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        Transcend Transcend DDR 200Pin SO-DIMM DDR-400 Non-ECC Memory
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1.  A Y    ALOCACOCNONCOA CRANO TETRA TTR TAT       HEN                  1  am t    IMAN          i  et       ite       L       y  G   p   3     H gt  K gt      lt     I    gt       ___  gt   PCB  09 1220       Transcend Information Inc     TS64MSD64V4J I    200PIN DDR400 Unbuffered SO DIMM    512MB With 64Mx8 CL3          Pin Identification    Symbol    Function                A0 A12  BAO  BA1    Address input                                                       Dimensions  Side Millimeters Inches  A 67 60 0 20 2 661 0 008  B 47 40 1 866  C 11 40 0 449  D 4 20 0 165  E 2 15 0 085  F 1 80 0 071  G 6 00 0 236  H 18 00 0 709    20 00 0 787  J 31 75 0 20 1 250 0 008  K 1 00 0 10 0 039 0 004     Refer Placement     Transcend Information Inc                             DQ0 DQ63 Data Input   Output   DQS0 DQS7 Data strobe input output  CK0 CK2 Clock Input    CKO  CK2  CKEO  CKE1 Clock Enable Input    CSO   CS1 Chip Select Input    RAS Row Address Strobe   CAS Column Address Strobe   WE Write Enable  DM0 DM7 Data in Mask  VDD  2 5 Voltage power supply  VREF Power Supply for Reference  VDDSPD  2 5 Voltage Serial EEPROM  Power Supply  SA0 SA2 Address in EEPROM  SCL Serial PD Clock  SDA Serial PD Add Data input output  VSS Ground  NC No Connection          200PIN DDR400 Unbuffered SO DIMM    TS64MSD64V4J I 512MB With 64Mx8 CL3                Pinouts   Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin Pin  No Name No Name No Name No Name No Name No Name  01 VREF 69 VDD 137 VSS 02 VREF 70 VDD 13
2. 8 VSS  03 VSS 71  CBO 139 DQ35 04 VSS 72  CB4 140 DQ39  05 DQO 73  CB1 141 DQ40 06 DQ4 74  CB5 142 DQ44  07 DQ1 75 VSS 143 VDD 08 DQ5 76 VSS 144 VDD  09 VDD 77  DQS8   145 DQ41 10 VDD 78  DM8 146 DQ45  11 DQSO 79  CB2 147 DQS5 12 DMO 80  CB6 148 DM5  13 DQ2 81 VDD 149 VSS 14 DQ6 82 VDD 150 VSS  15 VSS 83  CB3 151 DQ42 16 VSS 84  CB7 152 DQ46  17 DQ3 85 DU 153 DQ43 18 DQ7 86 DU 154 DQ47  19 DQ8 87 VSS 155 VDD 20 DQ12 88 VSS 156 VDD  21 VDD 89  CK2 157 VDDD 22 VDD 90 VSS 158  CK1  23 DQ9 91   CK2   159 VSS 24 DQ13 92 VDD 160 CK1  25 DQS1 93 VDD 161 VSS 26 DM1 94 VDD 162 VSS  27 VSS 95     CKE1   163 DQ48 28 VSS 96 CKEO   164 DQ52  29 DQ10 97  A13 165 DQ49 30 DQ14 98 DU 166 DQ53  31 DQ11 99  A12 167 VDD 32 DQ15   100 A11 168 VDD  33 VDD 101 A9 169 DQS6 34 VDD 102 A8 170 DM6  35 CKO 103 VSS 171 DQ50 36 VDD 104 VSS 172 DQ54  37  CKO 105 A7 173 VSS 38 VSS 106 A6 174 VSS  39 VSS 107 A5 175 DQ51 40 VSS 108 A4 176 DQ55  41 DQ16 109 A3 177 D56 42 DQ20   110 A2 178 DQ60  43 DQ17   111 Al 179 VDD 44 DQ21 112 AO 180 VDD  45 VDD 113 VDD 181 DQ57 46 VDD 114 VDD 182 DQ61  47 DQS2   115 A10 183 DQS7 48 DM2 116 BA1 184 DM7  49 DQ18 117 BAO 185 VSS 50 DQ22   118  RAS 186 VSS  51 VSS 119  WE 187 DQ58 52 VSS 120  CAS 188 DQ62  53 DQ19 121  CSO 189 DQ59 54 DQ23   122   CS1 190 DQ63  55 DQ24   123 DU 191 VDD 56 DQ28   124 DU 192 VDD  57 VDD 125 VSS 193 SDA 58 VDD 126 VSS 194 SAO  59 DQ25 127 DQ32   195 SCL 60 DQ29   128 DQ36 196 SA1  61 DQS3   129 DQ33   197 VDDSPD   62 DM3 130 DQ37   198 SA2  63 V
3. SS 131 VDD 199 VDD 64 VSS 132 VDD 200 DU  65 DQ26 133 DQS4 66 DQ30 134 DM4  67 DQ27   135 DQ34 68 DQ31 136 DQ38                                           Transcend Information Inc  3    
4. TS64MSD64V4J I    200PIN DDR400 Unbuffered SO DIMM    512MB With 64Mx8 CL3       Description   The TS64MSD64V4J I is a 64M x 64bits Double Data Rate  SDRAM high density for DDR400  The TS64MSD64V4J I  consists of 8pcs CMOS 64Mx8 bits Double Data Rate  SDRAMs in 66 pin TSOP II 400mil packages and a  2048 bits serial EEPROM on a 200 pin printed circuit  board  The TS64MSD64V4J I is a Dual In Line Memory  Module and is intended for mounting into 200 pin edge  connector sockets    Synchronous design allows precise cycle control with the  use of system clock  Data I O transactions are possible on  both edges of DQS  Range of operation frequencies   programmable latencies allow the same device to be useful  for a variety of high bandwidth  high performance memory    system applications     Features   e Industrial Temperature  TA    40C to  85C   e Power supply  VDD  VDDQ  2 6V   0 1V    e Max clock Freq  200MHZ    e Double data rate architecture  two data transfers per  clock cycle   e Differential clock inputs  CK and  Ck    e DLL aligns DQ and DGS transitions with CLK transition   e Commands entered on each positive CLK edge   e Auto and Self Refresh    e Data I O transactions on both edge of data strobe    e Serial Presence Detect  SPD  with serial EEPROM   e SSTL 2 compatible inputs and outputs    e MRS cycle with address key programs   CAS Latency  Access from column address    3  Burst Length  2 4 8     Data Sequence  Sequential  amp  Interleave     Placement    T    HU      
    
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