Dataram GRSX6275-10/8GB memory module
Contents
1. a 7 Ep in millimeters inches i oO CELIAC NNN E EE EEE Oy t t minie z a aim N aT oo l owe jo ae m fey mes E zr l 004 Back view Side view nl i Mihia Po Tr ee EFF f ial Hl El HEH H f CHEE cour f 1 puia l 4 CTE Loe _t Aveta of GRSX6275 10 10 Sep 09 Copyright 2009 Dataram Corporation U S A Headquarters 1 609 799 0071 Offices in Europe and Asia www dataram com The information contained in this document has been carefully checked and is believed to be reliable and accurate However Dataram assumes no responsibility for errors2. peera GRSX6275 10 a Optimizing Value and Performance ns ine DDR3 1066 PC3 8500 Registered ECC 1 5V 240 pin DIMMs Products in Family GRSX6275 10 2GB 1 x 2GB 1Rx4 DIMMs GRSX6275 810 2GB 1 x 2GB 2Rx8 DIMMs GRSX6275 10 8GB 1 x 8GB 2Rx4 DIMMs ue n 1 a m B et ee ee ee eee he ade a a Features Description 240 pin JEDEC compliant DIMMs Each GRSX6275 10 upgrade consists of a single DDR3 133 35 mm wide by 30 mm high 1 181 x 5 25 1066 Registered ECC DIMM that conforms to JEDEC s Data Transfer Rate 10 6 Gigabytes sec DDR3 PC3 8500 standard One 2K bit EEPROM is used Operating Voltage 1 5 V 0 075 for Serial Presence Detect and a combination Fully ROHS Compliant register PLL with Address and Command Parity is also Thermal Sensor used A thermal sensor accurately monitors the DIMM module and can prevent exceeding the maximum operating temperature of 95C Dataram Product Sun Microsystems Product Supported in these Sun Microsystems systems GRSX6275 10 2GB X4670A Sun Blade X6275 Server Module GRSX6275 810 2GB Not Offered by Sun GRSX6275 10 8GB Not Offered by Sun Front view ws Notes rs i f e Tolerances on all dimensions AT iaat iniii a s oa except where otherwise L Bi i F Bil Eiu pii ER ae 0 34 indicated are 13 005 a a i t Tn imei rat i F i KELIT C Eai jala ed eel H 1 Eg rc t All dimensions are expressed es Bo Be a
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