Overview M-Series: Fast Silicon Photomultiplier Sensors
Contents
1. No Contact NC pin 4 should be soldered to PCB this pin can be connected to ground but it can also be left floating without affecting the dark noise Figure 18 Solder footprint for the MicroFM 100XX SMT part All dimensions in mm M Series Fast Silicon Photomultiplier Sensors S e gt S L USER MANUAL sense light MicroSM 30000 and 10000 Series X13 Ceramic Package Note 10000 series package is same but with smaller sensor size 0 65 min O X 0 01mm D D gt ON SSL SS Cathode N Anode P MicroSM 60000 Series X13 Ceramic Package ST S nsss eE SSS 7 2 x ASSES AAA ERO SSN Rs 0 60 613 0 40 501 6 16 613 0 37 3 10 10 00 7 0 50 0 13 M Series Fast Silicon Photomultiplier Sensors S e gt S L USER MANUAL sense light MicroFM 10000 Series X18 Package 01 80 16 30 OX 0 01mm D 5 40 22 O INS A NT _____thtt t SECTION A A Fast Output Anode P GND Cathode N 03 30 010 X 0 01mm 1 52 1008 Cap not Wa 0 38 755 12 66 0 Cathode N Anode P M Series Fast Silicon Photomultiplier Sensors USER MANUAL MicroSM 30000 Series X39 Package Cap Not Shown O X 0 01mm 3 20 o 10 1 652. 0 50 4x No Contact NC pin 4 should be soldered to PCB this pin can be connected to ground but it can also be left floating without affecting the dark noise Recommend that NC pin 5 paddle is not soldered to the PCB and left floating to achieve optimal soldering on pins 1 to 4 Care must be taken to ensure that no electrical contacts on the PCB such as vias short out on the paddle if using the area underneath for routing If it is desired to solder pin 5 to the PCB for example to heatsink or ground the paddle please consult your contract manufacture for their solder recommendations based on their equipment and capabilities Figure 16 Solder footprint for the MicroFM 600XX SMT part All dimensions in mm M Series Fast Silicon Photomultiplier Sensors S e gt S L USER MANUAL sense light MicroFM 30000 Series SMT Package 3 00 Active Area Pin 11D No Contact NC pin 4 should be soldered to PCB this pin can be connected to ground but it can also be left floating without affecting the dark noise Figure 17 Solder footprint for the MicroFM 300XX SMT part All dimensions in mm Fingers on pads 1 4 can be omitted in tight pitch PCB designs to better facilitate routing of signals M Series Fast Silicon Photomultiplier Sensors S e o S L USER MANUAL sense light MicroFM 02500 amp 10000 Series SMT Package 1 50 0 05 X Active Area X Active Area 1 80 0 05 Pin 1 ID
3. 16 1 25 005 0 40 88 0 25 max 8 Thermistor a emaer 6 Cathode N __ sensl sense light M Series Fast Silicon Photomultiplier Sensors S e gt S L USER MANUAL sense light MicroFM SMTPA Board See Table 2 for pin connections z E ch W 3 3 An See Table 1 for connections Schematics shown for 3mm versions If the schematics for the other sizes are required then please contact support sensi com M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Handling and Soldering Safe Handling of Sensors e When unpacking care should be taken to prevent dropping or misorienting the sensors The specific items contained in the package and the type of packaging will depend on the parts ordered e Remember that the SIPM is a sensitive optoelectronic instrument always handle the sensor as carefully as possible e The sensor should be disconnected from the bias supply when not in use e SIPM sensors are ESD sensitive The following precautions are recommended A y NES e Ensure that personal grounding environmental controls and work surfaces are compliant with recommendations in JESD625 e Ensure that all personnel handling these devices are trained according to the recommendations in JESD625 e Devices must be placed in an ESD approved carrier during transport through an uncontrolled area Package Summary
4. SensL Array SMT line of products Large arrays can pose a readout challenge due to the many channels of amplification and processing that are required Therefore methods of reducing the number of channels are often employed in order to reduce the readout requirements Many examples of this can be found in the literature and SensL has extensive experience in developing solutions for array readout as demonstrated by the Matrix family of products Please contact SensL to request a Tech Note on the subject of large area array readout M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light M Series Mounted Sensors Some M Series sensors are available ready mounted on test boards to allow for easy evaluation The SMA and SMTPA were designed for evaluation of both the fast output and the DC coupled standard output These boards use the circuit shown in Figure 13 The use of these boards is detailed in the following sections MicroFM SMA The MicroFM SMA XXXXX product line Figure 14 features either an SMT or X18 packaged SIPM sensor type specified by the XXXXX digits soldered onto a small PCB board The board is simple to use having just three SMA connectors one delivers the bias voltage Vbias and the other two provide the output signals standard output from the cathode Sout and the fast output Fout The circuitry on the board is designed to bias the sensor in such a way as to preserve the optimum high speed per
5. Table 3 summarizes packages and product type In the following sections handling and soldering advice is given for each package type Table 3 Summary of which package types are associated with which product type e I See Table 4 for definition Sensors shipped in a tray require a bake according to J STD 20 prior to reflow soldering M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light SMT Package A dedicated SMT Handling and Soldering Tech Note is available that contains in depth information on the storage and use of the SMT parts including the CAD for the tape and reels The SMT package is compatible with standard reflow solder processes J STD 20 and so is ideal for high volume manufacturing The recommended solder footprints are shown in the Schematics section of this document If the SMT part is being assembled into an array the advice in the SMT Array Tech Note should be followed SMT SIPM sensors are shipped in moisture barrier bags MBB according to the J STD 033 standard An unopened MBB should be stored at a temperature below 40 C with humidity below 90 RH After the MBB has been opened the devices must be reflow soldered within a period of time depending on the moisture sensitivity level MSL SensL SMT Tape Reel are MSL 3 cut tape SMT are MSL 4 and SMT sensors shipped in trays require a bake prior to reflow soldering See Table 4 for details MSL Exposure time Condition Appl
6. M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL a sense light si La r e Pr e fit K gt ve M Series Fast Silicon Photomultiplier Sensors SensL s M Series sensors feature a uniquely fast output signal that can have a rise time of 100 ps and a recovery time of lt 1 ns allowing for precision timing and fast count rates The M Series sensors are available in four sensor sizes 0 25 mm 1 mm 3 mm and 6 mm and a number of package types including a 4 side tileable surface mount SMT package that is compatible with lead free reflow soldering processes The MicroFM sensors are based on the silicon photomultiplier concept and A form a range of high gain single photon sensitive visible light sensors Nos 2 amp They have performance characteristics similar to a conventional PMT lt gt GS while benefiting from the practical advantages of solid state technology low operating voltage robustness compactness and insensitively to light over exposure More information on the M Series sensors including their performance characteristics can be found in the M Series Datasheet Overview The M Series SIPM sensors from SensL are based on a N on P diode M Series structure Figure 1 that results in a broad range of sensitivity from 400 nm to 1000 nm hv poly nt Depletion region p All M Series SIPM sensors also feature SensL s proprietary fast outout terminal Figure 2 giving access to signals with
7. Pads and Pins Common PCB design practice is to ground any floating pins or pads such as those labelled NVC Grounding the pin helps shielding and can reduce noise interference from external sources EMI RF X39 Package The X39 TO 39 can package has through hole pins and hand soldering is recommended The SIPM can be damaged by excessive heat and so it is important that due care be given to temperature and dwell time when soldering the X39 products A maximum temperature of 260 C for no more than 10 seconds is recommended More details can be found in the Hand Soldering Guide Tech Note The MicroSM X89 product is a 6 pin TO 39 package housing a thermoelectric cooler TEC This allows the SIPM sensor to be cooled which significantly reduces the noise The specifications for the TEC and thermistor are shown in Tables 5 and 6 respectively NB Specifications for the TEC are given at the package hot side temperature T 300K The environment in the package is N Resistance 25 C H 2 2KQ Rating T_T Value Temperature coefficient 298K 5 06 K MiA moO Geary seal Table 6 X39 thermistor specifications Table 5 X39 TEC specifications M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Thermistor Characteristic 1000 00 G x 10 00 L a 2 N CC 1 00 0 10 50 30 10 10 30 50 70 90 Temperature C Figure 19 Thermistor resistance as a fun
8. Schematics Pin Pad Identification and Solder FOSTE din 11 MicroFM 60000 Series SMT Package en 11 lso BODO Genes SMT FACKA ssania te alinea 12 MicroFM 02500 amp 10000 MT 18 MicrooM 30000 and 10000 Seres 413 Leramio Package rara 14 Mero WM OOU0O Series A13 Cerami Packet rain 14 MICOFM WOO OG Sere MOOD paro sota 15 MiCrS SM 30900 Series X05 e e ara 15 Mitos MI IOGOOS SODUO keloid se 46 Fae lt 2 6 Susi tibias 16 ero o o A A etc evs ie wn weitere ti e rt Ie es as iano aa 17 PRIORI 18 Sci OSE EEE EIA 18 PRU bacca toa 18 MPa 19 A A In 20 o anna 20 DAO oa miele o IE o APN ad 20 Polini o A A E E E EAE 20 Not connected NO Pads and PINS ccein nirai eanan OnE ni 20 PORO d AP ve tne pct asi va xt E n 22 Appendix A Alternative Biasing in Fast Mode eee eeeeeeeeeeeaeeea eee eeeaeeeeeeeaeeeaeeeeeeeaeeeeessaeeeeeeseusaasensnsaaneees M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Glossary M Series A family of SIPM products based upon a N on P structure with broad spectral sensitivity FM M Series SiPM product that has at least 3 pins or pads accessible that include anode cathode and the fast output and can therefore be used in fast mode configuration SM M Series SIPM product that has only 2 pins giving access to the anode and cathode The third terminal fast output is not accessible and so SM sensors can only work in standard mode Fast mode Using the fast output signa
9. cal standard mode output pulse shape is shown in Figure 9 Impulse Response Standard Output MicroFM SMA 30035 0 0E 0 Cathode ere x Fast Output fe Anode ea fx amp w de oe Time nanoseconds Figure 8 Biasing for standard mode The cathode Figure 9 Standard mode signal from a MicroSM 30035 should be positive with respect to the anode but when illuminated with a 50 ps laser pulse either a positive or negative bias can be used C1 Vbias Recommended Standard Mode Readout and Amplification Output Standard Output Figure 10 shows how the M Series devices can R2 be connected to a standard high speed amplifier such as the OPA656 to convert the standard mode OV output signal current to a voltage This technique is recommended for standard mode readout of all sensL SIPM devices In the case of MicroFM Fast Output not connected devices the fast output can be left open R1 2K2 1mm sensor or 470R 3mm or 6mm sensor R2 50R C1 3pF 50V U1 OPA656 If Fast Output is used place 100pF Capacitor from Cathode to OV Vbias should be filtered with SensL generic voltage filter Figure 10 Example readout circuit for standard mode M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Dual Mode Readout of MicroFM Sensors It is possible to read out both fast and standard outputs simultaneously from the sensor to obtain two separate signals This can be used for obtainin
10. ction of temperature Temperature Difference K o a da dd FSF SSS Temperature Difference K oasa agiia o 0 1 0 2 0 3 0 4 0 6 0 6 0 7 Heat Pumped atthe Cold Side VV o 10 20 30 40 50 60 o ra 20 gt 20 Temperature Difference K Temperature Difference K Color Legend Imax 0 8 Imax 0 6 Imax 0 4 Imax Figure 20 Performance specification plots for the X39 TEC M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Further Help If more help is required in the set up or operation of M Series sensors there are several SensL resources that can help e The M Series Datasheet contains more detailed information on the physical and performance characteristics of the sensors e The Micro EVB is a product option for the MicroSM series of sensors and users may find it useful to consult its Product Brief and User Manual A variety of Tech Notes are available on the website www sens com such as e The Technical Note Introduction to SIPM which provides an over view of the MicroSM SiPM technology how it works and how performance parameters are affected by different settings e The MicroSM Quickstart Experimental Guide e A guide to handling and soldering SMT packages e A guide to hand soldering through hole SensL sensor products e A guide on creating arrays of close packed SMT sensors e Anextensive library of technical and scientific papers on the use of SensL SIPM sensors If addit
11. d to OV L1 REXF9503 Vbias should be filtered with SensL generic voltage filter Figure 7 Recommended fast SIPM readout circuitry for 3 mm and 6 mm MicroFM sensors Also shown is the recommended transformer part number and pin out labelling M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Standard Mode Biasing and Readout of M Series Sensors For applications that do not require fast timing from the MicroFM or for the MicroSM products that do not give access to the fast output signal SensL s M Series sensors will perform as a conventional SIPM For MicroFM products the fast outout terminal can be left open with no detriment to its standard mode performance Standard mode signals may be more suitable for applications involving slow pulses or slowly varying continuous light levels such as in luminometers or for gamma ray spectroscopy with slow or low light scintillators Recommended Standard Mode Biasing Figure 8 below shows the standard mode biasing configuration For MicroFM sensors the fast outout electrode is left open unconnected For all M Series sensors read out in standard mode the cathode should be held at a positive bias with reference to the anode It is recommended that the signal is taken from the side of the sensor held at OV Reading out in this way yields a pulse that has a rise time of 1 ns 10 ns and a decay time of several hundred ns depending on sensor and microcell size A typi
12. ectrodes of the SMT sensor The pins are labeled on the PCB with numbers 1 5 Each of the numbered pins is connected as listed in Table 2 with the option to use either a positive or negative bias l Function Connection Negative bias i ae standard output thod postive ae ul if unused connect to zero V o Lul fast output fast output if unused can be left open if unused can be left open S anode AA Opu negative bias input lif unused connect to zero V 9 E Pa oe E beri me PCB gnd PCB gnd S MicroFM SMTPA board Table 2 Pin connections for the MicroFM SMTPA board The biasing circuit of the SMTPA is the same as on the SMA board as indicated by Figure 13 however it does not contain any on board decoupling on the bias line Therefore a bias filter such as that in Figure 5 should be included on the bias line before connecting to the relevant bias input pin see Table 2 The standard output can be connected directly to an amplifier or 50Q load oscilloscope If the standard output is not used then that pin should be connected to zero Volts NOTE The presence of the pins will slightly degrade the fast output signal from the sensor The connectors from Samtec used are BBL 103 G E BBL 102 G E Compatible sockets from Samtec are SL 103 G 10 SL 102 G 10 M Series Fast Silicon Photomultiplier Sensors S e o S L USER MANUAL sense light Schematics Pin Pad Identification and Solder Footprint MicroFM 60000 Series SMT Package
13. extremely fast rise times and short pulse widths a M Series SiPM products are available in either MicroSM 2 pin or MicroFM 3 pin versions Figure 1 N on P sensor structure Cathode Fast Output MicroSM Although all M Series SIPM sensors have the architecture shown in Figure 2 MicroSM packaged products only have two pins giving access to the anode and cathode The fast outout is not accessible in MicroSM products MicroFM MicroFM packaged products have three or more pins giving access to the fast output as well as the anode and cathode The fast output is the derivative of the internal fast switching of the microcell in response to Anode the detection of a single photon Figure 2 Simplified microcell level schematic of the M Series SiPM M Series Fast Silicon Photomultiplier Sensors S e f S L USER MANUAL S Contents A L E E E ele decree oe E RI A 1 Vla bin 1 VC A et EEA Ges dente tne I oe tees 1 SP A e Po IA 3 B TAa e e RR A A E E a cee E li A 4 Fast Mode Biasing and Readout of Micro PI Ee elia 4 REE URLS Ze l Ged e ea T a E E callen E E 4 P A ee EE 4 Recommended Fast Mode in pora a 4 Standard Mode Biasing and Readout of M Series SEnSors e 6 Recommended Standard Mode BiasiNg e 6 Recommended Standard Mode Readout and Amplification sse eee 6 Du eis ae dert e rea Ue rd REAOOUCO Aras 8 ere S iaia ea 8 NE aroe MOU TS cirie ina isis 9 PCO ela 9 ee E EA 10
14. formance A typical output pulse is shown in Figure 4 which was taken from a MicroFM SMA 30035 The circuitry used is as given in Figures 13 Fast S output poe V2 0 2013 S Ubias sensl CA Rear MicroF SMA 3mm SMT sensor Standard output Figure 14 The MicroFM SMA board 3mm SMT version Output Function Comments _ bias input anode fast output if unused can be left open standard output cathode _ if unused can be left open Table 1 SMA connections The MicroFM SMA is recommended for users who require a plug and play set up to quickly evaluate MicroFM sensors with optimal timing performance The board provides outputs which can be connected directly to the oscilloscope or measurement device The board also allows the standard output from the cathode to be observed at the same time as the fast outout Table 1 summarizes the connections to the SMA board Each board has two mounting holes to allow secure placement during testing with sensors located at the edge of the board This allows two sensors to be placed in close proximity for coincidence timing measurements M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light MicroFM SMTPA The MicroFM SMTPA XXXXX or Pin Adapter board Figure 15 features an SMT packaged SiPM sensor type specified by the XXXXX digits mounted onto a small PCB board The PCB has five through hole pins that allow easy electrical connections to the el
15. g timing fast output and amplitude information standard output from separate channels This could be useful for applications such as PET Positron Emission Tomography where timing and energy information are required from each photon pulse Note that this is only possible with MicroFM sensors AC and DC coupled options for connecting the device for dual readout are shown in Figures 11 and 12 i C1 Vbias Output Figure 11 DC coupled readout option The standard output is amplified OV ov through a transimpedance amplifier TIA Fast Output is referenced to OV R1 2K2 1mm sensor or 470R 8mm or 6mm sensor R2 50R C1 3pF C2 100pF only required if also using Fast Output U1 OPA656 Fast Output readout options 1 Balun Transformer RFXF9503 large signal to oscilloscope 2 Minicircuits Amplifier ZX60 43 large signal 3 Minicircuits Amplifier ZFL 1000LN small signal Vbias should be filtered with SensL generic voltage filter C1 Vbias RI R3 Standard C2 Output Output N R2 Fast UV Output Figure 12 AC coupled readout option DC information from the SiPM is lost OV Li but the pulse amplitude is maintained Fast Output is referenced to OV through the transimpedance amplifier R1 2K2 1mm sensor or 470R 8mm or 6mm sensor TIA R2 50R R3 1K C1 3pF 50V C2 10nF 50V U1 OPA656 Fast Output readout options 1 Balun transformer RFXF9503 large signal to oscilloscope 2 Minicircuits ampl
16. icable SMT shipping format 168 hours lt 30 C 60 RH Tape and reel Ahi di lt 30 C 60 RH _ Cut tape and partial reels Table 4 MSL definitions applicable to SensL products reference J STD 020 All SMT shipped on tray do not have an MSL rating and should be baked prior to placement on PCB Please discuss this with your contract manufacture for their recommended baking cycle which adheres to IPC JEDEC J STD 20 MSL Classification Note the temperature of the bake should not exceed the recommended operating temperature of the product listed in product s datasheet Exposure to solvents such as concentrated isopropyl alcohol propan 2 ol or commercial flux removal fluids such as Fluxene will cause severe irreversible damage to the MLP packages If cleaning is necessary a 20 solution of isopropyl alcohol can be used Futher details on cleaning can be found in the SM Handling Guide Creating Arrays of SMT Sensors If multiple SMT parts are to be mounted in close proximity e g 1D or 2D arrays the following recommendations may be helpful By following this recommendations a planarity of 0 09 to 0 53 can be achieved e Minimum spacing between SMT parts of 200um e Use of FR4 PCB as the substrate material e Use commercial automatic placement machines to achieve the necessary placement accuracy to give the above spacing and planarity e Take into account the MSL 3 specifications of the SMT devices when assembling e Ho
17. ifier ZX60 43 large signal 3 Minicircuits amplifier ZFL 1000LN small signal Vbias should be filtered with SensL generic bias filter M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light A third option for simultaneous readout of the standard and fast outputs provides a DC coupled standard output signal and preserves the ability to read out the fast output The decoupling capacitor from the cathode to O V is critical to provide a return path for the fast output This circuit is used on the SensL SMA and SMTPA evaluation boards SensL recommend the Vbias readout options from Figures 11 and 12 for most system designs OV RI Standard OV YX Output Ci Fast Output Vbias Fast Output is referenced to OV R1 50R C1 10nF 50V Fast Output readout options 1 Balun transformer RFXF9503 large signal to oscilloscope Used on SensL SMA amp SMTPA for 3mm and 6mm 1mm sensor can be directly connected to an oscilloscope 2 Minicircuits amplifier ZX60 43 large signal 3 Minicircuits amplifier ZFL 1000LN small signal Vbias should be filtered with SensL generic bias filter Input should be a positive bias Figure 13 Third option for dual readout that is employed on the SensL SMA and SMTPA evaluation boards Further information on using a negative bias is given in Appendix A Readout of Arrays of SIPM Devices Many applications require the use of multiple sensors in the form of an array such as the
18. ignal 0 0559 Common microwave RF design rules such as controlled 2 0E 3 impedance microstrip lines should be used The AER capacitance of the fast output electrode is much lower of 5 the order of 2 3 pF for a 1 mm device than in a standard 5 sia configuration The lower output capacitance does not di typically allow the use of a transimpedance amplifier and 1 0E 2 instead one can use an RF style 50 2 impedance solution DEN including direct connection to a coaxial cable The 3 mm 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Time nanoseconds and 6 mm devices have higher capacitance so for best operation when connecting to an oscilloscope or driving long wires it is recommended that the fast output be connected to an RF transformer such as the RFXF9503 as in Figure 7 This provides impedance matching to improve amplitude and timing characteristics of the pulse for 50 Q impedance For 1 mm devices the capacitance is low enough to allow direct 50 connection as in Figure 6 Figure 4 Fast mode output of a MicroFM 30035 when illuminated with a 40 ps laser pulse Photek LPG 405 Another feature of the fast output electrode is that it is AC coupled with no DC component However if needed one can combine it with the standard output See the next section of the SIPM to incorporate DC information Fast Output Amplification It is important to note that the signal charge injected into the fast output electrode is typically about 2
19. ional help is needed please contact support sensl com M Series Fast Silicon Photomultiplier Sensors S e f S L USER MANUAL sense light Appendix A Alternative Biasing in Fast Mode OV When using one of the MicroFM products in fast mode it is recommended to use either of the biasing schemes shown in Figures 6 or 7 Cathode However a negative bias can be applied to the AN anode substrate as in Figure 22 without any N change in performance In this case care must 10nF Fast Outout be taken to ensure good decoupling of the bias 50V as u pu voltage at the device since the substrate is the return path for the fast signal If this biasing configuration is required it is recommended Anode that a 10 nF 50 V ceramic SMT decoupling capacitor with low ESR is placed as close to the anode as possible Vbias Without suitable decoupling the fast outout pulse can suffer from ringing and pulse shape Figure 21 Alternative biasing decoupling required distortion when the negatively biased anode configuration is used www sensl com sales sensl com S gt S 353 21 240 7110 International 1 650 641 3278 North America sense light All specifications are subject to change without notice
20. l from an FM product for improved timing or photon counting applications Standard mode Using the signal from the anode and cathode for the readout of an SM or FM product where timing performance is less critical M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light Biasing and Readout Fast Mode Biasing and Readout of MicroFM Sensors Recommended Fast Mode Biasing Vbias The fast output is referenced to the anode substrate of the SIPM Therefore the use of a positive bias voltage applied to the cathode with the anode at O V SA Cathode is recommended as in Figure 3 The fast mode signal polarity is negative If an application requires the use of a negative bias please refer to the advice in Fast Output Appendix A Please refer to the M Series datasheet for operating over voltage range Anode The observed signals will be very fast with rise times ranging from 100 ps to OV 1ns and pulse widths of 400 ps 5 ns depending on sensor size A typical output pulse for a 3 mm sensor MicroFM 30035 is shown in Figure 4 Figure 3 Recommended biasing o o o o For all application circuits shown in this User Manual it is recommended that a bias voltage filter such as the one shown in Figure 5 is used Recommended Fast Mode Readout Impulse Response Fast Output Due to the extreme speed of the signals from the fast MicroFM SMA 30035 output care should be taken in the routing of the s
21. ld the PCB board in a rigid frame to avoid warping due to the heat process e The user can refer to the additional lech Note on this subject M Series Fast Silicon Photomultiplier Sensors S C f S L USER MANUAL sense light X18 Package The X18 TO 18 can package has through hole pins and hand soldering is recommended The SIPM can be damaged by excessive heat and so it is important that due care be given to temperature and dwell time when soldering the X18 products A maximum temperature of 260 C for no more than 10 seconds is recommended More details can be found in the Hand Soldering Guide Tech Note X13 Package The X13 ceramic package has through hole pins and hand soldering is recommended The SIPM can be damaged by excessive heat and so it is important that due care be given to temperature and dwell time when soldering the X13 products A maximum temperature of 260 C for no more than 5 seconds applied at a distance of 2mm from the ceramic base is recommended More details can be found in the Hand Soldering Guide Tech Note X05 Package The X05 TO 05 can package has through hole pins and hand soldering is recommended The SIPM can be damaged by excessive heat and so it is important that due care be given to temperature and dwell time when soldering the X05 products A maximum temperature of 260 C for no more than 10 seconds is recommended More details can be found in the Hand Soldering Guide Tech Note Not Connected NC
22. of the SIPM charge generated during the avalanche However the pulse duration is also approximately 100 times shorter so the current amplitude observed is about 0 02 100 2 times higher This high current amplitude in combination with the significantly lower output capacitance make the device suitable for photon counting at very high speed tens of MHz and higher has been demonstrated in the lab For amplification of the fast signal it is recommended that a low noise 50 Q RF amplifier be used As with standard readout the level of gain required is dependent on the application For applications with high photon counts it is recommended that the Mini Circuits ZX60 48S be used For photon counting applications it is recommended that the Mini Circuits ZFL 1000LN be used For PET applications it is possible to obtain both timing and energy resolution information from the fast output with the anode and cathode only used for biasing M Series Fast Silicon Photomultiplier Sensors S e f S L USER MANUAL sense light RI R2 Vbias Voltage C1 C2 Supply OV R1 R2 50R C1 C2 10nF 50V Figure 5 Generic biasing filter recommended for all circuits given in this User Manual Vbias Fast Output OV Fast Output is referenced to OV Vbias should be filtered with SensL generic voltage filter Figure 6 Recommended fast SIPM readout circuitry for 1 mm MicroFM sensors Vbias Fast Output OV Fast Output is reference
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