY STAR Requirements ENERGY STAR Specification v4 0 v4 0 v5 0 v5 0 v5 0 Computer Type Desktop Computer Integrated Computer Desktop Computer Integrated Desktop Computer Thin Client Required States Idle State Cat A Sleep Mode Standby Level Off Mode Sleep Mode Idle State Active State Off Mode Sleep Mode Idle State Cat B ENERGY STAR 5 0 e Standby and ErP Capability Adjustments With and without Wake On LAN Sleep Standby With and without additional internal storage With and without Wake On LAN Sleep Standby Typical Electricity Consumption TEC Criteria N A Cat A under desktop conventional and desktop proxying operational mode weightings N A The Desktop Boards also meet the following international requirements e Republic of Korea e Standby program e European Union Energy related Products ErP directive For information about ENERGY STAR requirements and recommended configurations Electronic Product Environmental Assessment Tool EPEAT Korea e Standby Program European Union Energy related Products Directive 2009 ErP Refer to http www intel com go energystar http www epeat net http www kemco or kr new_eng pg02 pg02100300 asp http ec europa eu enterprise policies s ustainable business sustainable product policy ecodesign index en htm Regulat
52. ii 2 7 Power Consumption sascha 2 7 1 Minimum Load Configuration ars 2 7 2 Maximum Load Conftouration rennen nennen een ern eas Pa Milla EE 2 9 Environmental are a ceo eit ed ss et Nena Overview of BI OS Features 3 14 INEFOQUERION ee a esse este 3 2 BIOS Flash Memory Organization uu a ik 3 3 Resource Configufatiansan ass dol PEI Autoconfiguration ee 3 4 System Management BIOS SMBI0S 3 50 Legacy USB SUPPE ro 4 5 BIOS Updates uran gt 61 BIOS Recovery aussagen Ae 3 6 2 Custom Splash Screen a ee 37 BOO OPHONS are AE JAL Optical Drive e 3 9 2 INGIWORK EE 3 7 3 BootingWithoutAttachedDevices 3 7 4 Changing the Default Boot Device During POST 3 8 Adjusting Boot Speed narre 3 8 1 PeripheralSelectonandConfiguration 3 8 2 BIOS Boot Optimizations essit eH een 3 9 BIOS Security Features ns seele sep Board Status and Error Messages Axl BIOS Beeb Codes Lue AS ne el yale dedi 4 2 Front panel Power LED Blink Codes Ran nennen me 4 3 Bl OS Error Messages ara SE 4 4 Port 80h POST Codes u en ee eoe Hk E E Re aa det Regulatory Compliance and Battery Disposal Information 5 1 Regulatory Compll nce sva etes Seege geg en E a A y et aN a r ca lk lm ga giye 5 1 2 European Union Declaration of Conformity Statement 5 1 3 Product Ecology Statements AAA SLA EMC Reguld
53. ing Table 4 LAN Connector LED States LED LED Color LED State Condition LAN link is not established Link Activity A Green LAN link is established Blinking LAN activity is occurring Off 10 Mb s data rate is selected or negotiated Link Speed B Green Yellow 100 Mb s data rate is selected or negotiated Yellow 1000 Mb s data rate is selected or negotiated 25 Intel Desktop Board D2550MUD2 Technical Product Specification 1 9 26 Audio Subsystem The board supports the Intel High Definition Audio Intel HD Audio subsystem The audio subsystem consists of the following Intel NM10 Express Chipset Realtek ALC662 audio codec The audio subsystem has the following features Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port The back panel audio jacks are capable of retasking according to the user s definition or can be automatically switched depending on the recognized device type Front panel Intel HD Audio and AC 97 audio support 3 port analog audio out stack Windows Vista Basic certification A signal to noise S N ratio of 95 dB Table 5 lists the supported functions of the front panel and back panel audio jacks Table 5 Audio Jack Support mens Las rm Spk te Audio Jack phone Headphones Front Spks Stereo 2 Mic In Back panel Green u ctrl panel Defaut Product Description
54. ire an ACPI aware driver video displays and hard disk drives e Methods for achieving less than 15 watt system operation in the power on standby sleeping state e A Soft off feature that enables the operating system to power off the computer e Support for multiple wake up events see Table 8 on page 32 e Support for a front panel power and sleep mode switch Table 6 lists the system states based on how long the power switch is pressed depending on how ACPI is configured with an ACPI aware operating system Table 6 Effects of Pressing the Power Switch If the system is in this and the power switch state is pressed for the system enters this state Off Less than four seconds Power on ACPI G2 G5 Soft off ACPI GO working state On Less than four seconds Power off ACPI GO working state ACPI G2 G5 Soft off On More than four seconds Fail safe power off ACPI GO working state ACPI G2 G5 Soft off Sleep Less than four seconds Wake up ACPI G1 sleeping state ACPI GO working state Sleep More than four seconds Power off ACPI G1 sleeping state ACPI G2 G5 Soft off 1 11 1 1 System States and Power States Product Description Under ACPI the operating system directs all system and device power state transitions The operating system puts devices in and out of low power states based on user preferences and knowledge of how devices are being used by applications Devices that are not being used c
55. itten to a hard drive 2 2 2 4 2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole single throw SPST type switch that is normally open When the switch is closed the board resets and runs the POST 2 2 2 4 3 Power Sleep LED Header Pins 2 and 4 can be connected to a single or dual color LED Table 26 shows the default states for a single color LED Table 26 States for a One Color Power LED LED State Description Off Power off hibernate S5 S4 Blinking Sleeping S3 Steady Green Running Away SO NOTE The LED states listed in Table 26 are default settings that can be modified through BIOS setup Systems built with a dual color front panel power LED can also use alternate color state options 2 2 2 4 4 Power Switch Header Pins 6 and 8 can be connected to a front panel momentary contact power switch The switch must pull the SW ON pin to ground for at least 50 ms to signal the power supply circuitry to switch on or off The time requirement is due to internal debounce circuitry on the board At least two seconds must pass before the power supply circuitry will recognize another on off signal 53 Intel Desktop Board D2550MUD2 Technical Product Specification 2 2 2 5 Front Panel USB Headers Figure 13 and Figure 14 are connection diagrams for the front panel USB headers p NOTE e The 5 VDC power on the USB headers is fused e Use only a front panel USB connector that conforms to
56. l waveform Velocity change of 170 inches second Packaged Half sine 2 millisecond Free fall inches Velocity change inches s 167 30 152 24 136 81 100 118 Vibration Unpackaged 5 Hz to 20 Hz 0 01 g Hz sloping up to 0 02 g Hz 20 Hz to 500 Hz 0 02 g Hz flat Packaged 10 Hz to 40 Hz 0 015 g Hz flat 40 Hz to 500 Hz 0 015 g Hz sloping down to 0 00015 g Hz 64 3 Overview of BIOS Features 3 1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory SPI Flash and can be updated using a disk based program The SPI Flash contains the BIOS Setup program POST the PCI auto configuration utility LAN EEPROM information and Plug and Play support The BIOS displays a message during POST identifying the type of BIOS and a revision code The initial production BIOSs are identified as MUCDT10N 86A The BIOS Setup program can be used to view and change the BIOS settings for the computer The BIOS Setup program is accessed by pressing the lt F2 gt key after the Power On Self Test POST memory test begins and before the operating system boot begins The menu bar is shown below Maintenance Main Advanced Security Power Boot Exit ir NOTE The maintenance menu is displayed only when the board is in configure mode Section 2 3 on page 55 shows how to put the board in configure mode 65 Intel Desktop Board D2550MUD2 Technical Product Specification Table 33 lists the B
57. li Ir rimi ta batteriji u ati g andu jsir skond ir regolamenti ambjentali lokali OSTRZE ENIE Ryzyko wybuchu w przypadku wymiany na baterie niew a ciwego typu W miar mo liwo ci baterie nale y podda recyklingowi Zu ytych baterii nale y pozbywa si zgodnie z lokalnie obowi zuj cymi przepisami w zakresie ochrony rodowiska 95 Intel Desktop Board D2550MUD2 Technical Product Specification 96
58. ling only one SO DIMM it must be installed in the bottom socket SO DIMM 1 To be fully compliant with all applicable DDR3 SDRAM memory specifications the board should be populated with SO DI MMs that support the Serial Presence Detect SPD data structure This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance If non SPD memory is installed performance and reliability may be impacted or the SO DIMMs may not function under the determined frequency Table 3 lists the supported SO DIMM configurations Table 3 Supported Memory Configurations Raw Card SO DI MM DRAM Device DRAM of DRAM Version Capacity Technology Organization Devices 1 GB 1Gb 128Mx8 8 A 2 GB 2Gb 256Mx8 8 2 GB 1 Gb 128Mx8 16 j 4 GB 2 Gb 256Mx 8 16 Notes 1 System memory configurations are based on availability and are subject to change 2 Support for one 4 GB SO DIMM installed in slot 1 Slot O must be left empty Product Description Figure 3 illustrates the memory channel and SO DIMM configuration SO DIMM O SO DIMM 1 OM23186 Figure 3 Memory Channel and SO DI MM Configuration 19 Intel Desktop Board D2550MUD2 Technical Product Specification 1 5 ex j lt Intel NM10 Express Chipset The Intel NM10 Express Chipset provides interfaces to the processor and the USB SATA LPC LAN PCI and PCI Express interfaces The Intel NM10 Express
59. mber of options Note If no password is set any user can change all Setup options 73 Intel Desktop Board D2550MUD2 Technical Product Specification 74 d Board Status and Error Messages 4 1 BIOS Beep Codes The BIOS uses audible beep codes to signal status messages and error messages indicating recoverable errors that occur during the POST The beep codes are listed in Table 38 These beep codes can be heard through a speaker attached to the board s line out audio jack see Figure 5 B on page 27 Table 38 BIOS Beep Codes Type BIOS update in progress Video error Note Memory error Thermal trip warning None On off 1 0 second each two times then 2 5 second pause off entire pattern repeats beeps and pause once and the BIOS will continue to boot On off 1 0 second each three times then 2 5 second pause off entire pattern repeats beeps and pause until the system is powered off Alternate high and low beeps 1 0 second each for eight beeps followed by system shut down Note Disabled per default BIOS setup option Frequency 932 Hz When no VGA option ROM is found 932 Hz High beep 2000 Hz Low beep 1500 Hz 75 Intel Desktop Board D2550MUD2 Technical Product Specification 4 2 Front panel Power LED Blink Codes Whenever a recoverable error occurs during POST the BIOS causes the board s front panel power LED to blink an error message describing the problem see Table 3
60. npayoyBauyuya Maz6aynayya ag crapbix akymynsaTapay narp36Ha 3rogHa 3 MACLIOBbIM 3akaHagaycTBaM na 3Kanorii A UPOZORNINI V pripad vym ny baterie za nespr vny druh m ze doj t k vybuchu Je li to mozn baterie by m ly byt recyklov ny Baterie je treba zlikvidovat v souladu s m stn mi p edpisy o ivotn m prost ed A Mpoooyr Yr apxe kiv uvoc yia Expn n GE NEPINTWON nou n unarap a avrikaraora si ano pia Aav aopevou TUNoU Ol unatapiec 6a MpENEI va avaKUK WVOVTAI TAV KATI TETOIO Elva OuvaTo H an ppiyn rov xproiponoinuevov unarapiov NP NEI VA ylverai OUUPWVA HE TOUG KaTd TONO NEPIBA OVTIKOUG KAVOVIOLIOUG A VIGYAZAT Ha a telepet nem a megfelel tipusu telepre cser li az felrobbanhat A telepeket lehet s g szerint jra kell hasznositani A haszn lt telepeket a helyi k rnyezetv delmi el irasoknak megfelel en kell kiselejtezni Ax AK S Won ADE Bieta G rd H Maki ii MAE GY GJUL U ES ERBE BEES ARI Cit muneri RETE C CIEL 93 Intel Desktop Board D2550MUD2 Technical Product Specification A A A AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul Bateri sepatutnya dikitar semula jika boleh Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan OSTRZEZENIE Istnieje niebezpieczeristwo wybuchu w przypadku zastosowania niew a ciwego typu baterii Zu yte baterie nale y w miar mo liwo ci utylizowa zgodnie z odpowiednimi przepisami o
61. nstructions Overview of BIOS Features 3 6 BIOS Updates The BIOS can be updated using either of the following utilities which are available on the Intel World Wide Web site e Intel Express BIOS Update utility which enables automated updating while in the Windows environment Using this utility the BIOS can be updated from a file on a hard disk a USB drive a flash drive or a USB drive or an optical drive e Intel Flash Memory Update Utility which requires booting from DOS Using this utility the BIOS can be updated from a file on a hard disk a USB drive a flash drive or a USB drive or an optical drive e Intel F7 switch allows a user to select where the BIOS bio file is located and perform the update from that location device Similar to performing a BIOS Recovery without removing the BIOS configuration jumper Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS ell NOTE Review the instructions distributed with the upgrade utility before attempting a BIOS update For information about Refer to BIOS update utilities http downloadcenter intel com 3 6 1 BIOS Recovery It is unlikely that anything will interrupt a BIOS update however if an interruption occurs the BIOS could be damaged Table 35 lists the drives and media types that can and cannot be used for BIOS recovery The BIOS recovery media does not need to be made bootable
62. o boot 76 Board Status and Error Messages 4 4 Port 80h POST Codes During the POST the BIOS generates diagnostic progress codes POST codes to I O port 80h If the POST fails execution stops and the last POST code generated is left at port 80h This code is useful for determining the point where an error occurred Displaying the POST codes requires a PCI bus add in card often called a POST card The POST card can decode the port and display the contents on a medium such as a seven segment display A wn 2 NOTE The POST card must be installed in the PCI bus connector The following tables provide information about the POST codes generated by the BIOS e Table 41 lists the Port 80h POST code ranges e Table 42 lists the Port 80h POST codes themselves e Table 43 lists the Port 80h POST sequence A wi gt NOTE In the tables listed above all POST codes and range values are listed in hexadecimal Table 41 Port 80h POST Code Ranges Range Subsystem 0x00 0x05 Entering SX states SO to S5 0x10 0x20 0x30 Resuming from SX states 0x10 0x20 S2 0x30 S3 etc 0x11 Ox1F PEI phase pre MRC execution 0x21 0x29 MRC memory detection Ox2A Ox2F PEI phase post MRC execution 0x31 0x35 Recovery 0x36 Ox3F Platform DXE driver 0x41 Ox4F CPU Initialization PEI DXE SMM 0x50 Ox5F I O Buses PCI USB ATA etc Ox5F is an unrecoverable error Start with
63. ocessor core power connector 2 x 12 LVDS panel connector Intel Atom processor Trusted Platform Module TPM header SO DIMM channel A socket DIMM 1 SO DIMM channel A socket DIMM 0 Intel NM10 Express Chipset SATA connectors System fan header Front panel header BIOS setup configuration jumper block Battery Front panel USB 2 0 header Front Panel Wireless Activity LED header Piezo monotonic speaker header Conventional PCI bus add in card connector PCI Express Full Half Mini Card slot Serial port header COMM 2 FPD brightness connector LVDS inverter power voltage selection jumper Front panel audio header Front panel USB header that supports an Intel Z U130 USB Solid State Drive or compatible device brown colored Serial port header COMM 1 1 1 3 Block Diagram Figure 2 is a block diagram of the major functional areas hannel A O DIMM O Channel A SO DIMM 1 l un i PCI Express Full Mini Half Mini Card Slot LPC Legacy Bus 1 0 Controller HD Audio Link Figure 2 Block Diagram SPI SPI Device HD Audio Codec Product Description r BackPanel DVI D Connector PE SEE E Single Channel Intel Atom f BakPanel Memory Bus processor VGA Connector EI LVDS Connector DMI SMBus SS PCI Express x1 PEE NE PCI Bus la i Intel NM10 Serial ATA Interface EP DET 4 PCI Express x1 Gigabit Ethernet Controll
64. oise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications Le pr sent appareil numerique n met pas de bruits radio lectriques d passant les limites applicables aux appareils num riques de la classe B prescrites dans le R glement sur le broullage radio lectrique dict par le minist re des Communications du Canada Regulatory Compliance and Battery Disposal I nformation Japan VCCI Statement Japan VCCI Statement translation This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment VCCI If this is used near a radio or television receiver in a domestic environment it may cause radio interference Install and use the equipment according to the instruction manual TORE FRUERES ERE E ER BA VCCI DEE KES lt STFABHRBENRETT CORE RERE OEM E amp BMELTVETDH LDKENFTI AFPTLEISTRERKHELT ASNA E REMERASAECICEPINES BRAGE TEL RMU BO EUC TF uv Korea Class B Statement Korea Class B Statement translation This equipment is for home use and has acquired electromagnetic conformity registration so it can be used not only in residential areas but also other areas 89 Intel Desktop Board D2550MUD2 Technical Product Specification 5 1 5 90 Compliance Intel Desktop Board D2550MUD2 meets the ENERGY STAR requirements listed in Table 46 when used in corresponding system conf
65. optical disk drive or hard disk drive region will be less effective in controlling the local ambient temperature Regardless of where the system fan is located the maximum local ambient temperature as defined by Ta should be capped at 50 C Chassis inlet vents should also provide adequate openings for airflow to pass through The recommended free area ratio of chassis vents should be equal to or greater than 0 53 By using the reference pin fin heatsink most chassis with a system fan enabled should have local ambient temperature safely below the 50 C limit 61 Intel Desktop Board D2550MUD2 Technical Product Specification Recommended Fan and Vent Location Bad Fan Location Acceptable Fan and Vent Location Rear Panel Connectors Chassis ODD and HDD Region Front Panel Acceptable Fan and Vent Locations Recommended Fan and Bad Fan Locations Vent Locations OM23334 Figure 18 Fan Location Guide for Chassis Selection Chassis Orientation is Not Restricted For all chassis configurations the heatsink performance parameter Ya should be less than 3 85 C W The detail thermal measurement metrology is described in the TMSDG For chassis that fail to meet the thermal specifications guideline highlighted above an actively cooled heatsink solution should be used 62 Technical Reference 2 7 Power Consumption Power measurements were performed to determine bare minimum and likely maximum power requirements from the board as
66. ory Compliance and Battery Disposal I nformation 5 1 6 Regulatory Compliance Marks Board Level Intel Desktop Board D2550MUD2 has the regulatory compliance marks shown in Table 47 Table 47 Regulatory Compliance Marks Description Mark UL joint US Canada Recognized Component mark Includes adjacent UL file number for Intel Desktop Boards E210882 CAA US FCC Declaration of Conformity logo mark for Class B equipment FC CE mark Declaring compliance to the European Union EU EMC directive Low Voltage directive and RoHS directive Australian Communications Authority ACA and New Zealand Radio Spectrum Management NZ RSM C tick mark Includes adjacent Intel supplier code number N 232 Japan VCCI Voluntary Control Council for Interference mark Korea Certification mark Includes an adjacent KCC Korean Communications Commission certification number KCC REM CPU D2550MUD2 Taiwan BSMI Bureau of Standards Metrology and Inspections mark Includes adjacent Intel company number D33025 Printed wiring board manufacturer s recognition mark Consists of a unique UL recognized manufacturer s logo along with a flammability rating solder side China RoHS Environmentally Friendly Use Period Logo This is an example of the symbol used on Intel Desktop Boards and associated collateral The color of the mark may vary depending upon the application The Environmental Friendly Usage Period EFUP for Intel Desktop Boa
67. play settings will be preserved across BIOS updates 1 5 2 USB K r V The board provides up to seven USB 2 0 ports supports UHCI and EHCI and uses UHCI and EHCI compatible drivers four ports routed to the back panel and three ports routed to two front panel USB 2 0 headers One of the front panel USB headers brown colored supports an Intel Z U130 USB Solid State Drive or compatible device NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements even if no device is attached to the cable Use shielded cable that meets the requirements for full speed devices For information about Refer to The location of the USB connectors on the back panel Figure 9 page 41 The location of the front panel USB headers Figure 11 page 43 1 5 3 SATA Support 22 The board provides two SATA interface connectors that support one device per connector The board s SATA controller offers independent SATA ports with a theoretical maximum transfer rate of 3 0 Gb s on each port One device can be installed on each port for a maximum of two SATA devices A point to point interface is used for host to device connections unlike PATA which supports a master slave configuration and two devices on each channel For compatibility the underlying SATA functionality is transparent to the operating system The SATA controller supports IDE and AHCI configuration and can operate in both legacy and nati
68. r Current Capability eee t eI rn 58 ThermalConsiderationsforComponenits 60 Minimum Load Configuration Current and Power Results 63 Maximum Load Configuration Current and Power Results 64 Intel Desktop Board D2550MUD2 Environmental Specifications 64 BIOS Setup Program Menu Bars a ee aan 66 BIOS Setup Program Function Keys eee cer e rer ne ee EE 66 AcceptableDrives Media Types for BIOS Recovery nennen 69 Boot Device Menu Options asus ac anna aan 71 SupervisorandU serPasswordrFunctions 73 BIOS Beep Codes e many ee sila ma EE 75 Front panelPowerLEDBlinkCodes 76 BLOS et EE 76 Port 80h POST Code Ranges rr rr 77 Port SUMPOST COS A ES A REN RE e d dedecus 78 Typical Port 80h POST Sequence ier eo e 81 SafeLy Staridabdg sss se uu cerato ne ER EL 83 EMC Regulations lt lt rte re ieu E RE RN RR ed 87 ENERGYSTARReguiremenits nn renrnn 90 Regulatory Compliance Marks AA 91 1 Product Description 1 1 Overview 1 1 1 Feature Summary Table 1 summarizes the major features of Intel Desktop Board D2550MUD2 Table 1 Feature Summary Form Factor Processor Memory Chipset Audio Internal Graphics Legacy I O Control Peripheral Interfaces LAN Support Mini ITX 6 7 inches by
69. rces Any interrupts set to Available in Setup are considered to be available for use by the add in card 66 Overview of BIOS Features 3 4 System Management BIOS SMBI OS SMBIOS is a Desktop Management Interface DMI compliant method for managing computers in a managed network The main component of SMBIOS is the Management Information Format MIF database which contains information about the computing system and its components Using SMBIOS a system administrator can obtain the system types capabilities operational status and installation dates for system components The MIF database defines the data and provides the method for accessing this information The BIOS enables applications such as third party management software to use SMBIOS The BIOS stores and reports the following SMBIOS information e BIOS data such as the BIOS revision level e Fixed system data such as peripherals serial numbers and asset tags e Resource data such as memory size cache size and processor speed e Dynamic data such as event detection and error logging Non Plug and Play operating systems require an additional interface for obtaining the SMBIOS information The BIOS supports an SMBIOS table interface for such operating systems Using this support an SMBIOS service level application running on a non Plug and Play operating system can obtain the SMBIOS information Additional board information can be found in the BIOS under the Additional Info
70. rds has been determined to be 10 years K Gy 91 Intel Desktop Board D2550MUD2 Technical Product Specification 5 2 A A 92 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type Batteries should be recycled where possible Disposal of used batteries must be in accordance with local environmental regulations PRECAUTION Risque d explosion si la pile usag e est remplac e par une pile de type incorrect Les piles usag es doivent tre recycl es dans la mesure du possible La mise au rebut des piles usag es doit respecter les r glementations locales en vigueur en mati re de protection de l environnement FORHOLDSREGEL Eksplosionsfare hvis batteriet erstattes med et batteri af en forkert type Batterier b r om muligt genbruges Bortskaffelse af brugte batterier b r foreg i overensstemmelse med g ldende milj lovgivning OBS Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type Brukte batterier b r kastes i henhold til gjeldende milj lovgivning VIKTIGT Risk f r explosion om batteriet ers tts med felaktig batterityp Batterier ska kasseras enligt de lokala milj v rdsbest mmelserna VARO R j hdysvaara jos pariston tyyppi on v r Paristot on kierr tett v jos se on maghdollista K ytetyt paristot on h vitett v paikallisten ymp rist m r ysten mukaisesti VORSI CHT Bei falschem Einsetzen einer neuen Batter
71. rmation header under the Main BIOS page 67 Intel Desktop Board D2550MUD2 Technical Product Specification 3 5 68 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system s USB drivers are not yet available Legacy USB support is used to access the BIOS Setup program and to install an operating system that supports USB By default Legacy USB support is set to Enabled Legacy USB support operates as follows 1 2 3 When you apply power to the computer legacy support is disabled POST begins Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu POST completes The operating system loads While the operating system is loading USB keyboards and mice are recognized and may be used to configure the operating system Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program After the operating system loads the USB drivers all legacy and non legacy USB devices are recognized by the operating system and Legacy USB support from the BIOS is no longer used Additional USB legacy feature options can be accessed by using Intel Integrator Toolkit To install an operating system that supports USB verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system s installation i
72. s a requirement Whenever possible use of a processor heat sink that provides omni directional airflow to maintain required airflow across the processor voltage regulator area is recommended CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and or voltage regulator or in some instances damage to the board Fora list of chassis that have been tested with Intel Desktop Boards please refer to the following website http www3 intel com cd channel reseller asmo na eng tech reference 53211 htm All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance CAUTION Ensure that the ambient temperature does not exceed the board s maximum operating temperature Failure to do so could cause components to exceed their maximum case temperature and malfunction For information about the maximum operating temperature see the environmental specifications in Section 2 9 58 Technical Reference CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit Failure to do so may result in damage to the voltage regulator circuit The processor voltage regulator area shown in Figure 17 can reach a temperature of up to 85 C in
73. s product_ecology pour en savoir plus sur ce programme savoir les produits concern s les adresses disponibles les instructions d exp dition les conditions g n rales etc AAA AYTIVCIS MERO BELT ELVER UTIL 227 Fl a eH Oh RL C UE U YADNWEEIATASEI AV TVER ITAD ZH72 LER e GE UTC WRB in EA GBA GE CARNE TODI LORRA RIA http www intel com intel other ehs product ecology 3555 FTSE Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi lokasi terpilih untuk dikitarkan semula dengan betul Sila rujuk http www intel com intel other ehs product_ecology untuk mendapatkan butir butir program ini termasuklah skop produk yang dirangkumi lokasi lokasi tersedia arahan penghantaran terma amp syarat dsb Portuguese Como parte deste compromisso com o respeito ao ambiente a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados onde esses produtos s o reciclados de maneira adequada Consulte o site http www intel com intel other ehs product ecology em Ingl s para obter os detalhes sobre este programa inclusive o escopo dos produtos cobertos os locais dispon veis as instru es de envio os termos e condi es etc Regulatory
74. sourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input Ready to boot Legacy USB driver disconnect Board Status and Error Messages 81 Intel Desktop Board D2550MUD2 Technical Product Specification 82 5 Regulatory Compliance and Battery Disposal Information 5 1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board D2550MUD2 e Safety standards e European Union Declaration of Conformity statement e Product Ecology statements e Electromagnetic Compatibility EMC standards e Product certification markings 5 1 1 Safety Standards Intel Desktop Board D2550MUD2 complies with the safety standards stated in Table 44 when correctly installed in a compatible host system Table 44 Safety Standards Standard Title CSA UL 60950 1 Information Technology Equipment Safety Part 1 General Requirements USA and Canada EN 60950 1 Information Technology Equipment Safety Part 1 General Requirements European Union IEC 60950 1 Information Technology Equipment Safety Part 1 General R
75. spricht den Bestimmungen der Europ ischen Richtlinie 2004 108 EC 2006 95 EC amp 2002 95 EC EAAnvik To napov npoi v akoAoudel TIC Orar amp eic Tov Euponaikov O ny wv 2004 108 EC 2006 95 EC kal 2002 95 EC Magyar E term k megfelel a 2004 108 EC 2006 95 EC s 2002 95 EC Eur pai Ir nyelv el r sainak Icelandic bessi vara stenst regluger Evr pska Efnahags Bandalagsins n mer 2004 108 EC 2006 95 EC amp 2002 95 EC Italiano Questo prodotto conforme alla Direttiva Europea 2004 108 EC 2006 95 EC amp 2002 95 EC Latvie u Sis produkts atbilst Eiropas Direktivu 2004 108 EC 2006 95 EC un 2002 95 EC noteikumiem Lietuviy Sis produktas atitinka Europos direktyvu 2004 108 EC 2006 95 EC ir 2002 95 EC nuostatas Malti Dan il prodott hu konformi mal provvedimenti tad Direttivi Ewropej 2004 108 EC 2006 95 EC u 2002 95 EC Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004 108 EC 2006 95 EC amp 2002 95 EC Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004 108 EC 206 95 EC i 2002 95 EC Regulatory Compliance and Battery Disposal I nformation Portuguese Este produto cumpre com as normas da Diretiva Europ ia 2004 108 EC 2006 95 EC 2002 95 EC Espafiol Este producto cumple con las normas del Directivo Europeo 2004 108 EC 2006 95 EC amp 2002 95 EC Slovensky Tento produkt je v s lade s ustanoveniami eur pskych direktiv 2004 108 EC 20
76. ted access to Setup If both the supervisor and user passwords are set users can enter either the supervisor password or the user password to access Setup Users have access to Setup respective to which password is entered Setting the user password restricts who can boot the computer The password prompt will be displayed before the computer is booted If only the supervisor password is set the computer boots without asking for a password If both passwords are set the user can enter either password to boot the computer For enhanced security use different passwords for the supervisor and user passwords Valid password characters are A Z a z and 0 9 Passwords may be up to 16 characters in length Table 37 shows the effects of setting the supervisor password and user password This table is for reference only and is not displayed on the screen Table 37 Supervisor and User Password Functions Password Password Password Supervisor to Enter During Set Mode User Mode Setup Options Setup Boot Neither Can change all Can change all None None None options Note options Note Supervisor Can change all Can change a Supervisor Password Supervisor None only options limited number of options User only N A Can change all Enter Password User User options Clear User Password Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or and user set options limited Enter Password user user nu
77. tel GMA The Intel GMA 3650 graphics controller features the following e 640 MHz core frequency e High quality texture engine DX9 3 and OpenGL 3 0 compliant Hardware Pixel Shader 4 1 Vertex Shader Model 4 1 e Video Blu ray 2 0 H 264 amp VC1 hardware decoder PAVP 1 1c HDCP1 3 e Display Supports VGA and DVI displays up to 1920 x 1200 at 60 Hz refresh WUXGA Supports LVDS displays up to 1440 x 900 single channel 24 bpp Dual independent display support For information about Refer to Obtaining graphics software and utilities Section 1 2 page 16 17 Intel Desktop Board D2550MUD2 Technical Product Specification 1 4 The board has two 204 pin DDR3 SO DIMM sockets and supports the following memory features K r System Memory DDR3 SDRAM SO DIMMs with gold plated contacts Unbuffered single sided or double sided DIMMs 4 GB maximum total system memory Minimum total system memory 256 MB Non ECC DIMMs Serial Presence Detect DDR3 1066 MHz DDR3 1333 MHz DDR3 1600 MHz SO DIMMs DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz NOTES Due to passively cooled thermal constraints system memory must have an operating temperature rating of 85 C The board is designed to be passively cooled in a properly ventilated chassis Chassis venting locations are recommended above the system memory area for maximum heat dissipation effectiveness If you are instal
78. ter from an ACPI S3 state 34 Product Description 1 11 2 9 5 V Standby Power Indicator LED The 5 V standby power indicator LED shows that power is still present even when the computer appears to be off Figure 7 shows the location of the standby power indicator LED CAUTION If AC power has been switched off and the standby power indicator is still lit disconnect the power cord before installing or removing any devices connected to the board Failure to do so could damage the board and any attached devices OM23181 Figure 7 Location of the Standby Power Indicator LED 35 Intel Desktop Board D2550MUD2 Technical Product Specification 36 2 Technical Reference 2 1 Memory Map 2 1 1 Addressable Memory The board utilizes 4 GB of addressable system memory Typically the address space that is allocated for Conventional PCI bus add in cards PCI Express configuration space BIOS SPI Flash and chipset overhead resides above the top of DRAM total system memory On a system that has 4 GB of system memory installed it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions These functions include the following BIOS SPI Flash 2 MB Local APIC 19 MB Direct Media Interface 40 MB Internal graphics address registers Memory mapped I O that is dynamically allocated for Conventional PCI add in cards 37 Intel Desktop Board D255
79. the USB 2 0 specification for high speed USB devices Power 5 V Power 5 V One D D One USB USB Port D D Port Ground Ground Key no pin No Connection OM20141 Figure 13 Connection Diagram for Front Panel USB Header Power 5 V No Connection One D No Connection USB Port D No Connection Ground No Connection Key no pin LEDH OM21794 Figure 14 Connection Diagram for Front Panel USB Header with Intel Z USB Solid State Drive or Compatible Device Support 54 Technical Reference 2 3 BIOS Configuration Jumper Block CAUTION Do not move the jumper with the power on Always turn off the power and unplug the power cord from the computer before changing a jumper setting Otherwise the board could be damaged Figure 15 shows the location of the jumper block The jumper determines the BIOS Setup program s mode Table 27 lists the jumper settings for the three modes normal configure and recovery BRAABRARABA RRRRRRRHRRHARRRRRARRRRARRRRRRRRRRRRARRRRARRRRRRRR O men ENEE EET r OM23182 Figure 15 Location of the BIOS Configuration Jumper Block 55 Intel Desktop Board D2550MUD2 Technical Product Specification 56 Table 27 BIOS Configuration Jumper Settings Jumper Function Mode Setting Configuration Normal 1 2 The BIOS uses current configuration information and passwords for booting Configure 2 3 After the POST runs Setup runs automatically
80. tor to configure the brightness steps for the operating system s screen brightness control such as the Screen brightness adjustment slider under the Windows 7 Power Options control panel Flat Panel Configuration Changes Lock allows the system integrator to lock critical settings of the LVDS configuration to avoid end users potentially rendering the display unusable Color Depth allows the system integrator to select whether the panel is 24 bpp or 18 bpp Inverter Frequency and Polarity allows the system integrator to set the operating frequency and polarity of the panel inverter board Maximum and Minimum Inverter Current Limit allows the system integrator to set maximum PWM as appropriate according to the power requirements of the internal flat panel display and the selected inverter board Panel Power Sequencing allows the system integrator to adjust panel sequencing parameters if necessary 21 Intel Desktop Board D2550MUD2 Technical Product Specification a weg I NOTE Support for flat panel display configuration complies with the following 1 Internal flat panel display connectivity is disabled and all parameters hidden by default 2 Internal flat panel display settings are not exposed through Intel Integrator Toolkit or Intel Integrator Assistant GUIs 3 Internal flat panel display settings will not be overwritten by loading BIOS setup defaults 4 Internal flat panel dis
81. uide TMDG published for the Intel Atom processor D2000 series The TMDG contains detailed package information and thermal mechanical specifications for the processors The TMDG also contains information on how to enable a completely fanless design provided the right usage scenario and boundary conditions are observed for optimal thermal design While the TMSDG has a section on thermal design for passive system environments page 32 the information in this section can also be used to complement the TMDG 2 6 1 1 Definition of Terms Term Description TA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink Tj Processor junction temperature Wa Junction to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as Tj TA TDP Note Heat source must be specified for Y measurements TIM Thermal Interface Material the thermally conductive compound between the heatsink and the processor die surface This material fills the air gaps and voids and enhances the transfer of the heat from the processor die surface to the heatsink TDP Thermal Design Power a power dissipation target based on worst case applications Thermal solutions should be designed to dissipate the thermal design power Ta external The measured external ambient temperature surrounding the chassis The external amb
82. ve modes In legacy mode standard ATA I O and IRQ resources are assigned IRQ 14 and 15 In native mode standard Conventional PCI bus resource steering is used Native mode is the preferred mode for configurations using the Windows Vista operating system Product Description For information about Refer to Obtaining AHCI driver Section 1 2 page 16 The location of the SATA connectors Figure 11 page 43 1 6 Real Time Clock Subsystem Em t A coin cell battery CR2032 powers the real time clock and CMOS memory When the computer is not plugged into a wall socket the battery has an estimated life of three years When the computer is plugged in the standby current from the power supply extends the life of the battery The clock is accurate to 13 minutes year at 25 C with 3 3 VSB applied NOTE If the battery and AC power fail custom defaults if previously saved will be loaded into CMOS RAM at power on When the voltage drops below a certain level the BIOS Setup program settings stored in CMOS RAM for example the date and time might not be accurate Replace the battery with an equivalent one Figure 1 on page 13 shows the location of the battery 1 7 Legacy l O Controller The Legacy I O Controller provides the following features e Two serial port headers e One parallel port connector with Enhanced Parallel Port EPP support e Serial IRQ interface compatible with serialized IRQ support for Conventional PCI bus syst
83. y 2 Dependent on the standby power consumption of wake up devices used in the system 31 Intel Desktop Board D2550MUD2 Technical Product Specification 1 11 1 2 Wake up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific tir 32 states Table 8 Wake up Devices and Events Devices events that wake up the system Power switch RTC alarm LAN USB WAKE PME signal Serial port PS 2 devices from this sleep state 53 sa ss S3 S4 S5 S3 S4 S5 53 Note 2 S3 S4 S5 S3 S4 S5 S3 S3 S4 S5 Note 1 Note 1 Note 1 Note Notes 1 and Notes 1 S4 implies operating system support only 2 USB ports must be turned off during S4 S5 states 3 PS 2 wake from S5 should have a selection in the BIOS to enable wake from a combination key Alt Print Screen or the keyboard power button NOTE The use of these wake up events from an ACPI state requires an operating system that provides full ACPI support In addition software drivers and peripherals must fully support ACPI wake events Product Description 1 11 2 Hardware Support K r The board provides several power management hardware features including e Power connector e Fan header e LAN wake capabilities e Instantly Available PC technology e Wake from USB e Wake from PS 2 devices e Power Management Event signal PME wake up support e WAKE

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